CN106405755A - High-speed multi-channel transmitting and receiving device - Google Patents
High-speed multi-channel transmitting and receiving device Download PDFInfo
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- CN106405755A CN106405755A CN201611077800.9A CN201611077800A CN106405755A CN 106405755 A CN106405755 A CN 106405755A CN 201611077800 A CN201611077800 A CN 201611077800A CN 106405755 A CN106405755 A CN 106405755A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to a high-speed multi-channel transmitting and receiving device, which comprises an array optical transmitter chip (1), a planar optical waveguide integrated chip (3) and an array optical detector chip (7), and is characterized in that the planar optical waveguide integrated chip (3) is formed by integrating a first optical waveguide chip capable of realizing wavelength-division multiplexing and a second optical waveguide chip capable of realizing wavelength-division demultiplexing in a monolithic manner, an input end of the first optical waveguide chip is correspondingly coupled to the array optical transmitter chip (1), an input end of the second optical waveguide chip is optically coupled to multi-wave signals, and an output end of the second optical waveguide chip is correspondingly coupled to the array optical detector chip (7). The high-speed multi-channel transmitting and receiving device is higher in integration, lower in cost, smaller in device size and conducive to realizing automation.
Description
Technical field
The present invention relates to a kind of optic communication device, more particularly, to a kind of transceiving device of high-speed multiple channel, it is particularly suitable for
Apply in high speed transceiver module, belong to optical communication field.
Background technology
In recent years, the developing rapidly of Internet service, has higher requirement to the transfer rate of optical transport network,
The optical transmission system of 40Gbit/s and 100Gbit/s has been commercially available and has been widely applied.Realize high-speed parallel optical to pass
The scheme of defeated module mainly has wavelength-division multiplex CWDM/LAN-WDM and parallel beam PSM4.IEEE802.ba defines 40Gbit/s
With 100Gbit/s Ethernet transport protocol standard, according to different transmission ranges, specification the sending out of 40Gbit/s and 100Gbit/s
Emitter and receiver performance indications.With deepening continuously of high-speed transfer module application, the encapsulation standard size of high-speed module
Reduce year by year, this puts forward higher requirement to the miniaturization of optical transceiving device package dimension.
CWDM/LAN-WDM wavelength-division multiplex high-speed transfer module mainly adopts slab guide integrated chip and array thin at present
The wavelength division multiplex scheme of film optical filters, its main light path design principle is similar, and light transmitting and light receiving element are respectively adopted ripple
Multiplex technique is divided to realize wavelength-division multiplex and wavelength-division demultiplexing, discrete light emitting devices and discrete light receiving element limit mould
The package dimension of block, nor the reduction beneficial to module cost.
Realize multiplexing and the demultiplexing of wavelength using the optical transceiving device of array film filter plate, it is thin that input light enters array
Input light must be carried out light collimation before membrane filtration wave plate, this increases the difficulty of packaging technology, and be filtered using array film
Piece output light, not at the center of array film filter plate assembly, leads to the output optical port of device to deviate optical transceiving device center,
This can increase the technology difficulty that device encapsulation enters module.
Multiplexing and the demultiplexing of wavelength can be realized using waveguide integrated chip solution on slab guide, only need to will input
Optically coupling in slab guide integrated chip, you can realize multiplexing and the demultiplexing of wavelength.With respect to array film optical filter side
Case, effectively reduces the size of device using slab guide integrated chip, simultaneously in the premise not increasing device packaging process
Under, greatly reduce the cost of device.
The optical transceiver module major part of the integrated wavelength-division chip solution of currently employed waveguide is by discrete ballistic device and to connect
Receive device to be arranged in module, be unfavorable for the miniaturization of module and the reduction of module cost, the ballistic device of current discrete and connecing
Receipts device size is not consistent, and this is not conducive to Modular circuit design, the difficulty of the module packaging technology yet increasing.
Content of the invention
The present invention overcomes the defect that prior art exists, difficult in order to effectively reduce optical transceiving device size and packaging technology
Degree, invention proposes a kind of high-speed multiple channel transceiving device, it is possible to achieve the photoelectricity of high-speed multiple channel and electro-optic conversion, meets at a high speed
The encapsulation of transceiver module requires.
The present invention using technical scheme is：
A kind of transceiving device of high-speed multiple channel, including array optical transmitting set chip, planar optical waveguide integrated chip, array
Photo detector chip, described planar optical waveguide integrated chip is by first chip of light waveguide and realizing wavelength-division multiplex effect
Individual the second chip of light waveguide single-chip integration realizing wavelength-division demultiplexing is in one, the input of the first chip of light waveguide and array light
The corresponding coupling of emitter chip, the input of the second chip of light waveguide and many ripples signal optical coupling, the second chip of light waveguide defeated
Go out end coupling corresponding with array light detecting chip.
It is provided with silicon optical lens, described first light wave between described array optical transmitting set chip and slab guide integrated chip
The output end optical port leading chip is provided with the first contact pin coupled lens；The output end of described first chip of light waveguide and the first contact pin
Optoisolator is set between coupled lens.
Described array optical transmitting set chip is arranged in substrate using high accuracy paster, equidistant bonding, its inter-chip pitch
Identical with the input waveguide spacing of the first chip of light waveguide.
Spacing and leading to this high speed between described first chip of light waveguide output end and the second chip of light waveguide input more
Spacing between the input optical port of the optical device that road transceiving device uses cooperatively and output optical port is identical.
Described array optical transmitting set chip adopt four discrete optical transmitting set chips, described array optical transmitting set chip send out
Light center height is highly consistent with planar optical waveguide integrated chip waveguide core.
The input waveguide of described first chip of light waveguide is provided with light splitting waveguiding structure, and light splitting waveguiding structure is defeated with monitoring light
Enter detector chip to be connected, this light splitting waveguiding structure is realized monitoring light input detector chip to array optical transmitting set chip
Optical power monitoring.
Described silicon optical lens make the electrical interface of array optical transmitting set chip to planar optical waveguide integrated chip distance with
The distance of the electrical interface of array photo detector chip to planar optical waveguide integrated chip is identical.
The input of described second chip of light waveguide is provided with the second contact pin coupled lens, the first contact pin coupled lens,
Two contact pin coupled lens are identical with respect to the distance of slab guide integrated chip.
The optical detection face center of described array photo detector chip is consistent with the second chip of light waveguide waveguide core；Vertical Heat
Sink and be pasted on described array photo detector chip, this vertical heat sink upper surface adopts array optical detection described in circuit vertical conducting
Device chip.
It is an advantage of the invention that：
The present invention is simultaneously achieved wavelength-division multiplex and wavelength-division demultiplexing using a planar optical waveguide integrated chip, and will
Transmitting terminal and receiving terminal are encapsulated in a device, and integrated higher with respect to existing high-speed multiple channel transceiving device, cost is more
Low, device size is less, is advantageously implemented automation.
Brief description
Fig. 1 is the structural representation of device embodiment of the present invention；
Fig. 2 is that the array optical transmitting set chip of device embodiment of the present invention places schematic diagram with lens；
Fig. 3 is that the array photo detector chip of device embodiment of the present invention is arranged with planar optical waveguide integrated wavelength-division chip
Schematic diagram；
Fig. 4 is the planar optical waveguide integrated chip of device embodiment of the present invention；
Fig. 5 is that the contact pin coupled lens of device embodiment of the present invention place schematic diagram with planar optical waveguide integrated chip；
Specific embodiment
Below by specific embodiment and combine accompanying drawing the present invention will be further described.
A kind of transceiving device of high-speed multiple channel, including array optical transmitting set chip, planar optical waveguide integrated chip, output
Device, array photo detector chip, described planar optical waveguide integrated chip is by first light wave realizing wavelength-division multiplex effect
Lead chip and one realize the second chip of light waveguide single-chip integration of wavelength-division demultiplexing in one, the input of the first chip of light waveguide
End coupling corresponding with array optical transmitting set chip, the input of the second chip of light waveguide and many ripples signal optical coupling, the second light wave
Lead the output end coupling corresponding with array light detecting chip of chip, the first chip of light waveguide and the second chip of light waveguide are by a core
Piece integration realization.Spacing and at a high speed many with this between described first chip of light waveguide output end and the second chip of light waveguide input
Spacing between the input optical port of the optical module that channel transceiver part uses cooperatively and output optical port is identical.
As shown in figure 1, this transceiving device is provided with array optical transmitting set chip 1, the output light of light transmitting chip 1 is through four
Individual silicon optical lens 2, is optically coupled into planar optical waveguide integrated chip 3, in the wavelength-division multiplex input of planar optical waveguide integrated chip 3
Waveguide has light splitting waveguiding structure 401, and light splitting waveguiding structure 401 coupling corresponding with monitoring light input detector chip 4, by light splitting
It is coupled into monitoring input photo detector chip 4, realize optical power monitoring.This transceiving device is provided with array photo detector chip
7, array photo detector chip 7 is arranged on vertical heat sink 8, array photo detector chip 7 surface search coverage centre-height with
Planar optical waveguide integrated chip 3 waveguide core high precision is aligned.The contact pin coupled lens of two identical parameters, i.e. the first contact pin
Coupled lens 6-1 and the second contact pin coupled lens 6-2 realizes the coupling of this transceiving device output light and input light.
The arrangement of array optical transmitting set chip 1 and four silicon optical lens 2 is as shown in Fig. 2 array optical transmitting set chip structure
It is four thick wavelength-division light transmitting chips 101,102,103,104 by meeting IEEE 802.3ba consensus standard regulation by high-precision
Degree paster is arranged in same substrate 105 it is ensured that it is identical with the channel pitch of slab guide integrated wavelength-division multiplex chip 3, and
And guarantee that light transmitting chip 101,102,103,104 is consistent apart from substrate 105 Edge Distance.That is, 201 four silicon optical lens 2,
202nd, 203,204 it is arranged between light transmitting chip 101,102,103,104 and planar optical waveguide integrated chip 3, silicon optical lens
201st, 202,203,204 focusing center is accurately aligned with the input waveguide of planar optical waveguide integrated wavelength-division multiplex chip 3.Described
Silicon optical lens 2 effect realize make optical transmitting set chip 101,102,103,104 electrical interface to planar optical waveguide integrated chip 3 away from
From with identical, such light with a distance from across main amplifier electrical interface on array photo detector chip 7 to planar optical waveguide integrated chip 3
The electrical interface of the electrical interface of transmitting chip 101,102,103,104 and light-receiving chip point-blank, is conducive to the later stage
Encapsulation design and operation.
As shown in figure 3, the optical detection face center of array photo detector chip 7 and the second chip of light waveguide output waveguide center
Unanimously, detector array chip 7 is realized vertical optical detection using vertical heat sink 8 by the present invention, and this vertical heat sink 8 is being pasted with battle array
The face of row detector chip 7 and this heat sink 8 upper surface are done gold-plated electrode simultaneously and are processed, and realize circuit vertical conducting.
As shown in figure 4, planar optical waveguide integrated chip 3 single-chip integration has wavelength-division multiplex chip and Wave Decomposition multiplexing chip,
I.e. planar optical waveguide integrated chip 3 is realized wavelength-division and is demultiplexed by first chip of light waveguide realizing wavelength-division multiplex effect and one
Second chip of light waveguide composition.Wavelength-division multiplex chip has 301,302,303,304 and output wave of four input waveguides
Lead 309, wavelength-division multiplex chip is used for the flashlight of four different wave lengths being carried out close ripple, the channel spacing of wavelength-division multiplex chip with
The channel spacing of array emitter chip 1 is identical, realizes emitter chip 101,102,103,104 and wavelength-division multiplex chip waveguide pair
Accurate.Wave Decomposition multiplexing chip has 305,306,307,308 and input waveguide 310 of four output waveguides, and wavelength-division demultiplexes core
The flashlight including four different wave lengths is carried out partial wave, the channel spacing of Wave Decomposition multiplexing chip and detector array core by piece
The channel spacing of piece 7 is identical, realizes detector chip 7 and is aligned with Wave Decomposition multiplexing chip waveguide
As shown in figure 5, arranging two contact pin coupled lens between planar optical waveguide integrated chip 3 and module optical port, that is, the
One contact pin coupled lens 6-1 and the second contact pin coupled lens 6-2, the output end 309 to wavelength-division multiplex chip and Wave Decomposition respectively
The input 310 of multiplexing chip carries out waveguide and the coupling of contact pin.Input and contact pin coupled lens in wavelength-division multiplex chip
It is provided with optoisolator 5 between 6-1.With respect to plane between first contact pin coupled lens 6-1 and the second contact pin coupled lens 6-2
The distance of waveguide integrated chip 3 is identical.Described array optical transmitting set chip 1 is directly modulation laser instrument.
Although the present invention has been illustrated in detail in and has described a related specific embodiment reference, this area
Technical staff is it should be appreciated that can make various in the form and details in without departing substantially from the spirit and scope of the present invention
Change.These changes fall within the protection domain required by claim of the present invention.
Claims (9)
1. a kind of transceiving device of high-speed multiple channel, including array optical transmitting set chip (1), planar optical waveguide integrated chip (3),
Array photo detector chip (7) it is characterised in that：Described planar optical waveguide integrated chip (3) is realized wavelength-division multiplex by one and is made
First chip of light waveguide and one realize the second chip of light waveguide single-chip integration of wavelength-division demultiplexing in one, the first light wave
Lead input coupling corresponding with array optical transmitting set chip (1), the input of the second chip of light waveguide and many ripples signal of chip
Optical coupling, the coupling corresponding with array light detecting chip (7) of the output end of the second chip of light waveguide.
2. a kind of high-speed multiple channel according to claim 1 transceiving device it is characterised in that：Described array optical transmitting set
It is provided with silicon optical lens (2), the output end of described first chip of light waveguide between chip (1) and slab guide integrated chip (3)
Optical port is provided with the first contact pin coupled lens (6-1)；The output end of described first chip of light waveguide and the first contact pin coupled lens
(6-1) setting optoisolator (5) between.
3. a kind of high-speed multiple channel transceiving device according to claim 1 it is characterised in that：Described array optical transmitting set core
Piece (1) is arranged in substrate (105) using high accuracy paster, equidistant bonding, its inter-chip pitch and the first chip of light waveguide
Input waveguide spacing is identical.
4. a kind of high-speed multiple channel transceiving device according to claim 1 it is characterised in that：Described first chip of light waveguide
Spacing and the optical module using cooperatively with this high-speed multiple channel transceiving device between output end and the second chip of light waveguide input
Input optical port with output optical port between spacing identical.
5. a kind of high-speed multiple channel transceiving device according to claim 1 and 2 it is characterised in that：Described array light transmitting
Device chip (1) adopts four discrete optical transmitting set chips (101,102,103,104), described array optical transmitting set chip (1)
Height of luminescent center is highly consistent with planar optical waveguide integrated chip (3) waveguide core.
6. a kind of high-speed multiple channel transceiving device according to claim 1 and 2 it is characterised in that：Described first fiber waveguide
The input waveguide of chip is provided with light splitting waveguiding structure (401), light splitting waveguiding structure (401) and monitoring light input detector chip
(4) corresponding coupling, this light splitting waveguiding structure (401) will monitor light input detector chip (4) and realize to array optical transmitting set core
The optical power monitoring of piece (1).
7. a kind of high-speed multiple channel transceiving device according to claim 2 it is characterised in that：Described silicon optical lens (2) makes
The electrical interface of array optical transmitting set chip (1) arrives the distance of planar optical waveguide integrated chip (3) and array photo detector chip
(7) distance of electrical interface to planar optical waveguide integrated chip (3) is identical.
8. a kind of high-speed multiple channel transceiving device according to claim 2 it is characterised in that：Described second chip of light waveguide
Input be provided with the second contact pin coupled lens (6-2), the first contact pin coupled lens (6-1), the second contact pin coupled lens (6-
2) identical with respect to the distance of slab guide integrated chip (3).
9. a kind of high-speed multiple channel transceiving device according to claim 1 and 2 it is characterised in that：Described array optical detection
The optical detection face center of device chip (7) is consistent with the second chip of light waveguide output waveguide center；Vertical heat sink (8) are pasted on described
On array photo detector chip (7), this vertical heat sink (8) upper surface adopts array photo detector chip described in circuit vertical conducting
(7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611077800.9A CN106405755B (en) | 2016-11-30 | 2016-11-30 | A kind of transceiving device of high-speed multiple channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611077800.9A CN106405755B (en) | 2016-11-30 | 2016-11-30 | A kind of transceiving device of high-speed multiple channel |
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| CN106405755A true CN106405755A (en) | 2017-02-15 |
| CN106405755B CN106405755B (en) | 2018-11-06 |
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| CN201611077800.9A Active CN106405755B (en) | 2016-11-30 | 2016-11-30 | A kind of transceiving device of high-speed multiple channel |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106896455A (en) * | 2017-04-27 | 2017-06-27 | 苏州易锐光电科技有限公司 | Multichannel poly-lens WDM device and its tool and methods for using them |
| CN107153237A (en) * | 2017-06-20 | 2017-09-12 | 华中科技大学 | A kind of light transmit-receive integrated device of multichannel silicon substrate wavelength-division multiplex high speed |
| CN108121040A (en) * | 2017-12-18 | 2018-06-05 | 江苏奥雷光电有限公司 | A kind of optical module |
| CN108418635A (en) * | 2017-08-24 | 2018-08-17 | 四川新易盛通信技术有限公司 | A kind of eight channel high rate optical sending devices |
| CN109116469A (en) * | 2018-08-21 | 2019-01-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN109725392A (en) * | 2019-02-19 | 2019-05-07 | 武汉电信器件有限公司 | A kind of light emission component and light-receiving component |
| CN111708131A (en) * | 2020-06-22 | 2020-09-25 | 武汉光迅科技股份有限公司 | Light emitting module and optical module |
| CN111999801A (en) * | 2019-05-27 | 2020-11-27 | 华为技术有限公司 | PLC chip, TOSA, BOSA, optical module and optical network equipment |
| CN112817102A (en) * | 2021-01-04 | 2021-05-18 | 武汉光迅科技股份有限公司 | Optical module and preparation method thereof |
| CN113740979A (en) * | 2021-08-17 | 2021-12-03 | 武汉光迅科技股份有限公司 | Optical device and optical module |
| CN114070414A (en) * | 2021-11-09 | 2022-02-18 | 中国电子科技集团公司第二十九研究所 | Multichannel radio frequency light receiving arrangement |
| WO2022217736A1 (en) * | 2021-04-16 | 2022-10-20 | 武汉联特科技股份有限公司 | Silicon optical multi-channel parallel optical component and coupling method therefor |
| CN115826158A (en) * | 2022-11-08 | 2023-03-21 | 讯芸电子科技(中山)有限公司 | Light receiving device |
| CN116930916A (en) * | 2022-04-01 | 2023-10-24 | 深圳市速腾聚创科技有限公司 | Optical transceiver based on planar waveguide chip, manufacturing method and laser radar |
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| CN106896455A (en) * | 2017-04-27 | 2017-06-27 | 苏州易锐光电科技有限公司 | Multichannel poly-lens WDM device and its tool and methods for using them |
| CN107153237A (en) * | 2017-06-20 | 2017-09-12 | 华中科技大学 | A kind of light transmit-receive integrated device of multichannel silicon substrate wavelength-division multiplex high speed |
| CN108418635A (en) * | 2017-08-24 | 2018-08-17 | 四川新易盛通信技术有限公司 | A kind of eight channel high rate optical sending devices |
| CN108121040A (en) * | 2017-12-18 | 2018-06-05 | 江苏奥雷光电有限公司 | A kind of optical module |
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| CN111999801A (en) * | 2019-05-27 | 2020-11-27 | 华为技术有限公司 | PLC chip, TOSA, BOSA, optical module and optical network equipment |
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| CN111708131A (en) * | 2020-06-22 | 2020-09-25 | 武汉光迅科技股份有限公司 | Light emitting module and optical module |
| CN112817102A (en) * | 2021-01-04 | 2021-05-18 | 武汉光迅科技股份有限公司 | Optical module and preparation method thereof |
| WO2022217736A1 (en) * | 2021-04-16 | 2022-10-20 | 武汉联特科技股份有限公司 | Silicon optical multi-channel parallel optical component and coupling method therefor |
| US11740417B2 (en) | 2021-04-16 | 2023-08-29 | Linktel Technologies Co., Ltd. | Silicon photonics multi-channel parallel optical component and coupling method thereof |
| CN113740979A (en) * | 2021-08-17 | 2021-12-03 | 武汉光迅科技股份有限公司 | Optical device and optical module |
| CN114070414A (en) * | 2021-11-09 | 2022-02-18 | 中国电子科技集团公司第二十九研究所 | Multichannel radio frequency light receiving arrangement |
| CN116930916A (en) * | 2022-04-01 | 2023-10-24 | 深圳市速腾聚创科技有限公司 | Optical transceiver based on planar waveguide chip, manufacturing method and laser radar |
| CN115826158A (en) * | 2022-11-08 | 2023-03-21 | 讯芸电子科技(中山)有限公司 | Light receiving device |
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| CN106405755B (en) | 2018-11-06 |
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