CN106405755B - A kind of transceiving device of high-speed multiple channel - Google Patents
A kind of transceiving device of high-speed multiple channel Download PDFInfo
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- CN106405755B CN106405755B CN201611077800.9A CN201611077800A CN106405755B CN 106405755 B CN106405755 B CN 106405755B CN 201611077800 A CN201611077800 A CN 201611077800A CN 106405755 B CN106405755 B CN 106405755B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A kind of transceiving device of high-speed multiple channel of the present invention, including array optical transmitting set chip (1), planar optical waveguide integrated chip (3), array photo detector chip (7), the first chip of light waveguide and a second chip of light waveguide single-chip integration for realizing wavelength-division demultiplexing that the planar optical waveguide integrated chip (3) realizes wavelength-division multiplex effect by one are in one, the coupling corresponding with array optical transmitting set chip (1) of the input terminal of first chip of light waveguide, the input terminal of second chip of light waveguide and more wave signal optical couplings, the coupling corresponding with array light detecting chip (7) of the output end of second chip of light waveguide；The integrated higher of apparatus of the present invention, cost is lower, and device size smaller is advantageously implemented automation.
Description
Technical field
The present invention relates to a kind of optic communication device more particularly to a kind of transceiving devices of high-speed multiple channel, are particularly suitable for
It is applied in high speed transceiver module, belongs to optical communication field.
Background technology
In recent years, the rapid development of Internet service has higher requirement to the transmission rate of optical transport network,
The optical transmission system of 40Gbit/s and 100Gbit/s, which has been commercially available, to be widely applied.Realize that high-speed parallel optical passes
The scheme of defeated module mainly has wavelength-division multiplex CWDM/LAN-WDM and parallel beam PSM4.IEEE802.ba defines 40Gbit/s
With 100Gbit/s Ethernet transport protocol standards, according to different transmission ranges, the specification hair of 40Gbit/s and 100Gbit/s
Emitter and receiver performance indicator.With deepening continuously for high-speed transfer module application, the encapsulation standard size of high-speed module
Reduce year by year, more stringent requirements are proposed for this miniaturization to optical transceiving device package dimension.
CWDM/LAN-WDM wavelength-division multiplex high-speed transfer module mainly uses slab guide integrated chip and array thin at present
The wavelength division multiplex scheme of film optical filters, main light path design principle is similar, and wave is respectively adopted in light emitting and light receiving element
Multiplexing technology is divided to realize wavelength-division multiplex and wavelength-division demultiplexing, discrete light emitting devices and discrete light receiving element limit mould
The package dimension of block, nor conducive to the reduction of module cost.
Multiplexing and the demultiplexing of wavelength are realized using the optical transceiving device of array film filter plate, it is thin that input light enters array
Must input light be subjected to light collimation before membrane filtration wave plate, this increases the difficulty of packaging technology, and filters using array film
Piece output light at the center of array film filter plate component, does not cause the output optical port of device to deviate optical transceiving device center,
This can increase device encapsulation into the technology difficulty of module.
Multiplexing and the demultiplexing of wavelength can be realized in slab guide using waveguide integrated chip solution, need to will only be inputted
Optically coupling in slab guide integrated chip, you can realize multiplexing and the demultiplexing of wavelength.Relative to array film optical filter side
Case effectively reduces the size of device using slab guide integrated chip, while in the premise for not increasing device packaging process
Under, greatly reduce the cost of device.
The optical transceiver module that currently employed waveguide integrates wavelength-division chip solution is largely by discrete ballistic device and to connect
It receives device to be set in module, is unfavorable for the reduction of the miniaturization and module cost of module, the ballistic device of current discrete and connect
Receipts device size is not consistent, this is not conducive to Modular circuit design, also the difficulty of increased module packaging technology.
Invention content
The present invention overcomes defect of the existing technology, difficult in order to effectively reduce optical transceiving device size and packaging technology
Degree, invention propose a kind of high-speed multiple channel transceiving device, and the photoelectricity and electro-optic conversion of high-speed multiple channel may be implemented, and meet high speed
The encapsulation requirement of transceiver module.
The present invention is using technical solution：
A kind of transceiving device of high-speed multiple channel, including array optical transmitting set chip, planar optical waveguide integrated chip, array
Photo detector chip, the first chip of light waveguide and one that the planar optical waveguide integrated chip realizes that wavelength-division multiplex acts on by one
A the second chip of light waveguide single-chip integration for realizing wavelength-division demultiplexing is in one, input terminal and the array light of the first chip of light waveguide
Emitter chip corresponds to coupling, the input terminal of the second chip of light waveguide and more wave signal optical couplings, the second chip of light waveguide it is defeated
Outlet coupling corresponding with array light detecting chip.
Silicon optical lens, first light wave are provided between the array optical transmitting set chip and slab guide integrated chip
The output end optical port for leading chip is provided with the first contact pin coupled lens；The output end and the first contact pin of first chip of light waveguide
Optoisolator is set between coupled lens.
The array optical transmitting set chip using high-precision patch, equidistantly bonding be set in substrate, chip chamber away from
It is identical as the input terminal waveguide spacing of the first chip of light waveguide.
Spacing and mostly logical with the high speed between the first chip of light waveguide output end and the second chip of light waveguide input terminal
Spacing between the input optical port for the optical device that road transceiving device is used cooperatively and output optical port is identical.
The array optical transmitting set chip uses four discrete optical transmitting set chips, the hair of the array optical transmitting set chip
Light center height and planar optical waveguide integrated chip waveguide core are highly consistent.
The input waveguide of first chip of light waveguide is provided with light splitting waveguiding structure, and light splitting waveguiding structure and monitoring light are defeated
Enter detector chip to be connected, which will monitor light input detector chip and realize to array optical transmitting set chip
Optical power monitoring.
The silicon optical lens make the electrical interface of array optical transmitting set chip to planar optical waveguide integrated chip distance with
The distance of the electrical interface of array photo detector chip to planar optical waveguide integrated chip is identical.
The input terminal of second chip of light waveguide is provided with the second contact pin coupled lens, the first contact pin coupled lens,
Two contact pin coupled lens are identical relative to the distance of slab guide integrated chip.
The optical detection face center of the array photo detector chip is consistent with the second chip of light waveguide waveguide core；Vertical Heat
Heavy to be pasted on the array photo detector chip, the vertical heat sink upper surface is using array optical detection described in circuit vertical conducting
Device chip.
It is an advantage of the invention that：
The present invention realizes wavelength-division multiplex and wavelength-division demultiplexing using a planar optical waveguide integrated chip simultaneously, and will
Transmitting terminal and receiving terminal are encapsulated into a device, and relative to the existing integrated higher of high-speed multiple channel transceiving device, cost is more
Low, device size smaller is advantageously implemented automation.
Description of the drawings
Fig. 1 is the structural schematic diagram of device embodiment of the present invention；
Fig. 2 is that the array optical transmitting set chip of device embodiment of the present invention and lens place schematic diagram；
Fig. 3 is that the array photo detector chip of device embodiment of the present invention and planar optical waveguide integrate wavelength-division chip and be arranged
Schematic diagram；
Fig. 4 is the planar optical waveguide integrated chip of device embodiment of the present invention；
Fig. 5 is that the contact pin coupled lens of device embodiment of the present invention and planar optical waveguide integrated chip place schematic diagram；
Specific implementation mode
Below by specific embodiment and in conjunction with attached drawing, the present invention will be further described.
A kind of transceiving device of high-speed multiple channel, including array optical transmitting set chip, planar optical waveguide integrated chip, output
Device, array photo detector chip, the first light wave that the planar optical waveguide integrated chip realizes that wavelength-division multiplex acts on by one
Chip and a second chip of light waveguide single-chip integration for realizing wavelength-division demultiplexing are led in one, the input of the first chip of light waveguide
End coupling corresponding with array optical transmitting set chip, the input terminal of the second chip of light waveguide and more wave signal optical couplings, the second light wave
The output end coupling corresponding with array light detecting chip of chip is led, the first chip of light waveguide and the second chip of light waveguide are by a core
Piece integration realization.Between the first chip of light waveguide output end and the second chip of light waveguide input terminal spacing and with this high speed it is more
Spacing between the input optical port for the optical module that channel transceiver part is used cooperatively and output optical port is identical.
As shown in Figure 1, the transceiving device is provided with array optical transmitting set chip 1, the output light of light emitting chip 1 passes through four
A silicon optical lens 2, is optically coupled into planar optical waveguide integrated chip 3, is inputted in the wavelength-division multiplex of planar optical waveguide integrated chip 3
There is light splitting waveguiding structure 401, the coupling corresponding with monitoring light input detector chip 4 of light splitting waveguiding structure 401 will be divided for waveguide
It is coupled into monitoring input photo detector chip 4, realizes optical power monitoring.The transceiving device is provided with array photo detector chip
7, array photo detector chip 7 is set on vertical heat sink 8,7 surface search coverage centre-height of array photo detector chip with
3 waveguide core high precision of planar optical waveguide integrated chip is aligned.The contact pin coupled lens of two identical parameters, i.e. the first contact pin
Coupled lens 6-1 and the second contact pin coupled lens 6-2 realizes the coupling of the transceiving device output light and input light.
The arrangement of array optical transmitting set chip 1 and four silicon optical lens 2 is as shown in Fig. 2, array optical transmitting set chip structure
For four thick wavelength-division light emitting chips 101,102,103,104 as defined in IEEE 802.3ba consensus standards will be met by high-precision
Degree patch is set in same substrate 105, it is ensured that and it integrates the interchannel of wavelength-division multiplex chip 3 with slab guide away from identical, and
And ensure that light emitting chip 101,102,103,104 is consistent apart from 105 Edge Distance of substrate.Four silicon optical lens 2, i.e., 201,
202, it 203,204 is set between light emitting chip 101,102,103,104 and planar optical waveguide integrated chip 3, silicon optical lens
201,202,203,204 focusing center and planar optical waveguide integrate the input waveguide of wavelength-division multiplex chip 3 and precisely align.It is described
Silicon optical lens 2 effect realize make 101,102,103,104 electrical interface of optical transmitting set chip to planar optical waveguide integrated chip 3 away from
From with identical, such light at a distance from across main amplifier electrical interface to planar optical waveguide integrated chip 3 on array photo detector chip 7
The electrical interface of transmitting chip 101,102,103,104 and the electrical interface of light-receiving chip point-blank, are conducive to the later stage
Encapsulation design and operation.
As shown in figure 3, the optical detection face center of array photo detector chip 7 and the second chip of light waveguide output waveguide center
Unanimously, detector array chip 7 is realized vertical optical detection by the present invention using vertical heat sink 8, this vertical heat sink 8 is being pasted with battle array
Gold-plated electrode processing is done in the face of row detector chip 7 simultaneously with heat sink 8 upper surface, realizes circuit vertical conducting.
As shown in figure 4,3 single-chip integration of planar optical waveguide integrated chip has wavelength-division multiplex chip and Wave Decomposition multiplexing chip,
The first chip of light waveguide and a realization wavelength-division that i.e. planar optical waveguide integrated chip 3 realizes wavelength-division multiplex effect by one demultiplex
Second chip of light waveguide forms.There are four input waveguide 301,302,303,304 and an output waves for wavelength-division multiplex chip
Lead 309, wavelength-division multiplex chip is used to carry out multiplex to the signal light of four different wave lengths, the channel spacing of wavelength-division multiplex chip with
The channel spacing of array emitter chip 1 is identical, realizes emitter chip 101,102,103,104 and wavelength-division multiplex chip waveguide pair
It is accurate.There are four output waveguide 305,306,307,308 and an input waveguide 310, wavelength-divisions to demultiplex core for Wave Decomposition multiplexing chip
Piece will be comprising there are four the signal lights of different wave length to carry out partial wave, channel spacing and the detector array core of Wave Decomposition multiplexing chip
The channel spacing of piece 7 is identical, realizes that detector chip 7 is aligned with Wave Decomposition multiplexing chip waveguide
As shown in figure 5, two contact pin coupled lens, i.e., the are arranged between planar optical waveguide integrated chip 3 and module optical port
One contact pin coupled lens 6-1 and the second contact pin coupled lens 6-2, respectively to the output end 309 and Wave Decomposition of wavelength-division multiplex chip
The input terminal 310 of multiplexing chip carries out the coupling of waveguide and contact pin.In the input terminal and contact pin coupled lens of wavelength-division multiplex chip
Optoisolator 5 is provided between 6-1.Relative to plane between first contact pin coupled lens 6-1 and the second contact pin coupled lens 6-2
The distance of waveguide integrated chip 3 is identical.The array optical transmitting set chip 1 is direct modulation laser.
Although the present invention has been illustrated in detail in and has described a relevant specific embodiment reference, this field
Technical staff it should be appreciated that can make various in the form and details in without departing substantially from the spirit and scope of the present invention
Change.These changes fall within the protection domain required by the claim of the present invention.
Claims (8)
1. a kind of transceiving device of high-speed multiple channel, including array optical transmitting set chip (1), planar optical waveguide integrated chip (3),
Array photo detector chip (7), it is characterised in that：The planar optical waveguide integrated chip (3) realizes that wavelength-division multiplex is made by one
First chip of light waveguide and a second chip of light waveguide single-chip integration for realizing wavelength-division demultiplexing are in one, the first light wave
Lead the input terminal coupling corresponding with array optical transmitting set chip (1) of chip, the input terminal of the second chip of light waveguide and more wave signals
Optical coupling, the output end coupling corresponding with array light detecting chip (7) of the second chip of light waveguide；The array optical transmitting set chip
(1) silicon optical lens (2) is provided between slab guide integrated chip (3), the silicon optical lens (2) is so that array optical transmitting set
The electrical interface of chip (1) to distance and the array photo detector chip (7) of planar optical waveguide integrated chip (3) electrical interface to putting down
The distance of face optical waveguide integrated chip (3) is identical.
2. a kind of transceiving device of high-speed multiple channel according to claim 1, it is characterised in that：First waveguide core
The output end optical port of piece is provided with the first contact pin coupled lens (6-1)；The output end of first chip of light waveguide and first is inserted
Optoisolator (5) is set between needle coupled lens (6-1).
3. a kind of high-speed multiple channel transceiving device according to claim 1, it is characterised in that：The array optical transmitting set core
Piece (1) using high-precision patch, equidistantly bonding be set in substrate (105), chip chamber away from the first chip of light waveguide
Input terminal waveguide spacing is identical.
4. a kind of high-speed multiple channel transceiving device according to claim 1, it is characterised in that：First chip of light waveguide
Spacing and the optical module being used cooperatively with the high-speed multiple channel transceiving device between output end and the second chip of light waveguide input terminal
Input optical port with output optical port between spacing it is identical.
5. a kind of high-speed multiple channel transceiving device according to claim 1 or 2, it is characterised in that：The array light emitting
Device chip (1) uses four discrete optical transmitting set chips (101,102,103,104), the array optical transmitting set chip (1)
Height of luminescent center and planar optical waveguide integrated chip (3) waveguide core are highly consistent.
6. a kind of high-speed multiple channel transceiving device according to claim 1 or 2, it is characterised in that：First optical waveguide
The input waveguide of chip is provided with light splitting waveguiding structure (401), and light splitting waveguiding structure (401) inputs detector chip with monitoring light
(4) corresponding coupling, the light splitting waveguiding structure (401) will monitor light input detector chip (4) and realize to array optical transmitting set core
The optical power monitoring of piece (1).
7. a kind of high-speed multiple channel transceiving device according to claim 2, it is characterised in that：Second chip of light waveguide
Input terminal be provided with the second contact pin coupled lens (6-2), the first contact pin coupled lens (6-1), the second contact pin coupled lens (6-
2) distance relative to slab guide integrated chip (3) is identical.
8. a kind of high-speed multiple channel transceiving device according to claim 1 or 2, it is characterised in that：The array optical detection
The optical detection face center of device chip (7) is consistent with the second chip of light waveguide output waveguide center；Vertical heat sink (8) are pasted on described
On array photo detector chip (7), vertical heat sink (8) upper surface is using array photo detector chip described in circuit vertical conducting
(7)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201611077800.9A CN106405755B (en) | 2016-11-30 | 2016-11-30 | A kind of transceiving device of high-speed multiple channel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611077800.9A CN106405755B (en) | 2016-11-30 | 2016-11-30 | A kind of transceiving device of high-speed multiple channel |
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| CN106405755A CN106405755A (en) | 2017-02-15 |
| CN106405755B true CN106405755B (en) | 2018-11-06 |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106896455A (en) * | 2017-04-27 | 2017-06-27 | 苏州易锐光电科技有限公司 | Multichannel poly-lens WDM device and its tool and methods for using them |
| CN107153237A (en) * | 2017-06-20 | 2017-09-12 | 华中科技大学 | A kind of light transmit-receive integrated device of multichannel silicon substrate wavelength-division multiplex high speed |
| CN108418635A (en) * | 2017-08-24 | 2018-08-17 | 四川新易盛通信技术有限公司 | A kind of eight channel high rate optical sending devices |
| CN108121040A (en) * | 2017-12-18 | 2018-06-05 | 江苏奥雷光电有限公司 | A kind of optical module |
| CN109116469B (en) * | 2018-08-21 | 2020-07-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN109725392A (en) * | 2019-02-19 | 2019-05-07 | 武汉电信器件有限公司 | A kind of light emission component and light-receiving component |
| CN111999801A (en) * | 2019-05-27 | 2020-11-27 | 华为技术有限公司 | PLC chip, TOSA, BOSA, optical module and optical network equipment |
| CN111708131A (en) * | 2020-06-22 | 2020-09-25 | 武汉光迅科技股份有限公司 | Light emitting module and optical module |
| CN112817102A (en) * | 2021-01-04 | 2021-05-18 | 武汉光迅科技股份有限公司 | Optical module and preparation method thereof |
| CN113281841B (en) | 2021-04-16 | 2022-05-27 | 武汉联特科技股份有限公司 | Silicon optical multichannel parallel optical component and coupling method thereof |
| CN113740979A (en) * | 2021-08-17 | 2021-12-03 | 武汉光迅科技股份有限公司 | Optical device and optical module |
| CN114070414B (en) * | 2021-11-09 | 2023-04-11 | 中国电子科技集团公司第二十九研究所 | Multichannel radio frequency light receiving arrangement |
| CN115826158A (en) * | 2022-11-08 | 2023-03-21 | 讯芸电子科技(中山)有限公司 | Light receiving device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101995616B (en) * | 2009-08-19 | 2012-05-23 | 中国科学院半导体研究所 | Multi-channel optical transceiving module totally made of silicon-based material |
| CN201708807U (en) * | 2010-07-06 | 2011-01-12 | 武汉奥新科技有限公司 | Multi-channel difunctional wavelength division multiplexing photoelectric integrated module |
| US8625989B2 (en) * | 2011-01-21 | 2014-01-07 | Finisar Corporation | Multi-laser transmitter optical subassemblies for optoelectronic modules |
| CN202285050U (en) * | 2011-05-30 | 2012-06-27 | 武汉电信器件有限公司 | Planar-lightwave-circuit (PLC) type hybrid integrated optical component for compact small-form-factor pluggable/compact small-form-factor (CSFP/CSFF) packaging |
| TWM484713U (en) * | 2014-03-10 | 2014-08-21 | Luxnet Corp | Replaceable type light-emitting module and optical transceiver equipped with replaceable type light-emitting module |
| CN205176331U (en) * | 2015-10-08 | 2016-04-20 | 武汉电信器件有限公司 | Light wavelength devision multiplex separates multiplexing encapsulation subassembly |
| CN105759371B (en) * | 2016-01-07 | 2018-08-07 | 武汉电信器件有限公司 | A kind of parallel emission and reception module and production method for dual link transmission |
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