CN104601244B - A kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit - Google Patents

A kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit Download PDF

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CN104601244B
CN104601244B CN201410804586.7A CN201410804586A CN104601244B CN 104601244 B CN104601244 B CN 104601244B CN 201410804586 A CN201410804586 A CN 201410804586A CN 104601244 B CN104601244 B CN 104601244B
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chip
optical
data clock
laser
circuit
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CN104601244A (en
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李世瑜
余少华
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Wuhan Telecommunication Devices Co Ltd
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Wuhan Telecommunication Devices Co Ltd
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Abstract

The present invention is applied to technical field of photo communication, there is provided a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit, including:UFIU UMSC Fiber Interface Unit, optoelectronic transceiver unit and electric interface unit, optoelectronic transceiver unit complete opto-electronic conversion and high-speed electrical signals processing function using optoelectronic transceiver chip;The inner workings of optoelectronic transceiver chip include:Transmitting terminal data clock recovery circuit receives the electric signal of the electric interface unit input, pretreated electric signal is carried out to be loaded on laser by drive circuit, after high-speed electrical signals are converted into high-speed optical signal by laser, then exported after wavelength division multiplexer is multiplexed;The optical signal received first passes through Wave decomposing multiplexer and is demultiplexing as 16 road optical signals, it is transferred to photo-detector, trans-impedance amplifier is sent to after opto-electronic conversion and receiving terminal data clock recovery circuit is handled, consider that the factors such as cost, transmission loss, dispersion, size requirements select the embodiment of different optical transceiver modules, realize the transmission of long-range single mode fiber or short distance multimode transmissions.

Description

A kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit
Technical field
The invention belongs to technical field of photo communication, more particularly to a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit.
Background technology
In recent years, with high-quality video business, cloud computing, large-scale data center and fixation/mobile Internet application Demand sustainable growth, people are more and more to information quantity requirement, require more and more faster to message data rate.Operators are also recognized Knowing bandwidth demand can constantly be lifted with data explosion, the paces of their accelerated evolution transmission networks, from 40G/100G Upgrade to 400Gbps, meet fervent demand of the people to speed.
In March, 2014, CDFP industry alliances issued the multi-source agreement CDFP MSA (400Gbps of the hot pluggable modules of 400G Form-factor pluggable Multi-sources Agreement), the mechanically and electrically interface for specification 400G modules Design, its specification is based on 802.3 electrical and optical interface standard of OIF CEI-28GVSR and IEEE, there is provided there is heat to insert Dial the AN connector and module of appearance and size.Compact appearance and size defined in agreement, there are two kinds of styles of short and elongated. 400G CDFP are mainly used in the resource-intensive application in telecommunications, network and enterprise computing environment.
Traditional optical module is assembled using discrete component.By taking 100G CFP as an example, it includes 4 discrete light Emitting module (Transmitter Optical Subassembly, TOSA), 4 light-receiving component (Receiver Optical Subassembly, ROSA), wavelength division multiplexer (MUX), Wave decomposing multiplexer (DEMUX) etc..Wherein, 4 pairs of optical transceiver modules lead to Cross flexible PCB (FPC) to be connected on circuit board (PCB), microcontroller is also pasted with simultaneously on pcb board (MicroControllerUnit, MCU), clock recovery chip (Clock and DataRecovery, CDR) etc..Module general assembly It is about 80*145mm with area2, as shown in Figure 1.It can be seen that optical transceiving device occupies a big chunk area of optical module, And the assembly cost of optical transceiver cell in itself also can not be ignored.As the demand to information capacity is increasing, in same light , it is necessary to the transmission of higher rate under mouthful density, for example, the size of 400G CDFP optical modules is only 100G CFP module sizes 1/3rd or so, but the internal 25G for containing 16 passages respectively is received and transmitter unit (future also 8*50G, 4*100G etc. Scheme).Therefore, the encapsulation technology of traditional discrete assembly can not meet the optical module requirement of 400G and its above speed. On the other hand, it can be influenceed using discrete assembly assembling by ghost effect in encapsulating, make Bandwidth-Constrained.It is moreover, each discrete Element must carry out performance test respectively before assembling, then carry out case package, to ensure that the performance of completed knocked down products is qualified.Example As needed first to carry out performance test to light emission component and light-receiving component in encapsulation process, then to the optical mode with control circuit Block is tested, and undoubtedly process is complicated for this method for packing, time and effort consuming.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit, existing to solve Technology can not realize the problem of 400Gb/s High Speeding Optical Transmitter-receiver Circuits.
The embodiment of the present invention is achieved in that a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit, UFIU UMSC Fiber Interface Unit, Optoelectronic transceiver unit and electric interface unit;
The optoelectronic transceiver unit includes:Transmitting terminal data clock recovery circuit chip, driver chip, laser core Piece, photo detector chip, trans-impedance amplifier chip, receiving terminal data clock recovery circuit chip and control circuit chip;
The transmitting terminal data clock recovery circuit chip receives the electric signal of the electric interface unit input, is located in advance Electric signal after reason is loaded on the chip of laser by the driver chip, and the chip of laser is by high speed telecommunications Exported after number being converted into high-speed optical signal;
The photo detector chip receives input optical signal, and after the optical signal received is converted into electric signal, passes The trans-impedance amplifier chip and the receiving terminal data clock recovery circuit chip are sent to, carries out data clock sampling and caching Processing, then it is sent to the electric interface unit;
Described transmitting terminal data clock recovery circuit chip, driver chip, laser in the optoelectronic transceiver unit Chip, photo detector chip, trans-impedance amplifier chip, receiving terminal data clock recovery circuit chip and control circuit chip, lead to Crossing wire bonding, either welding or adhesion process are mounted on circuit board or flexible PCB, are electrically connected;
Transmission range at 500 meters and within when, the chip of laser is that 25G vertical cavity surface emitting lasers or straight adjust are swashed Light device chip;The photo detector chip is 25Gb/s diode detector chips;
When transmission range is more than 500 meters, the optoelectronic transceiver unit also includes wavelength division multiplexer chip and wavelength-division demultiplexes The high-speed electrical signals are converted into after the high-speed optical signal by the wavelength division multiplexer by device chip, the chip of laser Exported after chip multiplexing;The Wave decomposing multiplexer chip receives the optical signal, and received optical signal is demultiplexed, Received after being divided into 16 road optical signals by the photo detector chip;The chip of laser is 25G Direct Modulating Diode Lasers Device or Electroabsorption Modulated Laser chip;The photo detector chip is that 25Gb/s diode detectors or avalanche diode detect Device chip.
Second of 400Gb/s hot plug High Speeding Optical Transmitter-receiver Circuit, including:UFIU UMSC Fiber Interface Unit, optoelectronic transceiver unit and electricity connect Mouth unit;When transmission range is more than 500 meters, the optoelectronic transceiver unit includes photoelectric multiplexing/demultiplexing chip, transmitting end data Clock recovery circuitry chip, driver chip, trans-impedance amplifier chip, receiving terminal data clock recovery circuit chip and control electricity Road chip;
The transmitting terminal data clock recovery circuit chip receives the electric signal of the electric interface unit input, carries out The pretreated electric signal is loaded on the photoelectric multiplexing/demultiplexing chip by the driver chip, passes through electricity Multiplexing output optical signal after light conversion;The optical signal of input carries out photoelectricity by the photoelectric multiplexing/demultiplexing chip demultiplexing After conversion, the trans-impedance amplifier chip and the receiving terminal data clock recovery circuit chip are sent to, carries out data clock Sampling and caching process, then it is sent to the electric interface unit;
The photoelectric multiplexing/demultiplexing chip includes opto-electronic conversion, electro-optic conversion, wavelength-division multiplex and demultiplexing function.
The third 400Gb/s hot plug High Speeding Optical Transmitter-receiver Circuit, including:UFIU UMSC Fiber Interface Unit, optoelectronic transceiver unit and electricity connect Mouth unit;
The electric interface unit is used for the communication interface for providing module and external system;
The UFIU UMSC Fiber Interface Unit transmission range at 500 meters and within when, be MPO types optical interface or ribbon fiber;Transmission It is duplex LC type optical interfaces when distance is more than 500 meters;
The optoelectronic transceiver unit comprises at least optoelectronic transceiver chip and chip of laser, the optoelectronic transceiver chip and institute State the assembling between chip of laser be by integrate after the coupling of light path between micro optical element or do not couple Direct Bonding and Into;
When transmission range is more than 500 meters, the optoelectronic transceiver chip is optoelectronic transceiver chip one;
The optoelectronic transceiver chip one includes:Transmitting terminal data clock recovery circuit, drive circuit, modulation circuit, wavelength-division Multiplexer, Wave decomposing multiplexer, photo-detector, trans-impedance amplifier, receiving terminal data clock recovery circuit and control circuit;
The chip of laser is continuous wave laser or tunable laser chip;
The transmitting terminal data clock recovery circuit receives the electric signal of the electric interface unit input, after being pre-processed High-speed electrical signals be input to drive circuit and modulation circuit, the light of the chip of laser output produces after modulators modulate Raw high-speed optical signal, then exported after wavelength division multiplexer multiplexing;The Wave decomposing multiplexer receives the optical signal, and Received optical signal is demultiplexed, is received by the photo-detector after being divided into 16 road optical signals, is passed after opto-electronic conversion Trans-impedance amplifier and receiving terminal data clock recovery circuit are sent to, carries out signal amplification, data clock sampling and caching process, then It is sent to electric interface unit;The control circuit completes the automated power control to chip of laser, extinction ratio compensates, soft switching Deng intelligent control, and the real-time monitoring to photo-detector received optical power, so as to realize to the whole optical transceiver module Relevant operating conditions detection limit real-time supervision and reporting;
Transmission range at 500 meters and within when, the optoelectronic transceiver chip is optoelectronic transceiver chip two;
The optoelectronic transceiver chip two includes:Transmitting terminal data clock recovery circuit, drive circuit, photo-detector, across resistance Amplifier, receiving terminal data clock recovery circuit and control circuit;
The chip of laser is 25G vertical cavity surface emitting lasers or directly modulated lasers chip;
The transmitting terminal data clock recovery circuit receives electric signal, carries out pretreated high-speed electrical signals through driving electricity Road is loaded on the chip of laser, and chip of laser exports after high-speed electrical signals are converted into high-speed optical signal;Receive Optical signal transmission is sent to trans-impedance amplifier after opto-electronic conversion and receiving terminal data clock recovers electricity to light-receiving detector Road, signal amplification, data clock sampling and caching process are carried out, then be sent to electric interface unit;The control circuit completion pair The intelligent control of the automated power control of chip of laser, extinction ratio compensation, soft switching etc., and light work(is received to photo-detector The real-time monitoring of rate, so as to realize the real-time supervision and reporting of the relevant operating conditions detection limit to the whole optical transceiver module.
4th kind of 400Gb/s hot plug High Speeding Optical Transmitter-receiver Circuit, including:UFIU UMSC Fiber Interface Unit, optoelectronic transceiver unit and electricity connect Mouth unit;
The electric interface unit is used for the communication interface for providing module and external system;
When transmission range is more than 500 meters, the UFIU UMSC Fiber Interface Unit is duplex LC type optical interfaces;The optoelectronic transceiver unit Including at least optoelectronic transceiver chip three;
The optoelectronic transceiver chip three includes:Transmitting terminal data clock recovery circuit, drive circuit, modulation circuit, laser Device, wavelength division multiplexer, Wave decomposing multiplexer, photo-detector, trans-impedance amplifier, receiving terminal data clock recovery circuit and control electricity Road;
The transmitting terminal data clock recovery circuit receives the electric signal of the electric interface unit input, after being pre-processed High-speed electrical signals be input to driver and modulator, the light of the laser output produces high-speed optical signal after ovennodulation, Exported again after wavelength division multiplexer multiplexing;Wave decomposing multiplexer described in the optical signals of reception is demultiplexing as 16 road light letters Number, the photo-detector is transferred to, the trans-impedance amplifier and the receiving terminal data clock are sent to after opto-electronic conversion Restoring circuit, signal amplification, data clock sampling and caching process are carried out, then be sent to the electric interface unit;The control Circuit completes the automated power control to laser, extinction ratio compensates, the intelligent control of soft switching, and to photo detector chip The real-time monitoring of received optical power, so as to realize the real-time prison of the relevant operating conditions detection limit to the whole optical transceiver module Control reports.
A kind of beneficial effect of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided in an embodiment of the present invention includes:
1st, a kind of 400Gb/s optical transceiver modules provided by the invention are to be based on (supporting 25.78Gb/s to arrive per passage 25G 27.97Gb/s operating rate, is reduced to 25G), what 16 transceiver channels transmitted to realize 400G signals.Therefore its electrical interface bag 25G reception signals pin ,+3.3V power supplys energization pins, the low speed of 25G transmission signals pin containing 16 pairs of difference, 16 pairs of difference Signal pins and ground pin etc..Wherein low speed signal pin comprises at least serial data pin, serial clock pin etc..It is each logical Specifically accessible photoelectricity index is as follows in road:Light receiving part-three dB bandwidth is at least up to more than 18GHZ, and responsiveness is higher than 0.4A/W, it is better than -8dBm under 25Gb/s per passage OMA sensitivity.Light emitting portion is more than 500 meters (including 500 meters) When transmitting over long distances, using long wavelength laser, its extinction ratio is better than 3dB, and the OMA value of correlation intensity noise is less than -130dB/ Hz, light reflection indicatrix are less than -12dB;It is excellent using the laser of short wavelength, its extinction ratio in the short-distance transmission less than 500 meters In 3dB, light reflection indicatrix is less than -12dB;
2nd, according to the concrete application environment of the optical transceiver module and the specific requirement of function can be realized, and consider into The factors such as sheet, transmission loss, dispersion, size requirements are selected, and the different envelopes of various adaptability are provided for various application environments The embodiment of the optical transceiver module of assembling structure, directly modulated lasers or outer adjusting laser can be used, realize that long-range single mode fiber passes Defeated or short distance multimode transmissions;
3rd, optoelectronic transceiver chip provided in an embodiment of the present invention, laser (Laser Diode) array, detector are integrated with (Photodiode) array, wavelength division multiplexer (Multiplexer, MUX), Wave decomposing multiplexer (Demultiplexer, DEMUX) and the circuit with the function such as driving, signal amplification, shaping, processing and control, instead of in the traditional optical module of original, Discrete light emission component (Transmitter Optical Subassembly, TOSA), light-receiving component (Receiver Optical Subassembly, ROSA), data clock recover chip (Clock and Data Recovery, CDR), micro-control The elements such as device (MicroControllerUnit, MCU) processed, using Wafer level packaging, realize optical signal transceiver function, gram Taken in traditional optical module use discrete assembly caused by size it is big the problem of, by multiplex optical element and electricity component monolithic Or hybrid integrated is together, overall dimension greatly reduces, about the 1/3 of CFP, there is compact-sized, low in energy consumption, transmission rate height Etc. advantage, and reduce the coupling between the number of assembling steps between discrete component and cumbersome optical element, simplify encapsulation And testing process, shorten man-hour of production, and work efficiency lift-rising at double;Using based on complementary metal oxide semiconductor The manufacture craft of (Complementary Metal Oxide Semiconductor, CMOS), large-scale production, so as to have The cheap advantage of cost.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these Accompanying drawing obtains other accompanying drawings.
Fig. 1 is traditional CFP structural representations;
Fig. 2 is the structural representation of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided in an embodiment of the present invention;
Fig. 3 is the first implementation of the optoelectronic transceiver unit of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The structural representation of example;
Fig. 4 is the second implementation of the optoelectronic transceiver unit of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The structural representation of example;
Fig. 5 is the 3rd implementation of the optoelectronic transceiver unit of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The structural representation of example;
Fig. 6 is the four, the 5th of the optoelectronic transceiver unit of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The structural representation of embodiment;
Fig. 7 is the six, the 7th of the optoelectronic transceiver unit of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The structural representation of embodiment;
Fig. 8 is the structural representation of optoelectronic transceiver chip provided in an embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
In order to illustrate technical solutions according to the invention, illustrated below by specific embodiment.
It is illustrated in figure 2 the structural representation of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention, the light Transceiver module includes:UFIU UMSC Fiber Interface Unit 100, optoelectronic transceiver unit 101 and electric interface unit 102.
Embodiment one
Embodiment one provided by the invention is a kind of light of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The first embodiment of electric Transmit-Receive Unit, the present embodiment be transmission range at 500 meters and within embodiment, be illustrated in figure 3 this A kind of structural representation of the first embodiment of the optoelectronic transceiver unit of the 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided is provided Figure, from the figure 3, it may be seen that optoelectronic transceiver unit includes:Transmitting terminal data clock recovery circuit chip 201, driver chip 202, swash Light device chip 203, photo detector chip 204, trans-impedance amplifier chip 205 and receiving terminal data clock recovery circuit chip 206 With control circuit chip 207.
Transmitting terminal data clock recovery circuit chip 201 receives the electric signal of input, carries out pretreated electric signal and leads to Device chip 202 of overdriving is loaded on chip of laser 203, and high-speed electrical signals are converted into high-speed light by chip of laser 203 to be believed Exported after number.Photo detector chip 204 receives input optical signal, and after the optical signal received is converted into electric signal, passes Trans-impedance amplifier chip 205 and receiving terminal data clock recovery circuit chip 206 are sent to, is carried out at data clock sampling and caching Exported again after reason.
Transmitting terminal data clock recovery circuit chip 201, driver chip 202, chip of laser 203, photo-detector core Piece 204, trans-impedance amplifier chip 205, receiving terminal data clock recovery circuit chip 206 and control circuit chip 207, by drawing Either welding or adhesion process are mounted on circuit board or flexible PCB 208 line bonding, are electrically connected.
Chip of laser 203 is 25G vertical cavity surface emitting lasers or directly modulated lasers chip;Photo detector chip 204 For 25Gb/s diode detector chips.
Control circuit chip 207 completes automated power control to chip of laser 203, extinction ratio compensation, soft switching Intelligent control, and the real-time monitoring to the received optical power of photo detector chip 204, so as to realize to whole optical transceiver module The real-time supervision and reporting of relevant operating conditions detection limit.
Electric interface unit 102 is used for the communication interface for providing module and external system.
UFIU UMSC Fiber Interface Unit 100 is MPO (Multi-fiber Push On) type optical interfaces or ribbon fiber.
Embodiment two
Embodiment two provided by the invention is a kind of light of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The second embodiment of electric Transmit-Receive Unit, the present embodiment are embodiment of the transmission range more than 500 meters, are illustrated in figure 4 this hair A kind of structural representation of the second embodiment of the optoelectronic transceiver unit of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit of bright offer Figure, as shown in Figure 4, optoelectronic transceiver unit includes:Transmitting terminal data clock recovery circuit chip 301, driver chip 302, swash Light device chip 303, wavelength division multiplexer chip 304, Wave decomposing multiplexer chip 305, photo detector chip 306, trans-impedance amplifier Chip 307 and receiving terminal data clock recovery circuit chip 308 and control circuit chip 309.
Wavelength division multiplexer chip 304 is to be multiplexed into 16 optical signals of different wave length all the way.For example, can be configured To use a scheme in various WDM schemes as such as thick WDM (CWDM), intensive WDM (DWEM) or light WDM (LWDM) To be operated.Otherwise similarly, Wave decomposing multiplexer chip 305 is demultiplexed for receiving optical signal, will be divided into 16 all the way Road optical signal.
Transmitting terminal data clock recovery circuit chip 301 receives the electric signal of input, carries out pretreated electric signal and leads to Device chip 302 of overdriving is loaded on chip of laser 303, and high-speed electrical signals are converted into high-speed light by chip of laser 303 to be believed Number by wavelength division multiplexer chip 304 multiplexing after export.Wave decomposing multiplexer chip 305 receives optical signal, and by received light Signal is demultiplexed, and is divided into after 16 road optical signals and is received input optical signal, and the light that will be received by photo detector chip 306 After signal is converted into electric signal, trans-impedance amplifier chip 307 and receiving terminal data clock recovery circuit chip 308 are sent to, Exported after carrying out data clock sampling and caching process.
Transmitting terminal data clock recovery circuit chip 301, driver chip 302, chip of laser 303, wavelength division multiplexer Chip 304, Wave decomposing multiplexer chip 305, photo detector chip 306, trans-impedance amplifier chip 307, receiving terminal data clock Restoring circuit chip 308 and control circuit chip 309, by wire bonding, either welding or adhesion process are mounted on circuit board Or on flexible PCB 310, it is electrically connected.
Chip of laser 303 is 25G directly modulated lasers or Electroabsorption Modulated Laser chip;Photo-detector Chip 306 is 25Gb/s diode detectors or avalanche diode detector chip.
Control circuit chip 309 completes automated power control to chip of laser 303, extinction ratio compensation, soft switching Intelligent control, and the real-time monitoring to the received optical power of photo detector chip 306, so as to realize to whole optical transceiver module The real-time supervision and reporting of relevant operating conditions detection limit.
Electric interface unit 102 is used for the communication interface for providing module and external system.
UFIU UMSC Fiber Interface Unit 100 is duplex LC type optical interfaces.
Embodiment three
Embodiment three provided by the invention is a kind of light of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The 3rd embodiment of electric Transmit-Receive Unit, the present embodiment are embodiment of the transmission range more than 500 meters, are illustrated in figure 5 this hair A kind of structural representation of the 3rd embodiment of the optoelectronic transceiver unit of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit of bright offer Figure, as shown in Figure 5, optoelectronic transceiver unit includes:Photoelectric multiplexing/demultiplexing chip 403, transmitting terminal data clock recovery circuit core Piece 401, driver chip 402, trans-impedance amplifier chip 404, receiving terminal data clock recovery circuit chip 405 and control circuit Chip 406.
Transmitting terminal data clock recovery circuit chip 401 receives the electric signal of electric interface unit input, after being pre-processed Electric signal be loaded into by driver chip 402 on photoelectric multiplexing/demultiplexing chip 403, it is defeated by being multiplexed after electro-optic conversion Optical signals;The optical signal of input is by photoelectric multiplexing/demultiplexing chip demultiplexing 403, after carrying out opto-electronic conversion, be sent to across Impedance amplifier chip 404 and receiving terminal data clock recovery circuit chip 405, data clock sampling and caching process are carried out, then It is sent to electric interface unit 102.
Photoelectric multiplexing/demultiplexing chip 403 is made using silicon substrate or III-V compound semiconductor material, and it includes photoelectricity Conversion, electro-optic conversion, wavelength-division multiplex and demultiplexing function.
Transmitting terminal data clock recovery circuit chip 401, driver chip 402, photoelectricity in optoelectronic transceiver unit 101 is multiple With/demultiplexing chip 403, trans-impedance amplifier chip 404, receiving terminal data clock recovery circuit chip 405 and control circuit core Piece 406, by wire bonding, either welding or adhesion process are mounted on circuit board or flexible PCB 407, are electrically connected Connect.
Control circuit chip 406 completes the automated power control to laser, extinction ratio compensation, the intelligence control of soft switching System, and the real-time monitoring to photo detector chip received optical power, so as to realize the related work to whole optical transceiver module The real-time supervision and reporting of state-detection amount.
Electric interface unit 102 is used for the communication interface for providing module and external system.
UFIU UMSC Fiber Interface Unit 100 is duplex LC type optical interfaces.
Example IV
Example IV provided by the invention is a kind of light of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention Situation of the fourth embodiment transmission range of electric Transmit-Receive Unit more than 500 meters, is illustrated in figure 6 one kind provided by the invention The structural representation of the fourth embodiment of the optoelectronic transceiver unit of 400Gb/s hot plug High Speeding Optical Transmitter-receiver Circuits, optoelectronic transceiver list Member 101 comprises at least optoelectronic transceiver chip 1 and chip of laser 501, optoelectronic transceiver chip 1 and chip of laser Assembling between 501 is formed by integrated or Direct Bonding after the light path coupling between micro optical element.
Electric interface unit 102 is used for the communication interface for providing module and external system;UFIU UMSC Fiber Interface Unit 100 is duplex LC types Optical interface.
Optoelectronic transceiver chip 1 includes:Transmitting terminal data clock recovery circuit, drive circuit, modulation circuit, wavelength-division are multiple With device, Wave decomposing multiplexer, photo-detector, trans-impedance amplifier, receiving terminal data clock recovery circuit and control circuit;Laser Chip 501 is continuous wave laser or tunable laser chip.
Transmitting terminal data clock recovery circuit receives the electric signal of electric interface unit input, carries out pretreated high speed electricity Signal is input to drive circuit and modulation circuit, and the light that chip of laser 501 exports produces high-speed optical signal after ovennodulation, then Exported after wavelength division multiplexer is multiplexed;Wave decomposing multiplexer receives optical signal, and received optical signal is demultiplexed, point Received after into 16 road optical signals by photo-detector, trans-impedance amplifier is sent to after opto-electronic conversion and receiving terminal data clock is extensive Compound circuit, signal amplification, data clock sampling and caching process are carried out, then be sent to electric interface unit;Control circuit completion pair The intelligent control of the automated power control of chip of laser 501, extinction ratio compensation, soft switching etc., and to photo detector chip The real-time monitoring of received optical power, so as to realize in the real-time monitoring to the relevant operating conditions detection limit of whole optical transceiver module Report.
On wafer of the optoelectronic transceiver chip 502 based on SOI, using CMOS technology, make the member of multiple identical or different functions Part forming array, modular one single chip on the whole, realize one or more optically and electrically information processing functions.
The preparation method of optoelectronic transceiver chip 502 includes on soi substrates carrying out simultaneously electricity component and optical element Make or optical element makes after electricity component.
The manufacture craft of electricity component includes doping, photoetching, etching, is formed and recovers electricity across resistance amplifying circuit, data clock Road, drive circuit and control circuit;The manufacture craft of optical element includes photoetching, etching, deposit or epitaxial growth other materials, Form light multiplexing function, Optical Demultiplexing function, photo-detector.
The optical coupling interface of optoelectronic transceiver chip 502 is spot-size converter structure, or grating coupler structure, Huo Zhetong Cross outside micro optical element and carry out coupling output.
Optoelectronic transceiver chip 502 is that either Reflow Soldering or adhesion process are mounted on circuit board (PCB) by wire bonding Or on flexible PCB (FPC) 503, it is electrically connected.
Embodiment five
Example IV provided by the invention is a kind of light of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention The fourth embodiment transmission range of electric Transmit-Receive Unit at 500 meters and within situation, be illustrated in figure 6 one kind provided by the invention The structural representation of 5th embodiment of the optoelectronic transceiver unit of 400Gb/s hot plug High Speeding Optical Transmitter-receiver Circuits, optoelectronic transceiver list Member comprises at least optoelectronic transceiver chip 2 502 and chip of laser 501, optoelectronic transceiver chip 2 502 and chip of laser 501 it Between assembling be by integrating after the coupling of light path between micro optical element or not coupling what Direct Bonding formed.
Electric interface unit 102 is used for the communication interface for providing module and external system;UFIU UMSC Fiber Interface Unit 100 is MPO type light Interface or ribbon fiber.
Optoelectronic transceiver chip 2 502 includes:Transmitting terminal data clock recovery circuit, drive circuit, photo-detector, put across resistance Big device, receiving terminal data clock recovery circuit and control circuit;Chip of laser 501 be 25G vertical cavity surface emitting lasers or Directly modulated lasers chip.
Transmitting terminal data clock recovery circuit receives electric signal, carries out pretreated high-speed electrical signals and adds through drive circuit It is downloaded on chip of laser 501, chip of laser 501 exports after high-speed electrical signals are converted into high-speed optical signal;The light of reception Signal is transferred to light-receiving detector, and trans-impedance amplifier is sent to after opto-electronic conversion and receiving terminal data clock recovers electricity Road, signal amplification, data clock sampling and caching process are carried out, then be sent to electric interface unit;Control circuit is completed to laser The intelligent control of the automated power control of device chip 501, extinction ratio compensation, soft switching etc., and photo detector chip is received The real-time monitoring of luminous power, so as to realize the real-time supervision and reporting to the relevant operating conditions detection limit of whole optical transceiver module.
On wafer of the optoelectronic transceiver chip 502 based on SOI, using CMOS technology, make the member of multiple identical or different functions Part forming array, modular one single chip on the whole, realize one or more optically and electrically information processing functions.
The preparation method of optoelectronic transceiver chip 502 includes on soi substrates carrying out simultaneously electricity component and optical element Make or optical element makes after electricity component.
The manufacture craft of electricity component includes doping, photoetching, etching, is formed and recovers electricity across resistance amplifying circuit, data clock Road, drive circuit and control circuit;The manufacture craft of optical element includes photoetching, etching, deposit or epitaxial growth other materials, Form light multiplexing function, Optical Demultiplexing function, photo-detector.
The optical coupling interface of optoelectronic transceiver chip 502 is spot-size converter structure, or grating coupler structure, Huo Zhetong Cross outside micro optical element and carry out coupling output.
Optoelectronic transceiver chip 502 is that either Reflow Soldering or adhesion process are mounted on circuit board (PCB) by wire bonding Or on flexible PCB (FPC) 503, it is electrically connected.
Embodiment six
Embodiment six provided by the invention is a kind of light of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention Situation of the 5th embodiment transmission range of electric Transmit-Receive Unit more than 500 meters, is illustrated in figure 7 one kind provided by the invention The structural representation of the sixth embodiment of the optoelectronic transceiver unit of 400Gb/s hot plug High Speeding Optical Transmitter-receiver Circuits, optoelectronic transceiver list Member 101 comprises at least optoelectronic transceiver chip 3 601.
Electric interface unit 102 is used for the communication interface for providing module and external system;UFIU UMSC Fiber Interface Unit 100 is duplex LC types Optical interface.
Optoelectronic transceiver chip 3 601 includes:Transmitting terminal data clock recovery circuit, drive circuit, modulation circuit, laser Device, wavelength division multiplexer, Wave decomposing multiplexer, photo-detector, trans-impedance amplifier, receiving terminal data clock recovery circuit and control electricity Road.
Transmitting terminal data clock recovery circuit receives the electric signal of electric interface unit input, carries out pretreated high speed electricity Signal is input to driver and modulator, and the light of laser output produces high-speed optical signal after ovennodulation, then is answered by wavelength-division Exported after being multiplexed with device;The optical signals Wave decomposing multiplexer of reception is demultiplexing as 16 road optical signals, is transferred to photo-detector, warp Trans-impedance amplifier and receiving terminal data clock recovery circuit are sent to after crossing opto-electronic conversion, carries out signal amplification, data clock is adopted Sample and caching process, then it is sent to electric interface unit;Control circuit completes the automated power control to laser, extinction ratio is mended Repay, the intelligent control of soft switching, and the real-time monitoring to photo detector chip received optical power, whole light is received so as to realize Send out the real-time supervision and reporting of the relevant operating conditions detection limit of module.
On wafer of the optoelectronic transceiver chip 601 based on SOI, using CMOS technology, make the member of multiple identical or different functions Part forming array, modular one single chip on the whole, realize one or more optically and electrically information processing functions.
The preparation method of optoelectronic transceiver chip 601 includes on soi substrates carrying out simultaneously electricity component and optical element Make or optical element makes after electricity component;
The manufacture craft of electricity component includes doping, photoetching, etching, is formed and recovers electricity across resistance amplifying circuit, data clock Road, drive circuit and control circuit;The manufacture craft of optical element includes photoetching, etching, deposit or epitaxial growth other materials, Form light multiplexing function, Optical Demultiplexing function, photo-detector, laser;
The optical coupling interface of optoelectronic transceiver chip 601 is spot-size converter structure, or grating coupler structure, Huo Zhetong Cross outside micro optical element and carry out coupling output;
Optoelectronic transceiver chip 601 is that either Reflow Soldering or adhesion process are mounted on circuit board or flexibility by wire bonding On circuit board 602, it is electrically connected.
Embodiment seven
Embodiment seven provided by the invention is a kind of light of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention 5th embodiment transmission range of electric Transmit-Receive Unit at 500 meters and within situation, UFIU UMSC Fiber Interface Unit 100 is MPO type optical interfaces Or ribbon fiber, it is illustrated in figure 7 the optoelectronic transceiver list of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit provided by the invention a kind of The structural representation of 7th embodiment of member, optoelectronic transceiver unit 101 comprise at least optoelectronic transceiver chip 4 601.
Optoelectronic transceiver chip 4 601 includes:Transmitting terminal data clock recovery circuit, drive circuit, laser, optical detection Device, trans-impedance amplifier, receiving terminal data clock recovery circuit and control circuit
Transmitting terminal data clock recovery circuit receives electric signal, carries out pretreated high-speed electrical signals and is added by driver It is downloaded on laser, laser exports after high-speed electrical signals are converted into high-speed optical signal;Light-receiving detector receives defeated respectively Optical signal, and after the optical signal received is converted into electric signal, it is sent to trans-impedance amplifier and receiving terminal data clock Restoring circuit, data clock sampling and caching process are carried out, then be sent to electric interface unit;Control circuit is completed to laser Automated power control, extinction ratio compensation, the intelligent control of soft switching, and the real-time prison to photo detector chip received optical power Control, so as to realize the real-time supervision and reporting to the relevant operating conditions detection limit of whole optical transceiver module.
On wafer of the optoelectronic transceiver chip 601 based on SOI, using CMOS technology, make the member of multiple identical or different functions Part forming array, modular one single chip on the whole, realize one or more optically and electrically information processing function
The preparation method of optoelectronic transceiver chip 601 includes on soi substrates carrying out simultaneously electricity component and optical element Make or optical element makes after electricity component.
The manufacture craft of electricity component includes doping, photoetching, etching, is formed and recovers electricity across resistance amplifying circuit, data clock Road, drive circuit and control circuit;The manufacture craft of optical element includes photoetching, etching, deposit or epitaxial growth other materials, Form light multiplexing function, Optical Demultiplexing function, photo-detector, laser.
The optical coupling interface of optoelectronic transceiver chip 601 is spot-size converter structure, or grating coupler structure, Huo Zhetong Cross outside micro optical element and carry out coupling output.
Optoelectronic transceiver chip 601 is that either Reflow Soldering or adhesion process are mounted on circuit board or flexibility by wire bonding On circuit board 602, it is electrically connected.
A kind of 400Gb/s optical transceiver modules provided by the invention are to be based on (supporting 25.78Gb/s to arrive per passage 25G 27.97Gb/s operating rate, is reduced to 25G), what 16 transceiver channels transmitted to realize 400G signals.Therefore its electrical interface bag 25G reception signals pin ,+3.3V power supplys energization pins, the low speed of 25G transmission signals pin containing 16 pairs of difference, 16 pairs of difference Signal pins and ground pin etc..Wherein low speed signal pin comprises at least serial data pin, serial clock pin etc..It is each logical Specifically accessible photoelectricity index is as follows in road:Light receiving part-three dB bandwidth is at least up to more than 18GHZ, and responsiveness is higher than 0.4A/W, it is better than -8dBm under 25Gb/s per passage OMA sensitivity.Light emitting portion is transmitted in the long range more than 500 meters When, using long wavelength laser, its extinction ratio is better than 3dB, and the OMA value of correlation intensity noise is less than -130dB/Hz, and light reflection refers to Mark is less than -12dB;The laser of short wavelength is used in the short-distance transmission less than 500 meters, its extinction ratio is better than 3dB, and light is anti- Penetrate index and be less than -12dB.
The embodiment of the present invention, according to the concrete application environment of the optical transceiver module and the specific requirement of function can be realized, And consider that the factors such as cost, transmission loss, dispersion, size requirements are selected, provide various adaptations for various application environments Property different encapsulating structures optical transceiver module embodiment, can use directly modulated lasers or outer adjusting laser, realize over long distances Single-mode fiber transmits or short distance multimode transmissions.
The present invention at 500 meters and within application in embodiment, the direct packaging technology of chip on board, i.e. COB can be used (chip on board) is realized.Specifically, several bare chips are potted directly on flexible or rigid pcb board, using lead Bonding and glue sticking technique are electrically connected, and are covered with materials such as resins to ensure reliability.
Optoelectronic transceiver chip provided in an embodiment of the present invention is based on SOI (semiconductor-on-insultor) crystalline substance On circle, using CMOS technology, make the elements of multiple identical or different functions forming array, modular single core on the whole Piece, one or more optically and electrically information processing functions are realized with this, as optical signal transceiver, OWDM and demultiplexing, Electric current driving and Power Control etc..Wherein the making of optoelectronic transceiver chip can be realized using two ways:I.e. electricity component and Optical element makes on substrate simultaneously;Optical element makes after electricity component, and technique stream starts from SOI substrate, Ran Houjin The manufacture craft of the making of row electricity component and optical element, wherein electricity component mainly doping, photoetching, etching etc., to Formed across function element such as resistance amplifying circuit, data clock recovery circuit, drive circuit and control circuits.The making of optical element Technique is mainly photoetching, etching, deposit or epitaxial growth other materials etc., to form light multiplexing/demultiplexing, optical detection, light The elements such as source.
The structure chart of optoelectronic transceiver chip provided in an embodiment of the present invention is illustrated in figure 8, is integrated in optoelectronic transceiver chip LD (Laser Diode) array, PD (Photodiode) array, MUX, DEMUX and with driving, signal amplification, shaping, The circuit of the function such as processing and control, it instead of in former traditional optical module, discrete light emission component (Transmitter Optical Subassembly, TOSA), light-receiving component (Receiver Optical Subassembly, ROSA), data Clock recovery chip (Clock and Data Recovery, CDR), microcontroller (MicroControllerUnit, MCU) etc. Element, using Wafer level packaging, optical signal transceiver function is realized, overcome in traditional optical module and led using discrete assembly The problem of size of cause is big, by multiplex optical element together with electricity component monolithic or hybrid integrated, overall dimension subtracts significantly It is small, about the 1/3 of CFP, there is compact-sized, low in energy consumption, the advantage such as transmission rate height, and reduce the group between discrete component The coupling between step and cumbersome optical element is filled, packaging and testing flow is simplified, shortens the man-hour of production, And work efficiency lift-rising at double.
Using based on complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS manufacture craft), large-scale production, so as to the cheap advantage of cost.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.

Claims (9)

1. a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit, it is characterised in that the optical transceiver module includes:Optical interface list Member, optoelectronic transceiver unit and electric interface unit;
The optoelectronic transceiver unit includes:Transmitting terminal data clock recovery circuit chip, driver chip, chip of laser, light Detector chip, trans-impedance amplifier chip, receiving terminal data clock recovery circuit chip and control circuit chip;
The transmitting terminal data clock recovery circuit chip receives the electric signal of the electric interface unit input, after being pre-processed Electric signal be loaded into by the driver chip on the chip of laser, the chip of laser by high-speed electrical signals turn Exported after changing high-speed optical signal into;
The photo detector chip receives input optical signal, and after the optical signal received is converted into electric signal, is sent to The trans-impedance amplifier chip and the receiving terminal data clock recovery circuit chip, carry out at data clock sampling and caching Reason, then it is sent to the electric interface unit;
Described transmitting terminal data clock recovery circuit chip in the optoelectronic transceiver unit, driver chip, chip of laser, Photo detector chip, trans-impedance amplifier chip, receiving terminal data clock recovery circuit chip and control circuit chip, pass through lead Either welding or adhesion process are mounted on circuit board or flexible PCB for bonding, are electrically connected;
Transmission range at 500 meters and within when, the chip of laser is 25G vertical cavity surface emitting lasers or directly modulated lasers Chip;The photo detector chip is 25Gb/s diode detector chips;
When transmission range is more than 500 meters, the optoelectronic transceiver unit also includes wavelength division multiplexer chip and Wave decomposing multiplexer core The high-speed electrical signals are converted into after the high-speed optical signal by the wavelength division multiplexer chip by piece, the chip of laser Exported after multiplexing;The Wave decomposing multiplexer chip receives the optical signal, and received optical signal is demultiplexed, and is divided into Received after 16 road optical signals by the photo detector chip;The chip of laser be 25G directly modulated lasers or Electroabsorption Modulated Laser chip;The photo detector chip is 25Gb/s diode detectors or avalanche diode detector core Piece.
2. optical transceiver module as claimed in claim 1, it is characterised in that
The control circuit chip completes the automated power control to the chip of laser, extinction ratio compensates, the intelligence of soft switching It can control, and the real-time monitoring to photo detector chip received optical power, so as to realize to the whole optical transceiver module The real-time supervision and reporting of relevant operating conditions detection limit;
The electric interface unit is used for the communication interface for providing module and external system;
The UFIU UMSC Fiber Interface Unit transmission range at 500 meters and within when, be MPO types optical interface or ribbon fiber;Transmission range It is duplex LC type optical interfaces when more than 500 meters.
3. a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit, it is characterised in that the optical transceiver module includes:Optical interface list Member, optoelectronic transceiver unit and electric interface unit;When transmission range is more than 500 meters, the optoelectronic transceiver unit include photoelectric multiplexing/ When demultiplexing chip, transmitting terminal data clock recovery circuit chip, driver chip, trans-impedance amplifier chip, reception end data Clock restoring circuit chip and control circuit chip;
The transmitting terminal data clock recovery circuit chip receives the electric signal of the electric interface unit input, after being pre-processed The electric signal be loaded into by the driver chip on the photoelectric multiplexing/demultiplexing chip, after electro-optic conversion Multiplexing output optical signal;The optical signal of input demultiplexes by the photoelectric multiplexing/demultiplexing chip, after carrying out opto-electronic conversion, The trans-impedance amplifier chip and the receiving terminal data clock recovery circuit chip are sent to, it is gentle to carry out data clock sampling Processing is deposited, then is sent to the electric interface unit;
The photoelectric multiplexing/demultiplexing chip includes opto-electronic conversion, electro-optic conversion, wavelength-division multiplex and demultiplexing function.
4. optical transceiver module as claimed in claim 3, it is characterised in that the photoelectric multiplexing/demultiplexing chip uses silicon substrate Or III-V compound semiconductor material makes;
Described transmitting terminal data clock recovery circuit chip, driver chip, photoelectric multiplexing/solution in the optoelectronic transceiver unit Multiplexing chip, trans-impedance amplifier chip, receiving terminal data clock recovery circuit chip and control circuit chip, pass through wire bonding Either welding or adhesion process are mounted on circuit board or flexible PCB, are electrically connected;
The control circuit chip completes the automated power control to chip of laser, extinction ratio compensates, the intelligence of soft switching is controlled System, and the real-time monitoring to photo detector chip received optical power, so as to realize the correlation to the whole optical transceiver module The real-time supervision and reporting of working condition detection limit;
The electric interface unit is used for the communication interface for providing module and external system;
The UFIU UMSC Fiber Interface Unit is duplex LC type optical interfaces.
5. a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit, it is characterised in that the optical transceiver module includes:Optical interface list Member, optoelectronic transceiver unit and electric interface unit;
The electric interface unit is used for the communication interface for providing module and external system;
The UFIU UMSC Fiber Interface Unit transmission range at 500 meters and within when, be MPO types optical interface or ribbon fiber;Transmission range It is duplex LC type optical interfaces when more than 500 meters;
The optoelectronic transceiver unit comprises at least optoelectronic transceiver chip and chip of laser, and the optoelectronic transceiver chip swashs with described Assembling between light device chip is formed by integrated or Direct Bonding after the light path coupling between micro optical element;
When transmission range is more than 500 meters, the optoelectronic transceiver chip is optoelectronic transceiver chip one;
The optoelectronic transceiver chip one includes:Transmitting terminal data clock recovery circuit, drive circuit, modulation circuit, wavelength-division multiplex Device, Wave decomposing multiplexer, photo-detector, trans-impedance amplifier, receiving terminal data clock recovery circuit and control circuit;The laser Device chip is continuous wave laser or tunable laser chip;
The transmitting terminal data clock recovery circuit receives the electric signal of the electric interface unit input, carries out pretreated height Fast electric signal is input to drive circuit and modulation circuit, and the light of the chip of laser output produces high-speed light letter after ovennodulation Number, then exported after wavelength division multiplexer multiplexing;The Wave decomposing multiplexer receives the optical signal, and by received light Signal is demultiplexed, and is received after being divided into 16 road optical signals by the photo-detector, is sent to after opto-electronic conversion and is put across resistance Big device and receiving terminal data clock recovery circuit, signal amplification, data clock sampling and caching process are carried out, then be sent to electricity and connect Mouth unit;The control circuit completes the automated power control to chip of laser, extinction ratio compensates, the intelligence of soft switching is controlled System, and the real-time monitoring to photo-detector received optical power, so as to realize the related work to the whole optical transceiver module The real-time supervision and reporting of state-detection amount;
Transmission range at 500 meters and within when, the optoelectronic transceiver chip is optoelectronic transceiver chip two;
The optoelectronic transceiver chip two includes:Transmitting terminal data clock recovery circuit, drive circuit, photo-detector, across resistance amplify Device, receiving terminal data clock recovery circuit and control circuit;The chip of laser is 25G vertical cavity surface emitting lasers or straight Adjusting laser chip;
The transmitting terminal data clock recovery circuit receives electric signal, carries out pretreated high-speed electrical signals and adds through drive circuit It is downloaded on the chip of laser, chip of laser exports after high-speed electrical signals are converted into high-speed optical signal;The light letter of reception Number photo-detector is transferred to, trans-impedance amplifier and receiving terminal data clock recovery circuit are sent to after opto-electronic conversion, carried out Signal amplification, data clock sampling and caching process, then it is sent to electric interface unit;The control circuit is completed to laser core Automated power control, extinction ratio compensation, the intelligent control of soft switching of piece, and the real-time prison to photo-detector received optical power Control, so as to realize the real-time supervision and reporting of the relevant operating conditions detection limit to the whole optical transceiver module.
6. optical transceiver module as claimed in claim 5, it is characterised in that on the wafer of the optoelectronic transceiver chip based on SOI, Using CMOS technology, make the elements of multiple identical or different functions forming array, modular one single chip on the whole, it is real Existing one or more optically and electrically information processing functions;
The preparation method of the optoelectronic transceiver chip includes on soi substrates electricity component and optical element make simultaneously Or optical element makes after electricity component;
The manufacture craft of the electricity component includes doping, photoetching, etching, is formed and recovers electricity across resistance amplifying circuit, data clock Road, drive circuit and control circuit;It is other that the manufacture craft of the optical element includes photoetching, etching, deposit or epitaxial growth Material, form light multiplexing function, Optical Demultiplexing function, photo-detector;
The optical coupling interface of the optoelectronic transceiver chip is spot-size converter structure, either grating coupler structure or is passed through Outside micro optical element carries out coupling output;
The optoelectronic transceiver chip, it is that either Reflow Soldering or adhesion process are mounted on circuit board PCB or soft by wire bonding On property circuit board FPC, it is electrically connected.
7. a kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit, it is characterised in that the optical transceiver module includes:Optical interface list Member, optoelectronic transceiver unit and electric interface unit;
The electric interface unit is used for the communication interface for providing module and external system;
When transmission range is more than 500 meters, the UFIU UMSC Fiber Interface Unit is duplex LC type optical interfaces;The optoelectronic transceiver unit is at least Including optoelectronic transceiver chip three;
The optoelectronic transceiver chip three includes:Transmitting terminal data clock recovery circuit, drive circuit, modulation circuit, laser, ripple Division multiplexer, Wave decomposing multiplexer, photo-detector, trans-impedance amplifier, receiving terminal data clock recovery circuit and control circuit;
The transmitting terminal data clock recovery circuit receives the electric signal of the electric interface unit input, carries out pretreated height Fast electric signal is input to drive circuit and modulation circuit, and the light of the laser output produces high-speed optical signal after ovennodulation, Exported again after wavelength division multiplexer multiplexing;Wave decomposing multiplexer described in the optical signals of reception is demultiplexing as 16 road light letters Number, the photo-detector is transferred to, the trans-impedance amplifier and the receiving terminal data clock are sent to after opto-electronic conversion Restoring circuit, signal amplification, data clock sampling and caching process are carried out, then be sent to the electric interface unit;The control Circuit completes the automated power control to laser, extinction ratio compensates, the intelligent control of soft switching, and photo-detector is received The real-time monitoring of luminous power, so as to realize in the real-time monitoring to the relevant operating conditions detection limit of the whole optical transceiver module Report.
8. optical transceiver module as claimed in claim 7, it is characterised in that transmission range at 500 meters and within when, the light connects Mouth unit is MPO types optical interface or ribbon fiber, and the optoelectronic transceiver chip three is replaced with into optoelectronic transceiver chip four;
The optoelectronic transceiver chip four includes:Transmitting terminal data clock recovery circuit, drive circuit, laser, photo-detector, across Impedance amplifier, receiving terminal data clock recovery circuit and control circuit;
The transmitting terminal data clock recovery circuit receives electric signal, carries out pretreated high-speed electrical signals and passes through the driving Circuit is loaded on the laser, and the laser exports after high-speed electrical signals are converted into high-speed optical signal;The light is visited Survey device and receive input optical signal respectively, and after the optical signal received is converted into electric signal, be sent to and described amplify across resistance Device and the receiving terminal data clock recovery circuit, data clock sampling and caching process are carried out, then be sent to the electrical interface Unit;The control circuit completes the automated power control to laser, extinction ratio compensates, the intelligent control of soft switching, and Real-time monitoring to photo detector chip received optical power, so as to realize the relevant operating conditions to the whole optical transceiver module The real-time supervision and reporting of detection limit.
9. the optical transceiver module as described in claim any one of 7-8, it is characterised in that the optoelectronic transceiver chip is based on SOI Wafer on, using CMOS technology, make the elements of multiple identical or different functions forming array, modular list on the whole Individual chip, realize one or more optically and electrically information processing functions;
The preparation method of the optoelectronic transceiver chip includes on soi substrates electricity component and optical element make simultaneously Or optical element makes after electricity component;
The manufacture craft of the electricity component includes doping, photoetching, etching, is formed and recovers electricity across resistance amplifying circuit, data clock Road, drive circuit and control circuit;It is other that the manufacture craft of the optical element includes photoetching, etching, deposit or epitaxial growth Material, form light multiplexing function, Optical Demultiplexing function, photo-detector, laser;
The optical coupling interface of the optoelectronic transceiver chip is spot-size converter structure, either grating coupler structure or is passed through Outside micro optical element carries out coupling output;
The optoelectronic transceiver chip, it is that either Reflow Soldering or adhesion process are mounted on circuit board or flexible electrical by wire bonding On the plate of road, it is electrically connected.
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