CN113805290B

CN113805290B - Optical module

Info

Publication number: CN113805290B
Application number: CN202111088602.3A
Authority: CN
Inventors: 孙飞龙; 傅钦豪; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-09-16
Filing date: 2021-09-16
Publication date: 2023-01-24
Anticipated expiration: 2041-09-16
Also published as: CN113805290A

Abstract

The application provides an optical module, includes: a circuit board; the light receiving secondary module is electrically connected with the circuit board; the optical receive sub-module includes: one end of the light receiving cavity is provided with a light inlet hole, the other end of the light receiving cavity is provided with an opening, and an electric connector is arranged in the opening and is electrically connected with the circuit board; the light amplification assembly is arranged in the light receiving cavity and is close to the light inlet of the light receiving cavity, and the light amplification assembly comprises a semiconductor optical amplifier, a fourth substrate and a fifth substrate; the semiconductor optical amplifier is arranged on the fourth substrate and electrically connected with the fourth substrate, the fifth substrate is arranged at one end of the fourth substrate, and the fourth substrate is connected with the fifth substrate in a routing way and electrically connected with the electric connector through the fifth substrate; and the light receiving assembly is arranged in the light receiving cavity and used for receiving the signal light transmitted through the semiconductor optical amplifier. The embodiment of the application provides an optical module, which is convenient for the arrangement of electric connection between an SOA and an electric connector and ensures the stability of circuit connection between the SOA and the electric connector.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology becomes more and more important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

At present, in order to improve the transmission rate of an optical module, transmission channels in the optical module may be increased, that is, transmission capacity is improved in the optical module through a multi-channel design, so as to achieve the purpose of improving the transmission rate of the optical module, and further, a multi-channel optical module such as a 2-channel optical module and a 4-channel optical module is emerging at present. With the increase of the transmission channels of the optical modules, in order to complete the packaging of the optical modules, the optical transmitter sub-module and the optical receiver sub-module in the optical modules are separately packaged and physically separated from the circuit board, and then are electrically connected with the circuit board through the flexible circuit board.

However, in specific use, it is found that when the multi-channel optical module is used in a long-distance transmission scenario such as 40Km or 80Km, the sensitivity is difficult to meet the requirement of high sensitivity in the optical module.

Disclosure of Invention

The embodiment of the application provides an optical module, which is convenient for the arrangement of electric connection between an SOA and an electric connector and ensures the stability of the circuit connection between the SOA and the electric connector.

The application provides an optical module, includes:

a circuit board;

the light receiving sub-module is electrically connected with the circuit board and used for receiving signal light from the outside of the optical module;

wherein the optical receive sub-module comprises:

one end of the light receiving cavity is provided with a light inlet, the other end of the light receiving cavity is provided with an opening, and an electric connector is arranged in the opening and is electrically connected with the circuit board;

the light amplification assembly is arranged in the light receiving cavity and is close to a light inlet of the light receiving cavity, and the light amplification assembly comprises a semiconductor optical amplifier, a fourth substrate and a fifth substrate; the semiconductor optical amplifier is arranged on the fourth substrate and electrically connected with the fourth substrate, the fifth substrate is arranged at one end of the fourth substrate, and the fourth substrate is in routing connection with the fifth substrate and is electrically connected with the electric connector through the fifth substrate;

and the light receiving assembly is arranged in the light receiving cavity and used for receiving the signal light transmitted through the semiconductor optical amplifier.

In the Optical module that this application provided, including light amplification subassembly and setting in the income light mouth of light receiving cavity in the light receiving submodule, including Semiconductor Optical Amplifier (SOA), fourth base plate and fifth base plate in the light amplification subassembly, SOA sets up on the fourth base plate and the electricity is connected to the fourth base plate, the fifth base plate is located the one end of fourth base plate, fourth base plate routing connection fifth base plate, through the electric connector of fifth base plate electricity. In the optical module provided by the application, the SOA is electrically connected with the electric connector through the switching of the fourth substrate and the fifth substrate; the fifth substrate is arranged at one end of the fourth substrate, so that transfer of the connection pad between the fourth substrate and the electric connector is realized, arrangement of electric connection between the fourth substrate and the electric connector is facilitated, and meanwhile performance of electric connection between the SOA and the electric connector is facilitated to be guaranteed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic diagram of an optical communication terminal connection relationship according to some embodiments;

FIG. 2 is a schematic diagram of an optical network unit structure according to some embodiments;

fig. 3 is a schematic structural diagram of a light module according to some embodiments;

FIG. 4 is an exploded view diagram of a light module provided in accordance with some embodiments;

FIG. 5 is a perspective view of a ROSA provided in accordance with some embodiments;

fig. 6 is a schematic structural diagram illustrating a light receiving upper cover of a light receiving sub-module removed according to some embodiments;

FIG. 7 is a cross-sectional view of a ROSA module according to some embodiments;

FIG. 8 is a schematic diagram of a DeMUX operation for beam splitting including 4 wavelengths (β 1, β 2, β 3, and β 4) provided in accordance with some embodiments;

fig. 9 is a schematic diagram of an optical path structure of a rosa according to some embodiments;

FIG. 10 is an exploded view of a ROSA module according to some embodiments;

FIG. 11 is a first schematic diagram illustrating a first exemplary configuration of a substrate assembly in use according to some embodiments;

fig. 12 is a structural diagram illustrating a use state of a substrate assembly according to some embodiments;

FIG. 13 is a cross-sectional view of another rosa provided in accordance with some embodiments;

fig. 14 is a schematic structural view of an electrical connector according to some embodiments;

fig. 15 is a schematic structural diagram of another optical receive sub-module with a light receiving upper cover removed according to some embodiments;

FIG. 16 is a cross-sectional view of the light receiving sub-assembly of FIG. 15;

FIG. 17 is a schematic view of another first substrate according to some embodiments;

FIG. 18 is a state diagram illustrating another use of a first substrate according to some embodiments;

FIG. 19 is a schematic diagram of a light amplification module according to some embodiments;

FIG. 20 is a state diagram illustrating the use of another third substrate according to some embodiments;

fig. 21 is a partial structural diagram of a rosa according to some embodiments;

fig. 22 is a schematic structural view of a light receiving lower case in another light receiving sub-assembly according to some embodiments;

FIG. 23 is an enlarged view of a portion of FIG. 22 at A;

FIG. 24 is an enlarged view of a portion of FIG. 22 at B;

FIG. 25 is an enlarged view of a portion of FIG. 22 at C;

fig. 26 is a schematic structural diagram illustrating a further optical receive sub-module with a light receive cover removed according to some embodiments;

fig. 27 is a schematic structural diagram illustrating a fourth rosa with a light receiving cover removed according to some embodiments;

FIG. 28 is a diagram illustrating a state of use of yet another third substrate according to some embodiments;

fig. 29 is a schematic diagram of an SOA gain control circuit according to some embodiments.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so that the transmission of the information is completed. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a diagram of optical communication system connections according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of thousands of meters (6 kilometers to 8 kilometers), on which basis if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 may be any one or several of the following devices: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that the optical fiber 101 and the optical network terminal 100 are connected to each other. In an example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structure diagram of an optical network terminal according to some embodiments, and fig. 2 only shows the structure of the optical module 200 of the optical network terminal 100 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the onu 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a schematic diagram of an optical module according to some embodiments, and fig. 4 is an exploded schematic diagram of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 206 disposed in the housing, and an optical transceiver.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (left end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (right end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and a gold finger of the circuit board 206 extends out from the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive an external optical fiber 101 so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 206 and the optical transceiver device can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 206 and the like are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, and includes a snap-fit member that mates with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 206 includes circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 206 connects the above devices in the optical module 200 together according to circuit design through circuit routing to implement functions of power supply, electrical signal transmission, grounding, and the like.

The circuit board 206 is generally a rigid circuit board, which can also realize a bearing function due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; the hard circuit board can also be inserted into an electric connector in the cage of the upper computer, and in some embodiments disclosed in the application, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

Flexible circuit boards are also used in some optical modules; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device by using the flexible circuit board as a supplement to the rigid circuit board.

In some embodiments, an optical transceiver includes an tosa and an rosa. As shown in fig. 4, the optical transceiver includes an tosa 207 and an rosa 208, and the tosa 207 and the rosa 208 are collectively referred to as an optical subassembly; the tosa 207 and the rosa 208 are located on the edge of the circuit board 206, and the tosa 207 and the rosa 208 are stacked up and down. Optionally, the rosa 207 is closer to the upper housing 201 than the rosa 208, but is not limited thereto, and the rosa 208 may be closer to the upper housing 201 than the rosa 207. The optical sub-assembly shown in fig. 3 and 4 is only an example of the present application, but the optical sub-assembly in the embodiment of the present application may also be a transceiver structure, or the tosa 207 and the rosa 208 may be disposed in a cavity formed by the upper and lower shells in a non-top-bottom stacking manner. Optionally, the optical sub-assembly is located at an end of the circuit board 206, the optical sub-assembly being physically separated from the circuit board 206. The optical sub-assemblies are connected to the circuit board 206 by a flexible circuit board.

In the embodiment of the present application, the tosa 207 and the rosa 208 are physically separated from the circuit board 206, and then electrically connected to the circuit board 206 through a flexible circuit board or an electrical connector.

In the embodiment of the present application, the optical subassembly includes an optical receiving cavity, and the optical receiving cavity is used for accommodating a device or an assembly for transmitting and receiving signal light. Fig. 5 is a perspective view of a rosa according to some embodiments. As shown in fig. 5, the light receiving cavity of the rosa 208 provided in the embodiment of the present application includes a light receiving lower shell 081 and a light receiving upper cover 082, where the light receiving upper cover 082 covers and connects the light receiving lower shell 081 to form the light receiving cavity, and devices for transmitting and receiving light to be received are disposed in the light receiving cavity. The lower light receiving case 081 and the upper light receiving cover 082 may be made of metal material, such as die-cast or milled metal. Of course, in some embodiments of the present application, the structure of the light receiving cavity is not limited to the mechanism formed by the light receiving lower shell 081 and the light receiving upper cover 082 in fig. 5, and may be a light receiving cavity structure in other structural forms as required.

Fig. 6 is a schematic structural diagram of a rosa with a light receiving cover removed according to some embodiments, and fig. 7 is a cross-sectional view of the rosa according to some embodiments. As shown in fig. 5 to 7, one end of the lower light receiving housing 081 is provided with the fiber optic adapter assembly 300, and the other end is provided with the electrical connector 400; the free end of the fiber optic adapter assembly 300 is located at the optical port for transmitting signal light from outside the optical module; the electrical connector 400 is used to electrically connect the rosa 208 and the circuit board 206; the signal light from the outside of the optical module is transmitted into the light receiving cavity through the optical fiber adapter assembly 300, transmitted and converted by the light transmitting and light receiving devices in the light receiving cavity, and finally converted into an electrical signal, and transmitted to the circuit board 206 through the electrical connector 400. Optionally, the electrical connector 400 is electrically connected to the circuit board 206 via a flexible circuit board.

In some embodiments of the present application, an optical inlet 083 is formed at one end of the lower light receiving housing 081, and the optical fiber adapter assembly 300 is communicated with the inner cavity of the light receiving cavity through the optical inlet 083; the other end of the light receiving lower housing 081 is provided with an opening 084, and the electrical connector 400 is fitted in the opening 084. One side of the electrical connector 400 is used for electrically connecting the electrical devices in the light receiving cavity, and the other side is used for electrically connecting the circuit board 206, so that the electrical connection and switching from the circuit board 206 to the light receiving sub-module 208 are realized through the electrical connector 400. Typically, the electrical connector 400 is electrically connected to the electrical components within the light receiving cavity by wire bonding.

In some embodiments, the fiber optic adapter assembly 300 includes a fiber optic adapter, an adapter connector and the like, wherein one end of the adapter connector is connected to the fiber optic adapter, and the other end of the adapter connector is connected to the light inlet hole 083 of the lower light receiving shell 081; the optical fiber adapter is internally provided with an optical fiber inserting core and is used for being butted with an external optical fiber of the optical module; the adapter coupler is used for connecting the optical fiber adapter to the light receiving lower shell 081, and optical devices such as lenses can be arranged in the adapter coupler.

In some embodiments, a planar light window is disposed in the light entrance hole 083, and the planar light window may be used for the light entrance hole 083, which facilitates to some extent the sealing of the light receiving cavity. The plane optical window is obliquely arranged in the light inlet 083, or the plane optical window is not perpendicular to the central axis of the light inlet 083, and the obliquely arranged plane optical window is used for preventing a signal light path transmitted into the light receiving cavity from returning to the optical fiber adapter component 300, so that the signal light reflected back in the light receiving cavity is prevented from polluting the signal light transmitted to the optical fiber adapter component 300 from the outside of the optical module.

The light receiving cavity of the light receiving sub-module 208 provided in the embodiment of the present application is generally provided with an isolator, a lens, a light receiving chip, a transimpedance amplifier, and other devices. In some embodiments of the present application, a plurality of light-receiving chips are disposed in the light-receiving cavity of the rosa 208, and are configured to receive signal light with multiple wavelengths; for example, 2 light receiving chips, 4 light receiving chips, 8 light receiving chips and the like are arranged in the light receiving cavity. When a plurality of light receiving chips are arranged in the light receiving cavity, the light receiving sub-module 208 is used for receiving signal light with various wavelengths, the signal light with various wavelengths from the outside of the optical module is transmitted into the light receiving cavity through the optical fiber adapter, beam splitting according to the wavelength is realized through reflection and refraction of optical devices such as different lenses in the light receiving cavity, the signal light split according to the wavelength is finally transmitted to the photosensitive surface corresponding to the light receiving chips, the light receiving chips receive the signal light through the photosensitive surfaces, and the light receiving chips receive the signal light and convert the signal light into electric signals. The light receiving cavity of the optical sub-assembly 208 shown in fig. 6 and 7 is provided with 4 light receiving chips for receiving signal light of 4 different wavelengths, but the optical module provided in the embodiment of the present application is not limited to receiving signal light of 4 different wavelengths. In the embodiment of the present application, the light receiving chip is a PD (photodetector), such as an APD (avalanche photo diode), a PIN-PD (photodiode), or the like, and is configured to convert the received signal light into a photocurrent.

As shown in fig. 7, the rosa 208 provided in the embodiment of the present application includes a light receiving element 810 therein, the light receiving element 810 is disposed in the light receiving cavity, and the light receiving element 810 includes a plurality of light receiving chips. The light receiving module 810 further includes a metallized ceramic substrate, a circuit pattern is formed on the surface of the metallized ceramic substrate, the light receiving chip is disposed on the surface of the metallized ceramic substrate and electrically connected to the circuit on the metallized ceramic substrate, and the light receiving chip is electrically connected to the electrical connector 400 through the metallized ceramic substrate.

The light receiving module 810 is disposed inside the light receiving lower housing 081 near the electrical connector 400, and a transimpedance amplifier 820 is disposed on a side of the light receiving module 810; the light receiving element 810 is electrically connected to the transimpedance amplifier 820, for example, the light receiving element 810 is connected to the transimpedance amplifier 820 by wire bonding; the transimpedance amplifier 820 is electrically connected to the electrical connector 400. In some embodiments, to facilitate electrical connection of the transimpedance amplifier 820 to the electrical connector 400, the transimpedance amplifier 820 is closer to the electrical connector 400 than the light receiving element 810, as oriented in fig. 6 and 7, the transimpedance amplifier 820 is disposed on the right side of the light receiving element 810, and the transimpedance amplifier 820 is positioned between the light receiving element 810 and the electrical connector 400. Optionally, the light receiving element 810 is wire-bonded to the transimpedance amplifier 820, and in order to control the length of the wire-bonding between the light receiving element 810 and the transimpedance amplifier 820, the transimpedance amplifier 820 is close to the light receiving element 810.

In some embodiments of the present application, the rosa 208 further includes a demultiplexing assembly (DeMUX) 830, the demultiplexing assembly 830 is disposed in the optical receiving cavity, and the demultiplexing assembly 830 is configured to split the signal light according to different wavelengths of the signal light. Specifically, the method comprises the following steps: a beam of signal light including multiple wavelengths enters the wdm assembly 830, and signal light of different wavelengths is reflected for different times in the wdm assembly 830 to split the signal light of different wavelengths. FIG. 8 is a schematic diagram of a DeMUX operation for beam splitting including 4 wavelengths (β 1, β 2, β 3, and β 4) provided in accordance with some embodiments; the right side of the DeMUX comprises a light inlet used for inputting signal light with various wavelengths, the left side of the DeMUX comprises a plurality of light outlets used for emitting light, and each light outlet is used for emitting signal light with one wavelength. As shown in fig. 7, the signal light enters the DeMUX through the incident light port of the DeMUX, and the β 1 signal light reaches the light exit port of the DeMUX after six different reflections at six different positions of the DeMUX; the beta 2 signal light is reflected for four times to reach the light outlet of the DeMUX at four different positions; the beta 3 signal light is reflected twice differently through two different positions of the DeMUX and reaches the light outlet of the DeMUX; the beta 4 signal light is directly transmitted to the light outlet after being incident to the DeMUX. Therefore, signal light with different wavelengths enters the DeMUX through the same light inlet and is output through different light outlets, and beam splitting of the signal light with different wavelengths is achieved.

In some embodiments, as shown in fig. 6 and 7, the rosa 208 further includes a reflective prism 840, and the reflective prism 840 may be used to change the transmission direction of the signal light. The reflecting prism 840 is disposed above the light receiving module 810, wherein the emitting surface of the reflecting prism 840 covers the light receiving chip in the light receiving module 810, the signal light split by the wavelength division demultiplexing module 830 is incident to the reflecting prism 840, the signal light incident to the reflecting prism 840 is parallel to the photosensitive surface of the light receiving chip, and the reflecting surface of the reflecting prism 840 reflects the direction parallel to the photosensitive surface of the light receiving chip as the photosensitive surface perpendicular to the light receiving chip, so that the light receiving chip can receive the signal light smoothly.

As shown in fig. 6 and 7, the rosa 208 further includes an isolator 850, the isolator 850 is disposed in the rosa cavity and near the light entrance hole, the signal light entering the rosa cavity through the optical fiber adapter assembly 300 passes through the isolator 850, and the isolator 850 prevents the signal light reflected again and transmitted to the isolator 850 from passing through, so as to avoid the signal light to be received from being contaminated by the reflected specific component signal light during the transmission process, so as to ensure the quality of the signal light to be received.

As shown in fig. 6 and 7, the rosa 208 further includes a focusing lens 870, the focusing lens 870 is disposed in the light receiving cavity and is disposed near the light inlet of the wdm assembly 830, and the signal light focused by the focusing lens 870 is transmitted to the light inlet of the wdm assembly 830, so as to ensure the coupling efficiency of the signal light to the wdm assembly 830.

As shown in fig. 6 and 7, the light receiving sub-module 208 further includes a lens assembly 880, the lens assembly 880 is disposed in the light receiving cavity and located between the demultiplexing assembly 830 and the reflecting prism 840, and the lens assembly 880 is configured to correspondingly converge and transmit the signal light demultiplexed by the demultiplexing assembly 830 to the reflecting prism 840. The lens assembly 880 may adopt a structure form in which a plurality of lenses are arranged side by side, where each lens corresponds to one light outlet of the wdm assembly 830, that is, each lens corresponds to one focused signal light transmitting one wavelength; alternatively, the lens assembly 880 may employ a lens body provided with a plurality of protrusions, where the protrusions are used to converge light beams, and each protrusion focuses and transmits signal light of one wavelength.

Further, as shown in fig. 6 and 7, in order to meet the sensitivity requirement of the optical module in the transmission scene with a long distance such as 40Km or 80Km, the optical receive sub-module 208 provided in this embodiment further includes an optical amplifying assembly 500, where the optical amplifying assembly 500 is disposed in the light receiving cavity near the light entrance 083, the optical amplifying assembly 500 is configured to amplify the signal light transmitted into the light receiving cavity, and the signal light amplified by the optical amplifying assembly 500 is transmitted to the demultiplexing assembly 830.

In some embodiments of the present disclosure, the optical amplifying assembly 500 is disposed between the isolator 850 and the focusing lens 870, the signal light transmitted through the isolator 850 is transmitted to the optical amplifying assembly 500, and the signal light amplified by the optical amplifying assembly 500 is transmitted to the focusing lens 870.

In some embodiments of the present application, the rosa 208 further includes a collimating lens 860, the collimating lens 860 is disposed between the isolator 850 and the optical amplifying assembly 500, and the signal light transmitted through the isolator 850 is transmitted to the collimating lens 860 and is collimated by the collimating lens 860 to be transmitted to the optical amplifying assembly 500.

Optionally, in the embodiment of the present application, the Optical amplifying assembly 500 includes an SOA (Semiconductor Optical Amplifier), and the SOA is disposed on an Optical axis from the collimator lens 860 to the focusing lens 870. The SOA performs signal light amplification gain according to the magnitude of the applied driving current, and when the applied currents on the SOA are different, the amplification gains of the signal light are different, so that the control and adjustment of the SOA amplification gain multiple can be performed by controlling the magnitude of the applied driving current on the SOA.

Fig. 9 is a schematic diagram illustrating an optical path structure of a rosa according to some embodiments, where arrows in fig. 9 show transmission paths of signal light from outside the optical module in the rosa. As shown in fig. 9, the multi-wavelength signal light from outside the optical module is transmitted to the isolator 850 through the optical fiber adapter assembly 300, the signal light passing through the isolator 850 is transmitted to the collimating lens 860, the signal light collimated by the collimating lens 860 is transmitted to the optical amplifying assembly 500, the signal light amplified by the optical amplifying assembly 500 is transmitted to the focusing lens 870, the signal light converged by the focusing lens 870 is transmitted to the demultiplexing assembly 830, the signal transmitted to the demultiplexing assembly 830 is split into four signal lights according to the wavelength of the light, the four signal lights are transmitted to the lens group 880, the four signal lights are respectively converged and transmitted to the reflecting prism 840, and finally the signal light whose transmission direction is changed by the reflecting prism 840 is transmitted to the photosensitive surface of the optical receiving chip in the receiving assembly (shielded by the reflecting prism 840).

To facilitate the arrangement of the light receiving module 810, the transimpedance amplifier 820, the demultiplexing module 830, the reflecting prism 840, and the like in the lower light receiving housing 081, the light receiving sub-module 208 provided in the embodiment of the present application further includes a substrate assembly on which the light receiving module 810, the transimpedance amplifier 820, the demultiplexing module 830, the reflecting prism 840, and the like are arranged, and the substrate assembly is arranged on the bottom plate of the lower light receiving housing 081. When the optical sub-module 208 is assembled, the optical receiving element 810, the transimpedance amplifier 820, the demultiplexing element 830, the reflection prism 840, and the like are assembled on a substrate assembly, and then the substrate assembly is assembled on the bottom plate of the lower optical receiving case 081. The substrate assembly facilitates installation of the light receiving assembly 810, the transimpedance amplifier 820, the wavelength division multiplexing demultiplexing assembly 830, the reflecting prism 840 and the like in the light receiving lower shell 081, and also facilitates adjustment of relative heights of the light receiving assembly 810, the transimpedance amplifier 820, the wavelength division multiplexing demultiplexing assembly 830, the reflecting prism 840 and the like, so that the light transmission direction and coupling efficiency of signals to be received are ensured.

Fig. 10 is an exploded view of a rosa according to some embodiments. As shown in fig. 10, the optical subassembly provided in the embodiment of the present application further includes a substrate assembly 600, and the optical subassembly 810, the transimpedance amplifier 820, the demultiplexing assembly 830, the reflecting prism 840, the lens assembly 880, and the like are disposed above the substrate assembly 600.

Fig. 11 is a first schematic structural diagram illustrating a use state of a substrate assembly according to some embodiments. Referring to fig. 10 and 11, in some embodiments of the present application, the substrate assembly 600 includes a first substrate 610 and a second substrate 620, the second substrate 620 is disposed above the first substrate 610, the size of the second substrate 620 is smaller than that of the first substrate 610, and the first substrate 610 is used to carry the second substrate 620. The light receiving assembly 810, the transimpedance amplifier 820, and the reflection prism 840 are disposed on the first substrate 610. The demultiplexing assembly 830 and the lens group 880 are disposed on the second substrate 620; on one hand, the second substrate 620 is used for carrying the demultiplexing component 830 and the lens group 880, and on the other hand, the second substrate 620 is convenient for adjusting the optical path in the optical path coupling process, so as to ensure the coupling efficiency of the optical path to be received.

In some embodiments of the present application, the first substrate 610 is disposed on a bottom plate of the light receiving lower case 081, i.e., the first substrate 610 is attached to the bottom plate of the light receiving lower case 081. In order to facilitate the assembly of the first substrate 610 on the light receiving lower shell 081, as shown in fig. 11, a first unfilled corner 617 and a second unfilled corner 618 are disposed on a bottom edge of the first substrate 610 in the length direction, the first unfilled corner 617 is disposed on one side of the bottom of the first substrate 610, the second unfilled corner 618 is disposed on the other side of the bottom of the first substrate 610, and the first unfilled corner 617 and the second unfilled corner 618 are used for the bottom of the first substrate 610 to recede from a sidewall of the light receiving lower shell 081, so as to facilitate the assembly of the first substrate 610.

In some embodiments of the present application, as shown in fig. 11, in order to facilitate assembling the reflection prism 840 and prevent the assembling of the reflection prism 840 from interfering with the assembling of the light receiving assembly 810, etc., a first supporting block 841 and a second supporting block 842 are further provided on the first substrate 610; the first supporting block 841 is disposed at one end of the light receiving assembly 810, the second supporting block 842 is disposed at the other end of the light receiving assembly 810, the first supporting block 841 supports one end of the reflection prism 840, the second supporting block 842 supports the other end of the reflection prism 840, and then the first supporting block 841 and the second supporting block 842 are used for raising the reflection prism 840, so that the reflection prism 840 is located above the light receiving assembly 810 and on the light path of the light to be received. The reflecting prism 840 can be fixed on the first supporting block 841 and the second supporting block 842 by glue, for example, the reflecting prism 840 is fixedly arranged on the first supporting block 841 and the second supporting block 842 by glue dispensing, so that the reflecting prism 840 is supported by the first supporting block 841 and the second supporting block 842, the reflecting prism 840 can be conveniently fixed, and the glue dispensing can be effectively avoided from polluting devices such as the light receiving assembly 810. In some embodiments, the first and second support blocks 841 and 842 may be square columns of insulating material such as plastic or glass.

In some embodiments of the present application, the isolator 850, the optical amplification assembly 500, and the like may also be disposed on the first substrate 610 or the second substrate 620 to facilitate assembly and optical path coupling of the isolator 850, the optical amplification assembly 500, and the like.

In some embodiments of the present disclosure, the second substrate 620, the light receiving element 810, the transimpedance amplifier 820, and the like are fixedly connected to the first substrate 610 by a patch method, in order to ensure the accuracy of patch fixing of the second substrate 620, the light receiving element 810, the transimpedance amplifier 820, and the like on the first substrate 610, a mark point 611 is disposed on the surface of the first substrate 610, and the mark point 611 is used for visual identification of high-accuracy patches on the first substrate 610. Optionally, the mark point 611 may be a mark point in an O-type, L-type, or + type shape; the mark point 611 in fig. 11 is an O-shaped mark point. The mark points 611 may be disposed on the first substrate 610 by printing; the mark points are disposed at the edge of the top surface of the first substrate 610.

Further, in some embodiments of the present application, the substrate assembly 600 further includes a third substrate 630, the isolator 850, the optical amplification assembly 500, the collimating lens 860, the focusing lens 870 and the like are disposed on the third substrate 630, and disposing the isolator 850, the optical amplification assembly 500 and the like and the demultiplexing assembly 830 and the like on different substrates facilitates adjusting the relative heights of the devices, thereby further facilitating optical path coupling adjustment to ensure optical path coupling efficiency.

When the SOA in the optical amplification module 500 is in operation, when the optical amplification gain of the SOA is stabilized at a certain fixed value, a stable driving current needs to be applied to the SOA; meanwhile, because the SOA is susceptible to temperature, the optical amplification gains of the SOA are different at different temperatures under the same driving current, and therefore, the SOA needs to be maintained within a certain temperature range for determining the optical amplification gain of the SOA, and the working performance of the SOA can be better. Therefore, in some embodiments of the present application, the rosa 208 further includes a TEC (semiconductor Cooler) for stabilizing the operating temperature of the SOA.

Fig. 12 is a structural diagram illustrating a use state of a substrate assembly according to some embodiments. As shown in fig. 10 and 12, in some embodiments of the present application, the light receiving sub-module 208 further includes a TEC890, the isolator 850, the light amplifying assembly 500, the collimating lens 860, and the focusing lens 870 are disposed on the third substrate 630, and the third substrate 630 is disposed on the TEC 890. The isolator 850, the light amplification member 500, the collimator lens 860, and the focusing lens 870 are then disposed inside the light receiving cavity by fixing the TEC890 on the bottom plate of the light receiving lower housing 081. The isolator 850, the optical amplifying assembly 500, the collimating lens 860 and the focusing lens 870 are disposed on the TEC890 through a common substrate, so that the isolator 850, the optical amplifying assembly 500, the collimating lens 860 and the focusing lens 870 are affected the same when the third substrate 630 is deformed due to a temperature change, thereby ensuring stability of a transmission path among the isolator 850, the collimating lens 860, the optical amplifying assembly 500 and the focusing lens 870.

As shown in fig. 12, in some embodiments of the present application, the optical amplifier assembly 500 includes an SOA510 and a fourth substrate 520, the SOA510 is disposed on the fourth substrate 520, a surface of the fourth substrate 520 is formed with a circuit pattern, and the SOA510 is electrically connected to the circuit pattern on the fourth substrate 520 to facilitate application of a driving current to the SOA510 through the fourth substrate 520. Alternatively, the fourth substrate 520 may be a ceramic substrate, and a surface of the ceramic substrate forms a circuit pattern for electrically connecting the SOA 510. The SOA510 is attached to the fourth substrate 520, and the anode of the SOA510 is connected to a circuit on the fourth substrate 520 by wire bonding.

In the embodiment of the present application, the optical amplification module 500 further includes a temperature sensor 530, and the temperature sensor 530 is disposed around the SOA510 and is configured to collect the temperature of the SOA510 in real time so as to facilitate temperature control of the SOA 510. In some embodiments of the present application, the temperature sensor 530 is disposed on the fourth substrate 520, and a circuit pattern for electrically connecting the temperature sensor 530 is disposed on the fourth substrate 520. In some embodiments of the present application, the temperature sensor 530 may be a thermistor mounted on the fourth substrate 520 and electrically connected to the circuit pattern on the fourth substrate 520.

Fig. 13 is a cross-sectional view of another rosa provided in accordance with some embodiments, and fig. 13 shows the structure of the rosa provided in the embodiments of the present application and the structure of the optical path to be received. As shown in fig. 13, the TEC890 and the first substrate 610 are disposed on the light receiving lower case 081, that is, the TEC890 and the first substrate 610 are fixed at the bottom on the bottom plate of the light receiving lower case 081; wherein the TEC890 is connected to the fiber adapter assembly 300 near the lower light receiving housing 081, and the first substrate 610 is connected to the electrical connector 400 near the lower light receiving housing 081. A third substrate 630 is arranged on the top of the TEC890, and an isolator 850, a collimating lens 860, an optical amplifying assembly 500 and a focusing lens 870 are arranged on the third substrate 630; the second substrate 620, the light receiving assembly 810, the transimpedance amplifier 820 and the reflection prism 840 are arranged on the first substrate 610; the second substrate 620 is provided with a demultiplexing assembly 830 and a lens assembly 880. The first substrate 610, the second substrate 620 and the third substrate 630 cooperatively carry the components such as the isolator 850, the collimating lens 860 and the like, so that the requirement of the relative mounting height among the components is met, and meanwhile, the assembly of the components in the light receiving cavity is facilitated.

Fig. 14 is a schematic structural diagram of an electrical connector according to some embodiments. As oriented in fig. 13 and 14, the electrical connector 400 has a left side that extends into the cavity of the lower light receiving housing 081 and a right side that is outside the cavity of the lower light receiving housing 081. The electrical connector 400 includes an electrical connector body 410, wherein the electrical connector body 410 is used for embedding a connection opening 084; the left side of the electrical connector body 410 is used to electrically connect devices within the cavity of the light receiving lower housing 081, and the right side of the electrical connector body 410 is used to electrically connect the circuit board 206.

In some embodiments of the present application, a first step surface 420 and a second step surface 430 are disposed on the left side of the electrical connector body 410, the first step surface 420 and the second step surface 430 are located at different heights on the left side of the electrical connector body 410, and the tops of the first step surface 420 and the second step surface 430 facing the light receiving lower shell 081 form a mutually staggered step-like structure, so that the electrical connector 400 can be conveniently electrically connected to devices in the cavity of the light receiving lower shell 081. The right side of the electrical connector body 410 is provided with a first connection face 440 and a second connection face 450 which are disposed back to back, such as the first connection face 440 facing the top of the light receiving lower housing 081 and the second connection face 450 facing the bottom of the light receiving lower housing 081; the first connection face 440 and the second connection face 450 are used for connecting the circuit board 206, and the first connection face 440 and the second connection face 450 are electrically connected to the circuit board 206 through the flexible circuit board, respectively.

In some embodiments of the present application, as shown in fig. 14, a dc pin is disposed on the first step surface 420 for transmitting a dc signal and supplying power, and an ac pin and a ground pin are disposed on the second step surface 430 for transmitting an ac signal and grounding; the first connection surface 440 and the second connection surface 450 are respectively provided with a plurality of pins, and the pins of the first connection surface 440 and the second connection surface 450 are used for electrically connecting the circuit board 206; and the pins on the first step surface 420 are connected to the pins on the first connection surface 440 and the pins on the second step surface 430 are connected to the pins on the second connection surface 450. In some embodiments of the present application, the first step surface 420 is provided with a pin for connecting with the negative electrode, a pin for connecting with the positive electrode of the SOA510, and a pin for connecting with the positive electrode of the temperature sensor 530; the second stepped surface 430 is used for connecting the negative electrode of the light receiving component 810, the negative electrode of the transimpedance amplifier 820, the negative electrode of the SOA510, and a ground pin of the negative electrode of the temperature sensor 530.

In some embodiments of the present application, the devices in the cavity of the lower light receiving housing 081 are wire bonded to corresponding pins on the electrical connector 400, such as the pins on the electrical connector 400 of the transimpedance amplifier 820. In the embodiment of the application, the optical amplifying element 500, the TEC890, etc. also need to be powered, and thus it is necessary to provide electrical connections for the optical amplifying element 500, the TEC89, etc. through the electrical connector 400 for supplying power to the optical amplifying element 500, the TEC89, etc. but the optical amplifying element 500, the TEC89, etc. are relatively far away from the electrical connector 400 and span the wdm element 830 between the optical amplifying element 500, the TEC890, etc. and the electrical connector 400, and the electrical connections between the optical amplifying element 500, the TEC890, etc. and the electrical connector 400 are not easily realized by wire bonding and the impedance between the optical amplifying element 500, the TEC890, etc. and the electrical connector 400 is not easily limited, so that even if the optical amplifying element 500, the TEC890, etc. are electrically connected to the corresponding pins on the electrical connector 400 by wire bonding, the electrical connections between the optical amplifying element 500, the TEC890, etc. can be directly wire bonded, and the electrical stability of the optical amplifying element 500, TEC890, etc. is often difficult to meet the requirements.

In order to meet the requirements of the electrical connector 400 such as the optical amplification module 500 and the TEC890, in some embodiments of the present application, a substrate provided with a circuit pattern is used to perform switching between the optical amplification module 500, the TEC890, and the like and the electrical connector 400, and the substrate may be directly disposed in a cavity of the lower light receiving housing 081; for example, a substrate is provided on the bottom plate of the light receiving lower case 081 or other position of the light receiving cavity, corresponding metal layers are provided on the substrate to form a circuit pattern, one end of the substrate is electrically connected to the optical amplification assembly 500 and the TEC890 and the like, and the other end of the substrate is electrically connected to the electrical connector 400, thereby achieving electrical connection of the optical amplification assembly 500 and the TEC89 and the like to the electrical connector 400 through the substrate.

Fig. 15 is a schematic structural view of another light-receiving sub-module with a light-receiving upper cover removed according to some embodiments, and fig. 16 is a cross-sectional view of the light-receiving sub-module in fig. 15. As shown in fig. 15 and 16, a surface of the first substrate 610 is provided with a metal layer through which a circuit pattern is formed for electrical connection of the optical amplification assembly 500 and the TEC890 and the like to the electrical connector 400. Of course, in the embodiment of the present application, a substrate for separately achieving electrical connection of the optical amplification assembly 500 and the TEC890 and the like to the electrical connector 400 may be provided, the substrate being provided in the light receiving lower case 081; alternatively, a metal layer is provided on the surface of the second substrate 620, and the electrical connection of the optical amplifier module 500, the TEC890, and the like to the electrical connector 400 is realized through the second substrate 620. In addition, a circuit pattern may be formed inside the first substrate 610 and pads may be formed on the surface of the first substrate 610, the first substrate 610 and the electrical connector 400 are integrally configured, pins on the other side of the electrical connector 400 are electrically connected to the pads on the surface of the first substrate through the circuit pattern formed inside the first substrate 610, and the optical amplifier module 500, the TEC890, and the like are electrically connected to the pads on the first substrate 610, so that the optical amplifier module 500, the TEC890, and the like are electrically connected to the electrical connector 400. Next, an example in which a circuit pattern is formed on a metal layer provided on the surface of the first substrate 610 will be described in which the optical amplifier module 500, the TEC89, and the like are electrically connected to the electrical connector 400 via the first substrate 610.

Fig. 17 is a schematic structural diagram of another first substrate according to some embodiments, and fig. 17 shows a detailed structure of a metal layer disposed on the first substrate 610, although the structure and shape of the metal layer disposed on the first substrate 610 in the embodiments of the present disclosure are not limited to the structure and shape shown in fig. 17. As shown in fig. 17, in the first substrate 610 provided in the embodiment of the present application, a metal layer is disposed on the first substrate 610, the metal layer on the first substrate 610 extends from one end of the first substrate 610 to the other end of the first substrate 610, one end of the first substrate 610 is close to the optical amplifier assembly 500, the TEC89, and the like, and the other end is close to the electrical connector 400. In some embodiments, the first substrate 610 is a ceramic substrate, and a metal layer of gold or copper is disposed on a top surface of the ceramic substrate.

As shown in fig. 17, a first metal layer 612, a second metal layer 613, a third metal layer 614, a fourth metal layer 615, and a fifth metal layer 616 are disposed on the first substrate 610. Since the light amplification assembly 500 and the TEC89 are distributed more intensively, one ends of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615, and the fifth metal layer 616 are concentrated at one end of the first substrate 610; the pin distribution of the electrical connector 400 is relatively scattered, and thus the other ends of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615 and the fifth metal layer 616 are relatively scattered. Usually, one end of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615 and the fifth metal layer 616 is collectively disposed at one end of the first substrate 610 to electrically connect the optical amplifier module 500, the TEC89 and the like by wire bonding, and the other end of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615 and the fifth metal layer 616 is connected to the pins of the electrical connector 400 by wire bonding. In some embodiments of the present application, end portions of one ends of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615, and the fifth metal layer 616 are juxtaposed at one end of the first substrate 610 in a width direction of the first substrate 610.

In some embodiments of the present application, as shown in fig. 17, a blank region 619 is disposed on the first substrate 610, and the middle portions of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615 and the fifth metal layer 616 avoid the blank region 619, and the second substrate 620 is disposed above the blank region 619, so as to ensure that a smaller number of metal layers are laid below the wdm component 830, so as to reduce the influence of the metal layers on the use of the wdm component 830.

The detailed bus pattern of the metal layer on the first substrate 610 in some embodiments of the present application is also shown in detail in fig. 17. As shown in fig. 17, the blank region 619 is located at one side of the third metal layer 614, the second metal layer 613 is located at the other side of the third metal layer 614, and the middle of the third metal layer 614 and the end of the other end of the third metal layer 614 surround the blank region 619; the end of the other end of the third metal layer 614 extends to the side of the first substrate 610 along the width direction, and the end of the other end of the second metal layer 613 extends to one side of the end of the third metal layer 614; the fourth metal layer 615 surrounds a side of the empty region 619 not surrounded by the third metal layer 614, and an end of the other end of the fourth metal layer 615 extends to a side of an end of the third metal layer 614.

In some embodiments, as shown in fig. 17, the end of the other end of the first metal layer 612 is located between the end of the other end of the second metal layer 613 and the end of the other end of the third metal layer 614; the other end of fifth metal layer 616 terminates between the end of the other end of fourth metal layer 615 and the end of the other end of third metal layer 614. Thus, it is convenient to arrange the devices on the third metal layer 614 and coordinate the routing of the metal layers on the first substrate 610 to the electrical connector 400.

In some embodiments of the present application, one end of the first metal layer 612 is configured to be electrically connected to an anode of the TEC890, one end of the second metal layer 613 is configured to be connected to an anode of the temperature sensor 530, one end of the third metal layer 614 is configured to be connected to a cathode of the temperature sensor 530 and a cathode of the SOA510, one end of the fourth metal layer 615 is configured to be connected to an anode of the SOA510, and the fifth metal layer 616 is configured to be connected to a cathode of the TEC 890; the other ends of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615 and the fifth metal layer 616 are correspondingly connected to corresponding pins according to the distribution of the pins on the electrical connector 400.

In some embodiments of the present application, the metal layer layout shown in fig. 17 has a relatively large area of the other end of the third metal layer 614. On one hand, in order to ensure the grounding performance of the optical amplifying module 500, the TEC89 and the like, a plurality of wires need to be routed between the other end of the third metal layer 614 and the electrical connector 400, and the area of the other end of the third metal layer 614 is relatively larger, which is convenient for routing the other end of the third metal layer 614 and the electrical connector 400. On the other hand, the cathodes of the light receiving elements 810, the transimpedance amplifier 820 and other devices on the first substrate 610 also need to be grounded, so that the area of the other end of the third metal layer 614 is relatively large, which facilitates grounding of the cathodes of the light receiving elements 810, the transimpedance amplifier 820 and the like and mounting and fixing of the light receiving elements 810, the transimpedance amplifier 820 and the like. Thus, in some embodiments of the present disclosure, the end of the other end of the third metal layer 614 extends to the side of the first substrate 610 along the width direction of the first substrate 610, and the end of the other end of the first metal layer 612, the second metal layer 613, the fourth metal layer 615 and the fifth metal layer 616 is slightly farther from the side of the first substrate 610, so as to facilitate the routing of the metal layers on the first substrate 610 and the electrical devices disposed on the first substrate 610 to the electrical connector 400.

Fig. 18 is a state diagram of another use of a first substrate according to some embodiments. As shown in fig. 18, the light receiving element 810 and the transimpedance amplifier 820 are mounted on the third metal layer 614. In this embodiment, in order to ensure the normal operation of the light receiving element 810 and the transimpedance amplifier 820, some devices such as a matching resistor and a matching capacitor may be further required, and therefore, the devices such as a matching resistor and a matching capacitor may also be mounted on the third metal layer 614.

As shown in fig. 18, the second substrate 620 covers the middle of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615, and the fifth metal layer 616, the first support block 841 is disposed on the first metal layer 612 and the second metal layer 613, and the second support block 842 is disposed on the fourth metal layer 615 and the fifth metal layer 616. The second substrate 620 is insulated from the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615 and the fifth metal layer 616, and an insulating material may be covered in the middle of the first metal layer 612, the second metal layer 613, the third metal layer 614, the fourth metal layer 615 and the fifth metal layer 616, or the second substrate 620 is made of an insulating material, such as a ceramic substrate. The first support block 841 is insulated from the first metal layer 612 and the second metal layer 613, and the second support block 842 is insulated from the fourth metal layer 615 and the fifth metal layer 616; optionally, the first supporting block 841 and the second supporting block 842 are made of plastic, glass or other insulating materials. The first substrate 610 provided in this embodiment of the present application can be used to carry devices such as the wdm assembly 830, and can also provide electrical connection of the optical amplifier assembly 500 to the electrical connection 400, thereby ensuring the usability of the first substrate 610.

Fig. 19 is a schematic structural diagram of a light amplification assembly according to some embodiments. As shown in fig. 19, the optical amplification module 500 provided in the embodiment of the present application includes a fourth substrate 520, where the fourth substrate 520 has an elongated structure, an SOA positive electrode metal layer 521, an SOA negative electrode metal layer 522, and a temperature sensor negative electrode metal layer 523 are disposed on a top surface of the fourth substrate 520, and ends of the SOA positive electrode metal layer 521, the SOA negative electrode metal layer 522, and the temperature sensor negative electrode metal layer 523 are close to an end of the fourth substrate 520; the SOA510 is attached to the first section of the SOA negative electrode metal layer 522, the negative electrode of the SOA510 is electrically connected with the SOA negative electrode metal layer 522, and the positive electrode of the SOA510 is connected with the head end of the SOA positive electrode metal layer 521 through routing; the temperature sensor 530 is attached to the first section of the temperature sensor cathode metal layer 523, and the cathode of the temperature sensor 530 is electrically connected to the temperature sensor cathode metal layer 523. In the embodiment of the present application, the fourth substrate 520 is a long strip, which facilitates the arrangement of the collimating lens 860 and the focusing lens 870, and ensures the utilization rate of the third substrate 630; of course, the fourth substrate 520 in the embodiment of the present application is not limited to the strip structure, and may have other shapes.

In some embodiments of the present disclosure, the ends of the SOA anode metal layer 521, the SOA cathode metal layer 522, the temperature sensor cathode metal layer 523, and the anode of the temperature sensor 530 may be directly connected to the corresponding metal layers on the first substrate 610 by wire bonding. Of course, in the embodiment of the present invention, the fourth substrate 520 is not limited to be directly connected to the first substrate 610 by wire bonding, but a relay substrate may be disposed between the fourth substrate 520 and the first substrate 610, a circuit pattern formed by a metal layer is disposed on the relay substrate, the fourth substrate 520 and the first substrate 610 are electrically connected to the relay substrate respectively, and the fourth substrate 520 and the first substrate 610 are electrically connected to each other through the relay substrate.

Fig. 20 is a state diagram of another third substrate according to some embodiments. As shown in fig. 20, in some embodiments of the present application, the light amplifying assembly 500 further includes a fifth substrate 540, the fifth substrate 540 is disposed on a top surface of the third substrate 630, the fifth substrate 540 is located at an end of the fourth substrate 520, and the fifth substrate 540 is used as a relay substrate for electrically connecting the fourth substrate 520 to the first substrate 610. Of course, in the embodiment of the present application, the fifth substrate 540 is not limited to be disposed on the third substrate 630.

As shown in fig. 20, the fifth substrate 540 is disposed at an end of the fourth substrate 520, and the fifth substrate 540 is close to the positive and negative electrodes of the TEC890, so that the related wire bonding can be relatively intensively disposed, thereby facilitating the concentrated wire bonding. A plurality of metal strips are disposed on the fifth substrate 540, and the metal strips are used for transferring the metal layer on the fourth substrate 520 to the metal layer on the first substrate 610.

Optionally, a plurality of parallel metal strips are disposed on the top surface of the fifth substrate 540; of course, the embodiment of the present application is not limited to parallel metal strips, and metal strips with any shape may be provided as required. In some embodiments of the present application, as shown in fig. 20, a length direction of the fourth substrate 520 is perpendicular to a length direction of the fifth substrate 540, and a plurality of parallel metal strips are arranged along the length direction of the fifth substrate 540, so that the ends of the SOA anode metal layer 521, the SOA cathode metal layer 522, and the temperature sensor cathode metal layer 523 on the fourth substrate 520 are perpendicular to the metal strips on the fifth substrate 540, thereby facilitating routing of the SOA anode metal layer 521, the SOA cathode metal layer 522, and the temperature sensor cathode metal layer 523 on the fourth substrate 520 to the fifth substrate 540.

In an embodiment of the present application, as shown in fig. 20, 4 metal strips parallel to each other are disposed on the fourth substrate 520, and as shown in the direction of fig. 20, the metal strip for electrically connecting the SOA positive electrode metal layer 521, the SOA negative electrode metal layer 522 and the temperature sensor negative electrode metal layer 523, the metal strip for the positive electrode of the temperature sensor 530, and the metal strip for the positive electrode of the TEC890 are sequentially arranged from top to bottom. For convenience of description, the 4 parallel metal strips are sequentially a first metal strip 541, a second metal strip 542, a third metal strip 543 and a fourth metal strip 544 from top to bottom, the first metal strip 541 is connected with an SOA anode metal layer 521 in a routing mode, the second metal strip 542 is connected with an SOA cathode metal layer 522 and a temperature sensor cathode metal layer 523 in a routing mode, the third metal strip 543 is connected with an anode of a temperature sensor 530 in a routing mode, and the fourth metal strip 544 is connected with an anode of a TEC890 in a routing mode.

Fig. 21 is a partial structural diagram of a rosa according to some embodiments, wherein the anode of the TEC is located at the left position in fig. 21, and fig. 21 shows the wire bonding states of the first substrate 610, the fourth substrate 520 and the fifth substrate 540. As shown in fig. 21, the end of the fifth substrate 540 is close to the end of the third substrate 630, so that the end of the fifth substrate 540 is close to one end of the first substrate 610, and the end of the metal strip on the fifth substrate 540 is close to one end of the metal layer on the first substrate 610, thereby facilitating wire bonding.

As shown in fig. 21, in some embodiments of the present invention, one end of the metal layer on the first substrate 610 is close to the fifth substrate 540, the other end of the first metal strip 541 is wire-bonded to the second metal layer 613, the second metal strip 542 is wire-bonded to the third metal layer 614, the third metal strip 543 is wire-bonded to the fourth metal layer 615, and the fourth metal strip 544 is wire-bonded to the fifth metal layer 616. In the embodiment of the present application, the routing connection between the fourth substrate 520 and the first substrate 610 is combined with the fifth substrate 540, so that routing between the boards can be arranged in sequence, thereby effectively avoiding crossing of routing connection and ensuring the service performance of routing connection.

Fig. 22 is a schematic diagram showing a structure inside a light receiving lower housing in another light receiving sub-module provided according to some embodiments, and fig. 22 shows a structure of the light receiving sub-module 208 in the light receiving lower housing 081 in the embodiment of the present application and a layout for providing electrical connection between the light amplifying assembly 500 and the TEC 890; fig. 23 is a partially enlarged view of a portion in fig. 22, fig. 24 is a partially enlarged view of B portion in fig. 22, fig. 25 is a partially enlarged view of C portion in fig. 22, and the wire bonding structure of the relevant portion is shown in fig. 23 to 25. The layout designed in fig. 22-25 facilitates the electrical connector 400 to supply power to the optical amplification component 500 and the TEC890, etc. by combining the metal layer disposed on the first substrate 610 and the fifth substrate 540, thereby ensuring the power supply stability of the optical amplification component 500 and the TEC890, etc. Of course, the specific layout form in the embodiment of the present application is not limited to the one shown in fig. 22, and may be modified and adjusted as appropriate.

In the embodiment of the present application, the gain of the SOA510 may be adjusted according to the intensity of the signal light actually transmitted to the SOA510, so that the power of the signal light transmitted to the optical receiving module 810 is kept in a relatively stable state, and therefore, the gain of the SOA510 may be adjusted according to the intensity of the signal light transmitted to the rosa 208.

In the embodiment of the present application, to realize the electrical connection connector 400 such as the optical amplification module 500 and the TEC890, the present application is not limited to providing a gold layer on the first substrate 610, and a metal layer may be provided on the second substrate 620 or another substrate may be provided for providing the metal layer.

Fig. 26 is a schematic structural diagram of another optical receive sub-module with a light receive top cover removed according to some embodiments. As shown in fig. 26, in the second substrate 620 provided in the embodiment of the present application, a metal layer is disposed on the second substrate 620, and the electrical connection connector 400 satisfying the optical amplification module 500, the TEC890, and the like is implemented by disposing the metal layer on the second substrate 620.

In some embodiments of the present application, a metal layer on the second substrate 620 is disposed on the second substrate 620 at a position near a sidewall of the light receiving lower case 081. The metal layers on the second substrate 620 may be all strip-shaped, but may also be in other shapes.

Fig. 27 is a schematic structural diagram illustrating a fourth rosa with a light receiving cover removed according to some embodiments. As shown in fig. 27, the substrate assembly 600 further includes a sixth substrate 640 and a seventh substrate 650, wherein metal layers are respectively disposed on the sixth substrate 640 and the seventh substrate 650, and the electrical connection connector 400, such as the optical amplification module 500, the TEC890 and the like, is further implemented by combining the sixth substrate 640 and the seventh substrate 650.

In some embodiments of the present application, as shown in fig. 27, the sixth substrate 640 and the seventh substrate 650 are disposed on the second substrate 620, that is, the second substrate 620 is used to fixedly support the sixth substrate 640 and the seventh substrate 650, and the sixth substrate 640 and the seventh substrate 650 are disposed on the second substrate 620 at positions close to the side walls of the light receiving lower case 081. As shown in fig. 27, a sixth substrate 640 is disposed at one side of the second substrate 620 for the amplifying assembly 500 to electrically connect to the electrical connector 400, and a seventh substrate 650 is disposed at the other side of the seventh substrate 650 for the TEC890 to electrically connect to the electrical connector 400. The metal layers on the sixth and

seventh substrates

640 and 650 may be in a bar shape.

Of course, in some embodiments of the present application, the sixth substrate 640 and the seventh substrate 650 may also be disposed on the first substrate 610 or on the bottom plate of the light receiving lower case 081.

Fig. 28 is a diagram illustrating a use state of still another third substrate according to some embodiments, and fig. 28 shows a partial structure of another rosa 208. As shown in fig. 26, the rosa 208 provided in the embodiment of the present application further includes a beam splitter 085 and a backlight detector 086. The optical splitter 085 is configured to split the signal light transmitted from the outside of the optical module to the rosa 208 into light with a certain optical power, and the backlight detector 086 receives the signal light split by the optical splitter 085 and determines the intensity of the signal light transmitted from the outside of the optical module to the rosa 208 according to the received signal light power. Optionally, the optical splitter 085 may transmit the signal light, which is transmitted to the rosa 208 from the outside of the optical module with 2% to 5% of optical power, to the backlight detector 086, and in this embodiment, the optical splitter 085 is not limited to the signal light, which is transmitted to the rosa 208 from the outside of the optical module with 2% to 5% of optical power.

As shown in fig. 28, in some embodiments of the present application, the beam splitter 085 and the backlight detector 086 are disposed on the third substrate 630; the optical splitter 085 is disposed between the isolator 850 and the collimator lens 860, and the signal light transmitted through the isolator 850 is transmitted to the optical splitter 085; the signal light of a part of the optical power transmitted to the optical splitter 085 is reflected and transmitted to the backlight detector 086, the signal light of another part of the optical power is transmitted through the optical splitter 085 and then transmitted to the collimating lens 860, and the transmission direction of the signal light transmitted to the light-receiving sub-module 208 from the outside of the optical module is as shown by the arrow in fig. 26.

Fig. 29 is a schematic diagram of an SOA gain control circuit according to some embodiments. As shown in fig. 29, in the embodiment of the present application, the SOA gain control circuit includes an MCU2061, and the MCU2061 determines the gain of the SOA510 according to the collected signal, and further controls the working current applied to the SOA 510.

As shown in fig. 29, in some embodiments of the present application, the backlight detector 086 receives the signal light reflected by the beam splitter 085 and converts the signal light into an electrical signal; the output end of the backlight detector 086 is electrically connected with the transimpedance amplifier 820, and the electric signal converted by the backlight detector 086 is transmitted to the transimpedance amplifier 820 and amplified by the transimpedance amplifier 820; the transimpedance amplifier 820 and the MCU2061 are connected with a sampling module 2062, the MCU2061 acquires an analog signal through the sampling module 2062 to obtain a digital signal, then the MCU2061 determines the optical power of the signal light received by the backlight detector 086 through the digital signal to determine the actual optical power of the signal light from the outside of the optical module, further determines the gain of the SOA510 by combining the expected optical power value of the optical module, and finally determines the working current of the SOA510 according to the gain of the SOA 510. In some embodiments of the present application, a lookup table of the optical power of the backlight detector 086 receiving the signal light corresponding to the working current of the SOA510 may be stored in a register of the MCU2061, and when the optical power of the backlight detector 086 receiving the signal light is obtained, the working current of the SOA510 is obtained through the lookup table.

As shown in fig. 29, the temperature sensor 530 is connected to the MCU2061, and is configured to transmit the acquired temperature signal to the MCU2061, and the MCU2061 determines the current that the TEC890 needs to apply and the direction of the current according to the received temperature signal, so that the TEC890 can effectively control the temperature of the SOA510, and ensure that the SOA510 works in a set temperature range, thereby enabling the SOA510 to have better working performance.

In some embodiments of the present application, the register of the MCU2061 stores a lookup table of the temperature signal, the gain of the SOA510, and the TEC890 driving current, and determines the current and the current direction to be applied to the TEC890 according to the collected temperature signal and the set gain of the SOA 510. And driving the TEC890 according to the determined current and the current direction, so that the TEC890 regulates and controls the working temperature of the SOA 510.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board;

the optical receiving sub-module is arranged at one end of the circuit board, is electrically connected with the circuit board and is used for receiving signal light from the outside of the optical module;

wherein the optical receive sub-module comprises:

one end of the light receiving cavity is provided with a light inlet hole, the other end of the light receiving cavity is provided with an opening, and an electric connector is arranged in the opening and is electrically connected with the circuit board;

the light amplification assembly is arranged in the light receiving cavity and is close to a light inlet of the light receiving cavity, and the light amplification assembly comprises a semiconductor optical amplifier, a fourth substrate and a fifth substrate; the semiconductor optical amplifier is arranged on the fourth substrate and electrically connected with the fourth substrate, and the fifth substrate is arranged at one end of the fourth substrate; the metal layer on the fourth substrate extends along the width direction of the light receiving cavity, the metal strip on the fifth substrate extends along the length direction of the light receiving cavity, and the metal layer on the fourth substrate is correspondingly connected with the metal strip on the fifth substrate through a routing;

the first substrate is arranged in the light receiving cavity and positioned between the light amplification assembly and the electric connector, and a third metal layer and a fourth metal layer which extend from one end of the first substrate to the other end of the first substrate along the length direction of the light receiving cavity are arranged on the surface of the first substrate; one end of the third metal layer and one end of the fourth metal layer are arranged in parallel at the position, close to the fifth substrate, of the first substrate; a blank area is formed between the middle part of the third metal layer and the middle part of the fourth metal layer, the other end of the third metal layer extends to the other end of the first substrate, the width direction of the third metal layer extends to the side edge of the first substrate in the width direction, and the other end of the fourth metal layer is positioned on the side edge of the other end of the third metal layer; one ends of the third metal layer and the fourth metal layer are correspondingly connected with the metal strips on the fifth substrate through routing so as to be electrically connected with the fourth substrate through the fifth substrate, and the other end of the metal layer on the first substrate is connected with the electric connector through routing;

and a light receiving module disposed on the first substrate and configured to receive the signal light transmitted through the semiconductor optical amplifier.

2. The optical module according to claim 1, wherein an SOA anode metal layer and an SOA cathode metal layer are disposed on the fourth substrate, a cathode of the semiconductor optical amplifier is attached to the SOA cathode metal layer, and an anode of the semiconductor optical amplifier is wire-bonded to the SOA anode metal layer;

the fifth substrate is provided with a first metal strip and a second metal strip, the SOA anode metal layer is in routing connection with the first metal strip, and the SOA cathode metal layer is in routing connection with the second metal strip so as to be electrically connected with the electric connector through the first metal strip and the second metal strip.

3. The optical module of claim 2, wherein the optical amplifying assembly further comprises a temperature sensor, the fourth substrate further comprises a temperature sensor cathode metal layer, and a cathode of the temperature sensor is mounted on the temperature sensor cathode metal layer;

the fifth substrate is further provided with a third metal strip, the negative metal layer of the temperature sensor is connected with the second metal strip in a routing mode, and the positive electrode of the temperature sensor is connected with the third metal strip in a routing mode so as to be electrically connected with the electric connector through the third metal strip.

4. The optical module as claimed in claim 2, wherein the light receiving sub-module further comprises a TEC disposed on a bottom plate of the light receiving cavity;

the light receiving submodule further comprises a third substrate, the third substrate is arranged on the top of the TEC, and the light amplification assembly is arranged on the third substrate;

the fifth substrate is located between the fourth substrate and the electrode of the TEC, a fourth metal strip is further arranged on the fifth substrate, and the anode of the TEC is connected with the fourth metal strip in a routing mode so as to be electrically connected with the electric connector through the fourth metal strip.

5. The optical module of claim 1, wherein the rosa further comprises a demultiplexing assembly and a second substrate, the second substrate being disposed on the first substrate, the demultiplexing assembly being disposed on the second substrate between the optical amplification assembly and the optical receiver assembly.

6. The optical module of claim 5, wherein the rosa further comprises a reflective prism and a lens assembly, the reflective prism is covered over the light-receiving assembly, the lens assembly is disposed on the second substrate, and the lens assembly is located between the demultiplexing assembly and the reflective prism.

7. The optical module of claim 1, wherein the rosa further comprises an isolator, a collimating lens and a focusing lens, the isolator and the collimating lens are sequentially disposed between the light outlet of the light receiving cavity and the light amplifying assembly, and the focusing lens is disposed on a side of the light amplifying assembly away from the collimating lens.

8. The optical module according to claim 1, wherein the light receiving cavity comprises a light receiving lower shell and a light receiving upper cover, the light receiving upper cover is covered and connected with the light receiving lower shell, one end of the light receiving lower shell is provided with the light inlet hole, and the other end of the light receiving lower shell is provided with the opening;

the optical fiber adapter is characterized in that the light inlet hole is provided with an optical fiber adapter assembly, the optical fiber adapter assembly comprises an optical fiber adapter and an optical fiber adapter connecting piece, one end of the optical fiber adapter connecting piece is communicated with the optical fiber adapter, and the other end of the optical fiber adapter connecting piece is communicated with the light inlet hole.

9. The optical module according to claim 2, wherein an end of the first metal strip in the electrical connector direction and an end of the second metal strip in the electrical connector direction are provided at ends of the fifth board juxtaposed in the fifth board width direction.