CN101923193A - Pluggable light receiving and dispatching integrated module - Google Patents
Pluggable light receiving and dispatching integrated module Download PDFInfo
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- CN101923193A CN101923193A CN2009100873401A CN200910087340A CN101923193A CN 101923193 A CN101923193 A CN 101923193A CN 2009100873401 A CN2009100873401 A CN 2009100873401A CN 200910087340 A CN200910087340 A CN 200910087340A CN 101923193 A CN101923193 A CN 101923193A
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Abstract
The invention discloses a pluggable light receiving and dispatching integrated module, which comprises a radiating fin (1), a speedy multilayer organic substrate (2) arranged on the radiating fin (1), a silicon substrate (8) arranged on the hollow area in the center of the speedy multilayer organic substrate (2), a micro controller (9) arranged on the back of the speedy multilayer organic substrate (2), a laser array chip (4), a photoelectric detector array chip (5), a laser driver array chip (6) and a tansimpedance amplifier and amplitude limiting amplifier array chip (7) which are arranged on the front side of the silicon substrate (8), a speedy electric connector (10) which is arranged on the front side of the speedy multilayer organic substrate (2) and covered on the silicon substrate (8), the laser array chip (4), the photoelectric detector array chip (5), the laser driver array chip (6) and the tansimpedance amplifier and amplitude limiting amplifier array chip (7), an optical fiber belt (11) and an optical fiber connector (12). The module is characterized by simple structure, low-cost volume-production, small volume, simple appearance and convenient use.
Description
Technical field
The present invention relates to a kind of optical module, more particularly, relate to a kind of pluggable light receiving and dispatching integrated module based on laser array and photodetector array.
Background technology
With optical fiber is ripe being applied in the communication network of different stages such as backbone network, Metropolitan Area Network (MAN), LAN (Local Area Network) of optical communication technique of optical transmission carrier.Along with next generation computer, server, communication facilities etc. develop to high-frequency high-speed, the influence of factor such as be subjected to loss, radiation, crosstalk, traditional electrical interconnection based on copper cash will be difficult to continue as between frame, between plate again and the high speed information exchange of very short distance such as chip chamber provides support.Light interconnection is because advantages such as its high capacity, two-forty, low time delay, low-power consumption, will replace copper cash to provide physical connection on the very short distance for high performance system.
Parallel optical interconnecting can be realized longer-distance transmission by many optical fiber that are parallel to each other or optical waveguide transmission multiple signals under high bandwidth.Because what transmit in the electronic system all is electric signal, use up, and by the signal exchange between electronic system or the subsystem on the optical transmission medium realization certain distance, electrical-optical conversion and electro-optic detector spare are essential as signal vehicle.Vcsel (VCSEL) is the luminescent device that parallel optical interconnecting generally adopts, and its advantage comprises: threshold current is low; Resonator cavity is little, be easy to single longitudinal mode operation; The rounded symmetry of launch window, good beam quality is easy to be coupled with optical fiber; Light direction is easy to prepare a peacekeeping two-dimensional array perpendicular to substrate surface.Corresponding to Vcsel (VCSEL), the photodiode of photoreceiving surface is the photodetector that parallel optical interconnecting generally adopts.Different with the optical transceiver module of supporting long haul communication, the very short distance optical transceiver module is responsive more to size, cost.Parallel optical interconnecting module with miniaturization, low cost, wide bandwidth, high reliability is the critical product that solves the technical bottlenecks such as high speed processing, exchange, storage and transmission of short distance vast capacity information.
Different with the light emission module and the Optical Receivers that only have single light emission or light-receiving function, the integrated module of optical transceiver is that optical transmitting set and the optical receiver that will separate are packaged as a whole, has the function that simultaneously high-speed electrical signals that receives is converted to high-speed optical signal and the high-speed optical signal that receives is converted to high-speed electrical signals, so an integrated module of optical transceiver can replace a pair of light emission module and Optical Receivers on an information transmission node, the integrated module of optical transceiver is all taking advantage aspect space hold size and the cost simultaneously.
For realizing between frame, between plate and the parallel optical interconnecting between the high-speed chip, the parallel optical interconnecting module need be electrically connected with printed circuit board (PCB) in the frame, the printed circuit board (PCB) in the plate and the printed circuit board (PCB) that high-speed chip is installed.Adopting solder(ing) paste, soldered ball or metal salient point and surface mounting technology is to realize one of method that is electrically connected between parallel optical interconnecting module and the printed circuit board (PCB), but this method make the parallel optical interconnecting module and printed circuit board (PCB) between finish and be electrically connected the back and be difficult for changing, make troubles for the operation and maintenance of parallel optical interconnecting module.Pluggable high-speed electrical connectors is the effective means that addresses the above problem.
In sum, high-performance, low cost, the pluggable light receiving and dispatching integrated module that is used for short distance high capacity parallel optical interconnecting has powerful market potential.
Summary of the invention
(1) technical matters that will solve
In view of this, fundamental purpose of the present invention is to provide a kind of pluggable light receiving and dispatching integrated module, and this modular structure is simple, is suitable for low-cost production in enormous quantities the in enormous quantities, and volume is little simultaneously, and outward appearance is succinct, and is easy to use.
(2) technical scheme
For achieving the above object, the invention provides a kind of pluggable light receiving and dispatching integrated module, this pluggable light receiving and dispatching integrated module comprises:
Be installed in the organic substrate 2 of high speed multilayer on the heat radiator 1;
The silicon substrate of placing in the hollow out zone of the organic substrate of high speed multilayer 2 centers 8;
Be installed in the microcontroller 9 at the organic substrate of high speed multilayer 2 back sides;
Be installed in laser array chip 4, photodetector array chip 5, laser driver array chip 6 and trans-impedance amplifier and the limiting amplifier array chip 7 in silicon substrate 8 fronts;
Be installed in the organic substrate of high speed multilayer 2 fronts, and cover the high-speed electrical connectors 10 on silicon substrate 8, laser array chip 4, photodetector array chip 5, laser driver array chip 6 and trans-impedance amplifier and the limiting amplifier array chip 7; And
The fibre ribbon 11 and the joints of optical fibre 12.
In the such scheme, described laser array chip 4 and described photodetector array chip 5 are installed on the silicon substrate 8 by the flip chip technology back-off, and described laser driver array chip 6 and described trans-impedance amplifier and limiting amplifier array chip 7 are mounted on the silicon substrate 8 by the bare chip mounting technology.
In the such scheme, preparation has micro through hole array 13 on the described silicon substrate 8, the accurate location of end face on silicon substrate 8 that described fibre ribbon 11 is realized its 12 optical fiber by this micro through hole array 13.
In the such scheme, described fibre ribbon 11 is one dimension 1 * 12 arrays, the one end connects the joints of optical fibre 12, the other end passes heat radiator 1 and silicon substrate 8 carries out optically-coupled with laser array chip 4 and photodetector array chip 5, four optical fiber of its second to the 5th respectively with described laser array chip 4 on four light launching site of equidistantly arranging carry out optically-coupled, four optical fiber of the 8th to the 11 respectively with described photodetector array chip 5 on four optical receiver points of equidistantly arranging carry out optically-coupled, first optical fiber, six roots of sensation optical fiber, the 7th optical fiber and the 12 optical fiber are idle.
In the such scheme, described high-speed electrical connectors 10 is installed in the organic substrate of high speed multilayer 2 fronts, and covers silicon substrate 8 and the laser array chip 4, photodetector array chip 5, laser driver array chip 6, trans-impedance amplifier and the limiting amplifier array chip 7 that are positioned on the silicon substrate 8.
In the such scheme, described heat radiator 1, grooved hole 14 and groove 15 on it, wherein slotted eye 14 is through holes, is used to wear fibre ribbon 11; Groove 15 is blind holes, is used to hold the microcontroller 9 that is installed in the organic substrate of high speed multilayer 2 back sides.
In the such scheme, described laser array chip 4 is one dimension 1 * 4 arrays, described photodetector array chip 5 also is one dimension 1 * 4 array, laser array chip 4 and photodetector array chip 5 are parallel arranged on described silicon substrate 8, and four of the light launching site of four of laser array chip 4 equidistant arrangements and photodetector array chip 5 optical receiver points of equidistantly arranging are on same straight line simultaneously.
In the such scheme, being electrically connected by flipchip bump between described laser array chip 4 and described photodetector array chip 5 and the described silicon substrate 8 realizes; Electrical connection between described laser array chip 4 and the described laser driver array chip 6 realizes by the metal wire bonding, electrical connection between described photodetector array chip 5 and described trans-impedance amplifier and the limiting amplifier array chip 7 realizes by the metal wire bonding, described laser driver array chip 6, being electrically connected by the metal wire bonding between trans-impedance amplifier and limiting amplifier array chip 7 and the described silicon substrate 8 realizes described laser driver array chip 6, trans-impedance amplifier and limiting amplifier array chip 7, being electrically connected by the metal wire bonding between silicon substrate 8 and the organic substrate 2 of high speed multilayer realizes.
In the such scheme, described metal wire is spun gold, aluminium wire or copper wire, or gold ribbon, aluminium strip or copper strips.
In the such scheme, on four jiaos of this pluggable light receiving and dispatching integrated modules a double-screw bolt 3 is arranged respectively, this double-screw bolt 3 is mechanically anchored in the organic substrate 2 of high speed multilayer on the heat radiator 1 by the screw on four jiaos of relevant positions of through hole on four jiaos of relevant positions of the organic substrate 2 of high speed multilayer and heat radiator 1.
(3) beneficial effect
This pluggable light receiving and dispatching integrated module provided by the invention, simple in structure, be suitable for low-cost production in enormous quantities the in enormous quantities, volume is little simultaneously, and outward appearance is succinct, and is easy to use.
Description of drawings
Fig. 1 is the inner structure vertical view of pluggable light receiving and dispatching integrated module of the present invention;
Fig. 2 is the stereographic map of heat radiator.
Fig. 3 is the sectional view of pluggable light receiving and dispatching integrated module of the present invention;
Fig. 4 is the laser array chip of pluggable light receiving and dispatching integrated module of the present invention and the assembling assumption diagram of photodetector array chip and fibre ribbon;
Among the figure: 1: heat radiator; 2: the organic substrate of high speed multilayer; 3: double-screw bolt; 4: laser array chip; 5: the photodetector array chip; 6: the laser driver array chip; 7: trans-impedance amplifier and limiting amplifier array chip; 8: silicon substrate; 9: microcontroller; 10: high-speed electrical connectors; 11: fibre ribbon; 12: the joints of optical fibre; 13: micro through hole array; 14: slotted eye; 15: groove
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
As Fig. 1, Fig. 2 and shown in Figure 3, this pluggable light receiving and dispatching integrated module provided by the invention comprises:
Be installed in the organic substrate 2 of high speed multilayer on the heat radiator 1;
The silicon substrate of placing in the hollow out zone of the organic substrate of high speed multilayer 2 centers 8;
Be installed in the microcontroller 9 at the organic substrate of high speed multilayer 2 back sides;
Be installed in laser array chip 4, photodetector array chip 5, laser driver array chip 6 and trans-impedance amplifier and the limiting amplifier array chip 7 in silicon substrate 8 fronts;
Be installed in the organic substrate of high speed multilayer 2 fronts, and cover the high-speed electrical connectors 10 on silicon substrate 8, laser array chip 4, photodetector array chip 5, laser driver array chip 6 and trans-impedance amplifier and the limiting amplifier array chip 7; And
The fibre ribbon 11 and the joints of optical fibre 12.
High-speed electrical connectors 10 provides from this pluggable light receiving and dispatching integrated module to the electrical property interface that uses the electronic equipment of the present invention.The joints of optical fibre 12 provide from this pluggable light receiving and dispatching integrated module to the optics the external optical fiber and connect, to realize the optical signal transmission between this pluggable light receiving and dispatching integrated module and other device, perhaps to realize the optical signal transmission between this pluggable light receiving and dispatching integrated module and another integrated module of optical transceiver.
Laser instrument in the laser array chip among the present invention is a surface emitting laser, and for example Vcsel (VCSEL) can be from upper surface emitted laser device, also can be from bottom surface emitted laser device; Photodetector in the photodetector array chip is the detector of photoreceiving surface, can be the detector that upper surface is subjected to light, also can be the detector that the bottom surface is subjected to light.
As shown in Figure 1, in pluggable light receiving and dispatching integrated module of the present invention, four chips have been installed on the silicon substrate 8, be respectively laser array chip 4, photodetector array chip 5, laser driver array chip 6, trans-impedance amplifier and limiting amplifier array chip 7, wherein laser array chip 4 and photodetector array chip 5 are installed on the silicon substrate 8 by the flip chip technology back-off, and laser driver array chip 6 and trans-impedance amplifier and limiting amplifier array chip 7 are mounted on the silicon substrate 8 by the bare chip mounting technology.Gone out a zone by hollow out on the center of the organic substrate 2 of high speed multilayer, be used for placing silicon substrate 8.The size in the zone of this hollow out is by the size decision of silicon substrate 8, the length in the zone of hollow out is bigger 50～300 microns than the length of silicon substrate 8, the width in the zone of hollow out is bigger 50～300 microns than the width of silicon substrate 8, so that the operation when substrate 8 is placed into this hollow out regional is easy to realize.Being electrically connected by flipchip bump between laser array chip 4 and photodetector array chip 5 and the silicon substrate 8 realizes.Being electrically connected by the metal wire bonding between laser array chip 4 and the laser driver array chip 6 realizes, being electrically connected by the metal wire bonding between photodetector array chip 5 and trans-impedance amplifier and the limiting amplifier array chip 7 realizes, laser driver array chip 6, being electrically connected by the metal wire bonding between trans-impedance amplifier and limiting amplifier array chip 7 and the silicon substrate 8 realizes laser driver array chip 6, trans-impedance amplifier and limiting amplifier array chip 7, being electrically connected by the metal wire bonding between silicon substrate 8 and the organic substrate 2 of high speed multilayer realizes.Above-mentioned metal wire can be spun gold, aluminium wire, copper wire, also can be gold ribbon, aluminium strip, copper strips.
Paste by the heat conduction cementing agent between organic substrate 2 of high speed multilayer and the heat radiator 1, to realize better heat radiating effect.A double-screw bolt 3 is respectively arranged on four jiaos of pluggable light receiving and dispatching integrated module, double-screw bolt 3 is mechanically anchored in the organic substrate 2 of high speed multilayer on the heat radiator 1 by the screw on four jiaos of relevant positions of through hole on four jiaos of relevant positions of the organic substrate 2 of high speed multilayer and heat radiator 1.The effect of double-screw bolt 3 comprises: increase the strength of joint between organic substrate 2 of high speed multilayer and the heat radiator 1, separate with 1 of heat radiator to come off and cause the generation of the phenomenon that pluggable light receiving and dispatching integrated module damages thereby avoid pluggable light receiving and dispatching integrated module the organic substrate 2 of high speed multilayer to occur in the plug process; Increase the strength of joint between pluggable light receiving and dispatching integrated module and the use electronic equipment of the present invention, improve pluggable light receiving and dispatching integrated module reliability in use; For pluggable light receiving and dispatching integrated module provides thermal dissipating path.
The spatial structure of heat radiator 1 as shown in Figure 2, slotted eye 14 and groove 15 are positioned on the heat radiator 1, wherein slotted eye 14 is through holes, groove 15 is blind holes.Slotted eye 14 is used to wear fibre ribbon 11, so that fibre ribbon 11 is near laser array chip 4 and photodetector array chip 5.Groove 15 is used to hold the microcontroller 9 that is installed in the organic substrate of high speed multilayer 2 back sides.
Fig. 3 illustrates the side sectional structure of pluggable light receiving and dispatching integrated module.One end of fibre ribbon 11 connects the joints of optical fibre 12, and the other end passes heat radiator 1 and silicon substrate 8 carries out optically-coupled with laser array chip 4 and photodetector array chip 5.It is that the slotted eye 14 that the other end by fibre ribbon 11 passes on the heat radiator 1 is realized that the other end of above-mentioned fibre ribbon 11 passes heat radiator 1.The other end of above-mentioned fibre ribbon 11 pass silicon substrate 8 be the other end by fibre ribbon 11 pass on the silicon substrate 8 micro through hole array 13 realize.High-speed electrical connectors 10 is installed on the organic substrate of high speed multilayer 2 fronts by surface mounting technology; high-speed electrical connectors 10 covers silicon substrate 8 and the laser array chip 4 that is positioned on the silicon substrate 8; photodetector array chip 5; laser driver array chip 6; trans-impedance amplifier and limiting amplifier array chip 7; to silicon substrate 8 and the laser array chip 4 that is positioned on the silicon substrate 8; photodetector array chip 5; laser driver array chip 6; trans-impedance amplifier and limiting amplifier array chip 7 have played protective effect, make that simultaneously the pluggable light receiving and dispatching integrated module overall appearance is succinct.
Fibre ribbon 11 is one dimension 1 * 12 arrays, the one end connects the joints of optical fibre 12, the other end passes heat radiator 1 and silicon substrate 8 carries out optically-coupled with laser array chip 4 and photodetector array chip 5, four optical fiber of its second to the 5th respectively with described laser array chip 4 on four light launching site of equidistantly arranging carry out optically-coupled, four optical fiber of the 8th to the 11 respectively with described photodetector array chip 5 on four optical receiver points of equidistantly arranging carry out optically-coupled, first optical fiber, six roots of sensation optical fiber, the 7th optical fiber and the 12 optical fiber are idle.
Fibre ribbon 11 is one dimension 1 * 12 arrays, that is to say that fibre ribbon 11 is made up of 12 optical fiber that are arranged in a row.Referring to Fig. 4, if 12 optical fiber that will constitute fibre ribbon 11 from one side to another side (referring to Fig. 4 from left to right) be designated as successively first optical fiber, second optical fiber, the 3rd optical fiber ..., until the 12 optical fiber, then first optical fiber and the 12 optical fiber lay respectively at the position on the both sides of fibre ribbon 11, and six roots of sensation optical fiber and the 7th optical fiber are positioned at the centre position of fibre ribbon 11.Four optical fiber of second to the 5th of fibre ribbon 11 respectively with laser array chip 4 on four light launching site of equidistantly arranging carry out optically-coupled, four optical fiber of the 8th to the 11 respectively with photodetector array chip 5 on four optical receiver points of equidistantly arranging carry out optically-coupled, first optical fiber, six roots of sensation optical fiber, the 7th optical fiber and the 12 optical fiber are idle, and the arrangement of above fibre ribbon is not unique, can do other rational arrangements according to actual conditions.Spacing between four optical fiber of second to the 5th equals on the laser array chip 4 four spacings between the light launching site of equidistantly arranging, and the spacing between four optical fiber of the 8th to the 11 equals the spacing of four optical receiver points of equidistantly arranging on the photodetector array chip 5.The laser array chip 4 and the photodetector array chip 5 that are installed on the silicon substrate 8 by the flip chip technology back-off are parallel arranged, and four of the light launching site of four of laser array chip 4 equidistant arrangements and photodetector array chip 5 optical receiver points of equidistantly arranging are on same straight line simultaneously.
Preparation has micro through hole array 13 on the silicon substrate 8.Fibre ribbon 11 is realized the accurate location of end face on silicon substrate 8 of above-mentioned its 12 optical fiber by the micro through hole array on the silicon substrate 8 13, thereby realizes high efficiency optically-coupled.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a pluggable light receiving and dispatching integrated module is characterized in that, this pluggable light receiving and dispatching integrated module comprises:
Heat radiator (1);
Be installed in the organic substrate of high speed multilayer (2) on the heat radiator (1);
The silicon substrate of placing in the hollow out zone of the organic substrate of high speed multilayer (2) center (8);
Be installed in the microcontroller (9) at the organic substrate of high speed multilayer (2) back side;
Be installed in silicon substrate (8) positive laser array chip (4), photodetector array chip (5), laser driver array chip (6) and trans-impedance amplifier and limiting amplifier array chip (7);
Be installed in the organic substrate of high speed multilayer (2) front, and cover the high-speed electrical connectors (10) on silicon substrate (8), laser array chip (4), photodetector array chip (5), laser driver array chip (6) and trans-impedance amplifier and the limiting amplifier array chip (7); And
The fibre ribbon (11) and the joints of optical fibre (12).
2. pluggable light receiving and dispatching integrated module according to claim 1, it is characterized in that, described laser array chip (4) and described photodetector array chip (5) are installed on the silicon substrate (8) by the flip chip technology back-off, and described laser driver array chip (6) and described trans-impedance amplifier and limiting amplifier array chip (7) are mounted on the silicon substrate (8) by the bare chip mounting technology.
3. pluggable light receiving and dispatching integrated module according to claim 1, it is characterized in that, described silicon substrate (8) is gone up preparation has micro through hole array (13), described fibre ribbon (11) to realize the accurate location of end face on silicon substrate (8) of its 12 optical fiber by this micro through hole array (13).
4. pluggable light receiving and dispatching integrated module according to claim 1, it is characterized in that, described fibre ribbon (11) is one dimension 1 * 12 array, the one end connects the joints of optical fibre (12), the other end passes heat radiator (1) and silicon substrate (8) carries out optically-coupled with laser array chip (4) and photodetector array chip (5), four optical fiber of its second to the 5th respectively with described laser array chip (4) on four light launching site of equidistantly arranging carry out optically-coupled, four optical fiber of the 8th to the 11 respectively with described photodetector array chip (5) on four optical receiver points of equidistantly arranging carry out optically-coupled, first optical fiber, six roots of sensation optical fiber, the 7th optical fiber and the 12 optical fiber are idle.
5. pluggable light receiving and dispatching integrated module according to claim 1, it is characterized in that, described high-speed electrical connectors (10) is installed in the organic substrate of high speed multilayer (2) front, and covers silicon substrate (8) and be positioned at laser array chip (4), photodetector array chip (5), laser driver array chip (6), trans-impedance amplifier and limiting amplifier array chip (7) on the silicon substrate (8).
6. pluggable light receiving and dispatching integrated module according to claim 1 is characterized in that, described heat radiator (1), and grooved hole on it (14) and groove (15), wherein slotted eye (14) is a through hole, is used to wear fibre ribbon (11); Groove (15) is a blind hole, is used to hold the microcontroller (9) that is installed in the organic substrate of high speed multilayer (2) back side.
7. pluggable light receiving and dispatching integrated module according to claim 1, it is characterized in that, described laser array chip (4) is one dimension 1 * 4 array, described photodetector array chip (5) also is one dimension 1 * 4 array, laser array chip (4) and photodetector array chip (5) are parallel arranged on described silicon substrate (8), and four of the light launching site of four of laser array chip (4) equidistant arrangements and photodetector array chip (5) optical receiver points of equidistantly arranging are on same straight line simultaneously.
8. pluggable light receiving and dispatching integrated module according to claim 1 is characterized in that, being electrically connected by flipchip bump between described laser array chip (4) and described photodetector array chip (5) and the described silicon substrate (8) realizes; Electrical connection between described laser array chip (4) and the described laser driver array chip (6) realizes by the metal wire bonding, electrical connection between described photodetector array chip (5) and described trans-impedance amplifier and the limiting amplifier array chip (7) realizes by the metal wire bonding, described laser driver array chip (6), being electrically connected by the metal wire bonding between trans-impedance amplifier and limiting amplifier array chip (7) and the described silicon substrate (8) realizes described laser driver array chip (4), trans-impedance amplifier and limiting amplifier array chip (7), being electrically connected by the metal wire bonding between silicon substrate (8) and the organic substrate of high speed multilayer (2) realizes.
9. pluggable light receiving and dispatching integrated module according to claim 8 is characterized in that, described metal wire is spun gold, aluminium wire or copper wire, or gold ribbon, aluminium strip or copper strips.
10. pluggable light receiving and dispatching integrated module according to claim 1, it is characterized in that, on four jiaos of this pluggable light receiving and dispatching integrated modules a double-screw bolt (3) is arranged respectively, this double-screw bolt (3) is mechanically anchored in the organic substrate of high speed multilayer (2) on the heat radiator (1) by the screw on four jiaos of relevant positions of through hole on four jiaos of relevant positions of the organic substrate of high speed multilayer (2) and heat radiator (1).
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009100873401A CN101923193A (en) | 2009-06-17 | 2009-06-17 | Pluggable light receiving and dispatching integrated module |
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| CN2009100873401A CN101923193A (en) | 2009-06-17 | 2009-06-17 | Pluggable light receiving and dispatching integrated module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102508342A (en) * | 2011-11-25 | 2012-06-20 | 深圳市易飞扬通信技术有限公司 | Parallel optical module and optical fiber connector |
| CN104170079A (en) * | 2012-09-13 | 2014-11-26 | 富士电机株式会社 | Semiconductor device, method for attaching heat dissipating member to semiconductor device, and method for manufacturing semiconductor device |
| CN106506066A (en) * | 2016-12-11 | 2017-03-15 | 广东海信宽带科技有限公司 | A kind of colourless dense wave division multipurpose access network optical line terminal optical module |
| CN113805290A (en) * | 2021-09-16 | 2021-12-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2009
- 2009-06-17 CN CN2009100873401A patent/CN101923193A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102508342A (en) * | 2011-11-25 | 2012-06-20 | 深圳市易飞扬通信技术有限公司 | Parallel optical module and optical fiber connector |
| CN104170079A (en) * | 2012-09-13 | 2014-11-26 | 富士电机株式会社 | Semiconductor device, method for attaching heat dissipating member to semiconductor device, and method for manufacturing semiconductor device |
| CN106506066A (en) * | 2016-12-11 | 2017-03-15 | 广东海信宽带科技有限公司 | A kind of colourless dense wave division multipurpose access network optical line terminal optical module |
| CN113805290A (en) * | 2021-09-16 | 2021-12-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113805290B (en) * | 2021-09-16 | 2023-01-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Application publication date: 20101222 |