CN114647037A - Optical module - Google Patents
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- CN114647037A CN114647037A CN202011496690.6A CN202011496690A CN114647037A CN 114647037 A CN114647037 A CN 114647037A CN 202011496690 A CN202011496690 A CN 202011496690A CN 114647037 A CN114647037 A CN 114647037A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
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- Engineering & Computer Science (AREA)
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- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The application provides an optical module includes the light receiving submodule, the light receiving submodule includes the cavity, establish first lens in the cavity, the SOA chip, the second lens, the optical demultiplexing subassembly, the lens array, third lens and light receiving chip array, wherein first lens receive the light signal that comes from the optical fiber adapter and convert convergent beam, and transmit to the SOA chip, the SOA chip enlargies the light signal that comes from first lens, and export to the second lens, the second lens receives the light signal that comes from the SOA chip and converts collimated beam into, and transmit to the optical demultiplexing subassembly, split the light beam through the optical demultiplexing subassembly, the light signal after the beam splitting passes through in the light receiving chip after lens array and third lens. According to the optical module, the SOA chip is integrated into the optical receiving submodule of the optical module and is connected with other devices well, the power of optical signals received by the optical receiving submodule is amplified, and the optical module which is high in sensitivity and capable of transmitting in a long distance is obtained finally.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
The Optical module comprises an Optical transmitter submodule and an Optical receiver submodule, the Optical transmitter submodule comprises an Optical transmitter and the like, the Optical receiver submodule comprises an Optical receiver, an Optical Amplifier structure is required to be added in an Optical path to improve Optical power, and a common Optical Amplifier is an SOA (Semiconductor Optical Amplifier) chip, so how to integrate the SOA chip in the Optical component becomes a key for solving the problem.
Disclosure of Invention
The application provides an optical module, which amplifies an optical chip by integrating an SOA chip in an optical component so as to improve optical power.
The application provides an optical module, including:
a circuit board;
the light receiving sub-module is electrically connected with the circuit board and used for outputting optical signals;
the optical receive sub-module includes:
a cover plate;
the cavity, with the apron lid closes to be connected, is equipped with on the basal surface:
the first lens is used for receiving the optical signal from the optical fiber adapter and converting the optical signal into a convergent light beam;
an SOA component comprising an SOA chip for receiving and amplifying the optical signal from the first lens
The second lens is used for receiving the optical signal from the SOA chip and converting the optical signal into a collimated beam;
an optical demultiplexing assembly for receiving the optical signal from the second lens and splitting the optical signal into a plurality of optical signals of different wavelengths;
a lens array including a plurality of lenses for receiving the plurality of optical signals of different wavelengths output from the optical demultiplexing assembly and converting the plurality of optical signals of different wavelengths into a converging beam;
the third lens is covered on the light receiving chip array, has a reflecting surface, and is used for receiving a plurality of light signals with different wavelengths from the lens array, reflecting the light signals by the reflecting surface and then irradiating the light signals onto the light receiving surface of each light receiving chip in the light receiving chip array;
the light receiving chip array comprises a plurality of light receiving chips and is used for receiving a plurality of light signals with different wavelengths.
The application provides an optical module includes circuit board and light reception submodule, and light reception submodule closes apron and cavity of connecting including the lid, and the bottom surface of cavity is provided with: the optical signal from the second lens is decomposed into a plurality of optical signals with different wavelengths by the optical demultiplexing component, the plurality of optical signals with different wavelengths obtained after decomposition are converted into convergent beams by a plurality of lenses in the lens array and are transmitted to the third lens, the third lens is covered on a light receiving surface of the optical receiving chip array and is provided with a reflecting surface, and the convergent beams are reflected by the reflecting surface and then are incident on a plurality of optical receiving chips in the optical receiving chip array, the plurality of light receiving chips correspondingly receive a plurality of light signals with different wavelengths. The SOA chip is reasonably integrated into the optical receiving submodule of the optical module and is connected with other devices well, the power of optical signals received by the optical receiving submodule is amplified, and the optical module which is high in sensitivity and capable of transmitting in a long distance is obtained finally.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
fig. 2 is a schematic structural diagram of an optical network terminal;
fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;
fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;
fig. 5 is an external structural view of a rosa of an optical module according to an embodiment of the present disclosure;
fig. 6 is an exploded schematic structural diagram of a light-receiving sub-module of an optical module according to an embodiment of the present disclosure;
fig. 7 is a schematic top view illustrating a structure of a light-receiving sub-module of an optical module according to an embodiment of the present disclosure after a cover plate is removed;
fig. 8 is a schematic structural diagram of each internal device of a light-receiving sub-module of an optical module according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of each component inside another optical receive sub-module of an optical module according to an embodiment of the present application;
fig. 10 is a schematic diagram of a relative position relationship between a first lens, a second lens and an SOA chip in an optical module provided in the embodiment of the present application;
fig. 11 is a schematic view of an optical path structure between each device inside the rosa of the optical module according to the embodiment of the present application;
fig. 12 is a schematic optical path diagram of a light receiving state of an optical module according to an embodiment of the present application;
fig. 13 is a schematic optical path diagram of another light receiving state of the optical module according to the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
One of the core links of optical communication is the interconversion of optical and electrical signals. Optical communication uses optical signals carrying information to transmit in information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fiber/optical waveguide; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.
The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103.
One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.
The optical port of the optical module 200 is connected to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber. The electrical port of the optical module 200 is connected to the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit. The optical module realizes the interconversion between an optical signal and an electrical signal, thereby realizing the establishment of connection between the optical fiber 101 and the optical network unit 100.
Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and in the photoelectric conversion process, the carrier of the information is converted between the light and the electricity, but the information itself is not changed.
The optical network unit 100 has an optical module interface 102 for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200. The optical network unit is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through an optical network unit. Specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit serves as an upper computer of the optical module to monitor the operation of the optical module.
To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device sequentially through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal OLT and the like.
Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector connected to the circuit board 105 is provided in the cage 106, and is used for connecting an electrical port of an optical module such as a gold finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.
The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected to the optical fiber 101.
The cage 106 is located on the circuit board 105 of the optical network unit 100, and the electrical connectors on the circuit board 105 are wrapped in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.
Fig. 3 is a schematic diagram of an optical module structure provided in an embodiment of the present application, and fig. 4 is an exploded schematic diagram of an optical module structure provided in an embodiment of the present application, as shown in fig. 3 and fig. 4, an optical module 200 provided in an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a tosa 500, a tosa 400, and an optical fiber adapter 600, where a transmitting optical fiber ribbon of the tosa 500 and a receiving optical fiber ribbon of the tosa 400 are both connected to the optical fiber adapter 600, and the optical fiber adapter 600 is used for optically connecting the transmitting optical fiber ribbon and the receiving optical fiber ribbon with an external optical fiber.
The upper shell 201 and the lower shell 202 form a wrapping shell with two ports, specifically two ports (204, 205) in the same direction, or two ports in different directions; one of the ports is an electrical port 204 which is used for being inserted into an upper computer such as an optical network unit; the other port is an optical port 205 for connecting an external optical fiber 101; the optoelectronic devices such as the circuit board 300, the transmitter sub-module 500, and the receiver sub-module 400 are disposed in the packaging housing formed by the upper and lower housings.
The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that the upper shell and the lower shell are combined is adopted, so that devices such as a circuit board can be conveniently installed in the shell, the shell of the optical module can not be generally made into an integral structure, and therefore when the devices such as the circuit board are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure are not convenient to install, and production automation is not facilitated.
The unlocking handle 203 is positioned on the outer wall of the wrapping shell/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the cage 106 is clamped by the unlocking handle 203, so that the optical module is fixed in the upper computer; by pulling the unlocking handle, the engagement between the optical module 200 and the cage 106 is released, and the optical module can be pulled out from the upper computer.
The circuit board 300 is located in a casing formed by the upper casing and the casing, the circuit board 300 is electrically connected with the transmitter sub-module 500 and the receiver sub-module 400 respectively, and the circuit board is provided with chips, capacitors, resistors and other electric devices. The method comprises the following steps that corresponding chips are selected according to the requirements of products, and common chips comprise a microprocessor MCU, a clock data recovery chip CDR, a laser driving chip, a transimpedance amplifier TIA chip, a limiting amplifier LA chip, a power management chip and the like. The transimpedance amplifier is closely associated with the optical detection chip, and the transimpedance amplifier and the optical detection chip can be packaged together by a part of products, such as in the same TO (TO optical) tube shell or the same shell; the optical detection chip and the transimpedance amplifier can be separately packaged, and the transimpedance amplifier is arranged on the circuit board.
The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.
The surface of the end part of the circuit board 300 is provided with a golden finger, the golden finger consists of one pin which is mutually independent, the circuit board is inserted into an electric connector in the cage, and the golden finger is in conductive connection with a clamping elastic sheet in the electric connector; the golden fingers can be arranged on the surface of one side of the circuit board, and the golden fingers are generally arranged on the upper surface and the lower surface of the circuit board in consideration of the large requirement on the number of pins; the golden finger is used for establishing electrical connection with the upper computer, and the specific electrical connection can be power supply, grounding, I2C signals, communication data signals and the like.
The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.
The circuit board is generally a rigid circuit board, and the rigid circuit board can also realize a bearing effect due to relatively hard materials of the rigid circuit board, for example, the rigid circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.
Fig. 5 is a schematic diagram of an appearance structure of the light receiving sub-module in the embodiment of the present application, and as can be seen from fig. 5, the light receiving sub-module 400 in the present application includes a cover plate 410 and a cavity 420, the cover plate 410 and the cavity 420 are covered and connected, the cover plate 410 covers the cavity 420 from above, one end of the light receiving sub-module 400 is connected to the optical fiber adapter 600, and a side wall of the cavity 420 has an opening for inserting the circuit board 300.
Fig. 6 is an exploded schematic structural diagram of a light-receiving sub-module of an optical module according to an embodiment of the present disclosure; as can be seen from fig. 6, inside the cavity 420, from the side of the optical fiber adapter 600, there are provided the first lens 401, the SOA chip 402, the second lens 404, the optical demultiplexing component 406, the lens array 407, the third lens 408, and the light receiving chip array 409 in this order. The first lens 401, the SOA chip 402, the second lens 404, the optical demultiplexing assembly 406, the lens array 407, the third lens 408 and the light receiving chip array 409 are particularly disposed on the bottom surface of the cavity 420. The relative positional relationship among the first lens 401, the SOA chip 402 and the second lens 404 is shown in fig. 10. The first lens 401 is used for receiving the optical signal from the optical fiber adapter and converting the optical signal into a convergent light beam; the SOA chip 402 is used for receiving and amplifying the optical signal from the first lens; the second lens 404 is arranged on the surface of the circuit board and used for receiving the optical signal from the SOA chip and converting the optical signal into a collimated beam; the optical demultiplexing module 406 is configured to receive the optical signal from the second lens and split the optical signal into a plurality of optical signals with different wavelengths; the lens array 407 includes a plurality of lenses for receiving the plurality of optical signals with different wavelengths output from the optical demultiplexing assembly and converting the plurality of optical signals with different wavelengths into a converging light beam; the third lens 408 covers the light receiving chip array, and has a reflecting surface for receiving a plurality of light signals with different wavelengths from the lens array, and inputting the light signals into the light receiving chip array after being reflected by the reflecting surface; the light receiving chip array 409 includes a plurality of light receiving chips for receiving a plurality of light signals of different wavelengths; the light receiving chips are arranged on the bottom surface of the cavity in a row. In the embodiment of the present application, the light receiving surface of the light receiving chip in the light receiving chip array 409 is the upper surface of the corresponding chip, that is, the light receiving surface of the light receiving chip faces the bottom surface of the third lens 408, the light receiving surface of the light receiving chip is perpendicular to the light emitting surface of the lens array 407, and the light is reflected by the third lens 408 and then enters the light receiving surface of the light receiving chip.
In some embodiments, as shown in fig. 9, fig. 9 is a schematic structural diagram of each device in another optical receive sub-module of an optical module provided in the embodiments of the present application; the lens array 407 includes a plurality of lenses for receiving the plurality of optical signals with different wavelengths output by the optical demultiplexing component 406, converting the plurality of optical signals with different wavelengths into a converging light beam, and injecting the converging light beam onto the light receiving surface of each light receiving chip in the light receiving chip array; at this time, the light receiving surface of the light receiving chip is in parallel relation with the light emitting surface of the lens array 407, that is, the light receiving surface of the light receiving chip faces the lens array 407, so that the light is incident on the light receiving surface of the light receiving chip without total reflection by the third lens.
The connection and function of the structures in the rosa 400 will be described in detail with reference to fig. 7 and 8. As shown in fig. 7 and 8, an optical signal from the transmission link exits from the optical fiber adapter 600, the optical signal is transmitted to the first lens 401 by the optical fiber adapter 600, the first lens 401 receives the optical signal from the optical fiber adapter and converts the optical signal into a converging beam, and transmits the converging beam to the SOA chip 402, the SOA chip 402 receives and amplifies the optical signal from the first lens 401, and outputs the optical signal to the second lens 404, the second lens 404 receives the optical signal from the SOA chip 402 and converts the optical signal into a collimated beam, and transmits the collimated beam to the optical demultiplexing module, the optical signal output from the second lens 404 is decomposed into a plurality of optical signals with different wavelengths by the optical demultiplexing module 406, the plurality of optical signals with different wavelengths obtained by the decomposition are converted into a converging beam by a plurality of lenses in the lens array 407, and transmit the converging beam to the third lens 408, the third lens 408 has a reflection surface, and is input to a plurality of optical receiving chips in the optical receiving chip array 409 after being reflected by the reflection surface, the plurality of light receiving chips correspondingly receive a plurality of light signals with different wavelengths. The SOA chip is reasonably integrated into the optical receiving submodule of the optical module and is connected with other devices well, the power of optical signals received by the optical receiving submodule is amplified, and the optical module which is high in sensitivity and capable of transmitting in a long distance is obtained finally.
In order to carry the SOA chip 402, in the embodiment of the present application, the SOA chip 402 is carried by a ceramic slide 403, and the SOA chip 402 is attached to the surface of the ceramic slide 403; further, in order to ensure that the SOA chip 402 normally works, the working temperature of the SOA chip 402 needs to be monitored, so that the thermistor 411 is arranged in the application, the thermistor 411 is arranged near the SOA chip 402, a certain relation exists between the resistance value of the thermistor 411 and the working temperature of the SOA chip 402, the working temperature change of the SOA chip 402 can be monitored by monitoring the resistance value of the thermistor 411, the working temperature of the SOA chip 402 is adjusted by adjusting the current of the TEC, and when the current of the TEC changes, the working temperature of the SOA chip 402 changes accordingly until the temperature of the SOA chip 402 is adjusted to be lower than the normal working temperature. For convenience of description in the embodiment of the present application, the integrated three structures of the SOA chip 402, the ceramic slide 403 and the thermistor 411 are collectively described as an SOA component, the SOA component is located between the first lens 401 and the second lens 404 in the present application, that is, both sides of the SOA component are both provided with corresponding lenses, because the size of the space in the cavity of the light receiving submodule is limited, the SOA component is arranged between the first lens 401 and the second lens 404, the space between the two lenses can be reasonably used, and it is ensured that the size of the space of the cavity is not increased, if the SOA component is arranged at other positions, because the optical signal output by the SOA component is a diverging light beam, the state of the optical signal changes, the lens needs to be added to change the state of the optical signal, and further, the size of the space of the cavity can be increased.
In some configurations, the distance between the central axis of the light inlet of the optical demultiplexing module 406 and the central axis of the optical fiber adapter is relatively long, and the optical module further includes a displacement prism 405 for adjusting the distance between the central axis of the light inlet of the optical demultiplexing module 406 and the central axis of the optical fiber adapter, so that the optical axis can be moved by the displacement prism 405; the shift prism 405 may be located on the side of the central axis of the light inlet of the optical demultiplexer 406, specifically, between the optical demultiplexer 406 and the second lens 404, or on the side of the central axis of the fiber adapter 600, specifically, between the first lens 401 and the fiber adapter 600. In the embodiment of the present application, the position of the shift prism 405 is not limited, as long as the shift prism 405 can realize the movement of the central axis of the light inlet of the optical demultiplexing component 406 and the central axis of the optical fiber adapter, and the position where the distance between the two reaches the requirement all belongs to the protection scope of the embodiment of the present application.
In this embodiment of the application, the lens types of the first lens 401, the second lens 404 and the lens array 407 are adapted to the type of the optical fiber adapter, when the optical fiber adapter 600 is a collimating adapter, because the collimating adapter has a collimating lens inside, an optical signal coupled and output by the collimating adapter is a collimated light beam, the first lens 401 is a collimating lens, converts a collimated light beam output by the collimating adapter into a converging light beam, and couples the converging light beam into the SOA chip, and the second lens 404 is a collimating lens, and is used for converting a diverging light beam output by the SOA chip into a collimated light beam; the lens array 407 includes a plurality of converging lenses for converting the collimated light beam output from the optical demultiplexing assembly 406 into a converging light beam. When the optical fiber adapter is a non-collimating adapter, the first lens 401 is a converging lens, and is configured to convert a diverging light beam output by the optical fiber adapter into a converging light beam; the second lens 404 is a collimating lens, and is used for converting the divergent light beam output by the SOA chip into a collimated light beam; the lens array 407 includes a plurality of converging lenses for converting the collimated light beam output from the optical demultiplexing assembly into a converging light beam.
As shown in fig. 8, the optical demultiplexing module 406 includes a plurality of optical output ports, the number of the optical output ports is equal to the number of the optical signals with different wavelengths, and each optical output port outputs an optical signal with one wavelength; the lens array 407 includes a plurality of lenses, the plurality of lenses are arranged in an array, the number of lenses in the lens array 407 is equal to the number of optical output ports in the optical demultiplexing module 406, and each lens in the lens array 407 correspondingly receives the optical signal output by each optical output port in the optical demultiplexing module 406; the number of light receiving chips in the light receiving chip array 409 is equal to the number of lenses in the lens array 407; in the embodiment of the present application, the optical demultiplexing module 406 utilizes different films disposed on two sides and at different positions to transmit and reflect signal light with different wavelengths to separate a light signal into a plurality of light signals with different wavelengths.
It can be seen from the above that, the optical receive sub-module in the embodiment of the present application can reasonably implement connection of each structure and perform its function through the beam conversion of the first lens, the method of the SOA chip, the beam conversion of the second lens, the wavelength division of the optical demultiplexing component, the beam conversion of the lens array, the reflection of the third lens, and the reception of the optical receive chip array, so as to obtain reasonable optical design and optical path design, and finally, the SOA chip is reasonably integrated in the optical receive structure, so as to amplify the optical signal power received by the optical receive sub-module.
The following provides a schematic diagram of an optical path structure between structures in the rosa according to an embodiment of the present application with reference to fig. 11 to 13; fig. 11 is a schematic diagram of an optical path structure between devices in an optical receive sub-module of an optical module according to an embodiment of the present application; fig. 12 is a schematic optical path diagram of a light receiving state of an optical module according to an embodiment of the present application; fig. 13 is a schematic optical path diagram of another light receiving state of the optical module according to the embodiment of the present application. As shown in fig. 11, the light beam is sequentially converged by the first lens 401, amplified by the SOA chip 402, collimated by the second lens 404, split by the optical demultiplexing component 406, converged by the lens array 407, and reflected by the third lens 408, and then input to the light receiving chip array 409. Since the light receiving in the present application provides two states, one is that the light receiving surface of the light receiving chip faces upward, and then the light receiving surface of the light receiving chip needs to be reflected by the third lens to enter the light receiving surface of the light receiving chip, and the other is that the light receiving surface of the light receiving chip faces the lens array, and then the light receiving chip does not need to be reflected by the third lens and is directly input to the light receiving surface of the light receiving chip. Fig. 12 and 13 show schematic optical path diagrams of two reception states, respectively.
The application provides an optical module includes circuit board and light reception submodule, and light reception submodule closes apron and cavity of connecting including the lid, and the bottom surface of cavity is provided with: the optical signal from the second lens is decomposed into a plurality of optical signals with different wavelengths by the optical demultiplexing component, the plurality of optical signals with different wavelengths obtained after decomposition are converted into convergent beams by a plurality of lenses in the lens array and are transmitted to the third lens, the third lens is covered on a light receiving surface of the optical receiving chip array and is provided with a reflecting surface, and the convergent beams are reflected by the reflecting surface and then are incident on a plurality of optical receiving chips in the optical receiving chip array, the plurality of light receiving chips correspondingly receive a plurality of light signals with different wavelengths. The SOA chip is reasonably integrated into the optical receiving submodule of the optical module and is connected with other devices well, the power of optical signals received by the optical receiving submodule is amplified, and the optical module which is high in sensitivity and capable of transmitting in a long distance is obtained finally.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A light module, comprising:
a circuit board;
the light receiving secondary module is electrically connected with the circuit board and is used for outputting optical signals;
the optical receive sub-module includes:
a cover plate;
the cavity, with the apron lid closes to be connected, is equipped with on the basal surface:
the first lens is used for receiving the optical signal from the optical fiber adapter and converting the optical signal into a convergent light beam;
an SOA component comprising an SOA chip for receiving and amplifying the optical signal from the first lens
The second lens is used for receiving the optical signal from the SOA chip and converting the optical signal into a collimated beam;
an optical demultiplexing assembly for receiving the optical signal from the second lens and splitting the optical signal into a plurality of optical signals of different wavelengths;
a lens array including a plurality of lenses for receiving the plurality of optical signals of different wavelengths output from the optical demultiplexing assembly and converting the plurality of optical signals of different wavelengths into a converging beam;
the third lens is covered on the light receiving chip array, has a reflecting surface, and is used for receiving a plurality of light signals with different wavelengths from the lens array, reflecting the light signals by the reflecting surface and then irradiating the light signals onto the light receiving surface of each light receiving chip in the light receiving chip array;
the light receiving chip array comprises a plurality of light receiving chips and is used for receiving a plurality of light signals with different wavelengths.
2. The optical module of claim 1, further comprising a displacement prism for adjusting a distance between the optical inlet center axis of the optical demultiplexing assembly and the center axis of the optical fiber adapter, wherein the displacement prism is located between the optical demultiplexing assembly and the second lens.
3. The optical module of claim 2, wherein the displacement prism is located between the first lens and the fiber optic adapter.
4. The optical module of claim 1 wherein the SOA assembly is located between the first lens and the second lens, the SOA assembly further comprising a ceramic slide for carrying the SOA chip.
5. The optical module of claim 1 wherein the SOA assembly further comprises a thermistor for monitoring the operating temperature of the SOA chip.
6. The optical module according to claim 1, wherein the first lens is a converging lens for converting a diverging light beam output from the fiber optic adapter into a converging light beam;
the second lens is a collimating lens and is used for converting a divergent light beam output by the SOA chip into a collimated light beam;
the lens array includes a plurality of condensing lenses for converting the collimated light beams output from the optical demultiplexing assembly into condensed light beams.
7. The optical module of claim 1, wherein the optical demultiplexing assembly comprises a plurality of output ports, and the number of output ports is equal to the number of optical signals of the plurality of different wavelengths.
8. The optical module of claim 7, wherein the number of lenses in the lens array is equal to the number of output ports in the optical demultiplexing assembly.
9. The optical module according to claim 7, wherein the number of light receiving chips in the light receiving chip array is equal to the number of lenses in the lens array.
10. A light module, comprising:
a circuit board;
the light receiving sub-module is electrically connected with the circuit board and used for outputting optical signals;
the optical receive sub-module includes:
a cover plate;
the cavity, with the apron lid closes to be connected, and the surface is equipped with:
the first lens is used for receiving the optical signal from the optical fiber adapter and converting the optical signal into a convergent light beam;
an SOA component comprising an SOA chip for receiving and amplifying the optical signal from the first lens
The second lens is used for receiving the optical signal from the SOA chip and converting the optical signal into a collimated beam;
an optical demultiplexing assembly for receiving the optical signal from the second lens and splitting the optical signal into a plurality of optical signals of different wavelengths;
a lens array including a plurality of lenses for receiving the plurality of optical signals with different wavelengths output from the optical demultiplexing module, converting the plurality of optical signals with different wavelengths into a converging beam, and injecting the converging beam onto a light receiving surface of each light receiving chip in the light receiving chip array;
the light receiving chip array comprises a plurality of light receiving chips and is used for receiving a plurality of light signals with different wavelengths.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011496690.6A CN114647037A (en) | 2020-12-17 | 2020-12-17 | Optical module |
| PCT/CN2021/134455 WO2022127584A1 (en) | 2020-12-17 | 2021-11-30 | Optical module |
| US18/146,068 US20230194802A1 (en) | 2020-12-17 | 2022-12-23 | Optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011496690.6A CN114647037A (en) | 2020-12-17 | 2020-12-17 | Optical module |
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| CN114647037A true CN114647037A (en) | 2022-06-21 |
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| CN202011496690.6A Pending CN114647037A (en) | 2020-12-17 | 2020-12-17 | Optical module |
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| CN115327711A (en) * | 2022-06-30 | 2022-11-11 | 武汉华工正源光子技术有限公司 | ONT optical module based on COB packaging |
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