CN110488431A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN110488431A CN110488431A CN201910722007.7A CN201910722007A CN110488431A CN 110488431 A CN110488431 A CN 110488431A CN 201910722007 A CN201910722007 A CN 201910722007A CN 110488431 A CN110488431 A CN 110488431A
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- China
- Prior art keywords
- rosa
- tosa
- component
- optical module
- pedestal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
Abstract
The embodiment of the present application discloses a kind of optical module, comprising: photoelectric subassembly and shell component, the photoelectric subassembly are arranged in the shell component internal；Wherein, the photoelectric subassembly includes: light emitting secondary module TOSA component and light-receiving secondary module ROSA component；The TOSA component includes the TOSA protection cap at least having electromagnetic wave shielding function；The ROSA component includes the ROSA protection cap at least having electromagnetic wave shielding function.
Description
Technical field
This application involves technical field of photo communication, particularly relate to a kind of optical module.
Background technique
With optic communication in recent years and the high speed development of internet, market also increasingly increases severely to network demand, to lead
The flow of telecommunication backbone net is caused to be skyrocketed through.To adapt to demand of the market to high speed data transfers, the transmission speed of optical module
Also it is improving rapidly, currently, optical module is just gradually developed from 100G to 400G, however, compared with 100G optical module, 400G optical mode
Block needs the accessory circuit of Digital Signal Processing (DSP, Digital Signal Processing) and various complexity.Therefore,
The problems such as how coping with heat dissipation, miniaturization brought by the raising of optical module transmission speed and electromagnetic interference, becomes and urgently solves
Certainly the problem of.
Summary of the invention
In order to achieve the above objectives, the technical solution of the embodiment of the present application is achieved in that
In a first aspect, the embodiment of the present application provides a kind of optical module, comprising: photoelectric subassembly and shell component, the photoelectricity
Component is arranged in the shell component internal；Wherein,
The photoelectric subassembly includes: light emitting secondary module (Transmitter Optical Subassembly, TOSA) group
Part and light-receiving secondary module (Receiver Optical Subassembly, ROSA) component；The TOSA component includes at least
The TOSA protection cap for having electromagnetic wave shielding function；The ROSA component includes that the ROSA at least having electromagnetic wave shielding function is protected
Protecting cover.
In a kind of optional embodiment, the TOSA component further includes TOSA photoelectric cell, wherein the TOSA is protected
Protecting cover coats the TOSA photoelectric cell, for protecting the electricity of the TOSA photoelectric cell and the shielding TOSA photoelectric cell
Magnetic wave.
In a kind of optional embodiment, the ROSA component further includes ROSA photoelectric cell, wherein the ROSA is protected
Protecting cover coats the ROSA photoelectric cell, for protecting the electricity of the ROSA photoelectric cell and the shielding ROSA photoelectric cell
Magnetic wave.
In a kind of optional embodiment, the TOSA component and the ROSA component are band tail fiber type device, described
TOSA component further includes the first tail optical fiber cutting ferrule, and the ROSA component further includes the second tail optical fiber cutting ferrule；Wherein,
The TOSA protection cap is used for constraining the corresponding disk towpath diameter of the first tail optical fiber cutting ferrule, the ROSA protection cap
In the corresponding disk towpath diameter of constraint the second tail optical fiber cutting ferrule.
In a kind of optional embodiment, the photoelectric subassembly further include: pcb board and heat sink copper sheet；Wherein,
Heat-radiating substrate of the heat sink copper sheet as the TOSA component, is arranged in the lower surface of the pcb board.
In a kind of optional embodiment, the shell component includes: upper cover and pedestal, and the upper cover is arranged described
The top of photoelectric subassembly；The lower part of the photoelectric subassembly is arranged in the pedestal；Wherein,
The upper cover is fixed together with the pedestal by connector, and an accommodation space is formed, and the accommodation space is used
In the setting photoelectric subassembly.
In a kind of optional embodiment, the base end face is equipped with the first groove, and first groove is for keeping away
Allow the electronic device of the pcb board lower surface.
In a kind of optional embodiment, the base end face is equipped with the second groove, and second groove is for keeping away
Allow the heat sink copper sheet of the pcb board lower surface.
In a kind of optional embodiment, a side of accommodation space is formed by the upper cover and the pedestal
It is provided with optical interface, the horizontal middle spindle of the optical interface is higher than the upper surface of the pcb board.
In a kind of optional embodiment, the upper cover includes: the electromagnetic shielding circle for shielding electromagnetic wave；
Wherein, the junction of the upper cover Yu the pedestal is arranged in the electromagnetic shielding circle.
In a kind of optional embodiment, the electromagnetic shielding circle includes:
For blocking the ring wall seam allowance of the transmission channel of electromagnetic wave；
Shielding glue groove for fitting closely the upper cover and the pedestal.
In a kind of optional embodiment, venthole is provided in the ROSA protection cap, the ROSA component passes through
The venthole radiates.
A kind of optical module provided by the embodiment of the present application, comprising: photoelectric subassembly and shell component, the photoelectric subassembly are set
It sets in the shell component internal；Wherein, the photoelectric subassembly includes: light emitting secondary module TOSA component and light-receiving secondary module
ROSA component；The TOSA component includes the TOSA protection cap at least having electromagnetic wave shielding function；The ROSA component includes
At least has the ROSA protection cap of electromagnetic wave shielding function.The embodiment of the present application is realized to TOSA component and ROSA component element
Protection, electromagnetic shielding and heat dissipation, while also achieving the constraint and protection to optical module inner disk fibre.
Detailed description of the invention
Fig. 1 is the perspective view of optical module provided by the embodiments of the present application；
Fig. 2 is the perspective view of photoelectric subassembly in optical module provided by the embodiments of the present application；
Fig. 3 is the Structure explosion diagram of photoelectric subassembly in optical module provided by the embodiments of the present application；
Fig. 4 is the Structure explosion diagram of shell component in optical module provided by the embodiments of the present application；
Fig. 5 is the perspective view of pedestal in optical module provided by the embodiments of the present application；
Fig. 6 is the perspective view of upper cover in optical module provided by the embodiments of the present application；
Fig. 7 is the side sectional view of optical module provided by the embodiments of the present application；
Fig. 8 is the perspective view of pull ring in optical module provided by the embodiments of the present application；
Description of symbols:
100- optical module；200- photoelectric subassembly；210-TOSA component；211-TOSA protection cap；212-TOSA photoelectric cell；
213- the first tail optical fiber cutting ferrule；220-ROSA component；221-ROSA protection cap；222-ROSA photoelectric cell；223- the second tail optical fiber card
Set；230-PCB plate；231-U type through-hole；240-IC chip；250- is heat sink copper sheet；300- shell component；310- upper cover；311- electricity
Magnetic screen circle；3111- ring wall seam allowance；3112- shields glue groove；312- first boss；313- second boss；314- third boss；
315- third arc groove；The 4th arc groove of 316-；320- pedestal；The first groove of 321-；The second groove of 322-；323- light connects
Mouthful；324-PCB plate support column；325- through-hole；326- screw hole；The first arc groove of 327-；The second arc groove of 328-；329-
Four boss；330- pull ring；331- brake(-holder) block；332- pull ring handle；The first screw of 341-；The second screw of 342-；343- third spiral shell
Nail；The 4th screw of 344-.
Specific embodiment
The characteristics of in order to more fully hereinafter understand the embodiment of the present application and technology contents, with reference to the accompanying drawing to this Shen
Please the realization of embodiment be described in detail, appended attached drawing purposes of discussion only for reference is not used to limit the embodiment of the present application.
With optic communication in recent years and the high speed development of internet, market also increasingly increases severely to network demand, to lead
The flow of telecommunication backbone net is caused to be skyrocketed through.To adapt to demand of the market to high speed data transfers, the transmission speed of optical module
Also it is improving rapidly, currently, optical module is just gradually developed from 100G to 400G, however, compared with 100G optical module, 400G optical mode
Block needs the accessory circuit of DSP and various complexity.Therefore, how to cope with and dissipated brought by the raising of optical module transmission speed
The problems such as heat, miniaturization and electromagnetic interference, become urgent problem to be solved.
Existing high-speed optical module has from optics, hardware, process and structure etc. to consider to radiate and electromagnetic compatibility
Problem, however after overall plan and parts selection determine, optics, hardware and process aspect are difficult to be modified again, therefore, In
Structure design on, how as far as possible guarantee high-speed optical module package dimension miniaturization in the case where, in optical module shell
The problems such as taking into account heat dissipation and electromagnetic compatibility while interior layout more optical elements, becomes a major challenge in industry.
It is proposed to this end that the following technical scheme of the embodiment of the present application.
A kind of optical module provided by the embodiments of the present application, comprising: photoelectric subassembly and shell component, the photoelectric subassembly setting
In the shell component internal；Wherein, the photoelectric subassembly includes: light emitting secondary module TOSA component and light-receiving secondary module
ROSA component；The TOSA component includes the TOSA protection cap at least having electromagnetic wave shielding function；The ROSA component includes
At least has the ROSA protection cap of electromagnetic wave shielding function.
Fig. 1 is the perspective view of optical module provided by the embodiments of the present application, as shown in Figure 1, light provided by the embodiments of the present application
Module, comprising: photoelectric subassembly 200 and shell component 300, the photoelectric subassembly 200 are arranged inside the shell component 300；
Wherein, the photoelectric subassembly 200 (as shown in Figure 2) includes: TOSA component 210 and ROSA component 220；The TOSA component 210
(as shown in Figure 3) includes the TOSA protection cap 211 at least having electromagnetic wave shielding function；The ROSA component 220 includes at least
The ROSA protection cap 221 for having electromagnetic wave shielding function.
Fig. 2 is the perspective view of photoelectric subassembly in optical module provided by the embodiments of the present application, and Fig. 3 provides for the embodiment of the present application
Optical module in photoelectric subassembly Structure explosion diagram, as shown in Figures 2 and 3, photoelectricity in the optical module of the offer of the embodiment of the present application
Component 200, comprising: TOSA component 210, ROSA component 220, pcb board 230 and IC chip 240.The TOSA component 210 includes:
TOSA protective cover 211, TOSA photoelectric cell 212 and the first tail optical fiber cutting ferrule 213.The ROSA component 220 includes: ROSA protective cover
221, ROSA photoelectric cell 222 and the second tail optical fiber cutting ferrule 223.
Here, the TOSA protection cap 211 coats the TOSA photoelectric cell 212, for protecting the TOSA photo elements
The electromagnetic wave of part 212 and the shielding TOSA photoelectric cell 212.
Here, the TOSA component 210 is band tail fiber type device, and the TOSA component 210 includes the first tail optical fiber cutting ferrule
213, wherein the TOSA protection cap 211 is for constraining the corresponding disk towpath diameter of the first tail optical fiber cutting ferrule 213.
Here, the photoelectric subassembly 200 further include: heat sink copper sheet 250；Wherein, described in the heat sink copper sheet 250 is used as
The lower surface of the pcb board 230 is arranged in the heat-radiating substrate of TOSA component 210.
When it is implemented, the heat sink copper sheet 250 can be used as the heat dissipation supporting substrate of the TOSA photoelectric cell 212,
The heat sink copper sheet 250 can be bonded by glue or surface mounting technology (Surface Mounted Technology, SMT)
Mode be fixed on the lower surface of the pcb board 230, wherein the location for paste of the pcb board 230 and the heat sink copper sheet 250 is set
Effigurate through-hole (being not shown in Fig. 3), the TOSA photoelectric cell 212 are radiated by the through-hole.It is specific real
Shi Shi, the TOSA photoelectric cell 212 (such as laser, ceramic backing, lens, optical filter) can be pasted by the through-hole
On the heat sink copper sheet 250, the TOSA photoelectric cell 212, which is established by gold wire bonding with the pcb board 230, electrically to be connected
It connects.
When it is implemented, the TOSA protection cap 211 can be fixed on the pcb board 230 in such a way that glue is bonded
Upper surface.It is provided with pin and protruding features (being not shown in Fig. 3) on the TOSA protective cover 211, it is right on the pcb board 230
It should be provided with hole cavity feature (being not shown in Fig. 3), the pin and protruding features on the TOSA protective cover 211 and the pcb board
When corresponding hole cavity feature is bonded on 230, it is ensured that precise positioning of the TOSA protective cover 211 on the pcb board 230.
Here, the ROSA protection cap 221 coats the ROSA photoelectric cell 222, for protecting the ROSA photo elements
The electromagnetic wave of part 222 and the shielding ROSA photoelectric cell 222.
Here, the ROSA component 220 is band tail fiber type device, and the ROSA component 220 includes the second tail optical fiber cutting ferrule
223；Wherein, the ROSA protection cap 221 is for constraining the corresponding disk towpath diameter of the second tail optical fiber cutting ferrule 223.
Here, venthole is additionally provided in the ROSA protection cap 221, the ROSA component 220 passes through the venthole
It radiates.
When it is implemented, ROSA protective cover 221 is designed using special structure, ROSA protective cover 221 is equipped with venthole,
Be also used to prevent photodiode (Photo-Diode, PD) and trans-impedance amplifier (Trans-Impedance Amplifier,
TIA the condensation vapor) generated when chip operation influences the spectrophotometric data of optical module.
Fig. 4 is the Structure explosion diagram of shell component in optical module provided by the embodiments of the present application, as shown in figure 4, the application
The shell component 300 of the optical module of the offer of embodiment, comprising: upper cover 310, pedestal 320 and pull ring 330, the upper cover 310 are set
It sets on the top of the photoelectric subassembly 200；The lower part of the photoelectric subassembly 200 is arranged in the pedestal 320；Wherein,
The upper cover 310 is fixed together with the pedestal 320 by connector, and an accommodation space, the receiving are formed
Space is for being arranged the photoelectric subassembly 200.
Fig. 5 is the perspective view of pedestal in optical module provided by the embodiments of the present application, as shown in figure 5,320 bottom surface of the pedestal
It is equipped with the first groove 321, first groove 321 is used to avoid the electronic device of 230 lower surface of pcb board.
Here, 320 bottom surface of pedestal is equipped with the second groove 322, and second groove 322 is for avoiding the PCB
The heat sink copper sheet 250 of 230 lower surface of plate.
Here, the side that the upper cover 310 is formed by accommodation space with the pedestal 320 is provided with optical interface
323, as shown in figure 5, the right end in the pedestal 320 is optical interface 323.The horizontal middle spindle of the optical interface 323 is higher than institute
State the upper surface of pcb board 230；Wherein, the difference in height of the upper surface of the horizontal middle spindle of the optical interface and the pcb board is solid
Fixed height, the fixed height can be set to 2mm, but be not limited to 2mm.Such setting can provide more to pcb board 230
Big cloth plate suqare (the profile end face of pcb board 230 is to greatest extent close to optical interface 323), while being also convenient for inside optical module
The disk of optical fiber is fine.
As shown in Figure 3 and Figure 5, the photoelectric subassembly 200, the optical signal for receiving the optical module are converted to electricity
Signal converts electrical signals to optical signal.The photoelectric subassembly 200 includes the first tail optical fiber cutting ferrule 213 and the second tail optical fiber cutting ferrule
223；The pedestal 320 includes optical interface 323；Wherein, one end of the first tail optical fiber cutting ferrule 213 and the second tail optical fiber cutting ferrule 223
It is connect respectively with TOSA component 210 and ROSA component 220 by optical fiber, the first tail optical fiber cutting ferrule 213 and the second tail optical fiber cutting ferrule
223 other end is connect with the optical interface 323.Correspond to described first it should be noted that being equipped in the optical interface 323
Two interfaces of tail optical fiber cutting ferrule 213 and the second tail optical fiber cutting ferrule 223, with respectively with the first tail optical fiber cutting ferrule 213 and the second tail optical fiber
Cutting ferrule 223 is attached.When it is implemented, the optical interface 323 with optical connector for patch being adapted to.
As shown in figure 5, setting on the pedestal 320, there are six pcb board support column 324, six pcb board support columns 324
It is symmetrical along 320 two sides of pedestal, for being supported limit to the pcb board 230.The pedestal 320 is equipped with two
A U-shaped boss is set on described two U-shaped boss there are two through-hole 325, is additionally provided with two screw holes 326 on the pedestal 320；Phase
Ying Di sets that there are two U-shaped through-holes 231 (such as in position corresponding with two through-holes 325 on U-shaped boss on the pcb board 230
Shown in Fig. 2).The screw, including the first screw 341, the second screw 342,344 (such as Fig. 4 of third screw 343 and the 4th screw
It is shown).The pcb board 230 is fixed on by the first screw 341, the second screw 342, third screw 343 and the 4th screw 344
On six pcb board support columns 324.Correspondingly, corresponding with third screw 343 and the 4th screw 344 in the upper cover 310
Position (while being also position corresponding with two screw holes 326 on the pedestal 320) set there are two through-hole (as shown in Figure 4).
Meanwhile the upper cover 310 also by the first screw 341, the second screw 342, third screw 343 and the 4th screw 344 with it is described
Pedestal 320 is fixedly connected.Wherein, the U-shaped boss (is parallel to the PCB for carrying out transverse direction to the pcb board 230
The direction of plate 230) limit.In the specific implementation, the U-shaped boss in the allowed band of MSA agreement, on the pedestal 320
The activity surplus of ± 0.18mm can be reserved, between the U-shaped through-hole 321 on the pcb board 230 so that staff carries out light
The optics of module is adjusted, and after adjusting to optical module, can carry out filler to the gap of the activity surplus, described to ensure
Pcb board 230 is fixedly secured inside the shell component 300.
As shown in figure 5, two arc grooves are additionally provided on the pedestal 320, respectively the first arc groove 327 and second
Arc groove 328；Correspondingly, in the first arc groove 327 and the corresponding position of the second arc groove 328 in the upper cover 310
Equipped with third arc groove 315 and the 4th arc groove 316 (as shown in Figure 6).The first tail optical fiber cutting ferrule 213 passes through the bottom
The third arc groove 315 on the first arc groove 327 and the upper cover 310 on seat 320 is fixed on the upper cover 310 and institute
In the accommodation space for stating the formation of pedestal 320, that is, the inside of the shell component 300；The second tail optical fiber cutting ferrule 223 passes through
The second arc groove 328 on the pedestal 320 and the 4th arc groove 316 in the upper cover 310 are fixed on the upper cover
In 310 accommodation spaces formed with the pedestal 320, that is, the inside of the shell component 300.First arc groove
327, the second arc groove 328, third arc groove 315 and the 4th arc groove 316 are used for the first tail optical fiber cutting ferrule 213
It is limited with the second tail optical fiber cutting ferrule 223, to guarantee the first tail optical fiber cutting ferrule 213 and the second tail optical fiber cutting ferrule 223
With normally patching for optical connector.
Fig. 6 is the perspective view of upper cover in optical module provided by the embodiments of the present application, as shown in fig. 6, the upper cover 310 is wrapped
It includes: for shielding the electromagnetic shielding circle 311 of electromagnetic wave；Wherein, the electromagnetic shielding circle 311 is arranged in the upper cover 310 and institute
State the junction of pedestal 320.The electromagnetic shielding circle 311 includes: the ring wall seam allowance for blocking the transmission channel of electromagnetic wave
3111；Shielding glue groove 3112 for fitting closely the upper cover 310 with the pedestal 320.
When it is implemented, 310 two sides of upper cover (being parallel to the two sides on the direction of the center line of the optical interface 323)
Ring wall seam allowance 3111 be arranged it is higher, (be parallel to the center line of the optical interface 323 with the side wall of 320 two sides of pedestal
Direction on side wall) cooperation it is closer, electromagnetic shielding effect it is better.
As shown in fig. 6, the upper cover 310 is equipped with first boss 312, the first boss 312 is used for the pcb board
230 carry out longitudinal (perpendicular to direction of the pcb board 230) limit.When it is implemented, the surface of the first boss 312 with
The upper surface of the pcb board 230 is non-rigid contact, i.e., the surface of the described first boss 312 and the upper table of the pcb board 230
The gap of certain distance is remained between face, the distance can (distance meets MSA agreement, and the application is implemented for 0.1mm
Example is not limited thereof), maximum floating distance is 0.1mm to the pcb board 230 in the longitudinal direction, to realize to described
The limit of pcb board 230 in the longitudinal direction.
Here, the upper cover 310 is equipped with second boss 313, is pasted with heat-conducting pad (Fig. 6 in the second boss 313
In be not shown), the second boss 313 is arranged in the upper cover 310 on position corresponding with the IC chip 240, thus,
The logical heat-conducting pad that can be mounted in the excessively described second boss 313 of the IC chip 240 radiates.
Fig. 7 is the side sectional view of optical module provided by the embodiments of the present application, as shown in fig. 7, the embodiment of the present application provides
Optical module 100, comprising: the upper cover 310, the photoelectric subassembly 200 and the pedestal 320；Wherein, the upper cover 310 is set
It sets on the top of the photoelectric subassembly 200；The lower part of the photoelectric subassembly 200 is arranged in the pedestal 320；The upper cover 310
It is fixed together with the pedestal 320 by connector, forms an accommodation space, the accommodation space is for being arranged the photoelectricity
Component 200.
As shown in Figure 6 and Figure 7, third boss 314 is additionally provided in the upper cover 310, the third boss 314 is used for and institute
The 4th boss 329 stated on 320 corresponding position of pedestal is cooperated, to guarantee the electronic device inside the shell component 300
It is isolated from the outside on outer power port direction (direction for being close to golden finger).
As shown in fig. 7, the upper cover 310 is connect with the pedestal 320, the photoelectric subassembly 200 is coated on interior；It is described
Arc groove (the first arc groove 327 and the second arc groove 328) on pedestal 320 is recessed with the circular arc in the upper cover 310
Slot (third arc groove 315 and the 4th arc groove 316) cooperates, to the tail optical fiber cutting ferrule (213 He of the first tail optical fiber cutting ferrule
Second tail optical fiber cutting ferrule 223) it is limited completely；First boss 312 and the pedestal 320 in the upper cover 310 cooperate,
Longitudinal spacing is carried out to the pcb board 230.
Fig. 8 is the perspective view of pull ring in optical module provided by the embodiments of the present application, as shown in figure 8, the pull ring 330 wraps
Include: brake(-holder) block 331 and pull ring handle 332, the end of the brake(-holder) block 331 are encapsulated in the pull ring handle 332；The pull ring
330 for realizing optical module unlock and locking.
Here, when practical application, the material of the pull ring handle 332 can be plastic cement material.
A kind of optical module provided by the embodiment of the present application, comprising: photoelectric subassembly and shell component, the photoelectric subassembly are set
It sets in the shell component internal；Wherein, the photoelectric subassembly includes: light emitting secondary module TOSA component and light-receiving secondary module
ROSA component；The TOSA component includes the TOSA protection cap at least having electromagnetic wave shielding function；The ROSA component includes
At least has the ROSA protection cap of electromagnetic wave shielding function.The embodiment of the present application realizes the member to TOSA component and ROSA component
Part protection, electromagnetic shielding and heat dissipation, while also achieving the constraint and protection to optical module inner disk fibre.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
It should be understood that " one embodiment " or " embodiment " that specification is mentioned in the whole text mean it is related with embodiment
A particular feature, structure, or characteristic includes at least one embodiment of the application.Therefore, occur everywhere in the whole instruction
" in one embodiment " or " in one embodiment " not necessarily refer to identical embodiment.In addition, these specific features, knot
Structure or characteristic can combine in any suitable manner in one or more embodiments.It should be understood that in the various implementations of the application
In example, magnitude of the sequence numbers of the above procedures are not meant that the order of the execution order, the execution sequence Ying Yiqi function of each process
It can be determined with internal logic, the implementation process without coping with the embodiment of the present application constitutes any restriction.Above-mentioned the embodiment of the present application
Serial number is for illustration only, does not represent the advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
In several embodiments provided herein, it should be understood that disclosed device, it can be by others side
Formula is realized.The apparatus embodiments described above are merely exemplary, for example, the division of the unit, only one kind are patrolled
Function division is collected, there may be another division manner in actual implementation, such as: multiple units or components can combine, or can collect
At another system is arrived, or some features can be ignored or not executed.In addition, shown or discussed each component part is mutual
Between coupling direct-coupling or communication connection can be through some interfaces, the INDIRECT COUPLING or communication of equipment or unit
Connection, can be electrical, mechanical or other forms.
Above-mentioned unit as illustrated by the separation member, which can be or may not be, to be physically separated, aobvious as unit
The component shown can be or may not be physical unit, it can and it is in one place, it may be distributed over multiple network lists
In member；Some or all of units can be selected to achieve the purpose of the solution of this embodiment according to the actual needs.
Disclosed feature in several apparatus embodiments provided herein, in the absence of conflict can be any group
It closes, obtains new apparatus embodiments.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (12)
1. a kind of optical module characterized by comprising photoelectric subassembly and shell component, the photoelectric subassembly are arranged in the pipe
Inside shell component；Wherein,
The photoelectric subassembly includes: light emitting secondary module TOSA component and light-receiving secondary module ROSA component；The TOSA component
Including at least having the TOSA protection cap of electromagnetic wave shielding function；The ROSA component includes at least having electromagnetic wave shielding function
ROSA protection cap.
2. optical module according to claim 1, which is characterized in that the TOSA component further includes TOSA photoelectric cell,
In, the TOSA protection cap coats the TOSA photoelectric cell, for protecting described in the TOSA photoelectric cell and shielding
The electromagnetic wave of TOSA photoelectric cell.
3. optical module according to claim 1, which is characterized in that the ROSA component further includes ROSA photoelectric cell,
In, the ROSA protection cap coats the ROSA photoelectric cell, for protecting described in the ROSA photoelectric cell and shielding
The electromagnetic wave of ROSA photoelectric cell.
4. optical module according to claim 2 or 3, which is characterized in that the TOSA component and the ROSA component are band
Tail fiber type device, the TOSA component further include the first tail optical fiber cutting ferrule, and the ROSA component further includes the second tail optical fiber cutting ferrule；Its
In,
The TOSA protection cap is for constraining the corresponding disk towpath diameter of the first tail optical fiber cutting ferrule, and the ROSA protection cap is for about
The corresponding disk towpath diameter of Shu Suoshu the second tail optical fiber cutting ferrule.
5. optical module according to claim 1, which is characterized in that the photoelectric subassembly further include: pcb board and heat sink copper
Plate；Wherein,
Heat-radiating substrate of the heat sink copper sheet as the TOSA component, is arranged in the lower surface of the pcb board.
6. optical module according to claim 5, which is characterized in that the shell component includes: upper cover and pedestal, it is described on
The top of the photoelectric subassembly is arranged in lid；The lower part of the photoelectric subassembly is arranged in the pedestal；Wherein,
The upper cover is fixed together with the pedestal by connector, forms an accommodation space, the accommodation space is for setting
Set the photoelectric subassembly.
7. optical module according to claim 6, which is characterized in that the base end face is equipped with the first groove, and described the
One groove is used to avoid the electronic device of the pcb board lower surface.
8. optical module according to claim 6 or 7, which is characterized in that the base end face is equipped with the second groove, described
Second groove is used to avoid the heat sink copper sheet of the pcb board lower surface.
9. optical module according to claim 6, which is characterized in that it is empty to be formed by receiving in the upper cover and the pedestal
Between a side be provided with optical interface, the horizontal middle spindle of the optical interface is higher than the upper surface of the pcb board.
10. optical module according to claim 6, which is characterized in that the upper cover includes: the electromagnetism for shielding electromagnetic wave
Shielding ring；
Wherein, the junction of the upper cover Yu the pedestal is arranged in the electromagnetic shielding circle.
11. optical module according to claim 10, which is characterized in that the electromagnetic shielding, which encloses, includes:
For blocking the ring wall seam allowance of the transmission channel of electromagnetic wave；
Shielding glue groove for fitting closely the upper cover and the pedestal.
12. optical module according to claim 1, which is characterized in that it is provided with venthole in the ROSA protection cap, it is described
ROSA component is radiated by the venthole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910722007.7A CN110488431A (en) | 2019-08-06 | 2019-08-06 | A kind of optical module |
| PCT/CN2019/125117 WO2021022749A1 (en) | 2019-08-06 | 2019-12-13 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910722007.7A CN110488431A (en) | 2019-08-06 | 2019-08-06 | A kind of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110488431A true CN110488431A (en) | 2019-11-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910722007.7A Pending CN110488431A (en) | 2019-08-06 | 2019-08-06 | A kind of optical module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110488431A (en) |
| WO (1) | WO2021022749A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021022749A1 (en) * | 2019-08-06 | 2021-02-11 | 武汉光迅科技股份有限公司 | Optical module |
| CN113805285A (en) * | 2020-06-16 | 2021-12-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022218045A1 (en) * | 2021-04-16 | 2022-10-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113866919B (en) * | 2021-09-30 | 2023-08-15 | 武汉光迅科技股份有限公司 | Fiber coiling protective cover and PCB assembly |
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|---|---|
| WO2021022749A1 (en) | 2021-02-11 |
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