WO2021019358A1 - Ruban adhésif à double revêtement et procédé d'utilisation de celui-ci - Google Patents

Ruban adhésif à double revêtement et procédé d'utilisation de celui-ci Download PDF

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Publication number
WO2021019358A1
WO2021019358A1 PCT/IB2020/056760 IB2020056760W WO2021019358A1 WO 2021019358 A1 WO2021019358 A1 WO 2021019358A1 IB 2020056760 W IB2020056760 W IB 2020056760W WO 2021019358 A1 WO2021019358 A1 WO 2021019358A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
group
double coated
adhesive layer
layer
Prior art date
Application number
PCT/IB2020/056760
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English (en)
Inventor
Sunah YOU
Joonsik HWANG
Seunghoon Jung
Yeon Ung Bae
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3M Innovative Properties Company
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Publication date
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Publication of WO2021019358A1 publication Critical patent/WO2021019358A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Definitions

  • the present invention relates to a double coated adhesive tape and a method of using the same.
  • the present invention relates to a double coated adhesive tape with a variable adhesive strength and a method of using the same for adhesion of a substrate.
  • a substrate used in a display panel and the like generally requires a tape for protecting a surface from being damaged by external impact or bonding with other components.
  • a tape for protecting a surface from being damaged by external impact or bonding with other components For example, in an organic light emitting diode (OLED) panel, an adhesive tape for bonding of components with a polyimide substrate is used.
  • OLED organic light emitting diode
  • attachment and detachment may be repeated to align the position of the adhesive tape, but in this process, the shape of the adhesive tape is deformed and the adhesive strength may be deteriorated.
  • a thin plastic film needs to be temporarily attached to a rigid substrate and then separated from the substrate when manufacturing an electronic device such as a semiconductor.
  • Patent Document 1 US Patent Publication No. 2011-0210937
  • an object of the present invention is to provide a double coated adhesive tape with a variable adhesive strength and a method of using the same for adhesion of a substrate capable of exhibiting high performance by solving the conventional problems.
  • a double coated adhesive tape comprising: a base layer; and an adhesive layer A and an adhesive layer B disposed on one surface and the other surface of the base layer, respectively, wherein the adhesive layer A includes a reaction product of a base polymer and a crosslinking agent, an initiator, and a first monomer or a first oligomer curable by the initiator, and the adhesive layer A has a first adhesive strength before curing and a second adhesive strength after curing, wherein the second adhesive strength is higher or lower than the first adhesive strength.
  • a method of using a double coated adhesive tape comprising: applying the adhesive layer A of the double coated adhesive tape to a substrate A; forming a double coated adhesive tape application area and a double coated adhesive tape non-application area on the substrate A by removing a part of the double coated adhesive tape; and curing the adhesive layer A of the double coated adhesive tape application area to improve an adhesive strength.
  • a method of using a double coated adhesive tape comprising: applying the adhesive layer A of the double coated adhesive tape to a substrate A; changing a position of the double coated adhesive tape on the substrate A; and curing the adhesive layer A of which the position is changed to improve an adhesive strength.
  • a method of using a double coated adhesive tape comprising: applying the adhesive layer A and the adhesive layer B of the double coated adhesive tape to a substrate A and a substrate B, respectively, to bond the substrate A and the substrate B; curing the adhesive layer A and the adhesive layer B to decrease adhesive strengths; and separating the substrate A and the substrate B from the adhesive layer A and the adhesive layer B of which the adhesive strengths are decreased, respectively.
  • the double coated adhesive tape can easily increase or decrease the adhesive strength as needed compared to an initial adhesive strength, and has excellent compatibility with the components constituting the adhesive and excellent performance due to a large degree of change in the adhesive strength.
  • the double coated adhesive tape may be fixed to the substrate by easily removing unnecessary portions of the tape attached to the substrate initially and increasing the adhesive strength of the remaining portions, or increasing the adhesive strength after easily changing and aligning the initial position of the tape on the substrate.
  • the tape is attached to the substrate initially and then an unnecessary portion is removed by decreasing the adhesive strength to leave only a desired portion on the substrate, or two base materials are attached to each other by the tape and then may be easily separated from each other by decreasing the adhesive strength if necessary.
  • the adhesive film of the present invention and the adhesive composition for preparing the same may be usefully applied to a process requiring a variable adhesive strength, such as manufacturing of an OLED display panel.
  • FIG. 1 illustrates a cross-sectional view of a double coated adhesive tape according to an embodiment.
  • FIGS. 2 illustrates a method of using a double coated adhesive tape according to an embodiment.
  • FIG. 3A illustrates a first step of a method of using a double coated adhesive tape according to an embodiment.
  • FIG. 3B illustrates a second step of the method of using a double coated adhesive tape according to an embodiment.
  • FIG. 3C illustrates a third step of the method of using double coated adhesive tape according to an embodiment.
  • FIG. 4A illustrates a first step of a method of using the double coated adhesive tape according to the embodiment.
  • FIG. 4B illustrates a second step of the method of using the double coated adhesive tape according to the embodiment.
  • FIG. 4C illustrates a third step of the method of using the double coated adhesive tape according to the embodiment.
  • FIG. 5A is a graph illustrating a change in adhesive strength according to curing of a first monomer of an adhesive composition according to an embodiment.
  • FIG. 5B is a graph illustrating a change in adhesive strength according to addition of a second monomer of the adhesive composition according to an embodiment.
  • FIG. 6 illustrates changes in storage modulus and adhesive strength according to UV irradiation (oligomer curing) of the adhesive composition according to an embodiment.
  • Respective features of embodiments of the present invention can be partially or entirely bonded or combined with each other, and can be technically interlocked or driven variously.
  • FIG. 1 illustrates a cross-sectional view of a double coated adhesive tape according to an embodiment.
  • a double coated adhesive tape 10 includes a base layer 100; and an adhesive layer A 210 and an adhesive layer B 220 disposed on one surface and the other surface of the base layer 100, respectively.
  • the adhesive layer A 210 includes a reaction product of a base polymer and a crosslinking agent, an initiator, and a first monomer or a first oligomer which is curable by the initiator, and the adhesive layer A 210 has a first adhesive strength before curing and a second adhesive strength after curing, wherein the second adhesive strength is higher or lower than the first adhesive strength.
  • the double coated adhesive tape 10 of the present invention may further include a release layer A 310 disposed on the surface of the adhesive layer A 210; and a release layer B 320 disposed on the surface of the adhesive layer B 220.
  • the double coated adhesive tape of the present invention has a base layer to support the adhesive layers and improve mechanical properties.
  • the base layer may be a transparent polymer film, and for example, may be a transparent film including at least one resin selected from the group consisting of a polyester resin, a polyurethane resin, and a polyolefin (polyethylene, etc.) resin.
  • the base layer may also be constituted by paper, a plastic film, cloth, or a metal foil.
  • materials suitable for the base layer may include, for example, paper including both flat or smooth paper and textured paper such as crepe paper, natural or synthetic polymer films, natural and/or synthetic fibers or nonwoven fabric made from a combination thereof, fiber reinforced polymer films, fiber or yam reinforced polymer films or nonwoven fabric, and a multi-layer laminated structure.
  • the base layer may have flexibility and may also be a foam film.
  • the base layer may be a transparent foam film having flexibility.
  • the base layer may be constituted by an acrylic or thermoplastic urethane foam.
  • the base layer may have high transmittance to visible light, and for example, the base layer may be a transparent film. Specifically, the base layer may have visible light transmittance of 70% or more, 80% or more, or 90% or more.
  • the base layer may have a low haze, and for example, may be a haze of 10% or less, or 5% or less.
  • the base layer may have UV transmittance of 10% or more or 15% or more.
  • the base layer may have UV transmittance of 20% or more.
  • the base layer may have UV transmittance of 20% to 70% or 20% to 50%.
  • the thickness of the base layer may be in a range of 5 pm to 100 pm, or 10 pm to 100 pm. However, the thickness of the base layer may be adjusted as needed and the base layer may be prepared as a thick sheet. For example, when the base layer is a foam film, the base layer may be prepared with 1 mm or more.
  • Adhesive Layer A (including first monomer)
  • the adhesive layer A includes a reaction product of a base polymer and a crosslinking agent, an initiator, and a first monomer curable (or polymerizable) by the initiator.
  • the adhesive layer A according to the embodiment has a first adhesive strength before curing and a second adhesive strength after curing, and the second adhesive strength is higher than the first adhesive strength.
  • the adhesive layer A according to the embodiment includes the reaction product of the base polymer and the crosslinking agent, the initiator, and the first monomer, and the second adhesive strength is higher than the first adhesive strength.
  • the adhesive layer A includes the reaction product of the base polymer and the crosslinking agent. That is, the adhesive layer A includes a crosslinked base polymer.
  • the adhesive layer A including the reaction product of the base polymer and the crosslinking agent contains an initiator and a first monomer.
  • the initiator and the first monomer are dispersed in the reaction product of the base polymer and the crosslinking agent.
  • the first monomer may have compatibility with the reaction product of the base polymer and the crosslinking agent.
  • the first monomer may be cured by a photoinitiator or a thermal initiator. Specifically, when the photoinitiator is included in the adhesive composition, the first monomer may be cured by the photoinitiator after UV irradiation, and when the thermal initiator is included in the adhesive composition, the first monomer may be cured by the thermal initiator after heating.
  • the adhesive layer A may further include a second monomer different from the first monomer, and the second monomer may form an additional bond in the reaction product of the base polymer and the crosslinking agent. Accordingly, the complexity of base polymer chains is intensified due to the action of the second monomer, so that the adhesive strength of the adhesive layer A may be further improved.
  • the adhesive layer A may further include other additives.
  • the adhesive layer A may be constituted so that the components have specific contents.
  • the adhesive layer A may include 100 parts by weight of the base polymer, 0.1 to 20 parts by weight of the crosslinking agent, 10 to 120 parts by weight of the first monomer, and 0.1 to 10 parts by weight of the initiator.
  • the adhesive layer A may include 100 parts by weight of the base polymer, 0.1 to 20 parts by weight of the crosslinking agent, 10 to 120 parts by weight of the first monomer, 10 to 120 parts by weight of the second monomer, and 0.1 to 10 parts by weight of the initiator.
  • the contents of the components in the adhesive layer A may be based on the solid content.
  • the adhesive layer A has a structure different from the structure before curing at the time of curing (or polymerization) of the first monomer by UV irradiation.
  • FIG. 5A is a graph illustrating a change in adhesive strength according to curing of the first monomer in the adhesive layer A. As shown in FIG. 5A, the curing of the first monomer is initiated by the action of the initiator if necessary to increase the adhesive strength of the adhesive layer A.
  • FIG. 5B is a graph illustrating a change in adhesive strength according to addition of the second monomer in the adhesive layer A. As shown in FIG. 5B, as compared to a case of adding only the first monomer, in the case of adding the second monomer together, the adhesive strength after curing of the monomer is further increased.
  • the adhesive layer A has the first adhesive strength before curing of the first monomer.
  • the first adhesive strength is preferably low to a predetermined level or less to remove unnecessary portions after attaching the adhesive layer A to the substrate.
  • the first adhesive strength may be 200 gf/in or less, 150 gf/in or less, 100 gf/in or less, 50 gf/in or less, or 30 gf/in or less.
  • the first adhesive strength may be in a range of 0 gf/in to 200 gf/in, 0 gf/in to 100 gf/in, or 0 gf/in to 30 gf/in.
  • the adhesive strengths may be measured by ASTM D3330 which is a general measuring method in the art, and for example, may be an adhesive strength measured to polyimide.
  • the adhesive layer A has the second adhesive strength after curing of the first monomer.
  • the second adhesive strength is preferably high to a predetermined level or more to fix the remaining portion to the substrate after removing the unnecessary portions of the adhesive layer A.
  • the second adhesive strength may be 350 gf/in or more, 400 gf/in or more, 500 gf/in or more, or 1,000 gf/in or more.
  • the second adhesive strength may be in a range of 350 gf/in to 10,000 gf/in, or 500 gf/in to 5,000 gf/in.
  • the second adhesive strength is higher than the first adhesive strength.
  • the second adhesive strength may be higher than the first adhesive strength as 150 gf/in or more, 200 gf/in or more, 500 gf/in or more, or 1,000 gf/in or more.
  • the first adhesive strength and the second adhesive strength of the adhesive layer A may have a difference of 300 gf/in or more from each other when measuring the adhesive strength to polyimide.
  • a ratio of the second adhesive strength to the first adhesive strength may be 20 or more, 30 or more, 50 or more, 70 or more, or 100 or more.
  • the ratio of the first adhesive strength to the second adhesive strength may be 0.06 or less, 0.03 or less, 0.02 or less, or 0.01 or less.
  • the second adhesive strength may be further improved. That is, as compared to the case of adding only the first monomer, in the case of adding the second monomer together, the second adhesive strength is further increased.
  • the first adhesive strength may be further decreased. Accordingly, the difference between the first adhesive strength and the second adhesive strength may be further increased by the second monomer.
  • the first adhesive strength and the second adhesive strength may be adjusted by adjusting the addition amounts of the first monomer and the second monomer.
  • the adhesive layer A may satisfy requirements as an optically transparent adhesive layer.
  • the adhesive layer A may have a haze after curing of the first monomer of 5% or less, 2% or less, or 1% or less.
  • the adhesive layer A may have light transmittance after curing of the first monomer of 80% or more, 90% or more, or 95% or more.
  • the adhesive layer A may satisfy requirements as an optically transparent adhesive layer even when the second monomer is additionally included.
  • the adhesive layer A may have a haze after curing of 5% or less or 2% or less when the second monomer is further included.
  • the adhesive layer A may have light transmittance after curing of 80% or more or 90% or more when the second monomer is further included.
  • the thickness of the adhesive layer A may be 1000 pm or less or 500 pm or less, specifically 120 pm or less when the adhesive layer A is prepared as a thin film. Specifically, the thickness of the adhesive layer A may be in a range of 5 pm to 1000 pm, or 10 pm to 120 pm when the adhesive layer A is prepared as a thin film. Alternatively, the thickness of the adhesive layer A may be in a range of 0.1 mm to 5 mm, or 1 mm to 3 mm when the adhesive layer A is prepared as a thick film.
  • the double coated adhesive tape (wherein the adhesive layer A includes the first monomer) according to the embodiment may be fixed to the substrate by easily removing unnecessary portions of the tape attached to the substrate initially and increasing the adhesive strength of the remaining portion (partial removal), or increasing the adhesive strength after easily changing and aligning the initial position of the tape on the substrate (position changing).
  • FIG. 2 illustrates a method of using (partially removing) a double coated adhesive tape according to an embodiment.
  • the method of using the double coated adhesive tape according to the embodiment includes applying the adhesive layer A 210 of the double coated adhesive tape 10 to a substrate A 21; forming a double coated adhesive tape application area and a double coated adhesive tape non-application area on the substrate A 21 by removing a part of the double coated adhesive tape 10; and curing the adhesive layer A 211 of the double coated adhesive tape application area to improve the adhesive strength.
  • the forming of the double coated adhesive tape application area and the double coated adhesive tape non-application area on the substrate by removing the part of the double coated adhesive tape may be performed so that the double coated adhesive tape on the double coated adhesive tape application area obtained as the result has a shape such as a line, a figure, and a pattern.
  • a cutting line is formed on the surface of the double coated adhesive tape applied to the substrate in the form of dashed lines along an outside of a desired area. Thereafter, an adhesive tape or the like is attached to the area of the double coated adhesive tape to be removed and slowly lifted to remove a part of the double coated adhesive tape along the cutting line.
  • the curing of the adhesive layer A may be performed by irradiating UV to one surface of the double coated adhesive tape.
  • the curing of the adhesive layer A may be performed by irradiating (500) the UV to the adhesive layer A 211 of the double coated adhesive tape application area.
  • the UV irradiation may be performed at an energy condition of 500 mJ/cm 2 to 3,000 mJ/cm 2 in a wavelength range of 250 nm to 420 nm.
  • FIGS. 3A-C illustrate a method of using (position changing) a double coated adhesive tape according to an embodiment.
  • the method of using the double coated adhesive tape according to an embodiment includes applying the adhesive layer A 210 of the double coated adhesive tape to a substrate A 21 (FIG. 3 A); changing a position of the double coated adhesive tape 10 on the substrate A 21 (FIG. 3B); and curing the adhesive layer A 210 of which the position is changed to improve the adhesive strength (FIG. 3C).
  • the release layer 320 is removed from the adhesive layer B 220 of the double coated adhesive tape 10 and the substrate B 22 is attached to the adhesive layer B 220, so that the two substrates 21 and 22 may be bonded to each other with a precise dimension.
  • the substrates A and B may be made of materials such as metal, glass, and polymer. Specifically, the material of the substrate may be stainless steel, glass, polyolefin, polyimide, or the like.
  • Adhesive Layer A (including first oligomer)
  • the adhesive layer A includes a reaction product of a base polymer and a crosslinking agent, an initiator, and a first oligomer curable by the initiator.
  • the adhesive layer A according to the embodiment has a first adhesive strength before curing and a second adhesive strength after curing, and the second adhesive strength is lower than the first adhesive strength.
  • the adhesive layer A according to the embodiment includes the reaction product of the base polymer and the crosslinking agent, the initiator, and the first oligomer, and the second adhesive strength is lower than the first adhesive strength.
  • the adhesive layer A includes the reaction product of the base polymer and the crosslinking agent. That is, the adhesive layer A includes a crosslinked base polymer.
  • the adhesive layer A including the reaction product of the base polymer and the crosslinking agent contains an initiator and a first oligomer.
  • the initiator and the first oligomer are dispersed in the reaction product of the base polymer and the crosslinking agent.
  • the first oligomer may have compatibility with the reaction product of the base polymer and the crosslinking agent.
  • the first oligomer may be cured by a photoinitiator or a thermal initiator. Specifically, when the photoinitiator is included in the adhesive layer A, the first oligomer may be cured by the photoinitiator after UV irradiation, and when the thermal initiator is included in the adhesive layer A, the first oligomer may be cured by the thermal initiator after heating.
  • the adhesive layer A has a structure different from the structure before curing at the time of curing of the first oligomer by UV irradiation.
  • FIG. 6 is a graph illustrating changes in storage modulus and adhesive strength according to UV irradiation of the adhesive layer A according to an embodiment.
  • the adhesive layer A has a low storage modulus before UV irradiation, while has a rapidly increased storage modulus after UV irradiation.
  • the adhesive layer A has an excellent adhesive strength before UV irradiation, while has a rapidly decreased adhesive strength after UV irradiation.
  • the adhesive layer A may further include a second oligomer different from the first oligomer, and the second oligomer may form an additional bond in the reaction product of the base polymer and the crosslinking agent.
  • the adhesive layer A may further include a second oligomer different from the first oligomer and an organic acid.
  • the adhesive layer A may include 100 parts by weight of the first oligomer, 5 to 35 parts by weight of the second oligomer, and 1 to 6 parts by weight of the organic acid.
  • the adhesive layer A may further include other additives.
  • the adhesive layer A may be constituted so that the components have specific contents.
  • the adhesive layer A may include 100 parts by weight of the base polymer, 0.1 to 20 parts by weight of the crosslinking agent, 10 to 90 parts by weight of the first oligomer, and 0.1 to 10 parts by weight of the initiator.
  • the adhesive layer A may include 100 parts by weight of the base polymer, 0.1 to 20 parts by weight of the crosslinking agent, 10 to 90 parts by weight of the first oligomer, 0.1 to 20 parts by weight of the second oligomer, and 0.1 to 10 parts by weight of the initiator.
  • the adhesive layer A may include 100 parts by weight of the base polymer, 0.1 to 20 parts by weight of the crosslinking agent, 10 to 90 parts by weight of the first oligomer, 0.1 to 20 parts by weight of the second oligomer, 0.1 to 10 parts by weight of the organic acid, and 0.1 to 10 parts by weight of the initiator.
  • the contents of the components in the adhesive layer A may be based on the solid content.
  • the adhesive layer A has the first adhesive strength before curing of the first oligomer.
  • the first adhesive strength is preferably high to a predetermined level or more in order to initially attach the adhesive layer A to the substrate.
  • the first adhesive strength may be 350 gf/in or more, 400 gf/in or more, 500 gf/in or more, or 1,000 gf/in or more.
  • the first adhesive strength may be in a range of 350 gf/in to 10,000 gf/in, or 500 gf/in to 5,000 gf/in.
  • the adhesive layer A has the second adhesive strength after curing of the first oligomer.
  • the second adhesive strength is preferably low to a predetermined level or less in order to leave only a desired portion on the substrate by easily removing unnecessary portions of the adhesive layer A.
  • the second adhesive strength may be 200 gf/in or less, 150 gf/in or less, 100 gf/in or less, 50 gf/in or less, or 30 gf/in or less.
  • the second adhesive strength may be in a range of 0 gf/in to 200 gf/in, 0 gf/in to 100 gf/in, or 0 gf/in to 30 gf/in.
  • the second adhesive strength is lower than the first adhesive strength.
  • the second adhesive strength may be smaller than the first adhesive strength by 150 gf/in or more, 200 gf/in or more, 500 gf/in or more, or 1,000 gf/in or more.
  • a ratio (first adhesive strength/second adhesive strength) of the first adhesive strength to the second adhesive strength may be 3 or more, 5 or more, 10 or more, 12 or more, or 15 or more.
  • a ratio (second adhesive strength/first adhesive strength) of the first adhesive strength to the first adhesive strength may be 0.06 or less, 0.03 or less, 0.02 or less, or 0.01 or less.
  • the second adhesive strength is lower than the first adhesive strength.
  • the second adhesive strength may be lower than the first adhesive strength by 150 gf/in or more, 200 gf/in or more, 500 gf/in or more, or 1,000 gf/in or more.
  • a ratio (first adhesive strength/second adhesive strength) of the first adhesive strength to the second adhesive strength may be 20 or more, 30 or more, 50 or more, 70 or more, or 100 or more.
  • a ratio (second adhesive strength/first adhesive strength) of the second adhesive strength to the first adhesive strength may be 0.06 or less, 0.03 or less, 0.02 or less, or 0.01 or less.
  • the second adhesive strength may be further decreased. That is, as compared to the case of adding only the first oligomer, in the case of adding the second oligomer together, the second adhesive strength is further decreased.
  • the first adhesive strength may be further increased. Accordingly, a difference between the first adhesive strength and the second adhesive strength may be further increased by the second oligomer.
  • the first adhesive strength and the second adhesive strength may be adjusted by adjusting the addition amounts of the first oligomer and the second oligomer.
  • the adhesive layer A may satisfy requirements as an optically transparent adhesive layer.
  • the adhesive layer A may have a haze after curing of the first oligomer of 5% or less, 2% or less, or 1% or less.
  • the adhesive layer A may have light transmittance after curing of the first oligomer of 80% or more, 90% or more, or 95% or more.
  • the adhesive layer A may satisfy requirements as an optically transparent adhesive layer even when the second oligomer is additionally included.
  • the adhesive layer A may have a haze after curing of 5% or less or 2% or less when the second oligomer is further included.
  • the adhesive layer A may have light transmittance after curing of 80% or more or 90% or more when the second oligomer is further included.
  • the thickness of the adhesive layer A may be 1000 pm or less or 500 pm or less, specifically 120 pm or less when the adhesive layer A is prepared as a thin film. Specifically, the thickness of the adhesive layer A may be in a range of 5 pm to 1000 pm, or 10 pm to 120 pm when the adhesive layer A is prepared as a thin film. Alternatively, the thickness of the adhesive layer A may be in a range of 0.1 mm to 5 mm, or 1 mm to 3 mm when the adhesive layer A is prepared as a thick film.
  • the tape is initially attached to the substrate and then an unnecessary portion is removed by decreasing the adhesive strength to leave only a desired portion on the substrate (partial removal), or two base materials are attached to each other by the tape and then may be easily separated from each other by decreasing the adhesive strength if necessary (temporary attachment).
  • FIGS. 4A-C illustrate a method of using (temporary attachment) the double coated adhesive tape according to the embodiment.
  • the method of using the double coated adhesive tape according to the embodiment includes applying the adhesive layer A 210 and the adhesive layer B 220 of the double coated adhesive tape to the substrate A 21 and the substrate B 22, respectively, to bond the substrate A 21 and the substrate B 22 (FIG. 4A); curing the adhesive layer A 210 and the adhesive layer B 220 to decrease the adhesive strength (FIG. 4B); and separating the substrate A 21 and the substrate B 22 from the adhesive layer A 210 and the adhesive layer B 220 of which the adhesive strengths are decreased, respectively (FIG. 4C).
  • the curing of the adhesive layer A may be performed by irradiating UV to one surface of the double coated adhesive tape.
  • the UV irradiation may be performed at an energy condition of 500 mJ/cm 2 to 3,000 mJ/cm 2 in a wavelength range of 250 nm to 420 nm.
  • the substrates A and B may be made of materials such as metal, glass, and polymer.
  • the substrate A may be made of a flexible polymer material such as polyester, polyolefin, or polyimide
  • the substrate B may be made of a rigid material such as stainless steel, glass, or metal.
  • the base polymer, the crosslinking agent, the initiator, the first monomer, the second monomer, the first oligomer, the second oligomer, the organic acid, the additives, and the like constituting the adhesive layer A will be described.
  • the base polymer exhibits adhesive properties as a main component of the adhesive layer A.
  • the base polymer reacts (i.e., is crosslinked) with the crosslinking agent to form the adhesive layer A.
  • the base polymer may be included in a range of 35 wt% to 95 wt% based on the weight of the adhesive layer A. Specifically, the base polymer may be included in a range of 40 wt% to 90 wt%, 45 wt% to 85 wt%, or 50 wt% to 80 wt% based on the weight of the adhesive layer A. At this time, the content of the base polymer and the weight of the adhesive layer A may be based on the solid content.
  • the base polymer may contain a functional group reactive with the crosslinking agent.
  • the base polymer may have at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acryl group, a methacryl group, an acetate group, and a vinyl group.
  • the base polymer may be an acrylic resin.
  • the base polymer may be an acrylic copolymer resin.
  • the acrylic copolymer resin may be a resin copolymerized with at least two monomers selected from the group consisting of 2-ethylhexyl acrylate (2-EHA), butyl acrylate (BA), methyl acrylate (MA), vinyl acetate (VAc), acryl acid (AA), and 2-hydroxyethyl acrylate (2- HEA).
  • 2-EHA 2-ethylhexyl acrylate
  • BA butyl acrylate
  • MA methyl acrylate
  • VAc vinyl acetate
  • AA acryl acid
  • 2-HEA 2-hydroxyethyl acrylate
  • a combination of at least two monomers constituting the acrylic copolymer resin may include 2-EHA/MA, BA/MA, AA/2-HEA, MA/2-HEA, BA/2-HEA, MA/AA/2-HEA, and the like.
  • the base polymer may be a thermocurable resin or a photocurable resin.
  • the base polymer may be a thermocurable resin.
  • the base polymer may be a pressure sensitive adhesive (PSA) resin.
  • PSA pressure sensitive adhesive
  • the weight average molecular weight (Mw) of the base polymer may be 10,000 to 2,000,000. Alternatively, the weight average molecular weight of the base polymer may be 100,000 to 2,000,000.
  • the crosslinking agent reacts with the base polymer to form the adhesive layer A.
  • the content of the crosslinking agent in the adhesive layer A may be 0.1 parts by weight to 20 parts by weight based on 100 parts by weight of the base polymer. Specifically, the content of the crosslinking agent in the adhesive layer A may be 0.1 parts by weight to 10 parts by weight or 0.1 parts by weight to 5 parts by weight based on 100 parts by weight of the base polymer. At this time, the contents of the crosslinking agent and the base polymer may be based on the solid content.
  • the crosslinking agent may contain a functional group which is reactive with a functional group of the base polymer.
  • the crosslinking agent may have one or at least two functional groups selected from the group consisting of an epoxy group, an isocyanate group, a carboxyl group, a hydroxyl group, an acryl group, a methacryl group, an acetate group, and a vinyl group.
  • the crosslinking agent may have an epoxy group or an isocyanate group.
  • the crosslinking agent may be a photo-crosslinking agent, a thermal crosslinking agent, or a combination thereof.
  • the photo-crosslinking agent a general multifunctional acrylic compound can be used.
  • the photo-crosslinking agent may be at least one selected from the group consisting of diacrylate and triacrylate.
  • Specific examples of the photo-crosslinking agent may include 1,4- butanediol diacrylate, 1,6-hexanediol diacrylate (HDDA), 1,9-nonanediol diacrylate, tripropylene glycol diacrylate, tetraethylene glycol diacrylate, trimethylolpropane triacrylate, and pentaerythritol triacrylate.
  • the thermal crosslinking agent may be an isocyanate-based, epoxy-based, or metal chelate-based compound.
  • the isocyanate-based compound may be a multifunctional aromatic or aliphatic isocyanate compound.
  • the isocyanate-based compound may be trimerized isocyanate such as a toluene diisocyanate-trimethylol propane (TDI-TMP) adduct.
  • the epoxy- based compound may have one or at least two epoxy groups, and may have other functional groups reactive with the base polymer.
  • the metal chelate-based compound may be a chelate-based compound having a metal such as Zn, Ni, Mn, Fe, Co, Cr, Al, Ti or Zr. Examples of a commercially available thermal crosslinking agent may include Saivinol hardener series from Saiden Chemical Industry Co., Ltd.
  • the initiator is to cure the first monomer or the first oligomer.
  • the initiator may be a photoinitiator or a thermal initiator.
  • the content of the initiator in the adhesive layer A may be 0.1 parts by weight to 10 parts by weight based on 100 parts by weight of the base polymer. Specifically, the content of the initiator in the adhesive layer A may be 0.1 parts by weight to 5 parts by weight based on 100 parts by weight of the base polymer. At this time, the contents of the initiator and the base polymer may be based on the solid content.
  • a general photoinitiator can be used, and for example, as the photoinitiator, at least one selected from the group consisting of ketones (benzophenone, acetophenone, etc.), benzoins, benzoin ethers, benzyls, and benzyl ketals may be used.
  • ketones benzophenone, acetophenone, etc.
  • benzoins benzoin ethers
  • benzyls benzyl ketals
  • the photoinitiator may be benzoin ethers (e.g., benzoin methyl ether or benzoin isopropyl ether) or substituted benzoin ethers.
  • benzoin ethers e.g., benzoin methyl ether or benzoin isopropyl ether
  • substituted benzoin ethers e.g., benzoin methyl ether or benzoin isopropyl ether
  • the photoinitiator may be substituted acetophenone, for example, 2,2-diethoxyacetophenone or 2,2-dimethoxy-2-phenylacetophenone.
  • the photoinitiator may be substituted alpha-ketones (e.g., 2- methyl-2-hydroxypropiophenone), aromatic sulfonyl chlorides (e.g., 2-naphthalene sulfonyl chloride), or photoactive oximes (e.g., 1 -phenyl- l,2-propanedione-2-(0-ethoxycarbonyl) oxime).
  • alpha-ketones e.g., 2- methyl-2-hydroxypropiophenone
  • aromatic sulfonyl chlorides e.g., 2-naphthalene sulfonyl chloride
  • photoactive oximes e.g., 1 -phenyl- l,2-propanedione-2-(0-ethoxycarbonyl) oxime
  • the photoinitiator may be 1 -hydroxy cyclohexyl phenyl ketone, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 1 -[4-(2-hydroxyethoxy)phenyl] -2 -hydroxyl- methyl- 1 -propane- 1 -one, 2-benzyl -2 -dimethylamino- 1 -(4-morpholinophenyl)butanone, 2-methyl - l-[4-(methylthio)phenyl]-2-morpholinopropane-l-one, 2-hydroxy-2-methyl-l-phenylpropan-l-one, and the like.
  • Examples of a commercially available photoinitiator may include Ciba IRGACURE series from Ciba Specialty Chemicals Co., Ltd., Esacure KIP series from IGM Resins Co., Ltd., and the like.
  • a water-soluble or water-insoluble (i.e., oil-soluble) thermal initiator may be selectively used.
  • persulfates such as potassium persulfate, ammonium persulfate, sodium persulfate, and mixtures thereof
  • oxidation-reduction initiators such as a reaction product of a reducing agent such as metabisulfite (e.g., sodium metabisulfite) or bisulfate (e.g., sodium bisulfate) and persulfate
  • 4,4’-azobis(4-cyanopentanoic acid) and soluble salts thereof e.g., sodium salt, potassium salt
  • azos such as 2,2’-azobis(2-methylbutanenitrile), 2,2’-azobis(isobutyronitrile), and 2,2’-azobis(2,4-dimethylpentanenitrile); or peroxides such as benzoyl peroxide, cyclohexane peroxide, and lauroyl peroxide may be used.
  • the adhesive layer A may include a first monomer.
  • the first monomer is to be cured (or polymerized) after the reaction of the base polymer and the crosslinking agent. That is, the first monomer may be present in an uncured state even after the reaction of the base polymer and the crosslinking agent.
  • the first monomer in the uncured state may decrease the adhesive strength of the reaction product of the base polymer and the crosslinking agent.
  • the first monomer is cured as necessary to rapidly improve the adhesive strength of the reaction product.
  • the content of the first monomer in the adhesive layer A may be 10 parts by weight to 120 parts by weight based on 100 parts by weight of the base polymer. Specifically, the content of the first monomer in the adhesive layer A may be 20 parts by weight to 110 parts by weight, 30 parts by weight to 100 parts by weight, or 40 parts by weight to 90 parts by weight based on 100 parts by weight of the base polymer. At this time, the contents of the base polymer and the first monomer may be based on the solid content.
  • the molecular weight of the first monomer may be in a range of 50 to 2,000, or 100 to
  • the first monomer may be monofimctional or bifimctional or more compounds, for example, monofimctional to trifimctional compounds.
  • the first monomer may have at least one functional group selected from the group consisting of an acryl group, a methacryl group, an ethyleneoxy group, a vinyl group, and a carboxyl group.
  • the first monomer may have compatibility with the base polymer.
  • the first monomer may be cured by a photoinitiator or a thermal initiator.
  • the first monomer may be at least one compound represented by the following Chemical Formula Al.
  • n is an integer of 1 to 5;
  • R 1 is linear Ci- 12 alkyl, or Ce-io aryloxy substituted or unsubstituted with phenyl;
  • R a and R b are each independently hydrogen or acryloyloxymethyl.
  • n is an integer of 1 to 3.
  • n is an integer of 3 to 5.
  • R 1 is linear C1-3 alkyl.
  • R 1 is linear Ce- 12 alkyl.
  • R 1 is phenyloxy.
  • R 1 is phenyloxy substituted with phenyl.
  • R a and R b are hydrogen.
  • R a is hydrogen and R b is acryloyloxymethyl.
  • R a and R b are acryloyloxymethyl .
  • R 1 is linear C1-3 alkyl; and R a and R b are acryloyloxymethyl.
  • R 1 is linear Ce-i2 alkyl; and R a and R b are hydrogen.
  • R 1 is phenyloxy; and R a and R b are hydrogen.
  • R 1 is phenyloxy substituted with phenyl; and R a and R b are hydrogen.
  • TMPTA trimethylolpropane triacrylate
  • lauryl acrylate phenyl(EO)2 acrylate
  • o-phenylphenol EO acrylate o-phenylphenol EO acrylate
  • the adhesive layer A may further include a second monomer different from the first monomer.
  • the second monomer may form an additional bond in the reaction product of the base polymer and the crosslinking agent. Accordingly, the second monomer may increase a curing density of the reaction product of the base polymer and the crosslinking agent, and as a result, the second monomer may help to reduce the first adhesive strength.
  • the content of the second monomer in the adhesive layer A may be 10 parts by weight to 120 parts by weight based on 100 parts by weight of the base polymer. Specifically, the content of the second monomer in the adhesive layer A may be 20 parts by weight to 110 parts by weight, 30 parts by weight to 100 parts by weight, or 40 parts by weight to 90 parts by weight based on 100 parts by weight of the base polymer.
  • the contents of the base polymer and the second monomer may be based on the solid content.
  • the total content of the first monomer and the second monomer in the adhesive layer A may be 60 parts by weight or more based on 100 parts by weight of the base polymer. Specifically, the total content of the first monomer and the second monomer in the adhesive layer A may be 60 parts by weight to 200 parts by weight, or 60 parts by weight to 150 parts by weight based on 100 parts by weight of the base polymer.
  • the contents of the base polymer, the first monomer, and the second monomer may be based on the solid content.
  • the second monomer may react together to increase the curing density.
  • the second monomer may decrease the adhesive strength of the reaction product of the base polymer and the crosslinking agent, before curing.
  • the adhesive strength of the reaction product of the base polymer and the crosslinking agent is further decreased before curing of the first monomer, but further increased after curing, thereby exhibiting a rapider increase in the adhesive strength.
  • the molecular weight of the second monomer may be in a range of 50 to 1000, or 100 to
  • the second monomer may be monofimctional or bifiinctional or more compounds, for example, monofimctional to trifiinctional compounds.
  • the second monomer may have at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acryl group, a methacryl group, an acetate group, and a vinyl group.
  • the second monomer may have each functional group at each of both ends.
  • the second monomer may be at least one compound represented by the following Chemical Formula A2.
  • n is an integer of 1 to 5.
  • the second monomer may be 2-carboxyethyl acrylate, 2-carboxy (EO) ethyl acrylate, 2-carboxy (EO)2 ethyl acrylate, 2-carboxy (EO)3 ethyl acrylate, or carboxy (EO)4 ethyl acrylate.
  • the adhesive layer A may include a first oligomer.
  • the first oligomer is to be cured after the reaction of the base polymer and the crosslinking agent. That is, the first oligomer may be present in an uncured state even after the reaction of the base polymer and the crosslinking agent.
  • the first oligomer in the uncured state may not be involved in the adhesive strength of the reaction product of the base polymer and the crosslinking agent. However, after the reaction of the base polymer and the crosslinking agent, the first oligomer is cured as necessary to rapidly decrease the adhesive strength of the reaction product.
  • the first oligomer may be cured by a photoinitiator or a thermal initiator.
  • the first oligomer may have compatibility with the base polymer.
  • the first oligomer may include repeating units derived from epoxy acrylate.
  • the first oligomer may be at least one compound represented by the following Chemical Formula Bl.
  • Xi is each independently a linear or branched CMO alkylene group
  • Li is each independently a CMO alkylene group, a C3-20 cycloalkylene group or a Ci-10 alkyleneoxy group
  • Ri is each independently H, a CMO alkyl group, a CMO alkoxy group, a C2-10 alkenyl group, or a Ce-14 aryl group
  • m is an integer from 0 to 10.
  • the CMO alkylene group may include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a sec-butylene group, a t-butylene group, a pentylene group, an isopentylene group, a t-pentylene group, a hexylene group, a heptylene group, an octylene group, an isooctylene group, a t-octylene group, a 2-ethylhexylene group, a nonylene group, an isononylene group, a dexylene group, an isodecylene group, and the like.
  • C3-20 cycloalkylene group may include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cycloheptylene group, a decalinylene group, an adamantylene group, and the like.
  • C O alkyleneoxy group may include a methyleneoxy group, an ethyleneoxy group, a propyleneoxy group, a butyleneoxy group, a sec-butyleneoxy group, a t-butyleneoxy group, a pentyleneoxy group, a hexyleneoxy group, a heptyleneoxy group, an octyleneoxy group, a 2-ethyl- hexyleneoxy group, and the like.
  • Ci-10 alkyl group may include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec- butyl group, a t-butyl group, a pentyl group, an isopentyl group, a t-pentyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a t-octyl group, a 2-ethylhexyl group, a nonyl group, an isononyl group, a decyl group, an isodecyl group, and the like.
  • Ci-10 alkoxy group may include a methoxy group, an ethoxy group, a propoxy group, a butyloxy group, a sec-butoxy group, a t-butoxy group, a pentoxy group, a hexyloxy group, a heptoxy group, an octyloxy group, a 2-ethyl-hexyloxy group, and the like.
  • Specific examples of the C2-10 alkenyl group may include a vinyl group, an allyl group, a butenyl group, a propenyl group, and the like.
  • Ce-14 aryl group may include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, and the like.
  • the epoxy acrylate may have a bisphenol A skeleton.
  • the first oligomer may include bisphenol A epoxy acrylate as a structural unit.
  • the weight average molecular weight of the first oligomer may be in a range of 300 to 30,000, or 500 to 10,000.
  • the content of the first oligomer in the adhesive layer A may be 10 parts by weight to 100 parts by weight based on 100 parts by weight of the base polymer. Specifically, the content of the first oligomer in the adhesive layer A may be 10 parts by weight to 90 parts by weight, 10 parts by weight to 80 parts by weight, or 15 parts by weight to 70 parts by weight based on 100 parts by weight of the base polymer. At this time, the contents of the base polymer and the first oligomer may be based on the solid content.
  • the adhesive layer A may further include a second oligomer different from the first oligomer.
  • the second oligomer may react with a low molecular acid compound and the like remaining in the adhesive layer A to improve an initial adhesive strength of the adhesive layer A. Further, after the reaction of the base polymer and the crosslinking agent, the second oligomer is cured with the first oligomer as necessary to further decrease the adhesive strength of the reaction product.
  • the second oligomer may be at least one compound represented by the following Chemical Formula B2.
  • X 2 is each independently a linear or branched Ci- 10 alkylene group
  • L 2 is each independently a CMO alkylene group, a C 3-20 cycloalkylene group or a CMO alkyleneoxy group
  • R 2 is each independently H, a CMO alkyl group, a C O alkoxy group, a C 2-10 alkenyl group, or a Ce-i 4 aryl group
  • n is an integer from 0 to 10.
  • the CMO alkylene group may include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a sec-butylene group, a t-butylene group, a pentylene group, an isopentylene group, a t-pentylene group, a hexylene group, a heptylene group, an octylene group, an isooctylene group, a t-octylene group, a 2-ethylhexylene group, a nonylene group, an isononylene group, a dexylene group, an isodecylene group, and the like.
  • C 3-20 cycloalkylene group may include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cycloheptylene group, a decalinylene group, an adamantylene group, and the like.
  • CMO alkyleneoxy group may include a methyleneoxy group, an ethyleneoxy group, a propyleneoxy group, a butyleneoxy group, a sec-butyleneoxy group, a t-butyleneoxy group, a pentyleneoxy group, a hexyleneoxy group, a heptyleneoxy group, an octyleneoxy group, a 2-ethyl- hexyleneoxy group, and the like.
  • CMO alkyl group may include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec- butyl group, a t-butyl group, a pentyl group, an isopentyl group, a t-pentyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a t-octyl group, a 2-ethylhexyl group, a nonyl group, an isononyl group, a decyl group, an isodecyl group, and the like.
  • CMO alkoxy group may include a methoxy group, an ethoxy group, a propoxy group, a butyloxy group, a sec-butoxy group, a t-butoxy group, a pentoxy group, a hexyloxy group, a heptoxy group, an octyloxy group, a 2-ethyl-hexyloxy group, and the like.
  • C 2-10 alkenyl group may include a vinyl group, an allyl group, a butenyl group, a propenyl group, and the like.
  • CYu aryl group may include a phenyl group, a tolyl group, a xylyl group, a naphthyl group, and the like.
  • the second oligomer may be an epoxy resin having a bisphenol A skeleton.
  • the weight average molecular weight of the second oligomer may be in a range of 300 to 30,000, or 500 to 10,000.
  • the content of the second oligomer in the adhesive layer A may be 0.1 parts by weight to 20 parts by weight based on 100 parts by weight of the base polymer. Specifically, the content of the second oligomer in the adhesive layer A may be 0.1 parts by weight to 10 parts by weight, or 0.1 parts by weight to 5 parts by weight based on 100 parts by weight of the base polymer. At this time, the contents of the second oligomer and the base polymer may be based on the solid content.
  • the adhesive layer A may further include the organic acid.
  • the organic acid reacts with an end functional group (e.g., an epoxy group, etc.) of the oligomer present in the adhesive layer to improve the initial adhesive strength of the adhesive layer.
  • an end functional group e.g., an epoxy group, etc.
  • the organic acid may have 1 to 5, or 1 to 3 functional groups.
  • the organic acid may have at least one functional group selected from the group consisting of a hydroxyl group, an acryl group, a methacryl group, an acetate group, and a vinyl group in addition to a carboxyl group.
  • the organic acid may have a vinyl group.
  • the organic acid may be at least one compound represented by the following Chemical Formula B3.
  • L 3 is a single bond, a C HO alkylene group, a C3-20 cycloalkylene group, or a Ci- 10 alkyleneoxy group.
  • C HO alkylene group may include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a sec-butylene group, a t-butylene group, a pentylene group, an isopentylene group, a t-pentylene group, a hexylene group, a heptylene group, an octylene group, an isooctylene group, a t-octylene group, a 2-ethylhexylene group, a nonylene group, an isononylene group, a dexylene group, an isodecylene group, and the like.
  • C3-20 cycloalkylene group may include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cycloheptylene group, a decalinylene group, an adamantylene group, and the like.
  • C i-10 alkyleneoxy group may include a methyleneoxy group, an ethyleneoxy group, a propyleneoxy group, a butyleneoxy group, a sec-butyleneoxy group, a t-butyleneoxy group, a pentyleneoxy group, a hexyleneoxy group, a heptyleneoxy group, an octyleneoxy group, a 2-ethyl- hexyleneoxy group, and the like.
  • the organic acid may include methacrylic acid.
  • the molecular weight of the organic acid may be in a range of 50 to 1000, or 50 to 500.
  • the content of the organic acid in the adhesive layer may be 0.1 parts by weight to 10 part by weight, 0.1 parts by weight to 5 parts by weight, or 0.1 parts by weight to 3 parts by weight based on 100 parts by weight of the base polymer. At this time, the contents of the organic acid and the base polymer may be based on the solid content.
  • the adhesive layer may further include other additives if necessary.
  • additives include tackifiers (e.g., rosin ester, terpene, phenol, and aliphatic synthetic hydrocarbon resin, aromatic synthetic hydrocarbon resin, or a mixture of aliphatic synthetic hydrocarbon resin and aromatic synthetic hydrocarbon resin), surfactants, plasticizers (other than a physical foaming agent), nucleants (e.g., talc, silica, or T1O2), fillers (e.g., inorganic fillers and organic fillers), fibers, aging inhibitors, antioxidants, UV-absorbers, antistatic agents, lubricants, pigments, dyes, reinforcing agents, hydrophobic or hydrophilic silica, calcium carbonate, toughening agents, flame retardants, finely grinded polymeric particles (e.g., polyester, nylon, or polypropylene), stabilizers (e.g., UV stabilizer), and combinations thereof.
  • tackifiers e.g., rosin ester, terpene, phenol, and
  • the content of the additives is not particularly limited as an appropriate amount to obtain desired properties of the adhesive layer, but may be, for example, 0.1 wt% to 10 wt% or 0.1 wt% to 5 w% based on the weight of the adhesive layer.
  • the adhesive layer A may be prepared by preparing an adhesive composition and then forming a film.
  • the preparation method of the adhesive layer A includes mixing a base polymer, a crosslinking agent, an initiator, and a first monomer or a first oligomer; forming a film-like polymer by reacting the crosslinking agent with the base polymer; and preserving the first monomer or the first oligomer and the initiator in the film-like polymer to obtain an adhesive layer.
  • the adhesive composition may be prepared by mixing the base polymer, the crosslinking agent, the initiator, and the first monomer or the first oligomer, and further mixing a solvent and other additives as necessary.
  • the base polymer may be prepared by a general method such as solution polymerization.
  • the first oligomer, the second oligomer, and the organic acid may be purchased commercially or prepared separately.
  • the first oligomer, the second oligomer, and the organic acid may be prepared by reaction of any two of these compounds.
  • a bisphenol A epoxy resin reacts with methacrylic acid
  • an unreacted bisphenol A epoxy resin and methacrylic acid are present while bisphenol A epoxy acrylate is generated, so that the bisphenol A epoxy acrylate, the bisphenol A epoxy resin, and the methacrylic acid may be provided as the first oligomer, the second oligomer, and the organic acid, respectively.
  • the order and conditions for mixing the base polymer, the crosslinking agent, the initiator, and the first monomer or the first oligomer in the preparation of the adhesive composition are not particularly limited, and the process may be appropriately modified as necessary.
  • the viscosity may be adjusted by using a solvent in each mixing step.
  • the type of the solvent is not particularly limited, and may be, for example, at least one selected from the group consisting of toluene, a mixture of hexane/methyl ethyl ketone, xylene, and isopropyl acetate.
  • the mixing amount of the solvent is not particularly limited, but for example, the solvent may be mixed so that the solid content of the adhesive composition is in a range of 30 wt% to 90 wt%, or 50 wt% to 80 wt%.
  • the preparation method of the adhesive composition is not particularly limited, and the process conditions may be appropriately modified as necessary.
  • the reaction of the crosslinking agent and the base polymer may be performed by a general thermal curing process.
  • a thermal curing temperature may be in a range of 40°C to 150°C, 60°C to 150°C, 60°C to 120°C, or 100°C to 120°C
  • a thermal curing time may be 1 minute to 10 minutes, or 2 minutes to 5 minutes, but these thermal curing conditions may be adjusted according to the length and the number of a curing oven.
  • aging e.g., aging at about 50°C for 3 days
  • aging may be further performed after the thermal curing.
  • the thermal curing process may be performed when the adhesive composition is coated on the base layer.
  • the adhesive composition may be coated on the base layer with an appropriate thickness, and the thermal curing may be performed in this process.
  • the coating may be performed by a method such as notch bar, comma, gravure, or die coating.
  • a coating rate may be in a range of about 1 m/min to 40 m/min, or 5 m/min to 30 m/min, but the conditions may be adjusted according to the length of the curing oven.
  • the preserving of the first monomer or the first oligomer and the initiator in the film-like polymer may be performed by suppressing an environment (for example, preventing UV light exposure) in which the initiator may act in the coated (and thermally cured) film-like polymer.
  • the adhesive layer B may have a constant adhesive strength or have a variable adhesive strength.
  • the adhesive layer B is not subjected to additional curing according to UV irradiation, and accordingly, the adhesive strength is not changed according to UV irradiation.
  • the adhesive layer B may include a general adhesive, for example, an acrylic pressure -sensitive adhesive (PSA), but is not particularly limited.
  • PSA acrylic pressure -sensitive adhesive
  • the adhesive layer B may be constant in a low or high adhesive strength according to a temporary or permanent adhesive application.
  • the adhesive layer B has a first adhesive strength before curing and a second adhesive strength after curing, and the second adhesive strength of the adhesive layer B is higher or lower than the first adhesive strength.
  • the curing of the adhesive layer B may be performed by irradiating UV to one surface of the double coated adhesive tape.
  • the second adhesive strength of the adhesive layer A may be higher than the first adhesive strength, and the second adhesive strength of the adhesive layer B may be lower than the first adhesive strength.
  • the adhesive layer B may include the reaction product of the base polymer and the crosslinking agent, the initiator, and the first monomer, and may further include a second monomer different from the first monomer.
  • the second adhesive strength of the adhesive layer A may be lower than the first adhesive strength
  • the second adhesive strength of the adhesive layer B may be lower than the first adhesive strength
  • the adhesive layer B may include the reaction product of the base polymer and the crosslinking agent, the initiator, and the first oligomer, and may further include a second oligomer different from the first oligomer and an organic acid.
  • the types and contents of the base polymer, the crosslinking agent, the initiator, the first monomer, the second monomer, the first oligomer, the second oligomer, the organic acid, and the like included in the adhesive layer B are as described in the components of the adhesive layer A.
  • the double coated adhesive tape of the present invention may further include a release layer for protecting the surface of the adhesive layer.
  • the release layer may be at least one selected from the group consisting of a polyester (PET) film, a polyethylene (PE) film, a polypropylene (PP) film, and paper.
  • PET polyester
  • PE polyethylene
  • PP polypropylene
  • the release layer A and the release layer B may be transparent films.
  • release layer A and the release layer B may include a silicone coating layer on a surface in contact with the adhesive film.
  • Base layer 210 Adhesive layer A
  • Adhesive layer B 310 Release layer A

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention concerne un ruban adhésif à double revêtement ayant une force adhésive variable et un procédé d'utilisation de celui-ci pour l'adhérence d'un substrat. Le ruban adhésif à double revêtement comprend une couche de base ; et une couche adhésive A et une couche adhésive B disposées sur une surface et l'autre surface de la couche de base, respectivement, la couche adhésive A comprenant un produit de réaction d'un polymère de base et d'un agent de réticulation, un initiateur, et un premier monomère ou un premier oligomère qui peut être durci par l'initiateur et la couche adhésive A ayant une première force adhésive avant durcissement et une seconde force adhésive après durcissement, la seconde force adhésive étant supérieure ou inférieure à la première force adhésive.
PCT/IB2020/056760 2019-07-31 2020-07-17 Ruban adhésif à double revêtement et procédé d'utilisation de celui-ci WO2021019358A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190093301A KR20210015046A (ko) 2019-07-31 2019-07-31 양면 접착 테이프 및 이의 사용방법
KR10-2019-0093301 2019-07-31

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WO2021019358A1 true WO2021019358A1 (fr) 2021-02-04

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TW545018B (en) * 2001-07-18 2003-08-01 Naito & Co Ltd Business information exchange system, data exchange device, business information exchange method, and the recording medium
US20110030887A1 (en) * 2006-09-11 2011-02-10 Tesa Se Process for producing a double-sided pressure-sensitive tape and its use
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