WO2021018289A1 - 一种发光二极管灯具 - Google Patents

一种发光二极管灯具 Download PDF

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Publication number
WO2021018289A1
WO2021018289A1 PCT/CN2020/106242 CN2020106242W WO2021018289A1 WO 2021018289 A1 WO2021018289 A1 WO 2021018289A1 CN 2020106242 W CN2020106242 W CN 2020106242W WO 2021018289 A1 WO2021018289 A1 WO 2021018289A1
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WO
WIPO (PCT)
Prior art keywords
light
led
module
lampshade
led lamp
Prior art date
Application number
PCT/CN2020/106242
Other languages
English (en)
French (fr)
Inventor
姚志雄
江涛
熊爱明
周林
陆健
王名斌
张志超
Original Assignee
嘉兴山蒲照明电器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 嘉兴山蒲照明电器有限公司 filed Critical 嘉兴山蒲照明电器有限公司
Priority to JP2022600010U priority Critical patent/JP3238264U/ja
Publication of WO2021018289A1 publication Critical patent/WO2021018289A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
    • F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/14—Bayonet-type fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/18—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • This application relates to lighting appliances, and in particular to an LED lamp.
  • Ceiling lights are lighting decorations that are absorbed or embedded in the roof ceiling. Ceiling lights are often used as lighting equipment in various places such as homes, offices, and entertainment venues.
  • a traditional ceiling lamp is usually composed of a base, a light source module, a circuit module and a lampshade, and the light-emitting elements in the light source module are generally energy-saving lamps. Because energy-saving lamps have mercury pollution during the production process and after use and disposal, and their power consumption is larger than LEDs, and LEDs have the characteristics of no mercury, no toxicity, no electromagnetic pollution, no harmful rays, energy saving and environmental protection, and long service life. Therefore, the light-emitting elements of ceiling lamps have gradually replaced energy-saving lamps with LEDs. However, the existing ceiling lamps still have problems in lighting, heat dissipation, installation and packaging during use, as follows:
  • optical components such as light guide plates, lenses, reflecting units, etc.
  • the amount of light incident on the light guide plate will vary, and the structure of the optical components will be complicated , The brightness of the light guide plate is uneven, and the dark part of the light guide plate is generated;
  • the light source module is mostly installed in the lamp body by screws, or pasted in the lamp body by adhesive, and it is not easy to disassemble and replace after installation. In addition, after long-term use of the ceiling lamp, the light source module is often aging and burned. If the light source module is damaged and needs to be replaced, the damaged light source module needs to be removed with a tool, and then the new light source module Installation and replacement of LED light source modules must be performed by professionals, and the use process is not convenient;
  • Ceiling lamps are usually flat-shaped structures, which have the characteristics of small occupation height and wide lighting range. However, the overall thickness of the ceiling lamps is still very large, which causes the volume of the product to increase, thereby increasing the packaging and inventory costs.
  • this application provides an LED lamp.
  • An LED lamp includes a lampshade and a chassis connected to the lampshade.
  • An accommodating space formed by the lampshade and the chassis is provided with a photoelectric module.
  • the photoelectric module includes a light source module and a power supply module.
  • a hole is formed in the central part of the base, a support part and an edge part are formed around the hole, a gap is formed between the support part and the edge part, and a gap exists between the optoelectronic module and the support part.
  • the photoelectric module includes a circuit board
  • the circuit board includes a first surface and a second surface that are opposed to each other, the first surface faces the lampshade, and the second surface includes a seventh area and a second surface.
  • the electronic components of the power module include heating elements and heat-resistant elements, wherein the heating elements and the heat-resistant elements are located in the seventh area and the eighth area, respectively.
  • the circuit board is provided with a plurality of LED chip sets, each LED chip set includes a plurality of LED chips, and the first surface includes a fifth area opposite to the seventh area and a fifth area opposite to the eighth area.
  • the number of LED chips located in the fifth area is less than the number of LED chips located in the sixth area.
  • the pitch angle of the LED chip is 90*(1/n)°.
  • the LED chip groups are located on the same circumference, each LED chip group includes LED chips of one light color, and the LED chips on each circumference are staggered in the circumferential direction.
  • the photoelectric module further includes an insulating unit, which includes a first insulating portion covering all electronic components on the first surface and a second insulating portion covering all electronic components on the second surface.
  • the first insulating portion has a certain radian from one end of the light source module along the radial direction of the light source module to the other end of the light source module.
  • the lampshade has a wall, and the lampshade is of a revolving structure, the edge of the wall is provided with a second protrusion, and the second protrusion faces the radial direction of the lampshade from the edge of the wall.
  • the inner convex part is provided.
  • the LED lamp further includes an installation part for fixing the photoelectric module to the base.
  • the mounting portion includes a second mounting portion, the second mounting portion has a second slot, and when the lampshade is fixed to the base, the second protruding portion is locked into the second slot to be fixed.
  • this application achieves one of the following beneficial effects or any combination thereof: (1) The photoelectric module is rotated and fixed by the installation part, which is convenient for installation and maintenance, and improves work efficiency; (2) Adjusting the light source The arrangement of the LED chips on the module can make the light emitting effect of the LED lamp more uniform and the heat dissipation effect more excellent; (3) The electronic components on the second side of the circuit board are located on the circuit board compared to the electronic components of any light source module The inner side of the radial direction can prevent the heat generated by the electronic components of the light source module from affecting the electronic components on the second surface.
  • LED chips and power modules are located on the first side and the second side of the circuit board, respectively, the number of LED chips in the area corresponding to the power module on the first side is less than that on the first side without power supply
  • the number of LED chips in the area of the module can significantly reduce the dark area in the middle of the LED lamp and improve the luminous effect of the LED lamp.
  • it can reduce the influence of the heat generated by the power module on the light source module;
  • the second power module with a higher height is located in the groove of the base.
  • the optoelectronic module can be far away from the lampshade.
  • the light source module reaches the edge of the lampshade to increase the amount of light;
  • the first insulating part has a certain arc, which can increase its stress level and ensure that the photoelectric module is not damaged during transportation;
  • the second insulation The part is in contact with the side wall of the groove part of the base to increase the contact area and improve the thermal conductivity;
  • the light-emitting surface of the LED chip 2201 faces the central axis of the lamp, which can effectively eliminate the dark area in the middle and improve the light-emitting effect of the lamp; 9)
  • the refractive index of the packaging layer of the LED lamp bead with a suitable refractive index as n1, the lamp cover material can effectively increase the luminous flux of the LED lamp; (10) By setting a refractive index matching layer on the surface of the LED chip or the inner
  • Fig. 1 is a schematic structural diagram of an embodiment of the LED lamp of the present application
  • Fig. 2 is a schematic diagram of an embodiment of Fig. 1 with the lampshade removed;
  • Fig. 3 is a first perspective schematic view of the photoelectric module of the LED lamp in an embodiment with the insulating unit removed;
  • FIG. 4 is a second perspective schematic diagram of the photoelectric module of the LED lamp in an embodiment with the insulating unit removed;
  • Fig. 5 is a first three-dimensional schematic diagram of the photoelectric module of the LED lamp in another embodiment with the insulating unit removed;
  • FIG. 6 is a second perspective schematic diagram of the photoelectric module of the LED lamp in another embodiment with the insulating unit removed;
  • Fig. 7 is a first three-dimensional schematic diagram of a photoelectric module of an LED lamp in an embodiment
  • Fig. 8 is a second three-dimensional schematic diagram of a photoelectric module of an LED lamp in an embodiment
  • FIG. 9 is a perspective schematic view of the first insulating part of the photoelectric module of the LED lamp in an embodiment
  • Fig. 10 is a schematic cross-sectional view of a photoelectric module of an LED lamp in an embodiment
  • Figure 11 is an enlarged view of C in Figure 10;
  • Fig. 12 is a perspective schematic view of a second insulating portion of a photoelectric module of an LED lamp in an embodiment
  • Figure 13 is a schematic diagram of the LED lamp in an embodiment with the lampshade removed;
  • FIG. 14 is a structural schematic diagram 1 of the photoelectric module of the LED lamp in an embodiment
  • 15 is a second structural diagram of the photoelectric module of the LED lamp in an embodiment
  • Fig. 16 is a schematic structural view of the A-A section in Fig. 14;
  • Figure 17 is a schematic structural view of the B-B section in Figure 14;
  • FIG. 18 is a schematic diagram of the structure of the photoelectric module of the LED lamp in an embodiment with the insulation unit removed;
  • 19 is a structural schematic diagram 1 of the photoelectric module of the LED lamp in an embodiment with the insulation unit removed;
  • 20 is a second structural diagram of the photoelectric module of the LED lamp in an embodiment with the insulation unit removed;
  • Figure 21 is a structural schematic diagram of the photoelectric module of the LED lamp in another embodiment with the insulating unit removed;
  • 22 is a second structural diagram of the photoelectric module of the LED lamp in another embodiment with the insulating unit removed;
  • FIG. 23 is a schematic diagram of the structure of the first insulating part of the LED lamp in an embodiment
  • 24 is a schematic diagram of the structure of the second insulating portion of the LED lamp in an embodiment
  • FIG. 25 is a schematic structural diagram of a photoelectric module of an LED lamp in an embodiment
  • Figure 26 is a perspective schematic view of the LED lamp in an embodiment with the lampshade removed;
  • Figure 27 is a perspective view of a lampshade in an embodiment
  • Figure 28 is an enlarged view of A in Figure 26;
  • Figure 29 is an enlarged view of B in Figure 26;
  • Figure 30 is a front view of the mounting part
  • Figure 31 is a first perspective view of the mounting part in an embodiment
  • Figure 32 is a second perspective view of the mounting part in an embodiment
  • Figure 33 is a three-dimensional schematic diagram of a photoelectric module of an LED lamp in an embodiment
  • Figure 34 is a perspective view of the LED lamp in an embodiment with the lampshade removed;
  • 35 is a schematic cross-sectional view of an LED lamp in an embodiment
  • Figure 36 is an enlarged view of B in Figure 35;
  • Fig. 37 is a perspective schematic diagram of the LED lamp in an embodiment with the lampshade removed;
  • Fig. 38 is a three-dimensional schematic diagram of the LED lamp in an embodiment with the lampshade removed;
  • Figure 39 is a perspective view of a mounting part in an embodiment
  • Fig. 40 is a perspective schematic diagram of the LED lamp in an embodiment with the lampshade removed;
  • Figure 41 is a perspective schematic view of the LED lamp in an embodiment with the lampshade removed;
  • Figure 42 is a perspective view of a base in an embodiment
  • Figure 43 is a three-dimensional schematic diagram of an LED lamp in an embodiment
  • Fig. 44 is a first three-dimensional schematic diagram of a photoelectric module of an LED lamp in an embodiment
  • FIG. 45 is a second three-dimensional schematic diagram of a photoelectric module of an LED lamp in an embodiment
  • Fig. 46 is a first perspective view of an LED lamp in an embodiment
  • Fig. 47 is a second three-dimensional schematic diagram of an LED lamp in an embodiment
  • Fig. 48 is a diagram of the interface through which the light emitted by the LED chip passes through in an embodiment.
  • vertical generally refers to an angle of 90 degrees relative to the reference line, but in this application, vertical refers to a situation within 80 degrees to 100 degrees.
  • usage conditions and usage status of the LED lamps mentioned in this application refer to the usage scenarios of the LED lamps hanging vertically with the lampshade. Other exceptions will be explained separately.
  • the LED lamp of the embodiment of the present application is, for example, a ceiling lamp installed on a ceiling.
  • the upper part of FIGS. 1 to 48 (the positive direction of the Z axis in FIG. 1) corresponds to the direction of the floor surface facing the ceiling.
  • the LED lamps shown in FIGS. 1 to 48 are suitable for the opposite posture in normal use.
  • the LED lamp includes a lampshade 1, a base 3 connected to the lampshade 1, and a photoelectric module 2 is provided in the containing space formed by the lampshade 1 and the base 3.
  • the LED lamp further includes a mounting portion 31, a hanger 4, and an adapter (or adapter) 5 arranged on the base 3, and the photoelectric module 2 is fixed on the base 3 through the mounting portion 31, The hanger 4 is connected with the adapter 5.
  • a buffer member 7 is provided between the LED lamp and the ceiling.
  • the buffer member 7 may be, for example, a sponge.
  • the optoelectronic module 2 includes a light source module 22 and a power supply module 23.
  • the power supply module 23 may include a storage battery unit ,
  • the afterglow module is stored in the battery unit, and the afterglow module automatically emits afterglow lighting to ensure safety.
  • the optoelectronic module 2 is configured as an integral structure and can be detachably fixed to the base 3. Therefore, when the optoelectronic module 2 is damaged, it can be replaced separately, compared to the entire lamp Replacement saves more cost.
  • the optoelectronic module 2 in this embodiment includes electronic components, and insulation units are provided outside the electronic components, so as to prevent the electronic components from being contacted when the optoelectronic module 2 is replaced.
  • the optoelectronic module 2 includes a circuit board 201.
  • the circuit board 201 can be a PCB single-sided board or a PCB double-sided board. At least some electronic components are arranged on the circuit board 201. Furthermore, all electronic components are arranged on the circuit board 201.
  • the electronic components include electronic components in the light source module 22 (such as LED lamp beads) and electronic components in the power module 23. In other words, the electronic components of the light source module 22 and the power module 23 are integrated on the same circuit board, saving cost and space.
  • the circuit board 201 includes a first surface 2011 and a second surface 2012 that are oppositely disposed, wherein the first surface 2011 is a surface facing the lampshade 1.
  • the electronic components of the light source module 22 are arranged on the first surface 2011, and the electronic components of the power module 23 can all be arranged on the first surface 2011. Therefore, the circuit board 201 only needs to be on the first surface 2011. 2011 layout of the wiring layer can save wiring costs.
  • FIGS. 3 to 6 the circuit board 201 only needs to be on the first surface 2011.
  • the electronic components of the light source module 22 are disposed on the first surface 2011, and the electronic components of the power module 23 are all disposed on the second surface 2012, so that the light source can be
  • the electronic components in the module 22 and the electronic components in the power module 23 are separately arranged.
  • the electronic components of the light source module 22 and the electronic components of the power module 23 may generate heat. Therefore, separate the two to avoid concentration of heat sources or mutual influence of heat generated during work.
  • the circuit layer can be arranged on the first surface 2011 and the second surface 2012 at the same time.
  • the electronic components in the light source module 22 are arranged on the first side 2011, some of the electronic components in the power module 23 are arranged on the first side 2011, and the electronic components in the other part of the power module 23 are arranged on the first side 2011. On the second side 2012.
  • the electronic components of the power module 23 are respectively arranged on the first side 2011 and the second side 2012, so that the electronic components in the power module 23 can be better arranged.
  • the electronic components of the power module 23 on the first side 2011 include relatively low-height components, such as IC (control circuit) and chip components (such as chip resistors). Therefore, the light emitted by the light source module 22 is not due to The blocking of obstacles reduces light loss and improves luminous efficiency.
  • the electronic components of the power module 23 located on the second side 2012 include components with relatively high height, such as transformers, capacitors, inductors, and so on.
  • the electronic components of the power module 23 on the first side 2011 include heating components (components that generate more heat during operation, such as ICs, resistors, etc.), and the electronic components of the power module 23 on the second side 2012 include
  • the heat-resistant components and the above heating components are respectively arranged on the first side 2011 and the second side 2012, which can reduce the influence of the heat generated by the heating components on the heat-resistant components , Improve the overall reliability and life of the power module 23.
  • the optoelectronic module 2 further includes an insulating unit.
  • the insulating unit includes a first insulating portion 202 and a second insulating portion 203.
  • the first insulating portion 202 is configured to be used when the light source module 22 is working. The generated light is transmitted through, and the first insulating portion 202 covers all the electronic components on the first surface 2011 to prevent accidentally touching the electronic components on the first surface 2011 and causing electric shock.
  • the second insulating part 203 covers all the electronic components on the second surface 2012.
  • the material of the second insulating part 203 can be selected from PC or acrylic. These two materials have the characteristics of lightness and low cost.
  • the electronic components on the second surface 2012 are located on the radial inner side of the circuit board 201 than the electronic components of any light source module 22, that is, the electronic components and the light source on the second surface 2012
  • the projections of the electronic components of the module 22 in the thickness direction of the circuit board 201 do not overlap.
  • it can prevent the heat generated by the electronic components of the light source module 22 from affecting the electronic components on the second surface 2012.
  • it can limit the distribution area of the electronic components on the second surface 2012, thereby controlling the second insulating portion 203 size to control costs.
  • the first insulating portion 202 in this embodiment includes a cavity 2021, and the circuit board 201 is accommodated in the cavity 2021.
  • the first insulating portion 202 has a side wall 2022, the side wall 2022 is provided with a first limiting portion 2023, one or more second limiting portions 2024 are provided in the cavity 2021 of the first insulating portion 202, and the circuit board 201 is installed in the first
  • the two sides in the thickness direction of the circuit board 201 are respectively limited by the first limiting portion 2023 and the second limiting portion 2024, that is, the circuit board 201 is sandwiched between the first limiting portion 2023 and the second limiting portion Between 2024 to complete the fix.
  • the circuit board 201 is not easy to shake after installation.
  • the first limiting portion 2023 may be a buckle
  • the second limiting portion 2024 may be a cylindrical body.
  • the second insulating portion 203 is provided with a first buckling unit 2031
  • the circuit board 201 is provided with a corresponding second buckling unit 2013, and the first buckling unit 2031 is buckled with the second buckling unit 2013 , Thereby fixing the second insulating portion 203 to the circuit board 201.
  • the first fastening unit 2031 may be a fastening part
  • the second fastening unit 2013 may be a fastening hole or a fastening part.
  • the second buckling unit 2013 can also be disposed on the first insulating portion 202 to fix the second insulating portion 203 and the first insulating portion 202.
  • the circuit board 201 and the first insulating portion 202 can be positioned relative to each other through a concave-convex structure, thereby restricting the first insulating portion 202 relative to the circuit board 201 in a horizontal direction (a direction parallel to the XY plane) In other words, there will be no displacement between the circuit board 201 and the first insulating part 202. Therefore, there will be no displacement between the light source module 22 and the first insulating part 202, which can prevent the light source module from being The light extraction efficiency decreases due to the displacement between the parts.
  • the basic structure of the LED lamp is the same as the previous embodiment.
  • the LED lamp includes a lampshade 1, a photoelectric module 2 and a base 3. The description is not repeated here. The difference is that this embodiment provides an insulating unit and a circuit board. Another fixed form of As shown in FIGS.
  • the power module 23 includes a first power module 231 (such as the aforementioned electronic components in the part of the power module 23 provided on the first surface 2011) and a second power module 232 (such as The aforementioned electronic components in a part of the power module 23 on the second surface 2012), the first power module 231 may be an SMT (surface mounting technology) component, and the second power module 232 may be a DIP (dual inline -pin package) components, such as DIP components including inductors, capacitors, etc.
  • a first buckle 25 is provided on the first insulating portion 202, and the first insulating portion 202 is buckled with the light source module 22 through the first buckle 25.
  • the second insulating portion 203 is provided with a second buckle 26, and the second insulating portion 203 is buckled and combined with the light source module 22 through the second buckle 26 to insulate and mechanically protect the power module 23.
  • the power module 23 There is a certain distance between the second insulating part 203 and the second insulating part 203, so as to provide a stress buffer for the second insulating part 203, so as to prevent the second insulating part 203 from damaging the power module when impacted by an external force.
  • the first insulating part 202 and/or the second insulating part 203 can be provided with reinforcing ribs 27.
  • the reinforcing ribs By providing the reinforcing ribs, the impact resistance of the first insulating part and/or the second insulating part can be increased to prevent the first insulating part and /Or the second insulating part is damaged.
  • the first insulating part and the second insulating part of the above-mentioned different structures can be combined with each other.
  • each LED chip group includes several LED chips 2201.
  • the LED chip groups are located on the same circle or roughly on the same circle, that is, the number of LED chip groups is the same as the number of circles, and the number of circles is set to n (n is greater than or equal to 1), and the pitch angle of the LED chip 2201 can be set as ( 90/n)°, so that the LED lamps can have a good light distribution and luminous efficiency.
  • Any two LED chip sets have different light-emitting spectra to make the brightness of the LED lamps uniform and improve the color rendering of the LED lamps.
  • two or more LED chip sets can have the same light-emitting spectra, so that the LED The lamp has a good luminous effect.
  • the average distance between the LED chips 2201 is smaller than the distance between the first insulating portion 202 and the LED chip 2201, which can reduce the uneven brightness in the circumferential direction of the first insulating portion and achieve more uniform brightness.
  • the center distance between two adjacent LED chips 2201 is L3, and any LED chip 2201 of any LED chip group 221 is connected to the adjacent LED chip group 221.
  • the center distance of the closest LED chip 2201 is L4, which conforms to the following relationship: L3:L4 is 1:0.8-2, preferably L3:L4 is 1:1-1.5. In this way, the distribution of the LED chips 2201 is more uniform, so as to achieve the goal of uniform light output.
  • two adjacent LED chips 2201 and the axis of the LED lamp form a central angle A1
  • two adjacent LED chips 2201 and the LED lamp axis The axis forms a central angle A2, and the angle of the central angle A2 is smaller than the angle of the central angle A1.
  • two adjacent LED chips 2201 and the axis of the LED lamp form a central angle A3, and the angle of the central angle A3 in the outer ring is smaller than the angle of the central angle A2 in the inner ring.
  • the outer ring therefore has more LED chips 2201 than the middle ring.
  • the distance between adjacent LED chips 2201 in the outer ring is not too much larger than the distance between adjacent LED chips 2201 in the middle ring. Moreover, the distance between the two can be close or equal, and therefore, the arrangement of the LED chips 2201 will be more uniform, so that the light output can be more uniform.
  • the LED chip group 221 has several groups, and each group is arranged on the circuit board 201 in the form of a ring. The two adjacent LED chips 2201 and LEDs of the LED chip group 221 on the inner side The angle of the central angle formed by the axis of the lamp is greater than the angle formed by the two adjacent LED chips 2201 of the LED chip group 221 that is relatively more outside and the axis of the LED lamp.
  • the LED chip group 221 on the outer side has more LED chips 2201 than the LED chip group 221 on the inner side, so that the distance between the two adjacent LED chips 2201 of the LED chip group 221 on the outer side is equal to The distance between two adjacent LED chips 2201 of the LED chip group 221 on the inner side is closer. Therefore, the arrangement of the LED chips 2201 will be more uniform, so that the light can be emitted more uniformly.
  • the LED chip group 221 is provided with at least two groups, and at least two groups of the LED chip group 221 are arranged sequentially in the radial direction of the circuit board 201, and each group of the LED chip group 221 includes at least one LED chip 2201.
  • any one of the LED chips 2201 of one group of LED chip groups 221 in the radial direction of the board 201 and any one of the LED chips 2201 of another group of LED chip groups 221 radially adjacent to the circuit board 201 are on the circuit board 201 They are arranged staggered in the radial direction, that is, between the LED chips 2201 of different LED chip groups 221, they are located in different directions in the radial direction of the LED lamp, that is, any one starts from the axis of the LED lamp and extends in the radial direction of the LED lamp. If the wire is cut to two or more LED chips 2201, it will be cut to different positions of the two or more LED chips 2201, that is, it will not be cut to the same position of two or more LED chips 2201.
  • the circuit board 201 is radially adjacent to two groups of LED chip groups 221, in which the open area 2202 between any two adjacent LED chips 2201 in one group of LED chip group 221 and any two of the other group of LED chip groups 221
  • the open areas 2202 between adjacent LED chips 2201 are staggered in the radial direction of the circuit board 201 and communicate with each other.
  • the air is in contact with the LED chip 2201 more fully on the circulation path, so that the heat dissipation effect is better.
  • the circuit board 201 is radially adjacent to two groups of LED chip groups 221, the open area 2202 between any two adjacent LED chips 2201 in one group of LED chip groups 221 and any two of the other group of LED chip groups 221
  • the open areas 2202 between the adjacent LED chips 2201 are in the same direction in the radial direction of the circuit board 201, so the air flows directly along the radial direction of the circuit board. In the circulation path, the air contacts the LED chip 2201. The reduction is not conducive to the heat dissipation of the LED chip 2201.
  • the LED chip group 221 is provided in three groups, and they are arranged in sequence along the radial direction of the circuit board 201, and any open area 2202 of the corresponding three groups of LED chip groups is not in the same direction in the radial direction of the circuit board 201. . In this way, the flow path of convection on the surface of the circuit board 201 is optimized, and the heat dissipation efficiency is improved.
  • each LED chip group 221 only includes LED chips 2201 of one light color, and the LED chips 2201 on each circumference can be staggered in the circumferential direction. This arrangement has good color mixing and uniform light.
  • the LED chip 2201 includes an LED chip and a light conversion layer, and the light conversion layer includes glue and phosphor, the LED chip on a circle can emit white light, such as warm white light, Daylight color light, etc., the LED chips on the circumference adjacent to the white light emit primary color light, such as red light, green light, blue light, etc.
  • the first insulating portion 202 corresponds to the white light and the primary color light.
  • the diffusion part, the second diffusion part, the thickness of the first diffusion part in the optical axis direction of the LED chip 2201 is smaller than the thickness in other directions except the optical axis direction of the LED chip 2201, and the white light emitted by the LED chip is first
  • the diffuser is uniformly diffused, and the second diffuser has a uniform thickness.
  • the primary color light emitted by the LED chip is emitted with the same light distribution through the second diffuser without being diffused, thus adjusting the color temperature contrast on different circles to reproduce sky blue Color, provide proper lighting space according to the life scene.
  • the LED chip 2201 may be provided with a lens.
  • there are three LED chip groups on the circuit board 201 which are respectively located on a first circle, a second circle, and a third circle with a concentric center and different radii.
  • the LED chip 2201 on the second circumference covers the tubular lens, and each LED chip 2201 on the third circumference covers a single lens, which can make the illumination of the LED lamp uniform.
  • a part of the LED chip set may be irradiated toward the central part of the LED lamp, and a part of the LED chip set may be irradiated away from the circuit board 201 to prevent dark parts from appearing in the central part of the LED lamp.
  • the circuit board 201 is provided with two sets of LED chips 221.
  • the two LED chip sets are arranged on two concentric circles with different radii.
  • the first LED chip set is arranged on a circle
  • the second LED chip set is arranged on a circle.
  • the LED chip group is arranged on another circumference, and the areas corresponding to the first LED chip group and the second LED chip group on the first insulating portion 202 are respectively provided with a first absorption area and a second absorption area.
  • the wavelength absorption of the first absorption zone is greater than that of the second absorption zone, which can improve the color rendering and color temperature of the lamp and reduce the color deviation
  • the light source module 22 may further include a lens unit, which covers the circuit board 201.
  • the lens unit can be arranged in various forms.
  • the circuit board 201 is provided with multiple sets of LED chips.
  • a night light is provided between the adjacent LED chip sets.
  • the lens unit includes a lens body covering the LED chip set and a communicating part that communicates with the adjacent lens body and covers the night light.
  • the light-emitting surface of the lens body can be set to a curved surface to make the night light The emitted light diffuses to the center and outside of the LED lamp to achieve uniform illumination;
  • the lens unit has two ridges, and a night light is arranged between the two ridges.
  • the night light is used as a point light source with relative directivity.
  • the lens unit can be provided with protrusions, so that the light emitted by the LED chip 2201 on the circuit board 201 is mainly diffused and emitted in the radial direction with the circuit board 201 as the origin, thereby inhibiting the light source module 22 from lighting When there is a grainy feeling;
  • the circuit board 201 is provided with multiple sets of LED chip sets, the number of lens units is greater than 2, and there are avoiding parts between the lens units, the circuit board 201 has holes, and the LED chip sets are arranged around the holes to avoid The part has a concave part facing the hole to prevent the first insulating part 202 from light interference;
  • the lens unit has a storage concave part aligned with the LED chip 2201 to accommodate the LED chip 2201, and the lens unit has an incident surface and an opposite projection surface , The diffusivity in the projection surface and incident surface area close to the optical axis of the LED chip 2201 is set higher than the diffusivity in other areas, the brightness distribution of
  • the surface includes a light control surface.
  • the light control surface distributes the light emitted from the LED chip 2201 at a large angle.
  • the lens unit includes a plurality of lenses, and each lens covers each LED chip 2201, that is, the number of lenses is equal to the number of LED chips 2201, and the first insulating portion 202 is transparent
  • the lens cover makes the light of the LED chip 2201 emit toward the center of the lamp, and can set the peak angle of the light distribution of the lens, thereby improving the uniformity
  • the lens unit has a concave portion for the light emitted by the LED chip 2201 to enter and
  • the LED accommodating part prevents the LED chip from contacting the recessed part by accommodating the LED chip, and the LED accommodating part and the recessed part are smoothly continuous by a convex curved surface protruding from the LED chip
  • the lens unit includes a first light distribution Area and second light distribution area, the first light distribution area has a first outer surface, the second light distribution area has a second outer surface, the first outer surface reflects light inward in the optical axis direction of the LED chip 2201, and the second The outer surface is relative to the LED
  • the circuit board 201 can also take other different forms.
  • the circuit board 201 can include multiple sub-circuit boards, and the sub-circuit boards can be configured in a variety of different structures.
  • the board has a certain inclination angle relative to the base 3; in one embodiment, any sub-circuit board has an inner area where the LED chip 2201 is not placed and an outer area where the LED chip 2201 is placed.
  • the LED chips 2201 close to the inner area have a small distance and are far away
  • the distance between the LED chips 2201 in the inner area is large, so that the LED lamps can emit light uniformly;
  • the sub-circuit boards are arranged in a circumferential direction, and each sub-circuit board is provided with LED chips 2201 of different colors, and adjacent sub-circuits
  • the light color of the LED chip 2201 closest to the board is different, the distance between adjacent LED chips 2201 in the sub-circuit board is equal to the shortest distance between the LED chips 2201 located on the adjacent sub-circuit boards, and the LED chips 2201 of different light colors
  • the arrangement of the light-emitting surface can achieve uniform light emission; in one embodiment, adjacent sub-circuit boards are connected through the connecting portion, and the protrusion of one sub-circuit board is accommodated in the receiving portion of the adjacent sub-circuit board, from the LED chip 2201
  • the emitted light easily diffuses in the direction orthogonal to the extension direction of the LED chip 2201, which
  • the circuit board 201 can also take other different forms.
  • the circuit board 201 includes an inner area provided with a power supply module 23 and an outer area provided with a light source module 22, and the outer areas alternately adjoin each other.
  • the average distance from the multiple LED chips 2201 configured in the first block to the center of the circuit board 201 is greater than the distance from the multiple LED chips configured in the second block.
  • the average value of the distances between the plurality of LED chips 2201 and the center of the circuit board 201 can suppress the light emitted from the LED chips 2201 arranged in the first area located far from the center of the circuit board 201 from being disposed in the inner area.
  • the second insulating portion 203 covering the power module is blocked, which can ensure the uniform brightness of the light exit surface of the lampshade.
  • the circuit board 201 can also take other different forms.
  • the second surface 2012 of the circuit board 201 includes a third area 2014b for placing the power module 23 and a There is a fourth area 2015b of the power module 23.
  • the first surface 2011 includes a first area 2014a opposite to the third area 2014b, a second area 2015a opposite to the fourth area 2015b, and an LED chip 2201 located in the first area 2014a
  • the number is smaller than the number of LED chips 2201 located in the second area 2015a, so that on the one hand, the dark area in the middle of the LED lamp is significantly reduced, and the luminous effect of the LED lamp is improved. On the other hand, it can reduce the heat generated by the power module 23 on the light source module Group 22 influence.
  • the third area 2014b is close to the central axis of the LED lamp, and the fourth area 2015b is far away from the central axis of the LED lamp (compared to the third area 2014b), because the power module 23 is disposed close to the center of the LED lamp.
  • the amplitude of the external force received by the optoelectronic module 2 is small, and the power module 23 will not be damaged by the external force.
  • the circuit board 201 can also take other different forms. As shown in FIGS. 21 and 22, the second side 2012 of the circuit board 201 includes a seventh area 2016b and an eighth area 2017b.
  • Electronic components include heating components (components that generate more heat during operation, such as ICs, resistors, etc.) and non-heat-resistant components (referring to components that easily change their working ability due to heat, such as electrolytic capacitors).
  • the heating elements are located in the seventh area 2016b and the eighth area 2017b, which can reduce the influence of heat generated by the heating element on the heat-resistant elements, and improve the overall reliability and life of the power module 23.
  • the first side 2011 includes In the fifth area 2016a opposite to the seventh area 2016b and the sixth area 2017a opposite to the eighth area 2017b, the number of LED chips 2201 located in the fifth area 2016a is less than the number of LED chips 2201 located in the sixth area 2017b, thereby The influence of the heat generated by the power module 23 on the light source module 22 is reduced.
  • the circuit board 201 can also take other different forms.
  • the circuit board 201 includes an inner area where the power module 23 is disposed and an outer area where the light source module 22 is disposed.
  • the circuit board 201 can also take other different forms.
  • the optoelectronic module 2 includes a night light.
  • the circuit board 201 includes a first area where the night light is configured and a second area where the LED chip 2201 is configured. The first area is close to On the central axis of the LED lamp, a slit is formed between the night light and the LED chip 2201 to ensure the insulation distance between the night light and the LED chip, and prevent short circuit caused by the potential difference between the night light and the LED chip 2201.
  • the circuit board 201 can also take other different forms.
  • the circuit board 201 is provided with an optical member for controlling the light distribution of the light emitted from the LED chip 2201, and the optical member has a dome-shaped incident surface, an emission surface, and In the medium part between the two positions, the ratio of the distance r of the LED chip 2201 from the incident surface in the optical axis direction to the distance d of the LED chip 2201 from the incident surface in the peripheral direction is r/d ⁇ 1, which can be adjusted by adjusting r, d Generate the corresponding light space according to the life scene.
  • the first insulating portion 202 has a certain curvature from the center of the light source module 22 along the radial direction of the light source module 22 to the edge, or the first insulating portion 202 extends from one end of the light source module 22 along the light source.
  • the radial direction of the module 22 to the other end of the light source module 22 has a certain arc, and the central angle corresponding to the arc is 2°-50°, preferably 5°-15°.
  • the first insulating portion 202 includes a transparent substrate and a light-transmitting light diffusion layer, the transparent substrate is close to the circuit board 201, and a decorative layer forming a predetermined pattern is provided between the transparent substrate and the light diffusion layer. The light passing through the decorative layer will not be scattered by the light diffusion layer, so when viewing the LED lamp from the floor side, you can see a pattern with clear outlines, which can enhance the lighting effect.
  • a plurality of first holes 2032 are provided on the second insulating portion 203, and a space for accommodating electronic components is formed between the second insulating portion 203 and the circuit board 201.
  • the arrangement of the first hole 2032 facilitates the air convection in the space for accommodating the electronic components, so that at least a part of the heat generated during the operation of these electronic components is discharged through the first hole 2032, which enhances the heat dissipation of the electronic components effect.
  • the second insulating portion 203 can take other different forms.
  • the second insulating portion 203 can be composed of multiple blocks, with overlapping areas between the blocks, and the distance from the overlapping area to the base 3 is smaller than the second insulating portion
  • the distance between other parts of 203 (other areas except the overlapping area) and the base 3 prevents the second insulating part from contacting the power module 23, increases the heat dissipation path, and improves the heat dissipation effect.
  • the first insulating portion 202 can take other different forms.
  • the first insulating portion 202 includes a central area and an end area.
  • the central area is close to the central axis of the LED lamp, and the end area is away from the central axis of the LED lamp.
  • the end area is provided with a light guide reflector that guides the light emitted by the light source module 22 from the central area to the end area to increase the illumination range of the lamp.
  • the first insulating portion 202 can take other different forms.
  • the first insulating portion 202 has an inner area, an outer area, and an intermediate area between the inner area and the outer area.
  • the inner area is close to the central axis of the LED lamp.
  • the inner zone has a first thick part thicker than the middle zone, and the first thick part can provide a lens effect, so that the central part of the lamp is bright and light loss is small.
  • the first insulating portion 202 may take other different forms.
  • the surface of the first insulating portion 202 may have a plurality of prisms, and each prism has a first prism surface with a different inclination angle with respect to the circuit board 201.
  • On the second prism surface the light emitted from the LED chip is incident on the first prism surface and the second prism surface to be refracted, which can suppress the discomfort caused by glare.
  • the first insulating portion 202 can take other different forms.
  • the first insulating portion 202 has a light transmitting portion with high light transmittance and a lens portion with low light transmittance, and the light transmitting portion surrounds the lens portion and is away from the LED.
  • the central axis of the lamp can make the illumination of the lampshade uniform and the light output rate of the lamp is high.
  • the first insulating portion 202 is provided with a lens, which can control the radial and circumferential light distribution of the first insulating portion, suppress the uneven brightness of the lamp in the circumferential direction, and ensure the radial light distribution.
  • the first insulating portion 202 can take other different forms.
  • the optoelectronic module 2 includes a night light, which is arranged on the circumference closest to the central axis of the LED lamp, and the night light is provided with a transparent pattern.
  • the mask can ensure the luminous efficiency of the lamp and improve the design of the light.
  • the lampshade 1 may produce bright lines.
  • a diffuser is provided outside the night light for diffusion.
  • the area where the insulating portion 202 covers the night light and the light source module 22 is a uniform surface without unevenness, so no bright lines are generated.
  • the first insulating portion 202 and the second insulating portion 203 can take other different forms, as shown in FIGS. 23 and 24.
  • the first insulating portion 202 is provided with a lens group 212,
  • the lens group 212 is arranged corresponding to the LED chip group 221, that is, the lens group 212 is located above the LED chip group 221, so that the light distribution is more dispersed and uniform; the lens group 212 is formed at one time through the injection molding process, which reduces production compared with installing the lens separately.
  • the first insulating portion 202 is provided with multiple sets of heat dissipation holes
  • the heat dissipation holes group includes a plurality of heat dissipation holes 211, of which at least one set of heat dissipation holes is close to the LED chip set 221, so that the heat of the circuit board 201 can be quickly dissipated, extremely Greatly increase the heat dissipation effect.
  • the second insulating part 203 can also be provided with a heat dissipation hole 211 to further reduce the temperature of the power module 23 and increase the service life of the lamp.
  • the second insulating part 203 is provided with a plurality of auxiliary parts 2033, and the plurality of auxiliary parts 2033 are formed Circumferential distribution, of course, other distribution methods can also be used.
  • the auxiliary portion 2033 can increase the connection strength between the insulating unit and the circuit board 201, and can also increase the heat dissipation area of the second insulating portion 203 to improve heat radiation.
  • the heat dissipation hole 211 may be arranged in the middle of the first insulating portion 202, and in addition, a plurality of spaced recesses are provided on the outer edge of the first insulating portion 202, so that air can flow between the circuit board 201 and the first insulating portion 202. Convection between an insulating part 202 improves the heat dissipation effect.
  • FIG. 25 is a schematic structural diagram of another embodiment of the optoelectronic module 2b.
  • the optoelectronic module 2b includes a light source module 22 and a power supply module 23, and a reflector is provided between the light source module 22 and the power supply module 23
  • the LED light source module 22 surrounds the reflector 29.
  • the light source module 22 includes a circuit board 201 and at least one set of LED chip groups 221 on the circuit board 201.
  • Each LED chip group 221 includes a plurality of LED chips. 2201.
  • the light-emitting surface of the LED chip 2201 faces the central axis of the lamp, which can effectively eliminate the dark area in the middle and improve the light-emitting effect of the lamp. Referring to Fig.
  • the outer surface of the LED chip 2201 can be isolated from the external environment through a colloid (such as silica gel) to avoid the risk of electric shock.
  • a glue layer of uniform thickness is coated on the entire circuit board 201.
  • the LED light source module 22 further includes a heat sink 223.
  • the heat sink 223 may be an aluminum ring, a copper ring, etc.
  • the circuit board 201 is attached to the heat sink 223.
  • the surface of the circuit board 201 is provided with heat dissipation ribs (not marked in the figure) to increase the heat dissipation area, and the heat dissipation ribs and the circuit board 201 are located on two opposite surfaces of the heat dissipation member 223.
  • the following methods can be used to prepare the LED light source module 22:
  • the dispensing head is aligned with the circuit board 201, the turntable rotates to start dispensing, and the turntable stops rotating after the dispensing is completed;
  • the LED chip 2201 is pasted on the circuit board 201 to obtain the LED light source module 22.
  • the above preparation method has simple operation and low equipment cost, which can effectively improve production efficiency and reduce production cost.
  • the outer edge of the first insulating portion 202 is provided with a first protruding portion 2101, and the first protruding portion 2101 protrudes relative to the outer edge of the first insulating portion 202.
  • the first insulating portion 202 may be configured as a revolving body structure, and the first protruding portion 2101 may be provided in multiple along the circumference of the first insulating portion 202 at the outer edge of the first insulating portion 202.
  • a mounting portion 31 is provided on the base 3, and the mounting portion 31 provides for mounting the first protrusion 2101.
  • the installation portion 31 has a first installation portion 315, and the first installation portion 315 has a first slot 3111.
  • the first insulating portion 202 has a fixed position and a loose position. In the fixed position, the first protrusion 2101 is locked into the first slot 3111 to be fixed, and in the relaxed position, the first protrusion 2101 and The first slot 3111 is separated. In this embodiment, the first insulating portion 202 is switched between the fixed position and the relaxed position in a rotating form (roughly rotating around the axis of the LED lamp). In this embodiment, the two sides of the first slot 3111 in the axial direction of the LED lamp are closed by the first mounting portion 315 and the base 3. Therefore, when the first protrusion 2101 is inserted into the first slot 3111, , The first protrusion 2101 is limited in position on both sides in the thickness direction of the LED lamp.
  • the two sides of the first slot 3111 in the axial direction of the LED lamp are closed by the structure of the first mounting portion 315 to achieve the same effect as described above.
  • the first mounting portion 315 has a positioning unit to position the first protrusion 2101 that is inserted into the first slot 3111.
  • the positioning unit includes a first elastic arm 3112.
  • a first groove 3113 is formed between the first elastic arm 3112 and the first mounting portion 315. In the fixed position, the first protruding portion 2101 is in the LED lamp The radial end is clamped into the first groove 3113 to realize the positioning and fixing of the first insulating portion 202.
  • a first blocking portion 31121 is formed on the first elastic arm 3112.
  • the first elastic arm 3112 when the first protruding portion 2101 needs to escape from the first slot 3111 to rotate the first insulating portion 202, it is necessary to overcome the obstruction of the first blocking portion 31121 (that is, it is necessary to apply force to the An insulating portion 202, so that the first protruding portion 2101 squeezes the first elastic arm 3112 to release it), which can prevent the first insulating portion 202 from being removed from the first slot due to misoperation or collision. 3111 loosened.
  • the first elastic arm 3112 in the fixed position, can apply force to the first protruding portion 2101 to further secure the first insulating portion 202.
  • the first elastic arm 3112 can be integrally formed on the first mounting portion 315.
  • the first elastic arm 3112 may be a sheet-like structure, which is elastic due to its own material properties (a material with elasticity in the prior art, such as plastic or metal, may be used).
  • the first blocking portion 31121 can be directly formed by bending the first elastic arm 3112 (or setting the bending on the first elastic arm 3112).
  • first mounting portion 315 and the second mounting portion 316 are integral components, and the first slot 3111 and the second slot 3114 are respectively located on opposite sides of the member.
  • first mounting portion 315 and the second mounting portion 316 may also be of a separate structure (not shown).
  • the optoelectronic module 2 can also be connected to the base 3 with other structures. As shown in FIGS. 2 and 33, in some embodiments, the optoelectronic module 2 is fixed to the base 3 by a magnetic connection (in this embodiment, the other basic structures are the same as the previous embodiment). Specifically, the first insulating portion 202 of the optoelectronic module 2 has a first protruding portion 2101, a magnet 2102 is provided on the first protruding portion 2101, and the base 3 includes a part or component made of iron. Therefore, the magnet 2102 can be used to It is directly attached to the base 3 to complete the fixation.
  • the magnets can also be arranged in different positions, such as arranged on the light source module 22, the power module 23 or the second insulating part 203, which will not be repeated here.
  • the optoelectronic module 2 can also be connected to the base 3 in a screw-fixed manner (in this embodiment, the other basic structures are the same as the previous embodiment).
  • the first insulating portion 202 of the optoelectronic module 2 has a first protruding portion 2101, and a bolt 2103 is provided on the first protruding portion 2101, and the bolt 2103 is connected to the base 3 to complete the fixation of the optoelectronic module 2.
  • the bolts may also be arranged in different positions, such as arranged on the light source module 22, the power module 23 or the second insulating part, which will not be repeated here.
  • the optoelectronic module 2 can also be connected to the base 3 by other screw fixing methods.
  • the base 3 is provided with a plurality of through holes 3201a, and the through holes 3201a may be located on a circle.
  • the first insulating portion 202 of the optoelectronic module 2 is provided with a threaded hole, and the screw passes through the through hole to the threaded hole, thereby fixing the optoelectronic module 2 on the base.
  • the base 3 is provided with a plurality of through holes 3201b.
  • the through holes 3201b may be located on a circle.
  • a stud 3202 is placed in the through hole 3201b, so that the stud 3202 is press-rivetted on the base 3.
  • the first insulating portion 202 of the optoelectronic module 2 is provided with a screw hole 3203, and the screw passes through the screw hole 3203 to the stud 3202, thereby fixing the optoelectronic module 2 on the base 3.
  • the basic structure of the LED lamp shown in Fig. 38 is the same as that of the lamp (ceiling lamp) of the previous embodiment. The difference is the specific fixing method of the photoelectric module 2 and the base 3. Specifically, as shown in Figs. 38 and 39, the base 3 A mounting portion 31 is provided on the mounting portion 31.
  • the mounting portion 31 includes a fixed portion 314 and an inclined portion 317 connected to the fixed portion 314.
  • the fixed portion 314 includes an upper limit portion 3141, a lower limit portion 3142 disposed opposite to the upper limit portion 3141, and a lower limit portion 3142 is connected to the inclined portion 317, a connecting portion 3143 is provided between the upper limit portion 3141 and the lower limit portion 3142, the connecting portion 3143 is connected with a positioning portion 313, and the position of the positioning portion 313 is opposite to the inclined portion 317.
  • a part of the corners of the optoelectronic module 2 slides into the lower limit portion 3142 along the inclined portion 317 and is held in a fixed state by the positioning portion 313.
  • the surface of the upper limit portion 3141 contacts a part of the surface of the optoelectronic module 2.
  • the spatial position of the mounting portion 31 is located in the Cartesian coordinate system (X, Y, Z) shown in FIG. 39, the XY plane is parallel to the upper surface of the lower limit portion 3142, and the angle between the inclined portion 317 and the XY plane is ⁇ ,
  • the range of the included angle ⁇ is 0 ⁇ 20°, preferably 5° ⁇ 15°;
  • the included angle between the positioning portion 313 and the XZ plane is ⁇ , and the range of the included angle ⁇ is 10° ⁇ 50°, preferably 20 ° ⁇ 40°, by adjusting ⁇
  • the light source module 22 can be fixed in the mounting part 31.
  • the positioning part 313 is provided with an elastic plate 3131.
  • the range of the angle ⁇ between the elastic plate 3131 and the XZ direction is 28° ⁇ 68°, preferably 38° ⁇ 58°.
  • the optoelectronic module 2 can be slid out from the fixed part, and the design of ⁇ allows the user to easily replace the optoelectronic module 2 to improve work efficiency.
  • Set the maximum length of the position portion 313 in the Z-axis direction as L1.
  • the minimum length of the photoelectric module 2 in the Z-axis direction is L2
  • the sum of L1 and L2 is greater than
  • the distance D from the upper limit portion 3141 to the lower limit portion 3142 makes the fixing effect of the photoelectric module better.
  • an LED lamp is provided.
  • the basic structure of the LED lamp is the same as the lamp (ceiling lamp) of the previous embodiment.
  • the difference is the specific fixing method of the photoelectric module 2 and the base 3.
  • the optoelectronic module 2 in this embodiment is provided with mounting holes 28.
  • the mounting holes 28 can be located at both ends of the optoelectronic module 2, and the base 3 is provided with mounting portions 31 and mounting holes.
  • the number of 28 is the same as the number of mounting parts 31.
  • the mounting part 31 includes a support part 311 and a fastener part 312 fixed on the support part 311.
  • the fastener part 312 includes a telescopic part 3121 and a limit part 3122. , Align the mounting hole 28 on the optoelectronic module 2 with the fastener portion 312, and then apply force to the optoelectronic module 2, so that the retractable portion 3121 is compressed into the mounting hole 28 of the optoelectronic module 2, and then the optoelectronic module 2 It is locked into the gap between the telescopic part 3121 and the limiting part 3122.
  • the height of the mounting hole 28 is not less than the minimum distance between the telescopic portion 3121 and the limiting portion 3122.
  • the height of the mounting hole 28 is equal to the minimum distance between the telescopic portion 3121 and the limiting portion 3122.
  • this installation method is simple to operate, convenient for users to install, improve work efficiency, and has good fixing effects, low production costs, and is suitable for industrialization.
  • the mounting part 31 further includes a second mounting part 316, which has been provided for fixing the lampshade 1.
  • the lampshade 1 has a wall 11, and the lampshade 1 can be configured as a revolving structure.
  • the wall portion 11 has an edge, and the edge of the wall portion 11 is provided with a second protruding portion 1101.
  • the second protruding portion 1101 faces the radial inner side of the lampshade 1 relative to the edge of the wall portion 11.
  • a plurality of second protrusions 1101 may be provided along the circumferential direction of the lampshade 1.
  • the second installation portion 316 has a second slot 3114.
  • the second protruding portion 1101 is locked into the second slot 3114 and fixed.
  • the lampshade 1 rotates (roughly rotates around the axis of the LED lamp) to lock the second protrusion 1101 into the second slot 3114 or loosen from the second slot 3114.
  • the two sides of the second slot 3114 in the axial direction of the LED lamp are closed by the second mounting portion 316 and the base 3. Therefore, when the second protruding portion 1101 is locked into the second slot 3114 , The second protrusion 1101 is restricted in position on both sides in the thickness direction of the LED lamp.
  • the two sides of the second slot 3114 in the axial direction of the LED lamp are closed by the structure of the second mounting portion 316, so as to achieve the same effect as described above.
  • the second mounting portion 316 has a positioning unit to position the second protrusion 1101 that is inserted into the second slot 3114.
  • the positioning unit includes a second elastic arm 3115.
  • a second groove 3116 is formed between the second elastic arm 3115 and the second mounting portion 316. In the fixed position, the second protruding portion 1101 is in the LED lamp. The radial end is clamped into the second groove 3116 to realize the positioning and fixing of the lampshade 1.
  • a second blocking portion 31151 is formed on the second elastic arm 3115.
  • the second elastic arm 3115 when the second protrusion 1101 needs to be detached from the second slot 3114 to rotate the lampshade 1, the obstruction of the second blocking portion 31151 needs to be overcome first (that is, the lampshade 1 needs to be forced to The second protruding portion 1101 squeezes the second elastic arm 3115 to release it), so as to prevent the lamp cover 1 from being released from the second slot 3114 due to misoperation or collision.
  • the second elastic arm 3115 when the lampshade 1 is fixed, the second elastic arm 3115 can exert a force on the second protruding portion 1101 to further tighten the lampshade 1.
  • the second elastic arm 3115 can be integrally formed on the second mounting portion 316.
  • the second elastic arm 3115 may be a sheet-like structure, which is elastic due to its own material properties (a material with elasticity in the prior art, such as plastic or metal, may be used).
  • the second blocking portion 31151 can be directly formed by bending the second elastic arm 3115 (or setting the second elastic arm 3115 to bend).
  • the lampshade 1 in the present application can adopt different structures. See FIGS. 1 to 48.
  • the lampshade 1 has a smooth curved surface to prevent the difference in refractive index of the cross-section of the lampshade 1 from causing uneven light distribution.
  • the lampshade 1 includes a central part and a peripheral part surrounding the central part.
  • the lampshade 1 has a light diffusion layer which contains light diffusion particles. The density of the light diffusion particles in the central part is greater than the density of the light diffusion particles in the peripheral part. , In order to make the brightness of the center and the periphery of the lamp uniform.
  • the lampshade 1 has a plurality of diffusion areas, one of which overlaps the photoelectric module 2 in the Z-axis direction, which can improve the flash of the lamp.
  • the inner surface or outer surface of the lampshade 1 may be provided with a brightness enhancement film to distribute the light energy of the light emitted by the light source module 2, so as to achieve uniform light output from the LED lamp and avoid glare.
  • the inner surface and the outer surface are relative positions, and the inner surface of the lampshade 1 is the surface close to the photoelectric module 2.
  • the lampshade 1 is provided with a through hole, and the mounting screws used to mount the lampshade 1 to the base 3 are inserted into the through hole of the lampshade 1 with clearance, and are screwed to the base 3, so that the lampshade And the base expands or contracts due to the temperature change caused by the opening and closing of the lamp, and the stress caused by the expansion or contraction can also be reduced through the clearance, which can prevent the lampshade and the appliance from cracking or generating noise.
  • a light guide plate may be provided between the lampshade 1 and the first insulating portion 202.
  • the light guide plate is, for example, a transparent acrylic resin molded body.
  • the light guide plate may adopt different structures.
  • the end of the light guide plate The luminous intensity (the end close to the edge of the base 3) is the luminous intensity at an angle corresponding to 30% of the luminous intensity (maximum luminous intensity) in the main luminous direction of the LED chip 2201; in one embodiment, the light guide plate covers the circuit board 201, and the light guide plate It has an asymmetric first curved part and a second curved part.
  • the surface of the light guide plate can be formed A dot-shaped scatterer to achieve uniform light emission on the light-emitting surface;
  • the light guide plate includes a main light portion that guides the light emitted from the LED chip 2201 to the outer periphery of the light guide plate and guides and diverges the light from the LED chip 2201 toward the central part of the lamp Auxiliary light guide portion of light;
  • the light guide plate includes an introduction unit that introduces light into the interior of the lamp and an exit unit that guides the light to the outside of the lamp, which can suppress uneven brightness and glare of the light guide plate; in one embodiment
  • the light guide plate has an inner side surface and a corresponding outer side surface.
  • the radius of curvature of the inner side surface is greater than the radius of curvature of the outer side surface, which can prevent bright spots from appearing on the lampshade 1.
  • multiple groups of LEDs are provided on the circuit board 201
  • the chip set 221, the LED chip set 221 includes a plurality of LED chips 2201, the light-emitting surface of the LED chip 2201 faces the incident end surface of the light guide plate, and the plurality of LED chip sets 221 are arranged linearly in the length direction of the circuit board 201.
  • the first LED chip group, the second LED chip group, and the third LED chip group are linearly mounted on the end edge of the longitudinal direction of 201 toward the center line.
  • the first LED chip group is set between the end edge of the circuit board 201 and the first LED chip group.
  • the light guide plate has a light-transmitting substrate, and the main surface of the light-transmitting substrate is provided with a plurality of concave prism parts, and the concave prism parts are covered with a coating to prevent Dust accumulates in the main surface and the prism, and the thickness of the coating is small enough to prevent the optical performance of the light guide plate from degrading.
  • the arrangement of the above-mentioned light guide plate can be combined with the situation that the arrangement of the LED chips on the circuit board is not mutually exclusive.
  • the circuit board 201 is ring-shaped, such as the circuit board 201 of the optoelectronic module 2b in the foregoing embodiment.
  • a light guide plate may be provided between the lampshade 1 and the first insulating portion 202, and the light-emitting surface of the LED chip 2201 faces In the center of the lamp, the light guide plate can adopt different structures.
  • the thickness of the light guide plate is inclined, and its thickness gradually decreases from the outer periphery to the center, so that the brightness of the light guide plate is uniform; in one embodiment, the circuit board 201 There are a first LED chip group and a second LED chip group.
  • the first LED chip group is incident from the incident end surface of the first light guide plate
  • the second LED chip group is incident from the second light guide plate.
  • the upper surface and the lower surface of the light plate and the second light guide plate emit light.
  • the first light guide plate and the second light guide plate have translucency along their thickness direction, so that the lamp has a three-dimensional light-emitting effect; in one embodiment, the ring circuit board 201
  • the upper cover sequentially covers the reflection cover, the light guide plate and the light collection cover.
  • the convex part of the light guide plate is inserted into the concave part of the reflection cover.
  • the light collection cover has a lens area covering the exit surface of the light guide plate.
  • the lens area and the light guide plate are concave.
  • the incoming reflector is located at an optically opposite position, so that the light emitted by the lamp has a narrow orientation.
  • FIG. 42 is a schematic structural diagram of an embodiment of the base of the LED lamp of the present application.
  • the base 3 is located in a spatial rectangular coordinate system (X, Y, Z), where the Z axis Parallel to the central axis of the LED lamp, the base 3 is disc-shaped, for example made of aluminum or steel plate, as shown in Figures 42 and 43, a hole 33 is formed in the central part of the base 3, and a support is formed around the hole 33 There is a gap between the support portion 34 and the edge portion 35. The gap extends along the negative direction of the Z axis to form a groove portion 36.
  • the support portion 34 and the edge portion 35 are at the same position in the positive direction of the Z axis.
  • the support portion 34 and the edge portion 35 are at different positions in the positive direction of the Z axis.
  • the height of the support portion 34 in the positive direction of the Z axis is greater than that of the edge portion 35.
  • the optoelectronic module 2 has an upper surface and a lower surface opposite to the upper surface. The lower surface of the optoelectronic module 2 is far away from the lampshade 1, and the lower surface of the lampshade 1 is in surface contact with the support part 34, thereby passing the heat generated by the optoelectronic module The base is passed out to improve the heat dissipation speed.
  • the optoelectronic module 2 and the supporting portion 34 are not in a completely bonded surface contact state.
  • thermal conductive adhesive layer can be filled in the gap.
  • the heat generated by the chip 2201 during operation can be quickly delivered to the base 3 through the circuit board 201 and the thermal conductive adhesive layer, which improves the heat dissipation capacity.
  • a brightness sensor may be provided on the base 3, and the installation position of the brightness sensor is set at a position where there is no direct light from the lamp, and the lighting conditions of the lamp are continuously adjusted according to the increase in brightness caused by external light to achieve Energy saving and environmental load reduction, while appropriately suppressing excessive power consumption.
  • reinforcing ribs are provided on the base 3 to increase the strength of the base and reduce the thickness of the base.
  • the user usually sets the time to wake up the user through the remote control.
  • the electronic sound of the buzzer is generally used to remind the user, but the buzzer is generally configured on both sides.
  • the sound generating component needs to be installed on the side of the circuit board close to the ceiling. Due to the blockage of the circuit board, the sound generated by the sound generating component has a low volume when it reaches the user.
  • the base 3 is provided with an opposing portion facing the circuit board 201
  • the circuit board 201 is provided with an opening corresponding to the opposing portion
  • the sound generating element is mounted on a surface on a different side from the LED chip 2201
  • the sound is reflected by the opposite part and then propagated through the opening, ensuring that the user can obtain the desired volume.
  • FIG. 44 is a schematic structural diagram of an embodiment of the optoelectronic module of the present application.
  • the optoelectronic module 2 is provided with a power module 23 at a position relative to the groove portion 36, and the power module 23 includes a first A power module 231 and a second power module 232.
  • the height of the second power module 232 in the positive Z-axis direction is greater than the height of the LED chip 2201.
  • the second power module 232 is located in the groove of the base In the portion 36, the second insulating portion 203 is preferably in contact with the side wall of the groove portion 36 to increase the contact area and improve the thermal conductivity.
  • the LED lamp can be thinned (that is, the height in the Z-axis direction is shortened), and packaging and inventory costs can be reduced.
  • the photoelectric module 2 can be far away from the lampshade 1, so that the light source module 22 reaches the edge of the lampshade 1 to increase.
  • the edge of the lampshade 1 can be brightly illuminated. As a result, for example, the light emitted from an LED lamp can illuminate a wider range.
  • the base may also adopt other different structures.
  • the diameter of the base 3 is larger than the diameter of the lampshade 1, and the area on the base 3 outside the lampshade 1 is provided with a sub-light emitting part, which can effectively increase the illumination range of the lamp.
  • a pad is provided on the base 3, and a plurality of protrusions protrude from the surface of the pad.
  • the lampshade 1 is provided with a recess corresponding to the protrusion, and the depth of the recess is greater than the height of the protrusion from the surface of the pad.
  • the LED lamp includes a lampshade 1, a photoelectric module 2, and a base 3.
  • the basic structure is the same as that of the previous embodiment. The description is not repeated here. The difference is that this The LED lamp adopts the above-mentioned photoelectric module 2b.
  • the structure of the photoelectric module 2b refers to the above-mentioned embodiment, as shown in FIGS. 46 and 47.
  • the LED lamp is located in a spatial rectangular coordinate system (X, Y, Z), and the Z axis is parallel. On the central axis of the LED lamp, the LED lamp further includes a chassis 6, which is connected to the base 3.
  • the reflector 29 has an end point A and a vertex B, and the end point A is located between the LED light source module 22 and the power supply module 23.
  • the light emitting angle of 2201 is 0 ⁇ 120°; ⁇ is the angle between the line AB (the line connecting the end point A and the end point B) and the X-axis direction.
  • the height of the reflective member can be adjusted to obtain an excellent reflective effect, thereby obtaining a better light distribution.
  • the reflector 29 arches away from the power module 23 (ie, the negative direction of the Z-axis). On the one hand, it can increase the heat dissipation space of the power module 23; on the other hand, it can completely cover the power module. Play the role of insulation to prevent electric shock.
  • the power module 23 can be fixed on the base 3 by means of glue or snaps.
  • the base 3 may be provided with a groove 32, and the power module 23 The electrical components (such as inductors, capacitors, etc.) can be located in the groove 32.
  • the groove 32 can increase the heat dissipation space for the electrical components, and also shorten the heat dissipation path, thereby reducing the temperature of the power module 23.
  • the LED chip 2201 includes LED lamp beads. As shown in Figure 48, the light emitted by the LED lamp beads passes through four interfaces C, D, E and F.
  • the C interface is the interface between the packaging layer of the LED lamp beads and the air
  • the D interface is The interface between the air and the reflector 29
  • the E interface is the interface between the air and the lampshade
  • the F interface is the interface between the lampshade and the air.
  • the refractive index of the encapsulation layer of the LED lamp bead is n1
  • the refractive index of the lampshade is n2
  • the refractive index of air is n3.
  • it is mainly to reduce the reflection of the C, E and F interfaces, and increase D The reflection of the interface.
  • the first refraction can be set on the surface of the LED chip 2201 and the inner surface of the lampshade 1, respectively.
  • the range of n1 is 1.4 to 1.53, and the range of n4 is 1.18 to 1.24; in an embodiment, the range of n2 is 1.5 to 1.7, and the range of n5 is 1.22 to 1.3, at this time 0.16 ⁇ n1 -n4 ⁇ 0.35, 0.18 ⁇ n4-n3 ⁇ 0.24; 0.2 ⁇ n2-n5 ⁇ 0.48, 0.22 ⁇ n5-n1 ⁇ 0.3, it can be seen that after setting the first refractive index matching layer and the second refractive index matching layer, Effectively reduce light reflection and improve light utilization.
  • the interference of reflected light can be canceled, so as to further reduce light reflection. Since n1>n4>n3, there is no half-wave loss. Since the wavelength range of visible light is 400 ⁇ 760nm, in order to reduce the harm of blue light to human eyes and improve the human body’s comfort to light, it is necessary to increase blue light reflection and reduce red light The reflection of blue light can be mainly increased in the first refractive index matching layer.
  • ⁇ is the incident angle of light from the lampshade into the second refractive index matching layer, and ⁇ is the wavelength of red light; through the above two-layer thickness setting, the LED lamp can reach a better color temperature and make the room have a warm and comfortable atmosphere.
  • the outer surface of the lampshade 1 may be provided with a multilayer optical film, and the refractive index of the multilayer optical film is n H , n L , n H , n L in the light propagation direction from the lampshade 1 to the air.
  • n H , H represents a high refractive index film
  • L represents a low refractive index film.
  • the optical thickness of the multilayer optical film is 0.5 ⁇ 1, 0.25 ⁇ 2, 0.5 ⁇ 1, 0.25 ⁇ 2..., 0.5 ⁇ 1, ⁇ 1 is the wavelength of blue light, and ⁇ 2 is the light propagation direction from the lampshade 1 to the air.
  • single-layer optical film can not achieve the anti-reflection or anti-reflection effect very well.
  • the use of multi-layer optical film can perform different wavelengths of light according to the color rendering index or color temperature requirements of the lamp. Anti-reflection or anti-reflection to obtain excellent light-emitting effect.
  • the LED lamp of this application can also be provided with some other structures.
  • the LED lamp is provided with an auxiliary light source, which emits light diagonally upward and radiates the light to the ceiling, thereby improving the brightness of the space.
  • the height (h) and width (w) of the lamp satisfy the relationship 4 ⁇ w/h ⁇ 9.
  • the lampshade 1 and the base 3 are connected by a buckle, and the gap between the two is provided with a repellent retaining layer containing an insect repellent to effectively prevent insects from entering the interior of the lamp.
  • a backlight light source is provided at a position perpendicular to the circuit board 201, and the number of LED chips of the back light source on the side far from the base 3 is greater than the number of LED chips of the backlight source near the side of the base 3, so that the light emitting surface The illumination is uniform.
  • lampshade, photoelectric module, base and the LED lamps used in the application in this application have been implemented as described above. It should be reminded that the above-mentioned various embodiments such as “lampshade” and “circuit board “Insulation unit”, “LED chip arrangement”, “base” and other features can include one, two, multiple or all technical features without conflicting with each other. The relevant corresponding content can be selected from one or a combination of the technical features included in the corresponding embodiment.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种LED灯具，其包括灯罩(1)、与灯罩(1)相连接的底座(3)，灯罩(1)与底座(3)所形成的容置空间内设有光电模组(2)，光电模组(2)包括光源模组(22)和电源模组(23)，底座(3)上设有安装部(31)，光电模组(2)通过安装部(31)固定于底座(3)上。该LED灯具具有厚度薄、发光效果优异及散热性能佳的特点。

Description

[根据细则26改正10.10.2020]　一种发光二极管灯具 技术领域
本申请涉及照明器具，尤其涉及了一种LED灯具。
背景技术
吸顶灯是吸附或嵌入屋顶天花板的灯饰，在家庭、办公室、娱乐场所等各种场所经常选用吸顶灯作为照明设备。传统的吸顶灯通常由底座、光源模组、电路模组和灯罩组成，其光源模组中的发光元件一般为节能灯管。由于节能灯管在生产过程中和使用废弃后存在汞污染，而且其耗电量比LED大，而LED具有无汞无毒、无电磁污染、无有害射线及节能环保、使用寿命长等特点，所以吸顶灯的发光元件逐渐用LED取代了节能灯管。但是现有吸顶灯在使用过程中仍存在发光、散热、安装及包装等方面的问题，具体如下：
1.点亮过程中出现闪光、照射范围小、发光不均匀、灯具中央部分亮度小、灯具中央部分与灯具周边部分亮度不均匀、发光面发光不均匀、眩光、灯具周向亮度不均、发光元件安装面上照度不均匀、亮度不均匀及显色性低、发光效率及光设计性低、出现亮斑、渲染效果低、混色不均匀、天花板周向上照度不均匀、高度较高的电路元件会挡光、色温和颜色偏差性大、光取向窄、光透射效率低、光源的发光效率低、灯罩的侧方区域昏暗、灯罩的光射出面辉度不均匀、产生亮线、发光元件的光提取效率低、光舒适感低、消光时美观度低、有些使用场景会希望灯具发出的光具有三维效果或者根据相应的生活场景产生对应的光空间、带有色调的纸面在灯具下使用者难读取或者由于老年人对文字和观察对象物的颜色降低，老年人用光舒适感低等问题。
为改善吸顶灯的光学效果，其一在LED上增加背光透镜以减少灯具中间部 分和边缘部分的暗区，但是由于采用了背光透镜和透镜贴片工艺，生产成本大幅度提高，降低了产品竞争力；其二在发光元件与灯罩之间设置有光学构件，比如导光板、透镜、反射单元等，但采用上述光学构件后，会出现例如入射到导光板的光量会存在变化、光学构件结构复杂、导光板上亮度不均匀、导光板上产生暗部等问题；
2.发光元件和电路元件会产生热量，这些热量会影响吸顶灯的使用寿命；
3.光源模组大多通过螺钉安装在灯体内，或者通过粘结剂粘贴在灯体内，安装后不易拆卸替换。此外吸顶灯长期使用后，往往会出现光源模组老化、烧损现象，如光源模组损坏需要替换时，需通过工具将损坏的光源模组拆下，再将新的光源模组通过工具来安装，LED光源模组的更换操作必须由专业人员运用工作去操作，使用过程不便捷；
4.吸顶灯通常为扁平状结构，具有占用高度小、照明范围广等特点，然而，吸顶灯的整体厚度尺寸依然很大，致使产品的体积增大，进而提升了包装及库存成本。
此外灯具在使用过程中还存在安全性低、制造效率低、使用成本高、虫子等易进入灯具内部影响美观、电源出现故障时无法继续进行照明、为使灯具具有较大的光通量，存在电路板安装面积小、智能控制时遥控灵敏度低或遥控范围窄、安装时存在噪音等问题。
鉴于以上所述现有技术的缺点和不足，确有必要对现有的LED灯具进行改进，以弥补这些缺点和不足。
发明内容
本申请针对上述现有技术中的缺点，提供了一种LED灯具。
为了解决上述技术问题，本申请通过下述技术方案得以解决：
一种LED灯具，其包括灯罩、与灯罩相连接的底盘，所述灯罩与底盘所形成的容置空间内设有光电模组，所述光电模组包括光源模组和电源模组，所述底座的中央部分形成有孔洞，所述孔洞的周围形成有支撑部及边缘部，所述支撑部与边缘部之间具有间隔，所述光电模组与所述支撑部存在间隙。
作为优选，所述光电模组包括电路板，所述电路板包括相对设置的第一面和第二面，所述第一面朝向所述灯罩，所述的第二面包括第七区域和第八区域，所述电源模组的电子元件包括发热元件和不耐热元件，其中所述发热元件和不耐热元件分别位于所述第七区域和第八区域。
作为优选，所述电路板上设有多组LED芯片组，每个LED芯片组包括多个LED芯片，所述第一面包括与第七区域相对的第五区域和与所述第八区域相对的第六区域，位于所述第五区域内的LED芯片的数量小于位于所述第六区域内的LED芯片数量。
作为优选，所述LED芯片的仰俯角为90*(1/n)°。
作为优选，各LED芯片组位于同一圆周上，每个LED芯片组包括一种光色的LED芯片，每个圆周上的LED芯片在周向方向上错开。
作为优选，所述光电模组还包括绝缘单元，所述绝缘单元包括覆盖第一面上所有电子元件的第一绝缘部和覆盖第二面上所有电子元件的第二绝缘部。
作为优选，所述第一绝缘部从所述光源模组的一端沿光源模组的径向方向至光源模组的另一端具有一定的弧度。
作为优选，所述电源模组与第二绝缘部之间具有一定的间隔。
作为优选，所述灯罩具有壁部，且所述灯罩为回转体结构，所述壁部的边缘设有第二凸出部，所述第二凸出部相对壁部的边缘向灯罩的径向的内侧凸部。
作为优选，所述LED灯具还包括用于将所述光电模组固定至所述底座的安 装部。所述安装部包括第二安装部，所述第二安装部具有第二卡槽，所述灯罩固定至所述底座时，所述第二凸出部卡入所述第二卡槽固定。
本申请透过上述结构设计，达成了以下所述有益效果之一或其任意组合：(1)通过安装部对光电模组进行旋转固定，安装维修便捷，提高了工作效率；(2)调节光源模组上LED芯片的排列，可使LED灯具的出光效果更加均匀及散热效果更加优异；(3)电路板的第二面上的电子元件相比任意一个光源模组的电子元件而位于电路板的径向的更内侧，可避免光源模组的电子元件工作时产生的热量影响第二面的电子元件，其次可限制第二面上的电子元件的分布区域，从而控制第二绝缘部的尺寸，以控制成本；(4)LED芯片与电源模组分别位于电路板的第一面和第二面，第一面上对应于电源模组的区域内的LED芯片数量小于第一面未对应电源模组的区域内的LED芯片数量，如此一方面显著减少LED灯具中部的暗区，提高LED灯具的发光效果，另一方面又可减少电源模组产生的热量对光源模组的影响；(5)高度较高的第二电源模组位于所述底座的凹槽部中，因无需设置专门收纳电源模组的收纳空间，从而有效的降低了吸顶灯的高度，此外，光电模组能够远离灯罩，使光源模组到达灯罩的边缘的光量增加；(6)第一绝缘部具有一定的弧度，可提高其受力程度，保证光电模组在运输过程中不被损坏；(7)第二绝缘部与底座的凹槽部的侧壁相接触，增加接触面积，提高导热能力；(8)LED芯片2201的发光面朝向灯具的中心轴，可有效消除中间暗区，提高灯具的发光效果；(9)通过对选择合适折射率的LED灯珠的封装层的折射率为n1，灯罩材料，可有效提高LED灯具的光通量；(10)通过在LED芯片表面或灯罩内表面设置折射率匹配层，通过其厚度设计，可得到优异的光学效果。
附图说明
图1是本申请LED灯具的一实施例的结构示意图；
图2是图1去掉灯罩的一实施例的示意图；
图3是一实施例中的LED灯具的光电模组去掉绝缘单元的立体示意图一；
图4是一实施例中的LED灯具的光电模组去掉绝缘单元的立体示意图二；
图5是另一实施例中的LED灯具的光电模组去掉绝缘单元的立体示意图一；
图6是另一实施例中的LED灯具的光电模组去掉绝缘单元的立体示意图二；
图7是一实施例中的LED灯具的光电模组的立体示意图一；
图8是一实施例中的LED灯具的光电模组的立体示意图二；
图9是一实施例中的LED灯具的光电模组的第一绝缘部的立体示意图；
图10是一实施例中的LED灯具的光电模组的剖视示意图；
图11是图10中的C处的放大图；
图12是一实施例中的LED灯具的光电模组的第二绝缘部的立体示意图；
图13是一实施例中的LED灯具去掉灯罩的示意图；
图14是一实施例中的LED灯具的光电模组的结构示意图一；
图15是一实施例中的LED灯具的光电模组的结构示意图二；
图16是图14中A-A截面的结构示意图；
图17是图14中B-B截面的结构示意图；
图18是一实施例中的LED灯具的光电模组去掉绝缘单元的结构示意图；
图19是一实施例中的LED灯具的光电模组去掉绝缘单元的结构示意图一；
图20是一实施例中的LED灯具的光电模组去掉绝缘单元的结构示意图二；
图21是另一实施例中的LED灯具的光电模组去掉绝缘单元的结构示意图 一；
图22是另一实施例中的LED灯具的光电模组去掉绝缘单元的结构示意图二；
图23是一实施例中的LED灯具的第一绝缘部的结构示意图；
图24是一实施例中的LED灯具的第二绝缘部的结构示意图；
图25是一实施例中的LED灯具的光电模组的结构示意图；
图26是一实施例中的LED灯具去掉灯罩的的立体示意图；
图27是一实施例中的灯罩的立体示意图；
图28是图26中A处的放大图；
图29是图26中B处的放大图；
图30是安装部的主视图；
图31是一实施例中的安装部的立体示意图一；
图32是一实施例中的安装部的立体示意图二；
图33是一实施例中的LED灯具的光电模组的立体示意图；
图34是一实施例中的LED灯具去掉灯罩的立体图；
图35是一实施例中的LED灯具的剖视示意图；
图36是图35中B处的放大图；
图37是一实施例中的LED灯具去掉灯罩的立体示意图；
图38是一实施例中的LED灯具去掉灯罩的立体示意图；
图39是一实施例中安装部的立体示意图；
图40是一实施例中的LED灯具去掉灯罩的立体示意图；
图41是一实施例中的LED灯具去掉灯罩的立体示意图；
图42是一实施例中的底座的立体示意图；
图43是一实施例中的LED灯具的立体示意图；
图44是一实施例中的LED灯具的光电模组的立体示意图一；
图45是一实施例中的LED灯具的光电模组的立体示意图二；
图46是一实施例中的LED灯具的立体示意图一；
图47是一实施例中的LED灯具的立体示意图二；
图48是一实施例中LED芯片发出的光经过的界面图。
具体实施方式
下面结合附图与实施例对本申请作进一步详细描述。
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳实施例。但是，本申请可以通过许多不同的形式来实现，并不限于下面所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容理解的更加透彻全面。下文中关于方向如“轴向方向”、“上方”、“下方”等均是为了更清楚的表明结构位置关系，并非对本申请的限制。在本申请中，所述“垂直”、“水平”、“平行”定义为：包括在标准定义的基础上±10％的情形。例如，垂直通常指相对基准线夹角为90度，但在本申请中，垂直指的是包括80度至100以内的情形。另外，本申请中所述LED灯具的使用情况、使用状态，指的是LED灯具以灯罩竖直向下的垂吊方式的使用情境，如有其他例外情况将另做说明。
如图1至图48所示，本申请中实施方式的LED灯具是例如在天花板上安装的吸顶灯。图1至图48的上方(如图1中的Z轴正方向)相当于与天花板相对的地板面的方向。换言之，图1至图48示出的LED灯具适于通常使用时相反的姿势。
本申请设计的LED灯具，LED灯具空间位置位于如图1所示的笛卡尔坐标 系中，其中Z轴平行于LED灯具的中心轴。如图1至图48所示，LED灯具包括灯罩1、与灯罩1相连接的底座3，灯罩1与底座3所形成的容置空间内设有光电模组2。在本实施方式，LED灯具还包括设置于底座3上的安装部31、引挂器4及转接引挂器(或适配器)5，光电模组2通过安装部31固定于底座3上，引挂器4与适配器5相连接。LED灯具与天花板之间，为了抑制LED灯具的摇晃，设置了缓冲部件7，缓冲部件7例如可为海绵。
如图1至图48所示，光电模组2包括光源模组22及电源模组23，为防止电源故障等导致外部电源被切断时发生断电，电源模组23可包括存储电能的蓄电池单元，蓄电池单元内存储有余晖模块，通过余晖模块自动发出余晖照明以保障安全。
如图1至图48所示，光电模组2配置为一整体式结构，并可拆卸的固定至底座3，因此，当光电模组2损坏时，可单独对其进行替换，相比整灯替换，更节约成本。在更换光电模组2时，需防止触电情况的发生，特别是需要防止更换光电模组2时，手触碰到电子元件。本实施例中的光电模组2包括电子元件，电子元件外均设置绝缘单元，从而可防止更换光电模组2时，接触到电子元件。光电模组2包括电路板201，电路板201可为PCB单面板或PCB双面板，至少部分电子元件设置于所述电路板201上。进一步的，全部的电子元件均设置于所述电路板201上。其中，电子元件包括光源模组22中的电子元件(如LED灯珠)及电源模组23中的电子元件。也就是说，光源模组22的电子元件与电源模组23的电子元件集成于同一电路板上，节约了成本及空间。
如图3至图6所示，电路板201包括相对设置的第一面2011及第二面2012，其中，所述第一面2011为面向灯罩1的一面。一实施例中，光源模组22的电子元件设置于第一面2011上，而电源模组23的电子元件可全部设置于第一面 2011上，以此，电路板201仅需在第一面2011布置线路层，可节省布线成本。一些实施例中，参见图3和图4，光源模组22的电子元件设置于第一面2011上，而电源模组23的电子元件全部设置于第二面2012上，以此，可将光源模组22中的电子元件及电源模组23中的电子元件分开设置。在灯具点亮时，一般来说，光源模组22的电子元件和电源模组23的电子元件均可能会发热，因此将两者分开配置，可避免热源集中，或者工作时产生的热量相互影响，此时，可同时在第一面2011和第二面2012上布置线路层。于本实施例中，光源模组22中的电子元件设于第一面2011，部分电源模组23中的电子元件设于第一面2011，而另一部分的电源模组23中的电子元件设于第二面2012。本实施例中，将电源模组23的电子元件分别设置于第一面2011及第二面2012，可更好的对电源模组23中的电子元件进行布局配置。例如位于第一面2011的电源模组23的电子元件包括高度相对较低的元件，如IC(控制电路)、贴片元件(如贴片电阻)，因此，光源模组22发出的光因没有障碍物的阻挡，降低了光损耗，提高了发光效率。而位于第二面2012的电源模组23的电子元件包括高度相对较高的元件，如变压器、电容、电感等。又例如位于第一面2011的电源模组23的电子元件包括发热元件(工作时产生热量较多的元件，如IC、电阻等)，而位于第二面2012的电源模组23的电子元件包括不耐热元件(如电解电容)，将不耐热元件与上述的发热元件分别设置于第一面2011和第二面2012，可减小发热元件工作时产生的热量对不耐热元件的影响，提高电源模组23的整体的可靠性及寿命。
如图7至图12所示，光电模组2还包括绝缘单元，绝缘单元包括第一绝缘部202及第二绝缘部203，其中，第一绝缘部202配置为可供光源模组22工作时产生的光透过，且第一绝缘部202覆盖第一面2011上的所有电子元件，以防止误触第一面2011上的电子元件而导致触电。第二绝缘部203覆盖第二面2012 上的所有电子元件，第二绝缘部203的材料可选为PC或亚克力中的一种，此二种材料具有轻便、低成本的特点。本实施例中，第二面2012上的电子元件相比任意一个光源模组22的电子元件而位于电路板201的径向的更内侧，也就是说，第二面2012上的电子元件与光源模组22的电子元件在电路板201的厚度方向上的投影不重叠。一方面，可避免光源模组22的电子元件工作时产生的热量影响第二面2012的电子元件，另一方面，可限制第二面2012上的电子元件的分布区域，从而控制第二绝缘部203的尺寸，以控制成本。
本实施例中的第一绝缘部202包括一凹腔2021，电路板201容置于该凹腔2021内。第一绝缘部202具有侧壁2022，侧壁2022设置第一限位部2023，第一绝缘部202的凹腔2021内设置一个或多个第二限位部2024，电路板201装入第一绝缘部202时，电路板201厚度方向上的两侧分别受第一限位部2023及第二限位部2024限位，即电路板201夹在第一限位部2023及第二限位部2024之间，以完成固定。且电路板201安装完成后不易产生晃动。第一限位部2023可以为卡扣，而第二限位部2024可以为柱状体。
本实施例中的第二绝缘部203上设置第一扣接单元2031，而电路板201上设置相对应的第二扣接单元2013，第一扣接单元2031扣接于第二扣接单元2013，从而将第二绝缘部203固定至电路板201上。第一扣接单元2031可以是扣接部，第二扣接单元2013可以是扣接孔或扣接部。另外，第二扣接单元2013也可设置于第一绝缘部202上，从而将第二绝缘部203与第一绝缘部202固定。
于一实施例中，电路板201和第一绝缘部202可通过凹凸结构相对于彼此定位，由此限制了第一绝缘部202相对于电路板201在水平方向(与XY平面平行的方向)上的移动，即电路板201和第一绝缘部202之间不会发生位移，因此，光源模组22与第一绝缘部202之间不会发生位移，从而可以抑制由于光 源模组与第一绝缘部之间的位移而引起的光提取效率的降低。
于一实施例中，LED灯具的基本结构同前述实施例，LED灯具包括灯罩1、光电模组2及底座3，在此不重复叙述，不同之处在于此实施例提供了绝缘单元与电路板的另一种固定形式。如图13～17所示，电源模组23包括第一电源模组231(如前述的设于第一面2011上的部分电源模组23中的电子元件)和第二电源模组232(如前述的设于第二面2012上的部分电源模组23中的电子元件)，第一电源模组231可为SMT(surface mounting technology)元器件，第二电源模组232可为DIP(dual inline-pin package)元器件，例如DIP元器件包括电感、电容等。第一绝缘部202上设有第一卡扣件25，第一绝缘部202通过第一卡扣件25与光源模组22卡扣结合。第二绝缘部203设有第二卡扣件26，第二绝缘部203通过第二卡扣件26与光源模组22卡扣结合以对电源模组23进行绝缘及机械保护，电源模组23与第二绝缘部203之间具有一定的间隔，从而可给第二绝缘部203提供受力缓冲区，防止第二绝缘部203受外力冲击时损坏电源模组。
第一绝缘部202和/或第二绝缘部203上可设有加强筋27，通过设置加强筋，可增加第一绝缘部和/或第二绝缘部的抗冲击强度，防止第一绝缘部和/或第二绝缘部受到损坏。上述不同结构的第一绝缘部和第二绝缘部之间可相互组合。
如图18所示，电路板201上设有若干组LED芯片组221，每个LED芯片组包括若干个LED芯片2201。各LED芯片组位于同一圆周或大致位于同一圆周上，即LED芯片组的数量与圆周的数量相同，设圆周的数量为n(n大于或等于1)，LED芯片2201的仰俯角可设为(90/n)°，如此可使LED灯具具有良好配光和发光效率。任意两个LED芯片组具有不同的发光光谱，以使LED灯具亮度均匀及提高LED灯具的显色性，当然也可使两个及两个以上的LED芯片组具有相同的发光光谱，从而使LED灯具良好的发光效果。
于一实施例中，LED芯片2201之间的平均距离小于第一绝缘部202至LED芯片2201之间的距离，能够减少第一绝缘部周向上的亮度不均，实现更均匀的亮度。
本实施例中，同一LED芯片组221中，相邻两个LED芯片2201的中心距为L3，任一组LED芯片组221的任一颗LED芯片2201，其与相邻的LED芯片组221中最接近的一个LED芯片2201的中心距为L4，其符合以下关系：L3：L4为1:0.8～2，优选为L3：L4为1:1～1.5。以此使得LED芯片2201的分布更加均匀，以达到出光均匀的目的。
本实施例中，如图18所示，内圈中，相邻的两个LED芯片2201与LED灯具的轴心形成中心角A1，中间圈中，相邻的两个LED芯片2201与LED灯具的轴心形成中心角A2，中心角A2的角度小于中心角A1的角度。外圈中，相邻的两个LED芯片2201与LED灯具的轴心形成中心角A3，外圈中的中心角A3的角度小于内圈中的中心角A2的角度。举例来说，外圈因此而具有比中间圈更多的LED芯片2201，因此，外圈中相邻的LED芯片2201的间距不至于比中间圈中相邻的LED芯片2201的间距大太多，甚至，两者间距可以接近或相等，因而，LED芯片2201的排布会更加均匀，使得出光得以更加均匀。换句话说，LED芯片组221设有若干组，且每一组都是以环状的形式设于电路板201上，相对更内侧的LED芯片组221的相邻的两个LED芯片2201与LED灯具的轴心所形成中心角的角度大于相对更外侧的LED芯片组221的相邻的两个LED芯片2201与LED灯具的轴心所形成中心角的角度。也就是说，更外侧的LED芯片组221相比更内侧的LED芯片组221具有更多的LED芯片2201，以此使更外侧的LED芯片组221的相邻的两个LED芯片2201的间距与相对更内侧的LED芯片组221的相邻的两个LED芯片2201间距更加接近，因而，LED芯片2201的排布会更 加均匀，使得出光得以更加均匀。
本实施例中，LED芯片组221设置有至少两组，至少两组LED芯片组221在电路板201的径向方向上依次排布，每一组LED芯片组221包括至少一个LED芯片2201，电路板201径向上的其中一组LED芯片组221中的任一一个LED芯片2201与电路板201径向上相邻的另一组LED芯片组221的任一一个LED芯片2201在电路板201的径向上交错设置，也就是说，不同的LED芯片组221的LED芯片2201之间，在LED灯具的径向上位于不同的方向，即，任意一起始于LED灯具轴线并延伸于LED灯具径向的线，如切到两颗或以上的LED芯片2201，则会切到这两颗或以上的LED芯片2201的不同位置，即，不会切到两颗或以上的LED芯片2201的同一位置。如此一来，假设电路板201表面具有对流，空气在电路板201的径向上对流时，由于空气流通路径的关系，在流通路径上，空气与LED芯片2201的接触更加充分，使得散热效果更好。另外，从发光效果来讲，这种LED芯片2201的排布方式，更利于出光的均匀性。
本实施例中，同一LED芯片组221中相邻的两颗LED芯片2201之间具有开放区域2202，以允许空气在LED芯片2201之间流动，以此带走LED芯片2201工作时所产生的热。而电路板201径向上相邻的两组LED芯片组221，其中一组LED芯片组221中任意两颗相邻的LED芯片2201之间的开放区域2202与另一组LED芯片组221中任意两颗相邻的LED芯片2201之间的开放区域2202在电路板201的径向上是交错的，且相互连通的。如此一来，假设空气在电路板201的径向上对流，由于空气流通路径的关系，在流通路径上，空气与LED芯片2201的接触更加充分，使得散热效果更好。如果电路板201径向上相邻的两组LED芯片组221，其中一组LED芯片组221中任意两颗相邻的LED芯片2201之间的开放区域2202与另一组LED芯片组221中任意两颗相邻的LED芯 片2201之间的开放区域2202在电路板201的径向上是在同一方向上的，则空气便直接沿电路板径向流动，在流通路径上，空气与LED芯片2201的接触减少，不利于LED芯片2201散热。
举例来讲，LED芯片组221设置有三组，且沿电路板201的径向依次设置，相应的这三组LED芯片组中任意的开放区域2202在电路板201的径向方向上不在同一方向上。以此优化电路板201表面的对流的流通路径，提升散热效率。
于一实施例中，每个LED芯片组221只包括一种光色的LED芯片2201，可将每个圆周上的LED芯片2201在周向方向上错开，此排列具有良好的混色性及光均匀性，其次由于LED芯片2201包括LED晶片与光转换层，光转换层包括胶与荧光粉，通过调配胶与荧光粉的比例，可使一圆周上的LED芯片发白色光，如暖白色光、日光色光等，与发白色光相邻的圆周上的LED芯片发原色光，例如红色光、绿色光、蓝色光等，第一绝缘部202上对应白色光、原色光的区域分别设有第一漫射部、第二漫射部，第一漫射部在LED芯片2201的光轴方向上的厚度小于除LED芯片2201的光轴方向外其它方向上的厚度，LED芯片发出的白光被第一漫射部均匀地扩散，第二漫射部具有均匀的厚度，LED芯片发出的原色光经过第二漫射部以相同的光分布发射而不进行扩散，因而调整不同圆周上的色温对比度再现天蓝色，根据生活场景提供适当的照明空间。
于一实施例中，LED芯片2201上可设置透镜，例如电路板201上设有三个LED芯片组，分别位于同圆心、不同半径的第一圆周、第二圆周及第三圆周上，第一圆周、第二圆周上的LED芯片2201覆盖管状透镜，第三圆周上的每个LED芯片2201覆盖单个透镜，可使得LED灯具的照度均匀。
于一实施例中，可将其中一部分LED芯片组朝向LED灯具中央部分照射，一部分LED芯片组朝远离电路板201的方向照射光以防止LED灯具中央部分出 现暗部。
于一实施例中，电路板201上设有两组LED芯片组221，两LED芯片组分别排列在2个同圆心、不同半径的圆周上，第一LED芯片组排列在一圆周上，第二LED芯片组排列在另一圆周上，第一绝缘部202上对应于第一LED芯片组、第二LED芯片组的区域分别设有第一吸收区及第二吸收区，第一LED芯片组的发光色的色温小于第二芯片组的发光色的色温时，第一吸收区的波长吸收量大于第二吸收区的波长吸收量，可以提高灯具的显色性、色温及减少显色偏差
(DUV)。
于一实施例中，光源模组22还可包括透镜单元，透镜单元覆盖于电路板201上，透镜单元的设置存在多种形式，其一，电路板201上设有多组LED芯片组，相邻LED芯片组之间设有小夜灯，透镜单元包括覆盖LED芯片组的透镜主体及连通相邻透镜主体且覆盖小夜灯的连通部，可将透镜主体的发光面设为曲面，使得从小夜灯射出的光向LED灯具的中央及外部扩散，可以实现均匀照射；其二，透镜单元具有两个脊，两个脊之间设有小夜灯，小夜灯用作具有相对方向性的点光源，起到配光的作用；其三，透镜单元可设有凸起，使得电路板201上LED芯片2201发出的光主要朝以电路板201为原点的半径方向扩散发射，从而抑制光源模组22点亮时出现颗粒感；其四，电路板201上设有多组LED芯片组，透镜单元的数量大于2，透镜单元之间设有避让部，电路板201具有孔洞，LED芯片组环绕孔洞设置，避让部具有面向孔洞的凹部，防止第一绝缘部202光干涉；其五，透镜单元具有与LED芯片2201相对准的储存凹入部分，以容纳LED芯片2201，透镜单元具有入射表面及相对的投射表面，靠近LED芯片2201光轴的投射表面和入射表面的区域内的扩散率设置成高于其它区域内的扩散率，灯罩1的亮度分布变得平滑，光透射效率高；其六，透镜单元具有第 一表面和第二表面，第一表面是靠近LED芯片2201一侧的光入射表面，第二表面是LED芯片2201从第一表面入射的光透射过此表面发射到外部的一表面，第一表面包括光控制面，光控制面以大角度分布从LED芯片2201发出的光，在光控制面的周围设有多个凸部或多个凹部，通过多个凸部或凹部进行扩散，可以抑制灯罩1上亮线的产生；其七，透镜单元包括多个透镜，每个透镜分别覆盖每个LED芯片2201，即透镜数量与LED芯片2201的数量相等，第一绝缘部202具有透光性的透镜罩，透镜罩使LED芯片2201的光朝向灯具的中心部射出，可设定透镜的配光峰值角度，从而提高均匀度；其八，透镜单元具有供LED芯片2201发出的光入射的凹部及LED收纳部，通过收纳LED芯片而抑制LED芯片与凹部接触，LED收纳部与所述凹部通过相对于所述LED芯片凸出的凸曲面而平滑地连续；其九，透镜单元包括第一配光区和第二配光区，第一配光区具有第一外表面，第二配光区具有第二外表面，第一外表面在LED芯片2201的光轴方向上向内反射光，第二外表面相对于LED芯片2201的光轴方向上向外反射光，通过调整LED芯片的位置，可抑制一部分照度防止眩光产生。上述第二至第九中透镜单元的实施形式涉及的LED芯片2201的排列可采用上述实施例中的排列，也可采用其它的排列形式。
于一实施例中，电路板201还可采用其它不同的形式，如电路板201可包括多个子电路板，子电路板可设置成多种不同的结构，一实施例中，至少有一个子电路板相对于底座3具有一定的倾斜角度；一实施例中，任一子电路板具有未放置LED芯片2201的内部区域和放置LED芯片2201的外部区域，靠近内部区域的LED芯片2201间距小，远离内部区域的LED芯片2201之间的间距大，能够实现LED灯具发光均匀；一实施例中，子电路板按圆周方向排列，每个子电路板上设有不同色光的LED芯片2201，相邻子电路板最接近的LED芯片2201 的光色不同，子电路板中相邻LED芯片2201之间的距离等于分别位于相邻子电路板的LED芯片2201之间的最短距离，通过不同光色LED芯片2201的排列，可实现发光面发光均匀；一实施例中，相邻子电路板通过连接部连接，一子电路板的突出部容纳于与之相邻的子电路板的收纳部，来自LED芯片2201发出的光易向与LED芯片2201延伸方向正交的方向扩散，抑制了连接部中央变暗，从而抑制LED灯具的发光面发生亮度不均；一实施例中，电路板201由两子电路板组成，第一绝缘部202上设有反射部，反射部具有使一子电路板上LED芯片2201射出的光从下方垂直方向倾斜地发射的第一反射面和使另一子电路板上的LED芯片2201射出的光朝向灯具中央反射的第二反射面，以抑制第一绝缘部上亮度不均匀。
于一实施例中，电路板201还可采用其它不同的形式，如电路板201包括设有电源模组23的内侧区域与设有光源模组22的外侧区域，外侧区域以彼此邻接的方式交替配置的多个第一区块和多个第二区块，从配置在第一区块内的多个LED芯片2201到电路板201中心的距离的平均值大于从配置在第二区块内的多个LED芯片2201到电路板201中心的距离的平均值，因此能够抑制从配置在位于远离电路板201的中心部的位置的第一区域内的LED芯片2201发出的光被设置于内侧区域的覆盖电源模组的第二绝缘部203阻挡，可以确保灯罩的光射出面辉度均匀。
在一些实施例中，电路板201还可采用其它不同的形式，如图19和图20所示，电路板201的第二面2012包括用于放置电源模组23的第三区域2014b和未放置有电源模组23的第四区域2015b，第一面2011包括与第三区域2014b相对的第一区域2014a和与第四区域2015b相对的第二区域2015a，位于第一区域2014a内的LED芯片2201的数量小于位于第二区域2015a内的LED芯片2201 数量，如此一方面显著减少LED灯具中部的暗区，提高LED灯具的发光效果，另一方面又可减少电源模组23产生的热量对光源模组22的影响。在一些实施例中，第三区域2014b靠近LED灯具的中心轴，第四区域2015b远离LED灯具的中心轴(相较于第三区域2014b)，因电源模组23设置在靠近LED灯具的中心，在运输过程中，光电模组2所受外力的振幅较小，电源模组23不会因受外力而损坏。
在一些实施例中，电路板201还可采用其它不同的形式，如图21和图22所示，电路板201的第二面2012包括第七区域2016b和第八区域2017b，电源模组23的电子元件包括发热元件(工作时产生热量较多的元件，如IC、电阻等)和不耐热元件(意指容易因受热而改变工作能力的元件，如电解电容)，其中发热元件和不耐热元件分别位于第七区域2016b和第八区域2017b，可减小发热元件工作时产生的热量对不耐热元件的影响，提高电源模组23的整体的可靠性及寿命，第一面2011包括与第七区域2016b相对的第五区域2016a和与第八区域2017b相对的第六区域2017a，位于第五区域2016a内的LED芯片2201的数量小于位于第六区域2017b内的LED芯片2201数量，从而减少电源模组23产生的热量对光源模组22的影响。
于一实施例中，电路板201还可采用其它不同的形式，为提高光源模组22的散热效率，电路板201包括配置有电源模组23的内侧区域和配置有光源模组22的外侧区域，内侧区域与外侧区域之间设有脆弱部(缝隙或槽)，脆弱部的位置易弯曲，能够提高电路板201与底座3的密合度，增加了散热面积。
于一实施例中，电路板201还可采用其它不同的形式，光电模组2包括小夜灯，电路板201包括配置小夜灯的第一区域和配置LED芯片2201的第二区域，第一区域靠近LED灯具的中心轴，小夜灯与LED芯片2201之间形成一条 狭缝，以确保小夜灯与LED芯片之间的绝缘距离，防止由于小夜灯与LED芯片2201之间的电势差引起短路。
于一实施例中，电路板201还可采用其它不同的形式，如电路板201上设有控制从LED芯片2201发射光的光分布的光学构件，光学构件具有圆顶状入射表面、出射表面及位置两者之间的介质部，光轴方向上LED芯片2201距入射表面的距离r与外周方向上LED芯片2201距入射表面的距离d的比值为r/d＜1，通过调整r、d可根据生活场景产生对应的光空间。
从图10至图11可知，第一绝缘部202从光源模组22的中心沿光源模组22的径向方向至边缘具有一定弧度，或者第一绝缘部202从光源模组22的一端沿光源模组22的径向方向至光源模组22的另一端具有一定的弧度，弧度所对应的圆心角为2°至50°，优选5°至15°。将第一绝缘部202设计为具有弧度，可增加第一绝缘部202在运输过程的受力强度，从而保护光电模组2的完整性，还能够缓和第一绝缘部202相对于电路板201的倾斜度，使光线柔和地分布。其它实施例中，第一绝缘部202包括透明基材和具有透光性的光扩散层，透明基材靠近电路板201，透明基材与光扩散层之间设有形成预定图案的装饰层，透过装饰层的光不会被光扩散层散射，因此从地板侧观察LED灯具时，能够看到轮廓清晰的图案，可以增强照明效果。
如图10至图12所示，第二绝缘部203上设置有若干第一孔洞2032，第二绝缘部203与电路板201之间形成用于容置电子元件的空间。第一孔洞2032的设置，有利于用于容置电子元件的空间内的空气对流，藉此使这些电子元件工作时产生的至少一部分热量，通过上述第一孔洞2032而排出，加强电子元件的散热效果。
于一实施例中，第二绝缘部203可采用其它不同的形式，第二绝缘部203 可由多个区块组成，区块之间具有重叠区，重叠区至底座3的距离小于第二绝缘部203其他部分(除重叠区外的其它区域)至底座3的距离，以防止第二绝缘部与电源模组23接触，增加散热路径，提高散热效果。
于一实施例中，第一绝缘部202可采用其它不同的形式，第一绝缘部202包括中心区和端部区，其中心区靠近LED灯具的中心轴，端部区远离LED灯具的中心轴，端部区设有将光源模组22发出的光从中心区引导至端部区射出的导光反射部，以提高灯具的照射范围。
于一实施例中，第一绝缘部202可采用其它不同的形式，第一绝缘部202具有内区、外区及位于内区与外区之间的中间区，内区靠近LED灯具的中心轴，内区具有比中间区厚的第一厚部，第一厚部能够提供透镜效应，从而使灯具的中央部分明亮，光损耗小。
于一实施例中，第一绝缘部202可采用其它不同的形式，第一绝缘部202的表面上可具有多个棱镜，每个棱镜相对于电路板201具有不同倾斜角度的第一棱镜面和第二棱镜面，从LED芯片发出的光入射至第一棱镜面、第二棱镜面上发生折射，能够抑制眩光产生的不适感。
于一实施例中，第一绝缘部202可采用其它不同的形式，第一绝缘部202具有高透光率的透光部和低透光率的透镜部，透光部环绕透镜部且远离LED灯具的中心轴，可使灯罩照度均匀，灯具的光输出率高。一实施例中，第一绝缘部202上设有透镜，可以控制第一绝缘部径向和周向的光分布，抑制灯具周向亮度不均，确保径向配光。
于一实施例中，第一绝缘部202可采用其它不同的形式，光电模组2包括小夜灯，小夜灯设置在最靠近LED灯具的中心轴的圆周上，小夜灯上设有能够透射图案的掩膜，可保证灯具的发光效率及提高光设计性，此外小夜灯在打开 时，灯罩1上可能会产生亮线，为防止此现象出现，小夜灯外设有扩散罩进行漫射，第一绝缘部202覆盖小夜灯与光源模组22的区域为没有凹凸的均匀表面，因而不会产生亮线。
于一实施例中，第一绝缘部202与第二绝缘部203可采用其它不同的形式，如图23和图24所示，此实施例中，第一绝缘部202上设有透镜组212，透镜组212对应于LED芯片组221设置，即透镜组212位于LED芯片组221的上方，使得光分布更加分散、均匀；透镜组212通过注塑工艺一次成型，相比于单独安装透镜，降低了生产成本，第一绝缘部202上设有多组散热孔组，散热孔组包括多个散热孔211，其中至少有一组散热孔组靠近LED芯片组221，使电路板201的热量得以快速散发，极大增加了散热效果。此外第二绝缘部203上也可设有散热孔211，进一步降低电源模组23的温度，提高灯具的使用寿命，第二绝缘部203上设有多个辅助部2033，多个辅助部2033呈圆周分布，当然也可采用其它的分布方式，当绝缘单元与电路板201固定时，辅助部2033可增加绝缘单元与电路板201的连接强度，此外可增加第二绝缘部203的散热面积，提高散热效果。在其它实施例中，可将散热孔211设置在第一绝缘部202的中间，此外在第一绝缘部202的外边缘设有多个间隔排列的凹口，从而空气可在电路板201与第一绝缘部202之间对流，提高散热效果。
图25是光电模组2b另一实施例的结构示意图，如图25所示，光电模组2b包括光源模组22及电源模组23，光源模组22与电源模组23之间设有反光件29，LED光源模组22环绕在反光件29的四周，光源模组22包括电路板201和位于电路板201上的至少一组LED芯片组221，每个LED芯片组221包括多个LED芯片2201，LED芯片2201的发光面朝向灯具的中心轴，可有效消除中间暗区，提高灯具的发光效果。参见图46，LED芯片2201发出的部分光经反光 件29反射后射出灯罩1。在一实施例中，LED芯片2201的外表面可透过胶体(例如硅胶)与外部环境进行隔离，避免触电风险。或是在整个电路板201上涂布厚度均匀的胶层。
此实施例中，LED光源模组22还包括散热件223，散热件223可为铝环、铜环等，电路板201贴附于散热件223上，为提高散热效果，可在散热件223远离电路板201的表面上设置散热筋(图上未标示)以增加散热面积，散热筋与电路板201位于散热件223相对的两个表面。
此实施例中，LED光源模组22的制备可采用以下方法：
1)将电路板201焊盘端卡入转盘的卡槽中，启动转盘，电路板201环绕吸附在转盘的卡槽内；
2)点胶头对准电路板201，转盘转动开始点胶，点胶完成后转盘停止转动；
3)散热件223卡入转盘的卡槽中，转盘转动一圈后剪断散热件223，取出散热件223与电路板201；
4)在电路板201上贴覆LED芯片2201得到LED光源模组22。上述制备方法操作简单，设备成本低，可有效提高生产效率及降低生产成本。
如图26至图32所示，第一绝缘部202的外缘设置第一凸出部2101，第一凸出部2101相对第一绝缘部202的外缘而凸出。本实施例中，第一绝缘部202可设置为回转体结构，而第一凸出部2101可沿第一绝缘部202的周向而在第一绝缘部202的外缘而设置多个。本实施例中，底座3上设置安装部31，安装部31提供对第一凸出部2101的安装。具体的，安装部31具有一第一安装部315，第一安装部315具有一第一卡槽3111。第一绝缘部202具有一固定位置及松脱位置，在所述固定位置时，第一凸出部2101卡入第一卡槽3111固定，在所述放松位置时，第一凸出部2101与第一卡槽3111分离。本实施例中，第一绝缘 部202以转动的形式(大致为绕LED灯具轴线而转动)在所述固定位置及所述放松位置间切换。本实施例中，第一卡槽3111在LED灯具的轴向方向上的两侧通过第一安装部315与底座3而封闭，因此，当第一凸出部2101卡入第一卡槽3111后，第一凸出部2101在LED灯具厚度方向上的两侧受限位。其他实施例中，第一卡槽3111在LED灯具的轴向方向上的两侧通过第一安装部315的自身的结构而封闭，以达到上述相同的作用。本实施例中，第一安装部315具有定位单元，以对卡入第一卡槽3111的第一凸出部2101起到定位作用。具体的，定位单元包括一第一弹性臂3112，第一弹性臂3112与第一安装部315之间形成一第一凹槽3113，在所述固定位置时，第一凸出部2101在LED灯具径向的端部卡入所述第一凹槽3113内，以实现对第一绝缘部202的定位固定。第一弹性臂3112上形成一第一阻挡部31121。通过第一弹性臂3112的设置，当第一凸出部2101需要从第一卡槽3111脱出时而转动第一绝缘部202时，需要先克服第一阻挡部31121的阻碍(即需要施力于第一绝缘部202，从而使第一凸出部2101挤压第一弹性臂3112，以使其实现松脱)，从而可防止因误操作或碰撞等，导致第一绝缘部202从第一卡槽3111松脱。本实施例中，在所述固定位置时，第一弹性臂3112可施力于第一凸出部2101，以进一步起到紧固第一绝缘部202的作用。第一弹性臂3112可一体成型于所述第一安装部315。第一弹性臂3112可为片状结构，以其自身的材料属性(可采用现有技术中的具有弹性的材质，如塑料或金属)而具有弹性。第一阻挡部31121可通过第一弹性臂3112的弯折(或在第一弹性臂3112设置弯折)而直接成型。
本实施例中，第一安装部315与第二安装部316为一体式构件，第一卡槽3111和第二卡槽3114分别位于该构件的相对的两侧。其他实施例中，第一安装部315与第二安装部316也可以为分体式结构构成(图未示)。
光电模块2还可采用其他结构与底座3实现连接。如图2和图33所示，一些实施例中，光电模块2采用磁性连接的方式与底座3固定(该实施例中，其他基本结构同前述实施例)。具体的，光电模块2的第一绝缘部202具有第一凸出部2101，第一凸出部2101上设置磁铁2102，而底座3包括铁制成的部分或部件，因此，可通过磁铁2102而直接吸附至底座3上完成固定。其他实施例中，磁铁也可以设置在不同的位置，如设置在光源模组22、电源模组23或第二绝缘部203上，此处不再赘述。如图34所示，光电模块2还可采用螺纹固定的方式连接至底座3(该实施例中，其他基本结构同前述实施例)。具体的，光电模块2的第一绝缘部202具有第一凸出部2101，第一凸出部2101上设置螺栓2103，螺栓2103与底座3连接，以此完成对光电模组2的固定。其他实施例中，螺栓也可以设置在不同的位置，如设置在光源模组22、电源模组23或第二绝缘部上，此处不再赘述。于一实施例中，如图35和图36所示，光电模组2还可采用其它的螺纹固定方式连接至底座3，底座3上设有多个通孔3201a，通孔3201a可位于一圆周上，光电模组2的第一绝缘部202上设有螺纹孔，螺钉穿过通孔至螺纹孔，从而将光电模组2固定于底座上。于一些实施例，如图37所示，底座3上设有多个通孔3201b，通孔3201b可位于一圆周上，通孔3201b内放置有螺柱3202，使螺柱3202压铆在底座3上，光电模组2的第一绝缘部202上设有螺孔3203，螺钉穿过螺孔3203至螺柱3202上，从而将光电模组2固定于底座3上。
图38所示的LED灯具的基本结构同前述实施例的灯具(吸顶灯)，所不同的是光电模组2与底座3的具体固定方式，具体地，如图38和39所示，底座3上设有安装部31，安装部31包括固定部314及与固定部314连接的倾斜部317，固定部314包括上限位部3141、与上限位部3141相对设置的下限位部3142， 下限位部3142连接倾斜部317，上限位部3141与下限位部3142之间设有连接部3143，连接部3143连接有定位部313，定位部313与倾斜部317的位置相对。光电模组2的一部分边角沿着倾斜部317滑入至下限位部3142后通过定位部313保持固定状态，上限位部3141的表面接触光电模组2的部份表面。
安装部31的空间位置位于图39所示的笛卡尔坐标系(X,Y,Z)中，X-Y平面平行于下限位部3142的上表面，设倾斜部317与X-Y平面的夹角为α，夹角α的范围为0＜α≤20°，优选5°＜α≤15°；定位部313与X-Z平面的夹角为β，夹角β的范围为10°≤β≤50°，优选20°≤β≤40°，通过调节β，可将光源模组22固定于安装部31中。定位部313上设有弹板3131，弹板3131与X-Z方向的夹角γ的范围为28°＜γ＜68°，优选38°≤γ≤58°，当光电模组2出现损坏，需要进行更换时，可将光电模组2从固定部中滑出，通过设计γ，可使使用者便捷的更换光电模组2，提高工作效率。设定位部313在Z轴方向上的最大长度为L1，光电模组2滑入至下限位部3142时，光电模组2在Z轴方向上的最小长度为L2，L1与L2之和大于上限位部3141至下限位部3142的距离D，以此使得光电模组的固定效果更佳。
于一实施例中，如图40和41所示，提供一种LED灯具，该LED灯具的基本结构同前述实施例的灯具(吸顶灯)。所不同的是光电模组2及底座3的具体固定方式。具体的，参见图40和图41，本实施例中的光电模组2上设有安装孔28，安装孔28可位于光电模组2的两端，底座3上设有安装部31，安装孔28的数量与安装部31的数量相同，安装部31包括支撑部311与固定于支撑部311上的扣件部312，扣件部312包括伸缩部3121和限位部3122，光电模组安装时，将光电模组2上的安装孔28对准扣件部312，然后给光电模组2施加力，使伸缩部3121受力压缩进入光电模组2的安装孔28中，进而光电模组2卡入 伸缩部3121与限位部3122之间的空隙中。安装孔28的高度不小于伸缩部3121与限位部3122之间的最小距离，优选安装孔28的高度等于伸缩部3121与限位部3122之间的最小距离，运输过程中光电模组2不会出现晃动，光电模组的固定效果佳。安装完成后如图41所示，采用这种安装方式，操作方法简单，方便使用者进行安装，提高工作效率，而且固定效果佳，生产成本低，适于产业化。
参见图26至图32，安装部31还包括第二安装部316，已提供对灯罩1的固定。具体的，灯罩1具有壁部11，且灯罩1可设置为回转体结构。壁部11具有边缘，壁部11的边缘设置第二凸出部1101，第二凸出部1101相对壁部11的边缘向灯罩1的径向的内侧凸部。第二凸出部1101可沿灯罩1的周向而设置多个。第二安装部316具有一第二卡槽3114。当灯罩1固定至底座3时，第二凸出部1101卡入第二卡槽3114固定。本实施例中，灯罩1以转动的形式(大致为绕LED灯具轴线而转动)将第二凸出部1101卡入第二卡槽3114或从第二卡槽3114松脱。本实施例中，第二卡槽3114在LED灯具的轴向方向上的两侧通过第二安装部316与底座3而封闭，因此，当第二凸出部1101卡入第二卡槽3114后，第二凸出部1101在LED灯具厚度方向上的两侧受限位。其他实施例中，第二卡槽3114在LED灯具的轴向方向上的两侧通过第二安装部316的自身的结构而封闭，以达到上述相同的作用。本实施例中，第二安装部316具有定位单元，以对卡入第二卡槽3114的第二凸出部1101起到定位作用。具体的，定位单元包括一第二弹性臂3115，第二弹性臂3115与第二安装部316之间形成一第二凹槽3116，在所述固定位置时，第二凸出部1101在LED灯具径向的端部卡入所述第二凹槽3116内，以实现对灯罩1的定位固定。第二弹性臂3115上形成一第二阻挡部31151。通过第二弹性臂3115的设置，当第二凸出部1101需要从第二卡槽3114脱出时而转动灯罩1时，需要先克服第二阻挡部31151的阻碍(即 需要施力于灯罩1，从而使第二凸出部1101挤压第二弹性臂3115，以使其实现松脱)，从而可防止因误操作或碰撞等，导致灯罩1从第二卡槽3114松脱。本实施例中，灯罩1固定时，第二弹性臂3115可施力于第二凸出部1101，以进一步起到紧固灯罩1的作用。第二弹性臂3115可一体成型于所述第二安装部316。第二弹性臂3115可为片状结构，以其自身的材料属性(可采用现有技术中的具有弹性的材质，如塑料或金属)而具有弹性。第二阻挡部31151可通过第二弹性臂3115的弯折(或在第二弹性臂3115设置弯折)而直接成型。
本申请中的灯罩1可采用不同的结构，参见图1至图48，一实施例中，灯罩1具有平滑的弯曲表面以防止灯罩1截面的折射率差异而导致光分布不均匀。一实施例中，灯罩1包括中央部和环绕中央部的周边部，灯罩1具有光扩散层，光扩散层包含光扩散粒子，中央部中光扩散粒子的密度大于周边部中光扩散粒子的密度，以使灯具中央与周边的亮度均匀。一实施例中，灯罩1具有多个扩散区域，其中一扩散区域与光电模组2在Z轴方向上重叠，可以改善灯具闪光。一实施例中，灯罩1的内表面或外表面可设有增亮膜，对光源模组2发出的光进行光能分配，从而实现LED灯具出光均匀，避免产生眩光。此处的内表面与外表面为相对位置，灯罩1的内表面为靠近光电模组2的表面。一实施例中，灯罩1上设有通孔，用于将灯罩1安装到底座3上的安装螺钉游隙地插入到灯罩1的通孔中，并且被拧到底座3上，由此，即使灯罩和底座由于因灯具的开闭引起的温度变化而膨胀或收缩，也可以通过游隙减小由膨胀或收缩产生的应力，可以防止灯罩和器具破裂或产生噪音。
在其他实施例中，灯罩1与第一绝缘部202之间可设有导光板，导光板例如是透明的丙烯树脂成型体，导光板可采用不同结构，一实施例中，导光板的端部(靠近底座3边缘的一端)的发光强度为LED芯片2201主发光方向上发 光强度(最大发光强度)的30％所对应角度的发光强度；一实施例中，导光板覆盖电路板201，导光板具有非对称第一弯曲部及第二弯曲部，LED芯片2201发出的光一部分导向第一弯曲部，一部分导向第二弯曲部，从而使灯具发光均匀；一实施例中，导光板的表面可形成有点状的散射体，以实现发光面发光均匀；一实施例中，导光板包括把来自LED芯片2201发出的光导向导光板的外周的主导光部及朝向灯具中央部分引导和发散来自LED芯片2201的光的辅助导光部；一实施例中，导光板包括引入光至灯具内部的引入单元及将光引导至灯具外部的的导出单元，可抑制导光板的亮度不均匀和眩光；一实施例中，导光板具有内侧面及与之相对应的外侧面，内侧面的曲率半径大于外侧面的曲率半径，可抑制灯罩1上出现亮斑；一实施例中，电路板201上设有多组LED芯片组221，LED芯片组221包括多个LED芯片2201，LED芯片2201的发光面朝向导光板的入射端面，多个LED芯片组221在电路板201的长度方向上配置为直线状，从电路板201长度方向的端缘朝向中心线依次以直线状安装着第一LED芯片组、第二LED芯片组、第三LED芯片组，设电路板201的端缘与第一LED芯片组之间为第一相离尺寸L1，第一LED芯片组与第二LED芯片组之间为第二相离尺寸L2，第二LED芯片组与第三LED芯片组之间为第三相离尺寸L3，L1<L2<L3，导光板不易产生暗部；一实施例中，导光板具有透光性基材，透光性基材的主表面上设有多个凹棱镜部，凹棱镜部覆盖有涂层，防止尘埃累积在主表面和棱镜部内，涂层厚度足够小，可以抑制导光板的光学性能下降。上述导光板的设置可与前述电路板上LED芯片的排列不相互排斥的情况搭配组合。
于一实施例中，电路板201为环状，例如前述实施例中光电模组2b的电路板201，灯罩1与第一绝缘部202之间可设有导光板，LED芯片2201的发光面 朝向灯具的中央，导光板可采用不同的结构，一实施例中，导光板的厚度呈倾斜状，其厚度从外周部向中央部逐渐减少，使导光板亮度均匀；一实施例中，电路板201上设有第一LED芯片组、第二LED芯片组，第一LED芯片组从第一导光板的入射端面入射，第二LED芯片组从第二导光板的入射，入射的光朝第一导光板、第二导光板的上表面及下表面出射，第一导光板、第二导光板沿其厚度方向具有透光性，以使灯具具有三维的发光效果；一实施例中，环形电路板201上依次覆盖反射罩、导光板和集光罩，导光板的凸起部插入反射罩的凹入部，集光罩具有覆盖在导光板内部的出射面的透镜区，透镜区与导光板上的凹入的反射部位于光学相对的位置，使灯具发出的光具有窄取向。
本申请LED灯具中的底座可采用不同的结构，图42是本申请LED灯具中底座的一实施例的结构示意图，底座3位于一空间直角坐标系(X,Y,Z)内，其中Z轴与LED灯具的中心轴平行，底座3为圆盘状，例如利用铝板或者钢板等制成，如图42和图43所示，底座3的中央部分形成有孔洞33，孔洞33的周围形成有支撑部34及边缘部35，支撑部34与边缘部35之间具有间隔，间隔沿Z轴负方向延伸形成凹槽部36，支撑部34与边缘部35在Z轴正方向上处于同一位置，当然在其它实施例中，支撑部34与边缘部35在Z轴正方向上处于不同的位置，例如，支撑部34在Z轴正方向上的高度大于边缘部35。光电模块2具有上表面及与上表面相对的下表面，光电模组2的下表面远离灯罩1，灯罩1的下表面与支撑部34呈面接触的状态，从而将光电模组产生的热量通过底座传递出去，提高散热速度。其它实施例中，光电模组2与支撑部34不是成完全贴合的面接触状态，光电模组2与支撑部34之间会存在一部分的间隙，可在间隙中填充一些导热胶层，LED芯片2201产生的在工作时产生的热量能够通过电路板201以及导热胶层快速快递至底座3上，提高了散热能力。
于一实施例中，底座3上可设有亮度传感器，且亮度传感器的安装位置设置在未有灯具的直射光照射的位置，根据外部光线引起的亮度增加来连续调节灯具的照明条件，以实现节能和减少环境负荷，同时适当地抑制过度的电力消耗。一实施例中，底座3上设有加强筋，从而增加底座强度，降低了底座的厚度。
使用者一般通过遥控器设置了唤醒使用者的时间，为了确定灯具已经接收到遥控器的信号，现在一般是通过蜂鸣器的电子声音提醒使用者，但蜂鸣器一般是配置在双侧配线的电路板上，对于单侧配线的电路板，声音发生元件则需安装在电路板靠近天花板的一侧，由于电路板等阻隔，声音发生元件发出的声音传播至使用者时音量较小，一实施例中，底座3上设有面对电路板201设置的对置部，电路板201上设有与对置部相对应的开口，声音发生元件安装在与LED芯片2201不同侧的表面上，声音发生元件产生声音时，声音由对置部反射后通过开口传播，确保使用者能获得期望的音量。
图44是本申请光电模组的一实施例的结构示意图，参见图42至图45，光电模组2在相对于凹槽部36的位置处设有电源模组23，电源模组23包括第一电源模组231与第二电源模组232，第二电源模组232在Z轴正方向上的高度大于LED芯片2201的高度，吸顶灯安装完成后，第二电源模组232位于底座的凹槽部36中，优选第二绝缘部203与凹槽部36的侧壁相接触，增加接触面积，提高导热能力。因在底座3上不需要例如用于收纳第二电源模组232的收纳空间，从而将LED灯具变薄(即在Z轴方向上的高度缩短)，降低包装及库存成本，此外，光电模组2能够远离灯罩1，使光源模组22到达灯罩1的边缘的光量增加。换言之，在平面视灯罩1的情况下，能够使灯罩1的边缘照亮地很明亮。其结果是，例如从LED灯具发出的光，能够照射更广的范围。
底座还可采用其它不同的结构，一实施例中，底座3的直径大于灯罩1的直径，底座3上位于灯罩1外部的区域设有子发光部，可以有效提高灯具的照射范围。一实施例中，底座3上设有衬垫，从衬垫的表面突出多个凸部，灯罩1上设有与凸部对应的凹部，凹部的深度大于凸部从衬垫表面突出的高度，当凸部装配到凹部中时，灯罩1的周缘被压靠在衬垫上，并且消除了它们之间的间隙，从而可以有效地防止昆虫进入灯罩1。
图46和47为本申请LED灯具一实施例的结构示意图，LED灯具包括灯罩1、光电模组2、底座3，其基本结构同前述实施例，在此不重复叙述，不同之处在于，此LED灯具采用上述光电模组2b，光电模组2b的结构参照上述实施例，如图46和47所示，所述LED灯具位于一空间直角坐标系(X,Y,Z)内，Z轴平行于LED灯具的中心轴，所述LED灯具还包括底盘6，底盘6连接至底座3，反光件29具有端点A和顶点B，端点A位于LED光源模组22与电源模组23之间，顶点B为在Z轴反向上的最高点，则反光件29的高度(或顶点B至端点A在Z轴方向上的距离)z＝(a 2+b 2-2abcosα) 1/2*sinβ，a为LED芯片2201至端点A的直线距离；b为LED芯片2201至顶点B的直线距离；α为LED芯片2201至端点A的直线与LED芯片2201至顶点B的直线的夹角，α小于LED芯片2201的发光角度，即0＜α＜120°；β为直线AB(端点A与端点B的连线)与X轴方向的夹角。通过设计a及β，可调整反光件的高度，以得到优异的反光效果，从而得到较佳的光分布。一实施例中，反光件29朝远离电源模组23的方向(即Z轴负方向)拱起，一方面可增加电源模组23的散热空间；另一方面，可完全罩住电源模组，起到绝缘的作用，以防触电。一实施例中，电源模组23可通过胶粘或卡扣的方式固定于底座3上，一实施例中，如图47所示，底座3上可设有凹槽32，电源模组23中的电元器件(例如电感、电容等)可位 于凹槽32中，凹槽32可为电元器件增大散热空间，此外还可缩短散热路径，从而降低电源模组23的温度。
LED芯片2201包括LED灯珠，如图48所示，LED灯珠发出的光会经过C、D、E及F四个界面，C界面为LED灯珠的封装层与空气的界面，D界面为空气与反光件29的界面，E界面为空气与灯罩的界面，F界面为灯罩与空气的界面。设LED灯珠的封装层的折射率为n1，灯罩的折射率为n2，空气的折射率为n3，为提高光的利用率，主要是要降低C、E及F界面的反射，以及提高D界面的反射。C、E及F界面的反射会降低LED灯具的光通量，因而需对LED灯珠的封装层及灯罩的材料进行选择，根据反射率与折射率之间的关系，当光在C界面、F界面垂直入射时，可设置1-(n1-1) 2/(n1+1) 2-(n2-1) 2/(n2+1) 2＞0.9，通过对选择合适折射率的材料，可有效提高LED灯具的光通量。
此外因为n1、n2均大于n3，当入射角大于临界角时，会发生全反射，为减少C界面、E界面的反射，可在LED芯片2201的表面、灯罩1的内表面分别设置第一折射率匹配层、第二折射率匹配层，第一折射率匹配层的折射率n4＝(n1*n3) 1/2，第二折射率匹配层的折射率n5＝(n2*n3) 1/2，一实施例中，n1的范围为1.4～1.53，则n4的范围为1.18～1.24；一实施例中，n2的范围为1.5～1.7，则n5的范围为1.22～1.3，此时0.16≤n1-n4≤0.35，0.18≤n4-n3≤0.24；0.2≤n2-n5≤0.48，0.22≤n5-n1≤0.3，由此可知，设置第一折射率匹配层、第二折射率匹配层后，可有效减少光的反射，提高光的利用率。
关于第一折射率匹配层的厚度d1、第二折射率匹配层的厚度d2，可使反射光干涉相消，以进一步减少光的反射。由于n1＞n4＞n3，不存在半波损失，由于可见光的波长范围为400～760nm，为减少蓝光对人眼的危害以及提高人体对光的舒适感，因此需要增加蓝光的反射及减少红光的反射，可在第一折射率匹 配层时主要增加蓝光反射，则第一折射率匹配层的厚度d1＝(2k+1)λ/[4*((n4 2-n1 2*sinα 2) 1/2)]，(k＝0,1,2,3…..)，α为光从LED灯珠的封装层射入第一折射率匹配层的入射角，λ为蓝光的波长。
第二层折射率匹配层主要减少红光的反射，则第二折射率匹配层的厚度为d2＝kλ/[2*(n5 2-n2 2*sinβ 2) 1/2](k＝1,2,3…..)。β为光从灯罩射入第二折射率匹配层的入射角，λ为红光的波长；通过以上两层厚度的设置，可使LED灯具达到较佳的色温，使室内具有温暖舒适的氛围。
在其它实施例中，也可将第一折射率匹配层设为主要减少红光的反射，d1＝kλ/[2*(n4 2-n1 2*sinα 2) 1/2](k＝1,2,3…..)，α为光从LED灯珠的封装层射入第一折射率匹配层的入射角，λ为红光的波长，第二折射率匹配层为主要增加蓝光反射，d2＝(2k+1)λ/[4*((n5 2-n2 2*sinβ 2) 1/2)]，(k＝0,1,2,3…..)，β为光从灯罩射入第二折射率匹配层的入射角，λ为蓝光的波长。
于一实施例中，灯罩1的外表面上可设有多层光学膜，光从灯罩1至空气传播方向上，多层光学膜的折射率依次为n H，n L，n H，n L……，n H，H表示高折射率膜，L表示低折射率膜。在其它实施例中，光从灯罩1至空气传播方向上，多层光学膜的光学厚度分别为0.5λ1，0.25λ2，0.5λ1，0.25λ2……，0.5λ1，λ1为蓝光的波长，λ2为红光的波长，因可见光波长范围宽，单层光学膜不能很好的达到增透或增反效果，采用多层光学膜，可根据灯具的显色指数或色温要求，对不同波长的光进行增透或增反，以得到优异的出光效果。
本申请的LED灯具还可设置一些其它的结构。一实施例中，LED灯具中设有辅助光源，辅助光源向斜上方发射光并将光辐射至天花板，从而改善空间的亮度感。于一实施例中，灯具的高度(h)与宽度(w)满足关系式4≤w/h≤9。由此，可以实现能够获得期望亮度和期望光分布的照明光作为顶灯的照明器具， 同时减少由于器具本体的存在而产生的重压痕。于一实施例中，灯罩1与底座3通过卡扣连接，两者连接的间隙处设有包含昆虫趋避剂的趋避剂保持层，有效防止虫进入灯具内部。于一实施例中，与电路板201垂直的位置上设有背光光源，远离底座3一侧的背面光源的LED芯片数量大于靠近底座3一侧的背光源的LED芯片的数量，可使发光面照度均匀。
以上所述本申请的各种实施例特征，可以在不相互排斥的情况下任意组合变换，并不局限于具体的一种实施例中。例如图18所示的实施例中所述，这些特征虽然未在图43所示的实施例中说明亦可包括有图18实施例所述特征，但很显然，本领域普通技术人员可以根据图18的说明不经创造性的将此等特征应用于图43；又例如，本申请虽然以LED吸顶灯为例对各种创作方案进行了说明，但明显的这些设计均可以不经创造性的应用于其他形状或者类型的灯中，在此不再一一列举。
本申请中的灯罩、光电模组、底座及其应用的LED灯具各实施例的实现已如前所述，需要提醒的是，以上所述各个实施例中涉及的诸如“灯罩”、“电路板”、“绝缘单元”、“LED芯片的排布方式”、“底座”等特征在不相互冲突的情况下可以包括一个、两个、多个或者所有技术特征。有关的对应内容系可选自于包含有对应实施例中的技术特征之一或其组合。
本申请在上文中已以较佳实施例揭露，然熟悉本项技术者应理解的是，该实施例仅用于描绘本申请，而不应解读为限制本申请的范围。应注意的是，举凡与该实施例等效的变化与置换，均应设为涵盖于本申请的范畴内。因此，本申请的保护范围当以所附的权利要求书所界定的范围为准。

Claims (10)

  1. 一种LED灯具，其特征在于，包括灯罩、与灯罩相连接的底盘，所述灯罩与底盘所形成的容置空间内设有光电模组，所述光电模组包括光源模组和电源模组，所述底座的中央部分形成有孔洞，所述孔洞的周围形成有支撑部及边缘部，所述支撑部与边缘部之间具有间隔，所述光电模组与所述支撑部存在间隙。
  2. 如权利要求1所述的LED灯具，其特征在于，所述光电模组包括电路板，所述电路板包括相对设置的第一面和第二面，所述第一面朝向所述灯罩，所述的第二面包括第七区域和第八区域，所述电源模组的电子元件包括发热元件和不耐热元件，其中所述发热元件和不耐热元件分别位于所述第七区域和第八区域。
  3. 如权利要求2所述的LED灯具，其特征在于，所述电路板上设有多组LED芯片组，每个LED芯片组包括多个LED芯片，所述第一面包括与第七区域相对的第五区域和与诉搜狐第八区域相对的第六区域，位于所述第五区域内的LED芯片的数量小于位于所述第六区域内的LED芯片数量。
  4. 如权利要求3所述的LED灯具，其特征在于，所述LED芯片的仰俯角为90*(1/n)°。
  5. 如权利要求2所述的LED灯具，其特征在于，各LED芯片组位于同一圆周上，每个LED芯片组包括一种光色的LED芯片，每个圆周上的LED芯片在周向方向上错开。
  6. 如权利要求2所述的LED灯具，其特征在于，所述光电模组还包括绝缘单元，所述绝缘单元包括覆盖第一面上所有电子元件的第一绝缘部和覆盖第二面上所有电子元件的第二绝缘部。
  7. 如权利要求6所述的LED灯具，其特征在于，所述第一绝缘部从所述光源模组的一端沿光源模组的径向方向至光源模组的另一端具有一定的弧度。
  8. 如权利要求6所述的LED灯具，其特征在于，所述电源模组与第二绝缘部之 间具有一定的间隔。
  9. 如权利要求1所述的LED灯具，其特征在于，所述灯罩具有壁部，且所述灯罩为回转体结构，所述壁部的边缘设有第二凸出部，所述第二凸出部相对壁部的边缘向灯罩的径向的内侧凸部。
  10. 如权利要求9所述的LED灯具，其特征在于，所述LED灯具还包括用于将所述光电模组固定至所述底座的安装部，所述安装部包括第二安装部，所述第二安装部具有第二卡槽，所述灯罩固定至所述底座时，所述第二凸出部卡入所述第二卡槽固定。
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114263873B (zh) * 2021-12-28 2023-06-06 重庆长安汽车股份有限公司 一种汽车顶棚灯
DE102022104482A1 (de) 2022-02-24 2023-08-24 LUNITE GmbH Modulare Leuchteinheit
DE202022102261U1 (de) 2022-04-27 2023-08-07 Thorn Lighting Limited Flächenleuchte mit rückseitiger (Sekundär-)Beleuchtung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203656657U (zh) * 2013-12-30 2014-06-18 广州市鸿利光电股份有限公司 一种cob光源
CN104295952A (zh) * 2014-08-22 2015-01-21 广州市珠江灯光科技有限公司 照明装置及其制作方法
US20160025287A1 (en) * 2013-02-04 2016-01-28 Herman N. Philhower, as Trustee of the H N Philhower Family Trust (last dated Oct. 31, 2012) Solar Powered Ground Light
CN205606410U (zh) * 2016-03-15 2016-09-28 宏齐光电子(深圳)有限公司 一种led贴片式吸顶灯
CN206708963U (zh) * 2017-04-05 2017-12-05 广州武宏科技股份有限公司 一种led吸顶灯
CN207350040U (zh) * 2016-06-15 2018-05-11 深圳市聚作照明股份有限公司 一种吸顶灯
CN208509377U (zh) * 2018-07-19 2019-02-15 珠海格力电器股份有限公司 电路板组件、控制器及电器装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7748886B2 (en) * 2005-01-10 2010-07-06 The L.D. Kichler Co. Incandescent and LED light bulbs and methods and devices for converting between incandescent lighting products and low-power lighting products
US8465175B2 (en) * 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
CN201028326Y (zh) * 2007-02-14 2008-02-27 保定北辰太阳能有限公司 一种新型led照明发光体
US7731396B2 (en) * 2007-12-21 2010-06-08 Tpr Enterprises, Ltd. LED socket string
CN201638811U (zh) * 2010-01-15 2010-11-17 杜姬芳 大功率led封装结构
JP5757214B2 (ja) * 2011-09-30 2015-07-29 東芝ライテック株式会社 Ｌｅｄ照明装置
CN202452321U (zh) * 2011-12-15 2012-09-26 宋光荣 Led吸顶灯
US20130249375A1 (en) * 2012-03-21 2013-09-26 George W. Panagotacos Anti-icing solid state aircraft lamp assembly with defroster apparatus, system, and method
US20130335980A1 (en) * 2012-06-13 2013-12-19 Panasonic Corporation Light emitting device and lighting fixture
CN104100911A (zh) * 2013-04-15 2014-10-15 吴铭远 户外型led灯具结构
CN103363354A (zh) 2013-06-28 2013-10-23 宁波福泰电器有限公司 仿白炽灯光照角度的led灯
CN103528010A (zh) * 2013-09-22 2014-01-22 上海俪德照明科技股份有限公司 一种led光电模组
CN203631546U (zh) * 2013-11-21 2014-06-04 广东融捷光电科技有限公司 一种大功率集成封装芯片排布结构
CN203607458U (zh) * 2013-12-02 2014-05-21 深圳市邦贝尔电子有限公司 Led灯珠
CN103775876B (zh) 2014-01-15 2016-03-16 深圳市杰科电子有限公司 用于低压室内供电系统的led灯具
JP6344719B2 (ja) * 2014-10-09 2018-06-20 パナソニックＩｐマネジメント株式会社 照明器具
CN204201710U (zh) * 2014-12-01 2015-03-11 张雅芬 一种led吊灯
CN204459981U (zh) * 2015-01-20 2015-07-08 深圳市裕富照明有限公司 具有可见光通信功能的吸顶灯
CN104864325B (zh) * 2015-06-09 2017-10-13 珠海金晟照明科技有限公司 路灯灯头
WO2017019627A1 (en) * 2015-07-24 2017-02-02 Curtis Roys Method and assembly for replacing incandescent lights
CN105402618A (zh) 2015-12-04 2016-03-16 江阴乐圩光电股份有限公司 Led灯
WO2017152739A1 (zh) * 2016-03-07 2017-09-14 欧普照明股份有限公司 光学元件、光源模组及照明装置
CN206076231U (zh) * 2016-09-26 2017-04-05 佛山市国星光电股份有限公司 一种led灯丝及其灯丝灯
US10487989B2 (en) * 2017-03-02 2019-11-26 Opple Lighting Co., Ltd. LED lighting device
US10288274B2 (en) * 2017-05-05 2019-05-14 Ilsung Co., Ltd. LED lighting apparatus having flame barriers
CN107830478A (zh) * 2017-09-27 2018-03-23 苏州城时实业有限公司 太阳能led路障灯制造方法
CN107763455B (zh) * 2017-11-07 2024-04-05 浙江阳光美加照明有限公司 带接插件的光电模组以及使用该光电模组的led球泡灯
CN212156699U (zh) * 2017-12-08 2020-12-15 嘉兴山蒲照明电器有限公司 一种led灯

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160025287A1 (en) * 2013-02-04 2016-01-28 Herman N. Philhower, as Trustee of the H N Philhower Family Trust (last dated Oct. 31, 2012) Solar Powered Ground Light
CN203656657U (zh) * 2013-12-30 2014-06-18 广州市鸿利光电股份有限公司 一种cob光源
CN104295952A (zh) * 2014-08-22 2015-01-21 广州市珠江灯光科技有限公司 照明装置及其制作方法
CN205606410U (zh) * 2016-03-15 2016-09-28 宏齐光电子(深圳)有限公司 一种led贴片式吸顶灯
CN207350040U (zh) * 2016-06-15 2018-05-11 深圳市聚作照明股份有限公司 一种吸顶灯
CN206708963U (zh) * 2017-04-05 2017-12-05 广州武宏科技股份有限公司 一种led吸顶灯
CN208509377U (zh) * 2018-07-19 2019-02-15 珠海格力电器股份有限公司 电路板组件、控制器及电器装置

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