WO2021010205A1 - 封止用樹脂シート - Google Patents

封止用樹脂シート Download PDF

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Publication number
WO2021010205A1
WO2021010205A1 PCT/JP2020/026413 JP2020026413W WO2021010205A1 WO 2021010205 A1 WO2021010205 A1 WO 2021010205A1 JP 2020026413 W JP2020026413 W JP 2020026413W WO 2021010205 A1 WO2021010205 A1 WO 2021010205A1
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Prior art keywords
resin sheet
sealing
mass
sealing resin
filler
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PCT/JP2020/026413
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English (en)
French (fr)
Japanese (ja)
Inventor
祐作 清水
剛志 土生
大樹 ▲濱▼名
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日東電工株式会社
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Priority to KR1020227000272A priority Critical patent/KR20220032048A/ko
Priority to CN202080050036.4A priority patent/CN114174421B/zh
Priority to JP2021532793A priority patent/JP7577659B2/ja
Priority to TW109123361A priority patent/TWI850422B/zh
Publication of WO2021010205A1 publication Critical patent/WO2021010205A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Definitions

  • the present invention relates to a sealing resin sheet, specifically, a sealing resin sheet for sealing an element.
  • thermosetting resin is heat-cured to be a sealing sheet. It is known to form a cured product from (for example, see Patent Document 1 below).
  • the semiconductor elements and electronic components provided in them are also required to be miniaturized. Along with this, it is also required to improve the dimensional accuracy at the time of curing for the resin (cured body) that protects the semiconductor element and the electronic component. Specifically, there is a demand for further reducing the amount of the cured product that penetrates between the semiconductor element, the electronic component, and the substrate from the side edge of the semiconductor element or the electronic component.
  • the present invention provides a sealing resin sheet that can sufficiently seal an element and can reduce the intrusion of a cured product between an element represented by a semiconductor element or an electronic component and a substrate.
  • the present invention [1], at a shear rate of 0.01 rad / sec, a viscosity of 85 °C ( ⁇ 0.01) is, and the 8 ⁇ 10 5 Pa ⁇ s or more, at a shear rate of 0.1 rad / sec, 85 ° C. Is a sealing resin sheet having a viscosity ( ⁇ 0.1 ) of less than 8 ⁇ 10 5 Pa ⁇ s.
  • the viscosity at 85 ° C. ( ⁇ 0.01 ) at a shear rate of 0.01 rad / sec and the viscosity at 85 ° C. ( ⁇ 10 ) at a shear rate of 10 rad / sec are expressed by the following equation (1).
  • ⁇ 0.01 / ⁇ 10 ⁇ 70 (1)
  • the sealing according to the above [1] or [2], wherein the viscosity ( ⁇ 10 ) at 85 ° C. at a shear rate of 10 rad / sec is 0.4 ⁇ 10 5 Pa ⁇ s or less. Contains a resin sheet for use.
  • a viscosity of 85 °C ( ⁇ 0.01) is, and the 8 ⁇ 10 5 Pa ⁇ s or more, at a shear rate of 0.1 rad / sec , 85 ° C. viscosity ( ⁇ 0.1 ) is less than 8 ⁇ 10 5 Pa ⁇ s.
  • the element can be sufficiently sealed, and when the sealing resin sheet is heated to form a cured body, the amount of the cured body invading between the element and the substrate can be reduced.
  • FIG. 1A to 1D are cross-sectional views of a process of manufacturing an electronic element package by encapsulating a plurality of electronic elements using the first embodiment of the sealing resin sheet of the present invention.
  • a step of preparing a sealing resin sheet FIG. 1B is a step of preparing an electronic element
  • FIG. 1C is a step of pressing a sealing resin sheet to form a sealing body
  • FIG. 1D is a step of forming a sealing body. This is a step of heating to form a cured product.
  • 2A to 2D are cross-sectional views of a process for manufacturing an electronic element package by encapsulating a plurality of electronic elements using the second embodiment of the sealing resin sheet of the present invention.
  • a step of preparing a multilayer resin sheet for sealing FIG.
  • FIG. 2B is a step of preparing an electronic element
  • FIG. 2C is a step of pressing a multilayer resin sheet for sealing to form a sealed body
  • FIG. 2D is a step of sealing. This is a step of heating the body to form a cured product.
  • 3A to 3D are process cross-sectional views of the method for measuring the cured body penetration length Y in the examples
  • FIG. 3A is a step of preparing a multilayer resin sheet for sealing (step A)
  • FIG. 3B is a process.
  • FIG. 3C is a step of pressing a multilayer resin sheet for sealing to form a sealing body
  • FIG. 3D is a step of heating the sealing body. This is a step (step D) of forming a cured product.
  • the sealing resin sheet of the present invention has a viscosity at 85 ° C. at a predetermined shear rate in a viscoelasticity measurement described later, which is a predetermined value.
  • the sealing resin sheet is a resin sheet for sealing an element, and has a substantially plate shape (film shape) extending in a plane direction orthogonal to the thickness direction.
  • the material of the sealing resin sheet contains, for example, a thermosetting resin and a thermoplastic resin.
  • thermosetting resin examples include epoxy resin, silicone resin, urethane resin, polyimide resin, urea resin, melamine resin, and unsaturated polyester resin.
  • thermosetting resin can be used alone or in combination of two or more.
  • thermosetting resin an epoxy resin is preferable.
  • the epoxy resin is prepared as an epoxy resin composition containing a main agent, a curing agent and a curing accelerator.
  • the main agent examples include bifunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol A type epoxy resin, modified bisphenol F type epoxy resin, and biphenyl type epoxy resin, for example, phenol novolac type epoxy resin. , Cresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylol ethane type epoxy resin, dicyclopentadiene type epoxy resin and other trifunctional or higher functional epoxy resins. These main agents can be used alone or in combination of two or more. As the main agent, a bifunctional epoxy resin is preferable, and a bisphenol F type epoxy resin is more preferable.
  • the lower limit of the epoxy equivalent of the main agent is, for example, 10 g / eq. , Preferably 100 g / eq. Is.
  • the upper limit of the epoxy equivalent of the main agent is, for example, 300 g / eq. , Preferably 250 g / eq. Is.
  • the lower limit of the softening point of the main agent is, for example, 50 ° C., preferably 70 ° C., more preferably 72 ° C., and even more preferably 75 ° C.
  • the upper limit of the softening point of the main agent is, for example, 130 ° C., preferably 110 ° C., and more preferably 90 ° C.
  • the sealing resin sheet 1 can flow in the step shown in FIG. 1C. Therefore, the time of the step shown in FIG. 1C can be shortened, and one surface of the sealing resin sheet 1 in the thickness direction in the step shown in FIG. 2C can be flattened.
  • the lower limit of the ratio of the main agent in the material is, for example, 1% by mass, preferably 2% by mass.
  • the upper limit of the proportion of the base material in the material is, for example, 30% by mass, preferably 15% by mass.
  • the lower limit of the proportion of the main agent in the epoxy resin composition is, for example, 30% by mass, preferably 50% by mass.
  • the upper limit of the proportion of the main agent in the epoxy resin composition is, for example, 80% by mass, preferably 70% by mass.
  • the curing agent is a latent curing agent that cures the above-mentioned main agent by heating.
  • the curing agent include phenolic resins such as phenol novolac resin. If the curing agent is a phenol resin, the phenol resin is the main agent and the cured products have high heat resistance and high chemical resistance. Therefore, the cured product has excellent sealing reliability.
  • the ratio of the curing agent is set so as to have the following equivalent ratio.
  • the lower limit of the total number of hydroxyl groups in the phenol resin with respect to 1 equivalent of the epoxy group in the main agent is, for example, 0.7 equivalent, preferably 0.9 equivalent.
  • the upper limit of the total number of hydroxyl groups in the phenol resin with respect to 1 equivalent of the epoxy group in the main agent is, for example, 1.5 equivalents, preferably 1.2 equivalents.
  • the lower limit of the number of parts containing the curing agent with respect to 100 parts by mass of the main agent is, for example, 20 parts by mass, preferably 40 parts by mass.
  • the upper limit of the number of parts containing the curing agent with respect to 100 parts by mass of the main agent is, for example, 80 parts by mass, preferably 60 parts by mass.
  • the curing accelerator is a catalyst (thermosetting catalyst) that accelerates the curing of the main agent by heating.
  • the curing accelerator include organic phosphorus compounds, for example, imidazole compounds such as 2-phenyl-4,5-dihydroxymethylimidazole (2PHZ-PW).
  • an imidazole compound is mentioned.
  • the lower limit of the number of parts containing the curing accelerator with respect to 100 parts by mass of the main agent is, for example, 0.05 parts by mass.
  • the upper limit of the number of parts containing the curing accelerator with respect to 100 parts by mass of the main agent is, for example, 5 parts by mass.
  • the lower limit of the content ratio of the thermosetting resin in the material (sealing resin sheet) is, for example, 5% by mass, preferably 10% by mass, and more preferably 13% by mass.
  • the upper limit of the content ratio of the thermosetting resin in the material (sealing resin sheet) is, for example, 30% by mass, preferably 25% by mass, and more preferably 20% by mass.
  • thermoplastic resin examples include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, and polycarbonate resin.
  • These thermoplastic resins can be used alone or in combination of two or more.
  • thermoplastic resin an acrylic resin is preferably mentioned from the viewpoint of improving the dispersibility with the thermosetting resin.
  • the acrylic resin is, for example, a (meth) acrylic acid ester obtained by polymerizing a monomer component containing a (meth) acrylic acid alkyl ester having a linear or branched alkyl group and another monomer (copolymerizable monomer).
  • copolymers preferably carboxyl group-containing acrylic acid ester copolymers.
  • alkyl group examples include alkyl groups having 1 to 6 carbon atoms such as methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, isobutyl, pentyl, and hexyl.
  • Other monomers include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid, and glycidyl such as glycidyl acrylate and glycidyl methacrylate.
  • Group-containing monomers such as acid anhydride monomers such as maleic anhydride and itaconic anhydride, such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxy (meth) acrylate.
  • Butyl, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate or (4-hydroxymethylcyclohexyl)- Hydroxyl group-containing monomers such as methyl acrylate, such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth).
  • Sulfonic acid group-containing monomers such as acryloyloxynaphthalene sulfonic acid, phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate, for example, styrene monomers, for example, acrylonitrile and the like can be mentioned. These can be used alone or in combination of two or more. Preferred are carboxyl group-containing monomers and hydroxyl group-containing monomers, and more preferably, carboxyl group-containing monomers.
  • thermoplastic resin is more preferably an acrylic resin containing a carboxyl group, and more preferably the thermoplastic resin is composed of an acrylic resin containing a carboxyl group.
  • the lower limit of the acid value of the acrylic resin containing a carboxyl group is, for example, 18, preferably 25.
  • the upper limit of the acid value of the acrylic resin is 50, preferably 40.
  • the fluidity of the sealing resin sheet can be reduced when the sealing resin sheet is heated to form a cured product (the curing step described later).
  • the sealing resin sheet is heated to form a cured product (curing step described later)
  • the fluidity of the sealing resin sheet is appropriately reduced when the sealing resin sheet is heated to form a cured product (curing step described later). It is possible to obtain an element or a substrate in which the amount of the cured product penetrated is within a predetermined range.
  • the above acid value can be measured by using a conventionally known indicator titration method using potassium hydroxide.
  • the lower limit of the glass transition temperature Tg of the thermoplastic resin is, for example, ⁇ 70 ° C., preferably ⁇ 50 ° C., and more preferably ⁇ 30 ° C.
  • the upper limit of the glass transition temperature Tg of the thermoplastic resin is, for example, 0 ° C., preferably 5 ° C., and more preferably ⁇ 5 ° C.
  • the glass transition temperature Tg is, for example, a theoretical value obtained by the Fox equation, and a specific calculation method thereof is described in, for example, Japanese Patent Application Laid-Open No. 2016-175976.
  • the lower limit of the weight average molecular weight of the thermoplastic resin is, for example, 100,000, preferably 300,000, more preferably 1,000,000, and even more preferably 1,100,000.
  • the upper limit of the weight average molecular weight of the thermoplastic resin is, for example, 1,400,000.
  • the weight average molecular weight is measured by gel permeation chromatography (GPC) based on a standard polystyrene conversion value.
  • the lower limit of the proportion of the thermoplastic resin in the material is, for example, 1% by mass, preferably 5% by mass, and more preferably 15% by mass.
  • the upper limit of the proportion of the thermoplastic resin in the material is, for example, 30% by mass.
  • the lower limit of the ratio of the thermoplastic resin to the total amount of the thermoplastic resin and the thermosetting resin is, for example, 10% by mass, preferably 20% by mass.
  • the upper limit of the ratio of the thermoplastic resin to the total amount of the thermoplastic resin and the thermosetting resin is, for example, 40% by mass, preferably 30% by mass.
  • layered silicate compounds inorganic fillers (excluding layered silicate compounds), pigments, silane coupling agents, and other additives can be added to the material.
  • the layered silicate compound is dispersed in the material (sealing resin sheet) with respect to the thermosetting resin and the thermoplastic resin (resin matrix).
  • the layered silicate compound is a flow conditioner for forming a sealed body and a cured product (described later) from a sealing resin sheet. Specifically, it is a flow reducing agent during curing that reduces the fluidity of the cured product when the sealing resin sheet is heated to form a cured product.
  • the layered silicate compound is, for example, a silicate having a structure (three-dimensional structure) in which layers spread in two dimensions (in the plane direction) are stacked in the thickness direction, and is called a phyllosilicate.
  • the layered silicate compound includes smectites such as montmorillonite, biderite, nontronite, saponite, hectorite, saponite, and stephensite, such as kaolinite, such as haloysite, for example, talc, for example. , Mica, etc.
  • smectite is preferably mentioned from the viewpoint of improving the mixing property with the thermosetting resin, and montmorillonite is more preferable.
  • the layered silicate compound may be an unmodified product whose surface is not modified, or a modified product whose surface is modified by an organic component.
  • the surface of the layered silicate compound is modified with an organic component from the viewpoint of obtaining excellent affinity with the thermosetting resin and the thermoplastic resin.
  • examples of the layered silicate compound include organic smectite having a surface modified with an organic component, and more preferably organic bentonite having a surface modified with an organic component.
  • organic components include organic cations (onium ions) such as ammonium, imidazolium, pyridinium, and phosphonium.
  • ammonium examples include dimethyl distearyl ammonium, disstearyl ammonium, octadecyl ammonium, hexyl ammonium, octyl ammonium, 2-hexyl ammonium, dodecyl ammonium, and trioctyl ammonium.
  • the imidazolium examples include methylstearyl imidazolium, distearyl imidazolium, methylhexyl imidazolium, dihexyl imidazolium, methyl octyl imidazolium, dioctyl imidazolium, methyl dodecyl imidazolium, and didodecyl imidazolium.
  • Examples of the pyridinium include stearyl pyridinium, hexyl pyridinium, octyl pyridinium, dodecyl pyridinium and the like.
  • Examples of phosphonium include dimethyl distearyl phosphonium, distearyl phosphonium, octadecyl phosphonium, hexyl phosphonium, octyl phosphonium, 2-hexyl phosphonium, dodecyl phosphonium, and trioctyl. Phosphonium and the like can be mentioned.
  • the organic cations can be used alone or in combination of two or more. Ammonium is preferable, and dimethyl distearyl ammonium is more preferable.
  • organic layered silicate compound examples include organic smectite having a surface modified with ammonium, and more preferably organic bentonite having a surface modified with dimethyl distearyl ammonium.
  • the lower limit of the average particle size of the layered silicate compound is, for example, 1 nm, preferably 5 nm, and more preferably 10 nm.
  • the upper limit of the average particle size of the layered silicate compound is, for example, 100 ⁇ m, preferably 50 ⁇ m, and more preferably 10 ⁇ m.
  • the average particle size of the layered silicate compound is determined as a D50 value (cumulative 50% median diameter) based on, for example, the particle size distribution obtained by the particle size distribution measurement method in the laser scattering method.
  • the layered silicate compound a commercially available product can be used.
  • Esben series manufactured by Hojun
  • organic bentonite a commercially available product of organic bentonite.
  • the lower limit of the content ratio of the layered silicate compound in the material (sealing resin sheet) is, for example, 0.1% by mass, preferably 1% by mass, more preferably 2% by mass, still more preferably 3% by mass. %.
  • the upper limit of the content ratio of the layered silicate compound in the material (resin sheet for encapsulation) is, for example, 25% by mass, preferably 15% by mass, more preferably 10% by mass, still more preferably 7% by mass. is there.
  • examples of the inorganic filler include silicate compounds other than layered silicate compounds such as orthosilicate, solosilicate, and inosilicate, such as quartz (silicic acid), silica (silicic anhydride), and silicon nitride. (Silicon compounds other than layered silicate compounds) and the like. Further, examples of the inorganic filler include alumina, aluminum nitride, boron nitride and the like. These can be used alone or in combination of two or more. A silicon compound other than the layered silicate compound is preferable, and silica is more preferable.
  • the shape of the inorganic filler is not particularly limited, and examples thereof include a substantially spherical shape, a substantially plate shape, a substantially needle shape, and an indefinite shape.
  • a substantially spherical shape is preferable.
  • the upper limit of the average value of the maximum lengths of the inorganic fillers is, for example, 50 ⁇ m, preferably 20 ⁇ m, and more preferably 10 ⁇ m.
  • the lower limit of the average value of the maximum length of the inorganic filler is also, for example, 0.1 ⁇ m, preferably 0.5 ⁇ m.
  • the average particle size of the inorganic filler is determined as a D50 value (cumulative 50% median diameter) based on, for example, the particle size distribution obtained by the particle size distribution measurement method in the laser scattering method.
  • the inorganic filler has a maximum length smaller than the average value of the first filler, the second filler having a maximum length smaller than the average value of the maximum lengths of the first filler, and the maximum length of the second filler. It can include a third filler having an average value of the dimensions.
  • the lower limit of the average value of the maximum length of the first filler is, for example, 1 ⁇ m, preferably 3 ⁇ m.
  • the upper limit of the average value of the maximum length of the first filler is, for example, 50 ⁇ m, preferably 30 ⁇ m.
  • the upper limit of the average value of the maximum length of the second filler is, for example, 0.9 ⁇ m, preferably 0.8 ⁇ m.
  • the lower limit of the average value of the maximum length of the second filler is, for example, 0.02 ⁇ m, preferably 0.1 ⁇ m.
  • the upper limit of the average value of the maximum length of the third filler is, for example, 0.015 ⁇ m.
  • the lower limit of the average value of the maximum length of the second filler is, for example, 0.001 ⁇ m, preferably 0.01 ⁇ m.
  • the lower limit of the ratio of the average value of the maximum lengths of the first filler to the average value of the maximum lengths of the second filler is, for example, 2, preferably 5.
  • the upper limit of the ratio of the average value of the maximum lengths of the first filler to the average value of the maximum lengths of the second filler is, for example, 50, preferably 20.
  • the lower limit of the ratio of the average value of the maximum lengths of the second filler to the average value of the maximum lengths of the third filler is, for example, 10, preferably 20.
  • the upper limit of the ratio of the average value of the maximum lengths of the second filler to the average value of the maximum lengths of the third filler is, for example, 60, preferably 50.
  • the materials of the first filler, the second filler and the third filler may all be the same or different.
  • the surface of the inorganic filler may be partially or wholly surface-treated with a silane coupling agent or the like.
  • the lower limit of the content ratio of the inorganic filler in the material (sealing resin sheet) is, for example, 30% by mass, preferably 40% by mass.
  • the upper limit of the content ratio of the inorganic filler in the material (sealing resin sheet) is, for example, 70% by mass, preferably 60% by mass.
  • the sealing resin sheet 1 in the step shown in FIG. 1C can flow.
  • the lower limit of the content ratio of the first filler in the material (sealing resin sheet) is, for example, 20% by mass. , Preferably 30% by mass.
  • the upper limit of the content ratio of the first filler in the material (resin sheet for sealing) is, for example, 60% by mass, preferably 50% by mass.
  • the lower limit of the content ratio of the second filler in the material (resin sheet for sealing) is, for example, 10% by mass, preferably 15% by mass.
  • the upper limit of the content ratio of the second filler in the material (resin sheet for sealing) is, for example, 30% by mass, preferably 25% by mass.
  • the lower limit of the number of parts containing the second filler with respect to 100 parts by mass of the first filler is, for example, 30 parts by mass, preferably 40 parts by mass, and more preferably 50 parts by mass.
  • the upper limit of the number of parts containing the second filler with respect to 100 parts by mass of the first filler is, for example, 70 parts by mass, preferably 60 parts by mass, and more preferably 55 parts by mass.
  • the lower limit of the content ratio of the first filler in the material (sealing resin sheet) is, for example, 20% by mass, preferably 30. It is mass%.
  • the upper limit of the content ratio of the first filler in the material (resin sheet for sealing) is, for example, 60% by mass, preferably 50% by mass.
  • the lower limit of the content ratio of the second filler in the material (resin sheet for sealing) is, for example, 10% by mass, preferably 15% by mass.
  • the upper limit of the content ratio of the second filler in the material (resin sheet for sealing) is, for example, 30% by mass, preferably 25% by mass.
  • the lower limit of the content ratio of the third filler in the material (resin sheet for sealing) is, for example, 1% by mass, preferably 3% by mass.
  • the upper limit of the content ratio of the third filler in the material (resin sheet for sealing) is, for example, 10% by mass, preferably 5% by mass.
  • the lower limit of the number of parts containing the second filler with respect to 100 parts by mass of the first filler is, for example, 30 parts by mass, preferably 40 parts by mass, and more preferably 50 parts by mass.
  • the upper limit of the number of parts containing the second filler with respect to 100 parts by mass of the first filler is, for example, 70 parts by mass, preferably 60 parts by mass, and more preferably 55 parts by mass.
  • the lower limit of the number of parts containing the third filler with respect to 100 parts by mass of the second filler is, for example, 10 parts by mass, preferably 15 parts by mass.
  • the upper limit of the number of parts containing the third filler with respect to 100 parts by mass of the second filler is, for example, 40 parts by mass, preferably 30 parts by mass.
  • pigments examples include black pigments such as carbon black.
  • the lower limit of the particle size of the pigment is, for example, 0.001 ⁇ m.
  • the upper limit of the particle size of the pigment is, for example, 1 ⁇ m.
  • the particle size of the pigment is an arithmetic mean diameter obtained by observing the pigment with an electron microscope.
  • the lower limit of the ratio of the pigment to the material is, for example, 0.1% by mass.
  • the upper limit of the ratio of the pigment to the material is, for example, 2% by mass.
  • silane coupling agent examples include a silane coupling agent containing an epoxy group.
  • silane coupling agent containing an epoxy group examples include 3-glycidoxydialkyldialkoxysilanes such as 3-glycidoxypropylmethyldimethoxysilane and 3-glycidoxypropylmethyldiethoxysilane, for example, 3-.
  • 3-glycidoxyalkyltrialkoxysilanes such as glycidoxypropyltrimethoxysilane and 3-glycidoxypropyltriethoxysilane.
  • 3-glycidoxyalkyltrialkoxysilane is used.
  • the lower limit of the content ratio of the silane coupling agent in the material is, for example, 0.1% by mass, preferably 0.5% by mass.
  • the upper limit of the content ratio of the silane coupling agent in the material is, for example, 10% by mass, preferably 5% by mass, and more preferably 2% by mass.
  • this sealing resin sheet prepare the material by blending each of the above components in the above ratio.
  • the above-mentioned components are sufficiently stirred to uniformly disperse the layered silicate compound with respect to the thermosetting resin and the thermoplastic resin. Let me.
  • a solvent ketone type such as methyl ethyl ketone
  • the varnish is applied to a release sheet (not shown) and then dried by heating to produce a sealing resin sheet having a sheet shape.
  • a sealing resin sheet from the material by kneading extrusion without preparing a varnish.
  • the sealing resin sheet to be formed is in the B stage (semi-cured state), specifically, in the state before the C stage. That is, it is a state before complete curing.
  • the sealing resin sheet is formed from the material of the A stage into the B stage sheet by the heating in the above-mentioned drying and the heating in the extrusion kneading.
  • the lower limit of the thickness of the sealing resin sheet is, for example, 10 ⁇ m, preferably 25 ⁇ m, and more preferably 50 ⁇ m.
  • the upper limit of the thickness of the sealing resin sheet is, for example, 3000 ⁇ m, preferably 1000 ⁇ m, more preferably 500 ⁇ m, and even more preferably 300 ⁇ m.
  • the sealing resin sheet 1 is prepared (preparation step).
  • the sealing resin sheet 1 has one surface and the other surface in the thickness direction facing each other in the thickness direction.
  • the electronic element 21 is prepared.
  • the electronic element 21 includes electronic components, and for example, a plurality of electronic elements 21 are mounted on the substrate 22.
  • the plurality of electronic elements 21 and the substrate 22 are provided on the element mounting substrate 24 together with the bumps 23. That is, the element mounting substrate 24 includes a plurality of electronic elements 21, a substrate 22, and bumps 23.
  • the substrate 22 has a substantially flat plate shape extending in the plane direction.
  • a terminal (not shown) electrically connected to an electrode (not shown) of the electronic element 21 is provided on one surface 25 in the thickness direction of the substrate 22.
  • Each of the plurality of electronic elements 21 has a substantially flat plate shape (chip shape) extending in the plane direction.
  • the plurality of electronic elements 21 are arranged so as to be spaced apart from each other in the plane direction.
  • the thickness direction other side surface 28 of the plurality of electronic elements 21 is parallel to the thickness direction one side surface 25 of the substrate 22. Electrodes (not shown) are provided on the other surface 28 in the thickness direction of each of the plurality of electronic elements 21.
  • the electrodes of the electronic element 21 are electrically connected to the terminals of the substrate 22 via the bumps 23 described below.
  • the other surface 28 in the thickness direction of the electronic element 21 is separated from the one surface 25 in the thickness direction of the substrate 22 by a gap (space) 26.
  • the lower limit of the interval between adjacent electronic elements 21 is, for example, 50 ⁇ m, preferably 100 ⁇ m, and more preferably 200 ⁇ m.
  • the upper limit of the distance between the adjacent electronic elements 21 is, for example, 10 mm, preferably 5 mm, and more preferably 1 mm. When the distance between the adjacent electronic elements 21 is equal to or less than the above upper limit, more electronic elements 21 can be mounted on the substrate 22, and space can be saved.
  • the bump 23 electrically connects each electrode (not shown) of the plurality of electronic elements 21 and each terminal of the substrate 22.
  • the bump 23 is arranged between the electrode of the electronic element 21 and the terminal of the substrate 22.
  • Examples of the material of the bump 23 include metals such as solder and gold.
  • the thickness of the bump 23 corresponds to the thickness (height) of the gap 26.
  • the thickness of the bump 23 is appropriately set according to the application and purpose of the element mounting substrate 24.
  • the sealing resin sheet 1 is arranged on the plurality of electronic elements 21 (arrangement step). Specifically, the other surface of the sealing resin sheet 1 in the thickness direction is brought into contact with the other surface of the plurality of electronic elements 21 in the thickness direction.
  • the sealing resin sheet 1 and the element mounting substrate 24 are pressed (sealing step).
  • the sealing resin sheet 1 and the element mounting substrate 24 are heat-pressed.
  • a press 27 provided with two flat plates presses the sealing resin sheet 1 and the element mounting substrate 24 while sandwiching them in the thickness direction.
  • the flat plate of the press 27 is provided with, for example, a heat source (not shown).
  • the press conditions are not particularly limited, and conditions are selected in which the sealing resin sheet 1 can penetrate between the plurality of electronic elements 21 while the element mounting substrate 24 is not damaged. .. More specifically, the pressing condition is that the sealing resin sheet 1 flows and penetrates between the adjacent electronic elements 21 to cover the peripheral side surfaces of the plurality of electronic elements 21 while covering the electronic elements 21. It is set so that it can come into contact with one surface 25 in the thickness direction of the substrate 22 which does not overlap in a plan view.
  • the lower limit of the press pressure is, for example, 0.01 MPa, preferably 0.05 MPa.
  • the upper limit of the press pressure is, for example, 10 MPa, preferably 5 MPa.
  • the lower limit of the press time is, for example, 0.3 minutes, preferably 0.5 minutes.
  • the upper limit of the press time is, for example, 10 minutes, preferably 5 minutes.
  • the lower limit of the heating temperature is, for example, 40 ° C, preferably 60 ° C.
  • the upper limit of the heating temperature is, for example, 100 ° C., preferably 95 ° C.
  • the sealing resin sheet 1 By pressing the sealing resin sheet 1, the sealing resin sheet 1 is plastically deformed according to the outer shape of the electronic element 21.
  • the other surface of the sealing resin sheet 1 in the thickness direction is deformed into a shape corresponding to the one surface in the thickness direction and the peripheral side surface of the plurality of electronic elements 21.
  • the sealing resin sheet 1 is plastically deformed while maintaining the B stage.
  • the sealing resin sheet 1 contacts the one side 25 in the thickness direction of the substrate 22 which does not overlap with the electronic element 21 in a plan view while covering the peripheral side surfaces of the plurality of electronic elements 21.
  • the sealing body 31 that seals the electronic element 21 is formed (made) from the sealing resin sheet 1.
  • One surface of the sealing body 31 in the thickness direction becomes a flat surface.
  • the sealing body 31 is allowed to slightly penetrate into the gap (gap between the electronic element 21 and the substrate 22) 26. Specifically, the sealing body 31 is allowed to have a sealing body penetration length X (see FIG. 3C) in which the sealing body 31 penetrates into the gap 26 with reference to the side edge 75 of the electronic element 21. Will be done.
  • the upper limit of the encapsulant penetration length X is, for example, 20 ⁇ m, preferably 10 ⁇ m, more preferably 5 ⁇ m, still more preferably 3 ⁇ m, and particularly preferably 1 ⁇ m.
  • the sealing body 31 is heated to form a cured body 41 from the sealing body 31 (curing step).
  • the encapsulant 31 and the element mounting substrate 24 are taken out from the press 27, and then the encapsulant 31 and the element mounting substrate 24 are heated in a dryer under atmospheric pressure.
  • the lower limit of the heating temperature is, for example, 100 ° C., preferably 120 ° C.
  • the upper limit of the heating temperature is, for example, 200 ° C., preferably 180 ° C.
  • the lower limit of the heating time is, for example, 10 minutes, preferably 30 minutes.
  • the upper limit of the heating time is, for example, 180 minutes, preferably 120 minutes.
  • a C-staged (completely cured) cured body 41 is formed from the sealing body 31.
  • One surface of the cured body 41 in the thickness direction is an exposed surface.
  • the edge of the sealing body 31, which is allowed to slightly penetrate into the gap further slightly penetrates into the gap 26 to become the cured body 41, but the degree is acceptable. It is suppressed to a small extent.
  • the cured body 41 has a sealed body penetration length from the cured body penetration length Y (see FIG. 3D) in which the cured body 41 penetrates into the gap 26 with reference to the side edge 75 of the electronic element 21.
  • the value obtained by subtracting X (YX) (hereinafter, referred to as the encapsulant penetration amount (YX)) can be reduced.
  • the upper limit of the cured product penetration length Y is, for example, 45 ⁇ m, preferably 25 ⁇ m, more preferably 20 ⁇ m, still more preferably 10 ⁇ m, particularly preferably 5 ⁇ m, and most preferably 1 ⁇ m.
  • the lower limit of the cured product penetration length Y is, for example, ⁇ 25 ⁇ m, preferably ⁇ 10 ⁇ m, and more preferably ⁇ 5 ⁇ m.
  • the upper limit of the amount of the sealant penetrating (YX) is, for example, 30 ⁇ m, preferably 15 ⁇ m, more preferably 10 ⁇ m, still more preferably 5 ⁇ m, particularly preferably 3 ⁇ m, and most preferably 1 ⁇ m. ..
  • the sealing resin sheet 1 has a viscosity at 85 ° C. at a predetermined shear rate in the viscoelasticity measurement described in detail in Examples described later.
  • the lower limit of the viscosity ( ⁇ 0.01 ) at 85 ° C. at a shear rate of 0.01 rad / sec is 8 ⁇ 10 5 Pa ⁇ s, preferably 10 ⁇ 10 5 Pa ⁇ s.
  • the upper limit of the viscosity ( ⁇ 0.01 ) at 85 ° C. at a shear rate of 0.01 rad / sec is, for example, 25 ⁇ 10 5 Pa ⁇ s, preferably 18 ⁇ 10 5 Pa ⁇ s.
  • the upper limit of the viscosity ( ⁇ 0.1 ) at 85 ° C. at a shear rate of 0.1 rad / sec is less than 8 ⁇ 10 5 Pa ⁇ s, preferably less than 5 ⁇ 10 5 Pa ⁇ s.
  • the lower limit of the viscosity ( ⁇ 0.1 ) at 85 ° C. at a shear rate of 0.1 rad / sec is, for example, 1 ⁇ 10 5 Pa ⁇ s.
  • the viscosity at 85 ° C. ( ⁇ 0.01 ) at a shear rate of 0.01 rad / sec is equal to or higher than the above lower limit, and the viscosity at 85 ° C. ( ⁇ 0.1 ) at a shear rate of 0.1 rad / sec is If it is less than the above upper limit, the sealing resin sheet 1 is arranged on the electronic element 21, the sealing resin sheet 1 (sealing body 31) is heated, and the cured body 41 is formed as shown in FIG. 1D. When forming, the amount of the cured product 41 invading the gap 26 between the electronic element 21 and the substrate 22 can be reduced.
  • the sealing resin sheet 1 has a high viscosity (specifically, a viscosity at 85 ° C. ( ⁇ 0.01 ) at a shear rate of 0.01 rad / sec) when the shear force (shear rate) is low.
  • a viscosity at 85 ° C. ( ⁇ 0.01 ) at a shear rate of 0.01 rad / sec when the shear force (shear rate) is low.
  • the viscosity at 85 ° C. ( ⁇ 0.1 ) at a shear rate of 0.1 rad / sec is the above upper limit.
  • the viscosity of the sealing resin sheet 1 can be lowered in the sealing step (when the shearing force (shear velocity) is high), so that the sealing resin between the plurality of electronic elements 21 While the sheet 1 can be penetrated, the viscosity of the sealing resin sheet 1 can be increased in the curing step (when the shearing force (shear velocity) is low), so that the gap 26 between the electronic element 21 and the substrate 22 can be filled.
  • the amount of penetration of the cured product 41 can be reduced.
  • the sealing resin sheet 1 can be sufficiently penetrated between the plurality of electronic elements 21. Can not.
  • the upper limit of the viscosity ( ⁇ 10 ) at 85 ° C. at a shear rate of 10 rad / sec is, for example, 0.4 ⁇ 10 5 Pa ⁇ s, preferably 0.2 ⁇ 10 5 Pa ⁇ s.
  • the lower limit of the viscosity ( ⁇ 10 ) at 85 ° C. at a shear rate of 10 rad / sec is, for example, 0.01 ⁇ 10 5 Pa ⁇ s, preferably 0.05 ⁇ 10 5 Pa ⁇ s.
  • the viscosity of the sealing resin sheet 1 can be lowered in the sealing step (when the shearing force (shear rate) is high). , The sealing resin sheet 1 can be inserted between the plurality of electronic elements 21.
  • the viscosity at 85 ° C. ( ⁇ 0.01 ) at a shear rate of 0.01 rad / sec and the viscosity at 85 ° C. ( ⁇ 10 ) at a shear rate of 10 rad / sec are preferably given by the following formula (7). Satisfied, more preferably the following formula (8) is satisfied, more preferably the following formula (9) is satisfied, and particularly preferably the following formula (10) is satisfied. ⁇ 0.01 / ⁇ 10 ⁇ 40 (7) ⁇ 0.01 / ⁇ 10 ⁇ 70 (8) ⁇ 0.01 / ⁇ 10 ⁇ 100 (9) ⁇ 0.01 / ⁇ 10 ⁇ 120 (10) Further, the viscosity at 85 ° C.
  • the sealing resin sheet 1 and the sealing multilayer resin sheet 11 provided with the second sealing resin sheet 12 in order on one side in the thickness direction are used.
  • the electronic element 21 is sealed, and subsequently, the cured body 41 is formed.
  • the sealing multilayer resin sheet 11 includes a sealing resin sheet 1 and a second sealing resin sheet 12 arranged on the entire surface of one surface in the thickness direction thereof.
  • the sealing multilayer resin sheet 11 includes only the sealing resin sheet 1 and the second sealing resin sheet 12.
  • the material of the second sealing resin sheet 12 is the same as the material of the sealing resin sheet 1 (thermosetting resin composition), but does not contain a layered silicate compound.
  • the lower limit of the ratio of the thickness of the second sealing resin sheet 12 to the thickness of the sealing resin sheet 1 is, for example, 0.5, preferably 1, more preferably 2.
  • the upper limit of the ratio of the thickness of the second sealing resin sheet 12 to the thickness of the sealing resin sheet 1 is, for example, 10, preferably 5.
  • FIGS. 2A to 2D for a method of manufacturing the electronic device cured product package 50 by sealing a plurality of electronic devices 21 with the sealing multilayer resin sheet 11 and then forming a cured product 41. Will be explained.
  • the sealing multilayer resin sheet 11 is prepared. Specifically, the sealing resin sheet 1 and the second sealing resin sheet 12 are bonded together.
  • a plurality of electronic elements 21 mounted on the substrate 22 are prepared.
  • the sealing multilayer resin sheet 11 is arranged on the electronic element 21 so that the other surface in the thickness direction of the sealing resin sheet 1 contacts the one surface in the thickness direction of the electronic element 21.
  • the sealing resin sheet 1 and the element mounting substrate 24 are then pressed.
  • the sealing resin sheet 1 has the above-mentioned thixotropic property, so that it flows and penetrates between the adjacent electronic elements 21.
  • the fluidity of the second sealing resin sheet 12 does not change significantly even when pressed, and remains low, so that it is suppressed from entering between adjacent electronic elements 21.
  • the sealing body 31 that seals the plurality of electronic elements 21 is formed from the sealing multilayer resin sheet 11.
  • the press shown in FIG. 2C can be used.
  • the sealing resin sheet 1 and the second sealing resin sheet 12 can flow.
  • the sealing resin sheet 1 is in contact with the electronic element 21, while the second sealing resin sheet 12 is located on the opposite side of the electronic element 21 with respect to the sealing resin sheet 1. That is, the edge of the sealing body 31 facing the gap 26 is formed from the sealing resin sheet 1. On the other hand, one surface of the sealing body 31 in the thickness direction is formed from the second sealing resin sheet 12.
  • the sealing body 31 is heated to form a cured body 41 from the sealing body 31.
  • the sealing multilayer resin sheet 11 includes the sealing resin sheet 1 described above, the amount of the cured product 41 invading the gap 26 can be reduced.
  • the sealing resin sheet 1 and the second sealing resin sheet 12 contain an epoxy resin main agent having a softening point of 50 ° C. or higher and 130 ° C. or lower, for sealing in the step shown in FIG. 2C.
  • the resin sheet 1 and the second sealing resin sheet 12 can flow. Therefore, the time of the step shown in FIG. 2C can be shortened, and one surface of the second sealing resin sheet 12 in the thickness direction in the step shown in FIG. 2C can be flattened.
  • the sealing resin sheet 1 and the second sealing resin sheet 12 contain a phenol resin as a curing agent together with the main agent of the epoxy resin, the cured product 41 has high heat resistance and high chemical resistance. .. Therefore, the cured product 41 is excellent in sealing reliability.
  • the second sealing resin sheet 12 is fluidized by receiving a pressing force, and one surface in the thickness direction becomes flat. Further, in the step shown in FIG. 2C, in the sealing multilayer resin sheet 11, as described above, the sealing resin sheet 1 together with the second sealing resin sheet 12 softens and flows under the pressing force. It deforms according to the outer shape of the electronic element 21. In the step shown in FIG. 2C, the sealing resin sheet 1 is allowed to slightly enter the gap 26.
  • the electronic element 21 is sealed with a one-layer sealing resin sheet 1.
  • the electronic element 21 can be sealed with a plurality of sealing resin sheets 1 (laminated sheets).
  • the second sealing resin sheet 12 in the sealing multilayer resin sheet 11 may have multiple layers.
  • an electronic element 21 arranged with a gap 26 separated from one surface 25 in the thickness direction of the substrate 22 is mentioned, and this is sealed with a sealing resin sheet 1, but for example, although not shown, An electronic element 21 that contacts one surface 25 in the thickness direction of the substrate 22 can be mentioned, and this can be sealed with the sealing resin sheet 1.
  • the electronic element 21 is mentioned as an example of the element, a semiconductor element can also be mentioned.
  • the present invention will be described in more detail with reference to Preparation Examples, Comparative Preparation Examples, Examples and Comparative Examples.
  • the present invention is not limited to any preparation examples, comparative preparation examples, examples and comparative examples.
  • specific numerical values such as the compounding ratio (content ratio), physical property values, and parameters used in the following description are described in the above-mentioned "Form for carrying out the invention", and the compounding ratios corresponding to them ( Substitute for the upper limit (numerical value defined as "less than or equal to” or “less than”) or lower limit (numerical value defined as "greater than or equal to” or “exceeded”) such as content ratio), physical property value, parameter, etc. it can.
  • Layered silicate compound Esben NX manufactured by Hojun (organized bentonite whose surface is modified with dimethyl distearyl ammonium)
  • Main agent YSLV-80XY manufactured by Nippon Steel Chemical Co., Ltd.
  • Bisphenol F type epoxy resin high molecular weight epoxy resin, epoxy equivalent 200 g / eq., Solid, softening point 80 ° C.
  • Hardener LVR-8210DL manufactured by Gunei Chemical Co., Ltd.
  • Acrylic resin 1 HME-2006M manufactured by Negami Kogyo Co., Ltd., carboxyl group-containing acrylic acid ester copolymer (acrylic resin), acid value: 32, number of functional groups: 736, weight average molecular weight: 1290000, glass transition temperature (Tg):- Methyl ethyl ketone solution at 13.9 ° C.
  • Acrylic resin 2 HME-2000M manufactured by Negami Kogyo Co., Ltd., carboxyl group-containing acrylic acid ester copolymer (acrylic resin), acid value: 20, number of functional groups: 367, Weight average molecular weight: 1030000, glass transition temperature (Tg): 3.7 ° C, methyl ethyl ketone solution with solid content concentration of 20% by mass
  • Acrylic resin 3 HME-2004M manufactured by Negami Kogyo Co., Ltd., acrylic acid ester copolymer (acrylic resin), acid Value: 0, number of functional groups: 0, weight average molecular weight: 118000, glass transition temperature (Tg): -3 ° C, methyl ethyl ketone solution with solid content concentration of 20% by mass Silane coupling agent: KBM-403 (3) manufactured by Shin-Etsu Chemical Co., Ltd.
  • First filler FB-8SM (spherical molten silica powder (inorganic filler), average particle diameter 7.0 ⁇ m)
  • Second filler SC220G-SMJ (average particle size 0.5 ⁇ m) manufactured by Admatex is surface-treated with 3-methacryloxypropyltrimethoxysilane (product name: KBM-503 manufactured by Shin-Etsu Chemical Co., Ltd.).
  • Preparation Example 4 The material varnish was prepared according to the formulation shown in Table 2. After applying the varnish to the surface of the release sheet, it was dried at 120 ° C. for 2 minutes to prepare a second sealing resin sheet 12 having a thickness of 195 ⁇ m. The second sealing resin sheet 12 was a B stage.
  • Step A As shown in FIG. 3A, a sample sheet 61 having a length of 10 mm, a width of 10 mm, and a thickness of 260 ⁇ m is prepared from the sealing multilayer resin sheet 11 of each Example and each Comparative Example.
  • Step B As shown in FIG. 3B, a dummy element 71 having a length of 3 mm, a width of 3 mm, and a thickness of 200 ⁇ m prepares a dummy element mounting substrate 74 mounted on a glass substrate 72 via a bump 23 having a thickness of 20 ⁇ m.
  • Step C As shown in FIG. 3C, the dummy element 71 on the dummy element mounting substrate 74 is pressed by the vacuum plate press with the sample sheet 61 at a temperature of 65 ° C., a pressure of 0.1 MPa, a vacuum degree of 1.6 kPa, and a pressing time of 1 minute.
  • the sealed body 31 is formed from the sample sheet 61 by sealing with.
  • Step D As shown in FIG. 3D, the sealed body 31 is thermoset by heating at 150 ° C. under atmospheric pressure for 1 hour to form a cured body 41 from the sealed body 31.
  • Step E As shown in the enlarged view of FIG. 3D, the cured body 41 penetrates into the gap 26 between the dummy element 71 and the glass substrate 72 from the side edge 75 with reference to the side edge 75 of the dummy element 71.
  • the intrusion length Y is measured.
  • the cured product penetration length Y was evaluated according to the following criteria. The results are shown in Table 3.
  • ⁇ The cured product penetration length Y was 0 ⁇ m or more and 25 ⁇ m or less.
  • ⁇ The cured product penetration length Y was more than 25 ⁇ m, 45 ⁇ m or less, or less than 0 ⁇ m, -25 ⁇ m or more.
  • X The cured product penetration length Y was more than 45 ⁇ m or less than -25 ⁇ m.
  • minus means that a space (see the thick broken line in FIG. 2D) protruding outward from the side edge 75 of the dummy element 71 is formed.
  • the absolute value of "minus” corresponds to the protruding length of the space.
  • Step F With reference to the side edge 75 of the dummy element 71, the encapsulant penetration length X in which the encapsulant 31 penetrates into the gap 26 between the dummy element 22 and the glass substrate 72 from the side edge 75 was measured. The results are shown in Table 3. ⁇ : The encapsulant penetration length X was 0 ⁇ m or more and 10 ⁇ m or less. ⁇ : The sealing depth X was more than 10 ⁇ m and 20 ⁇ m or less. X: The encapsulant penetration length X was below 20 ⁇ m.
  • ⁇ Invasion amount of sealant> The encapsulant invasion amount (YX) was calculated by subtracting the encapsulant invasion length X obtained by the above method from the cured body invasion length Y obtained by the above method. The results are shown in Table 3. ⁇ : The amount of the sealant penetrating (YX) was 0 ⁇ m or more and 15 ⁇ m or less. ⁇ : The amount of the sealant invading (YX) was more than 15 ⁇ m and 30 ⁇ m or less. X: The amount of the sealant invading (YX) exceeded 30 ⁇ m.
  • Comparative Example 3 in which the viscosity ( ⁇ 0.1 ) at 85 ° C. at a shear rate of 0.1 rad / sec is 8 ⁇ 10 5 Pa ⁇ s or more, a sealing resin sheet is provided between a plurality of dummy elements. It could not be sufficiently invaded.
  • the sealing resin sheet is used to seal the element.

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