WO2021008518A1 - 超微型存储卡及终端 - Google Patents

超微型存储卡及终端 Download PDF

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Publication number
WO2021008518A1
WO2021008518A1 PCT/CN2020/101847 CN2020101847W WO2021008518A1 WO 2021008518 A1 WO2021008518 A1 WO 2021008518A1 CN 2020101847 W CN2020101847 W CN 2020101847W WO 2021008518 A1 WO2021008518 A1 WO 2021008518A1
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WO
WIPO (PCT)
Prior art keywords
contact
electrical connection
substrate
memory card
contact group
Prior art date
Application number
PCT/CN2020/101847
Other languages
English (en)
French (fr)
Inventor
王玉传
黄玉宝
侍海宁
范姝男
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to US17/627,447 priority Critical patent/US20220261609A1/en
Priority to EP20839783.6A priority patent/EP3971778A4/en
Publication of WO2021008518A1 publication Critical patent/WO2021008518A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
    • G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts

Definitions

  • This application relates to the field of communication technology, and in particular to an ultra-mini memory card and a terminal.
  • the terminal has become an important communication tool in people's life and work.
  • An existing ultra-micro memory card Nano Memory Card, NM memory card for short
  • NM memory card for short
  • applied to a terminal has a low data transmission speed due to the limited arrangement of contacts, which restricts the development of terminal technology.
  • the technical problem to be solved by the embodiments of the present application is to provide an ultra-mini memory card and a terminal that can increase the data transmission speed.
  • an embodiment of the present application provides an ultra-mini memory card, including a card body, a chip, and an interface, the chip is arranged inside the card body; the interface is arranged on the surface of the card body of the memory card, The chip is electrically connected to the interface, the card body includes a first surface and a second surface disposed opposite to each other, the interface includes a plurality of contacts, and the plurality of contacts are distributed on the first surface And the second surface.
  • four of the contacts distributed on the first surface and at least four contacts distributed on the second surface are used to transmit data.
  • the contacts distributed on the first surface are used for data transmission, and at least four contacts distributed on the second surface are used for data transmission.
  • the contacts are used to transmit data, which can meet the 8bit mode in the emmc protocol 5.0 and achieve higher transmission speeds.
  • the bus speed can reach 200MB/s in HS200 mode and 400MB/s in HS400 mode.
  • the contacts distributed on the first surface include a first contact group and a second contact group spaced apart along a first direction, the first contact group and the second contact group Each group includes a first contact, a second contact, a third contact, and a fourth contact arranged in sequence along a second direction.
  • the first direction is different from the second direction, and the first contact
  • the first contact of the group, the third contact of the first contact group, the first contact of the second contact group, and the fourth contact of the second contact group are used to transmit data
  • the second contact of the first contact group is used for transmitting power signals
  • the fourth contact of the first contact group is used for transmitting clock signals
  • the second contact of the second contact group is used for A ground signal is transmitted
  • the third contact of the second contact group is used to transmit a control signal.
  • the arrangement of contacts on the first surface remains the same as that of the existing ultra-micro memory card, so that the ultra-micro memory card in this embodiment can be recognized and recognized by the single-sided card holder in the existing terminal. Compatible and convenient to use.
  • the contacts distributed on the second surface include a third contact group and a fourth contact group spaced apart along the first direction, the third contact group and the fourth contact group Each group includes a first contact and a second contact arranged in sequence along a second direction, and the first contact and the second contact in the third contact group and the fourth contact group are used for To transmit data, the third contact group and the fourth contact group are arranged along the first direction, and the contacts in the third contact group and the fourth contact group are arranged in sequence along the second direction, which improves the preparation The convenience of ultra-micro memory cards.
  • the fourth contact group further includes a third contact, and the second contact of the fourth contact group is located between the first contact and the fourth contact of the fourth contact group. Between the third contacts of the contact group, the third contact of the fourth contact group is used to transmit ground signals.
  • the third contact group further includes a third contact, and the second contact of the third contact group is located between the first contact of the third contact group and the third contact. Between the third contacts of the contact group, the third contact of the third contact group is used to transmit a ground signal or a data strobe signal.
  • the card body includes a first substrate and a second substrate fixedly connected to the second substrate, and the chip is fixedly provided on a side of the second substrate facing the first substrate.
  • the first surface is the side of the first substrate facing away from the second substrate, and the second surface is the side of the second substrate facing away from the first substrate.
  • the card body is formed by combining the first substrate and the second substrate, which facilitates the preparation of the ultra-micro memory card.
  • the first substrate includes a first plate body and a first electrical connection portion
  • the first surface is a side of the first plate body facing the second substrate
  • the first electrical connection Portion protruding from the side of the first plate facing the second substrate
  • the second substrate includes a second plate and a second electrical connection portion
  • the second surface is the second plate facing the
  • the second electrical connection portion protrudes from the side of the second board facing the first substrate
  • the first electrical connection portion and the second electrical connection portion are interconnected by solder balls , Simplifies the structure of the ultra-micro memory card.
  • the first electrical connection portion includes a first electrical connection boss and a first electrical connection post, and the first electrical connection boss is protruding from the first board body toward the second board
  • the first electrical connection post is fixedly connected to an end of the first electrical connection boss facing away from the first board
  • the second electrical connection portion includes a second electrical connection boss and a second electrical connection boss.
  • the second electrical connection boss is protrudingly provided on the side of the second board facing the first board, and the second electrical connection post is fixedly connected to the second electrical connection boss away from the At one end of the second board, the solder ball is connected between the first electrical connection post and the second electrical connection post, which saves the amount of solder balls used.
  • the chip is disposed on the side of the second substrate facing the first substrate, and the chip includes a first chip and a second chip that are stacked, wherein the second chip is disposed on the The second substrate faces a side of the first substrate, and both the first chip and the second chip are electrically connected to the interface.
  • an embodiment of the present application also provides a terminal, including a terminal body, a card holder provided on the terminal body, and the above-mentioned ultra-mini memory card, the card holder including a cavity, and the ultra-mini
  • the memory card is accommodated in the cavity, and the inner wall of the cavity facing the first surface is provided with a plurality of first contact elastic pieces, and each first contact elastic piece corresponds to a contact on the first surface.
  • the cavity is provided with a plurality of second contact elastic pieces on the inner wall facing the second surface, and the second contact elastic pieces are in electrical contact with a contact on the second surface.
  • the terminal provided by the embodiment of the present application adopts an ultra-micro memory card with contacts on both sides, which increases the number of contacts. In this way, it is beneficial to increase the data transmission speed of the terminal and also improve the user experience.
  • FIG. 1 is a cross-sectional view of the ultra-micro memory card provided by the first embodiment of the application.
  • FIG. 2 is a cross-sectional view of an ultra-micro memory card provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of the arrangement of contacts distributed on the first surface of the ultra-micro memory card shown in FIG. 1.
  • FIG. 4 is a schematic diagram of the arrangement of contacts distributed on the second surface of the ultra-micro memory card shown in FIG. 1.
  • FIG. 5 is a schematic diagram of an application scenario in which an ultra-micro memory card is inserted into a terminal with a card holder with a single-side contact elastic piece.
  • FIG. 6 is a schematic diagram of an application scenario in which an ultra-micro memory card is inserted into a terminal with a card holder with double-sided contact springs.
  • FIG. 7 is a schematic diagram of the contact arrangement on the second surface of the ultra-micro memory card provided by the second embodiment of this application.
  • FIG. 8 is a schematic diagram of the arrangement of contacts distributed on the second surface of the ultra-micro memory card according to the third embodiment of this application.
  • FIG. 9 is a schematic diagram of the arrangement of contacts distributed on the second surface of the ultra-micro memory card according to the fourth embodiment of this application.
  • FIG. 1 is a schematic structural diagram of an ultra-micro memory card provided by the first embodiment of this application.
  • the ultra-micro memory card 100 includes a card body 10, a chip 20 and an interface 40.
  • the chip 20 is arranged inside the card body 10.
  • the interface 40 is provided on the surface of the card body 10.
  • the chip 20 is electrically connected to the interface 40.
  • the card body 10 includes a first surface 11 and a second surface 12 opposite to each other.
  • the interface 40 includes a plurality of contacts 41. The multiple contacts 41 are distributed on the first surface 11 and the second surface 12.
  • the multiple contacts 41 are distributed on the first surface 11 and the second surface 12, that is, the first surface 11 and the second surface 12 of the card body 10 are both arranged with the contacts 41, and it is not limited to the arrangement of ultra-micro memory cards.
  • the single side increases the number of contacts 41, which is beneficial to increase the data transmission speed of the memory card 100.
  • the card body 10 includes a first substrate 15 and a second substrate 17 fixedly connected to the first substrate 15.
  • the first surface 11 is the side of the first substrate 15 facing away from the second substrate 17.
  • the second surface 12 is the side of the second substrate 17 facing away from the first substrate 15.
  • the card body 10 is formed by combining the first substrate 15 and the second substrate 17, which facilitates the preparation of the ultra-micro memory card 100.
  • the first substrate 15 includes a first plate body 151 and a first electrical connection portion 153.
  • the first surface 11 is the side of the first plate 151 facing away from the second substrate 17.
  • the first electrical connection portion 153 is protrudingly provided on a surface of the first plate body 151 facing the second substrate 17.
  • the first electrical connection portion 153 is electrically connected to the contacts 41 and the chip 20 distributed on the first surface 11 through wires (not shown).
  • the first electrical connection portion 153 includes a first electrical connection boss 1531 and a first electrical connection post 1533.
  • the first electrical connection boss 1531 is provided on the side of the first board 151 facing the second substrate 17, the first electrical connection post 1533 is fixedly connected to the end of the first electrical connection boss 1531 away from the first board 151, the first electrical connection The connecting boss 1531 is located between the first electrical connecting column 1533 and the first board 151.
  • the second substrate 17 includes a second plate body 171 and a second electrical connection portion 173.
  • the second surface 12 is the side of the second plate body 171 facing away from the first substrate 15.
  • the second electrical connection portion 173 is protruded on the side of the second board 171 facing the first substrate 15.
  • the second electrical connection portion 173 is electrically connected to the contacts 41 and the chip 20 distributed on the second surface 12 through wires (not shown).
  • the second electrical connection portion 173 includes a second electrical connection boss 1731 and a second electrical connection pillar 1733.
  • the second electrical connection boss 1731 protrudes from the side of the second board 171 facing the first board 151, and the second electrical connection post 1733 is fixedly connected to an end of the second electrical connection boss 1731 away from the second board 171.
  • the second electrical connection boss 1731 is located between the second electrical connection post 1733 and the second board 171.
  • the second electrical connection pillar 1733 and the first electrical connection pillar 1533 are interconnected by solder balls, so that the amount of solder balls used
  • the chip 20 is provided on the side of the second substrate 17 facing the first substrate 15.
  • the chip 20 includes a first chip 21 and a second chip 23 that are stacked, wherein the second chip 23 is provided on the side of the second substrate 17 facing the first substrate 15.
  • the first chip 21 includes a control unit
  • the second chip 23 includes a storage unit.
  • the control unit is electrically connected with the storage unit.
  • the ultra-micro memory card 100 further includes an interface drive circuit.
  • the storage unit, the control unit and the interface drive circuit are arranged in the card body 10 of the memory card 100, and the interface is arranged in the card body 10 of the memory card. on the surface.
  • control unit is electrically connected to the storage unit and the memory card interface
  • interface drive circuit is electrically connected to the memory card interface and the control unit
  • the interface drive circuit connects the memory card interface to the control unit. Electrical connection, and electrical connection between the control unit and the storage unit. It can be understood that the control unit is not limited to be provided on the first chip 21, and the storage unit is not limited to be provided on the second chip 23.
  • the control unit and the storage unit can also be provided on a single chip to reduce the size of the ultra-micro memory card 100 and simplify the ultra-micro memory card 100.
  • the structure of the micro memory card 100 is electrically connected to the storage unit and the memory card interface.
  • the first electrical connection part can omit the first electrical connection post, that is, the first electrical connection part includes the first electrical connection boss 1531, and the second electrical connection part can omit the second electrical connection post. That is, the second electrical connection portion includes a second electrical connection boss 1731, and the solder ball 30 is directly disposed between the first electrical connection boss 1531 and the second electrical connection boss 1731, which simplifies the first electrical connection of the ultra-micro memory card 100 The structure of the substrate 15 and the second substrate 17.
  • the contacts 41 (or pins, or connecting terminals) of the ultra-micro memory card 100 may be spaced apart, and each contact (or pins, or connecting terminals) 41 is between the edges of the ultra-micro memory card 100. It can also be spaced. It can be seen that the contacts 41 on the ultra-micro memory card 100 are not covered with the surface of the card body 10 of the ultra-micro memory card 100. These intervals are all on the surface of the card body 10 of the ultra-micro memory card 100.
  • the area, and these areas can be used to set the wiring, that is to lay the wiring on the spacing between the contacts (or pins, or connecting terminals) 41, and the contacts (or pins, or connecting terminals) 41 and the edge of the ultra-micro memory card 100, and the wiring is used to connect the storage unit and the control unit, and the wiring is also used to interface the control unit and the memory card.
  • the contacts 41 distributed on the first surface 11 include a first contact group 411 and a second contact group 413 arranged at intervals along the first direction (the X direction shown in FIG. 3 ).
  • the first contact group 411 includes a first contact 4111, a second contact 4112, a third contact 4113, and a fourth contact 4114 arranged in order along a second direction (the Y direction shown in FIG. 3).
  • the second contact group 413 includes a first contact 4131, a second contact 4132, a third contact 4133, and a fourth contact 4134 arranged in sequence along the second direction.
  • the first direction is different from the second direction.
  • the first contact 4111, the second contact 4112, the third contact 4113, and the fourth contact 4114 are located on the same straight line; the first contact 4131, the second contact 4132, the third contact 4133 And the fourth contact 4134 are located on the same straight line.
  • the first contact 4111 of the first contact group 411, the third contact 4113 of the first contact group 411, the first contact 4131 of the second contact group 413, the fourth contact of the second contact group 413 4134 is used to transmit data (data, D for short)
  • the second contact 4112 of the first contact group 411 is used to transmit power supply (VCC) signals
  • the fourth contact 4134 of the first contact group 411 is used For transmitting clock (clock, CLK) signals
  • the second contact 4132 of the second contact group 413 is used to transmit power supply ground (GND) signals
  • the third contact 4133 of the second contact group 413 is used For transmission control (command/response, CMD) signals.
  • the first contact 4111 is marked as the data transmission pin D2
  • the second contact 4112 is marked as the power signal pin VCC
  • the third contact 4113 is marked as the data transmission pin D0
  • the fourth contact 4113 is marked as the data transmission pin D0.
  • the contact 4114 is marked as the clock signal pin CLK.
  • the first contact 4131 is marked as the data transmission pin D3
  • the second contact 4132 is marked as the ground signal pin GND
  • the third contact 4133 is marked as the control signal pin CMD
  • the fourth The contact 4134 is marked as the data signal pin D1.
  • FIG. 4 is a schematic diagram of the arrangement of contacts distributed on the second surface of the ultra-micro memory card shown in FIG. 1.
  • the contacts 41 distributed on the second surface 12 include a third contact group 415 and a fourth contact group 417 arranged at intervals along the first direction.
  • the third contact group 415 includes first contacts arranged in sequence in the second direction. 4151 and a second contact 4152.
  • the fourth contact group 417 includes a first contact 4171 and a second contact 4173 arranged in the second direction.
  • the first contact 4151 and the third contact 4173 of the third contact group 415 The second contact 4152 of the contact group 415, the first contact 4171 of the fourth contact group 417, and the second contact 4152 of the fourth contact group 417 are all used for data transmission.
  • first contact 4151 and the second contact 4152 are located on the same straight line; the first contact 4171 and the second contact 4173 are located on the same straight line; the first contact 4171 and the second contact 4173 are located on the same straight line. In a straight line.
  • the first contact 4151 is marked as a data transmission pin D4, and the second contact 4152 is marked as a data transmission pin D6.
  • the fourth contact group 417 the first contact 4171 is marked as a data transmission pin D5, and the second contact 4172 is marked as a data transmission pin D7.
  • the data meets the 8bit mode in the emmc protocol 5.0 to achieve higher transmission speeds.
  • the bus speed can reach 200MB/s in HS200 mode and 400MB/s in HS400 mode.
  • the size of the ultra-micro memory card 100 and the arrangement of the contacts 41 on the first surface 11 remain the same as those of the existing ultra-micro memory card, so that the ultra-micro memory card 100 can be used in existing terminals.
  • the single-sided deck is recognized and compatible, which is convenient for use.
  • FIG. 5 is a schematic diagram of an application scenario of a terminal with an ultra-mini memory card provided by an embodiment of the application.
  • the terminal 200 includes a terminal body 201, a card holder 203 provided on the terminal body 201, and the ultra-micro memory card 100 as described above.
  • the ultra-micro memory card 100 is inserted into the cavity 2031 of the card holder 203.
  • the inner wall of the cavity 2031 facing the first surface 11 is provided with a plurality of first contact elastic pieces 2033, and each first contact elastic piece 2033 corresponds to the first surface 11 A contact 41 on the upper surface elastically abuts and electrically contacts, so as to realize signal communication between the contact 41 on the first surface 11 and the holder 203.
  • FIG. 6 is a schematic diagram of an application scenario of a terminal with an ultra-mini memory card provided by another embodiment of this application.
  • the terminal 300 includes a terminal body 301, a card holder 303 provided on the terminal body 301, and the ultra-micro memory card 100 as described above.
  • the holder 301 includes a cavity 3031.
  • the ultra-micro memory card 100 is inserted into the cavity 3031.
  • the inner wall of the cavity 3011 facing the first surface 11 is provided with a plurality of first contact elastic pieces 3033, and each first contact elastic piece 3033 corresponds to a contact on the first surface 11.
  • the point 41 elastically abuts and makes electrical contact to realize the signal communication between the contact 41 on the first surface 11 and the card socket 303.
  • the inner wall of the cavity 3031 facing the second surface 12 is provided with a plurality of second contact elastic pieces 3035.
  • the second contact elastic piece 3035 correspondingly elastically abuts and electrically contacts a contact 41 on the second surface 12 to realize signal communication between the contact 41 on the first surface 11 and the holder 303. Since the card holder 303 adopts the ultra-micro memory card 100 with contacts 41 on both sides, this is beneficial to increase the data transmission speed of the terminal 300 and also improve the user experience.
  • Terminal 200 or terminal 300 may include various handheld devices with communication functions, vehicle-mounted devices, wearable devices, home smart devices, computing devices or other processing devices connected to wireless modems, as well as various forms of terminals, such as mobile Station (mobile station, MS), terminal (terminal), user equipment (UE), soft terminal, etc., for example, there are water meters, electricity meters, sensors, etc.
  • At least one wire is provided on the card body of the ultra-micro memory card, and at least one wire is located between the pins in the interface; at least one wire is used to connect the storage unit to The control unit is connected, and at least one wire is also used to connect the control unit to the interface.
  • each contact (pin) 41 of the interface on the card body 10 of the memory card 100 is not limited.
  • the length value and height value of each contact 41 of the interface 40 are not limited.
  • the shape of the contact (or pin, or connecting terminal) 41 mentioned in this embodiment can be a regular rectangle or an irregular shape.
  • the contact (or pin, or connecting terminal) of this embodiment The shape of 41 is not limited.
  • the distance between the side of each contact 41 of the interface and each side of the ultra-micro memory card 100 is not limited; the specific height value and length value of the ultra-micro memory card 100 are not limited.
  • FIG. 7 is a schematic diagram of the contact arrangement on the second surface of the ultra-micro memory card according to the second embodiment of the application.
  • the micro memory card provided in the second embodiment has substantially the same structure as the micro memory card provided in the first embodiment.
  • the contacts distributed on the second surface 230 include a third contact group 515 and a third contact group 515 arranged at intervals along the first direction.
  • the third contact group 515 includes a first contact 5151 and a second contact 5152 sequentially arranged along the second direction
  • the fourth contact group 517 includes a first contact arranged sequentially along the second direction.
  • Point 5171 and second contact 5172 where the first contact 5151 and the second contact 5152 of the third contact group 515, the first contact 5171 and the second contact 5172 of the fourth contact group 517 are both Used to transfer data.
  • the difference is that the fourth contact group 517 also includes a third contact 5173 for transmitting ground signals.
  • the first contact 5151 is marked as a data transmission pin D4, and the second contact 5152 is marked as a data transmission pin D6.
  • the fourth contact group 517 the first contact 5171 is marked as the data transmission pin D5, the second contact 5172 is marked as the data transmission pin D7, and the third contact 5173 is marked as the ground signal pin GND.
  • FIG. 8 is a schematic diagram of the contact arrangement on the second surface of the ultra-micro memory card according to the third embodiment of the application.
  • the micro memory card provided in the second embodiment has substantially the same structure as the micro memory card provided in the first embodiment.
  • the contacts distributed on the second surface 330 include a third contact group 615 and a third contact group 615 spaced apart along the first direction.
  • the third contact group 615 includes a first contact 6151 and a second contact 6152 sequentially arranged along the second direction
  • the fourth contact group 617 includes a first contact arranged sequentially along the second direction.
  • Point 6171 and second contact 6172 where the first contact 6151 and the second contact 6152 of the third contact group 615, and the first contact 6171 and the second contact 6172 of the fourth contact group 617 are both Used to transfer data.
  • the difference is that the fourth contact group 617 also includes a third contact 6173 for transmitting data strobe signals.
  • the first contact 6151 is marked as a data transmission pin D4
  • the second contact 6152 is marked as a data transmission pin D6
  • the fourth contact group 617 the first contact 6171 is marked as the data transmission pin D5
  • the second contact 6172 is marked as the data transmission pin D7
  • the third contact 6173 is marked as the data strobe signal pin Data strobe .
  • FIG. 9 is a schematic diagram of the contact arrangement on the second surface of the ultra-micro memory card according to the fourth embodiment of this application.
  • the ultra-micro memory card provided by the fourth embodiment has substantially the same structure as the ultra-micro memory card provided by the first embodiment.
  • the contacts distributed on the second surface 430 include a third contact group 715 and a third contact group 715 arranged at intervals along the first direction.
  • Four contact group 717 The difference is that the third contact group 715 includes the first contact, the second contact, the third contact... the Nth contact arranged in order along the second direction, and the fourth contact group 717 includes the first contact along the second direction.
  • the Mth contact are arranged in sequence, wherein the first contact and the second contact in the third contact group 715 and the fourth contact group 717 Points are used to transfer data.
  • N and M may be the same or different.
  • the first contact of the third contact group 715, the second contact of the third contact group 715, the first contact of the fourth contact group 717, and the second contact of the fourth contact group 717 The contacts are used to transmit data.
  • the contacts distributed on the first surface and the contacts distributed on the second surface may be arranged irregularly, that is, it is not limited that the contacts distributed on the first surface are arranged in the first direction and the second direction. It is not limited that the contacts distributed on the second surface are arranged along the first direction and the second direction. Four of the contacts distributed on the first surface and at least four contacts distributed on the second surface are used for data transmission.

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Abstract

一种超微型存储卡（100）及终端（300）。超微型存储卡（100）包括卡体（10）、芯片（20）及接口（40），芯片（20）设置在卡体（10）内部；接口（40）设置在存储卡（100）的卡体（10）的表面，芯片（20）与接口（40）电性连接，卡体（10）包括相背设置的第一表面（11）及第二表面（12），接口（40）包括多个触点（41），多个触点（41）分布于第一表面（11）及所述第二表面（12）。由于多个触点（41）分布于第一表面（11）及第二表面（12），即卡体（10）的第一表面（11）及第二表面（12）均排布触点（41），如此，有利于提高存储卡（100）的数据传输速度。

Description

超微型存储卡及终端
本申请要求于2019年7月15日提交中国专利局、申请号为201910636288.4、发明名称为“超微型存储卡及终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种超微型存储卡及终端。
背景技术
终端已经成为人们生活和工作中的重要通信工具。现有的一种应用于终端的超微型存储卡(Nano Memory Card，简称NM存储卡)，由于触点的排布局限，数据传输速度不高，制约终端技术的发展。
发明内容
本申请实施例所要解决的技术问题在于提供一种能够提高数据传输速度的超微型存储卡及终端。
为了实现上述目的，本申请实施方式采用如下技术方案：
第一方面，本申请实施例提供一种超微型存储卡，包括卡体、芯片及接口，所述芯片设置在所述卡体内部；所述接口设置在所述存储卡的卡体的表面，所述芯片与所述接口电性连接，所述卡体包括相背设置的第一表面及第二表面，所述接口包括多个触点，所述多个触点分布于所述第一表面及所述第二表面。
由于多个触点分布于第一表面及第二表面，即卡体的第一表面及第二表面均排布触点，增加了触点的数量，如此，有利于提高存储卡的数据传输速度。
在一实施方式中，分布于所述第一表面的其中四个触点及至少四个分布于所述第二表面的触点用于传输数据。
本实施方式中，分布于第一表面上的其中四个触点用于传输数据，至少四个分布于第二表面上的触点用于传输数据，如此，超微型存储卡上至少有八个触点用于传输数据，可满足emmc协议5.0中的8bit模式，实现更高的传输速度，例如在HS200模式下总线速度达200MB/s,在HS400模式下总线速度达400MB/s。
在一实施方式中，分布于所述第一表面的触点包括沿第一方向间隔设置的第一触点组及第二触点组，所述第一触点组与所述第二触点组均包括沿第二方向依次排列设置的第一触点、第二触点、第三触点及第四触点，所述第一方向不同于所述第二方向，所述第一触点组的第一触点、所述第一触点组的第三触点、所述第二触点组的第一触点、所述第二触点组的第四触点用于传输数据，所述第一触点组的第二触点用于传输电源信号，所述第一触点组的第四触点用于传输时钟信号，所述第二触点组的第二触点用于传输地信号，所述第二触点组的第三触点用于传输控制信号。
本实施方式中，第一表面上的触点排布方式与现有的超微型存储卡保持相同，使得本实施方式中的超微型存储卡能够被现有的终端中的单面卡座识别及兼容，方便了使用。
在一实施方式中，分布于所述第二表面的触点包括沿第一方向间隔设置的第三触点组及第四触点组，所述第三触点组与所述第四触点组均包括沿第二方向依次排列设置的第一触点及第二触点，所述第三触点组与所述第四触点组中的第一触点及第二触点均用于传输数据，第三触点组及第四触点组沿第一方向排列，所述第三触点组与所述第四触点组中的触点沿第二方向依次排列设置，提高了制备超微型存储卡的便利性。
在一实施方式中，所述第四触点组还包括第三触点，所述第四触点组的第二触点位于所述第四触点组的第一触点与所述第四触点组的第三触点之间，所述第四触点组的第三触点用于传输接地信号。
在一实施方式中，所述第三触点组还包括第三触点，所述第三触点组的第二触点位于所述第三触点组的第一触点与所述第三触点组的第三触点之间，所述第三触点组的第三触点用于传输接地信号或数据选通信号。
在一实施方式中，所述卡体包括相对设置且第一基板及与所述第二基板固定连接的第二基板，所述芯片固定设于所述第二基板朝向所述第一基板的一面，所述第一表面为所述第一基板背离所述第二基板的一面，所述第二表面为所述第二基板背离所述第一基板的一面。通过第一基板、第二基板组合而成卡体，方便了超微型存储卡的制备。
在一实施方式中，所述第一基板包括第一板体及第一电连接部，所述第一表面为所述第一板体朝向所述第二基板的一面，所述第一电连接部凸设所述第一板体朝向所述第二基板的一面，所述第二基板包括第二板体及第二电连接部，所述第二表面为所述第二板体朝向所述第一基板的一面，所述第二电连接部凸设所述第二板体朝向所述第一基板的一面，所述第一电连接部与所述第二电连接部通过锡球互连，简化了超微型存储卡内的结构。
在一实施方式中，所述第一电连接部包括第一电连接凸台与第一电连接柱，所述第一电连接凸台凸设于所述第一板体朝向所述第二板体的一面，所述第一电连接柱固定连接于所述第一电连接凸台背离所述第一板体的一端，所述第二电连接部包括第二电连接凸台与第二电连接柱，所述第二电连接凸台凸设于所述第二板体朝向所述第一板体的一面，所述第二电连接柱固定连接于所述第二电连接凸台背离所述第二板体的一端，所述锡球连接于所述第一电连接柱及所述第二电连接柱之间，节约了锡球的使用量。
在一实施方式中，所述芯片设于所述第二基板朝向所述第一基板的一面，所述芯片包括层叠设置的第一芯片及第二芯片，其中所述第二芯片设于所述第二基板朝向所述第一基板的一面，所述第一芯片、所述第二芯片均与所述接口电性连接。
第二方面，本申请实施例还提供一种终端，包括终端主体、设于所述终端主体上的卡座及如上所述的超微型存储卡，所述卡座包括腔体，所述超微型存储卡收容于所述腔体内，所述腔体朝向所述第一表面的内壁设有多个第一接触弹片，每个第一接触弹片对应与所述第一表面上的一个触点电性接触，所述腔体朝向所述第二表面的内壁设有多个第二接触弹片，所述第二接触弹片对应与所述第二表面上的一个触点电性接触。
本申请实施方式提供的终端，采用两面均设有触点的超微型存储卡，增加了触点的数量，如此，有利于提高终端的数据传输速度，亦提高了用户的使用体验。
附图说明
图1为本申请第一实施方式提供的超微型存储卡的一剖视图。
图2为本申请一实施方式提供的超微型存储卡的剖视图。
图3为分布于图1所示的超微型存储卡的第一表面上的触点排布示意图。
图4为分布于图1所示的超微型存储卡的第二表面上的触点排布示意图。
图5为超微型存储卡插设于具有单面接触弹片的卡座的终端的一应用场景示意图。
图6为超微型存储卡插设于具双面接触弹片的卡座的终端中的一应用场景示意图。
图7为本申请第二实施方式提供的超微型存储卡的第二表面上的触点排布示意图。
图8为本申请第三实施方式提供的分布于超微型存储卡的第二表面的触点排布示意图。
图9为本申请第四实施方式提供的分布于超微型存储卡的第二表面的触点排布示意图。
具体实施方式
请参阅图1，图1为本申请第一实施方式提供的超微型存储卡的结构示意图。超微型存储卡100包括卡体10、芯片20及接口40。芯片20设置在卡体10内部。接口40设置在卡体10的表面。芯片20与接口40电性连接。卡体10包括相背设置的第一表面11及第二表面12。接口40包括多个触点41。多个触点41分布于第一表面11及第二表面12。
由于多个触点41分布于第一表面11及第二表面12，即卡体10的第一表面11及第二表面12均排布触点41，而不限定于排布超微型存储卡的单面，增加了触点41的数量，如此，有利于提高存储卡100的数据传输速度。
卡体10包括第一基板15及与第一基板15固定连接的第二基板17。第一表面11为第一基板15背离第二基板17的一面。第二表面12为第二基板17背离第一基板15的一面。通过第一基板15、第二基板17组合而成卡体10，方便了超微型存储卡100的制备。
第一基板15包括第一板体151及第一电连接部153。第一表面11为第一板体151背离第二基板17的一面。第一电连接部153凸设于第一板体151朝向第二基板17的一面。第一电连接部153通过走线(图未)与分布于第一表面11的触点41及芯片20电性连接。第一电连接部153包括第一电连接凸台1531及第一电连接柱1533。第一电连接凸台1531设于第一板体151朝向第二基板17的一面，第一电连接柱1533固定连接于第一电连接凸台1531背离第一板体151的一端，第一电连接凸台1531位于第一电连接柱1533与第一板体151之间。
第二基板17包括第二板体171及第二电连接部173。第二表面12为第二板体171背离第一基板15的一面。第二电连接部173凸设于第二板体171朝向第一基板15的一面。第二电连接部173通过走线(图未)与分布于第二表面12的触点41及芯片20电性连接。第二电连接部173包括第二电连接凸台1731及第二电连接柱1733。第二电连接凸台1731凸设于第二板体171朝向第一板体151的一面，第二电连接柱1733固定连接于第二电连接凸台1731背离第二板体171的一端。第二电连接凸台1731位于第二电连接柱1733与第二板体171之间。第二电连接柱1733与第一电连接柱1533通过锡球互连，如此能够节约锡球的使用量。
芯片20设于第二基板17朝向第一基板15的一面。芯片20包括层叠设置的第一芯片21及第二芯片23，其中第二芯片23设于第二基板17朝向第一基板15的一面。第一芯片21包括控制单元，第二芯片23包括存储单元。控制单元与存储单元电性连接。在本实施例中，具体的，超微型存储卡100还包括接口驱动电路，将存储单元、控制单元以及接口驱动电路设置在存储卡100的卡体10内，将接口设置在存储卡的卡体的表面上。并且，将控制单元分别与存储单元、存储卡接口分别进行电连接，具体来说，接口驱动电路分别与存储卡接口、以及控制单元进行电连接，进而接口驱动电路将存储卡接口与控制单元进行电连接，并且将控制单元与存储单元进行电连接。可以理解，不限定控制单元设置于第一芯片21，不限定存储单元设置于第二芯片23，控制单元与存储单元也可以设置于单个芯片上，以缩小超微型存储卡100的体积及简化超微型存储卡100的结构。
可以理解，请参阅图2所示，第一电连接部可以省略第一电连接柱，即第一电连部包括第一电连接凸台1531，第二电连接部可以省略第二电连接柱，即第二电连部包括第二电连接凸台1731，锡球30直接设置于第一电连接凸台1531与第二电连接凸台1731之间，简化了超微型存储卡100的第一基板15及第二基板17的结构。
超微型存储卡100的各触点41(或引脚、或连接端子)之间可以是具有间距的，且各触点(或引脚、或连接端子)41与超微型存储卡100的边缘之间也可以是有间距的，可知超微型存储卡100上的各触点41并没有铺满超微型存储卡100的卡体10的表面，这些间距都是超微型存储卡100的卡体10表面的区域，进而这些区域可以用于设置走线，即将走线铺设在各触点(或引脚、或连接端子)41之间的间距上、以及各触点(或引脚、或连接端子)41与超微型存储卡100的边缘之间的间距上，并且走线用于将存储单元与控制单元连接，走线还用于将控制单元与存储卡接口连接。
请参阅图3，分布于第一表面11的触点41包括沿第一方向(如图3所示的X方向)间隔设置的第一触点组411及第二触点组413。第一触点组411包括沿第二方向(如图3所示的Y方向)依次排列设置的第一触点4111、第二触点4112、第三触点4113及第四触点4114。第二触点组413均包括沿第二方向依次排列设置的第一触点4131、第二触点4132、第三触点4133及第四触点4134。第一方向不同于第二方向。本实施方式中，第一触点4111、第二触点4112、第三触点4113及第四触点4114位于同一直线上；第一触点4131、第二触点4132、第三触点4133及第四触点4134位于同一直线上。
第一触点组411的第一触点4111、第一触点组411的第三触点4113、第二触点组413的第一触点4131、第二触点组413的第四触点4134用于传输数据(data,简称D)，第一触点组411的第二触点4112用于传输电源(power supply，简称VCC)信号，第一触点组411的第四触点4134用于传输时钟(clock，简称CLK)信号，第二触点组413的第二触点4132用于传输地(power supply ground，简称GND)信号，第二触点组413的第三触点4133用于传输控制(command/response，简称CMD)信号。
在第一触点组411中，第一触点4111标记为数据传输引脚D2，第二触点4112标记为电源信号引脚VCC，第三触点4113标记为数据传输引脚D0，第四触点4114标记为时钟信号引脚CLK。在第二触点组413中，第一触点4131标记为数据传输引脚D3，第二触点4132标记为地信号引脚GND，第三触点4133标记为控制信号引脚CMD，第四触点4134标记为数 据信号引脚D1。
请参阅图4，图4为分布于图1所示的超微型存储卡的第二表面的触点排布示意图。分布于第二表面12的触点41包括沿第一方向间隔设置的第三触点组415及第四触点组417，第三触点组415包括第二方向依次排列设置的第一触点4151及第二触点4152，第四触点组417包括沿第二方向依次排列设置的第一触点4171及第二触点4173，第三触点组415的第一触点4151、第三触点组415的第二触点4152、第四触点组417的第一触点4171及第四触点组417的第二触点4152均用于传输数据。本实施方式中，第一触点4151及第二触点4152位于同一直线上；第一触点4171及第二触点4173位于同一直线上；第一触点4171及第二触点4173位于同一直线上。
在第三触点组415中，第一触点4151标记为数据传输引脚D4，第二触点4152标记为数据传输引脚D6。在第四触点组417中，第一触点4171标记为数据传输引脚D5，第二触点4172标记为数据传输引脚D7。
分布于第一表面11的触点41中的其中四个(第一触点4111、第二触点4113、第一触点4131、第四触点4134)及分布于第二表面12的四个触点41(第一触点4151、第二触点4152、第一触点4171、第二触点4172)用于传输数据，如此，超微型存储卡100上有八个触点41用于传输数据，满足emmc协议5.0中的8bit模式，实现更高的传输速度，例如在HS200模式下总线速度达200MB/s,在HS400模式下总线速度达400MB/s。
本实施方式中，超微型存储卡100的尺寸以及第一表面11上的触点41的排布方式与现有的超微型存储卡保持相同，使得超微型存储卡100能够被现有的终端中的单面卡座识别及兼容，方便了使用。请参阅图5，图5为本申请一实施方式提供的具超微型存储卡的终端的一应用场景示意图。终端200，包括终端主体201、设于终端主体201上的卡座203及如上所述的超微型存储卡100。超微型存储卡100插设于卡座203的腔体2031内，腔体2031朝向第一表面11的内壁设有多个第一接触弹片2033，每个第一接触弹片2033对应与第一表面11上的一个触点41弹性抵接并电性接触，实现第一表面11上的触点41与卡座203之间的信号连通。
请参阅图6，图6为本申请又一实施方式提供的具超微型存储卡的终端的一应用场景示意图。终端300包括终端主体301、设于终端主体301上的卡座303及如上所述的超微型存储卡100。卡座301包括腔体3031。超微型存储卡100插设于腔体3031内，腔体3011朝向第一表面11的内壁设有多个第一接触弹片3033，每个第一接触弹片3033对应与第一表面11上的一个触点41弹性抵接并电性接触，实现第一表面11上的触点41与卡座303之间的信号连通。腔体3031朝向第二表面12的内壁设有多个第二接触弹片3035。第二接触弹片3035对应与第二表面12上的一个触点41弹性抵接并电性接触，实现第一表面11上的触点41与卡座303之间的信号连通。由于卡座303采用两面均设有触点41的超微型存储卡100，如此，有利于提高终端300的数据传输速度，亦提高了用户的使用体验。
终端200或终端300：可以包括各种具有通信功能的手持设备、车载设备、可穿戴设备、家庭智能设备、计算设备或连接到无线调制解调器的其它处理设备，以及各种形式的终端，例如，移动台(mobile station，MS)，终端(terminal)，用户设备(user equipment，UE)，软终端等等，举例来说有水表、电表、传感器等。
在可选的一种实施方式中，在超微型存储卡的卡体上设置有至少一个走线，至少一个走线位于接口中的各引脚之间；至少一个走线用于将存储单元与控制单元连接，至少一个走线还用于将控制单元与接口连接。
接口的各触点(引脚)41在存储卡100的卡体10上的位置不做限定。接口40的各触点41的长度值、高度值不做限定。本实施例中提到的触点(或引脚、或连接端子)41的形状可以是规则的矩形，也可以是不规则的形状，本实施例对触点(或引脚、或连接端子)41的形状不做限定。接口的各触点41的边与超微型存储卡100的各侧边之间的距离值不做限定；超微型存储卡100的具体高度值、长度值不做限定。
请参阅图7，图7为本申请第二实施方式提供的超微型存储卡的第二表面的触点排布示意图。第二实施方式提供的超微型存储卡与第一实施方式提供的超微型存储卡结构大致相同，分布于第二表面230的触点包括沿第一方向间隔设置的第三触点组515及第四触点组517，第三触点组515包括沿第二方向依次排列的第一触点5151及第二触点5152，第四触点组517包括沿第二方向依次排列设置的第一触点5171及第二触点5172，其中，第三触点组515的第一触点5151及第二触点5152，第四触点组517中的第一触点5171及第二触点5172均用于传输数据。不同在于，第四触点组517还包括第三触点5173，用于传输接地信号。
在第三触点组515中，第一触点5151标记为数据传输引脚D4，第二触点5152标记为数据传输引脚D6。在第四触点组517中，第一触点5171标记为数据传输引脚D5，第二触点5172标记为数据传输引脚D7，第三触点5173标记为地信号引脚GND。
请参阅图8，图8为本申请第三实施方式提供的超微型存储卡的第二表面上的触点排布示意图。第二实施方式提供的超微型存储卡与第一实施方式提供的超微型存储卡结构大致相同，分布于第二表面330的触点包括沿第一方向间隔设置的第三触点组615及第四触点组617，第三触点组615包括沿第二方向依次排列的第一触点6151及第二触点6152，第四触点组617包括沿第二方向依次排列设置的第一触点6171及第二触点6172，其中，第三触点组615的第一触点6151及第二触点6152，第四触点组617中的第一触点6171及第二触点6172均用于传输数据。不同在于，第四触点组617还包括第三触点6173，用于传输数据选通信号。
在第三触点组615中，第一触点6151标记为数据传输引脚D4，第二触点6152标记为数据传输引脚D6。在第四触点组617中，第一触点6171标记为数据传输引脚D5，第二触点6172标记为数据传输引脚D7，第三触点6173标记为数据选通信号引脚Data strobe。
请参阅图9，图9为本申请第四实施方式提供的超微型存储卡的第二表面上的触点排布示意图。第四实施方式提供的超微型存储卡与第一实施方式提供的超微型存储卡结构大致相同，分布于第二表面430的触点包括沿第一方向间隔设置的第三触点组715及第四触点组717。不同在于，第三触点组715包括沿第二方向依次排列设置的第一触点、第二触点、第三触点……第N触点，第四触点组717包括沿第二方向依次排列设置的第一触点、 第二触点、第三触点……第M触点，其中，第三触点组715与第四触点组717中的第一触点及第二触点均用于传输数据。N与M可以相同也可以不相同。本实施方式中，第三触点组715的第一触点、第三触点组715的第二触点、第四触点组717的第一触点、第四触点组717的第二触点用于传输数据。
可以理解，分布在第一表面的触点以及分布在第二表面的触点可以为不规则排布，即不限定分布于第一表面上的触点沿第一方向及第二方向排布，不限定分布于第二表面上的触点沿第一方向及第二方向排布，分布于第一表面的其中四个触点及至少四个分布于第二表面的触点用于传输数据。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (10)

  1. 一种超微型存储卡，其特征在于，包括卡体、芯片及接口，所述芯片设置在所述卡体内部；所述接口设置在所述存储卡的卡体的表面，所述芯片与所述接口电性连接，所述卡体包括相背设置的第一表面及第二表面，所述接口包括多个触点，所述多个触点分布于所述第一表面及所述第二表面。
  2. 根据权利要求1所述的超微型存储卡，其特征在于，分布于所述第一表面的其中四个触点及至少四个分布于所述第二表面的触点用于传输数据。
  3. 根据权利要求2所述的超微型存储卡，其特征在于，分布于所述第一表面的触点包括沿第一方向间隔设置的第一触点组及第二触点组，所述第一触点组与所述第二触点组均包括沿第二方向依次排列设置的第一触点、第二触点、第三触点及第四触点，所述第一方向不同于所述第二方向，所述第一触点组的第一触点、所述第一触点组的第三触点、所述第二触点组的第一触点、所述第二触点组的第四触点用于传输数据，所述第一触点组的第二触点用于传输电源信号，所述第一触点组的第四触点用于传输时钟信号，所述第二触点组的第二触点用于传输地信号，所述第二触点组的第三触点用于传输控制信号。
  4. 根据权利要求3所述的超微型存储卡，其特征在于，分布于所述第二表面的触点包括沿第一方向间隔设置的第三触点组及第四触点组，所述第三触点组与所述第四触点组均包括沿第二方向依次排列设置的第一触点及第二触点，所述第三触点组与所述第四触点组中的第一触点及第二触点均用于传输数据。
  5. 根据权利要求4所述的超微型存储卡，其特征在于，所述第四触点组还包括第三触点，所述第四触点组的第二触点位于所述第四触点组的第一触点与所述第四触点组的第三触点之间，所述第四触点组的第三触点用于传输接地信号。
  6. 根据权利要求4所述的超微型存储卡，其特征在于，所述第三触点组还包括第三触点，所述第三触点组的第二触点位于所述第三触点组的第一触点与所述第三触点组的第三触点之间，所述第三触点组的第三触点用于传输接地信号或数据选通信号。
  7. 根据权利要求1所述的超微型存储卡，其特征在于，所述卡体包括第一基板及与所述第二基板固定连接的第二基板，所述第一基板与所述第二基板围成收容空间，所述存储单元及所述控制单元固定设于所述第二基板朝向所述第一基板的一面，所述第一表面为所述第一基板背离所述第二基板的一面，所述第二表面为所述第二基板背离所述第一基板的一面。
  8. 根据权利要求1所述的超微型存储卡，其特征在于，所述第一基板包括第一板体及第一电连接部，所述第一表面为所述第一板体朝向所述第二基板的一面，所述第一电连接部凸设所述第一板体朝向所述第二基板的一面，所述第二基板包括第二板体及第二电连接部，所述第二表面为所述第二板体朝向所述第一基板的一面，所述第二电连接部凸设所述第二板体朝向所述第一基板的一面，所述第一电连接部与所述第二电连接部通过锡球互连。
  9. 根据权利要求8所述的超微型存储卡，其特征在于，所述第一电连接部包括第一电连接凸台与第一电连接柱，所述第一电连接凸台凸设于所述第一板体朝向所述第二板体的一面，所述第一电连接柱固定连接于所述第一电连接凸台背离所述第一板体的一端，所述第二电连接部包括第二电连接凸台与第二电连接柱，所述第二电连接凸台凸设于所述第二板体朝向所述第一板体的一面，所述第二电连接柱固定连接于所述第二电连接凸台背离所述第二 板体的一端，所述锡球连接于所述第一电连接柱及所述第二电连接柱之间。
  10. 一种终端，其特征在于，所述终端包括终端主体、设于所述终端主体上的卡座及根据权利要求1-9任意一项所述的超微型存储卡，所述卡座包括腔体，所述超微型存储卡收容于所述腔体内，所述腔体朝向所述第一表面的内壁设有多个第一接触弹片，每个第一接触弹片对应与所述第一表面上的一个触点电性接触，所述腔体朝向所述第二表面的内壁设有多个第二接触弹片，每个第二接触弹片对应与所述第二表面上的一个触点电性接触。
PCT/CN2020/101847 2019-07-15 2020-07-14 超微型存储卡及终端 WO2021008518A1 (zh)

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