WO2021005434A1 - 表示装置、表示モジュール、及び電子機器 - Google Patents
表示装置、表示モジュール、及び電子機器 Download PDFInfo
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- WO2021005434A1 WO2021005434A1 PCT/IB2020/055891 IB2020055891W WO2021005434A1 WO 2021005434 A1 WO2021005434 A1 WO 2021005434A1 IB 2020055891 W IB2020055891 W IB 2020055891W WO 2021005434 A1 WO2021005434 A1 WO 2021005434A1
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- layer
- light
- light emitting
- transistor
- display device
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Images
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- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H10K30/40—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
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Definitions
- One aspect of the present invention relates to display devices, display modules, and electronic devices.
- One aspect of the present invention relates to a display device having a light receiving device (also referred to as a light receiving element) and a light emitting device (also referred to as a light emitting element).
- One aspect of the present invention is not limited to the above technical fields.
- the technical fields of one aspect of the present invention include semiconductor devices, display devices, light emitting devices, power storage devices, storage devices, electronic devices, lighting devices, input devices (for example, touch sensors), input / output devices (for example, touch panels, etc.). ), Their driving method, or their manufacturing method can be given as an example.
- display devices are expected to be applied to various applications.
- applications of a large display device include a home television device (also referred to as a television or television receiver), digital signage (electronic signboard), PID (Public Information Display), and the like.
- a home television device also referred to as a television or television receiver
- digital signage electronic signboard
- PID Public Information Display
- mobile information terminals development of smartphones and tablet terminals equipped with a touch panel is underway.
- a light emitting device (also referred to as an EL device or EL element) that utilizes an electroluminescence (hereinafter referred to as EL) phenomenon is a DC low-voltage power supply that is easy to be thin and lightweight, can respond to an input signal at high speed, and can respond to an input signal at high speed. It has features such as being able to be driven by using electroluminescence, and is applied to display devices.
- Patent Document 1 discloses a flexible light emitting device to which an organic EL device (also referred to as an organic EL element) is applied.
- One aspect of the present invention is to provide a display device having a light detection function.
- One aspect of the present invention is to provide a highly convenient display device.
- One aspect of the present invention is to provide a multifunctional display device.
- One aspect of the present invention is to provide a display device having high display quality.
- One aspect of the present invention is to provide a display device having high sensitivity for light detection.
- One aspect of the present invention is to simplify a circuit (also referred to as an external circuit) externally attached to a display device.
- One aspect of the present invention is to provide a new display device.
- One aspect of the present invention includes a first pixel circuit and a second pixel circuit, the first pixel circuit having a light receiving device, a first transistor, and a second transistor, and a second pixel.
- the circuit has a light emitting device, the light receiving device has a first pixel electrode, an active layer, and a common electrode, and the light emitting device has a second pixel electrode, a light emitting layer, and a common electrode, and is active.
- the layer is located on the first pixel electrode and has the first organic compound, and the light emitting layer is located on the second pixel electrode and is different from the first organic compound.
- the common electrode has a portion that overlaps with the first pixel electrode via the active layer and a portion that overlaps with the second pixel electrode via the light emitting layer, and the first transistor has.
- the second transistor is a display device having a low temperature polysilicon in the semiconductor layer and a metal oxide in the semiconductor layer.
- One aspect of the present invention has a first pixel circuit and a second pixel circuit, the first pixel circuit has a light receiving device, a first transistor, and a second transistor, and a second pixel.
- the circuit has a light emitting device, the light receiving device has a first pixel electrode, a common layer, an active layer, and a common electrode, and the light emitting device has a second pixel electrode, a common layer, a light emitting layer, and a common electrode. It has an electrode, the active layer is located on the first pixel electrode and has the first organic compound, and the light emitting layer is located on the second pixel electrode and is the first organic.
- the common electrode has a portion that overlaps with the first pixel electrode via the active layer and a portion that overlaps with the second pixel electrode via the light emitting layer.
- the common layer is located on the first pixel electrode and the second pixel electrode, and the common layer has a portion that overlaps with the active layer and a portion that overlaps with the light emitting layer, and is a first transistor. Is a display device having low temperature polysilicon in the semiconductor layer and the second transistor having a metal oxide in the semiconductor layer.
- the common layer preferably has a layer that functions as a hole injection layer of the light emitting device.
- the common layer preferably has a layer that functions as a hole transport layer of the light emitting device.
- the common layer preferably has a layer that functions as an electron transport layer of the light emitting device.
- the common layer preferably has a layer that functions as an electron injection layer of the light emitting device.
- the second pixel circuit preferably further includes a third transistor having low temperature polysilicon in the semiconductor layer.
- the second pixel circuit preferably further includes a third transistor having a metal oxide in the semiconductor layer.
- the display device of one aspect of the present invention preferably further includes a resin layer, a light-shielding layer, and a substrate.
- the resin layer and the light-shielding layer are preferably located between the common electrode and the substrate, respectively.
- the resin layer preferably has an opening that overlaps the light receiving device.
- the resin layer preferably has a portion that overlaps with the light emitting device.
- the light-shielding layer preferably has a portion located between the common electrode and the resin layer.
- the light-shielding layer preferably covers at least a part of the opening and at least a part of the side surface of the resin layer exposed at the opening.
- the resin layer is preferably provided in an island shape and has a portion that overlaps with the light emitting device.
- the light-shielding layer preferably has a portion located between the common electrode and the resin layer. It is preferable that at least a part of the light that has passed through the substrate is incident on the light receiving device without passing through the resin layer.
- the light-shielding layer preferably covers at least a part of the side surface of the resin layer.
- the display device of one aspect of the present invention preferably further has an adhesive layer.
- the adhesive layer is preferably located between the common electrode and the substrate.
- the resin layer and the light-shielding layer are preferably located between the adhesive layer and the substrate, respectively.
- the adhesive layer preferably has a first portion that overlaps the light receiving device and a second portion that overlaps the light emitting device. The first portion is preferably thicker than the second portion.
- the display device of one aspect of the present invention preferably has flexibility.
- One aspect of the present invention is a module having a display device having any of the above configurations and to which a connector such as a flexible printed circuit board (hereinafter referred to as FPC) or TCP (Tape Carrier Package) is attached.
- FPC flexible printed circuit board
- TCP Tape Carrier Package
- a module such as a module in which an integrated circuit (IC) is mounted by a COG (Chip On Glass) method, a COF (Chip On Film) method, or the like.
- One aspect of the present invention is an electronic device having the above module and at least one of an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.
- a display device having a light detection function can be provided.
- a highly convenient display device can be provided.
- a multifunctional display device can be provided.
- a display device having high display quality can be provided.
- the external circuit of the display device can be simplified.
- a novel display device can be provided.
- FIG. 1A to 1D are cross-sectional views showing an example of a display device.
- 1E to 1I are top views showing an example of pixels.
- FIG. 2 is a cross-sectional view showing an example of a display device.
- FIG. 3A is a cross-sectional view showing an example of the display device.
- 3B and 3C are views showing an example of the upper surface layout of the resin layer.
- 4A and 4B are cross-sectional views showing an example of a display device.
- 5A to 5C are cross-sectional views showing an example of a display device.
- 6A to 6C are cross-sectional views showing an example of a display device.
- FIG. 7A is a top view showing an example of the display device.
- FIG. 7B is a cross-sectional view showing an example of the display device.
- FIG. 8A and 8B are cross-sectional views showing an example of a display device.
- FIG. 9A is a top view showing an example of the display device.
- FIG. 9B is a cross-sectional view showing an example of the display device.
- FIG. 10A is a top view showing an example of the display device.
- FIG. 10B is a cross-sectional view showing an example of the display device.
- 11A and 11B are cross-sectional views showing an example of a display device.
- 12A and 12B are cross-sectional views showing an example of a display device.
- FIG. 13 is a perspective view showing an example of the display device.
- FIG. 14 is a cross-sectional view showing an example of the display device.
- 15A and 15B are cross-sectional views showing an example of a display device.
- FIG. 16 is a cross-sectional view showing an example of a display device.
- FIG. 17A is a cross-sectional view showing an example of the display device.
- FIG. 17B is a cross-sectional view showing an example of a transistor.
- 18A and 18B are circuit diagrams showing an example of a pixel circuit.
- 19A and 19B are top views showing an example of a display device.
- 20A and 20B are diagrams showing an example of an electronic device.
- 21A to 21D are diagrams showing an example of an electronic device.
- 22A to 22F are diagrams showing an example of an electronic device.
- membrane and the word “layer” can be interchanged with each other in some cases or depending on the situation.
- conductive layer can be changed to the term “conductive layer”.
- insulating film can be changed to the term “insulating layer”.
- the display device of the present embodiment has a light receiving device and a light emitting device in the display unit.
- light emitting devices are arranged in a matrix on the display unit, and an image can be displayed on the display unit.
- light receiving devices are arranged in a matrix on the display unit, and the display unit also has a function as a light receiving unit.
- the light receiving unit can be used for an image sensor or a touch sensor. That is, by detecting the light with the light receiving unit, it is possible to capture an image and detect the proximity or contact of an object (finger, pen, etc.).
- the light emitting device can be used as a light source of the sensor. Therefore, it is not necessary to provide a light receiving unit and a light source separately from the display device, and the number of parts of the electronic device can be reduced.
- the light receiving device when the object reflects the light emitted from the light emitting device of the display unit, the light receiving device can detect the reflected light, so that imaging and touch (including near touch) detection can be performed even in a dark place. It is possible.
- the display device of the present embodiment has a function of displaying an image by using a light emitting device. That is, the light emitting device functions as a display device.
- an EL device such as an OLED (Organic Light Emitting Diode) or a QLED (Quantum-dot Light Emitting Diode).
- the light emitting substances possessed by the EL device include fluorescent substances (fluorescent materials), phosphorescent substances (phosphorescent materials), inorganic compounds (quantum dot materials, etc.), and substances showing thermal activated delayed fluorescence (thermally activated delayed fluorescence). (Thermally Activated Fluorescence: TADF) material) and the like.
- an LED such as a micro LED (Light Emitting Diode) can also be used.
- the display device of the present embodiment has a function of detecting light by using a light receiving device.
- the display device of the present embodiment can capture an image by using the light receiving device.
- the display device of this embodiment can be used as a scanner.
- an image sensor can be used to acquire data such as fingerprints, palm prints, or irises. That is, the biometric authentication sensor can be incorporated in the display device of the present embodiment.
- the number of parts of the electronic device can be reduced, and the size and weight of the electronic device can be reduced as compared with the case where the biometric authentication sensor is provided separately from the display device. ..
- the image sensor can be used to acquire data such as a user's facial expression, eye movement, or change in pupil diameter.
- data such as a user's facial expression, eye movement, or change in pupil diameter.
- the display device of the present embodiment can detect the proximity or contact of an object by using the light receiving device.
- the light receiving device for example, a pn type or pin type photodiode can be used.
- the light receiving device functions as a photoelectric conversion device that detects light incident on the light receiving device and generates an electric charge. The amount of charge generated is determined based on the amount of incident light.
- organic photodiode having a layer containing an organic compound as the light receiving device.
- Organic photodiodes can be easily made thinner, lighter, and larger in area, and have a high degree of freedom in shape and design, so that they can be applied to various display devices.
- an organic EL device is used as the light emitting device, and an organic photodiode is used as the light receiving device.
- the organic EL device and the organic photodiode can be formed on the same substrate. Therefore, the organic photodiode can be built in the display device using the organic EL device.
- the number of film forming steps becomes very large. Since many organic photodiodes have layers that can have the same configuration as organic EL devices, it is possible to suppress an increase in the film forming process by forming the layers that can have the same configuration in a batch. In addition, even if the number of film formations is the same, by reducing the number of layers that are filmed only on some devices, the influence of the film formation pattern deviation can be reduced, and adhesion to the film formation mask (metal mask, etc.) It is possible to reduce the influence of dust (including small foreign substances called particles). As a result, the yield of manufacturing the display device can be increased.
- one of the pair of electrodes can be a common layer for the light receiving device and the light emitting device.
- it is preferable that at least one of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer is a common layer for the light receiving device and the light emitting device.
- the active layer of the light receiving device and the light emitting layer of the light emitting device may be formed separately, and the other layers may have the same configuration for the light emitting device and the light receiving device.
- the layer that the light receiving device and the light emitting device have in common may have different functions in the light receiving device and the light emitting device.
- the components are referred to based on the function in the light emitting device.
- the hole injection layer functions as a hole injection layer in a light emitting device and as a hole transport layer in a light receiving device.
- the electron injection layer functions as an electron injection layer in the light emitting device and as an electron transport layer in the light receiving device.
- a metal oxide also referred to as an oxide semiconductor
- the semiconductor layer in which channels are formed in all the transistors included in the pixel circuit having a light receiving device and the pixel circuit having a light emitting device It is preferable to use a transistor having the same (hereinafter, also referred to as an OS transistor).
- the OS transistor has an extremely small off current, and can retain the electric charge accumulated in the capacitance connected in series with the transistor for a long period of time. Further, by using the OS transistor, the power consumption of the display device can be reduced.
- all the transistors included in the pixel circuit having a light receiving device and the pixel circuit having a light emitting device have silicon in the semiconductor layer on which channels are formed (hereinafter, also referred to as Si transistors). It is preferable to use). Examples of silicon include single crystal silicon, polycrystalline silicon, and amorphous silicon.
- Si transistors silicon in the semiconductor layer on which channels are formed
- Examples of silicon include single crystal silicon, polycrystalline silicon, and amorphous silicon.
- LTPS transistor having low-temperature polysilicon (LTPS (Low Temperature Poly-Silicon)) in the semiconductor layer hereinafter, also referred to as a LTPS transistor.
- the LTPS transistor has high field effect mobility and can operate at high speed.
- a Si transistor such as an LTPS transistor
- the external circuit mounted on the display device can be simplified, and the component cost and the mounting cost can be reduced.
- the display device of one aspect of the present invention it is preferable to use two types of transistors in a pixel circuit having a light receiving device.
- the pixel circuit preferably includes an OS transistor and an LTPS transistor.
- the material of the semiconductor layer according to the function required for the transistor, the quality of the pixel circuit having the light receiving device can be improved, and the accuracy of sensing and imaging can be improved.
- one of the OS transistor and the LTPS transistor may be used or both may be used for the pixel circuit having the light emitting device.
- the LTPS transistor even when two types of transistors are used, by using the LTPS transistor, it becomes easy to build various circuits composed of CMOS circuits on the same substrate as the display unit. As a result, the external circuit mounted on the display device can be simplified, and the component cost and the mounting cost can be reduced.
- the display device preferably has a light-shielding layer on the display surface side of the light emitting device and the light receiving device.
- the light emitted from the light emitting device is preferably taken out of the display device through the opening of the light shielding layer (or the region where the light shielding layer is not provided), and the light receiving device has an opening of the light shielding layer (or a light shielding layer). It is preferable that the light is irradiated through the region (the region where is not provided).
- the light receiving device detects the light emitted by the light emitting device reflected by the object.
- the light emitted from the light emitting device may be reflected in the display device and may be incident on the light receiving device without passing through the object.
- Such stray light becomes noise at the time of light detection, and becomes a factor of lowering the S / N ratio (Signal-to-noise ratio).
- the influence of stray light can be suppressed. As a result, noise can be reduced and the sensitivity of the sensor using the light receiving device can be increased.
- a structure for example, a resin layer
- the distance from the light-shielding layer to the light-receiving device and the distance from the light-shielding layer to the light-emitting device are different.
- the distance from the light-shielding layer to the light-receiving device can be increased, and the distance from the light-shielding layer to the light-emitting device can be shortened.
- the display device of one aspect of the present invention preferably further has a resin layer, a light-shielding layer, and a substrate.
- the resin layer and the light-shielding layer are preferably located between the common electrode and the substrate, respectively.
- At least a part of the light emitted by the light emitting device is taken out of the substrate through the resin layer. At least a part of the light that has passed through the substrate is incident on the light receiving device without passing through the resin layer.
- the resin layer has an opening that overlaps the light receiving device.
- the resin layer is provided in an island shape at a position overlapping the light emitting device.
- the resin layer is provided at a position where it overlaps with the light emitting device, and is not provided at a position where it overlaps with the light receiving device. Therefore, the distance from the light-shielding layer to the light-emitting device is shorter than the distance from the light-shielding layer to the light-receiving device. As a result, both the display quality and the image quality of the display device can be improved.
- FIG. 1A to 1D show cross-sectional views of a display device according to an aspect of the present invention.
- the display device 50A shown in FIG. 1A has a layer 53 having a light receiving device and a layer 57 having a light emitting device between the substrate 51 and the substrate 59.
- the display device 50B shown in FIG. 1B has a layer 53 having a light receiving device, a layer 55 having a transistor, and a layer 57 having a light emitting device between the substrate 51 and the substrate 59.
- the display device 50A and the display device 50B have a configuration in which red (R), green (G), and blue (B) lights are emitted from the layer 57 having the light emitting device.
- the display device of one aspect of the present invention has a plurality of pixels arranged in a matrix.
- One pixel has one or more sub-pixels.
- One sub-pixel has one light emitting device.
- the pixel has a configuration having three sub-pixels (three colors of R, G, B, or three colors of yellow (Y), cyan (C), and magenta (M), etc.), or sub-pixels. (4 colors of R, G, B, white (W), 4 colors of R, G, B, Y, etc.) can be applied.
- the pixel has a light receiving device.
- the light receiving device may be provided on all pixels or may be provided on some pixels. Further, one pixel may have a plurality of light receiving devices.
- the layer 55 having transistors preferably has a first transistor and a second transistor.
- the first transistor is electrically connected to the light receiving device.
- the second transistor is electrically connected to the light emitting device.
- the display device of one aspect of the present invention may have a function of detecting an object such as a finger in contact with the display device. For example, as shown in FIG. 1C, when the light emitted by the light emitting device in the layer 57 having the light emitting device is reflected by the finger 52 in contact with the display device 50B, the light receiving device in the layer 53 having the light receiving device reflects the light. Detect light. As a result, it is possible to detect that the finger 52 has come into contact with the display device 50B.
- the display device of one aspect of the present invention may have a function of detecting or imaging an object that is close to (not in contact with) the display device 50B.
- the pixels shown in FIGS. 1E to 1G have three sub-pixels (three light emitting devices) of R, G, and B, and a light receiving device PD.
- FIG. 1E shows an example in which three sub-pixels and a light receiving device PD are arranged in a 2 ⁇ 2 matrix
- FIG. 1F shows an example in which three sub pixels and a light receiving device PD are arranged in a horizontal row. It is an example that has been done.
- FIG. 1G is an example in which three sub-pixels are arranged in a horizontal row and a light receiving device PD is arranged below the three sub-pixels. It can also be said that the pixels shown in FIGS. 1E to 1G are each composed of four sub-pixels, three sub-pixels used for display and one sub-pixel used for light detection.
- the pixel shown in FIG. 1H has four sub-pixels (four light emitting devices) of R, G, B, and W, and a light receiving device PD.
- the pixel shown in FIG. 1I has three sub-pixels R, G, and B, a light emitting device IR that emits infrared light, and a light receiving device PD.
- the light receiving device PD preferably has a function of detecting infrared light.
- the light receiving device PD may have a function of detecting both visible light and infrared light.
- the wavelength of light detected by the light receiving device PD can be determined according to the application of the sensor.
- the display device of one aspect of the present invention is a top emission type that emits light in the direction opposite to the substrate on which the light emitting device is formed, a bottom emission type that emits light on the substrate side on which the light emitting device is formed, and both sides. It may be any of the dual emission type that emits light to.
- FIGS. 2 to 12 a top emission type display device will be described as an example.
- a display device including a light emitting device that emits visible light and a light receiving device that detects visible light will be mainly described, but the display device is a light emitting device that further emits infrared light. May have. Further, the light receiving device may be configured to detect infrared light or to detect both visible light and infrared light.
- FIG. 2 shows a cross-sectional view of the display device 10.
- the display device 10 includes a light receiving device 110 and a light emitting device 190.
- the light emitting device 190 has a pixel electrode 191 and a buffer layer 192, a light emitting layer 193, a buffer layer 194, and a common electrode 115.
- the light emitting layer 193 has an organic compound.
- the light emitting device 190 has a function of emitting visible light.
- the display device 10 may further have a light emitting device having a function of emitting infrared light.
- a case where the pixel electrode 191 functions as an anode and the common electrode 115 functions as a cathode will be described as an example.
- the light receiving device 110 has a pixel electrode 181, a buffer layer 182, an active layer 183, a buffer layer 184, and a common electrode 115.
- the active layer 183 has an organic compound.
- the light receiving device 110 has a function of detecting visible light.
- the light receiving device 110 may further have a function of detecting infrared light.
- the pixel electrode 181 functions as an anode and the common electrode 115 functions as a cathode in alignment with the light emitting device 190. That is, by driving the light receiving device 110 by applying a reverse bias between the pixel electrode 181 and the common electrode 115, the display device 10 detects the light incident on the light receiving device 110, generates an electric charge, and causes a current. Can be taken out as.
- the pixel electrode 181, the pixel electrode 191 and the buffer layer 182, the buffer layer 192, the active layer 183, the light emitting layer 193, the buffer layer 184, the buffer layer 194, and the common electrode 115 may each have a single layer structure and are laminated. It may be a structure.
- the pixel electrode 181 and the pixel electrode 191 are located on the insulating layer 214.
- the pixel electrode 181 and the pixel electrode 191 can be formed of the same material and in the same process.
- the end portion of the pixel electrode 181 and the end portion of the pixel electrode 191 are each covered with a partition wall 216.
- the pixel electrode 181 and the pixel electrode 191 are electrically insulated from each other by a partition wall 216 (also referred to as being electrically separated).
- An organic insulating film is suitable as the partition wall 216.
- Examples of the material that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins. ..
- the partition wall 216 is a layer that transmits visible light. Although the details will be described later, a partition wall 217 that blocks visible light may be provided instead of the partition wall 216.
- the buffer layer 182 is located on the pixel electrode 181.
- the active layer 183 overlaps with the pixel electrode 181 via the buffer layer 182.
- the buffer layer 184 is located on the active layer 183.
- the active layer 183 overlaps with the common electrode 115 via the buffer layer 184.
- the buffer layer 182 can have a hole transport layer.
- the buffer layer 184 can have an electron transport layer.
- the buffer layer 192 is located on the pixel electrode 191.
- the light emitting layer 193 overlaps with the pixel electrode 191 via the buffer layer 192.
- the buffer layer 194 is located on the light emitting layer 193.
- the light emitting layer 193 overlaps with the common electrode 115 via the buffer layer 194.
- the buffer layer 192 can have one or both of the hole injection layer and the hole transport layer.
- the buffer layer 194 can have one or both of an electron injection layer and an electron transport layer.
- the common electrode 115 is a layer commonly used for the light receiving device 110 and the light emitting device 190.
- the material and film thickness of the pair of electrodes included in the light receiving device 110 and the light emitting device 190 can be made equal. As a result, the manufacturing cost of the display device can be reduced and the manufacturing process can be simplified.
- the display device 10 has a light receiving device 110, a light emitting device 190, a transistor 41, a transistor 42, and the like between a pair of boards (board 151 and board 152).
- the buffer layer 182, the active layer 183, and the buffer layer 184 located between the pixel electrode 181 and the common electrode 115 can also be referred to as an organic layer (a layer containing an organic compound).
- the pixel electrode 181 preferably has a function of reflecting visible light.
- the common electrode 115 has a function of transmitting visible light.
- the common electrode 115 has a function of transmitting infrared light.
- the pixel electrode 181 preferably has a function of reflecting infrared light.
- the light receiving device 110 has a function of detecting light.
- the light receiving device 110 is a photoelectric conversion device that receives light 22 incident from the outside of the display device 10 and converts it into an electric signal.
- the light 22 can also be said to be light reflected by an object from the light emitted by the light emitting device 190. Further, the light 22 may enter the light receiving device 110 via a lens described later.
- the buffer layer 192, the light emitting layer 193, and the buffer layer 194 located between the pixel electrode 191 and the common electrode 115 can also be referred to as EL layers.
- the pixel electrode 191 preferably has a function of reflecting visible light.
- the common electrode 115 has a function of transmitting visible light.
- the display device 10 has a light emitting device that emits infrared light
- the common electrode 115 has a function of transmitting infrared light.
- the pixel electrode 191 preferably has a function of reflecting infrared light.
- a micro-optical resonator (microcavity) structure is applied to the light emitting device included in the display device of the present embodiment. Therefore, one of the pair of electrodes of the light emitting device preferably has an electrode having transparency and reflection to visible light (semi-transmissive / semi-reflective electrode), and the other has an electrode having reflection to visible light (semi-transmissive / semi-reflective electrode). It is preferable to have a reflective electrode).
- the light emitting device has a microcavity structure, the light emitted from the light emitting layer can be resonated between both electrodes, and the light emitted from the light emitting device can be strengthened.
- the semi-transmissive / semi-reflective electrode can have a laminated structure of a reflective electrode and an electrode having transparency to visible light (also referred to as a transparent electrode).
- the reflective electrode which functions as a part of the semitransmissive / semi-reflective electrode, may be referred to as a pixel electrode or a common electrode
- the transparent electrode may be referred to as an optical adjustment layer.
- the layer can also be said to have a function as a pixel electrode or a common electrode.
- the light transmittance of the transparent electrode shall be 40% or more.
- an electrode having a transmittance of visible light (light having a wavelength of 400 nm or more and less than 750 nm) of 40% or more as the light emitting device.
- the reflectance of visible light of the semi-transmissive / semi-reflective electrode is 10% or more and 95% or less, preferably 30% or more and 80% or less.
- the reflectance of visible light of the reflecting electrode is 40% or more and 100% or less, preferably 70% or more and 100% or less.
- the resistivity of these electrodes is preferably 1 ⁇ 10 -2 ⁇ cm or less.
- the transmittance and reflectance of the near-infrared light (light having a wavelength of 750 nm or more and 1300 nm or less) of these electrodes are also within the above numerical ranges. ..
- the buffer layer 192 or the buffer layer 194 may have a function as an optical adjustment layer. By making the film thickness of the buffer layer 192 or the buffer layer 194 different, it is possible to intensify and extract light of a specific color in each light emitting device.
- the semi-transmissive / semi-reflective electrode has a laminated structure of a reflective electrode and a transparent electrode, the optical distance between the pair of electrodes indicates the optical distance between the pair of reflective electrodes.
- the light emitting device 190 has a function of emitting visible light. Specifically, the light emitting device 190 is an electroluminescent device that emits light to the substrate 152 side by applying a voltage between the pixel electrode 191 and the common electrode 115 (see light emitting 21).
- the light emitting layer 193 is preferably formed so as not to overlap the light receiving device 110. As a result, it is possible to suppress the light emitting layer 193 from absorbing the light 22, and it is possible to increase the amount of light emitted to the light receiving device 110.
- the pixel electrode 181 is electrically connected to the source or drain of the transistor 41 through an opening provided in the insulating layer 214.
- the pixel electrode 191 is electrically connected to the source or drain of the transistor 42 through an opening provided in the insulating layer 214.
- the transistor 42 has a function of controlling the drive of the light emitting device 190.
- the transistor 41 and the transistor 42 are in contact with each other on the same layer (the substrate 151 in FIG. 2).
- At least a part of the circuit electrically connected to the light receiving device 110 is formed of the same material and the same process as the circuit electrically connected to the light emitting device 190.
- the thickness of the display device can be reduced and the manufacturing process can be simplified as compared with the case where the two circuits are formed separately.
- the light receiving device 110 and the light emitting device 190 are each covered with a protective layer 116.
- the protective layer 116 is provided in contact with the common electrode 115.
- impurities such as water can be suppressed from entering the light receiving device 110 and the light emitting device 190, and the reliability of the light receiving device 110 and the light emitting device 190 can be improved.
- the protective layer 116 and the substrate 152 are bonded to each other by the adhesive layer 142.
- a light-shielding layer 158 is provided on the surface of the substrate 152 on the substrate 151 side.
- the light-shielding layer 158 has openings at a position overlapping the light emitting device 190 and a position overlapping the light receiving device 110.
- the position overlapping with the light emitting device 190 specifically refers to a position overlapping with the light emitting region of the light emitting device 190.
- the position overlapping the light receiving device 110 specifically refers to a position overlapping the light receiving region of the light receiving device 110.
- the light receiving device 110 detects the light emitted by the light emitting device 190 reflected by the object.
- the light emitted from the light emitting device 190 may be reflected in the display device 10 and may be incident on the light receiving device 110 without passing through the object.
- the light-shielding layer 158 can suppress the influence of such stray light.
- the light shielding layer 158 is not provided, the light 23 emitted by the light emitting device 190 may be reflected by the substrate 152, and the reflected light 24 may be incident on the light receiving device 110.
- the light-shielding layer 158 it is possible to suppress the reflected light 24 from entering the light receiving device 110. As a result, noise can be reduced and the sensitivity of the sensor using the light receiving device 110 can be increased.
- the light-shielding layer 158 a material that blocks light emission from the light-emitting device can be used.
- the light-shielding layer 158 preferably absorbs visible light.
- a metal material or a resin material containing a pigment (carbon black or the like) or a dye can be used to form a black matrix.
- the light-shielding layer 158 may have a laminated structure of a red color filter, a green color filter, and a blue color filter.
- FIG. 3A shows a cross-sectional view of the display device 10A.
- the description of the same configuration as the display device described above may be omitted.
- the display device 10A differs from the display device 10 in that it has a resin layer 159.
- the resin layer 159 is provided on the surface of the substrate 152 on the substrate 151 side.
- the resin layer 159 is provided at a position where it overlaps with the light emitting device 190, and is not provided at a position where it overlaps with the light receiving device 110.
- the resin layer 159 may be provided at a position overlapping the light emitting device 190 and having an opening 159p at a position overlapping the light receiving device 110.
- the resin layer 159 may be provided in an island shape at a position where it overlaps with the light emitting device 190, and may not be provided at a position where it overlaps with the light receiving device 110.
- a light-shielding layer 158 is provided on the surface of the substrate 152 on the substrate 151 side and the surface of the resin layer 159 on the substrate 151 side.
- the light-shielding layer 158 has openings at a position overlapping the light emitting device 190 and a position overlapping the light receiving device 110.
- the light-shielding layer 158 can absorb the stray light 23a that has passed through the resin layer 159 and is reflected by the surface of the substrate 152 on the substrate 151 side. Further, the light-shielding layer 158 can absorb the stray light 23b before reaching the resin layer 159. As a result, the stray light incident on the light receiving device 110 can be reduced. Therefore, it is possible to reduce noise and increase the sensitivity of the sensor using the light receiving device 110. In particular, it is preferable that the light-shielding layer 158 is located close to the light emitting device 190 because stray light can be further reduced. Further, when the light-shielding layer 158 is located close to the light emitting device 190, the viewing angle dependence of the display can be suppressed, which is preferable from the viewpoint of improving the display quality.
- the range in which the light receiving device 110 detects light can be controlled.
- the imaging range is narrowed and the resolution of imaging can be increased.
- the light-shielding layer 158 preferably covers at least a part of the opening and at least a part of the side surface of the resin layer 159 exposed at the opening.
- the light-shielding layer 158 preferably covers at least a part of the side surface of the resin layer 159.
- the distance from the light-shielding layer 158 to the light-emitting device 190 (specifically, the light-emitting region of the light-emitting device 190) is received from the light-shielding layer 158. It is shorter than the distance to the device 110 (specifically, the light receiving region of the light receiving device 110).
- the noise of the sensor it is possible to reduce the noise of the sensor, increase the resolution of imaging, and suppress the dependence on the viewing angle of the display. Therefore, both the display quality and the image quality of the display device can be improved.
- the resin layer 159 is a layer that transmits light emitted from the light emitting device 190.
- the material of the resin layer 159 include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.
- the structure provided between the substrate 152 and the light-shielding layer 158 is not limited to the resin layer, and an inorganic insulating film or the like may be used. The thicker the structure, the greater the difference between the distance from the light-shielding layer to the light-receiving device and the distance from the light-shielding layer to the light-emitting device. Since an organic insulating film such as a resin can be easily formed to be thick, it is suitable as the structure.
- the shortest distance from the end of the light-shielding layer 158 on the light-receiving device 110 side to the common electrode 115 For example, the shortest distance from the end of the light-shielding layer 158 on the light-receiving device 110 side to the common electrode 115.
- a distance L1 and a shortest distance L2 from the end of the light-shielding layer 158 on the light emitting device 190 side to the common electrode 115 can be used. Since the shortest distance L2 is shorter than the shortest distance L1, stray light from the light emitting device 190 can be suppressed and the sensitivity of the sensor using the light receiving device 110 can be increased. In addition, the viewing angle dependence of the display can be suppressed. Since the shortest distance L1 is longer than the shortest distance L2, the imaging range of the light receiving device 110 can be narrowed, and the imaging resolution can be increased.
- the distance from the light shielding layer 158 to the light receiving device 110 and the distance from the light shielding layer 158 to the light emitting device 190 can be obtained. Can make a difference with the distance to.
- FIG. 4A shows a cross-sectional view of the display device 10B.
- the display device 10B differs from the display device 10A in that it does not have the buffer layer 182 and the buffer layer 192 and has the common layer 112.
- the common layer 112 is located on the partition wall 216, on the pixel electrode 181 and on the pixel electrode 191.
- the common layer 112 is a layer commonly used for the light receiving device 110 and the light emitting device 190.
- the common layer 112 may have a single-layer structure or a laminated structure.
- the common layer 112 for example, one or both of the hole injection layer and the hole transport layer can be formed.
- the common layer 112 may have different functions in the light emitting device 190 and the light receiving device 110.
- the hole injection layer functions as a hole injection layer in the light emitting device 190 and as a hole transport layer in the light receiving device 110.
- At least a part of the layers other than the active layer and the light emitting layer has a common configuration between the light receiving device and the light emitting device, so that the manufacturing process of the display device can be reduced.
- FIG. 4B shows a cross-sectional view of the display device 10C.
- the display device 10C differs from the display device 10A in that it does not have the buffer layer 184 and the buffer layer 194 and has the common layer 114.
- the common layer 114 is located on the partition wall 216, the active layer 183, and the light emitting layer 193.
- the common layer 114 is a layer commonly used for the light receiving device 110 and the light emitting device 190.
- the common layer 114 may have a single-layer structure or a laminated structure.
- the common layer 114 for example, one or both of the electron injection layer and the electron transport layer can be formed.
- the common layer 114 may have different functions in the light emitting device 190 and the light receiving device 110.
- the electron injection layer functions as an electron injection layer in the light emitting device 190 and as an electron transport layer in the light receiving device 110.
- At least a part of the layers other than the active layer and the light emitting layer has a common configuration between the light receiving device and the light emitting device, so that the manufacturing process of the display device can be reduced.
- FIG. 5A shows a cross-sectional view of the display device 10D.
- the display device 10D differs from the display device 10A in that it does not have the buffer layer 182, the buffer layer 192, the buffer layer 184, and the buffer layer 194, and has the common layer 112 and the common layer 114.
- an organic compound is used for the active layer 183 of the light receiving device 110.
- the light receiving device 110 can have a layer other than the active layer 183 having the same configuration as the light emitting device 190 (EL device). Therefore, the light receiving device 110 can be formed in parallel with the formation of the light emitting device 190 only by adding the step of forming the active layer 183 to the manufacturing process of the light emitting device 190. Further, the light emitting device 190 and the light receiving device 110 can be formed on the same substrate. Therefore, the light receiving device 110 can be built in the display device without significantly increasing the manufacturing process.
- the light receiving device 110 and the light emitting device 190 have a common configuration except that the active layer 183 of the light receiving device 110 and the light emitting layer 193 of the light emitting device 190 are separately formed.
- the configuration of the light receiving device 110 and the light emitting device 190 is not limited to this.
- the light receiving device 110 and the light emitting device 190 may have layers that are separated from each other (see the display devices 10A, 10B, and 10C described above).
- the light receiving device 110 and the light emitting device 190 preferably have one or more layers that are commonly used (common layer). As a result, the light receiving device 110 can be incorporated in the display device without significantly increasing the manufacturing process.
- FIG. 5B shows a cross-sectional view of the display device 10E.
- the display device 10E differs from the display device 10D in that it does not have the substrate 151 and the substrate 152, but has the substrate 153, the substrate 154, the adhesive layer 155, and the insulating layer 212.
- the substrate 153 and the insulating layer 212 are bonded to each other by an adhesive layer 155.
- the substrate 154 and the protective layer 116 are bonded to each other by an adhesive layer 142.
- the display device 10E has a configuration in which the insulating layer 212, the transistor 41, the transistor 42, the light receiving device 110, the light emitting device 190, and the like formed on the manufactured substrate are transposed on the substrate 153. It is preferable that the substrate 153 and the substrate 154 each have flexibility. Thereby, the flexibility of the display device 10E can be increased. For example, it is preferable to use a resin for the substrate 153 and the substrate 154, respectively.
- the substrates 153 and 154 include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, acrylic resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins, and polyethers, respectively.
- polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, acrylic resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins, and polyethers, respectively.
- Sulfonate (PES) resin polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofibers and the like can be used.
- PES Sulfonate
- polyamide resin nylon, aramid, etc.
- polysiloxane resin cycloolefin resin
- polystyrene resin polyamideimide resin
- polyurethane resin polyvinyl chloride resin
- polyvinylidene chloride resin polypropylene resin
- PTFE polytetrafluoroethylene
- ABS resin cellulose nanofibers and the like
- a film having high optical isotropic property may be used for the substrate included in the display device of the present embodiment.
- the film having high optical isotropic properties include a triacetyl cellulose (TAC, also referred to as cellulose triacetate) film, a cycloolefin polymer (COP) film, a cycloolefin copolymer (COC) film, and an acrylic film.
- TAC triacetyl cellulose
- COP cycloolefin polymer
- COC cycloolefin copolymer
- FIG. 5C shows a cross-sectional view of the display device 10F.
- FIG. 6A shows a cross-sectional view of the display device 10G.
- FIG. 6B shows a cross-sectional view of the display device 10H.
- the display device 10F has a lens 149 in addition to the configuration of the display device 10D.
- the display device of this embodiment may have a lens 149.
- the lens 149 is provided at a position overlapping the light receiving device 110.
- the lens 149 is provided in contact with the substrate 152.
- the lens 149 of the display device 10F has a convex surface on the substrate 151 side.
- FIG. 5C shows an example in which the lens 149 is formed first, the light shielding layer 158 may be formed first.
- the end of the lens 149 is covered with a light-shielding layer 158.
- the display device 10F has a configuration in which the light 22 is incident on the light receiving device 110 via the lens 149.
- the imaging range of the light receiving device 110 can be narrowed as compared with the case where the lens 149 is not provided, and the overlapping of the imaging range with the adjacent light receiving device 110 can be suppressed. As a result, a clear image with less blur can be captured.
- the size of the pinhole when the lens 149 is provided is larger than the size of the pinhole (in FIG. 5C, the size of the opening of the light shielding layer 158 overlapping the light receiving device 110). (Equivalent to) can be increased. Therefore, by having the lens 149, the amount of light incident on the light receiving device 110 can be increased.
- the display device 10G shown in FIG. 6A is also one of the configurations in which the light 22 is incident on the light receiving device 110 via the lens 149.
- the lens 149 is provided in contact with the upper surface of the protective layer 116.
- the lens 149 of the display device 10G has a convex surface on the substrate 152 side.
- a lens array 146 is provided on the display surface side of the substrate 152.
- the lens included in the lens array 146 is provided at a position overlapping the light receiving device 110. It is preferable that the light-shielding layer 158 is provided on the surface of the substrate 152 on the substrate 151 side.
- a lens such as a microlens may be directly formed on a substrate or a light receiving device, or a separately manufactured lens array such as a microlens array may be formed on the substrate. It may be pasted on.
- the lens preferably has a refractive index of 1.3 or more and 2.5 or less.
- the lens can be formed using at least one of an inorganic material and an organic material.
- a material containing resin can be used for the lens.
- a material containing at least one of an oxide and a sulfide can be used for the lens.
- a resin containing chlorine, bromine, or iodine, a resin containing a heavy metal atom, a resin containing an aromatic ring, a resin containing sulfur, or the like can be used for the lens.
- a material containing a resin and nanoparticles of a material having a higher refractive index than the resin can be used for the lens. Titanium oxide, zirconium oxide, etc. can be used for the nanoparticles.
- FIG. 6C shows a cross-sectional view of the display device 10J.
- the display device 10J differs from the display device 10D in that it does not have a partition wall 216 that transmits visible light and has a partition wall 217 that blocks visible light.
- the partition wall 217 preferably absorbs the light emitted by the light emitting device 190.
- a black matrix can be formed by using a resin material containing a pigment or a dye. Further, by using a brown resist material, the partition wall 217 can be formed of a colored insulating layer.
- the light emitted by the light emitting device 190 is reflected by the substrate 152 and the partition wall 216, and the reflected light may be incident on the light receiving device 110. Further, the light emitted by the light emitting device 190 passes through the partition wall 216 and is reflected by a transistor, wiring, or the like, so that the reflected light may enter the light receiving device 110. In the display device 10J, since the light is absorbed by the partition wall 217, it is possible to prevent such reflected light from entering the light receiving device 110. As a result, noise can be reduced and the sensitivity of the sensor using the light receiving device 110 can be increased.
- the partition wall 217 preferably absorbs at least the wavelength of light detected by the light receiving device 110. For example, when the light receiving device 110 detects the green light emitted by the light emitting device 190, the partition wall 217 preferably absorbs at least the green light. For example, if the partition wall 217 has a red color filter, it can absorb green light and suppress the reflected light from entering the light receiving device 110.
- the light-shielding layer 158 can absorb most of the stray light 23b before reaching the resin layer 159, but a part of the stray light 23b is reflected and may be incident on the partition wall 217. If the partition wall 217 is configured to absorb the stray light 23b, it is possible to prevent the stray light 23b from entering the transistor, wiring, or the like. Therefore, it is possible to prevent the stray light 23c from reaching the light receiving device 110. The more times the stray light 23b hits the light-shielding layer 158 and the partition wall 217, the more the amount of light absorbed can be increased, and the amount of the stray light 23c reaching the light receiving device 110 can be extremely reduced. When the resin layer 159 is thick, the number of times the stray light 23b hits the light-shielding layer 158 and the partition wall 217 can be increased, which is preferable.
- the partition wall 217 absorbs the light, the stray light 23d incident on the partition wall 217 directly from the light emitting device 190 can be absorbed by the partition wall 217. For this reason as well, by providing the partition wall 217, the stray light incident on the light receiving device 110 can be reduced.
- FIG. 7A shows a top view of the display device 10K.
- FIG. 7B shows a cross-sectional view between the alternate long and short dash lines A1-A2 in FIG. 7A.
- FIG. 8A shows a cross-sectional view between the alternate long and short dash lines A3-A4 in FIG. 7A.
- One pixel comprises a light receiving device 110, a red light emitting device 190R, a green light emitting device 190G, and a blue light emitting device 190B.
- the upper surface shapes of the light receiving device 110 and the light emitting devices 190R, 190G, 190B are not particularly limited. Hexagonal close-packed type is applied to the pixel layout shown in FIG. 7A. The hexagonal close-packed layout is preferable because the aperture ratios of the light receiving device 110 and the light emitting devices 190R, 190G, and 190 can be increased. In the top view, the light receiving region of the light receiving device 110 is a quadrangle, and the light emitting regions of the light emitting devices 190R, 190G, and 190B are hexagonal, respectively.
- the light receiving device 110 is provided inside the frame-shaped light-shielding layer 219a.
- the frame-shaped light-shielding layer 219a may have a gap (which can also be said to be a cut, a broken portion, or a missing portion).
- a spacer 219b is provided between the green light emitting device 190G and the blue light emitting device 190B.
- the display device 10K includes a light receiving device 110, a red light emitting device 190R, a green light emitting device 190G, and a blue light emitting device 190B.
- the light emitting device 190R has a pixel electrode 191R, a common layer 112, a light emitting layer 193R, a common layer 114, and a common electrode 115.
- the light emitting layer 193R has an organic compound that emits red light 21R.
- the light emitting device 190R has a function of emitting red light.
- the light emitting device 190G has a pixel electrode 191G, a common layer 112, a light emitting layer 193G, a common layer 114, and a common electrode 115.
- the light emitting layer 193G has an organic compound that emits green light 21G.
- the light emitting device 190G has a function of emitting green light.
- the light emitting device 190B has a pixel electrode 191B, a common layer 112, a light emitting layer 193B, a common layer 114, and a common electrode 115.
- the light emitting layer 193B has an organic compound that emits blue light 21B.
- the light emitting device 190B has a function of emitting blue light.
- the light receiving device 110 has a pixel electrode 181 and a common layer 112, an active layer 183, a common layer 114, and a common electrode 115.
- the active layer 183 has an organic compound.
- the light receiving device 110 has a function of detecting visible light.
- the display device 10K has a light receiving device 110, a light emitting device 190R, a light emitting device 190G, a light emitting device 190B, a transistor 41, a transistor 42R, a transistor 42G, a transistor 42B, and the like between a pair of boards (board 151 and board 152).
- the ends of the pixel electrodes 181, 191R, 191G, and 191B are each covered with a partition wall 216.
- the pixel electrode 181 is electrically connected to the source or drain of the transistor 41 through an opening provided in the insulating layer 214.
- the pixel electrode 191R is electrically connected to the source or drain of the transistor 42R through an opening provided in the insulating layer 214.
- the pixel electrode 191G is electrically connected to the source or drain of the transistor 42G through an opening provided in the insulating layer 214.
- the pixel electrode 191B is electrically connected to the source or drain of the transistor 42B through the opening provided in the insulating layer 214.
- the light receiving device 110 and the light emitting devices 190R, 190G, and 190B are each covered with a protective layer 116.
- a resin layer 159 is provided on the surface of the substrate 152 on the substrate 151 side.
- the resin layer 159 is provided at a position where it overlaps with the light emitting devices 190R, 190G, and 190B, and is not provided at a position where it overlaps with the light receiving device 110.
- a light-shielding layer 158 is provided on the surface of the substrate 152 on the substrate 151 side and the surface of the resin layer 159 on the substrate 151 side.
- the light-shielding layer 158 has openings at positions overlapping each of the light emitting devices 190R, 190G, and 190B, and at positions overlapping with the light receiving device 110.
- the partition wall 216 is provided with a frame-shaped opening.
- the partition wall 216 has an opening between the light receiving device 110 and the light emitting device 190R.
- a light-shielding layer 219a is provided so as to cover the opening.
- the light-shielding layer 219a preferably covers the opening of the partition wall 216 and the side surface of the partition wall 216 exposed by the opening.
- the light-shielding layer 219a preferably further covers at least a part of the upper surface of the partition wall 216.
- stray light may pass through the partition wall 216 and enter the light receiving device 110.
- the stray light transmitted through the partition wall 216 is absorbed by the light-shielding layer 219a at the opening of the partition wall 216.
- the light-shielding layer 219a preferably has a forward taper shape. As a result, the coverage of the film (common layer 112, common layer 114, common electrode 115, protective layer 116, etc.) provided on the light-shielding layer 219a can be improved.
- the light-shielding layer 219a preferably absorbs at least the wavelength of light detected by the light-receiving device 110.
- the light shielding layer 219a preferably absorbs at least the green light.
- the light-shielding layer 219a may be a black matrix formed by using a resin material containing a pigment or a dye.
- the light-shielding layer 219a may have a laminated structure of a red color filter, a green color filter, and a blue color filter. Alternatively, a brown resist material may be used as the light-shielding layer 219a to form a colored insulating layer.
- the light receiving device 110 detects the green light emitted by the light emitting device 190G
- the light emitted by the light emitting device 190G is reflected by the substrate 152 and the partition wall 216, and the reflected light may be incident on the light receiving device 110.
- the light emitted by the light emitting device 190G passes through the partition wall 216 and is reflected by a transistor, wiring, or the like, so that the reflected light may be incident on the light receiving device 110.
- the light is absorbed by the light-shielding layer 158 and the light-shielding layer 219a, so that such reflected light can be suppressed from entering the light-receiving device 110.
- noise can be reduced and the sensitivity of the sensor using the light receiving device 110 can be increased.
- the light-shielding layer 158 can absorb most of the stray light 23b before reaching the resin layer 159. Further, even if a part of the stray light 23b is reflected by the light-shielding layer 158, the light-shielding layer 219a absorbs the stray light 23b, so that the stray light 23b can be suppressed from being incident on the transistor or the wiring. Therefore, it is possible to prevent the stray light from reaching the light receiving device 110.
- the resin layer 159 is thick, the number of times the stray light 23b hits the light-shielding layer 158 and the light-shielding layer 219a can be increased, which is preferable.
- the resin layer 159 is thick, the distance from the light-shielding layer 158 to the light emitting device of each color is shortened, and the dependence on the viewing angle of the display can be suppressed, which is preferable from the viewpoint of improving the display quality.
- the light-shielding layer 219a absorbs the light, the stray light 23d incident on the light-shielding layer 219a directly from the light emitting device can be absorbed by the light-shielding layer 219a. For this reason as well, by providing the light-shielding layer 219a, it is possible to reduce the stray light incident on the light receiving device 110.
- the range in which the light receiving device 110 detects light can be controlled. If the distance from the light-shielding layer 158 to the light-receiving device 110 is long, the imaging range is narrowed and the resolution of imaging can be increased.
- the spacer 219b is located on the partition wall 216 and is located between the light emitting device 190G and the light emitting device 190B in a top view.
- the upper surface of the spacer 219b is preferably closer to the light-shielding layer 158 than the upper surface of the light-shielding layer 219a.
- the sum L4 of the thickness of the partition wall 216 and the thickness of the spacer 219b is preferably larger than the thickness L3 of the light-shielding layer 219a. This makes it easy to fill the adhesive layer 142.
- the light-shielding layer 158 may be in contact with the protective layer 116 (or the common electrode 115) at the portion where the spacer 219b and the light-shielding layer 158 overlap.
- FIG. 8B shows a cross-sectional view of the display device 10L.
- the display device 10L has a configuration in which the light emitting devices 190R, 190G, and 190B have the same light emitting layer.
- FIG. 8B corresponds to a cross-sectional view between the alternate long and short dash lines A3-A4 in FIG. 7A.
- the light emitting device 190G shown in FIG. 8B has a pixel electrode 191G, an optical adjustment layer 197G, a common layer 112, a light emitting layer 113, a common layer 114, and a common electrode 115.
- the light emitting device 190B shown in FIG. 8B has a pixel electrode 191B, an optical adjustment layer 197B, a common layer 112, a light emitting layer 113, a common layer 114, and a common electrode 115.
- the common layer 112, the light emitting layer 113, and the common layer 114 have a common configuration in the light emitting devices 190R, 190G, and 190B.
- the light emitting layer 113 includes a light emitting layer 193R that emits red light, a light emitting layer 193G that emits green light, and a light emitting layer 193B that emits blue light.
- the EL layer is shown by the common layer 112, the light emitting layer 113, and the common layer 114, but is not limited thereto.
- the light emitting device may have a single structure having one light emitting unit between the pixel electrode 191 and the common electrode 115, or may have a tandem structure having a plurality of light emitting units.
- the light emitting layer 113 is commonly provided in a light emitting device that emits light of each color.
- the light emitted by the light emitting device 190G is taken out as green light 21G via the colored layer CFG.
- the light emitted by the light emitting device 190B is taken out as blue light 21B via the colored layer CFB.
- the light emitting device 190G and the light emitting device 190B have the same configuration except that they have optical adjustment layers having different thicknesses. Reflective electrodes are used as the pixel electrode 191G and the pixel electrode 191B. As the optical adjustment layer, a transparent electrode on the reflective electrode can be used.
- the light emitting device of each color preferably has an optical adjustment layer 197 of a different thickness.
- the light emitting device 190G shown in FIG. 8B is optically adjusted by using the optical adjustment layer 197G so that the optical distance between the pixel electrode 191G and the common electrode 115 is an optical distance that enhances green light.
- the light emitting device 190B is optically adjusted by using the optical adjustment layer 197B so that the optical distance between the pixel electrode 191B and the common electrode 115 is an optical distance that enhances blue light.
- FIG. 9A shows a top view of the display device 10M.
- FIG. 9B shows a cross-sectional view between the alternate long and short dash lines A5-A6 in FIG. 9A.
- a light-shielding layer 219a is provided between the green light emitting device 190G and the blue light emitting device 190B, and the space 143 is filled with the inert gas. It differs from the display device 10K shown in FIGS. 7A, 7B, and 8A in that a hollow sealing structure is applied.
- the light shielding layer 219a may be provided both between the light emitting device 190R and the light receiving device 110 and between the light emitting device 190G and the light emitting device 190B.
- FIG. 10A shows a top view of the display device 10N.
- FIG. 10B shows a cross-sectional view between the alternate long and short dash lines A7 to A8 in FIG. 10A.
- FIG. 11A shows a cross-sectional view between the alternate long and short dash lines A9 and A10 in FIG. 10A.
- the cross-sectional structure between the alternate long and short dash lines A3-A4 in the display device 10N can be the same as that of the display device 10K (FIG. 8A).
- the same configuration as that of the display device 10M (FIG. 9B) may be applied.
- the display device 10N differs from the display device 10K (FIGS. 7A and 7B) in the upper surface shape and the cross-sectional shape of the light-shielding layer 219a.
- the light-shielding layer 219a surrounds the four sides of the light receiving device 110, and one end and the other end are separated from each other.
- the gap 220 (which can be said to be a break, a broken portion, or a missing portion) of the light-shielding layer 219a is located on the side of the red light emitting device 190R.
- the gap 220 of the light shielding layer 219a is located on the light emitting device side different from the light emitting device used for the sensing.
- a green light emitting device 190G or a blue light emitting device 190B for sensing. This makes it possible to suppress the influence of noise during sensing. Further, when sensing is performed using the green light emitting device 190G, as shown in the region 230, one end of the light shielding layer 219a may protrude toward the red light emitting device 190R as compared with the green light emitting device 190G. preferable. As a result, it is possible to prevent the stray light from the green light emitting device 190G from entering the light receiving device 110 through the gap 220.
- the partition wall 216 has an opening between the light receiving device 110 and the light emitting device 190R.
- a light-shielding layer 219a is provided so as to cover the opening.
- the light-shielding layer 219a preferably covers the opening of the partition wall 216 and the side surface of the partition wall 216 exposed by the opening.
- the light-shielding layer 219a preferably further covers at least a part of the upper surface of the partition wall 216.
- the light-shielding layer 219a may have an inverted tapered shape.
- the thickness of the organic film and the common electrode 115 provided on the light-shielding layer 219a having an inverted taper shape may become thin near the side surface of the light-shielding layer 219a.
- a void 160 may be formed near the side surface of the light-shielding layer 219a.
- the common electrode 115 is stepped by the light-shielding layer 219a, and the common electrode 115 is formed inside and outside the light-shielding layer 219a.
- the shape of the upper surface of the light-shielding layer 219a is such that the four sides of the light-receiving device 110 are surrounded and one end and the other end are separated from each other, and a gap 220 is provided to prevent the common electrode 115 from being separated. As a result, display defects in the display device 10N can be suppressed.
- FIG. 11A is a cross-sectional view including the gap 220 of the light shielding layer 219a.
- the partition wall 216 is provided with openings that surround the four sides of the light receiving device 110 and have one end and the other end separated from each other, similar to the shape of the upper surface of the light shielding layer 219a.
- a common layer 112 In the gap 220 of the light-shielding layer 219a, a common layer 112, a common layer 114, a common electrode 115, and a protective layer 116 are provided in this order on the partition wall 216.
- FIG. 11B shows a cross-sectional view of the display device 10P.
- the display device 10P differs from the display device 10N in that it has a side wall 219c in contact with the side surface of the light shielding layer 219a.
- the upper surface shape of the light-shielding layer 219a may be a frame shape as shown in FIG. 7A, or may have a gap 220 as shown in FIG. 10A.
- the coverage of the organic film and the common electrode 115 can be improved, and the display quality of the display device can be improved.
- improving the coverage of the common electrode 115 it is possible to suppress step breakage and thinning of the common electrode 115, so that uneven brightness of the display due to the voltage drop of the common electrode 115 can be suppressed.
- the side wall 219c can be formed using a material that can be used for the partition wall 216.
- Display device 10Q] 12A and 12B show a cross-sectional view of the display device 10Q.
- the same upper surface structure as that of the display device 10K (FIG. 7A) can be applied.
- FIG. 12A shows a cross-sectional view between the alternate long and short dash lines A1-A2 in FIG. 7A.
- FIG. 12B shows a cross-sectional view between the alternate long and short dash lines A3-A4 in FIG. 7A.
- the display device 10Q is mainly different from the display device 10K in that it does not have a partition wall 216 and has a partition wall 217.
- the light-shielding layer 219a is located on the partition wall 217. Unlike the partition wall 216, the partition wall 217 can absorb the light emitted by the light emitting device, so that the partition wall 217 does not need to have an opening.
- the stray light 23d incident on the partition wall 217 from the light emitting device is absorbed by the partition wall 217.
- the stray light 23d incident on the light-shielding layer 219a from the light emitting device is absorbed by the light-shielding layer 219a.
- the spacer 219b is located between the light emitting device 190G and the light emitting device 190B.
- the upper surface of the spacer 219b is preferably closer to the light-shielding layer 158 than the upper surface of the light-shielding layer 219a. If the thickness of the spacer 219b is thinner than the thickness of the light-shielding layer 219a, the adhesive layer 142 is not sufficiently filled inside the frame-shaped light-shielding layer 219a, and the reliability of the light receiving device 110 and the display device 10Q is lowered. There is a risk of doing. Therefore, the spacer 219b is preferably thicker than the light-shielding layer 219a. This makes it easy to fill the adhesive layer 142. As shown in FIG. 12B, the light-shielding layer 158 may be in contact with the protective layer 116 (or the common electrode 115) at the portion where the spacer 219b and the light-shielding layer 158 overlap.
- FIG. 13 shows a perspective view of the display device 100A
- FIG. 14 shows a cross-sectional view of the display device 100A.
- the display device 100A has a configuration in which the substrate 152 and the substrate 151 are bonded together.
- the substrate 152 is clearly indicated by a broken line.
- the display device 100A includes a display unit 162, a circuit 164, wiring 165, and the like.
- FIG. 13 shows an example in which an IC (integrated circuit) 173 and an FPC 172 are mounted on the display device 100A. Therefore, the configuration shown in FIG. 13 can be said to be a display module having a display device 100A, an IC, and an FPC.
- a scanning line drive circuit can be used.
- the wiring 165 has a function of supplying signals and electric power to the display unit 162 and the circuit 164.
- the signal and power are input to the wiring 165 from the outside via the FPC 172 or from the IC 173.
- FIG. 13 shows an example in which the IC173 is provided on the substrate 151 by the COG (Chip On Glass) method, the COF (Chip On Film) method, or the like.
- the IC 173 an IC having, for example, a scanning line drive circuit or a signal line drive circuit can be applied.
- the display device 100A and the display module may be configured without an IC. Further, the IC may be mounted on the FPC by the COF method or the like.
- FIG. 14 shows an example of a cross section of the display device 100A when a part of the region including the FPC 172, a part of the circuit 164, a part of the display unit 162, and a part of the region including the end are cut. Shown.
- the display device 100A shown in FIG. 14 has a transistor 201, a transistor 205, a transistor 206, a light emitting device 190, a light receiving device 110, and the like between the substrate 151 and the substrate 152.
- the resin layer 159 and the insulating layer 214 are adhered to each other via the adhesive layer 142.
- a solid sealing structure, a hollow sealing structure, or the like can be applied to seal the light emitting device 190 and the light receiving device 110.
- the space 143 surrounded by the substrate 152, the adhesive layer 142, and the substrate 151 is filled with an inert gas (nitrogen, argon, etc.), and a hollow sealing structure is applied.
- the adhesive layer 142 may be provided so as to overlap the light emitting device 190 and the light receiving device 110. Further, the space 143 surrounded by the substrate 152, the adhesive layer 142, and the substrate 151 may be filled with a resin different from that of the adhesive layer 142.
- the light emitting device 190 has a laminated structure in which the pixel electrode 191 and the common layer 112, the light emitting layer 193, the common layer 114, and the common electrode 115 are laminated in this order from the insulating layer 214 side.
- the pixel electrode 191 is connected to the conductive layer 222b of the transistor 206 via an opening provided in the insulating layer 214.
- the end of the pixel electrode 191 is covered with a partition wall 217.
- the pixel electrode 191 contains a material that reflects visible light
- the common electrode 115 contains a material that transmits visible light.
- the light receiving device 110 has a laminated structure in which the pixel electrode 181, the common layer 112, the active layer 183, the common layer 114, and the common electrode 115 are laminated in this order from the insulating layer 214 side.
- the pixel electrode 181 is electrically connected to the conductive layer 222b of the transistor 205 via an opening provided in the insulating layer 214.
- the end of the pixel electrode 181 is covered by a partition wall 217.
- the pixel electrode 181 contains a material that reflects visible light
- the common electrode 115 contains a material that transmits visible light.
- the light emitted by the light emitting device 190 is emitted to the substrate 152 side. Further, light is incident on the light receiving device 110 via the substrate 152 and the space 143. It is preferable to use a material having high transparency to visible light for the substrate 152.
- the pixel electrode 181 and the pixel electrode 191 can be manufactured by the same material and the same process.
- the common layer 112, the common layer 114, and the common electrode 115 are used for both the light receiving device 110 and the light emitting device 190.
- the light receiving device 110 and the light emitting device 190 can all have the same configuration except that the configurations of the active layer 183 and the light emitting layer 193 are different. As a result, the light receiving device 110 can be incorporated in the display device 100A without significantly increasing the manufacturing process.
- a resin layer 159 and a light-shielding layer 158 are provided on the surface of the substrate 152 on the substrate 151 side.
- the resin layer 159 is provided at a position where it overlaps with the light emitting device 190, and is not provided at a position where it overlaps with the light receiving device 110.
- the light-shielding layer 158 is provided so as to cover the surface of the substrate 152 on the substrate 151 side, the side surface of the resin layer 159, and the surface of the resin layer 159 on the substrate 151 side.
- the light-shielding layer 158 has openings at a position overlapping the light receiving device 110 and a position overlapping the light emitting device 190.
- the light-shielding layer 158 By providing the light-shielding layer 158, it is possible to control the range in which the light receiving device 110 detects light. Further, by having the light-shielding layer 158, it is possible to suppress the direct incident of light from the light emitting device 190 to the light receiving device 110 without passing through the object. Therefore, it is possible to realize a sensor with low noise and high sensitivity.
- the resin layer 159 By providing the resin layer 159, the distance from the light-shielding layer 158 to the light-emitting device 190 can be made shorter than the distance from the light-shielding layer 158 to the light-receiving device 110. As a result, it is possible to suppress the viewing angle dependence of the display while reducing the noise of the sensor. Therefore, both the display quality and the image quality can be improved.
- the configuration of the partition wall 217 and the light-shielding layer 219a in the display device 100A is the same as that of the display device 10Q (FIG. 12A).
- the partition wall 217 covers the end portion of the pixel electrode 181 and the end portion of the pixel electrode 191.
- a light-shielding layer 219a is provided on the partition wall 217.
- the light-shielding layer 219a is located between the light-receiving device 110 and the light-emitting device 190.
- the partition wall 217 and the light-shielding layer 219a preferably absorb the wavelength of light detected by the light receiving device 110. As a result, the stray light incident on the light receiving device 110 can be suppressed.
- the transistor 201, the transistor 205, and the transistor 206 are all formed on the substrate 151. These transistors can be manufactured by the same material and the same process.
- An insulating layer 211, an insulating layer 213, an insulating layer 215, and an insulating layer 214 are provided on the substrate 151 in this order.
- a part of the insulating layer 211 functions as a gate insulating layer of each transistor.
- a part of the insulating layer 213 functions as a gate insulating layer of each transistor.
- the insulating layer 215 is provided so as to cover the transistor.
- the insulating layer 214 is provided so as to cover the transistor and has a function as a flattening layer.
- the number of gate insulating layers and the number of insulating layers covering the transistors are not limited, and may be a single layer or two or more layers, respectively.
- the insulating layer can function as a barrier layer. With such a configuration, it is possible to effectively suppress the diffusion of impurities from the outside into the transistor, and it is possible to improve the reliability of the display device.
- an inorganic insulating film as the insulating layer 211, the insulating layer 213, and the insulating layer 215, respectively.
- an inorganic insulating film for example, a silicon nitride film, a silicon nitride film, a silicon oxide film, a silicon nitride film, an aluminum oxide film, an aluminum nitride film, or the like can be used.
- a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, a neodymium oxide film and the like may be used. Further, two or more of the above-mentioned insulating films may be laminated and used.
- the organic insulating film often has a lower barrier property than the inorganic insulating film. Therefore, the organic insulating film preferably has an opening near the end of the display device 100A. As a result, it is possible to prevent impurities from entering from the end of the display device 100A via the organic insulating film.
- the organic insulating film may be formed so that the end portion of the organic insulating film is inside the end portion of the display device 100A so that the organic insulating film is not exposed at the end portion of the display device 100A.
- An organic insulating film is suitable for the insulating layer 214 that functions as a flattening layer.
- the material that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins. ..
- an opening is formed in the insulating layer 214.
- an organic insulating film is used for the insulating layer 214, it is possible to prevent impurities from entering the display unit 162 from the outside through the insulating layer 214. Therefore, the reliability of the display device 100A can be improved.
- the transistor 201, transistor 205, and transistor 206 include a conductive layer 221 that functions as a gate, an insulating layer 211 that functions as a gate insulating layer, a conductive layer 222a and a conductive layer 222b that function as sources and drains, a semiconductor layer 231 and a gate insulating layer. It has an insulating layer 213 that functions as a gate and a conductive layer 223 that functions as a gate.
- the same hatching pattern is attached to a plurality of layers obtained by processing the same conductive film.
- the insulating layer 211 is located between the conductive layer 221 and the semiconductor layer 231.
- the insulating layer 213 is located between the conductive layer 223 and the semiconductor layer 231.
- the structure of the transistor included in the display device of this embodiment is not particularly limited.
- a planar type transistor, a stagger type transistor, an inverted stagger type transistor and the like can be used.
- a top gate type or a bottom gate type transistor structure may be used.
- gates may be provided above and below the semiconductor layer on which the channel is formed.
- a configuration in which a semiconductor layer on which a channel is formed is sandwiched between two gates is applied to the transistor 201, the transistor 205, and the transistor 206.
- the transistor may be driven by connecting two gates and supplying the same signal to them.
- the threshold voltage of the transistor may be controlled by giving one of the two gates a potential for controlling the threshold voltage and giving the other a potential for driving.
- the crystallinity of the semiconductor material used for the transistor is also not particularly limited, and either an amorphous semiconductor or a semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or semiconductor having a partially crystalline region). May be used. It is preferable to use a semiconductor having crystallinity because deterioration of transistor characteristics can be suppressed.
- the semiconductor layer of the transistor preferably has a metal oxide (also referred to as an oxide semiconductor).
- the semiconductor layer of the transistor may have silicon. Examples of silicon include amorphous silicon and crystalline silicon (low temperature polysilicon, single crystal silicon, etc.).
- the semiconductor layers include, for example, indium and M (M is gallium, aluminum, silicon, boron, ittrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lantern, cerium, neodymium, etc. It is preferable to have one or more selected from hafnium, tantalum, tungsten, and gallium) and zinc.
- M is preferably one or more selected from aluminum, gallium, yttrium, and tin.
- an oxide containing indium (In), gallium (Ga), and zinc (Zn) also referred to as IGZO
- IGZO oxide containing indium (In), gallium (Ga), and zinc (Zn)
- the atomic number ratio of In in the In-M-Zn oxide is preferably equal to or higher than the atomic number ratio of M.
- the atomic number ratio of In is 4
- the atomic number ratio of Ga is 1 or more and 3 or less.
- the atomic number ratio of Ga is larger than 0.1 when the atomic number ratio of In is 5. This includes the case where the number of atoms is 2 or less and the atomic number ratio of Zn is 5 or more and 7 or less.
- the atomic number ratio of Ga is larger than 0.1 when the atomic number ratio of In is 1. This includes the case where it is 2 or less and the atomic number ratio of Zn is larger than 0.1 and 2 or less.
- the transistor included in the circuit 164 and the transistor included in the display unit 162 may have the same structure or different structures.
- the structures of the plurality of transistors included in the circuit 164 may all be the same, or may be two or more types.
- the structures of the plurality of transistors included in the display unit 162 may all be the same, or may be two or more types.
- a connecting portion 204 is provided in a region of the substrate 151 where the substrates 152 do not overlap.
- the wiring 165 is electrically connected to the FPC 172 via the conductive layer 166 and the connection layer 242.
- a conductive layer 166 obtained by processing the same conductive film as the pixel electrode 181 is exposed on the upper surface of the connecting portion 204.
- the connection portion 204 and the FPC 172 can be electrically connected via the connection layer 242.
- optical members can be arranged on the outside of the substrate 152.
- the optical member include a polarizing plate, a retardation plate, a light diffusing layer (diffusing film, etc.), an antireflection layer, a condensing film, and the like.
- an antistatic film for suppressing the adhesion of dust a water-repellent film for preventing the adhesion of dirt, a hard coat film for suppressing the occurrence of scratches due to use, a shock absorbing layer and the like are arranged. You may.
- Glass, quartz, ceramic, sapphire, resin and the like can be used for the substrate 151 and the substrate 152, respectively.
- the flexibility of the display device can be increased.
- various curable adhesives such as a photocurable adhesive such as an ultraviolet curable type, a reaction curable type adhesive, a thermosetting type adhesive, and an anaerobic type adhesive can be used.
- these adhesives include epoxy resin, acrylic resin, silicone resin, phenol resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin and the like.
- a material having low moisture permeability such as an epoxy resin is preferable.
- a two-component mixed type resin may be used.
- an anisotropic conductive film (ACF: Anisotropic Conducive Film), an anisotropic conductive paste (ACP: Anisotropic Connective Paste), or the like can be used.
- ACF Anisotropic Conducive Film
- ACP Anisotropic Connective Paste
- the light emitting device 190 includes a top emission type, a bottom emission type, and a dual emission type.
- a conductive film that transmits visible light is used for the electrode on the side that extracts light. Further, it is preferable to use a conductive film that reflects visible light for the electrode on the side that does not take out light.
- the light emitting device 190 has at least a light emitting layer 193.
- the light emitting device 190 includes a substance having a high hole injecting property, a substance having a high hole transporting property, a hole blocking material, a substance having a high electron transporting property, a substance having a high electron injecting property, or a bipolar. It may further have a layer containing a sex substance (a substance having high electron transport property and hole transport property) and the like.
- the common layer 112 preferably has one or both of a hole injection layer and a hole transport layer.
- the common layer 114 preferably has one or both of an electron transport layer and an electron injection layer.
- the hole injection layer is a layer for injecting holes from the anode into the hole transport layer, and is a layer containing a material having high hole injectability.
- a material having high hole injection property an aromatic amine compound or a composite material containing a hole transporting material and an acceptor material (electron acceptor material) can be used.
- the hole transport layer is a layer that transports holes injected from the anode to the light emitting layer by the hole injection layer.
- the hole transport layer is a layer that transports holes generated based on the light incident on the active layer to the anode.
- the hole transport layer is a layer containing a hole transport material.
- the hole transporting material a substance having a hole mobility of 10-6 cm 2 / Vs or more is preferable. In addition, any substance other than these can be used as long as it is a substance having a higher hole transport property than electrons.
- the hole-transporting material examples include materials having high hole-transporting properties such as ⁇ -electron-rich heteroaromatic compounds (for example, carbazole derivatives, thiophene derivatives, furan derivatives, etc.) and aromatic amines (compounds having an aromatic amine skeleton). Is preferable.
- materials having high hole-transporting properties such as ⁇ -electron-rich heteroaromatic compounds (for example, carbazole derivatives, thiophene derivatives, furan derivatives, etc.) and aromatic amines (compounds having an aromatic amine skeleton). Is preferable.
- the electron transport layer is a layer that transports electrons injected from the cathode to the light emitting layer by the electron injection layer.
- the electron transport layer is a layer that transports electrons generated based on the light incident on the active layer to the cathode.
- the electron transport layer is a layer containing an electron transport material.
- As the electron transporting material a substance having an electron mobility of 1 ⁇ 10 -6 cm 2 / Vs or more is preferable. Any substance other than these can be used as long as it is a substance having a higher electron transport property than holes.
- Examples of the electron-transporting material include a metal complex having a quinoline skeleton, a metal complex having a benzoquinolin skeleton, a metal complex having an oxazole skeleton, a metal complex having a thiazole skeleton, and the like, as well as an oxazole derivative, a triazole derivative, and an imidazole derivative.
- ⁇ electron deficiency including oxazole derivative, thiazole derivative, phenanthroline derivative, quinoline derivative having quinoline ligand, benzoquinoline derivative, quinoxalin derivative, dibenzoquinoxaline derivative, pyridine derivative, bipyridine derivative, pyrimidine derivative, and other nitrogen-containing heteroaromatic compounds
- a material having high electron transport property such as a type heteroaromatic compound can be used.
- the electron injection layer is a layer for injecting electrons from the cathode into the electron transport layer, and is a layer containing a material having high electron injectability.
- a material having high electron injectability an alkali metal, an alkaline earth metal, or a compound thereof can be used.
- a composite material containing an electron transporting material and a donor material (electron donating material) can also be used.
- Either a low molecular weight compound or a high molecular weight compound can be used for the common layer 112, the light emitting layer 193, and the common layer 114, and an inorganic compound may be contained.
- the layers constituting the common layer 112, the light emitting layer 193, and the common layer 114 can be formed by a method such as a thin film deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, or a coating method, respectively. ..
- the light emitting layer 193 is a layer containing a light emitting substance.
- the light emitting layer 193 can have one or more kinds of light emitting substances.
- a substance exhibiting a luminescent color such as blue, purple, bluish purple, green, yellowish green, yellow, orange, and red is appropriately used.
- a substance that emits near infrared light can also be used.
- the active layer 183 of the light receiving device 110 includes a semiconductor.
- the semiconductor include an inorganic semiconductor such as silicon and an organic semiconductor containing an organic compound.
- an organic semiconductor is used as the semiconductor of the active layer.
- the light emitting layer 193 of the light emitting device 190 and the active layer 183 of the light receiving device 110 can be formed by the same method (for example, vacuum deposition method), which is preferable because the manufacturing apparatus can be shared. ..
- Examples of the n-type semiconductor material contained in the active layer 183 include electron-accepting organic semiconductor materials such as fullerenes (for example, C 60 , C 70, etc.) or derivatives thereof.
- Examples of the material for the p-type semiconductor contained in the active layer 183 include copper (II) phthalocyanine (Cupper (II) phthalocyanine; CuPc), tetraphenyldibenzoperichanine (DBP), and zinc phthalocyanine (Zinc Phthalocyanine). Examples thereof include electron-donating organic semiconductor materials such as. Further, tin phthalocyanine (SnPc) may be used as a material for the p-type semiconductor.
- the active layer 183 is preferably formed by co-depositing an n-type semiconductor and a p-type semiconductor.
- Materials that can be used for conductive layers such as transistor gates, sources and drains, as well as various wirings and electrodes that make up display devices include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, and silver. Examples thereof include metals such as titanium and tungsten, and alloys containing the metal as a main component. A film containing these materials can be used as a single layer or as a laminated structure.
- a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide containing gallium, or graphene can be used.
- metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, and alloy materials containing the metal materials can be used.
- a nitride of the metal material for example, titanium nitride
- the laminated film of the above material can be used as the conductive layer.
- a laminated film of an alloy of silver and magnesium and an indium tin oxide because the conductivity can be enhanced.
- These can also be used for conductive layers such as various wirings and electrodes constituting the display device, and conductive layers (conductive layers that function as pixel electrodes and common electrodes) of the display device.
- Examples of the insulating material that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxide, silicon nitride, silicon nitride, and aluminum oxide.
- FIG. 15A shows a cross-sectional view of the display device 100B.
- the display device 100B is mainly different from the display device 100A in that it has a protective layer 116 and a solid sealing structure is applied.
- the protective layer 116 that covers the light receiving device 110 and the light emitting device 190 By providing the protective layer 116 that covers the light receiving device 110 and the light emitting device 190, impurities such as water can be suppressed from entering the light receiving device 110 and the light emitting device 190, and the reliability of the light receiving device 110 and the light emitting device 190 can be improved. it can.
- the insulating layer 215 and the protective layer 116 are in contact with each other through the opening of the insulating layer 214.
- the inorganic insulating film of the insulating layer 215 and the inorganic insulating film of the protective layer 116 are in contact with each other.
- FIG. 15B shows an example in which the protective layer 116 has a three-layer structure.
- the protective layer 116 has an inorganic insulating layer 116a on the common electrode 115, an organic insulating layer 116b on the inorganic insulating layer 116a, and an inorganic insulating layer 116c on the organic insulating layer 116b.
- the end of the inorganic insulating layer 116a and the end of the inorganic insulating layer 116c extend outward from the end of the organic insulating layer 116b and are in contact with each other. Then, the inorganic insulating layer 116a comes into contact with the insulating layer 215 (inorganic insulating layer) through the opening of the insulating layer 214 (organic insulating layer). As a result, the light receiving device 110 and the light emitting device 190 can be surrounded by the insulating layer 215 and the protective layer 116, so that the reliability of the light receiving device 110 and the light emitting device 190 can be improved.
- the protective layer 116 may have a laminated structure of an organic insulating film and an inorganic insulating film. At this time, it is preferable that the end portion of the inorganic insulating film extends outward from the end portion of the organic insulating film.
- the protective layer 116 and the substrate 152 are bonded to each other by the adhesive layer 142.
- the adhesive layer 142 is provided so as to overlap the light receiving device 110 and the light emitting device 190, respectively, and a solid sealing structure is applied to the display device 100B.
- Display device 100C] 16 and 17A show a cross-sectional view of the display device 100C.
- the perspective view of the display device 100C is the same as that of the display device 100A (FIG. 13).
- FIG. 16 shows an example of a cross section of the display device 100C when a part of the region including the FPC 172, a part of the circuit 164, and a part of the display unit 162 are cut.
- FIG. 17A shows an example of a cross section of the display device 100C when a part of the display unit 162 is cut.
- FIG. 16 shows an example of a cross section of the display unit 162 when a region including the light receiving device 110 and the light emitting device 190R that emits red light is cut.
- FIG. 17A shows an example of a cross section of the display unit 162 when a region including a light emitting device 190G that emits green light and a light emitting device 190B that emits blue light is cut.
- the display device 100C shown in FIGS. 16 and 17A has a transistor 203, a transistor 207, a transistor 208, a transistor 209, a transistor 210, a light emitting device 190R, a light emitting device 190G, a light emitting device 190B, and a light receiving device between the substrates 153 and the substrate 154. It has a device 110 and the like.
- the resin layer 159 and the common electrode 115 are adhered to each other via an adhesive layer 142, and a solid-state sealing structure is applied to the display device 100C.
- the substrate 153 and the insulating layer 212 are bonded to each other by an adhesive layer 155.
- the substrate 154 and the insulating layer 157 are bonded to each other by an adhesive layer 156.
- a method for manufacturing the display device 100C first, a first manufacturing substrate provided with an insulating layer 212, each transistor, a light receiving device 110, each light emitting device, etc., an insulating layer 157, a resin layer 159, a light shielding layer 158, etc. Is attached to the second production substrate provided with the above by the adhesive layer 142. Then, the substrate 153 is attached to the exposed surface by peeling off the first production substrate, and the substrate 154 is attached to the exposed surface by peeling off the second production substrate, whereby the substrate is attached on the first production substrate and the second production substrate.
- Each of the components formed above is transposed onto the substrate 153 and the substrate 154. It is preferable that the substrate 153 and the substrate 154 each have flexibility. Thereby, the flexibility of the display device 100C can be increased.
- an inorganic insulating film that can be used for the insulating layer 211, the insulating layer 213, and the insulating layer 215 can be used, respectively.
- the light emitting device 190R has a laminated structure in which the pixel electrode 191R, the common layer 112, the light emitting layer 193R, the common layer 114, and the common electrode 115 are laminated in this order from the insulating layer 214b side.
- the pixel electrode 191R is connected to the conductive layer 169R via an opening provided in the insulating layer 214b.
- the conductive layer 169R is connected to the conductive layer 222b of the transistor 208 via an opening provided in the insulating layer 214a.
- the conductive layer 222b is connected to the low resistance region 231n through an opening provided in the insulating layer 215. That is, the pixel electrode 191R is electrically connected to the transistor 208.
- the transistor 208 has a function of controlling the drive of the light emitting device 190R.
- the light emitting device 190G has a laminated structure in which the pixel electrode 191G, the common layer 112, the light emitting layer 193G, the common layer 114, and the common electrode 115 are laminated in this order from the insulating layer 214b side.
- the pixel electrode 191G is electrically connected to the low resistance region 231n of the transistor 209 via the conductive layer 169G and the conductive layer 222b of the transistor 209. That is, the pixel electrode 191G is electrically connected to the transistor 209.
- the transistor 209 has a function of controlling the drive of the light emitting device 190G.
- the light emitting device 190B has a laminated structure in which the pixel electrode 191B, the common layer 112, the light emitting layer 193B, the common layer 114, and the common electrode 115 are laminated in this order from the insulating layer 214b side.
- the pixel electrode 191B is electrically connected to the low resistance region 231n of the transistor 210 via the conductive layer 169B and the conductive layer 222b of the transistor 210. That is, the pixel electrode 191B is electrically connected to the transistor 210.
- the transistor 210 has a function of controlling the drive of the light emitting device 190B.
- the light receiving device 110 has a laminated structure in which the pixel electrode 181, the common layer 112, the active layer 183, the common layer 114, and the common electrode 115 are laminated in this order from the insulating layer 214b side.
- the pixel electrode 181 is electrically connected to the low resistance region 231n of the transistor 207 via the conductive layer 168 and the conductive layer 222b of the transistor 207. That is, the pixel electrode 181 is electrically connected to the transistor 207.
- the ends of the pixel electrodes 181, 191R, 191G, and 191B are covered by the partition wall 216.
- the pixel electrodes 181, 191R, 191G, and 191B include a material that reflects visible light, and the common electrode 115 contains a material that transmits visible light.
- the light emitted by the light emitting devices 190R, 190G, and 190B is emitted to the substrate 154 side. Further, light is incident on the light receiving device 110 via the substrate 154 and the adhesive layer 142. It is preferable to use a material having high transparency to visible light for the substrate 154.
- the pixel electrode 181 and the pixel electrode 191 can be manufactured by the same material and the same process.
- the common layer 112, the common layer 114, and the common electrode 115 are commonly used in the light receiving device 110 and the light emitting devices 190R, 190G, and 190B.
- the light receiving device 110 and the light emitting device of each color can all have the same configuration except that the configurations of the active layer 183 and the light emitting layer are different. As a result, the light receiving device 110 can be incorporated in the display device 100C without significantly increasing the manufacturing process.
- a resin layer 159 and a light-shielding layer 158 are provided on the surface of the insulating layer 157 on the substrate 153 side.
- the resin layer 159 is provided at a position where it overlaps with the light emitting devices 190R, 190G, and 190B, and is not provided at a position where it overlaps with the light receiving device 110.
- the light-shielding layer 158 is provided so as to cover the surface of the insulating layer 157 on the substrate 153 side, the side surface of the resin layer 159, and the surface of the resin layer 159 on the substrate 153 side.
- the light-shielding layer 158 has an opening at a position overlapping the light receiving device 110 and at a position overlapping each of the light emitting devices 190R, 190G, and 190B.
- the light-shielding layer 158 it is possible to control the range in which the light receiving device 110 detects light. Further, by having the light-shielding layer 158, it is possible to prevent light from directly incident on the light-receiving device 110 from the light-emitting devices 190R, 190G, and 190B without passing through an object. Therefore, it is possible to realize a sensor with low noise and high sensitivity.
- the distance from the light-shielding layer 158 to the light emitting device of each color is shorter than the distance from the light-shielding layer 158 to the light-receiving device 110. As a result, it is possible to suppress the viewing angle dependence of the display while reducing the noise of the sensor. Therefore, both the display quality and the image quality can be improved.
- the configurations of the partition wall 216, the light-shielding layer 219a, and the spacer 219b in the display device 100C are the same as those of the display device 10K (FIGS. 7B and 8A).
- the partition wall 216 has an opening between the light receiving device 110 and the light emitting device 190R.
- a light-shielding layer 219a is provided so as to fill the opening.
- the light-shielding layer 219a is located between the light-receiving device 110 and the light-emitting device 190R.
- the light-shielding layer 219a absorbs the light emitted by the light emitting device 190R. As a result, the stray light incident on the light receiving device 110 can be suppressed.
- the spacer 219b is located between the light emitting device 190G and the light emitting device 190B.
- the upper surface of the spacer 219b is preferably closer to the light-shielding layer 158 than the upper surface of the light-shielding layer 219a.
- the sum of the height (thickness) of the partition wall 216 and the height (thickness) of the spacer 219b is preferably larger than the height (thickness) of the light-shielding layer 219a. This makes it easy to fill the adhesive layer 142.
- the light-shielding layer 158 may be in contact with the common electrode 115 (or the protective layer) at the portion where the spacer 219b and the light-shielding layer 158 overlap.
- a connecting portion 204 is provided in a region of the substrate 153 where the substrates 154 do not overlap.
- the wiring 165 is electrically connected to the FPC 172 via the conductive layer 167, the conductive layer 166, and the connection layer 242.
- the conductive layer 167 can be obtained by processing the same conductive film as the conductive layer 168.
- a conductive layer 166 obtained by processing the same conductive film as the pixel electrode 181 is exposed on the upper surface of the connecting portion 204.
- the connection portion 204 and the FPC 172 can be electrically connected via the connection layer 242.
- the transistor 207, the transistor 208, the transistor 209, and the transistor 210 are a pair of semiconductor layers having a conductive layer 221 that functions as a gate, an insulating layer 211 that functions as a gate insulating layer, a channel forming region 231i, and a pair of low resistance regions 231n.
- the insulating layer 211 is located between the conductive layer 221 and the channel forming region 231i.
- the insulating layer 225 is located between the conductive layer 223 and the channel forming region 231i.
- the conductive layer 222a and the conductive layer 222b are each connected to the low resistance region 231n via an opening provided in the insulating layer 215.
- the conductive layer 222a and the conductive layer 222b one functions as a source and the other functions as a drain.
- the insulating layer 225 overlaps the channel forming region 231i of the semiconductor layer 231 and does not overlap the low resistance region 231n.
- the structure shown in FIG. 16 can be produced by processing the insulating layer 225 using the conductive layer 223 as a mask.
- the insulating layer 215 is provided so as to cover the insulating layer 225 and the conductive layer 223, and the conductive layer 222a and the conductive layer 222b are connected to the low resistance region 231n, respectively, through the openings of the insulating layer 215.
- an insulating layer covering the transistor may be provided on the conductive layer 222a and the conductive layer 222b.
- FIG. 17B shows an example in which the insulating layer 225 covers the upper surface and the side surface of the semiconductor layer.
- the conductive layer 222a and the conductive layer 222b are connected to the low resistance region 231n via openings provided in the insulating layer 225 and the insulating layer 215, respectively.
- the display device of the present embodiment has a light receiving device and a light emitting device in the display unit, and the display unit has both a function of displaying an image and a function of detecting light.
- the size and weight of the electronic device can be reduced as compared with the case where the sensor is provided outside the display unit or the outside of the display device.
- a more multifunctional electronic device can be realized by combining with a sensor provided outside the display unit or outside the display device.
- the light receiving device can have at least one layer of the layers provided between the pair of electrodes having the same configuration as the light emitting device (EL device).
- the light receiving device may have all layers other than the active layer having the same configuration as the light emitting device (EL device). That is, the light emitting device and the light receiving device can be formed on the same substrate only by adding the step of forming the active layer to the manufacturing process of the light emitting device.
- the pixel electrode and the common electrode can be formed by the same material and the same process, respectively.
- the manufacturing process of the display device can be simplified. .. As described above, a highly convenient display device can be manufactured by incorporating a light receiving device without having to carry out a complicated process.
- a structure is provided on the surface forming the light-shielding layer so that the distance from the light-shielding layer to the light-receiving device is long and the distance from the light-shielding layer to the light-emitting device is short.
- the display device of one aspect of the present invention has a first pixel circuit having a light receiving device and a second pixel circuit having a light emitting device in the display unit.
- the first pixel circuit and the second pixel circuit are arranged in a matrix, respectively.
- FIG. 18A shows an example of a first pixel circuit having a light receiving device
- FIG. 18B shows an example of a second pixel circuit having a light emitting device.
- the first pixel circuit PIX1 shown in FIG. 18A has a light receiving device PD, a transistor M1, a transistor M2, a transistor M3, a transistor M4, and a capacitance C1.
- a photodiode is used as the light receiving device PD.
- the cathode is electrically connected to the wiring V1 and the anode is electrically connected to one of the source and drain of the transistor M1.
- the gate is electrically connected to the wiring TX, and the other of the source or drain is electrically connected to one electrode of the capacitance C1, one of the source or drain of the transistor M2, and the gate of the transistor M3.
- the gate is electrically connected to the wiring RES, and the other of the source or drain is electrically connected to the wiring V2.
- one of the source and the drain is electrically connected to the wiring V3, and the other of the source and the drain is electrically connected to one of the source and the drain of the transistor M4.
- the gate is electrically connected to the wiring SE, and the other of the source and drain is electrically connected to the wiring OUT1.
- a constant potential is supplied to the wiring V1, the wiring V2, and the wiring V3, respectively.
- the transistor M2 is controlled by a signal supplied to the wiring RES, and has a function of resetting the potential of the node connected to the gate of the transistor M3 to the potential supplied to the wiring V2.
- the transistor M1 is controlled by a signal supplied to the wiring TX, and has a function of controlling the timing of changing the potential of the node according to the electric charge generated in the light receiving device PD.
- the transistor M3 functions as an amplification transistor that outputs according to the potential of the node.
- the transistor M4 is controlled by a signal supplied to the wiring SE, and functions as a selection transistor for reading an output corresponding to the potential of the node by an external circuit connected to the wiring OUT1.
- the second pixel circuit PIX2 shown in FIG. 18B has a light emitting device EL, a transistor M5, a transistor M6, a transistor M7, and a capacitance C2.
- a light emitting diode is used as the light emitting device EL.
- the gate is electrically connected to the wiring VG, one of the source or the drain is electrically connected to the wiring VS, and the other of the source or the drain is the one electrode of the capacitance C2 and the gate of the transistor M6. Connect electrically.
- One of the source or drain of the transistor M6 is electrically connected to the wiring V4, and the other is electrically connected to the anode of the light emitting device EL and one of the source or drain of the transistor M7.
- the gate is electrically connected to the wiring MS, and the other of the source and drain is electrically connected to the wiring OUT2.
- the cathode of the light emitting device EL is electrically connected to the wiring V5.
- a constant potential is supplied to the wiring V4 and the wiring V5, respectively.
- the anode side of the light emitting device EL can have a high potential, and the cathode side can have a lower potential than the anode side.
- the transistor M5 is controlled by a signal supplied to the wiring VG, and functions as a selection transistor for controlling the selection state of the second pixel circuit PIX2. Further, the transistor M6 functions as a drive transistor that controls the current flowing through the light emitting device EL according to the potential supplied to the gate. When the transistor M5 is in the conductive state, the potential supplied to the wiring VS is supplied to the gate of the transistor M6, and the emission brightness of the light emitting device EL can be controlled according to the potential.
- the transistor M7 is controlled by a signal supplied to the wiring MS, and has a function of outputting the potential between the transistor M6 and the light emitting device EL to the outside via the wiring OUT2.
- the wiring V1 to which the cathode of the light receiving device PD is electrically connected and the wiring V5 to which the cathode of the light emitting device EL is electrically connected can have the same layer and the same potential.
- channels are formed in all of the transistors M1, transistor M2, transistor M3, and transistor M4 included in the first pixel circuit PIX1, and the transistors M5, transistor M6, and transistor M7 included in the second pixel circuit PIX2. It is preferable to apply a transistor using a metal oxide (oxide semiconductor) to the semiconductor layer to be formed. As a result, the power consumption of the display device can be reduced.
- a metal oxide oxide semiconductor
- a transistor using silicon it is preferable to apply a transistor using silicon to the semiconductor layer on which a channel is formed to all of the transistors M1 to M7. This enables high-speed driving of the circuit.
- the manufacturing process of the display device can be reduced and the yield can be increased.
- a transistor using an oxide semiconductor may be applied to one or more and six or less of the transistors M1 to M7, and a transistor using silicon may be applied to the remaining transistors.
- a transistor using an oxide semiconductor and a transistor using low-temperature polysilicon are used will be described.
- the semiconductor layers of the transistors M1 and M2 are, for example, indium and M (M is gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, respectively. It is preferable to have one or more selected from molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, and gallium) and zinc. In particular, M is preferably one or more selected from aluminum, gallium, yttrium, and tin.
- an oxide containing indium (In), gallium (Ga), and zinc (Zn) also referred to as IGZO
- IGZO oxide containing indium (In), gallium (Ga), and zinc (Zn)
- the description of the first embodiment can be referred to.
- a transistor using an oxide semiconductor having a wider bandgap and a smaller carrier density than silicon can realize an extremely small off-current. Therefore, due to the small off-current, it is possible to retain the electric charge accumulated in the capacitance connected in series with the transistor for a long period of time. Therefore, it is particularly preferable to use a transistor to which an oxide semiconductor is applied for each of the transistor M1 and the transistor M2 connected in series with the capacitance C1.
- a transistor having an oxide semiconductor as the transistor M1 and the transistor M2 the potential held at the gate of the transistor M3 is leaked through the transistor M1 or the transistor M2 based on the electric charge generated in the light receiving device PD. Can be prevented.
- charge retention period the period from the end of the charge accumulation operation to the start of the read operation.
- an output signal having a potential of the same height is ideally obtained for all pixels.
- the length of the charge retention period differs from row to row, and the charge stored in the pixel node of each row leaks over time, the potential of the pixel output signal will differ from row to row.
- Image data in which the number of gradations changes for each line is obtained. Therefore, by applying a transistor having an oxide semiconductor as the transistor M1 and the transistor M2, the potential change of the node can be reduced. That is, even if the image is taken by using the global shutter method, the change in the gradation of the image data due to the difference in the charge retention period can be suppressed to a small value, and the quality of the captured image can be improved.
- a transistor using low-temperature polysilicon as a semiconductor layer it is preferable to apply a transistor using low-temperature polysilicon as a semiconductor layer to the transistor M3 included in the first pixel circuit PIX1.
- a transistor using low-temperature polysilicon for the semiconductor layer can realize higher field-effect mobility than a transistor using an oxide semiconductor, and is excellent in driving ability and current ability. Therefore, the transistor M3 can operate at a higher speed than the transistors M1 and M2.
- the transistors M1 and M2 have a small leakage current, and the transistor M3 has a high driving ability, so that the minute potential read from the light receiving device PD does not leak, and , Can be read at high speed.
- the transistor M4 included in the first pixel circuit PIX1 functions as a switch for flowing the output from the transistor M3 to the wiring OUT1, it does not have the required functions such as small off-current and high-speed operation unlike the transistors M1 to M3. Therefore, the semiconductor layer of the transistor M4 may be low-temperature polysilicon or an oxide semiconductor.
- a transistor in which low-temperature polysilicon is applied to a semiconductor in which a channel is formed can be used for the transistor M5 to the transistor M7, or a transistor to which an oxide semiconductor is applied can be used. It can also be used.
- a transistor using low temperature polysilicon as a semiconductor layer and a transistor using an oxide semiconductor as a semiconductor layer may be used in combination.
- the transistor is described as an n-channel type transistor in FIGS. 18A and 18B, a p-channel type transistor can also be used. Further, the transistor is not limited to a single gate, and may further have a back gate.
- the transistor included in the first pixel circuit PIX1 and the transistor included in the second pixel circuit PIX2 are preferably formed side by side on the same substrate. In particular, it is preferable that the transistor included in the first pixel circuit PIX1 and the transistor included in the second pixel circuit PIX2 are mixed in one region and arranged periodically.
- each pixel circuit can be reduced, and a high-definition light receiving unit or display unit can be realized.
- the display unit PIX of FIG. 19A the display unit described in the first embodiment can be applied. Pixels are arranged in a matrix on the display unit PIX, and the first pixel circuit PIX1 in FIG. 18A and the second pixel circuit PIX2 in FIG. 18B are arranged in a matrix.
- the gate driver GD and the source driver SD are electrically connected to the second pixel circuit PIX2 of FIG. 18B to supply a signal to the second pixel circuit PIX2.
- the row selection driver RD and the read circuit ROC are electrically connected to the first pixel circuit PIX1 of FIG. 18A and supply a signal to the first pixel circuit PIX1.
- the row selection driver RD is electrically connected to the wiring SE and wiring RES of the first pixel circuit PIX1 of FIG. 18A.
- the readout circuit ROC is electrically connected to the wiring OUT1.
- the row selection driver RD and the read circuit ROC are controlled by a controller.
- the analog-to-digital conversion circuit ADC which will be described later, is also controlled by the same controller.
- the display unit PIX shown in FIG. 19A includes a transistor using low-temperature polysilicon as a semiconductor layer and a transistor using a metal oxide as a semiconductor layer.
- the circuit provided around the display unit PIX of FIG. 19A is required to be driven at high speed rather than having a small off-current characteristic. Therefore, it is preferable to use a transistor using low-temperature polysilicon. Further, in the case of a transistor using low temperature polysilicon, both a p-type transistor and an n-type transistor can be manufactured by a series of manufacturing processes, so that CMOS can be manufactured. Therefore, in particular, since it is preferable that each of the amplifier circuit AMP electrically connected to the readout circuit ROC, the analog-digital conversion circuit ADC electrically connected to the amplifier circuit AMP, and the controller is composed of CMOS, the low temperature poly It is preferably formed by a transistor using silicon.
- the amplifier circuit AMP is output from the analog-digital conversion circuit ADC.
- FIG. 19B shows an example of a panel in which the display unit PIX, the gate driver GD, the source driver SD, the row selection driver RD, and the read circuit ROC are all formed of transistors using metal oxide as a channel.
- An analog signal (Analog Signal) is output from the read circuit ROC.
- a transistor using a metal oxide as a channel it is more difficult to form both an n-type transistor and a p-type transistor from the same semiconductor material than silicon. In other words, it is harder to make CMOS than silicon.
- the amplifier circuit AMP, the analog-to-digital conversion circuit ADC, and the controller which are preferably composed of CMOS, are not provided on the same substrate as the display unit PIX, but by connecting a separately manufactured IC chip or the like to the amplifier circuit. It is preferable to provide an AMP and an analog-to-digital conversion circuit ADC.
- an external IC chip can reduce component costs and mounting costs as compared with the case where an amplifier circuit AMP, an analog-digital conversion circuit ADC, and a controller are prepared.
- the display device of one aspect of the present invention has a transistor using low-temperature polysilicon as a semiconductor layer. Therefore, it becomes easy to build various circuits composed of CMOS circuits on the same substrate as the display unit. As a result, the external circuit mounted on the display device can be simplified, and the component cost and the mounting cost can be reduced.
- the display device of one aspect of the present invention has a transistor using an oxide semiconductor in the semiconductor layer. As a result, the power consumption of the display device can be reduced.
- the display device has two types of transistors, a transistor using an oxide semiconductor for the semiconductor layer and a transistor using low-temperature polysilicon for the semiconductor layer. Therefore, the material of the semiconductor layer can be changed according to the function required for the transistor. Further, since it has a transistor that uses LTPS as a semiconductor layer, it becomes easy to build various circuits composed of CMOS circuits on the same substrate as the display unit. As a result, the external circuit mounted on the display device can be simplified, and the component cost and the mounting cost can be reduced.
- the electronic device of the present embodiment has a display device of one aspect of the present invention.
- the display device of one aspect of the present invention can be applied to the display unit of an electronic device. Since the display device of one aspect of the present invention has a function of detecting light, biometric authentication can be performed on the display unit, or touch or near touch can be detected. As a result, the functionality and convenience of the electronic device can be enhanced.
- Electronic devices include, for example, electronic devices with relatively large screens such as television devices, desktop or notebook personal computers, monitors for computers, digital signage, and large game machines such as pachinko machines, as well as digital devices. Examples include cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, personal digital assistants, sound reproduction devices, and the like.
- the electronic device of the present embodiment has sensors (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, voice, time, hardness, electric field, current, voltage. , Including the ability to measure power, radiation, flow rate, humidity, gradient, vibration, odor or infrared rays).
- the electronic device of the present embodiment can have various functions. For example, a function to display various information (still images, moving images, text images, etc.) on the display unit, a touch panel function, a function to display a calendar, date or time, a function to execute various software (programs), wireless communication. It can have a function, a function of reading a program or data recorded on a recording medium, and the like.
- the electronic device 6500 shown in FIG. 20A is a portable information terminal that can be used as a smartphone.
- the electronic device 6500 includes a housing 6501, a display unit 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, a light source 6508, and the like.
- the display unit 6502 has a touch panel function.
- the display device of one aspect of the present invention can be applied to the display unit 6502.
- FIG. 20B is a schematic cross-sectional view including an end portion of the housing 6501 on the microphone 6506 side.
- a translucent protective member 6510 is provided on the display surface side of the housing 6501, and the display panel 6511, the optical member 6512, the touch sensor panel 6513, and the print are provided in the space surrounded by the housing 6501 and the protective member 6510.
- a substrate 6517, a battery 6518, and the like are arranged.
- a display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 by an adhesive layer (not shown).
- a part of the display panel 6511 is folded back, and the FPC 6515 is connected to the folded back portion.
- IC6516 is mounted on FPC6515.
- the FPC6515 is connected to a terminal provided on the printed circuit board 6517.
- a flexible display according to one aspect of the present invention can be applied to the display panel 6511. Therefore, an extremely lightweight electronic device can be realized. Further, since the display panel 6511 is extremely thin, it is possible to mount a large-capacity battery 6518 while suppressing the thickness of the electronic device. Further, by folding back a part of the display panel 6511 and arranging the connection portion with the FPC 6515 on the back side of the pixel portion, an electronic device having a narrow frame can be realized.
- FIG. 21A shows an example of a television device.
- the display unit 7000 is incorporated in the housing 7101.
- a configuration in which the housing 7101 is supported by the stand 7103 is shown.
- the display device of one aspect of the present invention can be applied to the display unit 7000.
- the operation of the television device 7100 shown in FIG. 21A can be performed by an operation switch included in the housing 7101 or a separate remote control operation machine 7111.
- the display unit 7000 may be provided with a touch sensor, and the television device 7100 may be operated by touching the display unit 7000 with a finger or the like.
- the remote controller 7111 may have a display unit that displays information output from the remote controller 7111.
- the channel and volume can be operated by the operation keys or the touch panel included in the remote controller 7111, and the image displayed on the display unit 7000 can be operated.
- the television device 7100 is configured to include a receiver, a modem, and the like.
- the receiver can receive general television broadcasts.
- information communication is performed in one direction (sender to receiver) or two-way (sender and receiver, or between recipients, etc.). It is also possible.
- FIG. 21B shows an example of a notebook personal computer.
- the notebook personal computer 7200 has a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like.
- a display unit 7000 is incorporated in the housing 7211.
- the display device of one aspect of the present invention can be applied to the display unit 7000.
- 21C and 21D show an example of digital signage.
- the digital signage 7300 shown in FIG. 21C includes a housing 7301, a display unit 7000, a speaker 7303, and the like. Further, it may have an LED lamp, an operation key (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.
- FIG. 21D is a digital signage 7400 attached to a columnar pillar 7401.
- the digital signage 7400 has a display unit 7000 provided along the curved surface of the pillar 7401.
- the display device of one aspect of the present invention can be applied to the display unit 7000.
- the wider the display unit 7000 the more information can be provided at one time. Further, the wider the display unit 7000 is, the more easily it is noticed by people, and for example, the advertising effect of the advertisement can be enhanced.
- the touch panel By applying the touch panel to the display unit 7000, not only the image or moving image can be displayed on the display unit 7000, but also the user can intuitively operate the display unit 7000, which is preferable. In addition, when used for the purpose of providing information such as route information or traffic information, usability can be improved by intuitive operation.
- the digital signage 7300 or the digital signage 7400 can be linked with the information terminal 7311 or the information terminal 7411 such as a smartphone owned by the user by wireless communication.
- the information of the advertisement displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411.
- the display of the display unit 7000 can be switched by operating the information terminal 7311 or the information terminal 7411.
- the digital signage 7300 or the digital signage 7400 can be made to execute a game using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller). As a result, an unspecified number of users can participate in and enjoy the game at the same time.
- the electronic devices shown in FIGS. 22A to 22F include a housing 9000, a display unit 9001, a speaker 9003, an operation key 9005 (including a power switch or an operation switch), a connection terminal 9006, and a sensor 9007 (force, displacement, position, speed). , Acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, voice, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, smell or infrared (Including the function of), microphone 9008, and the like.
- the electronic devices shown in FIGS. 22A to 22F have various functions. For example, a function to display various information (still images, moving images, text images, etc.) on the display unit, a touch panel function, a function to display a calendar, date or time, etc., a function to control processing by various software (programs), It can have a wireless communication function, a function of reading and processing a program or data recorded on a recording medium, and the like.
- the functions of the electronic device are not limited to these, and can have various functions.
- the electronic device may have a plurality of display units.
- the electronic device even if the electronic device is provided with a camera or the like, it has a function of shooting a still image or a moving image and saving it on a recording medium (external or built in the camera), a function of displaying the shot image on a display unit, and the like. Good.
- FIG. 22A is a perspective view showing a mobile information terminal 9101.
- the mobile information terminal 9101 can be used as, for example, a smartphone.
- the mobile information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like. Further, the mobile information terminal 9101 can display character and image information on a plurality of surfaces thereof.
- FIG. 22A shows an example in which three icons 9050 are displayed. Further, the information 9051 indicated by the broken line rectangle can be displayed on another surface of the display unit 9001. Examples of information 9051 include notification of incoming calls such as e-mail, SNS, and telephone, titles such as e-mail and SNS, sender name, date and time, time, remaining battery level, and antenna reception strength. Alternatively, an icon 9050 or the like may be displayed at the position where the information 9051 is displayed.
- FIG. 22B is a perspective view showing a mobile information terminal 9102.
- the mobile information terminal 9102 has a function of displaying information on three or more surfaces of the display unit 9001.
- information 9052, information 9053, and information 9054 are displayed on different surfaces.
- the user can check the information 9053 displayed at a position that can be observed from above the mobile information terminal 9102 with the mobile information terminal 9102 stored in the chest pocket of the clothes.
- the user can check the display without taking out the mobile information terminal 9102 from the pocket, and can determine, for example, whether or not to receive a call.
- FIG. 22C is a perspective view showing a wristwatch-type portable information terminal 9200.
- the mobile information terminal 9200 can be used as, for example, a smart watch.
- the display unit 9001 is provided with a curved display surface, and can display along the curved display surface.
- the mobile information terminal 9200 can also make a hands-free call by communicating with a headset capable of wireless communication, for example.
- the mobile information terminal 9200 can also perform data transmission and charge with other information terminals by means of the connection terminal 9006.
- the charging operation may be performed by wireless power supply.
- 22D to 22F are perspective views showing a foldable mobile information terminal 9201.
- 22D is a perspective view of the mobile information terminal 9201 in an unfolded state
- FIG. 22F is a folded state
- FIG. 22E is a perspective view of a state in which one of FIGS. 22D and 22F is in the process of changing to the other.
- the mobile information terminal 9201 is excellent in portability in the folded state, and is excellent in display listability due to a wide seamless display area in the unfolded state.
- the display unit 9001 included in the personal digital assistant terminal 9201 is supported by three housings 9000 connected by a hinge 9055.
- the display unit 9001 can be bent with a radius of curvature of 0.1 mm or more and 150 mm or less.
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Abstract
Description
図2は、表示装置の一例を示す断面図である。
図3Aは、表示装置の一例を示す断面図である。図3B、図3Cは、樹脂層の上面レイアウトの一例を示す図である。
図4A、図4Bは、表示装置の一例を示す断面図である。
図5A~図5Cは、表示装置の一例を示す断面図である。
図6A~図6Cは、表示装置の一例を示す断面図である。
図7Aは、表示装置の一例を示す上面図である。図7Bは、表示装置の一例を示す断面図である。
図8A、図8Bは、表示装置の一例を示す断面図である。
図9Aは、表示装置の一例を示す上面図である。図9Bは、表示装置の一例を示す断面図である。
図10Aは、表示装置の一例を示す上面図である。図10Bは、表示装置の一例を示す断面図である。
図11A、図11Bは、表示装置の一例を示す断面図である。
図12A、図12Bは、表示装置の一例を示す断面図である。
図13は表示装置の一例を示す斜視図である。
図14は表示装置の一例を示す断面図である。
図15A、図15Bは、表示装置の一例を示す断面図である。
図16は表示装置の一例を示す断面図である。
図17Aは、表示装置の一例を示す断面図である。図17Bは、トランジスタの一例を示す断面図である。
図18A、図18Bは、画素回路の一例を示す回路図である。
図19A、図19Bは、表示装置の一例を示す上面図である。
図20A、図20Bは、電子機器の一例を示す図である。
図21A~図21Dは、電子機器の一例を示す図である。
図22A~図22Fは、電子機器の一例を示す図である。
本実施の形態では、本発明の一態様の表示装置について図1~図17を用いて説明する。
図1E~図1Iに、画素の一例を示す。
図2に表示装置10の断面図を示す。
図3Aに表示装置10Aの断面図を示す。なお、以降の表示装置の説明において、先に説明した表示装置と同様の構成については、説明を省略することがある。
図4Aに表示装置10Bの断面図を示す。
図4Bに表示装置10Cの断面図を示す。
図5Aに表示装置10Dの断面図を示す。
図5Bに表示装置10Eの断面図を示す。
図5Cに表示装置10Fの断面図を示す。図6Aに表示装置10Gの断面図を示す。図6Bに表示装置10Hの断面図を示す。
図6Cに表示装置10Jの断面図を示す。
図7Aに、表示装置10Kの上面図を示す。図7Bに、図7Aにおける一点鎖線A1−A2間の断面図を示す。図8Aに、図7Aにおける一点鎖線A3−A4間の断面図を示す。
図8Bに、表示装置10Lの断面図を示す。
図9Aに、表示装置10Mの上面図を示す。図9Bに、図9Aにおける一点鎖線A5−A6間の断面図を示す。
図10Aに、表示装置10Nの上面図を示す。図10Bに、図10Aにおける一点鎖線A7−A8間の断面図を示す。図11Aに、図10Aにおける一点鎖線A9−A10間の断面図を示す。
図11Bに、表示装置10Pの断面図を示す。
図12A及び図12Bに、表示装置10Qの断面図を示す。表示装置10Qは、表示装置10K(図7A)と同様の上面構造を適用することができる。図12Aに、図7Aにおける一点鎖線A1−A2間の断面図を示す。図12Bに、図7Aにおける一点鎖線A3−A4間の断面図を示す。
図13に、表示装置100Aの斜視図を示し、図14に、表示装置100Aの断面図を示す。
図15Aに、表示装置100Bの断面図を示す。
図16及び図17Aに、表示装置100Cの断面図を示す。表示装置100Cの斜視図は表示装置100A(図13)と同様である。図16には、表示装置100Cの、FPC172を含む領域の一部、回路164の一部、及び、表示部162の一部をそれぞれ切断したときの断面の一例を示す。図17Aには、表示装置100Cの、表示部162の一部を切断したときの断面の一例を示す。図16では、表示部162のうち、特に、受光デバイス110と赤色の光を発する発光デバイス190Rを含む領域を切断したときの断面の一例を示す。図17Aでは、表示部162のうち、特に、緑色の光を発する発光デバイス190Gと青色の光を発する発光デバイス190Bを含む領域を切断したときの断面の一例を示す。
本実施の形態では、本発明の一態様の表示装置について図18及び図19を用いて説明する。
まず、表示装置が有する画素回路の構成例について図18を用いて説明する。
次に、表示装置の構成例について図19を用いて説明する。
本実施の形態では、本発明の一態様の電子機器について、図20~図22を用いて説明する。
Claims (16)
- 第1の画素回路及び第2の画素回路を有し、
前記第1の画素回路は、受光デバイス、第1のトランジスタ、及び第2のトランジスタを有し、
前記第2の画素回路は、発光デバイスを有し、
前記受光デバイスは、第1の画素電極、活性層、及び共通電極を有し、
前記発光デバイスは、第2の画素電極、発光層、及び前記共通電極を有し、
前記活性層は、前記第1の画素電極上に位置し、
前記活性層は、第1の有機化合物を有し、
前記発光層は、前記第2の画素電極上に位置し、
前記発光層は、前記第1の有機化合物とは異なる第2の有機化合物を有し、
前記共通電極は、前記活性層を介して前記第1の画素電極と重なる部分と、前記発光層を介して前記第2の画素電極と重なる部分と、を有し、
前記第1のトランジスタは、半導体層に低温ポリシリコンを有し、
前記第2のトランジスタは、半導体層に金属酸化物を有する、表示装置。 - 第1の画素回路及び第2の画素回路を有し、
前記第1の画素回路は、受光デバイス、第1のトランジスタ、及び第2のトランジスタを有し、
前記第2の画素回路は、発光デバイスを有し、
前記受光デバイスは、第1の画素電極、共通層、活性層、及び共通電極を有し、
前記発光デバイスは、第2の画素電極、前記共通層、発光層、及び前記共通電極を有し、
前記活性層は、前記第1の画素電極上に位置し、
前記活性層は、第1の有機化合物を有し、
前記発光層は、前記第2の画素電極上に位置し、
前記発光層は、前記第1の有機化合物とは異なる第2の有機化合物を有し、
前記共通電極は、前記活性層を介して前記第1の画素電極と重なる部分と、前記発光層を介して前記第2の画素電極と重なる部分と、を有し、
前記共通層は、前記第1の画素電極上及び前記第2の画素電極上に位置し、
前記共通層は、前記活性層と重なる部分と、前記発光層と重なる部分と、を有し、
前記第1のトランジスタは、半導体層に低温ポリシリコンを有し、
前記第2のトランジスタは、半導体層に金属酸化物を有する、表示装置。 - 請求項2において
前記共通層は、前記発光デバイスの正孔注入層として機能する層を有する、表示装置。 - 請求項2または3において
前記共通層は、前記発光デバイスの正孔輸送層として機能する層を有する、表示装置。 - 請求項2乃至4のいずれか一において
前記共通層は、前記発光デバイスの電子輸送層として機能する層を有する、表示装置。 - 請求項2乃至5のいずれか一において
前記共通層は、前記発光デバイスの電子注入層として機能する層を有する、表示装置。 - 請求項1乃至6のいずれか一において
前記第2の画素回路は、さらに、第3のトランジスタを有し、
前記第3のトランジスタは、半導体層に低温ポリシリコンを有する、表示装置。 - 請求項1乃至6のいずれか一において
前記第2の画素回路は、さらに、第3のトランジスタを有し、
前記第3のトランジスタは、半導体層に金属酸化物を有する、表示装置。 - 請求項1乃至8のいずれか一において、
さらに、樹脂層、遮光層、及び基板を有し、
前記樹脂層及び前記遮光層は、それぞれ、前記共通電極と前記基板との間に位置し、
前記樹脂層は、前記受光デバイスと重なる開口を有し、
前記樹脂層は、前記発光デバイスと重なる部分を有し、
前記遮光層は、前記共通電極と前記樹脂層との間に位置する部分を有する、表示装置。 - 請求項9において、
前記遮光層は、前記開口の少なくとも一部、及び、前記開口にて露出している前記樹脂層の側面の少なくとも一部を覆う、表示装置。 - 請求項1乃至8のいずれか一において、
さらに、樹脂層、遮光層、及び基板を有し、
前記樹脂層及び前記遮光層は、それぞれ、前記共通電極と前記基板との間に位置し、
前記樹脂層は、島状に設けられ、かつ、前記発光デバイスと重なる部分を有し、
前記遮光層は、前記共通電極と前記樹脂層との間に位置する部分を有し、
前記基板を通過した光の少なくとも一部は、前記樹脂層を介さずに、前記受光デバイスに入射する、表示装置。 - 請求項11において、
前記遮光層は、前記樹脂層の側面の少なくとも一部を覆う、表示装置。 - 請求項9乃至12のいずれか一において、
さらに、接着層を有し、
前記接着層は、前記共通電極と前記基板との間に位置し、
前記樹脂層及び前記遮光層は、それぞれ、前記接着層と前記基板との間に位置し、
前記接着層は、前記受光デバイスと重なる第1の部分と、前記発光デバイスと重なる第2の部分と、を有し、
前記第1の部分は、前記第2の部分に比べて厚い、表示装置。 - 請求項1乃至13のいずれか一において、
可撓性を有する、表示装置。 - 請求項1乃至14のいずれか一に記載の表示装置と、コネクタまたは集積回路と、を有する、表示モジュール。
- 請求項15に記載の表示モジュールと、
アンテナ、バッテリ、筐体、カメラ、スピーカ、マイク、及び操作ボタンのうち、少なくとも一つと、を有する、電子機器。
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US17/623,798 US20220246694A1 (en) | 2019-07-05 | 2020-06-23 | Display apparatus, display module, and electronic device |
JP2021531207A JPWO2021005434A5 (ja) | 2020-06-23 | 表示装置 | |
KR1020227003468A KR20220025073A (ko) | 2019-07-05 | 2020-06-23 | 표시 장치, 표시 모듈, 및 전자 기기 |
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US11832464B2 (en) | 2019-08-02 | 2023-11-28 | Semiconductor Energy Laboratory Co., Ltd. | Functional panel, display device, input/output device, and data processing device |
TW202211195A (zh) | 2020-08-12 | 2022-03-16 | 日商半導體能源研究所股份有限公司 | 顯示裝置、其工作方法以及電子裝置 |
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JP2007081203A (ja) * | 2005-09-15 | 2007-03-29 | Fujifilm Corp | エリアセンサ、画像入力装置、およびそれを組み込んだ電子写真装置等 |
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