WO2021000474A1 - 有机发光二极管显示面板及电子设备 - Google Patents

有机发光二极管显示面板及电子设备 Download PDF

Info

Publication number
WO2021000474A1
WO2021000474A1 PCT/CN2019/114778 CN2019114778W WO2021000474A1 WO 2021000474 A1 WO2021000474 A1 WO 2021000474A1 CN 2019114778 W CN2019114778 W CN 2019114778W WO 2021000474 A1 WO2021000474 A1 WO 2021000474A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
emitting diode
organic light
light emitting
display panel
Prior art date
Application number
PCT/CN2019/114778
Other languages
English (en)
French (fr)
Inventor
周阳
金武谦
赵勇
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/633,313 priority Critical patent/US11289687B2/en
Publication of WO2021000474A1 publication Critical patent/WO2021000474A1/zh

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, and in particular to an organic light emitting diode display panel and electronic equipment.
  • Mobile phones are one of the indispensable products in people's daily life.
  • mobile phones made with flexible organic light emitting diode display panels have the advantage of being foldable.
  • the flexible polymer substrate of the flexible organic light-emitting diode display panel has poor water and oxygen barrier properties, so that the organic light-emitting layer and the active cathode in the organic light-emitting diode are easily corroded, which shortens the service life of the mobile phone.
  • the purpose of the present application is to provide an organic light-emitting diode display panel and electronic equipment, which have good performance in blocking water vapor and oxygen.
  • the present application provides an electronic device, the electronic device includes an organic light emitting diode display panel, the organic light emitting diode display panel includes a flexible polymer substrate, a first inorganic layer, a second inorganic layer, and organic light emitting A diode array layer, the first inorganic layer and the second inorganic layer are formed on two opposite surfaces of the flexible polymer substrate, and the organic light emitting diode array layer is formed on the first inorganic layer away from the One side of the flexible polymer substrate.
  • the organic light emitting diode display panel further includes an organic layer formed on a side of the second inorganic layer away from the flexible polymer substrate.
  • the organic light emitting diode display panel has at least one photosensitive area, and the photosensitive area of the organic light emitting diode display panel is provided with a groove, and the groove penetrates at least a part of the organic light emitting diode display panel along the first direction.
  • Layer, the first direction is the direction in which the organic layer points to the flexible polymer substrate.
  • the groove penetrates the entire organic layer along the first direction, or the groove penetrates the entire organic layer and part of the second inorganic layer along the first direction.
  • the electronic device further includes an optical sensor disposed in the groove, and the size of the optical sensor along the first direction is less than or equal to that of the groove along the first direction. depth.
  • the organic light emitting diode display panel further has a display area, the display area is arranged at the periphery of the photosensitive area, or the photosensitive area overlaps the display area.
  • the flexible polymer substrate and the organic layer are both polyimide layers, and the light transmittance of the polyimide layer is greater than or equal to 90%.
  • the second inorganic layer includes a stack of a first silicon oxide layer and an amorphous silicon layer, and the amorphous silicon layer is disposed between the first silicon oxide layer and the organic layer. between.
  • the polyimide layer is formed by coating the polyamic acid solution, and then subjecting the polyamic acid solution to imidization in a heating chamber, and the volume percentage of oxygen in the heating chamber Less than or equal to 100ppm.
  • the first inorganic layer includes a stack of at least one second silicon dioxide layer and at least one silicon nitride layer, and the second silicon dioxide layer is located on a side close to the flexible polymer substrate .
  • the organic light emitting diode display panel includes a flexible polymer substrate, a first inorganic layer, a second inorganic layer, and an organic light emitting diode array layer.
  • the first inorganic layer and the second inorganic layer The layers are formed on two opposite surfaces of the flexible polymer substrate, and the organic light emitting diode array layer is formed on the side of the first inorganic layer away from the flexible polymer substrate.
  • the organic light emitting diode display panel further includes an organic layer formed on a side of the second inorganic layer away from the flexible polymer substrate.
  • the organic light emitting diode display panel has at least one photosensitive area, and the photosensitive area of the organic light emitting diode display panel is provided with a groove, and the groove penetrates at least partly along the first direction
  • the first direction is a direction in which the organic layer points to the flexible polymer substrate.
  • the groove penetrates the entire organic layer along the first direction, or the groove penetrates the entire organic layer and part of the second direction along the first direction. Inorganic layer.
  • the organic light emitting diode display panel further has a display area, and the display area is arranged at the periphery of the photosensitive area, or the photosensitive area overlaps the display area.
  • the flexible polymer substrate and the organic layer are both polyimide layers, and the light transmittance of the polyimide layer is greater than or equal to 90%.
  • the polyimide layer is formed by coating the polyamic acid solution and then imidizing the polyamic acid solution in a heating chamber.
  • the volume of oxygen in the heating chamber is The percentage content is less than or equal to 100ppm.
  • the second inorganic layer includes a stack of a first silicon oxide layer and an amorphous silicon layer, and the amorphous silicon layer is disposed on the first silicon oxide layer and the Between organic layers.
  • the first inorganic layer includes a stack of at least one second silicon dioxide layer and at least one silicon nitride layer, and the second silicon dioxide layer is located close to the flexible polymer substrate. Side.
  • the application provides an organic light emitting diode display panel and electronic equipment.
  • the organic light emitting diode display panel includes a flexible polymer substrate, a first inorganic layer, a second inorganic layer, and an organic light emitting diode array layer, a first inorganic layer and a second inorganic layer.
  • the layers are formed on two opposite surfaces of the flexible polymer substrate, and the organic light emitting diode array layer is formed on the side of the first inorganic layer away from the flexible polymer substrate.
  • FIG. 1 is a schematic plan view of an electronic device according to the first embodiment of the application
  • Fig. 2 is a first schematic cross-sectional view taken along the A-A tangent line of the electronic device shown in Fig. 1;
  • Fig. 3 is a second schematic cross-sectional view taken along the A-A tangent line of the electronic device shown in Fig. 1;
  • Figure 4 is a third schematic cross-sectional view taken along the A-A tangent line of the electronic device shown in Figure 1;
  • Fig. 5 is a fourth schematic cross-sectional view taken along the A-A tangent line of the electronic device shown in Fig. 1;
  • FIG. 6 is a schematic plan view of the electronic device according to the second embodiment of the application.
  • FIG. 7 is a schematic plan view of an electronic device according to a third embodiment of the application.
  • FIG. 8 is a schematic plan view of an electronic device according to a fourth embodiment of the application.
  • 101 flexible polymer substrate 102 first inorganic layer; 103 second inorganic layer; 104 organic light emitting diode array layer; 105 organic layer; 106 encapsulation layer; 1021 second silicon dioxide layer; 1022 silicon nitride layer; 1031 first Silicon oxide layer; 1032 amorphous silicon layer; 100a photosensitive area; 100b display area; 100c groove.
  • FIG. 1 is a schematic plan view of an electronic device according to a first embodiment of the application
  • FIG. 2 is a first cross-sectional schematic view along the A-A tangent line of the electronic device shown in FIG.
  • the electronic device 100 is a smart mobile terminal.
  • the electronic device 100 includes an organic light emitting diode display panel 10 and an optical sensor 20.
  • the optical sensor 20 includes a camera, an infrared sensor, a distance sensor, a fingerprint recognition sensor, and the like.
  • the organic light emitting diode display panel 10 includes a flexible polymer substrate 101, a first inorganic layer 102, a second inorganic layer 103 and an organic light emitting diode array layer 104.
  • the first inorganic layer 102 and the second inorganic layer 103 are formed on two opposite surfaces of the flexible polymer substrate 101.
  • the organic light emitting diode array layer 104 is formed on the side of the first inorganic layer 102 away from the flexible polymer substrate 101.
  • the first inorganic layer 102 and the second inorganic layer 103 have good compactness to block water vapor and oxygen.
  • the flexible polymer substrate 101 has good flexibility.
  • the first inorganic layer 102 and the second inorganic layer 103 And the flexible polymer substrate 101 as a whole has good flexibility and barrier properties, and can prevent water vapor and oxygen from corroding the active cathode and organic light-emitting materials of the organic light-emitting diode array layer, so as to improve the service life of electronic devices.
  • the flexible polymer substrate 101 functions to support the organic light emitting diode array layer 104.
  • the flexible polymer substrate 101 is a polyimide layer.
  • the light transmittance of the polyimide layer is greater than or equal to 90%.
  • the polyimide layer is formed by applying a polyamic acid solution and then imidizing the polyamic acid solution in a heating chamber, where the oxygen volume percentage in the heating chamber is less than or equal to 100 ppm, The light transmittance of the formed polyimide layer is greater than or equal to 90%, so as to prevent the polyimide layer from turning yellow and causing low light transmittance, thereby affecting the optical signal of the optical sensor 20 on the side of the flexible polymer substrate 101.
  • the receiving effect of the polyimide layer that is, the light transmittance of the polyimide layer is greater than or equal to 90%, which is beneficial to improve the optical signal reception of the optical sensor 20.
  • the temperature of the heating chamber is increased from 120°C to 450°C for the first time period, and after maintaining at 450°C for the second time period, the third time period passes. Cool down to 120°C.
  • the first inorganic layer 102 includes a stack of at least one second silicon dioxide layer 1021 and at least one silicon nitride layer 1022, and the second silicon dioxide layer 1021 is located on the side close to the flexible polymer substrate 101.
  • the first inorganic layer 102 is a stack of a second silicon dioxide layer 1021 and a silicon nitride layer 1022.
  • the second silicon dioxide layer 1021 is located on the side close to the flexible polymer substrate 101 to block water vapor. While acting with oxygen, the adhesion between the first inorganic layer 102 and the flexible polymer substrate 101 is improved.
  • the silicon nitride layer 1022 has a better blocking effect on water vapor and oxygen, so as to further prevent water vapor and oxygen from passing through the first inorganic layer 102 to reach the organic light emitting diode array layer. 104.
  • the first inorganic layer 102 is a stack of at least one second silicon dioxide layer 1021 and at least one silicon nitride layer 1022, so that the first inorganic layer 102 can be well attached to the flexible polymer substrate 101 while performing a good
  • the function of blocking water vapor and oxygen prevents water vapor and oxygen from passing through the first inorganic layer 102 and corroding the active cathode and organic light-emitting material of the organic light-emitting diode array layer 104.
  • the preparation material of the second inorganic layer 103 may be silicon oxide, silicon nitride, aluminum oxide, and other inorganic materials to prevent water vapor and oxygen from entering the flexible polymer substrate 101.
  • the organic light emitting diode display panel 10 further includes an organic layer 105.
  • the organic layer 105 is formed on the side of the second inorganic layer 103 away from the flexible polymer substrate 101.
  • the organic layer 105 is formed on the side of the second inorganic layer 103 away from the flexible polymer substrate 101 to increase the diffusion path of water vapor and oxygen to the organic light emitting diode array layer 104.
  • the first inorganic layer 102, the flexible polymer substrate 101, the second inorganic layer 103, and the organic layer 105 as a whole further improve the barrier properties of the organic light emitting diode display panel 10 to water vapor and oxygen.
  • the organic layer 105 is a polyimide layer, and the light transmittance of the polyimide layer is greater than or equal to 90%.
  • the polyimide layer is formed by applying a polyamic acid solution and then imidizing the polyamic acid solution in a heating chamber, where the oxygen volume percentage in the heating chamber is less than or equal to 100 ppm,
  • the light transmittance of the formed polyimide layer is greater than or equal to 90%, so as to prevent the polyimide layer from turning yellow and causing low light transmittance, thereby affecting the optical signal of the optical sensor 20 on the side of the flexible polymer substrate 101. The reception effect.
  • the second inorganic layer 103 includes a stack of a first silicon oxide layer 1031 and an amorphous silicon layer ( ⁇ -Si) 1032.
  • the amorphous silicon layer 1032 is disposed between the first silicon oxide 1031 and the organic layer 105.
  • the thickness of the first silicon oxide layer 1031 is 450 nm-550 nm. While the first silicon oxide layer 1031 and the amorphous silicon layer 1032 both function to block water vapor and oxygen, the amorphous silicon layer 1032 further improves the adhesion between the second inorganic layer 103 and the organic layer 105.
  • the second inorganic layer 103 further includes a silicon nitride layer (not shown), and the silicon nitride layer is formed between the first silicon oxide layer 1031 and the amorphous silicon layer 1032 to further improve the second inorganic layer 103 The effect of water vapor and oxygen is blocked, thereby further improving the barrier ability of the organic light emitting diode display panel 10 to water vapor and oxygen.
  • the organic light emitting diode array layer 104 includes a plurality of organic light emitting diodes arranged in an array.
  • the organic light emitting diode includes an anode, a cathode, and an organic light emitting material between the anode and the cathode.
  • the organic light-emitting materials and the active metals in the cathode are sensitive to water vapor and oxygen, and are easily corroded, causing the organic light-emitting diodes to fail to work normally and shorten the service life of electronic devices.
  • the organic light emitting diode display panel 10 further includes an encapsulation layer 106.
  • the encapsulation layer 106 is used to encapsulate the organic light emitting diode array layer 104 to prevent the organic light emitting diode array layer 104 from contacting water vapor and oxygen, which will shorten the service life of the organic light emitting diode display panel and reduce the service life of electronic devices.
  • the encapsulation layer 106 includes at least two inorganic layers and an organic layer located between the two inorganic layers.
  • the organic light emitting diode display panel 10 has at least one photosensitive area 100 a.
  • the photosensitive area 100a is used to set the optical sensor 20. After the light enters the photosensitive area 100a, the optical sensor 20 receives the optical signal and converts the optical signal into an electrical signal.
  • the organic light emitting diode display panel 10 also has a display area 100b, and the display area 100b is disposed at the periphery of the photosensitive area 100a. Specifically, there are multiple photosensitive areas 100a, the multiple photosensitive areas 100a are independent of each other, and the display area 100b is located at the periphery of the multiple photosensitive areas 100a.
  • the plurality of photosensitive regions 100 a are located at one end of the organic light emitting diode display panel 10.
  • the shape of the plurality of photosensitive regions 100a is a circle, a square, or other patterns.
  • the optical sensor 20 is located in the photosensitive area 100 a of the organic light emitting diode display panel 10 and is arranged on the side of the organic layer 105 away from the flexible polymer substrate 101. At least one optical sensor 20 is correspondingly arranged in each photosensitive area 100 a.
  • the orthographic projection of the optical sensor 20 on the flexible polymer substrate 101 is located in the photosensitive area 100a or coincides with the photosensitive area 100a.
  • the photosensitive area 100 a of the organic light emitting diode display panel 10 is a light-transmitting area to ensure that external light signals can reach the optical sensor 20.
  • Making the photosensitive area 100a of the organic light-emitting diode display panel 10 a light-transmitting area can be achieved by digging holes in the film layer of the photosensitive area 100a.
  • the organic light-emitting diode array layer 104 of the photosensitive area 100a is dug out to form holes to avoid organic
  • the metal layer in the LED array layer 104 shields light so that the optical signal cannot reach the optical sensor 20.
  • FIG. 3 is a second schematic cross-sectional view taken along the A-A tangent line of the electronic device shown in FIG. 1.
  • the photosensitive area 100a of the organic light emitting diode display panel 10 is provided with a groove 100c.
  • the groove 100c penetrates at least a part of the organic layer 105 along a first direction, and the organic layer 105 points to the flexible polymer substrate 101 in the first direction.
  • the optical sensor 20 is disposed in the groove 100c.
  • the size of the optical sensor 20 in the first direction may be greater than the depth of the groove 100c in the first direction. Further, the size of the optical sensor 20 along the first direction is less than or equal to the depth of the groove 100c along the first direction.
  • the groove 100c penetrates part of the organic layer 105 along the first direction, and the groove 100c is used to accommodate the optical sensor 20, so that the height of the optical sensor 20 protruding from the organic light emitting diode display panel 10 is reduced, thereby reducing electrons.
  • the unevenness caused by the optical sensor 20 is arranged, and the side of the optical sensor 20 that receives the light signal is closer to the light incident surface of the organic light emitting diode display panel 10, reducing the path that light needs to pass through to the optical sensor 20, so that The optical sensor 20 receives more light signals.
  • the thickness of the groove 100 c penetrating the organic layer 105 along the first direction depends on the size of the optical sensor 20.
  • FIG. 4 is a third schematic cross-sectional view taken along the A-A tangent line of the electronic device shown in FIG. 1.
  • the groove 100c can penetrate the entire organic layer 105 along the first direction to further reduce the unevenness of the electronic device caused by the optical sensor 20 being disposed on the back of the light-emitting surface of the organic light-emitting diode display panel 10, and further improve The effect of the optical signal received by the optical sensor 20.
  • FIG. 5 is a fourth cross-sectional schematic diagram of the electronic device shown in FIG. 1 along the A-A tangent line.
  • the groove 100c penetrates the entire organic layer 105 and a part of the second inorganic layer 103 along the first direction.
  • the second inorganic layer is composed of a first silicon oxide layer 1031 and a polysilicon layer 1032 and the polysilicon layer 1032 is located between the first silicon oxide layer 1031 and the organic layer 105
  • the groove 100c penetrates the entire organic layer along the first direction.
  • the layer 105 and the polysilicon layer 1032 in the second inorganic layer 103 ensure the performance of the organic light-emitting diode display panel 10 to block water vapor and oxygen, while further reducing the optical sensor 20 disposed on the light-emitting surface of the organic light-emitting diode display panel 10.
  • the back side causes unevenness of the electronic device.
  • the second inorganic layer 103 is composed of a first silicon oxide layer 1031, a polysilicon layer 1032, and silicon nitride located between the first silicon oxide 1031 and the polysilicon 1032.
  • the polysilicon layer 1032 is located on the side close to the organic layer 105, the concave The groove 100c penetrates the entire organic layer 105 and the polysilicon layer 1032 and the silicon nitride layer in the second inorganic layer 103 along the first direction.
  • FIG. 6 is a schematic plan view of the electronic device according to the second embodiment of the application.
  • the electronic device 100 shown in FIG. 6 is basically similar to the electronic device 100 shown in FIG. 1, except that the photosensitive area 100a is disposed at one end of the organic light emitting diode display panel 10. There is one photosensitive area 100a, and the photosensitive area 100a is U-shaped. The display area 100b is located at the periphery of the photosensitive area 100a. A plurality of optical sensors 20 are provided in the photosensitive area 100a.
  • the photosensitive area 100a of the organic light emitting diode display panel 10 is provided with a groove 100c, and the orthographic projection of the groove 100c on the flexible polymer substrate 101 coincides with the photosensitive area 100a.
  • the groove 100 c penetrates at least part of the organic layer 105 along the direction in which the organic layer 105 points to the flexible polymer substrate 101.
  • FIG. 7 is a schematic plan view of the electronic device according to the third embodiment of the application.
  • the electronic device 100 shown in FIG. 7 is basically similar to the electronic device 100 shown in FIG. 1, except that the photosensitive area 100a and the display area 100b completely overlap, and the optical sensor 20 is disposed at one end of the organic light emitting diode display panel 10 and is located at the photosensitive area.
  • the photosensitive area 100a of the organic light emitting diode display panel 10 is provided with a groove 100c that penetrates at least part of the organic layer 105 along the direction of the organic layer 105 pointing to the flexible polymer substrate 101.
  • the groove 100c is provided with a camera and an infrared sensor. A large number of touch elements are also provided in 100c.
  • the touch elements may be infrared emitting and receiving sensing elements.
  • the touch elements may also be ultrasonic transmitters and corresponding ultrasonic receivers, so that the display area 100b of the electronic device 100 has Display function, touch function and light transmission function.
  • the photosensitive area 100a of the organic light emitting diode display panel 10 is provided with a groove 100c, and the orthographic projection of the groove 100c on the flexible polymer substrate 101 coincides with the photosensitive area 100a.
  • FIG. 8 is a schematic plan view of an electronic device according to a fourth embodiment of the application.
  • the electronic device 100 shown in FIG. 8 is basically similar to the electronic device 100 shown in FIG. 7, except that the photosensitive area 100a and the display area 100b partially overlap, and the photosensitive area 100a is located in the display area 100b, that is, the display area 100b is larger than the photosensitive area 100a. .
  • the present application also provides an organic light emitting diode display panel.
  • the organic light emitting diode display panel includes a flexible polymer substrate, a first inorganic layer, a second inorganic layer, and an organic light emitting diode array layer.
  • the first inorganic layer The second inorganic layer is formed on two opposite surfaces of the flexible polymer substrate, and the organic light emitting diode array layer is formed on the side of the first inorganic layer away from the flexible polymer substrate.
  • the organic light-emitting diode display panel of the present application forms an inorganic layer on two opposite surfaces of a flexible polymer substrate.
  • the flexible polymer substrate and the inorganic layers on the opposite surfaces as a whole have high barrier properties to water vapor and oxygen. This prevents water vapor and oxygen from corroding the active cathode and the organic light-emitting layer of the organic light-emitting diode array layer, thereby improving the service life of the organic light-emitting diode display panel.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请提供一种有机发光二极管显示面板及电子设备，有机发光二极管显示面板包括柔性聚合物衬底、第一无机层、第二无机层以及有机发光二极管阵列层，第一无机层和第二无机层形成于柔性聚合物衬底相对的两表面上，有机发光二极管阵列层形成于第一无机层远离柔性聚合物衬底的一侧。

Description

有机发光二极管显示面板及电子设备 技术领域
本申请涉及显示技术领域，尤其涉及一种有机发光二极管显示面板及电子设备。
 背景技术
手机是人们日常生活中不可或缺的产品之一。目前，采用柔性有机发光二极管显示面板制得的手机具有可折叠的优点。然而，柔性有机发光二极管显示面板的柔性聚合物衬底由于阻水和阻氧的性能差，导致有机发光二极管中的有机发光层和活泼阴极容易被侵蚀，造成手机的使用寿命缩短。
因此，有必要提出一种技术方案以解决柔性有机发光二极管显示面板的柔性聚合物衬底由于阻挡水蒸气和阻挡氧气的性能差而导致手机使用寿命短的问题。
 技术问题
本申请的目的在于提供一种有机发光二极管显示面板及电子设备，该有机发光二极管显示面板及电子设备阻挡水蒸气和阻挡氧气的性能良好。
 技术解决方案
为实现上述目的，本申请提供一种电子设备，所述电子设备包括有机发光二极管显示面板，所述有机发光二极管显示面板包括柔性聚合物衬底、第一无机层、第二无机层以及有机发光二极管阵列层，所述第一无机层和所述第二无机层形成于所述柔性聚合物衬底相对的两表面上，所述有机发光二极管阵列层形成于所述第一无机层远离所述柔性聚合物衬底的一侧。
在上述电子设备中，所述有机发光二极管显示面板还包括一有机层，所述有机层形成于所述第二无机层远离所述柔性聚合物衬底的一侧。
在上述电子设备中，所述有机发光二极管显示面板具有至少一感光区，所述有机发光二极管显示面板的所述感光区设置有凹槽，所述凹槽沿第一方向至少贯穿部分所述有机层，所述第一方向为所述有机层指向所述柔性聚合物衬底的方向。
在上述电子设备中，所述凹槽沿所述第一方向贯穿整个所述有机层，或，所述凹槽沿所述第一方向贯穿整个所述有机层以及部分所述第二无机层。
在上述电子设备中，所述电子设备还包括设置于所述凹槽中的光学感应器，所述光学感应器沿所述第一方向的尺寸小于或等于所述凹槽沿所述第一方向的深度。
在上述电子设备中，所述有机发光二极管显示面板还具有显示区，所述显示区设置于所述感光区的外围，或，所述感光区与所述显示区重合。
在上述电子设备中，所述柔性聚合物衬底和所述有机层均为聚酰亚胺层，所述聚酰亚胺层的透光率大于或等于90%。
在上述电子设备中，所述第二无机层包括一第一氧化硅层和一非晶硅层的叠层，所述非晶硅层设置于所述第一氧化硅层和所述有机层之间。
在上述电子设备中，所述聚酰亚胺层是通过涂覆聚酰胺酸溶液后，使聚酰胺酸溶液在加热腔室中经过亚胺化以形成，加热腔室中的氧气体积百分含量小于或等于100ppm。
在上述电子设备中，所述第一无机层包括至少一第二氧化硅层以及至少一氮化硅层的叠层，所述第二氧化硅层位于靠近所述柔性聚合物衬底的一侧。
一种有机发光二极管显示面板，所述有机发光二极管显示面板包括柔性聚合物衬底、第一无机层、第二无机层以及有机发光二极管阵列层，所述第一无机层和所述第二无机层形成于所述柔性聚合物衬底相对的两表面上，所述有机发光二极管阵列层形成于所述第一无机层远离所述柔性聚合物衬底的一侧。
在上述有机发光二极管显示面板中，所述有机发光二极管显示面板还包括一有机层，所述有机层形成于所述第二无机层远离所述柔性聚合物衬底的一侧。
在上述有机发光二极管显示面板中，所述有机发光二极管显示面板具有至少一感光区，所述有机发光二极管显示面板的所述感光区设置有凹槽，所述凹槽沿第一方向至少贯穿部分所述有机层，所述第一方向为所述有机层指向所述柔性聚合物衬底的方向。
在上述有机发光二极管显示面板中，所述凹槽沿所述第一方向贯穿整个所述有机层，或，所述凹槽沿所述第一方向贯穿整个所述有机层以及部分所述第二无机层。
在上述有机发光二极管显示面板中，所述有机发光二极管显示面板还具有显示区，所述显示区设置于所述感光区的外围，或，所述感光区与所述显示区重合。
在上述有机发光二极管显示面板中，所述柔性聚合物衬底和所述有机层均为聚酰亚胺层，所述聚酰亚胺层的透光率大于或等于90%。
在上述有机发光二极管显示面板中，所述聚酰亚胺层是通过涂覆聚酰胺酸溶液后，使聚酰胺酸溶液在加热腔室中经过亚胺化以形成，加热腔室中的氧气体积百分含量小于或等于100ppm。
在上述有机发光二极管显示面板中，所述第二无机层包括一第一氧化硅层和一非晶硅层的叠层，所述非晶硅层设置于所述第一氧化硅层和所述有机层之间。
在上述有机发光二极管显示面板中，所述第一无机层包括至少一第二氧化硅层以及至少一氮化硅层的叠层，所述第二氧化硅层位于靠近所述柔性聚合物衬底的一侧。
 有益效果
本申请提供一种有机发光二极管显示面板及电子设备，有机发光二极管显示面板包括柔性聚合物衬底、第一无机层、第二无机层以及有机发光二极管阵列层，第一无机层和第二无机层形成于柔性聚合物衬底相对的两表面上，有机发光二极管阵列层形成于第一无机层远离柔性聚合物衬底的一侧。通过在柔性聚合物衬底相对的两表面上分别形成一无机层，柔性聚合物衬底与其相对两表面上的无机层作为一个整体对水蒸气以及氧气的阻隔性能高，以避免水蒸气和氧气侵蚀有机发光二极管阵列层的活泼阴极和有机发光层，从而提高有机发光二极管显示面板及电子设备的使用寿命。
 附图说明
图1为本申请第一实施例电子设备的平面示意图；
图2为沿图1所示电子设备的A-A切线的第一种截面示意图；
图3为沿图1所示电子设备的A-A切线的第二种截面示意图；
图4为沿图1所示电子设备的A-A切线的第三种截面示意图；
图5为沿图1所示电子设备的A-A切线的第四种截面示意图；
图6为本申请第二实施例电子设备的平面示意图；
图7为本申请第三实施例电子设备的平面示意图；
图8为本申请第四实施例电子设备的平面示意图。
附图标示如下：
100 电子设备； 10有机发光二极管显示面板； 20 光学感应器；
101 柔性聚合物衬底； 102 第一无机层； 103第二无机层； 104有机发光二极管阵列层； 105 有机层；106 封装层；1021第二氧化硅层；1022氮化硅层； 1031第一氧化硅层； 1032非晶硅层； 100a 感光区；100b 显示区； 100c 凹槽。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1及图2，图1为本申请第一实施例电子设备的平面示意图，图2为沿图1所示电子设备的A-A切线的第一种截面示意图。电子设备100为智能移动终端。电子设备100包括有机发光二极管显示面板10以及光学感应器20。光学感应器20包括摄像头、红外感应器、距离感应器以及指纹识别传感器等。有机发光二极管显示面板10包括柔性聚合物衬底101、第一无机层102、第二无机层103以及有机发光二极管阵列层104。
第一无机层102和第二无机层103形成于柔性聚合物衬底101相对的两表面上。有机发光二极管阵列层104形成于第一无机层102远离柔性聚合物衬底101的一侧。第一无机层102和第二无机层103具有良好的致密性以起到阻隔水蒸气和氧气的作用，而柔性聚合物衬底101具有良好的柔性，第一无机层102、第二无机层103以及柔性聚合物衬底101作为一个整体具有良好的柔性以及阻隔性，能避免水蒸气以及氧气侵蚀有机发光二极管阵列层的活泼阴极和有机发光材料，以提高电子设备的使用寿命。
柔性聚合物衬底101起到承载有机发光二极管阵列层104的作用。柔性聚合物衬底101为聚酰亚胺层。聚酰亚胺层的透光率大于或等于90%。聚酰亚胺层是通过涂覆聚酰胺酸溶液后，使聚酰胺酸溶液在加热腔室中经过亚胺化以形成，其中，加热腔室中的氧气体积百分含量小于或等于100ppm，以使得形成的聚酰亚胺层的透光率大于或等于90%，避免聚酰亚胺层变黄导致透光率低，从而影响柔性聚合物衬底101一侧的光学感应器20对光信号的接收效果，即聚酰亚胺层的透光率大于或等于90%有利于提高光学感应器20对光信号的接收。此外，聚酰胺酸经过亚胺化以形成聚酰亚胺时，加热腔室的温度由120℃经过第一时间段升温至450℃，在450℃保持第二时间段后，经过第三时间段降温至120℃。
第一无机层102包括至少一第二氧化硅层1021以及至少一氮化硅层1022的叠层，第二氧化硅层1021位于靠近柔性聚合物衬底101的一侧。具体地，第一无机层102为一第二氧化硅1021以及一氮化硅层1022的叠层，第二氧化硅层1021位于靠近柔性聚合物衬底101的一侧，以起到阻挡水蒸气和氧气作用的同时，提高第一无机层102与柔性聚合物衬底101之间的附着力。另外，相对于第二氧化硅层1021，氮化硅层1022对水蒸气和氧气具有更好的阻挡作用，以进一步地避免水蒸气和氧气穿过第一无机层102而到达有机发光二极管阵列层104。第一无机层102为至少一第二氧化硅层1021以及至少一氮化硅层1022的叠层使得第一无机层102能良好地附着于柔性聚合物衬底101上的同时，能起到良好的阻挡水蒸气和氧气的作用，避免水蒸气和氧气穿过第一无机层102而侵蚀有机发光二极管阵列层104的活泼阴极和有机发光材料。
第二无机层103的制备材料可以为氧化硅、氮化硅、氧化铝以及其他无机材料，以起到阻挡水蒸气和氧气进入柔性聚合物衬底101的作用。
进一步地，有机发光二极管显示面板10还包括一有机层105。有机层105形成于第二无机层103远离柔性聚合物衬底101的一侧。通过在第二无机层103远离柔性聚合物衬底101的一侧形成有机层105，以增加水蒸气和氧气扩散至有机发光二极管阵列层104的路径，第一无机层102、柔性聚合物衬底101、第二无机层103以及有机层105作为一个整体进一步地提高有机发光二极管显示面板10对水蒸气和氧气的阻隔性。有机层105为聚酰亚胺层，聚酰亚胺层的透光率大于或等于90%。聚酰亚胺层是通过涂覆聚酰胺酸溶液后，使聚酰胺酸溶液在加热腔室中经过亚胺化以形成，其中，加热腔室中的氧气体积百分含量小于或等于100ppm，以使得形成的聚酰亚胺层的透光率大于或等于90%，避免聚酰亚胺层变黄导致透光率低，从而影响柔性聚合物衬底101一侧的光学感应器20对光信号的接收效果。
第二无机层103包括一第一氧化硅层1031和一非晶硅层（α-Si）1032的叠层。非晶硅层1032设置于第一氧化硅1031和有机层105之间。其中，第一氧化硅层1031的厚度为450纳米-550纳米。第一氧化硅层1031和非晶硅层1032均起到阻隔水蒸气和氧气作用的同时，非晶硅层1032起到进一步提高第二无机层103与有机层105之间附着力的作用。
进一步地，第二无机层103还包括氮化硅层（未示出），氮化硅层形成于第一氧化硅层1031和非晶硅层1032之间，以进一步地提高第二无机层103阻挡水蒸气和氧气的作用，从而进一步地提高有机发光二极管显示面板10对水蒸气和氧气的阻挡能力。
有机发光二极管阵列层104包括多个阵列排布的有机发光二极管。有机发光二极管包括阳极、阴极以及位于阳极和阴极之间的有机发光材料。有机发光材料以及阴极中的活泼金属对水蒸气和氧气敏感，而容易被侵蚀，导致有机发光二极管不能正常工作，造成电子设备的使用寿命缩短。
有机发光二极管显示面板10还包括一封装层106。封装层106用于对有机发光二极管阵列层104进行封装，避免有机发光二极管阵列层104与水蒸气以及氧气接触，而导致有机发光二极管显示面板的使用寿命缩短，造成电子设备的使用寿命减小。封装层106包括至少两个无机层以及位于两个无机层之间的有机层。
请继续参阅图1和图2，有机发光二极管显示面板10具有至少一感光区100a。感光区100a用于设置光学感应器20，光射入至感光区100a之后，光学感应器20接收光信号并将光信号转化为电信号。有机发光二极管显示面板10还具有显示区100b，显示区100b设置于感光区100a的外围。具体地，感光区100a为多个，多个感光区100a彼此相互独立，显示区100b位于多个感光区100a的外围。多个感光区100a位于有机发光二极管显示面板10的一端。多个感光区100a的形状为圆形、正方形或者其他图形。光学感应器20位于有机发光二极管显示面板10的感光区100a且设置于有机层105远离柔性聚合物衬底101的一侧，每个感光区100a对应地设置至少一光学感应器20。光学感应器20在柔性聚合物衬底101上的正投影位于感光区100a内或与感光区100a重合。
需要说明的是，有机发光二极管显示面板10的感光区100a为透光区以保证外界的光信号能到达光学感应器20。使得有机发光二极管显示面板10的感光区100a为透光区可以通过在感光区100a的膜层上挖孔以实现，例如将感光区100a的有机发光二极管阵列层104挖去以形成孔，避免有机发光二极管阵列层104中的金属层遮光使得光信号无法到达光学感应器20。
请参阅图3，其为沿图1所示电子设备的A-A切线的第二种截面示意图。如图3所示，有机发光二极管显示面板10的感光区100a设置有凹槽100c，凹槽100c沿第一方向至少贯穿部分有机层105，第一方向为有机层105指向柔性聚合物衬底101的方向。光学感应器20设置于凹槽100c中。光学感应器20沿第一方向的尺寸可以大于凹槽100c沿第一方向的深度。进一步地，光学感应器20沿第一方向的尺寸小于或等于凹槽100c沿第一方向的深度。具体地，凹槽100c沿第一方向贯穿部分有机层105，凹槽100c用于容置光学感应器20，以使得光学感应器20凸出有机发光二极管显示面板10的高度减小，从而减少电子设置由于光学感应器20造成的不平整，且使得光学感应器20接收光信号的一侧更加贴近有机发光二极管显示面板10的入光面，减少光传输至光学感应器20需要经过的路径，使得光学感应器20接收的光信号更多。凹槽100c沿第一方向贯穿有机层105的厚度取决于光学感应器20的尺寸。
请参阅图4，其为沿图1所示电子设备的A-A切线的第三种截面示意图。如图4所示，凹槽100c可以沿第一方向贯穿整个有机层105，以进一步地减少光学感应器20设置于有机发光二极管显示面板10出光面背面造成电子设备的不平整，且进一步地提高光学感应器20接收的光信号的效果。
请参阅图5，其沿图1所示电子设备的A-A切线的第四种截面示意图。凹槽100c沿第一方向贯穿整个有机层105和部分第二无机层103。具体地，第二无机层由一第一氧化硅层1031和一多晶硅层1032组成且多晶硅层1032位于第一氧化硅层1031和有机层105之间时，凹槽100c沿第一方向贯穿整个有机层105以及第二无机层103中的多晶硅层1032，以保证有机发光二极管显示面板10阻挡水蒸气和氧气的性能的同时，更进一步地减少光学感应器20设置于有机发光二极管显示面板10出光面背面造成电子设备的不平整。
第二无机层103由一第一氧化硅层1031、一多晶硅层1032以及位于第一氧化硅1031和多晶硅1032之间的氮化硅组成且多晶硅层1032位于靠近有机层105的一侧时，凹槽100c沿第一方向贯穿整个有机层105以及第二无机层103中的多晶硅层1032和氮化硅层。
请参阅图6，其为本申请第二实施例电子设备的平面示意图。图6所示电子设备100与图1所示电子设备100基本相似，不同之处在于，感光区100a设置于有机发光二极管显示面板10的一端，感光区100a为一个，感光区100a为U型，显示区100b位于感光区100a的外围。感光区100a中设置有多个光学感应器20。有机发光二极管显示面板10的感光区100a设置有凹槽100c，凹槽100c在柔性聚合物衬底101上的正投影与感光区100a恰好重合。凹槽100c沿有机层105指向柔性聚合物衬底101的方向至少贯穿部分有机层105。
请参阅图7，其为本申请第三实施例电子设备的平面示意图。图7所示电子设备100与图1所示电子设备100基本相似，不同之处在于，感光区100a与显示区100b完全重合，光学感应器20设置于有机发光二极管显示面板10的一端且位于感光区100a内。有机发光二极管显示面板10的感光区100a设置有沿有机层105指向柔性聚合物衬底101的方向至少贯穿部分有机层105的凹槽100c，凹槽100c中设置有摄像头以及红外传感器等，凹槽100c中还设置有大量的触控元件，触控元件可以为红外线发射和接收感测元件，触控元件也可以为超声波发射器和相应的超声波接收器，以使得电子设备100的显示区100b具有显示功能、触控功能以及透光功能。有机发光二极管显示面板10的感光区100a设置有凹槽100c，凹槽100c在柔性聚合物衬底101上的正投影与感光区100a恰好重合。
请参阅图8，其为本申请第四实施例电子设备的平面示意图。图8所示电子设备100与图7所示电子设备100基本相似，不同之处在于，感光区100a与显示区100b部分重合，感光区100a位于显示区100b内，即显示区100b大于感光区100a。
基于相同的发明构思，本申请还提供一种有机发光二极管显示面板，有机发光二极管显示面板包括柔性聚合物衬底、第一无机层、第二无机层以及有机发光二极管阵列层，第一无机层和第二无机层形成于柔性聚合物衬底相对的两表面上，有机发光二极管阵列层形成于第一无机层远离柔性聚合物衬底的一侧。
本申请有机发光二极管显示面板通过在柔性聚合物衬底相对的两表面上分别形成一无机层，柔性聚合物衬底与其相对两表面的无机层作为一个整体对水蒸气以及氧气的阻隔性能高，以避免水蒸气和氧气侵蚀有机发光二极管阵列层的活泼阴极和有机发光层，从而提高有机发光二极管显示面板的使用寿命。
以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (19)

  1. 一种电子设备，其中，所述电子设备包括有机发光二极管显示面板，所述有机发光二极管显示面板包括柔性聚合物衬底、第一无机层、第二无机层以及有机发光二极管阵列层，所述第一无机层和所述第二无机层形成于所述柔性聚合物衬底相对的两表面上，所述有机发光二极管阵列层形成于所述第一无机层远离所述柔性聚合物衬底的一侧。
  2. 根据权利要求1所述的电子设备，其中，所述有机发光二极管显示面板还包括一有机层，所述有机层形成于所述第二无机层远离所述柔性聚合物衬底的一侧。
  3. 根据权利要求2所述的电子设备，其中，所述有机发光二极管显示面板具有至少一感光区，所述有机发光二极管显示面板的所述感光区设置有凹槽，所述凹槽沿第一方向至少贯穿部分所述有机层，所述第一方向为所述有机层指向所述柔性聚合物衬底的方向。
  4. 根据权利要求3所述的电子设备，其中，所述凹槽沿所述第一方向贯穿整个所述有机层，或，所述凹槽沿所述第一方向贯穿整个所述有机层以及部分所述第二无机层。
  5. 根据权利要求3所述的电子设备，其中，所述电子设备还包括设置于所述凹槽中的光学感应器，所述光学感应器沿所述第一方向的尺寸小于或等于所述凹槽沿所述第一方向的深度。
  6. 根据权利要求3所述的电子设备，其中，所述有机发光二极管显示面板还具有显示区，所述显示区设置于所述感光区的外围，或，所述感光区与所述显示区重合。
  7. 根据权利要求2所述的电子设备，其中，所述柔性聚合物衬底和所述有机层均为聚酰亚胺层，所述聚酰亚胺层的透光率大于或等于90%。
  8. 根据权利要求7所述的电子设备，其中，所述第二无机层包括一第一氧化硅层和一非晶硅层的叠层，所述非晶硅层设置于所述第一氧化硅层和所述有机层之间。
  9. 根据权利要求7所述的电子设备，其中，所述聚酰亚胺层是通过涂覆聚酰胺酸溶液后，使聚酰胺酸溶液在加热腔室中经过亚胺化以形成，加热腔室中的氧气体积百分含量小于或等于100ppm。
  10. 根据权利要求1所述的电子设备，其中，所述第一无机层包括至少一第二氧化硅层以及至少一氮化硅层的叠层，所述第二氧化硅层位于靠近所述柔性聚合物衬底的一侧。
  11. 一种有机发光二极管显示面板，其中，所述有机发光二极管显示面板包括柔性聚合物衬底、第一无机层、第二无机层以及有机发光二极管阵列层，所述第一无机层和所述第二无机层形成于所述柔性聚合物衬底相对的两表面上，所述有机发光二极管阵列层形成于所述第一无机层远离所述柔性聚合物衬底的一侧。
  12. 根据权利要求11所述的有机发光二极管显示面板，其中，所述有机发光二极管显示面板还包括一有机层，所述有机层形成于所述第二无机层远离所述柔性聚合物衬底的一侧。
  13. 根据权利要求12所述的有机发光二极管显示面板，其中，所述有机发光二极管显示面板具有至少一感光区，所述有机发光二极管显示面板的所述感光区设置有凹槽，所述凹槽沿第一方向至少贯穿部分所述有机层，所述第一方向为所述有机层指向所述柔性聚合物衬底的方向。
  14. 根据权利要求13所述的有机发光二极管显示面板，其中，所述凹槽沿所述第一方向贯穿整个所述有机层，或，所述凹槽沿所述第一方向贯穿整个所述有机层以及部分所述第二无机层。
  15. 根据权利要求13所述的有机发光二极管显示面板，其中，所述有机发光二极管显示面板还具有显示区，所述显示区设置于所述感光区的外围，或，所述感光区与所述显示区重合。
  16. 根据权利要求12所述的有机发光二极管显示面板，其中，所述柔性聚合物衬底和所述有机层均为聚酰亚胺层，所述聚酰亚胺层的透光率大于或等于90%。
  17. 根据权利要求16所述的有机发光二极管显示面板，其中，所述聚酰亚胺层是通过涂覆聚酰胺酸溶液后，使聚酰胺酸溶液在加热腔室中经过亚胺化以形成，加热腔室中的氧气体积百分含量小于或等于100ppm。
  18. 根据权利要求16所述的有机发光二极管显示面板，其中，所述第二无机层包括一第一氧化硅层和一非晶硅层的叠层，所述非晶硅层设置于所述第一氧化硅层和所述有机层之间。
  19. 根据权利要求11所述的有机发光二极管显示面板，其中，所述第一无机层包括至少一第二氧化硅层以及至少一氮化硅层的叠层，所述第二氧化硅层位于靠近所述柔性聚合物衬底的一侧。
PCT/CN2019/114778 2019-07-04 2019-10-31 有机发光二极管显示面板及电子设备 WO2021000474A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/633,313 US11289687B2 (en) 2019-07-04 2019-10-31 Organic light emitting diode (OLED) display panel and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910598928.7 2019-07-04
CN201910598928.7A CN110350104B (zh) 2019-07-04 2019-07-04 有机发光二极管显示面板及电子设备

Publications (1)

Publication Number Publication Date
WO2021000474A1 true WO2021000474A1 (zh) 2021-01-07

Family

ID=68178314

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/114778 WO2021000474A1 (zh) 2019-07-04 2019-10-31 有机发光二极管显示面板及电子设备

Country Status (2)

Country Link
CN (1) CN110350104B (zh)
WO (1) WO2021000474A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110350104B (zh) * 2019-07-04 2021-03-16 武汉华星光电半导体显示技术有限公司 有机发光二极管显示面板及电子设备
CN110783393B (zh) * 2019-11-15 2022-03-08 昆山国显光电有限公司 一种显示面板保护结构及显示组件
CN111029483B (zh) * 2019-12-19 2021-03-16 武汉华星光电半导体显示技术有限公司 Oled面板及其制作方法
CN111063717A (zh) * 2019-12-23 2020-04-24 武汉华星光电半导体显示技术有限公司 一种柔性显示装置
CN111146359A (zh) * 2019-12-26 2020-05-12 武汉天马微电子有限公司 柔性显示面板、其制作方法及显示装置
CN111430431A (zh) * 2020-04-14 2020-07-17 Oppo广东移动通信有限公司 用于显示装置的柔性显示面板及具有其的显示装置
CN111766969B (zh) * 2020-06-08 2023-04-07 武汉华星光电半导体显示技术有限公司 一种触控显示面板及其制作方法
CN111863895A (zh) * 2020-07-16 2020-10-30 武汉华星光电半导体显示技术有限公司 一种可折叠显示屏

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070184292A1 (en) * 2006-02-03 2007-08-09 Samsung Electronics Co., Ltd Flat panel display device and manufacturing method for the same
CN203910803U (zh) * 2013-05-16 2014-10-29 三星显示有限公司 有机发光二极管显示器和包括其的电子装置
CN105609530A (zh) * 2014-11-17 2016-05-25 三星显示有限公司 有机发光二极管显示器及其制造方法和电子装置
CN109860266A (zh) * 2019-03-12 2019-06-07 武汉华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN110350104A (zh) * 2019-07-04 2019-10-18 武汉华星光电半导体显示技术有限公司 有机发光二极管显示面板及电子设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9978987B2 (en) * 2014-03-24 2018-05-22 Pioneer Corporation Light emitting device and method of manufacturing a light emitting device
CN105655494B (zh) * 2016-03-18 2018-08-24 深圳市华星光电技术有限公司 有机发光二极管的基底及其制作方法、有机发光二极管

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070184292A1 (en) * 2006-02-03 2007-08-09 Samsung Electronics Co., Ltd Flat panel display device and manufacturing method for the same
CN203910803U (zh) * 2013-05-16 2014-10-29 三星显示有限公司 有机发光二极管显示器和包括其的电子装置
CN104167424A (zh) * 2013-05-16 2014-11-26 三星显示有限公司 有机发光二极管显示器、包括其的电子装置及其制造方法
CN105609530A (zh) * 2014-11-17 2016-05-25 三星显示有限公司 有机发光二极管显示器及其制造方法和电子装置
CN109860266A (zh) * 2019-03-12 2019-06-07 武汉华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN110350104A (zh) * 2019-07-04 2019-10-18 武汉华星光电半导体显示技术有限公司 有机发光二极管显示面板及电子设备

Also Published As

Publication number Publication date
CN110350104B (zh) 2021-03-16
CN110350104A (zh) 2019-10-18

Similar Documents

Publication Publication Date Title
WO2021000474A1 (zh) 有机发光二极管显示面板及电子设备
US11289687B2 (en) Organic light emitting diode (OLED) display panel and electronic device
US11508176B2 (en) Display substrate and method for manufacturing the same, display apparatus
JP5341701B2 (ja) 表示装置およびデジタルカメラ
WO2020244110A1 (zh) 有机发光二极管显示面板及电子设备
WO2020192117A1 (en) Array substrate and fabricating method thereof, and display apparatus
JPWO2011016126A1 (ja) 表示装置
WO2021017196A1 (zh) 有机发光二极管显示面板及其制作方法、显示装置
WO2023065433A1 (zh) 显示面板及显示装置
CN112364760A (zh) 一种显示装置
CN113745433A (zh) 一种显示面板
TW202005139A (zh) 光提取設備及可撓性oled顯示器
WO2019174121A1 (zh) 显示面板、显示面板制备方法及电子装置
WO2020186613A1 (zh) 识别模组及显示装置
CN113285043B (zh) 一种显示面板、显示面板的制作方法及显示装置
US20240037980A1 (en) Display panel and electronic device
TW202247033A (zh) 指紋感測模組及顯示裝置
CN113437124A (zh) 显示面板及显示装置
TWI666767B (zh) 主動元件基板
US11639870B2 (en) Optical sensing device
CN116847676A (zh) 显示面板以及显示装置
US9449939B2 (en) Geometry of contact sites at brittle inorganic layers in electronic devices
TWI746260B (zh) 感光裝置
WO2023102888A1 (zh) 可见光通信器件、显示基板、装置及显示基板的制作方法
TWI717911B (zh) 顯示裝置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19935993

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19935993

Country of ref document: EP

Kind code of ref document: A1