WO2020258871A1 - 触控结构、显示面板及显示装置 - Google Patents

触控结构、显示面板及显示装置 Download PDF

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WO2020258871A1
WO2020258871A1 PCT/CN2020/072543 CN2020072543W WO2020258871A1 WO 2020258871 A1 WO2020258871 A1 WO 2020258871A1 CN 2020072543 W CN2020072543 W CN 2020072543W WO 2020258871 A1 WO2020258871 A1 WO 2020258871A1
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Prior art keywords
substrate
touch
groove
touch structure
touch electrode
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PCT/CN2020/072543
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English (en)
French (fr)
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崔永鑫
黄秀颀
刘成
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云谷（固安）科技有限公司
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Application filed by 云谷（固安）科技有限公司 filed Critical 云谷（固安）科技有限公司
Publication of WO2020258871A1 publication Critical patent/WO2020258871A1/zh
Priority to US17/403,418 priority Critical patent/US20210373685A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • This application relates to the field of display technology, and in particular to a touch structure, a display panel, and a display device.
  • the display panel (Organic Light Emitting Diode, OLED for short), as a current-type light-emitting device, is favored by the market because of its good bending performance.
  • the touch electrode is an important part of the display panel, and improving its bending performance has become a key step in preparing a flexible display panel.
  • a touch structure including a substrate, touch electrodes and conductive parts.
  • the substrate has a first surface, the substrate is provided with a plurality of first grooves on the first surface, and the touch electrode is disposed on the first surface of the substrate.
  • the conductive part is arranged on the touch electrode.
  • the touch electrode is electrically connected to a peripheral circuit through the conductive portion. The conductivity of the conductive portion is greater than the conductivity of the touch structure.
  • An embodiment of the present application also provides a display panel including an organic light-emitting layer and an encapsulation layer covering the light-emitting layer.
  • the display panel also includes the aforementioned touch control structure.
  • the touch control structure is arranged inside the packaging layer or outside the packaging layer.
  • An embodiment of the present application also provides a display device including the aforementioned display panel. More specifically, the display device can be used in electronic devices such as vehicle display screens, mobile phone terminals, and ipads.
  • FIG. 1 is a schematic cross-sectional structure diagram of a touch structure provided by an embodiment of the application.
  • FIG. 2 is a schematic cross-sectional structure diagram of a touch structure provided by another embodiment of the application.
  • FIG. 3 is a schematic diagram of a cross-sectional structure of a touch structure provided by another embodiment of the application.
  • FIG. 4 is a schematic diagram of a cross-sectional structure of a first groove of a touch structure provided by an embodiment of the application.
  • FIG. 5 is a schematic cross-sectional structure diagram of a touch structure provided by another embodiment of the application.
  • FIG. 6 is a schematic diagram of a cross-sectional structure of a display panel provided by an embodiment of the application.
  • FIG. 7 is a schematic cross-sectional structure diagram of a display panel provided by another embodiment of the application.
  • the touch electrode is an important part of the display panel.
  • the touch electrode is used to sense the contact position of the user's finger or stylus with the display panel.
  • the sensitivity of the touch electrode is one of the important factors that determine the quality of the display panel.
  • ITO indium tin oxide
  • the touch electrode has the problems of poor adhesion, easy to fall off, and high resistance. Therefore, it is necessary to provide a new type of touch structure, and a display panel and a display device having the same.
  • an embodiment of the present application provides a touch structure including a substrate 11, touch electrodes 12 and conductive portions 13.
  • a number of first grooves 110 are formed on the upper surface of the base 11.
  • the touch electrode 12 is arranged on the substrate 11 conformally.
  • the conductive portion 13 is disposed above the touch electrode 12.
  • the touch electrode 12 is electrically connected to a peripheral circuit through the conductive portion 13 (not shown in the figure).
  • the conductivity of the conductive portion 13 is greater than the conductivity of the touch electrode 12.
  • the touch structure having the above structure can be combined with a display device.
  • Those skilled in the art can choose to embed the touch control structure inside the display device, or directly contact the surface of the packaging layer of the display device, or set it in the module part of the display device, and there is no further restriction here.
  • the touch electrode 12 and the substrate 11 have a larger contact area, thereby increasing the contact area between the touch electrode 12 and the substrate 11. Adhesion between the substrates 11. When the substrate 11 undergoes repeated bending and deformation, the touch electrode 12 is not easy to fall off from the substrate 11.
  • the touch electrode 12 is a silver electrode.
  • the touch electrode 12 includes a plurality of nano silver particles.
  • the average particle size of nano silver particles is several nanometers to several hundred nanometers.
  • the touch electrode 12 is obtained by coating the upper surface of the substrate 11 with a slurry containing silver nanoparticles and then curing it. By controlling the coating thickness of the slurry, the touch electrode 12 can have better light transmittance.
  • the nano silver particles are filled in the first groove 110 during the coating process.
  • the arrangement of the plurality of first grooves 110 is particularly beneficial to improve the adhesion between the touch electrode 12 formed of nano silver particles and the substrate 11.
  • the conductivity of the touch electrode 12 and the peripheral circuit is enhanced, thereby improving the sensitivity of the touch structure.
  • the substrate 11 is an electrically insulating, light-transmitting layered or plate-shaped structure.
  • the substrate 11 can be selected but not limited to a tempered glass substrate.
  • Tempered glass also known as tempered glass, is glass with compressive stress on the surface, which is obtained by strengthening the glass with a tempering method.
  • the use of toughened glass can improve the supporting ability of the substrate 11.
  • the tempered glass substrate may have an ultra-thin thickness, for example, about 100 ⁇ m to about 1.1 mm, so that it has a certain strength and a certain toughness.
  • the substrate 11 can also be selected but not limited to a flexible substrate, such as a polyimide substrate.
  • the substrate 11 may be a single layer or a multilayer substrate 11 superimposed on each other, and there is no further limitation here.
  • a first groove 110 is provided on the upper surface of the substrate 11.
  • the depth of the first groove 110 can be selected as required, but the first groove 110 cannot extend to the lower surface of the substrate 11. This is because once the first groove 110 extends to the bottom surface of the substrate 11, the adhesion of the touch structure to other components will be greatly reduced. In other words, the substrate 11 must have a complete plane, such as a lower surface, so that it can adhere to other components.
  • the first groove 110 extends to 1/3 to 1/2 of the depth of the substrate 11, that is, the groove depth of the first groove 110 is 1/3 of the thickness of the substrate 11. To 1/2, even if the substrate 11 has a complete surface, the first groove 110 provides enough space for arranging the touch electrodes 12, increasing the size of the touch electrodes 12 and the substrate. The contact area of 11 ensures the adhesion between the touch electrode 12 and the substrate 11.
  • the touch electrode 12 is arranged on the substrate 11 conformally.
  • the touch electrode 12 is electrically connected to a peripheral circuit (not shown in the figure) through a conductive portion 13 disposed above it.
  • the conductivity of the conductive portion 13 may be greater than the conductivity of the touch electrode 12.
  • the touch electrode 12 is arranged on the substrate 11 conformally, that is, a part of the touch electrode 12 is embedded in the first groove 110. Following shape means corresponding to the shape of the base 11. Compared with the flat surface contact between the touch electrode and the substrate, due to the arrangement of the first groove 110, the touch electrode 12 has a larger contact area with the substrate 11, which increases the adhesion between the two to a certain extent. Attached force.
  • the touch electrode 12 is electrically connected to the peripheral circuit through the conductive portion 13 with strong conductivity, which solves the problem of large resistance caused by the direct connection of the touch electrode 12 to an external circuit.
  • Conductivity can be represented by resistivity or conductivity.
  • the resistivity of the touch electrode 12 is greater than the resistivity of the conductive portion 13, and the electrical conductivity of the touch electrode 12 is less than the electrical conductivity of the conductive portion 13.
  • the touch electrode 12 includes a layered portion provided on the upper surface of the base 11 in addition to the portion provided in the first groove 110.
  • the laminar portion is connected with the part arranged in the first groove 110 to form an integrated laminar touch electrode 12.
  • the touch electrode 12 includes a laminar portion covering the upper surface of the substrate 11, and a plurality of protrusions corresponding to each other from the laminar portion into the plurality of first grooves 110. .
  • the protruding portion fills the first groove 110.
  • the overall thickness of the touch electrode 12, that is, the distance from the bottom of the first groove 110 to the upper surface of the touch electrode 12, may be less than 1 mm, for example, it may be tens of microns to hundreds of microns.
  • the conductive portion 13 is a conductive portion connecting the touch electrode 12 and peripheral signal lines.
  • the conductive portion 13 has good conductivity.
  • the conductive portion 13 can be made of metal material to ensure a better electrical transmission effect.
  • the first groove 110 has a small end facing the touch electrode 12 and a large end far away from the touch electrode 12.
  • the first groove 110 has a structure with a small opening and a large bottom wall area. The large area of the bottom wall of the first groove 110 allows the touch electrode 12 and the first groove to have a larger contact area, which can further ensure the adhesion of the touch electrode 12 and the second substrate 11 .
  • the cross-sectional area of the small end of the first groove 110 is not less than 1/4 of the cross-sectional area of the bottom wall of the first groove 110, and is not larger than the bottom of the first groove 110. 1/2 of the wall cross-sectional area. This is because if the opening at the small end of the first groove 110 is too small, the touch electrode 12 cannot be completely deposited into the first groove during preparation, and cannot be completely deposited into the first groove 110, resulting in The adhesion between the touch electrode 12 and the substrate 11 may deteriorate.
  • the cross section of the first groove 110 in the thickness direction of the base 11 is trapezoidal.
  • a second groove 130 is formed on the surface of the conductive portion 13 away from the touch electrode 12.
  • the peripheral circuit signal line may be partially disposed in the second groove 130.
  • the second groove 130 may not extend to the lower surface of the conductive portion 13.
  • a conductive portion 13 with a stronger conductivity than the touch electrode 12 is provided. If the second groove 130 extends to the lower surface of the conductive portion 13, it means that the electrode of the peripheral circuit directly contacts the touch electrode 12, and the conductive portion 13 does not function. The substantial electrical conductivity is contrary to the original intention of this application. Therefore, the second groove 130 may not extend to the lower surface of the conductive portion 13.
  • the depth of the second groove 130 can be selected as required.
  • the second groove 130 extends to 1/3 to 1/2 of the conductive portion 13, that is, the depth of the second groove 130 is 1/3 to 1/3 of the thickness of the conductive portion 13 1/2.
  • Peripheral circuit signal lines are arranged conformally (that is, corresponding to the shape of the conductive portion 13) above the second groove 130.
  • the wall surface of the first groove 110 has an uneven surface.
  • the wall surface of the second groove 130 has a flat surface.
  • the wall surface of the first groove 110 may be in a zigzag shape, or may be a plurality of protrusions arranged at intervals.
  • a person of ordinary skill in the art can select different or the same wall surface shape of the first groove 110 according to needs.
  • the wall surface of the first groove 110 adopts an uneven structure, mainly to increase the contact area between the touch electrode 12 and the substrate 11 to increase the adhesion between the two.
  • the wall surface of the second groove 130 adopts a flat surface, which is mainly to facilitate the arrangement of peripheral signal lines. The uneven wall surface easily leads to the clamping of the signal line and the signal line breaks.
  • the wall surface of the first groove 110 is an uneven surface
  • the wall surface of the second groove 130 is a flat surface.
  • the orthographic projection area of the conductive portion 13 on the substrate 11 is not greater than the orthographic projection area of the touch electrode 12 on the substrate 11.
  • the overlapping arrangement of the conductive portion 13 is mainly to enhance the conductivity of the touch electrode 12 and the peripheral signal circuit, so as to better realize the sensitivity of the touch signal.
  • the orthographic projection area of the conductive portion 13 on the substrate 11 is not greater than the orthographic projection area of the touch electrode 12 on the substrate 11, so that the conductive portion 13 and the touch electrode 12 can have a larger contact area. To improve the sensitivity of the touch structure to touch signals.
  • the conductivity of the conductive portion 13 is greater than the conductivity of the touch electrode 12.
  • the conductive portion 13 can be made of a metal material, for example, a silver film.
  • the thickness of the silver film ranges from 100 nm to 180 nm.
  • the substrate 11 is a composite substrate, which at least includes a first substrate 112 and a second substrate 114 stacked in sequence.
  • the second substrate 114 is disposed between the first substrate 112 and the touch electrode 12.
  • the elastic modulus of the first substrate 112 is greater than the elastic modulus of the second substrate 114.
  • the materials of the two may be the same or different.
  • the elastic modulus of the first substrate 112 may be greater than that of the second substrate 114, that is, the flexibility of the second substrate 112 is higher than that of the first substrate 114.
  • the first substrate 112 needs to have a certain rigidity to provide sufficient supporting capacity to ensure that the subsequent film layer has a flat surface during the preparation process.
  • the second substrate 114 has better flexibility and bending properties. The use of such a composite substrate not only ensures the flatness of the corresponding surface during the preparation process, but also ensures the flexibility and bending properties of the touch electrode 12.
  • the second substrate 114 is a flexible substrate, such as a polyimide substrate.
  • the touch control structure includes a plurality of touch electrodes 12 arranged at intervals, and a plurality of conductive parts 13 are arranged at intervals above each touch electrode 12.
  • the distance between the touch electrodes 12 is 20 ⁇ m to 30 ⁇ m.
  • the distance between the conductive portions 13 on the same touch electrode 12 is 1000 ⁇ m to 1500 ⁇ m.
  • the touch electrodes 12 are nano silver wire touch electrodes.
  • a display panel is further provided.
  • the display panel includes an organic light-emitting layer 20 and an encapsulation layer 30 covering the light-emitting layer 20.
  • the display panel further includes the touch structure described in any one of the above.
  • the touch control structure is arranged inside the packaging layer 30 or outside the packaging layer 30.
  • the touch control structure is arranged on the upper surface of the packaging layer 30 in direct contact.
  • the packaging layer 30 is a thin film packaging structure.
  • the thin film packaging structure can be used as the substrate 11 of the touch structure, without the need to additionally provide the substrate 11, which is beneficial to reduce the thickness of the display panel, thereby improving the bending performance of the display panel.
  • the thin film packaging structure includes a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer stacked in sequence.
  • the use of the film packaging structure can better block water and oxygen from destroying the display organic light-emitting material layer, thereby increasing the service life of the display panel.
  • the display panel of the present application can be applied to AMOLED display panels, Micro-OLED display panels, and quantum dot display panels. At the same time, the display panel can also be applied to various display devices such as smart phones, tablet computers, vehicle display devices, wearable display products, etc.

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Abstract

本申请涉及一种触控结构、显示面板及其显示装置。触控结构包括基底、触控电极和导电部。所述基底具有第一表面，所述基底在所述第一表面开设若干第一凹槽。所述触控电极，设置在所述基底的所述第一表面。所述导电部设置在所述触控电极上。所述触控电极通过所述导电部与外围电路电连接。所述导电部的导电能力大于所述触控结构的导电能力。

Description

触控结构、显示面板及显示装置
相关申请
本申请要求2019年06月28日申请的，申请号为201910578708.8，名称为“触控结构、显示面板及其显示装置”的中国专利申请的优先权，在此将其全文引入作为参考。
技术领域
本申请涉及显示技术领域，尤其涉及一种触控结构、显示面板及显示装置。
背景技术
显示面板(Organic Light Emitting Diode，简称OLED)作为一种电流型发光器件，因其具有较好的弯折性能备受市场青睐。触控电极作为显示面板的重要组成部分，提高其弯折性能成为制备柔性显示面板的关键一步。
发明内容
有鉴于此，本申请一方面提供了一种触控结构，包括基底、触控电极以及导电部。所述基底具有第一表面，所述基底在所述第一表面开设若干第一凹槽，所述触控电极设置在所述基底的所述第一表面。所述导电部设置在所述触控电极上。所述触控电极通过所述导电部与外围电路电连接。所述导电部的导电能力大于所述触控结构的导电能力。
本申请实施例还提供了一种显示面板，包括有机发光层以及覆盖所述发光层的封装层。所述显示面板还包括上述触控结构。所述触控结构设置在封装层内或者设置在封装层外。
本申请实施例还提供一种显示装置，包括前述显示面板。更具体的，该显示装置可以用于车载显示屏、手机终端、ipad等电子设备。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更清楚地说明本申请实施，下面将对实施例中所使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的实施例的示意图，对于本领域普通技术人员来说，在不付出创造性劳动的前提下，还可以根据提供的附图获得其它的附图。
图1为本申请的一实施例提供的触控结构的截面结构示意图。
图2为本申请的另一实施例提供的触控结构的截面结构示意图。
图3为本申请的另一个实施例提供的触控结构的截面结构示意图。
图4为本申请一实施例提供的触控结构的第一凹槽的截面结构示意图。
图5为本申请的另一实施例提供的触控结构的截面结构示意图。
图6为本申请的一实施例提供的显示面板的截面结构示意图。
图7为本申请的另一个实施例提供的显示面板的截面结构示意图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
正如背景技术所述，随着技术不断进步，OLED柔性终端电子设备越来越受到人们的青睐。为了实现终端电子设备的柔性，传统设备的结构都面临着重大的考验。其中，触控电极是显示面板的重要组成部分。触控电极用于感测用户手指或触控笔与显示面板的接触位置。触控电极的灵敏度是决定显示面板质量的重要因素之一。随着折叠显示面板的发展、传统的氧化铟锡(ITO)触控电极因成本高、耐弯折性能差逐渐不能满足性能需求。而且，触控电极存在着粘附性差、容易脱落、电阻大的问题。因此，有必要提供一种新型触控结构，以及具有其的显示面板和显示装置。
请参阅图1，本申请实施例提供一种触控结构，包括基底11，触控电极12以及导电部13。所述基底11上表面开设有若干第一凹槽110。触控电极12随形设置在所述基底11上。所述导电部13设置在所述触控电极12的上方。所述触控电极12通过所述导电部13与外围电路电连接(图中未标出)。所述导电部13的导电能力大于所述触控电极12的导电能力。
具有上述结构的所述触控结构可以与显示器件组合在一起。本领域技术人员可以选择将触控结构嵌入在显示器件内部，也可以直接接触设置在显示器件封装层的表面，也可以设置在显示器件的模组部，此处不做进一步的限制。
具有上述结构的所述触控结构，由于在基底11上表面形成了多个第一凹槽110，从而使得触控电极12与基底11有更大的接触面积，进而提高了触控电极12与基底11之间的粘附性。在基底11发生反复的弯折变形时触控电极12不易从基底11上脱落。
可选的，触控电极12为银电极。具体的，触控电极12包括多个纳米银颗粒。纳米银颗 粒的平均粒径为几纳米至几百纳米。在一实施例中，触控电极12由含有纳米银颗粒的浆料涂覆在基底11的上表面后固化得到。通过控制浆料的涂覆厚度可使触控电极12具有较好的透光性。纳米银颗粒在涂覆的过程中填充在第一凹槽110中。多个第一凹槽110的设置特别有利于提高纳米银颗粒形成的触控电极12与基底11之间的粘附性。
另外，通过导电能力相对于触控电极12更强的导电部13的设置，增强了触控电极12与外围电路的导电能力，从而提高了触控结构的灵敏度。
可选的，基底11为电绝缘的透光的层状或板状结构。基底11可以选择但不限于钢化玻璃基底。强化玻璃又称钢化玻璃，是表面具有压应力的玻璃，采用钢化方法对玻璃进行增强处理得到。采用钢化玻璃能够提高基底11的支撑能力。钢化玻璃基底可具有超薄的厚度，例如约100μm至约1.1mm，使其具有一定的强度同时又兼具一定的韧性。基底11还可以选择但不限于柔性基底，如聚酰亚胺衬底。基底11可以是单层的或相互叠加的多层基底11，此处不做进一步的限定。
可选地，在基底11的上表面设置第一凹槽110。所述第一凹槽110的深度可以根据需要选择，但是所述第一凹槽110不能延伸至所述基底11的下表面。这是因为，一旦所述第一凹槽110延伸至所述基底11的下表面，该触控结构与其它元件的粘附性将会大大下降。换言之，所述基底11必须具有一完整的平面，例如下表面，使其与其它元件粘附。在一实施例中，所述第一凹槽110延伸至所述基底11的1/3至1/2深度处，即所述第一凹槽110的槽深为基底11的厚度的1/3至1/2，既使所述基底11具有完整的一表面，所述第一凹槽110又提供足够的空间用于设置触控电极12，增大了所述触控电极12与所述基底11的接触面积，保证了所述触控电极12与所述基底11的粘附性。
可选地，所述触控电极12随形设置在所述基底11上。所述触控电极12通过设置在其上方的导电部13与外围电路电连接(图中未标出)。所述导电部13的导电能力可大于所述触控电极12的导电能力。所述触控电极12随形设置在所述基底11上即触控电极12一部分嵌设在第一凹槽110内。随形为对应所述基底11的形状之意。与触控电极与基底的平坦平面接触相比，由于第一凹槽110的设置，使得所述触控电极12与所述基底11有更大的接触面积，一定程度上增加了两者的粘附力。另外，所述触控电极12通过导电能力较强的导电部13与外围电路电连接，解决了因触控电极12与为外部电路直接连接而带来的电阻较大的问题。导电能力可以由电阻率或电导率表示。在一实施例中，所述触控电极12的电阻率大于所述导电部13的电阻率，所述触控电极12的电导率小于所述导电部13的电导率。
在一实施例中，所述触控电极12除设置在第一凹槽110内的部分，还包括设置在所述基 底11上表面的层状部。所述层状部与设置在第一凹槽110内的部分相连，形成一体的层状的触控电极12。换言之，所述触控电极12包括覆盖在所述基底11上表面的层状部，以及从所述层状部向多个第一凹槽110内一一对应的凸出的多个凸出部。在一实施例中，所述凸出部填满所述第一凹槽110。在一实施例中，所述触控电极12整体的厚度，即从第一凹槽110底部到触控电极12上表面的距离，可小于1毫米，例如可以为几十微米至几百微米。
可选地，所述导电部13为连接触控电极12与外围信号线的传导部。导电部13具有较好的导电能力。所述导电部13可以选择金属材质，以保证较好的电传输效果。
请参阅图2，可选地，至少部分所述第一凹槽110具有朝向所述触控电极12的小端和远离所述触控电极的大端。换言之，所述第一凹槽110具有开口小，底壁面积大的结构。第一凹槽110的底壁面积大使得随形设置的触控电极12与第一凹槽具有更大的接触面积，从而能够更进一步的保证触控电极12与第二基底11的粘附性。
在一实施例中，所述第一凹槽110的小端的横截面积不小于所述第一凹槽110的底壁横截面积的1/4，不大于所述第一凹槽110的底壁横截面积的1/2。这是因为如果第一凹槽110的小端的开口过小，会导致触控电极12在制备的时候无法完全沉积到第一凹槽内，不能完全沉积到所述第一凹槽110内，导致所述触控电极12与所述基底11的粘附性会变差。
更进一步的，所述第一凹槽110在所述基底11厚度方向上的截面呈梯形。
可选地，请参阅图3，所述导电部13远离所述触控电极12的表面上开设有第二凹槽130。外围电路信号线可部分设置在所述第二凹槽130中。同样的，所述第二凹槽130不可以延伸至所述导电部13的下表面。正如前述所言，为了提高所述触控电极12的导电能力，设置了相对于触控电极12导电能力更强的导电部13。如果所述第二凹槽130延伸至所述导电部13的下表面，这就意味着，所述外围电路的电极直接与所述触控电极12接触，则所述导电部13并未起到实质的导电能力，这与本申请的初衷是相违背的。因此，所述第二凹槽130不可以延伸至所述导电部13的下表面。所述第二凹槽130的深度可以根据需要选择。在一实施例中，所述第二凹槽130延伸至导电部13的1/3至1/2处，即所述第二凹槽130的槽深为导电部13的厚度的1/3至1/2。在所述第二凹槽130的上方随形(也就是对应所述导电部13的形状)设置外围电路信号线。
可选地，所述第一凹槽110的壁面具有不平坦表面。可选地，所述第二凹槽130的壁面具有平坦表面。请参阅图4，所述第一凹槽110的壁面可以是呈锯齿状，也可以是若干间隔呈若干间隔排布的凸起。本领域普通技术人员可以根据需要选择不同或相同的第一凹槽110的壁面形态。所述第一凹槽110的壁面采用不平坦结构，主要是为了增加所述触控电极12与 所述基底11的接触面积以增大两者之间的粘附性。所述第二凹槽130的壁面采用平坦表面，主要是利于外围信号线设置。不平坦的壁面容易导致信号线的夹持以致信号线断裂。在一实施例中，所述第一凹槽110的壁面为不平坦表面，所述第二凹槽130的壁面为平坦表面。
可选地，所述导电部13在所述基底11上的正投影面积不大于所述触控电极12在所述基底11上的正投影面积。采用导电部13的搭接设置主要是增强触控电极12与外围信号线路的导电能力，以更好的实现触控信号的灵敏度。所述导电部13在所述基底11上正投影面积不大于所述触控电极12在所述基底上11的正投影面积，可以使导电部13与触控电极12具有较大的接触面积，以提高触控结构对触控信号的灵敏度。
可选地，所述导电部13的导电能力大于所述触控电极12的导电能力。所述导电部13可以选择金属材质，例如可以是银膜。银膜的厚度范围为100nm至180nm。
请参阅图5，可选地，所述基底11为复合基底，至少包括依顺序层叠设置的第一基底112和第二基底114。第二基底114设置在第一基底112与触控电极12之间。所述第一基底112的弹性模量大于所述第二基底114的弹性模量。关于第一基底112和第二基底114，两者的材质可以相同也可以不同。
在柔性屏的结构中，为了保持柔性屏良好的弯折性能，第一基底112的弹性模量可大于第二基底114的弹性模量，即第二基底112的柔韧性高于第一基底114。第一基底112需要具备一定的刚度以提供足够的支撑能力保证后续膜层的制备过程中具有平整的表面。第二基底114具有更好的柔韧性、弯折性。采用这样的复合基底，既保证了制备过程中相应表面的平整性又保证了触控电极12的柔韧性、弯折性。
在一实施例中，所述第二基底114为柔性基底，如聚酰亚胺基底。
在一实施例中，所述触控结构包括若干间隔排布的触控电极12，每个触控电极12的上方均间隔排布的设置有多个所述导电部13。
在一实施例中，若干所述触控电极12的间距为20μm至30μm。
在一实施例中，同一触控电极12上的若干所述导电部13的间距为1000μm至1500μm。
可选地，所述触控电极12为纳米银线触控电极。
请参阅图6，本申请的一个实施例中，还提供一种显示面板，所述显示面板包括有机发光层20以及覆盖所述发光层20的封装层30。所述显示面板还包括上述任一项所述的触控结构。所述触控结构设置在封装层30内或者设置在封装层30外。
可选地，所述触控结构直接接触设置在所述封装层30上表面。
可选地，所述的封装层30为薄膜封装结构。请参阅图7，所述薄膜封装结构可以作为所 述触控结构的基底11，而不必另外设置基底11，这样有利于显示面板厚度的减少，进而提高显示面板的弯折性能。
可选地，所述薄膜封装结构包括依顺序层叠设置的第一无机封装层、有机封装层和第二无机封装层。采用该薄膜封装结构能够更好的阻隔水氧破坏显示有机发光材料层，进而提高显示面板的使用寿命。
本申请的显示面板可以应用AMOLED显示面板、Micro-OLED显示面板、量子点显示面板。同时，该显示面板也可以应用于各种显示装置如智能手机、平板电脑、车载显示装置、穿戴显示产品等。
本申请在描述位置关系时，除非另有描述，否则当一元件例如层、膜或基板被指为在另一膜层“上”时，其能直接在其他膜层上或亦可存在中间膜层。进一步说，当层被指为在另一层“下”时，其可直接在下方，亦可存在一或多个中间层。亦可以理解的是，当层被指为在两层“之间”时，其可为两层之间的唯一层，或亦可存在一或多个中间层。本申请在描述位置关系时，术语“上”、“下”为基于附图所示的方位或位置关系，仅是为了便于简化描述，而不是指示或暗示所指的装置或元件必须位于“上”或“下”，因此不能理解为对本申请技术方案的限制。
在使用本申请中描述的“包括”、“具有”、和“包含”的情况下，除非使用了明确的限定用语，例如“仅”、“由……组成”等，否则还可以添加另一部件。除非相反地提及，否则单数形式的术语可以包括复数形式，并不能理解为其数量为一个。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (19)

  1. 一种触控结构，其中，包括：
    基底，所述基底具有第一表面，所述基底在所述第一表面开设若干第一凹槽，
    触控电极，设置在所述基底的所述第一表面，及
    导电部，设置在所述触控电极上，所述触控电极通过所述导电部与外围电路电连接，所述导电部的导电能力大于所述触控电极的导电能力。
  2. 根据权利要求1所述的触控结构，其中，所述触控电极为银电极。
  3. 根据权利要求1所述的触控结构，其中，所述第一凹槽的深度为所述基底厚度的1/3至1/2。
  4. 根据权利要求1所述的触控结构，其中，所述第一凹槽的壁面具有不平坦表面。
  5. 根据权利要求1所述的触控结构，其中，所述若干第一凹槽中的至少一个或多个朝向所述触控电极的端面的面积小于远离所述触控电极的端面的面积。
  6. 根据权利要求1所述的触控结构，其中，所述第一凹槽在所述基底厚度方向上的截面呈梯形。
  7. 根据权利要求1所述的触控结构，其中，所述导电部远离所述触控电极的表面上开设有第二凹槽。
  8. 根据权利要求7所述的触控结构，其中，所述第二凹槽的深度为所述导电部厚度的1/3至1/2。
  9. 根据权利要求7所述的触控结构，其中，所述第二凹槽的壁面具有平坦表面。
  10. 根据权利要求7所述的触控结构，其中，还包括所述外围电路，所述外围电路包括信号线，所述信号线部分设置在所述第二凹槽中。
  11. 根据权利要求1所述的触控结构，其中，所述导电部在所述基底上正投影面积小于或等于所述触控电极在所述基底上的正投影面积。
  12. 根据权利要求1所述的触控结构，其中，所述导电部材质为金属。
  13. 根据权利要求1所述的触控结构，其中，所述基底为复合基底，至少包括层叠设置的第一基底和第二基底，所述第二基底设置在所述第一基底和所述触控电极之间，所述第一基底的弹性模量大于所述第二基底的弹性模量，所述第二基底远离所述第一基底的表面设置有所述第一凹槽。
  14. 根据权利要求13所述的触控结构，其中，所述第二基底为柔性基底。
  15. 根据权利要求1所述的触控结构，其中，所述触控电极的数量为多个，多个所述触控电极相互间隔的设置在所述基底的所述第一表面。
  16. 根据权利要求15所述的触控结构，其中，所述导电部的数量为多个，每个触控电极上均间隔设置多个所述导电部。
  17. 根据权利要求1所述的触控结构，其中，所述触控电极包括覆盖在所述基底的所述第一表面的层状部，以及从所述层状部向所述若干第一凹槽内一一对应凸出的若干凸出部。
  18. 一种显示面板，其中，所述显示面板包括有机发光层以及覆盖所述发光层的封装层，所述显示面板还包括如权利要求1所述的触控结构，所述触控结构设置在封装层内或者设置在封装层外。
  19. 一种显示装置，其中，包括如权利要求18所述的显示面板。
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