WO2020253654A1 - Oled显示基板、显示面板及其制作方法、显示装置 - Google Patents

Oled显示基板、显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2020253654A1
WO2020253654A1 PCT/CN2020/096174 CN2020096174W WO2020253654A1 WO 2020253654 A1 WO2020253654 A1 WO 2020253654A1 CN 2020096174 W CN2020096174 W CN 2020096174W WO 2020253654 A1 WO2020253654 A1 WO 2020253654A1
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Prior art keywords
layer
area
display area
display
retaining wall
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PCT/CN2020/096174
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English (en)
French (fr)
Inventor
罗程远
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京东方科技集团股份有限公司
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Priority to US17/283,972 priority Critical patent/US20210351387A1/en
Publication of WO2020253654A1 publication Critical patent/WO2020253654A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present disclosure relates to the field of display technology, and in particular to an OLED display substrate, a display panel, a manufacturing method thereof, and a display device.
  • OLED Organic Light-Emitting Diode
  • the embodiments of the present disclosure provide an OLED display substrate, a display panel, a manufacturing method thereof, and a display device.
  • At least one embodiment of the present disclosure provides an OLED display panel, which includes:
  • a display substrate having a display area and a non-display area surrounding the display area
  • a retaining wall, the retaining wall is located in the non-display area and surrounds the display area;
  • a residual layer, the residual layer is located between the retaining wall and the display area;
  • a plurality of light emitting structures, the plurality of light emitting structures are located in the display area;
  • An encapsulation structure encapsulates the plurality of light-emitting structures and is connected to the residual layer and the display substrate.
  • the residual layer is made of a soluble material that is soluble in a solvent, and the organic light-emitting functional layer of the light-emitting structure is insoluble in the solvent.
  • the soluble material includes at least one of the following materials: polyethylene glycol, polycaprolactone, polyvinyl alcohol, polyvinylpyrrolidone, and polymethylmethacrylate.
  • the residual layer includes residual parts dispersed in a plurality of intervals between the retaining wall and the display area.
  • the display panel further includes a pixel defining layer located in the display area; or, the pixel defining layer is located in an area enclosed by the retaining wall, and the pixel defining layer is located in the display area.
  • a plurality of auxiliary pixel areas are defined in an area between the barrier wall and the display area, and the residual layer is located in the auxiliary pixel area.
  • the pixel defining layer and the retaining wall are on the same layer.
  • the display panel further includes a water and oxygen barrier layer located in the non-display area, and the water and oxygen barrier layer covers the surface of the retaining wall.
  • the water and oxygen barrier layer also covers the surface of the display substrate located on at least one side of the retaining wall.
  • the packaging structure includes:
  • the packaging cover plate is arranged opposite to the display substrate
  • the packaging glue is bonded between the display substrate and the packaging cover, and is located in the non-display area in the non-display area and at least partially in the auxiliary area.
  • At least one embodiment of the present disclosure provides an OLED display substrate, which includes:
  • a display substrate having a display area and a non-display area surrounding the display area
  • a retaining wall located in the non-display area and surrounding the display area;
  • the sacrificial layer is located between the retaining wall and the display area;
  • a plurality of light-emitting structures located in the display area, and the light-emitting structure includes an organic light-emitting functional layer;
  • the organic layer is located on the sacrificial layer and is the same layer as the organic light-emitting function layer.
  • the sacrificial layer is made of a soluble material that is soluble in a solvent, and the organic light-emitting functional layer of the light-emitting structure is insoluble in the solvent.
  • the soluble material includes at least one of the following materials: polyethylene glycol, polycaprolactone, polyvinyl alcohol, polyvinylpyrrolidone, and polymethylmethacrylate.
  • the OLED display substrate further includes: a pixel defining layer, the pixel defining layer is located in the display area; or, the pixel defining layer is located in an area enclosed by the retaining wall, and the pixel defining layer is located A plurality of auxiliary pixel areas are defined in an area between the barrier wall and the display area, and the sacrificial layer is located in the auxiliary pixel area.
  • the OLED display substrate further includes a water and oxygen barrier layer located in the non-display area, and the water and oxygen barrier layer covers the surface of the retaining wall.
  • the water and oxygen barrier layer also covers the surface of the display substrate located on at least one side of the retaining wall.
  • At least one embodiment of the present disclosure provides a manufacturing method of an OLED display panel, the method including:
  • a barrier wall on a display substrate, the display substrate having a display area and a non-display area surrounding the display area, and the barrier wall is located in the non-display area and surrounds the display area;
  • the display substrate is packaged to form an encapsulation structure on the display substrate, the encapsulation structure covers the plurality of light emitting structures and is connected to the residual layer and the display substrate.
  • the removing the printing film layer on the sacrificial layer includes:
  • the imprinting mold includes a printing plate adapted to the printing film layer on the sacrificial layer, and an adhesive is provided on the printing plate for adhering to the sacrificial layer.
  • Print film is provided on the printing plate for adhering to the sacrificial layer.
  • the forming a retaining wall on the display substrate includes:
  • the pixel defining layer is located in the display area; or, the pixel defining layer is located in the area enclosed by the retaining wall, and the pixel defining layer is in the area between the retaining wall and the display area A plurality of auxiliary pixel areas are defined.
  • At least one embodiment of the present disclosure provides a display device including any of the aforementioned OLED display panels.
  • FIG. 1 is a schematic diagram of a top view structure of an OLED display substrate provided by an embodiment of the disclosure
  • FIG. 2 is a schematic diagram of a cross-sectional structure of the OLED display substrate shown in FIG. 1 along the line A-A;
  • FIG. 3 is another schematic cross-sectional structure diagram of the OLED display substrate shown in FIG. 1 along the line A-A;
  • FIG. 4 is a schematic top view of another OLED display substrate provided by an embodiment of the disclosure.
  • FIG. 5 is a schematic diagram of a cross-sectional structure of the OLED display substrate shown in FIG. 4 along the line B-B;
  • FIG. 6 is a schematic diagram of a hierarchical structure of a display area of an OLED display substrate provided by an embodiment of the disclosure
  • FIG. 7 is a schematic structural diagram of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 8 is a schematic top view of the OLED display panel shown in FIG. 7 after the packaging structure is removed;
  • FIG. 9 is a schematic flowchart of a manufacturing method of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 10 is a schematic structural diagram of an imprint mold used in a manufacturing method of an OLED display panel provided by an embodiment of the disclosure.
  • inkjet printing technology is usually used to form the organic light-emitting functional layer.
  • it is an indispensable step to remove the solvent in the ink through subsequent processes, so as to dry the solute to form the required film.
  • the display area Since the solvent atmosphere of the sub-pixel structure at the edge of the display area of the display substrate is different from the solvent atmosphere of the sub-pixel structure in the middle of the display area (the solvent concentration at the edge of the display area is lower than the solvent concentration in the middle of the display area), the display area The solvent at the edge of the display area evaporates faster than the solvent in the middle of the display area, so that the drying degree of the film in the middle and the edge area of the display area is different, resulting in poor uniformity of the organic light-emitting function layer in the display area, which affects the display effect .
  • an auxiliary area (Dummy area) is provided in the non-display area of the display substrate.
  • the sub-pixel structure of the auxiliary area is the same as the sub-pixel structure of the display area.
  • Ink droplets also drip into the auxiliary area during printing, increasing the edge of the display area.
  • the solvent atmosphere makes the film layers in the middle and edge regions of the display area have the same degree of drying, thereby improving the uniformity of the organic light-emitting functional layer in the display area, and thereby improving the display effect.
  • a printing film layer is formed on the display substrate corresponding to the auxiliary area, and the printing film layer cannot be peeled off from the display substrate after film formation. If the packaging is directly performed on the printing film layer, the printing film layer will form a path for water and oxygen to enter after the packaging.
  • the OLED device on the display substrate will be corroded and damaged under the action of water vapor and oxygen, which will affect the packaging of the display substrate. effect.
  • the encapsulation area can only be set to avoid the area where the printing film layer is located, that is, the encapsulation area needs to be set on the periphery of the auxiliary area, which will cause the non-destructive effect of the OLED display panel.
  • the display area has a large area, which is not conducive to the narrow frame design of the display device.
  • FIG. 1 is a schematic top view of an OLED display substrate provided by an embodiment of the present disclosure.
  • the OLED display substrate includes a display substrate 1.
  • the display substrate 1 has a display area a and a non-display area b surrounding the display area a.
  • the display area a is used for displaying images
  • the non-display area b surrounds the periphery of the display area a.
  • the OLED display panel also includes a retaining wall 2 and a plurality of light emitting structures 4.
  • the retaining wall 2 is located in the non-display area b and surrounds the display area a.
  • the auxiliary area b1 the area between the retaining wall 2 and the display area a is called the auxiliary area b1, that is, the non-display area b includes the auxiliary area b1, and the auxiliary area b1 surrounds the edge of the display area a.
  • the wall 2 is arranged around the outer edge of the auxiliary area b1.
  • the multiple light-emitting structures 4 are located in the display area a, and the display substrate 1 realizes the display of the screen by controlling the multiple light-emitting structures 4 to emit light.
  • a plurality of light emitting structures 4 are arranged in an array in the display area a.
  • the plurality of light emitting structures 4 may include light emitting structures 4 of multiple colors, such as a red light emitting structure 4, a blue light emitting structure 4, and a green light emitting structure 4.
  • Each light-emitting structure 4 corresponds to a sub-pixel structure, and multiple sub-pixel structures constitute a pixel structure.
  • each light-emitting structure 4 includes two electrode layers and an organic light-emitting function layer located between the two electrode layers.
  • FIG. 2 is a schematic diagram of a cross-sectional structure of the OLED display substrate shown in FIG. 1 along the line A-A.
  • the OLED display substrate further includes a sacrificial layer 3 a and an organic layer 8.
  • the sacrificial layer 3a is located between the barrier wall 2 and the display area a, that is, in the auxiliary area b1, and the organic layer 8 is located on the sacrificial layer 3a.
  • the organic layer 8 is the same layer as the organic light-emitting functional layer of the light-emitting structure 4.
  • the same layer refers to the organic light-emitting functional layer that simultaneously forms the organic layer 8 and the light-emitting structure 4 by inkjet printing.
  • the sacrificial layer 3a is used to separate the organic layer 8 formed in the auxiliary area b1 by inkjet printing.
  • the OLED display substrate further includes a pixel defining layer 6.
  • the pixel defining layer 6 defines a plurality of pixel regions (also called opening regions) 6a in the display region a, and each pixel region 6a has a light emitting structure 4 in it.
  • the auxiliary area b1 is an annular area surrounding the display area a defined by the barrier wall 2 and the pixel definition layer 5, and the organic layer 8 is formed in the entire annular area.
  • the annular area is a part of the non-display area b, and is used for inkjet printing together with the display area b of the display substrate 1 during inkjet printing.
  • the retaining wall 2 is used to limit the area range of the auxiliary area b1 and prevent ink from spreading to the outside of the auxiliary area b1 during inkjet printing, so as to avoid pollution and damage to the equipment environment and the binding area.
  • the edge of the printing area expands to the auxiliary area b1 outside the display area a, that is, the coverage of the printing area is increased, which can increase the solvent atmosphere at the edge of the display area a. Therefore, the difference in the degree of drying of the film in the middle part and the edge part of the display area a is reduced, so that the uniformity of the printing film in the display area a of the display substrate 1 is higher, and the display effect of the display panel is ensured.
  • the packaging structure is directly formed on the organic light-emitting function layer, in the subsequent use of the display substrate, the junction of the organic light-emitting function layer and the packaging structure may separate, resulting in Package failure.
  • an encapsulation structure is directly formed on the organic light-emitting functional layer. After the encapsulation, the organic light-emitting functional layer will form a path for water and oxygen to enter.
  • the OLED device on the display substrate will be corroded and damaged under the action of water vapor and oxygen. Show the packaging effect of the substrate.
  • the printing film layer (that is, the aforementioned organic layer 8) of the auxiliary area b1 needs to be removed. Since the sacrificial layer 3a is provided in the auxiliary area b1, the sacrificial layer 3a is located in the area enclosed by the barrier wall 2 and is formed on the surface of the display substrate 1. The sacrificial layer 3a can carry printing ink during inkjet printing. And the role of removing the organic layer 8 after drying to form the organic layer 8. In the process of removing the organic layer 8, the sacrificial layer 3a will be partially or completely peeled off from the display substrate 1. The material of the sacrificial layer 3a will not affect the packaging effect. After the organic layer 8 is removed, the auxiliary area b1 is coated with packaging glue That is, the display substrate can be packaged, which can meet the narrow frame design requirements of the display panel.
  • the auxiliary area b1 and the packaging area of the non-display area b at least partially overlap, that is, the auxiliary area b1 is also used for packaging the OLED display substrate.
  • the range of the auxiliary area b1 may be equal to the area range that the packaging area should occupy, or the range of the auxiliary area b1 may also be smaller than the range occupied by the packaging area, and the specific range of the auxiliary area b1 may be set according to actual conditions to reduce For the frame size of the small display panel, the setting range of the auxiliary area b1 does not exceed the outer edge of the packaging area.
  • the barrier wall 2 described above can be formed on the display substrate 1 by photolithography using photosensitive resin organic materials.
  • the material and manufacturing process of the barrier wall 2 are not limited to this.
  • the retaining wall 2 can have a variety of specific settings.
  • the height of the retaining wall 2 may be 1 ⁇ m-3 ⁇ m, and the width of the retaining wall may be 10 ⁇ m-20 ⁇ m.
  • the specific value of the height of the retaining wall 2 can be set according to actual needs, so as to achieve that the ink jet will not spray to the area other than the auxiliary area b1 during the ink jet printing process.
  • the retaining wall 2 and the pixel defining layer 6 can be arranged in the same layer.
  • the same layer arrangement refers to the formation of the same patterning process in order to simplify the manufacturing process.
  • a typical patterning process refers to a process of applying a mask once to expose, develop, etch, and remove the photoresist.
  • the material of the pixel defining layer 6 is a non-photosensitive material, after exposure and development, the area where the opening is to be formed exposed by the photoresist needs to be etched to form the opening (that is, the aforementioned pixel area).
  • the material of the pixel defining layer 6 is a photosensitive material, the material of the pixel defining layer can be exposed and developed directly to form an opening.
  • the barrier wall 2 in order to prevent water vapor and oxygen from entering the display area a along the path formed by the part of the barrier wall 2 after the OLED display substrate 1 is packaged, the barrier wall 2 may be provided to block water and oxygen.
  • the water and oxygen barrier layer 7 is used to improve the packaging effect of the OLED display substrate 1 and ensure the reliability of the packaging.
  • the material of the water and oxygen barrier layer 7 can be SiN x , SiO 2 , SiC, AL 2 O 3 , ZnS, ZnO and other materials that have the function of blocking water vapor and oxygen, and can be through chemical vapor deposition (CVD), sputtering It is formed by radiation, atomic layer deposition (ALD) and other methods.
  • the thickness of the water and oxygen barrier layer 7 may be 0.05 ⁇ m-2.5 ⁇ m.
  • the water and oxygen barrier layer 7 only covers the surface of the retaining wall 2.
  • the water and oxygen barrier layer 7 in addition to covering the surface of the retaining wall 2, can also cover the upper surface of the display substrate 1 on both sides of the retaining wall 2. Therefore, the auxiliary packaging structure can be further used to effectively block water vapor and oxygen for the display device on the display substrate 1.
  • the sacrificial layer 3a can be made of a soluble material, so that after the printing film layer 4 is formed, the sacrificial layer 3a can be dissolved and softened by a corresponding solvent. As the sacrificial layer 3a softens, the sacrificial layer 3a can be softened. The printing film layer 4 on 3a is removed.
  • the sacrificial layer 3a can have a variety of specific arrangements, which are intended to realize the separation of the printing film layer 4 from the display substrate 1 and ensure the packaging effect of the display substrate 1.
  • the sacrificial layer 3a may be made of a soluble material that is soluble in a solvent, and the organic light-emitting functional layer of the light-emitting structure is insoluble in the solvent. In this way, when the sacrificial layer 3a is dissolved by the solvent, the organic layer 8 can maintain the entire layer structure, so that the entire layer structure can be removed from the display substrate 1.
  • the sacrificial layer 3a is made of a soluble resin, plastic or rubber material.
  • the selected material can be dissolved by a corresponding solvent to obtain a liquid material, and then the liquid material can be filled in the auxiliary area b1 by spin coating, printing, spraying, etc., and located in the area enclosed by the retaining wall 2.
  • the sacrificial layer 3a is formed by curing after drying to remove the solvent.
  • the above-mentioned solvent can be dropped along the inner side of the retaining wall 2 and/or on the surface of the organic layer 8.
  • the solvent can pass through the mesh pores of the organic layer 8
  • the layer 3a penetrates, so that the sacrificial layer 3a can be dissolved and softened.
  • the organic layer 8 can be peeled from the display substrate 1, and the organic layer 8 can be removed from the display substrate 1 to facilitate in the auxiliary area b1 performs packaging operations.
  • the material of the sacrificial layer 3a may be one or more of polyethylene glycol, polycaprolactone, polyvinyl alcohol, polyvinylpyrrolidone, polymethyl methacrylate, etc., for dissolving the sacrificial layer 3a
  • the solvent can be ethanol, isopropanol, acetone and so on.
  • FIG. 4 is a schematic structural diagram of an OLED display substrate provided by another embodiment of the disclosure.
  • the structure of the OLED display substrate shown in FIG. 4 is the same as the structure substrate of the OLED display substrate shown in FIG. 1, except that, in the OLED display substrate shown in FIG. 4, the pixel defining layer 6 is surrounded by the barrier wall 2. Within the area, that is, the pixel defining layer 6 is located in the display area a and the auxiliary area b1 at the same time.
  • Fig. 5 is a schematic cross-sectional structure diagram of the display substrate shown in Fig. 4 along the line B-B.
  • the pixel defining layer 6 defines a plurality of pixel areas 6 a in the display area a, and each pixel area 6 a includes a light emitting structure 4.
  • the pixel defining layer 6 defines a plurality of auxiliary pixel areas 6b in the auxiliary area b1.
  • the sacrificial layer 3a and the organic layer 8 are located in the auxiliary pixel region 6b.
  • the OLED display substrate includes a display substrate 1, and an anode layer 41, a pixel defining layer 6, an organic light emitting function layer 42 and a cathode layer 43 on the display substrate 1.
  • the anode layer 41, the organic light-emitting functional layer 42 and the cathode layer 43 are sequentially laminated on the display substrate 1 to form the light-emitting structure 4.
  • the organic light emitting functional layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked.
  • the hole injection layer is connected to the anode, and the electron injection layer is connected to the cathode.
  • the display substrate 1 includes a base substrate 10 and a Thin Film Transistor (TFT) array structure layer 11, a protective layer 12, and a planarization layer 13 sequentially located on the base substrate 10.
  • TFT array structure layer 11 includes a plurality of TFTs 110, each light-emitting structure 4 corresponds to at least two TFTs 110, and each light-emitting structure 4 and the corresponding TFT 110 form a sub-pixel structure.
  • the TFT 110 includes a gate 111, a gate insulating layer 112, an active layer 113, a source 114, and a drain 115.
  • the gate insulating layer 112 covers the gate 111 and the active layer 113 is on the gate insulating layer 111.
  • the source 114 and the drain 115 are respectively connected to the active layer 113, and the drain 115 is connected to the anode 41.
  • the bottom gate structure is taken as an example to illustrate the structure of the TFT as an example.
  • the embodiments of the present disclosure may also adopt other structures of TFTs, which are not limited in the present disclosure.
  • FIG. 7 is a schematic structural diagram of an OLED display panel provided by an embodiment of the disclosure. As shown in FIG. 7, the OLED display panel includes a display substrate 1, a barrier wall 2, a residual layer 3, a plurality of light-emitting structures 4, and an encapsulation structure 5.
  • FIG. 8 is a schematic top view of the OLED display panel shown in FIG. 7 after the packaging structure is removed.
  • the display substrate 1 has a display area a and a non-display area b surrounding the display area a; a plurality of light emitting structures 4 are located in the display area a; the barrier wall 2 is located in the non-display area b and surrounds the display area a ; The residual layer 3 is located between the retaining wall 2 and the display area a.
  • the structure shown in FIG. 8 is the structure obtained after removing the printing film layer on the sacrificial layer of the OLED display substrate shown in FIG. 2.
  • the residual layer 3 includes a plurality of residual portions 31 dispersed between the retaining wall 2 and the display area a.
  • the organic layer 8 is removed, a part of the material of the sacrificial layer 3a is taken away, and the solute part obtained after the solvent in the sacrificial layer 3a is evaporated is the residual layer 3.
  • the residual part 31 obtained after the solvent evaporation will have a dispersed block structure, and the shape of the block structure is random and irregular . It should be noted that the residual layer 3 in FIG. 7 is located in the entire area between the barrier wall 2 and the pixel defining layer 6, in fact, there is a high probability that it only exists in the partial area between the barrier wall 2 and the pixel defining layer 6.
  • the packaging structure 5 includes a packaging cover 52 and a packaging glue 51.
  • the packaging cover 52 is arranged opposite to the display substrate 1.
  • the packaging glue 51 is bonded between the display substrate 1 and the packaging cover 52, and is at least partially located in the auxiliary area b1.
  • the packaging glue 51 is also located at the periphery of the retaining wall 2.
  • the packaging cover plate is a transparent cover plate, including but not limited to a glass cover plate, a plastic cover plate, and the like.
  • the OLED display panel may further include a filler, which is located between the multiple light emitting structures 4 of the display substrate and the packaging cover.
  • the filling glue may be an optical glue.
  • the packaging glue 51 is located in the entire auxiliary area b1, but in other embodiments, the packaging glue 51 may also be located only in an annular area of the auxiliary area b1 close to the retaining wall 2. The area enclosed by the packaging glue 51 is filled with the filling glue.
  • the packaging structure may also be a thin film packaging structure.
  • the thin film encapsulation structure includes at least one organic encapsulation layer and at least one inorganic encapsulation layer.
  • the thin film packaging structure includes two inorganic packaging layers and an organic packaging layer located between the two inorganic packaging layers.
  • the OLED display substrate in FIG. 8 can be replaced with a structure obtained by removing the printing film layer on the sacrificial layer from the OLED display substrate shown in FIG. 3 or FIG. 5.
  • FIG. 9 is a schematic flowchart of a manufacturing method of an OLED display panel provided by an embodiment of the disclosure. As shown in FIG. 9, an embodiment of the present disclosure proposes a manufacturing method of an OLED display panel, including:
  • step S1 a barrier wall 2 is formed in the non-display area b of the display substrate 1;
  • the display substrate 1 has a display area and a non-display area surrounding the display area, and the barrier wall 2 is located in the non-display area b and surrounds the display area a.
  • the non-display area between the barrier wall 2 and the display area a is an auxiliary area, and the auxiliary area surrounds the display area and is adjacent to the display area.
  • the auxiliary area b1 surrounds the periphery of the display area a, and the auxiliary area b1 is limited by setting a barrier 2 on the periphery of the auxiliary area b1 , Can prevent ink droplets from spreading to areas other than the auxiliary area b1 during inkjet printing.
  • the preset range of the auxiliary area b1 may be set corresponding to the packaging area of the display substrate 1. When setting, the range of the auxiliary area b1 may not be larger than the range of the packaging area of the non-display area b.
  • photosensitive resin organic materials may be used to form the barrier wall 2 by photolithography. This method is relatively simple to operate and can improve the production efficiency.
  • the height of the retaining wall 2 may be 1 ⁇ m-3 ⁇ m, and the width of the retaining wall 2 may be 10 ⁇ m-20 ⁇ m.
  • the retaining wall 2 and the pixel defining layer 6 can be fabricated simultaneously.
  • the step S1 may include: forming a layer of resin material film on the display substrate; performing patterning processing on the resin material film layer to obtain the barrier wall and the pixel defining layer.
  • the pixel defining layer is located in the display area; or, the pixel defining layer is located in the display area and the auxiliary area, and the pixel defining layer defines a plurality of auxiliary pixel areas in the auxiliary area.
  • the patterning process is the aforementioned patterning process.
  • a typical patterning process refers to a process of applying a mask once to expose, develop, etch, and remove the photoresist.
  • the material of the pixel defining layer 6 and the barrier wall 2 is a non-photosensitive material, after exposure and development, it is necessary to etch the region where the opening is to be formed exposed by the photoresist to form the opening.
  • the material of the pixel defining layer 6 and the barrier wall 2 is a photosensitive material, the material of the pixel defining layer can be exposed and developed directly to form an opening.
  • step S2 a sacrificial layer 3a is formed in the auxiliary region b1;
  • a sacrificial layer 3a is formed in the auxiliary area b1.
  • the sacrificial layer 3a is used to separate the printing film layer on the sacrificial layer 3a from the display substrate 1 after inkjet printing to form a printing film layer to remove the auxiliary Print film in area b1.
  • the material of the sacrificial layer 3a can be one or more of polyethylene glycol, polycaprolactone, polyvinyl alcohol, polyvinylpyrrolidone, polymethylmethacrylate, etc., that is, it can be selected to be soluble Made of material in order to remove the print film layer on the sacrificial layer 3a.
  • the selected sacrificial layer 3a material can be dissolved by a corresponding solvent to obtain a liquid material, and then the liquid material is filled in the auxiliary area b1 by spin coating, printing, spraying, etc., and the solvent is removed by drying After curing, the sacrificial layer 3a is formed.
  • step S3 inkjet printing is performed on the display substrate 1 to form a printing film layer
  • the printing area covers the display area a and the auxiliary area b1. Accordingly, the formed printing film layer includes the organic layer 8 on the sacrificial layer 3a and the organic light emitting function layer in the light emitting structure 4.
  • inkjet printing is performed on the display substrate 1.
  • the printing area covers the display area a and the auxiliary area b1, that is, the edge of the printing area extends to the auxiliary area b1, which increases the coverage of the printing area.
  • This can increase the solvent atmosphere at the edge of the display area a, thereby reducing the difference in the degree of drying of the film in the middle and the edge of the display area a, improving the uniformity of the printing film in the display area a of the OLED display substrate 1, and ensuring the display panel display effect.
  • step S4 the printing film layer 4 on the sacrificial layer 3a is removed;
  • step S4 the printing film layer on the sacrificial layer 3a is peeled off from the display substrate through the sacrificial layer 3a.
  • step S5 an electrode layer is formed on the printing film layer of the display area to obtain a plurality of light-emitting structures.
  • the printing film layer in the display area is the organic light-emitting functional layer.
  • step S6 the display substrate 1 is packaged to form a package structure on the display substrate.
  • the packaging structure 5 covers the plurality of light emitting structures 4 and is connected to the residual layer 3 in the auxiliary region b1 and the display substrate 1.
  • the display substrate 1 is packaged, and the packaged area is not smaller than the area where the auxiliary area b1 is located.
  • the auxiliary area b1 is coated with encapsulating glue 51.
  • the encapsulating glue 51 wraps the retaining wall 2 and can extend to the outer area of the retaining wall 2.
  • the encapsulating glue 51 is used to connect the display substrate 1 and the package cover. 52 bonding.
  • the embodiment of the present disclosure proposes a method for manufacturing an OLED display panel, which can increase the coverage of the printing area by setting the auxiliary area, thereby reducing the difference in the degree of drying between the middle part and the edge part of the display area, so that the display area of the display substrate is printed
  • the film layer has high uniformity; by setting the sacrificial layer in the auxiliary area, after the auxiliary area is formed by inkjet printing, the sacrificial layer can play the role of removing the printing film. After removing the printing film, it can be directly used in the auxiliary
  • the area is encapsulated, that is, the auxiliary area is used as the encapsulation area. Compared with the case where the encapsulation area is at the periphery of the auxiliary area, the area of the non-display area is significantly reduced, which meets the design requirements of the narrow frame of the display panel.
  • the OLED display provided by the embodiment of the present disclosure
  • the manufacturing method of the panel may further include: forming a water and oxygen barrier layer 7 on the retaining wall 2.
  • the water and oxygen barrier layer 7 should be made of materials that have the effect of blocking water and oxygen, for example: it can be SiN x , SiO 2 , SiC, AL 2 O 3 , ZnS, ZnO and other materials, and the method of formation can be through chemical vapor deposition (CVD), sputtering, atomic layer deposition (ALD) and other methods.
  • CVD chemical vapor deposition
  • ALD atomic layer deposition
  • the thickness of the water and oxygen barrier layer 7 may be 0.05 ⁇ m-2.5 ⁇ m, but of course it is not limited to this. It is intended to form a water and oxygen barrier film outside the barrier wall 2 to ensure the reliability of the display substrate 1 packaging.
  • the water and oxygen barrier layer 7 covers the surface of the retaining wall 2.
  • the water and oxygen barrier layer 7 may not only cover the surface of the retaining wall 2, but also The upper surface of the display substrate 1 on both sides of the wall 2 can further assist the packaging structure to play a good role in blocking water vapor and oxygen to the display devices on the display substrate 1.
  • this step S4 may include: dropping a solvent for softening the sacrificial layer 3a into the retaining wall 2, after softening the sacrificial layer 3a, adhering the printed film layer on the sacrificial layer through the imprinting mold 9, and baking Dry solvent.
  • the purpose of the sacrificial layer 3a is to carry ink droplets during inkjet printing, and to remove the printing film layer on the sacrificial layer 3a after the printing film layer is formed.
  • the printing film layer can be removed by a variety of methods, that is, the sacrificial layer 3a can also have a variety of settings.
  • the sacrificial layer 3a can be made of soluble resin, plastic or rubber.
  • the above solvent can be dropped along the inner side of the barrier wall 2 and/or the surface of the printing film layer in the auxiliary area, and the solvent can pass through the grid of the printing film layer
  • the pores penetrate into the sacrificial layer 3a, so that the sacrificial layer 3a can be dissolved and softened.
  • the printing film layer in the auxiliary area can be adhered by the imprint mold 9 to realize printing in the auxiliary area
  • the peeling of the film layer from the display substrate 1 can remove the print film layer in the auxiliary area from the display substrate 1.
  • the sacrificial layer 3a When this part of the print film layer is removed, the sacrificial layer 3a will be all or part of the printed film layer attached from the display substrate 1 is removed, the remaining material of the sacrificial layer 3a can be dried to remove the solvent, and the remaining sacrificial layer 3a (that is, the aforementioned residual layer) will not affect the packaging of the packaging material, and the residual layer and display substrate in the auxiliary area b1
  • the encapsulation glue 51 is coated on the top.
  • the encapsulation area (the area where the encapsulation glue 51 is coated) can be larger than the area occupied by the auxiliary area b1. After the encapsulation glue 51 is coated, the encapsulation cover 52 can be buckled with the display substrate, and then The packaging of the display substrate 1 is completed.
  • the solvent used to dissolve the sacrificial layer may be ethanol, isopropanol, acetone, or the like.
  • the imprinting mold 9 may include a printing plate 91 adapted to the printing film layer in the auxiliary area b1, and an adhesive 92 is provided on the printing plate 91 for adhering to the printing on the sacrificial layer 3a.
  • the film layer namely the organic layer 8.
  • the imprinting mold 9 serves to remove the organic layer 8.
  • the imprinting mold 9 includes a printing plate 91.
  • the size and shape of the printing plate 91 can be adapted to the shape of the organic layer 8, and the thickness of the printing plate 91 can be greater than the thickness of the blocking plate.
  • the height of the wall 2 is used to completely contact the organic layer 8 when the organic layer 8 is removed.
  • An adhesive 92 is provided on the contact surface of the printing plate 91 and the organic layer 8. The adhesive 92 is used to contact the organic layer 8 At this time, the organic layer 8 is adhered, and then the organic layer 8 is removed from the display substrate.
  • the printing plate 91 may be made of a resin material with elasticity.
  • the adhesive 92 can be a rubber-based or acrylic adhesive.
  • the thickness of the adhesive 92 on the printing plate 91 may be 50 nm-500 nm.
  • the embodiment of the present disclosure also provides a display device including the above-mentioned OLED display panel.
  • the display device may be an electronic device with a display function, such as a TV, a mobile phone, and a tablet computer.
  • the embodiment of the present disclosure proposes a display device.
  • the coverage area of the display substrate for inkjet printing can be increased, thereby reducing the drying degree of the film in the middle and edge portions of the display area of the display substrate. Difference, improve the uniformity of the print film layer at the edge of the print area of the display substrate, and ensure the display effect of the display device; by setting a sacrificial layer in the auxiliary area, the sacrificial layer can play a role after the auxiliary area is formed by inkjet printing.
  • the function of assisting in removing the printing film layer, and the auxiliary area overlaps with the packaging area of the display substrate at least partially.
  • the packaging area can be directly packaged in the auxiliary area, which meets the narrow frame design requirements of the display panel, which can reduce
  • the frame size of the display device can increase the screen-to-body ratio of the display device and provide users with better visual enjoyment.

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Abstract

一种OLED显示基板（1）、显示面板及其制作方法、显示装置，涉及显示技术领域。OLED显示面板包括：显示基板（1），具有显示区域（a）及环绕所述显示区域（a）的非显示区域（b）；挡墙（2），所述挡墙（2）位于所述非显示区域（b）且环绕所述显示区域（a）；残留层（3），所述残留层（3）位于所述挡墙（2）和所述显示区域（a）之间；以及封装结构（5），所述封装结构（5）包覆多个发光结构（4），且与所述残留层（3）和所述显示基板（1）连接。

Description

OLED显示基板、显示面板及其制作方法、显示装置
本申请要求于2019年6月19日提交的申请号为201910530643.X、发明名称为“一种显示面板及其制作方法、显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种OLED显示基板、显示面板及其制作方法、显示装置。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)被誉为新一代的显示技术，由于其具有高响应度、高对比度、可柔性化等优点，因而拥有广泛的应用前景。OLED的成膜技术中的喷墨打印技术，由于具有较高的材料利用率，被认为是实现大尺寸OLED量产化的重要方式。
发明内容
本公开实施例提供一种OLED显示基板、显示面板及其制作方法、显示装置。
本公开至少一实施例提供了一种OLED显示面板，该OLED显示面板包括：
显示基板，具有显示区域及环绕所述显示区域的非显示区域；
挡墙，所述挡墙位于所述非显示区域且环绕所述显示区域；
残留层，所述残留层位于所述挡墙和所述显示区域之间；
多个发光结构，所述多个发光结构位于所述显示区域；以及
封装结构，所述封装结构包覆所述多个发光结构，且与所述残留层和所述显示基板连接。
可选地，所述残留层采用可溶解于溶剂的可溶解材料制成，所述发光结构的有机发光功能层不溶于所述溶剂。
可选地，所述可溶解材料包括以下材料中的至少一种：聚乙二醇、聚己内酯、聚乙烯醇、聚乙烯吡咯烷酮、聚甲基丙烯酸甲酯。
可选地，所述残留层包括分散于所述挡墙和所述显示区域之间的多个间隔的 残留部分。
可选地，所述的显示面板还包括像素界定层，所述像素界定层位于所述显示区域；或者，所述像素界定层位于所述挡墙围成的区域，所述像素界定层在所述挡墙和所述显示区域之间的区域中限定出多个辅助像素区域，所述残留层位于所述辅助像素区域。
可选地，所述像素界定层和所述挡墙同层。
可选地，所述的显示面板还包括位于所述非显示区域的水氧阻隔层，所述水氧阻隔层覆盖在所述挡墙的表面上。
可选地，所述水氧阻隔层还覆盖在位于所述挡墙的至少一侧的所述显示基板的表面上。
可选地，所述封装结构包括：
封装盖板，与所述显示基板相对布置；
封装胶，粘接在所述显示基板和所述封装盖板之间，位于所述非显示区域位于所述非显示区域且至少部分位于所述辅助区域。
本公开至少一实施例提供了一种OLED显示基板，该OLED显示基板包括：
显示基板，具有显示区域及环绕所述显示区域的非显示区域；
挡墙，位于所述非显示区域且环绕所述显示区域；
牺牲层，位于所述挡墙和所述显示区域之间；
多个发光结构，位于所述显示区域，所述发光结构包括有机发光功能层；
有机层，位于所述牺牲层上且与所述有机发光功能层同层。
可选地，所述牺牲层采用可溶解于溶剂的可溶解材料制成，所述发光结构的有机发光功能层不溶于所述溶剂。
可选地，所述可溶解材料包括以下材料中的至少一种：聚乙二醇、聚己内酯、聚乙烯醇、聚乙烯吡咯烷酮、聚甲基丙烯酸甲酯。
可选地，所述OLED显示基板还包括：像素界定层，所述像素界定层位于所述显示区域；或者，所述像素界定层位于所述挡墙围成的区域，所述像素界定层在所述挡墙和所述显示区域之间的区域中限定出多个辅助像素区域，所述牺牲层位于所述辅助像素区域内。
可选地，所述OLED显示基板还包括位于所述非显示区域的水氧阻隔层，所述水氧阻隔层覆盖在所述挡墙的表面上。
可选地，所述水氧阻隔层还覆盖在位于所述挡墙的至少一侧的所述显示基板的表面上。
本公开至少一实施例提供一种OLED显示面板的制作方法，该方法包括：
在显示基板上形成挡墙，所述显示基板具有显示区域及环绕所述显示区域的非显示区域，所述挡墙位于所述非显示区域且环绕所述显示区域；
在所述挡墙和所述显示区域之间的区域内形成牺牲层；
在所述显示基板上进行喷墨打印，以形成打印膜层，其中，打印区域覆盖所述挡墙围成的区域；
去除所述牺牲层上的打印膜层，在所述挡墙和所述显示区域之间形成所述牺牲层的残留层；
在所述显示区域的打印膜层上形成电极层，得到多个发光结构；
对所述显示基板进行封装，以在所述显示基板上形成封装结构，所述封装结构包覆所述多个发光结构，且与所述残留层和所述显示基板连接。
可选地，所述去除所述牺牲层上的打印膜层，包括：
在所述牺牲层上的打印膜层上滴入用于溶解所述牺牲层的溶剂；
在所述牺牲层软化后，通过压印模具粘附所述牺牲层上的所述打印膜层；
烘干所述溶剂，得到所述残留层。
可选地，所述压印模具包括与所述牺牲层上的打印膜层相适配的印板，所述印板上设置有粘合剂，用于粘附所述牺牲层上的所述打印膜层。
可选地，所述在显示基板上形成挡墙，包括：
在所述显示基板上形成一层树脂材料膜层；
对所述树脂材料膜层进行图形化处理，得到所述挡墙和像素界定层；
其中，所述像素界定层位于所述显示区域；或者，所述像素界定层位于所述挡墙围成的区域，所述像素界定层在所述挡墙和所述显示区域之间的区域中限定出多个辅助像素区域。
本公开至少一实施例提供一种显示装置，该显示装置包括前述任一种OLED显示面板。
附图说明
图1为本公开实施例提供的一种OLED显示基板的俯视结构示意图；
图2为图1所示OLED显示基板沿A-A线的截面结构示意图；
图3为图1所示OLED显示基板沿A-A线的另一截面结构示意图；
图4为本公开实施例提供的另一种OLED显示基板的俯视结构示意图；
图5为图4所示OLED显示基板沿B-B线的截面结构示意图；
图6为本公开实施例提供的OLED显示基板的显示区域的层级结构示意图；
图7为本公开实施例提供的一种OLED显示面板的结构示意图；
图8为图7所示OLED显示面板去除封装结构后的俯视结构示意图；
图9为本公开实施例提供的一种OLED显示面板的制作方法的流程示意图；
图10为本公开实施例提供的一种OLED显示面板的制作方法所使用的压印模具的结构示意图。
具体实施方式
为更进一步阐述本公开为达成预定发明目的所采取的技术手段及功效,以下结合附图及可选实施例，对依据本公开提出的OLED显示基板、显示面板及其制作方法、显示装置，其具体实施方式、结构、特征及其功效，详细说明如后。
在OLED显示基板的制作过程中，通常采用喷墨打印技术形成有机发光功能层。在该喷墨打印的过程中，通过后续工艺去除墨水中的溶剂，从而使溶质干燥形成所需要的薄膜，是必不可少的步骤。由于显示基板的显示区域边缘的亚像素结构所处的溶剂氛围与显示区域中间的亚像素结构所处的溶剂氛围不同(显示区域边缘的溶剂浓度比显示区域中间的溶剂浓度低)，使得显示区域的边缘的溶剂相对于显示区域的中部的溶剂挥发更快，使得显示区域的中部和边缘区域的膜层的干燥程度存在差异，导致显示区域的有机发光功能层的均匀性较差，影响显示效果。
相关技术中，在显示基板的非显示区域设置辅助区域(Dummy区域)，辅助区域的亚像素结构与显示区域的亚像素结构相同，打印时墨滴同样滴入辅助区域，增加了显示区域的边缘的溶剂氛围，使得显示区域的中间和边缘区域的膜层的干燥程度相当，从而提高了显示区域内有机发光功能层的均匀性，进而能够提高显示效果。
辅助区域在与显示区域一同进行喷墨打印后，在辅助区域对应的显示基板上会形成打印膜层，打印膜层在成膜后无法从显示基板剥离去除。若直接在打印膜层上进行封装，封装后该打印膜层会形成水氧进入的路径，显示基板上的 OLED器件在水汽和氧气的作用下，会出现腐蚀损坏的现象，影响显示基板的封装效果。所以在无法将打印膜层从显示基板上去除的情况下，封装区域只能避开打印膜层所在的区域设置，即，封装区域需要在辅助区域的外围设置，这会导致OLED显示面板的非显示区域的面积较大，不利于显示装置的窄边框设计。
图1是本公开实施例提供的一种OLED显示基板的俯视结构示意图。如图1所示，该OLED显示基板包括显示基板1。显示基板1具有显示区域a及环绕显示区域a的非显示区域b。其中，显示区域a用于显示画面，非显示区域b环绕在显示区域a四周外围。
该OLED显示面板还包括挡墙2和多个发光结构4。挡墙2位于非显示区域b且环绕所述显示区域a。为便于描述，下文中，将挡墙2与显示区域a之间的区域称为辅助区域b1，也即是，非显示区域b包括辅助区域b1，辅助区域b1环绕于显示区域a的边缘，挡墙2环绕设置在辅助区域b1的外边缘。多个发光结构4位于显示区域a，显示基板1通过控制这多个发光结构4发光来实现画面的显示。
在本公开实施例中，多个发光结构4阵列布置在显示区域a内。多个发光结构4可以包括多种颜色的发光结构4，例如红色发光结构4、蓝色发光结构4和绿色发光结构4。每个发光结构4对应一个亚像素结构，多个亚像素结构构成一个像素结构。示例性地，每个发光结构4均包括两个电极层和位于两个电极层之间的有机发光功能层。
图2为图1所示OLED显示基板沿A-A线的截面结构示意图。结合图1和图2，该OLED显示基板还包括牺牲层3a和有机层8。牺牲层3a位于挡墙2和显示区域a之间，即位于辅助区域b1内，有机层8位于所述牺牲层3a上。有机层8与发光结构4的有机发光功能层同层，这里，同层是指通过喷墨打印同时形成该有机层8和发光结构4的有机发光功能层。该牺牲层3a用于分离喷墨打印形成在辅助区域b1内的有机层8。
如图1和图2所示，该OLED显示基板还包括像素界定层6。像素界定层6在显示区域a内限定出多个像素区域(又称开口区域)6a，每个像素区域6a内具有一个发光结构4。
示例性地，在图1所示实施例中，辅助区域b1为由挡墙2和像素定义层5限定的环绕显示区域a的环形区域，有机层8形成在整个环形区域内。该环形区域为非显示区域b的一部分区域，用于在喷墨打印时，与显示基板1的显示 区域b一同进行喷墨打印。挡墙2用于对辅助区域b1的区域范围进行限制，且在喷墨打印时避免墨水扩散到辅助区域b1的外部，以避免对设备环境和绑定区域造成污染和损坏。
在本公开实施例中，在喷墨打印后，打印区域的边缘扩展至显示区域a外围的辅助区域b1，也即是打印区域的覆盖范围增大，这样可以增加显示区域a边缘的溶剂氛围，从而减小显示区域a中间部分和边缘部分膜层的干燥程度差异，使得显示基板1的显示区域a的打印膜层均匀性较高，保证显示面板的显示效果。
由于有机膜层与封装结构的结合性较差，若直接在有机发光功能层上形成封装结构，在后续显示基板的使用过程中，有机发光功能层和封装结构的结合处可能会发生分离，导致封装失效。同时，直接在有机发光功能层上形成封装结构，封装后，有机发光功能层会形成水氧进入的路径，显示基板上的OLED器件在水汽和氧气的作用下，会出现腐蚀损坏的现象，影响显示基板的封装效果。
为保证封装的可靠性，在辅助区域b1所在的位置进行封装时，需要将辅助区域b1的打印膜层(即前述有机层8)去除。由于辅助区域b1中设置有牺牲层3a，牺牲层3a位于挡墙2所围成的区域内，且形成在显示基板1的表面上，牺牲层3a能够起到在喷墨打印时承载打印墨水，且在烘干形成有机层8后去除有机层8的作用。在去除有机层8的过程中，牺牲层3a会部分或全部的从显示基板1上剥离，牺牲层3a的材料不会影响封装效果，在去除有机层8后，在辅助区域b1涂布封装胶即可对显示基板进行封装，可以满足显示面板的窄边框设计要求。
在本公开实施例中，辅助区域b1与非显示区域b的封装区域至少部分重合，也即是，该辅助区域b1还用于对OLED显示基板进行封装。例如，辅助区域b1的范围可以等同于封装区域应占用的区域范围，或，辅助区域b1的范围还可以小于封装区域所占范围，辅助区域b1的具体范围可以根据实际情况设定，旨在减小显示面板的边框大小，辅助区域b1的设置范围不超过封装区域的外边缘即可。
可选地，基于上述的挡墙2可以采用感光型树脂类有机材料通过光刻的方式形成在显示基板1上，当然，挡墙2的材料和制作工艺不限于此。挡墙2可以有多种具体的设置形式。
可选地，挡墙2的高度可以为1μm-3μm，挡墙的宽度可以为10μm-20μm。 挡墙2的高度的具体数值可以根据实际需求设定，旨在达到在喷墨打印的过程中喷墨不会喷溅到辅助区域b1以外的区域即可。
在本公开实施例中，挡墙2与像素界定层6可以同层设置。这里，同层设置是指采用同一构图工艺形成，以便于简化制作工艺。
典型的构图工艺是指应用一次掩膜板，通过光刻胶曝光、显影、刻蚀、去除光刻胶的工艺。当像素界定层6的材料为非感光型材料时，曝光显影后，需要对光刻胶露出的待形成开口的区域进行刻蚀，以形成开口(即前述像素区域)。当像素界定层6的材料为感光型材料时，可以直接对像素界定层的材料进行曝光显影即可形成开口。
可选地，在本公开实施例中，为防止OLED显示基板1封装后，水汽和氧气沿挡墙2部分形成的路径进入显示区域a内部，可以在挡墙2的外部设置用于阻隔水氧的水氧阻隔层7，以提高OLED显示基板1封装的效果，保证封装的可靠性。
可选地，水氧阻隔层7的材料可以是SiN x、SiO 2、SiC、AL 2O 3、ZnS、ZnO等具有阻隔水汽和氧气作用的材料，且可以通过化学气相沉积(CVD)、溅射、原子层沉积(ALD)等方式形成。可选地，水氧阻隔层7的厚度可以是0.05μm-2.5μm。
在一种可能的实施方式中，如图2所示，水氧阻隔层7仅覆盖在挡墙2的表面。在另一种可能的实施方式中，如图3所示，水氧阻隔层7除覆盖挡墙2的表面外，水氧阻隔层7还可以覆盖挡墙2两侧的显示基板1的上表面，可以进一步的辅助封装结构对显示基板1上的显示器件起到良好的阻挡水汽和氧气的作用。
可选地，牺牲层3a可以采用可溶解的材料制成，以便于在打印膜层4形成后，可以通过对应的溶剂将牺牲层3a溶解软化，随着牺牲层3a的软化，可以将牺牲层3a上的打印膜层4去除。牺牲层3a可以有多种具体的设置形式，旨在实现从显示基板1上分离打印膜层4，保证显示基板1的封装效果的作用。
示例性地，牺牲层3a可以采用可溶于溶剂的可溶解材料制成，且发光结构的有机发光功能层不溶于该溶剂。这样，在牺牲层3a被溶剂溶解时，有机层8能够保持整层结构，以便于将该整层结构从显示基板1移除。
示例性地，牺牲层3a采用可溶解的树脂、塑料或橡胶材料制成。
在形成牺牲层3a时，可以通过对应的溶剂将选用的材料溶解得到液态的材 料，然后通过旋涂、印刷、喷涂等方式将液态的材料填充在辅助区域b1、且位于挡墙2围成的区域内，最后经过烘干去除溶剂后固化形成牺牲层3a。
在牺牲层3a上进行喷墨打印形成有机层8后，可以顺着挡墙2的内侧和/或在有机层8的表面滴入上述的溶剂，溶剂能够通过有机层8的网格孔隙向牺牲层3a渗透，从而可以将牺牲层3a溶解软化，随着牺牲层3a的软化，即可实现有机层8与显示基板1的剥离，将有机层8从显示基板1上去除，以便于在辅助区域b1进行封装操作。
可选地，牺牲层3a的材料可以为聚乙二醇、聚己内酯、聚乙烯醇、聚乙烯吡咯烷酮、聚甲基丙烯酸甲酯等中的一种或几种，用于溶解牺牲层3a的溶剂可以是乙醇、异丙醇、丙酮等。
图4为本公开另一实施例提供的OLED显示基板的结构示意图。图4所示的OLED显示基板的结构与图1所示OLED显示基板的结构基板相同，不同之处在于，在图4所示的OLED显示基板中，像素界定层6位于挡墙2围成的区域内，也即是像素界定层6同时位于显示区域a和辅助区域b1。
图5为图4所示显示基板沿B-B线的截面结构示意图。如图5所示，像素界定层6在显示区域a限定出多个像素区域6a，每个像素区域6a中包括一个发光结构4。像素界定层6在辅助区域b1限定出多个辅助像素区域6b。牺牲层3a和有机层8位于辅助像素区域6b中。
图6为图1和图4所示OLED显示基板的显示区域的层级结构示意图。如图6所示，该OLED显示基板包括显示基板1、以及位于显示基板1上的阳极层41、像素界定层6、有机发光功能层42和阴极层43。阳极层41、有机发光功能层42和阴极层43依次层叠在显示基板1上，形成发光结构4。
示例性地，有机发光功能层可以包括依次层叠的空穴注入层、空穴传输层、发光层、电子传输层和电子注入层。空穴注入层与阳极连接，电子注入层与阴极连接。
显示基板1包括衬底基板10和依次位于衬底基板10上的薄膜晶体管(Thin Film Transistor，TFT)阵列结构层11、保护层12和平坦化层13。示例性地，TFT阵列结构层11中包括多个TFT110，每个发光结构4对应至少两个TFT110，每个发光结构4和对应的TFT110组成一个亚像素结构。
如图6所示，TFT110包括栅极111、栅绝缘层112、有源层113、源极114 以及漏极115等结构。栅绝缘层112覆盖在栅极111上有源层113在栅绝缘层111上，源极114和漏极115分别与有源层113连接，漏极115与阳极41连接。图6中以底栅结构为例，对TFT的结构进行示例性说明，但是，本公开实施例也可以采用其他结构的TFT，本公开对此不做限制。
图7为本公开实施例提供的一种OLED显示面板的结构示意图。如图7所示，该OLED显示面板包括显示基板1、挡墙2、残留层3、多个发光结构4、和封装结构5。
图8为图7所示OLED显示面板去除封装结构后的俯视结构示意图。结合图7和图8，显示基板1具有显示区域a及环绕显示区域a的非显示区域b；多个发光结构4位于所述显示区域a；挡墙2位于非显示区域b且环绕显示区域a；残留层3位于挡墙2和所述显示区域a之间。
图8所示结构即图2所示OLED显示基板去除牺牲层上的打印膜层之后得到的结构。如图8所示，残留层3包括分散于挡墙2和显示区域a之间的多个间隔的残留部分31。在去除有机层8时会带走部分牺牲层3a的材料，牺牲层3a中的溶剂蒸发后残留得到的溶质部分即为残留层3。由于在去除有机层8之后剩余在辅助区域b1中的牺牲层3a材料较少，溶剂蒸发后得到的残留部分31会呈分散的块状结构，这些块状结构的形状是随机的且不规则的。需要说明的是，图7中的残留层3位于挡墙2和像素界定层6之间的整个区域，实际上，大概率只存在于挡墙2和像素界定层6之间的部分区域。
如图8所示，该封装结构5包括封装盖板52和封装胶51。封装盖板52与显示基板1相对布置。封装胶51粘接在显示基板1和封装盖板52之间，且至少部分位于辅助区域b1。例如图7中，封装胶51除了位于辅助区域b1，还位于挡墙2外围。
可选地，该封装盖板为透明盖板，包括但不限于玻璃盖板、塑料盖板等。
可选地，该OLED显示面板还可以包括填充胶，位于显示基板的多个发光结构4和封装盖板之间。示例性地，该填充胶可以为光学胶。
需要说明的是，在图7中，封装胶51位于整个辅助区域b1，但是在其他实施例中，封装胶51也可以仅位于辅助区域b1靠近挡墙2的一圈环形区域。封装胶51围成的区域内均填充该填充胶。
可替代地，在其他实施例中，封装结构也可以为薄膜封装结构。薄膜封装结 构包括至少一层有机封装层和至少一层无机封装层。例如，该薄膜封装结构包括两层无机封装层和位于这两层无机封装层之间的有机封装层。
需要说明的是，图8中的OLED显示基板可以替换为图3或图5所示的OLED显示基板去除牺牲层上的打印膜层之后得到的结构。
图9为本公开实施例提供的一种OLED显示面板的制作方法的流程示意图。如图9所示，本公开实施例提出一种OLED显示面板的制作方法，包括：
在步骤S1中，在显示基板1的非显示区域b形成挡墙2；
显示基板1具有显示区域及环绕所述显示区域的非显示区域，挡墙2位于非显示区域b且围绕显示区域a。挡墙2和显示区域a之间的非显示区域为辅助区域，所述辅助区域环绕所述显示区域且与所述显示区域相邻。
在制作时，首先在显示基板1的非显示区域b确定辅助区域b1的范围，辅助区域b1环绕显示区域a的外围，并通过在辅助区域b1的外围设置挡墙2来限制辅助区域b1的范围，可以防止喷墨打印时墨滴扩散到辅助区域b1以外的区域。在本公开实施例中，预设的辅助区域b1的范围可以与显示基板1的封装区域对应设置，在设置时，可以使辅助区域b1的范围不大于非显示区域b的封装区域的范围。
例如，可以采用感光树脂类有机材料通过光刻的方式形成挡墙2。该方法操作较为简便，可以提高制作的效率。示例性地，挡墙2的高度可以是1μm-3μm，且挡墙2的宽度可以为10μm-20μm。
在一种可能的实施方式中，挡墙2与像素界定层6可以同步制作。在这种情况下，该步骤S1可以包括：在所述显示基板上形成一层树脂材料膜层；对所述树脂材料膜层进行图形化处理，得到所述挡墙和像素界定层。其中，所述像素界定层位于所述显示区域；或者，所述像素界定层位于所述显示区域和所述辅助区域，所述像素界定层在所述辅助区域中限定出多个辅助像素区域。
这里，图形化处理即前述构图工艺，典型的构图工艺是指应用一次掩膜板，通过光刻胶曝光、显影、刻蚀、去除光刻胶的工艺。当像素界定层6和挡墙2的材料为非感光型材料时，曝光显影后，需要对光刻胶露出的待形成开口的区域进行刻蚀，以形成开口。当像素界定层6和挡墙2的材料为感光型材料时，可以直接对像素界定层的材料进行曝光显影即可形成开口。
在步骤S2中，在辅助区域b1内形成牺牲层3a；
挡墙2设置完成后，在辅助区域b1内形成牺牲层3a，牺牲层3a用于在喷墨打印形成打印膜层后，将牺牲层3a上的打印膜层与显示基板1分离，以便去除辅助区域b1内的打印膜层。
可选地，牺牲层3a的材料可以为聚乙二醇、聚己内酯、聚乙烯醇、聚乙烯吡咯烷酮、聚甲基丙烯酸甲酯等中的一种或几种，即可以选用可被溶解的材料制成，以便去除牺牲层3a上的打印膜层。
在形成牺牲层3a时，可以通过对应的溶剂将选用的牺牲层3a材料溶解得到液态的材料，然后通过旋涂、印刷、喷涂等方式将液态材料填充在辅助区域b1内，经过烘干去除溶剂后固化形成牺牲层3a。
在步骤S3中，在显示基板1上进行喷墨打印，以形成打印膜层；
其中，打印区域覆盖显示区域a和辅助区域b1，相应地，形成的打印膜层包括牺牲层3a上的有机层8和发光结构4中的有机发光功能层。
在牺牲层3a形成后，对显示基板1进行喷墨打印，打印区域覆盖显示区域a和辅助区域b1，也即是，打印区域的边缘扩展至辅助区域b1，增大了打印区域的覆盖范围，这样可以增加显示区域a边缘的溶剂氛围，从而减小显示区域a中间部分和边缘部分膜层的干燥程度差异，提高OLED显示基板1的显示区域a的打印膜层均匀性，可以保证显示面板的显示效果。
在步骤S4中，去除牺牲层3a上的打印膜层4；
在该步骤S4中，通过牺牲层3a将牺牲层3a上的打印膜层从显示基板上剥离。
在步骤S5中，在所述显示区域的打印膜层上形成电极层，得到多个发光结构。
这里，显示区域中的打印膜层即为有机发光功能层。
在步骤S6中，对显示基板1进行封装，以在所述显示基板上形成封装结构。
所述封装结构5包覆所述多个发光结构4，且与所述辅助区域b1中的所述残留层3和所述显示基板1连接。
在去除打印膜层4后，对显示基板1进行封装，封装的区域不小于辅助区域b1所在的区域。例如，如图6所示，在辅助区域b1涂覆封装胶51，封装胶51将挡墙2包裹，且可以延伸至挡墙2的外侧区域；利用封装胶51将显示基板1与封装盖板52粘接。
本公开实施例提出一种OLED显示面板的制作方法，通过设置辅助区域可 以增大打印区域的覆盖范围，从而减小显示区域中间部分和边缘部分的干燥程度差异，使得显示基板的显示区域的打印膜层均匀性较高；通过在辅助区域设置牺牲层，辅助区域在喷墨打印形成打印膜层后，牺牲层能够起到去除打印膜层的作用，在去除打印膜层后，可以直接在辅助区域进行封装，即将辅助区域作为封装区域，与封装区域在辅助区域的外围的情况相比，显著减小了非显示区域的面积，满足显示面板的窄边框设计要求。
由于采用光刻胶制作形成的挡墙2结构不具备水氧阻隔的性能，所以为避免由挡墙2结构形成水氧进入的路径，从而可能影响封装的效果，本公开实施例提出的OLED显示面板的制作方法，还可以包括：在挡墙2上形成水氧阻隔层7。
该水氧阻隔层7的制作应选用具有阻隔水氧作用的材料，例如：可以是SiN x、SiO 2、SiC、AL 2O 3、ZnS、ZnO等材料，形成的方法可以是通过化学气相沉积(CVD)、溅射、原子层沉积(ALD)等方式形成。
示例性地，水氧阻隔层7的厚度可以是0.05μm-2.5μm，当然不限于此，旨在在挡墙2外部形成阻隔水氧的膜层，保证显示基板1封装的可靠性。
在一种可能的实施方式中，水氧阻隔层7覆盖挡墙2的表面上，在另一种可能的实施方式中，水氧阻隔层7除覆盖挡墙2的表面外，还可以覆盖挡墙2两侧的显示基板1的上表面，可以进一步的辅助封装结构对显示基板1上的显示器件起到良好的阻挡水汽和氧气的作用。
可选地，该步骤S4可以包括：在挡墙2内滴入用于软化牺牲层3a的溶剂，将牺牲层3a软化后，通过压印模具9粘附牺牲层上的打印膜层，并烘干溶剂。
牺牲层3a设置的目的即在于在喷墨打印时承载墨滴，并在形成打印膜层后去除牺牲层3a上的打印膜层。打印膜层可以通过多种方法去除，即牺牲层3a也可以有多种设置形式，例如，牺牲层3a可以采用可溶解的树脂、塑料或橡胶等材料制成。
在牺牲层3a上进行喷墨打印形成打印膜层后，可以顺着挡墙2的内侧和/或在辅助区域内的打印膜层的表面滴入上述溶剂，溶剂能够通过打印膜层的网格孔隙向牺牲层3a渗透，从而可以将牺牲层3a溶解软化，随着牺牲层3a的软化，通过压印模具9可以对辅助区域内的打印膜层进行粘附，即可实现辅助区域内的打印膜层与显示基板1的剥离，可以将辅助区域内的打印膜层从显示基板1上去除，在去除这部分打印膜层时，牺牲层3a会全部或者部分的被打印膜层连带从显示基板1上去除，残余的牺牲层3a的材料可以进行烘干去除溶剂，残余 的牺牲层3a(即前述残留层)不会影响到封装材料的封装，可以在辅助区域b1内的残留层和显示基板上涂布封装胶51，当然，封装区域(涂布封装胶51的区域)可以大于辅助区域b1所占的区域，涂布封装胶51后，可以将封装盖板52与显示基板扣合，进而完成显示基板1的封装。
可选地，上述用于溶解牺牲层的溶剂可以是乙醇、异丙醇、丙酮等。
如图10所示，压印模具9可以包括与辅助区域b1内的打印膜层相适配的印板91，印板91上设置有粘合剂92，用于粘附牺牲层3a上的打印膜层，即有机层8。压印模具9起到揭除有机层8的作用，压印模具9包括印板91，印板91的尺寸及形状可以与有机层8的形状相适配，且印板91的厚度可以大于挡墙2的高度，用于在揭除有机层8时与有机层8完全接触，印板91与有机层8接触的表面上设置粘合剂92，粘合剂92用于在与有机层8接触时，粘附有机层8，进而将有机层8从显示基板上去除。
可选地，印板91可以采用具有弹性的树脂类材料制作。粘合剂92可以选用橡胶基或者丙烯酸类胶粘剂。可选的，印板91上的粘合剂92的厚度可以是50nm-500nm。
本公开实施例还提出一种显示装置，包括上述的OLED显示面板。
示例性地，显示装置可以是电视、手机、平板电脑等具有显示功能的电子设备。
本公开实施例提出一种显示装置，通过将打印区域扩大至显示区域外围，可以增大显示基板进行喷墨打印的覆盖范围，从而减小显示基板显示区域中间部分和边缘部分膜层的干燥程度差异，提高显示基板的显示区域打印区域边缘的打印膜层均匀性，保证显示装置的显示效果；通过在辅助区域设置牺牲层，辅助区域在喷墨打印形成打印膜层后，牺牲层能够起到辅助去除打印膜层的作用，且辅助区域与显示基板的封装区域至少部分重合，在去除打印膜层后，可以直接在辅助区域进行封装，满足了显示面板的窄边框设计要求，即可以减小显示装置的边框大小，可以提高显示装置的屏占比，给用户提供更好的视觉享受。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种OLED显示面板，包括：
    显示基板，具有显示区域及环绕所述显示区域的非显示区域；
    挡墙，所述挡墙位于所述非显示区域且环绕所述显示区域；
    残留层，所述残留层位于所述挡墙和所述显示区域之间；
    多个发光结构，所述多个发光结构位于所述显示区域；以及
    封装结构，所述封装结构包覆所述多个发光结构，且与所述残留层和所述显示基板连接。
  2. 根据权利要求1所述的OLED显示面板，其中，所述残留层采用可溶解于溶剂的可溶解材料制成，所述发光结构的有机发光功能层不溶于所述溶剂。
  3. 根据权利要求2所述的OLED显示面板，其中，所述可溶解材料包括以下材料中的至少一种：聚乙二醇、聚己内酯、聚乙烯醇、聚乙烯吡咯烷酮、聚甲基丙烯酸甲酯。
  4. 根据权利要求1至3任一项所述的OLED显示面板，其中，所述残留层包括分散于所述挡墙和所述显示区域之间的多个间隔的残留部分。
  5. 根据权利要求1至4任一项所述的OLED显示面板，还包括像素界定层，所述像素界定层位于所述显示区域；或者，
    所述像素界定层位于所述挡墙围成的区域，所述像素界定层在所述挡墙和所述显示区域之间的区域中限定出多个辅助像素区域，所述残留层位于所述辅助像素区域中。
  6. 根据权利要求5所述的OLED显示面板，其中，所述像素界定层和所述挡墙同层。
  7. 根据权利要求1至6任一项所述的OLED显示面板，还包括位于所述非显示区域的水氧阻隔层，所述水氧阻隔层覆盖在所述挡墙的表面上。
  8. 根据权利要求7所述的OLED显示面板，其中，所述水氧阻隔层还覆盖在位于所述挡墙的至少一侧的所述显示基板的表面上。
  9. 根据权利要求1至8任一项所述的OLED显示面板，其中，所述封装结构包括：
    封装盖板，与所述显示基板相对布置；
    封装胶，粘接在所述显示基板和所述封装盖板之间，位于所述非显示区域内且至少部分位于所述挡墙和所述显示区域之间。
  10. 一种OLED显示基板，包括：
    显示基板，具有显示区域及环绕所述显示区域的非显示区域；
    挡墙，位于所述非显示区域且环绕所述显示区域；
    牺牲层，位于所述挡墙和所述显示区域之间；
    多个发光结构，位于所述显示区域，所述发光结构包括有机发光功能层；
    有机层，位于所述牺牲层上且与所述有机发光功能层同层。
  11. 根据权利要求10所述的OLED显示基板，其中，所述牺牲层采用可溶解于溶剂的可溶解材料制成，所述有机发光功能层不溶于所述溶剂。
  12. 根据权利要求11所述的OLED显示基板，其中，所述可溶解材料包括以下材料中的至少一种：聚乙二醇、聚己内酯、聚乙烯醇、聚乙烯吡咯烷酮、聚甲基丙烯酸甲酯。
  13. 根据权利要求10至12任一项所述的OLED显示基板，还包括：像素界定层，所述像素界定层位于所述显示区域；或者，
    所述像素界定层位于所述挡墙围成的区域，所述像素界定层在所述挡墙和所述显示区域之间的区域中限定出多个辅助像素区域，所述牺牲层位于所述辅助像素区域中。
  14. 根据权利要求10至13任一项所述的OLED显示基板，还包括位于所述非显示区域的水氧阻隔层，所述水氧阻隔层覆盖在所述挡墙的表面上。
  15. 根据权利要求14所述的OLED显示基板，其中，所述水氧阻隔层还覆盖在位于所述挡墙的至少一侧的所述显示基板的表面上。
  16. 一种OLED显示面板的制作方法，包括：
    在显示基板上形成挡墙，所述显示基板具有显示区域及环绕所述显示区域的非显示区域，所述挡墙位于所述非显示区域且环绕所述显示区域；
    在所述挡墙和所述显示区域之间的区域内形成牺牲层；
    在所述显示基板上进行喷墨打印，以形成打印膜层，其中，打印区域覆盖所述挡墙围成的区域；
    去除所述牺牲层上的打印膜层，在所述挡墙和所述显示区域之间形成所述牺牲层的残留层；
    在所述显示区域的打印膜层上形成电极层，得到多个发光结构；
    对所述显示基板进行封装，以在所述显示基板上形成封装结构，所述封装结构包覆所述多个发光结构，且与所述残留层和所述显示基板连接。
  17. 根据权利要求16所述的制作方法，其特征在于，所述去除所述牺牲层上的打印膜层，包括：
    在所述牺牲层上的打印膜层上滴入用于溶解所述牺牲层的溶剂；
    在所述牺牲层软化后，通过压印模具粘附所述牺牲层上的所述打印膜层；
    烘干所述溶剂，得到所述残留层。
  18. 根据权利要求17所述的制作方法，其特征在于，所述压印模具包括与所述牺牲层上的打印膜层相适配的印板，所述印板上设置有粘合剂，用于粘附所述牺牲层上的所述打印膜层。
  19. 根据权利要求16所述的制作方法，其特征在于，所述在显示基板上形成挡墙，包括：
    在所述显示基板上形成一层树脂材料膜层；
    对所述树脂材料膜层进行图形化处理，得到所述挡墙和像素界定层；
    其中，所述像素界定层位于所述显示区域；或者，所述像素界定层位于所述挡墙围成的区域，所述像素界定层在所述挡墙和所述显示区域之间的区域中限定出多个辅助像素区域。
  20. 一种显示装置，包括权利要求1至9任一项所述的OLED显示面板。
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