WO2020253396A1 - Oled显示基板及其制作方法、显示装置 - Google Patents

Oled显示基板及其制作方法、显示装置 Download PDF

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Publication number
WO2020253396A1
WO2020253396A1 PCT/CN2020/087796 CN2020087796W WO2020253396A1 WO 2020253396 A1 WO2020253396 A1 WO 2020253396A1 CN 2020087796 W CN2020087796 W CN 2020087796W WO 2020253396 A1 WO2020253396 A1 WO 2020253396A1
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WIPO (PCT)
Prior art keywords
oled display
display substrate
pixel defining
protrusion
defining layer
Prior art date
Application number
PCT/CN2020/087796
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English (en)
French (fr)
Inventor
彭利满
刘祺
刘亮亮
王建强
吴岩
杨津
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/041,162 priority Critical patent/US20230098150A1/en
Publication of WO2020253396A1 publication Critical patent/WO2020253396A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present disclosure relates to the field of display technology, in particular to an OLED display substrate, a manufacturing method thereof, and a display device.
  • the OLED display device is an active light-emitting device and does not require a backlight.
  • organic light-emitting materials need to be vapor-deposited on the substrate. After the OLED display substrate is made, input current to the anode and cathode of the OLED display substrate. Make organic light-emitting materials emit light.
  • the fine metal mask Fe Metal Mask, FMM
  • FMM Fine Metal Mask
  • the fine metal The mask is easy to form large-area contact with the edge area of the OLED display substrate, resulting in easy electrostatic discharge during the evaporation process, and during the evaporation process, the OLED display substrate and the fine metal mask will move relatively, causing further friction Increase the probability of occurrence of electrostatic discharge, which will cause damage to the fine metal mask, and then abnormal evaporation, which affects the product yield of the OLED display substrate.
  • an OLED display substrate has a display area and an edge area located at the periphery of the display area.
  • the OLED display substrate includes a backplane and a pixel defining layer on the backplane.
  • the edge area of the OLED display substrate is provided with protrusions on the back plate.
  • the protrusion is a columnar structure formed in the pixel defining layer.
  • At least part of the protrusions and the pixel defining layer of the OLED display substrate are made of the same material.
  • spacers are further provided on the pixel defining layer, and the protrusions located in the edge area and the spacers are formed by the same process and the same material. .
  • the height difference between the end surface of the spacer away from the back plate and the end surface of the protrusion away from the back plate is not greater than a preset threshold.
  • the height difference between the end surface of the spacer away from the back plate and the end surface of the protrusion away from the back plate is not more than 3 ⁇ m.
  • the end surface of the spacer away from the back plate and the end surface of the protrusion away from the back plate are located on the same horizontal plane.
  • a flat layer is provided between the backplane and the pixel defining layer.
  • the embodiment of the present disclosure also provides a display device, including the OLED display substrate as described above.
  • the embodiments of the present disclosure also provide a manufacturing method of an OLED display substrate, the OLED display substrate including a display area and an edge area located at the periphery of the display area, the manufacturing method including:
  • a protrusion is formed at the edge area.
  • the forming a protrusion at the edge region includes:
  • the pixel defining layer and the protrusion of the OLED display substrate are formed on the flat layer, wherein the pixel defining layer and the protrusion are made of the same material.
  • the manufacturing method further includes:
  • the spacers at the display area of the OLED display substrate and the protrusions at the edge area are formed, wherein the spacers and the protrusions are made of the same material.
  • the manufacturing method further includes:
  • the spacer at the display area and the second part of the protrusion at the edge area are formed, and the first part and the second part constitute the protrusion.
  • the manufacturing method further includes:
  • the organic light-emitting material is evaporated in the pixel area defined by the pixel defining layer.
  • FIG. 1 is a schematic diagram of the structure of an OLED display substrate in the related art
  • FIG. 2 is a schematic diagram of vapor deposition using a fine metal mask in the manufacturing process of an OLED display substrate in the related art
  • FIG. 3 is a schematic structural diagram of an OLED display substrate according to an embodiment of the disclosure.
  • FIG. 4 is a schematic diagram of vapor deposition using a fine metal mask in the manufacturing process of an OLED display substrate according to an embodiment of the disclosure
  • 5 to 7 are schematic diagrams of the structure of an OLED display substrate according to a specific embodiment of the disclosure.
  • the OLED display device is an active light-emitting device and does not require a backlight.
  • organic light-emitting materials need to be vapor-deposited on the substrate. After the OLED display substrate is made, input current to the anode and cathode of the OLED display substrate. Make organic light-emitting materials emit light.
  • a fine metal mask Fe Metal Mask, FMM
  • FMM Fine Metal Mask
  • a thin film transistor array layer 2 a pixel defining layer 3
  • spacers 4 are formed on the display area A of the OLED display substrate.
  • organic light-emitting materials of different colors are evaporated.
  • the spacer 4 can avoid large-area contact between the display area A and the fine metal mask 5.
  • the fine metal mask 5 is made of metal.
  • the fine metal mask 5 is OLED display substrates are in contact with a large area, and electrostatic discharge (ESD) is easily generated at the contact position, which can damage the fine metal mask 5, damage the fine metal mask 5, and cause abnormal evaporation, such as R, G, B materials Evaporation to other locations will cause color mixing defects.
  • ESD electrostatic discharge
  • the edge area B of the OLED display substrate is not provided with spacers.
  • the fine metal mask 5 easily forms a large-area contact with the edge area B of the OLED display substrate . Resulting in electrostatic discharge during the evaporation process, and during the evaporation process, the OLED display substrate and the fine metal mask 5 will move relative to each other, friction further increases the probability of electrostatic discharge, electrostatic discharge will cause fine metal.
  • the damage of the mask 5, and then an abnormal vapor deposition affects the product yield of the OLED display substrate.
  • the damage of the fine metal mask 5 will also cause an increase in production costs.
  • the embodiments of the present disclosure provide an OLED display substrate, a manufacturing method thereof, and a display device, which can avoid electrostatic discharge during the evaporation process, improve the product yield of the OLED display substrate, and improve the fine metal mask. Long service life, saving production costs.
  • the embodiment of the present disclosure provides an OLED display substrate.
  • the OLED display substrate includes a display area A and an edge area B located at the periphery of the display area.
  • the edge area B of the OLED display substrate is provided with a protrusion 6 .
  • the raised portion 6 has a certain height, and the total area of the end surface of the raised portion 6 on the side of the base substrate 1 away from the OLED display substrate is smaller than the total area of the edge region B.
  • the use of fine metal When the mask plate 5 is vapor-deposited, the protrusions 6 can support the fine metal mask plate 5 to avoid large-area contact between the fine metal mask plate 5 and the edge region B.
  • the edge area of the OLED display substrate is provided with protrusions.
  • the fine metal mask is used to When the OLED display substrate is vapor-deposited, the raised portion can support the fine metal mask to avoid large-area contact between the fine metal mask and the edge area of the OLED display substrate, thereby avoiding electrostatic discharge during the evaporation process.
  • the product yield of the OLED display substrate is improved, and damage to the fine metal mask can be avoided, the service life of the fine metal mask can be increased, and the production cost can be saved.
  • spacers 4 are provided in the display area A of the OLED display substrate.
  • the spacers 4 can mask the fine metal.
  • the diaphragm 5 is supported to prevent the fine metal mask 5 from contacting the display area A.
  • the height difference between the end surface of the spacer 4 away from the back plate and the end surface of the protrusion 6 away from the back plate cannot be too large. If the end surface of the spacer 4 away from the back plate and the protrusion 6 away from the back plate The height difference between the end faces of the plate is too large, which will affect the flatness of the fine metal mask 5 and the effect of vapor deposition.
  • the end face of the spacer 4 away from the back plate and the end face of the protrusion 6 away from the back plate is not greater than a preset threshold. Specifically, the height difference between the end surface of the spacer 4 away from the back plate and the end surface of the protrusion 6 away from the back plate is not greater than 3 ⁇ m.
  • the backplane can be a glass substrate or a flexible backplane.
  • the end surface of the spacer 4 away from the back plate and the end surface of the protrusion 6 away from the back plate are located on the same horizontal plane, so that the flatness of the fine metal mask 5 can be maintained and abnormal evaporation can be avoided.
  • an insulating material can be used to make the raised portion 6.
  • the same material as part of the film layer of the OLED display substrate can be used to make the raised portion 6, so that the film forming equipment in the related art can be used to make the raised portion 6.
  • the protrusion 6 does not require additional film forming equipment to make the protrusion 6.
  • the protrusions 6 and the pixel defining layer 3 of the OLED display substrate are made of the same material, so that the same patterning process can be used in the edge area when the pixel defining layer 3 is formed in the display area A.
  • B forms all or part of the protrusion 6.
  • At least part of the protrusions 6 and the spacers 4 of the OLED display substrate are made of the same material, so that the same material can be used when making the pattern of the spacers 4 in the display area A.
  • the patterning process forms all or part of the protrusion 6 in the edge region B.
  • the material of the pixel defining layer 3 can be used to form the support 61 as the protrusion 6, specifically, the mask used to make the pixel defining layer in the related art can be The support 61 is changed to form the support 61.
  • the mask used to make the pixel defining layer in the related art includes the opaque pattern of the pixel defining layer 3 corresponding to the display area A and the light transmitting pattern other than the opaque pattern, using The mask patterned the entire layer of the pixel defining layer material to form a pattern of the pixel defining layer 3 in the display area A.
  • the mask is not transparent except for the pixel defining layer 3 corresponding to the display area A.
  • the support 61 In addition to the light pattern, it also includes the opaque pattern of the support 61 corresponding to the edge area B, so that the entire layer of the pixel defining layer material can be patterned by using the mask, not only to form the pixel defining layer 3 in the display area A , Can also form a support 61 at the edge area B.
  • the support 61 can be columnar, and the longitudinal section of the support 61 can be trapezoidal or rectangular.
  • the support 61 is not limited to a column, and can also have other shapes, such as a hemispherical shape.
  • an entire pixel defining layer may be formed in the edge area B, and then the protrusion 6 may be formed by trenching the pixel defining layer in the edge area B.
  • the mask used to make the pixel defining layer includes the opaque patterns of the pixel defining layer 3 corresponding to the display area A and the transparent patterns other than the opaque patterns. The mask is used to define the entire layer of the pixel defining layer The material is patterned to form a pattern of the pixel defining layer 3 in the display area A.
  • the mask includes the corresponding edge area B in addition to the opaque pattern of the pixel defining layer 3 corresponding to the display area A
  • the opaque pattern of the protrusion 621 and the semi-transmissive pattern of the groove 622 corresponding to the edge area B so that the mask is used to pattern the entire layer of the pixel defining layer material, not only can form the pixels in the display area A
  • the pattern of the delimiting layer 3 may also form protrusions 621 and grooves 622 located in the edge area B.
  • the thickness of the protrusions 621 is greater than the thickness of the grooves 622. Therefore, the protrusions 621 can be used as the protrusions 6
  • the fine metal mask 5 is supported.
  • an entire pixel defining layer 631 may be formed in the edge area B, and then auxiliary spacers 632 are formed on the pixel defining layer 631 in the edge area B to form the protrusion 6.
  • the auxiliary spacer 632 can be made of the same material as the spacer 4, and the auxiliary spacer 632 and the spacer 4 can be formed at the same time through the same patterning process. It is only necessary to make the spacer 4 in the related art. The mask can be changed.
  • the mask used to make the spacer 4 in the related art includes the opaque pattern of the spacer 4 corresponding to the display area A and the transparent pattern except the opaque pattern
  • the mask is used to pattern the entire layer of the spacer material to form the spacer 4 in the display area A.
  • the mask includes the spacer 4 corresponding to the display area A.
  • it also includes the opaque pattern of the auxiliary spacer 632 corresponding to the edge area B, so that the entire layer of the spacer material can be patterned by using the mask, not only to form the spacer in the display area A
  • an auxiliary spacer 632 located in the edge area B can also be formed, and the pixel defining layer 631 and the auxiliary spacer 632 can form the protrusion 6.
  • the embodiment of the present disclosure also provides a display device, including the OLED display substrate as described above.
  • the display device may be any product or component with a display function, such as a TV, a monitor, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device also includes a flexible circuit board, a printed circuit board, and a backplane.
  • the embodiments of the present disclosure also provide a manufacturing method of an OLED display substrate, the OLED display substrate including a display area and an edge area located at the periphery of the display area, and the manufacturing method includes:
  • a flat layer is formed on the back plate; and a protrusion is formed at the edge area.
  • the edge area of the OLED display substrate is provided with protrusions.
  • the fine metal mask is used to When the OLED display substrate is vapor-deposited, these protrusions can support the fine metal mask to avoid large-area contact between the fine metal mask and the edge area of the OLED display substrate, thereby avoiding electrostatic discharge during the evaporation process.
  • the product yield of the OLED display substrate is improved, and damage to the fine metal mask can be avoided, the service life of the fine metal mask can be increased, and the production cost can be saved.
  • spacers 4 are provided in the display area A of the OLED display substrate.
  • the spacers 4 can mask the fine metal.
  • the diaphragm 5 is supported to prevent the fine metal mask 5 from contacting the display area A.
  • the height difference between the end surface of the spacer 4 away from the back plate and the end surface of the protrusion 6 away from the back plate cannot be too large. If the end surface of the spacer 4 away from the back plate and the protrusion 6 away from the back plate The height difference between the end faces of the plate is too large, which will affect the flatness of the fine metal mask 5 and the effect of vapor deposition.
  • the end face of the spacer 4 away from the back plate and the end face of the protrusion 6 away from the back plate is not greater than a preset threshold. Specifically, the height difference between the end surface of the spacer 4 away from the back plate and the end surface of the protrusion 6 away from the back plate is not greater than 3 ⁇ m.
  • the end surface of the spacer 4 away from the back plate and the end surface of the protrusion 6 away from the back plate are located on the same horizontal plane, so that the flatness of the fine metal mask 5 can be maintained and abnormal evaporation can be avoided.
  • an insulating material can be used to make the raised portion 6.
  • the same material as part of the film layer of the OLED display substrate can be used to make the raised portion 6, so that the film forming equipment in the related art can be used to make the raised portion 6.
  • the protrusion 6 does not require additional film forming equipment to make the protrusion 6.
  • the protrusions 6 and the pixel defining layer 3 of the OLED display substrate are made of the same material, so that the same patterning process can be used in the edge area when the pixel defining layer 3 is formed in the display area A.
  • B forms all or part of the protrusion 6.
  • protrusions 6 and the pixel defining layer 3 of the OLED display substrate adopt the same material, forming the protrusions includes:
  • the pixel defining layer and the protrusion of the OLED display substrate are formed on the flat layer, wherein the pixel defining layer and the protrusion are made of the same material.
  • the material of the pixel defining layer 3 can be used to form the protrusion 61, specifically, the support can be formed by changing the mask used to make the pixel defining layer in the related art 61.
  • a mask used to make a pixel defining layer in the related art includes an opaque pattern of the pixel defining layer 3 corresponding to the display area A and a light-transmitting pattern other than the opaque pattern, and the mask is used to pair The entire layer of the pixel defining layer material is patterned to form a pattern of the pixel defining layer 3 in the display area A.
  • the mask includes the opaque pattern of the pixel defining layer 3 corresponding to the display area A.
  • the support 61 located in the edge area B is formed.
  • the support 61 may be columnar, and the longitudinal section of the support 61 may be trapezoidal or rectangular.
  • the support 61 is not limited to a column, and may also have other shapes, such as a hemispherical shape.
  • an entire pixel defining layer may be formed in the edge area B, and then the protrusion 6 may be formed by trenching the pixel defining layer in the edge area B.
  • the mask used to make the pixel defining layer in the related art includes the opaque pattern of the pixel defining layer 3 corresponding to the display area A and the transparent pattern other than the opaque pattern. The mask is used for the entire layer
  • the pixel defining layer material is patterned to form the pattern of the pixel defining layer 3 in the display area A.
  • the mask includes the opaque pattern of the pixel defining layer 3 corresponding to the display area A, and the corresponding The opaque pattern of the protrusion 621 in the edge area B and the semi-transmissive pattern of the groove 622 in the corresponding edge area B, so that the mask is used to pattern the entire layer of the pixel defining layer material, not only can be formed in the display area
  • the pattern of the pixel defining layer 3 of A can also form protrusions 621 and grooves 622 located in the edge area B.
  • the thickness of the protrusions 621 is greater than the thickness of the grooves 622. Therefore, the protrusions 621 can be used as protrusions.
  • the part 6 supports the fine metal mask 5.
  • At least part of the protrusions 6 and the spacers 4 of the OLED display substrate are made of the same material, so that the same material can be used when making the pattern of the spacers 4 in the display area A.
  • the patterning process forms all or part of the raised portion 6 in the edge region B.
  • the manufacturing method includes:
  • the spacer 4 located at the display area of the OLED display substrate and the protrusion 6 located at the edge area are formed, wherein the spacer 4 and the protrusion 6 are formed by Made of the same material.
  • a part of the protrusions 6 and the spacers 4 of the OLED display substrate are made of the same material, and another part of the protrusions 6 and the pixel defining layer 3 of the OLED display substrate are made of the same material.
  • the same patterning process can be used to form a part of the protrusion 6 in the edge area B.
  • the pattern of the pixel defining layer 3 can be made in the display area A while using the same pattern.
  • the secondary patterning process forms another part of the raised portion 6 in the edge region B.
  • Forming the protrusion includes:
  • the spacer at the display area and the second part of the protrusion at the edge area are formed, and the first part and the second part constitute the protrusion.
  • an entire pixel defining layer 631 can be formed in the edge area B, and then auxiliary spacers 632 are formed on the pixel defining layer 631 in the edge area B to form the protrusion 6.
  • the auxiliary spacer 632 can be made of the same material as the spacer 4, and the auxiliary spacer 632 and the spacer 4 can be formed at the same time through the same patterning process. It is only necessary to make the spacer 4 in the related art. The mask can be changed.
  • the mask used to make the spacer 4 in the related art includes the opaque pattern of the spacer 4 corresponding to the display area A and the transparent pattern except the opaque pattern
  • the mask is used to pattern the entire layer of the spacer material to form the spacer 4 in the display area A.
  • the mask includes the spacer 4 corresponding to the display area A.
  • it also includes the opaque pattern of the auxiliary spacer 632 corresponding to the edge area B, so that the entire layer of the spacer material can be patterned by using the mask, not only to form the spacer in the display area A
  • an auxiliary spacer 632 located in the edge area B can also be formed, and the pixel defining layer 631 and the auxiliary spacer 632 can form the protrusion 6.

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Abstract

一种OLED显示基板及其制作方法、显示装置，其中OLED显示基板具有显示区域(A)和位于显示区域(A)周边的边缘区域(B)，所述OLED显示基板包括背板和位于所述背板上的像素界定层(3)，其中在所述OLED显示基板的边缘区域(B)，在背板上设置有凸起部(6)。

Description

OLED显示基板及其制作方法、显示装置
相关申请的交叉引用
本申请主张在2019年6月21日在中国提交的中国专利申请号No.201910544755.0的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，特别是指一种OLED显示基板及其制作方法、显示装置。
背景技术
OLED显示器件为主动发光器件，无需背光源，在制作OLED显示基板时，需要将有机发光材料蒸镀到基板上，在制作完成OLED显示基板后，向OLED显示基板的阳极和阴极输入电流即可使有机发光材料发光。
在蒸镀工艺中，需要利用精细金属掩膜板(Fine Metal Mask，FMM)将有机发光材料蒸镀到基板上，在相关技术中OLED显示基板的制作工艺中，在进行蒸镀时，精细金属掩膜板容易与OLED显示基板的边缘区域形成大面积接触，导致在蒸镀过程中易产生静电释放情况，并且在蒸镀过程中，OLED显示基板与精细金属掩膜板会相对移动，摩擦进一步增大静电释放的发生几率，静电释放会造成精细金属掩膜板的破损，进而出现蒸镀异常，影响OLED显示基板的产品良率。
发明内容
本公开的实施例提供技术方案如下：
一方面，提供一种OLED显示基板，所述OLED显示基板具有显示区域和位于显示区域周边的边缘区域，所述OLED显示基板包括背板和位于所述背板上的像素界定层，其中在所述OLED显示基板的边缘区域，在背板上设置有凸起部。
可选地，在所述OLED显示基板的边缘区域，所述凸起部为在所述像素 界定层中形成的柱状结构。
可选地，至少部分所述凸起部与所述OLED显示基板的像素界定层采用相同的材料。
可选地，在所述OLED显示基板的显示区域，在所述像素界定层上还设置有隔垫物，位于所述边缘区域的凸起部与所述隔垫物为通过同一工艺同材料形成。
可选地，所述隔垫物远离背板的端面与所述凸起部远离背板的端面之间的高度差不大于预设阈值。
可选地，其中所述隔垫物远离背板的端面与所述凸起部远离背板的端面之间的高度差不大于3μm。
可选地，所述隔垫物远离背板的端面与所述凸起部远离背板的端面位于同一水平面上。
可选地，在所述背板和所述像素界定层之间设置有平坦层。
本公开实施例还提供了一种显示装置，包括如上所述的OLED显示基板。
本公开实施例还提供了一种OLED显示基板的制作方法，所述OLED显示基板包括显示区域和位于显示区域周边的边缘区域，所述制作方法包括：
在背板上形成平坦层；和
在所述边缘区域处形成凸起部。
可选地，所述在边缘区域处形成凸起部，包括：
通过同一次构图工艺，在所述平坦层上形成所述OLED显示基板的像素界定层和所述凸起部，其中所述像素界定层与所述凸起部由相同材料构成。
可选地，在所述背板上形成平坦层之后，该制作方法还包括：
在所述平坦层上形成像素界定层；以及
通过同一次构图工艺，形成位于所述OLED显示基板的显示区域处的隔垫物，和位于所述边缘区域的凸起部，其中所述隔垫物与所述凸起部由相同材料构成。
可选地，在所述背板上形成平坦层之后，该制作方法还包括：
通过同一次构图工艺，形成位于所述显示区域处的像素界定层和位于所述边缘区域处的凸起部的第一部分；
通过同一次构图工艺，形成位于所述显示区域处的隔垫物和位于所述边缘区域处的凸起部的第二部分，所述第一部分和所述第二部分组成所述凸起部。
可选地，该制作方法还包括：
在所述像素界定层所界定的像素区域内蒸镀有机发光材料。
附图说明
图1为相关技术中OLED显示基板的结构示意图；
图2为相关技术中OLED显示基板的制作工艺中，利用精细金属掩膜板进行蒸镀的示意图；
图3为本公开实施例OLED显示基板的结构示意图；
图4为本公开实施例OLED显示基板的制作工艺中，利用精细金属掩膜板进行蒸镀的示意图；
图5-图7为本公开具体实施例OLED显示基板的结构示意图。
具体实施方式
为使本公开的实施例要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
OLED显示器件为主动发光器件，无需背光源，在制作OLED显示基板时，需要将有机发光材料蒸镀到基板上，在制作完成OLED显示基板后，向OLED显示基板的阳极和阴极输入电流即可使有机发光材料发光。
在蒸镀工艺中，需要利用精细金属掩膜板(Fine Metal Mask，FMM)将有机发光材料蒸镀到基板上，通过FMM来实现在不同像素蒸镀上不同的有机发光材料，如图1所示，OLED显示基板的显示区域A上形成有薄膜晶体管阵列层2、像素界定层3和隔垫物4，其中，在像素界定层3限定出的像素区域内蒸镀不同颜色的有机发光材料。如图2所示，在进行蒸镀时，隔垫物4能够避免显示区域A与精细金属掩膜板5大面积接触，精细金属掩膜板5为金属材质，如果精细金属掩膜板5与OLED显示基板大面积接触，在接触位置很容易产生静电释放(ESD)，进而损伤精细金属掩膜板5，使精细金属 掩膜板5破损，出现蒸镀异常，比如R、G、B的材料蒸镀到其它位置，就会出现混色类不良。
如图1和图2所示，相关技术中OLED显示基板的边缘区域B未设置隔垫物，在进行蒸镀时，精细金属掩膜板5容易与OLED显示基板的边缘区域B形成大面积接触，导致在蒸镀过程中易产生静电释放情况，并且在蒸镀过程中，OLED显示基板与精细金属掩膜板5会相对移动，摩擦进一步增大静电释放的发生几率，静电释放会造成精细金属掩膜板5的破损，进而出现蒸镀异常，影响OLED显示基板的产品良率，另外由于精细金属掩膜板5的破损还会造成生产成本的上升。
本公开的实施例针对上述问题，提供一种OLED显示基板及其制作方法、显示装置，能够避免在蒸镀过程中发生静电释放情况，提高OLED显示基板的产品良率，提高精细金属掩膜板的使用寿命，节省生产成本。
本公开的实施例提供一种OLED显示基板，如图3所示，OLED显示基板包括显示区域A和位于显示区域周边的边缘区域B，所述OLED显示基板的边缘区域B设置有凸起部6。
其中，凸起部6具有一定的高度，且凸起部6远离OLED显示基板的衬底基板1一侧的端面的总面积小于边缘区域B的总面积，如图4所示，在利用精细金属掩膜板5进行蒸镀时，凸起部6能够对精细金属掩膜板5进行支撑，避免精细金属掩膜板5与边缘区域B大面积的接触。
本实施例中，为了避免精细金属掩膜板与边缘区域形成大面积接触，在OLED显示基板的边缘区域设置有凸起部，这样在OLED显示基板的制程中，在利用精细金属掩膜板对OLED显示基板进行蒸镀时，该凸起部能够对精细金属掩膜板进行支撑，避免精细金属掩膜板与OLED显示基板的边缘区域形成大面积接触，进而避免在蒸镀过程中发生静电释放情况，提高OLED显示基板的产品良率，并且能够避免精细金属掩膜板出现破损，提高精细金属掩膜板的使用寿命，节省生产成本。
如图3和图4所示，在OLED显示基板的显示区域A设置有隔垫物4，在利用精细金属掩膜板5对OLED显示基板进行蒸镀时，隔垫物4能够对精细金属掩膜板5进行支撑，避免精细金属掩膜板5与显示区域A接触。本实 施例中，隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差不能过大，如果隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差过大，会影响精细金属掩膜板5的平整度，影响蒸镀的效果，因此，隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差不大于预设阈值，具体地，隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差不大于3μm。
可选地，所述背板可以为玻璃基板，也可以是柔性背板。
可选地，隔垫物4远离背板的端面与凸起部6远离背板的端面位于同一水平面上，这样可以保持精细金属掩膜板5的平整度，避免出现蒸镀异常。
具体地，可以采用绝缘材料来制作凸起部6，可选地，可以采用与OLED显示基板的部分膜层相同的材料来制作凸起部6，这样可利用相关技术中的成膜设备来制作凸起部6，无需额外增加成膜设备来制作凸起部6。当然，也可以采用与OLED显示基板的膜层不同的材料专门制作凸起部6。
一具体实施例中，至少部分凸起部6与OLED显示基板的像素界定层3采用相同的材料，这样在显示区域A制作像素界定层3的图形的同时，可以利用同一次构图工艺在边缘区域B形成凸起部6的全部或者一部分。
另一具体实施例中，至少部分所述凸起部6与所述OLED显示基板的隔垫物4采用相同的材料，这样在显示区域A制作隔垫物4的图形的同时，可以利用同一次构图工艺在边缘区域B形成凸起部6的全部或者一部分。
一具体示例中，如图5所示，可以利用像素界定层3的材料形成支撑物61做为凸起部6，具体地，可以通过对相关技术中用以制作像素界定层的掩膜板进行改变来形成支撑物61，比如相关技术中用以制作像素界定层的掩膜板包括对应显示区域A的像素界定层3的不透光图形和除不透光图形之外的透光图形，利用该掩膜板对整层的像素界定层材料进行构图后形成位于显示区域A的像素界定层3的图形，本实施例中，掩膜板除包括对应显示区域A的像素界定层3的不透光图形之外，还包括对应边缘区域B的支撑物61的不透光图形，这样利用该掩膜板对整层的像素界定层材料进行构图后不但可以形成位于显示区域A的像素界定层3的图形，还可以形成位于边缘区域B的支撑物61。其中，支撑物61可以为柱状，支撑物61的纵截面可以为梯形或 矩形等，当然，支撑物61并不局限于为柱状，还可以为其他形状，比如半球状等。
另一具体示例中，如图6所示，可以在边缘区域B形成整层的像素界定层，之后通过对边缘区域B的像素界定层进行挖槽来形成凸起部6。用以制作像素界定层的掩膜板包括对应显示区域A的像素界定层3的不透光图形和除不透光图形之外的透光图形，利用该掩膜板对整层的像素界定层材料进行构图后形成位于显示区域A的像素界定层3的图形，本实施例中，掩膜板除包括对应显示区域A的像素界定层3的不透光图形之外，还包括对应边缘区域B的凸起621的不透光图形以及对应边缘区域B的凹槽622的半透光图形，这样利用该掩膜板对整层的像素界定层材料进行构图后不但可以形成位于显示区域A的像素界定层3的图形，还可以形成位于边缘区域B的凸起621和凹槽622，其中，凸起621的厚度大于凹槽622的厚度，因此，可以将凸起621做为凸起部6来对精细金属掩膜板5进行支撑。
另一具体示例中，如图7所示，可以在边缘区域B形成整层的像素界定层631，之后在边缘区域B的像素界定层631上形成辅助隔垫物632来组成凸起部6。其中，辅助隔垫物632可以采用与隔垫物4相同的材料，可以通过同一次构图工艺同时形成辅助隔垫物632与隔垫物4，只需要对相关技术中用以制作隔垫物4的掩膜板进行改变即可，相关技术中用以制作隔垫物4的掩膜板包括对应显示区域A的隔垫物4的不透光图形和除不透光图形之外的透光图形，利用该掩膜板对整层的隔垫物材料进行构图后形成位于显示区域A的隔垫物4，本实施例中，掩膜板除包括对应显示区域A的隔垫物4的不透光图形之外，还包括对应边缘区域B的辅助隔垫物632的不透光图形，这样利用该掩膜板对整层的隔垫物材料进行构图后不但可以形成位于显示区域A的隔垫物4，还可以形成位于边缘区域B的辅助隔垫物632，像素界定层631和辅助隔垫物632能够组成凸起部6。
本公开实施例还提供了一种显示装置，包括如上所述的OLED显示基板。所述显示装置可以为：电视、显示器、数码相框、手机、平板电脑等任何具有显示功能的产品或部件，其中，所述显示装置还包括柔性电路板、印刷电路板和背板。
本公开实施例还提供了一种OLED显示基板的制作方法，所述OLED显示基板包括显示区域和位于显示区域周边的边缘区域，所述制作方法包括：
在背板上形成平坦层；和在所述边缘区域处形成凸起部。
本实施例中，为了避免精细金属掩膜板与边缘区域形成大面积接触，在OLED显示基板的边缘区域设置有凸起部，这样在OLED显示基板的制程中，在利用精细金属掩膜板对OLED显示基板进行蒸镀时，这些凸起部能够对精细金属掩膜板进行支撑，避免精细金属掩膜板与OLED显示基板的边缘区域形成大面积接触，进而避免在蒸镀过程中发生静电释放情况，提高OLED显示基板的产品良率，并且能够避免精细金属掩膜板出现破损，提高精细金属掩膜板的使用寿命，节省生产成本。
如图3和图4所示，在OLED显示基板的显示区域A设置有隔垫物4，在利用精细金属掩膜板5对OLED显示基板进行蒸镀时，隔垫物4能够对精细金属掩膜板5进行支撑，避免精细金属掩膜板5与显示区域A接触。本实施例中，隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差不能过大，如果隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差过大，会影响精细金属掩膜板5的平整度，影响蒸镀的效果，因此，隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差不大于预设阈值，具体地，隔垫物4远离背板的端面与凸起部6远离背板的端面之间的高度差不大于3μm。
可选地，隔垫物4远离背板的端面与凸起部6远离背板的端面位于同一水平面上，这样可以保持精细金属掩膜板5的平整度，避免出现蒸镀异常。
具体地，可以采用绝缘材料来制作凸起部6，可选地，可以采用与OLED显示基板的部分膜层相同的材料来制作凸起部6，这样可利用相关技术中的成膜设备来制作凸起部6，无需额外增加成膜设备来制作凸起部6。当然，也可以采用与OLED显示基板的膜层不同的材料专门制作凸起部6。
一具体实施例中，至少部分凸起部6与OLED显示基板的像素界定层3采用相同的材料，这样在显示区域A制作像素界定层3的图形的同时，可以利用同一次构图工艺在边缘区域B形成凸起部6的全部或部分。
在全部凸起部6与OLED显示基板的像素界定层3采用相同的材料时， 形成所述凸起部包括：
通过同一次构图工艺，在所述平坦层上形成所述OLED显示基板的像素界定层和所述凸起部，其中所述像素界定层与所述凸起部由相同材料构成。
一具体示例中，如图5所示，可以利用像素界定层3的材料形成凸起部61，具体地，可以通过对相关技术中用以制作像素界定层的掩膜板进行改变来形成支撑物61，比如相关技术中用以制作像素界定层的掩膜板包括对应显示区域A的像素界定层3的不透光图形和除不透光图形之外的透光图形，利用该掩膜板对整层的像素界定层材料进行构图后形成位于显示区域A的像素界定层3的图形，本实施例中，掩膜板除包括对应显示区域A的像素界定层3的不透光图形之外，还包括对应边缘区域B的支撑物61的不透光图形，这样利用该掩膜板对整层的像素界定层材料进行构图后不但可以形成位于显示区域A的像素界定层3的图形，还可以形成位于边缘区域B的支撑物61。其中，支撑物61可以为柱状，支撑物61的纵截面可以为梯形或矩形等，当然，支撑物61并不局限于为柱状，还可以为其他形状，比如半球状等。
另一具体示例中，如图6所示，可以在边缘区域B形成整层的像素界定层，之后通过对边缘区域B的像素界定层进行挖槽来形成凸起部6。相关技术中用以制作像素界定层的掩膜板包括对应显示区域A的像素界定层3的不透光图形和除不透光图形之外的透光图形，利用该掩膜板对整层的像素界定层材料进行构图后形成位于显示区域A的像素界定层3的图形，本实施例中，掩膜板除包括对应显示区域A的像素界定层3的不透光图形之外，还包括对应边缘区域B的凸起621的不透光图形以及对应边缘区域B的凹槽622的半透光图形，这样利用该掩膜板对整层的像素界定层材料进行构图后不但可以形成位于显示区域A的像素界定层3的图形，还可以形成位于边缘区域B的凸起621和凹槽622，其中，凸起621的厚度大于凹槽622的厚度，因此，可以将凸起621做为凸起部6来对精细金属掩膜板5进行支撑。
另一具体实施例中，至少部分所述凸起部6与所述OLED显示基板的隔垫物4采用相同的材料，这样在显示区域A制作隔垫物4的图形的同时，可以利用同一次构图工艺在边缘区域B形成凸起部6的全部或一部分。
在全部凸起部6与OLED显示基板的隔垫物4采用相同的材料时，所述 制作方法包括：
在所述平坦层上形成像素界定层；以及
通过同一次构图工艺，形成位于所述OLED显示基板的显示区域处的隔垫物4，和位于所述边缘区域的凸起部6，其中所述隔垫物4与所述凸起部6由相同材料构成。
另一具体实施例中，一部分凸起部6与所述OLED显示基板的隔垫物4采用相同的材料，另一部分凸起部6与所述OLED显示基板的像素界定层3采用相同的材料，这样在显示区域A制作隔垫物4的图形的同时，可以利用同一次构图工艺在边缘区域B形成凸起部6的一部分，在显示区域A制作像素界定层3的图形的同时，可以利用同一次构图工艺在边缘区域B形成凸起部6的另一部分。
形成所述凸起部包括：
通过同一次构图工艺，形成位于所述显示区域处的像素界定层和位于所述边缘区域处的凸起部的第一部分；以及
通过同一次构图工艺，形成位于所述显示区域处的隔垫物和位于所述边缘区域处的凸起部的第二部分，所述第一部分和所述第二部分组成所述凸起部。
一具体示例中，如图7所示，可以在边缘区域B形成整层的像素界定层631，之后在边缘区域B的像素界定层631上形成辅助隔垫物632来组成凸起部6。其中，辅助隔垫物632可以采用与隔垫物4相同的材料，可以通过同一次构图工艺同时形成辅助隔垫物632与隔垫物4，只需要对相关技术中用以制作隔垫物4的掩膜板进行改变即可，相关技术中用以制作隔垫物4的掩膜板包括对应显示区域A的隔垫物4的不透光图形和除不透光图形之外的透光图形，利用该掩膜板对整层的隔垫物材料进行构图后形成位于显示区域A的隔垫物4，本实施例中，掩膜板除包括对应显示区域A的隔垫物4的不透光图形之外，还包括对应边缘区域B的辅助隔垫物632的不透光图形，这样利用该掩膜板对整层的隔垫物材料进行构图后不但可以形成位于显示区域A的隔垫物4，还可以形成位于边缘区域B的辅助隔垫物632，像素界定层631和辅助隔垫物632能够组成凸起部6。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”，或者可以存在中间元件。
以上所述是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (14)

  1. 一种OLED显示基板，具有显示区域和位于显示区域周边的边缘区域，所述OLED显示基板包括背板和位于所述背板上的像素界定层，
    其中在所述OLED显示基板的边缘区域，在背板上设置有凸起部。
  2. 根据权利要求1所述的OLED显示基板，其中在所述OLED显示基板的边缘区域，所述凸起部为在所述像素界定层中形成的柱状结构。
  3. 根据权利要求2所述的OLED显示基板，其中，至少部分所述凸起部与所述OLED显示基板的像素界定层采用相同的材料。
  4. 根据权利要求1所述的OLED显示基板，其中在所述OLED显示基板的显示区域，在所述像素界定层上还设置有隔垫物，位于所述边缘区域的凸起部与所述隔垫物材料相同，且通过同一步构图工艺制作。
  5. 根据权利要求4所述的OLED显示基板，其中所述隔垫物远离背板的端面与所述凸起部远离背板的端面之间的高度差不大于预设阈值。
  6. 根据权利要求5所述的OLED显示基板，其中所述隔垫物远离背板的端面与所述凸起部远离背板的端面之间的高度差不大于3μm。
  7. 根据权利要求5所述的OLED显示基板，其中，所述隔垫物远离背板的端面与所述凸起部远离背板的端面位于同一水平面上。
  8. 根据权利要求1-7中任一项所述的OLED显示基板，其中，在所述背板和所述像素界定层之间设置有平坦层。
  9. 一种显示装置，其特征在于，包括如权利要求1-8中任一项所述的OLED显示基板。
  10. 一种OLED显示基板的制作方法，所述OLED显示基板包括显示区域和位于显示区域周边的边缘区域，所述制作方法包括：
    在背板上形成平坦层；和
    在所述边缘区域处形成凸起部。
  11. 如权利要求10所述的制作方法，其中所述在边缘区域处形成凸起部，包括：
    通过同一次构图工艺，在所述平坦层上形成所述OLED显示基板的像素 界定层和所述凸起部，其中所述像素界定层与所述凸起部由相同材料构成。
  12. 如权利要求10所述的制作方法，其中在所述背板上形成平坦层之后，还包括：
    在所述平坦层上形成像素界定层；以及
    通过同一次构图工艺，形成位于所述OLED显示基板的显示区域处的隔垫物，和位于所述边缘区域的凸起部，其中所述隔垫物与所述凸起部由相同材料构成。
  13. 如权利要求10所述的制作方法，其中在所述背板上形成平坦层之后，还包括：
    通过同一次构图工艺，形成位于所述显示区域处的像素界定层和位于所述边缘区域处的凸起部的第一部分；
    通过同一次构图工艺，形成位于所述显示区域处的隔垫物和位于所述边缘区域处的凸起部的第二部分，所述第一部分和所述第二部分组成所述凸起部。
  14. 如权利要求11-13中任一项所述的制作方法，还包括：
    在所述像素界定层所界定的像素区域内蒸镀有机发光材料。
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