WO2020252956A1 - 显示面板及其制备方法 - Google Patents

显示面板及其制备方法 Download PDF

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Publication number
WO2020252956A1
WO2020252956A1 PCT/CN2019/106635 CN2019106635W WO2020252956A1 WO 2020252956 A1 WO2020252956 A1 WO 2020252956A1 CN 2019106635 W CN2019106635 W CN 2019106635W WO 2020252956 A1 WO2020252956 A1 WO 2020252956A1
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layer
bending
sub
area
region
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PCT/CN2019/106635
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English (en)
French (fr)
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闫博
曹君
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武汉华星光电半导体显示技术有限公司
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Priority to US16/614,298 priority Critical patent/US11424310B2/en
Publication of WO2020252956A1 publication Critical patent/WO2020252956A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present invention relates to the field of display technology, in particular to a display panel and a method for manufacturing the display panel.
  • Organic Light-Emitting Diode (Organic Light-Emitting Diode, referred to as: OLED) has the advantages of simple structure, fast response speed, active light emission, and low power consumption. It has been widely used in the display fields of mobile phones, flat panels, and TVs. With the development of differentiation, flexible and folding screens have become a trend.
  • a flexible OLED display panel usually includes a display part, a driver IC located in the non-display part, and metal traces connecting the driver IC and the display part.
  • the driver IC is distributed on the lower frame of the panel. In practical applications, the driver IC is usually folded to the display The bending area on the back of the panel is called Pad Bending area.
  • Pad Bending area generally includes flexible substrate, organic filling layer, metal traces, planarization layer (Planarization layer, abbreviated as: PLN), pixel definition layer (Pixel Define Layer, abbreviated as: PDL) and spacer particles (Photo Spacer, abbreviated as PS), Bending During the bending process of the region, the bending radius of each film layer is inconsistent. Therefore, the bending stress between the film layers is likely to cause the metal trace to break and reduce the reliability of the device.
  • Planarization layer abbreviated as: PLN
  • PDL pixel definition layer
  • PS Photo Spacer
  • the non-display part of the prior art OLED display panel has the technical defect that the bending stress generated when it is bent damages the metal wiring, and needs to be improved.
  • the present invention provides a display panel in which a conventional dielectric film layer stack structure is patterned in a non-display area, and a part of the packaging layer is combined to form a control layer, so that the neutral surface position when the Bending area is bent is close to the source/drain
  • the electrode is located on the layer, thereby reducing the influence of the bending stress on the metal wiring; in order to solve the technical defect that the bending stress damages the metal wiring in the non-display part of the prior art OLED display panel.
  • the present invention provides a display panel including a display area and a non-display area, and the non-display area is provided with a bending sub-area for bending, and the bending sub-area is provided with a neutrality for adjusting the bending sub-area.
  • the control layer where the surface is located;
  • the neutral surface of the bending subregion in the bending state is close to the metal trace in the bending subregion.
  • control layer includes a dike structure, and an elastic material layer formed in the dike structure.
  • the material of the dike structure adopts one of PLN film layer, PDL film layer, PS film layer material, or a combination of two or more materials; the material of the elastic material layer adopts The organic material for the organic encapsulation layer is prepared.
  • the enclosed area of the dike structure is flush with the edge of the bending section, and the elastic material layer is flush with the edge of the bending section; or the dike
  • the enclosed area of the structure is larger than the bending section, and the coverage area of the elastic material layer exceeds the bending section.
  • the dike structure includes at least two sub dike structures, two adjacent sub dike structures are arranged next to each other, and the two adjacent sub dike structures are both Corresponding sub-elastic material layers are provided.
  • the thicknesses of the elastic sublayers located in two adjacent sub-dam structures are the same or different, and the bullets located in two adjacent sub-dam structures
  • the elastic modulus of the sexual material layer is the same or different.
  • the dike structure is an integral single-layer structure.
  • the dike structure is a multi-layer structure arranged in layers.
  • a method for manufacturing a display panel includes the following steps:
  • the method further includes the following steps:
  • the display panel provided by the present invention patterns a part of the film layer of the display panel in the non-display area to form a bank structure, and fills the bank structure with a high elastic modulus organic material layer to cover On the film layer where the metal trace is located, the organic material layer matches the elastic modulus and thickness of the film layer on the other side of the metal trace, so that the neutral surface of the bending section can be close to the metal trace, reducing bending stress Damage to metal traces.
  • FIG. 1a is a schematic diagram of a front view of a display panel provided by the present invention.
  • Figure 1b is a schematic diagram of the A-A' cross-sectional structure in Figure 1a.
  • 2a and 2b are schematic diagrams of the neutral plane adjustment principle of the stacked layer of materials.
  • Fig. 3 is a schematic structural diagram of another embodiment of Fig. 1b.
  • Fig. 4 is a schematic structural diagram of another embodiment of Fig. 1b.
  • FIG. 5 is a flow chart of the method for manufacturing the display panel provided by the present invention.
  • the present invention aims at the non-display part of the prior art OLED display panel, which has the technical defect that the bending stress generated during bending damages the metal wiring, and this embodiment can solve this defect.
  • the display panel provided by an embodiment of the present invention includes a flexible substrate 101, a display area 102 located on the flexible substrate 101, and a non-display area 103 provided at one end of the display area 102;
  • the display area 102 is provided with a TFT device layer 104, an OLED light-emitting device 105, and an encapsulation layer.
  • the encapsulation layer is a superimposed layer of the first inorganic layer 110, the organic layer 111, and the second inorganic layer 112; in the non-display area 103
  • the source/drain metal trace 106 of the TFT device and the interlayer extension layer of the TFT device layer 104 and the OLED light-emitting device 105 are provided.
  • the interlayer extension layer includes the TFT device The PLN layer 113, the PDL layer 114, and the PS layer on the surface of the PDL layer 114, wherein the PLN layer 113 is used to planarize the film layer above the TFT device and other areas of the film layer to facilitate subsequent pixels Electrodes, OLED devices, etc.
  • the PDL layer 114 is used to form a pixel defined area on the film layer above the TFT device to facilitate subsequent positioning and preparation of the OLED device;
  • the PS is formed on the PDL layer 114 Above, the PS has a certain height, which is used to isolate the contact between the mask used in the organic light-emitting material evaporation process and the metal trace 106 on the surface of the flexible substrate 101, and to avoid mechanical damage to the metal trace 106.
  • the non-display area 103 is provided with an IC chip and a metal trace 106 connecting the IC chip and the display area 102, and the non-display area 103 is bent toward the back of the display panel to connect the IC
  • the chip is fixed to the back of the display panel, and the bent part is the bent sub-area 107 arranged in the non-display area 103.
  • the bending sub-region 107 includes a substrate layer, the substrate layer includes a flexible substrate 101 and an elastic layer 108 on the flexible substrate 101, the material of the elastic layer 108 can be selected as an organic material; the elastic layer 108 is embedded It is arranged in the flexible substrate 101, and the upper surface of the elastic layer 108 is flush with the upper surface of the flexible substrate 101; the metal trace 106 is provided on the substrate layer; and,
  • the control layer 109 covers the metal wiring 106; the main part of the control layer 109 is an organic material layer with a high elastic modulus.
  • the control layer 109 adopts the organic material of the display panel. Preparation of encapsulation layer materials.
  • the neutral surface of the laminated structure As shown in Figure 2a, during the bending process of the laminated structure, the outer layer is stretched and the inner layer is squeezed. There must be a transition layer on its cross-section that is neither stretched nor compressed, and the stress is almost zero. This transition layer is called the neutral surface of the laminated structure. However, the position of the neutral surface will vary depending on the combination of the thickness and elastic modulus of each material layer. The principle of adjusting the position of the neutral surface can be expressed by the following relationship:
  • the distance ⁇ between the neutral surface and the bottom surface can be calculated by the following formula:
  • Ei is the elastic modulus of the i-th layer
  • t1 is the film thickness of the i-th layer
  • hi is the distance from the top surface of the i-th layer to the bottom surface.
  • the neutral plane before adding the control layer, the neutral plane is located under the metal trace; after adding the control layer, the neutral plane shifts, and the distance from the metal trace is reduced to further avoid the Metal traces are damaged by bending stress.
  • the display panel provided by the embodiment of the present invention includes a flexible substrate 301, a display area on the flexible substrate 301, and a non-display area provided at one end of the display area; the display area is provided with The TFT device layer 304, the OLED light emitting device 305, and an encapsulation layer, the encapsulation layer is a superimposed layer of the first inorganic layer 310, the organic layer 311, and the second inorganic layer 312; the display area also includes a PLN layer 313 and a PDL layer 314 And the PS layer on the surface of the PDL layer 314.
  • the non-display area includes a bending sub-area 307, the bending sub-area 307 includes a substrate layer, and the substrate layer includes a flexible substrate 301 and an elastic layer 308 on the flexible substrate 301; metal traces 306, the metal The wiring 306 is disposed on the substrate layer; and, a control layer, which covers the metal wiring 306.
  • control layer includes a bank structure 309 formed on the surface of the bending sub-region 307, and an elastic material layer 315 formed in the bank structure 309; the elastic material layer 315 is made of an organic encapsulation layer The organic material is formed in the dike structure 309 by the IJP-inkjet printing method.
  • the enclosed area of the dike structure 309 is flush with the edge of the bending sub-region 307, and the elastic material layer 315 is flush with the edge of the bending sub-region 307 to cover at least the bending sub-region 307 , Protect the metal trace 306 in the bending area; or the enclosed area of the dike structure 309 is larger than the bending sub-region 307, and the coverage area of the elastic material layer 315 exceeds the bending sub-region 307.
  • the coverage area has been extended to the area outside the bending sub-region 307. For example, it can protect the surrounding metal traces 306 that may be affected by the bending sub-region 307 during the bending process. After the bending is completed, these The metal trace 306 will not be affected by bending stress.
  • the dike structure 309 can be set as an integrated single-layer structure.
  • the dike structure 309 and the elastic material layer 315 are prepared by the same IJP-inkjet printing method.
  • the advantage of the integrated molding is that it saves the preparation process and at the same time
  • the height of the dike structure 309 can be freely defined, and will not be restricted by the thickness of other film layers. In this way, the height of the dike structure 309 can be defined by the thickness requirement of the elastic material layer 315;
  • the single-layer structure is that the non-display area and the functional film layer on the side of the metal wiring 306 layer away from the flexible substrate 301 are selectively patterned to form the bank corresponding to the position of the bending sub-region 307 Structure 309.
  • the embankment structure 309 may be arranged as a multilayer structure stacked, for example, the embankment structure 309 includes a base layer, a superimposed layer, and a cushion layer, and the base layer adopts the PLN layer 313 pattern of the TFT device layer 304 Formed by chemical preparation, the overlay layer is formed by patterning the PDL layer 314 on the TFT device layer 304, the cushion layer is formed by patterning the PS layer disposed on the PDL layer 314, and the embankment
  • the base layer, the superimposed layer, and the stacked layer of the cushion layer of the structure 309 can be prepared by layered patterning, or the stacked layers can be prepared by the same photomask process.
  • the foregoing solution is to use the existing stacked layers for processing and set in the
  • the elastic material layer 315 in the dike structure 309 is prepared by the same manufacturing process as the organic encapsulation layer of the display panel, which relatively saves material costs.
  • the display panel provided by the embodiment of the present invention includes a flexible substrate 401, a display area on the flexible substrate 401, and a non-display area provided at one end of the display area; the display area is provided with TFT device layer 404, OLED light emitting device 105 and encapsulation layer, the encapsulation layer is a superimposed layer of a first inorganic layer 410, an organic layer 411, and a second inorganic layer 412; the display area also includes a PLN layer 413 and a PDL layer 414 And the PS layer on the surface of the PDL layer 414.
  • the non-display area includes a bending sub-area 407, which includes a flexible substrate 401, an elastic layer 408 on the flexible substrate 401, a metal trace 406 on the elastic layer 408, and a bank Structure and an elastic material layer arranged in the dike structure.
  • the dike structure includes at least two sub dike structures, and two sub dike structures are taken as an example for description, that is, the dike structure includes a first sub dike structure 4091 and a second sub dike structure 4092, And the first sub-dike structure 4091 and the second sub-dike structure 4092 are connected to each other.
  • the first sub-dike structure 4091 is provided with a first elastic material layer 4093
  • the second sub-dike structure 4092 is provided with a second elastic material layer 4094.
  • the first elastic material layer 4093 and the second The two elastic material layers 4094 are separated from each other by the border of the embankment structure.
  • the first elastic material layer 4093 and the second elastic material layer 4094 are located in different regions of the bending sub-region 407, and the thickness and elastic mode of the first elastic material layer 4093 and the second elastic material layer 4094 are The amount can be the same or different.
  • the thickness and elastic modulus of the first elastic material layer 4093 and the second elastic material layer 4094 can be adjusted according to the actual bending stress of each area.
  • the metal trace 406 can be fragile.
  • the area is set to a thicker thickness, and the relatively safe area is set to a thinner thickness.
  • the first sub-dike structure 4091 and the second sub-dike structure 4092 will be based on the first elastic material layer 4093
  • the height is set with the thickness of the second elastic material layer 4094.
  • the arrangement principle of the dike structure including more than two sub dike structures is the same as the above solution, and will not be repeated here.
  • the method includes the following steps:
  • the method further includes the following steps:
  • the method further includes the following steps:
  • the display panel can also be prepared by another method:
  • S10 providing a flexible substrate, providing a first area and a second area at one end of the first area on the surface of the flexible substrate, providing a bending sub-area in the second area, and preparing a TFT in the first area
  • an elastic layer is prepared in the second region, and the source/drain metal of the TFT device layer extends into the second region and is located on the surface of the elastic layer.
  • S20 Prepare a planarization layer and a pixel definition layer on the flexible substrate, and perform a patterning process on the pixel definition layer located in the first area.
  • S30 Perform a patterning process on the planarization layer and the pixel definition layer located in the second region, and form a bank structure in the bending sub-region.
  • step S20 further includes the steps:
  • the step S30 also includes the steps:
  • S301 Perform a patterning process on a stacked layer of the planarization layer, the pixel definition layer, and the spacer layer located in the second region, to form a bank structure in the bending sub-region.
  • the beneficial effects are: compared with the prior art, the display panel provided by the present invention patterned a part of the film layer of the display panel in the non-display area to form a bank structure, and filled the bank structure with organic materials with high elastic modulus Layer, covering the film layer where the metal trace is located.
  • the organic material layer matches the elastic modulus and thickness of the film layer on the other side of the metal trace, so that the neutral surface of the bending subarea can be close to the metal trace, reducing Damage to metal traces caused by small bending stress.

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Abstract

一种显示面板，在显示面板的非显示区，将介质膜层堆叠结构图案化，将之与部分封装层配合形成调控层，以将弯折段弯折时的中性面位置靠近源/漏极金属所在层，从而减小金属走线（306）受弯折应力的影响。

Description

显示面板及其制备方法 技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板及该显示面板的制备方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，简称：OLED)具有结构简单、响应速度快、主动发光、低功耗等优点，在手机、平板、电视等显示领域已经有了广泛的应用，随着产品差异化的发展，可挠曲、折叠屏已经成为一种趋势。
柔性OLED显示面板通常包括显示部分、位于非显示部分的驱动IC以及连接驱动IC与显示部分的金属走线，其中驱动IC分布在面板的下边框，在实际应用中，通常将驱动IC对折到显示面板背面，弯折的区域称为Pad Bending区域。
Pad Bending区域一般包括柔性基板、有机填充层、金属走线、平坦层(Planarizationlayer，简称：PLN)、像素定义层(Pixel Define Layer，简称：PDL)以及间隔粒子(Photo Spacer，简称PS)，Bending区域在弯折过程，各个膜层弯折半径不一致，因此产生的膜层间弯折应力容易使金属走线断裂，降低器件的可靠性。
综上所述，现有技术的OLED显示面板的非显示部分，存在其弯折时产生的弯折应力损伤金属走线的技术缺陷，需要改进。
技术问题
本发明提供一种显示面板，在非显示区将常规的介质膜层堆叠结构图案化，将之与部分封装层配合形成调控层，以将Bending区域弯折时的中性面位置靠近源/漏极所在层，从而减小金属走线受弯折应力的影响；以解决现有技术的OLED显示面板的非显示部分存在弯折应力损伤金属走线的技术缺陷。
技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种显示面板，包括显示区和非显示区，且所述非显示区设置有用于弯折的弯折子区，所述弯折子区处设置有用于调节所述弯折子区的中性面所处位置的调控层；
其中，通过调节所述调控层的弹性膜量和厚度，使得所述弯折子区在弯折状态下的中性面靠近所述弯折子区中的金属走线。
根据本发明一优选实施例，所述调控层包括围堤结构，以及形成于所述围堤结构内的弹 性材料层。
根据本发明一优选实施例，所述围堤结构的材料采用制备PLN膜层、PDL膜层、PS膜层材料的其中一种，或者两种以上的组合材料；所述弹性材料层的材料采用制备有机封装层的有机材料。
根据本发明一优选实施例，所述围堤结构的围合区域与所述弯折段边缘相平齐，且所述弹性材料层与所述弯折段边缘相平齐；或者所述围堤结构的围合区域大于所述弯折段，所述弹性材料层的覆盖面积超出所述弯折段。
根据本发明一优选实施例，所述围堤结构包括至少两个子围堤结构，相邻的两个所述子围堤结构相接设置，且相邻的两个所述子围堤结构内均设置有相应的子弹性材料层。
根据本发明一优选实施例，位于相邻两个所述子围堤结构内的所述子弹性材料层的厚度相同或不同，且位于相邻两个所述子围堤结构内的所述子弹性材料层的弹性模量相同或不同。
根据本发明一优选实施例，所述围堤结构为一体成型的单层结构。
根据本发明一优选实施例，所述围堤结构为层叠设置的多层结构。
依据本发明的上述目的，提供一种显示面板的制备方法，所述方法包括以下步骤：
S10，提供柔性基板，在所述柔性基板表面设置第一区域、以及位于所述第一区域一端的第二区域，在所述第二区域设置弯折子区，并在所述第一区域制备TFT器件层，所述TFT器件层的源/漏极金属延伸至所述第二区域内；
S20，在所述柔性基板上制备平坦化层，并对位于所述第二区域的平坦化层进行图案化处理，在所述弯折子区形成围堤结构的基础层；
S30，在所述柔性基板上制备像素定义层，并对位于所述第二区域的像素定义层进行图案化处理，在所述弯折子区形成围堤结构的叠加层；
S40，在所述第一区域制备OLED器件层，以及第一无机封装层；
S50，在所述第一无机封装层表面以及所述围堤结构内形成有机材料层，所述围堤结构与所述有机材料层形成用于调节所述弯折子区的中性面所处位置的调控层；
S60，在所述柔性基板表面制备第二无机封装层，所述第二无机封装层至少覆盖所述第一区域。
根据本发明一优选实施例，所述步骤S30之后还包括步骤：
S301，在所述柔性基板上制备间隔物层，并对所述间隔物层进行图案化处理，所述间隔物层在所述像素定义层上形成间隔柱，所述间隔物层在所述围堤结构的叠加层表面形成垫高层。
有益效果
与现有技术相比，本发明提供的显示面板，将显示面板位于非显示区的部分膜层图案化形成围堤结构，并在围堤结构内填充高弹性模量的有机材料层，覆盖在金属走线所在膜层上，该有机材料层与金属走线另一侧的膜层进行弹性模量和厚度的配合，可将弯折段的中性面靠近金属走线，减小弯折应力对金属走线的损伤。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1a为本发明提供的显示面板主视结构示意图；
图1b为图1a中A-A’截面结构示意图。
图2a、2b为材料堆叠层的中性面调整原理示意图。
图3为图1b另一实施例结构示意图。
图4为图1b又一实施例结构示意图。
图5为本发明提供的显示面板的制备方法流程图。
本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有技术的OLED显示面板的非显示部分，存在其弯折时产生的弯折应力损伤金属走线的技术缺陷，本实施例能够解决该缺陷。
如图1a、1b所示，本发明实施例提供的显示面板，包括柔性基板101以及位于所述柔性基板101上的显示区102、设置于所述显示区102一端的非显示区103；所述显示区102内设置有TFT器件层104、OLED发光器件105以及封装层，所述封装层为第一无机层110、有机层111、第二无机层112的叠加层；所述非显示区103内设置有所述TFT器件的源/漏极金属走线106、以及所述TFT器件层104和所述OLED发光器件105的层间延伸层，例如，所述层间延伸层包括所述TFT器件上的PLN层113、PDL层114以及所述PDL层114 表面的PS层，其中，所述PLN层113用于将TFT器件上方的膜层与该膜层的其他区域进行平坦化处理，便于后续像素电极、OLED器件等制备在平整的膜层表面；所述PDL层114用于在TFT器件上方的膜层形成像素限定区域，便于后续OLED器件的定位制备；所述PS形成于所述PDL层114上，所述PS具有一定高度，用于隔绝有机发光材料蒸镀工艺采用的掩膜板与柔性基板101表面金属走线106的接触，避免金属走线106的机械损伤。
所述非显示区103内设置有IC芯片，以及连接所述IC芯片与所述显示区102的金属走线106，所述非显示区103向所述显示面板背部弯折，以将所述IC芯片固定至所述显示面板背部，弯折的部分为设置于所述非显示区103的弯折子区107。
所述弯折子区107包括衬底层，所述衬底层包括柔性基板101和位于所述柔性基板101上的弹性层108，所述弹性层108的材料可选择为有机材料；所述弹性层108嵌设于所述柔性基板101内，且所述弹性层108上表面与所述柔性基板101的上表面平齐；金属走线106，所述金属走线106设置于所述衬底层上；以及，调控层109，所述调控层109覆盖所述金属走线106；所述调控层109的主要部分为具有高弹性模量的有机材料层，例如，所述调控层109采用所述显示面板的有机封装层材料制备。
如图2a所示，层叠结构在弯曲过程中，外层受拉伸，内层受挤压，在其断面上必然会有一个既不受拉，又不受压的过渡层，应力几乎等于零，这个过渡层称为层叠结构的中性面，然而，中性面的位置会受各材料层的厚度、弹性模量的组合不同而变化，中性面位置调整原理可用以下关系式来表示：
对于该叠层结构，中性面位置距底面距离λ，可由以下公式计算得出：
Figure PCTCN2019106635-appb-000001
其中：Ei为第i层的弹性模量；t1为第i层的膜厚；hi为第i层上表面距底面的距离。
如图2b所示，当在叠层结构上方添加一层i+1后其，中性面位置距底面距离λ’，可由以下公式计算得出：
Figure PCTCN2019106635-appb-000002
则中性面相对位置的变化量:
Δλ＝λ′-λ——1.3
另外：hi与ti又有以下对应关系：
Figure PCTCN2019106635-appb-000003
由公式1.1、1.2、1.3、1.4解得：
Figure PCTCN2019106635-appb-000004
因为：
Figure PCTCN2019106635-appb-000005
所以：
Figure PCTCN2019106635-appb-000006
即：Δλ＞0，中性面上移。
在本发明实施例中，添加所述调控层前，中性面位于所述金属走线下方；添加调控层后，中性面上移，距所述金属走线距离减小，进一步避免所述金属走线受弯曲应力影响导致损伤。
如图3所示，本发明实施例提供的显示面板，包括柔性基板301以及位于所述柔性基板301上的显示区、设置于所述显示区一端的非显示区；所述显示区内设置有TFT器件层304、OLED发光器件305以及封装层，所述封装层为第一无机层310、有机层311、第二无机层312的叠加层；所述显示区还包括PLN层313、PDL层314以及所述PDL层314表面的PS层。
所述非显示区包括弯折子区307，所述弯折子区307包括衬底层，所述衬底层包括柔性基板301和位于所述柔性基板301上的弹性层308；金属走线306，所述金属走线306设置于所述衬底层上；以及，调控层，所述调控层覆盖所述金属走线306。
具体的，所述调控层包括形成在所述弯折子区307表面的围堤结构309，以及形成于所述围堤结构309内的弹性材料层315；所述弹性材料层315采用制备有机封装层的有机材料通过IJP-喷墨打印的制备方式形成在所述围堤结构309内。
所述围堤结构309的围合区域与所述弯折子区307边缘相平齐，且所述弹性材料层315与所述弯折子区307边缘相平齐，以至少覆盖所述弯折子区307，保护所述弯折区域内的所述金属走线306；或者所述围堤结构309的围合区域大于所述弯折子区307，所述弹性材料层315的覆盖面积超出所述弯折子区307，已将覆盖范围扩展至所述弯折子区307之外的区域，例如，可保护所述弯折子区307弯折过程中可能影响到的其周边的金属走线306，弯折完成后这些金属走线306不会受到弯曲应力影响。
所述围堤结构309可设置为一体成型的单层结构，例如，所述围堤结构309与弹性材料层315选择相同的IJP-喷墨打印方式制备，一体成型的优势在于节省制备工序，同时可自由定义所述围堤结构309的高度，不会受到其他膜层厚度的限制，如此可通过所述弹性材料层315的厚度需求来定义所述围堤结构309的高度；又如，所述单层结构为将所述非显示区且 位于所述金属走线306层远离柔性基板301侧的功能膜层择一进行图案化处理，形成对应于所述弯折子区307位置的所述围堤结构309。
所述围堤结构309可设置为层叠设置的多层结构，例如，所述围堤结构309包括基础层、叠加层以及垫高层，所述基础层采用所述TFT器件层304的PLN层313图案化制备形成，所述叠加层采用所述TFT器件层304上的PDL层314图案化制备形成，所述垫高层采用设置于所述PDL层314上的PS层图案化制备形成，所述围堤结构309的基础层、叠加层以及垫高层的堆叠层可分层图案化制备，或者对其堆叠层采用同一光罩制程制备，前述方案是利用已有堆叠层进行加工处理，且设置于所述围堤结构309内的所述弹性材料层315采用所述显示面板的有机封装层同制程制备，相对节省材料成本。
如图4所示，本发明实施例提供的显示面板，包括柔性基板401以及位于所述柔性基板401上的显示区、设置于所述显示区一端的非显示区；所述显示区内设置有TFT器件层404、OLED发光器件105以及封装层，所述封装层为第一无机层410、有机层411、第二无机层412的叠加层；所述显示区还包括PLN层413、PDL层414以及所述PDL层414表面的PS层。
所述非显示区包括弯折子区407，所述弯折子区407包括柔性基板401、位于所述柔性基板401上的弹性层408、位于所述弹性层408上的金属走线406、以及围堤结构和设置于所述围堤结构内的弹性材料层。
所述围堤结构包括至少两个子围堤结构，以两个所述子围堤结构为例进行说明，即所述围堤结构包括第一子围堤结构4091和第二子围堤结构4092，且所述第一子围堤结构4091和所述第二子围堤结构4092相接设置。
所述第一子围堤结构4091内设置有第一弹性材料层4093，所述第二子围堤结构4092内设置有第二弹性材料层4094，所述第一弹性材料层4093与所述第二弹性材料层4094之间由围堤结构的边框相互隔离。
所述第一弹性材料层4093与所述第二弹性材料层4094位于所述弯折子区407的不同区域，所述第一弹性材料层4093与所述第二弹性材料层4094的厚度及弹性模量可相同或不同，可根据各区域的实际弯折应力调节所述第一弹性材料层4093与所述第二弹性材料层4094的厚度和弹性模量，例如将所述金属走线406脆弱的区域设置成较厚的厚度，而相对安全的区域设置为较薄的厚度，相应的，所述第一子围堤结构4091与所述第二子围堤结构4092会根据第一弹性材料层4093与所述第二弹性材料层4094的厚度设置高度。
所述围堤结构包括两个以上子围堤结构的设置原理与上述方案相同，此处不再赘述。
依据本发明的上述目的，提供一种显示面板的制备方法，如图5所示，所述方法包括以下步骤：
S10，提供柔性基板，在所述柔性基板表面设置第一区域、以及位于所述第一区域一端的第二区域，在所述第二区域设置弯折子区，并在所述第一区域制备TFT器件层，所述TFT器件层的源/漏极金属延伸至所述第二区域内。
S20，在所述柔性基板上制备平坦化层，并对位于所述第二区域的平坦化层进行图案化处理，在所述弯折子区形成围堤结构的基础层。
S30，在所述柔性基板上制备像素定义层，并对位于所述第二区域的像素定义层进行图案化处理，在所述弯折子区形成围堤结构的叠加层。
S40，在所述第一区域制备OLED器件层，以及第一无机封装层。
S50，在所述第一无机封装层表面以及所述围堤结构内形成有机材料层，所述围堤结构与所述有机材料层形成用于调节所述弯折子区的中性面所处位置的调控层。
S60，在所述柔性基板表面制备第二无机封装层，所述第二无机封装层至少覆盖所述第一区域。
根据本发明一优选实施例，所述步骤S10之后还包括步骤：
S101，在所述第二区域制备弹性层，所述TFT器件层的源/漏极金属延伸至所述第二区域内且位于所述弹性层表面。
根据本发明一优选实施例，所述步骤S30之后还包括步骤：
S301，在所述柔性基板上制备间隔物层，并对所述间隔物层进行图案化处理，所述间隔物层在所述像素定义层上形成间隔柱，所述间隔物层在所述围堤结构的叠加层表面形成垫高层。
又如，所述显示面板还可以采用另一种方法制备：
S10，提供柔性基板，在所述柔性基板表面设置第一区域、以及位于所述第一区域一端的第二区域，在所述第二区域设置弯折子区，并在所述第一区域制备TFT器件层，在所述第二区域制备弹性层，所述TFT器件层的源/漏极金属延伸至所述第二区域内且位于所述弹性层表面。
S20，在所述柔性基板上制备平坦化层以及像素定义层，并对位于所述第一区域的所述像素定义层进行图案化处理。
S30，对位于所述第二区域的所述平坦化层和所述像素定义层进行图案化处理，在所述弯折子区形成围堤结构。
S40，在所述第一区域制备OLED器件层，以及第一无机封装层。
S50，在所述第一无机封装层表面以及所述围堤结构内形成有机材料层，所述围堤结构与所述有机材料层形成用于调节所述弯折子区的中性面所处位置的调控层。
S60，在所述柔性基板表面制备第二无机封装层，所述第二无机封装层至少覆盖所述第一区域。
具体的，所述步骤S20还包括步骤：
S201，在所述像素定义层上制备间隔物层，并对位于所述第一区域的所述间隔物层进行图案化处理；
所述步骤S30还包括步骤：
S301，对位于所述第二区域的所述平坦化层、所述像素定义层以及所述间隔物层的堆叠层进行图案化处理，在所述弯折子区形成围堤结构。
有益效果为：与现有技术相比，本发明提供的显示面板，将显示面板位于非显示区的部分膜层图案化形成围堤结构，并在围堤结构内填充高弹性模量的有机材料层，覆盖在金属走线所在膜层上，该有机材料层与金属走线另一侧的膜层进行弹性模量和厚度的配合，可将弯折子区的中性面靠近金属走线，减小弯折应力对金属走线的损伤。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种显示面板，其包括：显示区和非显示区，且所述非显示区设置有用于弯折的弯折子区，所述弯折子区处设置有用于调节所述弯折子区的中性面所处位置的调控层和弹性层，所述调控层与所述弹性层对立设置于所述弯折子区的金属走线层两侧；
    其中，通过调节所述调控层和所述弹性层的弹性膜量和厚度，使得所述弯折子区在弯折状态下的中性面靠近所述弯折子区中的金属走线。
  2. 根据权利要求1所述的显示面板，其中，所述调控层包括围堤结构，以及形成于所述围堤结构内的弹性材料层。
  3. 根据权利要求2所述的显示面板，其中，所述围堤结构的围合区域与所述弯折子区边缘相平齐，且所述弹性材料层与所述弯折子区边缘相平齐；或者所述围堤结构的围合区域大于所述弯折子区，所述弹性材料层的覆盖面积超出所述弯折子区。
  4. 根据权利要求2所述的显示面板，其中，所述围堤结构包括至少两个子围堤结构，相邻的两个所述子围堤结构相接设置，且相邻的两个所述子围堤结构内均设置有相应的子弹性材料层。
  5. 根据权利要求4所述的显示面板，其中，位于相邻两个所述子围堤结构内的所述子弹性材料层的厚度相同或不同，且位于相邻两个所述子围堤结构内的所述子弹性材料层的弹性模量相同或不同。
  6. 根据权利要求3或4所述的显示面板，其中，所述围堤结构为一体成型的单层结构。
  7. 根据权利要求3或4所述的显示面板，其中，所述围堤结构为层叠设置的多层结构。
  8. 根据权利要求2所述的显示面板，其中，所述围堤结构的材料采用制备PLN膜层、PDL膜层、PS膜层材料的其中一种，或者两种以上的组合材料；所述弹性材料层的材料采用制备有机封装层的有机材料。
  9. 一种显示面板，其包括：显示区和非显示区，且所述非显示区设置有用于弯折的弯折子区，所述弯折子区处设置有用于调节所述弯折子区的中性面所处位置的调控层；
    其中，通过调节所述调控层的弹性膜量和厚度，使得所述弯折子区在弯折状态下的中性面靠近所述弯折子区中的金属走线。
  10. 根据权利要求9所述的显示面板，其中，所述调控层包括围堤结构，以及形成于所述围堤结构内的弹性材料层。
  11. 根据权利要求10所述的显示面板，其中，所述围堤结构的围合区域与所述弯折子区边缘相平齐，且所述弹性材料层与所述弯折子区边缘相平齐；或者所述围堤结构的围合区域大于所述弯折子区，所述弹性材料层的覆盖面积超出所述弯折子区。
  12. 根据权利要求10所述的显示面板，其中，所述围堤结构包括至少两个子围堤结构，相邻的两个所述子围堤结构相接设置，且相邻的两个所述子围堤结构内均设置有相应的子弹性材料层。
  13. 根据权利要求12所述的显示面板，其中，位于相邻两个所述子围堤结构内的所述子弹性材料层的厚度相同或不同，且位于相邻两个所述子围堤结构内的所述子弹性材料层的弹性模量相同或不同。
  14. 根据权利要求11或12所述的显示面板，其中，所述围堤结构为一体成型的单层结构。
  15. 根据权利要求11或12所述的显示面板，其中，所述围堤结构为层叠设置的多层结构。
  16. 根据权利要求10所述的显示面板，其中，所述围堤结构的材料采用制备PLN膜层、PDL膜层、PS膜层材料的其中一种，或者两种以上的组合材料；所述弹性材料层的材料采用制备有机封装层的有机材料。
  17. 显示面板制备方法，所述方法包括以下步骤：
    S10，提供柔性基板，在所述柔性基板表面设置第一区域、以及位于所述第一区域一端的第二区域，在所述第二区域设置弯折 子区，并在所述第一区域制备TFT器件层，所述TFT器件层的源/漏极金属延伸至所述第二区域内；
    S20，在所述柔性基板上制备平坦化层，并对位于所述第二区域的平坦化层进行图案化处理，在所述弯折子区形成围堤结构的基础层；
    S30，在所述柔性基板上制备像素定义层，并对位于所述第二区域的像素定义层进行图案化处理，在所述弯折子区形成围堤结构的叠加层；
    S40，在所述第一区域制备OLED器件层，以及第一无机封装层；
    S50，在所述第一无机封装层表面以及所述围堤结构内形成有机材料层，所述围堤结构与所述有机材料层形成用于调节所述弯折子区的中性面所处位置的调控层；
    S60，在所述柔性基板表面制备第二无机封装层，所述第二无机封装层至少覆盖所述第一区域。
  18. 根据权利要求17所述的制备方法，所述步骤S30之后还包括步骤：
    S301，在所述柔性基板上制备间隔物层，并对所述间隔物层进行图案化处理，所述间隔物层在所述像素定义层上形成间隔柱，所述间隔物层在所述围堤结构的叠加层表面形成垫高层。
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