WO2020251334A1 - 무선충전용 송수신 안테나와 그 제조 장치 및 제조 방법 - Google Patents
무선충전용 송수신 안테나와 그 제조 장치 및 제조 방법 Download PDFInfo
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- WO2020251334A1 WO2020251334A1 PCT/KR2020/007735 KR2020007735W WO2020251334A1 WO 2020251334 A1 WO2020251334 A1 WO 2020251334A1 KR 2020007735 W KR2020007735 W KR 2020007735W WO 2020251334 A1 WO2020251334 A1 WO 2020251334A1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/09—Winding machines having two or more work holders or formers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Definitions
- the present disclosure relates to a transmitting/receiving antenna for wireless charging, an apparatus for manufacturing the same, and a manufacturing method thereof, and a sheet for an antenna substrate with a connecting PCB attached thereto, and the plurality of connections starting from one of a plurality of connection terminals of the connection PCB.
- An antenna device including an antenna pattern ending at the other one of the terminals, wherein the antenna pattern includes a plurality of wires serving as one wire embedded in the antenna substrate sheet, and the plurality of wires are wound on the antenna substrate sheet. It relates to an antenna device and an apparatus and method for manufacturing the antenna device, including a bridge connecting the completed point and the connection PCB.
- the wet etching method is a method of forming an antenna pattern by corroding parts except for the antenna wire to be composed of strong acidic chemicals, so it is expensive and causes environmental pollution, or a separate pollution prevention facility is required.
- the dry etching and copper foil punching methods are similar in shape to the wet etching method, but complement the disadvantages of wet etching, and are widely used because they form an antenna pattern by a mechanical method.
- the use of an adhesive is essential to attach the antenna coil to the substrate during the manufacturing process, which causes a problem in durability.
- the antenna coil In order to expand the surface of the (conductor), several layers of copper foil antennas are stacked to form a stack. In order to stack several layers of copper foil antennas, a high-efficiency adhesive is used to ensure that each layer is firmly attached. . At this time, there are disadvantages of loss of charging efficiency due to an adhesive, which is a dielectric material that impairs the efficiency between transmission and reception, an additional process, an increase in defect rate, and an increase in production cost due to purchase of the adhesive.
- the method of embedding in a substrate using a single copper wire as a conductor of an antenna coil has advantages in that it is easy to manufacture and can increase the efficiency between transmission and reception because there is no material interfering between layers. In order to increase the surface area, a wire having a thick thickness may be used, but in this case, it is not suitable for miniaturization of electronic devices due to an increase in the thickness of the antenna device.
- the manufacturing process of dry etching or punching method is the mainstream, and the manufacturing of such a dry etching and punching method is a solidly processed copper sheet antenna coil on the base film. Since a fine and elaborate process must be used to adhere properly, the manufacturing cost has increased considerably. In addition, current loss occurs due to the influence of the dielectric properties of the adhesive due to the application of the adhesive between layers, as well as cutting thin sheets of 20 to 30 microns. Because it is a method of forming a single antenna coil, it can be easily damaged by a small force, so the manufacturing process is very complicated, such as having to form a separate protective film to protect the antenna coil, and adhesives, including copper foil, and base film ), etc. All subsidiary materials also have a problem that manufacturing costs are considerably high because high-purity materials must be used.
- the conventional method as described above requires a wider surface of the antenna coil to obtain a higher current during charging.
- a copper foil sheet as an antenna coil including etching and punching methods
- two or three layers are stacked. Raise it to improve the area of the surface.
- the antenna patterns formed between each layer must be accurately matched to reduce interference between antenna patterns, the lamination process is a very precise operation, and thus the process increases, and the defect rate also increases.
- the present disclosure is invented to solve the problems of the prior art as described above, and an antenna manufacturing apparatus and manufacturing method for wireless charging capable of improving the antenna manufacturing cost and reducing the antenna manufacturing cost and manufactured in this manner. It is an object to provide an antenna device.
- Another object of the present disclosure is to minimize errors in the manufacturing process due to an increase in the thickness of the overlapping area because the bridge is processed with thin copper foil at the overlapping portion of the wire in the manufacturing process, thereby significantly improving the manufacturing yield of the antenna. It is to provide a wireless charging antenna device having a thin structure and an apparatus and method for manufacturing the same.
- a base frame for mounting a sheet for an antenna substrate, a central frame disposed at an upper center of the base frame, and a plurality of wires are coupled to the central frame, and a plurality of wires are parallel to the antenna substrate sheet.
- An embedding head structure to be embedded at the same time, a welding module structure that is coupled to the central frame and welds an antenna pattern formed including the plurality of wires to a connecting PCB, and ends of the plurality of wires and the connection PCB.
- An antenna manufacturing apparatus comprising a copper foil adhesive structure for constructing a bridge to connect is provided.
- the bridge may be a copper foil or a composite including at least copper foil.
- the embedding head structure comprises an embedding head module for discharging the plurality of wires, and is coupled to an upper portion of the embedding head module to generate predetermined energy through ultrasonic vibration to melt the antenna substrate sheet. It may include an ultrasonic vibrator member.
- the embedding head structure may further include a wire supply rotating plate member, wherein a plurality of wires pulls for supplying each of the plurality of wires are formed at an upper end, and configured to be rotatable.
- the steps of simultaneously embedding a plurality of wires on a sheet for an antenna substrate in parallel, constructing a bridge connecting the ends of the plurality of wires to the connection PCB, and the start of the plurality of wires There is provided a method of manufacturing an antenna device comprising the step of welding an end and both ends of the bridge.
- attaching the connection PCB to the sheet for the antenna substrate may be further included.
- it may further include forming one or more openings in the antenna substrate sheet.
- At least one of the plurality of connection terminals of the connection PCB may be located in the one or more openings.
- a sheet for an antenna substrate to which a connecting PCB is attached and starting at one of a plurality of connection terminals of the connection PCB, ending at the other of the plurality of connection terminals.
- An antenna device including an antenna pattern, wherein the antenna pattern includes a plurality of wires embedded in the antenna substrate sheet and a bridge connecting the plurality of wires and the connection PCB.
- At least one opening is formed in the antenna substrate sheet, and at least one of the plurality of connection terminals of the connection PCB may be located in the at least one opening.
- positions of start ends of the plurality of wires and positions of both ends of the bridge may be welded.
- the antenna pattern is made of a plurality of wires serving as one line embedded in the sheet for the antenna substrate, and the start ends of the plurality of wires are welded at a position of terminal 1 of the connection PCB, and the plurality of An antenna device is provided, wherein the point where the winding of the wire of the antenna board is completed is welded at the position of terminal 2 of the connection PCB.
- a rotatable embedding head module and a wire supply module synchronously and rotationally interlocked with the embedding head module are provided, and a plurality of wires are embedded in parallel to serve as one line on a substrate sheet,
- the wire is bridged with a thin copper foil at the overlapping portion, the thickness of the overlapping portion is thinned, so that the antenna according to an embodiment of the present disclosure can be used in a slim electronic device.
- FIG. 1 is an explanatory diagram illustrating an example of a method of manufacturing a conventional wireless charging antenna.
- FIG. 2 is a schematic front view showing an antenna manufacturing apparatus for wireless charging according to an embodiment of the present disclosure.
- FIG 3 is a schematic side view showing an apparatus for manufacturing a wireless charging receiving antenna according to an embodiment of the present disclosure.
- FIG 4 is a partially enlarged view of an embedding head structure according to an embodiment of the present disclosure.
- 5A is a schematic explanatory view showing a periphery of an embedding head structure according to an embodiment of the present disclosure.
- 5B is a schematic explanatory view showing a periphery of a copper foil adhesive structure and a welding module structure according to an embodiment of the present disclosure.
- 6A to 6D are schematic diagrams showing in detail a wire nozzle of an embedding head structure according to an embodiment of the present disclosure.
- FIG. 7A and 7B are partially enlarged views illustrating a cross section of the wire nozzle of FIG. 6 in detail.
- FIG 8 is a partially enlarged view showing in detail the welding module structure according to an embodiment of the present disclosure.
- FIG. 9 is a flowchart illustrating a method of manufacturing an antenna device according to an embodiment of the present disclosure.
- 10A to 10G are explanatory diagrams showing in more detail the manufacturing process of the receiving antenna device for wireless charging according to the present disclosure.
- FIG. 11 is an explanatory diagram illustrating a process in which a plurality of wires are simultaneously embedded by an embedding head module in the manufacturing process of FIG. 10;
- first and second may be used to describe various components, but the components should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component.
- FIG. 2 is a schematic front view showing an apparatus for manufacturing an antenna for wireless charging according to an embodiment of the present disclosure
- FIG. 3 is a schematic side view showing an apparatus for manufacturing a receiving antenna for wireless charging according to an embodiment of the present disclosure.
- 4 is a partially enlarged view of an embedding head structure according to an embodiment of the present disclosure
- FIG. 5A is a schematic explanatory view showing a periphery of the embedding head structure according to an embodiment of the present disclosure
- FIG. 5B is an exemplary embodiment of the present disclosure.
- FIG. 6a to 6d is a schematic diagram showing in detail the wire nozzle of the embedding head structure according to an embodiment of the present disclosure
- 7A and 7B are partially enlarged views showing a cross-section of the wire nozzle of FIG. 6 in detail
- FIG. 8 is a partially enlarged view showing in detail the welding module structure according to an embodiment of the present disclosure
- FIG. 9 It is a flowchart illustrating a method of manufacturing an antenna device according to an embodiment of the disclosure
- FIGS. 10A to 10G are explanatory diagrams showing in more detail a manufacturing process of the receiving antenna device for wireless charging according to the present disclosure
- FIG. 11 Is an explanatory diagram illustrating a process in which a plurality of wires are simultaneously embedded by the embedding head module in the manufacturing process of FIG. 10.
- Hybrid-type wireless charging receiving antenna manufacturing apparatus 200 is formed in a box shape of a predetermined size as shown in Figs. 2 and 3, and an antenna substrate sheet (2) on the upper top plate (1) of the body And a base frame part 4 which is mounted and moves back and forth along the guide rail 3 installed at the lower end of the body;
- the first transfer plate member 6 is provided with screw rods 5A and 5B installed in the center of the base frame 4 at regular intervals in the upper and width directions and coupled to the front and rear surfaces of the middle part of the body in a screw manner, respectively.
- a central frame portion 10 formed to be fastened to each of the first transfer coupling member 8 and the second transfer coupling member 9 of the second transfer plate member 7 in a screw manner;
- a connecting, also referred to as a finger PCB, of the antenna board sheet 2 which is installed on the second transfer plate member 7 at regular intervals and placed in the base frame part 4 and bridged with copper foil.
- a bridge 13 is constructed with copper foil on the antenna substrate sheet 2 on which the multi-wire embedding process is completed through the copper foil adhesive structure 14, and the bridge 13
- the control unit 17 that comprehensively controls the process of manufacturing the wireless wire charging antenna according to the procedure of the program set to weld the connection PCB 15 of the sheet 2 for the antenna board after the construction has been completed through the welding module structure 16 Consists of including. [In FIG. 3, since the welding module structure 16 is covered by the copper foil adhesive structure 14, the welding module structure 16 is separately shown in the upper right of FIG. 3 for convenience.]
- the composite including copper foil may be, for example, in the form of bonding a flexible printed circuit board (FPCB) to copper foil.
- FPCB flexible printed circuit board
- a plurality of wires 11a to 11n which are drawn at a predetermined interval at the lower end of the body, are placed in parallel under the control of the controller 17.
- An ultrasonic vibrator member 19 that instantaneously melts the sheet 2 for an antenna substrate by generating a predetermined energy in the ultrasonic vibrator member 19, and the upper end of the ultrasonic vibrator member 19 are coupled via bearings 21a and 21b as a medium and embedding head module
- Wire spools (20a to 20n) for supplying a plurality of wires (11a to 11n) to (18) are formed on the upper end, and the body is formed in a disk shape, but is interlocked with the embedding head module (18) to provide a wire
- the rotating plate member 22 and the rotating shaft 23 are coupled via the bearings 21a and 21b coupled to the center of the wire supply rotating plate member 22, and the embedding head module 18 and the wire are controlled under the control of the controller 17.
- An embedding rotation motor 24 that rotates the supply rotation plate member 22 by a set rotation angle, and a coupling fixing member 25 at the upper end of the embedding rotation motor 24 are coupled via a coupling fixing member 25 to control pneumatic pressure under the control of the controller 17. It is configured to include an embedding pneumatic cylinder 26 for moving the body of the embedding head structure 12 fixed to the coupling fixing member 25 up and down.
- the coupling fixing member 25 has an upper end of the body coupled to the pneumatic rod 27 of the embedding pneumatic cylinder 26, as shown in FIGS. 4, 5A and 5B, while the embedding rotary motor 24 at the opposite lower end thereof.
- the upper end of) is coupled by screwing and is installed to be movable together with the entire body of the embedding head structure 12.
- the embedding head module 18 has a plurality of insertion holes 28 into which wires supplied from the wire spools 20a to 20e are inserted, for example, 5 are formed around the side of the body as shown in FIGS. 6a to 6d.
- holes 30a to 30n are formed in a cross-section of the lowermost wire nozzle 29 of the embedding head module 18 in a pentagonal structure as shown in FIGS. 7A and 7B.
- the distance A between the hole 30a and the hole 30b is preferably formed to be smaller than the diameter R of the hole.
- five holes 30a to 30n have a pentagonal shape, but the number or shape of the holes 30a to 30n is not limited thereto and may be implemented in various ways.
- the embedding head module 18, the copper foil adhesive structure 14, and the up, down, left, and right movement trajectories of the welding module structure 16 are detected or controlled.
- Detection sensors 31a to 31n that detect the detection point set by 17 and transmit it to the control unit 17 are installed, respectively.
- a plurality of vacuum adsorption nozzles 32 capable of adsorbing an object with a vacuum are installed at the lower end of the body as shown in FIGS. 2, 3, and 5B, and the control unit 17 360-degree bridge construction by attaching copper foil, etc. so that the wire does not crossover while moving up, down, left, and right from the end of the wire of the antenna board sheet (2) where the multi-wire embedding process is completed according to the function control.
- the rotatable copper foil bonding module 33 is coupled to the upper end of the copper foil bonding module 33 via a bonding fixing member 25 and fixed to the bonding fixing member 25 through pneumatic pressure under the function control of the controller 17. It is configured to further include a copper foil pneumatic cylinder 34 for moving the body of the copper foil bonding module 33 up and down.
- the welding module structure 16 includes the connection PCB 15 of the sheet 2 for the antenna substrate on which the bridge construction has been completed, as shown in FIGS. 3, 5B, and 8.
- the laser welding module 35 which moves to the left and right while welding with a laser beam, is coupled to the upper end of the laser welding module 35 via a welding fixing member 25 to control pneumatic pressure under the function control of the controller 17. It is configured to further include a welding pneumatic cylinder 36 for moving the body of the laser welding module 35 fixed to the welding fixing member 25 through the up and down.
- a space in which the sheet 2 for an antenna substrate, the connection PCB 15, and the bridge 13 can be placed is formed on the base frame unit 4, and the connection PCB 15 And an adhesive supply device 37 for applying the adhesive to the bridge 13 may be provided.
- the embedding head module 18 preferably prevents twisting of the multiple antenna wires in order to form an antenna having a loop pattern by connecting the multiple wires 11a to 11n in parallel.
- the embedding head module 18 moves while transmitting the ultrasonic vibration transmitted from the ultrasonic vibrator member 19 to the substrate 2 with the antenna wires 11a to 11n inserted into the holes 30a to 30n formed inside the head. Will do. That is, when viewed from an angle above the substrate 2, movement and rotation in the x, y, and z directions are performed.
- the laser welding module 35 includes, for example, wires 11a to 11n and bridges 13 and wires 11a to 11 when welding through the laser nozzle 38. 11n) and the connection PCB 15 may include a laser nozzle 38 that irradiates the lazy beam 41 while lightly pressing the welding head 39.
- the size of the lower end portion of the welding head 39 to which the upper portion is coupled to the lower end of the laser nozzle 38 is preferably 1.5 to 2.5 times the size of the antenna wire.
- the pressure pressing the welding head 39 is preferably about 10kg ⁇ 25kg/cm2.
- the multiple wires 11a to 11n are preferably formed in parallel with thin coils in order to increase the surface area while being thin like an etched or punched copper foil antenna.
- the base frame part 4 may include a pinion gear member 40 for moving the base frame part 4 back and forth in connection with the guide rail 3 installed at the lower end of the body. At this time, when the process of embedding the wires 11a to 11n is completed, the base frame part 4 moves to the opposite side based on the center frame part 10 to perform the construction and welding of the bridge 13.
- FIG. 9 is a flowchart illustrating a method of manufacturing an antenna device according to an embodiment of the present disclosure.
- a step (S1) of simultaneously embedding a plurality of wires 11a to 11n on the antenna substrate sheet 2 in parallel (S1), and the ends of the plurality of wires 11a to 11n (FIG. 10G)
- the step of constructing a bridge 13 connecting the "C" point in the) and the connection PCB (eg, the "terminal 1" point in FIG. 10G) (S2) and the start end of a plurality of wires 11a to 11n It may include a step (S3) of welding (point “B” in FIG. 10G) and both ends of the bridge 13 (point “terminal 2" and "C” in FIG. 10G).
- step S1, step S2, and step S3 the step of attaching the connection PCB 15 to the sheet 2 for an antenna substrate may be further included.
- step S1 may further include forming one or more openings (see “101” and “102” in FIGS. 10B to 10G) in the sheet 2 for the antenna substrate.
- the openings 101 and 102 may not be required.
- the positions of the openings 101 and 102 that is, both ends of the bridge 13 ("terminal 2" in FIG. 10G and The bridge 13 can be attached to the antenna substrate sheet 2 by welding the "C" point).
- connection PCB 15 is placed under the sheet 2 for the antenna substrate, but the connection PCB 15 is Both terminals 1 and 2 can be configured to be located in one elongated opening. That is, not only the terminal 2 is located in the opening 101, but in the present embodiment, both terminals 1 and 2 are located in one elongated opening.
- the bridge 13 may be disposed on the antenna substrate sheet 2.
- a sheet 2 for an antenna substrate is prepared from a material such as PVC, PET, Teslin, etc., which can embed wire by ultrasonic waves.
- connection PCB 15 in the case where the bridge 13 is disposed under the sheet 2 for an antenna substrate, the opening in the sheet 2 for an antenna substrate 2 with a laser or a punching tool (not shown) (Fig. Hole punching step (see FIG. 10B) of punching a hole in 10b (see “101” and “102”) but having a diameter similar to the thickness of the wires 11a to 11n, and FIG. 10c
- the connection PCB 15 can be attached as described above.
- the embedding head module 18 is driven and the antenna Take the wires (11a ⁇ 11n) and jump slightly higher than the thickness of the connection PCB (15) to place the antenna wires (11a ⁇ 11n) on the connection PCB (15) (at this time, the antenna wires (11a ⁇ 11n) are the connection PCB.
- the antenna can be formed by forming an antenna by reaching the point B and descending to the height at point A', and then reaching the point C and stopping the formation of the antenna.
- control unit 17 moves the first transfer coupling member 8 of the first transfer plate member 6 screwed with the screw rods 5A and 5B formed on the central frame 10 to transfer the first
- the base that moves the embedding head module 18 coupled to the plate member 6 left and right while moving the embedding pneumatic cylinder 26 coupled to the upper end of the embedding head module 18 up and down to move back and forth from the bottom thereof
- a plurality of wires 11a to 11n are formed in parallel on the sheet 2 for an antenna substrate placed in the frame 4.
- the embedding head module 18 forms, for example, five wires, and at the same time, the controller 17 drives the ultrasonic vibrator member 19 located at the top of the embedding head module 18 to generate ultrasonic waves. Wires 11a to 11n emitted from the embedding head module 18 by generating predetermined energy through vibration are embedded in the antenna substrate sheet 2 while instantaneously melting the antenna substrate sheet 2.
- the antenna lines that simultaneously form five wires 11a to 11n in parallel are wound multiple times on the sheet 2 for the antenna substrate while serving as one line when finally buried. (See Figure 10g).
- control unit 17 rotates the embedding head module 18 at the same angle according to the rotation direction of the wires 11a to 11n as shown in FIG. 10E. That is, the control unit 17 drives the embedding rotation motor 24 to rotate the embedding head module 18 by 360 degrees according to the rotation direction of the wires 11a to 11n, and at the same time, the embedding head module 18
- the wire supply rotating plate member 22 is also interlocked with the embedding head module 18 to rotate 360 degrees and release the wires 11a to 11n from the wire spools 20a to 20n.
- the embedding head module 18 and the wire supply rotating plate member 22 simultaneously rotate and interlock to form the antenna wires 11a to 11n once, the antenna wires 11a to 11n are formed in a circular shape. ), there is no overlapping or twisting of the wires 11a to 11n.
- the control unit 17 stops the driving of the embedding head module 18 and the axis of the embedding head module 18 (shown A cutting knife (not shown) attached to) descends, cuts the ends of the antenna wires 11a to 11n, and then moves the embedding head module 18 to the start position of the next process.
- control unit 17 moves the second transfer coupling member 9 of the second transfer plate member 7 screwed to the screw rod 5B formed in the central frame portion 10 as shown in FIG. 5B.
- the copper foil bonding module by moving the copper foil bonding module 33 coupled to the second transfer plate member 7 to the left and right while moving the copper foil pneumatic cylinder 34 coupled to the top of the copper foil bonding module 33 up and down.
- the copper foil bonding module 33 forms and connects the bridge 13 with the point C and the terminal 2 of the connection PCB 15 as shown in FIG. 10F.
- the bridge 13 is preferably made of a thin copper foil of about 10 to 40 ⁇ m, for example, but the width of the bridge 13 is preferably constructed so as to allow sufficient current to pass so as not to lose the amount of current generated by the antenna.
- the control unit 17 drives the welding module structure 16 as shown in FIG. 5B to weld the connection PCB 15, which is a connection terminal for the sheet for the antenna board, on which the bridge construction has been completed, to complete the wireless charging antenna 100. do.
- the control unit 17 moves the second transfer coupling member 9 of the second transfer plate member 7 screwed to the screw rods 5A and 5B formed on the central frame portion 10 to move the second transfer plate.
- the lower end of the laser welding module 35 by moving the welding pneumatic cylinder 36 coupled to the upper end of the laser welding module 35 up and down while moving the laser welding module 35 coupled to the member 7 left and right.
- the wireless charging antenna 100 is completed by welding the connection PCB 15, which is the connection terminal of the antenna board sheet 2 on which the bridge construction has been completed. That is, in the welding process, as shown in FIG. 10G, the wireless charging antenna is completed by welding the terminal 1 (point B), terminal 2, and point C of the connection PCB 15 using a laser compression technique.
- a punching mold (not shown) may be used in the completed antenna sheet according to product specifications.
- the antenna device manufactured according to an embodiment of the present disclosure starts with the antenna substrate sheet 2 to which the connection PCB 15 is attached, and one of the plurality of connection terminals of the connection PCB 15 (terminal 1).
- An antenna device 100 including an antenna pattern ending at the other one (terminal 2) of the plurality of connection terminals is provided.
- the antenna pattern is a point where the winding of the plurality of wires 11a to 11n and the plurality of wires 11a to 11n serving as one line embedded in the antenna substrate sheet 2 is completed on the antenna substrate sheet 2 It may include a bridge 13 connecting terminal 2 of the connection PCB 15 (eg, point "C" in FIG. 10G).
- one or more openings 101 and 102 are formed in the antenna substrate sheet 2, and at least one of the plurality of connection terminals (terminal 2) of the connection PCB 15 is one or more openings.
- the bridge 13 may be disposed under the sheet 2 for an antenna substrate.
- the positions (B or terminal 1) of the start ends of the plurality of wires 11a to 11n and the positions (C and terminals 2) of both ends of the bridge 13 are to be welded. I can.
- connection PCB 15 is placed under the sheet 2 for the antenna substrate, but the connection PCB 15 is It can be configured so that all terminals including terminals 1 and 2 are located in one elongated opening.
- the bridge 13 may be disposed on the antenna substrate sheet 2.
- the antenna pattern is made of a plurality of wires 11a to 11n serving as one line embedded in the sheet 2 for an antenna substrate, and the start of the plurality of wires 11a to 11n The end is welded at the position of terminal 1 of the connection PCB, and the point at which winding is completed on the antenna board sheet 2 of the plurality of wires 11a to 11n is welded at the position of terminal 2 of the connection PCB 15.
- An antenna device (not shown) may be provided.
- the overall thickness of the antenna device slightly increases in a portion where the plurality of wires 11a to 11n overlap, but there is an advantage in that the process time and process cost are reduced by omitting the bridge process.
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Abstract
Description
Claims (14)
- 안테나 기판용 시트를 장착하는 베이스 프레임과,상기 베이스 프레임의 중앙 상부에 배치되는 중앙 프레임과,상기 중앙 프레임에 결합되고, 상기 안테나 기판용 시트에 복수의 와이어를 병렬로 동시에 매립시키는 임베딩 헤드 구조체와,상기 중앙 프레임에 결합되고, 상기 복수의 와이어를 포함하여 형성된 안테나 패턴을 연결(connecting) PCB에 용접하는 용접 모듈 구조체와,상기 복수의 와이어의 끝 단과 상기 연결 PCB를 연결하는 브릿지를 시공하는 동박 접착 구조체를 포함하는, 안테나 제조 장치.
- 제1항에 있어서,상기 브릿지는 동박(copper foil) 또는 적어도 동박을 포함하는 복합체로 된, 안테나 제조 장치.
- 제1항에 있어서,상기 임베딩 헤드 구조체는,상기 복수의 와이어를 배출하는 임베딩 헤드 모듈과,상기 임베딩 헤드 모듈의 상부에 결합되어 초음파 진동을 통해 소정의 에너지를 발생시켜 상기 안테나 기판용 시트를 융해시키는 초음파 진동자 부재를 포함하는, 안테나 제조 장치.
- 제3항에 있어서,상기 임베딩 헤드 구조체는,상단부에 상기 복수의 와이어의 각각을 공급하는 복수의 와이어스 풀이 형성되고, 회전 가능하게 구성된 와이어 공급 회전판 부재를 더 포함하는, 안테나 제조 장치.
- 안테나 기판용 시트 상에 복수의 와이어를 병렬로 동시에 매립시키는 단계와,상기 복수의 와이어의 끝 단과 연결 PCB를 연결하는 브릿지를 시공하는 단계와,상기 복수의 와이어의 시작 단과, 상기 브릿지의 양 끝 단을 용접하는 단계를 포함하는, 안테나 장치의 제조 방법.
- 제5항에 있어서,상기 매립시키는 단계, 상기 브릿지를 시공하는 단계, 상기 용접하는 단계 중 어느 한 단계 전에,상기 연결 PCB를 상기 안테나 기판용 시트에 부착시키는 단계를 더 포함하는, 안테나 장치의 제조 방법.
- 제6항에 있어서,상기 매립시키는 단계 전에,상기 안테나 기판용 시트에 하나 이상의 개구를 형성하는 단계를 더 포함하는, 안테나 장치의 제조 방법.
- 제7항에 있어서,상기 연결 PCB의 복수의 접속단자 중 적어도 하나는 상기 하나 이상의 개구에 위치하는, 안테나 장치의 제조 방법.
- 연결(connecting) PCB가 부착된 안테나 기판용 시트와,상기 연결 PCB의 복수의 접속단자 중 하나에서 시작하여 상기 복수의 접속 단자 중 다른 하나에서 끝나는 안테나 패턴을 포함하는 안테나 장치로서,상기 안테나 패턴은 상기 안테나 기판용 시트에 매립된 1선 역할을 하는 복수의 와이어와, 상기 복수의 와이어가 상기 안테나 기판용 시트 상에서 와인딩이 완료되는 지점과 상기 연결 PCB를 연결하는 브릿지를 포함하는, 안테나 장치.
- 제9항에 있어서,상기 브릿지는 동박 또는 적어도 동박을 포함하는 복합체로 된, 안테나 장치.
- 제10항에 있어서,상기 안테나 기판용 시트에 하나 이상의 개구가 형성되고, 상기 연결 PCB의 복수의 접속단자 중 적어도 하나는 상기 하나 이상의 개구에 위치하는, 안테나 장치.
- 제11항에 있어서,상기 복수의 와이어의 시작 단의 위치와, 상기 브릿지의 양 끝 단의 위치들은 용접되는, 안테나 장치.
- 연결(connecting) PCB가 부착된 안테나 기판용 시트와,상기 연결 PCB의 복수의 접속단자 중 하나에서 시작하여 상기 복수의 접속 단자 중 다른 하나에서 끝나는 안테나 패턴을 포함하는 안테나 장치로서,상기 안테나 패턴은 상기 안테나 기판용 시트에 매립된 1선 역할을 하는 복수의 와이어로 이루어지고, 상기 복수의 와이어의 시작 단은 상기 연결 PCB의 단자 1의 위치에서 용접되고, 상기 복수의 와이어의 상기 안테나 기판용 시트 상에서 와인딩이 완료되는 지점은 상기 연결 PCB의 단자 2의 위치에서 용접되는, 안테나 장치.
- 제13항에 있어서,상기 안테나 기판용 시트에 하나 이상의 개구가 형성되고, 상기 연결 PCB의 복수의 접속단자 중 적어도 하나는 상기 하나 이상의 개구에 위치하는, 안테나 장치.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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US17/272,829 US20220352633A1 (en) | 2019-06-13 | 2020-06-15 | Transceiver Antenna for Wireless Charging, Apparatus and Method of Manufacturing the Same |
CN202080043829.3A CN114051645A (zh) | 2019-06-13 | 2020-06-15 | 用于无线充电的收发器天线、制造该收发器天线的设备及方法 |
EP20823629.9A EP3985797A4 (en) | 2019-06-13 | 2020-06-15 | TRANSMITTING AND RECEIVING ANTENNA FOR WIRELESS CHARGING AND DEVICE AND METHOD FOR PRODUCING THE SAME |
JP2021573754A JP7446340B2 (ja) | 2019-06-13 | 2020-06-15 | ワイヤレス充電用送受信アンテナと、その製造装置および製造方法 |
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KR1020190069837A KR102129590B1 (ko) | 2019-06-13 | 2019-06-13 | 하이브리드형 무선충전용 수신안테나 장치 및 그 제조방법 |
KR10-2019-0069837 | 2019-06-13 |
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KR102554573B1 (ko) * | 2020-08-24 | 2023-07-12 | 신명규 | 다중 와이어 임베딩 헤드 및 이를 이용한 플렉시블 케이블 제조 장치 |
CN114783760A (zh) * | 2022-05-30 | 2022-07-22 | 歌尔股份有限公司 | 无线充电线圈及其制备方法 |
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US20220352633A1 (en) | 2022-11-03 |
JP2022536517A (ja) | 2022-08-17 |
EP3985797A1 (en) | 2022-04-20 |
CN114051645A (zh) | 2022-02-15 |
EP3985797A4 (en) | 2023-11-15 |
KR102129590B1 (ko) | 2020-07-02 |
JP7446340B2 (ja) | 2024-03-08 |
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