WO2020248326A1 - Air blocking device, wafer feeding apparatus, and air blocking control method - Google Patents

Air blocking device, wafer feeding apparatus, and air blocking control method Download PDF

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Publication number
WO2020248326A1
WO2020248326A1 PCT/CN2019/096225 CN2019096225W WO2020248326A1 WO 2020248326 A1 WO2020248326 A1 WO 2020248326A1 CN 2019096225 W CN2019096225 W CN 2019096225W WO 2020248326 A1 WO2020248326 A1 WO 2020248326A1
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Prior art keywords
air barrier
wafer
telescopic
internal space
base
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PCT/CN2019/096225
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French (fr)
Chinese (zh)
Inventor
李�杰
赵建龙
王利强
葛林海
丁双生
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上海提牛机电设备有限公司
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Publication of WO2020248326A1 publication Critical patent/WO2020248326A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the present invention relates to the field of semiconductors, in particular to an air barrier device, wafer loading equipment and an air barrier control method.
  • Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer.
  • the wafer in the process of wafer loading, the wafer can be separated from the wafer cassette by a separating mechanism, and then the separated wafer is sent to the wafer processing tank area by a robot. Furthermore, the internal space is required. Open communication with the wafer tank area.
  • the invention provides an air blocking device, a wafer loading equipment and an air blocking control method to solve the problem that foreign matter such as acid mist and acid gas easily enters the internal space of the loading equipment.
  • an air barrier device for use in wafer loading equipment, comprising: a base, a telescopic mechanism, and an air barrier; the base is provided on the wafer loading equipment Frame, the telescopic mechanism is connected between the base and the air barrier;
  • the telescopic mechanism is used to control the expansion and contraction of the air barrier relative to the base;
  • the air barrier When the air barrier is extended relative to the substrate, it can be blocked between an internal space of the wafer loading equipment and an external wafer processing tank area;
  • the internal space and the wafer processing tank section can be communicated via a communication space, so that the robot can pass through the communication space to transfer the internal space
  • the wafer is transported to the wafer processor tank area.
  • the telescopic mechanism includes a telescopic rod, a rod sleeve structure, and a telescopic drive structure, the rod sleeve structure is provided on the base, the telescopic rod passes through the rod sleeve structure, and the telescopic drive structure is connected to the base.
  • the base body and the air barrier, and the telescopic rod is fixedly connected to the air barrier;
  • the telescopic drive structure is used to drive the telescopic rod to expand and contract with respect to the base body along its length direction, so that the air barrier plate expands and contracts with respect to the base body.
  • the telescopic drive structure is a telescopic cylinder structure.
  • the telescopic rod is fixedly connected to the air barrier through a fixing bar provided at its end, and the fixed bar is arranged along the surface of the air barrier and perpendicular to the telescopic rod.
  • the telescopic mechanism further includes a buffer structure, which connects the base and the air barrier, and is used to provide a buffering force when the air barrier is telescopic relative to the base.
  • the buffer structure and the telescopic drive structure are respectively located on both sides of the telescopic rod.
  • a surface of the air barrier plate opposite to the internal space is provided with elongated protrusions.
  • the length direction of the elongated protrusion is perpendicular to the expansion and contraction direction of the air barrier.
  • a wafer loading equipment including a rack, a separation mechanism for separating wafers and wafer cassettes, and an air blocking device related to the first aspect and its optional solutions; There is an internal space in the rack.
  • an air barrier control method which is applied in a wafer loading process, including:
  • the retractable mechanism controls the air barrier to retract, so that the internal space and the wafer processing tank Intervals can be connected by connecting spaces;
  • the extension of the corresponding air barrier is controlled by the telescopic mechanism until the wafer in the internal space is transported to the wafer processing tank area by a robot again; wherein, the wafer in the wafer processing tank area When the circle is processed, the air baffle can keep extending.
  • the air barrier in the air barrier device can be used to block between the internal space of the wafer loading equipment and the wafer processing tank area. In this way, foreign matter such as acid mist and acid gas generated during wafer processing in the wafer processing tank area is prevented from entering the wafer loading equipment, and the wafers, wafer boxes, etc. therein are prevented from being contaminated and damaged.
  • the air barrier can also be retracted to ensure that the robot can still transport the wafers smoothly.
  • Fig. 1 is a schematic diagram of the working principle of the air blocking device in an embodiment of the present invention
  • Fig. 2 is a first structural diagram of an air blocking device in an embodiment of the present invention.
  • Figure 3 is a second structural diagram of an air blocking device in an embodiment of the present invention.
  • Fig. 4 is a third structural diagram of an air blocking device in an embodiment of the present invention.
  • Fig. 5 is a schematic flow chart of an air barrier control method in an embodiment of the present invention.
  • Fig. 1 is a schematic diagram of the working principle of the air barrier device in an embodiment of the present invention
  • Fig. 2 is a schematic structural diagram 1 of the air barrier device in an embodiment of the present invention
  • Fig. 3 is a schematic structural diagram 2 of the air barrier device in an embodiment of the present invention
  • Figure 4 is a schematic view of the third embodiment of the air barrier device of the present invention.
  • the air barrier device used in the wafer loading equipment, includes: a base 2, a telescopic mechanism, and an air barrier partition 1; the base 2 is provided in the wafer loading equipment machine The telescopic mechanism is connected between the base 2 and the air barrier 1.
  • the telescopic mechanism is used to control the expansion and contraction of the air barrier 1 relative to the base 2.
  • the telescopic mechanism can be understood to be able to control the air barrier 1 to move in a linear direction, so that it can move linearly relative to the base 2. Because the air barrier 1 can exceed the shielding range of the base 2 during linear motion, the Linear motion can be understood as telescopic motion.
  • the air barrier 1 When the air barrier 1 extends relative to the substrate 2, it can block between an internal space of the wafer loading equipment and an external wafer processing tank area.
  • the internal space can refer to any part or all of the space in the wafer loading equipment. In the specific implementation process, it can be specifically a part of the space on the upper side of the separation mechanism 10 used to separate the wafer from the wafer cassette.
  • the separation mechanism The wafer separated by 10 may be on the upper side of the separation mechanism 10.
  • the wafer processing tank area can be understood as any area capable of processing wafers.
  • the internal space and the wafer processing tank section can be communicated via a communication space, so that the robot can pass through the communication space to connect the internal space
  • the wafers in the wafer are transported to the wafer processor tank area.
  • the communication space should be understood as simultaneously satisfying the following contents: the space connecting the internal space and the wafer processing tank area respectively; the space that can be blocked by the air barrier 1, and the space through which the robot transfers the wafer.
  • the communication space may not be formed by any physical structure, but may also be formed by a rack.
  • the air barrier in the air barrier device can be used to block the internal space between the wafer loading equipment and the wafer processing tank area, thereby avoiding the occurrence of wafer processing in the wafer processing tank area.
  • Foreign matter such as acid mist and acid gas enters the wafer loading equipment to prevent the wafers and wafer cassettes from being contaminated and damaged.
  • the air barrier can also be retracted to ensure that the robot can still transport the wafers smoothly.
  • the telescopic mechanism includes a telescopic rod 3, a rod sleeve structure 4 and a telescopic drive structure 5.
  • the rod sleeve structure 4 is provided on the base body 2, the telescopic rod 3 passes through the rod sleeve structure 4, and further, the rod sleeve structure 4 can play a guiding and limiting role for the telescopic rod 3 to avoid it The direction and position of expansion and contraction are deviated.
  • the rod sleeve structure 4 may have a through hole for the telescopic rod 3 to pass through.
  • the length of the through hole in the axial direction can be understood as limiting the rotation of the telescopic rod 3, and the axis of rotation can be understood as the axis perpendicular to the telescopic rod. Axial.
  • the telescopic drive structure 5 connects the base 2 and the air barrier 1, and the telescopic rod 3 is fixedly connected to the air barrier 1.
  • the telescopic drive structure 5 is used to drive the telescopic rod 3 to expand and contract with respect to the base 2 along its length direction, so that the air barrier 1 is telescopic with respect to the base 2.
  • the telescopic drive structure 5 can be any structure that can produce linear motion.
  • the telescopic drive structure 5 may be a telescopic cylinder structure.
  • the telescopic cylinder structure can be understood as any structure that can use the gas pressure change of the cylinder to actively cause the telescopic rod 3 to move linearly along its axial direction.
  • it may include a cylinder body and a piston rod.
  • the piston rod can be connected to the telescopic rod 3 and the cylinder body
  • the cavity in the middle can be connected to the air source to be controlled.
  • the telescopic drive structure 5 may also be a screw nut structure driven by a motor.
  • the telescopic rod 3 is fixedly connected to the air barrier 1 through a fixing strip 6 provided at its end, and the fixing strip 6 runs along the air barrier 1
  • the surface of 1 is set and perpendicular to the telescopic rod 3.
  • the fixing bar 6 can facilitate the generation of a force along the axial direction of the telescopic rod 3 with the telescopic rod 3, thereby facilitating the expansion and contraction of the air resistance partition plate 1 through the force.
  • both ends of the telescopic rod 3 can be kept at a certain distance from the air barrier 1, and the interval can be determined by the structural design of the fixing bar 6 and the rod sleeve structure 4. Form even intervals.
  • the fixing bar 6 and the air barrier 1 and the fixing bar 6 and the telescopic rod 3 can be fixedly connected together or assembled together.
  • the surface of the air barrier 1 opposite to the internal space is provided with elongated protrusions 7.
  • the elongated protrusions 7 may be integrated with the air barrier 1 or may be non-integrated, and then manufactured together through a process.
  • the length direction of the elongated protrusion 7 is perpendicular to the expansion and contraction direction of the air barrier 1.
  • the elongated protrusions 7 can improve the bending resistance of the air barrier plate 1 and effectively improve the stability of its shape and structure, which in turn can help increase the service life of the air barrier panel 1.
  • the telescopic mechanism may further include a buffer structure 9 which connects the base body 2 and the air barrier 1 and is used to connect the air barrier 1 It provides a cushioning force when telescoping relative to the base 2.
  • the buffer structure 9 can be a cylinder buffer structure, which can be understood as the gas pressure of any cylinder can passively change under the telescopic movement of the telescopic rod 3, and it is usually difficult to match the telescopic rod due to changes in gas pressure.
  • the expansion and contraction of 3 can generate a certain buffer force for the expansion and contraction of the telescopic rod 3, avoiding impact and wear between components due to the rapid and direct expansion and contraction movement, and further improving the service life of the structure.
  • the buffer structure 9 may also be an elastic buffer structure, for example, it may have a spring, so as to use the elastic force of the spring to produce a certain hindrance and buffer to the telescopic movement.
  • the buffer structure 9 and the telescopic drive structure 5 may be located on both sides of the telescopic rod 3 respectively.
  • the buffer structure 9 and the telescopic drive structure 5 may also be in pairs, and each pair of buffer structures 9 is symmetrical Distributed on both sides of the telescopic rod 3, each pair of telescopic drive structures 5 are symmetrically distributed on both sides of the telescopic rod 3.
  • a base 8 may be provided on the lower side of the base body 2, and the base 8 may be used to connect with the bracket.
  • the base 8 may be provided with a connecting part, which may be, for example, a locking part, a buckle part, etc., and the connecting part can be used to realize a detachable connection between the base 8 and the base 8.
  • This embodiment also provides a wafer loading equipment, including the air blocking device related to the first aspect and its optional solutions.
  • Fig. 5 is a schematic flow chart of an air barrier control method in an embodiment of the present invention.
  • the air barrier control method used in the wafer loading process including:
  • S102 Use a robot to transfer wafers, so that the wafers in the internal space can be transported to the wafer processing tank area through the communication space.
  • the air barrier can keep extending.
  • the separation mechanism 10 can be used to separate the wafer cassette and the wafer, and then the separation mechanism 10 can send the separated wafer to the upper side of the separation mechanism 10, so that The separated wafer is in the internal space mentioned above.
  • the separation mechanism 10 can be, for example, a "silicon wafer and cassette separation mechanism" with the publication number CN108372963A.
  • the air barrier in the air barrier device can be used to block the internal space of the wafer loading equipment from the wafer Between processing tank areas, so as to prevent foreign matter such as acid mist and acid gas generated during wafer processing in the wafer processing tank area from entering the wafer loading equipment, preventing the wafers, wafer boxes, etc. from being contaminated ,damage.
  • the air barrier can also be retracted to ensure that the robot can still transport the wafers smoothly.

Abstract

Provided are an air blocking device, a wafer feeding apparatus, and an air blocking control method. An air blocking plate in the air blocking device can be used to be blocked between an internal space of the wafer feeding apparatus and a wafer treatment groove area so as to prevent foreign matter, such as acid mist and acid gases, generated when a wafer is treated in the wafer treatment groove area from entering the wafer feeding apparatus and prevent the wafer and a wafer box therein from being polluted and damaged. Moreover, when the wafer needs to be transported, the air blocking plate can be retracted to ensure the smooth transport of the wafer by a mechanical arm.

Description

空气阻隔装置、晶圆上料设备与空气阻隔控制方法Air barrier device, wafer loading equipment and air barrier control method 技术领域Technical field
本发明涉及半导体领域，尤其涉及一种空气阻隔装置、晶圆上料设备与空气阻隔控制方法。The present invention relates to the field of semiconductors, in particular to an air barrier device, wafer loading equipment and an air barrier control method.
背景技术Background technique
晶圆是指硅半导体集成电路制作所用的硅晶片，由于其形状为圆形，故称为晶圆。Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer.
现有相关技术中，在晶圆上料的过程中，可利用分离机构将晶圆与晶圆盒分离，然后利用机械手将分离出的晶圆送至晶圆处理槽区，进而，内部空间需与晶圆槽区开放连通。In the related art, in the process of wafer loading, the wafer can be separated from the wafer cassette by a separating mechanism, and then the separated wafer is sent to the wafer processing tank area by a robot. Furthermore, the internal space is required. Open communication with the wafer tank area.
其中，晶圆处理槽区所产生的酸雾和酸气等异物易于进入到上料设备的内部空间，从而对其中的晶圆、晶圆盒等造成污染、损害。Among them, foreign matter such as acid mist and acid gas generated in the wafer processing tank area is easy to enter the internal space of the feeding equipment, thereby causing pollution and damage to the wafers, wafer cassettes, etc. therein.
发明内容Summary of the invention
本发明提供一种空气阻隔装置、晶圆上料设备与空气阻隔控制方法，以解决酸雾和酸气等异物易于进入到上料设备的内部空间的问题。The invention provides an air blocking device, a wafer loading equipment and an air blocking control method to solve the problem that foreign matter such as acid mist and acid gas easily enters the internal space of the loading equipment.
根据本发明的第一方面，提供了一种空气阻隔装置，用于晶圆上料设备中，包括：基体、伸缩机构，以及空气阻隔板；所述基体设于所述晶圆上料设备的机架，所述伸缩机构连接于所述基体与所述空气阻隔板之间；According to a first aspect of the present invention, there is provided an air barrier device for use in wafer loading equipment, comprising: a base, a telescopic mechanism, and an air barrier; the base is provided on the wafer loading equipment Frame, the telescopic mechanism is connected between the base and the air barrier;
所述伸缩机构用于控制所述空气阻隔板相对于所述基体伸缩；The telescopic mechanism is used to control the expansion and contraction of the air barrier relative to the base;
所述空气阻隔板相对于所述基体伸出时，能够阻挡于所述晶圆上料设备的一个内部空间与外部的晶圆处理槽区之间；When the air barrier is extended relative to the substrate, it can be blocked between an internal space of the wafer loading equipment and an external wafer processing tank area;
所述空气阻隔板相对于所述基体缩回时，所述内部空间与所述晶圆处理槽区间能够经连通空间相连通，以使得机械手能够穿过所述连通空间将所述内部空间中的晶圆运输至所述晶圆处理器槽区。When the air barrier is retracted relative to the substrate, the internal space and the wafer processing tank section can be communicated via a communication space, so that the robot can pass through the communication space to transfer the internal space The wafer is transported to the wafer processor tank area.
可选的，所述伸缩机构包括伸缩杆、杆套结构与伸缩驱动结构，所述杆 套结构设于所述基体，所述伸缩杆穿过所述杆套结构，所述伸缩驱动结构连接所述基体与所述空气阻隔板，所述伸缩杆与所述空气阻隔板固定连接；Optionally, the telescopic mechanism includes a telescopic rod, a rod sleeve structure, and a telescopic drive structure, the rod sleeve structure is provided on the base, the telescopic rod passes through the rod sleeve structure, and the telescopic drive structure is connected to the base. The base body and the air barrier, and the telescopic rod is fixedly connected to the air barrier;
所述伸缩驱动结构用于驱动所述伸缩杆沿其长度方向相对于所述基体伸缩，以使得所述空气阻隔板相对于所述基体伸缩。The telescopic drive structure is used to drive the telescopic rod to expand and contract with respect to the base body along its length direction, so that the air barrier plate expands and contracts with respect to the base body.
可选的，所述伸缩驱动结构为伸缩气缸结构。Optionally, the telescopic drive structure is a telescopic cylinder structure.
可选的，所述伸缩杆通过设于其末端的固定条与所述空气阻隔板固定连接，所述固定条沿所述空气阻隔板的表面设置，且垂直于所述伸缩杆。Optionally, the telescopic rod is fixedly connected to the air barrier through a fixing bar provided at its end, and the fixed bar is arranged along the surface of the air barrier and perpendicular to the telescopic rod.
可选的，所述伸缩机构还包括缓冲结构，所述缓冲结构连接所述基体与所述空气阻隔板，用于在所述空气阻隔板相对所述基体伸缩时提供缓冲作用力。Optionally, the telescopic mechanism further includes a buffer structure, which connects the base and the air barrier, and is used to provide a buffering force when the air barrier is telescopic relative to the base.
可选的，所述缓冲结构与所述伸缩驱动结构分别位于所述伸缩杆的两侧。Optionally, the buffer structure and the telescopic drive structure are respectively located on both sides of the telescopic rod.
可选的，所述空气阻隔板的用于与所述内部空间相对的一侧表面设有长条状凸起。Optionally, a surface of the air barrier plate opposite to the internal space is provided with elongated protrusions.
可选的，所述长条状凸起的长度方向垂直于所述空气阻隔板的伸缩方向。Optionally, the length direction of the elongated protrusion is perpendicular to the expansion and contraction direction of the air barrier.
根据本发明的第二方面，提供了一种晶圆上料设备，包括机架、用于分离晶圆与晶圆盒的分离机构，以及第一方面及其可选方案涉及的空气阻隔装置；所述机架内具有内部空间。According to a second aspect of the present invention, there is provided a wafer loading equipment, including a rack, a separation mechanism for separating wafers and wafer cassettes, and an air blocking device related to the first aspect and its optional solutions; There is an internal space in the rack.
根据本发明的第三方面，提供了一种空气阻隔控制方法，应用于晶圆上料过程中，包括：According to a third aspect of the present invention, there is provided an air barrier control method, which is applied in a wafer loading process, including:
在第一方面及其可选方案涉及的空气阻隔装置中的空气阻隔板伸出时，通过所述伸缩机构控制所述空气阻隔板缩回，以使得所述内部空间与所述晶圆处理槽区间能够经连通空间相连通；When the air barrier in the air barrier device according to the first aspect and its alternative solutions extends, the retractable mechanism controls the air barrier to retract, so that the internal space and the wafer processing tank Intervals can be connected by connecting spaces;
利用机械手传输晶圆，以使得所述内部空间中的晶圆能够经所述连通空间被输送至所述晶圆处理槽区；Using a robot to transfer wafers, so that the wafers in the internal space can be transported to the wafer processing tank area through the communication space;
通过所述伸缩机构控制对应的空气阻隔板伸出，直至再次需要利用机械手将所述内部空间中的晶圆输送至所述晶圆处理槽区；其中，所述晶圆处理槽区中的晶圆被处理时，所述空气阻隔板能够保持伸出。The extension of the corresponding air barrier is controlled by the telescopic mechanism until the wafer in the internal space is transported to the wafer processing tank area by a robot again; wherein, the wafer in the wafer processing tank area When the circle is processed, the air baffle can keep extending.
本发明提供的空气阻隔装置、晶圆上料设备与空气阻隔控制方法中， 利用空气阻隔装置中的空气阻隔板，可以阻隔在晶圆上料设备的内部空间与晶圆处理槽区之间，从而避免晶圆处理槽区中对晶圆进行处理时产生的酸雾和酸气等异物进入到晶圆上料设备中，防止其中的晶圆、晶圆盒等被污染、损坏。同时，需传输晶圆时，也可缩回空气阻隔板，以保障机械手依旧能顺利运输晶圆。In the air barrier device, wafer loading equipment and air barrier control method provided by the present invention, the air barrier in the air barrier device can be used to block between the internal space of the wafer loading equipment and the wafer processing tank area. In this way, foreign matter such as acid mist and acid gas generated during wafer processing in the wafer processing tank area is prevented from entering the wafer loading equipment, and the wafers, wafer boxes, etc. therein are prevented from being contaminated and damaged. At the same time, when wafers need to be transferred, the air barrier can also be retracted to ensure that the robot can still transport the wafers smoothly.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.
图1是本发明一实施例中空气阻隔装置的作用原理示意图；Fig. 1 is a schematic diagram of the working principle of the air blocking device in an embodiment of the present invention;
图2是本发明一实施例中空气阻隔装置的结构示意图一；Fig. 2 is a first structural diagram of an air blocking device in an embodiment of the present invention;
图3是本发明一实施例中空气阻隔装置的结构示意图二；Figure 3 is a second structural diagram of an air blocking device in an embodiment of the present invention;
图4是本发明一实施例中空气阻隔装置的结构示意图三；Fig. 4 is a third structural diagram of an air blocking device in an embodiment of the present invention;
图5是本发明一实施例中空气阻隔控制方法的流程示意图。Fig. 5 is a schematic flow chart of an air barrier control method in an embodiment of the present invention.
附图标记说明：Description of reference signs:
1-空气阻隔板；1- Air barrier;
2-基体；2-substrate;
3-伸缩杆；3- Telescopic rod;
4-杆套结构；4-rod sleeve structure;
5-伸缩驱动结构；5- Telescopic drive structure;
6-固定条；6-Fixed strip;
7-长条状凸起；7-Long protrusions;
8-底座；8-Base;
9-缓冲结构；9-Buffer structure;
10-分离机构。10- Separate mechanism.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行 清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本发明的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, but not necessarily Describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in a sequence other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations of them are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to the clearly listed Those steps or units may include other steps or units that are not clearly listed or are inherent to these processes, methods, products, or equipment.
下面以具体地实施例对本发明的技术方案进行详细说明。下面这几个具体的实施例可以相互结合，对于相同或相似的概念或过程可能在某些实施例不再赘述。The technical solutions of the present invention will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.
图1是本发明一实施例中空气阻隔装置的作用原理示意图；图2是本发明一实施例中空气阻隔装置的结构示意图一；图3是本发明一实施例中空气阻隔装置的结构示意图二；图4是本发明一实施例中空气阻隔装置的结构示意图三。Fig. 1 is a schematic diagram of the working principle of the air barrier device in an embodiment of the present invention; Fig. 2 is a schematic structural diagram 1 of the air barrier device in an embodiment of the present invention; Fig. 3 is a schematic structural diagram 2 of the air barrier device in an embodiment of the present invention Figure 4 is a schematic view of the third embodiment of the air barrier device of the present invention.
请参考图1至图4，空气阻隔装置，用于晶圆上料设备中，包括：基体2、伸缩机构，以及空气阻隔板1；所述基体2设于所述晶圆上料设备的机架，所述伸缩机构连接于所述基体2与所述空气阻隔板1之间。Please refer to Figures 1 to 4, the air barrier device, used in the wafer loading equipment, includes: a base 2, a telescopic mechanism, and an air barrier partition 1; the base 2 is provided in the wafer loading equipment machine The telescopic mechanism is connected between the base 2 and the air barrier 1.
所述伸缩机构用于控制所述空气阻隔板1相对于所述基体2伸缩。The telescopic mechanism is used to control the expansion and contraction of the air barrier 1 relative to the base 2.
其中的伸缩机构，可理解为能够控制空气阻隔板1沿直线方向移动，从而使其相对于基体2发生直线运动，因空气阻隔板1在直线运动时可超出基体2的遮挡范围，故而，该直线运动可理解为伸缩运动。The telescopic mechanism can be understood to be able to control the air barrier 1 to move in a linear direction, so that it can move linearly relative to the base 2. Because the air barrier 1 can exceed the shielding range of the base 2 during linear motion, the Linear motion can be understood as telescopic motion.
所述空气阻隔板1相对于所述基体2伸出时，能够阻挡于所述晶圆上料设备的一个内部空间与外部的晶圆处理槽区之间。When the air barrier 1 extends relative to the substrate 2, it can block between an internal space of the wafer loading equipment and an external wafer processing tank area.
其中的内部空间可以指晶圆上料设备内的任意部分或全部空间，具体实施过程中，可以具体为用于分离晶圆与晶圆盒的分离机构10上侧的部分空 间，其中，分离机构10分离出的晶圆可处于分离机构10的上侧。The internal space can refer to any part or all of the space in the wafer loading equipment. In the specific implementation process, it can be specifically a part of the space on the upper side of the separation mechanism 10 used to separate the wafer from the wafer cassette. The separation mechanism The wafer separated by 10 may be on the upper side of the separation mechanism 10.
其中的晶圆处理槽区，可理解为任意能够对晶圆进行处理的区域。The wafer processing tank area can be understood as any area capable of processing wafers.
所述空气阻隔板1相对于所述基体2缩回时，所述内部空间与所述晶圆处理槽区间能够经连通空间相连通，以使得机械手能够穿过所述连通空间将所述内部空间中的晶圆运输至所述晶圆处理器槽区。When the air barrier 1 is retracted relative to the base 2, the internal space and the wafer processing tank section can be communicated via a communication space, so that the robot can pass through the communication space to connect the internal space The wafers in the wafer are transported to the wafer processor tank area.
其中的连通空间，需理解为同时满足以下内容：分别连通内部空间与晶圆处理槽区的空间；能够被空气阻隔板1阻隔的空间，以及：机械手传输晶圆需穿过的空间。此外，该连通空间可以并非由任意实体结构形成，也可以由机架形成。The communication space should be understood as simultaneously satisfying the following contents: the space connecting the internal space and the wafer processing tank area respectively; the space that can be blocked by the air barrier 1, and the space through which the robot transfers the wafer. In addition, the communication space may not be formed by any physical structure, but may also be formed by a rack.
以上实施方式中，利用空气阻隔装置中的空气阻隔板，可以阻隔在晶圆上料设备的内部空间与晶圆处理槽区之间，从而避免晶圆处理槽区中对晶圆进行处理时产生的酸雾和酸气等异物进入到晶圆上料设备中，防止其中的晶圆、晶圆盒等被污染、损坏。同时，需传输晶圆时，也可缩回空气阻隔板，以保障机械手依旧能顺利运输晶圆。In the above embodiments, the air barrier in the air barrier device can be used to block the internal space between the wafer loading equipment and the wafer processing tank area, thereby avoiding the occurrence of wafer processing in the wafer processing tank area. Foreign matter such as acid mist and acid gas enters the wafer loading equipment to prevent the wafers and wafer cassettes from being contaminated and damaged. At the same time, when wafers need to be transferred, the air barrier can also be retracted to ensure that the robot can still transport the wafers smoothly.
其中一种实施方式中，请参考图2至图4，所述伸缩机构包括伸缩杆3、杆套结构4与伸缩驱动结构5。In one of the embodiments, please refer to FIGS. 2 to 4, the telescopic mechanism includes a telescopic rod 3, a rod sleeve structure 4 and a telescopic drive structure 5.
所述杆套结构4设于所述基体2，所述伸缩杆3穿过所述杆套结构4，进而，利用杆套结构4，可为伸缩杆3起到导向与限位作用，避免其伸缩方向以及位置发生偏离。The rod sleeve structure 4 is provided on the base body 2, the telescopic rod 3 passes through the rod sleeve structure 4, and further, the rod sleeve structure 4 can play a guiding and limiting role for the telescopic rod 3 to avoid it The direction and position of expansion and contraction are deviated.
故而，杆套结构4可以具有供伸缩杆3穿过的通孔，该通孔沿轴向的长度可理解为能够限制伸缩杆3发生转动，该转动的轴心可理解为垂直于伸缩杆的轴向。Therefore, the rod sleeve structure 4 may have a through hole for the telescopic rod 3 to pass through. The length of the through hole in the axial direction can be understood as limiting the rotation of the telescopic rod 3, and the axis of rotation can be understood as the axis perpendicular to the telescopic rod. Axial.
所述伸缩驱动结构5连接所述基体2与所述空气阻隔板1，所述伸缩杆3与所述空气阻隔板1固定连接。The telescopic drive structure 5 connects the base 2 and the air barrier 1, and the telescopic rod 3 is fixedly connected to the air barrier 1.
所述伸缩驱动结构5用于驱动所述伸缩杆3沿其长度方向相对于所述基体2伸缩，以使得所述空气阻隔板1相对于所述基体2伸缩。The telescopic drive structure 5 is used to drive the telescopic rod 3 to expand and contract with respect to the base 2 along its length direction, so that the air barrier 1 is telescopic with respect to the base 2.
其中的伸缩驱动结构5，可以为任意能够产生直线运动的结构。The telescopic drive structure 5 can be any structure that can produce linear motion.
具体实施过程中，伸缩驱动结构5可以为伸缩气缸结构。该伸缩气缸结构可以理解为任意能够利用气缸的气体压力变化，主动使得伸缩杆3沿其轴向发生直线移动的结构，例如可以包括气缸本体与活塞杆，活塞杆可连接伸 缩杆3，气缸本体中的空腔可对外连通气源，进而受控。During specific implementation, the telescopic drive structure 5 may be a telescopic cylinder structure. The telescopic cylinder structure can be understood as any structure that can use the gas pressure change of the cylinder to actively cause the telescopic rod 3 to move linearly along its axial direction. For example, it may include a cylinder body and a piston rod. The piston rod can be connected to the telescopic rod 3 and the cylinder body The cavity in the middle can be connected to the air source to be controlled.
另一具体实施过程中，伸缩驱动结构5也可以为采用电机驱动的丝杆螺母结构。In another specific implementation process, the telescopic drive structure 5 may also be a screw nut structure driven by a motor.
可见，任意已有或改进的直线运动的方案，均可应用于本实施例的伸缩驱动结构5，进而不脱离本实施例的范围。It can be seen that any existing or improved linear motion solution can be applied to the telescopic drive structure 5 of this embodiment without departing from the scope of this embodiment.
其中一种实施方式中，请参考图2至图4，所述伸缩杆3通过设于其末端的固定条6与所述空气阻隔板1固定连接，所述固定条6沿所述空气阻隔板1的表面设置，且垂直于所述伸缩杆3。In one of the embodiments, please refer to FIGS. 2 to 4, the telescopic rod 3 is fixedly connected to the air barrier 1 through a fixing strip 6 provided at its end, and the fixing strip 6 runs along the air barrier 1 The surface of 1 is set and perpendicular to the telescopic rod 3.
通过固定条6，可以便于与伸缩杆3之间产生沿伸缩杆3轴向的作用力，从而便于通过该作用力推动与拉动空气阻隔板1伸缩。The fixing bar 6 can facilitate the generation of a force along the axial direction of the telescopic rod 3 with the telescopic rod 3, thereby facilitating the expansion and contraction of the air resistance partition plate 1 through the force.
具体实施过程中，由于固定条6与杆套结构4，可以使得伸缩杆3的两端均与空气阻隔板1保持一定间隔，且该间隔可以因固定条6与杆套结构4的结构设计而形成均匀的间隔。In the specific implementation process, due to the fixing bar 6 and the rod sleeve structure 4, both ends of the telescopic rod 3 can be kept at a certain distance from the air barrier 1, and the interval can be determined by the structural design of the fixing bar 6 and the rod sleeve structure 4. Form even intervals.
固定条6与空气阻隔板1之间，以及固定条6与伸缩杆3之间，均可以是固定连接在一起的，也可以是装配在一起的。The fixing bar 6 and the air barrier 1 and the fixing bar 6 and the telescopic rod 3 can be fixedly connected together or assembled together.
其中一种实施方式中，所述空气阻隔板1的用于与所述内部空间相对的一侧表面设有长条状凸起7。该长条状凸起7可以是与空气阻隔板1一体的，也可以是非一体，进而通过工艺制作在一起的。In one of the embodiments, the surface of the air barrier 1 opposite to the internal space is provided with elongated protrusions 7. The elongated protrusions 7 may be integrated with the air barrier 1 or may be non-integrated, and then manufactured together through a process.
具体实施过程中，所述长条状凸起7的长度方向垂直于所述空气阻隔板1的伸缩方向。During specific implementation, the length direction of the elongated protrusion 7 is perpendicular to the expansion and contraction direction of the air barrier 1.
通过长条状凸起7，可以提高空气阻隔板1的抗弯性能，有效提高其形状、结构的稳定性，进而可有利于提高空气阻隔板1的使用寿命。The elongated protrusions 7 can improve the bending resistance of the air barrier plate 1 and effectively improve the stability of its shape and structure, which in turn can help increase the service life of the air barrier panel 1.
其中一种实施方式中，请参考图4，所述伸缩机构还可包括缓冲结构9，所述缓冲结构9连接所述基体2与所述空气阻隔板1，用于在所述空气阻隔板1相对所述基体2伸缩时提供缓冲作用力。In one of the embodiments, please refer to FIG. 4, the telescopic mechanism may further include a buffer structure 9 which connects the base body 2 and the air barrier 1 and is used to connect the air barrier 1 It provides a cushioning force when telescoping relative to the base 2.
具体实施过程中，缓冲结构9可以为气缸缓冲结构，该气缸缓冲结构可以理解为任意气缸的气体压力能够被动在伸缩杆3的伸缩运动下发生变化，进而因气体气压变化通常难以匹配于伸缩杆3的伸缩，其可对伸缩杆3的伸缩产生一定缓冲力，避免其因快速、直接的伸缩运动而使得部件之间发生冲击、磨损等，进一步提高结构的使用寿命。In the specific implementation process, the buffer structure 9 can be a cylinder buffer structure, which can be understood as the gas pressure of any cylinder can passively change under the telescopic movement of the telescopic rod 3, and it is usually difficult to match the telescopic rod due to changes in gas pressure. The expansion and contraction of 3 can generate a certain buffer force for the expansion and contraction of the telescopic rod 3, avoiding impact and wear between components due to the rapid and direct expansion and contraction movement, and further improving the service life of the structure.
在另一具体实施过程中，缓冲结构9还可以为弹性缓冲结构，具体可例如具有弹簧，以利用弹簧的弹性作用力对伸缩运动产生一定阻碍与缓冲。In another specific implementation process, the buffer structure 9 may also be an elastic buffer structure, for example, it may have a spring, so as to use the elastic force of the spring to produce a certain hindrance and buffer to the telescopic movement.
可见，任意已有或改进的能够对直线运动产生一定缓冲的方案，均可应用于本实施例的伸缩驱动结构5，进而不脱离本实施例的范围。It can be seen that any existing or improved solution that can produce a certain buffer for linear motion can be applied to the telescopic drive structure 5 of this embodiment without departing from the scope of this embodiment.
其中一种实施方式中，在同时具有所述缓冲结构9与所述伸缩驱动结构5的情况下，所述缓冲结构9与所述伸缩驱动结构5可以分别位于所述伸缩杆3的两侧。In one embodiment, when the buffer structure 9 and the telescopic drive structure 5 are provided at the same time, the buffer structure 9 and the telescopic drive structure 5 may be located on both sides of the telescopic rod 3 respectively.
另一实施方式中，在同时具有所述缓冲结构9与所述伸缩驱动结构5的情况下，所述缓冲结构9与所述伸缩驱动结构5也可以是呈对的，每对缓冲结构9对称分布于伸缩杆3的两侧，每对伸缩驱动结构5对称分布于伸缩杆3的两侧。In another embodiment, in the case of having the buffer structure 9 and the telescopic drive structure 5 at the same time, the buffer structure 9 and the telescopic drive structure 5 may also be in pairs, and each pair of buffer structures 9 is symmetrical Distributed on both sides of the telescopic rod 3, each pair of telescopic drive structures 5 are symmetrically distributed on both sides of the telescopic rod 3.
其中一种实施方式中，基体2的下侧可设有底座8，进而可利用底座8与支架连接。具体实施过程中，底座8可设有连接部件，该连接部件可以例如为锁定部件、卡扣部件等等，进而利用连接部件，可以实现底座8与之间之间的可拆卸连接。In one of the embodiments, a base 8 may be provided on the lower side of the base body 2, and the base 8 may be used to connect with the bracket. In the specific implementation process, the base 8 may be provided with a connecting part, which may be, for example, a locking part, a buckle part, etc., and the connecting part can be used to realize a detachable connection between the base 8 and the base 8.
本实施例还提供了一种晶圆上料设备，包括第一方面及其可选方案涉及的空气阻隔装置。This embodiment also provides a wafer loading equipment, including the air blocking device related to the first aspect and its optional solutions.
图5是本发明一实施例中空气阻隔控制方法的流程示意图。Fig. 5 is a schematic flow chart of an air barrier control method in an embodiment of the present invention.
请参考图5，空气阻隔控制方法，应用于晶圆上料过程中，包括：Please refer to Figure 5, the air barrier control method used in the wafer loading process, including:
S101：在以上所涉及的空气阻隔装置中的空气阻隔板伸出时，通过所述伸缩机构控制所述空气阻隔板缩回，以使得所述内部空间与所述晶圆处理槽区间能够经连通空间相连通。S101: When the air barrier in the above-mentioned air barrier device is extended, the retracting mechanism of the air barrier is controlled by the telescopic mechanism, so that the internal space and the wafer processing tank section can communicate The space is connected.
S102：利用机械手传输晶圆，以使得所述内部空间中的晶圆能够经所述连通空间被输送至所述晶圆处理槽区。S102: Use a robot to transfer wafers, so that the wafers in the internal space can be transported to the wafer processing tank area through the communication space.
S103：通过所述伸缩机构控制对应的空气阻隔板伸出，直至再次需要利用机械手将所述内部空间中的晶圆输送至所述晶圆处理槽区。S103: Control the extension of the corresponding air barrier through the telescopic mechanism until the wafer in the internal space needs to be transported to the wafer processing tank area by the robot again.
其中，所述晶圆处理槽区中的晶圆被处理时，所述空气阻隔板能够保持伸出。Wherein, when the wafer in the wafer processing tank area is processed, the air barrier can keep extending.
以上方法流程中有关技术特征、技术名词，以及技术效果的描述可参照前文所涉及的装置、设备实施例理解。The description of the relevant technical features, technical terms, and technical effects in the above method flow can be understood with reference to the device and equipment embodiments mentioned above.
此外，在空气阻隔板伸出的情况下，还能具体利用分离机构10分离晶圆盒与晶圆，进而分离机构10可将分离得到的晶圆送至分离机构10上侧，进而，可使得分离后的晶圆处于前文所涉及的内部空间。In addition, when the air barrier is extended, the separation mechanism 10 can be used to separate the wafer cassette and the wafer, and then the separation mechanism 10 can send the separated wafer to the upper side of the separation mechanism 10, so that The separated wafer is in the internal space mentioned above.
该分离机构10可例如公开号为CN108372963A的“硅片与片盒脱离机构”。The separation mechanism 10 can be, for example, a "silicon wafer and cassette separation mechanism" with the publication number CN108372963A.
综上所述，本实施例提供的空气阻隔装置、晶圆上料设备与空气阻隔控制方法中，利用空气阻隔装置中的空气阻隔板，可以阻隔在晶圆上料设备的内部空间与晶圆处理槽区之间，从而避免晶圆处理槽区中对晶圆进行处理时产生的酸雾和酸气等异物进入到晶圆上料设备中，防止其中的晶圆、晶圆盒等被污染、损坏。同时，需传输晶圆时，也可缩回空气阻隔板，以保障机械手依旧能顺利运输晶圆。In summary, in the air barrier device, wafer loading equipment, and air barrier control method provided in this embodiment, the air barrier in the air barrier device can be used to block the internal space of the wafer loading equipment from the wafer Between processing tank areas, so as to prevent foreign matter such as acid mist and acid gas generated during wafer processing in the wafer processing tank area from entering the wafer loading equipment, preventing the wafers, wafer boxes, etc. from being contaminated ,damage. At the same time, when wafers need to be transferred, the air barrier can also be retracted to ensure that the robot can still transport the wafers smoothly.
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: It is still possible to modify the technical solutions described in the foregoing embodiments, or equivalently replace some or all of the technical features; these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention range.

Claims (10)

  1. 一种空气阻隔装置，用于晶圆上料设备中，其特征在于，包括：基体、伸缩机构，以及空气阻隔板；所述基体设于所述晶圆上料设备的机架，所述伸缩机构连接于所述基体与所述空气阻隔板之间；An air barrier device used in wafer loading equipment, characterized in that it comprises: a base, a telescopic mechanism, and an air barrier; the base is arranged on the frame of the wafer feeding equipment, and the telescopic The mechanism is connected between the base and the air barrier;
    所述伸缩机构用于控制所述空气阻隔板相对于所述基体伸缩；The telescopic mechanism is used to control the expansion and contraction of the air barrier relative to the base;
    所述空气阻隔板相对于所述基体伸出时，能够阻挡于所述晶圆上料设备的一个内部空间与外部的晶圆处理槽区之间；When the air barrier is extended relative to the substrate, it can be blocked between an internal space of the wafer loading equipment and an external wafer processing tank area;
    所述空气阻隔板相对于所述基体缩回时，所述内部空间与所述晶圆处理槽区间能够经连通空间相连通，以使得机械手能够经所述连通空间将所述内部空间中的晶圆运输至所述晶圆处理器槽区。When the air barrier is retracted relative to the substrate, the internal space and the wafer processing tank section can be connected through a communication space, so that the robot can transfer the crystal in the internal space through the communication space. The circle is transported to the wafer processor slot area.
  2. 根据权利要求1所述的装置，其特征在于，所述伸缩机构包括伸缩杆、杆套结构与伸缩驱动结构，所述杆套结构设于所述基体，所述伸缩杆穿过所述杆套结构，所述伸缩驱动结构连接所述基体与所述空气阻隔板，所述伸缩杆与所述空气阻隔板固定连接；The device according to claim 1, wherein the telescopic mechanism includes a telescopic rod, a rod sleeve structure and a telescopic drive structure, the rod sleeve structure is provided on the base, and the telescopic rod passes through the rod sleeve Structure, the telescopic drive structure connects the base body and the air barrier, and the telescopic rod is fixedly connected to the air barrier;
    所述伸缩驱动结构用于驱动所述伸缩杆沿其长度方向相对于所述基体伸缩，以使得所述空气阻隔板相对于所述基体伸缩。The telescopic drive structure is used to drive the telescopic rod to expand and contract with respect to the base body along its length direction, so that the air barrier plate expands and contracts with respect to the base body.
  3. 根据权利要求2所述的装置，其特征在于，所述伸缩驱动结构为伸缩气缸结构。The device according to claim 2, wherein the telescopic drive structure is a telescopic cylinder structure.
  4. 根据权利要求2所述的装置，其特征在于，所述伸缩杆通过设于其末端的固定条与所述空气阻隔板固定连接，所述固定条沿所述空气阻隔板的表面设置，且垂直于所述伸缩杆。The device according to claim 2, wherein the telescopic rod is fixedly connected to the air barrier through a fixing bar provided at its end, and the fixing bar is arranged along the surface of the air barrier and is vertical于The telescopic rod.
  5. 根据权利要求2至4任一项所述的装置，其特征在于，所述伸缩机构还包括缓冲结构，所述缓冲结构连接所述基体与所述空气阻隔板，用于在所述空气阻隔板相对所述基体伸缩时提供缓冲作用力。The device according to any one of claims 2 to 4, wherein the telescopic mechanism further comprises a buffer structure, and the buffer structure connects the base body and the air barrier plate for connecting the air barrier It provides a cushioning force when telescoping relative to the base body.
  6. 根据权利要求5所述的装置，其特征在于，所述缓冲结构与所述伸缩驱动结构分别位于所述伸缩杆的两侧。The device according to claim 5, wherein the buffer structure and the telescopic drive structure are respectively located on both sides of the telescopic rod.
  7. 根据权利要求1至4任一项所述的装置，其特征在于，所述空气阻隔板的用于与所述内部空间相对的一侧表面设有长条状凸起。The device according to any one of claims 1 to 4, wherein the surface of the air barrier plate opposite to the internal space is provided with elongated protrusions.
  8. 根据权利要求7所述的装置，其特征在于，所述长条状凸起的长度方向垂直于所述空气阻隔板的伸缩方向。7. The device according to claim 7, wherein the length direction of the elongated protrusion is perpendicular to the expansion and contraction direction of the air barrier.
  9. 一种晶圆上料设备，其特征在于，包括权利要求1至8任一项所述的空气阻隔装置。A wafer loading equipment, characterized by comprising the air barrier device according to any one of claims 1 to 8.
  10. 一种空气阻隔控制方法，应用于晶圆上料过程中，其特征在于，包括：An air barrier control method, applied to a wafer loading process, is characterized in that it includes:
    在权利要求1至8任一项所述的空气阻隔装置中的空气阻隔板伸出时，通过所述伸缩机构控制所述空气阻隔板缩回，以使得所述内部空间与所述晶圆处理槽区间能够经连通空间相连通；When the air barrier of the air barrier device according to any one of claims 1 to 8, the air barrier is controlled to retract by the telescopic mechanism, so that the internal space and the wafer processing The tank sections can be connected through the connecting space;
    利用机械手传输晶圆，以使得所述内部空间中的晶圆能够经所述连通空间被输送至所述晶圆处理槽区；Using a robot to transfer wafers, so that the wafers in the internal space can be transported to the wafer processing tank area through the communication space;
    通过所述伸缩机构控制对应的空气阻隔板伸出，直至再次需要利用机械手将所述内部空间中的晶圆输送至所述晶圆处理槽区；其中，所述晶圆处理槽区中的晶圆被处理时，所述空气阻隔板能够保持伸出。The extension of the corresponding air barrier is controlled by the telescopic mechanism until the wafer in the internal space is transported to the wafer processing tank area by a robot again; wherein, the wafer in the wafer processing tank area When the circle is processed, the air baffle can keep extending.
PCT/CN2019/096225 2019-06-13 2019-07-16 Air blocking device, wafer feeding apparatus, and air blocking control method WO2020248326A1 (en)

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