JPH09330972A - Substrate transporting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transporting device which can suitably control the atmosphere. SOLUTION: A blowing section 6 is provided above a substrate holding arm 1 so that the section 6 can be moved together with the arm 1. The section 6 is connected to a clean unit 8 through a tubular duct 7. The unit 8 is incorporated with a fan 9 and a filter 11, and the air which is fed under pressure from the fan 9 and from which specific components to be removed are removed through the filter 11 is supplied to the section 6 through the duct 7 and blown upon a substrate W held by the arm 1. As a result, the space around the substrate W is formed and maintained in a required atmosphere.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus having a plurality of substrate processing units, an interface device for transferring substrates between different apparatuses, a carrier capable of accommodating a plurality of substrates, and a substrate processing apparatus. The present invention relates to a substrate transfer device provided in a substrate loading / unloading device that transfers substrates to and from a substrate processing apparatus, and particularly transfers substrates between transfer positions such as a substrate processing unit and a substrate transfer unit. The present invention relates to a substrate transfer device that performs

[0002]

2. Description of the Related Art In the manufacture of substrates, if harmful components (particles, chemical components such as alkali components, etc.) adhere to the substrate, they may cause contamination of the substrate and adversely affect the substrate processing (eg, poor development of chemically amplified resist). It is known that this leads to a decrease in product quality and a decrease in yield. Therefore,
It is necessary to prevent harmful components from adhering to the substrate even when the substrate is transported in each device.

Conventionally, a substrate processing device, an interface device, a substrate loading / unloading device, etc. are covered with an outer space, and a fan, a filter, etc. are installed on the ceiling part thereof, and a gas in which required harmful components are removed is used as a substrate in each device. The substrate is supplied to the transfer space, the inside of the substrate transfer space is made into a clean atmosphere, and the substrate is transferred in each device.

[0004]

However, in the conventional apparatus, the entire substrate transfer space has a clean gas atmosphere, but the substrate transfer space is large, and the atmosphere must be controlled in such a large space. Therefore, there were the following problems.

A large fan and a filter are required, resulting in high cost. In addition, the running cost is high due to the increased power consumption of the fan. In particular, when removing chemical components, a chemisorptive filter is installed on the ceiling of the equipment, but this chemisorptive filter is very expensive and has a short replacement cycle. Time cost (running cost)
High was a problem.

Further, in order to prevent the inflow of the external atmosphere, it is necessary to enhance the airtightness of the outer enclosure or to raise the pressure in the substrate transfer space, but the outer enclosure is provided with a substrate loading / unloading port and the like. In relation, it is virtually impossible to achieve a perfect seal. On the other hand, it is virtually impossible to completely raise the pressure in a large space. Therefore, in the conventional device,
It is impossible to completely prevent the inflow of the external atmosphere, and complete atmosphere control has not been realized.

Further, in the substrate transfer space, it is necessary to consider the flow of particles and heat, and it is necessary to consider the air flow in a wide substrate transfer space.
Therefore, the device must be designed in consideration of the arrangement of the constituent parts in the device, resulting in high manufacturing cost and increased man-hours for maintenance. Furthermore, the air flow in the substrate transfer space is disturbed by the transfer operation of the substrate transfer device, causing particles to fly up.

In addition to the above-mentioned inconvenience due to the need to control the atmosphere in a large space, the conventional device is
Since the fan and filter were installed on the ceiling of the device, there was also the problem that maintenance was difficult.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transfer apparatus capable of eliminating the above-mentioned various inconveniences.

[0010]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is, in a substrate transfer apparatus for transferring a substrate between transfer positions such as a substrate processing unit and a substrate transfer unit, a holding unit for holding the substrate, and a gas pressure feeding unit for feeding gas under pressure. , A removing means for removing a predetermined removal component from the gas to be pumped, and a gas, which is pumped by the gas pumping means and has the removal component removed by the removing means, is blown toward the substrate held by the holding means. A blowing unit, a moving unit that moves at least the holding unit and the blowing unit between a plurality of transport positions,
It is characterized in that it comprises the gas pressure feeding means, the removing means, and a connecting means for connecting the blowing means, and at least the gas pressure feeding means is fixedly installed at each transport position.

According to a second aspect of the present invention, in the substrate transfer apparatus according to the first aspect, the removing means is configured to be moved by the moving means together with the holding means and the blowing portion, and the connecting means. Among them, the connecting means for connecting the gas pressure feeding means and the removing means is constituted by a tubular duct.

According to a third aspect of the present invention, in the substrate transfer apparatus according to the first aspect, the removing means is fixedly installed at each transfer position, and the connecting means includes the removing means and the blowing means. It is characterized in that the connecting means for connecting between the parts is constituted by a tubular duct.

According to a fourth aspect of the invention, in the substrate transfer apparatus according to any one of the first to third aspects, the space blocking means is arranged so as to surround the substrate held by the holding means, The gas from the blowing unit is blown into the substrate holding space surrounded by the space blocking unit, and the substrate can be taken into and out of the space blocking unit at least between the substrate holding space and its external space. It is characterized in that an opening is formed.

According to a fifth aspect of the invention, in the substrate transfer apparatus according to the fourth aspect, a shutter mechanism for opening and closing the substrate loading / unloading opening is provided.

According to a sixth aspect of the present invention, in the substrate transfer apparatus according to the fourth aspect, the cleaned gas is blown down from above the substrate loading / unloading opening.
A gas curtain is formed in the opening.

According to a seventh aspect of the present invention, in the substrate transfer apparatus according to any one of the first to sixth aspects, the gas blown from the blowing portion toward the substrate held by the holding means is It is characterized in that at least a part thereof is configured to flow downward in a direction lower than that of the holding means.

[0017]

The operation of the present invention is as follows. According to the invention described in claim 1, at least the blowing unit is moved between the plurality of positions (in the substrate transfer space) by the moving unit together with the holding unit that holds the substrate. At least the gas pressure feeding means is fixedly installed at each transport position, and the gas pressure feeding means, the removing means, and the blowing portion are connected by the connecting means. The gas that has been pressure-fed by the gas pressure-feeding means and the predetermined removal components (particles, chemical components, etc.) removed by the removal means is blown out from the blowing portion toward the substrate held by the holding means.

According to the second aspect of the invention, the removing means is moved by the moving means together with the holding means and the blowing section, and only the gas pressure feeding means is fixedly installed at each carrying position. The gas pressure-fed by the gas pressure-feeding means is supplied to the removing means via the tubular duct, the removing component in the gas is removed by the removing means, and the gas after the removal component is removed is held by the holding means. It is blown toward the substrate held by.

According to the third aspect of the present invention, only the blowing portion moves together with the holding means, and the gas pressure feeding means and the removing means are fixedly installed at the respective conveying positions. Then, the gas that has been pressure-fed by the gas pressure-feeding means and the removal component has been removed by the removal means is supplied to the blowing portion through the tubular duct and blown toward the substrate held by the holding means.

According to the invention described in claim 4, the space blocking means is arranged so as to surround the substrate held by the holding means, and the gas from the blowing portion is blown out into the substrate holding space surrounded by the space blocking means. The atmosphere of the external space is prevented from flowing into the substrate holding space. The substrate held by the holding means is loaded / unloaded through the substrate loading / unloading opening formed in the space blocking means.

According to the fifth aspect of the present invention, a shutter mechanism for opening and closing the opening for loading and unloading the substrate is provided, and the opening is opened only when loading and unloading the substrate, and the opening is closed in other cases (such as during movement between transfer positions). The substrate holding space is further sealed.

According to the sixth aspect of the present invention, the cleaned gas is blown down from above the opening for loading and unloading the substrate, and the gas curtain is formed in the opening. Without providing the cause machine parts,
The atmosphere of the external space is prevented from flowing in through the substrate loading / unloading opening to enhance the airtightness of the substrate holding space.

According to the seventh aspect of the invention, at least a part of the gas blown from the blowing portion toward the substrate held by the holding means is caused to flow downward in a direction lower than that of the holding means and lower than that of the holding means. Suppressing particles and chemical components from rising in a certain direction and causing heat to flow downward, etc., harmful components and heat rise from a direction lower than the holding means and flow above the substrate held by the holding means. To stop doing.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a vertical cross-sectional view showing the structure of a substrate transfer device according to an embodiment of the present invention.

This substrate transfer device is provided in, for example, a substrate processing device, and a substrate holding arm 1 as a holding means is supported by an arm support base 2. The substrate holding arm 1 is configured to move in and out of the arm support base 2 by a drive mechanism (not shown) such as a ball screw provided in the arm support base 2. This withdrawal operation is performed in order to transfer the substrate W to the transfer position such as the substrate processing unit or the substrate transfer unit. In the figure,
A double-arm type substrate transfer device is shown in which two substrate holding arms 1 are vertically stacked, and each substrate holding arm 1 is independently withdrawn from and withdrawn from an arm support base 2. The present invention can be similarly applied to a single-arm type substrate transfer device provided with only one.

The arm support base 2 is supported by a shaft 2a, and is rotated about a vertical axis by a rotary drive mechanism 3 such as a motor. By this rotation, the direction in which the substrate holding arm 1 is retracted can be changed. Has become.

The arm support base 2 is moved up and down in the vertical axis direction by a lift drive mechanism 4 such as a ball screw via a shaft 2a and a rotation drive mechanism 3.

Further, the arm support base 2 is horizontally 1 axis direction (direction perpendicular to the plane of the drawing) by a 1 axis direction drive mechanism 5 such as a ball screw via a shaft 2a, a rotation drive mechanism 3 and a lift drive mechanism 4. It is supposed to be moved to.

The ascending / descending movement and the movement in the horizontal 1-axis direction are carried out for the purpose of carrying (moving) between a plurality of carrying positions, and the ascending / descending drive mechanism 4 and the 1-axis direction drive mechanism 5 in the present invention. It constitutes a means of transportation.

In the present embodiment, the blowing section 6 is supported on the arm supporting base 2 by a supporting member (not shown) so as to be close to and above the substrate holding arm 1. An outlet is provided on the surface (lower surface) of the outlet 6 on the substrate holding arm 1 side. One end side of a tubular duct 7 is communicatively connected to the blowing portion 6, and the gas pressure-fed from the duct 7 is blown from the blowing outlet toward the substrate W held by the substrate holding arm 1.

The other end of the duct 7 is connected to a clean unit 8 fixedly installed at a predetermined position. The clean unit 8 includes a fan unit 10 having a fan 9 and a filter unit 1 having a filter 11.
Two are connected and installed internally. The fan 9 corresponds to gas pressure feeding means, takes in outside air, and pressure-feeds gas (air in this case) to the duct 7 side (blowing portion 6 side). The filter 11 corresponds to the removing means, and the duct 9 is provided by the fan 9.
The predetermined removal component in the gas (air) pumped to the side is removed. As a result, the gas (air) that has been pressure-fed by the fan 9 and has the predetermined removal component removed by the filter 11 is blown out from the outlet of the outlet 6 toward the substrate W held by the substrate holding arm 1. . Then, the atmosphere around the substrate W held by the substrate holding arm 1 is formed and maintained in an atmosphere in which a predetermined removal component is removed.

When only particles are to be removed, the filter unit 12 is equipped with a HEPA (hepa) filter or a ULPA (ulpa) filter for removing particles. When only chemical components such as alcal component and acid component are removed, the chemical adsorption filter is provided in the filter unit 12. When removing both of them, the filter unit 12 is provided with a filter for removing particles and a chemical adsorption filter. Furthermore, when removing other removal components, a required filter is provided in the filter unit 12.

Further, the clean unit 8 is fixedly installed at a predetermined place, while the blowing section 6 is moved up and down or moved in the horizontal uniaxial direction together with the substrate holding arm 1 and the arm support 2. Therefore, the duct 7 is made of a resin such as polycarbonate so as to be deformable so that it can follow the movement of the blowing portion 6. The fan unit 10 in the clean unit 8
The connection between the filter unit 12 and the duct 7 constitutes the connection means in the present invention.

In FIG. 1, the fan 9 is replaced by the filter 1
Although it is provided in the previous stage of No. 1, even if the positions of the fan 9 and the filter 11 in the clean unit 8 are reversed (the fan 9
May be provided after the filter 11).

Next, the structure of another embodiment will be described with reference to FIG. In the apparatus shown in FIG. 2, the filter unit 12 is connected above the blowing portion 6, and one end of the duct 7 is connected to the space above the filter 11. Further, only the fan unit 10 is provided in the clean unit 8. According to this configuration, the filter 11 (filter unit 12) is moved up and down or moved in the horizontal uniaxial direction together with the blowing portion 6, the substrate holding arm 1, and the arm support 2. Then, the gas (air) pumped by the fan 9 is sent to the space above the filter 11 via the duct 7, and a predetermined removal component is removed by the filter 11,
It is blown out from the blow-out portion 6 toward the substrate W. The other structure is substantially the same as that of the above-mentioned embodiment, and the detailed description thereof will be omitted.

In FIG. 2, the filter unit 12
Although a blowing portion indicated by reference numeral 6 is provided below, the blowing portion 6 is omitted, and the gas (air) that has passed through the filter 11 is directly held on the substrate W held by the substrate holding arm 1.
It may be configured to blow out to. In the case of such a configuration, the filter unit 12 constitutes the blowing portion in the present invention.

Some modifications will be described below by taking the apparatus of FIG. 1 as an example, but these modifications can be appropriately modified and implemented in the apparatus of FIG.

Although air is used as the gas in the above embodiment, as shown in FIG. 3, the inert gas is filtered from the gas supply source 14 (such as a factory utility) that pumps the inert gas such as nitrogen gas. 11 may be supplied. As a result, the atmosphere around the substrate W held by the substrate holding arm 1 is formed and maintained in the atmosphere of the inert gas from which the predetermined removal component has been removed. In the case of FIG. 3, the gas supply source 14 corresponds to the gas pressure feeding means, but in consideration of the pressure loss of the filter 11, the fan 9 may be provided before (or after) the filter 11.

In the apparatus shown in FIG. 1, a blowing portion 6 is provided above the substrate holding arm 1 and an arm support base 2 is provided below the blowing portion 6.
However, as shown in FIG. 4, a part of the side surface of the space between the arm support 2 and the blowing section 6 (side of the substrate W held by the substrate holding arm 1) is further provided. A side wall 16 having an opening 15 formed therein is provided to surround the substrate W held by the substrate holding arm 1, and the gas from the blowing portion 6 is
It may be configured to be blown out into the substrate holding space 13 surrounded by the side wall 16, the arm support 2, the blowing portion 6, and the like. The side wall 16 is for blocking the substrate holding space 13 and its external space in the side surface portion of the substrate holding space 13. In addition, the opening 15 is for loading and unloading the substrate W between the substrate holding space 13 and the external space,
The substrate holding arm 1 moves out through the opening 15. With such a configuration, the inflow of the external atmosphere (including particles floating in the external space; the same applies hereinafter) to the substrate holding space 13 can be suppressed more suitably.

In the case of FIG. 4, the side wall 16, the blowing portion 6 and the arm support base 2 constitute the space blocking means in the present invention, but the arm support base 2 is provided below the substrate holding arm 1.
In the case of a substrate transfer device that does not have the above, a partition wall may be arranged below the substrate holding arm 1.

In the case of FIG. 4, the side wall 16 is further provided with an opening different from the opening 15, and the gas from the blowing portion 6 is moved downward from the opening to below the substrate holding space 13 (direction lower than the substrate holding arm 1). It may be allowed to flow down. When a partition is arranged below the substrate holding arm 1,
A punching hole or the like may be provided in the partition wall below to allow the gas from the blowing portion 6 to flow down below the substrate holding space 13.

As shown in FIG. 5, in the configuration of FIG.
A shutter mechanism 17 that opens and closes the opening 15 of the side wall 16 may be provided. The shutter mechanism 17 is configured to elevate and lower the shutter 17c and open and close the opening 15 by expanding and contracting the rod 17b of the air cylinder 17a, for example. Then, the opening 15 is opened only when the substrate W is moved in and out of the substrate holding space 13 (when the substrate holding arm 1 is moved back and forth), and the opening 15 is closed otherwise.
With such a configuration, inflow of the external atmosphere from the opening 15 into the substrate holding space 13 can be further suppressed as compared with the configuration of FIG. Even if the shutter 17 does not completely seal the opening 15, the inside of the substrate holding space 13 is lifted with respect to the external space, and the substrate holding space 13
There should be no inflow of external atmosphere into the interior.

As shown in FIG. 6, in the configuration of FIG.
The cleaned gas may be blown down from above the opening 15 of the side wall 16 to form a curtain of gas in the opening 15. In FIG. 6A, a gas curtain is formed by the gas (air) blown out from the blowing portion 6. Figure 6
In (b), the cleaned gas for forming a curtain of gas (particles and chemical components are removed if necessary) is configured to be pressure-fed by another duct 7 ′. The other end of the duct 7 ′ may be connected to the clean unit 8 so as to communicate therewith, or if necessary, another clean unit (a fan and a necessary filter are provided and configured in the same manner as the clean unit 8). ).
Further, the cleaned inert gas is supplied to the opening 15 of the side wall 16.
May be pressure-fed (supplied) upward to blow down the cleaned inert gas from above the opening 15 to form a curtain of the inert gas in the opening 15. With such a configuration, the inflow of the external atmosphere from the opening 15 into the substrate holding space 13 can be constantly suppressed, and the mechanical parts (such as the shutter mechanism 17 in FIG. 5) that cause dust generation are not used. Therefore, no new particles are generated.

As shown in FIG. 7, at least a part of the gas blown out from the blowing portion 6 is made lower than the substrate holding arm 1 by providing a guide member 18 around the lower portion of the substrate holding arm 1. You may make it flow down. With this configuration, particles, chemical components, and the like rise up from a direction lower than the substrate holding arm 1 and can be prevented from flowing into the upper portion of the substrate W, heat from flowing into the upper portion of the substrate W, and the like.

As shown in FIG. 8, the size of the blowing portion 6 in the horizontal direction is set to be slightly larger than that of the arm supporting base 2 to form a gas curtain on the side surface around the substrate holding arm 1 and to move downward. A gas stream to may be formed.

As shown in the sectional view of FIG. 9 (a), the duct 7 (7 ') may be composed of one duct having a large diameter, but as shown in FIG. It is also possible to bundle a plurality of small ones. With the configuration shown in FIG. 9B, the bending resistance of the duct 7 (7 ′) is reduced, and the deformation of the duct 7 due to the movement operation of the blowing portion 6, the substrate holding arm 1, and the arm support 2 is smooth. It is possible to reduce the burden of the moving operation. Further, as shown in FIG. 9 (c), in the configuration of FIG. 9 (b), the thin duct 7 (7 ′) is used.
A thin protective duct 19 may be wound around the bundle of. With such a configuration, the duct 7 accompanying the movement operation of the blowing portion 6, the substrate holding arm 1, and the arm support base 2
Even if the ducts 7 rub against each other during bending to generate particles, it is possible to prevent the particles from being scattered around.

Next, the configuration of a substrate processing apparatus and the like incorporating the substrate transfer apparatus according to the above-described embodiment and its modification will be described with reference to FIGS. FIG. 10 is a plan sectional view showing the overall configuration of the substrate processing apparatus and the like.
FIG. 1 is a view of the substrate transfer device in the substrate processing apparatus as seen from the X-axis direction. The substrate processing apparatus is an apparatus for performing resist processing.

The substrate processing apparatus 30 comprises a spin scrubber SS for cleaning the substrate, a spin coater SC for resist coating,
Spin developer SD for development processing, heat treatment section for heat treatment (a heat treatment section and a cooling treatment section (not shown) are stacked in the Z-axis direction in the figure and arranged side by side in the Y-axis direction) HCP, edge exposure Various substrate processing units such as the unit EEW are provided. Further, the substrate transfer path 31 of the substrate transfer device 20 according to the above-described embodiment and its modification is provided. The substrate transfer device 20 moves along the substrate transfer path 31 (moves in the Y-axis direction) and moves up and down (moves in the Z-axis direction) to transfer the substrate W in the substrate transfer space including the substrate transfer path 31. To do. In this case, the moving direction of the uniaxial drive mechanism 5 is the Y-axis direction. The substrate transfer apparatus 20 also transfers the substrate W to each substrate processing unit (transfer position). Further, the substrate transfer device 2
0 is the substrate transfer device 2 in the substrate loading / unloading device 40 described later.
0a and the substrate transfer device 2 in the interface device 60
The substrate W is also delivered to and from 0b.

As shown in FIG. 11, the duct 7 is
When supported by a caterpillar-shaped articulated pipe guiding mechanism 70, the clean unit 8 and the blowing unit 6 are connected to each other, and when the blowing unit 6, the substrate holding arm 1 and the arm support 2 are moved up and down or moved in the Y-axis direction. In the duct 7 (shown by the chain double-dashed line)
This prevents inconveniences such as being entangled and being caught in the components inside the substrate processing apparatus 30.

A substrate loading / unloading device 40 is arranged at one end of the substrate processing apparatus 30, and an interface device 60 for transferring the substrate W to / from the exposure processing apparatus 50 is provided at the other end. It is arranged.

The substrate loading / unloading device 40 includes a carrier mounting table 4 on which a carrier C capable of stacking and accommodating a plurality of substrates W is mounted.
1 and a substrate transfer device 20a that transfers / delivers the substrate W between the carrier C and the substrate transfer device 20 in the substrate processing apparatus 30. The substrate transport apparatus 20a takes out the unprocessed substrates W one by one from the carrier C (transport position), transports the substrates W along the substrate transport path 42, and delivers them to the substrate transport apparatus 20 in the substrate processing apparatus 30. At the same time as carrying in the substrate W before processing, the substrate processing apparatus 30
Processed substrate W received from the substrate transfer device 20 inside
Are carried along the substrate carrying path 42 and stored in the carrier C (carrying out the processed substrate W). In addition,
The substrate W is transferred between the substrate transfer devices 20a and 20 via a substrate transfer table (transfer position) not shown.

The interface device 60 is provided with a substrate transfer device 20b. This substrate transfer device 20b
Conveys the pre-exposure-processed substrate W received from the substrate conveyance device 20 in the substrate treatment device 30 along the substrate conveyance path 61, and in the exposure treatment device 50 via the substrate carry-in table 62 (conveyance position). The substrate W after being subjected to the exposure processing, which is received from the substrate transfer device in the exposure processing device 50 via the substrate unloading stage 63 (transfer position), is transferred along the substrate transfer path 61 while being delivered to the substrate transfer device (not shown). It operates so as to be delivered to the substrate transfer device 20 in the substrate processing apparatus 30. The substrate W between the substrate transfer devices 20b and 20
Is delivered via a substrate delivery table (transport position) not shown.

The exposure processing apparatus 50 is provided with an exposure machine such as a reduction projection exposure machine (stepper) and a substrate transfer apparatus (not shown) for transferring the substrate W in the exposure processing apparatus 50. ing.

In the conventional example, as shown in FIG. 12, a fan unit 101 provided with a fan 100 and a filter unit 103 provided with a filter 102 are provided on the ceiling of the devices 30, 40, 60, and each device 30, 40 40,
Since the atmosphere control of the entire substrate transfer space 60 is performed, the shaded areas in FIGS. 12 and 13 are subject to the atmosphere control. On the other hand, in the present invention, FIG.
As shown in 0, the substrate holding arm 1 of the substrate transfer device 20.
Since it is only necessary to perform the atmosphere control of an extremely small space (the substrate holding space 13 in FIG. 4 and the like) around the substrate W held on the substrate processing apparatus 30, in the substrate processing apparatus 30, the area indicated by the diagonal lines in FIG. Be subject to control. As described above, since the space for atmosphere control in the substrate processing apparatus 30 can be greatly reduced, the amount of gas used for atmosphere control is reduced, the fan 9 and the filter 11 can be downsized, and the cost can be reduced. it can. Further, since the space for controlling the atmosphere is reduced, it is possible to raise the pressure in the space, and it is possible to easily prevent the external atmosphere from flowing into the substrate holding space 13. Furthermore, the clean unit 8 is installed on the floor, for example, at a height at which a worker can easily work, so that the fan 9 in the clean unit 8 is maintained and the filter 11 is replaced (when the chemical adsorption filter is included). It is now easier than ever to use conventional devices. Further, although the fan 9 is miniaturized, its weight is relatively heavier than the filter 11 and the like, and also serves as a heat source. According to the present invention, the fan 9 is used as the substrate transfer device 20 main body. Since they are separated and fixedly installed at a specific place, the load of the movement operation of the substrate holding arm 1, the arm support base 2, and the blowing portion 6 can be reduced, and the heat from the fan 9 to the substrate W held by the substrate holding arm 1 can be reduced. The influence of can be prevented.

By the way, generally, the substrate processing apparatus 30 of this type and the like are installed in a clean room. Air flows down into the clean room from the ceiling of the clean room by downflow. Therefore, the substrate transfer path 31
An opening or a punching hole is provided in the ceiling portion of the apparatus 30 above the device to take downflow air in the clean room into the substrate transfer path 31 and downflow air into the substrate transfer path 31 (this air is a removal component). Is not sufficiently removed, in particular, air in which the chemical component is not removed at all) can be formed to suppress the soaring of particles to some extent. Of course,
By configuring as shown in FIGS. 7 and 8 and the like,
It is possible to preferably prevent particles from flying up in the vicinity of the substrate W held by the substrate holding arm 1 and prevent harmful components from flowing from a direction lower than that of the substrate holding arm 1.

The substrate transfer devices 20a and 20b also have
The present invention may be applied. Substrate transfer device 20a or 20b
The target space for atmosphere control in each of the devices 40 and 60 when the present invention is applied to is shown in FIG. According to this structure, the same effects as those of the substrate processing apparatus 30 described above can be obtained in the substrate loading / unloading device 40 and the interface device 60.

[0057]

As is apparent from the above description, according to the invention described in claims 1 to 7, the atmosphere control is performed in an extremely narrow space around the substrate held by the holding means of the substrate transfer device. Since it is limited, the fan and the filter can be small, and the cost can be reduced. Further, the power consumption of the fan is reduced, the running cost can be reduced, and the heat generation amount of the fan is also reduced, so that the influence of heat on the substrate can be reduced. In particular, in the case of removing chemical components, regular replacement of the filter can be achieved by replacing a small chemical adsorption filter, so that it is possible to suppress an increase in running cost of the chemical adsorption filter.

Since the space for controlling the atmosphere is small,
It is possible to easily raise the pressure in the space and suitably prevent the inflow of the external atmosphere.

Further, in the conventional apparatus, since the fan and the filter were installed on the ceiling of the substrate processing apparatus and the like, it was difficult to perform maintenance. However, according to the invention of claim 2, the gas pressure feeding means is provided to the operator. Since it can be installed at a position that can be reached, it becomes easier to maintain the gas pressure feeding means. Further, according to the invention as set forth in claim 3, the gas pressure feeding means and the removing means can be installed at positions accessible by the operator, and maintenance of these means and replacement work of the removing means are facilitated. .

Further, although the gas pressure feeding means can be miniaturized according to the present invention, it is relatively heavy and serves as a heat source. However, in the present invention, the gas pressure feeding means is separated from the holding means. Since it is fixedly installed at a specific place, the load of the moving operation of the holding means can be reduced, and the influence of heat from the gas pressure feeding means on the substrate held by the holding means can be prevented.

Further, according to the invention described in claim 4, the space holding means is arranged so as to surround the substrate held by the holding means, and the gas from the blowing portion is surrounded by the space holding means. Since the air is blown out into the space, it is possible to more preferably suppress the inflow of the external atmosphere into the substrate holding space.

According to the fifth aspect of the invention, since the shutter mechanism for opening and closing the opening for loading and unloading the substrate is provided, the inflow of the external atmosphere from the opening can be suitably suppressed.

Further, according to the invention of claim 6,
The purified gas is blown down from above the substrate loading / unloading opening to form a gas curtain in the opening, so that the inflow of the external atmosphere from the opening can be constantly suppressed, and the cause of dust generation. Since no mechanical parts such as a shutter mechanism are used, new particles are not generated.

According to the invention described in claim 7, at least a part of the gas blown from the blowing portion toward the substrate held by the holding means is made to flow downward in a direction lower than that of the holding means. Therefore, it is possible to prevent harmful effects such as harmful components and heat from a direction lower than the holding means. Further, this eliminates the need to particularly consider the particles and heat flow in the entire substrate transfer space, unlike the conventional apparatus, and can reduce the manufacturing cost and the number of man-hours at the time of maintenance.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing a configuration of a substrate transfer device according to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view showing the main configuration of another embodiment of the apparatus.

FIG. 3 is a vertical cross-sectional view showing a configuration of a main part of a modified example of the embodiment apparatus.

FIG. 4 is a vertical cross-sectional view showing the configuration of the main part of another modification of the embodiment apparatus.

FIG. 5 is a vertical cross-sectional view showing a main part configuration of still another modification of the embodiment apparatus.

FIG. 6 is a vertical cross-sectional view showing a main part configuration of still another modification of the embodiment apparatus.

FIG. 7 is a vertical cross-sectional view showing a main part configuration of still another modified example of the embodiment apparatus.

FIG. 8 is a vertical cross-sectional view showing a main part configuration of still another modified example of the embodiment apparatus.

FIG. 9 is a cross-sectional view showing various configurations of a duct.

FIG. 10 is a plan sectional view showing the overall configuration of a substrate processing apparatus and the like incorporating the apparatus of the embodiment.

FIG. 11 is a diagram of the substrate transfer device in the substrate processing apparatus as seen from the X-axis direction.

FIG. 12 is a vertical cross-sectional view showing a configuration of a substrate processing apparatus and the like according to a conventional example.

FIG. 13 is a plan view of an atmosphere control space of a conventional device.

[Explanation of symbols]

 1: Substrate holding arm 2: Arm support base 4: Lifting drive mechanism 5: 1 Axial direction drive mechanism 6: Blow-out section 7, 7 ': Duct 9: Fan 11: Filter 13: Substrate holding space 15: Opening / closing board 16: Side wall 17: Shutter mechanism 18: Guide member W: Substrate

Claims (7)

[Claims] 1. A substrate transfer apparatus for transferring a substrate between transfer positions such as a substrate processing unit and a substrate transfer unit, a holding unit for holding the substrate, a gas pumping unit for pumping a gas, and the gas to be pumped. A removing unit for removing a predetermined removal component from the gas, and a blowing unit that blows out the gas that has been pressure-fed by the gas pressure-feeding unit and has the removal component removed by the removal unit toward the substrate held by the holding unit; A holding unit and a moving unit that moves the blowing unit between a plurality of conveying positions; and a connecting unit that connects the gas pressure feeding unit, the removing unit, and the blowing unit, and at least the gas pressure feeding unit is provided at each conveying position. A substrate transfer device, which is fixedly installed with respect to. 2. The substrate transfer apparatus according to claim 1, wherein the removing unit is configured to be moved by the moving unit together with the holding unit and the blowing unit, and the connecting unit includes the gas pressure feeding unit. The substrate transfer device, wherein the connecting means for connecting the removing means is constituted by a tubular duct. 3. The substrate transfer apparatus according to claim 1, wherein the removing unit is fixedly installed at each transfer position, and the connecting unit connects the removing unit and the blowing unit. A substrate transfer device characterized in that the means is constituted by a tubular duct. 4. The substrate transfer apparatus according to claim 1, wherein a space blocking unit is arranged so as to surround the substrate held by the holding unit, and the gas from the blowing unit is It is configured so that it is blown into a substrate holding space surrounded by a space blocking means, and the space blocking means is formed with an opening through which a substrate can be taken in and out between at least the substrate holding space and its external space. Characteristic board transfer device. 5. The substrate transfer apparatus according to claim 4, further comprising a shutter mechanism that opens and closes the opening for loading and unloading the substrate. 6. The substrate transfer apparatus according to claim 4, wherein the cleaned gas is blown downward from above the substrate loading / unloading opening, and a gas curtain is formed in the opening. Substrate transfer device. 7. The substrate transfer apparatus according to claim 1, wherein at least a part of the gas blown from the blowing unit toward the substrate held by the holding unit is held by the holding unit. A substrate transfer apparatus, which is configured to flow down in a lower direction.