JPH10335285A - Substrate-processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate-processing apparatus, in which there is no possibility of a drive source for driving a movable member becoming corroded and deteriorated with an environment which contains a processing fluid in the construction where the movable member is provided to operate in a processing chamber. SOLUTION: A drive chamber 18 is defined below a top plate 15, and a rodless cylinder 19 is disposed in the drive chamber 18 for opening/closing a shutter 14. The drive force of the rodless cylinder 19 is transmitted to the shutter 14 through a drive transmission shaft 27. The drive transmission shaft 27 extends vertically and is inserted into an opening part 28 formed in the top plate 15. Associated with the opening part 28, there is provided a sealing member 38 for sealing a gap between the drive transmission shaft 15 and the top plate 15. An internal chamber 42 is formed in the drive chamber 18, adjoining the top plate 15, into the chamber 42 of which an inert gas is supplied from an inactive gas supply source as a gas supply means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing for processing a substrate to be processed such as a semiconductor wafer, a glass substrate for a liquid crystal display device, and a glass substrate for a PDP (plasma display panel) using a processing fluid. Related to the device.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a plurality of (for example, 50) semiconductor wafers (hereinafter simply referred to as "wafers") are used.
That. ) May be used in batch processing. FIG. 7 shows a configuration example of a batch type wafer processing apparatus. Referring to FIG. 7, the batch type wafer processing apparatus is provided with a plurality (two in this example) of processing tanks 81 and 82 capable of storing a processing liquid in a processing chamber 80. The wafer to be processed is transferred by a transfer robot (not shown) along the transfer direction 83, and is sequentially immersed in a processing liquid (chemical solution or pure water) stored in the processing tanks 81 and 82. Thus, cleaning of the wafer surface and etching of the thin film formed on the wafer surface are performed.

The atmosphere above the processing tank 81 contains components of the processing liquid stored in the processing tank 81, and the atmosphere above the processing tank 82 contains the processing liquid stored in the processing tank 82. Contains liquid components. Processing tanks 81, 82
There is no particular problem when the processing liquids stored in the processing tanks 81 and 82 are the same, but when the processing liquids stored in the processing tanks 81 and 82 are different from each other, the atmosphere on the processing tank 81 side and the processing tank 82
If mixed with the atmosphere on the side, a chemical reaction may occur, which may adversely affect the wafer.

Therefore, in the conventional apparatus, a shutter 84 that can be opened and closed is provided between the processing tank 81 and the processing tank 82, and when the wafer is transferred from the processing tank 81 to the processing tank 82, the shutter 84 is opened. The circulation of the atmosphere on the processing tank 81 side and the atmosphere on the processing tank 82 side is interrupted by 84. The shutter 84 is provided, for example, so that it can be opened and closed in the vertical direction. That is, the processing tank 81 and the processing tank 8
2, a driving chamber (not shown) is formed below the processing chamber 80 by a top plate 85 and is isolated from the processing chamber 80.
A shutter drive source (not shown) is provided in the drive chamber. The shutter drive source and the shutter 84 are connected by a drive transmission shaft 87 inserted through an opening 86 formed in the top plate 85. Thus, when the shutter drive source is driven, the drive transmission shaft 87 is moved up and down, and the shutter 84 is opened and closed.

[0005]

However, in the above-described conventional apparatus, the atmosphere containing the processing liquid component in the processing chamber 80 is
The shutter drive source may enter the drive chamber through the opening 86 formed in the top plate 85, and the shutter drive source may be corroded or deteriorated by the entered atmosphere. Therefore,
SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing method in which a driving source for driving the movable member is not corroded or deteriorated by an atmosphere containing a processing fluid in a structure provided with a movable member operating in a processing chamber. It is to provide a device.

[0006]

According to a first aspect of the present invention, there is provided a substrate processing apparatus, comprising: a processing chamber for supplying a processing fluid to a substrate to perform processing; A driving source that drives a movable member that operates to perform processing on the driving chamber, a driving chamber that is provided to surround the driving source, and that is formed by a partition wall that separates the processing chamber and the driving source; An opening formed in a partition of the drive chamber, a drive transmission shaft that passes through the opening, and transmits a driving force of the drive source to the movable member, and a drive transmission shaft provided in the opening, A sealing member for sealing a gap between the driving chamber and the partition wall.

According to the first aspect of the present invention, since the seal member is provided in relation to the opening formed in the partition wall separating the processing chamber and the drive chamber, the drive transmission shaft and the periphery of the opening are provided. The resulting gap can be sealed. Accordingly, the atmosphere in the processing chamber does not enter the driving chamber through the opening.
It is possible to prevent the drive source provided in the drive room from being corroded or deteriorated.

It is preferable to apply a so-called mechanical seal as the seal member. By applying the mechanical seal, the gap between the drive transmission shaft and the opening can be better sealed, so that the possibility that the drive source is corroded or deteriorated can be further eliminated. In addition, the surface of the mechanical seal is preferably made of a material having a small frictional resistance with the drive transmission shaft, such as a fluororesin, thereby reducing dust generation due to friction between the drive transmission shaft and the seal member. can do.

The invention according to claim 2 is the substrate processing apparatus according to claim 1, further comprising gas supply means for supplying gas to the driving chamber. Claim 2
According to the configuration described above, by supplying the gas into the drive chamber by the gas supply unit, the pressure in the drive chamber can be made higher than the pressure in the processing chamber. Accordingly, even if a small gap is formed between the seal member and the drive transmission shaft, the atmosphere in the processing chamber does not enter the drive chamber. Therefore, it is possible to reliably prevent the atmosphere including the processing fluid component from entering the driving chamber and corroding or deteriorating the driving source.

According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect, the gas supply means is an inert gas supply means for supplying an inert gas to the driving chamber. is there. According to the third aspect of the present invention, since the gas supply means is the inert gas supply means, the drive chamber is filled with the inert gas, so that the drive source is enveloped by the inert gas. Therefore, the possibility that the drive source is corroded or deteriorated can be further reduced as compared with the case where a gas (for example, air) containing oxygen or the like is supplied.

According to a fourth aspect of the present invention, there is further provided an internal chamber provided inside the drive chamber and surrounding the drive transmission shaft. The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus supplies the substrate processing apparatus. According to the configuration of the fourth aspect, the internal chamber is formed so as to surround the drive transmission shaft, and the gas is supplied to the internal chamber by the gas supply means, so that the gas is directly blown to the drive transmission shaft. Can be. Thus, the processing fluid component attached to the drive transmission shaft can be removed, so that corrosion and deterioration of the drive transmission shaft due to the processing fluid can also be prevented. Moreover, since the gas blown to the drive transmission shaft is guided to the opening along the drive transmission shaft, it is possible to effectively prevent the atmosphere in the processing chamber from entering the drive chamber through the opening. The amount of gas to be supplied can be reduced.

The invention according to claim 5 is the substrate processing apparatus according to claim 4, wherein the internal chamber is provided adjacent to the partition wall having the opening. According to the configuration of the fifth aspect, since the internal chamber is provided adjacent to the partition wall having the opening, for example, when the drive transmission shaft performs a reciprocating linear operation, the drive transmission shaft moves from the processing chamber to the drive chamber. At the same time, the processing fluid component attached to the drive transmission shaft can be removed. Therefore,
Corrosion and deterioration of the drive transmission shaft and the drive source due to the processing fluid can be more effectively prevented.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described.
This will be described in detail with reference to the accompanying drawings. FIG. 1 is a simplified perspective view showing a substrate processing apparatus according to an embodiment of the present invention, partially cut away. The substrate processing apparatus 1 is capable of processing a plurality of wafers (not shown) at once.
This is a so-called batch type processing apparatus.

The substrate processing apparatus 1 has a substantially rectangular parallelepiped outer shape, and has a processing chamber 2 formed therein. The wafer to be processed is introduced into the processing chamber 2 from the left side when viewed from the front of the substrate processing apparatus 1. The wafer introduced into the processing chamber 2 is received by the transfer robot 3 and transferred linearly from left to right when viewed from the front of the processing apparatus 1. A plurality of processing tanks 4 are arranged in a line in the lower part of the processing chamber 2 along the wafer transfer direction. The plurality of processing tanks 4 include a processing liquid tank capable of storing a processing liquid such as a chemical solution or pure water, a drying unit for drying a wafer, and the like. The wafer transferred by the transfer robot 3 is sequentially immersed in the processing liquid stored in the processing tank 4 during the transfer process, and subjected to various processes such as surface cleaning and thin film etching. In addition, as the chemical solution stored in the processing tank 4, for example, ammonia, hydrofluoric acid, sulfuric acid, and the like can be exemplified.

The transfer robot 3 is provided below the elongated hole 5 on the front side of the processing tank 4 and is capable of reciprocating along a guide rail (not shown) extending in the wafer transfer direction. It is configured. The transfer robot 3 includes a column 6 protruding upward from the slot-shaped opening 5, two arms 7, 8 extending horizontally from the upper end of the column 6 toward the back, and arms 7, 8. It has holding parts 9 and 10 provided respectively in a state of hanging down. The column 6 is configured to be able to reciprocate up and down. Further, the holding parts 9 and 10
Are provided so as to be swingable about arms 7 and 8, respectively, and are rotated in directions approaching each other to collectively hold a plurality of (for example, 50) wafers.
The held wafers can be released by being rotated in the directions away from each other. With this configuration, the transfer robot 3 moves the wafer in the space 11 above the processing tank 4 by moving in the wafer transfer direction while holding the wafer, or moves the support column 6 up and down while holding the wafer. By being moved, a wafer can be taken in and out of each processing tank 4.

Between the plurality of processing tanks 4 and the elongated opening 5, a partition plate 12 which is long in the wafer transfer direction is provided upright. When the wafer is immersed in the processing tank 4, the processing liquid in the processing tank 4 is scattered, and the partition plate 12 is applied to a driving mechanism (not shown) of the transfer robot 3 including the above-described guide rail. It is to prevent. A plurality of cutouts 13 into which the arms 7 and 8 of the transfer robot 3 enter when the wafer is taken in and out of the processing tank 4 are formed at the upper edge of the partition plate 12. It does not hinder.

The substrate processing apparatus 1 is provided with a shutter 14 between a predetermined processing tank 4a and a processing tank 4b adjacent to the processing tank 4a. It is possible to partition between an acid-based atmosphere on the side and an alkaline-based atmosphere on the processing tank 4b side. In other words, in the processing apparatus 1 according to this embodiment, a processing tank in which an acid-based chemical solution (hydrofluoric acid, sulfuric acid, or the like) is stored upstream of the shutter 14 with respect to the wafer transfer direction. On the downstream side,
There is a treatment tank in which an alkaline chemical solution (such as ammonia) is stored.

The shutter 14 protrudes into the space 11 to partition the atmosphere in the space 11 (indicated by a two-dot chain line in FIG. 1) and as a partition provided between the processing tanks 4a and 4b. It is configured to be openable and closable in an open state displaced below the top plate 15, and is opened when a wafer is moved from the processing tank 4a to the processing tank 4b by a driving mechanism described later. At the time of, it is closed.
Thus, the acid-based atmosphere on the processing tank 4a side and the alkali-based atmosphere on the processing tank 4b side do not mix except when the wafer is moved from the processing tank 4a to the processing tank 4b. And the atmosphere of the alkaline system are mixed with each other, and the neutralization reaction is less likely to occur. Therefore, it is possible to reduce the problem that the salt generated by the neutralization reaction adheres to the surface of the wafer conveyed in the space 11 above the processing tank 4 and adversely affects the wafer.

The shutter 14 is used to remove the chemical from the processing liquid tank storing the chemical and the wafer after the chemical processing, in addition to the position where the acid-based atmosphere and the alkaline-based atmosphere can be separated from each other. When provided between processing tanks storing different types of processing liquids (processing fluids), such as between processing liquid tanks storing pure water, atmospheres containing different types of processing liquid components are mixed. You don't have to.

FIG. 2 is a cross-sectional view of the drive mechanism of the shutter 14 as viewed from the side of the processing apparatus 1. FIG.
FIG. 4 is a cross-sectional view of the drive mechanism of No. 4 as viewed from the front of the processing apparatus 1. Below the top plate 15 provided between the processing tanks 4a and 4b, the top plate 15, the bottom plate 16 and the side plate 1
A drive chamber 18 is defined by the drive chamber 7, and a rodless cylinder 19 as a drive source for driving the shutter 14 to open and close is disposed inside the drive chamber 18. Further, inside the drive chamber 18, for example, a narrow shutter storage chamber 2 partitioned by the right side plate 17 a and the partition wall 20.
1 is formed. In the shutter housing chamber 21,
When the shutter 14 is opened, the shutter 14 can be accommodated through an entrance 22 formed in the top plate 15.

The rodless cylinder 19 sends air into a vertically extending cylinder tube 23, and moves a piston (not shown) in the cylinder tube 23 by air pressure, following the movement of the piston. , Head 2
4 slides along head guides 25 and 26 provided in parallel with the cylinder tube 23. Accordingly, in the rodless cylinder 19, the head 24 is moved within the entire length of the cylinder tube 23. Therefore, by applying the rodless cylinder 19 as a driving source of the shutter 14, a driving chamber for accommodating the driving source is provided. 18
Space can be reduced. However, it goes without saying that a cylinder having a rod that moves up and down in the vertical direction may be used as the drive source instead of the rodless cylinder 19.

The driving force of the rodless cylinder 19 is transmitted to the shutter 14 by a driving transmission shaft 27. The drive transmission shaft 27 is provided so as to extend in the up-down direction.
5 is inserted through the opening 28. The lower end of the drive transmission shaft 27 is connected to the head 24 of the rodless cylinder 19 via a bracket 29 so that the drive transmission shaft 27 can be moved up and down as the head 24 moves up and down.
An attachment member 30 for connecting the drive transmission shaft 27 and the shutter 14 is attached to an upper end of the drive transmission shaft 27.

Here, most of the rodless cylinder 19 is made of metal (for example, aluminum), and a part of the packing, etc., is made of rubber (for example, nitrile butadiene rubber). The drive transmission shaft 27 is made of metal (for example, stainless steel) or resin (for example, vinyl chloride).

Reference numeral 31 is a bracket guide for guiding the movement of the bracket 29. The mounting member 30 is a member having an inverted L-shaped cross section, and has a horizontal portion 32 having a planar rectangular shape, and a hanging portion 33 extending downward from the right edge of the horizontal portion 32 in FIG. 3. doing.
The mounting member 30 is fixed to the drive transmission shaft 27 by a bolt 34 being screwed into the drive transmission shaft 27 from above the horizontal portion 33 in a state where the upper end of the drive transmission shaft 27 is in contact with the lower surface of the horizontal portion 32. Have been. Further, the upper part of the shutter 14 is attached to the hanging part 33 of the attachment member by a bolt 35 so as to be in close contact therewith.

With the above configuration, the cylinder tube 23
When the head 24 is slid up and down by changing the air pressure inside, the drive transmission shaft 27 moves up and down with the movement of the head 24. As a result, the shutter 14 connected to the drive transmission shaft 27 is moved to the shutter guide 36 provided in the space.
An open state (a state shown by a solid line in FIG. 2) in which the both side edges are guided by the shutter 37,
Into a closed state (indicated by a two-dot chain line in FIG. 2).

FIG. 4 is an enlarged sectional view showing the structure near the top plate 15 in FIG. A seal member 38 for sealing a gap 29 between the drive transmission shaft 27 and the top plate 15 is provided on the upper surface of the top plate 15 in relation to the opening 28 through which the drive transmission shaft 27 is inserted. The seal member 38 is formed of, for example, an annular mechanical seal, is inserted into the drive transmission shaft 27, and is
It is fixed to the upper surface of. Specifically, the cap 39
Is formed in a disk shape, and an annular concave portion 40 having a diameter substantially equal to the outer diameter of the seal member 38 is formed on the lower surface thereof. When the sealing member 38 is fitted in the concave portion 40 of the cap 39, the cap 39 is
1 is attached by being fixed to the upper surface of the top plate 15.

The mechanical seal constituting the seal member 38 is one in which a spring member is provided inside a ring-shaped sliding member made of, for example, fluorine resin. Since the ring-shaped sliding member is made of fluororesin, the sliding resistance of the drive transmission shaft 27 can be reduced, so that the amount of particles generated by the drive transmission shaft 27 sliding up and down can be reduced. Can be reduced. Further, the inner diameter of the ring-shaped sliding member is reduced by the elastic force of the spring member incorporated in the ring-shaped sliding member, so that the ring-shaped sliding member can be in close contact with the drive transmission shaft 27. Thus, the gap 29 between the drive transmission shaft 27 and the top plate 15 can be satisfactorily sealed, so that there is no possibility that the atmosphere in the space 11 enters the drive chamber 18 through the gap 29. Therefore, it is possible to prevent the metal part of the rodless cylinder 19 as a drive source provided in the drive chamber 18 from being corroded or the rubber part from being deteriorated by the atmosphere containing the processing liquid component.

As the seal member 38, for example, an O-ring or the like may be applied in addition to the mechanical seal described above. An internal chamber 42 is formed in the drive chamber 18 adjacent to the top plate 15.
An inert gas such as N2 is supplied from an inert gas supply source 43 as a gas supply means. More specifically, the inner chamber 42 includes an upper plate 44 that is in close contact with the top plate 15, a lower plate 45 that is provided at a predetermined distance from the upper plate 44 in the vertical direction, and the upper plate 44 and the lower plate 45. It is partitioned by a peripheral side plate 46 to be connected. Upper plate 44, Lower plate 45
The peripheral wall plate 46 can be made of, for example, a resin material such as polypropylene. The upper plate 44 and the lower plate 45 are formed with shaft through holes 47 and 48, respectively, and the drive transmission shaft 27 is inserted into the shaft through holes 47 and 48. That is, the drive transmission shaft 27 penetrates the internal chamber 42 and is inserted into the opening 28 formed in the top plate 15.

The top plate 15 and the upper plate 44 have gas supply holes 49 for supplying an inert gas into the internal chamber 42.
Are formed through. Furthermore, on the upper surface of the top plate 15,
Peripheral side wall 5 rising upward from the peripheral edge of gas supply hole 49
A supply pipe connecting portion 52 is provided, which is defined by the upper wall 51 closing the upper side of the peripheral side wall 50. A connection port 53 is formed at a predetermined position of the peripheral side wall 50, and a distal end of a gas supply pipe 54 connected to the inert gas supply source 43 is screwed into the connection port 53.

According to this configuration, the gas supply pipe 54 and the supply pipe connection portion 5 from the inert gas supply source 43
2 and an inert gas can be supplied through the gas supply holes 49. When the inert gas is supplied into the internal chamber 42, the pressure in the internal chamber 42 is changed to the driving chamber 18 and the processing chamber 2
Since the pressure becomes higher than the atmospheric pressure in the (space 11), the atmosphere in the processing chamber 2 enters the internal chamber 42 (drive chamber 18) even if a gap is formed between the seal member 38 and the drive transmission shaft 27. Never do. Therefore, it is possible to further eliminate the possibility that the atmosphere containing the processing liquid component enters the driving chamber 18 and corrodes or deteriorates the rodless cylinder 19 as the driving source.

The inert gas supplied to the inner chamber 42 enters the drive chamber 18 through a gap between the drive transmission shaft 27 and the shaft through hole 48 formed in the lower plate 45 that defines the inner chamber 42. Since the rodless cylinder 19 (see FIG. 2) as a driving source in the driving chamber 18 is wrapped by the invading inert gas, corrosion and deterioration of the rodless cylinder 19 can be more effectively prevented.

Further, since the drive transmission shaft 27 passes through the internal chamber 42, the inert gas supplied to the internal chamber 42 can be directly blown onto the drive transmission shaft 27. Thereby, the processing liquid component attached to the drive transmission shaft 27 can be removed, and the drive transmission shaft 27 by the processing liquid component can be removed.
Of the metal part and deterioration of the resin part can be prevented.

Furthermore, since the internal chamber 42 is provided in close contact with the top plate 15, the drive transmission shaft 27 is drawn into the drive chamber 18, and at the same time, the processing liquid component adhered to the drive transmission shaft 27 is removed. Can be removed. Therefore, corrosion and deterioration of the drive transmission shaft 27 due to the processing liquid component can be more effectively prevented. Although one embodiment of the present invention has been described, the present invention can be embodied in various forms other than the above embodiment. For example, in the above-described embodiment, an inert gas such as N2 is supplied to the internal chamber. However, not limited to the inert gas, a gas containing oxygen or the like (for example, air) may be supplied. It is only necessary that the pressure in the room be higher than the pressure in the processing chamber. However, by supplying the inert gas to the internal chamber, the driving source can be wrapped with the inert gas, so that the driving source is more corroded than when a gas (eg, air) containing oxygen or the like is supplied. And the possibility of deterioration is further reduced.

In the above-described embodiment, the internal chamber is provided in close contact with the top plate. However, as shown in FIG. 5, the internal chamber 42 may be provided separately from the top plate 15. Also in this case, the gas supplied to the internal chamber 42 is
From the driving chamber 18 and the pressure in the driving chamber 18
Since the pressure becomes higher than the pressure in the space 1, it is possible to prevent the atmosphere in the space 11 from entering the drive room 18. Therefore, corrosion and deterioration of the drive source 56 disposed in the drive chamber 18 can be prevented. Further, since the drive transmission shaft 27 penetrates the internal chamber 42, the gas supplied to the internal chamber 42 is blown to the drive transmission shaft 27,
By removing the processing liquid component adhered to the substrate, corrosion and deterioration of the drive transmission shaft 27 due to the processing liquid component can be prevented.

Further, as shown in FIG. 6, the above-described internal chamber 42 (see FIG. 2) may be omitted and the gas may be supplied directly to the drive chamber 18. Also in this case, the air pressure in the driving chamber 18 can be made higher than the air pressure in the space 11, so that the atmosphere in the space 11
8 can be prevented from entering. Further, in the above-described embodiment, the configuration in which the shutter is moved up and down by the drive transmission shaft that slides in the up and down direction has been described. For example, a vertically long rack is formed on one surface of the shutter. A pinion that meshes with the shaft may be attached to a rotation drive shaft extending in the horizontal direction, and the shutter may be moved up and down by rotating the rotation drive shaft. In this case, a seal member may be provided between the partition wall separating the drive source from the processing chamber provided with the shutter and the rotary drive shaft.

Further, when the transfer robot is configured to be rotatable about a rotary drive shaft as a drive transmission shaft, not only the drive source for driving the shutter but also separates the drive source from the processing chamber. By providing a seal member between the partition wall and the rotary drive shaft, it is possible to prevent corrosion and deterioration of the drive source and the drive transmission shaft for driving the transfer robot.

In addition to the batch type substrate processing apparatus,
The configuration according to the present invention may be applied to, for example, a substrate processing apparatus of a type that processes substrates one by one. further,
The substrate to be processed is not limited to a wafer, but may be a glass substrate for a liquid crystal display device, a PDP (plasma display panel) substrate, or the like. In addition, various design changes can be made within the scope of the technical matters described in the claims.

[Brief description of the drawings]

FIG. 1 is a simplified perspective view showing a substrate processing apparatus according to an embodiment of the present invention, partially cut away.

FIG. 2 is a sectional view of a shutter driving mechanism as viewed from a side of the substrate processing apparatus.

FIG. 3 is a cross-sectional view of a shutter driving mechanism as viewed from the front of the substrate processing apparatus.

FIG. 4 is an enlarged cross-sectional view showing a configuration near a top plate shown in FIG. 2;

FIG. 5 is a simplified cross-sectional view of a main part showing a modification of the present invention.

FIG. 6 is a simplified cross-sectional view of a principal part showing another modified example of the present invention.

FIG. 7 is a simplified perspective view showing a configuration example of a conventional batch type wafer processing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Processing chamber 4 Processing tank 11 Space 14 Shutter (movable member) 15 Top plate (partition wall) 19 Rodless cylinder (drive source) 18 Drive chamber 27 Drive transmission shaft 28 Opening 38 Seal member 42 Internal chamber 43 Non Active gas supply source (gas supply means)

Claims (5)

[Claims] 1. A processing chamber for supplying a processing fluid to a substrate to perform processing, a drive source for driving a movable member that operates to perform processing on the substrate, and a drive source surrounding the drive source. A driving chamber formed by a partition wall that separates the processing chamber from the driving source; an opening formed in the partition wall of the driving chamber; and a driving force of the driving source inserted through the opening. A substrate processing apparatus, comprising: a drive transmission shaft for transmitting the driving force to the movable member; and a seal member provided in the opening to seal a gap between the drive transmission shaft and the partition of the drive chamber. . 2. The substrate processing apparatus according to claim 1, further comprising gas supply means for supplying gas to said driving chamber. 3. The substrate processing apparatus according to claim 2, wherein said gas supply means is an inert gas supply means for supplying an inert gas to said driving chamber. 4. An internal chamber provided inside the drive chamber and formed so as to surround the drive transmission shaft, wherein the gas supply means supplies gas to the internal chamber. Claim 2 or Claim 3 characterized by the above-mentioned.
The substrate processing apparatus according to any one of the preceding claims. 5. The internal chamber is provided adjacent to a partition wall in which the opening is formed.
The substrate processing apparatus according to any one of the preceding claims.