WO2020246142A1 - Substrat souple - Google Patents

Substrat souple Download PDF

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Publication number
WO2020246142A1
WO2020246142A1 PCT/JP2020/016342 JP2020016342W WO2020246142A1 WO 2020246142 A1 WO2020246142 A1 WO 2020246142A1 JP 2020016342 W JP2020016342 W JP 2020016342W WO 2020246142 A1 WO2020246142 A1 WO 2020246142A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
elastic resin
flexible substrate
coating layer
layer
Prior art date
Application number
PCT/JP2020/016342
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English (en)
Japanese (ja)
Inventor
匠 佐野
Original Assignee
株式会社ジャパンディスプレイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2020246142A1 publication Critical patent/WO2020246142A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • An embodiment of the present invention relates to a flexible substrate.
  • a flexible substrate in which electrical elements are arranged in a matrix can be attached to a curved surface such as a housing of an electronic device or a human body.
  • the electrical element for example, various sensors such as a touch sensor and a temperature sensor and a display element can be applied.
  • An object of the present embodiment is to provide a flexible substrate capable of suppressing deterioration over time due to a wiring step.
  • the flexible substrate according to the embodiment includes a flexible insulating base material, a plurality of wire portions including wiring provided on the insulating base material, and a first elastic resin layer that supports the insulating base material.
  • a coating layer that covers the wire portion and the first elastic resin layer, and a second elastic resin layer that covers the coating layer are provided, and the coating layer is an area between two adjacent wire portions.
  • the side surface of the wire portion, the first elastic resin layer, and the second elastic resin layer are formed in contact with each other.
  • FIG. 1 is a schematic plan view of a flexible substrate according to the present embodiment.
  • FIG. 2 is an enlarged plan view of a part of the flexible substrate shown in FIG.
  • FIG. 3 is a cross-sectional view of the flexible substrate taken along the line AB shown in FIG.
  • FIG. 4 is a cross-sectional view of the flexible substrate on the CD line shown in FIG.
  • FIG. 5 is a cross-sectional view of a flexible substrate according to a comparative example.
  • FIG. 6 is another cross-sectional view of the flexible substrate according to the comparative example.
  • FIG. 7 is still another cross-sectional view of the flexible substrate according to the comparative example.
  • FIG. 1 is a schematic plan view of the flexible substrate 100 according to the present embodiment.
  • the first direction D1, the second direction D2, and the third direction D3 are defined as shown in the figure.
  • the first direction D1 and the second direction D2 are parallel to the main surface of the flexible substrate 100 and intersect with each other.
  • the third direction D3 is a direction perpendicular to the first direction D1 and the second direction D2, and corresponds to the thickness direction of the flexible substrate 100.
  • the first direction D1 and the second direction D2 intersect vertically in the present embodiment, they may intersect at an angle other than vertical.
  • the flexible substrate 100 includes a plurality of scanning lines 1, a plurality of signal lines 2, a plurality of electrical elements 3, a support 8, a scanning line driver DR1, and a signal line driver DR2.
  • the scanning line driver DR1 and the signal line driver DR2 may be provided outside the flexible substrate 100.
  • the scanning line 1, the signal line 2, and the electrical element 3 are provided on the support 8.
  • the plurality of scanning lines 1 extend in the first direction D1 as a whole and are arranged in the second direction D2.
  • Each of the plurality of scanning lines 1 is electrically connected to the scanning line driver DR1.
  • the plurality of signal lines 2 extend in the second direction D2 as a whole and are lined up in the first direction D1.
  • Each of the plurality of signal lines 2 is electrically connected to the signal line driver DR2.
  • Each of the electrical elements 3 is provided at the intersection of the scanning line 1 and the signal line 2, and is electrically connected to the scanning line 1 and the signal line 2.
  • FIG. 2 is an enlarged plan view of a part of the flexible substrate 100 shown in FIG.
  • the flexible substrate 100 includes an insulating base material 4 that supports the scanning line 1 and the signal line 2.
  • the insulating base material 4 has elasticity and flexibility.
  • the insulating base material 4 can be formed of, for example, polyimide, but is not limited to this example.
  • the insulating base material 4 has a plurality of first partial PT1s extending in the first direction D1 and arranged side by side in the second direction D2, and a plurality of first portions PT1 extending in the second direction D2 and arranged side by side in the first direction D1. It has a second portion PT2 and a plurality of island-shaped portions IL located at the intersection of the first portion PT1 and the second portion PT2.
  • the first portion PT1 and the second portion PT2 are each formed in a wavy shape (formed in a meandering manner).
  • the island-shaped portion IL is connected to the first portion PT1 and the second portion PT2.
  • the scanning line 1 is located on the first portion PT1 and is arranged in a wavy shape.
  • the signal line 2 is located on the second portion PT2 and is arranged in a wavy shape.
  • the scanning line 1 and the signal line 2 are examples of wiring provided in the flexible substrate 100.
  • the scanning line 1 and the signal line 2 can be formed of, for example, a metal material or a transparent conductive material, and may have a single-layer structure or a laminated structure.
  • the flexible substrate 100 may include other types of wiring such as a power supply line that supplies power to the electrical element 3.
  • the scanning line 1 has a first wiring 11 shown by a solid line and a second wiring 12 shown by a broken line.
  • the second wiring 12 overlaps with the electrical element 3.
  • the first wiring 11 and the second wiring 12 are arranged in different layers from each other and are electrically connected through the contact holes CH1 and CH2.
  • the scanning line 1 supplies a scanning signal to the electrical element 3.
  • the electric element 3 is accompanied by the output of a signal such as a sensor, the output signal from the electric element 3 is supplied to the signal line 2.
  • a drive signal is supplied to the signal line 2.
  • a controller including a scanning signal supply source, a drive signal supply source, a processor for processing an output signal, and the like may be provided on the flexible board 100, or may be provided on a device connected to the flexible board 100.
  • the electrical element 3 is located on the island-shaped portion IL.
  • the electrical element 3 is smaller than the island-shaped portion IL, and in FIG. 2, the island-shaped portion IL protrudes from the edge of the electrical element 3.
  • the electrical element 3 is a sensor, a semiconductor, an actuator, or the like.
  • the sensor an optical sensor that receives visible light or near-infrared light, a temperature sensor, a pressure sensor, a touch sensor, or the like can be applied.
  • a semiconductor element a light emitting element, a light receiving element, a diode, a transistor, or the like can be applied.
  • the electrical element 3 is a light emitting element, a flexible display having flexibility and elasticity can be realized.
  • the light emitting element for example, a light emitting diode having a size of about 100 ⁇ m such as a mini LED or a micro LED or an organic electroluminescence element can be applied.
  • the electrical element 3 is an actuator, for example, a piezo element can be applied.
  • the electrical element 3 is not limited to the one illustrated here, and other elements having various functions can be applied.
  • the electrical element 3 may be a capacitor, a resistor, or the like. Further, the arrangement position and shape of the electric element 3 are not limited to the example shown in FIG.
  • the insulating base material 4, the scanning line 1, the signal line 2, the first organic insulating layer 5 and the second organic insulating layer 6 described later are collectively referred to as a wire portion LP.
  • the wire LP is located on the support 8.
  • the line portion LP extends in the first direction D1 and extends in the second direction D2 in a plurality of corrugated (meandering type) first line portions LP1 arranged side by side in the second direction D2. It includes a plurality of corrugated (meandering) second line portions LP2 arranged side by side.
  • the first line portion LP1 includes the first portion PT1 of the above-mentioned insulating base material 4 and the scanning line 1.
  • the second wire portion LP2 includes the second portion PT2 of the insulating base material 4 described above and the signal line 2.
  • FIG. 3 is a cross-sectional view of the flexible substrate 100 in line AB shown in FIG.
  • the flexible substrate 100 further includes a first organic insulating layer 5, a second organic insulating layer 6, a coating layer 7, and a second elastic resin layer 9.
  • the support 8 will be referred to as the first stretchable resin layer 8.
  • the first elastic resin layer 8 has a first surface SF1.
  • the wire portion LP is located on the first surface SF1.
  • the wire portion LP is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, a signal line 2, and a scanning line 1 shown in FIG.
  • the second wire portion LP2 is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, and a signal line 2.
  • the first line portion LP1 is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, and a scanning line 1.
  • the insulating base material 4 is located on the first surface SF1.
  • the first organic insulating layer 5 covers the insulating base material 4.
  • the second organic insulating layer 6 covers the first organic insulating layer 5.
  • the signal line 2 is located on the second organic insulating layer 6.
  • the coating layer 7 covers the second line portion LP2. That is, the coating layer 7 covers the signal line 2, the insulating base material 4, the first organic insulating layer 5, and the second organic insulating layer 6. Further, the coating layer 7 is in contact with the entire surface of the first surface SF1 in the region R1 between the two adjacent second line portions LP2. That is, the coating layer 7 covers the second wire portion LP2 and the first stretchable resin layer 8.
  • the coating layer 7 is formed of a poly-para-xylylenes (PPX) structure, such as parylene®. Although the details will be described later, if the coating layer 7 is a material having excellent coverage of wiring steps and surface flatness and having material properties described later, other than the poly-p-xylylene structure described above. It may be formed by a material.
  • the second elastic resin layer 9 covers the coating layer 7. That is, in the region R1 between the two adjacent second wire portions LP2, the coating layer 7 includes the side surface of the second wire portion LP2, the first elastic resin layer 8 (first surface SF1), and the second elastic resin. It is formed in contact with the layer 9.
  • the first stretchable resin layer 8 and the second stretchable resin layer 9 may be formed of the same material or may be formed of different materials.
  • the relationship between the line portion LP and the coating layer 7 has been described by taking the second line portion LP2 as an example, but it should be noted that the relationship between the first line portion LP1 and the coating layer 7 is also the same. That is, the coating layer 7 covers the first line portion LP1 and the first stretchable resin layer 8, and in the region between the two adjacent first line portions LP1, the side surface of the first line portion LP1 and the first stretchable resin It is formed in contact with the layer 8 (first surface SF1) and the second elastic resin layer 9.
  • the second stretchable resin layer 9 is formed of a stretchable and flexible resin, for example, an elastomer material such as acrylic, epoxy, urethane, or silicone.
  • the breaking elongation rate of the second elastic resin layer 9 is, for example, 1000%.
  • the breaking elongation rate is a value indicating how much the substance is stretched from the start of pulling the substance in a state where no external force is applied (normal state) to the breaking, for example, the breaking elongation rate is 1000% described above.
  • the substance has a property of being stretchable by 10 times as much as the normal state before breaking.
  • the recovery rate of the second elastic resin layer 9 is, for example, 90%.
  • the recovery rate is a value indicating how much the substance returns to the normal state (returns to the original state) when the external force is removed from the substance in the state of being pulled by applying the external force.
  • the recovery rate may be referred to as restoring force.
  • the transmittance of the second elastic resin layer 9 is, for example, 90%.
  • the transmittance is a value indicating how much incident light of a specific wavelength is passed through by a substance.
  • Water vapor permeability of the second stretchable resin layer 9 is, for example, several 10g / m 2 ⁇ 24h.
  • the water vapor permeability indicates the amount of water vapor that passes through a substance of a unit area in a unit time under the conditions of a specified temperature and humidity. That is, the water vapor permeability indicates the number of grams of water vapor per 1 m 2 of the area permeated in 24 hours.
  • the water vapor transmittance may be referred to as moisture permeability.
  • the second stretchable resin layer 9 further has properties such as ultraviolet resistance whose characteristics do not change even when irradiated with ultraviolet rays.
  • the coating layer 7 is formed of a material having elasticity, flexibility and barrier properties.
  • the coating layer 7 is formed of, for example, a material that is vapor-deposited as a gas in a room temperature vapor deposition chamber. As described above, the coating layer 7 is formed by being vapor-deposited in a thin-film deposition chamber at room temperature, so that damage caused by heat to other elements can be reduced.
  • the coating layer 7 is formed by, for example, vapor deposition of gas, it is possible to uniformly form the layer even in cracks and narrow portions.
  • An example of such a material is the parylene described above.
  • the elongation at break of the coating layer 7 (parylene) is, for example, 200%.
  • the transmittance of the coating layer 7 (parylene) is, for example, 90%.
  • Water vapor permeability of the coating layer 7 (parylene) is, for example 0.1g / m 2 ⁇ 24h. Unlike the second elastic resin layer 9, the coating layer 7 (parylene) does not have the above-mentioned ultraviolet resistance property.
  • the coating layer 7 has the characteristics that the water vapor transmittance is smaller than that of the second stretchable resin layer 9 and the elongation at break is also smaller. Further, the coating layer 7 also has a characteristic that a layer can be uniformly formed even in a crack or a narrow portion.
  • FIG. 4 is a cross-sectional view of the flexible substrate 100 on the CD line shown in FIG.
  • the electrical element 3 is arranged on the island-shaped portion IL of the insulating base material 4.
  • An inorganic insulating layer 10 (passivation layer) is arranged between the electrical element 3 and the island-shaped portion IL.
  • the inorganic insulating layer 10 is formed in an island shape that overlaps with the electric element 3 (or the island-shaped portion IL) in a plan view.
  • the first wiring portions 11a and 11b are arranged on the first organic insulating layer 5 and covered with the second organic insulating layer 6.
  • the second wiring portion 12 is arranged on the inorganic insulating layer 10 and is electrically connected to the electric element 3. In the example shown in FIG. 4, both ends of the second wiring portion 12 are covered with the first organic insulating layer 5.
  • the contact holes CH1 and CH2 are provided in the first organic insulating layer 5.
  • the first wiring portion 11a is electrically connected to the second wiring portion 12 via the connecting member CM1 arranged in the contact hole CH1.
  • the first wiring portion 11b is electrically connected to the second wiring portion 12 via the connecting member CM2 arranged in the contact hole CH2.
  • the connection member CM1 may be a part of the first wiring portion 11a, or may be provided separately from the first wiring portion 11a.
  • the connection member CM2 may be a part of the first wiring portion 11b, or may be provided separately from the first wiring portion 11b.
  • the island-shaped inorganic insulating layer 10 is arranged between the electrical element 3 and the insulating base material 4.
  • the inorganic insulating layer 10 functions as a protective film that suppresses the intrusion of moisture and the like into the second wiring portion 12 of the electrical element 3 and the scanning line 1. Therefore, the reliability of the flexible substrate 100 is improved. Further, in general, the inorganic film is more likely to crack than the organic film, but since the inorganic insulating layer 10 is not provided below the first wiring portions 11a and 11b of the scanning line 1, the first wiring portion 11a And the disconnection at 11b is suppressed. The same applies to signal lines (not shown). Further, as compared with the case where the inorganic insulating layer 10 is provided on the entire flexible substrate 100, the elasticity and flexibility of the flexible substrate 100 are less likely to be impaired.
  • the second wiring portion 12 that overlaps with the electric element 3 is arranged in a layer different from that of the first wiring portions 11a and 11b, the degree of freedom of design in the vicinity of the electric element 3 is increased. improves. Further, since the contact holes CH1 and CH2 are provided above the inorganic insulating layer 10, the connection positions between the first wiring portion 11a and the second wiring portion 12 and the first wiring portion 11b and the second wiring portion 12b are provided. Poor connection at the connection position with 12 is suppressed.
  • the effect of the flexible substrate 100 according to the present embodiment will be described with reference to a comparative example.
  • the comparative example is for explaining a part of the effects that the flexible substrate 100 according to the present embodiment can exert, and the configurations and effects common to the comparative example and the present embodiment can be described from the scope of the present invention. It is not an exclusion.
  • FIG. 5 is a diagram showing a cross section of the flexible substrate 100A according to the comparative example.
  • the flexible substrate 100A according to the comparative example is provided so that the coating layer 7 does not cover the entire wire portion LP but covers the signal line 2 (and the second organic insulating layer 6) constituting the wire portion LP. Therefore, it is different from the flexible substrate 100 according to the present embodiment.
  • the coating layer 7 is provided so as to cover the signal line 2 constituting the wire portion LP instead of the entire wire portion LP as in the flexible substrate 100A according to the comparative example, the region between the two adjacent wire portion LPs.
  • the second elastic resin layer 9 is in contact with the first surface SF1 instead of the coating layer 7.
  • the coating layer 7 is formed of a material that is vapor-deposited as a gas, such as parylene, it is possible to uniformly form the layer even in cracks and narrow portions, while the second elastic resin. Due to the material properties of the layer 9, the layer cannot be uniformly formed in a crack or a narrow portion. Therefore, as shown in FIG. 5, in the region R1 between the two adjacent line portions LP, the third direction of the line portion LP is between the second elastic resin layer 9 and the first elastic resin layer 8. Bubbles (gap) due to the length (height) of D3 are generated.
  • the area where the second elastic resin layer 9 contacts the first surface SF1 of the first elastic resin layer 8 becomes smaller, so that the flexible substrate 100A is repeatedly used and the first elastic resin layer 8 is used. As the second elastic resin layer 9 repeatedly expands and contracts, the second elastic resin layer 9 may peel off from the first elastic resin layer 8.
  • the coating layer 7 is provided so as to cover not only the signal line 2 but also the entire line portion LP and the first elastic resin layer 8, the adjacent 2 In the region R1 between the two line portions LP, as shown in FIG. 3, the coating layer 7 is in contact with the side surface of the line portion LP and the entire surface of the first surface SF1 of the first elastic resin layer 8 to form a line. It is possible to suppress the generation of air bubbles due to the height of the part LP (wiring step).
  • the coating layer 7 is the first stretchable resin. It is possible to suppress the possibility of peeling off from the layer 8, and it is also possible to suppress the possibility of the second elastic resin layer 9 provided over the entire surface of the flat coating layer 7 peeling off. It is possible.
  • the second stretchable resin layer 9 becomes the first stretchable resin layer 9 as shown in FIG. 6 due to the material characteristics of the second stretchable resin layer 9.
  • the area of the elastic resin layer 8 in contact with the first surface SF1 is smaller than that shown in FIG. 5, and there is a problem that the possibility that the second elastic resin layer 9 is peeled off from the first elastic resin layer 8 is further increased.
  • the material characteristics of the second elastic resin layer 9 show that FIG. As shown, the area where the second elastic resin layer 9 is in contact with the first surface SF1 of the first elastic resin layer 8 is smaller than that in the case shown in FIG. 5, and the second elastic resin layer 9 is the first elastic resin.
  • the possibility of peeling off from the layer 8 is further increased, but in the case of the configuration according to the present embodiment, the layer is uniformly formed even in the cracks and narrow portions, and the generation of air bubbles due to the wiring step is suppressed. Therefore, it is also possible to realize a narrow pitch of the line portion LP.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne un substrat souple qui permet de réduire au minimum la détérioration au fil du temps provoquée par une différence de hauteur de câblage.　Un substrat souple selon un mode de réalisation est équipé d'une pluralité de parties de câble comprenant un substrat isolant souple et un câblage disposé sur le substrat isolant et comportant également une première couche de résine élastique pour supporter le substrat isolant, une couche de revêtement pour recouvrir les parties de câble et la première couche de résine élastique et une seconde couche de résine élastique pour recouvrir la couche de revêtement, la couche de revêtement étant formée de manière à entrer en contact avec les surfaces latérales des parties de câble, la première couche de résine élastique et la seconde couche de résine élastique dans les régions entre deux parties de câble adjacentes.
PCT/JP2020/016342 2019-06-06 2020-04-13 Substrat souple WO2020246142A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-106151 2019-06-06
JP2019106151A JP2020202209A (ja) 2019-06-06 2019-06-06 フレキシブル基板

Publications (1)

Publication Number Publication Date
WO2020246142A1 true WO2020246142A1 (fr) 2020-12-10

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PCT/JP2020/016342 WO2020246142A1 (fr) 2019-06-06 2020-04-13 Substrat souple

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JP (1) JP2020202209A (fr)
WO (1) WO2020246142A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231018A (ja) * 2011-04-26 2012-11-22 Nippon Mektron Ltd フレキシブル回路体及びその製造方法
US20150351221A1 (en) * 2014-05-27 2015-12-03 Gwangju Institute Of Science And Technology Electrode arrangement with 3d structure and fabrication method thereof
WO2017003531A1 (fr) * 2015-06-30 2017-01-05 Apple Inc. Dispositifs électroniques comportant des composants d'entrée-sortie souples
JP2017113088A (ja) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
JP2018066933A (ja) * 2016-10-21 2018-04-26 株式会社ジャパンディスプレイ 表示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231018A (ja) * 2011-04-26 2012-11-22 Nippon Mektron Ltd フレキシブル回路体及びその製造方法
US20150351221A1 (en) * 2014-05-27 2015-12-03 Gwangju Institute Of Science And Technology Electrode arrangement with 3d structure and fabrication method thereof
WO2017003531A1 (fr) * 2015-06-30 2017-01-05 Apple Inc. Dispositifs électroniques comportant des composants d'entrée-sortie souples
JP2017113088A (ja) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
JP2018066933A (ja) * 2016-10-21 2018-04-26 株式会社ジャパンディスプレイ 表示装置

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