WO2020246142A1 - Flexible substrate - Google Patents

Flexible substrate Download PDF

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Publication number
WO2020246142A1
WO2020246142A1 PCT/JP2020/016342 JP2020016342W WO2020246142A1 WO 2020246142 A1 WO2020246142 A1 WO 2020246142A1 JP 2020016342 W JP2020016342 W JP 2020016342W WO 2020246142 A1 WO2020246142 A1 WO 2020246142A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
elastic resin
flexible substrate
coating layer
layer
Prior art date
Application number
PCT/JP2020/016342
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French (fr)
Japanese (ja)
Inventor
匠 佐野
Original Assignee
株式会社ジャパンディスプレイ
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Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2020246142A1 publication Critical patent/WO2020246142A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • An embodiment of the present invention relates to a flexible substrate.
  • a flexible substrate in which electrical elements are arranged in a matrix can be attached to a curved surface such as a housing of an electronic device or a human body.
  • the electrical element for example, various sensors such as a touch sensor and a temperature sensor and a display element can be applied.
  • An object of the present embodiment is to provide a flexible substrate capable of suppressing deterioration over time due to a wiring step.
  • the flexible substrate according to the embodiment includes a flexible insulating base material, a plurality of wire portions including wiring provided on the insulating base material, and a first elastic resin layer that supports the insulating base material.
  • a coating layer that covers the wire portion and the first elastic resin layer, and a second elastic resin layer that covers the coating layer are provided, and the coating layer is an area between two adjacent wire portions.
  • the side surface of the wire portion, the first elastic resin layer, and the second elastic resin layer are formed in contact with each other.
  • FIG. 1 is a schematic plan view of a flexible substrate according to the present embodiment.
  • FIG. 2 is an enlarged plan view of a part of the flexible substrate shown in FIG.
  • FIG. 3 is a cross-sectional view of the flexible substrate taken along the line AB shown in FIG.
  • FIG. 4 is a cross-sectional view of the flexible substrate on the CD line shown in FIG.
  • FIG. 5 is a cross-sectional view of a flexible substrate according to a comparative example.
  • FIG. 6 is another cross-sectional view of the flexible substrate according to the comparative example.
  • FIG. 7 is still another cross-sectional view of the flexible substrate according to the comparative example.
  • FIG. 1 is a schematic plan view of the flexible substrate 100 according to the present embodiment.
  • the first direction D1, the second direction D2, and the third direction D3 are defined as shown in the figure.
  • the first direction D1 and the second direction D2 are parallel to the main surface of the flexible substrate 100 and intersect with each other.
  • the third direction D3 is a direction perpendicular to the first direction D1 and the second direction D2, and corresponds to the thickness direction of the flexible substrate 100.
  • the first direction D1 and the second direction D2 intersect vertically in the present embodiment, they may intersect at an angle other than vertical.
  • the flexible substrate 100 includes a plurality of scanning lines 1, a plurality of signal lines 2, a plurality of electrical elements 3, a support 8, a scanning line driver DR1, and a signal line driver DR2.
  • the scanning line driver DR1 and the signal line driver DR2 may be provided outside the flexible substrate 100.
  • the scanning line 1, the signal line 2, and the electrical element 3 are provided on the support 8.
  • the plurality of scanning lines 1 extend in the first direction D1 as a whole and are arranged in the second direction D2.
  • Each of the plurality of scanning lines 1 is electrically connected to the scanning line driver DR1.
  • the plurality of signal lines 2 extend in the second direction D2 as a whole and are lined up in the first direction D1.
  • Each of the plurality of signal lines 2 is electrically connected to the signal line driver DR2.
  • Each of the electrical elements 3 is provided at the intersection of the scanning line 1 and the signal line 2, and is electrically connected to the scanning line 1 and the signal line 2.
  • FIG. 2 is an enlarged plan view of a part of the flexible substrate 100 shown in FIG.
  • the flexible substrate 100 includes an insulating base material 4 that supports the scanning line 1 and the signal line 2.
  • the insulating base material 4 has elasticity and flexibility.
  • the insulating base material 4 can be formed of, for example, polyimide, but is not limited to this example.
  • the insulating base material 4 has a plurality of first partial PT1s extending in the first direction D1 and arranged side by side in the second direction D2, and a plurality of first portions PT1 extending in the second direction D2 and arranged side by side in the first direction D1. It has a second portion PT2 and a plurality of island-shaped portions IL located at the intersection of the first portion PT1 and the second portion PT2.
  • the first portion PT1 and the second portion PT2 are each formed in a wavy shape (formed in a meandering manner).
  • the island-shaped portion IL is connected to the first portion PT1 and the second portion PT2.
  • the scanning line 1 is located on the first portion PT1 and is arranged in a wavy shape.
  • the signal line 2 is located on the second portion PT2 and is arranged in a wavy shape.
  • the scanning line 1 and the signal line 2 are examples of wiring provided in the flexible substrate 100.
  • the scanning line 1 and the signal line 2 can be formed of, for example, a metal material or a transparent conductive material, and may have a single-layer structure or a laminated structure.
  • the flexible substrate 100 may include other types of wiring such as a power supply line that supplies power to the electrical element 3.
  • the scanning line 1 has a first wiring 11 shown by a solid line and a second wiring 12 shown by a broken line.
  • the second wiring 12 overlaps with the electrical element 3.
  • the first wiring 11 and the second wiring 12 are arranged in different layers from each other and are electrically connected through the contact holes CH1 and CH2.
  • the scanning line 1 supplies a scanning signal to the electrical element 3.
  • the electric element 3 is accompanied by the output of a signal such as a sensor, the output signal from the electric element 3 is supplied to the signal line 2.
  • a drive signal is supplied to the signal line 2.
  • a controller including a scanning signal supply source, a drive signal supply source, a processor for processing an output signal, and the like may be provided on the flexible board 100, or may be provided on a device connected to the flexible board 100.
  • the electrical element 3 is located on the island-shaped portion IL.
  • the electrical element 3 is smaller than the island-shaped portion IL, and in FIG. 2, the island-shaped portion IL protrudes from the edge of the electrical element 3.
  • the electrical element 3 is a sensor, a semiconductor, an actuator, or the like.
  • the sensor an optical sensor that receives visible light or near-infrared light, a temperature sensor, a pressure sensor, a touch sensor, or the like can be applied.
  • a semiconductor element a light emitting element, a light receiving element, a diode, a transistor, or the like can be applied.
  • the electrical element 3 is a light emitting element, a flexible display having flexibility and elasticity can be realized.
  • the light emitting element for example, a light emitting diode having a size of about 100 ⁇ m such as a mini LED or a micro LED or an organic electroluminescence element can be applied.
  • the electrical element 3 is an actuator, for example, a piezo element can be applied.
  • the electrical element 3 is not limited to the one illustrated here, and other elements having various functions can be applied.
  • the electrical element 3 may be a capacitor, a resistor, or the like. Further, the arrangement position and shape of the electric element 3 are not limited to the example shown in FIG.
  • the insulating base material 4, the scanning line 1, the signal line 2, the first organic insulating layer 5 and the second organic insulating layer 6 described later are collectively referred to as a wire portion LP.
  • the wire LP is located on the support 8.
  • the line portion LP extends in the first direction D1 and extends in the second direction D2 in a plurality of corrugated (meandering type) first line portions LP1 arranged side by side in the second direction D2. It includes a plurality of corrugated (meandering) second line portions LP2 arranged side by side.
  • the first line portion LP1 includes the first portion PT1 of the above-mentioned insulating base material 4 and the scanning line 1.
  • the second wire portion LP2 includes the second portion PT2 of the insulating base material 4 described above and the signal line 2.
  • FIG. 3 is a cross-sectional view of the flexible substrate 100 in line AB shown in FIG.
  • the flexible substrate 100 further includes a first organic insulating layer 5, a second organic insulating layer 6, a coating layer 7, and a second elastic resin layer 9.
  • the support 8 will be referred to as the first stretchable resin layer 8.
  • the first elastic resin layer 8 has a first surface SF1.
  • the wire portion LP is located on the first surface SF1.
  • the wire portion LP is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, a signal line 2, and a scanning line 1 shown in FIG.
  • the second wire portion LP2 is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, and a signal line 2.
  • the first line portion LP1 is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, and a scanning line 1.
  • the insulating base material 4 is located on the first surface SF1.
  • the first organic insulating layer 5 covers the insulating base material 4.
  • the second organic insulating layer 6 covers the first organic insulating layer 5.
  • the signal line 2 is located on the second organic insulating layer 6.
  • the coating layer 7 covers the second line portion LP2. That is, the coating layer 7 covers the signal line 2, the insulating base material 4, the first organic insulating layer 5, and the second organic insulating layer 6. Further, the coating layer 7 is in contact with the entire surface of the first surface SF1 in the region R1 between the two adjacent second line portions LP2. That is, the coating layer 7 covers the second wire portion LP2 and the first stretchable resin layer 8.
  • the coating layer 7 is formed of a poly-para-xylylenes (PPX) structure, such as parylene®. Although the details will be described later, if the coating layer 7 is a material having excellent coverage of wiring steps and surface flatness and having material properties described later, other than the poly-p-xylylene structure described above. It may be formed by a material.
  • the second elastic resin layer 9 covers the coating layer 7. That is, in the region R1 between the two adjacent second wire portions LP2, the coating layer 7 includes the side surface of the second wire portion LP2, the first elastic resin layer 8 (first surface SF1), and the second elastic resin. It is formed in contact with the layer 9.
  • the first stretchable resin layer 8 and the second stretchable resin layer 9 may be formed of the same material or may be formed of different materials.
  • the relationship between the line portion LP and the coating layer 7 has been described by taking the second line portion LP2 as an example, but it should be noted that the relationship between the first line portion LP1 and the coating layer 7 is also the same. That is, the coating layer 7 covers the first line portion LP1 and the first stretchable resin layer 8, and in the region between the two adjacent first line portions LP1, the side surface of the first line portion LP1 and the first stretchable resin It is formed in contact with the layer 8 (first surface SF1) and the second elastic resin layer 9.
  • the second stretchable resin layer 9 is formed of a stretchable and flexible resin, for example, an elastomer material such as acrylic, epoxy, urethane, or silicone.
  • the breaking elongation rate of the second elastic resin layer 9 is, for example, 1000%.
  • the breaking elongation rate is a value indicating how much the substance is stretched from the start of pulling the substance in a state where no external force is applied (normal state) to the breaking, for example, the breaking elongation rate is 1000% described above.
  • the substance has a property of being stretchable by 10 times as much as the normal state before breaking.
  • the recovery rate of the second elastic resin layer 9 is, for example, 90%.
  • the recovery rate is a value indicating how much the substance returns to the normal state (returns to the original state) when the external force is removed from the substance in the state of being pulled by applying the external force.
  • the recovery rate may be referred to as restoring force.
  • the transmittance of the second elastic resin layer 9 is, for example, 90%.
  • the transmittance is a value indicating how much incident light of a specific wavelength is passed through by a substance.
  • Water vapor permeability of the second stretchable resin layer 9 is, for example, several 10g / m 2 ⁇ 24h.
  • the water vapor permeability indicates the amount of water vapor that passes through a substance of a unit area in a unit time under the conditions of a specified temperature and humidity. That is, the water vapor permeability indicates the number of grams of water vapor per 1 m 2 of the area permeated in 24 hours.
  • the water vapor transmittance may be referred to as moisture permeability.
  • the second stretchable resin layer 9 further has properties such as ultraviolet resistance whose characteristics do not change even when irradiated with ultraviolet rays.
  • the coating layer 7 is formed of a material having elasticity, flexibility and barrier properties.
  • the coating layer 7 is formed of, for example, a material that is vapor-deposited as a gas in a room temperature vapor deposition chamber. As described above, the coating layer 7 is formed by being vapor-deposited in a thin-film deposition chamber at room temperature, so that damage caused by heat to other elements can be reduced.
  • the coating layer 7 is formed by, for example, vapor deposition of gas, it is possible to uniformly form the layer even in cracks and narrow portions.
  • An example of such a material is the parylene described above.
  • the elongation at break of the coating layer 7 (parylene) is, for example, 200%.
  • the transmittance of the coating layer 7 (parylene) is, for example, 90%.
  • Water vapor permeability of the coating layer 7 (parylene) is, for example 0.1g / m 2 ⁇ 24h. Unlike the second elastic resin layer 9, the coating layer 7 (parylene) does not have the above-mentioned ultraviolet resistance property.
  • the coating layer 7 has the characteristics that the water vapor transmittance is smaller than that of the second stretchable resin layer 9 and the elongation at break is also smaller. Further, the coating layer 7 also has a characteristic that a layer can be uniformly formed even in a crack or a narrow portion.
  • FIG. 4 is a cross-sectional view of the flexible substrate 100 on the CD line shown in FIG.
  • the electrical element 3 is arranged on the island-shaped portion IL of the insulating base material 4.
  • An inorganic insulating layer 10 (passivation layer) is arranged between the electrical element 3 and the island-shaped portion IL.
  • the inorganic insulating layer 10 is formed in an island shape that overlaps with the electric element 3 (or the island-shaped portion IL) in a plan view.
  • the first wiring portions 11a and 11b are arranged on the first organic insulating layer 5 and covered with the second organic insulating layer 6.
  • the second wiring portion 12 is arranged on the inorganic insulating layer 10 and is electrically connected to the electric element 3. In the example shown in FIG. 4, both ends of the second wiring portion 12 are covered with the first organic insulating layer 5.
  • the contact holes CH1 and CH2 are provided in the first organic insulating layer 5.
  • the first wiring portion 11a is electrically connected to the second wiring portion 12 via the connecting member CM1 arranged in the contact hole CH1.
  • the first wiring portion 11b is electrically connected to the second wiring portion 12 via the connecting member CM2 arranged in the contact hole CH2.
  • the connection member CM1 may be a part of the first wiring portion 11a, or may be provided separately from the first wiring portion 11a.
  • the connection member CM2 may be a part of the first wiring portion 11b, or may be provided separately from the first wiring portion 11b.
  • the island-shaped inorganic insulating layer 10 is arranged between the electrical element 3 and the insulating base material 4.
  • the inorganic insulating layer 10 functions as a protective film that suppresses the intrusion of moisture and the like into the second wiring portion 12 of the electrical element 3 and the scanning line 1. Therefore, the reliability of the flexible substrate 100 is improved. Further, in general, the inorganic film is more likely to crack than the organic film, but since the inorganic insulating layer 10 is not provided below the first wiring portions 11a and 11b of the scanning line 1, the first wiring portion 11a And the disconnection at 11b is suppressed. The same applies to signal lines (not shown). Further, as compared with the case where the inorganic insulating layer 10 is provided on the entire flexible substrate 100, the elasticity and flexibility of the flexible substrate 100 are less likely to be impaired.
  • the second wiring portion 12 that overlaps with the electric element 3 is arranged in a layer different from that of the first wiring portions 11a and 11b, the degree of freedom of design in the vicinity of the electric element 3 is increased. improves. Further, since the contact holes CH1 and CH2 are provided above the inorganic insulating layer 10, the connection positions between the first wiring portion 11a and the second wiring portion 12 and the first wiring portion 11b and the second wiring portion 12b are provided. Poor connection at the connection position with 12 is suppressed.
  • the effect of the flexible substrate 100 according to the present embodiment will be described with reference to a comparative example.
  • the comparative example is for explaining a part of the effects that the flexible substrate 100 according to the present embodiment can exert, and the configurations and effects common to the comparative example and the present embodiment can be described from the scope of the present invention. It is not an exclusion.
  • FIG. 5 is a diagram showing a cross section of the flexible substrate 100A according to the comparative example.
  • the flexible substrate 100A according to the comparative example is provided so that the coating layer 7 does not cover the entire wire portion LP but covers the signal line 2 (and the second organic insulating layer 6) constituting the wire portion LP. Therefore, it is different from the flexible substrate 100 according to the present embodiment.
  • the coating layer 7 is provided so as to cover the signal line 2 constituting the wire portion LP instead of the entire wire portion LP as in the flexible substrate 100A according to the comparative example, the region between the two adjacent wire portion LPs.
  • the second elastic resin layer 9 is in contact with the first surface SF1 instead of the coating layer 7.
  • the coating layer 7 is formed of a material that is vapor-deposited as a gas, such as parylene, it is possible to uniformly form the layer even in cracks and narrow portions, while the second elastic resin. Due to the material properties of the layer 9, the layer cannot be uniformly formed in a crack or a narrow portion. Therefore, as shown in FIG. 5, in the region R1 between the two adjacent line portions LP, the third direction of the line portion LP is between the second elastic resin layer 9 and the first elastic resin layer 8. Bubbles (gap) due to the length (height) of D3 are generated.
  • the area where the second elastic resin layer 9 contacts the first surface SF1 of the first elastic resin layer 8 becomes smaller, so that the flexible substrate 100A is repeatedly used and the first elastic resin layer 8 is used. As the second elastic resin layer 9 repeatedly expands and contracts, the second elastic resin layer 9 may peel off from the first elastic resin layer 8.
  • the coating layer 7 is provided so as to cover not only the signal line 2 but also the entire line portion LP and the first elastic resin layer 8, the adjacent 2 In the region R1 between the two line portions LP, as shown in FIG. 3, the coating layer 7 is in contact with the side surface of the line portion LP and the entire surface of the first surface SF1 of the first elastic resin layer 8 to form a line. It is possible to suppress the generation of air bubbles due to the height of the part LP (wiring step).
  • the coating layer 7 is the first stretchable resin. It is possible to suppress the possibility of peeling off from the layer 8, and it is also possible to suppress the possibility of the second elastic resin layer 9 provided over the entire surface of the flat coating layer 7 peeling off. It is possible.
  • the second stretchable resin layer 9 becomes the first stretchable resin layer 9 as shown in FIG. 6 due to the material characteristics of the second stretchable resin layer 9.
  • the area of the elastic resin layer 8 in contact with the first surface SF1 is smaller than that shown in FIG. 5, and there is a problem that the possibility that the second elastic resin layer 9 is peeled off from the first elastic resin layer 8 is further increased.
  • the material characteristics of the second elastic resin layer 9 show that FIG. As shown, the area where the second elastic resin layer 9 is in contact with the first surface SF1 of the first elastic resin layer 8 is smaller than that in the case shown in FIG. 5, and the second elastic resin layer 9 is the first elastic resin.
  • the possibility of peeling off from the layer 8 is further increased, but in the case of the configuration according to the present embodiment, the layer is uniformly formed even in the cracks and narrow portions, and the generation of air bubbles due to the wiring step is suppressed. Therefore, it is also possible to realize a narrow pitch of the line portion LP.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Provided is a flexible substrate which makes it possible to minimize deterioration over time caused by a wiring height difference.　A flexible substrate according to one embodiment equipped with a plurality of wire parts comprising a flexible insulative substrate and wiring provided on the insulative substrate, and also equipped with a first elastic resin layer for supporting the insulative substrate, a coating layer for covering the wire parts and the first elastic resin layer, and a second elastic resin layer for covering the coating layer, wherein the coating layer is formed so as to contact the lateral surfaces of the wire parts, the first elastic resin layer and the second elastic resin layer in the regions between two adjacent wire parts.

Description

フレキシブル基板Flexible substrate
　本発明の実施形態は、フレキシブル基板に関する。 An embodiment of the present invention relates to a flexible substrate.
　近年、可撓性および伸縮性を有したフレキシブル基板の利用が種々の分野で検討されている。一例を挙げると、マトリクス状に電気的素子が配列されたフレキシブル基板を電子機器の筐体や人体等の曲面に貼り付ける利用形態が考えられる。電気的素子としては、例えばタッチセンサや温度センサ等の各種センサや表示素子が適用され得る。 In recent years, the use of flexible and stretchable flexible substrates has been studied in various fields. As an example, a flexible substrate in which electrical elements are arranged in a matrix can be attached to a curved surface such as a housing of an electronic device or a human body. As the electrical element, for example, various sensors such as a touch sensor and a temperature sensor and a display element can be applied.
　フレキシブル基板においては、屈曲や伸縮による応力で配線が損傷しないように対策を講じる必要がある。このような対策としては、例えば、配線を支持する基材にハニカム形状の開口を設けることや、配線を蛇行した形状（ミアンダ形状）とすることが提案されている。 For flexible boards, it is necessary to take measures to prevent the wiring from being damaged by stress due to bending or expansion and contraction. As such measures, for example, it has been proposed to provide a honeycomb-shaped opening in the base material that supports the wiring, or to make the wiring meandering (munder shape).
　一方で、フレキシブル基板においては、配線段差に起因した経時劣化を抑制するための対策も講じる必要がある。 On the other hand, for flexible substrates, it is necessary to take measures to suppress deterioration over time due to wiring steps.
特開２０１５－１９８１０１号公報JP-A-2015-198101 特開２０１５－１９８１０２号公報JP-A-2015-198102 特開２０１７－１１８１０９号公報JP-A-2017-118109 特開２０１７－１１３０８８号公報JP-A-2017-113088
　本実施形態の目的は、配線段差に起因した経時劣化を抑制することが可能なフレキシブル基板を提供することにある。 An object of the present embodiment is to provide a flexible substrate capable of suppressing deterioration over time due to a wiring step.
　一実施形態に係るフレキシブル基板は、可撓性の絶縁基材と、前記絶縁基材の上に設けられる配線とからなる複数の線部と、前記絶縁基材を支持する第１伸縮樹脂層と、前記線部と前記第１伸縮樹脂層とを覆うコーティング層と、前記コーティング層を覆う第２伸縮樹脂層と、を具備し、前記コーティング層は、隣接する２つの前記線部の間の領域において、前記線部の側面と前記第１伸縮樹脂層と前記第２伸縮樹脂層とに接して形成されている。 The flexible substrate according to the embodiment includes a flexible insulating base material, a plurality of wire portions including wiring provided on the insulating base material, and a first elastic resin layer that supports the insulating base material. A coating layer that covers the wire portion and the first elastic resin layer, and a second elastic resin layer that covers the coating layer are provided, and the coating layer is an area between two adjacent wire portions. In the above, the side surface of the wire portion, the first elastic resin layer, and the second elastic resin layer are formed in contact with each other.
　本実施形態によれば、配線段差に起因した経時劣化を抑制することが可能なフレキシブル基板を提供することができる。 According to this embodiment, it is possible to provide a flexible substrate capable of suppressing deterioration over time due to a wiring step.
図１は、本実施形態に係るフレキシブル基板の概略的な平面図である。FIG. 1 is a schematic plan view of a flexible substrate according to the present embodiment. 図２は、図１に示したフレキシブル基板の一部を拡大した平面図である。FIG. 2 is an enlarged plan view of a part of the flexible substrate shown in FIG. 図３は、図２に示したＡ－Ｂ線におけるフレキシブル基板の断面図である。FIG. 3 is a cross-sectional view of the flexible substrate taken along the line AB shown in FIG. 図４は、図２に示したＣ－Ｄ線におけるフレキシブル基板の断面図である。FIG. 4 is a cross-sectional view of the flexible substrate on the CD line shown in FIG. 図５は、比較例に係るフレキシブル基板の断面図である。FIG. 5 is a cross-sectional view of a flexible substrate according to a comparative example. 図６は、比較例に係るフレキシブル基板の別の断面図である。FIG. 6 is another cross-sectional view of the flexible substrate according to the comparative example. 図７は、比較例に係るフレキシブル基板のさらに別の断面図である。FIG. 7 is still another cross-sectional view of the flexible substrate according to the comparative example.
　いくつかの実施形態につき、図面を参照しながら説明する。　
　なお、開示はあくまで一例に過ぎず、当業者において、発明の主旨を保っての適宜変更について容易に想到し得るものについては、当然に本発明の範囲に含有される。また、図面は、説明をより明確にするため、実施の態様に比べて模式的に表される場合があるが、あくまで一例であって、本発明の解釈を限定するものではない。各図において、連続して配置される同一または類似の要素については符号を省略することがある。また、本明細書と各図において、既出の図に関して前述したものと同一または類似した機能を発揮する構成要素には同一の参照符号を付し、重複する詳細な説明を省略することがある。 Some embodiments will be described with reference to the drawings.
It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate changes while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be represented schematically as compared with the embodiments in order to clarify the description, but the drawings are merely examples and do not limit the interpretation of the present invention. In each figure, the reference numerals may be omitted for the same or similar elements arranged consecutively. Further, in the present specification and each figure, components exhibiting the same or similar functions as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and duplicate detailed description may be omitted.
　図１は、本実施形態に係るフレキシブル基板１００の概略的な平面図である。本実施形態においては、図示したように第１方向Ｄ１、第２方向Ｄ２、第３方向Ｄ３を定義する。第１方向Ｄ１および第２方向Ｄ２は、フレキシブル基板１００の主面と平行であり、互いに交わる方向である。第３方向Ｄ３は、第１方向Ｄ１、第２方向Ｄ２に対して垂直な方向であり、フレキシブル基板１００の厚さ方向に相当する。第１方向Ｄ１と第２方向Ｄ２は、本実施形態では垂直に交わるが、垂直以外の角度で交わっても良い。 FIG. 1 is a schematic plan view of the flexible substrate 100 according to the present embodiment. In the present embodiment, the first direction D1, the second direction D2, and the third direction D3 are defined as shown in the figure. The first direction D1 and the second direction D2 are parallel to the main surface of the flexible substrate 100 and intersect with each other. The third direction D3 is a direction perpendicular to the first direction D1 and the second direction D2, and corresponds to the thickness direction of the flexible substrate 100. Although the first direction D1 and the second direction D2 intersect vertically in the present embodiment, they may intersect at an angle other than vertical.
　フレキシブル基板１００は、複数の走査線１と、複数の信号線２と、複数の電気的素子３と、支持体８と、走査線ドライバＤＲ１と、信号線ドライバＤＲ２と、を備えている。なお、走査線ドライバＤＲ１および信号線ドライバＤＲ２は、フレキシブル基板１００の外部に設けられていても良い。走査線１、信号線２、および電気的素子３は、支持体８の上に設けられている。複数の走査線１は、全体的に第１方向Ｄ１に延出し、第２方向Ｄ２に並んでいる。複数の走査線１は、それぞれ走査線ドライバＤＲ１と電気的に接続されている。複数の信号線２は、全体的に第２方向Ｄ２に延出し、第１方向Ｄ１に並んでいる。複数の信号線２は、それぞれ信号線ドライバＤＲ２と電気的に接続されている。電気的素子３の各々は、走査線１と信号線２との交差部に設けられ、走査線１および信号線２と電気的に接続されている。 The flexible substrate 100 includes a plurality of scanning lines 1, a plurality of signal lines 2, a plurality of electrical elements 3, a support 8, a scanning line driver DR1, and a signal line driver DR2. The scanning line driver DR1 and the signal line driver DR2 may be provided outside the flexible substrate 100. The scanning line 1, the signal line 2, and the electrical element 3 are provided on the support 8. The plurality of scanning lines 1 extend in the first direction D1 as a whole and are arranged in the second direction D2. Each of the plurality of scanning lines 1 is electrically connected to the scanning line driver DR1. The plurality of signal lines 2 extend in the second direction D2 as a whole and are lined up in the first direction D1. Each of the plurality of signal lines 2 is electrically connected to the signal line driver DR2. Each of the electrical elements 3 is provided at the intersection of the scanning line 1 and the signal line 2, and is electrically connected to the scanning line 1 and the signal line 2.
　図２は、図１に示したフレキシブル基板１００の一部を拡大した平面図である。フレキシブル基板１００は、上記に加えて、走査線１および信号線２を支持する絶縁基材４を備えている。絶縁基材４は、伸縮性および可撓性を有している。絶縁基材４は、例えばポリイミドで形成することができるが、この例に限られない。 FIG. 2 is an enlarged plan view of a part of the flexible substrate 100 shown in FIG. In addition to the above, the flexible substrate 100 includes an insulating base material 4 that supports the scanning line 1 and the signal line 2. The insulating base material 4 has elasticity and flexibility. The insulating base material 4 can be formed of, for example, polyimide, but is not limited to this example.
　絶縁基材４は、第１方向Ｄ１に延出し第２方向Ｄ２に並んで配置された複数の第１部分ＰＴ１と、第２方向Ｄ２に延出し第１方向Ｄ１に並んで配置された複数の第２部分ＰＴ２と、第１部分ＰＴ１と第２部分ＰＴ２との交差部に位置する複数の島状部ＩＬと、を有している。第１部分ＰＴ１および第２部分ＰＴ２は、それぞれ波状に形成されている（蛇行して形成されている）。島状部ＩＬは、第１部分ＰＴ１と第２部分ＰＴ２とに接続されている。 The insulating base material 4 has a plurality of first partial PT1s extending in the first direction D1 and arranged side by side in the second direction D2, and a plurality of first portions PT1 extending in the second direction D2 and arranged side by side in the first direction D1. It has a second portion PT2 and a plurality of island-shaped portions IL located at the intersection of the first portion PT1 and the second portion PT2. The first portion PT1 and the second portion PT2 are each formed in a wavy shape (formed in a meandering manner). The island-shaped portion IL is connected to the first portion PT1 and the second portion PT2.
　走査線１は、第１部分ＰＴ１上に位置し、波状に配置されている。信号線２は、第２部分ＰＴ２上に位置し、波状に配置されている。走査線１および信号線２は、フレキシブル基板１００が備える配線の一例である。走査線１および信号線２は、例えば金属材料や透明導電材料で形成することができ、単層構造であっても良いし、積層構造であっても良い。フレキシブル基板１００は、走査線１および信号線２の他に、電気的素子３に給電する電源線等の他種の配線を備えても良い。 The scanning line 1 is located on the first portion PT1 and is arranged in a wavy shape. The signal line 2 is located on the second portion PT2 and is arranged in a wavy shape. The scanning line 1 and the signal line 2 are examples of wiring provided in the flexible substrate 100. The scanning line 1 and the signal line 2 can be formed of, for example, a metal material or a transparent conductive material, and may have a single-layer structure or a laminated structure. In addition to the scanning line 1 and the signal line 2, the flexible substrate 100 may include other types of wiring such as a power supply line that supplies power to the electrical element 3.
　走査線１は、実線で示す第１配線１１と、破線で示す第２配線１２と、を有している。第２配線１２は、電気的素子３と重畳している。第１配線１１および第２配線１２は、互いに異なる層に配置されており、コンタクトホールＣＨ１およびＣＨ２を通じて電気的に接続されている。 The scanning line 1 has a first wiring 11 shown by a solid line and a second wiring 12 shown by a broken line. The second wiring 12 overlaps with the electrical element 3. The first wiring 11 and the second wiring 12 are arranged in different layers from each other and are electrically connected through the contact holes CH1 and CH2.
　走査線１は、電気的素子３に走査信号を供給する。例えば電気的素子３がセンサのような信号の出力を伴うものである場合、信号線２には電気的素子３からの出力信号が供給される。また、後述するが電気的素子３が発光素子やアクチュエータのように、入力される信号に応じて作動するものである場合、信号線２には駆動信号が供給される。走査信号の供給源、駆動信号の供給源または出力信号を処理するプロセッサ等を含むコントローラは、フレキシブル基板１００に設けられても良いし、フレキシブル基板１００に接続される機器に設けられても良い。 The scanning line 1 supplies a scanning signal to the electrical element 3. For example, when the electric element 3 is accompanied by the output of a signal such as a sensor, the output signal from the electric element 3 is supplied to the signal line 2. Further, as will be described later, when the electric element 3 operates in response to an input signal, such as a light emitting element or an actuator, a drive signal is supplied to the signal line 2. A controller including a scanning signal supply source, a drive signal supply source, a processor for processing an output signal, and the like may be provided on the flexible board 100, or may be provided on a device connected to the flexible board 100.
　電気的素子３は、島状部ＩＬ上に位置している。電気的素子３は島状部ＩＬよりも小さく、図２においては電気的素子３の縁から島状部ＩＬがはみ出ている。例えば電気的素子３は、センサ、半導体、またはアクチュエータ等である。例えばセンサとしては、可視光や近赤外光を受光する光学センサ、温度センサ、圧力センサ、またはタッチセンサ等を適用できる。例えば半導体素子としては、発光素子、受光素子、ダイオード、またはトランジスタ等を適用できる。電気的素子３が発光素子である場合、可撓性および伸縮性を有するフレキシブルディスプレイを実現できる。発光素子としては、例えばミニＬＥＤやマイクロＬＥＤといった１００μｍ前後の大きさを有する発光ダイオードや有機エレクトロルミネッセンス素子を適用することができる。電気的素子３がアクチュエータである場合、例えばピエゾ素子を適用できる。なお、電気的素子３は、ここで例示したものに限られず、その他にも種々の機能を有する素子を適用し得る。電気的素子３は、コンデンサや抵抗等であっても良い。また、電気的素子３の配置位置や形状は図２に示した例に限らない。 The electrical element 3 is located on the island-shaped portion IL. The electrical element 3 is smaller than the island-shaped portion IL, and in FIG. 2, the island-shaped portion IL protrudes from the edge of the electrical element 3. For example, the electrical element 3 is a sensor, a semiconductor, an actuator, or the like. For example, as the sensor, an optical sensor that receives visible light or near-infrared light, a temperature sensor, a pressure sensor, a touch sensor, or the like can be applied. For example, as a semiconductor element, a light emitting element, a light receiving element, a diode, a transistor, or the like can be applied. When the electrical element 3 is a light emitting element, a flexible display having flexibility and elasticity can be realized. As the light emitting element, for example, a light emitting diode having a size of about 100 μm such as a mini LED or a micro LED or an organic electroluminescence element can be applied. When the electrical element 3 is an actuator, for example, a piezo element can be applied. The electrical element 3 is not limited to the one illustrated here, and other elements having various functions can be applied. The electrical element 3 may be a capacitor, a resistor, or the like. Further, the arrangement position and shape of the electric element 3 are not limited to the example shown in FIG.
　本実施形態においては、絶縁基材４、走査線１、信号線２、後述する第１有機絶縁層５および第２有機絶縁層６を総称して線部ＬＰとする。線部ＬＰは、支持体８上に位置している。線部ＬＰは、第１方向Ｄ１に延出し第２方向Ｄ２に並んで配置された複数の波型（蛇行型）の第１線部ＬＰ１と、第２方向Ｄ２に延出し第１方向Ｄ１に並んで配置された複数の波型（蛇行型）の第２線部ＬＰ２と、を含んでいる。第１線部ＬＰ１は、上記した絶縁基材４の第１部分ＰＴ１と、走査線１と、を含んでいる。第２線部ＬＰ２は、上記した絶縁基材４の第２部分ＰＴ２と、信号線２と、を含んでいる。 In the present embodiment, the insulating base material 4, the scanning line 1, the signal line 2, the first organic insulating layer 5 and the second organic insulating layer 6 described later are collectively referred to as a wire portion LP. The wire LP is located on the support 8. The line portion LP extends in the first direction D1 and extends in the second direction D2 in a plurality of corrugated (meandering type) first line portions LP1 arranged side by side in the second direction D2. It includes a plurality of corrugated (meandering) second line portions LP2 arranged side by side. The first line portion LP1 includes the first portion PT1 of the above-mentioned insulating base material 4 and the scanning line 1. The second wire portion LP2 includes the second portion PT2 of the insulating base material 4 described above and the signal line 2.
　図３は、図２に示したＡ－Ｂ線におけるフレキシブル基板１００の断面図である。フレキシブル基板１００は、上記した要素の他に、第１有機絶縁層５と、第２有機絶縁層６と、コーティング層７と、第２伸縮樹脂層９と、をさらに備えている。なお、以下の説明中では、支持体８を、第１伸縮樹脂層８と称するものとする。 FIG. 3 is a cross-sectional view of the flexible substrate 100 in line AB shown in FIG. In addition to the above-mentioned elements, the flexible substrate 100 further includes a first organic insulating layer 5, a second organic insulating layer 6, a coating layer 7, and a second elastic resin layer 9. In the following description, the support 8 will be referred to as the first stretchable resin layer 8.
　第１伸縮樹脂層８は、第１面ＳＦ１を有している。線部ＬＰは、第１面ＳＦ１に位置している。 The first elastic resin layer 8 has a first surface SF1. The wire portion LP is located on the first surface SF1.
　線部ＬＰは、絶縁基材４、第１有機絶縁層５、第２有機絶縁層６、信号線２、図１に示した走査線１によって構成されている。このうち、第２線部ＬＰ２は、図３に示すように、絶縁基材４、第１有機絶縁層５、第２有機絶縁層６、信号線２によって構成されている。図示しないが、第１線部ＬＰ１は、絶縁基材４、第１有機絶縁層５、第２有機絶縁層６、走査線１によって構成されている。 The wire portion LP is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, a signal line 2, and a scanning line 1 shown in FIG. Of these, as shown in FIG. 3, the second wire portion LP2 is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, and a signal line 2. Although not shown, the first line portion LP1 is composed of an insulating base material 4, a first organic insulating layer 5, a second organic insulating layer 6, and a scanning line 1.
　絶縁基材４は、第１面ＳＦ１に位置している。第１有機絶縁層５は、絶縁基材４を覆っている。第２有機絶縁層６は、第１有機絶縁層５を覆っている。信号線２は、第２有機絶縁層６の上に位置している。 The insulating base material 4 is located on the first surface SF1. The first organic insulating layer 5 covers the insulating base material 4. The second organic insulating layer 6 covers the first organic insulating layer 5. The signal line 2 is located on the second organic insulating layer 6.
　コーティング層７は、第２線部ＬＰ２を覆っている。すなわち、コーティング層７は、信号線２、絶縁基材４、第１有機絶縁層５および第２有機絶縁層６を覆っている。また、コーティング層７は、隣接する２つの第２線部ＬＰ２の間の領域Ｒ１において第１面ＳＦ１の全面と接している。つまり、コーティング層７は、第２線部ＬＰ２および第１伸縮樹脂層８を覆っている。コーティング層７は、ポリ－ｐ－キシリレン（PPX: poly-para-xylylenes）構造体、例えばパリレン（登録商標）によって形成される。詳細については後述するが、コーティング層７は、配線段差のカバレッジ性や、表面の平坦性に優れ、かつ、後述する材料特性を有する材料であれば、上記したポリ－ｐ－キシリレン構造体以外の材料によって形成されても良い。 The coating layer 7 covers the second line portion LP2. That is, the coating layer 7 covers the signal line 2, the insulating base material 4, the first organic insulating layer 5, and the second organic insulating layer 6. Further, the coating layer 7 is in contact with the entire surface of the first surface SF1 in the region R1 between the two adjacent second line portions LP2. That is, the coating layer 7 covers the second wire portion LP2 and the first stretchable resin layer 8. The coating layer 7 is formed of a poly-para-xylylenes (PPX) structure, such as parylene®. Although the details will be described later, if the coating layer 7 is a material having excellent coverage of wiring steps and surface flatness and having material properties described later, other than the poly-p-xylylene structure described above. It may be formed by a material.
　第２伸縮樹脂層９は、コーティング層７を覆っている。つまり、コーティング層７は、隣接する２つの第２線部ＬＰ２の間の領域Ｒ１において、第２線部ＬＰ２の側面と、第１伸縮樹脂層８（第１面ＳＦ１）と、第２伸縮樹脂層９とに接して形成されている。なお、第１伸縮樹脂層８と第２伸縮樹脂層９とは、同一の材料によって形成されても良いし、それぞれ異なる材料によって形成されても良い。 The second elastic resin layer 9 covers the coating layer 7. That is, in the region R1 between the two adjacent second wire portions LP2, the coating layer 7 includes the side surface of the second wire portion LP2, the first elastic resin layer 8 (first surface SF1), and the second elastic resin. It is formed in contact with the layer 9. The first stretchable resin layer 8 and the second stretchable resin layer 9 may be formed of the same material or may be formed of different materials.
　なお、図３では、第２線部ＬＰ２を例にとって線部ＬＰとコーティング層７の関係について説明したが、第１線部ＬＰ１とコーティング層７の関係も同様であることには留意されたい。すなわち、コーティング層７は、第１線部ＬＰ１および第１伸縮樹脂層８を覆い、隣接する２つの第１線部ＬＰ１の間の領域において、第１線部ＬＰ１の側面と、第１伸縮樹脂層８（第１面ＳＦ１）と、第２伸縮樹脂層９とに接して形成されている。 Note that, in FIG. 3, the relationship between the line portion LP and the coating layer 7 has been described by taking the second line portion LP2 as an example, but it should be noted that the relationship between the first line portion LP1 and the coating layer 7 is also the same. That is, the coating layer 7 covers the first line portion LP1 and the first stretchable resin layer 8, and in the region between the two adjacent first line portions LP1, the side surface of the first line portion LP1 and the first stretchable resin It is formed in contact with the layer 8 (first surface SF1) and the second elastic resin layer 9.
　ここで、コーティング層７を形成する材料の特性と、第２伸縮樹脂層９を形成する材料の特性とについて説明する。 Here, the characteristics of the material forming the coating layer 7 and the characteristics of the material forming the second elastic resin layer 9 will be described.
　第２伸縮樹脂層９は、伸縮性および可撓性を有した樹脂、例えば、アクリル、エポキシ、ウレタン、シリコーン等のエラストマー材によって形成される。 The second stretchable resin layer 9 is formed of a stretchable and flexible resin, for example, an elastomer material such as acrylic, epoxy, urethane, or silicone.
　第２伸縮樹脂層９の破断伸長率は、例えば１０００％である。破断伸長率とは、外力が加わっていない状態（通常状態）の物質を引っ張り始めてから破断するまでに、当該物質がどれだけ伸長するかを示す値であり、例えば破断伸長率が上記した１０００％の物質の場合、当該物質は、破断するまでに、通常状態の１０倍だけ伸長可能な性質を有している。 The breaking elongation rate of the second elastic resin layer 9 is, for example, 1000%. The breaking elongation rate is a value indicating how much the substance is stretched from the start of pulling the substance in a state where no external force is applied (normal state) to the breaking, for example, the breaking elongation rate is 1000% described above. In the case of the substance, the substance has a property of being stretchable by 10 times as much as the normal state before breaking.
　第２伸縮樹脂層９のリカバリー率は、例えば９０％である。リカバリー率とは、外力が加えられて引っ張られた状態の物質から、当該外力が除かれた場合に、当該物質がどれだけ通常状態に戻る（元に戻る）のかを示す値である。なお、リカバリー率は、復元力と称されても良い。 The recovery rate of the second elastic resin layer 9 is, for example, 90%. The recovery rate is a value indicating how much the substance returns to the normal state (returns to the original state) when the external force is removed from the substance in the state of being pulled by applying the external force. The recovery rate may be referred to as restoring force.
　第２伸縮樹脂層９の透過率は、例えば９０％である。透過率とは、物質が特定の波長の入射光をどれだけ通過させるのかを示す値である。 The transmittance of the second elastic resin layer 9 is, for example, 90%. The transmittance is a value indicating how much incident light of a specific wavelength is passed through by a substance.
　第２伸縮樹脂層９の水蒸気透過率は、例えば数１０ｇ／ｍ２・２４ｈである。水蒸気透過率とは、規定の温度および湿度の条件下において、単位時間に単位面積の物質を通過する水蒸気の量を示す。すなわち、水蒸気透過率とは、２４時間に透過した面積１ｍ２あたりの水蒸気のグラム数を示している。なお、水蒸気透過率は、透湿度と称されても良い。 Water vapor permeability of the second stretchable resin layer 9 is, for example, several 10g / m 2 · 24h. The water vapor permeability indicates the amount of water vapor that passes through a substance of a unit area in a unit time under the conditions of a specified temperature and humidity. That is, the water vapor permeability indicates the number of grams of water vapor per 1 m 2 of the area permeated in 24 hours. The water vapor transmittance may be referred to as moisture permeability.
　第２伸縮樹脂層９は、上記した各種特性の他に、紫外線が照射されても特性が変化しない耐紫外線といった性質をさらに有している。 In addition to the various properties described above, the second stretchable resin layer 9 further has properties such as ultraviolet resistance whose characteristics do not change even when irradiated with ultraviolet rays.
　一方で、コーティング層７は、伸縮性、可撓性およびバリア性を有する材料によって形成される。コーティング層７は、例えば、室温の蒸着チャンバ内で気体として蒸着される材料によって形成される。このように、コーティング層７が、室温の蒸着チャンバ内で蒸着されて形成されることで、他の要素への熱に起因したダメージを軽減することが可能である。 On the other hand, the coating layer 7 is formed of a material having elasticity, flexibility and barrier properties. The coating layer 7 is formed of, for example, a material that is vapor-deposited as a gas in a room temperature vapor deposition chamber. As described above, the coating layer 7 is formed by being vapor-deposited in a thin-film deposition chamber at room temperature, so that damage caused by heat to other elements can be reduced.
　コーティング層７は、上記したように、例えば気体を蒸着させて形成されるため、割れ目や狭い部分にも均一に層を形成することが可能である。このような材料の一例が上記したパリレンである。 As described above, since the coating layer 7 is formed by, for example, vapor deposition of gas, it is possible to uniformly form the layer even in cracks and narrow portions. An example of such a material is the parylene described above.
　コーティング層７（パリレン）の破断伸長率は、例えば２００％である。コーティング層７（パリレン）の透過率は、例えば９０％である。コーティング層７（パリレン）の水蒸気透過率は、例えば０．１ｇ／ｍ２・２４ｈである。コーティング層７（パリレン）は、第２伸縮樹脂層９とは異なり、上記した耐紫外線といった性質を有していない。 The elongation at break of the coating layer 7 (parylene) is, for example, 200%. The transmittance of the coating layer 7 (parylene) is, for example, 90%. Water vapor permeability of the coating layer 7 (parylene) is, for example 0.1g / m 2 · 24h. Unlike the second elastic resin layer 9, the coating layer 7 (parylene) does not have the above-mentioned ultraviolet resistance property.
　以上説明したように、コーティング層７は、第２伸縮樹脂層９に比べて水蒸気透過率が小さく、かつ、破断伸長率も小さいという特性を有している。また、コーティング層７は、割れ目や狭い部分にも均一に層を形成することが可能という特性も有している。 As described above, the coating layer 7 has the characteristics that the water vapor transmittance is smaller than that of the second stretchable resin layer 9 and the elongation at break is also smaller. Further, the coating layer 7 also has a characteristic that a layer can be uniformly formed even in a crack or a narrow portion.
　図４は、図２に示したＣ－Ｄ線におけるフレキシブル基板１００の断面図である。電気的素子３は、絶縁基材４の島状部ＩＬの上に配置されている。電気的素子３と島状部ＩＬとの間には、無機絶縁層１０（パッシベーション層）が配置されている。無機絶縁層１０は、平面視においては電気的素子３（あるいは島状部ＩＬ）と重畳する島状に形成されている。第１配線部１１ａおよび１１ｂは、第１有機絶縁層５の上に配置され、第２有機絶縁層６によって覆われている。第２配線部１２は、無機絶縁層１０の上に配置され、電気的素子３と電気的に接続されている。図４に示す例においては、第２配線部１２の両端部が第１有機絶縁層５に覆われている。 FIG. 4 is a cross-sectional view of the flexible substrate 100 on the CD line shown in FIG. The electrical element 3 is arranged on the island-shaped portion IL of the insulating base material 4. An inorganic insulating layer 10 (passivation layer) is arranged between the electrical element 3 and the island-shaped portion IL. The inorganic insulating layer 10 is formed in an island shape that overlaps with the electric element 3 (or the island-shaped portion IL) in a plan view. The first wiring portions 11a and 11b are arranged on the first organic insulating layer 5 and covered with the second organic insulating layer 6. The second wiring portion 12 is arranged on the inorganic insulating layer 10 and is electrically connected to the electric element 3. In the example shown in FIG. 4, both ends of the second wiring portion 12 are covered with the first organic insulating layer 5.
　コンタクトホールＣＨ１およびＣＨ２は、第１有機絶縁層５に設けられている。第１配線部１１ａは、コンタクトホールＣＨ１に配置された接続部材ＣＭ１を介して第２配線部１２と電気的に接続されている。同様に、第１配線部１１ｂは、コンタクトホールＣＨ２に配置された接続部材ＣＭ２を介して第２配線部１２と電気的に接続されている。接続部材ＣＭ１は、第１配線部１１ａの一部であっても良いし、第１配線部１１ａとは別に設けられても良い。接続部材ＣＭ２は、第１配線部１１ｂの一部であっても良いし、第１配線部１１ｂとは別に設けられても良い。 The contact holes CH1 and CH2 are provided in the first organic insulating layer 5. The first wiring portion 11a is electrically connected to the second wiring portion 12 via the connecting member CM1 arranged in the contact hole CH1. Similarly, the first wiring portion 11b is electrically connected to the second wiring portion 12 via the connecting member CM2 arranged in the contact hole CH2. The connection member CM1 may be a part of the first wiring portion 11a, or may be provided separately from the first wiring portion 11a. The connection member CM2 may be a part of the first wiring portion 11b, or may be provided separately from the first wiring portion 11b.
　このように、電気的素子３と絶縁基材４との間には島状の無機絶縁層１０が配置されている。この無機絶縁層１０は、電気的素子３や走査線１の第２配線部１２への水分等の侵入を抑制する保護膜として機能する。このため、フレキシブル基板１００の信頼性が向上する。また、一般的に無機膜は有機膜に比べてクラックが生じ易いが、走査線１の第１配線部１１ａおよび１１ｂの下方には無機絶縁層１０が設けられていないため、第１配線部１１ａおよび１１ｂでの断線が抑制される。図示しない信号線についても同様である。さらに、無機絶縁層１０がフレキシブル基板１００の全体に設けられている場合と比較して、フレキシブル基板１００の伸縮性および可撓性が阻害されにくくなる。 In this way, the island-shaped inorganic insulating layer 10 is arranged between the electrical element 3 and the insulating base material 4. The inorganic insulating layer 10 functions as a protective film that suppresses the intrusion of moisture and the like into the second wiring portion 12 of the electrical element 3 and the scanning line 1. Therefore, the reliability of the flexible substrate 100 is improved. Further, in general, the inorganic film is more likely to crack than the organic film, but since the inorganic insulating layer 10 is not provided below the first wiring portions 11a and 11b of the scanning line 1, the first wiring portion 11a And the disconnection at 11b is suppressed. The same applies to signal lines (not shown). Further, as compared with the case where the inorganic insulating layer 10 is provided on the entire flexible substrate 100, the elasticity and flexibility of the flexible substrate 100 are less likely to be impaired.
　また、走査線１において、電気的素子３と重畳する第２配線部１２が第１配線部１１ａおよび１１ｂとは異なる層に配置されているため、電気的素子３の近傍における設計の自由度が向上する。また、コンタクトホールＣＨ１およびＣＨ２は、無機絶縁層１０の上方に設けられているため、第１配線部１１ａと第２配線部１２との接続位置、および、第１配線部１１ｂと第２配線部１２との接続位置での接続不良が抑制される。 Further, in the scanning line 1, since the second wiring portion 12 that overlaps with the electric element 3 is arranged in a layer different from that of the first wiring portions 11a and 11b, the degree of freedom of design in the vicinity of the electric element 3 is increased. improves. Further, since the contact holes CH1 and CH2 are provided above the inorganic insulating layer 10, the connection positions between the first wiring portion 11a and the second wiring portion 12 and the first wiring portion 11b and the second wiring portion 12b are provided. Poor connection at the connection position with 12 is suppressed.
　ここで、比較例を用いて、本実施形態に係るフレキシブル基板１００の効果について説明する。なお、比較例は、本実施形態に係るフレキシブル基板１００が奏し得る効果の一部を説明するためのものであって、比較例と本実施形態とで共通する構成や効果を本願発明の範囲から除外するものではない。 Here, the effect of the flexible substrate 100 according to the present embodiment will be described with reference to a comparative example. It should be noted that the comparative example is for explaining a part of the effects that the flexible substrate 100 according to the present embodiment can exert, and the configurations and effects common to the comparative example and the present embodiment can be described from the scope of the present invention. It is not an exclusion.
　図５は、比較例に係るフレキシブル基板１００Ａの断面を示す図である。比較例に係るフレキシブル基板１００Ａは、コーティング層７が線部ＬＰ全体を覆うのではなく、線部ＬＰを構成する信号線２（および第２有機絶縁層６）を覆うように設けられている点で、本実施形態に係るフレキシブル基板１００と相違している。 FIG. 5 is a diagram showing a cross section of the flexible substrate 100A according to the comparative example. The flexible substrate 100A according to the comparative example is provided so that the coating layer 7 does not cover the entire wire portion LP but covers the signal line 2 (and the second organic insulating layer 6) constituting the wire portion LP. Therefore, it is different from the flexible substrate 100 according to the present embodiment.
　比較例に係るフレキシブル基板１００Ａのように、コーティング層７が線部ＬＰ全体ではなく、線部ＬＰを構成する信号線２を覆うように設けられる場合、隣接する２つの線部ＬＰの間の領域Ｒ１においては、コーティング層７ではなく、第２伸縮樹脂層９が第１面ＳＦ１と接している。 When the coating layer 7 is provided so as to cover the signal line 2 constituting the wire portion LP instead of the entire wire portion LP as in the flexible substrate 100A according to the comparative example, the region between the two adjacent wire portion LPs. In R1, the second elastic resin layer 9 is in contact with the first surface SF1 instead of the coating layer 7.
　上記したように、コーティング層７は、例えばパリレン等、気体として蒸着される材料により形成されるため、割れ目や狭い部分にも均一に層を形成することが可能である一方で、第２伸縮樹脂層９は、材料特性上、割れ目や狭い部分においては均一に層を形成することができない。このため、図５に示すように、隣接する２つの線部ＬＰの間の領域Ｒ１においては、第２伸縮樹脂層９と第１伸縮樹脂層８との間に、線部ＬＰの第３方向Ｄ３の長さ（高さ）に起因した気泡（隙間）が生じてしまう。この気泡によれば、領域Ｒ１において、第２伸縮樹脂層９が第１伸縮樹脂層８の第１面ＳＦ１と接する面積が小さくなるため、フレキシブル基板１００Ａが繰り返し使用され、第１伸縮樹脂層８および第２伸縮樹脂層９が伸縮を繰り返すにつれて、第２伸縮樹脂層９が第１伸縮樹脂層８から剥がれ落ちてしまう可能性がある。 As described above, since the coating layer 7 is formed of a material that is vapor-deposited as a gas, such as parylene, it is possible to uniformly form the layer even in cracks and narrow portions, while the second elastic resin. Due to the material properties of the layer 9, the layer cannot be uniformly formed in a crack or a narrow portion. Therefore, as shown in FIG. 5, in the region R1 between the two adjacent line portions LP, the third direction of the line portion LP is between the second elastic resin layer 9 and the first elastic resin layer 8. Bubbles (gap) due to the length (height) of D3 are generated. According to the bubbles, in the region R1, the area where the second elastic resin layer 9 contacts the first surface SF1 of the first elastic resin layer 8 becomes smaller, so that the flexible substrate 100A is repeatedly used and the first elastic resin layer 8 is used. As the second elastic resin layer 9 repeatedly expands and contracts, the second elastic resin layer 9 may peel off from the first elastic resin layer 8.
　一方で、本実施形態に係るフレキシブル基板１００の場合、コーティング層７は、信号線２だけでなく、線部ＬＰ全体および第１伸縮樹脂層８を覆うように設けられているので、隣接する２つの線部ＬＰの間の領域Ｒ１においては、図３に示したように、コーティング層７が線部ＬＰの側面と第１伸縮樹脂層８の第１面ＳＦ１の全面とに亘って接し、線部ＬＰの高さ（配線段差）に起因した気泡の発生を抑制することができる。これによれば、コーティング層７が第１伸縮樹脂層８の第１面ＳＦ１と接する面積が十分に確保されるため、フレキシブル基板１００Ａが繰り返し使用されたとしても、コーティング層７が第１伸縮樹脂層８から剥がれ落ちてしまう可能性を抑制することが可能であり、ひいては、平坦なコーティング層７の全面に亘って設けられる第２伸縮樹脂層９が剥がれ落ちてしまう可能性も抑制することが可能である。 On the other hand, in the case of the flexible substrate 100 according to the present embodiment, since the coating layer 7 is provided so as to cover not only the signal line 2 but also the entire line portion LP and the first elastic resin layer 8, the adjacent 2 In the region R1 between the two line portions LP, as shown in FIG. 3, the coating layer 7 is in contact with the side surface of the line portion LP and the entire surface of the first surface SF1 of the first elastic resin layer 8 to form a line. It is possible to suppress the generation of air bubbles due to the height of the part LP (wiring step). According to this, since the area where the coating layer 7 is in contact with the first surface SF1 of the first stretchable resin layer 8 is sufficiently secured, even if the flexible substrate 100A is repeatedly used, the coating layer 7 is the first stretchable resin. It is possible to suppress the possibility of peeling off from the layer 8, and it is also possible to suppress the possibility of the second elastic resin layer 9 provided over the entire surface of the flat coating layer 7 peeling off. It is possible.
　以上説明したように、一実施形態によれば、配線段差に起因した経時劣化を抑制することが可能なフレキシブル基板を提供することができる。 As described above, according to one embodiment, it is possible to provide a flexible substrate capable of suppressing deterioration over time due to a wiring step.
　また、比較例に係る構成の場合、線部ＬＰの高さを高くしてしまうと、第２伸縮樹脂層９の材料特性上、図６に示すように、第２伸縮樹脂層９が第１伸縮樹脂層８の第１面ＳＦ１と接する面積が図５に示した場合に比べてさらに小さくなり、第２伸縮樹脂層９が第１伸縮樹脂層８から剥がれ落ちる可能性がさらに高まるという問題があるが、本実施形態に係る構成の場合、割れ目や狭い部分にも均一に層を形成し、配線段差に起因した気泡の発生を抑制することが可能となるので、線部ＬＰの高さをより高くするも可能である。 Further, in the case of the configuration according to the comparative example, if the height of the line portion LP is increased, the second stretchable resin layer 9 becomes the first stretchable resin layer 9 as shown in FIG. 6 due to the material characteristics of the second stretchable resin layer 9. The area of the elastic resin layer 8 in contact with the first surface SF1 is smaller than that shown in FIG. 5, and there is a problem that the possibility that the second elastic resin layer 9 is peeled off from the first elastic resin layer 8 is further increased. However, in the case of the configuration according to the present embodiment, it is possible to uniformly form a layer even in a crack or a narrow portion and suppress the generation of air bubbles due to a wiring step, so that the height of the wire portion LP can be increased. It can be higher.
　さらに、比較例に係る構成の場合、隣接する２つの線部ＬＰの間の領域を狭くしてしまうと（狭ピッチ化を試みると）、第２伸縮樹脂層９の材料特性上、図７に示すように、第２伸縮樹脂層９が第１伸縮樹脂層８の第１面ＳＦ１と接する面積が図５に示した場合に比べてさらに小さくなり、第２伸縮樹脂層９が第１伸縮樹脂層８から剥がれ落ちる可能性がさらに高まるという問題があるが、本実施形態に係る構成の場合、割れ目や狭い部分にも均一に層を形成し、配線段差に起因した気泡の発生を抑制することが可能となるので、線部ＬＰの狭ピッチ化を実現することも可能である。 Further, in the case of the configuration according to the comparative example, if the area between the two adjacent line portions LP is narrowed (when an attempt is made to narrow the pitch), the material characteristics of the second elastic resin layer 9 show that FIG. As shown, the area where the second elastic resin layer 9 is in contact with the first surface SF1 of the first elastic resin layer 8 is smaller than that in the case shown in FIG. 5, and the second elastic resin layer 9 is the first elastic resin. There is a problem that the possibility of peeling off from the layer 8 is further increased, but in the case of the configuration according to the present embodiment, the layer is uniformly formed even in the cracks and narrow portions, and the generation of air bubbles due to the wiring step is suppressed. Therefore, it is also possible to realize a narrow pitch of the line portion LP.
　以上のように、本実施形態に係る構成の場合、フレキシブル基板１００の設計の自由度を向上させることも可能となる。 As described above, in the case of the configuration according to the present embodiment, it is possible to improve the degree of freedom in designing the flexible substrate 100.
　なお、本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これらの新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これらの実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.
　２…信号線、４…絶縁基材、５…第１有機絶縁層、６…第２有機絶縁層、７…コーティング層、８…第１伸縮樹脂層、９…第２伸縮樹脂層、１００…フレキシブル基板、ＬＰ…線部、ＳＦ１…第１面、Ｒ１…領域。 2 ... signal line, 4 ... insulating base material, 5 ... first organic insulating layer, 6 ... second organic insulating layer, 7 ... coating layer, 8 ... first elastic resin layer, 9 ... second elastic resin layer, 100 ... Flexible substrate, LP ... wire part, SF1 ... first surface, R1 ... region.

Claims (6)

  1. 　可撓性の絶縁基材と、前記絶縁基材の上に設けられる配線とからなる複数の線部と、
    　前記絶縁基材を支持する第１伸縮樹脂層と、
    　前記線部と前記第１伸縮樹脂層とを覆うコーティング層と、
    　前記コーティング層を覆う第２伸縮樹脂層と、
    　を具備し、
    　前記コーティング層は、隣接する２つの前記線部の間の領域において、前記線部の側面と前記第１伸縮樹脂層と前記第２伸縮樹脂層とに接して形成されている、
    　フレキシブル基板。     A plurality of wire portions composed of a flexible insulating base material and wiring provided on the insulating base material,
    The first elastic resin layer that supports the insulating base material and
    A coating layer that covers the wire portion and the first elastic resin layer,
    A second elastic resin layer covering the coating layer and
    Equipped with
    The coating layer is formed in a region between two adjacent wire portions in contact with the side surface of the wire portion, the first stretchable resin layer, and the second stretchable resin layer.
    Flexible board.
  2. 　前記コーティング層は、蒸着プロセスによって形成される、請求項１に記載のフレキシブル基板。 The flexible substrate according to claim 1, wherein the coating layer is formed by a thin-film deposition process.
  3. 　前記コーティング層は、
    　前記第２伸縮樹脂層に比べて水蒸気透過率が小さく、かつ、破断伸長率が小さい材料によって形成される、
    　請求項１に記載のフレキシブル基板。     The coating layer is
    It is formed of a material having a small water vapor transmittance and a low elongation at break as compared with the second stretchable resin layer.
    The flexible substrate according to claim 1.
  4. 　前記コーティング層は、
    　ポリ－ｐ－キシリレン構造体によって形成される、
    　請求項１に記載のフレキシブル基板。     The coating layer is
    Formed by a poly-p-xylylene structure,
    The flexible substrate according to claim 1.
  5. 　前記線部は、
    　第１方向に延出し前記第１方向と交差する第２方向に並んで配置される複数の走査線を含む第１線部と、前記第２方向に延出し前記第１方向に並んで配置される複数の信号線を含む第２線部と、を含み、
    　前記コーティング層は、
    　隣接する２つの前記第１線部の間の領域、ならびに、隣接する２つの前記第２線部の間の領域において、前記第１及び第２線部の側面と前記第１伸縮樹脂層と前記第２伸縮樹脂層とに接して形成されている、
    　請求項１に記載のフレキシブル基板。     The line part is
    A first line portion including a plurality of scanning lines extending in the first direction and arranged side by side in the second direction intersecting the first direction, and extending in the second direction and arranged side by side in the first direction. Includes a second line section containing a plurality of signal lines,
    The coating layer is
    In the region between the two adjacent first line portions and the region between the two adjacent second line portions, the side surfaces of the first and second wire portions, the first elastic resin layer, and the said. Formed in contact with the second elastic resin layer,
    The flexible substrate according to claim 1.
  6. 　前記第１線部及び前記第２線部は、前記第１伸縮樹脂層上で蛇行して形成されている、請求項５に記載のフレキシブル基板。 The flexible substrate according to claim 5, wherein the first wire portion and the second wire portion meander on the first elastic resin layer.
PCT/JP2020/016342 2019-06-06 2020-04-13 Flexible substrate WO2020246142A1 (en)

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JP2019106151A JP2020202209A (en) 2019-06-06 2019-06-06 Flexible substrate
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231018A (en) * 2011-04-26 2012-11-22 Nippon Mektron Ltd Flexible circuit body and method for manufacturing the same
US20150351221A1 (en) * 2014-05-27 2015-12-03 Gwangju Institute Of Science And Technology Electrode arrangement with 3d structure and fabrication method thereof
WO2017003531A1 (en) * 2015-06-30 2017-01-05 Apple Inc. Electronic devices with soft input-output components
JP2017113088A (en) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 Biological sensor device
JP2018066933A (en) * 2016-10-21 2018-04-26 株式会社ジャパンディスプレイ Display

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231018A (en) * 2011-04-26 2012-11-22 Nippon Mektron Ltd Flexible circuit body and method for manufacturing the same
US20150351221A1 (en) * 2014-05-27 2015-12-03 Gwangju Institute Of Science And Technology Electrode arrangement with 3d structure and fabrication method thereof
WO2017003531A1 (en) * 2015-06-30 2017-01-05 Apple Inc. Electronic devices with soft input-output components
JP2017113088A (en) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 Biological sensor device
JP2018066933A (en) * 2016-10-21 2018-04-26 株式会社ジャパンディスプレイ Display

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