WO2020241184A1 - Ｉｉｉ族化合物基板の製造方法及びｉｉｉ族化合物基板 - Google Patents

Ｉｉｉ族化合物基板の製造方法及びｉｉｉ族化合物基板 Download PDF

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WO2020241184A1
WO2020241184A1 PCT/JP2020/018471 JP2020018471W WO2020241184A1 WO 2020241184 A1 WO2020241184 A1 WO 2020241184A1 JP 2020018471 W JP2020018471 W JP 2020018471W WO 2020241184 A1 WO2020241184 A1 WO 2020241184A1
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crystal
group iii
iii compound
gan
substrate
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PCT/JP2020/018471
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French (fr)
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芳宏 久保田
永田　和寿
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信越化学工業株式会社
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Priority to EP20814676.1A priority Critical patent/EP3978659A4/en
Priority to KR1020217034388A priority patent/KR20220012226A/ko
Priority to US17/613,653 priority patent/US20220235489A1/en
Priority to CN202080039330.5A priority patent/CN113840949A/zh
Publication of WO2020241184A1 publication Critical patent/WO2020241184A1/ja

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    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
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    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
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Definitions

  • the present invention relates to a method for producing a high-quality group III compound substrate such as AlN, Ga2O3, and GaN and the substrate thereof, and particularly to a GaN crystal substrate.
  • Substrates of group III compounds such as crystalline AlN, Ga 2 O 3 , and GaN have a wide bandgap, and have excellent high-frequency characteristics such as ultra-short wavelength luminescence and high withstand voltage. For this reason, group III compound substrates are expected to be applied to devices such as lasers, Schottky diodes, power devices, and high-frequency devices.
  • group III compound substrates are expected to be applied to devices such as lasers, Schottky diodes, power devices, and high-frequency devices.
  • a bulk GaN substrate in which GaN crystals are grown in a liquid such as liquid ammonia or Na flux is generally of relatively high quality, but it is difficult to increase the diameter.
  • GaN is placed on a substrate such as a sapphire substrate, a GaAs substrate, or an AlN substrate.
  • a substrate such as a sapphire substrate, a GaAs substrate, or an AlN substrate.
  • a large-diameter GaN thin film can be obtained by heteroepitaxially growing the mixture.
  • the heteroepitaxial growth method when the film thickness is increased in order to obtain a high-quality substrate, lattice defects, warpage, and cracks are likely to occur.
  • Non-Patent Document 1 a plurality of small-diameter GaN substrates produced by the Na flux method are bonded in a honeycomb shape on a susceptor made of thermally decomposed graphite (PG), which is used as a seed substrate, and the HVPE method is used on the plurality of small-diameter GaN substrates. It is described that a large-diameter GaN substrate was obtained by growing GaN in.
  • PG thermally decomposed graphite
  • Non-Patent Document 2 describes a production method in which a SCAM (ScAlMgO 4 ) (0001) substrate is used as a seed crystal and GaN is epitaxially grown on it by the MOVPE method (organic metal vapor phase epitaxy method).
  • Patent Document 1 a GaN crystal is epitaxially grown on a sapphire substrate, a plurality of the crystals are cut into a honeycomb shape, and the seed is attached to a susceptor such as PG with an adhesive containing heat-resistant ceramics and an inorganic polymer as main components.
  • a susceptor such as PG with an adhesive containing heat-resistant ceramics and an inorganic polymer as main components.
  • the above-mentioned prior art had two more common problems. That is, even if the GaN crystal is grown and then cooled to peel off and recover the GaN crystal generated from the seed crystal, the two are strongly bonded to each other, so that the desired GaN crystal can be obtained in good yield and is expensive. It was difficult to recover the seed crystals.
  • a GaN crystal grown from a seed crystal such as sapphire or GaN is forcibly peeled off and recovered, the GaN crystal itself generated at that time is damaged, or the GaN crystal generated in the subsequent process or handling during processing becomes , It was easy for damage to occur.
  • the seed crystal is strongly attached not only to the generated GaN but also to the susceptor, and a strong thermal stress is applied to the generated GaN crystal, and the thermal stress causes the generated GaN crystal to warp or crack. It was.
  • the present invention has been made in view of the above circumstances, and a manufacturing method for growing a high-quality group III compound substrate such as AlN or GaN crystal with a large diameter and a thick thickness, and a group III compound substrate obtained by the method, particularly a GaN substrate, are used.
  • the purpose is to provide.
  • the present invention provides the following method for producing a group III compound substrate and the substrate thereof.
  • a method for producing a Group III compound substrate which comprises using a substance having a cleaving property that can be peeled off from the member of the above.
  • the susceptor at least the surface on which the seed crystal is placed is composed of the substance having the peelable cleavage property, and the substance having the peelable cleavage property is thermally decomposed boron nitride (PBN).
  • the method for producing a group III compound substrate according to (1) above which is characterized by the above.
  • the crystal growth rate is higher than that of the first crystal growth step.
  • III according to any one of (1) to (4) above, which comprises a second crystal growth step of growing a crystal of a group III compound in the seed crystal at a low second crystal rate. A method for producing a group compound substrate.
  • a third crystal step of growing a crystal of a Group III compound in the seed crystal at a third crystal rate is included, and the third crystal step is included.
  • a higher quality large group III compound substrate can be obtained at low cost while taking advantage of the high film formation rate, which is a feature of the vapor phase growth method. That is, since an extremely thick group III compound substrate having a large diameter and no variation can be produced, a large-diameter group III compound substrate having excellent crystal characteristics and low cost can be easily obtained.
  • FIG. 1 is a schematic diagram for explaining a method for producing a group III compound substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram for explaining an example of a method for producing a group III compound substrate according to an embodiment of the present invention.
  • the method for producing a Group III compound substrate of the present invention is a method for producing a Group III compound substrate in which crystals of a Group III compound are grown on a seed crystal placed and fixed on a susceptor by a vapor phase growth method. And at least one member of the seed crystal is characterized by using a substance having a releasable cleavage property.
  • part or all of the susceptor may be composed of a cleaving substance that can be peeled off.
  • a part or all of the seed crystal may be made of a substance having a cleaving property that can be peeled off.
  • the production method of the present invention is effective for group III compounds such as AlN, Ga 2 O 3 , and GaN, but is particularly suitable for GaN crystal growth.
  • the group III compound has a fast crystal growth rate, a large diameter, and a thick material. It relates to a gas phase growth method suitable for production, particularly a hydride gas phase growth method (HVPE method, THVPE method, etc.).
  • the GaN crystal is grown and then cooled, and the generated GaN crystal is peeled off and recovered from the seed crystal such as sapphire or GaN.
  • the two are strongly bonded, it was extremely difficult to obtain a good yield without damaging the target GaN crystal and to recover an expensive seed crystal.
  • the generated GaN crystal was forcibly peeled from the seed crystal such as sapphire or GaN and attempted to be recovered, an unreasonable force was applied, and the precious GaN crystal was often cracked or damaged.
  • the seed crystal strongly adheres not only to the generated GaN crystal but also to the susceptor structure, and strong thermal stress is applied to the GaN crystal after the reaction and cooling, which is a major cause of various property deterioration, warpage, and cracking.
  • these phenomena become more prominent, which has become a major bottleneck in improving the characteristics and reducing the cost of the GaN substrate.
  • the present inventor has solved the above problem by using a substance having a cleaving property that can be peeled off from one or both of the seed crystal and the susceptor on which the seed crystal is placed. That is, if a material having a cleavage property that can be peeled off is used for the seed crystal, the seed crystal can be easily peeled off from the cleavage plane of the seed crystal when the generated GaN crystal is peeled off, and the generated GaN crystal and the seed crystal can be easily recovered. can do.
  • the susceptor can be easily peeled off from the cleavage surface of the susceptor when the generated GaN crystal is peeled off, and the generated GaN crystal and the seed crystal can be easily recovered. Can be done.
  • a large-scale GaN crystal substrate of higher quality can be obtained at low cost while taking advantage of the high film formation rate, which is a feature of the vapor phase growth method. That is, since an extremely thick GaN crystal substrate having a large diameter and no variation can be produced, a large diameter GaN substrate having excellent crystal characteristics and low cost can be easily obtained.
  • At least the surface on which the seed crystal is placed may be composed of the above-mentioned substance having a peelable cleavage property. Therefore, the entire susceptor does not need to be composed of the above-mentioned material having a peelable cleavage property.
  • the cleaving substance used for the susceptor is preferably a layered substance.
  • the layered material as the susceptor, when the generated GaN crystal is peeled off, the susceptor can be easily peeled off between the network planes of the layered structure of the layered material, and the generated GaN crystal and the seed crystal can be recovered more easily. .. Further, by using a substance having a layered substance for the susceptor, the thermal stress generated by the adhesion between the generated GaN crystal and the susceptor can be appropriately absorbed between the layers or alleviated by delamination.
  • the "substance having cleaving property” is a substance that cleaves the group III compound substrate and the seed crystal with a mechanical impact that does not crack or damage the seed crystal, or between the group III compound substrate and the seed crystal. It is a substance that is cleaved by the thermal stress generated by the difference in the coefficient of thermal expansion.
  • the GaN base (handle) substrate portion 11 is formed at a relatively high crystal growth rate at first, and then the GaN crystal body portion 12 is thickened at a low speed (see FIG. 1). .. According to this, the GaN base (handle) substrate portion 11 serves as a barrier layer for diffusion of impurities from the seed crystal 3 and the susceptor 2, and (ii) the thicker the crystal growth, the more crystal defects in the upper layer. Due to the crystal growth property of decreasing crystal growth, it can be used as a "sacrificial layer" to reduce crystal defects in the target GaN crystal body portion 12, and (iii) mechanically during peeling after crystal growth and subsequent processing steps.
  • the target GaN crystal main body portion can grow at a lower speed, thereby suppressing deterioration of characteristics such as lattice defects and variation in other characteristics, which is preferable.
  • the peelable cleavage substance used for the susceptor is a layered compound with high purity and not affected by the reaction gas.
  • Pyrolysis boron nitride (PBN) is preferable, and PBN or a composite composition of carbon and PBN produced by intentionally weakening the interlayer bonding force of PBN or a composite of it and carbon is cost effective (large size, high strength). More preferred.
  • hexagonal boron nitride is a layered compound.
  • a PBN film on the surface of a carbon substrate to prepare a PBN / carbon composite for example, the method described in JP-A-4-79992 can be used.
  • the pressure inside the furnace is increased or decreased in a pulsed manner to weaken the bonding force between the surfaces in the layered structure in which atoms are bonded in a planar manner.
  • a layer can be formed.
  • the GaN crystal It is close to the lattice constant and thermal expansion rate of the GaN crystal, has resistance to the raw material gas, is relatively inexpensive, and has the releasable cleavage property used for the seed crystal from the viewpoint of ease of peeling and recovery from the produced GaN crystal.
  • SCAM SCAM
  • the substrate surface may be coated with SiO 2 , AlN, or the like.
  • the susceptor on which the seed crystal is placed is a substance having a releasable cleavage property
  • a GaN substrate having a manufacturing method selected from the MOCVD method, the Na flux method, and the liquid Anne method can also be used as the seed substrate.
  • the seed crystal when the seed crystal is a substance having a peelable cleavage property, it is not necessary to use a substance having a peelable cleavage property as the susceptor.
  • the GaN substrate itself, pyrolytic graphite (PG), ceramics such as corundum, and the like can also be used as the susceptor.
  • PG is a layered substance and has cleavability, it does not easily peel off because the network planes of the layered structure are strongly bonded to each other.
  • the crystal growth rate is such that the GaN base (handle) substrate portion 11 is first produced at a relatively high speed, and then the GaN crystal body portion 12 is thickened at a low speed. Is this good. Furthermore, in order to change from high speed to low speed, it is possible to reduce the speed in multiple steps and / or continuously because it is economical and efficient, stress generation in the produced GaN crystal can be suppressed, and characteristics can be improved. Particularly preferable (see the crystal growth rate transition portion 13 in FIG. 1).
  • Example 1 An alumina mat-like heat insulating material is placed in a stainless steel reactor (inner surface is coated with zirconia sprayed very thinly in advance) with an inner diameter of 1500 mm and a height of 1800 mm, which has a water-cooled jacket and an exhaust port, and a cylindrical rod inside.
  • a heating device inner diameter 1000 mm x height 1300 mm
  • a gas supply pipe having a shape-like SiC heater (center tube 61 made of the same material as the above reaction device; inner diameter ⁇ 30 mm, second tube 62; An inner diameter of ⁇ 40 mm, an outermost tube 63; an inner diameter of ⁇ 50 mm) was provided.
  • ⁇ 520 mm in which three susceptors (see reference numeral 2 in FIG. 2) made of PBN (manufactured by pulsatile fluctuation of the furnace pressure during PBN production), which are easily delaminated with a diameter of 170 mm, are arranged and stored at intervals of 120 °.
  • PBN-coated graphite susceptor revolution jig (see reference numeral 5 in FIG. 2) was prepared.
  • the susceptor surface is processed into a tile shape from a 2-inch SCAM crystal as a seed substrate (see reference numeral 3 in FIG. 2), and an alumina-based adhesive (see reference numeral 4 in FIG. 1) is attached to the back surface to bond it in a 6-inch disk shape.
  • the susceptor revolution jig 5 rotates at 10 rpm to revolve the susceptor 2, and the force of the revolution gear is used to rotate each of the three susceptors 2 at 30 rpm to reach the temperature.
  • the reaction was carried out at a rate of about 300 ⁇ m / h for 1 hour (see reference numeral 11 in FIG. 1), and then the raw material gas was sequentially squeezed for 2 hours so that the growth rate was finally reached about 100 ⁇ m / h. After adjustment (see reference numeral 13 in FIG. 1), a slow reaction was carried out for 45 hours (see reference numeral 12 in FIG. 1).
  • the obtained GaN crystal was easily peeled from the SCAM crystal due to the cleavage property of the seed crystal SCAM, and the seed crystal SCAM was recovered and used for reuse. Since the delaminated GaN crystal absorbed thermal stress by delamination of the layered PBN susceptor, almost no warpage occurred, so it can be easily processed by cylindrical grinding, high-speed reaction part, speed transition part, low speed. A base material substrate having a diameter of 6 inches and a thickness of 5 mm composed of a reaction part was produced.
  • a smooth GaN substrate having a thickness of 625 ⁇ m was obtained by appropriately slicing and polishing from the surface side of the low-speed reaction portion of this base material substrate.
  • the following analysis was performed on the GaN substrate containing the high-speed portion (see reference numeral 11 in FIG. 1) together with the commercialized low-speed reaction portion GaN substrate.
  • the high-speed reaction part is a handle substrate during processing, as a "protective layer” to reduce mechanical damage, as a “barrier layer” to prevent contamination of impurities from adhesives, etc., and as a “sacrificial layer” to reduce crystal defects. It plays the role of.
  • the FWHM (Full Width at Half Maximum) of the X-ray locking curve of the (100) plane of the GaN substrate processed from the above-mentioned low-speed reaction section has an average of 31 arcsec and variation at any three points in the plane. However, the crystallinity was good at 3 arcsec.
  • the GaN substrate including the high-speed portion had a 448 arcsec and a variation of 84 arcsec.
  • the metal contamination of the GaN substrate of the low-speed reaction section 12 was below the detection limit, but the lower side (seed crystal, seed crystal,) of the GaN substrate including the high-speed reaction section 11 was found.
  • the susceptor side On the susceptor side), a very small amount of metals such as Mg, Al, Si, and Fe, which are thought to be from the seed crystal and the alumina-based adhesive used, were observed.
  • the commercialized GaN substrate crystal is a uniform and good GaN crystal substrate with almost no warpage and almost no variation.
  • the effects of this example are (1) the use of a cleavable and / or layered substance in which one or both of the seed crystal and the susceptor structure on which it is placed can be peeled off, and (2) crystal growth.
  • the synergistic effect of the two is large due to the fact that the GaN base (handle) substrate portion 11 is created at a relatively high speed at first and then the GaN crystal body portion 12 is thickened at a low speed. Is shown.
  • Example 1 the seed crystal was changed from the SCAM crystal to a 2-inch GaN substrate manufactured with Na flux having no cleaving property, and the susceptor was changed to corundum ceramics having no cleaving property. Crystal growth was carried out under exactly the same conditions except for the above. As a result, after the THVPE reaction, an attempt was made to cool and take out the internal product, but the GaN and the susceptor were fused, and the produced GaN and the precious seed substrate were broken into pieces and none of them could be recovered.
  • Example 2 Except that the seed substrate of SCAM of Example 1 was changed to a 2-inch GaN substrate manufactured with Na flux having no cleavability that can be peeled off, and the reaction gas was changed from GaCl 3 gas to GaCl to change from THVPE to HVPE method. The crystal growth reaction was carried out under the same conditions. The reaction was set to have the same linear velocity as in Example 1 in terms of Ga minutes. After cooling, the obtained GaN crystal was integrated with the seed crystal, and the GaN crystal could be easily peeled off from the layered PBN susceptor. The concerned thermal stress during cooling was absorbed by delamination, no cracks were generated, and almost no warpage occurred.
  • the FWHM (Full Width at Half Maximum) of the X-ray locking curve of the (100) plane of the GaN substrate commercialized in the same manner as in Example 1 had an average of 25 arcsec and a variation of 3 arcsec at any three points in the plane.
  • the analytical value of metal impurities was below the measurement limit.
  • Example 3 Except for the fact that the crystal growth was carried out for 50 hours at a low rate of about 100 ⁇ m / h from the beginning in Example 1 and that the susceptor was made of pyrolytic graphite (PG) which had cleavability but was difficult to peel off. Crystal growth was carried out under exactly the same conditions. The obtained GaN crystal could be easily peeled off from the seed crystal SCAM and the PG susceptor, and the SCAM could be recovered and reused. Since the delaminated GaN crystal had a weak delamination property of the layered PG susceptor, the thermal stress of the GaN crystal could not be sufficiently absorbed and a warp of several millimeters occurred. However, no cracking occurred. It was processed to ⁇ 6 inch by cylindrical grinding while correcting it to some extent.
  • PG pyrolytic graphite

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Abstract

本発明のＩＩＩ族化合物基板の製造方法は、サセプター（２）に載置され、固定された種結晶（３）に、気相成長法により、ＩＩＩ族化合物の結晶（１）を成長させるＩＩＩ族化合物基板の製造方法であり、サセプター（２）及び種結晶（３）の少なくとも一方の部材に剥離可能な劈開性を有する物質を用いることを特徴とする。ＩＩＩ族化合物基板は、本発明のＩＩＩ族化合物基板の製造方法により製造されることを特徴とする。本発明により、気相成長法の特長である、高成膜速度の特長を生かしつつ、より高品質な大型ＧａＮ結晶基板が低コストで得られるＩＩＩ族化合物基板の製造方法及びその製造方法で製造された基板を提供できる。

Description

ＩＩＩ族化合物基板の製造方法及びＩＩＩ族化合物基板
　本発明は高品質のＡｌＮ、Ｇａ２Ｏ３、ＧａＮ等のＩＩＩ族化合物基板の製法及びその基板に関するものであり、特にはＧａＮ結晶基板に関わるものである。
　結晶性ＡｌＮ、Ｇａ２Ｏ３、ＧａＮ等のＩＩＩ族化合物の基板は広いバンドギャップを有し、極短波長の発光性や高耐圧で優れた高周波特性を持つ。このため、ＩＩＩ族化合物の基板は、レーザー、ショットキーダイオード、パワーデバイス、高周波デバイス等のデバイスへの応用に期待されている。しかしながら、現状はこれ等のＩＩＩ族化合物の高品質で大口径の結晶成長は難しく、ＩＩＩ族化合物基板の用途が限定的である。
　例えばＧａＮ基板について見ると、一般的に液体アンモニア若しくはＮａフラックス等の液中でＧａＮ結晶を成長させたバルクＧａＮ基板は比較的高品質だが、大口径化が難しい。これに対し、気相で結晶成長する有機金属気相成長法（ＭＯＣＶＤ法）やハイドライド気相成長法（ＨＶＰＥ法、ＴＨＶＰＥ法等）では、サファイア基板、ＧａＡｓ基板、ＡｌＮ基板等の基板上にＧａＮをヘテロエピタキシャル成長させる事に依り、大口径のＧａＮ薄膜が得られる。しかし、ヘテロエピタキシャル成長法では、高品質な基板を得ようと膜厚を厚くすると、格子欠陥、反り、割れが生じやすい。
　例えば、非特許文献１には、Ｎａフラックス法で作製した小口径ＧａＮ基板の複数枚を熱分解グラファイト（ＰＧ）製サセプター上にハニカム形状に貼り合せ、それを種基板とし、その上にＨＶＰＥ法でＧａＮを成長させることによって大口径のＧａＮ基板を得た事が記載されている。
　非特許文献２には、ＳＣＡＭ（ＳｃＡｌＭｇＯ４）（０００１）基板を種結晶として、その上にＭＯＶＰＥ法（有機金属気相エピタキシ法）でＧａＮのエピタキシャル成長を行う製法が記載されている。
　特許文献１では、サファイア基板上にＧａＮ結晶をエピタキシャル成長させ、その結晶を複数枚、ハニカム形状に切り出してＰＧ等のサセプター上に耐熱性セラミックスと無機ポリマーを主成分とする接着剤で貼り付けて種結晶とし、ＨＶＰＥ法でＧａＮの大型化と厚膜化を行う方法が記載されている。
特許第６２０３４６０号公報
Phys.　Status　Solidi　B　254,　No.8,1600671　(2017) Phys.　Status　Solidi　A　214,　No.9,1600754　(2017)
　上述の先行技術には、更に共通した２つの問題が有った。即ち、ＧａＮ結晶を成長後、冷却し、種結晶から生成したＧａＮ結晶を剥離・回収しようと思っても、両者が強く結合しているため、目的のＧａＮ結晶を収率良く得る事及び高価な種結晶の回収をする事が困難であった。サファイヤ、ＧａＮ等の種結晶から成長したＧａＮ結晶を無理矢理に剥離し、回収すると、その際に生成したＧａＮ結晶その物を棄損したり、その後の工程や加工時の取扱でも生成したＧａＮ結晶には、損傷が発生し易かった。加えて種結晶は生成ＧａＮのみならずサセプターにも強く付着しており、生成したＧａＮ結晶に強い熱応力が掛り、その熱応力が、生成したＧａＮ結晶が反ったり、割れたりする要因となっていた。
　本発明は上記事情に鑑みなされたもので、高品質のＡｌＮやＧａＮ結晶等のＩＩＩ族化合物基板を大口径かつ厚く成長させる製法と、其れにより得られるＩＩＩ族化合物基板、特にはＧａＮ基板を提供する事を目的とする。
　本発明は上記目的を達成する為、下記のＩＩＩ族化合物基板の製造方法及びその基板を提供する。
（１）サセプターに載置され、固定された種結晶に、気相成長法により、ＩＩＩ族化合物の結晶を成長させるＩＩＩ族化合物基板の製造方法であって、前記サセプター及び前記種結晶の少なくとも一方の部材に剥離可能な劈開性を有する物質を用いることを特徴とするＩＩＩ族化合物基板の製造方法。
（２）前記サセプターは、少なくとも前記種結晶を載置している面が前記剥離可能な劈開性を有する物質で構成され、前記剥離可能な劈開性を有する物質が熱分解窒化ホウ素（ＰＢＮ）であることを特徴とする上記（１）に記載のＩＩＩ族化合物基板の製造方法。
（３）前記剥離可能な劈開性を有する物質が熱分解窒化ホウ素（ＰＢＮ）及び炭素の複合体であることを特徴とする上記（１）または（２）に記載のＩＩＩ族化合物基板の製造方法。
（４）前記種結晶が前記剥離可能な劈開性を有する物質で構成され、
　前記剥離可能な劈開性を有する物質がＳＣＡＭ（ＳｃＡｌＭｇＯ４）結晶であることを特徴とする上記（１）～（３）のいずれか１つに記載のＩＩＩ族化合物基板の製造方法。
（５）第１の結晶速度で前記種結晶にＩＩＩ族化合物の結晶を成長させる第１の結晶成長工程、及び前記第１の結晶成長工程の後に、前記第１の結晶速度よりも結晶速度が低い第２の結晶速度で、前記種結晶にＩＩＩ族化合物の結晶を成長させる第２の結晶成長工程を含むことを特徴とする上記（１）～（４）のいずれか１つに記載のＩＩＩ族化合物基板の製造方法。
（６）前記第１の結晶成長工程及び前記第２の結晶工程の間に、第３の結晶速度で前記種結晶にＩＩＩ族化合物の結晶を成長させる第３の結晶工程を含み、前記第３の結晶工程では、前記第３の結晶速度は、前記第１の結晶速度から前記第２の結晶速度へ、段階的に及び／又は連続的に変わることを特徴とする上記（５）に記載のＩＩＩ族化合物基板の製造方法。
（７）前記ＩＩＩ族化合物が窒化ガリウム（ＧａＮ）であることを特徴とする上記（１）～（６）のいずれか１つに記載のＩＩＩ族化合物基板の製造方法。
（８）上記（１）～（７）のいずれか１つに記載のＩＩＩ族化合物基板の製造方法により製造されることを特徴とするＩＩＩ族化合物基板。
　本発明によれば気相成長法の特長である、高成膜速度の特長を生かしつつ、より高品質な大型ＩＩＩ族化合物基板が低コストで得られる。即ち、大口径でバラツキの無い、極めて厚物のＩＩＩ族化合物基板が作製出来る為、基板の結晶特性にも優れ且つ、低コストの大口径ＩＩＩ族化合物基板が容易に得られる。
図１は、本発明の一実施形態に係るＩＩＩ族化合物基板の製造方法を説明するための模式図である。 図２は、本発明の一実施形態に係るＩＩＩ族化合物基板の製造方法の実施例を説明するための模式図である。
　本発明のＩＩＩ族化合物基板の製造方法は、サセプターに載置され、固定された種結晶に、気相成長法により、ＩＩＩ族化合物の結晶を成長させるＩＩＩ族化合物基板の製造方法であり、サセプター及び種結晶の少なくとも一方の部材に剥離可能な劈開性を有する物質を用いることを特徴とする。例えば、サセプターの一部又は全部を剥離可能な劈開性を有する物質で構成されるようにしてもよい。また、種結晶の一部又は全部を剥離可能な劈開性を有する物質で構成されるようにしてもよい。以下に本発明に係るＩＩＩ族化合物基板、特にはＧａＮ基板の製造方法及びその基板の実施する為の形態について説明する。
　本発明の製造方法はＡｌＮ、Ｇａ２Ｏ３、ＧａＮ等のＩＩＩ族化合物に有効であるが、取り分けＧａＮ結晶成長に最適であり、中でもＩＩＩ族化合物結晶成長速度が早く、大口径、厚物の生産に向く気相成長法、特にハイドライド気相成長法（ＨＶＰＥ法、ＴＨＶＰＥ法等）に関したものである。
　此れ迄のハイドライド気相成長法（ＨＶＰＥ法、ＴＨＶＰＥ法等）の従来技術では、ＧａＮ結晶を成長後、冷却し、サファイヤやＧａＮ等の種結晶から生成ＧａＮ結晶を剥離・回収しようと思っても、両者が強く結合しているため、目的のＧａＮ結晶を棄損せず収率良く得る事や高価な種結晶の回収をする事は極めて困難であった。無理矢理にサファイヤやＧａＮ等の種結晶から生成ＧａＮ結晶を剥離し、回収しようとすると、無理な力が掛り、貴重なＧａＮ結晶を割ったり、傷つけたりする事が多かった。加えて種結晶は生成ＧａＮ結晶のみならずサセプター構造体にも強く付着し、反応、冷却後にはＧａＮ結晶に強い熱応力が掛り、種々の特性劣化や反り、割れの大きな原因となっていた。特に大口径や厚い結晶成長の時には、これ等の現象は更に顕著になりＧａＮ基板の高特性化や低コスト化の大きなネックとなっていた。
　其処で本発明者は鋭意検討した結果、種結晶及び其れを載置するサセプターの一方、若しくは両方に剥離可能な劈開性を有する物質を用いる事に依り上記の問題を解決するに至った。即ち、種結晶に剥離可能な劈開性を有する物質を用いると、生成ＧａＮ結晶を剥離する際には種結晶の劈開面から種結晶を容易に剥離出来、生成ＧａＮ結晶及び種結晶を容易に回収することができる。又、サセプターに剥離可能な劈開性を有する物質を用いることにより、生成ＧａＮ結晶を剥離する際にはサセプターの劈開面からサセプターを容易に剥離出来、生成ＧａＮ結晶及び種結晶を容易に回収することができる。
　これにより、気相成長法の特長である、高成膜速度の特長を生かしつつ、より高品質な大型ＧａＮ結晶基板が低コストで得られる。即ち、大口径でバラツキの無い、極めて厚物のＧａＮ結晶基板が作成出来る為、基板の結晶特性にも優れ且つ、低コストの大口径ＧａＮ基板が容易に得られる。
　サセプターは、少なくとも種結晶を載置している面が、上述の剥離可能な劈開性を有する物質で構成されていればよい。したがって、サセプター全体が、上述の剥離可能な劈開性を有する物質で構成されている必要はない。
　サセプターに用いる劈開性を有する物質は、好ましくは、層状物質である。層状物質をサセプターに用いることにより、生成ＧａＮ結晶を剥離する際には層状物質の層構造の網平面間でサセプターを容易に剥離出来、生成ＧａＮ結晶及び種結晶を更に容易に回収することができる。又、サセプターに層状物質を有する物質を用いる事に依り、生成ＧａＮ結晶とサセプターが付着して発生する熱応力は、適宜、層間で吸収されたり、層間剥離により緩和されたりする事ができる。
　サセプター及び種結晶の少なくとも一方の部材に剥離可能な劈開性を有する物質を用いることにより、此れ迄、困難であった大口径、厚物のＧａＮ結晶に於いても、反りや割れ等が発生せずにＧａＮ結晶が高収率で得られ、又、高価な種結晶の回収も容易となり、種結晶の使い回しも可能となる。
　なお、「剥離可能な劈開性を有する物質」とは、ＩＩＩ族化合物基板及び種結晶を割ったり傷付けたりしない程度の機械的衝撃で劈開する物質、または、ＩＩＩ族化合物基板及び種結晶の間の熱膨張率の差異による生ずる熱応力で劈開する物質である。
　更に、結晶成長速度を、最初は相対的に高速でＧａＮのベース（ハンドル）基板部分１１を作成し、その後は低速でＧａＮ結晶本体部分１２の厚膜化を行う事が好ましい（図１参照）。これに依り、ＧａＮのベース（ハンドル）基板部分１１は（ｉ）種結晶３やサセプター２からの不純物拡散のバリヤー層として、又、（ｉｉ）結晶成長は厚く積む程、その上層部ほど結晶欠陥が減少するという結晶成長の性質より、目的のＧａＮ結晶本体部分１２の結晶欠陥を少なくする「犠牲層」として、更には（ｉｉｉ）結晶成長後の剥離時やその後の加工工程等の機械的なダメージを防ぐ「保護層」として、或いは（ｉｖ）操作・搬送時のハンドル基板として寄与する。こうすると、目的とするＧａＮ結晶本体部分はより低速で結晶成長を行う事で格子欠陥等の特性劣化や他の特性のバラツキを抑制出来、好ましい。
　価格、反応ガス（ＧａＣｌ、ＧａＣｌ３、ＮＨ３）に対する耐食性、不純物の混入等の観点から、サセプターに用いる剥離可能な劈開性を有する物質は、高純度で反応ガスにも侵されず、層状化合物である熱分解窒化硼素（ＰＢＮ）が好ましく、ＰＢＮ層間結合力を故意に弱めて製造された層間剥離が容易なＰＢＮ又はそれと炭素との複合体の構成物はコスト面（大型、高強度）から更に好ましい。なお、窒化硼素の中で六方晶の窒化硼素が層状化合物である。
　炭素基材表面にＰＢＮ被膜を形成してＰＢＮ／炭素複合体を作製するには、例えば、特公平４－７９９９２号公報に記載の方法を用いることが出来る。このとき、化学蒸着炉内でＰＢＮ膜を成膜している途中で、炉内圧をパルス的に増減させることにより、原子が面状に結合した層状構造における面同士の結合力を弱化させたＰＢＮ層を成膜することが出来る。成膜途中に、このような結合力が弱い層を適宜挿入することにより、層間剥離が容易なＰＢＮ膜を形成することが出来る。
　ＧａＮ結晶の格子定数及び熱膨張率に近く、原料ガスへの耐性、相対的に価格も安く、生成ＧａＮ結晶から剥離・回収の容易性の観点から、種結晶に用いる剥離可能な劈開性を有する物質として、ＳＣＡＭ（ＳｃＡｌＭｇＯ４）結晶を用いる事が好ましく、劈開性ＳＣＡＭ（ＳｃＡｌＭｇＯ４）の単独基板、又はそれ等の複数基板を、結晶方位を合せて貼り合せた基板を用いる事が特に好ましい。反応ガス（ＧａＣｌ、ＧａＣｌ３、ＮＨ３）に対する耐食性、不純物の混入等の観点から、基板表面をＳｉＯ２、ＡｌＮ等で被覆して用いても良い。
　本発明では種結晶を載置するサセプターが剥離可能な劈開性を有する物質である場合は、種結晶には、剥離可能な劈開性を有する物質を用いなくてもよい。この場合、種基板にはＭＯＣＶＤ法、Ｎａフラックス法、及び液アン法から選ばれた製法のＧａＮ基板等も用いる事が出来る。
　本発明では種結晶が剥離可能な劈開性を有する物質である場合、サセプターには、剥離可能な劈開性を有する物質を用いなくてもよい。この場合、サセプターには、ＧａＮ基板その物や熱分解グラファイト（ＰＧ）、コランダム等のセラミックス等も用いることができる。なお、ＰＧは、層状物質であり、劈開性を有するが、層構造の網平面同士の結合が強いため、容易に剥離しない。
　本発明で結晶成長速度を、前述の理由に依り、最初は相対的に高速でＧａＮのベース（ハンドル）基板部分１１を作成し、その後は低速でＧａＮ結晶本体部分１２の厚膜化を行うことがこのましい。更に経済的、効率的な側面及び生成ＧａＮ結晶中の応力発生を抑制、特性向上が出来る事等から、高速から低速に変えるに当り、複数段階的及び/又は連続的に、低速化する事が特に好ましい（図１の結晶成長速度遷移部分１３参照）。
　以下、本発明の実施例を説明するが、本発明はこれに限定されるものではない。
　以下に実施例及び比較例を上げて、本発明を更に具体的に説明するが、本発明は此れら実施例に限定されるものではない。
［実施例１］
　水冷ジャケットと排気口を有する内径１５００ｍｍ×高さ１８００ｍｍのステンレス製反応装置（内面は予め極薄くジルコニアを溶射し、コーテングした）にアルミナのマット状の断熱材を入れ、その内側に円筒状にロッド状のＳｉＣヒーターを持つ加熱装置（内径１０００ｍｍ×高さ１３００ｍｍ）とガス供給管（図２の符号６参照）（上記の反応装置と同材質で中心管６１；内径φ３０ｍｍ、２番目の管６２；内径φ４０ｍｍ、最外管６３；内径φ５０ｍｍ）を備えた。一方、φ１７０ｍｍの層間剥離性が容易なＰＢＮ（ＰＢＮ製造時に炉内圧をパルス的に変動させ製造した物）製の３枚のサセプター（図２の符号２参照）を１２０°間隔に配置収納するφ５２０ｍｍのＰＢＮコート・グラファイトのサセプター公転冶具（図２の符号５参照）を準備した。このサセプター面に２インチのＳＣＡＭ結晶から種基板（図２の符号３参照）としてタイル状に加工し、裏面にアルミナ系接着材（図１の符号４参照）を付け６インチの円盤状に接着した後、加熱ヒーターで１３８０℃に加熱しつつ、同時にサセプター公転冶具５は１０ｒｐｍで回転してサセプター２を公転させ、その公転歯車の力を用いて３枚の各サセプター２は３０ｒｐｍで自転させ温度、回転が安定を確認した後、反応装置内部に３重管の中心管６１からＧａＣｌ３ガスを、最外管６３からＮＨ３ガスを、中心管と最外管との間の管６２からＮ２ガスを供給しＴＨＶＰＥ反応を開始した。
　最初、高速の結晶成長として約３００μｍ／ｈの速度で１時間反応後（図１の符号１１参照）、原料ガスを逐次２時間掛けて絞り成長速度を最終的に約１００μｍ／ｈになる様に調整した（図１の符号１３参照）後、低速反応を４５時間行なった（図１の符号１２参照）。
　冷却後、得られたＧａＮ結晶は種結晶ＳＣＡＭの劈開性により容易にＳＣＡＭ結晶から剥離し、種結晶ＳＣＡＭは回収し再使用に向けた。剥離したＧａＮ結晶は層状のＰＢＮ製サセプターの層間剥離で熱応力を吸収した為、殆ど反りが発生しなかったので其の儘、簡単に円筒研削で加工出来、高速反応部・速度遷移部・低速反応部からなるφ６インチ×厚さ５ｍｍの母材基板を作製した。
　この母材基板の低速反応部の表面側から適宜スライス、研磨し、厚み６２５μｍの平滑なＧａＮ基板を得た。反応解析の為に、製品化した低速反応部分のＧａＮ基板と併せて高速部分（図１の符号１１参照）を含むＧａＮ基板について以下の分析を行った。尚、高速反応部分は加工時のハンドル基板、機械的ダメージを軽減する「保護層」として、接着剤等からの不純物の汚染防止用「バリヤー層」として又、結晶欠陥を少なくする「犠牲層」としての役割を担うものである。
　上記の低速反応部（図１の符号１２参照）から加工したＧａＮ基板の（１００）面のＸ線ロッキングカーブのＦＷＨＭ（Full　Width　at　Half　Maximum）は面内の任意の３点が平均３１ａｒｃｓｅｃ、バラツキが３ａｒｃｓｅｃで結晶性が良好な物であった。一方、高速部分部（図１の符号１１参照）を含むＧａＮ基板は４４８ａｒｃｓｅｃ、バラツキが８４ａｒｃｓｅｃであった。又、因みに上記の各基板の表面の化学分析をした結果、低速反応部１２のＧａＮ基板は金属汚染は検出限界以下であったが、高速反応部１１を含むＧａＮ基板の下部側（種結晶、サセプタ―側）には種結晶及び使用したアルミナ系接着材からと思われるＭｇ、Ａｌ、Ｓｉ、Ｆｅ等の金属の極僅かな混入が認められた。
　更に積層欠陥を単色Ｃａｔｈｏｄｅ　Ｌｕｍｉｎｅｓｃｅｎｃｅ像で観察した結果、製品化したＧａＮ基板の表面層には殆ど見られなかった。一方、高速部分１１を含むＧａＮ基板では積層欠陥が見られ、特に高速部分１１には多く観察された。此の事は高速部分１１が一種の不純物のトラップ層、或いは欠陥の犠牲層の役割を担っている事が分かる。以上の結果から製品化したＧａＮ基板晶は反りの無く、バラツキの殆ど無い均一で良好なＧａＮ結晶基板である事が示された。本実施例の効果は（１）種結晶と其れを載置するサセプター構造体の一方、若しくは両方が剥離可能な劈開性及び/又は層状性の物質を用いた事、加えて（２）結晶成長速度を、最初は相対的に高速でＧａＮのベース（ハンドル）基板部分１１を作成し、その後は低速でＧａＮ結晶本体部分１２の厚膜化を行成った事に依る両者の相乗効果が大きい事を示すものである。
［比較例］
　実施例１で種結晶をＳＣＡＭ結晶から、剥離可能な劈開性を有さないＮａフラックスで製造した２インチのＧａＮ基板に、サセプターを剥離可能な劈開性を有さないコランダムのセラミックス製に変えた以外は全く同じ条件で結晶成長を行った。その結果、ＴＨＶＰＥ反応後、冷却して内部の生成物を取り出そうとしたがＧａＮとサセプターとが融着して、生成ＧａＮと貴重な種基板は粉々に割れていずれも回収不可能であった。
［実施例２］
　実施例１のＳＣＡＭの種基板を剥離可能な劈開性を有さないＮａフラックスで製造した２インチのＧａＮ基板に変え、反応ガスをＧａＣｌ３ガスからＧａＣｌに変えてＴＨＶＰＥからＨＶＰＥ法にした以外は同一条件で結晶成長反応を行った。尚、反応はＧａ分換算で実施例１と同一線速となる様にした。冷却後、得られたＧａＮ結晶は種結晶と一体になった形でＧａＮ結晶は層状のＰＢＮ製サセプターから容易に引き剥がす事が出来た。心配した冷却時の熱応力は層間剥離で吸収し、クラック発生も無く、又、殆ど反りも発生しなかった。実施例１と同様に製品化したＧａＮ基板の（１００）面のＸ線ロッキングカーブのＦＷＨＭ（Full　Width　at　Half　Maximum）は面内の任意の３点が平均２５ａｒｃｓｅｃ、バラツキが３ａｒｃｓｅｃであった。金属不純物の分析値は測定限界以下であった。又、積層欠陥を単色Ｃａｔｈｏｄｅ　Ｌｕｍｉｎｅｓｃｅｎｃｅ像で観察した結果、ＧａＮの表面層には殆ど見られなかった。上記の測定と観察から、得られたＧａＮ結晶は極めてバラツキの無い均一で良好な結晶基板である事を示している。
［実施例３］
　実施例１で最初のから低速度の約１００μｍ／ｈで結晶成長を５０時間行なった事とサセプターに劈開性を有するが剥離することが難しい熱分解グラファイト（ＰＧ）製を使用した事、以外は全く同一条件で結晶成長を行った。得られたＧａＮ結晶は容易に種結晶のＳＣＡＭ及びＰＧ製サセプターから剥離出来、ＳＣＡＭは回収し再使用が可能であった。剥離したＧａＮ結晶は層状のＰＧ製サセプターの層間剥離性が弱かった為、ＧａＮ結晶の熱応力を充分に吸収出来ず数ミリの反りが発生した。しかし割れは起こらなかった。多少、矯正しながら円筒研削でφ６インチに加工した。
１　ＧａＮ基板
２　サセプター
３　種結晶
４　接着剤
５　サセプター公転治具
６　ガス供給管
１１　ベース（ハンドル）基板部分
１２　ＧａＮ結晶本体部分
１３　結晶成長速度遷移部分

 

Claims (8)

  1. 　サセプターに載置され、固定された種結晶に、気相成長法により、ＩＩＩ族化合物の結晶を成長させるＩＩＩ族化合物基板の製造方法であって、
    　前記サセプター及び前記種結晶の少なくとも一方の部材に剥離可能な劈開性を有する物質を用いることを特徴とするＩＩＩ族化合物基板の製造方法。
  2. 　前記サセプターは、少なくとも前記種結晶を載置している面が前記剥離可能な劈開性を有する物質で構成され、
    　前記剥離可能な劈開性を有する物質が熱分解窒化ホウ素（ＰＢＮ）であることを特徴とする請求項１に記載のＩＩＩ族化合物基板の製造方法。
  3. 　前記剥離可能な劈開性を有する物質が熱分解窒化ホウ素（ＰＢＮ）及び炭素の複合体であることを特徴とする請求項１または２に記載のＩＩＩ族化合物基板の製造方法。
  4. 　前記種結晶が前記剥離可能な劈開性を有する物質で構成され、
    　前記剥離可能な劈開性を有する物質がＳＣＡＭ（ＳｃＡｌＭｇＯ４）結晶であることを特徴とする請求項１～３のいずれか１項に記載のＩＩＩ族化合物基板の製造方法。
  5. 　第１の結晶速度で前記種結晶にＩＩＩ族化合物の結晶を成長させる第１の結晶成長工程、及び
    　前記第１の結晶成長工程の後に、前記第１の結晶速度よりも結晶速度が低い第２の結晶速度で、前記種結晶にＩＩＩ族化合物の結晶を成長させる第２の結晶成長工程を含むことを特徴とする請求項１～４のいずれか１項に記載のＩＩＩ族化合物基板の製造方法。
  6. 　前記第１の結晶成長工程及び前記第２の結晶工程の間に、第３の結晶速度で前記種結晶にＩＩＩ族化合物の結晶を成長させる第３の結晶工程を含み、
    　前記第３の結晶工程では、前記第３の結晶速度は、前記第１の結晶速度から前記第２の結晶速度へ、段階的に及び／又は連続的に変わることを特徴とする請求項５に記載のＩＩＩ族化合物基板の製造方法。
  7. 　前記ＩＩＩ族化合物が窒化ガリウム（ＧａＮ）であることを特徴とする請求項１～６のいずれか１項に記載のＩＩＩ族化合物基板の製造方法。
  8. 　請求項１～７のいずれか１項に記載のＩＩＩ族化合物基板の製造方法により製造されることを特徴とするＩＩＩ族化合物基板。

     
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