WO2020235646A1 - Appareil électronique - Google Patents

Appareil électronique Download PDF

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Publication number
WO2020235646A1
WO2020235646A1 PCT/JP2020/020163 JP2020020163W WO2020235646A1 WO 2020235646 A1 WO2020235646 A1 WO 2020235646A1 JP 2020020163 W JP2020020163 W JP 2020020163W WO 2020235646 A1 WO2020235646 A1 WO 2020235646A1
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WO
WIPO (PCT)
Prior art keywords
shield
printed circuit
electronic device
circuit board
shield member
Prior art date
Application number
PCT/JP2020/020163
Other languages
English (en)
Japanese (ja)
Inventor
田中　哲哉
祐太 玉樹
Original Assignee
株式会社ソニー・インタラクティブエンタテインメント
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ソニー・インタラクティブエンタテインメント filed Critical 株式会社ソニー・インタラクティブエンタテインメント
Priority to JP2021520854A priority Critical patent/JP7301126B2/ja
Publication of WO2020235646A1 publication Critical patent/WO2020235646A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electromagnetic shielding technique inside an electronic device and a technique for improving heat exhaust performance.
  • Electronic devices such as game devices and personal computers have printed circuit boards on which a plurality of electronic components are arranged.
  • the electronic components arranged on the printed circuit board emit electromagnetic waves that become noise that affects the operation of other circuit elements and wireless communication.
  • a method of covering a plurality of electronic components arranged on a printed circuit board with a metal shield member is known. (See Patent Document 1)
  • the wavelength of electromagnetic noise emitted from electronic components has become shorter than before as the operating signals of electronic components have become faster. As a result, electromagnetic noise may leak even from a narrower gap than before.
  • the present invention has been made in view of the above problems, and an object of the present invention is to suppress the influence of electromagnetic noise emitted from electronic components and to have an effect that electromagnetic noise having a shorter wavelength than the conventional one leaks to the outside. It is an object of the present invention to provide an electronic device having an electromagnetic shield structure for preventing the noise.
  • the electronic device of the present invention suppresses electromagnetic radiation from the printed circuit board and a plurality of electronic components mounted on the printed circuit board to the outside by collectively covering the printed circuit board. Moreover, it is provided with a shield member characterized by being in thermal contact with those electronic components.
  • Another aspect of the electronic device of the present invention is a shield member that covers an electronic component mounted on a printed circuit board and suppresses electromagnetic radiation from the electronic component to the outside, and a surface opposite to the surface that covers the electronic component. It has a heat sink attached so as to make thermal contact with the shield member.
  • FIG. 1 It is a perspective view of the electronic device which concerns on this embodiment. It is an exploded perspective view of the exhaust hole provided in the upper part of the electronic device which concerns on this embodiment. It is a perspective view which views the unit including the cooling fan and the antenna mounting member which concerns on this embodiment. It is a side view of the unit when the antenna board is attached to the antenna attachment member which concerns on this embodiment. It is an exploded perspective view of the electronic device in the state which the Z2 direction is facing up shown in FIG. It is a front view of the optional equipment attachment part and the lower shield member provided on the bottom surface side of the electronic equipment which concerns on this embodiment. It is a front view of the lid part attached to the optional device attachment part which concerns on this embodiment.
  • the electronic device can be applied to, for example, a game machine, a development machine for executing various programs under development (for example, a game program), and an information processing device (for example, a server device) different from the game.
  • a game machine for example, a game program
  • an information processing device for example, a server device
  • FIG. 1 is a perspective view of an electronic device according to the present embodiment.
  • the directions indicated by X1 and X2 in FIG. 1 are referred to as right and left, respectively, and the directions indicated by Y1 and Y2 are referred to as front and rear, respectively.
  • the directions indicated by Z1 and Z2 are referred to as upward and downward, respectively.
  • These directions are used to explain the relative positional relationship of the elements (parts, members, parts) of the electronic device 10, and do not specify the posture of the electronic device 10 when used.
  • the electronic device 10 may be used in the horizontal posture shown in FIG. 1 or may be used in the vertical posture.
  • the electronic device 10 may be configured to be usable in a posture opposite to the posture shown in FIG.
  • an input device such as a game controller or keyboard, a display, or the like is connected to the electronic device 10.
  • the electronic device 10 reads a game program recorded on an optical disk or a game program acquired via a network.
  • the electronic device 10 executes the game program based on the signal input from the input device, and displays the game image as the processing result on the display.
  • the electronic device 10 has a main printed circuit board 40 (see FIG. 5) on which integrated circuits such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and a RAM (Random Access Memory) are mounted.
  • the main printed circuit board 40 is arranged horizontally, that is, parallel to the front-rear direction and the left-right direction.
  • the upper and lower sides of the main print substrate 40 are shielded by a metal plate for suppressing unnecessary radiation, that is, the first shield 71A and the second shield 71B. It is covered with a shield member 60.
  • the electronic device 10 has a heat sink 73 above the main printed circuit board 40.
  • the heat sink 73 is connected to the integrated circuit 70, which is a heat source of the main printed circuit board 40.
  • the integrated circuit 70 is a high-speed CPU, it consumes a large amount of power and requires a large heat sink 73.
  • the electronic device 10 has a plurality of cooling fans, and the heat sink 73 receives an air flow formed by the fans.
  • the heat sink 73 is arranged on the upper side of the main printed circuit board 40, and has a plate-shaped bottom portion 732 and a plurality of fins 733 formed on the bottom portion 732.
  • the bottom 732 is in contact with the integrated circuit 70.
  • the heat of the integrated circuit 70 is transferred from the bottom 732 to the fins 733.
  • the bottom 732 is a vapor chamber, that is, a metal plate in which a space in which a liquid that easily vaporizes is sealed is formed.
  • the bottom 732 may be a metal plate or block that does not have such a space.
  • the fins 733 are welded to the bottom 732 and lined up along the main printed circuit board 40.
  • the fin 733 is composed of metal plates arranged at predetermined intervals on the upper surface of the bottom portion 732 parallel to the main printed circuit board 40.
  • the structure of the heat sink 73 is not limited to the example of FIG.
  • the bottom 732 of the heat sink 73 and the fins 733 may be integrally formed.
  • the plurality of fins 733 may be arranged in the vertical direction. That is, the fins 733 may be arranged in a direction perpendicular to the main printed circuit board 40.
  • the upper case 11 has a main body cover 111 and a side cover 112 formed separately from the main body cover 111 and attached to the main body cover 111.
  • a substantially triangular recess 114 is formed in the center of the upper surface of the electronic device 10.
  • the shape of the recess 114 is not limited to that shown as long as the inner wall is formed so as to match the arrangement of the heat sink 73.
  • the side cover 112 is formed with an exhaust port 113. The side cover 112 may be symmetrically attached to the left and right side surfaces of the electronic device 10.
  • FIG. 2 is an exploded perspective view of an exhaust hole provided in the upper part of the electronic device 10. That is, the figure shows the internal structure of the side cover 112. As shown in FIGS. 1 and 2, a plurality of louvers 112a arranged in the front-rear direction are formed inside the exhaust port 113. Each louver 112a has a plate shape, and guides the air flow from the inside of the electronic device 10 to the rear of the electronic device 10 in an oblique direction. As a result, the air that has passed through the heat sink 73 is discharged to the rear side of the electronic device 10.
  • the side cover 112 has an outer member 112b that constitutes an upper surface and a side surface of the electronic device 10, and an inner member 112c that includes a plurality of louvers 112a and is attached to the inside of the outer member 112b.
  • the side cover 112 may be integrally formed of one member.
  • each louver 112a partially overlaps with the adjacent louver 112a. In this way, the inside of the electronic device 10, for example, the cooling fan is not exposed to the outside.
  • FIG. 3 is a perspective view of a unit of the electronic device 10 including a cooling fan and an antenna mounting member.
  • the housing of this unit has a first structure for accommodating the fan 39 and an antenna board mounting portion 20 having a second structure.
  • This unit is built into the electronic device 10 so that the fan 39 is located on the back surface, for example.
  • the antenna board mounting portion 20 is formed at the tip of a support portion 22 extending from a corner of the housing.
  • the antenna board mounting portion 20 has a collating portion 23 for positioning the antenna board and a holding portion 24 for holding the antenna board.
  • the holes provided on the antenna board and the matching portion 23 are aligned with each other, and the antenna board is positioned.
  • each part such as the joining portion 23 and the holding portion 24 constituting the antenna board mounting portion 20 does not have a portion that overlaps with each other. That is, the structure is not such that another component is located behind one component of the antenna board mounting portion 20, which is the second structure, when viewed from the tip end side of the support portion 22.
  • the first and second structures can be integrally molded by molding, and productivity is improved.
  • FIG. 4 is a side view of the unit when the antenna board is attached to the antenna attachment member.
  • the unit is provided with a plurality of antenna board mounting portions 20 so that the antenna boards can be mounted at different angles.
  • the antenna substrates 21A and 21B are installed at different angles of 90 degrees. That is, the antenna substrate 21A has the surface of the substrate perpendicular to the electronic device 10, and the antenna substrate 21B has the surface of the substrate horizontal.
  • the number of antenna boards may be 3 or more.
  • FIG. 5 is an exploded perspective view of the electronic device with the Z2 direction of FIG. 1 facing up.
  • An optional device mounting portion 30 is provided on the bottom surface of the electronic device 10.
  • the optional device mounting portion 30 includes an optional printed circuit board 31 and a connector 32 for mounting an optional device (not shown). Further, there is a lower shield member 34 that covers a part of the main printed circuit board 40 and suppresses electromagnetic radiation from the electronic device to the outside.
  • the lower case 12 accommodates these structures.
  • the optional printed circuit board 31 may be the same as the main printed circuit board 40, or as separate substrates, both substrates may be electrically connected by a connector or the like.
  • FIG. 6 is a front view of the optional device mounting portion 30 and the lower shield member 34 provided on the bottom surface side of the electronic device 10.
  • the lower shield member 34 covers an area other than the area where the optional equipment is attached.
  • a recess having a step from the upper surface (upper surface in FIG. 5) is formed in the central portion of the lower shield member 34 in order to accommodate the optional equipment.
  • the recess has a wall 35 (35a, 35b, 35c, 35d) as an inner wall, and this wall 35 surrounds the optional equipment mounting portion 30.
  • the optional equipment mounting area of the optional printed circuit board 31 is exposed.
  • the optional device mounting area does not have to be located at the center of the lower shield member 34.
  • the optional device mounting area may be in contact with any of the four corners of the upper surface of the lower shield member 34, or may be in contact with an edge other than the four corners.
  • the shielding property can be maintained by the inner wall of the recess at the boundary with the lower shield member 34.
  • four walls 35a, 35b, 35c, and 35d are formed by making the upper surface shape of the depression substantially quadrangular, but the shape of the depression is not limited to this, and there are many circles, ellipses, triangles, pentagons or more. It may be square or the like.
  • the shape of the upper surface of the recess may be appropriately selected depending on the shape of the assumed optional equipment and the like.
  • the position of the recess in the lower shield member 34 is not limited, and in any case, the shielding property can be maintained by the inner wall of the recess.
  • the connecting portion 36 includes a base portion 361 and a fixing portion 362.
  • the lower shield member 34 is fixed by screwing a hole provided in the fixing portion 362 to the optional printed circuit board 31.
  • the fixing portion 362 is elastic depending on at least one of the material and the structure. For example, the fixing portion 362 has an L-shaped arm and absorbs the misalignment of parts due to tolerances and the like.
  • a plurality of ventilation holes 37 are formed on the pair of walls 35b and 35d facing each other of the lower shield member 34, respectively.
  • the ventilation holes 37 are formed so that the air flow path taken in from the outside of the housing by the fan described later passes through the exposed area of the optional printed circuit board 31 and the optional equipment attached thereto.
  • Each of the plurality of ventilation holes 37 extends in a direction intersecting with the substrate. That is, the ventilation holes 37 are formed by arranging vertically long slit-shaped holes in the horizontal direction on the inner wall of the recess of the lower shield member 34. As a result, the optional equipment can be cooled efficiently.
  • the lower case 12 of FIG. 5 is made of resin and has an opening 38 corresponding to an optional device mounting area (optional device mounting portion 30).
  • the lid 381 closes the opening 38 of the lower case 12.
  • the lid 381 prevents the optional equipment from being exposed to the outside of the housing.
  • FIG. 7 is a front view of the lid portion attached to the optional device mounting portion 30.
  • a shield surface 382 is provided on the surface side of the lid 381 facing the printed circuit board.
  • the shield surface 382 is a metal plate, but any material such as a metal foil or a material capable of suppressing electromagnetic radiation to the outside may be used.
  • a shielding member 383 is attached to the surface of the shielding surface 382 of the lid 381 so as to surround the outer periphery of the optional equipment mounting area with the lid 381 attached.
  • the shielding member 383 serves as a gasket.
  • the shielding member 383 has electromagnetic wave shielding properties and elasticity, such as those in which a metal foil is attached to the surface of urethane.
  • FIG. 8 is a horizontal sectional view of the electronic device shown in FIG. 1 with the Z2 direction facing up. The left side of the figure corresponds to the front surface of the electronic device 10.
  • the fan 39 that contributes to cooling the optional equipment is provided on the bottom surface side and the rear surface side of the housing of the electronic device 10.
  • the air flow in this case is illustrated by a white arrow. Air is taken in from the front surface and the side surface of the housing, passes through the front stage path x1, and reaches the optional equipment mounting portion 30. Then, it enters the optional equipment mounting area through the ventilation hole 37. The air that has cooled the optional equipment passes through the rear passage path x2 through the facing ventilation holes 37, and is discharged to the outside of the housing by the fan 39.
  • a support member 41 for supporting a separate electronic component is provided on the main printed circuit board 40.
  • FIG. 9 is an enlarged view of a vertical cross section of the electronic device in the state where the Z2 direction shown in FIG. 1 is facing up.
  • the cable 42 extends from the main printed circuit board 40 and is pressed against the surface of the main printed circuit board 40 by the foot portion 411 of the support member 41.
  • the lower shield member 34 By arranging the lower shield member 34 so as to overlap the surface of the main printed circuit board 40, the outside of the side surface forming the foot portion 411 of the support member 41 is covered by the side surface of the lower shield member 34.
  • An opening 341 is provided on the side surface of the lower shield member 34. The cable 42 is pulled out of the lower shield member 34 through the opening 341.
  • a shielding member 44 is attached to the side surface of the lower shielding member 34.
  • the shielding member 44 covers the opening 341 to prevent leakage of unnecessary radiation from the gap between the cable 42 and the lower shielding member 34.
  • the shielding member 44 is made of an elastic material such as rubber.
  • FIG. 10 illustrates a state in which the shielding member 44 is viewed from the side surface of the lower shielding member 34.
  • the notch 441 is formed radially around one point at the center of the lower end of the shielding member 44. By passing the cable 42 through the center of the radial cut, the gap between the opening 341 and the cable 42 can be effectively closed.
  • the shielding member 44 may be provided inside the shield case. Further, the shape and position of the notch 441 are not limited to those shown in the figure.
  • FIG. 11 shows a state in which the main printed circuit board 40 is viewed from above.
  • the surface of the main printed circuit board 40 is resist-treated, and electronic components are mounted on both sides.
  • the main printed circuit board 40 has a plurality of through holes 501 and 502.
  • Fastening members such as screws and discrete parts (not shown) such as electrolytic capacitors and transistors are attached to the through holes 501 and 502, respectively (hereinafter, the fastening members and discrete parts are referred to as "mounting target parts"). If the component to be mounted is a screw, one through hole 501 and 502 may be provided, but if the electrolytic capacitor is used, two holes are formed, and if the transistor is used, three holes are formed. Lands 51A and 51B, which are regions for conducting the mounting component and the main printed board 40, are provided around the through holes 501 and 502, respectively.
  • the parts to be mounted take various shapes.
  • a hexagonal land that is, a conduction region, the same applies hereinafter
  • a circular land 51B is provided for the circular part.
  • similar or “similar” belongs to the same type in the classification of general figures such as circles, ellipses, triangles, quadrangles, etc., except when they have the same shape or similarity.
  • the number of vertices and the angle of the sides at the vertices are the same, and so on.
  • the shapes of the through holes 501 and 502 themselves do not have to correspond to the shapes of the parts to be mounted.
  • FIG. 17 shows a processing procedure for automatic mounting of the electronic device 10 using the land of FIG.
  • the automatic mounting device includes a camera, a control unit, and a mounting robot.
  • the control unit is composed of, for example, a calculation unit such as a CPU (Central Processing Unit), a communication unit that realizes communication with a camera or a robot, and a storage unit that stores necessary information.
  • the main printed circuit board 40 is imaged with a camera (S1).
  • the captured image is sent to the control unit, where the image is recognized (S2). That is, the control unit recognizes the positions of the through holes 501 and 502 and the shapes of the lands 51A and 51B provided around the positions.
  • the control unit specifies the components (mounting target components) to be mounted in the through holes 501 and 502, respectively, based on the shapes of the lands 51A and 51B (S3). Therefore, in the storage unit of the control unit, a correspondence table in which the identification information of the mounted symmetric component and the shape of the land are associated with each other is stored in advance. The control unit acquires the identification information of the component to be mounted by referring to the correspondence table. The control unit transmits the identification information of the specified mounting target component and the information indicating the mounting position to the robot arm (S4). The robot arm performs correct mounting according to the instructions (S5). Through the above processing, the efficiency of automatic mounting is realized.
  • the control unit may be provided in the automatic mounting device, or may operate on a server on the Internet.
  • the shield member 60 collectively covers a plurality of mounted electronic components on one surface of the main printed circuit board 40 to prevent (suppress) electromagnetic radiation from those electronic components.
  • the shield member 60 is not provided with holes except for holes for fixing the shield member 60 to the main printed circuit board 40. With this structure, electromagnetic noise from electronic components inside the shield can be further reduced.
  • FIG. 12 is a front view of the shield member.
  • the shield member 60 has an edge portion in contact with one surface of the main printed circuit board 40 and a direction away from the edge portion from one surface of the main printed circuit board 40 (lower in FIG. 13).
  • a lower surface that protrudes in the direction) and forms a storage space for collectively covering a plurality of electronic components on the main printed circuit board is provided.
  • a plurality of recesses 61 are formed on the lower surface thereof. The recess 61 is formed at a position corresponding to the electronic components on the printed circuit board so as to avoid those components.
  • the recess 61 is formed so that the bottom portion of the shield member 60 is in contact with at least a part of the electronic components on the printed circuit board while the shield member 60 is attached to the printed circuit board. With this structure, the electronic component and the shield member 60 are brought close to each other, and the electronic component and the shield member 60 are easily brought into thermal contact with each other.
  • the shape and size of the recess 61 are not limited, and may differ depending on the position by appropriately selecting the recess 61 according to the corresponding electronic component.
  • a thermal interface material is applied to the surfaces of a plurality of electronic components arranged on a main printed circuit board (not shown in FIG. 12).
  • the shield member 60 and the plurality of electronic components are thermally connected via the recess 61 and the TIM.
  • the heat generated by the plurality of electronic components is transmitted to the shield member 60, and the shield member 60 also functions as a heat radiating plate.
  • the electronic device 10 may be further provided with at least one mechanism such as a fan, a ventilation hole, and a heat sink for cooling the shield member 60.
  • the edge of the shield member 60 is a heat sink so as to be in thermal contact with the shield member 60.
  • the heat sink 62 is provided at a position covering a power source element or a high-speed element that consumes a large amount of power in a state where the shield member 60 is attached to the printed circuit board, and is thermally connected to the element. As a result, the heat generated by each element is efficiently transmitted to the shield member 60.
  • the position and area of the heat sink 62 with respect to the shield member 60 are not limited.
  • FIG. 13 is a cross-sectional view of the main printed circuit board with the shield attached.
  • the electronic components arranged on the upper surface of the main printed circuit board 40 include an integrated circuit 70 such as a CPU that operates at high speed.
  • the first shield 71A covers the integrated circuit 70.
  • the first shield 71A is provided with an opening 72A, through which the heat sink 73 comes into contact with the integrated circuit 70.
  • the second shield 71B covers the first shield 71A and a plurality of other electronic components.
  • the second shield 71B is provided so as to overlap the first shield 71A.
  • the heat sink 73, the first shield 71A, and the second shield 71B are drawn at intervals. It is actually fixed without any gaps.
  • the second shield 71B also has an opening 72B that brings the heat sink 73 into contact with the integrated circuit 70.
  • the opening 72B of the second shield 71B is provided so as to overlap the opening 72A of the first shield 71A.
  • a convex portion 731 is provided on the bottom surface of the heat sink 73, and the convex portion 731 is fitted into the openings formed by the openings 72A and 72B, and the integrated circuit 70 and the heat sink 73 are thermally connected.
  • the edges of the openings 72A and 72B of the two shields do not have to match when they are overlapped. Even if the two are out of alignment, the structure is such that the heat sink 73 can be thermally connected to the integrated circuit 70.
  • the sizes of the openings 72A and 72B may also be different.
  • a shielding member 74A is arranged between the first shield 71A and the second shield 71B and between the first shield 71A and the heat sink 73.
  • the shielding member 74A is made by pasting a metal foil on the surface of a material such as elastic rubber or urethane, and has both conductivity and flexibility.
  • the shielding member 74A has a role of closing the gap between the opening formed by the openings 72A and 72B and the first shield 71A. Specifically, the shielding member 74A fills the gap between the first shield 71A and the second shield 71B, and the gap between the first shield 71A and the heat sink 73. Therefore, the shielding member 74A can be rephrased as a "conductive first connecting member".
  • the shielding member 74A may be provided so as to come into contact with the first shield 71A, the second shield 71B, and the heat sink 73 at the same time at predetermined positions.
  • a conductive and flexible shielding member 74B is arranged between the second shield 71B and the bottom 732 of the heat sink 73. That is, the shielding member 74B has a role of closing the gap between the opening formed by the openings 72A and 72B and the second shield 71B. Specifically, the shielding member 74B fills the gap between the second shield 71B and the heat sink 73. Therefore, the shielding member 74B can be rephrased as a "conductive second connecting member". As a result, electromagnetic noise generated from the electronic components inside the first shield 71A and the second shield 71B is prevented from leaking from between the second shield 71B and the heat sink 73.
  • the electronic device 10 has a light emitting region 80 on the front surface.
  • the light emitting region 80 includes a plurality of indicators 81, and notifies the user of the operating state of the electronic device 10 by a light emitting pattern.
  • FIG. 15 is a cross-sectional view of an electronic device in a state where the light emitting region faces the Y2 direction. That is, FIG. 15 shows the internal structure of the light emitting region 80.
  • the light emitting region 80 includes a plurality of LEDs 82 mounted on the substrate and a plurality of light guide members 83.
  • the plurality of light guide members 83 are composed of a bottom surface 84 and an injection surface 85, and each bottom surface 84 of the plurality of light guide members 83 is arranged at a position facing the plurality of LEDs 82. With this structure, the light of each LED can be guided to the respective injection surface 85.
  • a light-shielding member 86 is arranged between the plurality of LEDs 82.
  • the light-shielding member 86 prevents the light of the adjacent LED from entering the light guide member 83. This structure prevents the light emission pattern of the indicator 81 from becoming ambiguous due to the mixing of the lights of adjacent LEDs.
  • FIG. 16 is a diagram showing the shape of the light-shielding member 86.
  • the light-shielding member 86 has a comb-teeth shape integrally formed by a plurality of partition walls to be arranged between the LEDs 82 and shafts supporting them at appropriate intervals. According to this structure, it is easier to assemble than a structure in which light-shielding members are provided one by one between adjacent LEDs. Further, when manufacturing the light-shielding member 86, by cutting the material plate into a shape in which the comb teeth are meshed with each other, the gap between the comb teeth can be utilized for another comb tooth, and the loss of the material can be reduced. it can.
  • the shielding member 44 of FIG. 10 is provided with a radial notch 441, but the present invention is not limited to this, and any shape may be used as long as the gap when the cable 42 is passed can be reduced.
  • a hole equal to or slightly smaller in diameter of the cable 42 may be drilled.
  • the cable 42 may be passed between the shielding member 44 and the main printed circuit board 40 without providing a notch or a hole by utilizing its deformability.
  • the shielding members appearing in various parts of the embodiment may be formed by pasting a metal foil on the surface of an elastic material or by mixing a metal compound or a metal filler inside the material. Further, it may be made of a metal part having a shape suitable for each structural part and then attached with a rubber pedestal or the like on the back surface thereof.
  • the present invention can be used for game machines, development machines for executing various programs under development (for example, game programs), various information processing devices other than game machines (for example, server devices), and the like. Is.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un appareil électronique qui comprend : un élément de blindage 60 n'ayant pas de trous qui recouvre un composant électronique monté sur une carte de circuit imprimé et bloque la sortie d'un rayonnement électromagnétique du composant électronique ; et un dissipateur thermique 62 monté en contact thermique avec l'élément de blindage. L'élément de blindage 60 retire la chaleur du composant électronique au moyen d'un matériau d'interface thermique (TIM) et fonctionne comme une plaque de dissipation de chaleur. En outre, avec le dissipateur thermique 62, il est possible d'éliminer efficacement la chaleur du composant électronique, qui génère une grande quantité de chaleur, par l'intermédiaire du TIM et de l'élément de blindage 60.
PCT/JP2020/020163 2019-05-23 2020-05-21 Appareil électronique WO2020235646A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021520854A JP7301126B2 (ja) 2019-05-23 2020-05-21 電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-096804 2019-05-23
JP2019096804 2019-05-23

Publications (1)

Publication Number Publication Date
WO2020235646A1 true WO2020235646A1 (fr) 2020-11-26

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PCT/JP2020/020163 WO2020235646A1 (fr) 2019-05-23 2020-05-21 Appareil électronique

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JP (1) JP7301126B2 (fr)
WO (1) WO2020235646A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314286A (ja) * 2001-04-10 2002-10-25 Hitachi Ltd 電子装置
JP2009054701A (ja) * 2007-08-24 2009-03-12 Hitachi Kokusai Electric Inc 電子部品放熱構造
JP2013123342A (ja) * 2011-12-12 2013-06-20 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
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