WO2020233413A1 - 显示装置、柔性显示面板及其制造方法 - Google Patents

显示装置、柔性显示面板及其制造方法 Download PDF

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Publication number
WO2020233413A1
WO2020233413A1 PCT/CN2020/089048 CN2020089048W WO2020233413A1 WO 2020233413 A1 WO2020233413 A1 WO 2020233413A1 CN 2020089048 W CN2020089048 W CN 2020089048W WO 2020233413 A1 WO2020233413 A1 WO 2020233413A1
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Prior art keywords
layer
electrode
flexible substrate
area
away
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PCT/CN2020/089048
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English (en)
French (fr)
Inventor
刘晓云
康亮亮
王小芬
靳倩
刘暾
樊燕
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京东方科技集团股份有限公司
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Priority to US17/251,863 priority Critical patent/US11751432B2/en
Publication of WO2020233413A1 publication Critical patent/WO2020233413A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display device, a flexible display panel, and a manufacturing method of the flexible display panel.
  • stretchable flexible display panels are gaining more and more attention.
  • Existing stretchable flexible display panels generally divide multiple displays by opening hollow areas. The unit, due to the existence of the hollow area, enables the flexible display panel to be stretched and deformed. However, the external water and oxygen will erode from the hollow area to the display area, thereby affecting the display effect.
  • the purpose of the present disclosure is to provide a display device, a flexible display panel, and a manufacturing method of the flexible display panel.
  • a flexible display panel including a flexible substrate and a plurality of pixel islands arrayed on the flexible substrate; the pixel islands have a display area and a peripheral area surrounding the display area, and Each of the pixel islands includes a driving layer, a first electrode layer, a light emitting layer, and a second electrode layer that are sequentially stacked on the flexible substrate;
  • the first electrode layer includes a first electrode located in the display area and a peripheral electrode located in the peripheral area, the peripheral electrode surrounds the display area, and the peripheral electrode is provided with a surface away from the flexible substrate
  • the barrier structure surrounding the display area has a preset distance between the barrier structure and the display interval; the light-emitting layer is intermittently arranged between the area facing the barrier structure and the area within the preset distance.
  • the barrier structure is a ring-shaped rib, and the height of the rib is greater than the thickness of the light-emitting layer; the light-emitting layer is directly facing the barrier structure.
  • the light-emitting layer is located in an area of the convex edge away from the surface of the first electrode layer; or
  • the blocking structure is an annular groove, and the depth of the groove is greater than the thickness of the light-emitting layer; the area of the light-emitting layer facing the blocking structure is the area where the light-emitting layer is located on the bottom surface of the groove.
  • the blocking structure is a ring-shaped ridge made of conductive material
  • the second electrode layer is located in an area of the ridge away from the surface of the first electrode layer and located at The regions within the preset interval are intermittently arranged, and the regions of the second electrode layer within the preset interval are in contact with the inner wall of the rib.
  • the rib includes:
  • the first conductive layer is arranged on the surface of the peripheral electrode away from the flexible substrate and surrounds the display area;
  • the second conductive layer is disposed on the surface of the first conductive layer away from the flexible substrate, and the area of the second electrode layer located within the predetermined interval is in contact with the inner wall of the second conductive layer.
  • the first conductive layer and the peripheral electrode are an integrated structure of transparent conductive material; the second conductive layer is made of metal.
  • the rib further includes:
  • the protective layer is arranged on the surface of the second conductive layer away from the flexible substrate.
  • the angle between the cross section perpendicular to the flexible substrate in the rib and the surface of the first electrode layer away from the flexible substrate is not less than 90°, and is not More than 100°.
  • the driving layer includes:
  • the active layer is arranged on the flexible substrate and located in the display area;
  • the gate is arranged on the surface of the gate insulating layer away from the flexible substrate and directly opposite to the active layer;
  • the source-drain layer is provided on the surface of the dielectric layer away from the gate, and the source-drain layer includes a source and a drain connected to the active layer;
  • the driving electrode is arranged on the surface of the dielectric layer away from the gate and located in the peripheral area;
  • a flat layer covering the dielectric layer, the source and drain layers and the driving electrode, and the first electrode layer is provided on a surface of the flat layer away from the flexible substrate;
  • the drain is connected to the first electrode through a first via hole in the flat layer; the driving electrode is connected to the peripheral electrode through a second via hole in the flat layer.
  • a method for manufacturing a flexible display panel includes a flexible substrate and a plurality of pixel islands arrayed on the flexible substrate, the pixel islands having a display area and surrounding areas.
  • the manufacturing method includes:
  • a first electrode layer of each pixel island is formed on the surface of each driving layer away from the flexible substrate; the first electrode layer includes a first electrode located in the display area and a peripheral electrode located in the peripheral area , The peripheral electrode surrounds the display area;
  • a light-emitting layer of each pixel island is formed on the surface of each of the first electrode layers away from the flexible substrate, and the light-emitting layer is intermittently arranged in an area facing the barrier structure and an area located within the predetermined distance range ;
  • a second electrode layer of each pixel island is formed on the surface of each light-emitting layer away from the flexible substrate.
  • the barrier structure is a ring-shaped rib, and the height of the rib is greater than the thickness of the light-emitting layer; the light-emitting layer is directly facing the barrier structure.
  • the light-emitting layer is located in an area of the convex edge away from the surface of the first electrode layer; or
  • the blocking structure is an annular groove, and the depth of the groove is greater than the thickness of the light-emitting layer; the area of the light-emitting layer facing the blocking structure is the area where the light-emitting layer is located on the bottom surface of the groove.
  • the blocking structure is a ring-shaped ridge made of conductive material
  • the second electrode layer is located in an area of the ridge away from the surface of the first electrode layer and located at The regions within the preset interval are intermittently arranged, and the regions of the second electrode layer within the preset interval are in contact with the inner wall of the rib.
  • forming a barrier structure surrounding the display area on the surface of the peripheral electrode away from the flexible substrate includes:
  • a second conductive layer is formed on the surface of the first conductive layer away from the flexible substrate, and an area of the second electrode layer located within the predetermined distance range is in contact with the inner wall of the second conductive layer.
  • the material of the first conductive layer and the peripheral electrode are both transparent conductive materials and are formed by a patterning process; the material of the second conductive layer is metal.
  • forming a barrier structure surrounding the display area on the surface of the peripheral electrode away from the flexible substrate further includes:
  • a protective layer is formed on the surface of the second conductive layer away from the flexible substrate.
  • a display device including the flexible display panel described in any one of the above.
  • FIG. 1 is a top view of a first embodiment of a flexible display panel of the present disclosure.
  • Fig. 2 is a cross-sectional view of the flexible display panel A-A in Fig. 1.
  • FIG 3 is a cross-sectional view of a second embodiment of a flexible display panel of the present disclosure.
  • FIG 4 is a cross-sectional view of the flexible display panel before forming the light-emitting layer in the second embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view of a third embodiment of a flexible display panel of the present disclosure.
  • Fig. 6 is a flowchart of an embodiment of the manufacturing method of the present disclosure.
  • FIG. 7 is a flowchart of step S130 in an embodiment of the manufacturing method of the present disclosure.
  • FIG. 8 is a schematic diagram after step S120 is completed in an embodiment of the manufacturing method of the present disclosure.
  • FIG. 9 is a schematic diagram after step S1310 is completed in an embodiment of the manufacturing method of the present disclosure.
  • FIG. 10 is a schematic diagram after step S1320 is completed in an embodiment of the manufacturing method of the present disclosure.
  • FIG. 11 is a schematic diagram after step S1330 is completed in an embodiment of the manufacturing method of the present disclosure.
  • FIG. 12 is a schematic diagram after completing step S160 in an embodiment of the manufacturing method of the present disclosure.
  • FIG. 13 is a schematic diagram after completing step S150 in an embodiment of the manufacturing method of the present disclosure.
  • the flexible display panel is a stretchable flexible display panel, which may include a flexible substrate 1 and a plurality of pixel islands S, each pixel island The S array is distributed on the flexible substrate 1.
  • Each pixel island S has a display area X and a peripheral area Y, and the peripheral area Y surrounds the display area X.
  • Each pixel island S includes a driving layer 2, a first electrode layer 3, a light emitting layer 4, and a second electrode layer 5 stacked in a direction away from the flexible substrate 1, wherein:
  • the first electrode layer 3 includes a first electrode 31 located in the display area X and a peripheral electrode 32 located in the peripheral area Y.
  • the peripheral electrode 32 surrounds the display area X, and the surface of the peripheral electrode 32 away from the flexible substrate 1 is provided with a surface surrounding the display area X.
  • the ring-shaped barrier structure 33 has a predetermined distance between the barrier structure 33 and the display area X; the area of the light emitting layer 4 facing the barrier structure 33 and the area of the light emitting layer 4 within the predetermined distance are intermittently arranged, that is, the light emitting layer 4 is The inside of the blocking structure 33 is broken.
  • the light-emitting layer 4 is intermittently arranged between the area of the blocking structure 33 and the area within the preset interval, the corrosion path of water and oxygen is blocked and the water and oxygen are prevented from being displayed in the Y direction of the peripheral area Area X is eroded, which helps to ensure the display effect. At the same time, it can avoid adding openings on the mask to form the disconnected light-emitting layer 4, thereby reducing the difficulty of design and manufacturing of the mask.
  • the flexible substrate 1 can be a flexible transparent material, such as PET (polyethylene terephthalate), PI (polyimide), etc., so that the flexible substrate 1 can be stretched. Of course, it can also be bent.
  • the shape and size of the flexible substrate 1 are not particularly limited.
  • the flexible substrate 1 may include a substrate, and a barrier layer and a buffer layer laminated on the flexible substrate 1 in sequence.
  • the flexible base 1 may also include only a substrate, or the flexible base 1 may include a substrate and one of a barrier layer and a buffer layer.
  • each pixel island S includes a driving layer 2, a first electrode layer 3, a light-emitting layer 4, and a second electrode layer 5 sequentially stacked on the flexible substrate 1.
  • a driving layer 2 For one pixel island S:
  • the driving layer 2 is provided on one side of the flexible substrate 1, and the driving layer 2 may include a thin film transistor, and the thin film transistor may be a top gate thin film transistor or a bottom gate thin film transistor for driving the light emitting layer 4 to emit light.
  • the driving layer 2 includes an active layer 21, a gate insulating layer 22, a gate 23, a dielectric layer 24, a source/drain layer and a driving electrode 27, in which:
  • the active layer 21 is located in the display area X, and its material may be polysilicon, amorphous silicon, etc., and the active layer 21 may include a channel region and two doped regions of different doping types located on both sides of the channel region.
  • the gate insulating layer 22 may cover the active layer 21, and the material of the gate insulating layer 22 is an insulating material such as silicon oxide.
  • the gate 23 is arranged on the surface of the gate insulating layer 22 away from the flexible substrate 1 and directly opposite to the active layer 21, that is, the projection of the gate 23 on the flexible substrate 1 is within the projection range of the active layer 21 on the flexible substrate 1.
  • the projection of the gate 23 on the flexible substrate 1 coincides with the projection of the channel region of the active layer 21 on the flexible substrate 1.
  • the dielectric layer 2 covers the gate 23 and the gate insulating layer 22.
  • the dielectric layer 24 may include an interlayer insulating layer 241 and an interlayer dielectric layer 242 that are sequentially stacked in a direction away from the flexible substrate, and the interlayer insulating layer 241 Both and the interlayer dielectric layer 242 are insulating materials, but the materials of the two can be different.
  • the dielectric layer 24 can also be a single-layer structure.
  • the source-drain layer is provided on the surface of the dielectric layer 24 away from the gate layer, and the source-drain layer includes a source electrode 25 and a drain electrode 26.
  • the source electrode 25 and the drain electrode 26 are directly opposite and connected to the active layer 21, for example, the source electrode
  • the drain 25 and the drain 26 are respectively connected to two doped regions of the corresponding active layer 21 through via holes.
  • the drain 26 and the first electrode 31 are connected through a via hole.
  • the driving electrode 27 is provided on the surface of the dielectric layer 24 away from the gate 23 and located in the peripheral area Y, and the driving electrode 27 is connected to the peripheral electrode 32 in the peripheral area Y. Further, the source and drain layers and the driving electrodes 27 are made of the same material, which is convenient to be formed through a patterning process.
  • the above-mentioned driving layer 2 may further include a flat layer 28.
  • the flat layer 28 may be an insulating material and cover the dielectric layer 24, the source and drain layers and the driving electrodes 27.
  • the surface of the flat layer 28 away from the flexible substrate 1 is a flat surface.
  • the plane is the surface of the driving layer 2 away from the flexible substrate 1.
  • the first electrode layer 3 is provided on the surface of the driving layer 2 away from the flexible substrate 1, for example, the first electrode layer 3 is provided on the surface of the flat layer 28 away from the flexible substrate 1.
  • the first electrode layer 3 includes a first electrode 31 and a peripheral electrode 32, wherein:
  • the first electrode 31 is located in the display area X and is connected to the source and drain layers of the driving layer 2. For example, the first electrode 31 is connected to the drain 26 through a first via hole in the flat layer 28.
  • the peripheral electrode 32 is located in the peripheral area Y surrounding the display area X. The peripheral electrode 32 surrounds the first electrode 31, and the peripheral electrode 32 is connected to the driving electrode 27. For example, the peripheral electrode 32 is connected to the driving electrode through the second via hole in the flat layer 28. The electrode 27 is connected.
  • the surface of the peripheral electrode 32 away from the flexible substrate 1 is provided with an annular barrier structure 33 surrounding the display area X, and there is a preset distance between the barrier structure 33 and the display area X, and the preset distance is the edge of the barrier structure 33 and the display area X
  • the distance between the upper positions close to the barrier structure 33 is greater than 0, so that the barrier structure 33 is not directly connected to the display area X, but is separated by the area of the peripheral electrode 32 within the preset interval.
  • the barrier structure 33 may be a rib or groove provided on the peripheral electrode 32.
  • the light-emitting layer 4 is discontinuous at the inner wall of the rib or the side wall of the groove, so that the light-emitting layer 4 is in the barrier structure 33 The inside is broken.
  • the blocking structure 33 may be a ridge protruding in a direction away from the flexible substrate 1, and the ridge may be a continuous or discontinuous ring structure.
  • the shape of the radial cross section can be rectangular, trapezoidal, etc., and the radial cross section is a cross section perpendicular to the flexible substrate 1.
  • the height of the ribs is greater than the thickness of the light-emitting layer 4; the area of the light-emitting layer facing the blocking structure 33 is the area where the light-emitting layer 4 is located on the surface of the ribs away from the first electrode layer 3.
  • the inner wall of the ribs has a certain slope on the surface of the first electrode layer 3 away from the flexible substrate 1.
  • the height of the ribs can be greater than the thickness of the light-emitting layer 4, so that the light-emitting layer 4 can be broken at the inner wall of the ribs, so that The light emitting layer 4 is discontinuous within the range of the preset interval.
  • the angle between the radial cross section of the inner wall of the rib and the surface of the first electrode layer 3 away from the flexible substrate 1 is not less than 90° and not more than 100°.
  • the thickness of the light-emitting layer 4 is less than 1 ⁇ m, and the height of the rib can be greater than 1 ⁇ m, which further ensures that the light-emitting layer 4 is disconnected on the inner wall of the rib.
  • the ribs can be conductive or insulating materials, and the ribs can be a single layer or a multilayer structure stacked in a direction away from the flexible substrate 1.
  • the ribs can be conductive material and include the first A conductive layer 331 and a second conductive layer 332, wherein:
  • the first conductive layer 331 is provided on the surface of the peripheral electrode 32 away from the flexible substrate 1.
  • the first conductive layer 331 and the peripheral electrode 32 are made of transparent conductive material, such as ITO, and the first conductive layer 331 and the periphery
  • the electrode 32 may be a one-piece structure, so that it may be formed through a single patterning process.
  • first conductive layer 331 may also be a conductive material different from the first electrode layer 3.
  • the second conductive layer 332 covers the surface of the first conductive layer 331 away from the flexible substrate 1, and may be a conductive material such as metal.
  • the second conductive layer 332 can be a metal material.
  • the ribs may further include a protective layer 333, which can cover the surface of the second conductive layer 332 away from the flexible substrate 1.
  • the material can be a conductive or insulating material.
  • 332 plays a protective role.
  • the protective layer 333 and the first conductive layer 331 may both use transparent conductive materials such as ITO.
  • the blocking structure 33 is a groove recessed toward the flexible substrate 1, the groove surrounds the display area X, and the depth of the groove
  • the thickness of the light-emitting layer 4 can be greater than the thickness of the light-emitting layer 4, and the area of the light-emitting layer 4 facing the barrier structure 33 is the area where the light-emitting layer 4 is located on the bottom surface of the groove, so that the light-emitting layer 4 can be broken at the sidewall of the groove, so that the light-emitting layer 4
  • the side walls of the groove are discontinuous.
  • the peripheral electrode 32 is recessed in the groove, but the part inside the groove is connected to the part outside the groove without being disconnected, so as to ensure a smooth circuit.
  • Each pixel island S may include a plurality of pixels.
  • the pixel island S further includes a pixel defining layer 6, which is arranged in the display area X and has a plurality of pixels.
  • the hollowed-out pixel area defines a plurality of pixels, and each pixel is within a range surrounded by the blocking structure 33.
  • the light-emitting layer 4 can cover the surface of the first electrode layer 3 away from the flexible substrate 1, and the area of the light-emitting layer facing the blocking structure 33 is intermittently disposed in the area within the predetermined distance range.
  • the barrier structure 33 as the above rib as an example, as shown in FIG. 2, the thickness of the light-emitting layer 4 is less than the height of the rib. Therefore, due to the existence of the rib, the light-emitting layer 4 cannot cover the protrusion when the light-emitting layer 4 is formed.
  • the inner wall of the rib is disconnected at the inner wall of the convex rib, that is, it is interrupted inside the blocking structure 33, blocking the path of water and oxygen erosion.
  • the light-emitting layer 4 may include electro-organic light-emitting materials, which may be formed by processes such as evaporation.
  • the light-emitting layer 4 may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer sequentially stacked on the first electrode layer 3. The specific light-emitting principle will not be described in detail here. .
  • the second electrode layer 5 can cover the surface of the light-emitting layer 4 away from the flexible substrate 1, and the second electrode layer 5 is connected to the peripheral electrode 32.
  • the blocking structure 33 is the above-mentioned rib.
  • the area of the second electrode layer 5 located within the preset interval is in contact with the second conductive layer 332 of the rib, thereby contacting the inner wall of the rib.
  • the second electrode layer 5 can also extend to the peripheral area Y and pass through the via hole and the peripheral electrode. 32 connection, the via is located within the range of the preset pitch, and is located on the side of the discontinuous area of the light emitting layer 4 close to the display area X.
  • the second electrode layer 5 can be used as a cathode, and the first electrode 31 of the first electrode layer 3 can be used as an anode, and the light emitting layer 4 can be driven to emit light by applying a signal to the first electrode 31.
  • each pixel island S the first electrode layer 3 of each pixel island S belongs to a conductive layer formed by a patterning process, and a plurality of trenches 100 may be opened in the conductive layer, and the trenches 100 are recessed into the driving layer 2 For example, the trench 100 exposes the dielectric layer 24 in the depth direction.
  • the depth of the trench 100 can also be greater, for example, the flexible substrate 1 is exposed.
  • Each trench 100 may be distributed in a crisscross pattern, thereby dividing a plurality of pixel islands S.
  • the trench 100 may be opened after the barrier structure 33 is formed and before the light-emitting layer 4 is formed. Therefore, after the light-emitting layer 4 and the second electrode layer 5 are formed, the light-emitting layer 4 and the second electrode layer 5 can be laminated on the bottom surface of the trench 100.
  • the flexible display panel of the embodiment of the present disclosure may further include an encapsulation layer 7.
  • the encapsulation layer 7 simultaneously covers the second electrode layer 5 of each pixel island S away from the surface of the flexible substrate 1 and extends To the inside of the trench 100 and cover the inner surface of the trench 100, the encapsulation layer 7 plays a role of isolation and protection, and because the light-emitting layer 4 is intermittently arranged in the area within the preset distance range and the area facing the barrier structure 33 , The path of water and oxygen erosion has been blocked, even if the packaging layer 7 in the trench 100 is broken due to stretching, the display effect can still be guaranteed.
  • the encapsulation layer 7 can be a single-layer or multi-layer structure, which is not specifically limited here.
  • the embodiments of the present disclosure also provide a method for manufacturing a flexible display panel.
  • the flexible display panel includes a flexible substrate and a plurality of pixel islands arrayed on the flexible substrate. Each pixel island has a display area and a peripheral area surrounding the display area.
  • the specific structure of the flexible display panel can refer to the flexible display panel of any of the above embodiments.
  • the manufacturing method of the embodiment of the present disclosure includes:
  • Step S110 forming a driving layer of each pixel island on one side of the flexible substrate
  • Step S120 forming a first electrode layer of each pixel island on the surface of each driving layer away from the flexible substrate.
  • the first electrode layer includes a first electrode located in the display area and a first electrode located in the peripheral area.
  • the peripheral electrode, the peripheral electrode surrounds the display area;
  • Step S130 forming a barrier structure surrounding the display area on the surface of each peripheral electrode away from the flexible substrate, and the barrier structure has a preset distance from the display area;
  • Step S140 forming a light-emitting layer of each pixel island on the surface of each first electrode layer away from the flexible substrate, where the light-emitting layer is facing the barrier structure and is located within the preset distance range.
  • Step S150 forming a second electrode layer of each pixel island on the surface of each light emitting layer away from the flexible substrate.
  • the manufacturing method of the embodiment of the present disclosure as shown in FIGS. 1 to 5, because the light emitting layer 4 is intermittently arranged in the area facing the barrier structure 33 and the area located within the preset interval, that is, the light emitting layer 4 is interrupted inside the barrier structure 33. Open, so as to block the corrosion path of water and oxygen, prevent the water and oxygen from corroding from the peripheral area Y to the display area X, which is beneficial to ensure the display effect. At the same time, it can avoid adding openings on the mask to form a disconnected light-emitting layer, thereby reducing the design and manufacturing difficulty of the mask.
  • step S110 a driving layer of each pixel island is formed on one side of the flexible substrate.
  • the flexible substrate 1 may be a flexible transparent material, such as PET (polyethylene terephthalate), PI (polyimide), etc., so that the flexible substrate 1 can be stretched. Of course, it can also be bent.
  • the shape and size of the flexible substrate 1 are not particularly limited.
  • the flexible base 1 may include a substrate, and a barrier layer and a buffer layer sequentially stacked on the flexible base 1.
  • the flexible base 1 may also include only a substrate, or the flexible base 1 may include a substrate and one of a barrier layer and a buffer layer.
  • the driving layer 2 may include a thin film transistor, which may be a top gate thin film transistor or a bottom gate thin film transistor, and the thin film transistor is used to drive the light emitting layer 4 to emit light.
  • the driving layer 2 includes an active layer 21, a gate insulating layer 22, a gate 23, a dielectric layer 24, a source and drain layer, and a driving electrode 27, and each pixel island is formed on one side of the flexible substrate 1.
  • the driving layer 2 of S, step S110 includes step S1110-step S1160, where:
  • Step S1110 forming an active layer of each pixel island on one side of the flexible substrate.
  • Step S1120 forming a gate insulating layer covering each of the active layers
  • Step S1130 forming the gate of each pixel island on the surface of the gate insulating layer away from the flexible substrate;
  • Step S1140 forming a dielectric layer covering each of the gate and the gate insulating layer.
  • Step S1150 forming a source and drain layer of each pixel island on the surface of the dielectric layer away from the gate, the source and drain layer includes a source and a drain connected to the active layer, and The drain and the first electrode are connected through a via hole.
  • Step S1160 forming a driving electrode on the surface of the dielectric layer away from the gate, the driving electrode is located in the peripheral area and connected to the peripheral electrode.
  • a first electrode layer of the pixel island is formed on the surface of each driving layer away from the flexible substrate.
  • the first electrode layer includes a first electrode located in the display area and a first electrode located in the display area.
  • the peripheral electrode of the peripheral area, the peripheral electrode surrounds the display area.
  • the first electrode layer 3 can be formed on the surface of the flexible substrate 1 by a masking process.
  • an electrode metal layer can be deposited on the surface of the flexible substrate 1, and the electrode metal layer can be patterned by a masking process.
  • the first electrode layer 3 is obtained.
  • the structure of the first electrode layer 3 can refer to the first electrode layer 3 in the above implementation of the flexible display panel, which will not be repeated here.
  • step S130 a barrier structure surrounding the display area is formed on the surface of each peripheral electrode away from the flexible substrate, and the barrier structure has a predetermined distance from the display area.
  • the blocking structure 33 may be a ring-shaped rib or groove provided on the peripheral electrode 32.
  • the barrier structure 33 is a rib of conductive material, and the rib may be a single layer or a multilayer structure stacked in a direction away from the flexible substrate 1.
  • step S130 Including step S1310 and step S1320, where:
  • Step S1310 forming a first conductive layer surrounding the display area on the surface of the peripheral electrode away from the flexible substrate.
  • the first conductive layer 331 is provided on the surface of the peripheral electrode 32 away from the flexible substrate 1, and in order to simplify the process, the first conductive layer 331 and the peripheral electrode 32 are made of the same transparent conductive material.
  • the first conductive layer 311 can be obtained by etching a partial area of the peripheral electrode 32, and the unetched area of the peripheral electrode 32 is the first conductive layer 331.
  • the first conductive layer 331 may also be a conductive material different from the peripheral electrode 32.
  • Step S1320 forming a second conductive layer on the surface of the first conductive layer away from the flexible substrate, and an area of the second electrode layer located within the predetermined distance range is in contact with the inner wall of the second conductive layer.
  • the second conductive layer 332 covers the surface of the first conductive layer 331 away from the flexible substrate 1, and may be a conductive material such as metal.
  • the second conductive layer 332 can be a metal material.
  • the thickness of the transparent conductive material is limited. The large rib height helps to ensure that the light-emitting layer 4 is disconnected at the inner wall of the rib.
  • step S130 may further include:
  • Step S1330 forming a protective layer on the surface of the second conductive layer away from the flexible substrate.
  • the material of the protective layer 333 can be a conductive or insulating material to protect the second conductive layer 332.
  • the protective layer 333 and the first conductive layer 331 can be made of transparent conductive materials such as ITO.
  • Step S140 forming a light-emitting layer of each pixel island on the surface of each first electrode layer away from the flexible substrate, where the light-emitting layer is facing the barrier structure and is located within the preset distance range. Intermittent regional settings.
  • the light-emitting layer 4 may include an electro-organic light-emitting material, which may be formed by evaporation and other processes.
  • the light-emitting layer 4 can be interrupted within a preset interval. , Thereby blocking the path of water and oxygen erosion.
  • the blocking structure 33 is the above-mentioned rib or groove, so that there is a height difference on the peripheral electrode 32, and the light-emitting layer 4 is disconnected because it cannot be formed on the inner wall of the rib or the side wall of the groove.
  • Step S150 forming a second electrode layer of each pixel island on the surface of each light emitting layer away from the flexible substrate.
  • the second electrode layer 5 can cover the surface of the light-emitting layer 4 away from the flexible substrate 1, and the second electrode layer 5 is connected to the peripheral electrode 32.
  • the second electrode layer 5 is located within the aforementioned preset distance range. The area of is in contact with the second conductive layer 332 of the rib, that is, is in contact with the inner wall of the rib, and thus is connected to the peripheral electrode 32.
  • the second electrode layer 5 can also extend to the peripheral area Y, and be connected to the peripheral electrode 32 through a via hole, which is located within a predetermined interval. And it is located on the side of the discontinuous area of the light emitting layer 4 close to the display area X.
  • the second electrode layer 5 can be used as a cathode, and the first electrode 31 of the first electrode layer 3 can be used as an anode, and the light emitting layer 4 can be driven to emit light by applying a signal to the first electrode 31.
  • the manufacturing method of the embodiment of the present disclosure may further include:
  • step S160 a plurality of trenches recessed into the driving layer are opened in the first electrode layer to divide each of the pixel islands.
  • the trench 100 can be formed by a wet or dry etching process, and the trench 100 is recessed into the driving layer 2.
  • the trench 100 exposes the dielectric layer 224 along the depth direction.
  • the depth of 100 can also be greater, for example, the flexible substrate 1 is exposed.
  • Each trench 100 may be distributed in a crisscross pattern, thereby dividing a plurality of pixel islands S.
  • the trench 100 can be opened after the formation of the first electrode layer 3 and before the formation of the light-emitting layer 4. Therefore, after the light-emitting layer 4 and the second electrode layer 5 of each pixel island S are formed, the light-emitting layer 4 and the second electrode layer 5 can be It is laminated on the bottom surface of the trench 100.
  • the manufacturing method of the embodiment of the present disclosure may further include:
  • Step S170 forming a pixel defining layer of each pixel island on a surface of each of the first electrodes away from the flexible substrate, the pixel defining layer having a plurality of hollowed out pixel regions.
  • Step S170 can be performed before step S160.
  • Step S180 forming an encapsulation layer on the surface of each of the second electrode layers away from the flexible substrate.
  • the encapsulation layer 7 covers the surface of the second electrode layer 5 away from the flexible substrate 1, and extends into the trench 100, and covers the inner surface of the trench 100, so that the encapsulation layer 7 acts as isolation Because the light-emitting layer 4 is intermittently arranged within the preset interval, the path of water and oxygen erosion has been blocked. Even if the packaging layer 7 in the trench 100 is broken due to stretching, the display effect can still be guaranteed.
  • the encapsulation layer 7 can be a single-layer or multi-layer structure, which is not specifically limited here.
  • the embodiments of the present disclosure also provide a display device, which may include the flexible display panel of any of the foregoing embodiments.
  • the display device can be used in electronic devices such as mobile phones, watches, tablet computers, etc., which will not be listed here.
  • the beneficial effects of the display device can refer to the beneficial effects of the flexible display panel in the above-mentioned embodiments, which will not be detailed here.
  • the flexible display panel and the manufacturing method thereof of the present disclosure since the surface of the peripheral electrode of each pixel island away from the flexible substrate is provided with a barrier structure surrounding the display area, the barrier structure and the display area have a preset distance, and the light emitting layer is facing
  • the area of the barrier structure is intermittently arranged with the area within the preset interval, that is, the light-emitting layer is disconnected inside the barrier structure, thereby blocking the erosion path of water and oxygen, preventing water and oxygen from corroding from the peripheral area to the display area, which is beneficial to ensure the display effect.
  • it can avoid adding openings on the mask to form a disconnected light-emitting layer, thereby reducing the design and manufacturing difficulty of the mask.

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Abstract

本公开提供一种显示装置、柔性显示面板及其制造方法，涉及显示技术领域。该柔性显示面板包括柔性基底和阵列分布于柔性基底上的多个像素岛；像素岛具有显示区和围绕显示区的外围区，且每个像素岛包括依次层叠于柔性基底上的驱动层、第一电极层、发光层和第二电极层；第一电极层包括位于显示区的第一电极和位于外围区的外围电极，外围电极围绕显示区，且外围电极远离柔性基底的表面设有围绕显示区的阻挡结构，阻挡结构与显示区间具有预设间距；发光层正对于阻挡结构的区域与位于预设间距范围内的区域间断设置。 (图2)

Description

显示装置、柔性显示面板及其制造方法
相关申请的交叉引用
本申请要求于2019年5月23日递交的中国专利申请第201910435464.8号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及显示技术领域，具体而言，涉及一种显示装置、柔性显示面板及柔性显示面板的制造方法。
背景技术
目前，柔性显示面板获得了广泛的关注，其中，可拉伸的柔性显示面板正在获得越来越广泛的关注，现有可拉伸的柔性显示面板一般是通过开设镂空区域，分割出多个显示单元，由于镂空区域的存在，使得柔性显示面板可被拉伸变形。但是，外界的水氧会由镂空区域向显示区域侵蚀，从而影响显示效果。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。
发明内容
本公开的目的在于提供一种显示装置、柔性显示面板及柔性显示面板的制造方法。
根据本公开的一个方面，提供一种柔性显示面板，包括柔性基底和阵列分布于所述柔性基底上的多个像素岛；所述像素岛具有显示区和围绕所述显示区的外围区，且每个所述像素岛包括依次层叠于所述柔性基底上的驱动层、第一电极层、发光层和第二电极层；
所述第一电极层包括位于所述显示区的第一电极和位于所述外围区的外围电极，所述外围电极围绕所述显示区，且所述外围电极远离所述柔性基底的表面设有围绕所述显示区的阻挡结构，所述阻挡结构与所述显示区间具有预设间距；所述发光层正对于所述阻挡结构的区域与位于所述预设间距范围内的区域间断设置。
在本公开的一种示例性实施例中，所述阻挡结构为环形的凸棱，所述凸棱的高度大于所述发光层的厚度；所述发光层正对于所述阻挡结构的区域为所述发光层位于所述凸棱远离所述第一电极层的表面的区域；或者
所述阻挡结构为环形的凹槽，所述凹槽的深度大于所述发光层的厚度；所述发光层正对于所述阻挡结构的区域为所述发光层位于所述凹槽底面的区域。
在本公开的一种示例性实施例中，所述阻挡结构为环形的导电材质的凸棱，所述第二电极层位于所述凸棱远离所述第一电极层的表面的区域与位于所述预设间距范围内的区域间断设置，且所述第二电极层位于所述预设间距范围内的区域与所述凸棱的内壁接触。
在本公开的一种示例性实施例中，所述凸棱包括：
第一导电层，设于所述外围电极远离所述柔性基底的表面且围绕所述显示区；
第二导电层，设于所述第一导电层远离所述柔性基底的表面，所述第二电极层位于所述预设间距范围内的区域与所述第二导电层的内壁接触。
在本公开的一种示例性实施例中，所述第一导电层和所述外围电极为透明导电材质的一体式结构；所述第二导电层为金属材质。
在本公开的一种示例性实施例中，所述凸棱还包括：
保护层，设于所述第二导电层远离所述柔性基底的表面。
在本公开的一种示例性实施例中，所述凸棱内的垂直于所述柔性基底的截面与所述第一电极层远离所述柔性基底的表面的夹角不小于90°，且不大于100°。
在本公开的一种示例性实施例中，所述驱动层包括：
有源层，设于所述柔性基底上，且位于所述显示区；
栅绝缘层，覆盖所述有源层和所述柔性基底；
栅极，设于所述栅绝缘层远离所述柔性基底的表面，且与所述有源层正对；
介电层，覆盖所述栅极和所述栅绝缘层；
源漏层，设于所述介电层远离所述栅极的表面，所述源漏层包括与所述有源层连接的源极和漏极；
驱动电极，设于所述介电层远离所述栅极的表面，且位于所述外围区；
平坦层，覆盖所述介电层、所述源漏层和所述驱动电极，所述第一电极层设于所述平坦层远离所述柔性基底的表面；
所述漏极通过所述平坦层内的第一过孔与所述第一电极连接；所述驱动电极通过所述平坦层内的第二过孔与所述外围电极连接。
根据本公开的一个方面，提供一种柔性显示面板的制造方法，所述柔性显示面板包括柔性基底和阵列分布于所述柔性基底上的多个像素岛，所述像素岛具有显示区和围绕所述显示区的外围区，所述制造方法包括：
在柔性基底的一侧形成各所述像素岛的驱动层；
在各所述驱动层远离所述柔性基底的表面形成各所述像素岛的第一电极层；所述第一电极层包括位于所述显示区的第一电极和位于所述外围区的外围电极，所述外围电极围绕所述显示区；
在各所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，所述阻挡结构与所述显示区间具有预设间距；
在各所述第一电极层远离所述柔性基底的表面形成各所述像素岛的发光层，所述发光层正对于所述阻挡结构的区域与位于所述预设间距范围内的区域间断设置；
在各所述发光层远离所述柔性基底的表面形成各所述像素岛的第二电极层。
在本公开的一种示例性实施例中，所述阻挡结构为环形的凸棱，所述凸棱的高度大于 所述发光层的厚度；所述发光层正对于所述阻挡结构的区域为所述发光层位于所述凸棱远离所述第一电极层的表面的区域；或者
所述阻挡结构为环形的凹槽，所述凹槽的深度大于所述发光层的厚度；所述发光层正对于所述阻挡结构的区域为所述发光层位于所述凹槽底面的区域。
在本公开的一种示例性实施例中，所述阻挡结构为环形的导电材质的凸棱，所述第二电极层位于所述凸棱远离所述第一电极层的表面的区域与位于所述预设间距范围内的区域间断设置，且所述第二电极层位于所述预设间距范围内的区域与所述凸棱的内壁接触。
在本公开的一种示例性实施例中，在所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，包括：
在所述外围电极远离所述柔性基底的表面形成围绕所述显示区的第一导电层；
在所述第一导电层远离所述柔性基底的表面形成第二导电层，所述第二电极层位于所述预设间距范围内的区域与所述第二导电层的内壁接触。
在本公开的一种示例性实施例中，所述第一导电层的材料和所述外围电极均为透明导电材料，且通过一次构图工艺形成；所述第二导电层的材料为金属。
在本公开的一种示例性实施例中，在所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，还包括：
在所述第二导电层远离所述柔性基底的表面形成保护层。
根据本公开的一个方面，提供一种显示装置，包括上述任意一项所述的柔性显示面板。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开柔性显示面板第一实施方式的俯视图。
图2为图1中柔性显示面板的A-A剖视图。
图3为本公开柔性显示面板第二实施方式的剖视图。
图4为本公开柔性显示面板第二实施方式中形成发光层前的剖视图。
图5为本公开柔性显示面板第三实施方式的剖视图。
图6为本公开制造方法一实施方式的流程图。
图7为本公开制造方法一实施方式中步骤S130的流程图。
图8为本公开制造方法一实施方式中完成步骤S120后的示意图。
图9为本公开制造方法一实施方式中完成步骤S1310后的示意图。
图10为本公开制造方法一实施方式中完成步骤S1320后的示意图。
图11为本公开制造方法一实施方式中完成步骤S1330后的示意图。
图12为本公开制造方法一实施方式中完成步骤S160后的示意图。
图13为本公开制造方法一实施方式中完成步骤S150后的示意图。
附图标记说明：1、柔性基底；S、像素岛；X、显示区；Y外围区；2、驱动层；21、有源层；22、栅绝缘层；23、栅极；24、介电层；241、层间绝缘层；242、层间介质层；25、源极；26、漏极；27、驱动电极；28、平坦层；3、第一电极层；31、第一电极；32、外围电极；33、阻挡结构；331、第一导电层；332、第二导电层；333、保护层；4、发光层；5、第二电极层；6、像素界定层；7、封装层；100、沟槽。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本公开将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。此外，附图仅为本公开的示意性图解，并非一定是按比例绘制。
虽然本说明书中使用相对性的用语，例如“上”“下”来描述图标的一个组件对于另一组件的相对关系，但是这些术语用于本说明书中仅出于方便，例如根据附图中所述的示例的方向。能理解的是，如果将图标的装置翻转使其上下颠倒，则所叙述在“上”的组件将会成为在“下”的组件。当某结构在其它结构“上”时，有可能是指某结构一体形成于其它结构上，或指某结构“直接”设置在其它结构上，或指某结构通过另一结构“间接”设置在其它结构上。
用语“一个”、“一”、“该”、“所述”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等；用语“第一”、“第二”等仅作为标记使用，不是对其对象的数量限制。
本公开实施方式提供了一种柔性显示面板，如图1-图5所示，该柔性显示面板为可拉伸的柔性显示面板，其可包括柔性基底1和多个像素岛S，各个像素岛S阵列分布于柔性基底1上。每个像素岛S具有显示区X和外围区Y，外围区Y围绕于显示区X外。每个像素岛S包括向远离柔性基底1的方向依次层叠的驱动层2、第一电极层3、发光层4和第二电极层5，其中：
第一电极层3包括位于显示区X的第一电极31和位于外围区Y的外围电极32，外围电极32围绕显示区X，且外围电极32远离柔性基底1的表面设有围绕显示区X的环形的阻挡结构33，阻挡结构33与显示区X间具有预设间距；发光层4正对于阻挡结构33的区域与发光层4位于该预设间距范围内的区域间断设置，即发光层4在该阻挡结构33内 侧断开。
本公开实施方式的柔性显示面板，由于发光层4正对于阻挡结构33的区域与位于预设间距范围内的区域间断设置，从而阻断水氧的侵蚀路径，防止水氧由外围区Y向显示区X侵蚀，有利于保证显示效果。同时，可避免在掩膜版上增设开孔，来形成断开的发光层4，从而降低掩膜版的设计和制造难度。
下面对本公开实施方式柔性显示面板的各部分进行详细说明：
如图2-图5所示，柔性基底1可为柔性的透明材料，例如PET(聚对苯二甲酸乙二醇酯)、PI(聚酰亚胺)等，使得柔性基底1可拉伸，当然，也可弯折。柔性基底1的形状和尺寸在不做特殊限定。举例而言，柔性基底1可包括衬底以及依次层叠与柔性基底1上的阻挡层和缓冲层。当然，柔性基底1也可以仅包括衬底，或者柔性基底1包括衬底，还包括阻挡层和缓冲层之一。
如图1-图5所示，多个像素岛S阵列分布于柔性基底1上，相邻的像素岛S间隔设置，举例而言，各个像素岛S可由多个纵横交错的沟槽100分隔而成。每个像素岛S均包括依次层叠于柔性基底1上的驱动层2、第一电极层3、发光层4和第二电极层5，对于一个像素岛S而言：
驱动层2设于柔性基底1一侧，且驱动层2可包括薄膜晶体管，该薄膜晶体管可为顶栅薄膜晶体管或者底栅薄膜晶体管，用于驱动发光层4发光。如图2-图5所示，以顶栅薄膜晶体管为例，驱动层2包括有源层21、栅绝缘层22、栅极23、介电层24、源漏层和驱动电极27，其中：
有源层21位于显示区X，其材料可以是多晶硅、非晶硅等，且有源层21可包括沟道区和位于沟道区两侧的两个不同掺杂类型的掺杂区。
栅绝缘层22可覆盖有源层21，栅绝缘层22的材料为氧化硅等绝缘材料。
栅极23设于栅绝缘层22远离柔性基底1的表面，且与有源层21正对，即栅极23在柔性基底1上的投影位于有源层21在柔性基底1的投影范围内，例如，栅极23在柔性基底1上的投影与有源层21的沟道区在柔性基底1的投影重合。
介电层2覆盖栅极23和栅绝缘层22，举例而言，介电层24可包括向远离柔性基底的方向依次层叠的层间绝缘层241和层间介质层242，层间绝缘层241和层间介质层242均为绝缘材料，但二者的材料可以不同。当然，介电层24也可为单层结构。
源漏层设于介电层24远离栅极层的表面，且源漏层包括源极25和漏极26，源极25和漏极26与有源层21正对并连接，例如，源极25和漏极26分别通过过孔与对应的有源层21的两个掺杂区连接。同时，漏极26与第一电极31通过过孔连接。
驱动电极27设于介电层24远离栅极23的表面，且位于外围区Y，且驱动电极27与外围区Y内的外围电极32连接。进一步的，源漏层和驱动电极27的材料相同，便于通过一次构图工艺形成。
此外，上述的驱动层2还可以包括平坦层28，平坦层28可为绝缘材料，且覆盖介电 层24、源漏层和驱动电极27，平坦层28远离柔性基底1的表面为平面，该平面为驱动层2远离柔性基底1的表面。
如图2-图5所示，第一电极层3设于驱动层2远离柔性基底1的表面，例如，第一电极层3设于平坦层28远离柔性基底1的表面。第一电极层3包括第一电极31和外围电极32，其中：
第一电极31位于显示区X，并与驱动层2的源漏层连接，例如，第一电极31通过平坦层28内的第一过孔与漏极26连接。外围电极32位于围绕该显示区X的外围区Y，外围电极32围绕第一电极31，且外围电极32与驱动电极27连接，例如，外围电极32通过平坦层28内的第二过孔与驱动电极27连接。
外围电极32远离柔性基底1的表面设有围绕显示区X的环形的阻挡结构33，且阻挡结构33与显示区X间具有预设间距，该预设间距为阻挡结构33与显示区X的边缘上靠近阻挡结构33的位置之间的距离，该预设间距大于0，使得阻挡结构33与显示区X不直接相接，而被外围电极32在预设间距范围内的区域隔开。
阻挡结构33可为设于外围电极32的凸棱或凹槽，在形成发光层4时，发光层4在凸棱的内壁或凹槽的侧壁处间断，使得发光层4在阻挡结构33的内侧断开。
在本公开柔性显示面板的第一实施方式中，如图2所示，阻挡结构33可为向远离柔性基底1的方向隆起的凸棱，该凸棱可为连续或间断的环状结构，其径向截面的形状可为矩形、梯形等，径向截面为垂直于柔性基底1的截面。凸棱的高度大于发光层4的厚度；发光层正对于阻挡结构33的区域为发光层4位于凸棱远离第一电极层3的表面的区域。
凸棱的内壁在第一电极层3远离柔性基底1的表面上呈一定的坡度，凸棱的高度可大于发光层4的厚度，从而使发光层4可在凸棱的内壁处断开，使得发光层4在该预设间距的范围内间断。例如，凸棱的内壁的径向截面与第一电极层3远离柔性基底1的表面的夹角不小于90°，且不大于100°。同时，发光层4的厚度小于1μm，凸棱的高度可大于1μm，进一步保证发光层4在凸棱的内壁断开。
凸棱可为导电或绝缘材质，且凸棱可为单层或沿远离柔性基底1的方向层叠的多层结构，举例而言，如图2所示，凸棱可为导电材质，且包括第一导电层331和第二导电层332，其中：
第一导电层331设于外围电极32远离柔性基底1的表面，且为了简化工艺，第一导电层331和外围电极32均为透明导电材质，例如ITO等材料，且第一导电层331和外围电极32可为一体式结构，从而可通过一次构图工艺形成。
当然，第一导电层331也可以是不同于第一电极层3的导电材料。
第二导电层332覆盖于第一导电层331远离柔性基底1的表面，并可为金属等导电材质。第二导电层332可为金属材料，在第一导电层331与外围电极32为透明导电材质的一体结构时，由于透明导电材料的成膜厚度有限，第二导电层332采用金属材料可进一步增大凸棱高度，有利于保证发光层4在凸棱的内壁处断开。
进一步的，如图2所示，凸棱还可包括保护层333，保护层333可覆盖于第二导电层332远离柔性基底1的表面，其材料可为导电或绝缘材料，对第二导电层332起到保护作用，例如保护层333可与第一导电层331均采用ITO等透明导电材料。
在本公开柔性显示面板的第二实施方式中，如图3和图4所示，阻挡结构33为向靠近柔性基底1的方向凹陷的凹槽，凹槽围绕显示区X，且凹槽的深度可大于发光层4的厚度，发光层4正对于阻挡结构33的区域为发光层4位于凹槽底面的区域，从而使发光层4可在凹槽的侧壁处断开，使得发光层4在凹槽的侧壁间断。外围电极32凹入凹槽内，但在凹槽内的部分与凹槽外的部分连接而未断开，以保证电路通畅。
每个像素岛S可包括多个像素，为了限定出各个像素，如图1-图5所示，像素岛S还包括像素界定层6，像素界定层6设于显示区X，且具有多个镂空的像素区，以限定出多个像素，各个像素均为阻挡结构33所围绕的范围内。
发光层4可覆盖于第一电极层3远离柔性基底1的表面，且发光层正对于阻挡结构33的区域与位于上述预设间距范围内的区域间断设置。以阻挡结构33为上文中的凸棱为例，如图2所示，发光层4的厚度小于凸棱的高度，因而由于凸棱的存在，在形成发光层4时，发光层4无法覆盖凸棱的内壁，而在凸棱的内壁处断开，即在阻挡结构33内侧间断，阻断了水氧侵蚀的路径。
发光层4可包含电致有机发光材料，其可采用蒸镀等工艺形成。举例而言，发光层4可包括依次层叠于第一电极层3上的空穴注入层、空穴传输层、有机发光层、电子传输层和电子注入层，具体发光原理在此不再详述。
第二电极层5可覆盖于发光层4远离柔性基底1的表面，且第二电极层5与外围电极32连接，在一实施方式中，如图2所示，阻挡结构33为上述的凸棱，第二电极层5位于预设间距范围内的区域与凸棱的第二导电层332接触，从而与凸棱的内壁接触。当然，如图5所示，在本公开柔性显示面板的第三实施方式中，若凸棱33为绝缘材质，则第二电极层5也可延伸至外围区Y，并通过过孔与外围电极32连接，该过孔位于预设间距的范围内，且位于发光层4的间断区域靠近显示区X的一侧。
第二电极层5可作为阴极，第一电极层3的第一电极31可作为阳极，可通过向第一电极31施加信号驱动发光层4发光。
在形成各个像素岛S时，各个像素岛S的第一电极层3属于通过一次构图工艺形成的导电层，可在该导电层开设有多个沟槽100，沟槽100凹陷至驱动层2内，例如，沟槽100沿深度方向露出介电层24，当然，沟槽100的深度也可以更大，例如露出柔性基底1。各个沟槽100可纵横交错分布，从而分割出多个像素岛S。
如图2-图5所示，沟槽100可开设于阻挡结构33形成后，发光层4形成前，因而，在形成发光层4和第二电极层5后，发光层4和第二电极层5可层叠于沟槽100的底面。
此外，如图2-图5所示，本公开实施方式的柔性显示面板还可包括封装层7，封装层7同时覆盖各个像素岛S的第二电极层5远离柔性基底1的表面，且延伸至沟槽100内， 并覆盖沟槽100的内表面，从而通过封装层7起到隔离和保护作用，且由于发光层4在预设间距范围内的区域与正对于阻挡结构33的区域间断设置，已经阻断了水氧侵蚀的路径，即便沟槽100内的封装层7因为拉伸而破裂时，仍可保证显示效果。封装层7可为单层或多层结构，在此不做特殊限定。
本公开实施方式还提供一种柔性显示面板的制造方法，该柔性显示面板包括柔性基底和阵列分布于柔性基底上的多个像素岛，各像素岛具有显示区和围绕显示区的外围区，该柔性显示面板的具体结构可参考上述任意实施方式的柔性显示面板。
如图6所示，本公开实施方式的制造方法包括：
步骤S110、在柔性基底的一侧形成各所述像素岛的驱动层；
步骤S120、在各所述驱动层远离所述柔性基底的表面形成各所述像素岛的第一电极层，所述第一电极层包括位于所述显示区的第一电极和位于所述外围区的外围电极，所述外围电极围绕所述显示区；
步骤S130、在各所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，所述阻挡结构与所述显示区间具有预设间距；
步骤S140、在各所述第一电极层远离所述柔性基底的表面形成各所述像素岛的发光层，所述发光层正对于所述阻挡结构的区域与位于所述预设间距范围内的区域间断设置；
步骤S150、在各所述发光层远离所述柔性基底的表面形成各所述像素岛的第二电极层。
本公开实施方式的制造方法，如图1-图5所示，由于发光层4正对于阻挡结构33的区域与位于预设间距范围内的区域间断设置，即发光层4在阻挡结构33内侧断开，从而阻断水氧的侵蚀路径，防止水氧由外围区Y向显示区X侵蚀，有利于保证显示效果。同时，可避免在掩膜版上增设开孔，来形成断开的发光层，从而降低掩膜版的设计和制造难度。
下面对本公开实施方式制造方法的各步骤进行详细说明：
在步骤S110中，在柔性基底的一侧形成各所述像素岛的驱动层。
如图2和图8所示，柔性基底1可为柔性的透明材料，例如PET(聚对苯二甲酸乙二醇酯)、PI(聚酰亚胺)等，使得柔性基底1可拉伸，当然，也可弯折。柔性基底1的形状和尺寸在不做特殊限定。举例而言，柔性基底1可包括衬底以及依次层叠于柔性基底1上的阻挡层和缓冲层。当然，柔性基底1也可以仅包括衬底，或者柔性基底1包括衬底，还包括阻挡层和缓冲层之一。
如图2和图8所示，驱动层2可包括薄膜晶体管，该薄膜晶体管可为顶栅薄膜晶体管或者底栅薄膜晶体管，薄膜晶体管用于驱动发光层4发光。以顶栅薄膜晶体管为例，驱动层2包括有源层21、栅绝缘层22、栅极23、介电层24、源漏层和驱动电极27，在柔性基底1的一侧形成各像素岛S的驱动层2，即步骤S110，包括步骤S1110-步骤S1160，其中：
步骤S1110、在所述柔性基底一侧形成各所述像素岛的有源层。
步骤S1120、形成覆盖各所述有源层的栅绝缘层；
步骤S1130、在所述栅绝缘层远离所述柔性基底的表面形成各所述像素岛的栅极；
步骤S1140、形成覆盖各所述栅极和所述栅绝缘层的介电层。
步骤S1150、在所述介电层远离所述栅极的表面形成各所述像素岛的源漏层，所述源漏层包括与所述有源层连接的源极和漏极，且所述漏极与第一电极通过过孔连接。
步骤S1160、在所述介电层远离所述栅极的表面形成驱动电极，所述驱动电极位于所述外围区，且与所述外围电极连接。
如图2-图5和图8所示，柔性基底1和驱动层2的结构的细节已在上文柔性显示面板的实施方式中进行了说明，在此不再赘述。
在步骤S120中，在各所述驱动层远离所述柔性基底的表面形成个所述像素岛的第一电极层，所述第一电极层包括位于所述显示区的第一电极和位于所述外围区的外围电极，所述外围电极围绕所述显示区。
如图9所示，可通过掩膜工艺在柔性基底1的表面形成第一电极层3，例如，可在柔性基底1的表面沉积电极金属层，通过掩膜工艺对电极金属层进行图案化，得到第一电极层3。第一电极层3的结构可参考上文柔性显示面板的实施方式中的第一电极层3，在此不再赘述。
在步骤S130中，在各所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，所述阻挡结构与所述显示区间具有预设间距。
如图2-图5所示，阻挡结构33可为设于外围电极32的环形的凸棱或凹槽，在形成发光层4时，发光层4在凸棱的内壁或凹槽的内壁处断开，使得发光层4在该阻挡结构33内侧断开。在一实施方式中，如图2所示，阻挡结构33为导电材质的凸棱，凸棱可为单层或沿远离柔性基底1的方向层叠的多层结构，如图7所示，步骤S130包括步骤S1310和步骤S1320，其中：
步骤S1310、在所述外围电极远离所述柔性基底的表面形成围绕所述显示区的第一导电层。
如图9所示，第一导电层331设于外围电极32远离柔性基底1的表面，且为了简化工艺，第一导电层331和外围电极32均为相同的透明导电材质。可通过对外围电极32的局部区域进行刻蚀得到第一导电层311，外围电极32的未被刻蚀的区域即为第一导电层331。当然，第一导电层331也可以是不同于外围电极32的导电材料。
步骤S1320、在所述第一导电层远离所述柔性基底的表面形成第二导电层，所述第二电极层位于所述预设间距范围内的区域与所述第二导电层的内壁接触。
如图10所示，第二导电层332覆盖于第一导电层331远离柔性基底1的表面，并可为金属等导电材质。第二导电层332可为金属材料，在第一导电层331与外围电极32为透明导电材质的一体结构时，由于透明导电材料的成膜厚度有限，第二导电层332采用金 属材料可进一步增大凸棱高度，有利于保证发光层4在凸棱的内壁处断开。
此外，如图7所示，步骤S130还可包括：
步骤S1330、在所述第二导电层远离所述柔性基底的表面形成保护层。
如图11所示，保护层333的材料可为导电或绝缘材料，对第二导电层332起到保护作用，例如保护层333可与第一导电层331均采用ITO等透明导电材料。
步骤S140、在各所述第一电极层远离所述柔性基底的表面形成各所述像素岛的发光层，所述发光层正对于所述阻挡结构的区域与位于所述预设间距范围内的区域间断设置。
如图13所示，发光层4可包括电致有机发光材料，其可通过蒸镀等工艺形成，在形成过程中，由于阻挡结构33的存在，可使发光层4在预设间距范围内间断，从而阻断水氧侵蚀的路径。举例而言，阻挡结构33为上文中的凸棱或凹槽，使得外围电极32上存在高度差，发光层4因无法形成于凸棱的内壁或凹槽的侧壁而断开。
步骤S150、在各所述发光层远离所述柔性基底的表面形成各所述像素岛的第二电极层。
如图13所示，第二电极层5可覆盖于发光层4远离柔性基底1的表面，且第二电极层5与外围电极32连接，例如，第二电极层5位于上述预设间距范围内的区域与凸棱的第二导电层332接触，即与凸棱的内壁接触，从而与外围电极32连接。当然，如图5所示，若凸棱为绝缘材质，则第二电极层5也可延伸至外围区Y，并通过过孔与外围电极32连接，该过孔位于预设间距的范围内，且位于发光层4的间断区域靠近显示区X的一侧。
第二电极层5可作为阴极，第一电极层3的第一电极31可作为阳极，可通过向第一电极31施加信号驱动发光层4发光。
在步骤S130后，步骤S140前，本公开实施方式的制造方法还可包括：
步骤S160、在所述第一电极层开设有多个凹陷至所述驱动层内的沟槽，以划分出各所述像素岛。
如图12所示，可通过湿法或干法刻蚀工艺形成沟槽100，且沟槽100凹陷至驱动层2内，例如，沟槽100沿深度方向露出介电层224，当然，沟槽100的深度也可以更大，例如露出柔性基底1。各个沟槽100可纵横交错分布，从而分割出多个像素岛S。
沟槽100可开设于第一电极层3形成后，发光层4形成前，因而，在形成各个像素岛S的发光层4和第二电极层5后，发光层4和第二电极层5可层叠于沟槽100的底面。
为了限定出各个像素，在步骤S130后，在步骤S140前，本公开实施方式的制造方法还可包括：
步骤S170、在各所述第一电极远离柔性基底的表面形成各所述像素岛的像素界定层，所述像素界定层具有多个镂空的像素区。
步骤S170可先于步骤S160进行。
本公开实施方式的制造方法还可包括：
步骤S180、在各所述第二电极层远离所述柔性基底的表面形成封装层。
如图2-图5所示，封装层7覆盖第二电极层5远离柔性基底1的表面，且延伸至沟槽100内，并覆盖沟槽100的内表面，从而通过封装层7起到隔离和保护作用，且由于发光层4在预设间距范围内间断设置，已经阻断了水氧侵蚀的路径，即便沟槽100内的封装层7因为拉伸而破裂时，仍可保证显示效果。封装层7可为单层或多层结构，在此不做特殊限定。
此外，尽管在附图中以特定顺序描述了本公开中方法的各个步骤，但是，这并非要求或者暗示必须按照该特定顺序来执行这些步骤，或是必须执行全部所示的步骤才能实现期望的结果。附加的或备选的，可以省略某些步骤，将多个步骤合并为一个步骤执行，以及/或者将一个步骤分解为多个步骤执行等。
本公开实施方式还提供一种显示装置，该显示装置可包括上述任意实施方式的柔性显示面板。该显示装置可用于手机、手表、平板电脑等电子设备，在此不再一一列举。同时，该显示装置的有益效果可参考上述实施方式中柔性显示面板的有益效果，在此不再详述。
本公开的显示装置、柔性显示面板及其制造方法，由于每个像素岛的外围电极远离柔性基底的表面设有围绕显示区的阻挡结构，阻挡结构与显示区间具有预设间距，发光层正对于阻挡结构的区域与位于预设间距范围内的区域间断设置，即发光层在阻挡结构内侧断开，从而阻断水氧的侵蚀路径，防止水氧由外围区向显示区侵蚀，有利于保证显示效果。同时，可避免在掩膜版上增设开孔，来形成断开的发光层，从而降低掩膜版的设计和制造难度。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由所附的权利要求指出。

Claims (15)

  1. 一种柔性显示面板，包括柔性基底和阵列分布于所述柔性基底上的多个像素岛；所述像素岛具有显示区和围绕所述显示区的外围区，且每个所述像素岛包括依次层叠于所述柔性基底上的驱动层、第一电极层、发光层和第二电极层；
    所述第一电极层包括位于所述显示区的第一电极和位于所述外围区的外围电极，所述外围电极围绕所述显示区，且所述外围电极远离所述柔性基底的表面设有围绕所述显示区的阻挡结构，所述阻挡结构与所述显示区间具有预设间距；所述发光层位于所述阻挡结构范围内的区域与位于所述预设间距范围内的区域间断设置。
  2. 根据权利要求1所述的柔性显示面板，其中，所述阻挡结构为环形的凸棱，所述凸棱的高度大于所述发光层的厚度；所述发光层位于所述阻挡结构范围内的区域为所述发光层位于所述凸棱远离所述第一电极层的表面的区域；或者
    所述阻挡结构为环形的凹槽，所述凹槽的深度大于所述发光层的厚度；所述发光层位于所述阻挡结构范围内的区域为所述发光层位于所述凹槽底面的区域。
  3. 根据权利要求1所述的柔性显示面板，其中，所述阻挡结构为环形的导电材质的凸棱，所述第二电极层位于所述凸棱远离所述第一电极层的表面的区域与位于所述预设间距范围内的区域间断设置，且所述第二电极层位于所述预设间距范围内的区域与所述凸棱的内壁接触。
  4. 根据权利要求3所述的柔性显示面板，其中，所述凸棱包括：
    第一导电层，设于所述外围电极远离所述柔性基底的表面且围绕所述显示区；
    第二导电层，设于所述第一导电层远离所述柔性基底的表面，所述第二电极层位于所述预设间距范围内的区域与所述第二导电层的内壁接触。
  5. 根据权利要求4所述的柔性显示面板，其中，所述第一导电层和所述外围电极为透明导电材质的一体式结构；所述第二导电层为金属材质。
  6. 根据权利要求4所述的柔性显示面板，其中，所述凸棱还包括：
    保护层，设于所述第二导电层远离所述柔性基底的表面。
  7. 根据权利要求2所述的柔性显示面板，其特征在于，所述凸棱内的垂直于所述柔性基底的截面与所述第一电极层远离所述柔性基底的表面的夹角不小于90°，且不大于100°。
  8. 根据权利要求1-7任一项所述的柔性显示面板，其中，所述驱动层包括：
    有源层，设于所述柔性基底上，且位于所述显示区；
    栅绝缘层，覆盖所述有源层和所述柔性基底；
    栅极，设于所述栅绝缘层远离所述柔性基底的表面，且与所述有源层相对设置；
    介电层，覆盖所述栅极和所述栅绝缘层；
    源漏层，设于所述介电层远离所述栅极的表面，所述源漏层包括与所述有源层连接的源极和漏极；
    驱动电极，设于所述介电层远离所述栅极的表面，且位于所述外围区；
    平坦层，覆盖所述介电层、所述源漏层和所述驱动电极，所述第一电极层设于所述平坦层远离所述柔性基底的表面；
    所述漏极通过所述平坦层内的第一过孔与所述第一电极连接；所述驱动电极通过所述平坦层内的第二过孔与所述外围电极连接。
  9. 一种柔性显示面板的制造方法，所述柔性显示面板包括柔性基底和阵列分布于所述柔性基底上的多个像素岛，所述像素岛具有显示区和围绕所述显示区的外围区，所述制造方法包括：
    在柔性基底的一侧形成各所述像素岛的驱动层；
    在各所述驱动层远离所述柔性基底的表面形成各所述像素岛的第一电极层；所述第一电极层包括位于所述显示区的第一电极和位于所述外围区的外围电极，所述外围电极围绕所述显示区；
    在各所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，所述阻挡结构与所述显示区间具有预设间距；
    在各所述第一电极层远离所述柔性基底的表面形成各所述像素岛的发光层，所述发光层位于所述阻挡结构范围内的区域与位于所述预设间距范围内的区域间断设置；
    在各所述发光层远离所述柔性基底的表面形成各所述像素岛的第二电极层。
  10. 根据权利要求9所述的制造方法，其中，所述阻挡结构为环形的凸棱，所述凸棱的高度大于所述发光层的厚度；所述发光层位于所述阻挡结构范围内的区域为所述发光层位于所述凸棱远离所述第一电极层的表面的区域；或者
    所述阻挡结构为环形的凹槽，所述凹槽的深度大于所述发光层的厚度；所述发光层位于所述阻挡结构范围内的区域为所述发光层位于所述凹槽底面的区域。
  11. 根据权利要求9所述的制造方法，其中，所述阻挡结构为环形的导电材质的凸棱，所述第二电极层位于所述凸棱远离所述第一电极层的表面的区域与位于所述预设间距范围内的区域间断设置，且所述第二电极层位于所述预设间距范围内的区域与所述凸棱的内壁接触。
  12. 根据权利要求11所述的制造方法，其中，在所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，包括：
    在所述外围电极远离所述柔性基底的表面形成围绕所述显示区的第一导电层；
    在所述第一导电层远离所述柔性基底的表面形成第二导电层，所述第二电极层位于所述预设间距范围内的区域与所述第二导电层的内壁接触。
  13. 根据权利要求12所述的制造方法，其中，所述第一导电层的材料和所述外围电极均为透明导电材料，且通过一次构图工艺形成；所述第二导电层的材料为金属。
  14. 根据权利要求12所述的制造方法，其中，在所述外围电极远离所述柔性基底的表面形成围绕所述显示区的阻挡结构，还包括：
    在所述第二导电层远离所述柔性基底的表面形成保护层。
  15. 一种显示装置，其特征在于，包括权利要求1-8任一项所述的柔性显示面板。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115274790A (zh) * 2022-07-20 2022-11-01 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110112317B (zh) * 2019-05-23 2021-03-02 京东方科技集团股份有限公司 显示装置、柔性显示面板及其制造方法
CN110416435B (zh) * 2019-08-28 2022-01-14 武汉天马微电子有限公司 有机发光显示面板和显示装置
CN110649069B (zh) * 2019-09-02 2022-03-29 武汉华星光电半导体显示技术有限公司 显示面板及显示面板的制作方法
CN110491929B (zh) * 2019-09-05 2022-05-24 京东方科技集团股份有限公司 显示基板、制备方法及显示装置
CN111244322B (zh) * 2020-01-17 2022-04-26 京东方科技集团股份有限公司 显示基板及其制作方法、和显示装置
CN111564478B (zh) * 2020-05-19 2022-11-04 京东方科技集团股份有限公司 可拉伸显示基板及其制备方法、显示装置
CN116209311A (zh) * 2021-11-30 2023-06-02 京东方科技集团股份有限公司 显示基板和显示装置
CN114464754B (zh) * 2022-01-25 2023-05-12 武汉华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN115050787A (zh) * 2022-06-10 2022-09-13 云谷（固安）科技有限公司 显示面板、制作方法和显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170040395A1 (en) * 2014-10-21 2017-02-09 Samsung Display Co., Ltd. Organic light-emitting diode display
CN106887523A (zh) * 2015-11-20 2017-06-23 三星显示有限公司 有机发光显示器及其制造方法
CN108649054A (zh) * 2018-05-08 2018-10-12 京东方科技集团股份有限公司 显示基板及其制作方法和显示装置
US20180374907A1 (en) * 2016-06-01 2018-12-27 Samsung Display Co., Ltd. Display apparatus and method of fabricating the same
CN109427861A (zh) * 2017-09-04 2019-03-05 三星显示有限公司 显示装置及其制造方法
CN109742121A (zh) * 2019-01-10 2019-05-10 京东方科技集团股份有限公司 一种柔性基板及其制备方法、显示装置
CN110112317A (zh) * 2019-05-23 2019-08-09 京东方科技集团股份有限公司 显示装置、柔性显示面板及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10205122B2 (en) 2015-11-20 2019-02-12 Samsung Display Co., Ltd. Organic light-emitting display and method of manufacturing the same
EP3608964B1 (en) * 2018-08-08 2022-05-11 LG Display Co., Ltd. Stretchable display device
WO2020073226A1 (en) * 2018-10-10 2020-04-16 Boe Technology Group Co., Ltd. Display substrate, display apparatus, method of fabricating display substrate
CN209087845U (zh) 2019-01-10 2019-07-09 京东方科技集团股份有限公司 一种柔性基板及显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170040395A1 (en) * 2014-10-21 2017-02-09 Samsung Display Co., Ltd. Organic light-emitting diode display
CN106887523A (zh) * 2015-11-20 2017-06-23 三星显示有限公司 有机发光显示器及其制造方法
US20180374907A1 (en) * 2016-06-01 2018-12-27 Samsung Display Co., Ltd. Display apparatus and method of fabricating the same
CN109427861A (zh) * 2017-09-04 2019-03-05 三星显示有限公司 显示装置及其制造方法
CN108649054A (zh) * 2018-05-08 2018-10-12 京东方科技集团股份有限公司 显示基板及其制作方法和显示装置
CN109742121A (zh) * 2019-01-10 2019-05-10 京东方科技集团股份有限公司 一种柔性基板及其制备方法、显示装置
CN110112317A (zh) * 2019-05-23 2019-08-09 京东方科技集团股份有限公司 显示装置、柔性显示面板及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115274790A (zh) * 2022-07-20 2022-11-01 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法

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