WO2020208708A1 - 造形ユニット - Google Patents

造形ユニット Download PDF

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Publication number
WO2020208708A1
WO2020208708A1 PCT/JP2019/015464 JP2019015464W WO2020208708A1 WO 2020208708 A1 WO2020208708 A1 WO 2020208708A1 JP 2019015464 W JP2019015464 W JP 2019015464W WO 2020208708 A1 WO2020208708 A1 WO 2020208708A1
Authority
WO
WIPO (PCT)
Prior art keywords
modeling
work
information
base member
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/015464
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
将 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN202311790462.3A priority Critical patent/CN117601435A/zh
Priority to JP2021513062A priority patent/JP7476886B2/ja
Priority to PCT/JP2019/015464 priority patent/WO2020208708A1/ja
Priority to CN202311791873.4A priority patent/CN117601436A/zh
Priority to CN201980097229.2A priority patent/CN113939394B/zh
Priority to EP19924222.3A priority patent/EP3954530A4/en
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to US17/601,275 priority patent/US20220274181A1/en
Publication of WO2020208708A1 publication Critical patent/WO2020208708A1/ja
Anticipated expiration legal-status Critical
Priority to JP2024066501A priority patent/JP2024086918A/ja
Priority to JP2025031308A priority patent/JP2025078694A/ja
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80—Data acquisition or data processing
    • B22F10/85—Data acquisition or data processing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80—Data acquisition or data processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/22—Driving means
    • B22F12/224—Driving means for motion along a direction within the plane of a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/30—Platforms or substrates
    • B22F12/33—Platforms or substrates translatory in the deposition plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/46—Radiation means with translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50—Means for feeding of material, e.g. heads
    • B22F12/53—Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes

Definitions

  • Patent Document 1 describes an apparatus for forming a modeled object by melting a powdery material with an energy beam and then solidifying the molten material. In an apparatus for modeling such a modeled object, it is a technical issue to appropriately model the modeled object.
  • a modeling unit including a modeling device for modeling a modeled object on the base member based on a set position set on the base member and an output device for outputting position information regarding the set position.
  • a modeling unit including an output device that outputs information is provided.
  • a modeling device for modeling a modeled object on a base member, a measuring device for acquiring three-dimensional information of the base member and the modeled object, and an output device for outputting a measurement result by the measuring device.
  • a modeling unit is provided.
  • a modeling device for modeling a modeled object including a planar surface on an upper surface of a base member having a planar side surface, and the side surface of the base member and the planar surface of the modeled object.
  • a modeling unit including a control device that controls the modeling device so as to be parallel to the surface is provided.
  • FIG. 8 is a sectional view taken along line VII # 1-VII # 1'of the beam detection member shown in FIG.
  • FIG. 9 is a sectional view taken along line VII # 2-VII # 2'of the beam detection member shown in FIG.
  • FIG. 10 is a plan view showing a beam detection member mounted on the mounting surface.
  • FIG. 11 is a plan view showing a reference member on which a mark for alignment is formed.
  • FIG. 12 is a plan view showing a reference member mounted on the mounting surface.
  • FIG. 13 is a perspective view showing a mounting surface and a work in the stage coordinate system.
  • FIG. 14 is a flowchart showing the flow of the first work model alignment operation.
  • FIG. 15 is a flowchart showing the flow of the second work model alignment operation.
  • FIG. 20 (b) is a plan view showing beam spots of the plurality of guide lights on the surface of the work W (particularly, the user-designated point) when the plurality of guide lights do not intersect at the user-designated point.
  • FIG. 21 is a perspective view showing a work and a three-dimensional structure in the stage coordinate system.
  • FIG. 22 is a flowchart showing the flow of the modeling model alignment operation.
  • FIG. 23 is a plan view showing a display example of the work model.
  • FIG. 24 is a plan view showing a display example of the work model.
  • FIG. 25 is a plan view showing a display example of the work model.
  • FIG. 26 is a plan view showing a display example of the work model.
  • FIG. 27 is a plan view showing a display example on the display.
  • FIGS. 28 is a cross-sectional view showing a work model and a modeling model.
  • FIG. 29 is a cross-sectional view conceptually showing a modified example of modeling information together with a modeling model and a work model.
  • FIGS. 30 (a) to 30 (c) is a cross-sectional view conceptually showing an example of a method of modifying modeling information together with a work model and a modeling model.
  • FIGS. 31 (a) to 31 (c) is a cross-sectional view conceptually showing another example of the method of modifying the modeling information together with the work model and the modeling model.
  • FIG. 32 (a) to 32 (e) is a cross-sectional view showing a state in which light is irradiated and a modeling material is supplied in a certain region on the work.
  • FIGS. 23 (a) to 33 (c) is a cross-sectional view showing a process of forming a three-dimensional structure.
  • FIG. 34 is a system configuration diagram showing a system configuration of the processing system of the second embodiment.
  • FIG. 35 is a perspective view showing an external structure of a processing unit included in the processing system of the second embodiment.
  • FIG. 36 is a cross-sectional view showing an example of the structure of the processing head.
  • FIG. 37 is a cross-sectional view showing an example of the structure of the processing head.
  • FIG. 54 is a perspective view showing a stage that supports the work fixed to the fixing jig.
  • FIG. 55 is a system configuration diagram showing another example of the system configuration of the processing system.
  • 56 (a) is a plan view showing another example of the reference member, and
  • FIG. 52 (b) is a cross-sectional view taken along the line AA'in FIG. 56 (a).
  • the processing system SYS has a material supply device 1, a modeling device 2, a stage device 3, a light source 4, and a gas supply device 5, as shown in FIGS. 1 and 2.
  • At least a part of each of the modeling device 2, the stage device 3, and the measuring device 8 is housed in the chamber space 63IN inside the housing 6.
  • the modeling material M does not have to be powder, and for example, a wire-shaped modeling material or a gaseous modeling material may be used.
  • the processing system SYS may process the modeling material M with an energy beam such as a charged particle beam to form a modeled object.
  • the material nozzle 212 has a supply outlet 214 for supplying the modeling material M.
  • the material nozzle 212 supplies the modeling material M from the supply outlet 214 (eg, spraying, ejecting, or spraying).
  • the material nozzle 212 is physically connected to the material supply device 1 which is a supply source of the modeling material M via a pipe (not shown) or the like.
  • the material nozzle 212 supplies the modeling material M supplied from the material supply device 1 via the pipe.
  • the material nozzle 212 may pump the modeling material M supplied from the material supply device 1 via a pipe. That is, the modeling material M from the material supply device 1 and a gas for transportation (for example, an inert gas such as nitrogen or argon) may be mixed and pumped to the material nozzle 212 via a pipe.
  • a gas for transportation for example, an inert gas such as nitrogen or argon
  • the head drive system 22 moves the modeling head 21.
  • the head drive system 22 moves the modeling head 21 within the chamber space 63IN, for example.
  • the head drive system 22 moves the modeling head 21 along at least one of the X-axis, the Y-axis, and the Z-axis.
  • each of the irradiation region EA and the supply region MA moves on the work W along at least one of the X-axis and the Y-axis.
  • the head drive system 22 may move the modeling head 21 along at least one rotation direction in the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis. .. In other words, the head drive system 22 may rotate the modeling head 21 around at least one of the X-axis, Y-axis, and Z-axis. The head drive system 22 may change the posture of the modeling head 21 around at least one of the X-axis, the Y-axis, and the Z-axis.
  • the head drive system 22 includes, for example, a motor and the like.
  • the irradiation optical system 211 and the material nozzle 212 may be moved separately.
  • the head drive system 22 may be able to adjust at least one of the position of the injection unit 213, the orientation of the injection unit 213, the position of the supply outlet 214, and the orientation of the supply outlet 214.
  • the irradiation region EA where the irradiation optical system 211 irradiates the processing light EL and the supply region MA where the material nozzle 212 supplies the modeling material M can be controlled separately.
  • the position measuring device 23 can measure the position of the modeling head 21.
  • the position measuring device 23 may include, for example, at least one of an encoder and a laser interferometer.
  • the guide light emitting device 24 is arranged on the modeling head 21.
  • the guide light emitting device 24 emits the guide light GL.
  • the guide light emitting device 24 emits the guide light GL so that the guide light GL advances in the chamber space 63IN.
  • the plurality of guide light emitting devices 24 are aligned so that the plurality of guide light GLs emitted from the plurality of guide light emitting devices 24 intersect with each other at a certain position below the modeling head 21. In particular, the plurality of guide light emitting devices 24 are aligned so that the plurality of guide light GLs intersect each other at the focus position of the processing light EL.
  • the plurality of guide light emitting devices 24 are subjected to additional processing by the modeling device 2 with a plurality of guide light GLs. It can be said that they are aligned with each other so as to intersect each other at the additional processing position.
  • the additional processing position typically overlaps at least partially with the respective positions of the irradiation area EA and the supply area MA. The method of using such a guide light emitting device 24 will be described in detail later.
  • the plurality of guide light GLs may be aligned so as to intersect each other at a position (defocus position) deviated from the focus position of the processing light EL.
  • the stage device 3 includes a stage 31.
  • the stage 31 is housed in the chamber space 63IN.
  • the stage 31 can support the work W.
  • the state of "the stage 31 supporting the work W" here may mean a state in which the work W is directly or indirectly supported by the stage 31.
  • the stage 31 may be able to hold the work W. That is, the stage 31 may support the work W by holding the work W. Alternatively, the stage 31 does not have to be able to hold the work W.
  • the work W may be placed on the stage 31. That is, the stage 31 may support the work W placed on the stage 31. At this time, the work W may be mounted on the stage 31 without being clamped.
  • the state in which the "stage 31 supports the work W" in the present embodiment may include a state in which the stage 31 holds the work W and a state in which the work W is placed on the stage 31.
  • the stage 31 may be referred to as a support device for supporting the work W, a mounting device on which the work W is placed, a holding device for holding the work W, or a table. Since the stage 31 is housed in the chamber space 63IN, the work W supported by the stage 31 is also housed in the chamber space 63IN. Further, the stage 31 can release the held work W when the work W is held.
  • the irradiation optical system 211 described above irradiates the processing light EL at least a part of the period during which the stage 31 supports the work W.
  • the light source 4 emits, for example, at least one of infrared light and ultraviolet light as processed light EL.
  • the processed light EL light of other wavelengths, for example, light having a wavelength in the visible region may be used.
  • the processing light EL is a laser light.
  • the light source 4 may include a laser light source such as a semiconductor laser. Examples of the laser light source include at least one such as a laser diode (LD: Laser Diode), a fiber laser, a CO 2 laser, a YAG laser, and an excimer laser.
  • the processing light EL does not have to be laser light, and the light source 4 may include an arbitrary light source (for example, at least one such as an LED (Light Emitting Diode) and a discharge lamp).
  • the housing 6 is a housing device that accommodates at least a part of each of the modeling device 2 and the stage device 3 in the chamber space 63IN, which is the internal space of the housing 6.
  • the housing 6 includes a partition member 61 that defines a chamber space 63IN.
  • the partition member 61 is a member that separates the chamber space 63IN from the external space 64OUT of the housing 6.
  • the partition member 61 faces the chamber space 63IN via its inner wall 611, and faces the outer space 64OUT through its outer wall 612. In this case, the space surrounded by the partition member 61 (more specifically, the space surrounded by the inner wall 611 of the partition member 61) becomes the chamber space 63IN.
  • the partition member 61 may be provided with a door that can be opened and closed.
  • This door may be opened when the work W is placed on the stage 31. This door may be opened when the work W and / or the modeled object (for example, the three-dimensional structure ST) is taken out from the stage 31. This door may be closed during the period when the modeling device 2 is modeling the modeled object.
  • the modeled object for example, the three-dimensional structure ST
  • the control device 7 controls the operation of the processing system SYS.
  • the control device 7 may include, for example, a CPU (Central Processing Unit) (or a GPU (Graphics Processing Unit) in addition to or in place of the CPU) and a memory.
  • the control device 7 functions as a device that controls the operation of the processing system SYS by executing a computer program by the CPU.
  • This computer program is a computer program for causing the control device 7 (for example, the CPU) to perform (that is, execute) the operation described later to be performed by the control device 7. That is, this computer program is a computer program for causing the control device 7 to function so that the processing system SYS performs the operation described later.
  • the computer program executed by the CPU may be recorded in a memory (that is, a recording medium) included in the control device 7, or may be an arbitrary storage medium built in the control device 7 or externally attached to the control device 7 (that is, a recording medium). For example, it may be recorded on a hard disk or a semiconductor memory). Alternatively, the CPU may download the computer program to be executed from a device external to the control device 7 via the network interface.
  • a memory that is, a recording medium
  • the CPU may download the computer program to be executed from a device external to the control device 7 via the network interface.
  • the control device 7 may control the injection mode of the processed light EL by the irradiation optical system 211.
  • the injection mode may include, for example, at least one of the intensity of the processing light EL and the injection timing of the processing light EL.
  • the injection mode may include, for example, the ratio of the length of the emission time of the pulsed light to the emission period of the pulsed light (so-called duty ratio).
  • the injection mode may include, for example, the length of the emission time of the pulsed light itself or the emission cycle itself.
  • the control device 7 may control the movement mode of the modeling head 21 by the head drive system 22.
  • the movement mode may include, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing.
  • the control device 7 may control the supply mode of the modeling material M by the material supply device 1.
  • the supply mode of the modeling material M by the material nozzle 212 is mainly determined by the supply mode of the modeling material M by the material supply device 1. Therefore, controlling the supply mode of the modeling material M by the material supply device 1 can be regarded as equivalent to controlling the supply mode of the modeling material M by the material nozzle 212.
  • the supply mode may include, for example, at least one of a supply amount (particularly, a supply amount per unit time) and a supply timing.
  • the control device 7 may not be provided inside the processing system SYSTEM, and may be provided as a server or the like outside the processing system SYS, for example.
  • the control device 7 and the processing system SYS may be connected by a wired and / or wireless network (or a data bus and / or a communication line).
  • a wired network for example, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used.
  • a network using a parallel bus interface may be used.
  • control device 7 may be able to transmit information such as commands and control parameters to the processing system SYS via the network.
  • the processing system SYS may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network. Even if the processing system SYS is provided with a transmission device (that is, an output device that outputs information to the control device 7) that transmits information such as commands and control parameters to the control device 7 via the network. Good.
  • the first control device that performs a part of the processing performed by the control device 7 is provided inside the processing system SYS, the second control device that performs the other part of the processing performed by the control device 7 is provided.
  • the control device may be provided outside the processing system SYS.
  • the recording medium for recording the computer program executed by the CPU includes CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD + R, and DVD-RW. , DVD + RW and Blu-ray (registered trademark) optical disks, magnetic media such as magnetic tapes, magneto-optical disks, semiconductor memories such as USB memory, and any other medium capable of storing programs. May be good.
  • the recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which the computer program is implemented in at least one form such as software and firmware).
  • each process or function included in the computer program may be realized by a logical processing block realized in the control device 7 by the control device 7 (that is, a computer) executing the computer program. It may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 7, or a logical processing block and a partial hardware module that realizes a part of the hardware are mixed. It may be realized in the form of.
  • FPGA predetermined gate array
  • the measuring device 8 can measure an object to be measured under the control of the control device 7.
  • the measurement result of the measuring device 8 is output from the measuring device 8 to the control device 7.
  • the measuring device 8 may be referred to as a measuring unit.
  • the measurement may include the measurement of the position of the object to be measured.
  • the position of the measurement object may include a position in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction of each portion (that is, each part) subdivided into the measurement object.
  • the position of the measurement object may include the position of the surface of the measurement object.
  • the position of the surface of the measurement object may include a position in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction of each portion (that is, each part) subdivided from the surface of the measurement object. ..
  • the measurement may include measurement of the shape of the object to be measured (for example, a three-dimensional shape).
  • the shape of the object to be measured is the direction of each part of the object to be measured (for example, the direction of the normal of each part, and the amount of inclination of each part with respect to at least one of the X-axis, Y-axis, and Z-axis. Substantially equivalent) may be included.
  • the shape of the object to be measured may include the shape of the surface of the object to be measured.
  • the shape of the surface of the object to be measured is the orientation of each part of the surface of the object to be measured (for example, the direction of the normal of each part, and each part with respect to at least one of the X-axis, Y-axis, and Z-axis. It may include the amount of inclination (that is, substantially equivalent to the posture of each part).
  • the measurement may include the measurement of the attribute of the object to be measured.
  • the attributes of the measurement object may include, for example, at least one such as the reflectance of the measurement object, the spectral reflectance of the measurement object, and the surface roughness of the measurement object.
  • the measurement object includes, for example, an object placed on the mounting surface 311 of the stage 31. Therefore, the measurement range of the measuring device 8 is set to a desired range so that the object mounted on the mounting surface 311 can be measured.
  • the object to be mounted on the mounting surface 311 is the work W described above.
  • Another example of an object mounted on the mounting surface 311 is a three-dimensional structure ST formed on the work W.
  • a reference member 34 see FIG. 11 and the like
  • the measuring device 8 may have any structure as long as the object to be measured can be measured.
  • the measuring device 8 may be any kind of measuring device as long as it can measure the object to be measured.
  • 1 and 2 show an example in which the measuring device 8 is a 3D scanner. That is, FIGS. 1 and 2 show an example in which the measuring device 8 optically measures the object to be measured. 1 and 2 show an example in which the measuring device 8 measures the measurement target without contacting the measurement target. That is, FIGS. 1 and 2 show an example in which the measuring device 8 measures the object to be measured in a non-contact manner.
  • the measuring device 8 may measure the object to be measured by using a method different from the optical method, for example, an electromagnetic wave or a sound wave.
  • the measuring device 8 may come into contact with the object to be measured and measure the object to be measured.
  • a measuring device that contacts a measurement target and measures the measurement target there is a measuring device that measures the measurement target while pressing a sensor such as a probe against the measurement target.
  • the measuring device 8 When the measuring device 8 is a 3D scanner, the measuring device 8 includes, for example, a projection device 81 and an image pickup device 82, as shown in FIG. In the example shown in FIG. 2, the measuring device 8 includes a plurality of imaging devices 82. More specifically, in the example shown in FIG. 2, the measuring device 8 includes two imaging devices 82 (specifically, imaging devices 82 # 1 and imaging devices 82 # 2). However, the measuring device 8 may include a single imaging device 82.
  • the projection device 81 irradiates the mounting surface 311 with the measurement light DL.
  • the measurement light DL is light for projecting a desired projection pattern on the mounting surface 311.
  • the measurement light DL is light for projecting a desired projection pattern on the measurement object placed on the mounting surface 311.
  • the desired projection pattern may include a one-dimensional projection pattern.
  • the desired projection pattern may include a two-dimensional projection pattern.
  • the projection device 81 may project a single type of projection pattern onto the measurement object. Alternatively, the projection device 81 may sequentially project a plurality of types of projection patterns onto the measurement object.
  • FIGS. 3 (a) to 3 (j) show an example of the projection pattern.
  • FIG. 3A shows a projection pattern corresponding to a white image.
  • FIG. 3B shows a projection pattern corresponding to a black image.
  • 3 (a) and 3 (b) may be used to measure the state of ambient light.
  • 3 (c) to 3 (f) show a plurality of projection patterns corresponding to a plurality of fringe patterns (for example, a plurality of fringe patterns having different numbers and widths of fringes).
  • 3 (g) to 3 (j) show a plurality of projection patterns corresponding to gray patterns having different phases (in other words, phase shift patterns).
  • the projection device 81 sequentially projects a plurality of projection patterns shown in FIGS. 3A and 3B, and then sequentially projects a plurality of projection patterns shown in FIGS. 3C to 3F. After that, a plurality of projection patterns shown in FIGS. 3 (g) to 3 (j) may be projected in order.
  • the period width of the gray code included in the projection patterns shown in FIGS. 3 (g) to 3 (j) is the stripes included in the projection patterns shown in FIGS. 3 (c) to 3 (f). It may be the same as the minimum width.
  • the stereo visual phase shift method is an example of a method of measuring the state of the measurement object by imaging the measurement object on which the phase shift pattern is projected by using a plurality of imaging devices 82.
  • the image pickup device 82 images the mounting surface 311.
  • the image pickup device 82 images an object to be measured mounted on the mounting surface 311.
  • the imaging device 82 images a projection pattern projected on the object to be measured.
  • the control device 7 measures the measurement information about the measurement object measured by the measurement device 8 (that is, the measurement of the measurement object by the measurement device 8) based on the image pickup result of the image pickup device 82 (particularly, the information about the captured projection pattern). (Measurement information about the result) is generated. Since the measurement of the measurement target includes at least one of the measurement of the position of the measurement target and the measurement of the shape of the measurement target, the measurement information is the measurement position information regarding the position of the measurement target measured by the measuring device 8. And at least one of the measurement shape information regarding the shape of the measurement object measured by the measuring device 8 may be included.
  • the control device 7 can function as an information generation device for generating measurement information (that is, at least one of measurement position information and measurement shape information).
  • the measurement information may include any one of the measurement position information and the measurement shape information.
  • the measurement information may include both measurement position information and measurement shape information.
  • the measurement information may be information in which the measurement position information and the measurement shape information correspond to each other.
  • "Measurement information corresponding to the measurement position information and the measurement shape information" means information in a state where both the position and the shape of each part of the measurement object can be specified. Therefore, by referring to such measurement information, although the position of a certain part of the measurement target can be specified, the situation that the shape of the same part cannot be specified does not occur.
  • the measurement information will be described with reference to an example in which the measurement position information and the measurement shape information correspond to each other. It should be noted that such measurement information does not have to include the measurement position information and the measurement shape information as separate and different information, as long as both the position and shape of each part of the measurement object can be specified.
  • the measurement information may have any data structure.
  • the measuring device 8 is isolated from the chamber space 63IN by the partition member 83.
  • the measuring device 8 is arranged in a space isolated from the chamber space 63IN by the partition member 83.
  • the adhesion of the substance existing in the chamber space 63IN to the measuring device 8 is suppressed.
  • the substance existing in the chamber space 63IN include the modeling material M supplied from the material nozzle 212 to the chamber space 63IN and the substance generated from the modeling surface MS described later due to the irradiation of the processing light EL. Be done.
  • a fume containing at least one of the fine particles of the molten modeling material M and the fine particles of the material constituting the molten work W can be mentioned.
  • the partition wall member 83 includes a light transmitting member 84 capable of blocking the above-mentioned substance while allowing the measurement light DL to pass through at a position where the optical path of the measurement light DL irradiated by the projection device 81 intersects with the partition wall member 83. ing.
  • the measuring device 8 can appropriately irradiate the measurement object arranged in the chamber space 63IN with the measurement light DL. it can.
  • the measuring device 8 does not have to be isolated from the chamber space 63IN by the partition member 83.
  • the measuring device 8 may be arranged in the chamber space 63IN. When the measuring device 8 is arranged in the chamber space 63IN, the measuring device 8 may have dust resistance.
  • the display 91 is a display device capable of displaying a desired image under the control of the control device 7.
  • the display 91 may display information about the processing system SYS.
  • the display 91 may display information about the three-dimensional structure ST.
  • the display 91 may display information about the work W.
  • the display 91 may display information regarding the result of imaging by the imaging device 82.
  • the display 91 does not have to be provided inside the processing system SYS.
  • the display 91 may be provided as an external display outside the processing system SYS.
  • the display 91 and the processing system SYS may be connected by a wired and / or wireless network (or a cable, a data bus and / or a communication line).
  • the control device 7 may be configured to enable transmission / reception (that is, input / output) of various types of information to / from the display 91 via the network.
  • the display 91 is a transmission / reception unit (that is, input / output) that transmits / receives information to / from the control device 7 (furthermore, to / from other devices included in the processing system SYS with or without the control device 7).
  • a unit) and a display unit for displaying an image may be provided.
  • the input device 92 is a device that receives input of information from the outside of the processing system SYS.
  • the input device 92 may accept the input of information from the user of the processing system SYS.
  • the input device 92 may accept input of information from a device outside the processing system SYS.
  • the input device 92 may accept input of information from a recording medium that can be attached to the processing system SYS.
  • An example of the input device 92 is an operating device that can be operated by the user.
  • the operating device at least one of a keyboard, a mouse, a touch pad, a touch panel (for example, a touch panel integrated with the display 91) and a pointing device can be mentioned.
  • the input device 92 is an interface device for connecting to an external device of the processing system SYS.
  • a reading device capable of reading a recording medium that can be attached to the processing system SYS.
  • the information received by the input device 92 (that is, the information input to the input device 92) is output to, for example, the control device 7.
  • the input device 92 may accept input of information via the display screen of the display 91.
  • the input device 92 may accept input of information via a GUI (Graphical User Interface) displayed on the display screen of the display 91.
  • the input device 92 may accept input of information regarding the user's operation to the GUI displayed on the display screen of the display 91.
  • the display 91 may display an image (for example, the GUI described above) for receiving the input of information via the input device 92 under the control of the control device 7. In this way, the display 91 may also be used as the input device 92.
  • the input device 92 does not have to be provided inside the processing system SYS.
  • the input device 92 may be provided as an external input device outside the processing system SYS.
  • the input device 92 and the processing system SYS may be connected by a wired and / or wireless network (or a cable, a data bus and / or a communication line).
  • the control device 7 may be configured to acquire the information input to the input device 92 via the network.
  • the control device 7 may be configured to function as a receiving device that receives the information input to the input device 92 via the network.
  • the input device 92 is a transmission / reception unit (that is, an input / output unit) that transmits / receives information to / from the control device 7 (furthermore, to / from other devices included in the processing system SYS with or without the control device 7).
  • An output unit) and an input receiving unit that receives input from the outside of the processing system SYS may be provided.
  • the machining system SYS performs a work model alignment operation under the control of the control device 7. After that, the processing system SYS performs a modeling model alignment operation under the control of the control device 7. After that, the processing system SYS performs a modeling operation under the control of the control device 7. Further, the machining system SYS may perform a coordinate matching operation under the control of the control device 7 prior to the work model alignment operation. Therefore, in the following, the coordinate matching operation, the work model alignment operation, the modeling model alignment operation, and the modeling operation will be described in order.
  • the coordinate matching operation is an operation for associating the modeling coordinate system, the stage coordinate system, and the measurement coordinate system with each other.
  • the modeling coordinate system is a three-dimensional coordinate system used to specify the position of the modeling head 21.
  • the head drive system 22 moves the modeling head 21 based on the information regarding the position of the modeling head 21 specified in the modeling coordinate system.
  • the position measuring device 23 measures the position of the modeling head 21 in the modeling coordinate system.
  • the stage coordinate system is a three-dimensional coordinate system used to specify a position on the stage 31 (particularly, a position on the mounting surface 311 of the stage 31).
  • the stage coordinate system may be a three-dimensional coordinate system used to specify the position of the stage 31.
  • the stage drive system may move the stage 31 based on the information regarding the position of the stage 31 specified in the stage coordinate system. ..
  • the measurement coordinate system is a three-dimensional coordinate system used to specify the position of the measurement object measured by the measurement device 8. That is, the measurement coordinate system is a three-dimensional coordinate system used to specify the position of the measurement device 8 within the measurement range.
  • the control device 7 generates measurement position information regarding the position of the measurement object in the measurement coordinate system based on the measurement result of the measurement device 8.
  • the coordinates of a certain position in any one of the modeling coordinate system, the stage coordinate system, and the measurement coordinate system are set to the modeling coordinate system. It can be converted to the coordinates of a certain position in another coordinate system of the stage coordinate system and the measurement coordinate system. Therefore, in the coordinate matching operation, the information (for example, a conversion matrix) used for converting the coordinates in the modeling coordinate system into the respective coordinates of the stage coordinate system and the measurement coordinate system, and the coordinates in the stage coordinate system are converted into the modeling coordinate system.
  • the information for example, a conversion matrix
  • the information used to convert to the respective coordinates of the measurement coordinate system eg, conversion matrix
  • the information used to convert to the respective coordinates of the measurement coordinate system eg, conversion matrix
  • convert the coordinates in the measurement coordinate system to the respective coordinates of the modeling coordinate system and the stage coordinate system e.g., conversion matrix
  • the machining system SYS does not have to perform the coordinate matching operation.
  • the processing system SYS does not have to perform the coordinate matching operation.
  • FIG. 4 is a flowchart showing the flow of the coordinate matching operation.
  • the machining system SYS performs an operation of associating the modeling coordinate system with the stage coordinate system as a part of the coordinate matching operation (steps S111 to S113). Further, the machining system SYS performs an operation of associating the measurement coordinate system with the stage coordinate system as a part of the coordinate matching operation (steps S114 to S116).
  • the modeling coordinate system and the stage coordinate system are associated with each other and the measurement coordinate system and the stage coordinate system are associated with each other, the modeling coordinate system and the measurement coordinate system are indirectly associated with each other via the stage coordinate system. Therefore, by performing the processes from step S111 to step S116, the modeling coordinate system, the stage coordinate system, and the measurement coordinate system are associated with each other.
  • FIG. 4 shows an example in which the processing system SYS performs an operation of associating the modeling coordinate system with the stage coordinate system and then performing an operation of associating the measurement coordinate system with the stage coordinate system.
  • the processing system SYS may perform an operation of associating the modeling coordinate system with the stage coordinate system after performing the operation of associating the measurement coordinate system with the stage coordinate system.
  • the beam detection member 32 is placed on the mounting surface 311 of the stage 31 (step S111).
  • the beam detection member 32 is placed on the mounting surface 311 so that the positional relationship between the beam detecting member 32 and the mounting surface 311 is the desired first positional relationship.
  • the beam detecting member 32 Marks for alignment are formed on both the surface and the mounting surface 311.
  • FIG. 5 is a plan view showing the stage 31 including the mounting surface 311 on which the alignment mark is formed.
  • FIG. 6 is a sectional view taken along line VV'of the stage 31 shown in FIG.
  • FIG. 7 is a plan view showing a beam detection member 32 on which a mark for alignment is formed.
  • FIG. 8 is a cross-sectional view of VII # 1-VII # 1'of the beam detection member 32 shown in FIG.
  • FIG. 9 is a sectional view taken along line VII # 2-VII # 2'of the beam detection member 32 shown in FIG.
  • FIG. 10 is a plan view showing the beam detection member 32 mounted on the mounting surface 311.
  • a plurality of pins 312 are formed on the mounting surface 311 as markings for alignment.
  • two pins 312 are formed on the mounting surface 311.
  • three or more pins 312 may be formed.
  • the pin 312 is a member that protrudes from the mounting surface 311 along the Z-axis direction. The information regarding the position of the pin 312 in the stage coordinate system is known to the control device 7.
  • the beam detection member 32 includes a base member 321.
  • the base member 321 is a plate-shaped member.
  • the base member 321 has a shape and size that can be mounted on the mounting surface 311.
  • a plurality of through holes 322 are formed in the base member 321 as a mark for alignment. In the example shown in FIGS. 7 and 8, two through holes 322 are formed in the base member 321.
  • the through hole 322 penetrates the base member 321 along the Z-axis direction.
  • the beam detection member 32 is placed on the mounting surface 311 so that the pin 312 is inserted into the through hole 322.
  • the beam detection member 32 is placed on the mounting surface 311 with the pin 312 inserted into the through hole 322. Therefore, the arrangement mode of the through hole 322 is the same as the arrangement mode of the pin 312. Further, the number of through holes 322 is the same as (or may be large) the number of pins 312.
  • the beam detection member 32 is placed on the mounting surface 311 so as to have a desired first positional relationship with respect to the mounting surface 311.
  • the beam detection member 32 is mounted on the mounting surface 311 so as to have a desired first positional relationship with respect to the pin 312 on the mounting surface 311.
  • the beam detection member 32 is mounted on the mounting surface 311 so as to satisfy the desired first positional relationship in which the pin 312 of the mounting surface 311 and the through hole 322 of the beam detection member 32 overlap in the Z-axis direction. ..
  • the beam detection member 32 has the same position of the pin 312 in the X-axis direction and the position of the through hole 322 corresponding to the pin 312 in the X-axis direction, and is the same as the position of the pin 312 in the Y-axis direction. It is mounted on the mounting surface 311 so as to satisfy the desired first positional relationship that the position of the through hole 322 corresponding to the pin 312 in the Y-axis direction is the same.
  • the position where the pin 312 is formed may be used as a reference position on the mounting surface 311 when the beam detection member 32 is mounted on the mounting surface 311.
  • the beam detection member 32 is placed on the mounting surface 311 in a state of being aligned so as to have a desired first positional relationship with respect to the reference position on the mounting surface 311.
  • the beam detection member 32 is further provided with a light shielding member 323.
  • the light-shielding member 323 is a member that shields the processed light EL.
  • the light-shielding member 323 is formed on the upper surface of the base member 321 (that is, the surface facing the + Z side).
  • the upper surface of the light-shielding member 323 is located above the upper surface of the base member 321.
  • the upper surface of the light-shielding member 323 may be located below the upper surface of the base member 321 or may be located at the same height as the upper surface of the base member 321.
  • At least a part of the light-shielding member 323 may be integrated with the base member 321.
  • the light-shielding member 323 may be removable from the base member 321.
  • the light-shielding member 323 is formed with an opening 324 that penetrates the light-shielding member 323 along the Z-axis direction.
  • the shape of the opening 324 in the plane along the XY plane is a slit shape, but it may be any other shape, a circular shape (pinhole shape), an oval shape, a polygonal shape, or the like.
  • the opening 324 is a through hole through which the processing light EL can pass.
  • the beam detection member 32 further includes a beam detector 325.
  • the beam detector 325 is arranged at a position where it can receive the processed light EL that has passed through the opening 324.
  • the opening 324 is arranged at a position having a predetermined positional relationship with respect to the through hole 322.
  • the information regarding the positional relationship between the opening 324 and the through hole 322 is known to the control device 7.
  • the beam detection member 32 includes a single beam detector 325 (typically, a photoelectric converter such as a light amount sensor capable of photoelectrically converting the received processed light EL)
  • the photoelectric converter The positional relationship between the opening 324 and the processing light EL can be obtained from the output.
  • the beam detector 325 is located below the shading member 323 (ie, -Z side).
  • a diffuser plate for diffusing the processing light EL or the guide light GL may be arranged between the opening 324 and the beam detector 325 and / or on the incident side of the opening 324. Further, a cover glass for protecting the opening 324 may be arranged on the incident side of the opening 324.
  • the beam detection member 32 may include a single beam detector 325 as described above, or may include a plurality of beam detectors 325.
  • the light shielding member 323 may be formed with a plurality of openings 324 corresponding to the plurality of beam detectors 325, respectively.
  • each beam detector 325 detects the processed light EL incident on each beam detector 325 through the opening 324 corresponding to each beam detector 325.
  • the detection result of the beam detector 325 may include information on the state of the processed light EL incident on the beam detector 325.
  • the detection result of the beam detector 325 includes information on the intensity of the processed light EL incident on the beam detector 325 (specifically, the intensity in the plane intersecting the XY plane). More specifically, the detection result of the beam detector 325 includes information on the intensity distribution of the processed light EL in the plane along the XY plane.
  • the detection result of the beam detector 325 is output to the control device 7.
  • the modeling apparatus 2 irradiates the beam detection member 32 with the processing light EL (step S112).
  • the modeling device 2 irradiates the processing light EL toward the beam detector 325 arranged on the beam detection member 32.
  • the beam detection member 32 includes a plurality of beam detectors 325
  • the modeling apparatus 2 irradiates the plurality of beam detectors 325 in order with the processing light EL.
  • the head drive system 22 moves the modeling head 21 so as to irradiate the processing light EL toward the beam detector 325.
  • the head drive system 22 moves the modeling head 21 so that the processing light EL (more specifically, the irradiation region EA of the processing light EL) crosses the opening 324 in the plane along the XY plane. May be good.
  • the modeling head 21 irradiates the processing light EL during the period of movement by the head drive system 22.
  • the processing light EL is applied to the opening 324 at a certain timing during the period when the modeling head 21 is moving. That is, the processing light EL is detected by the beam detector 325 at a certain timing during the period when the modeling head 21 is moving.
  • the control device 7 associates the modeling coordinate system with the stage coordinate system based on the detection result of the beam detector 325 in step S112 (step S113). Specifically, the detection result of the beam detector 325 shows that at least a part of the processing light EL irradiates the opening 324 as compared with the intensity of the processing light EL during the period when the processing light EL is not irradiated to the opening 324. It shows that the intensity of the processed light EL during the period is increased. Therefore, the control device 7 determines the time when the processing light EL is irradiating the opening 324 (that is, the time when the processing light EL is irradiating the beam detector 325) based on the detection result of the beam detector 325. It is identifiable.
  • control device 7 is based on the time when the processing light EL is irradiated to the opening 324 and the measurement result of the position measuring device 23, and the modeling head 21 at the time when the processing light EL is irradiated to the beam detector 325.
  • the position of is identifiable.
  • the control device 7 can specify the position of the modeling head 21 in a state where the beam detector 325 can be irradiated with the processing light EL based on the output of the beam detector 325 and the measurement result of the position measuring device 23. There may be. That is, the control device 7 can specify the position of the modeling head 21 in a state in which the beam detector 325 can be irradiated with the processing light EL in the modeling coordinate system.
  • the position of the modeling head 21 referred to here may include the position of the modeling head 21 itself, or may include a position unique to the modeling head 21.
  • there is an additional processing position that is, a focus position of the processing light EL
  • the control device 7 models based on the information on the position of the modeling head 21 in which the opening 324 can be irradiated with the processing light EL and the information on the positional relationship between the opening 324 and the through hole 322.
  • the position of the modeling head 21 in a state where the through hole 322 can be irradiated with the processing light EL in the situation where the beam detection member 32 is mounted on the mounting surface 311 the through hole 322 and the pin 312 overlap in the Z-axis direction. Therefore, the position of the modeling head 21 in which the through hole 322 can be irradiated with the processing light EL can be regarded as equivalent to the position of the modeling head 21 in which the pin 312 can be irradiated with the processing light EL. Further, as described above, the information regarding the position of the pin 312 in the stage coordinate system is known to the control device 7.
  • the position in the modeling coordinate system of the modeling head 21 in a state where the pin 312 can be irradiated with the processing light EL and the position in the stage coordinate system where the pin 312 is formed are determined. It can be identified as a position that should be associated with each other. That is, the control device 7 can specify that a specific position in the modeling coordinate system and a specific position in the stage coordinate system should be associated with each other. As a result, the control device 7 has the modeling coordinate system and the stage based on the specific result that a specific position in the modeling coordinate system and a specific position in the stage coordinate system should be associated with each other. Can be associated with a coordinate system.
  • control device 7 can specify the position of the modeling head 21 in a state in which the processing light EL can be irradiated to an arbitrary position in the stage coordinate system in the modeling coordinate system. Further, the control device 7 can specify a position (for example, an additional processing position) in which the modeling head 21 arranged at an arbitrary position in the modeling coordinate system irradiates the processing light EL in the stage coordinate system.
  • the reference member 34 is placed on the mounting surface 311 of the stage 31.
  • the reference member 34 is placed on the mounting surface 311 so that the positional relationship between the reference member 34 and the mounting surface 311 is a desired second positional relationship.
  • the reference member 34 and the mounting surface 311 are mounted. Marks for alignment are formed on both sides of the surface 311.
  • FIG. 11 is a plan view showing a reference member 34 on which a mark for alignment is formed.
  • FIG. 12 is a plan view showing a reference member 34 mounted on the mounting surface 311.
  • a mark different from the pin 312 formed on the mounting surface 311 may be used as a mark for mounting the reference member 34 on the mounting surface 311.
  • the reference member 34 includes a base member 341.
  • the base member 341 is a plate-shaped member.
  • the base member 341 has a shape and size that can be mounted on the mounting surface 311.
  • a plurality of through holes 342 are formed in the base member 341 as a mark for alignment.
  • the base member 341 is formed with two through holes 342.
  • the through hole 342 penetrates the base member 341 along the Z-axis direction.
  • the reference member 34 is placed on the mounting surface 311 so that the pin 312 is inserted into the through hole 342. Therefore, the arrangement pattern of the through hole 342 is the same as the arrangement pattern of the pin 312. Further, the number of through holes 342 is the same as (or may be large) the number of pins 312. As a result, the reference member 34 is placed on the mounting surface 311 so as to have a desired second positional relationship with respect to the mounting surface 311. The reference member 34 is mounted on the mounting surface 311 so as to have a desired second positional relationship with respect to the pin 312 on the mounting surface 311.
  • the reference member 34 is placed on the mounting surface 311 so as to satisfy the desired second positional relationship that the pin 312 of the mounting surface 311 and the through hole 342 of the reference member 34 overlap in the Z-axis direction.
  • the position of the pin 312 in the X-axis direction and the position of the through hole 342 corresponding to the pin 312 in the X-axis direction are the same, and the position of the pin 312 in the Y-axis direction and the pin It is placed on the mounting surface 311 so as to satisfy the desired second positional relationship that the position of the through hole 342 corresponding to 312 in the Y-axis direction is the same.
  • the position where the pin 312 is formed may be used as a reference position on the mounting surface 311 when the reference member 34 is mounted on the mounting surface 311.
  • the reference member 34 is placed on the mounting surface 311 in a state of being aligned so as to have a desired second positional relationship with respect to the reference position on the mounting surface 311.
  • At least one reference mark 343 is formed on the upper surface of the base member 341.
  • One reference mark 343 may be formed, two reference marks 343 may be formed, three reference marks 343 may be formed, or four reference marks 343 may be formed on the base member 341.
  • the reference mark 343 may be formed, or five or more reference marks 343 may be formed.
  • FIG. 11 shows an example in which five reference marks 343 are formed on the upper surface of the base member 341.
  • the reference mark 343 is a mark that can be measured by the measuring device 8.
  • the reference mark 343 is a mark that can be imaged by the image pickup device 82 included in the measuring device 8.
  • the information regarding the positional relationship between the reference mark 343 and the through hole 342 is known to the control device 7.
  • the reference mark 343 is a predetermined position on the mounting surface 311 (for example, the center of the mounting surface 311) when the reference member 34 is mounted on the mounting surface 311 so that the pin 312 is inserted into the through hole 342. It may be formed at a predetermined position on the base member 341 so that the reference mark 343 is arranged on the base member 341.
  • the information regarding the predetermined position on the mounting surface 311 on which the reference mark 343 is arranged may be information known to the control device 7. ..
  • the predetermined position on the mounting surface 311 on which the reference mark 343 is to be placed serves as the reference position on the mounting surface 311 when the reference member 34 is mounted on the mounting surface 311. It may be used.
  • the reference member 34 is placed on the mounting surface 311 in a state where the reference mark 343 is arranged at the reference position on the mounting surface 311.
  • the information regarding the positional relationship between the position where the reference mark 343 is arranged and the through hole 342 does not have to be known to the control device 7.
  • the beam detection member 32 shown in FIGS. 7 to 9 and the reference member shown in FIGS. 11 and 12 may be provided on the same member.
  • the measuring device 8 measures the reference member 34 (step S114). In particular, the measuring device 8 measures the reference mark 343 formed on the reference member 34.
  • the control device 7 associates the measurement coordinate system with the stage coordinate system based on the measurement result of the measurement device 8 in step S115 (step S116). Specifically, the control device 7 can specify the position of the reference mark 343 in the measurement coordinate system from the measurement result of the measurement device 8. Further, as described above, the information regarding the positional relationship between the reference mark 343 and the through hole 342 is known to the control device 7. Therefore, the control device 7 determines the through hole 322 in the measurement coordinate system based on the information regarding the position of the reference mark 343 in the measurement coordinate system and the information regarding the positional relationship between the reference mark 343 and the through hole 342. The position can be specified.
  • the position of the through hole 342 and the position of the pin 312 are the same under the condition that the reference member 34 is mounted on the mounting surface 311. Therefore, the position of the through hole 342 in the measurement coordinate system can be regarded as equivalent to the position of the pin 312 in the measurement coordinate system.
  • the information regarding the position of the pin 312 in the stage coordinate system is known to the control device 7. Therefore, the control device 7 can specify that the position of the pin 312 in the measurement coordinate system and the position of the pin 312 in the stage coordinate system should be associated with each other. That is, the control device 7 can specify that a specific position in the measurement coordinate system and a specific position in the stage coordinate system should be associated with each other.
  • control device 7 is based on the specific result that a specific position in the measurement coordinate system and a specific position in the stage coordinate system should be associated with each other, and the measurement coordinate system and the stage. Can be associated with a coordinate system. As a result, the control device 7 can specify the position of the measurement target in the stage coordinate system.
  • the control device 7 can specify that the information regarding the position of the reference mark 343 in the measurement coordinate system and the predetermined position in the stage coordinate system in which the reference mark 343 is arranged are positions to be associated with each other. .. That is, the control device 7 can specify that a specific position in the measurement coordinate system and a specific position in the stage coordinate system should be associated with each other. As a result, the control device 7 is based on the specific result that a specific position in the measurement coordinate system and a specific position in the stage coordinate system should be associated with each other, and the measurement coordinate system and the stage. Can be associated with a coordinate system.
  • the beam detection member 32 may be used to measure the positional deviation between the processing light EL and the guide light GL.
  • the processing system SYS emits a plurality of guide light GLs
  • the positional deviation between the position where the plurality of guide light GLs intersect and the focus position (additional processing position) of the processing light EL is measured by using the beam detection member 32. You may.
  • the focus position and / or the position of the guide light GL of the processing light EL (when a plurality of guide light GLs are used, the intersection position of the plurality of guide light GLs). May be changed.
  • the work model alignment operation is an operation of aligning the work model WM, which is a three-dimensional model of the work W to form the three-dimensional structure ST, with the actual work W.
  • the work model alignment operation is an operation of aligning the work model WM and the work W in the reference coordinate system.
  • the reference coordinate system is a coordinate system that serves as a reference for the processing system SYS.
  • the reference coordinate system is a coordinate system used for control by the control device 7.
  • the stage coordinate system is used as the reference coordinate system.
  • the work model alignment operation is an operation of aligning the work model WM and the work W in the stage coordinate system.
  • the measurement coordinate system or the modeling coordinate system may be used as the reference coordinate system.
  • Other coordinate systems different from the stage coordinate system, the measurement coordinate system, and the modeling coordinate system may be used as the reference coordinate system.
  • the work information includes both the work position information regarding the position of the work model WM and the work shape information regarding the shape of the work model WM.
  • the work information is information corresponding to the work position information and the work shape information.
  • the position of the work model WM coincides with the actual position of the work W (or, if not, it substantially matches). Therefore, the work position information can be regarded as equivalent to the information regarding the position of the work W.
  • the shape of the work model WM matches the shape of the actual work W (or, if not, it substantially matches). Therefore, the work shape information can be regarded as equivalent to the information regarding the actual shape of the work W.
  • the "work information corresponding to the work position information and the work shape information" is the same as the "measurement information corresponding to the measurement position information and the measurement shape information", and is both the position and shape of each part of the work model WM. Means information that can be identified. It should be noted that such work information does not have to include the work position information and the work shape information as separate and independent information, as long as both the position and shape of each part of the work model WM can be specified.
  • the work information may have any data structure.
  • the work shape information is information on the positions of the pixels (in other words, volume elements, so-called voxels) constituting the work model WM (that is, data indicating the shape of the work model WM using information on the pixel positions). It may be included.
  • the work shape information may include polygon data of the work model WM.
  • the work shape information may include cross-sectional shape data regarding the cross section of each layer obtained by slicing the work model WM (that is, slicing the work model WM to a predetermined thickness in an arbitrary surface direction).
  • FIG. 13 is a perspective view showing the mounting surface 311 and the work model WM in the stage coordinate system.
  • the position and orientation (in other words, posture) of each part of the work model WM (for example, each part of the surface of the work model WM) can be specified in the stage coordinate system. That is, the control device 7 can specify the position and orientation (in other words, the posture) of each part of the work W (for example, each part of the surface of the work W) in the stage coordinate system.
  • the machining system SYS can appropriately perform additional machining on the work W whose position and orientation are known from the work information in the modeling operation described later based on the work information.
  • the machining system SYS performs at least one of the first work model alignment operation, the second work model alignment operation, and the third work model alignment operation as the work model alignment operation. Therefore, in the following, the first to third work alignment operations will be described in order.
  • the machining system SYS does not have to perform the work model alignment operation. For example, when the work information is input to the machining system SYS via the input device 92, the machining system SYS does not have to perform the work model alignment operation.
  • FIG. 14 is a flowchart showing the flow of the first work model alignment operation.
  • the work W is placed on the mounting surface 311 of the stage 31 (step S121). After that, the measuring device 7 measures the work W (step S122).
  • the control device 7 After that, the control device 7 generates work information based on the measurement result of the measuring device 8 in step S122 (step S123). Specifically, as described above, the control device 7 generates measurement information regarding the work W measured by the measuring device 8 based on the measurement result of the measuring device 8 (that is, the imaging result of the imaging device 82).
  • the measurement information includes measurement shape information regarding the shape of the work W. This measured shape information is used as it is as the work shape information. Further, the measurement information includes measurement position information regarding the position of the work W. However, the measurement position information is information regarding the position of the work W in the measurement coordinate system. Therefore, the control device 7 converts the position of the work W in the measurement coordinate system indicated by the measurement position information into the position of the work W in the stage coordinate system.
  • the information about the position of the work W in the stage coordinate system acquired by the conversion is used as the work position information.
  • the control device 7 can generate work information in which the work position information and the work shape information correspond to each other. That is, the control device 7 can generate work information about the work model WM corresponding to the actual work W.
  • FIG. 15 is a flowchart showing the flow of the second work model alignment operation.
  • the work W is placed on the mounting surface 311 of the stage 31 (step S131). After that, the measuring device 7 measures the work W (step S132).
  • the control device 7 acquires work model data corresponding to the shape of the work W mounted on the mounting surface 311 in tandem with or in parallel with the processing of steps S131 to S132 (step S133). Specifically, the control device 7 acquires work model data indicating a work model WM having the same or similar shape as the work W.
  • the work model data includes work model feature information regarding the features of the work model WM.
  • the work model data includes at least work model shape information regarding the shape of the work model WM, which is an example of the features of the work model WM.
  • the work model data may be recorded in a memory (that is, a recording medium) included in the control device 7.
  • the work model data may be recorded on an arbitrary recording medium (for example, a hard disk or a semiconductor memory) built in the control device 7 or externally attached to the control device 7.
  • the control device 7 may acquire the work model data by reading the work model data from these recording media by using the input device 92 as needed.
  • the work model data may be recorded in a device external to the control device 7.
  • the work model data may be recorded in an external device of the processing system SYS.
  • the control device 7 may acquire the work model data by downloading the work model data from an external device by using the input device 92 as needed.
  • a plurality of work model data indicating a plurality of work model WMs having a plurality of different shapes may be recorded on the recording medium (or an external device).
  • the control device 7 may acquire one work model data corresponding to the shape of the work W from the plurality of work model data.
  • the control device 7 can appropriately acquire one work model data corresponding to the shape of the work W.
  • a single work model data may be recorded on the recording medium (or an external device).
  • the control device 7 may acquire work model data based on the instruction of the user of the processing system SYS. Specifically, the control device 7 may control the display 91 so as to display a plurality of work model WMs. Further, the control device 7 displays a GUI for allowing the user to select any one of the plurality of work model WMs as a work model WM having the same or similar shape as the work W.
  • the display 91 may be controlled.
  • the user may grasp the shape of the work W by visually recognizing the work W, and may select a work model WM having the same or similar shape as the grasped work W by using the input device 92.
  • the control device 7 acquires the work model data indicating the work model WM selected by the user.
  • the control device 7 indicates a work model WM having the same or similar shape as the predetermined shape of the work W.
  • Work model data may be acquired.
  • the control device 7 may modify the work model WM indicated by the acquired work model data based on the user's instruction. For example, the control device 7 may modify the characteristics (for example, at least one of the shape and the size) of the work model WM based on the instruction of the user.
  • the work model data related to the modified work model WM is used in the subsequent processing.
  • the control device 7 acquires the work model shape information regarding the shape of the work model WM from the work model data. Since the shape of the work model WM is the same as or similar to the shape of the work W, the work model shape information can be regarded as equivalent to the information regarding the shape of the work W.
  • the measurement information generated based on the measurement result of the measuring device 8 also includes the measurement shape information regarding the shape of the work W. However, the accuracy of the shape of the work W indicated by the measured shape information may be lower than the accuracy of the shape of the work model WM indicated by the work model shape information due to the measurement error of the measuring device 8. Therefore, in the first embodiment, the control device 7 uses the work model shape information acquired from the work model data as the work shape information instead of the measurement shape information included in the measurement information.
  • the work model shape information is information separate from the measurement information generated based on the measurement result of the measuring device 8. Therefore, the work model shape information is not associated with information regarding the position of the work W on the mounting surface 311. That is, the control device 7 cannot specify at which position the work model WM (that is, the work W) is arranged on the mounting surface 311 only by referring to the work model shape information. Further, the control device 7 cannot specify the posture in which the work model WM (that is, the work W) is arranged on the mounting surface 311 only by referring to the work model shape information. Further, the control device 7 cannot specify how large the work model WM (that is, the work W) has on the mounting surface 311 only by referring to the work model shape information.
  • the control device 7 associates the measurement position information regarding the position of the work W included in the measurement information with the work model shape information.
  • the control device 7 can specify the position of the work model WM on the mounting surface 311 in addition to the shape of the work model WM by associating the measurement position information with the work model shape information. Generate information.
  • the position of the work model WM on the mounting surface 311 can be used as the position of the work W on the mounting surface 311. Therefore, the control device 7 can generate work information that can specify the position of the work W on the mounting surface 311 (and, of course, the shape can also be specified).
  • the control device 7 can function as an arithmetic unit that associates the measurement position information with the work model shape information.
  • the control device 7 generates measurement information including the measurement shape information and the measurement position information in a state of being associated with each other, based on the measurement result of the measurement device 8. After that, the control device 7 performs an alignment process for arranging the work model WM at the position of the work W indicated by the measurement position information. That is, the control device 7 performs the alignment process of moving, enlarging, reducing and / or rotating the work model WM to bring it closer to the work W indicated by the measured shape information. As a result, the position of the work model WM on the mounting surface 311 (that is, the position of the work W on the mounting surface 311) is determined. Therefore, the control device 7 can generate work information based on the result of the alignment process.
  • control device 7 is a measurement feature point that is a feature point of the work W (specifically, a feature point of the work W that can be identified from the measurement information) based on the measurement information and corresponds to the work model extraction point. Is also extracted.
  • the control device 7 extracts a plurality of (for example, three or more) measurement feature points.
  • the control device 7 may extract the measurement feature points based on the operation for designating the measurement feature points performed by the user using the input device 92.
  • the control device 7 may extract the measurement feature points according to a predetermined extraction standard without requiring the operation of the user. After that, the control device 7 pattern-matches the work model WM and the work W indicated by the measurement information based on the work model feature points and the measurement feature points.
  • the work model feature points are the measurement feature points, as shown in FIG. 16, which is a conceptual diagram conceptually showing how the work model WM and the work W indicated by the measurement information are pattern-matched.
  • the work model WM is translated, enlarged, reduced and / or rotated so as to approach.
  • the control device 7 translates, enlarges, reduces and / or rotates the work model WM until the deviation between the work model feature point and the measurement feature point becomes a predetermined amount or less (typically, until it becomes the minimum).
  • the work model WM is arranged at the same position as the arrangement position of the work W indicated by the measurement information in the measurement coordinate system.
  • the control device 7 can specify the position of the work model WM in the measurement coordinate system.
  • the position of the work model WM in the measurement coordinate system is converted to the position of the work model WM in the stage coordinate system as described above.
  • information on the position of the work model WM that can be used as the work position information is acquired. That is, the work information corresponding to the work model shape information that can be used as the work shape information and the information about the position of the work model WM that can be used as the work position information is acquired as the information about the work model WM.
  • the control device 7 may perform the alignment process by using an arbitrary algorithm for performing the alignment process.
  • an arbitrary algorithm for performing the alignment process there is an ICP (Interactive Closet Point) algorithm for aligning a plurality of point clouds (for example, a point cloud including the above-mentioned work model feature points and a point cloud including the measurement feature points). Be done.
  • ICP Interactive Closet Point
  • the shape of the work model WM (that is, the shape of the work W) indicated by the work information can be more accurate than that of the first work model alignment operation.
  • the accuracy of the shape of the work W indicated by the measured shape information may be lower than the accuracy of the shape of the work model WM indicated by the work model shape information. Therefore, by using the work information generated by the second work model alignment operation, the machining system SYS may be able to form the three-dimensional structure ST with higher accuracy by the modeling operation described later. ..
  • the control device 7 has the measurement result (particularly, measurement position information) of the measurement device 8 included in the processing system SYS and the work model data (particularly) acquired in step S133. , Work model shape information) and work information is generated. That is, the control device 7 associates the measurement position information generated from the measurement result of the measurement device 8 included in the processing system SYS with the work model shape information. However, even if the control device 7 acquires the measurement position information from the outside of the processing system SYS via the input device 92 and generates the work information based on the acquired measurement position information and the work model shape information. Good. That is, the control device 7 may associate the measurement position information acquired from the outside of the processing system SYS via the input device 92 with the work model shape information.
  • step S134 of FIG. 15 the control device 7 included in the processing system SYS associates the measurement position information with the work model shape information.
  • an external device of the processing system SYS may associate the measurement position information with the work model shape information.
  • the control device 7 may transmit (that is, output) the measurement position information, the model shape information, and the external device of the processing system SYS via the network.
  • FIG. 17 is a flowchart showing the flow of the third work model alignment operation.
  • the work W is placed on the mounting surface 311 of the stage 31 (step S141). After that, the measuring device 7 measures the work W (step S142).
  • step S142 acquires the work model data corresponding to the shape of the work W mounted on the mounting surface 311 (step S142). Since the process of step S142 may be the same as the process of step S133 in the second work model alignment operation described above, detailed description thereof will be omitted.
  • a certain point on the surface of the work model WM is designated as a user-designated point by the user (step S143).
  • the user uses the input device 92 to specify a user-designated point.
  • the control device 7 controls the display 91 so as to display the work model WM indicated by the work model data acquired in step S142, and the user controls the display 91 so as to display the work model WM, and the user can use the user designated point on the work model WM displayed on the display 91. May be specified.
  • the user-designated point may be a characteristic point on the surface of the work model WM.
  • the vertices, the corners, the points located on the most + Z side, the points located on the most -Z side, the points located on the most + X side, and the points located on the most -X side At least one of a point, a point located on the most + Y side, and a point located on the most ⁇ Y side can be mentioned.
  • the user-specified point may be any point as long as it is a point on the surface of the work model WM.
  • the head drive system 22 has a desired third positional relationship between the point on the work W (hereinafter, referred to as “work designated point”) corresponding to the user-designated point designated in step S143 and the modeling device 2.
  • the modeling head 21 is moved so that the position condition is satisfied (step S144).
  • the work designated point is typically the same as the user designated point.
  • the information regarding the third positional relationship is information known to the control device 7.
  • An example of a state in which the work designated point and the modeling device 2 have a desired third positional relationship is a state in which the modeling device 2 can process the work designated point. Since the modeling device 2 mainly processes the object at the additional processing position (that is, the focus position of the processing light EL), the additional processing is an example of a state in which the work designated point and the modeling device 2 have a desired third positional relationship. The state where the position is set to the work designated point can be mentioned. As described above, the plurality of guide light GLs emitted from the plurality of guide light emitting devices 24 intersect at the additional processing position.
  • a state in which a plurality of guide light GLs intersect at the work designated point can be mentioned. That is, as an example of a state in which the work designated point and the modeling apparatus 2 have a desired third positional relationship, a state in which a plurality of guide light GLs are applied to the work designated point can be mentioned.
  • the plurality of guide light emitting devices 24 emit a plurality of guide light GLs
  • the head drive system 22 emits a plurality of guide light GLs.
  • the modeling head 21 is moved so that the plurality of guide light GLs intersect at the designated point (step S144). That is, the head drive system 22 changes the relative positional relationship between the work W and the additional processing position so that the plurality of guide light GLs intersect at the work designated point by moving the modeling head 21.
  • FIG. 18 is a cross-sectional view showing how a plurality of guide light GLs intersect at a designated work point.
  • FIG. 19 is a cross-sectional view showing a state in which a plurality of guide light GLs do not intersect at a designated work point.
  • the state of the plurality of guide light GLs changes from the state shown in FIG. 19 to the state shown in FIG. 18 (that is, the point where the plurality of guide light GLs intersect approaches the work designated point. ), Move the modeling head 21.
  • the guide light GL can function as a guide light for aligning the work designated point and the modeling device 2 so that the work designated point and the modeling device 2 have a desired third positional relationship. Since the work designated point is designated on the surface of the work W, the guide light GL aligns the work W and the modeling device 2 so that the work designated point and the modeling device 2 have a desired third positional relationship. Can function as a guide light to do.
  • the control device 7 may control the head drive system 22 so that the modeling head 21 moves based on a user's instruction to move the modeling head 21. That is, the user may visually confirm whether or not the plurality of guide light GLs intersect at the work designated point, and the head drive system 22 may move the modeling head 21 based on the confirmation result by the user.
  • the user's instruction may be input via the input device 92.
  • the control device 7 controls the image pickup device 82 so as to image the state of the guide light GL on the work W, and displays the image pickup result of the image pickup device 82.
  • 91 may be controlled.
  • the control device 7 controls the other image pickup device so as to image the state of the guide light GL on the work W.
  • the display 91 may be controlled so as to display the imaging result of another imaging device.
  • the user may input an instruction to move the modeling head 21 by using the input device 92 while referring to the display content of the display 91.
  • the control device 7 may control the head drive system 22 so that the modeling head 21 moves based on the imaging result of the imaging device 82 (or the imaging result of another imaging device, the same applies hereinafter).
  • the wavelength of the guide light GL may be different from the wavelength of the processed light EL.
  • a filter that reflects the processing light EL and transmits the guide light GL is arranged on the most work W side of the optical system of the imaging device 82 or another imaging device. You may.
  • an infrared reflection filter may be used as the filter.
  • the image pickup result of the image pickup apparatus 82 is the surface of the work W (particularly, the work designation) as shown in FIG. 20A.
  • Point indicates that the beam spots of a plurality of guide light GLs overlap. That is, the imaging result of the imaging device 82 shows that a single beam spot is formed on the surface of the work W (particularly, the designated work point) as shown in FIG. 20 (a).
  • the imaging result of the imaging device 82 is the surface of the work W (particularly, the work designated point) as shown in FIG. 20 (b).
  • the control device 7 can determine whether or not a plurality of guide light GLs intersect at the work designated point based on the imaging result of the imaging device 82. If the plurality of guide light GLs do not intersect at the work designated point, the user or the control device 7 can change the state of the plurality of guide light GLs on the surface of the work W from the state shown in FIG. 20 (b) to FIG. 20 (a). ) Is changed (that is, a plurality of beam spots are approached), and the modeling head 21 is moved.
  • step S145 the position measuring device 23 measures the position of the modeling head 21 when a plurality of guide light GLs intersect at the work designated point (step S145). As described above, the plurality of guide light GLs intersect at the additional processing position. Therefore, in step S145, it can be said that the position measuring device 23 measures the position of the modeling head 21 in a state where the additional processing position is set at the work designated point.
  • step S145 it can be said that the position measuring device 23 measures the position of the modeling head 21 in a state where the work designated point can be processed. Further, since the additional processing position has a fixed positional relationship with respect to the modeling head 21, the operation of measuring the position of the modeling head 21 can be regarded as equivalent to the operation of indirectly measuring the additional processing position. Further, since the position of the modeling head 21 is measured with the additional processing position set at the work designated point, the operation of measuring the position of the modeling head 21 (that is, indirectly measuring the additional processing position) is performed. , It can be regarded as equivalent to the operation of indirectly measuring the position of the work designated point on the work W.
  • the control device 7 determines whether or not a new user-designated point should be designated (step S146). Specifically, the control device 7 may determine whether or not the desired number of user-designated points have been designated and the above-described processes of steps S144 and S145 have been performed for each of the desired number of user-designated points. Good. The desired number may be one, two, three, four, or five or more. When it is determined that the desired number of user-designated points has not been specified (as a result, the processes of steps S144 and S145 described above have not been performed for each of the desired number of user-designated points), the control device 7 may determine that a new user-designated point should be designated.
  • control device 7 when a desired number of user-designated points are specified and it is determined that the processes of steps S144 and S145 described above have been performed for each of the desired number of user-designated points, the control device 7 is newly added. It may be determined that the user-specified point does not have to be specified.
  • the position of the work W in the X-axis direction, the position in the Y-axis direction, and the position in the Z-axis direction can be calculated in step S148 described later.
  • the shape of the work W is information known to the control device 7 and the number of user-specified points is two, in addition to the position of the work W in the X-axis direction, the position in the Y-axis direction, and the position in the Z-axis direction. Therefore, the rotation ⁇ z around the Z axis of the work W can be calculated.
  • the position of the work W in the X-axis direction, the position in the Y-axis direction, and the Z-axis direction can be calculated.
  • step S147 when it is determined that a new user-designated point should be specified (step S147: Yes), a certain point on the surface of the work model WM by the user (however, until now, the user has been specified). A point that has never been designated as a point) is designated as a new user-designated point (step S147). After that, the processes of steps S144 and S145 described above are performed for the new user-designated points.
  • step S147 if it is determined as a result of the determination in step S146 that a new user-designated point does not have to be specified (step S147: No), the control device 7 measures the position measuring device 23 in step S145. Work information is generated based on the result and the work model data acquired in step S142 (step S148).
  • the measurement result of the position measuring device 23 in step S145 indicates the position of the modeling head 21 when the work designated point and the modeling device 2 have a desired third positional relationship. .. Therefore, the control device 7 can specify the position of the work designated point in the modeling coordinate system from the measurement result of the position measuring device 23. This is because the work designated point and the modeling device 2 have a desired third positional relationship, so that the work designated point and the modeling head 21 naturally have a third position that is known information to the control device 7. This is because it has a certain positional relationship that can be specified from the information on the relationship.
  • the control device 7 performs an alignment process for arranging the user-designated point of the work model WM at the position of the work designated point specified from the measurement result of the position measuring device 23. That is, the control device 7 performs the alignment process of moving, enlarging, reducing and / or rotating the work model WM indicated by the work model shape information to bring the user-designated point closer to the position of the work-designated point. As a result, the position of the work model WM on the mounting surface 311 is known. Therefore, the control device 7 generates work information based on the result of the alignment process. As the alignment process, the control device 7 may perform the same process as the alignment process used in the second work model alignment operation described above.
  • control device 7 uses an ICP (Interactive Closet Point) algorithm for aligning a plurality of point clouds (for example, a point cloud including a model designated point and a point cloud including a user designated point). Processing may be performed. Therefore, the details of the alignment process in the third work model alignment operation will be omitted.
  • ICP Interactive Closet Point
  • the control device 7 can generate work information without requiring the measurement device 8 to measure the work W. Therefore, even if the work W has a shape that is difficult to measure or cannot be measured by the measuring device 8, the control device 7 can generate the work information.
  • the modeling model alignment operation aligns the modeling model PM, which is a three-dimensional model of the three-dimensional structure ST to be formed by additional processing, with the work model WM indicated by the work information generated by the work model alignment operation. It is an operation.
  • the modeling model alignment operation is an operation of aligning the modeling model PM and the work model WM in the reference coordinate system.
  • the stage coordinate system is used as the reference coordinate system. Therefore, the modeling model alignment operation is an operation of aligning the modeling model PM and the work model WM in the stage coordinate system.
  • modeling information regarding the modeling model PM aligned with the work model WM is generated.
  • the modeling model information is information corresponding to the modeling position information regarding the position of the modeling model PM and the modeling shape information regarding the shape of the modeling model PM.
  • the "modeling information corresponding to the modeling position information and the modeling shape information" means information in a state in which both the position and the shape of each part of the modeling model PM can be specified. It should be noted that such modeling information does not have to include the modeling position information and the modeling shape information as separate and independent information, as long as both the position and shape of each part of the modeling model PM can be specified.
  • the modeling information may have any data structure.
  • the modeling shape information is information on the positions of the pixels (in other words, volume elements, so-called voxels) constituting the modeling model PM (that is, data indicating the shape of the modeling model PM using the information on the pixel positions). It may be included.
  • the modeling shape information may include polygon data of the modeling model PM.
  • the modeling shape information may include cross-sectional shape data regarding the cross section of each layer obtained by slicing the modeling model PM (that is, slicing the modeling model PM to a predetermined thickness in an arbitrary surface direction).
  • the control device 7 is as shown in FIG. 21, which is a perspective view showing the work W and the three-dimensional structure ST in the stage coordinate system.
  • the positional relationship between the work W and the three-dimensional structure ST to be formed on the work W can be specified in the stage coordinate system. That is, the control device 7 can specify at which position on the work W the three-dimensional structure ST should be formed in the stage coordinate system.
  • the control device 7 can specify what kind of posture the three-dimensional structure ST should have on the work W in the stage coordinate system.
  • the control device 7 can specify what size the three-dimensional structure ST should have on the work W in the stage coordinate system.
  • the processing system SYS can form the three-dimensional structure ST at an appropriate position on the work W in the modeling operation described later based on the modeling information (furthermore, the work information if necessary). .. That is, the processing system SYS forms a three-dimensional structure ST having an appropriate shape according to the modeling information at an appropriate position specified by the modeling information on the work W whose position and shape can be specified by the workpiece information. can do.
  • the processing system SYS does not have to perform the modeling model alignment operation. For example, when the modeling information is input to the processing system SYS via the input device 92, the processing system SYS does not have to perform the modeling model alignment operation.
  • FIG. 22 is a flowchart showing the flow of the modeling model alignment operation.
  • the control device 7 acquires modeling model data corresponding to the shape of the three-dimensional structure ST to be formed by additional processing (step S151). Specifically, the control device 7 acquires modeling model data indicating a modeling model PM having the same or similar shape as the shape of the three-dimensional structure ST.
  • the modeling model data includes modeling model feature information regarding the features of the modeling model PM.
  • the modeling model data includes at least modeling model shape information regarding the shape of the modeling model PM, which is an example of the features of the modeling model PM.
  • the modeling model data may be recorded in a memory (that is, a recording medium) included in the control device 7.
  • the modeling model data may be recorded on an arbitrary recording medium (for example, a hard disk or a semiconductor memory) built in the control device 7 or externally attached to the control device 7.
  • the control device 7 may acquire the modeling model data by reading the modeling model data from these recording media by using the input device 92 as needed.
  • the modeling model data may be recorded in a device external to the control device 7.
  • the modeling model data may be recorded in an external device of the processing system SYS. In this case, the control device 7 may acquire the modeling model data by downloading the modeling model data from an external device via the input device 92.
  • a plurality of modeling model data indicating a plurality of modeling model PMs having a plurality of different shapes may be recorded on the recording medium (or an external device).
  • the control device 7 may acquire one modeling model data corresponding to the shape of the three-dimensional structure ST from the plurality of modeling model data.
  • the control device 7 appropriately obtains one modeling model data corresponding to the shape of the three-dimensional structure ST. Can be obtained.
  • a single modeling model data is recorded on the recording medium (or an external device). May be good.
  • the control device 7 may acquire modeling model data based on the instruction of the user of the processing system SYS. Specifically, the control device 7 may control the display 91 so as to display a plurality of modeling model PMs. Further, the control device 7 displays a GUI for allowing the user to select any one of the plurality of modeling model PMs as a modeling model PM having the same or similar shape as the shape of the three-dimensional structure ST. As such, the display 91 may be controlled.
  • the user may use the input device 92 to select a modeling model PM having the same or similar shape as the shape of the three-dimensional structure ST to be formed by additional processing. As a result, the control device 7 acquires the modeling model data indicating the modeling model PM selected by the user.
  • the control device 7 has a modeling model having the same or similar shape as the predetermined shape of the three-dimensional structure ST.
  • the modeling model data indicating PM may be acquired.
  • the control device 7 may modify the modeling model PM indicated by the acquired modeling model data based on the user's instruction. For example, the control device 7 may modify the characteristics (for example, at least one of the shape and the size) of the modeling model PM based on the instruction of the user. When the characteristics of the modeling model PM are modified, the modeling model data related to the modified modeling model PM is used in the subsequent processing.
  • the control device 7 controls the display 91 so as to display the work model WM based on the work information (step S152). That is, the control device 7 displays the image showing the work model WM having the shape indicated by the work information at the position indicated by the work information (that is, the position of the actual work W) in the stage coordinate system. To control. At this time, the control device 7 may control the display 91 so as to display the work model WM together with the stage 3 (particularly, the mounting surface 311). Alternatively, the control device 7 may control the display 91 so as to display the actual work W (that is, an image showing the actual work W). For example, the control device 7 may control the display 91 so as to display the imaging result of the imaging device 82 that is imaging the actual work W. Note that FIG. 23 shows a display example of the work model WM.
  • the control device 7 receives an input from the user for aligning the work model WM and the modeling model PM (that is, aligning the work W and the modeling model PM) (step S153).
  • the work model WM is displayed on the display 91 in step S152. Therefore, in step S153, the control device 7 may accept an input from the user for designating the position of the modeling model PM with respect to the work model WM displayed on the display 91. Therefore, the input device 92 may be referred to as a designated device because it is a device used to specify the position of the modeling model PM.
  • the user specifies a position where at least a part of the three-dimensional structure ST should be formed by additional processing (that is, a modeling position where at least a part of the three-dimensional structure ST should be formed) as a position of the modeling model PM.
  • the modeling position may include a position where at least a part of the three-dimensional structure ST formed by the addition processing is distributed.
  • the modeling position may include a position where additional processing is performed to form at least a part of the three-dimensional structure ST. Since the additional processing is performed at the above-mentioned additional processing position (typically, the focus position of the processing light EL), the modeling position is set so that the additional processing position forms at least a part of the three-dimensional structure ST. It may include the position to be set.
  • the modeling position is the processing light for forming at least a part of the three-dimensional structure ST. It may include a position where the EL is irradiated (that is, a position where the irradiation region EA is set). Since the additional processing is performed at the position where the modeling material M is supplied (that is, the position where the supply region MA is set), the modeling position is the modeling material for forming at least a part of the three-dimensional structure ST. It may include a position where M is supplied (that is, a position where the supply area MA is set).
  • the modeling position may include a position where additional processing for forming the three-dimensional structure ST is started (that is, a modeling start position).
  • the modeling position may include a position where the additional processing for forming the three-dimensional structure ST ends (that is, the modeling end position).
  • the modeling position may include a position where a feature point of the three-dimensional structure ST should be formed.
  • the characteristic points of the three-dimensional structure ST the apex, the angle, the point located on the most + Z side, the point located on the most -Z side, the point located on the most + X side, and the point located on the most -X side.
  • At least one of a point, a point located on the most + Y side, and a point located on the most ⁇ Y side can be mentioned.
  • the user may specify a position having a predetermined positional relationship with the above-mentioned modeling position as the position of the modeling model PM. ..
  • the user may specify a position offset by a predetermined distance in a predetermined direction from the above-mentioned modeling position as the position of the modeling model PM.
  • the user may specify the position of the modeling model PM by using the input device 92.
  • the user may specify the position of the modeling model PM on the display screen of the display 91 on which the work model WM is displayed in step S152.
  • the user uses the input device 92 to move the pointer 911 for designating the position of the modeling model PM, and the pointer 911 to the position desired to be designated as the position of the modeling model PM.
  • the position of the pointer 911 may be designated as the position of the modeling model PM at the timing when is positioned.
  • the user may specify the position of the modeling model PM by using the guide light GL emitted by the guide light emitting device 24 described above.
  • the user uses the input device 92 to move the modeling head 21 to move a plurality of guide light GLs with respect to the work W, and at the same time, a plurality of guide light GLs at positions desired to be designated as positions of the modeling model PM.
  • the position where the plurality of guide light GLs intersect at the timing when the two guide lights intersect may be designated as the position of the modeling model PM.
  • the control device 7 may control the display 91 so as to display the position designated as the position of the modeling model PM in association with the work model WM.
  • the control device 7 is a display object 912 indicating a position designated as a position of the modeling model PM (in the example shown in FIG. 24, a display object indicating a white circle). ) May be controlled so that the display 91 is displayed in a display mode in which the positional relationship between the display object and the work model WM can be specified.
  • the user may specify a single position as the position of the modeling model PM.
  • the position specified by the user may be specified as the position of a part of the modeling model PM (that is, the position (region) where the part of the three-dimensional structure ST should be formed).
  • a region determined according to the position designated by the user may be designated as the position of the modeling model PM (that is, the position where the three-dimensional structure ST should be formed).
  • the area determined according to the position specified by the user the area including the position specified by the user, the area centered on the position specified by the user, the area having the position specified by the user as the apex, and the user. At least one of an area defined by a boundary including the position specified by the user and an area having a predetermined positional relationship with respect to the position specified by the user can be mentioned.
  • the user may specify a plurality of positions as the positions of the modeling model PM as shown in FIG. 25 showing a display example of the work model WM.
  • the area surrounded by the plurality of positions specified by the user is designated as the position of the modeling model PM (that is, the position where the three-dimensional structure ST should be formed).
  • You may.
  • a region having a predetermined positional relationship with respect to a plurality of positions designated by the user may be designated as a position of the modeling model PM (that is, a position where the three-dimensional structure ST should be formed).
  • the user may specify a single position as the position of the modeling model PM and also specify the posture of the modeling model PM.
  • the control device 7 uses the work W as shown in FIG. 26 showing a display example of the display 91.
  • the work model WM may be displayed in a display mode in which a defective surface portion of the surface of the work W and a non-defective surface portion of the surface of the work W can be distinguished.
  • the surface portion of the surface of the work W where the defect is generated is set as the modeling position. You may specify.
  • the control device 7 When accepting an input for designating the position of the modeling model PM, the control device 7 adds the modeling WM (or the actual work W) to the modeling as shown in FIG. 27 showing an example of display on the display 91.
  • the display 91 may be controlled to display the model PM (that is, the image of the modeling model PM). That is, the control device 7 may control the display 91 so as to display the modeling model PM arranged at the position designated by the user.
  • the user may specify the position of the modeling model PM by moving the modeling model PM on the display screen of the display 91 on which the modeling model PM is displayed by using the input device 92.
  • the user can intuitively specify the position of the modeling model PM.
  • the control device 7 may accept from the user an input for designating the posture of the modeling model PM with respect to the work model WM in addition to the input for designating the position of the modeling model PM with respect to the work model WM.
  • the control device 7 may accept from the user an input for designating the size of the modeling model PM with respect to the work model WM in addition to the input for designating the position of the modeling model PM with respect to the work model WM.
  • the user may use the input device 92 to specify the orientation and / or size of the modeling model PM.
  • the user can translate, rotate, enlarge, and / or reduce the modeling model PM by using the input device 92 on the display screen of the display 91 on which the modeling model PM is displayed, so that the position of the modeling model PM can be determined.
  • the posture and / or the posture may be specified.
  • the control device 7 can generate modeling position information regarding the position of the modeling model PM in the stage coordinate system.
  • the control device 7 generates modeling information in which the modeling position information regarding the position of the modeling model PM and the modeling shape information regarding the shape of the modeling model PM correspond to each other (step S154). That is, the control device 7 generates modeling information regarding the modeling model PM whose position and shape in the stage coordinate system are fixed.
  • control device 7 may modify the modeling information generated in step S154, if necessary.
  • the three-dimensional structure ST is formed on the work W. That is, the modeling model PM and the work model WM are aligned so that the modeling model PM is arranged on the work model WM.
  • the modeling information generated in step S154 is used depending on the relationship between the shape of the surface of the modeling model PM facing the work model WM side and the shape of the surface of the work model WM facing the modeling model PM side.
  • the modeling information generated in step S154 is used.
  • the three-dimensional structure ST cannot be formed on the work W. Specifically, as shown in FIG.
  • the modeling information can be used as 3 There is a possibility that a gap is formed between the dimensional structure ST and the work W. Alternatively, if the modeling information is used, there is a possibility that a three-dimensional structure ST that partially bites into the work W is formed.
  • the control device 7 may modify the modeling information.
  • FIG. 29 which is a cross-sectional view conceptually showing a modification example of the modeling information together with the modeling model PM and the work model WM
  • the control device 7 is a modeling model PM indicated by the modified modeling information.
  • the modeling information (particularly, the modeling shape information) may be modified so that the shape of the surface PMa has a complementary relationship with the shape of the surface WMa of the work model WM.
  • FIGS. 30 (a) to 30 (c) An example of a method of modifying the modeling information as shown in FIG. 29 is shown in FIGS. 30 (a) to 30 (c).
  • FIGS. 30 (a) to 30 (c) is a cross-sectional view conceptually showing an example of a method of modifying the modeling information together with the work model WM and the modeling model PM.
  • the control device 7 brings the modeling model PM and the work model WM close to each other until there is no gap between the surface PMa of the modeling model PM and the surface WMa of the work model WM. That is, the control device 7 causes the modeling model PM to bite into the work model WM until there is no gap between the surface PMa of the modeling model PM and the surface WMa of the work model WM.
  • the control device 7 calculates the thickness D of the overlapping portion between the modeling model PM and the work model WM (that is, the amount of the modeling model PM biting into the work model WM) D.
  • the control device 7 adds a cutting allowance model CM, which is a three-dimensional model corresponding to a modeled object having a thickness D, to the surface PMa before modification of the modeling model PM.
  • the control device 7 cuts the surface CMa facing the work model WM of the cutting allowance model CM so as to have a complementary relationship with the shape of the surface WMa of the work model WM. Partially cut the substitute model CM.
  • the modified modeling information includes the position and position of the three-dimensional model (that is, the modified modeling model PM) including the partially cut cutting allowance model CM and the modified modeling model PM.
  • the modeling information (particularly, the modeling shape information) may be modified to include information about the shape.
  • FIGS. 31 (a) to 31 (c) are cross-sectional views conceptually showing another example of the method of modifying the modeling information together with the work model WM and the modeling model PM.
  • the control device 7 brings the modeling model PM and the work model WM close to each other until there is no gap between the surface PMa of the modeling model PM and the surface WMa of the work model WM.
  • the control device 7 calculates the thickness D of the overlapping portion between the modeling model PM and the work model WM (that is, the amount of the modeling model PM biting into the work model WM) D.
  • the control device 7 cuts a portion of the modeling model PM that overlaps with the work model WM. Further, the control device 7 cuts a portion of the modeling model PM other than the lower end portion having the thickness D. As a result, the lower end portion of the modeling model PM having the thickness D and not overlapping with the work model WM remains as the repair model RM.
  • the shape of the surface RMa of the repair model RM facing the work model WM is complementary to the shape of the surface WMa of the work model WM.
  • This repair model RM can be regarded as equivalent to a three-dimensional model of the modeled object for filling the gap between the surface PMa of the model PM and the surface WMa of the work model WM.
  • the repair model RM is added to the lower end of the modeling model PM.
  • the three-dimensional model including the repair model RM and the modeling model PM is used as a new (that is, modified) modeling model PM. Therefore, in the control device 7, the modified modeling information includes information regarding the position and shape of the three-dimensional model (that is, the modified modeling model PM) including the repair model RM and the modified modeling model PM. , The modeling information (particularly, the modeling shape information) may be modified.
  • the modeling operation is an operation for actually forming the three-dimensional structure ST on the work W.
  • the processing system SYS forms the three-dimensional structure ST by the laser overlay welding method. Therefore, the processing system SYS may form the three-dimensional structure ST by performing the existing modeling operation based on the laser overlay welding method.
  • the existing modeling operation based on the laser overlay welding method.
  • the processing system SYS forms a three-dimensional structure ST whose position and shape are specified by the above-mentioned modeling model alignment operation on the work W whose position and shape are specified by the above-mentioned work model alignment operation. That is, the machining system SYS is a three-dimensional structure having a desired shape at a desired position on the work W based on the work information generated by the work model alignment operation described above and the modeling information generated by the modeling model alignment operation described above.
  • Form ST is a three-dimensional structure having a desired shape at a desired position on the work W based on the work information generated by the work model alignment operation described above and the modeling information generated by the modeling model alignment operation described above.
  • the processing system SYS forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SLs arranged along the Z-axis direction in order.
  • structural layers layered partial structures
  • the processing system SYS sequentially forms a plurality of structural layers SL obtained by cutting the three-dimensional structure ST into round slices along the Z-axis direction.
  • a three-dimensional structure ST which is a laminated structure in which a plurality of structural layers SL are laminated, is formed.
  • the flow of the operation of forming the three-dimensional structure ST by forming the plurality of structural layers SL one by one in order will be described.
  • each structural layer SL Under the control of the control device 7, the processing system SYS sets an irradiation region EA in a desired region on the modeling surface MS corresponding to the surface of the work W or the surface of the formed structural layer SL, and the irradiation region EA is set with respect to the irradiation region EA.
  • the processing light EL is irradiated from the irradiation optical system 211.
  • the region occupied by the processed light EL emitted from the irradiation optical system 211 on the modeling surface MS may be referred to as an irradiation region EA.
  • the focus position (that is, the condensing position) of the processed light EL coincides with the modeling surface MS.
  • the molten pool (that is, the pool of metal melted by the processing light EL) MP is generated in the desired region on the modeling surface MS by the processing light EL emitted from the irradiation optical system 211. It is formed.
  • the processing system SYS sets a supply region MA in a desired region on the modeling surface MS under the control of the control device 7, and supplies the modeling material M to the supply region MA from the material nozzle 212.
  • the processing system SYS supplies the modeling material M to the molten pool MP from the material nozzle 212.
  • the modeling material M supplied to the molten pool MP melts.
  • the processing light EL is not irradiated to the molten pool MP as the modeling head 21 moves, the modeling material M melted in the molten pool MP is cooled and solidified (that is, solidified) again.
  • the solidified modeling material M is deposited on the modeling surface MS. That is, a modeled object is formed by the deposit of the solidified modeling material M.
  • a series of modeling processes including formation of the molten pool MP by irradiation with such processing light EL, supply of the modeling material M to the molten pool MP, melting of the supplied modeling material M, and solidification of the molten modeling material M can be performed.
  • the modeling head 21 is repeatedly moved relative to the modeling surface MS along the XY plane. That is, when the modeling head 21 moves relative to the modeling surface MS, the irradiation region EA also moves relative to the modeling surface MS. Therefore, a series of modeling processes is repeated while moving the irradiation region EA relative to the modeling surface MS along the XY plane (that is, in the two-dimensional plane).
  • the processed light EL is selectively irradiated to the irradiation region EA set in the region where the modeled object is to be formed on the modeling surface MS, but it is not desired to form the modeled object on the modeling surface MS.
  • the irradiation area EA set in the area is not selectively irradiated (it can be said that the irradiation area EA is not set in the area where the modeled object is not to be formed). That is, the processing system SYS moves the irradiation region EA along the predetermined movement locus on the modeling surface MS, and converts the processing light EL into the modeling surface MS at a timing according to the distribution mode of the region where the modeled object is to be formed. Irradiate.
  • the mode of distribution of the region where the modeled object is to be formed may be referred to as a distribution pattern or a pattern of the structural layer SL.
  • the molten pool MP also moves on the modeling surface MS along the movement locus according to the movement locus of the irradiation region EA.
  • the molten pool MP is sequentially formed on the modeling surface MS in the portion of the region along the movement locus of the irradiation region EA that is irradiated with the processing light EL.
  • the supply region MA also moves on the modeling surface MS along the movement locus according to the movement locus of the irradiation region EA. Become.
  • a structural layer SL corresponding to an aggregate of the modeled objects made of the solidified modeling material M is formed on the modeling surface MS. That is, the structural layer SL corresponding to the aggregate of the shaped objects formed on the modeling surface MS in the pattern corresponding to the moving locus of the molten pool MP (that is, the shape corresponding to the moving locus of the molten pool MP in a plan view).
  • the structural layer SL) to have is formed.
  • At this time, at least a part of the side surface of the structural layer SL may be parallel to at least a part of the side surface of the work W. That is, the processing system SYS may form a structural layer SL including a surface parallel to at least a part of the side surface of the work W on the upper surface of the work W having a flat side surface.
  • FIG. 32 (e) shows an example in which at least a part of the side surface of the structural layer SL and at least a part of the side surface of the work W are parallel to the Z axis.
  • the processing light EL may be irradiated to the irradiation region EA and the supply of the modeling material M may be stopped. Further, when the irradiation region EA is set in the region where the modeled object is not to be formed, the modeling material M is supplied to the irradiation region EL, and the irradiation region EL is irradiated with the processing light EL having a strength that does not allow the molten pool MP. You may. In the above description, the irradiation area EA is moved with respect to the modeling surface MS, but the modeling surface MS may be moved with respect to the irradiation area EA.
  • the processing system SYS repeatedly performs the operation for forming such a structural layer SL under the control of the control device 7 based on the modeling information (that is, the information regarding the modeling model PM). Specifically, first, the modeling model PM indicated by the modeling information is sliced at a stacking pitch to create slice data. Note that this slice data may be partially modified according to the characteristics of the processing system SYS.
  • the processing system SYS performs an operation for forming the first structural layer SL # 1 on the modeling surface MS corresponding to the surface of the work W, that is, three-dimensional model data corresponding to the structural layer SL # 1, that is, the structural layer. This is performed based on the slice data corresponding to SL # 1.
  • the processing system SYS uses information on the tool path which is the locus of the irradiation region EA (supply region MA) passing through the region where the structural layer SL # 1 exists in the slice data corresponding to the structural layer SL # 1. May be operated. As a result, the structural layer SL # 1 is formed on the modeling surface MS as shown in FIG. 33A.
  • the structural layer SL # 1 is integrated (in other words, bonded) with the modeling surface MS. That is, the structural layer SL # 1 is integrated (in other words, combined) with the work W.
  • the processing system SYS sets the surface (that is, the upper surface) of the structural layer SL # 1 on the new modeling surface MS, and then forms the second structural layer SL # 2 on the new modeling surface MS.
  • the control device 7 first controls the head drive system 22 so that the modeling head 21 moves along the Z axis. Specifically, the control device 7 controls the head drive system 22 so that the irradiation region EA and the supply region MA are set on the surface of the structural layer SL # 1 (that is, the new modeling surface MS). The modeling head 21 is moved toward the + Z side. As a result, the focus position of the processing light EL coincides with the new modeling surface MS. After that, the processing system SYS operates on the structural layer SL # 1 based on the slice data corresponding to the structural layer SL # 2 in the same operation as the operation of forming the structural layer SL # 1 under the control of the control device 7.
  • the structural layer SL # 2 is formed on the surface. As a result, the structural layer SL # 2 is formed as shown in FIG. 33 (b).
  • the structural layer SL # 1 is integrated (in other words, bonded) with the modeling surface MS. That is, the structural layer SL # 1 is integrated (in other words, bonded) with the structural layer SL # 2.
  • the same operation is repeated until all the structural layers SL constituting the three-dimensional structure ST to be formed on the work W are formed.
  • the three-dimensional structure ST is formed by the laminated structure in which a plurality of structural layers SL are laminated.
  • the side surface of the three-dimensional structure ST composed of the plurality of structural layer SL At least a part may also be parallel to at least a part of the side surface of the work W. That is, the processing system SYS may form a three-dimensional structure ST including a surface parallel to at least a part of the side surface of the work W on the upper surface of the work W having a planar side surface.
  • the three-dimensional structure ST formed in this way is typically integrated with the work W (in other words, it is combined). That is, the processing system SYS forms a three-dimensional structure ST integrated (in other words, combined) with the work W.
  • the processing system SYS forms a three-dimensional structure ST integrated (in other words, combined) with the work W.
  • the relative positions of the work W and the 3D structure ST are fixed (that is, maintained). ). That is, it can be said that the machining system SYS forms a three-dimensional structure ST whose relative position with respect to the work W is fixed.
  • the machining system SYS can generate work information by a work model alignment operation and can form a three-dimensional structure ST on a work W whose position and shape are specified based on the generated work information. Therefore, the machining system SYS can appropriately form the three-dimensional structure ST on the work W as compared with the case where the work information is not used. Further, since the work information is mainly generated by the machining system SYS, the load on the user is reduced as compared with the case where the work information is generated by the user himself / herself.
  • the processing system SYS can generate modeling position information by the modeling model alignment operation, and can form a three-dimensional structure ST whose position is specified based on the generated modeling position information on the work W. Therefore, the processing system SYS can appropriately form the three-dimensional structure ST on the work W as compared with the case where the modeling position information is not used. Further, since the modeling position information is mainly generated by the processing system SYS, the load on the user is reduced as compared with the case where the modeling position information is generated by the user himself / herself.
  • machining system SYSA Processing system SYS of the second embodiment
  • FIG. 34 is a system configuration diagram showing an example of the system configuration of the processing system SYSa of the second embodiment.
  • FIG. 35 is a perspective view showing an external structure of a processing unit UNTa2 included in the processing system SYSa of the second embodiment.
  • the constituent requirements already explained will be designated by the same reference numerals, and detailed description thereof will be omitted.
  • the processing system SYSa includes a modeling unit UNTa1, a processing unit UNTa2, and a transfer device 10a.
  • the modeling unit UNTa1 includes a material supply device 1, a modeling device 2, a stage device 3, a light source 4, a gas supply device 5, a housing 6, and a control device. 7, a measuring device 8, a display 91, and an input device 92. Therefore, the modeling unit UNTa1 can form the three-dimensional structure ST on the work W by performing the coordinate matching operation, the work model alignment operation, the modeling model alignment operation, and the modeling operation in the same manner as the processing system SYS. it can.
  • the modeling unit UNTa1 is different from the processing system SYS in that it further includes an output device 93a. Other features of the modeling unit UNTa1 may be the same as other features of the processing system SYS.
  • the output device 93a is a device that outputs information to the outside of the modeling unit UNTa1.
  • the output device 93a may output information to the user of the modeling unit UNTa1 and / or the user of the processing unit UNTa2.
  • the output device 93a may output information to a device outside the modeling unit UNTa1.
  • the output device 93a may output information to the processing unit UNTa2.
  • the output device 93a may output information to a recording medium that can be attached to the modeling unit UNTa1.
  • Examples of the output device 93a include at least one of a display capable of outputting information as an image and a speaker capable of outputting information as audio.
  • Another example of the output device 93a is an interface device for connecting to an external device of the modeling unit UNTa1. As another example of the output device 93a, there is a writing device that can write to a recording medium that can be attached to the modeling unit UNTa1.
  • the information output by the output device 93a may include information about the modeling unit UNTa1.
  • the information about the modeling unit UNTa1 may include, for example, information about an operation performed by the modeling unit UNTa1 (for example, a coordinate matching operation, a work model alignment operation, a modeling model alignment operation and / or a modeling operation).
  • the processing unit UNTa2 processes the object to be processed.
  • the object to be processed includes the three-dimensional structure ST (that is, the three-dimensional structure ST formed by the above-mentioned modeling unit UNTa1).
  • the machining operation performed by the machining unit UNTa2 may be any motion as long as the three-dimensional structure ST can be machined.
  • the processing unit UNTa2 shall perform finish processing for bringing the dimensions of the three-dimensional structure ST closer to the design dimensions (that is, ideal dimensions).
  • the processing unit UNTa2 may perform finish processing on the three-dimensional structure ST by removing (for example, cutting) a part of the three-dimensional structure ST. That is, the processing unit UNTa2 may perform removal processing on the three-dimensional structure ST.
  • the machining unit UNTa2 has an input device 101a (not shown in FIG. 35), a machining device 102a, a stage device 103a, and a control device 104a (FIG. 35), as shown in FIGS. 34 and 35. (Not shown).
  • FIG. 35 shows an example in which the machining unit UNTa2 is a machining unit (so-called machining center) having three translational axes orthogonal to each other and two rotation axes orthogonal to each other.
  • the structure of the processing unit UNTa2 is not limited to the structure shown in FIG. 35.
  • the machining unit UNTa2 may be any machine tool (for example, a lathe, a turning center, a multi-tasking machine, a drilling machine or a grinding machine) different from the machining center.
  • the input device 101a is a device that receives input of information from the outside of the processing unit UNTa2.
  • the input device 101a may accept input of information from the user.
  • the input device 101a may accept input of information from the user of the processing unit UNTa2 and / or the user of the modeling unit UNTa1.
  • the input device 101a may accept input of information from an external device of the processing unit UNTa2.
  • the input device 101a may accept the input of information output from the modeling unit UNTa1.
  • the input device 101a may accept input of information from a recording medium that can be attached to the processing unit UNTa2.
  • An example of the input device 101a is an operation device that can be operated by the user.
  • Examples of the operating device include at least one of a keyboard, a mouse, a touch pad, a touch panel (for example, a touch panel integrated with a display (not shown) included in the processing unit UNTa2) and a pointing device.
  • Another example of the input device 101a is an interface device for connecting to an external device of the processing unit UNTa2.
  • As another example of the input device 101a there is a reading device capable of reading a recording medium that can be attached to the processing unit UNTa2.
  • the information received by the input device 101a (that is, the information input to the input device 101a) is output to, for example, the control device 104a.
  • the processing device 102a processes the three-dimensional structure ST (that is, the object to be processed) (for example, as described above, it is removed).
  • the processing device 102a includes a processing head 1021a, a head drive system 1022a (however, not shown in FIG. 35), and a position measuring device 1023a (however, not shown in FIG. 35). It has. However, the processing device 102a does not have to include the head drive system 1022a and the position measuring device 1023a.
  • the processing head 1021a processes the three-dimensional structure ST (that is, the object to be processed).
  • the processing head 1021a may have any structure as long as the three-dimensional structure ST can be processed.
  • An example of such a processing head 1021a is shown in FIGS. 36 and 37.
  • FIG. 36 shows a machining head 1021a that partially cuts a three-dimensional structure ST using a cutting tool 10211a.
  • cutting tools 10211a include at least one of a drill, a tool, a milling cutter, an end mill, a reamer, a tap, a hob, a pinion cutter, a die, a broach, a trimmer and a router.
  • the processing head 1021a partially removes the three-dimensional structure ST by injecting an energy beam EB from the irradiation optical system 10212a onto the three-dimensional structure ST.
  • the portion of the three-dimensional structure ST irradiated with the energy beam EB is evaporated or ablated, so that the three-dimensional structure ST is partially removed.
  • An example of the energy beam EB is light, a charged particle beam, or the like.
  • the head drive system 1022a moves the processing head 1021a under the control of the control device 104a.
  • the head drive system 1022a moves the machining head 1021a along at least one of the X-axis, the Y-axis, the Z-axis, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • the head drive system 1022a includes, for example, a motor and the like.
  • the head drive system 1022a moves the processing head 1021a with respect to the bed 1030a which is the base of the stage device 103a along the X-axis and the Z-axis which are translational axes and are orthogonal to each other. .. That is, the processing head 1021a can move with respect to the bed 1030a with two translational degrees of freedom.
  • the position measuring device 1023a can measure the position of the processing head 1021a.
  • the position measuring device 1023a may include, for example, at least one of an encoder and a laser interferometer.
  • the stage device 103a includes a stage 1031a.
  • the stage 1031a can support the work W (more specifically, the work W on which the three-dimensional structure ST is formed by the modeling unit UNTa1).
  • the state of "stage 1031a supporting the work W" referred to here may mean a state in which the work W is directly or indirectly supported by the stage 1031a.
  • the stage 1031a may be capable of holding the work W. That is, the stage 1031a may support the work W by holding the work W. Alternatively, the stage 1031a may not be able to hold the work W. In this case, the work W may be placed on the stage 1031a. That is, the stage 1031a may support the work W placed on the stage 1031a.
  • the state in which the "stage 1031a supports the work W" in the second embodiment may include a state in which the stage 1031a holds the work W and a state in which the work W is placed on the stage 1031a.
  • the stage 1031a may be referred to as a support device for supporting the work W, a mounting device on which the work W is placed, a holding device for holding the work W, or a table. Further, the stage 1031a can release the held work W when the work W is held.
  • the processing head 1021a described above processes the three-dimensional structure ST during at least a part of the period in which the stage 1031a supports the work W.
  • the stage 1031a may be provided with a mechanical chuck, a vacuum suction chuck, a magnetic chuck, or the like in order to hold the work W.
  • the stage device 103a further includes a stage drive system 1032a (however, not shown in FIG. 35). However, the stage device 103a does not have to include the stage drive system 1032a.
  • the stage drive system 1032a rotates about the C axis, which is the rotation axis, with respect to the cradle 1033a of the stage device 103a (that is, moves in the rotation direction along the ⁇ Z direction).
  • Move 1031a That is, the stage 1031a can move with respect to the cradle 1033a with one degree of rotation freedom.
  • the stage drive system 1032a rotates (that is, moves in the rotation direction along the ⁇ X direction) with respect to the trunnion 1034a of the stage device 103a around the A axis which is the rotation axis and is orthogonal to the C axis.
  • the cradle 1033a may be referred to as a swing member or a rotating member.
  • the stage drive system 1032a moves the trunnion 1034a with respect to the bed 1030a along the translation axis and the Y axis intersecting the X axis and the Z axis. That is, the trunnion 1034a can move with respect to the bed 1030a with one translational degree of freedom.
  • the trunnion 1034a may be referred to as a moving member.
  • the processing head 1021a can move with respect to the stage 1031a with three translational degrees of freedom and two rotation degrees of freedom.
  • Each feed axis in the stage drive system 1032a (furthermore, the head drive system 1022a) (that is, the feed axis corresponding to the X axis, the feed axis corresponding to the Y axis, the feed axis corresponding to the Z axis, and the feed corresponding to the C axis).
  • the shaft and the feed shaft corresponding to the A shaft are driven by a servomotor under the control of the control device 7 or the control device 104a.
  • the number of axes of movement of the processing head 1021a is not limited to 5, and may be 3, 4, or 6 axes.
  • the stage 1031a may not be movable with two rotation degrees of freedom, the processing head 1021a may be movable with two rotation degrees of freedom, and each of the processing head 1021a and the stage 1031a has one rotation degree of freedom or more. You may be able to exercise at.
  • Such a processing device 102a may have a function of measuring the work W or the three-dimensional structure ST supported by the stage 1031a.
  • the function of the processing apparatus 102a to measure the work W or the three-dimensional structure ST will be described with reference to FIGS. 38 to 42.
  • FIG. 38 is a cross-sectional view showing a processing head 1021a to which a probe 10213a for measuring a work W or a three-dimensional structure ST is attached.
  • FIGS. 39 to 42 is a plan view showing how the work W or the three-dimensional structure ST is measured by using the probe 10213a.
  • a probe (specifically, a touch probe) 10213a is attached to the processing head 1021a.
  • the processing device 102a brings the probe 10213a into contact with a predetermined portion of the work W or the three-dimensional structure ST under the control of the control device 104a.
  • the control device 104a calculates the position of the work W or the three-dimensional structure ST based on the position of the processing head 1021a when the probe 10213a comes into contact with the predetermined portion of the work W or the three-dimensional structure ST.
  • the processing apparatus 102a may bring the probe 10213a into contact with the corner (that is, the apex) of the work W.
  • the processing apparatus 102a may bring the probe 10213a into contact with one corner of the work W.
  • the control device 104a can calculate the position of the work W in each of the X-axis direction, the Y-axis direction, and the Z-axis direction.
  • the processing apparatus 102a may bring the probe 10213a into contact with each of the two corners of the work W.
  • control device 104a has the position of the work W in the ⁇ Z direction (that is, the amount of rotation of the work W around the Z axis) in addition to the position of the work W in each of the X-axis direction, the Y-axis direction, and the Z-axis direction. Can be calculated.
  • the processing apparatus 102a may bring the probe 10213a into contact with each of the three corners of the work W.
  • control device 104a is the position of the work W in each of the X-axis direction, the Y-axis direction and the Z-axis direction, and the position of the work W in each of the ⁇ X direction, the ⁇ Y direction and the ⁇ Z direction (that is, around the X-axis).
  • the amount of rotation of each work W around the Y-axis and the Z-axis) can be calculated.
  • the processing apparatus 102a may bring the probe 10213a into contact with the side surface of the work W.
  • the processing apparatus 102a is on the + X side of the work W as shown in FIG.
  • the probe 10213a may be brought into contact with each of the side surface and the side surface on the ⁇ X side.
  • the control device 104a can calculate the center position of the work W in the X-axis direction.
  • the processing apparatus 102a attaches the probe 10213a to each of the + Y side side surface and the ⁇ Y side side surface of the work W as shown in FIG. You may make contact.
  • the control device 104a can calculate the center position of the work W in the Y-axis direction.
  • the processing apparatus 102a also uses the work W as shown in FIG. 41.
  • the probe 10213a may be brought into contact with each of the side surfaces.
  • the control device 104a can calculate the center position of the work W (in the example shown in FIG. 41, the center position in the plane along the XY plane).
  • control device 104a controls the operation of the processing unit UNTa2.
  • the control device 104a may include, for example, a CPU (Central Processing Unit) (or a GPU (Graphics Processing Unit) in addition to or in place of the CPU) and a memory.
  • the control device 104a functions as a device that controls the operation of the machining unit UNTa2 by the CPU executing a computer program.
  • This computer program is a computer program for causing the control device 104a (for example, the CPU) to perform (that is, execute) the operation described later to be performed by the control device 104a. That is, this computer program is a computer program for causing the control device 104a to function so that the processing unit UNTa2 performs an operation described later.
  • the control device 104a may control the machining mode of the three-dimensional structure ST by the machining head 1021a.
  • the machining mode may include the state of the cutting tool 10211a (for example, the amount of rotation of the cutting tool 10211a).
  • the processing head 1021a includes the irradiation optical system 10212a (see FIG. 37)
  • the processing mode includes the state of the energy beam EB (for example, at least one of the intensity of the energy beam EB and the injection timing of the energy beam EB). You may be.
  • the control device 104a may control the movement mode of the processing head 1021a by the head drive system 1022a.
  • the control device 104a may not be provided inside the processing unit UNTa2, and may be provided as a server or the like outside the processing unit UNTa2, for example.
  • the control device 104a and the processing unit UNTa2 may be connected by a wired and / or wireless network (or a data bus and / or a communication line).
  • a wired network for example, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used.
  • a network using a parallel bus interface may be used.
  • control device 104a may be able to transmit information such as commands and control parameters to the processing unit UNTa2 via the network.
  • the processing unit UNTa2 may include a receiving device that receives information such as commands and control parameters from the control device 104a via the network. Even if the processing unit UNTa2 is provided with a transmission device (that is, an output device that outputs information to the control device 104a) that transmits information such as commands and control parameters to the control device 104a via the network. Good.
  • the first control device that performs a part of the processing performed by the control device 104a is provided inside the processing unit UNTa2, the second control device that performs the other part of the processing performed by the control device 104a is provided.
  • the control device may be provided outside the processing unit UNTa2.
  • each process or function included in the computer program may be realized by a logical processing block realized in the control device 104a by the control device 104a (that is, a computer) executing the computer program. It may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 104a, or a logical processing block and a partial hardware module that realizes a part of the hardware are mixed. It may be realized in the form of.
  • FPGA predetermined gate array
  • the transport device 10a transports the work W from the modeling unit UNTa1 to the processing unit UNTa2.
  • the transport device 10a may, for example, grab the work W using a transport arm and transport the gripped work W.
  • the transport device 10a may transport the work W by accommodating the work W in the accommodating container and transporting the accommodating container in which the work W is accommodated.
  • the processing system SYS forms a three-dimensional structure ST integrated with the work W. Therefore, the transport device 10a substantially transports the three-dimensional structure ST formed on the work W by transporting the work W.
  • the transport device 10a transports the three-dimensional structure ST together with the work W.
  • the transport device 10a transports the three-dimensional structure ST together with the work W while maintaining the relative position between the work W and the three-dimensional structure ST. Therefore, the transfer device 10a conveys the work W (three-dimensional structure ST) from the modeling unit UNTa1 to the processing unit UNTa2 after the modeling unit UNTa1 forms the three-dimensional structure ST on the work W.
  • the processing unit UNTa2 processes the three-dimensional structure ST conveyed from the modeling unit UNTa1 by the transfer device 10a.
  • the transport device 10a transports the work W from the modeling unit UNTa1 to the processing unit UNTa2.
  • the transport device 10a transports the work W to the processing unit UNTa2 after the modeling unit UNTa1 forms the three-dimensional structure ST on the work W.
  • the transfer device 10a conveys the work W integrated with the three-dimensional structure ST.
  • the transport device 10a transports the work W together with the three-dimensional structure ST.
  • the transport device 10a transports the work W together with the three-dimensional structure ST while maintaining the relative positions between the three-dimensional structure ST and the work W.
  • the processing system SYSa does not have to be provided with the transfer device 10a.
  • the modeling unit UNTa1 forms a three-dimensional structure ST in the same manner as the processing system SYS of the first embodiment described above. That is, the modeling unit UNTa1 performs a coordinate matching operation, then a work model alignment operation, then a modeling model alignment operation, and then a modeling operation.
  • the control device 7 sets the reference point RP whose relative position with respect to the three-dimensional structure ST is fixed. Therefore, the control device 7 may set the reference point RP on the object whose relative position with respect to the three-dimensional structure ST is fixed in addition to or instead of setting the reference point RP on the work W. ..
  • the control device 7 may set the reference point RP on an object whose relative position with respect to the three-dimensional structure ST does not change.
  • the control device 7 may set a reference point RP on the three-dimensional structure ST. Also in this case, the reference point RP whose relative position to the three-dimensional structure ST is fixed can be set.
  • the control device 7 may set the reference point RP based on the instruction of the user of the modeling unit UNTa1. That is, the user may specify the position where the reference point RP is to be set by using the input device 92, and the control device 7 may set the reference point RP at the position specified by the user. In this case, the control device 7 may control the display 91 so as to display the work model WM and the modeling model PM.
  • FIG. 43 is a plan view showing a display example of the work model WM and the modeling model PM. Further, the user may specify a position on which the reference point RP is to be set on the display screen of the display 91 on which the work model WM and the modeling model PM are displayed. For example, as shown in FIG.
  • the user uses the input device 92 to move the pointer 913 for setting the reference point RP, and at the timing when the pointer 913 is positioned at the position where the reference point RP is desired to be set.
  • the position of the pointer 913 may be specified as the position where the reference point RP should be set.
  • the control device 7 may set the reference point RP by the control device 7 itself without being based on the instruction of the user of the modeling unit UNTa1. For example, the control device 7 extracts the feature points of the work model WM (that is, the feature points of the work W) based on the work model data indicating the work model WM, and sets the reference point RP at the position of the extracted feature points. It may be set. That is, the control device 7 may set the feature point of the work model WM as the reference point RP. Alternatively, for example, the control device 7 may set the feature point of the object whose relative position with respect to the three-dimensional structure ST does not change as the reference point RP.
  • the control device 7 may set the feature point of the existing structure formed on the work W (for example, the three-dimensional structure ST formed by the previous modeling operation) as the reference point RP.
  • the feature point of a certain object may include a point of a feature position in the three-dimensional shape of the object indicated by the point cloud data which is a set of points indicating the position on the surface of the object.
  • feature points vertices, corners, boundaries, points located on the most + Z side, points located on the most -Z side, points located on the most + X side, points located on the most -X side, and most on the + Y side. At least one of the points located and the point located closest to the -Y side can be mentioned.
  • the control device 7 is an object having a predetermined positional relationship with the modeling model PM (or an object whose relative position with respect to the three-dimensional structure ST does not change, or an existing structure formed on the work W). , The same shall apply hereinafter in this paragraph)
  • the reference point RP may be set at a position above.
  • the control device 7 may set the reference point RP at a position on the work W which is separated from the position of the modeling model PM by a predetermined distance in a predetermined direction.
  • the control device 7 sets a reference point RP at the position of the mark or a position on the work W having a predetermined positional relationship with the mark. May be good.
  • FIGS. 44 (a) to 44 (c) is a plan view showing an example of a mark provided on the work W.
  • the marker MK1 as an example of the mark may be formed on the work W.
  • the shape of the marker MK1 is not limited to a rectangular shape (box shape), and may be, for example, a cross shape or an L shape.
  • a notch MK2 as an example of a mark may be formed on a side of the work W (for example, near the center of the side).
  • the condition that the reference point RP is set at the corner of is may be preset.
  • a notch MK3 as an example of a mark may be formed at a corner of the work W.
  • a condition that the reference point RP is set at the angle opposite to the angle at which the notch MK3 is formed may be set in advance.
  • the modeling position information indicating the position of the modeling model PM described above is based on the reference point RP in addition to or in place of the absolute position of the modeling model PM in the reference coordinate system.
  • the relative position of the modeling model PM to be used may be shown.
  • the modeling position information may indicate the relative position between the reference point RP and the modeling model PM.
  • the modeling position information may indicate where the modeling model PM is located with respect to the reference point RP.
  • FIG. 45 is a plan view showing the positional relationship between the reference point RP and the modeling model PM.
  • the modeling position information may indicate the distance between the reference point RP and the modeling model PM in the X-axis direction. As shown in FIG.
  • the modeling position information may indicate the distance between the reference point RP and the modeling model PM in the Y-axis direction. Although not shown for simplification of the drawings, the modeling position information may indicate the distance between the reference point RP and the modeling model PM in the Z-axis direction. In the example shown in FIG. 45, the modeling position information is obtained when the distance between the reference point RP and the modeling model PM (more specifically, a part of the modeling model PM) in the X-axis direction is xx [mm]. It is shown that the distance between the reference point RP and the modeling model PM in the Y-axis direction is yy [mm].
  • the modeling position information is a three-dimensional structure at a position separated from the reference point RP by xx [mm] along the X-axis direction and by yy [mm] along the Y-axis direction in the reference coordinate system. Indicates that ST should be formed.
  • the modeling information including such modeling position information is the modeling information associated with the reference point RP (more specifically, associated with the position of the reference point RP).
  • the modeling information including such the modeling position information includes the reference point RP and the modeling information (for example, the modeling shape information (that is, the modeling shape information). It can also be said that the modeling information is associated with the modeling model PM (that is, the shape of the three-dimensional structure ST).
  • the work position information indicating the position of the work model WM described above is added to or replaced with the absolute position of the work model WM in the reference coordinate system.
  • the position of the reference point RP set on the work W may be indicated.
  • the work position information may indicate the relative position between the reference point RP and the work W.
  • the work position information may indicate where in the work model WM the reference point RP is set.
  • the control device 7 may modify the work position information (that is, the work information) generated in the work model alignment operation based on the reference point RP.
  • the control device 7 may add information regarding the reference point RP to the work position information (that is, work information) generated in the work model alignment operation. For example, as shown in FIG.
  • the work position information indicates that the reference point RP is set at the vertices on the + X side and ⁇ Y side of the work W whose shape is square in the plane along the XY plane. You may be.
  • the work information including such work position information is the work information associated with the reference point RP (more specifically, associated with the position of the reference point RP).
  • the work information including the work position information includes the reference point RP and the work information (for example, the work shape information (that is, the work shape information).
  • the shape of the work model WM (that is, the work W))))
  • the modeling unit UNTa1 forms the three-dimensional structure ST based on the work information and the modeling information, as in the processing system SYS of the first embodiment. Perform the modeling operation for.
  • the control device 7 determines the work W based on the information regarding the reference point RP.
  • the modeling apparatus 2 may be controlled so that the three-dimensional structure ST is formed with reference to the reference point RP.
  • the control device 7 may control the modeling device 2 so that the additional processing is performed at a position determined with reference to the reference point RP.
  • control device 7 may control the head drive system 22 so that the modeling head 21 moves with reference to the reference point RP of the work W.
  • control device 7 sets the processing light EL at the timing when the irradiation region EA overlaps the position determined with reference to the reference point RP of the work W (for example, the position where the modeled object constituting the three-dimensional structure ST should be formed).
  • the modeling device 2 may be controlled so as to irradiate.
  • the three-dimensional structure ST is formed at a position having a predetermined positional relationship with respect to the reference point RP of the work W (that is, the reference point RP of the work model WM).
  • FIG. 46 is a plan view showing a three-dimensional structure ST formed on the work W when the reference point RP shown in FIG. 45 is set. As shown in FIG. 46, the three-dimensional structure ST is separated from the reference point RP of the work W by xx [mm] along the X-axis direction and by yy [mm] along the Y-axis direction. It is formed.
  • the output device 93a further outputs information regarding the reference point RP (hereinafter referred to as reference point information). Specifically, the output device 93a outputs reference point information to the processing unit UNTa2. In this case, the processing unit SYS2 processes the three-dimensional structure ST formed by the modeling unit UNTa1 based on the reference point information.
  • the reference point information may include the first information regarding the position of the reference point RP (for example, the position of the reference point RP in the reference coordinate system). Specifically, the reference point information may include the first information indicating the position on the work model WM in which the reference point RP is set. The reference point information may include the first information indicating the position of the portion of the work model WM in which the reference point RP is set. That is, the reference point information may include the first information indicating at which position the reference point RP is set on the work model WM. Since the reference point RP on the work W corresponds to the reference point RP on the work model WM, the reference point information may include the first information indicating the position on the work W in which the reference point RP is set. ..
  • the processing unit UNTa2 can specify at which position on the work W transported from the modeling unit UNTa1 by the transfer device 10a the reference point RP is set.
  • the reference point RP is set.
  • the work information (specifically, the work information associated with the reference point RP) may indicate the position of the reference point RP.
  • the work information may be associated with the reference point RP, as described above.
  • the reference point information may include work information (particularly, work information associated with the reference point RP). That is, the output device 93a may output the work information (particularly, the work information associated with the reference point RP) to the processing unit UNTa2 as the reference point information. Even in this case, the machining unit UNTa2 can specify which position on the work W is designated as the reference point RP.
  • the reference point information includes measurement information (particularly, measurement information associated with the reference point RP) regarding the measurement result of the work W by the measuring device 8 in addition to or in place of the work information associated with the reference point RP. May be good. That is, the output device 93a may output the measurement information (particularly, the measurement information associated with the reference point RP) regarding the measurement result of the work W to the processing unit UNTa2 as the reference point information. This is because the measurement information regarding the measurement result of the work W includes the information regarding the shape of the work W and the information regarding the position of the work W as well as the work information.
  • the "measurement information of the work W associated with the reference point RP” may mean measurement information including information about the reference point RP (for example, measurement information capable of specifying the position of the reference point RP).
  • the measuring device 8 may measure the work W before the modeling unit UNTa1 forms the three-dimensional structure ST (that is, before starting the modeling operation).
  • the reference point information may include measurement information regarding the measurement result of the work W before the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the portion that can be a feature point on the work W is the three-dimensional structure. It has the advantage that it is less likely to be blocked by the ST.
  • the measuring device 8 may measure the work W at a desired timing during the period when the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the reference point information may include measurement information regarding the measurement result of the work W at a desired timing during the period when the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the measuring device 8 may measure the work W after the modeling unit UNTa1 forms the three-dimensional structure ST (that is, after the modeling operation is completed).
  • the reference point information may include measurement information regarding the measurement result of the work W after the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the reference point information is, in addition to or in place of the first information described above, the relative position between the reference point RP and the three-dimensional structure ST (for example, the relative position between the reference point RP and the three-dimensional structure ST in the reference coordinate system).
  • the reference point information may include the relationship between the position of the reference point RP and the position of the three-dimensional structure ST (for example, the position of the reference point RP and the three-dimensional structure in the reference coordinate system).
  • the second information regarding the position of the object ST) may be included.
  • the reference point information includes the second information indicating the formation position of the three-dimensional structure ST starting from the reference point RP. That is, the reference point information may include the second information indicating the position where the three-dimensional structure ST is formed with respect to the reference point RP.
  • the reference point information is the second information indicating which position is designated as the position of the modeling model PM with reference to the reference point RP. That is, the reference point information may include information about the positional relationship between the reference point RP and the modeling model PM (that is, the relationship between the position of the reference point RP and the position of the modeling model PM). It may be included.
  • the processing unit UNTa2 can specify where the three-dimensional structure ST is formed with reference to the reference point RP.
  • the modeling information may indicate the relative position of the modeling model PM with respect to the reference point RP.
  • the modeling information may be associated with the reference point RP.
  • the reference point information may include modeling information (particularly, modeling information associated with the reference point RP). That is, the output device 93a may output the modeling information (particularly, the modeling information associated with the reference point RP) to the processing unit UNTa2 as the reference point information.
  • the processing unit UNTa2 can specify where the three-dimensional structure ST is formed with reference to the reference point RP.
  • the reference point information is, in addition to or in place of the modeling information associated with the reference point RP, measurement information regarding the measurement result of the three-dimensional structure ST by the measuring device 8 (particularly, measurement information associated with the reference point RP). It may be included. That is, the output device 93a may output the measurement information (particularly, the measurement information associated with the reference point RP) regarding the measurement result of the three-dimensional structure ST to the processing unit UNTa2 as the reference point information. This is because the measurement information regarding the measurement result of the three-dimensional structure ST includes the information regarding the shape of the three-dimensional structure ST and the information regarding the position of the three-dimensional structure ST as well as the modeling information.
  • the "measurement information of the three-dimensional structure ST associated with the reference point RP" is measurement information including information about the reference point RP (for example, measurement information capable of specifying the position of the three-dimensional structure ST with respect to the reference point RP). ) May mean.
  • the measuring device 8 may measure the three-dimensional structure ST at a desired timing during the period when the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the reference point information may include measurement information regarding the measurement result of the three-dimensional structure ST at a desired timing during the period when the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the measuring device 8 may measure the three-dimensional structure ST after the modeling unit UNTa1 forms the three-dimensional structure ST (that is, after completing the modeling operation).
  • the reference point information may include measurement information regarding the measurement result of the three-dimensional structure ST after the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the processing unit UNTa2 processes (for example, removal processing) the three-dimensional structure ST formed by the modeling unit UNTa1.
  • the processing unit UNTa2 performs finish processing for bringing the dimensions of the three-dimensional structure ST closer to the design dimensions (that is, ideal dimensions).
  • the processing unit UNTa2 performs finish processing for bringing the dimensions of the three-dimensional structure ST closer to the design dimensions (that is, ideal dimensions).
  • the three-dimensional structure ST is placed on the stage 1031a of the processing unit UNTa2 (step S21). Specifically, the three-dimensional structure ST is conveyed from the modeling unit UNTa1 to the processing unit UNTa2 by the transfer device 10a. Specifically, since the three-dimensional structure ST is integrated with the work W, the three-dimensional structure ST integrated with the work W is conveyed from the modeling unit UNTa1 to the processing unit UNTa2 by the transfer device 10a. To.
  • the three-dimensional structure ST (that is, the three-dimensional structure ST integrated with the work W) conveyed by the conveying device 10a is placed on the stage 1031a. At this time, the stage 1031a may hold the three-dimensional structure ST.
  • the stage 1031a may hold the three-dimensional structure ST.
  • the reference point information output by the output device 93a of the modeling unit UNTa1 is input to the input device 101a of the processing unit UNTa2 (step S22). That is, the input device 101a acquires the reference point information.
  • the processing unit UNTa2 processes the three-dimensional structure ST based on the reference point information (steps S23 to S24). That is, the control device 104a of the processing unit UNTa2 controls the processing device 102a so as to process the three-dimensional structure ST based on the reference point information.
  • the control device 104a may control the processing device 102a so as to process the three-dimensional structure ST with reference to the reference point RP of the work W.
  • control device 104a may control the processing device 102a so that the processing (for example, the above-mentioned removal processing, which is substantially the finishing processing) is performed at a position determined with reference to the reference point RP. ..
  • the control device 104a may control the head drive system 1022a so that the machining head 1021a moves with reference to the reference point RP of the work W.
  • processing is performed on the three-dimensional structure ST formed at a position having a predetermined positional relationship with respect to the reference point RP of the work W.
  • the processing unit UNTa2 processes the three-dimensional structure ST with reference to the reference point RP, which is the reference when the modeling unit UNTa1 performs the modeling operation.
  • the reference point used as the reference position by the processing unit UNTa2 when performing the processing operation coincides with the reference point used as the reference position when the modeling unit UNTa1 performs the modeling operation.
  • the control device 104a first aligns the work W with the processing device 102a (particularly, the processing head 1021a) (step S23). That is, the control device 104a positions the processing head 1021a (step S23). In the second embodiment, particularly, the control device 104a aligns the reference point RP with the processing device 102a (particularly, the processing head 1021a) so that the work W and the processing device 102a (particularly, the processing head 1021a) are aligned with each other. Alignment shall be performed.
  • the control device 104a aligns the reference point RP and the machining head 1021a in the reference coordinate system of the machining unit UNTa2.
  • the machining coordinate system is used as the reference coordinate system of the machining unit UNTa2.
  • the machining coordinate system is a three-dimensional coordinate system used to specify the position of the machining head 1021a.
  • the head drive system 1022a moves the machining head 1021a based on the information regarding the position of the machining head 1021a specified in the machining coordinate system.
  • the position measuring device 1023a measures the position of the machining head 1021a in the machining coordinate system.
  • the reference coordinate system of the modeling unit UNTa1 (that is, the reference coordinate system of the processing system SYS of the first embodiment) is referred to as a "modeling reference coordinate system", and the reference coordinate system of the processing unit UNTa2. Is referred to as a "processing reference coordinate system" to distinguish between the two.
  • the work W may be measured using the above-mentioned probe 10213a or the like prior to the alignment of the reference point RP and the processing device 102a. That is, the position of the work W in the machining reference coordinate system may be measured. Then, the reference point RP of the work W whose position in the processing reference coordinate system has been found may be aligned with the processing apparatus 102a.
  • the control device 104a sets the reference point RP and the processing device 102a on the work W based on the reference point information.
  • the machining head 1021a is moved so that the alignment condition that the machining head 1021a has a predetermined positional relationship is satisfied.
  • the alignment condition is that the cutting tool 10211a is located at the reference point RP (for example, the tip of the cutting tool 10211a is at the reference point RP). It may include the first condition of contacting). However, when the first condition is used, the cutting tool 10211a is stopped in order to prevent the three-dimensional structure ST from being erroneously machined in the process of aligning the reference point RP and the machining device 102a. It is preferable to do.
  • the processing head 1021a includes the irradiation optical system 10212a (see FIG.
  • the alignment condition is the second condition that the energy beam EB from the irradiation optical system 10212a is applied to the reference point RP. It may be included.
  • the alignment condition may include a second condition that the convergent position of the energy beam EB from the irradiation optical system 10212a is located at the reference point RP.
  • the strength of the energy beam EB is used to prevent the three-dimensional structure ST from being erroneously machined in the process of aligning the reference point RP and the processing device 102a. Is preferably so low that the three-dimensional structure ST cannot be processed. For example, when the alignment probe 10213a (see FIG.
  • the alignment condition is that the probe 10213a is located at the reference point RP (for example, the tip of the probe 10213a is the reference point). It may include the third condition of contacting the RP).
  • the alignment condition includes a fourth condition that the beam from the irradiation device is irradiated to the reference point RP. You may.
  • the alignment condition may include a fourth condition that the convergent position of the beam from the irradiation device is located at the reference point RP.
  • the control device 104a may move the machining head 1021a based on the reference point information so that the alignment condition is satisfied.
  • the reference point information indicates the position on the work W in which the reference point RP is set, as described above. Therefore, the control device 104a specifies the reference point RP set on the work W based on the reference point information, and the alignment condition that the specified reference point RP and the processing device 102a have a predetermined positional relationship is satisfied.
  • the processing head 1021a may be moved so as to be used.
  • the control device 104a is instructed by the user to be input to the machining unit UNTa2 via the input device 101a.
  • the machining head 1021a may be moved so that the alignment condition that the reference point RP and the machining device 102a have a predetermined positional relationship is satisfied. That is, the user may move the machining head 1021a so that the alignment condition is satisfied.
  • the control device 104a controls the processing device 102a so as to process the three-dimensional structure ST based on the result of the alignment between the reference point RP and the processing head 1021a (step S24). Specifically, the control device 104a specifies the position of the processing head 1021a when the alignment condition is satisfied, based on the measurement result of the position measuring device 1023a. That is, the control device 104a specifies the position of the machining head 1021a when the reference point RP and the machining head 1021a are aligned so that the alignment condition is satisfied. After that, the control device 104a identifies the position of the reference point RP in the machining reference coordinate system based on the position of the machining head 1021a in the machining reference coordinate system when the alignment condition is satisfied.
  • the control device 104a aligns. Based on the position of the machining head 1021a when the condition is satisfied, the position of the cutting tool 10211a when the alignment condition is satisfied (for example, the position of the cutting tool 10211a) can be specified. This is because the cutting tool 10211a is attached to the machining head 1021a, so that the cutting tool 10211a and the machining head 1021a usually have a specific positional relationship known to the control device 104a.
  • the position of the cutting tool 10211a when the alignment condition is satisfied can be regarded as equivalent to the position of the reference point RP in the machining reference coordinate system. This is because the cutting tool 10211a is located at the reference point RP when the alignment condition is satisfied. Therefore, the control device 104a sets the position of the cutting tool 10211a when the alignment condition is satisfied as a reference point in the machining reference coordinate system based on the position of the machining head 1021a when the alignment condition is satisfied. It may be specified as the position of the RP. At this time, the tool diameter of the cutting tool 1021a may be corrected.
  • the control device 104a when the third condition that the probe 10213a is located at the reference point RP (for example, the tip of the probe 10213a comes into contact with the reference point RP) is used as the alignment condition, the control device 104a also uses the alignment condition.
  • the position of the probe 10213a when the alignment condition is satisfied may be specified as the position of the reference point RP in the processing reference coordinate system based on the position of the processing head 1021a when is satisfied.
  • the control device 104a is the processing head when the alignment condition is satisfied. Based on the position of 1021a, the irradiation position of the energy beam EB when the alignment condition is satisfied can be specified. This is because the irradiation optical system 10212a is attached to the processing head 1021a, so that the irradiation position of the energy beam EB and the processing head 1021a usually have a specific positional relationship known to the control device 104a. Is.
  • the irradiation position of the energy beam EB when the alignment condition is satisfied can be regarded as equivalent to the position of the reference point RP in the processing reference coordinate system. This is because the energy beam EB is irradiated to the reference point RP when the alignment condition is satisfied. Therefore, the control device 104a determines the irradiation position of the energy beam EB when the alignment condition is satisfied as a reference in the processing quasi-coordinate system based on the position of the processing head 1021a when the alignment condition is satisfied. It may be specified as the position of the point RP.
  • the control device 104a is the position of the processing head 1021a when the alignment condition is satisfied.
  • the irradiation position of the beam when the alignment condition is satisfied may be specified as the position of the reference point RP in the processing reference coordinate system.
  • control device 104a uses the position of the machining head 1021a in the machining reference coordinate system as a reference when the alignment condition is satisfied, instead of specifying the position of the reference point RP in the machining reference coordinate system.
  • the processing apparatus 102a may be controlled so as to process the three-dimensional structure ST (step S24). This is because the position of the machining head 1021a in the machining reference coordinate system when the alignment condition is satisfied typically corresponds to the position of the reference point RP in the machining reference coordinate system. Therefore, the operation of machining the three-dimensional structure ST based on the position of the machining head 1021a in the machining reference coordinate system when the alignment condition is satisfied is substantially in the machining reference coordinate system. It may be regarded as equivalent to the operation of processing the three-dimensional structure ST with reference to the position of the reference point RP.
  • the control device 104a controls the processing device 102a so as to process the three-dimensional structure ST based on the position of the reference point RP in the processing reference coordinate system based on the reference point information (step S24). ).
  • the reference point information indicates the formation position of the three-dimensional structure ST starting from the reference point RP. Therefore, the control device 104a is based on the position of the reference point RP in the machining reference coordinate system and the reference point information, and the relative position between the reference point RP and the three-dimensional structure ST in the machining reference coordinate system. Can be identified. That is, the control device 104a can specify the position of the three-dimensional structure ST in the machining reference coordinate system.
  • FIGS. 48 (a) and 48 (b) are perspective views and plan views showing an example of the work W and the three-dimensional structure ST supported by the stage 1031a, respectively.
  • the control device 104a is based on the reference point information on each side surface (for example, the side surface on the + X side and the side surface on the ⁇ X side) of the prismatic three-dimensional structure ST. It is possible to specify how far the side surface, the side surface on the + Y side and the side surface on the ⁇ Y side) are located from the reference point RP set at the corner of the work W.
  • the reference point RP set at the corner of the work W.
  • the side surface of the three-dimensional structure ST on the + X side is located at a position separated from the reference point RP by a distance d11 based on the reference point information.
  • the side surface of the dimensional structure ST on the -X side is located at a position separated from the reference point RP by a distance d12
  • the side surface of the three-dimensional structure ST on the + Y side is located at a position separated from the reference point RP by a distance d13. Therefore, it can be specified that the side surface of the three-dimensional structure ST on the ⁇ Y side is located at a position separated from the reference point RP by a distance d14.
  • the control device 104a is based on the reference point information and the measurement result of the work W. , It is possible to specify how far each side surface of the prismatic three-dimensional structure ST is located from each side surface of the work W. In the example shown in FIG. 48B, the control device 104a is located at a position where the side surface of the three-dimensional structure ST on the + X side is separated from the side surface of the work W on the + X side by a distance d21 based on the reference point information.
  • the side surface on the -X side of the 3D structure ST is located at a position separated from the side surface on the -X side of the work W by a distance d22, and the side surface on the + Y side of the 3D structure ST is the work W.
  • the side surface on the ⁇ Y side of the three-dimensional structure ST is located at a position separated from the side surface on the + Y side by a distance d23, and the side surface on the ⁇ Y side of the work W is located at a position separated by a distance d24 from the side surface on the ⁇ Y side of the work W. Can be identified.
  • FIGS. 49 (a) and 49 (b) are perspective views and plan views showing another example of the three-dimensional structure ST of the work W supported by the stage 1031a, respectively.
  • the control device 104a has a prismatic shape based on the reference point information. It is possible to specify how far each side surface of the three-dimensional structure ST is located from the reference point RP set near the center of the work W. In the example shown in FIG.
  • the side surface of the three-dimensional structure ST on the + X side is located at a position separated from the reference point RP by a distance d31 based on the reference point information.
  • the side surface of the dimensional structure ST on the -X side is located at a position separated from the reference point RP by a distance d32, and the side surface of the three-dimensional structure ST on the + Y side is located at a position separated from the reference point RP by a distance d33. Therefore, it can be specified that the side surface of the three-dimensional structure ST on the ⁇ Y side is located at a position separated from the reference point RP by a distance d34.
  • the control device 104a specifies in which direction and how much the machining head 1021a should be moved with reference to the reference point RP in the machining reference coordinate system to appropriately machine the three-dimensional structure ST. can do.
  • the control device 104a can specify the movement locus (so-called tool path) of the machining head 1021a with reference to the reference point RP in the machining reference coordinate system. Therefore, the processing apparatus 2 can appropriately process the three-dimensional structure ST.
  • control device 104a can specify the respective shapes of the work W and the three-dimensional structure ST with high accuracy only by referring to the position of the reference point RP and the reference point information in the machining reference coordinate system. It may not be possible. Therefore, in the second embodiment, the work shape information regarding the shape of the work W and the modeling shape information regarding the shape of the three-dimensional structure ST are processed from the output device 93a of the modeling unit UNTa1 in a state of being associated with the reference point information. It may be input to the input device 101a of the unit UNTa2.
  • the control device 104a is used for the work W whose shape can be specified with relatively high accuracy based on the work shape information in the machining reference coordinate system (particularly, for the reference point RP on the work W). ), Where is the 3D structure ST whose shape can be specified with relatively high accuracy based on the modeling shape information, with the position of the reference point RP and the reference point information in the processing reference coordinate system. Can be identified based on.
  • the work shape information and the modeling shape data may be input from the modeling unit UNTa1 to the processing unit UNTa2 in a state of being associated with each other.
  • "Work information and modeling information in a state associated with each other” means work information and modeling in a state in which the positional relationship between the work model WM (work W) and the modeling model PM (three-dimensional structure ST) can be specified. It may mean information.
  • the measurement information regarding the measurement result of the measuring device 8 included in the modeling unit UNTa1 is associated with the reference point information from the output device 93a of the modeling unit UNTa1. It may be input to the input device 101a of the processing unit UNTa2.
  • measurement information regarding the measurement result of the work W using the measuring device 8 may be input to the processing unit UNTa2.
  • measurement information regarding the measurement result of the three-dimensional structure ST using the measuring device 8 may be input to the processing unit UNTa2.
  • the control device 104a is used for the work W whose shape can be specified with relatively high accuracy based on the measured shape information in the machining reference coordinate system (particularly, for the reference point RP on the work W). ), Where is the 3D structure ST whose shape can be specified with relatively high accuracy based on the measured shape information, with the position of the reference point RP and the reference point information in the processing reference coordinate system. Can be identified based on.
  • the measurement information may be input from the modeling unit UNTa1 to the processing unit UNTa2 in a state where the measurement result of the work W and the measurement result of the three-dimensional structure ST are associated with each other.
  • the "measurement information in which the measurement result of the work W and the measurement result of the three-dimensional structure ST are associated with each other" means that the positional relationship between the work W and the three-dimensional structure ST can be specified. It may mean some measurement information.
  • the measuring device 8 may measure the work W before the modeling unit UNTa1 forms the three-dimensional structure ST (that is, before starting the modeling operation).
  • the measuring device 8 may measure at least one of the work W and the three-dimensional structure ST at a desired timing during the period when the modeling unit UNTa1 forms the three-dimensional structure ST.
  • the measuring device 8 may measure the work W and the three-dimensional structure ST after the modeling unit UNTa1 forms the three-dimensional structure ST (that is, after the modeling operation is completed).
  • the machining system SYS Sa of the second embodiment is different from the machining system SYS of the first embodiment described above in that it further includes an output device 93a. It is equipped with different modeling units UNTa1. Therefore, the processing system SYS of the second embodiment can enjoy the same effect as the effect that can be enjoyed by the processing system SYS of the first embodiment described above.
  • the processing unit UNTa2 processes the three-dimensional structure ST based on the reference point information regarding the reference point RP, which is the reference when the modeling unit UNTa1 performs the modeling operation. Can be done. Specifically, the processing unit UNTa2 can process the three-dimensional structure ST based on the reference point RP, which is the reference when the modeling unit UNTa1 performs the modeling operation. As a result, it is compared with the case where the reference point information is not used (that is, the case where the 3D structure ST is processed based on the point unrelated to the reference point RP used as the reference when the modeling unit UNTa1 performs the modeling operation). As a result, the positioning of the processing head 1021a becomes easy.
  • the modeling unit UNTa1 and the processing unit UNTa2 are separate devices, the modeling reference coordinate system and the processing reference coordinate system do not always match. Therefore, even if the position of the 3D structure ST in the modeling reference coordinate system is known information, the position of the 3D structure ST in the processing reference coordinate system is not always known information. Therefore, in order for the processing unit UNTa2 to process the three-dimensional structure ST, the positioning of the processing head 1021a described above (more specifically, the three-dimensional structure ST and the processing head 1021a, which are the objects to be processed, Alignment) is required.
  • the machining unit UNTa2 determines the positions of the machining head 1021a and the plurality of feature points of the three-dimensional structure ST, for example, in order to position the machining head 1021a. It may be necessary to make adjustments. For example, the machining unit UNTa2 aligns the + X side end of the three-dimensional structure ST with the machining head 1021a, and aligns the ⁇ X side end of the three-dimensional structure ST with the machining head 1021a. After that, it may be necessary to identify the center position of the 3D structure ST in the X-axis direction.
  • the machining unit UNTa2 aligns the + Y side end of the three-dimensional structure ST with the machining head 1021a, and aligns the ⁇ Y end of the three-dimensional structure ST with the machining head 1021a. After that, it may be necessary to identify the center position of the 3D structure ST in the Y-axis direction. For example, the machining unit UNTa2 may need to perform other necessary operations. Therefore, the processing cost of the three-dimensional structure ST (for example, at least one of the time cost and the cost cost) may be relatively large.
  • the machining unit UNTa2 it is sufficient for the machining unit UNTa2 to align the work W (particularly, the reference point RP on the work W) and the machining head 1021a in order to position the machining head 1021a. is there.
  • the machining unit UNTa2 does not have to align the three-dimensional structure ST and the machining head 1021a. This is because the modeling unit UNTa1 forms the three-dimensional structure ST with reference to the reference point RP, so that the processing unit UNTa2 can be used as the reference point RP of the work W by referring to the reference point information regarding the reference point RP.
  • the processing cost of the three-dimensional structure ST can be reduced as compared with the case where the reference point information is not used.
  • the reference point RP is set on the work W integrated with the three-dimensional structure ST, even if the three-dimensional structure ST is transported from the modeling unit UNTa1 to the processing unit UNTa2, the reference point RP and the reference point RP The relative position with respect to the three-dimensional structure ST does not change. That is, when the relative position between the reference point RP and the three-dimensional structure ST when the work W is placed on the stage 31 of the modeling unit UNTa1, and when the work W is placed on the stage 1031a of the processing unit UNTa2. The relative positions of the reference point RP and the three-dimensional structure ST are the same.
  • the processing unit UNTa2 is three-dimensionally based on the reference point RP as a reference when the modeling unit UNTa1 performs the modeling operation.
  • the structure ST can be appropriately processed.
  • FIG. 50 is a plan view showing a three-dimensional structure ST formed on the work W by the modeling unit UNTa1 having a relatively poor modeling accuracy when the reference point RP shown in FIG. 45 is set. is there. As shown in FIG.
  • the modeling accuracy of the modeling unit UNTa1 when the modeling accuracy of the modeling unit UNTa1 is relatively poor, it is originally separated from the reference point RP of the work W by xx [mm] along the X-axis direction and in the Y-axis direction.
  • the three-dimensional structure ST should be formed at a position separated by yy [mm] along the line, the actual work W is xx [mm] along the X-axis direction from the reference point RP.
  • the three-dimensional structure ST is formed at a position separated by xx'[mm] different from that of xx'[mm] and separated by yy'[mm] different from yy [mm] along the Y-axis direction.
  • a three-dimensional structure ST having a size of s [mm] along a certain direction for example, at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction
  • a three-dimensional structure ST having a size along the direction of s'[mm] different from s [mm] is actually formed.
  • the reference point information output from the modeling unit UNTa1 to the processing unit UNTa2 does not include information on the modeling error of the three-dimensional structure ST. Therefore, the processing unit UNTa2 cannot determine whether or not a modeling error of the three-dimensional structure ST has occurred. Therefore, the processing unit UNTa2 may not be able to properly process the three-dimensional structure ST.
  • the modeling unit UNTa1 may perform an operation for reducing the influence caused by the modeling error of the three-dimensional structure ST.
  • the modeling unit UNTa1 may measure the actually formed three-dimensional structure ST by using the measuring device 8 after forming the three-dimensional structure ST.
  • the measurement result of the measuring device 8 indicates that the 3D structure ST is measured at the ideal position indicated by the modeling information, it means that the modeling error of the 3D structure ST has not occurred. Presumed.
  • the processing unit UNTa2 may process the three-dimensional structure ST so as to reduce the influence caused by the modeling error of the three-dimensional structure ST.
  • the output device 93a of the modeling unit UNTa1 may output the measurement result of the measuring device 8 to the processing unit UNTa2.
  • the processing unit UNTa2 may process the three-dimensional structure ST based on the measurement result of the measuring device 8 so as to reduce the influence caused by the modeling error of the three-dimensional structure ST.
  • the control device 104a of the processing unit UNTa2 may correct the reference point information that does not reflect the modeling error based on the measurement result of the measuring device 8 to generate the reference point information that reflects the modeling error.
  • the reference point information that reflects the modeling error is relative to the reference point RP and the actual 3D structure ST (for example, the 3D structure ST formed at a position deviated from the ideal position indicated by the modeling information).
  • the control device 104a may control the processing device 102a so as to process the three-dimensional structure ST based on the reference point information in which the modeling error is reflected. Alternatively, for example, the control device 104a reduces the influence of the modeling error based on the measurement result of the measuring device 8 and the reference point information that does not reflect the modeling error (for example, processing caused by the modeling error).
  • the processing apparatus 102a may be controlled (so as to suppress the deterioration of accuracy). Specifically, for example, the control device 104a determines the actual position of the three-dimensional structure ST in the reference coordinate system based on the measurement result of the measuring device 8 and the reference point information that does not reflect the modeling error.
  • the processing apparatus 102a may be controlled so as to process the three-dimensional structure ST in which the actual position (that is, the position where the modeling error is reflected) is specified.
  • control device 7 of the modeling unit UNTa1 corrects the reference point information that does not reflect the modeling error based on the measurement result of the measuring device 8 and generates the reference point information that reflects the modeling error. You may.
  • the output device 93a of the modeling unit UNTa1 may output the reference point information reflecting the modeling error to the processing unit UNTa2.
  • the processing unit UNTa2 may process the three-dimensional structure ST based on the reference point information output from the modeling unit UNTa1.
  • the reference point information is output from the modeling unit UNTa1 to the processing unit UNTa2.
  • the user of the modeling unit UNTa1 and / or the processing unit UNTa2 may manually input the reference point information into the processing unit UNTa2. That is, the user of the modeling unit UNTa1 and / or the processing unit UNTa2 may input the reference point information into the processing unit UNTa2 by using an input device 101a such as a keyboard. That is, as the acquisition route of the reference point information by the processing unit UNTa2, there may be a route for acquiring the reference point information from the user in addition to or instead of the route for acquiring the reference point information from the modeling unit UNTa1. In this case, the output device 93a of the modeling unit UNTa1 does not have to output the reference point information to the processing unit UNTa2. The modeling unit UNTa1 does not have to include the output device 93a.
  • reference point information is input to the processing unit UNTa2 from the modeling unit UNTa1 and / or the user.
  • information different from the reference point information may be input to the processing unit UNTa2 via the input device 101a, and the processing unit UNTa2 is three-dimensionally based on the input information.
  • the structure ST may be processed. That is, the control device 104a of the processing unit UNTa2 may control the processing device 102a so as to process the three-dimensional structure ST based on information different from the reference point information.
  • control device 104a generates reference point information based on information different from the reference point information, and controls the processing device 102a so as to process the three-dimensional structure ST based on the generated reference point information. May be good.
  • the control device 104a may control the processing device 102a so as to process the three-dimensional structure ST based on information different from the reference point information without generating the reference point information.
  • the control device 104a identifies and specifies the position of the three-dimensional structure ST in the machining reference coordinate system (and other characteristics such as the shape if necessary) based on information different from the reference point information.
  • the processing apparatus 102a may be controlled to process the three-dimensional structure ST based on the information regarding the position.
  • Work information and modeling information are examples of information that is different from the reference point information. That is, the work information and the modeling information may be input from the output device 93a of the modeling unit UNTa1 to the input device 101a of the processing unit UNTa2. At this time, the work information and the modeling information may be input from the modeling unit UNTa1 to the processing unit UNTa2 in a state of being associated with each other.
  • the work information and the modeling information include the work shape information included in the work information (that is, information on the three-dimensional shape of the work model WM, which is substantially information on the three-dimensional shape of the work W) and the modeling information.
  • the processing unit from the modeling unit UNTa1 in a state in which the included modeling shape information (that is, information on the three-dimensional shape of the modeling model PM, which is substantially information on the three-dimensional shape of the three-dimensional structure ST) is associated. It may be input to UNTa2.
  • the work information and the modeling information are the work position information included in the work information (that is, information on the position of the work model WM, which is substantially information on the position of the work W) and the modeling position included in the modeling information.
  • Information (that is, information regarding the position of the modeling model PM, which is substantially information regarding the position of the three-dimensional structure ST) may be input from the modeling unit UNTa1 to the processing unit UNTa2 in a state of being associated with the information.
  • the "work information and modeling information in a state associated with each other" is work information in a state in which the positional relationship between the work model WM (work W) and the modeling model PM (three-dimensional structure ST) can be specified. And may mean modeling information.
  • the modeling unit UNTa1 may measure the work W using the measuring device 8 before forming the three-dimensional structure ST, and measures the measurement result of the measuring device 8 before forming the three-dimensional structure ST.
  • Information may be input to the machining unit UNTa2 via the input device 101a.
  • the modeling unit UNTa1 may measure at least one of the work W and the three-dimensional structure ST by using the measuring device 8 at a desired timing during the period during which the three-dimensional structure ST is formed. Measurement information regarding the measurement result of the measuring device 8 at a desired timing during the period of forming the structure ST may be input to the processing unit UNTa2 via the input device 101a.
  • the modeling unit UNTa1 may measure the work W and the three-dimensional structure ST using the measuring device 8 after forming the three-dimensional structure ST, and the measuring device 8 after forming the three-dimensional structure ST. The measurement information regarding the measurement result of the above may be input to the processing unit UNTa2 via the input device 101a.
  • the "measurement information in which the measurement result of the work W and the measurement result of the three-dimensional structure ST are associated" are the work model WM (work W) and the modeling model PM (three-dimensional structure ST). It may mean the measurement information in a state where the positional relationship of the above can be specified.
  • the machining unit UNTa2 may be provided with a measuring device for measuring the three-dimensional structure ST, and is based on the measurement result of the measuring device included in the machining unit UNTa2 (that is, the measurement result of the three-dimensional structure ST).
  • the reference point information may be generated.
  • the processing unit UNTa2 may process the three-dimensional structure ST based on the measurement result of the measuring device included in the processing unit UNTa2 (that is, the measurement result of the three-dimensional structure ST).
  • the measuring device included in the processing unit UNTa2 may have the same structure as the measuring device 8 included in the modeling unit UNTa1.
  • the modeling unit UNTa1 and the processing unit UNTa2 are provided with a control device 7 and a control device 104a, respectively. That is, the processing system SYSa includes a control device 7 and a control device 104a that control the modeling unit UNTa1 and the processing unit UNTa2, respectively.
  • the machining system SYSA may include, in addition to or in place of the control device 7 and the control device 104a, a common control device 7a that controls the modeling unit UNTa1 and the machining unit UNTa2.
  • the processing system SYSa includes a modeling unit UNTa1 that does not have to be provided with the control device 7, a processing unit UNTa2 that does not have to be provided with the control device 104a, a transfer device 10a, and a control device 7a. May be good.
  • FIG. 51 is a system configuration diagram showing a system configuration of a processing system SYSA including a common control device 7a for controlling the modeling unit UNTa1 and the processing unit UNTa2.
  • FIG. 51 shows an example in which the modeling unit UNTa1 does not include the control device 7, but the modeling unit UNTa1 may include the control device 7.
  • processing system SYSA1 including the control device 7a will be referred to as "processing system SYSA1".
  • control device 7a may perform at least a part of the operation performed by the control device 7 and the operation performed by the control device 104a.
  • the reference point information does not necessarily have to be input from the output device 93a of the modeling unit UNTa1 to the input device 101a of the processing unit UNTa2.
  • the control device 7a may set a reference point RP in the modeling operation and control the processing device 102a in the machining operation based on the reference point information regarding the set reference point RP.
  • control device 7a controls the modeling device 2 so as to form the three-dimensional structure ST based on the work information and the modeling information, generates the reference point information based on the work information and the modeling information, and generates the reference point information.
  • the processing apparatus 102a may be controlled so as to process the three-dimensional structure ST based on the above.
  • the control device 7a may acquire the reference point information regarding the reference point RP generated by the control device 7 of the modeling unit UNTa1 in the modeling operation, and input the acquired reference point information to the input device 101a of the processing unit UNTa2. ..
  • the control device 7a may acquire the work information and the modeling information used by the control device 7 of the modeling unit UNTa1 in the modeling operation, and input the acquired work information and the modeling information to the input device 101a of the processing unit UNTa2. ..
  • the control device 7a acquires reference point information regarding the reference point RP generated by the control device 7 of the modeling unit UNTa1 in the modeling operation, and processes the three-dimensional structure ST based on the acquired reference point information.
  • the device 102a may be controlled.
  • the control device 7a acquires the work information and the modeling information used by the control device 7 of the modeling unit UNTa1 in the modeling operation, generates the reference point information based on the acquired work information and the modeling information, and generates the generated reference point.
  • the processing apparatus 102a may be controlled so as to process the three-dimensional structure ST based on the information.
  • the processing system SYS1 does not have to be provided with the transfer device 10a. Further, the control device 7 may be provided outside the processing system SYS1.
  • the stage 31 of the modeling unit UNTa1 supports the work W alone. However, the stage 31 may support the work W through an object different from the work W. In this case, the measuring device 8 of the modeling unit UNTa1 may measure the work W together with an object different from the work W.
  • FIG. 52 is a perspective view showing an example of a stage 31 that supports the work W through an object different from the work W.
  • the stage 31 may support the work W via, for example, a fixing jig (for example, a vise) 36a for fixing the work W. That is, the stage 31 may support the fixing jig 36a, and the work W may be fixed to the fixing jig 36a supported by the stage 31.
  • the fixing jig 36a is, for example, a device for fixing the work W so that the three-dimensional structure ST does not shift with respect to the stage 1031a during the processing of the three-dimensional structure ST by the processing unit UNTa2. May be good.
  • the measuring device 8 may measure the work W fixed to the fixing jig 36a. That is, the measuring device 8 may measure the work W together with the fixing jig 36a. Further, as long as the fixing jig 36a fixes the work W, the relative positions of the fixing jig 36a and the three-dimensional structure ST hardly change. Therefore, the control device 104a is placed on the fixing jig 36a. A reference point RP may be set. Further, in the modeling operation, the processing apparatus 2 may form the three-dimensional structure ST on the work W fixed to the fixing jig 36a.
  • FIG. 53 is a perspective view showing a three-dimensional structure ST formed on the work W fixed to the fixing jig 36a.
  • the transport device 10a may transport the work W fixed to the fixing jig 36a.
  • the transport device 10a may transport the work W fixed to the fixing jig 36a together with the fixing jig 36a. That is, when the stage 31 supports the work W through an object different from the work W, the transport device 10a may transport the work W together with an object different from the work W.
  • the stage 1031a of the processing unit UNTa2 may also support the work W via a fixing jig 36a for fixing the work W. That is, the stage 1031a may support the fixing jig 36a, and the work W may be fixed to the fixing jig 36a supported by the stage 1031a.
  • FIG. 54 is a perspective view showing the stage 1031a that supports the work W fixed to the fixing jig 36a. That is, when the stage 31 supports the work W through an object different from the work W, the stage 1031a may support the work W through an object different from the work W.
  • the fixing jig 36a may be fixed to the stage 1031a. As a result, the displacement of the three-dimensional structure ST with respect to the stage 1031a during the machining of the three-dimensional structure ST by the processing unit UNTa2 is suppressed.
  • the fixing jig 36a is screwed to the stage 1031a via a screw hole 361a formed in the fixing jig 36a and a groove (for example, a T groove) formed in the stage 1031a. May be good.
  • the stage 31 may support a plurality of work Ws fixed to each of the plurality of fixing jigs 36a. That is, the stage 31 may support a plurality of work Ws via the plurality of fixing jigs 36a, respectively.
  • the work model alignment operation described above is performed for each of the plurality of work Ws.
  • the stage 31 supports N (where N is an integer of 2 or more) work Ws
  • the work model alignment operation is performed on the first work W, so that the first work W is performed.
  • Work information about the work W is generated, and the work model alignment operation is performed for the second work W, so that the work information about the second work W is generated, ..., For the Nth work W.
  • the work model alignment operation By performing the work model alignment operation, work information regarding the Nth work W is generated. However, when the measurement range of the measuring device 8 includes two or more work Ws, the measurement by the measuring device 8 for the work model alignment operation is performed collectively for the two or more work Ws. May be good. Further, when the measuring device 8 forms the three-dimensional structure ST after the three-dimensional structure ST is formed, the measuring device 8 forms the plurality of three-dimensional structure STs formed on the plurality of works W, respectively. It may be measured together with a plurality of work Ws or in order.
  • the stage 31 may support a plurality of work Ws without using the fixing jig 36a. Similarly in this case, the work model alignment operation described above may be performed for each of the plurality of work Ws.
  • FIG. 55 showing another example of the system configuration of the processing system SYS of the first embodiment (that is, another example of the system configuration of the modeling unit UNTa1 of the second embodiment).
  • the stage device 3 may include a stage drive system 32 for moving the stage 31.
  • the stage drive system 32 may move the stage 31 within the chamber space 63IN, for example.
  • the stage drive system 32 may move the stage 31 along at least one of the X-axis, the Y-axis, and the Z-axis.
  • each of the irradiation region EA and the supply region MA moves on the work W along at least one of the X-axis and the Y-axis.
  • the stage drive system 32 may move the stage 31 along at least one of the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis.
  • the stage drive system 32 includes, for example, a motor and the like.
  • the stage device 3 may further include the position measuring device 33.
  • the position measuring device 33 can measure the position of the stage 31.
  • the position measuring device 33 may include, for example, at least one of an encoder and a laser interferometer.
  • the modeling device 2 does not have to include the head drive system 22. However, even when the processing system SYS includes the stage drive system 32, the modeling device 2 may include the head drive system 22. When the modeling device 2 does not include the head drive system 22, the modeling device 2 does not have to include the position measuring device 23.
  • step S112 of FIG. 4 described above which shows the flow of the coordinate matching operation for associating the above-mentioned modeling coordinate system with the stage coordinate system
  • the stage drive system 32 May move the stage 31 so that the processing light EL is irradiated toward the beam detector 325.
  • the control device 7 corrects the position of the pin 312 in the stage coordinate system, which is information known to the control device 7, according to the amount of movement of the stage 31, and then the pin 312.
  • the position in the modeling coordinate system of the modeling head 21 in a state where the processing light EL can be irradiated and the position in the stage coordinate system where the pin 312 is formed should be associated with each other. You may. However, if the processing system SYS does not have the head drive system 22 (that is, the modeling head 21 does not move), the modeling coordinate system may not be used. In this case, the modeling coordinate system and the stage coordinates The processing of steps S111 to S113 of FIG. 4 described above showing the flow of the coordinate matching operation for associating with the system may not be performed.
  • the position measuring device 33 is shown in step S115 of FIG. 4 described above showing the flow of the coordinate matching operation for associating the measured coordinate system with the stage coordinate system. May measure the position of the stage 31 when the measuring device 8 is measuring the reference member 34.
  • the control device 7 includes the measurement result of the measuring device 8 in step S115 and the measurement result of the position of the stage 31 when the measuring device 8 is measuring the reference member 34 in step S115.
  • the measurement coordinate system and the stage coordinate system may be associated with each other based on. Specifically, the control device 7 can specify the position of the reference mark 343 in the measurement coordinate system from the measurement result of the measurement device 8.
  • the control device 7 has the through hole 322 and the through hole 322 in the measurement coordinate system based on the information regarding the position of the reference mark 343 in the measurement coordinate system and the information regarding the positional relationship between the reference mark 343 and the through hole 322.
  • the position of the pin 312 can be specified.
  • the information regarding the position of the pin 312 in the stage coordinate system is known to the control device 7.
  • the control device 7 can identify that the position of the pin 312 in the measurement coordinate system and the position of the pin 312 in the stage coordinate system should be associated with each other.
  • the position of the pin 312 in the stage coordinate system is corrected by the amount of movement of the stage 31 by the stage drive system 32.
  • the control device 7 can specify that the position of the pin 312 in the measurement coordinate system and the corrected position of the pin 312 in the stage coordinate system are positions to be associated with each other.
  • the control device 7 is based on the specific result that a specific position in the measurement coordinate system and a specific position in the stage coordinate system should be associated with each other, and the measurement coordinate system and the stage. Can be associated with a coordinate system.
  • step S144 of FIG. 17 which shows the flow of the third work model alignment operation described above
  • the stage drive system 32 is described in step S143 of FIG.
  • the stage 31 may be moved so that the positional condition that the designated user-designated point and the modeling apparatus 2 have a desired third positional relationship is satisfied.
  • step S145 of FIG. 17 after the stage 31 is moved so that the position condition that the user-designated point and the modeling device 2 have a desired third positional relationship is satisfied, the position condition of the position measuring device 33 is changed.
  • the position of the stage 31 at the time of filling may be measured.
  • the control device 7 obtains work information based on the measurement results of the position measuring devices 23 and / or 33 in step S145 of FIG. 17 and the work model data acquired in step S142. It may be generated.
  • the measurement result of the position measuring device 23 and / or 33 in step S145 is the position of the modeling head 21 and / or the stage 31 when the user-designated point and the modeling device 2 have a desired third positional relationship. Is shown. Therefore, the control device 7 can specify the position of the user-designated point in the modeling coordinate system and / or the position of the user-designated point in the stage coordinate system from the measurement results of the position measuring device 23 and / or 33.
  • the control device 7 arranges the work model designated point, which is a point corresponding to the user designated point in the work model WM, at the position of the user designated point specified from the measurement results of the position measuring device 23 and / or 33. You may perform the alignment process for this. After that, the control device 7 may generate work information based on the result of the alignment process.
  • the beam detection member 32 is placed on the mounting surface 311 in order to perform the coordinate matching operation.
  • the beam detection member 32 (particularly, the light shielding member 323 and the beam detector 325) may be formed on the stage 31 (for example, the mounting surface 311).
  • the reference member 34 is placed on the mounting surface 311 in order to perform the coordinate matching operation.
  • the reference member 34 (particularly, the reference mark 343) may be formed on the stage 31 (for example, the mounting surface 311).
  • the pin 312 and the through hole 322 are used as markings for positioning when the beam detection member 32 is mounted on the mounting surface 311.
  • the pin 312 and the through hole 322 are merely examples of markings for alignment, and markings different from those of the pin 312 and the through hole 322 may be used.
  • a convex structure which is an example of a mark is formed on the mounting surface 311
  • a concave structure which is an example of a mark is formed on the beam detection member 32
  • the convex structure is concave.
  • the beam detection member 32 and the mounting surface 311 may be aligned by mounting the beam detecting member 32 on the mounting surface 311 so as to be fitted into the structure of the above.
  • a concave structure which is an example of a mark is formed on the mounting surface 311
  • a convex structure which is an example of a mark is formed on the beam detection member 32
  • the convex structure is concave.
  • the beam detection member 32 and the mounting surface 311 may be aligned by mounting the beam detecting member 32 on the mounting surface 311 so as to be fitted into the structure of the above.
  • a guide member having a shape along at least a part of the outer edge of the beam detection member 32 is formed on the mounting surface 311 as a mark, and the beam is detected so that the outer edge of the beam detection member 32 comes into contact with the guide member.
  • the beam detection member 32 and the mounting surface 311 may be aligned by mounting the member 32 on the mounting surface 311. The same applies to the positioning mark when the reference member 34 is placed on the mounting surface 311.
  • a reference member 34 different from the beam detection member 32 for associating the modeling coordinate system with the stage coordinate system is used.
  • the beam detection member 32 may be used as a reference member 34 for associating the measurement coordinate system with the stage coordinate system.
  • at least one of the light-shielding member 323, the opening 324, and the beam detector 325 formed on the beam detection member 32 may be used as the reference mark 343.
  • the reference mark 343 may be formed on the base member 321 of the beam detection member 32.
  • the reference member 34 is formed with a mark that can be measured by the measuring device 8 as the reference mark 343.
  • the reference member 34 is a cross-sectional view showing another example of the reference member 34.
  • FIG. 52 (b) which is a cross-sectional view taken along the line AA in FIGS. 52 (a) and 52 (a)
  • 52 (a) and 52 (b) show an example in which at least a part (specifically, a hemisphere) of a sphere is formed on the reference member 34 as a three-dimensional member 344.
  • the three-dimensional member 344 may have the same characteristics as the reference mark 343 except that it has a three-dimensional structure. As a result, even when the three-dimensional member 344 is formed, the measurement coordinate system and the stage coordinate system are appropriately associated with each other.
  • the beam detection member 32 is mounted on the mounting surface 311 in order to perform the coordinate matching operation.
  • the reference member 34 is placed on the mounting surface 311 in order to perform the coordinate matching operation.
  • the coordinate matching operation may be performed without using the beam detection member 32 or the reference member 34.
  • a photosensitive / heat-sensitive member heat-sensitive paper as an example
  • a processing coordinate system head coordinate system
  • the processing light reference origin As a result, a mark is exposed on the photosensitive / heat-sensitive member, and this mark becomes the processing light reference origin.
  • the intersecting positions of the plurality of guide lights GL emitted from the plurality of guide light emitting devices 24 are matched with the positions of the exposed marks on the photosensitive / heat sensitive member.
  • the processed coordinate system and the measured coordinate system can be associated with each other.
  • the position of the exposed mark may be measured by using the measuring device 8.
  • the modeling device 2 melts the modeling material M by irradiating the modeling material M with processing light EL.
  • the modeling apparatus 2 may melt the modeling material M by irradiating the modeling material M with an arbitrary energy beam.
  • the modeling device 2 may include a beam irradiating device capable of irradiating an arbitrary energy beam in addition to or in place of the irradiation optical system 211.
  • Any energy beam includes, but is not limited to, a charged particle beam such as an electron beam, an ion beam, or an electromagnetic wave.
  • the processing system SYS can form the three-dimensional structure ST by the laser overlay welding method.
  • the processing system SYS can form the three-dimensional structure ST from the modeling material M by another method capable of forming the three-dimensional structure ST by irradiating the modeling material M with the processing light EL (or an arbitrary energy beam). It may be formed.
  • Other methods include, for example, a powder bed melting bonding method (Power Bed Fusion) such as a powder sintering laminated molding method (SLS: Selective Laser Sintering), a binder jetting method (Binder Jetting), or a laser metal fusion method (LMF:). Laser Metal Fusion) can be mentioned.
  • the processing system SYS may use an arbitrary method for additional processing, which is different from the method capable of forming the three-dimensional structure ST by irradiating the modeling material M with the processing light EL (or an arbitrary energy beam).
  • the three-dimensional structure ST may be formed.
  • the processing system SYS forms the three-dimensional structure ST by supplying the modeling material M from the material nozzle 212 toward the irradiation region EA where the irradiation optical system 211 irradiates the processing light EL. ..
  • the processing system SYS may form the three-dimensional structure ST by supplying the modeling material M from the material nozzle 212 without irradiating the processing light EL from the irradiation optical system 211.
  • the processing system SYS melts the modeling material M on the modeling surface MS by spraying the modeling material M onto the modeling surface MS from the material nozzle 212, and solidifies the melted modeling material M.
  • the dimensional structure ST may be formed.
  • the processing system SYS melts the modeling material M on the modeling surface MS and solidifies the molten modeling material M by blowing a gas containing the modeling material M onto the modeling surface MS from the material nozzle 212 at an ultra-high speed.
  • the three-dimensional structure ST may be formed.
  • the processing system SYS melts the modeling material M on the modeling surface MS by spraying the heated modeling material M onto the modeling surface MS from the material nozzle 212, and solidifies the melted modeling material M.
  • the three-dimensional structure ST may be formed.
  • the processing system SYS (particularly, the modeling head 21) does not have to include the irradiation optical system 211. Good.
  • the processing system SYS performs a removal processing capable of removing at least a part of the object by irradiating an object such as a work W with a processing light EL (or an arbitrary energy beam) in addition to or instead of the additional processing. You may.
  • the processing system SYS irradiates an object such as a work W with processing light EL (or an arbitrary energy beam) in addition to or in place of at least one of addition processing and removal processing to mark at least a part of the object. Marking processing capable of forming (for example, letters, numbers or figures) may be performed. Even in this case, the above-mentioned effects can be enjoyed.
  • Appendix 1 A modeling device that models a modeled object on the base member based on the set position set on the base member, and A modeling unit including an output device that outputs position information related to the set position.
  • Appendix 2 The modeling unit according to Appendix 1, wherein the output device outputs the position information to a processing unit that performs a processing operation on the modeled object.
  • Appendix 3 The modeling unit according to Appendix 2, which performs the processing operation based on the position information output from the output device.
  • [Appendix 4] The processing unit aligns the modeled object with the processing unit based on the position information output from the output device, and performs the processing operation based on the result of the alignment.
  • Appendix 2 or 3 The modeling unit described in.
  • Appendix 5 The modeling unit according to any one of Appendix 1 to 4, wherein the modeling device models the modeled object whose relative position with respect to the base member is fixed.
  • Appendix 6 The modeling unit according to any one of Appendix 1 to 5, wherein the modeling device models the modeled object coupled to the base member.
  • [Appendix 7] The modeling unit according to any one of Appendix 1 to 6, wherein the position information includes information on a relative position between the set position and the base member.
  • [Appendix 11] The modeling apparatus models the modeled object on the base member based on the modeling data.
  • Appendix 12 The modeling unit according to Appendix 11, wherein the modeling data includes data that determine the content of a modeling operation for modeling the modeled object.
  • Appendix 13 The modeling unit according to Appendix 11 or 12, wherein the modeling data includes three-dimensional shape data of the modeled object.
  • Appendix 14 Further equipped with a measuring device that measures the modeled object and obtains the measurement result, The modeling unit according to any one of Appendix 8 to 13, wherein the output device outputs the measurement result associated with the set position as the position information.
  • Appendix 15 The measuring device measures the position of the base member in the reference coordinate system of the modeling unit.
  • Appendix 16 Further provided with a support device for supporting the base member, The modeling unit according to Appendix 15, wherein the reference coordinate system includes a support position coordinate system for indicating a position of the support device on a support surface.
  • the measuring device measures the position of the portion of the base member in the reference coordinate system of the modeling unit, The output device outputs the position of the portion of the base member associated with the set position.
  • Appendix 18 The modeling unit according to Appendix 9 to 17, wherein the output device outputs information regarding the set position.
  • [Appendix 19] The modeling unit according to any one of Appendix 14 to 18, wherein the measuring device measures the modeled object in a non-contact manner.
  • Appendix 20 The modeling unit according to any one of Appendix 1 to 19, further comprising a control device for setting the set position.
  • Appendix 21 The modeling unit according to Appendix 19, wherein the control device sets the set position on the base member.
  • Appendix 22 A control device that sets the set position on the base member, A modeling unit including a modeling device that models a modeled object on the base member based on the set position.
  • [Appendix 26] A modeling device that models a modeled object on the base member, A modeling unit including a base member and an output device that outputs position information regarding a relationship between a set position set on at least one of the modeled objects and the position of the modeled object.
  • [Appendix 27] A modeling device that models a modeled object on the base member, A modeling unit including an output device that outputs three-dimensional shape data of the base member and three-dimensional shape data of the modeled object.
  • [Appendix 28] The modeling unit according to Appendix 27, wherein the output device outputs the three-dimensional shape data of the base member in association with the three-dimensional shape data of the modeled object.
  • [Appendix 29] The modeling unit according to Appendix 27 or 28, wherein the output device outputs position information regarding a set position set on the base member.
  • [Appendix 30] The modeling unit according to Appendix 29, wherein the output device outputs the set position in association with the three-dimensional shape data of the base member.
  • [Appendix 31] The modeling unit according to Appendix 29 or 30, wherein the output device outputs the set position in association with the three-dimensional shape data of the modeled object.
  • [Appendix 32] A modeling device that models a modeled object on the base member, A measuring device that acquires three-dimensional information of the base member and the modeled object, and A modeling unit including an output device that outputs measurement results by the measuring device.
  • the measuring device measures the base member in at least one period before the modeled object is modeled and while the modeled object is being modeled, obtains the first measurement result, and the modeled object is modeled.
  • the modeling unit according to Appendix 32 which measures the modeled object and acquires a second measurement result during at least one period after the modeled object is modeled.
  • the modeling unit according to Appendix 34 The modeling unit according to Appendix 33, wherein the output device outputs the first measurement result and the second measurement result in association with each other.
  • Appendix 35 A modeling device that models a modeled object on the base member, A measuring device for measuring the base member and the modeled object, and It is equipped with an output device that outputs the measurement results of the measuring device.
  • the measuring device measures the base member in at least one period before the modeled object is modeled and while the modeled object is being modeled, obtains the first measurement result, and the modeled object is modeled.
  • Appendix 36 The modeling unit according to Appendix 35, wherein the output device outputs the first measurement result and the second measurement result in association with each other.
  • Appendix 37 The modeling unit according to any one of Appendix 1 to 31, further comprising a measuring device for measuring the modeled object.
  • [Appendix 38] The modeling unit according to Appendix 37, wherein the output device outputs position information regarding a set position set on the base member and a measurement result of the measuring device.
  • a control device for correcting the position information regarding the set position set on the base member based on the measurement result of the measuring device is provided.
  • the modeling device includes a supply device that supplies materials to the modeling position.
  • Appendix 42 The modeling unit according to Appendix 41, wherein the modeling device includes a beam irradiation device that irradiates the modeling position with an energy beam.
  • Appendix 43 The modeling unit according to any one of Appendix 1 to 42, wherein the modeling device forms the modeled object by performing additional processing on the base member.
  • Appendix 44 The modeling unit according to any one of Appendix 1 to 43, wherein a mark is provided on the base member.
  • [Appendix 45] The modeling unit according to Appendix 44, wherein the position of the mark or a position having a predetermined relationship with the mark is a set position on the base member.
  • [Appendix 46] The modeling unit according to any one of Appendix 1 to 45, wherein the feature point of the base member is a set position on the base member.
  • [Appendix 47] The modeling unit according to Appendix 46, wherein the feature point includes a boundary of the base member or a boundary of a structure on the base member.
  • [Appendix 48] The modeling unit according to Appendix 43 or 44, wherein the feature point includes a corner of the base member or a corner of a structure on the base member.
  • a modeling device for modeling a modeled object including a flat surface on the upper surface of a base member having a flat side surface, A modeling unit including a control device that controls the modeling device so that the side surface of the base member and the planar surface of the modeled object are parallel to each other.
  • the processing unit according to Appendix 50 further comprising an input device for inputting the position information.
  • Appendix 52 The processing unit according to Appendix 51, wherein the position information from the modeling unit that models the modeled object is input to the input device.
  • Appendix 53 The processing unit according to Appendix 52, wherein the position information is input to the input device from at least one of a user of the modeling unit for modeling the modeled object and a user of the processing unit.
  • Appendix 54 The processing unit according to any one of Appendix 50 to 53, wherein the control device generates the position information based on the modeling data that determines the content of the modeling operation for modeling the modeled object.
  • Appendix 55 The processing unit according to any one of Appendix 50 to 54, wherein the control device generates the position information based on the modeling data including the three-dimensional shape data of the modeled object.
  • Appendix 56 The processing unit according to Appendix 54 or 55, further comprising an input device into which the modeling data is input.
  • Appendix 57 The processing unit according to Appendix 56, wherein the modeling data is input to the input device from the modeling unit that models the modeled object.
  • Appendix 58 From Appendix 50, the control device adjusts the set position and the processing device based on the position information, and controls the processing device so as to perform the processing operation based on the result of the alignment.
  • the processing unit according to any one of 57 The processing unit according to any one of 57.
  • Appendix 59 The processing unit according to any one of Appendix 50 to 58, wherein the modeled object is transported from the modeling unit to the processing unit after the modeling unit for modeling the modeled object has modeled the modeled object.
  • Appendix 60 The processing unit according to Appendix 59, wherein the modeled object is conveyed from the modeling unit to the processing unit together with the base member.
  • Appendix 61 The processing unit according to Appendix 60, wherein the modeled object is conveyed from the modeling unit to the processing unit together with the base member while maintaining the relative position between the base member and the modeled object.
  • Appendix 66 The processing unit according to any one of Appendix 50 to 65, wherein the processing apparatus performs a removal processing operation for removing a part of the modeled object as the processing operation.
  • Appendix 67 A processing device that performs processing operations on a modeled object formed on the base member, A machining unit including a control device that controls the machining device by using information on the relationship between the set position set on the base member and the position of the modeled object.
  • Appendix 68 A processing device that performs processing operations on a modeled object formed on the base member, A machining unit including a control device that controls the machining device by using the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • Appendix 69 The processing unit according to Appendix 68, wherein the control device controls the processing device by using information associated with the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • Appendix 70 The machining unit according to Appendix 68 or 69, wherein the control device controls the machining device by using information about a set position set on the base member.
  • Appendix 71 The machining unit according to Appendix 70, wherein the control device controls the machining device by using information associated with the set position and the three-dimensional shape data of the base member.
  • Appendix 72 The processing unit according to Appendix 70 or 71, wherein the control device controls the processing device by using information associated with the set position and the three-dimensional shape data of the modeled object.
  • Appendix 73 A processing device that performs processing operations on a modeled object formed on the base member, A processing unit including a control device that controls the processing device by using the first measurement result of the base member and the second measurement result of the base member and the modeled object.
  • Appendix 74 The processing unit according to Appendix 73, wherein the first measurement result and the second measurement result are associated with each other.
  • [Appendix 75] A modeling unit that models a modeled object on the base member based on a set position set on the base member, and A machining system including a machining unit that performs a machining operation on the modeled object based on position information regarding the set position.
  • [Appendix 76] The processing system according to Appendix 75, wherein the modeling unit outputs the position information to the processing unit.
  • [Appendix 77] The processing system according to Appendix 76, wherein the processing unit performs the processing operation based on the position information output from the modeling unit.
  • the modeling unit models the modeled object based on the modeling data, and outputs the modeling data to the processing unit.
  • the processing unit generates the position information based on the modeling data, and performs the processing operation on the modeled object based on the generated position information according to any one of the items 75 to 77.
  • Processing system [Appendix 79] The processing system according to any one of Appendix 75 to 78, further comprising a control device for controlling at least one of the modeling unit and the processing unit.
  • Appendix 80 The processing system according to Appendix 79, wherein the control device acquires position information regarding the set position from the modeling unit and outputs the acquired position information to the processing unit.
  • Appendix 81 The processing system according to Appendix 79 or 80, wherein the control device acquires modeling data from the modeling unit and outputs the acquired modeling data to the processing unit.
  • the control device acquires position information regarding the set position from the modeling unit, and controls the processing unit so as to perform the processing operation based on the acquired position information. Any one of the items 79 to 81.
  • the processing system described in. [Appendix 83]
  • the control device acquires modeling data from the modeling unit, generates position information regarding the set position based on the acquired modeling data, and performs the processing operation based on the generated position information.
  • the machining system according to any one of Appendix 79 to 82, which controls a machining unit.
  • the control device controls the modeling unit so as to model the modeled object based on the position information regarding the set position, and controls the machining unit so as to perform the machining operation based on the position information.
  • the processing system according to any one of 79 to 83.
  • the control device controls the modeling unit so as to model the modeled object based on the modeling data, generates position information regarding the set position based on the modeling data, and is based on the generated position information.
  • the machining system according to any one of Appendix 79 to 84, which controls the machining unit so as to perform the machining operation.
  • Appendix 86 The processing system according to Appendix 78, 81, 83 or 85, wherein the modeling data includes data defining the content of a modeling operation for modeling the modeled object.
  • Appendix 87 The processing system according to Appendix 78, 81, 83, 85 or 86, wherein the modeling data includes three-dimensional shape data of the modeled object.
  • Appendix 88 The processing system according to any one of Appendix 75 to 87, further comprising a transport device for transporting the modeled object from the modeling unit to the processing unit.
  • Appendix 89 The processing system according to Appendix 88, wherein the transfer device transfers the modeled object from the modeling unit to the processing unit after the modeling unit has modeled the modeled object.
  • Appendix 90 The processing system according to Appendix 88 or 89, wherein the transfer device conveys the modeled object together with the base member from the modeling unit to the processing unit.
  • Appendix 91 The processing system according to Appendix 90, wherein the transport device transports the modeled object from the modeling unit to the processing unit together with the base member while maintaining a relative position between the base member and the modeled object.
  • Appendix 92 The processing system according to Appendix 90 or 91, wherein the transport device transports the modeled object coupled to the base member from the modeling unit to the processing unit.
  • Appendix 93 A modeling unit that models a modeled object on the base member based on a set position set on the base member, and A machining system including a machining unit that performs a machining operation on the modeled object based on position information regarding a relative position between the set position and the modeled object.
  • [Appendix 94] The modeling apparatus models the modeled object on the base member based on the modeling data.
  • [Appendix 95] The processing system according to Appendix 94, wherein the modeling data includes data that determine the content of a modeling operation for modeling the modeled object.
  • [Appendix 96] The processing system according to Appendix 94 or 95, wherein the modeling data includes three-dimensional shape data of the modeled object.
  • Appendix 97 Further equipped with a measuring unit that measures the modeled object, The processing system according to any one of Appendix 93 to 96, wherein the position information includes a measurement result by the measurement unit associated with the set position.
  • the measuring unit measures the position of the base member in the reference coordinate system of the modeling unit.
  • the reference coordinate system includes a support position coordinate system for indicating a position of the support device on a support surface.
  • the measuring unit measures the position of a portion of the base member in the reference coordinate system of the modeling unit, The processing system according to any one of Supplementary note 97 to 99, wherein the position information includes information regarding the position of the portion of the base member associated with the set position.
  • a modeling unit that models a modeled object on the base member A processing system including a processing unit that performs a processing operation on a modeled object formed on the base member by using information on the relationship between a set position set on the base member and the position of the modeled object.
  • a modeling unit that models a modeled object on the base member A processing unit including a processing unit that performs a processing operation on a modeled object formed on the base member by using the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • Appendix 103 The processing system according to Appendix 102, wherein the processing unit performs the processing operation by using information associated with the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • Appendix 104 The machining system according to Appendix 102 or 103, wherein the machining unit performs the machining operation using information about a set position set on the base member.
  • Appendix 105 The machining system according to Appendix 104, wherein the machining unit performs the machining operation by using information associated with the set position and the three-dimensional shape data of the base member.
  • Appendix 106 The machining system according to Appendix 104 or 105, wherein the machining unit performs the machining operation by using information associated with the set position and the three-dimensional shape data of the modeled object.
  • Appendix 107 A modeling unit that models a modeled object on the base member, It is equipped with a processing unit that performs processing operations on the modeled object formed on the base member. The processing unit is a processing system that performs the processing operation by using the first measurement result of the base member and the second measurement result of the base member and the modeled object.
  • Appendix 108 The processing system according to Appendix 107, wherein the first measurement result and the second measurement result are associated with each other.
  • the modeling unit is the modeling unit according to any one of Appendix 1 to 49.
  • the processing system according to any one of Appendix 75 to 108.
  • the processing unit is the processing unit according to any one of Appendix 50 to 74.
  • a control device that controls the output device so as to output position information regarding the set position.
  • a control device that controls a modeling unit including a modeling device and an output device.
  • the modeling device Based on the set position set on the base member, the modeling device is controlled so as to model a modeled object on the base member. A control device that controls the output device so as to output position information regarding a relative position between the set position and the modeled object.
  • a control device that controls the modeling device so as to model the modeled object on the base member based on the set position A control device that controls the modeling device so as to model the modeled object on the base member based on the set position.
  • a control device that controls a modeling unit including a modeling device and an output device A set position is set on at least one of the base member and the modeled object, and the modeling device is controlled so as to model the modeled object on the base member based on the set position.
  • the modeling device is controlled so as to model a modeled object on the base member.
  • a control device that controls the output device so as to output position information regarding a relationship between a set position set on at least one of the base member and the modeled object and the position of the modeled object.
  • a control device that controls a modeling unit including a modeling device and an output device.
  • the modeling device is controlled so as to model a modeled object on the base member.
  • a control device that controls the output device so as to output the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • a control device that controls a modeling unit including a modeling device, a measuring device, and an output device.
  • the modeling device is controlled so as to model a modeled object on the base member.
  • the measuring device is controlled so as to measure the base member and the modeled object.
  • the output device is controlled so as to output the measurement result by the measuring device.
  • the base member is measured and the first measurement result is obtained during at least one period before the modeled object is modeled and while the modeled object is being modeled, and while the modeled object is being modeled and said.
  • the modeling device is controlled so as to form a modeled object including the planar surface on the upper surface of the base member having the planar side surface.
  • a control device that controls the modeling device so that the side surface of the base member and the planar surface of the modeled object are parallel to each other.
  • a control device that controls a processing device that performs a processing operation on a modeled object formed on the base member based on a set position set on the base member based on position information related to the set position.
  • Appendix 122 A control device that controls a processing device that performs a processing operation on a modeled object formed on a base member by using the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • Appendix 123 A control device that controls a processing device that performs a processing operation on a modeled object formed on a base member by using the first measurement result of the base member and the second measurement result of the base member and the modeled object. ..
  • Appendix 124 A control device used in a processing system including a modeling unit and a processing unit. The modeling unit is controlled so as to model a modeled object on the base member based on a set position set on the base member.
  • [Appendix 131] Based on the set position set on the base member, modeling the modeled object on the base member and A modeling method including outputting position information regarding the relationship between the set position and the position of the modeled object.
  • [Appendix 132] Setting the set position on the base member and A modeling method including modeling a modeled object on the base member based on the set position.
  • [Appendix 133] Modeling a modeled object on the base member and To set the set position on at least one of the base member and the modeled object, It includes outputting the first position information regarding the set position and the second position information regarding the positional relationship between the set position and the position of the modeled object.
  • the modeling is a modeling method in which the modeled object is modeled based on the set position.
  • [Appendix 138] Performing processing operations on the modeled object formed on the base member Including obtaining information on the relationship between the set position set on the base member and the position of the modeled object.
  • Performing the processing operation is a processing method including performing the processing operation using the information.
  • [Appendix 139] Performing processing operations on the modeled object formed on the base member Including the acquisition of the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • Performing the processing operation is a processing method including performing the processing operation by using the three-dimensional shape data of the base member and the three-dimensional shape data of the modeled object.
  • [Appendix 140] Performing processing operations on the modeled object formed on the base member Including the acquisition of the first measurement result of the base member and the second measurement result of the base member and the modeled object. Performing the processing operation is a processing method including performing the processing operation using the first measurement result and the second measurement result.
  • [Appendix 141] Based on the set position set on the base member, modeling the modeled object on the base member and A processing method including performing a processing operation on the modeled object based on the position information.
  • [Appendix 142] Based on the set position set on the base member, modeling the modeled object on the base member and A processing method including performing a processing operation on the modeled object based on position information regarding a relative position between the set position and the modeled object.
  • the present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of claims and within the scope not contrary to the gist or idea of the invention that can be read from the entire specification, and the modeling unit accompanied by such modification. Machining units, machining systems, control devices, modeling methods and machining methods are also included in the technical scope of the present invention.

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