WO2020203462A1 - 分散液、組成物、封止部材、発光装置、照明器具、表示装置および分散液の製造方法 - Google Patents
分散液、組成物、封止部材、発光装置、照明器具、表示装置および分散液の製造方法 Download PDFInfo
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- WO2020203462A1 WO2020203462A1 PCT/JP2020/012985 JP2020012985W WO2020203462A1 WO 2020203462 A1 WO2020203462 A1 WO 2020203462A1 JP 2020012985 W JP2020012985 W JP 2020012985W WO 2020203462 A1 WO2020203462 A1 WO 2020203462A1
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- Prior art keywords
- oxide particles
- metal oxide
- mass
- dispersion
- dispersion liquid
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- 239000006185 dispersion Substances 0.000 title claims abstract description 205
- 239000007788 liquid Substances 0.000 title claims abstract description 117
- 239000000203 mixture Substances 0.000 title claims description 105
- 238000007789 sealing Methods 0.000 title claims description 92
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000005286 illumination Methods 0.000 title 1
- 239000002245 particle Substances 0.000 claims abstract description 366
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 249
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 249
- -1 silane compound Chemical class 0.000 claims abstract description 126
- 229910000077 silane Inorganic materials 0.000 claims abstract description 111
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 76
- 150000001875 compounds Chemical class 0.000 claims abstract description 62
- 238000001228 spectrum Methods 0.000 claims abstract description 11
- 238000000411 transmission spectrum Methods 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000001291 vacuum drying Methods 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 56
- 239000011347 resin Substances 0.000 claims description 56
- 239000000243 solution Substances 0.000 claims description 42
- 239000011259 mixed solution Substances 0.000 claims description 40
- 238000002156 mixing Methods 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 239000003054 catalyst Substances 0.000 claims description 10
- 230000003595 spectral effect Effects 0.000 claims description 8
- 230000003301 hydrolyzing effect Effects 0.000 claims description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 abstract description 14
- 239000000463 material Substances 0.000 description 64
- 229920002050 silicone resin Polymers 0.000 description 58
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 55
- 239000002904 solvent Substances 0.000 description 45
- 125000003545 alkoxy group Chemical group 0.000 description 31
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 26
- 239000002612 dispersion medium Substances 0.000 description 25
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 24
- 230000002209 hydrophobic effect Effects 0.000 description 22
- 229910001928 zirconium oxide Inorganic materials 0.000 description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 17
- 238000006460 hydrolysis reaction Methods 0.000 description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 230000002776 aggregation Effects 0.000 description 13
- 239000011164 primary particle Substances 0.000 description 13
- 239000007787 solid Substances 0.000 description 13
- 238000009826 distribution Methods 0.000 description 12
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 12
- 150000004756 silanes Chemical class 0.000 description 11
- 238000011282 treatment Methods 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- 238000004220 aggregation Methods 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 239000010954 inorganic particle Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 229910008051 Si-OH Inorganic materials 0.000 description 6
- 229910006358 Si—OH Inorganic materials 0.000 description 6
- 238000000149 argon plasma sintering Methods 0.000 description 6
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000007062 hydrolysis Effects 0.000 description 5
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 5
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 5
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 5
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000011163 secondary particle Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000003755 preservative agent Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- HYFLWBNQFMXCPA-UHFFFAOYSA-N 1-ethyl-2-methylbenzene Chemical compound CCC1=CC=CC=C1C HYFLWBNQFMXCPA-UHFFFAOYSA-N 0.000 description 2
- JRLPEMVDPFPYPJ-UHFFFAOYSA-N 1-ethyl-4-methylbenzene Chemical compound CCC1=CC=C(C)C=C1 JRLPEMVDPFPYPJ-UHFFFAOYSA-N 0.000 description 2
- ZLCSFXXPPANWQY-UHFFFAOYSA-N 3-ethyltoluene Chemical compound CCC1=CC=CC(C)=C1 ZLCSFXXPPANWQY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910002808 Si–O–Si Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000005456 alcohol based solvent Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000002296 dynamic light scattering Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- KUCGHDUQOVVQED-UHFFFAOYSA-N ethyl(tripropoxy)silane Chemical compound CCCO[Si](CC)(OCCC)OCCC KUCGHDUQOVVQED-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical compound CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- CKFGINPQOCXMAZ-UHFFFAOYSA-N methanediol Chemical compound OCO CKFGINPQOCXMAZ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- YTZKOQUCBOVLHL-UHFFFAOYSA-N tert-butylbenzene Chemical compound CC(C)(C)C1=CC=CC=C1 YTZKOQUCBOVLHL-UHFFFAOYSA-N 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 2
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PSJBSUHYCGQTHZ-UHFFFAOYSA-N 3-Methoxy-1,2-propanediol Chemical compound COCC(O)CO PSJBSUHYCGQTHZ-UHFFFAOYSA-N 0.000 description 1
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 229910002087 alumina-stabilized zirconia Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 229910002084 calcia-stabilized zirconia Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 229910002086 ceria-stabilized zirconia Inorganic materials 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- SOYVLBDERBHIME-UHFFFAOYSA-N chloro(diethyl)silicon Chemical group CC[Si](Cl)CC SOYVLBDERBHIME-UHFFFAOYSA-N 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical group C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- YCITZMJNBYYMJO-UHFFFAOYSA-N chloro(diphenyl)silicon Chemical group C=1C=CC=CC=1[Si](Cl)C1=CC=CC=C1 YCITZMJNBYYMJO-UHFFFAOYSA-N 0.000 description 1
- IPAIXTZQWAGRPZ-UHFFFAOYSA-N chloro-methyl-phenylsilicon Chemical group C[Si](Cl)C1=CC=CC=C1 IPAIXTZQWAGRPZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- PFMKUUJQLUQKHT-UHFFFAOYSA-N dichloro(ethyl)silicon Chemical group CC[Si](Cl)Cl PFMKUUJQLUQKHT-UHFFFAOYSA-N 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical group C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- XNAFLNBULDHNJS-UHFFFAOYSA-N dichloro(phenyl)silicon Chemical group Cl[Si](Cl)C1=CC=CC=C1 XNAFLNBULDHNJS-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical group CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical group CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical group CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- XZFFGKZBTQABBO-UHFFFAOYSA-N ethoxy(dimethyl)silane Chemical group CCO[SiH](C)C XZFFGKZBTQABBO-UHFFFAOYSA-N 0.000 description 1
- FJKCDSVHCNEOOS-UHFFFAOYSA-N ethoxy(diphenyl)silane Chemical group C=1C=CC=CC=1[SiH](OCC)C1=CC=CC=C1 FJKCDSVHCNEOOS-UHFFFAOYSA-N 0.000 description 1
- ZZRGHKUNLAYDTC-UHFFFAOYSA-N ethoxy(methyl)silane Chemical group CCO[SiH2]C ZZRGHKUNLAYDTC-UHFFFAOYSA-N 0.000 description 1
- 229910001940 europium oxide Inorganic materials 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229910002088 hafnia-stabilized zirconia Inorganic materials 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229940071870 hydroiodic acid Drugs 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229940035429 isobutyl alcohol Drugs 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910002085 magnesia-stabilized zirconia Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- RSRCJPGCPWEIHN-UHFFFAOYSA-N methoxy(diphenyl)silane Chemical group C=1C=CC=CC=1[SiH](OC)C1=CC=CC=C1 RSRCJPGCPWEIHN-UHFFFAOYSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical group CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 150000003138 primary alcohols Chemical class 0.000 description 1
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- ZJMWRROPUADPEA-UHFFFAOYSA-N sec-butylbenzene Chemical compound CCC(C)C1=CC=CC=C1 ZJMWRROPUADPEA-UHFFFAOYSA-N 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical group CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical group CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical group CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/12—Treatment with organosilicon compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G25/00—Compounds of zirconium
- C01G25/02—Oxides
-
- C—CHEMISTRY; METALLURGY
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/0081—Composite particulate pigments or fillers, i.e. containing at least two solid phases, except those consisting of coated particles of one compound
- C09C1/0084—Composite particulate pigments or fillers, i.e. containing at least two solid phases, except those consisting of coated particles of one compound containing titanium dioxide
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- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/36—Compounds of titanium
- C09C1/3607—Titanium dioxide
- C09C1/3684—Treatment with organo-silicon compounds
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- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/10—Treatment with macromolecular organic compounds
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
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- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
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- C01P2004/51—Particles with a specific particle size distribution
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- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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- C01—INORGANIC CHEMISTRY
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- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
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- C01—INORGANIC CHEMISTRY
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- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
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- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/60—Optical properties, e.g. expressed in CIELAB-values
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Definitions
- the present invention relates to a dispersion liquid, a composition, a sealing member, a light emitting device, a lighting fixture, a display device, and a dispersion liquid containing metal oxide particles surface-modified with a silane compound and a silicone compound.
- the present application claims priority based on Japanese Patent Application No. 2019-066737 filed in Japan on March 29, 2019, the contents of which are incorporated herein by reference.
- a light emitting diode is widely used as a light source having advantages such as small size, long life, and low voltage drive.
- the LED chip in the LED package is generally sealed with a sealing material containing a resin in order to prevent contact with deterioration factors existing in the external environment such as oxygen and moisture. Therefore, the light emitted from the LED chip passes through the sealing material and is emitted to the outside. Therefore, in order to increase the luminous flux emitted from the LED package, it is important to efficiently extract the light emitted from the LED chip to the outside of the LED package.
- the surface was modified with a surface modifying material having one or more functional groups selected from an alkenyl group, an H—Si group, and an alkoxy group.
- a composition for forming a light scattering complex containing a metal oxide particle and a matrix resin composition has been proposed (Patent Document 1).
- a dispersion liquid containing metal oxide particles having a small dispersed particle size and a high refractive index is mixed with a silicone resin in a state where transparency is relatively maintained. There is.
- the light scattering complex obtained by curing the composition for forming a light scattering complex has suppressed decrease in light transmittance and improved light scattering property.
- the present inventors not only improve the light scattering property of the obtained sealing member but also improve the refractive index of the sealing member by incorporating the metal oxide particles having a high refractive index into the sealing material. It was found that it can be made to.
- the refractive index of the sealing member is improved, the efficiency of extracting light from the sealed light emitting element is generally improved.
- the metal oxide particles are contained in the encapsulating material for such a purpose, it is advantageous that the content of the metal oxide particles is large from the viewpoint of improving the refractive index.
- the present invention has been made to solve the above problems, and is a dispersion liquid containing metal oxide particles and suppressing aggregation of the metal oxide particles when dispersed in a methyl silicone resin.
- a composition containing the same a sealing member formed by using the composition, a light emitting device having the sealing member, a lighting device and a display device provided with the light emitting device, and a method for producing a dispersion liquid. The purpose is.
- the first aspect of the present invention is a dispersion liquid containing metal oxide particles surface-modified with a silane compound and a silicone compound.
- the dispersion obtained by drying by vacuum drying, for the metal oxide particles, and measuring the transmission spectrum in the range of wave number of the Fourier transform type infrared spectrophotometer by 800 cm -1 above 3800 cm -1, the range
- the spectrum values are standardized so that the maximum value of the spectrum is 100 and the minimum value is 0, the following equation (1): IA / IB ⁇ 3.5 (1) (Wherein "IA", the spectral value at 3500 cm -1, "IB” respectively show the spectral values in 1100 cm -1)
- the second aspect of the present invention provides a composition obtained by mixing the dispersion liquid and the resin component. Further, in order to solve the above problems, a third aspect of the present invention provides a sealing member which is a cured product of the composition.
- a fourth aspect of the present invention provides a light emitting device including the sealing member and a light emitting element sealed by the sealing member. Further, in order to solve the above problems, a fifth aspect of the present invention provides a luminaire or a display device including the light emitting device.
- the sixth aspect of the present invention comprises a first step of mixing at least a silane compound and water to obtain a hydrolyzed solution in which the silane compound is hydrolyzed.
- the second step of mixing the hydrolyzed solution and the metal oxide particles to obtain a mixed solution and A third step of dispersing the metal oxide particles in the mixed solution to obtain a first dispersion, and A fourth step of treating the metal oxide particles in the first dispersion with a silicone compound to obtain a second dispersion.
- the content of the metal oxide particles in the mixed solution is 10% by mass or more and 49% by mass or less, and the total content of the silane compound and the metal oxide particles in the mixed solution is 65% by mass or more.
- a method for producing a dispersion liquid having a content of 98% by mass or less is provided.
- the catalyst may be mixed with the silane compound and the water.
- a dispersion liquid containing metal oxide particles and which suppresses aggregation of the metal oxide particles when dispersed in a methyl silicone resin, a composition containing the same, the composition It is possible to provide a sealing member formed by using the above, a light emitting device having the sealing member, a lighting device and a display device provided with the light emitting device, and a method for producing a dispersion liquid.
- a sealing material which is a raw material of a sealing member
- metal oxide particles are modified by a surface modifying material and dispersed in a resin such as a silicone resin.
- a resin such as a silicone resin.
- the methyl silicone resin has a large content of methyl groups and a high degree of hydrophobicity as compared with phenyl silicone resins and the like which have been generally used in the past. Therefore, even when the metal oxide particles are modified with the surface modifying material as described above, it is difficult for the metal oxide particles to be uniformly dispersed in the methyl silicone resin.
- the present inventors did not significantly improve the dispersibility of the metal oxide particles in the methyl silicone resin even if the amount of the surface modifying material used was simply increased. I found that.
- the present inventors further investigated and focused on the modified state of the surface modifying material on the surface of the metal oxide particles. That is, even if the metal oxide particles are modified using a large amount of surface modifying material, if only a small amount of the surface modifying material adheres to the surface of the metal oxide particles, the surface of the metal oxide particles Is not sufficiently hydrophobic. On the other hand, even when the metal oxide particles are modified using a small amount of the surface modifying material, the adhesion ratio of the surface modifying material to the surface of the metal oxide particles is high, and the surface of the metal oxide particles is adhered to. When a large amount of surface modifying material is attached, the surface of the metal oxide particles is sufficiently hydrophobic.
- the present inventors determine the degree of adhesion of the surface modifying material to the metal oxide particles as described above by Fourier transform infrared spectrophotometric intensity. We have found that the silane compound and the silicone compound can be sufficiently adhered to the surface of the metal oxide particles by a method described later, and that the measurement and observation can be performed by an meter (FT-IR), and the present invention has been made.
- the dispersion liquid according to this embodiment contains metal oxide particles surface-modified with a silane compound and a silicone compound.
- the transmission spectrum of the metal oxide particles obtained by drying the dispersion liquid by vacuum drying in the wave number range of 800 cm -1 or more and 3800 cm -1 is measured by a Fourier transform infrared spectrophotometer. Further, when the spectrum value is standardized so that the maximum value of the spectrum in the range is 100 and the minimum value is 0, the following equation (1) is satisfied. IA / IB ⁇ 3.5 (1) (Wherein “IA”, the spectral value at 3500 cm -1, "IB” respectively show the spectral values in 1100 cm -1)
- the dispersion liquid according to the present embodiment is mixed with the methyl silicone resin and the metal oxide particles are dispersed in the methyl silicone resin, aggregation of the metal oxide particles is suppressed. Will be done.
- the composition (resin composition) obtained as a mixture suppresses turbidity and becomes relatively transparent.
- the position of wave number 1100 cm -1 belongs to the siloxane bond (Si—O—Si bond), and the position of wave number 3500 cm -1 is , Belongs to the silanol group (Si-OH group).
- the silane compound and the silicone compound each have a Si—OH group capable of forming a Si—O—Si bond and a group capable of forming a Si—OH group.
- the spectral values (IA) in 3500 cm -1 by comparing the spectral values (IB) in 1100 cm -1, silane compound and Si-OH and the silicone compound, the Si-OH groups capable of forming group It becomes possible to observe the degree of reaction.
- the present inventors have found that when the IA / IB is 3.5 or less, the silane compound and the silicone compound are sufficiently adhered to the surface of the metal oxide particles. As a result, the metal oxide particles can be dispersed in the methyl silicone resin without agglomeration even when mixed with the methyl silicone resin. As a result, the composition obtained as a mixture suppresses turbidity and becomes relatively transparent. Furthermore, since the metal oxide particles are contained, when a sealing member for sealing the light emitting element is obtained using the composition, the refractive index of the sealing member is that of the methyl silicone resin alone. Compared to the one, it is improved. As described above, when a composition is obtained using the dispersion liquid according to the present embodiment and the light emitting element is sealed using the composition, the light emitting device is caused by the high refractive index and light transmittance of the sealing member. Brightness improves.
- the IA / IB may be 3.5 or less as described above, but is preferably 3.0 or less, and more preferably 2.5 or less. It may be 2.4 or less or 2.3 or less.
- the transmission spectrum of the metal oxide particles by the Fourier transform infrared spectrophotometer can be measured as follows, to give a specific example.
- the obtained dispersion is dried by vacuum drying.
- measurement was performed with a Fourier transform infrared spectrophotometer (for example, manufactured by JASCO Corporation, model number: FT / IR-670 Plus). To do.
- the measurement can be made in this way.
- the metal oxide particles scatter the light emitted from the light emitting element in the sealing member described later. Further, depending on the type of metal oxide particles, the refractive index of the sealing member is improved. As a result, the metal oxide particles contribute to the improvement of the brightness of light in the light emitting device.
- the metal oxide particles contained in the dispersion liquid according to the present embodiment are not particularly limited.
- the metal oxide particles include, for example, zirzyl oxide particles, titanium oxide particles, zinc oxide particles, iron oxide particles, copper oxide particles, tin oxide particles, cerium oxide particles, tanthal oxide particles, niobium oxide particles, and the like.
- Strontium titanate particles potassium niobate particles, lithium niobate particles, calcium tantistate particles, yttria-stabilized zirconia particles, alumina-stabilized zirconia particles, calcia-stabilized zirconia particles, magnesia-stabilized zirconia particles, scandia-stabilized zirconia particles , Hafnia-stabilized zirconia particles, yttria-stabilized zirconia particles, ceria-stabilized zirconia particles, india-stabilized zirconia particles, strontium-stabilized zirconia particles, samarium oxide-stabilized zirconia particles, gadrinium oxide-stabilized zirconia particles, antimonated tin oxide particles , And at least one or more selected from the group consisting of yttria-stabilized tin oxide particles are preferably used.
- the dispersion liquid is at least one selected from the group consisting of zirconium oxide particles and titanium oxide particles. It is preferable to include it. Further, the metal oxide particles preferably have a refractive index of 1.7 or more from the viewpoint of improving the refractive index of the sealing member.
- the metal oxide particles are more preferably zirconium oxide particles and / or titanium oxide particles, and particularly preferably zirconium oxide particles.
- the metal oxide particles may be dispersed as primary particles in the dispersion liquid, or may be dispersed as secondary particles in which the primary particles are aggregated. Usually, the metal oxide particles are dispersed as secondary particles.
- the average dispersed particle size of the metal oxide particles in the dispersion is not particularly limited, but is, for example, 10 nm or more and 300 nm or less, preferably 20 nm or more and 250 nm or less, and more preferably 30 nm or more and 200 nm or less. If necessary, it may be 30 nm or more and 80 nm or less, 30 nm or more and 100 nm or less, 80 nm or more and 180 nm or less.
- the average dispersed particle diameter of the metal oxide particles is 10 nm or more, the brightness of the light of the light emitting device described later produced by using this dispersion is improved.
- the average dispersed particle size of the metal oxide particles is 300 nm or less, it is possible to suppress a decrease in the light transmittance of the dispersion liquid, the composition described later, and the sealing member produced by using the dispersion liquid. Can be done. As a result, the brightness of the light of the light emitting device is improved.
- the average dispersed particle size of the metal oxide particles can be the particle size D50 of the metal oxide particles when the cumulative percentage of the scattering intensity distribution obtained by the dynamic light scattering method is 50%.
- This value can be measured by a dynamic light scattering type particle size distribution meter (for example, manufactured by HORIBA, model number: SZ-100SP). The measurement can be performed using a quartz cell having an optical path length of 10 mm ⁇ 10 mm, targeting a dispersion liquid having a solid content adjusted to 5% by mass.
- a "solid content” means a residue when a volatile component is removed in a dispersion liquid.
- a dispersion liquid for example, 1.2 g of a dispersion liquid
- a magnetic crucible for example, 1.2 g
- components that remain without volatilization metal oxide particles, surface modifying materials, etc.
- the average dispersed particle size of the metal oxide particles is the diameter of the dispersed metal oxide particles regardless of whether the metal oxide particles are dispersed in the primary particles or the secondary particles. Based on this, it is measured and calculated. Further, in the present embodiment, the average dispersed particle size of the metal oxide particles may be measured as the average dispersed particle size of the metal oxide particles to which the surface modifying material is attached. In the dispersion liquid, there may be metal oxide particles to which the surface modifying material is attached and metal oxide particles to which the surface modifying material is not attached. Therefore, the average dispersed particle size of the metal oxide particles is usually measured as a value in a mixed state thereof.
- the average primary particle size of the metal oxide particles used can be arbitrarily selected, and is, for example, 3 nm or more and 200 nm or less, preferably 5 nm or more and 170 nm or less, and more preferably 10 nm or more and 100 nm or less.
- the average primary particle diameter of the inorganic particles may be 5 to 20 nm, 5 to 25 nm, 50 to 120 nm, or 50 to 150 nm, if necessary.
- the average primary particle size is in the above range, it is possible to suppress a decrease in transparency of the sealing member. As a result, the brightness of the light of the light emitting device can be further improved.
- the average primary particle size of the metal oxide particles can be measured, for example, by observing with a transmission electron microscope.
- a transmission electron microscope image is obtained by observing a collodion film obtained by collecting metal oxide particles from a dispersion liquid with a transmission electron microscope.
- a predetermined number for example, 100 metal oxide particles in the transmission electron microscope image are selected.
- the longest linear component (maximum major axis) of each of these metal oxide particles is measured, and these measured values are calculated by arithmetic mean.
- the agglomerated particle diameter of the agglomerates is not measured.
- the maximum major axis of the metal oxide particles (primary particles) constituting this agglomerate is measured in a predetermined number and used as the average primary particle diameter.
- the content of the metal oxide particles in the dispersion liquid is not particularly limited as long as it can be mixed with the resin component described later.
- the content of the metal oxide particles in the dispersion can be arbitrarily selected, and for example, 1% by mass or more and 70% by mass or less, preferably 5% by mass or more and 50% by mass or less, and more preferably 7% by mass or more and 40% by mass or less. More preferably, it is 10% by mass or more and 30% by mass or less. If necessary, it may be 20% by mass or more and 40% by mass or less, or 25% by mass or more and 35% by mass or less.
- the metal oxide particles in the dispersion liquid of the present embodiment may be metal oxide particles that are first surface-modified with a silane compound and then surface-modified with a silicone compound.
- the surface modification material described below is attached to the surface of the metal oxide particles described above. Due to this adhesion, the metal oxide particles are stably dispersed in the dispersion liquid and the dispersion liquid produced by using the dispersion liquid.
- the dispersion according to this embodiment contains a surface modifying material.
- the surface modifying material adheres to the surface of the metal oxide particles to modify the surface, thereby preventing the metal oxide particles from aggregating. Further, the adhesion improves the compatibility with the resin component.
- adhering to the metal oxide particles means that the surface-modifying material contacts or binds to the metal oxide particles by the interaction or reaction between them.
- Examples of the contact include physical adsorption.
- examples of the bond include an ionic bond, a hydrogen bond, a covalent bond and the like.
- the dispersion according to this embodiment contains at least a silane compound and a silicone compound as a surface modifying material. That is, in the present embodiment, the metal oxide particles are surface-modified with at least a silane compound and a silicone compound.
- the silane compound easily adheres to the vicinity of the surface of the metal oxide particles.
- the silicone compound has a relatively large molecular weight and mainly contributes to the improvement of affinity with the dispersion medium and the resin component described later.
- the dispersion liquid does not contain either a silane compound or a silicone compound
- the above-mentioned excellent effect cannot be obtained.
- the silicone compound does not easily adhere to the surface of the metal oxide particles, and the dispersibility of the metal oxide particles in the methyl silicone resin becomes inferior.
- the dispersion liquid does not contain a silicone compound, the affinity between the metal oxide particles and the methyl silicone resin is not sufficiently large, and the dispersibility of the metal oxide particles in the methyl silicone resin is inferior. It becomes.
- the silane compound can be arbitrarily selected, for example, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, and ethyltripropoxysilane, isobutyltrimethoxysilane, methylphenyldimethoxy.
- Silane compounds containing alkyl and alkoxy groups such as silane and methylphenyldiethoxysilane, silane compounds containing alkenyl and alkoxy groups such as vinyltrimethoxysilane, metharoxypropyltrimethoxysilane and acryloxipropyltrimethoxysilane, di Silane compounds containing H-Si groups and alkoxy groups such as ethoxymonomethylsilane, monoethoxydimethylsilane, diphenylmonomethoxysilane, and diphenylmonoethoxysilane, silane compounds containing other alkoxy groups such as phenyltrimethoxysilane, and dimethylchlorosilane, Examples thereof include silane compounds containing H—Si groups such as methyldichlorosilane, diethylchlorosilane, ethyldichlorosilane, methylphenylchlorosilane, diphenylchlorosilane
- the surface modifying material preferably contains a silane compound containing an alkyl group and an alkoxy group from the viewpoint of low viscosity and easy dispersion of inorganic particles in the dispersion step described later.
- the number of alkoxy groups in the silane compound containing such an alkyl group and an alkoxy group may be preferably 1 or more and 3 or less, and the number of alkoxy groups is more preferably 3. If necessary, the number of alkoxy groups may be 1 or 2.
- the number of carbon atoms of the alkoxy group can be arbitrarily selected, but it is preferably 1 or more and 5 or less. The carbon number may be 1 or more and 3 or less, or 2 or more and 4 or less.
- the number of alkyl groups in the silane compound containing an alkyl group and an alkoxy group is preferably 1 or more and 3 or less, and more preferably 1. If necessary, the number of alkyl groups may be 2 or 3.
- the number of carbon atoms of the alkyl group is preferably 1 or more and 5 or less, more preferably 1 or more and 3 or less, and further preferably 1 or more and 2 or less.
- the total number of alkoxy groups and alkyl groups in the silane compound containing an alkyl group and an alkoxy group is preferably 2 or more and 4 or less, and preferably 4.
- silane compound as such a surface modifying material examples include methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, and ethyltripropoxysilane. , One or more selected from the group consisting of these compounds can be preferably included.
- the content of the silane compound in the dispersion can be arbitrarily selected and is not particularly limited, but is, for example, 50% by mass or more and 500% by mass or less, preferably 70% by mass or more and 400% by mass with respect to 100% by mass of the amount of metal oxide particles. % Or less, more preferably 90% by mass or more and 300% by mass or less. If necessary, it may be 80% by mass or more and 350% by mass or less, and 150% by mass or more and 250% by mass or less. As a result, a sufficient amount of silicone compound can be attached to the surface of the metal oxide particles via the silane compound, improving the dispersion stability of the metal oxide particles and dispersibility in the methyl silicone resin. Can be improved.
- the silicone compound can be arbitrarily selected, for example, alkoxy group-containing phenyl silicone, dimethyl silicone, methyl phenyl silicone, methyl hydrogen silicone, methyl phenyl hydrogen silicone, diphenyl hydrogen silicone, alkoxy double-ended phenyl silicone, alkoxy double-ended methyl.
- examples thereof include phenyl silicone, alkoxy group-containing methyl phenyl silicone, alkoxy group-containing dimethyl silicone, alkoxy one-terminal trimethyl one-terminal (methyl group end) dimethyl silicone, and alkoxy group-containing phenyl silicone.
- the silicone compound may be a monomer, an oligomer, or a resin (polymer). It is preferable to use a monomer or an oligomer because surface modification is easy.
- the silicone compound is preferably an alkoxy group-containing phenyl silicone, dimethyl silicone, methyl phenyl silicone, alkoxy double-ended phenyl silicone, alkoxy double-ended methyl phenyl silicone, Examples thereof include alkoxy group-containing methylphenyl silicone, alkoxy group-containing dimethyl silicone, alkoxy one-terminal trimethyl one-terminal (methyl group end) dimethyl silicone, and alkoxy group-containing phenyl silicone.
- the silicone compound contains one or more selected from the group consisting of methoxy group-containing phenyl silicone, dimethyl silicone, and methoxy group-containing dimethyl silicone.
- the content of the silicone compound in the dispersion can be arbitrarily selected and is not particularly limited. For example, it is, for example, 50% by mass or more, 500% by mass or less, preferably 80% by mass or more and 400% by mass or less, and more preferably 100% by mass or more and 300% by mass or less with respect to 100% by mass of the amount of metal oxide particles. If necessary, it may be 50% by mass or more and 200% by mass or less, and 50% by mass or more and 150% by mass or less. As a result, a sufficient amount of the silicone compound can be adhered to the surface of the metal oxide particles, the dispersion stability of the metal oxide particles can be improved, and the dispersibility in the methyl silicone resin can be improved. it can. Furthermore, the amount of liberated silicone compound can be reduced, and unintentional aggregation of metal oxide particles in the methyl silicone resin can be suppressed.
- the dispersion liquid may contain components other than the silane compound and the silicone compound as the surface modifying material.
- examples of such a component include carbon-carbon unsaturated bond-containing fatty acids, specifically, methacrylic acid, acrylic acid and the like.
- the amount of the surface-modifying material with respect to the metal oxide particles is not particularly limited and can be arbitrarily selected. With respect to the amount of the metal oxide particles, for example, it is 100% by mass or more and 1000% by mass or less, preferably 150% by mass or more and 800% by mass or less, and more preferably 190% by mass or more and 600% by mass or less. It may be 200% by mass or more and 900% by mass or less, or 250% by mass or more and 850% by mass or less. When the amount of the surface modifying material is within the above range, the dispersibility of the metal oxide particles can be sufficiently improved while reducing the amount of the surface modifying material to be released.
- the dispersion liquid according to the present embodiment can contain a dispersion medium for dispersing the metal oxide particles.
- the dispersion medium is not particularly limited as long as it can disperse the metal oxide particles to which the surface modifying material is attached and can be mixed with the resin component described later.
- examples of such a dispersion medium include various organic solvents such as a hydrophobic solvent and a hydrophilic solvent. One type of these solvents may be used, or two or more types may be used.
- hydrophobic solvents examples include aromatics, saturated hydrocarbons, unsaturated hydrocarbons and the like. One type of these solvents may be used, or two or more types may be used. Among the above, aromatics, particularly aromatic hydrocarbons, are preferable. Aromatic compounds have excellent compatibility with methyl silicone resins, which will be described later, and contribute to improving the viscosity characteristics of the resulting composition and improving the quality (transparency, shape, etc.) of the sealing member to be formed.
- aromatic hydrocarbons can be arbitrarily selected, for example, benzene, toluene, ethylbenzene, 1-phenylpropane, isopropylbenzene, n-butylbenzene, tert-butylbenzene, sec-butylbenzene, o-, m- or Examples thereof include p-xylene, 2-, 3- or 4-ethyltoluene.
- One of these aromatic hydrocarbons may be used alone, or two or more of these aromatic hydrocarbons may be used in combination.
- the dispersion medium is toluene, o-, m- or p-xylene.
- One or more selected from the group consisting of benzene is particularly preferably used.
- the ratio of the hydrophobic solvent in the dispersion medium can be arbitrarily selected, and is, for example, 10% by mass or more and 90% by mass or less, preferably 20% by mass or more and 80% by mass or less, and more preferably 30% by mass or more and 70% by mass or less. is there. This makes it easier to mix the dispersion liquid with the resin component described later, particularly a methyl silicone resin. If necessary, it may be 60% by mass or more and 90% by mass or less, 65% by mass or more and 85% by mass or less, or 70% by mass or more and 80% by mass or less.
- the hydrophilic solvent can be contained in the dispersion liquid, for example, due to the method described later.
- examples of such a hydrophilic solvent include alcohol solvents, ketone solvents, nitrile solvents and the like. One of these can be preferably used alone or in combination of two or more.
- Examples of the alcohol solvent include branched or linear alcohol compounds having 1 to 4 carbon atoms and their ether condensates. These solvents can be used alone or in combination of two or more.
- the alcohol compound contained in the alcohol solvent may be any of primary, secondary and tertiary alcohols.
- the alcohol compound contained in the alcohol solvent may be any of monohydric, divalent and trihydric alcohols. More specifically, examples of the alcohol solvent include methanol, ethanol, 1-propanol, isopropyl alcohol, 1-butyl alcohol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, methanediol, 1,2-ethane.
- Diol 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 2-butene-1
- Preferred examples thereof include 4-diol, 1,4-butanediol, glycerin, diethylene glycol, 3-methoxy-1,2-propanediol and the like.
- ketone solvent for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and the like are preferably mentioned.
- nitrile solvent for example, acetonitrile and the like are preferably mentioned.
- the hydrophilic solvent preferably contains an alcohol solvent from the viewpoint of having excellent affinity with both water and the hydrophobic solvent and promoting the mixing thereof.
- the carbon number of the alcohol compound constituting the alcohol solvent is preferably 1 or more and 3 or less, and more preferably 1 or more and 2 or less.
- methanol and ethanol, particularly methanol can be preferably used because the effects of the above alcohol solvent can be sufficiently exhibited.
- the ratio of the hydrophilic solvent in the dispersion medium is, for example, 10% by mass or less, preferably 7% by mass or less.
- the lower limit can be selected as needed, and may be 0% by mass or more, and may be 1% by mass or more or 3% by mass or more.
- the content of the dispersion medium in the dispersion liquid of the present embodiment can be arbitrarily selected, but is preferably 10% by mass or more and 98% by mass or less, more preferably 20% by mass or more and 80% by mass or less, and further preferably. It is 30% by mass or more and 70% by mass or less. If necessary, it may be 60% by mass or more and 90% by mass or less, 65% by mass or more and 85% by mass or less, or 70% by mass or more and 80% by mass or less.
- the dispersion liquid according to this embodiment may contain components other than those described above.
- the dispersion liquid according to the present embodiment may contain components other than those described above, such as dispersants, dispersion aids, antioxidants, flow regulators, thickeners, pH regulators, preservatives, etc., if necessary. It may contain general additives and the like. Further, the dispersion liquid according to the present embodiment may contain components that may be contained due to the method described later, for example, acid, water, alcohol and the like.
- the dispersion liquid according to the present embodiment is distinguished from the composition according to the present embodiment, which contains a resin component and can form a sealing member by curing. That is, even when the dispersion liquid according to the present embodiment contains a resin component described later, which is mentioned in the description of the composition, it can form a sealing member when it is simply cured. The amount does not include the resin component described later. More specifically, in the dispersion liquid according to the present embodiment, the mass ratio of the resin component and the metal oxide particles is in the range of 0: 100 to 40:60 for the resin component: metal oxide particles. It is preferably in the range of 0: 100 to 30:70, and even more preferably in the range of 0: 100 to 20:80.
- the dispersion liquid according to the present embodiment is particularly preferably essentially free of the resin components described below, and most preferably completely free of the resin components described below.
- the surface of the metal oxide particles is sufficiently modified with a silane compound and a silicone compound.
- the metal oxide particles modified in this way have excellent affinity with the methyl-based silicone resin and can be dispersed relatively uniformly in the methyl-based silicone resin. Therefore, even when the metal oxide particles are dispersed in the methyl silicone resin, the occurrence of turbidity such as cloudiness is suppressed. Furthermore, the change in viscosity of the methyl silicone resin containing the metal oxide particles is also suppressed.
- Dispersion liquid manufacturing method> Next, a method for producing the dispersion liquid according to the present embodiment will be described.
- the method for producing a dispersion liquid according to the present embodiment includes a first step of mixing a silane compound and water to obtain a hydrolyzed liquid obtained by hydrolyzing the silane compound.
- the content of the metal oxide particles in the mixed solution is 10% by mass or more and 49% by mass or less, and the total content of the silane compound and the metal oxide particles in the mixed solution is 65% by mass. It is 98% by mass or less.
- the total content of the silane compound and the metal oxide particles can also be evaluated by the solid content. Further, the total content of the silane compound and the inorganic particles does not include alcohol generated by hydrolysis of the silane compound described later. That is, the total content of the silane compound and the inorganic particles means the total content of the silane compound, the hydrolyzed silane compound, and the inorganic particles. Needless to say, the total content is a value including the content of the inorganic particles attached to the silane compound.
- silane compound one of the above-mentioned silane compounds can be used alone or in combination of two or more.
- the content of the silane compound in the hydrolyzed solution is not particularly limited. The balance can be obtained by removing other components from the hydrolyzed solution, and the content of the silane compound in the hydrolyzed solution is, for example, 60% by mass or more and 99% by mass or less, preferably 70% by mass or more and 97% by mass. Hereinafter, it is more preferably 80% by mass or more and 95% by mass or less. If necessary, it may be 85% by mass or more and 95% by mass or less, or 87% by mass or more and 93% by mass or less.
- a surface modifying material other than the silane compound may be contained in the hydrolyzed solution.
- the hydrolyzed solution contains water.
- Water serves as a substrate for the hydrolysis reaction of surface modifying materials such as silane compounds.
- the content of water in the hydrolyzed solution is not particularly limited and can be arbitrarily selected.
- the water content can be appropriately set according to the amount of the surface modifying material.
- the amount of water added to the hydrolyzed solution is preferably 0.5 mol or more and 5 mol or less, more preferably 0.6 mol or more and 3 mol or less, still more preferably, with respect to 1 mol of the surface modifying material such as a silane compound. Is 0.7 mol or more and 2 mol or less.
- the content of water in the hydrolyzed solution may be, for example, 1% by mass or more and 40% by mass or less, 3% by mass or more and 30% by mass or less, 5% by mass or more and 20% by mass or less, or It may be 8% by mass or more and 13% by mass or less.
- the content of water in the hydrolyzed solution may be, for example, 1% by mass or more and 20% by mass or less, preferably 1% by mass or more and 15% by mass or less, and more preferably 1% by mass or more and 10% by mass or less. It may be.
- a catalyst may be added to the hydrolyzed solution together with the silane compound and water.
- the hydrolyzed solution may contain only the surface modifying material, water and the catalyst.
- an acid or a base can be used as the catalyst.
- the acid catalyzes the hydrolysis reaction of the silane compound in the hydrolyzate.
- the base catalyzes the condensation reaction between the hydrolyzed surface modifying material and the functional groups on the surface of the metal oxide particles, such as hydroxyl groups and silanol groups.
- the above-mentioned “acid” refers to an acid based on the definition of so-called Bronsted-Lowry, and refers to a substance that imparts a proton in the hydrolysis reaction of a surface modifying material such as a silane compound.
- the above-mentioned “base” means a base based on the definition of so-called Bronsted-Lowry, and here, it means a substance that accepts protons in a hydrolysis reaction of a surface modifying material such as a silane compound and a subsequent condensation reaction. ..
- the acid is not particularly limited as long as it can supply protons in the hydrolysis reaction of the silane compound, and can be arbitrarily selected.
- examples of the acid include inorganic acids such as hydrochloric acid, hydrobromic acid, hydroiodic acid, sulfuric acid, nitric acid, boric acid and phosphoric acid, and organic acids such as acetic acid, citric acid and formic acid. These acids can be used alone or in combination of two or more.
- the base is not particularly limited as long as it can accept protons in the hydrolysis reaction of the silane compound, and can be arbitrarily selected.
- sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide, ammonia, amine and the like can be mentioned. These bases can be used alone or in combination of two or more.
- an acid as the catalyst.
- an inorganic acid is preferable, and hydrochloric acid is more preferable, from the viewpoint of acidity.
- the content of the catalyst in the hydrolyzed solution is not particularly limited and can be arbitrarily selected.
- it may be 10 ppm or more and 1000 ppm or less, preferably 20 ppm or more and 800 ppm or less, and more preferably 30 ppm or more and 600 ppm or less.
- it may be 0.1 ppm or more and 100 ppm or less, or 1 ppm or more and 10 ppm or less.
- the amount of hydrochloric acid may be 0.001 part by mass or more and 5 parts by mass or less with respect to 100 parts by mass in the hydrolyzed solution, and 0.001% by mass. It may be parts or more and 3 parts by mass or less, 0.005 parts by mass or more and 1 part by mass or less, or 0.005 parts by mass or more and 0.1 parts by mass or less.
- the first step may be a step of mixing only the silane compound, water and the catalyst.
- the hydrolyzed solution may contain a hydrophilic solvent, if necessary.
- the hydrophilic solvent can promote the mixing of water and the silane compound in the hydrolyzed solution, and can further promote the hydrolysis reaction of the surface modifying material.
- hydrophilic solvent examples include various hydrophilic solvents that can be contained in the above-mentioned dispersion liquid.
- the hydrophilic solvent is preferably one or more selected from the group consisting of alcohol-based solvents, more preferably, from the viewpoint of having excellent affinity with both water and hydrophobic solvents and promoting their miscibility. Includes one or more selected from the group consisting of methanol and ethanol.
- the hydrophilic solvent may consist only of an alcohol solvent.
- the content of the hydrophilic solvent in the hydrolyzed solution is not particularly limited, but can be, for example, 60% by mass or less, preferably 50% by mass or less. Within this range, the content of the surface modifying material and water in the hydrolyzed solution can be sufficiently increased.
- the content of the hydrophilic solvent may be 40% by mass or less, 20% by mass or less, 10% by mass or less, or 5% by mass or less.
- the content of the hydrophilic solvent in the hydrolyzed solution can be, for example, 10% by mass or more, preferably 15% by mass or more.
- the mixing of the surface-modifying material and water can be further promoted, and as a result, the hydrolysis reaction of the surface-modifying material can be efficiently promoted.
- the hydrolysis solution may not contain a hydrophilic solvent except for the compound derived from the hydrolysis reaction. That is, only the hydrophilic solvent which is a compound derived from the hydrolysis reaction may be contained.
- the silane compound having an alkoxy group when used as the silane compound, it is hydrolyzed, so that an alcohol compound derived from the alkoxy group is contained in the mixed solution. Since the hydrolysis reaction proceeds even in the adsorbed water of the metal oxide particles, it can occur in any of the first step to the fourth step. Therefore, in this case, the obtained dispersion contains the alcohol compound unless there is a step of removing the alcohol compound.
- the temperature of the hydrolyzed solution is not particularly limited and can be arbitrarily selected, and can be appropriately changed depending on the type of the silane compound. For example, it is 5 ° C. or higher and 65 ° C. or lower, more preferably 20 ° C. or higher and 65 ° C. or lower, and further preferably 30 ° C. or higher and 60 ° C. or lower. If necessary, the temperature may be 40 ° C. or higher and 75 ° C. or lower, or 50 ° C. or higher and 70 ° C. or lower.
- the holding time at the above temperature is not particularly limited, but is, for example, 10 minutes or more and 180 minutes or less, preferably 30 minutes or more and 120 minutes or less. If necessary, it may be 15 minutes or more and 60 minutes or less, or 20 minutes or more and 40 minutes or less.
- the hydrolyzed solution may be appropriately stirred.
- the hydrolyzed solution and the metal oxide particles are mixed to obtain a mixed solution.
- the mixed solution preferably comprises only the hydrolyzed solution and the metal oxide particles.
- the second step may be a step of mixing only the hydrolyzed solution obtained in the first step and the metal oxide particles.
- the content of the metal oxide particles in the mixed solution is 10% by mass or more and 49% by mass or less, and the total content of the silane compound and the metal oxide particles is 65% by mass or more and 98% by mass or less.
- Mixing is done as it is.
- the amount and ratio of each material may be adjusted in advance so that the above content in the mixing step is satisfied.
- the total content of the silane compound and the metal oxide particles in the mixed solution is as large as 65% by mass or more and 98% by mass or less.
- the organic solvent and the dispersion medium such as water, which have been regarded as indispensable in the past, are not contained in the mixed solution, or only a very small amount is mixed as compared with the conventional one.
- a small amount of unavoidable alcohol compound is contained.
- the metal oxide particles can be uniformly dispersed, and the silane compound can be uniformly dispersed in the metal oxide particles.
- the present inventors have found that good adhesion (surface modification) is achieved.
- the metal oxide particles are surface-modified in the liquid phase with a surface-modifying material, not only the metal oxide particles and the surface-modifying material but also a dispersion medium are mixed to obtain a mixed solution. It is common to disperse the mixed solution using a disperser.
- a disperser When the metal oxide particles surface-modified by such a method are mixed with the methyl silicone resin, they cannot be sufficiently dispersed in the methyl silicone resin and aggregate, resulting in the methyl silicone resin. There was a problem that turbidity such as white turbidity occurred. In such a case, the added metal oxide particles do not sufficiently exhibit the desired performance.
- the dispersion medium is usually added for the purpose of lowering the viscosity of the mixed solution, uniformly dispersing the metal oxide particles, and uniformly modifying the surface of the inorganic particles in the surface modifying material.
- the viscosity of the dispersion liquid increases, and as a result, the surface modifying material does not sufficiently adhere to the surface of the metal oxide particles.
- Silane compounds are small molecules and have a relatively low viscosity. Further, since it is hydrolyzed in the first step described above, it has good adhesion to metal oxide particles. Therefore, the silane compound is extremely suitable for dispersing metal oxide particles in a high-concentration surface-modifying material.
- the total content of the silane compound and the metal oxide particles is less than 65% by mass, the amount of components other than the above two components, for example, the dispersion medium becomes too large, and therefore, the dispersion step (third step) described later.
- the silane compound cannot be sufficiently adhered to the surface of the metal oxide particles.
- a large amount of hydroxyl groups remain on the surface of the metal oxide particles, and when the dispersion obtained by dispersion is mixed with the hydrophobic material, the metal oxide particles aggregate and the hydrophobic material. Will become turbid.
- the total content of the silane compound and the metal oxide particles may be 65% by mass or more, preferably 70% by mass or more, and more preferably 75% by mass or more. If necessary, it may be 80% by mass or more, 85% by mass or more, 90% by mass or more, or 92% by mass or more.
- the total content of the silane compound and the metal oxide particles may be 98% by mass or less, preferably 97% by mass or less, and more preferably 95% by mass or less. If necessary, it may be 90% by mass or less, 85% by mass or less, 80% by mass or less, or 75% by mass or less.
- the content of the metal oxide particles in the mixed solution is 10% by mass or more and 49% by mass or less.
- the amount of the silane compound with respect to the metal oxide particles can be set within an appropriate range, the silane compound can be uniformly adhered to the surface of the metal oxide particles, and the viscosity of the mixed solution can be adjusted. The rise can be suppressed.
- the silane compound in the mixed solution may be 16% by mass or more and 88% by mass or less.
- the content of the metal oxide particles in the mixed solution is less than 10% by mass, the amount of the silane compound is excessive with respect to the metal oxide particles, and the excess silane compound is the metal oxide in the obtained dispersion liquid. There is a strong tendency to induce agglomeration of particles.
- the content of the metal oxide particles in the mixed solution is preferably 20% by mass or more, more preferably 23% by mass or more, still more preferably 26% by mass or more, and particularly more preferably 30% by mass or more.
- the content of the metal oxide particles exceeds 49% by mass, the amount of the silane compound is insufficient with respect to the metal oxide particles, and a sufficient amount of the silane compound does not adhere to the metal oxide particles. Further, as a result of the content of the metal oxide particles becoming too large, the viscosity of the mixed solution becomes too large, and there is a strong tendency that the metal oxide particles cannot be sufficiently dispersed in the dispersion step (third step) described later.
- the content of the metal oxide particles in the mixed solution is preferably 45% by mass or less, more preferably 40% by mass or less, still more preferably 38% by mass or less, and particularly preferably 36% by mass or less. It may be 34% by mass or less.
- the ratio of the content of the silane compound to the content of the metal oxide particles in the mixed solution is not particularly limited, but is, for example, 100% by mass or more and 800% by mass or less, preferably 140% by mass, with respect to the amount of the metal oxide particles. % Or more and 600% by mass or less, more preferably 180% by mass or more and 400% by mass or less, and particularly preferably 200% by mass or more and 270% by mass or less.
- the amount of the silane compound with respect to the metal oxide particles can be set within an appropriate range, and the silane compound can be uniformly adhered to the surface of the metal oxide particles.
- an organic solvent may be further mixed with the mixed solution.
- the organic solvent By mixing the organic solvent, it is possible to control the reactivity of the surface-modifying material, and it is possible to control the degree of adhesion of the surface-modifying material to the surface of the metal oxide particles. Further, the organic solvent makes it possible to adjust the viscosity of the mixed solution.
- organic solvent examples include the organic solvents listed as the dispersion medium of the dispersion liquid according to the present embodiment described above, and one of these can be used alone or in combination of two or more.
- the content of the organic solvent in the mixed solution is not particularly limited as long as it satisfies the contents of the metal oxide particles and the silane compound described above. Needless to say, the mixed solution does not have to contain an organic solvent.
- the mixing time and mixing temperature in the mixing step can be arbitrarily selected, but for example, mixing may be performed at room temperature, and after the materials are combined, stirring may be performed for about 0 to 600 seconds.
- the metal oxide particles are dispersed in the mixed liquid to obtain a first dispersion liquid in which the metal oxide particles are dispersed.
- the metal oxide particles are dispersed in the hydrolyzed high concentration silane compound. Therefore, in the obtained first dispersion liquid, the silane compound is relatively uniformly adhered to the surface of the metal oxide particles, and the metal oxide particles are dispersed relatively uniformly.
- Dispersion of metal oxide particles can be performed by using a known dispersion method, for example, a known disperser.
- a known disperser for example, a bead mill, a ball mill, a homogenizer, a disper, a stirrer and the like are preferably used.
- the third step is preferably a step of dispersing only the mixture obtained in the mixing step.
- the dispersion time can be arbitrarily selected depending on the conditions, but may be, for example, 6 to 18 hours, preferably 8 to 12 hours, and more preferably 10 to 11 hours. However, it is not limited to these.
- the dispersion temperature can be arbitrarily selected, but may be, for example, 10 to 50 ° C, preferably 20 to 40 ° C, and more preferably 30 to 40 ° C. However, it is not limited to these.
- the difference between the dispersion step and the mixing step is that the dispersion is continuously performed over a certain period of time.
- the metal oxide particles are treated with a silicone compound to obtain a second dispersion.
- a dispersion liquid in which the silane compound is relatively uniformly adhered to the surface of the metal oxide particles is obtained. Therefore, the silicone compound can be relatively uniformly attached to the surface of the metal oxide particles via the silane compound.
- the first dispersion liquid and the silicone compound are mixed to obtain a treatment liquid.
- the treatment liquid may be held at a constant temperature for a predetermined time. Stirring may be performed if necessary. By these treatments, the adhesion of the silicone compound to the metal oxide particles can be further promoted.
- silicone compound examples include the above-mentioned silicone compounds. One of these can be used alone or in combination of two or more.
- the content of the silicone compound in the second dispersion is, for example, 50% by mass or more and 300% by mass or less, preferably 70% by mass or more and 130% by mass or less, based on the metal oxide particles. It can be added to and mixed with the first dispersion. If necessary, it may be 60% by mass or more and 100% by mass or less, or 65% by mass or more and 85% by mass or less.
- a sufficient amount of silicone compound can be adhered to the surface of the metal oxide particles, the dispersion stability of the metal oxide particles is improved, and the dispersibility in the methyl silicone resin is improved. Can be made to. Furthermore, the amount of liberated silicone compound can be reduced, and unintentional aggregation of metal oxide particles in the methyl silicone resin can be suppressed.
- the holding temperature is not particularly limited and can be appropriately changed depending on the type of the silicone compound.
- it is 40 ° C. or higher and 130 ° C. or lower, preferably 50 ° C. or higher and 120 ° C. or lower.
- the holding time is not particularly limited, but is, for example, 1 hour or more and 24 hours or less, preferably 2 hours or more and 20 hours or less.
- the second dispersion may be appropriately stirred.
- the treatment with the silicone compound may be performed a plurality of times.
- the second dispersion liquid may contain a dispersion medium, for example, an aromatic hydrocarbon such as toluene described above, if necessary.
- the amount of the dispersion medium can be arbitrarily selected, for example, 20% by mass or more and 80% by mass or less, preferably 30% by mass or more and 70% by mass or less, and more preferably 40% by mass or more. It is 60% by mass or less.
- the metal oxide particles can be treated with the silicone compound to obtain a second dispersion.
- This second dispersion may be obtained as the dispersion according to the present embodiment.
- post-treatment such as the following fifth step may be performed to obtain the dispersion liquid according to the present embodiment.
- the second dispersion obtained in the fourth step and the hydrophobic solvent are mixed to obtain a third dispersion.
- the hydrophobic solvent the hydrophobic solvent used in the dispersion liquid according to the present embodiment described above can be used alone or in combination of two or more.
- the mixing amount of the hydrophobic solvent is not particularly limited and can be arbitrarily selected, and can be appropriately set according to the content of the hydrophobic solvent contained in the obtained dispersion according to the present embodiment.
- the dispersion liquid according to the present embodiment as described above can be obtained as the third dispersion liquid.
- the above-mentioned dispersion medium for example, the above-mentioned aromatic hydrocarbon such as toluene
- the hydrophobic solvent may be used as the hydrophobic solvent.
- the amount of the hydrophobic solvent can be arbitrarily selected, for example, 20% by mass or more and 80% by mass or less, preferably 30% by mass or more and 70% by mass or less, and more preferably 40% by mass or less. It is 60% by mass or less.
- the metal oxide particles are uniformly dispersed, and the surface of the metal oxide particles is uniformly and sufficiently modified by the silane compound and the silicone compound.
- the metal oxide particles modified in this way have excellent affinity with the methyl-based silicone resin and can be dispersed relatively uniformly in the methyl-based silicone resin. Therefore, even when the metal oxide particles are dispersed in the methyl silicone resin, the occurrence of turbidity such as cloudiness is suppressed. Furthermore, the change in viscosity of the methyl silicone resin containing the metal oxide particles is also suppressed.
- the dispersion liquid according to the present embodiment includes components other than those described above, such as a dispersant, a dispersion aid, an antioxidant, a flow regulator, a thickener, a pH regulator, and a preservative. General additives and the like may be mixed. These can be added at any step, if desired.
- the metal oxide particles can be mixed with the hydrophobic material by using the step of directly dispersing the metal oxide particles in the silane compound. It is presumed that in the dispersion liquid of the present embodiment, more silane compounds are attached to the metal oxide particles and the coating is denser than in the conventional dispersion liquid. However, depending on exactly what the surface of the metal oxide particles is in the dispersion and the condition of the surface, how the dispersion can be better mixed with the hydrophobic material. It is unclear in detail whether this has happened. It is difficult to directly identify the characteristics of the dispersion liquid of the present embodiment by the surface condition of the metal oxide particles modified with the silane compound and the silicone compound.
- the dispersion of the present invention contains metal oxide particles, one or more silane compounds and one or more silicone compounds having at least a part adhered to the metal oxide particles, and, if necessary, a hydrophobic solvent.
- the ability to mix metal oxide particles with hydrophobic materials is presumed to be manifested by the complex entanglement of numerous factors. In view of these facts, it is difficult to unequivocally explain the state of the surface of the metal oxide particles so that the metal oxide particles can be mixed with the hydrophobic material.
- the present inventor has also found a method for identifying a preferable state of metal oxide particles by a spectrum, as will be described later.
- the composition according to the present embodiment is a composition obtained by mixing the above-mentioned dispersion liquid and a resin component. Therefore, the composition according to the present embodiment contains a resin component, that is, a resin and / or a precursor thereof, in addition to the metal oxide particles surface-modified with the above-mentioned silane compound and silicone compound.
- the composition according to this embodiment can be cured and used as a sealing member for a light emitting element as described later.
- the composition according to the present embodiment can improve the brightness of the light of the light emitting device when used for the sealing member by containing the metal oxide particles that contribute to the improvement of the refractive index and the transparency described above. it can.
- the composition according to the present embodiment contains metal oxide particles surface-modified with the above-mentioned silane compound and silicone compound. Therefore, even when the methyl silicone resin is contained as the resin component, the aggregation of the metal oxide particles is suppressed and the decrease in transparency is suppressed. Therefore, when the composition according to the present embodiment is used for the sealing member, the brightness of the light of the light emitting device can be improved.
- the content of the metal oxide particles in the composition of the present embodiment can be arbitrarily selected. From the viewpoint of obtaining a highly transparent composition, it is preferably 5% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 40% by mass or less, and 10% by mass or more and 35% by mass or less. It is more preferable to have. If necessary, it may be 1% by mass or more and 20% by mass or less, or 3% by mass or more and 15% by mass or less.
- the content of the surface modifying material such as the silane compound and the silicone compound in the composition can correspond to the content in the dispersion liquid according to the present embodiment.
- the resin component is the main component in the composition according to this embodiment.
- the resin component is cured to seal the light emitting device.
- deterioration factors such as moisture and oxygen from the external environment are prevented from reaching the light emitting element.
- the cured product obtained from the resin component is basically transparent and can transmit the light emitted from the light emitting element.
- Such a resin component is not particularly limited as long as it can be used as a sealing material.
- one type of resin such as silicone resin or epoxy resin can be used alone or in combination of two or more types.
- a silicone resin particularly a methyl silicone resin, is preferable.
- methyl silicone resin for example, a dimethyl silicone resin, a methyl phenyl silicone resin, or the like can be used.
- the ratio of the methyl silicone resin to the resin component may be adjusted according to desired characteristics, and is not particularly limited. For example, it may be 100% by mass, 20% by mass or more and 80% by mass or less, 30% by mass or more and 70% by mass or less, and 40% by mass or more and 60% by mass or less. May be good. Conventionally, when metal oxide particles are contained in a methyl silicone resin, the metal oxide particles are aggregated, the transparency is lowered, and the refractive index is not sufficiently improved. On the other hand, the composition according to the present embodiment contains metal oxide particles surface-modified with the above-mentioned silane compound and silicone compound.
- the structure of the resin component may be a two-dimensional chain structure, a three-dimensional network structure, or a cage-type structure.
- the resin component may be in the form of a polymer that has been cured when used as a sealing member.
- the resin component may be in a state before curing, that is, a precursor. Therefore, the resin component present in the composition may be, for example, a monomer, an oligomer, or a polymer.
- the viscosity of the resin component at 25 ° C. measured in accordance with JIS Z 8803: 2011 is, for example, 10 mPa ⁇ s or more and 100,000 mPa ⁇ s or less, preferably 100 mPa ⁇ s or more and 10,000 mPa ⁇ s or less, more preferably. It is 1,000 mPa ⁇ s or more and 7,000 mPa ⁇ s or less.
- the content of the resin component in the composition according to the present embodiment can be the balance of other components, but is, for example, 10% by mass or more and 70% by mass or less.
- the mass ratio of the resin component and the metal oxide particles in the composition according to the present embodiment can be arbitrarily selected.
- the resin component: the metal oxide particles may be in the range of 50:50 to 90:10. It is preferably in the range of 60:40 to 80:20, more preferably.
- the composition according to the present embodiment may contain a dispersion medium derived from the dispersion liquid according to the present embodiment, or may be removed. That is, the dispersion medium derived from the dispersion liquid may be completely removed.
- the dispersion medium may remain in the composition in an amount of 1% by mass or more and 10% by mass or less, or may remain in an amount of 2% by mass or more and 5% by mass or less.
- composition according to the present embodiment may contain phosphor particles as long as the object of the present invention is not impaired.
- the phosphor particles absorb the light of a specific wavelength emitted from the light emitting element and emit the light of a predetermined wavelength. That is, the phosphor particles can convert the wavelength of light and adjust the color tone.
- the phosphor particles are not particularly limited as long as they can be used in a light emitting device as described later, and can be arbitrarily selected, and can be appropriately selected and used so that the light emitting color of the light emitting device becomes a desired color. ..
- the content of the phosphor particles in the composition of the present embodiment can be appropriately adjusted and used so as to obtain a desired brightness.
- composition of the present embodiment contains commonly used additives such as preservatives, polymerization initiators, polymerization inhibitors, curing catalysts, photodiffusing agents, etc., as long as the object of the present invention is not impaired. It may have been.
- the light diffusing agent it is preferable to use silica particles having an average particle diameter of 1 to 30 ⁇ m.
- composition according to the present embodiment can be produced by mixing the dispersion liquid according to the present embodiment and the resin component. Further, after mixing, the dispersion medium contained in the dispersion may be removed by an evaporator or the like, if necessary.
- the composition according to the present embodiment contains metal oxide particles surface-modified with the above-mentioned silane compound and silicone compound.
- the composition according to the present embodiment can be used to form a sealing member that improves the brightness of the light of the light emitting device.
- the methyl silicone resin used in the above description has, for example, a siloxane bond in which silicon and oxygen are alternately bonded as a main skeleton, and many functional groups bonded to Si atoms, for example, 60% or more, preferably 80. % Or more may mean a methyl group. However, it is not limited to this example.
- the sealing member according to this embodiment is a cured product of the composition according to this embodiment.
- the sealing member according to the present embodiment is usually used as a sealing member or a part thereof arranged on the light emitting element.
- the thickness and shape of the sealing member according to the present embodiment can be appropriately adjusted according to desired applications and characteristics, and are not particularly limited.
- the sealing member according to the present embodiment can be produced by curing the composition according to the present embodiment as described above.
- the curing method of the composition can be selected according to the characteristics of the resin component in the composition according to the present embodiment. For example, thermosetting and electron beam curing can be mentioned. More specifically, the sealing member of the present embodiment can be obtained by curing the resin component in the composition of the present embodiment by an addition reaction or a polymerization reaction.
- the average dispersed particle size of the metal oxide particles in the sealing member is preferably 10 nm or more and 300 nm or less, more preferably 20 nm or more and 250 nm or less, and further preferably 30 nm or more and 200 nm or less.
- the average dispersed particle diameter of the metal oxide particles in the sealing member is the average particle diameter (median diameter) based on the number distribution, which is measured by transmission electron microscope observation (TEM) of the sealing member.
- the average dispersed particle size of the metal oxide particles in the sealing member in the present embodiment is a value measured and calculated based on the dispersed particle size of the metal oxide particles in the sealing member.
- the average dispersed particle size is measured and calculated based on the diameter of the dispersed metal oxide particles regardless of whether the metal oxide particles are dispersed in the primary particles or the secondary particles.
- the average particle size of the metal oxide particles in the sealing member may be measured as the average particle size of the metal oxide particles to which the surface modifying material described later is attached.
- the sealing member there may be metal oxide particles to which the surface modifying material is attached and metal oxide particles to which the surface modifying material is not attached. Therefore, the average particle size of the metal oxide particles in the sealing member is usually measured as a value in a mixed state thereof.
- the sealing member according to this embodiment is a cured product of the composition according to this embodiment, it is excellent in refractive index and transparency. Therefore, according to the present embodiment, it is possible to obtain a sealing member having excellent extraction efficiency that improves the brightness of the light of the light emitting device.
- the light emitting device includes the above-mentioned sealing member and a light emitting element sealed in the sealing member.
- the light emitting element include a light emitting diode (LED) and an organic light emitting diode (OLED).
- the sealing member according to this embodiment is suitable for sealing a light emitting diode.
- the light emitting device is a light emitting diode on the chip, that is, an LED chip, and the light emitting device is an LED package.
- 1 to 4 are schematic views (cross-sectional views) showing an example of a light emitting device according to an embodiment of the present invention, respectively.
- the size of each member in the drawing is appropriately emphasized for ease of explanation, and does not indicate the actual size or the ratio between the members.
- components having substantially the same functional configuration are designated by the same reference numerals to omit duplicate description.
- the light emitting device (LED package) 1A shown in FIG. 1 covers a substrate 2 having a recess 21, a light emitting element (LED chip) 3 arranged on the bottom surface of the recess 21 of the substrate 2, and a light emitting element 3 in the recess 21. It is provided with a sealing member 4A for sealing as described above.
- the sealing member 4A is composed of the sealing member according to the present embodiment described above. Therefore, the metal oxide particles derived from the composition according to the present embodiment described above are dispersed in the sealing member 4A, and as a result, the light extraction efficiency in the light emitting device 1A is improved. Further, the phosphor particles 5 are dispersed in the sealing member 4A. The phosphor particles 5 convert at least a part of the wavelengths of the light emitted from the light emitting element 3.
- the light emitting device 1B shown in FIG. 2 is different from the light emitting device 1A in that the sealing member 4B has two layers. That is, the sealing member 4B has a first layer 41B that directly covers the light emitting element 3 and a second layer 43B that covers the first layer 41B. Both the first layer 41B and the second layer 43B are sealing members according to the present embodiment. In the first layer 41B, the phosphor particles 5 are dispersed. On the other hand, the second layer 43B does not contain the phosphor particles 5. The light emitting device 1B emits light because the metal oxide particles derived from the composition according to the present embodiment described above are dispersed in the first layer 41B and the second layer 43B constituting the sealing member 4B. Brightness is improving.
- the light emitting device 1C shown in FIG. 3 is also different from the light emitting device 1A in that the configuration of the sealing member 4C is different from that of the sealing member 4A.
- the sealing member 4C has a first layer 41C that directly covers the light emitting element 3 and a second layer 43C that covers the first layer 41C.
- the first layer 41C is not the sealing member according to the present embodiment, but the above-mentioned sealing member of a resin containing no metal oxide particles, and is composed of another resin or the like that can be used for the sealing member. ing.
- the phosphor particles 5 are dispersed.
- the second layer 43C is a sealing member according to the present embodiment.
- the metal oxide particles derived from the composition according to the present embodiment described above are dispersed in the second layer 43C constituting the sealing member 4C, so that the light extraction efficiency is improved. ing.
- the sealing member 4D further includes a first layer 41D that directly covers the light emitting element 3, a second layer 43D that covers the first layer 41D, and a second layer 43D. It has a third layer 45D to cover.
- the first layer 41D and the second layer 43D are not the sealing members according to the present embodiment, but the above-mentioned resin sealing members containing no metal oxide particles, and can be used for the sealing members. It is composed of the above resin.
- the phosphor particles 5 are dispersed.
- the third layer 45D is a sealing member according to the present embodiment. In the light emitting device 1D, the brightness of light is improved by dispersing the metal oxide particles derived from the composition according to the present embodiment described above in the third layer 45D constituting the sealing member 4D. ing.
- the light emitting device according to the present embodiment is not limited to the illustrated mode.
- the light emitting device according to the present embodiment does not have to contain phosphor particles in the sealing member.
- the sealing member according to the present embodiment can exist at an arbitrary position in the sealing member.
- the light emitting element is sealed by the sealing member of the present embodiment, so that the brightness of the light is improved.
- the present invention also relates to a method for manufacturing a light emitting device, which comprises, in one aspect, a step of sealing a light emitting element using the composition according to the present embodiment.
- the production method may include a step of mixing the dispersion liquid and the resin component according to the present embodiment to obtain the composition.
- the light emitting element can be sealed by applying the composition according to the present embodiment onto the light emitting element by, for example, a dispenser or the like, and then curing the composition.
- the light emitting device according to the present embodiment as described above can be used for, for example, a lighting fixture and a display device. Therefore, in one aspect, the present invention also relates to a luminaire or display device including the light emitting device according to the present embodiment.
- the lighting equipment include general lighting devices such as indoor lights and outdoor lights, and lighting of switch portions of electronic devices such as mobile phones and OA devices.
- the lighting equipment according to the present embodiment includes a light emitting device according to the present embodiment. Therefore, even if the same light emitting element is used, the luminous flux emitted becomes larger than in the conventional case, and the surrounding environment can be made brighter.
- Examples of display devices include mobile phones, personal digital assistants, electronic dictionaries, digital cameras, computers, televisions, and peripheral devices thereof.
- the display device according to the present embodiment includes a light emitting device according to the present embodiment. Therefore, even if the same light emitting element is used, the luminous flux emitted becomes larger as compared with the conventional case, and for example, a clearer and brighter display can be performed.
- Example 1 (1. Preparation of dispersion)
- Methyltrimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-13
- 90.78 parts by mass 9.21 parts by mass of water, and 0.01 parts by mass of hydrochloric acid (1N).
- I prepared it. These were added to a container and mixed to obtain a hydrolyzed solution.
- this hydrolyzed solution was stirred at 60 ° C. for 30 minutes to hydrolyze methyltrimethoxysilane to obtain a hydrolyzed solution.
- (Ii) Second Step A mixed solution was obtained by mixing 30 parts by mass of zirconium oxide particles (manufactured by Sumitomo Osaka Cement Co., Ltd.) having an average primary particle diameter of 12 nm and 70 parts by mass of the hydrolyzed solution.
- the content of zirconium oxide particles in the mixed solution is 30% by mass
- the content of methyltrimethethoxysilane is 63.5% by mass
- the total content of zirconium oxide particles and methyltrimethoxysilane is 93.5% by mass.
- composition 5.0 g of the dispersion liquid according to Example 1 and 3.5 g of methylphenyl silicone (KER-2500-B manufactured by Shin-Etsu Chemical Co., Ltd.) were mixed. Then, toluene was removed from this mixed solution by an evaporator to obtain the composition according to Example 1. As a result of visually observing the appearance of the obtained composition according to Example 1, it was transparent. As a result, it was confirmed that the zirconium oxide particles were relatively uniformly dispersed in the composition with suppressed aggregation.
- the viscosity of the obtained composition was measured using a rheometer (Rheometer RS-6000, manufactured by HAAKE) under the conditions of 25 ° C. and a shear rate of 1 (1 / s). As a result, the viscosity immediately after production was 10 Pa ⁇ s. This composition was stored at room temperature (25 ° C.), and the viscosity after 1 month was measured. As a result, the viscosity of the composition was 50 Pa ⁇ s, which was a level that could withstand practical use, although the viscosity was increased. From this, it was confirmed that the zirconium oxide particles were stably dispersed in the composition for a long period of time.
- the brightness of the obtained white LED package was measured by applying a voltage of 3 V and a current of 150 mA to the LED package using a total luminous flux measurement system (manufactured by Otsuka Electronics Co., Ltd.). As a result, the brightness of this white LED package was 73.2 lm.
- Example 2 (1. Preparation of dispersion) (Iv) Steps 1 to 5 Examples except that zirconium oxide particles having an average primary particle diameter of 90 nm (manufactured by Sumitomo Osaka Cement Co., Ltd.) were used instead of the zirconium oxide particles having an average primary particle diameter of 12 nm.
- a dispersion liquid (third dispersion liquid) according to Example 2 was obtained.
- the content of zirconium oxide particles in the mixed solution obtained in the second step is 30% by mass, the content of methyltrimethoxysilane is 63.5% by mass, and the total content of zirconium oxide particles and methyltrimethoxysilane. was 93.5% by mass.
- the viscosity of the composition was measured using a rheometer (Rheometer RS-6000, manufactured by HAAKE) under the conditions of 25 ° C. and a shear rate of 1 (1 / s). As a result, the viscosity immediately after production was 10 Pa ⁇ s. This composition was stored at room temperature (25 ° C.), and the viscosity after 1 month was measured. As a result, the viscosity of the composition was 40 Pa ⁇ s, which was a level that could withstand practical use, although the viscosity was increased.
- the zirconium oxide particles are preferable even when the methylphenyl silicone and the dispersion liquid are mixed. No turbidity or excessive increase in viscosity was observed. Further, as shown in Example 1 and Reference Example 1, it was confirmed that the brightness of the white LED package can be improved. On the other hand, in Comparative Example 1, when methylphenylsilicone and the dispersion were mixed, the obtained composition gelled. Therefore, it was inappropriate as a composition for sealing a light emitting element.
- a light emitting device having this sealing member, a lighting device and a display device provided with this light emitting device, and a method for producing a dispersion liquid can be provided.
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Abstract
Description
本願は、2019年3月29日に、日本に出願された特願2019-066737号に基づき優先権を主張し、その内容をここに援用する。
前記分散液を、真空乾燥により乾燥して得られる、前記金属酸化物粒子について、フーリエ変換式赤外分光光度計により800cm-1以上3800cm-1の波数の範囲の透過スペクトルを測定し、当該範囲におけるスペクトルの最大値を100、最小値を0となるように、スペクトルの値を規格化した際に、以下の式(1):
IA/IB≦3.5(1)
(式中、「IA」は、3500cm-1におけるスペクトル値、「IB」は、1100cm-1におけるスペクトル値をそれぞれ示す)
を満足する、分散液を提供する。
さらに、上記課題を解決するために、本発明の第三の態様は、前記組成物の硬化物である、封止部材を提供する。
さらに、上記課題を解決するために、本発明の第五の態様は、前記発光装置を備える、照明器具または表示装置を提供する。
前記加水分解液と金属酸化物粒子とを混合して混合液を得る第2の工程と、
前記混合液中において前記金属酸化物粒子を分散し、第1の分散液を得る第3の工程と、
前記第1の分散液中の前記金属酸化物粒子をシリコーン化合物により処理して、第2の分散液を得る第4の工程と、を有し、
前記混合液中における前記金属酸化物粒子の含有量が10質量%以上49質量%以下であり、前記混合液中における前記シラン化合物と前記金属酸化物粒子との合計の含有量が65質量%以上98質量%以下である、分散液の製造方法が提供される。
前記第1の工程において、前記シラン化合物と前記水とともに、触媒を混合してもよい。
なお、本実施の形態は、発明の趣旨をより良く理解させるために具体的に説明するものであり、特に指定のない限り、本発明を限定するものではない。本発明の趣旨を逸脱しない範囲で、量、数、種類、比率、構成等について、省略、追加、置換、又は変更が可能である。
<1. 本発明者らの着想>
まず、本発明の詳細な説明に先立ち、本発明者らによる本発明に至るまでの着想について説明する。
次に、本実施形態に係る分散液について説明する。本実施形態に係る分散液は、シラン化合物とシリコーン化合物とにより表面修飾された、金属酸化物粒子を含む。
IA/IB≦3.5(1)
(式中、「IA」は、3500cm-1におけるスペクトル値、「IB」は、1100cm-1におけるスペクトル値をそれぞれ示す)
この結果、混合物として得られる組成物(樹脂組成物)は、濁りが抑制され、比較的透明になる。
得られた分散液を、真空乾燥で乾燥する。次いで、乾燥により得られた金属酸化物粒子0.01~0.05gを用いることにより、フーリエ変換式赤外分光光度計(例えば日本分光株式会社製、型番:FT/IR-670 Plus)で測定する。このようにして測定をすることができる。
以下、分散液に含まれる各成分について説明する。
金属酸化物粒子は、後述する封止部材中において、発光素子から放出される光を散乱させる。また、金属酸化物粒子は、その種類によっては、封止部材の屈折率を向上させる。これらにより、金属酸化物粒子は、発光装置において光の明るさの向上に寄与する。
また、金属酸化物粒子は、封止部材の屈折率を向上させる観点から、屈折率が1.7以上であることが好ましい。
本実施形態に係る分散液は、表面修飾材料を含む。この表面修飾材料は、分散液内において、少なくともその一部が金属酸化物粒子の表面に付着して当該表面を修飾することにより、金属酸化物粒子の凝集を防止する。さらに、前記付着によって、樹脂成分との相溶性を向上させる。
シラン化合物としては任意に選択でき、例えば、メチルトリメトキシシラン、メチルトリエトキシシラン、メチルトリプロポキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、およびエチルトリプロポキシシラン、イソブチルトリメトキシシラン、メチルフェニルジメトキシシラン、メチルフェニルジエトキシシラン等のアルキル基およびアルコキシ基を含むシラン化合物、ビニルトリメトキシシラン、メタクリロキシプロピルトリメトキシシラン、アクリロキシプロピルトリメトキシシラン等のアルケニル基およびアルコキシ基を含むシラン化合物、ジエトキシモノメチルシラン、モノエトキシジメチルシラン、ジフェニルモノメトキシシラン、ジフェニルモノエトキシシラン等のH-Si基およびアルコキシ基を含むシラン化合物、フェニルトリメトキシシラン等のその他アルコキシ基を含むシラン化合物、ならびにジメチルクロロシラン、メチルジクロロシラン、ジエチルクロロシラン、エチルジクロロシラン、メチルフェニルクロロシラン、ジフェニルクロロシラン、フェニルジクロロシラン、トリメトキシシラン、ジメトキシシラン、モノメトキシシラン、トリエトキシシラン等のH-Si基を含むシラン化合物等が挙げられる。これらのうち1種を単独でまたは2種以上を組み合わせて用いることができる。これらの中でも、アルコキシ基、特にメトキシ基を有するシラン化合物は、金属酸化物粒子に付着しやすいため好ましい。
このようなアルキル基およびアルコキシ基を含むシラン化合物中のアルコキシ基の数は、好ましくは1以上3以下であればよく、アルコキシ基の数は3であることがより好ましい。なお必要に応じて、アルコキシ基の数は1や2であってもよい。アルコキシ基の炭素数は任意に選択できるが、1以上5以下であることが好ましい。前記炭素数は、1以上3以下や、2以上4以下であっても良い。
アルキル基およびアルコキシ基を含むシラン化合物中のアルキル基の数は、1以上3以下であることが好ましく、1であることがより好ましい。なお必要に応じて、アルキル基の数は2や3であってもよい。アルキル基の炭素数は、好ましくは1以上5以下であり、より好ましくは1以上3以下であり、さらに好ましくは1以上2以下である。
アルキル基およびアルコキシ基を含むシラン化合物中のアルコキシ基とアルキル基の総数は2以上4以下であることが好ましく、4であることが好ましい。
このような表面修飾材料としてのシラン化合物としては、例えば、メチルトリメトキシシラン、メチルトリエトキシシラン、メチルトリプロポキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、およびエチルトリプロポキシシランが例として挙げられ、これらの化合物からなる群から選択される1種または2種以上を好ましく含むことができる。
シリコーン化合物としては任意に選択でき、例えば、アルコキシ基含有フェニルシリコーン、ジメチルシリコーン、メチルフェニルシリコーン、メチルハイドロジェンシリコーン、メチルフェニルハイドロジェンシリコーン、ジフェニルハイドロジェンシリコーン、アルコキシ両末端フェニルシリコーン、アルコキシ両末端メチルフェニルシリコーン、アルコキシ基含有メチルフェニルシリコーン、アルコキシ基含有ジメチルシリコーン、アルコキシ片末端トリメチル片末端(メチル基片末端)ジメチルシリコーンおよびアルコキシ基含有フェニルシリコーン等が挙げられる。これらのうち1種を単独でまたは2種以上を組み合わせて用いることができる。
シリコーン化合物は、モノマーであってもよく、オリゴマーであってもよく、レジン(ポリマー)であってもよい。表面修飾が容易であることより、モノマーかオリゴマーを用いることが好ましい。
また、分散液は、表面修飾材料としてシラン化合物およびシリコーン化合物以外の成分を含んでもよい。このような成分としては、例えば、炭素-炭素不飽和結合含有脂肪酸、具体的には、メタクリル酸、アクリル酸等が挙げられる。
金属酸化物粒子に対する表面修飾材料の量、すなわち、シラン化合物とシリコーン化合物の合計の含有量は、特に限定されず任意に選択できる。金属酸化物粒子の量に対して、例えば100質量%以上1000質量%以下であり、好ましくは150質量%以上800質量%以下であり、より好ましくは、190質量%以上600質量%以下である。200質量%以上900質量%以下や、250質量%以上850質量%以下であってもよい。表面修飾材料の量が上述した範囲内であると、遊離する表面修飾材料の量を低減しつつ、金属酸化物粒子の分散性を十分に向上させることができる。
本実施形態に係る分散液は、金属酸化物粒子を分散する分散媒を含むことができる。この分散媒は、表面修飾材料が付着した金属酸化物粒子を分散させることができ、後述する樹脂成分と混合することができるものであれば、特に限定されない。
このような分散媒としては、例えば、疎水性溶媒や、親水性溶媒等の各種有機溶剤が挙げられる。これらの溶媒は1種を用いてもよく、2種以上を用いてもよい。
ニトリル系溶媒としては、例えば、アセトニトリル等が、好ましく挙げられる。
上述した中でも、メタノールおよびエタノール、特にメタノールは、上記のアルコール系溶媒の効果を十分に発現することができるために好適に用いることができる。
本実施形態に係る分散液は、上述した以外の成分を含んでもよい。例えば、本実施形態に係る分散液は、必要に応じて上述した以外の成分、例えば、分散剤、分散助剤、酸化防止剤、流動調整剤、増粘剤、pH調整剤、防腐剤等の一般的な添加剤等を含んでいてもよい。
また、本実施形態に係る分散液は、後述する方法に起因して含まれ得る成分、例えば、酸、水、アルコール等を含んでもよい。
次に、本実施形態に係る分散液の製造方法について説明する。
前記加水分解液と金属酸化物粒子とを混合して混合液を得る第2の工程と、
前記混合液中において前記金属酸化物粒子を分散し、第1の分散液を得る第3の工程と、
前記第1の分散液中の前記金属酸化物粒子をシリコーン化合物により処理して、第2の分散液を得る第4の工程と、を有する。
前記混合液中における、前記金属酸化物粒子の含有量が10質量%以上49質量%以下であり、前記混合液中における前記シラン化合物と前記金属酸化物粒子との合計の含有量が65質量%以上98質量%以下である。
なお、前記シラン化合物と前記金属酸化物粒子の合計の含有量は、固形分により評価することもできる。
また、前記シラン化合物と前記無機粒子との合計含有量には、後述するシラン化合物の加水分解で発生するアルコールは含まない。すなわち、前記シラン化合物と前記無機粒子との合計含有量とは、シラン化合物と、加水分解されたシラン化合物と、無機粒子との合計含有量を意味する。なお、上記合計含有量が上記シラン化合物に付着された無機粒子の含有量を含めた値であることは言うまでもない。
本工程においては、少なくともシラン化合物と水とを混合し、シラン化合物が加水分解された加水分解液を得る。このように予めシラン化合物の少なくとも一部が加水分解した加水分解液を用いることにより、後述する分散工程(第3の工程)において金属酸化物粒子の表面にシラン化合物が付着しやすくなる。
また、加水分解液中におけるシラン化合物の含有量は、特に限定されない。加水分解液中から他の成分を除いた残部とすることができるが、加水分解液中におけるシラン化合物の含有量は、例えば60質量%以上99質量%以下、好ましくは70質量%以上97質量%以下、より好ましくは80質量%以上95質量%以下である。必要に応じて、85質量%以上95質量%以下や、87質量%以上93質量%以下であってもよい。
加水分解液中における水の含有量は、特に限定されず、任意に選択できる。例えば、水の含有量は、表面修飾材料の量に対応して適宜設定できる。例えば、加水分解液に添加される水の量は、シラン化合物などの前記表面修飾材料1molに対し、0.5mol以上5mol以下であることが好ましく、より好ましくは0.6mol以上3mol以下、さらに好ましくは、0.7mol以上2mol以下である。これにより、表面修飾材料の加水分解反応を十分に進行させつつ、過剰量の水により製造される分散液において金属酸化物粒子の凝集が生じることをより確実に防止することができる。加水分解液中における水の含有量は、例えば1質量%以上40質量%以下であってもよく、3質量%以上30質量%以下であってもよく、5質量%以上20質量%以下や、8質量%以上13質量%以下であってもよい。
酸は、加水分解液中において、シラン化合物の加水分解反応を触媒する。一方塩基は、加水分解された表面修飾材料と金属酸化物粒子表面の官能基、例えば水酸基やシラノール基との、縮合反応を触媒する。これら反応により、後述する分散工程(第3の工程)において、シラン化合物を初めとしたシラン化合物が金属酸化物粒子に付着しやすくなり、金属酸化物粒子の分散安定性が向上する。
ここで、上記の「酸」とは、いわゆるブレンステッド-ローリの定義に基づく酸をいい、シラン化合物等の表面修飾材料の加水分解反応においてプロトンを与える物質をいう。また、上記の「塩基」とは、いわゆるブレンステッド-ローリの定義に基づく塩基をいい、ここでは、シラン化合物等の表面修飾材料の加水分解反応およびその後の縮合反応においてプロトンを受容する物質をいう。
第1の工程は、シラン化合物と水と触媒のみを混合する工程であってもよい。
この処理において、加水分解液の温度は、特に限定されず任意に選択でき、シラン化合物の種類によって適宜変更できる。例えば5℃以上65℃以下、より好ましくは20℃以上65℃以下、さらに好ましくは30℃以上60℃以下である。必要に応じて、40℃以上75℃以下や、50℃以上70℃以下であっても良い。
なお、上記の加水分解液の保持において、加水分解液を適宜撹拌してもよい。
本工程においては、加水分解液と金属酸化物粒子とを混合して混合液を得る。混合液は、好ましくは、前記加水分解液と前記金属酸化物粒子のみからなる。第2の工程は、前記第1の工程で得られた加水分解液と金属酸化物粒子のみを混合する工程であってよい。
混合工程における混合時間や混合温度は任意に選択できるが、例えば室温で混合を行っても良く、材料を一緒にした後は、0~600秒ほど攪拌を行ってもよい。
次に、混合液中において金属酸化物粒子を分散して、金属酸化物粒子が分散した第1の分散液を得る。本実施形態において、金属酸化物粒子は、加水分解された高濃度のシラン化合物中において分散される。したがって、得られる第1の分散液においては、金属酸化物粒子の表面には比較的均一にシラン化合物が付着しており、かつ、金属酸化物粒子が比較的均一に分散する。
分散時間は、条件に応じて任意に選択できるが、例えば6~18時間であってもよく、好ましくは8~12時間であり、より好ましくは10~11時間である。ただしこれらのみに限定されない。
分散温度は任意に選択できるが、例えば10~50℃であってもよく、好ましくは20~40℃であり、より好ましくは30~40℃である。ただしこれらのみに限定されない。
なお分散工程が、混合工程と異なる点として、分散が一定時間にわたって連続して行われることを意味してよい。
次に、金属酸化物粒子をシリコーン化合物により処理して、第2の分散液を得る。上述したように、第3の工程においては、シラン化合物が金属酸化物粒子の表面に比較的均一に付着している分散液が得られる。したがって、シリコーン化合物は、シラン化合物を介して金属酸化物粒子の表面に比較的均一に付着することができる。
なお、上記の保持において、第2の分散液を適宜撹拌してもよい。
なお第4の工程では、第2の分散液は、必要に応じて分散媒、例えば上述したトルエンなどの芳香族炭化水素、を含んでよい。第2の分散液において、分散媒の量は任意に選択でき、例えば、20質量%以上80質量%以下であり、好ましくは30質量%以上70質量%以下であり、より好ましくは40質量%以上60質量%以下である。
本工程においては、第4の工程で得られた第2の分散液と、疎水性溶媒とを混合して、第3の分散液を得る。疎水性溶媒としては、上述した本実施形態に係る分散液に使用する疎水性溶媒を1種単独でまたは2種以上を組み合わせて用いることができる。
また、疎水性溶媒の混合量は特に限定されず任意に選択でき、得られる本実施形態に係る分散液に含まれる疎水性溶媒の含有量に合わせて適宜設定できる。
以上により、上述したような本実施形態に係る分散液を、第3の分散液として得ることができる。
第3の分散液は、疎水性溶媒として、上述した分散媒、例えば上述したトルエンなどの芳香族炭化水素、を使用してよい。第3の分散液において、疎水性溶媒の量は任意に選択でき、例えば、20質量%以上80質量%以下であり、好ましくは30質量%以上70質量%以下であり、より好ましくは40質量%以上60質量%以下である。
本発明の分散液は、金属酸化物粒子と、少なくとも一部が金属酸化物粒子に付着した1種以上のシラン化合物および1種以上のシリコーン化合物と、必要に応じて疎水性溶媒とを含む。金属酸化物粒子を疎水性材料と混合できることは、多数の要因の複雑な絡み合いによって、発現していると推察される。これらのことを鑑みると、金属酸化物粒子を疎水性材料と混合することができるようにするための金属酸化物粒子の表面の状態を、文言により一概に説明することは、難しい。本発明者は、後述するように、金属酸化物粒子の好ましい状態を、スペクトルによって特定する方法も見出した。
次に、本実施形態に係る組成物について説明する。本実施形態に係る組成物は、上述した分散液と樹脂成分とを混合することにより得られる組成物である。したがって、本実施形態に係る組成物は、上述したシラン化合物とシリコーン化合物とにより表面修飾された金属酸化物粒子に加え、樹脂成分、すなわち樹脂および/またはその前駆体を含む。
樹脂成分は、封止部材として用いた際に硬化したポリマー状となっていればよい。組成物中において、樹脂成分は、硬化前の状態、すなわち前駆体であってもよい。したがって、組成物中に存在する樹脂成分は、例えば、モノマーであってもよく、オリゴマーであってもよく、ポリマーであってもよい。
JIS Z 8803:2011に準拠して測定される25℃における樹脂成分の粘度は、例えば、10mPa・s以上100,000mPa・s以下、好ましくは100mPa・s以上10,000mPa・s以下、より好ましくは1,000mPa・s以上7,000mPa・s以下である。
本実施形態に係る組成物中における樹脂成分と金属酸化物粒子との質量比率は任意に選択でき、例えば、樹脂成分:金属酸化物粒子で、50:50~90:10の範囲にあることが好ましく、60:40~80:20の範囲にあることがより好ましい。
本実施形態の組成物中における蛍光体粒子の含有量は、所望の明るさが得られるように、適宜調整して用いることができる。
なお上記説明に用いたメチル系シリコーン樹脂としては、例えば、主骨格としてケイ素と酸素が交互に結びついたシロキサン結合を有し、Si原子に結合する官能基の多く、例えば60%以上、好ましくは80%以上、がメチル基であるものを、意味しても良い。ただしこの例のみに限定されない。
本実施形態に係る封止部材は、本実施形態に係る組成物の硬化物である。本実施形態に係る封止部材は、通常、発光素子上に配置される封止部材またはその一部として用いられる。
本実施形態に係る封止部材の厚みや形状は、所望の用途や特性に応じて適宜調整することができ、特に限定されるものではない。
次に、本実施形態に係る発光装置について説明する。本実施形態に係る発光装置は、上述した封止部材と、当該封止部材に封止された発光素子とを備えている。
発光素子としては、例えば発光ダイオード(LED)、有機発光ダイオード(OLED)等が挙げられる。特に、本実施形態に係る封止部材は、発光ダイオードの封止に適している。
封止部材4Aは、上述した本実施形態に係る封止部材により構成されている。したがって、封止部材4A中においては、上述した本実施形態に係る組成物由来の金属酸化物粒子が分散されており、この結果、発光装置1Aにおける光の取出し効率が向上している。また、封止部材4A内においては、蛍光体粒子5が分散している。蛍光体粒子5は、発光素子3より出射される光の少なくとも一部の波長を変換する。
照明器具としては、例えば、室内灯、室外灯等の一般照明装置、携帯電話やOA機器等の、電子機器のスイッチ部の照明等が挙げられる。
本実施形態に係る照明器具は、本実施形態に係る発光装置を備える。このため、同一の発光素子を使用しても従来と比較して放出される光束が大きくなり、周囲環境をより明るくすることができる。
本実施形態に係る表示装置は、本実施形態に係る発光装置を備える。このため、同一の発光素子を使用しても従来と比較して放出される光束が大きくなり、例えばより鮮明かつ明度の高い表示を行うことができる。
(1. 分散液の作製)
(i)第1の工程
メチルトリメトキシシラン(信越工業化学社製、製品名KBM-13)90.78質量部と、水9.21質量部と、塩酸(1N)0.01質量部とを用意した。これらを容器に添加して混合し、加水分解液を得た。次いでこの加水分解液を60℃で30分撹拌し、メチルトリメトキシシランの加水分解処理を行い、加水分解液を得た。
平均一次粒子径が12nmの酸化ジルコニウム粒子(住友大阪セメント社製)30質量部、前記加水分解液70質量部を混合して、混合液を得た。混合液中の酸化ジルコニウム粒子の含有量は30質量%、メチルトリメトエトキシシランの含有量は63.5質量%、酸化ジルコニウム粒子とメチルトリメトキシシランの合計の含有量は、93.5質量%であった。
この混合液をビーズミルで10時間、室温で分散処理した。この後、ビーズを除去し、第1の分散液を得た。
第1の分散液の固形分(100℃で1時間加熱した後の残留成分)を測定した結果、固形分の量は70質量%であった。
得られた第1の分散液の一部を採取し、固形分が5質量%になるようにメタノールで調整した第1の分散液のD10とD50とD90を、粒度分布計(HORIBA社製、型番:SZ-100SP)を用いて測定した。その結果、D10は15nmで、D50は65nmで、D90は108nmであった。なお、第1の分散液に含まれる粒子は、基本的にメチルトリエトキシシランが付着した酸化ジルコニウム粒子のみであると考えられる。このことから、測定されたD10、D50、D90は、メチルトリエトキシシランが付着した酸化ジルコニウム粒子のD10、D50およびD90であると考えられた。
第1の分散液39.0質量部と、メトキシ基含有フェニルシリコーンレジン(信越化学工業社製、KR217)8.6質量部と、トルエンを52.4質量部と、を混合して処理液を得た。この処理液を110℃で18時間混合及び攪拌し、第2の分散液を得た。
得られた第2の分散液の固形分を測定し、固形分が30質量%となるように、トルエンを添加し、簡単に混合した。その結果、実施例1に係る分散液(第3の分散液)を得た。
(i)粒度分布
得られた実施例1に係る分散液の一部を採取し、さらにトルエンを加えて固形分を5質量%に調整した、分散液を用意した。この分散液について、D10とD50とD90を、粒度分布計(HORIBA社製、型番:SZ-100SP)を用いて測定した。その結果、D10は54nmで、D50は108nmで、D90は213nmであった。なお、分散液に含まれる粒子は、基本的に表面修飾材料(メチルトリエトキシシラン、メトキシ基含有フェニルシリコーンレジン)が付着した酸化ジルコニウム粒子のみであると考えられる。よって、測定されたD10、D50、D90は、表面修飾材料が付着した酸化ジルコニウム粒子のD10、D50およびD90であると考えられた。
得られた第3の分散液10gを真空乾燥で2時間乾燥した。次いで、得られた金属酸化物粒子0.01~0.05gを用いて、フーリエ変換式赤外分光光度計(日本分光株式会社製、型番:FT/IR-670 Plus)で、800cm-1以上3800cm-1の波数の範囲の透過スペクトルを測定した。この測定範囲におけるスペクトルの最大値を100、最小値を0となるようにスペクトルの値を規格化し、これをもとに、3500cm-1の値(IA)と1100cm-1の値(IB)を求めた。この結果、IAは55.2、IBは24.9であり、IA/IBは、2.2であった。当該結果を表1に示す。
実施例1に係る分散液5.0gと、メチルフェニルシリコーン(信越化学工業社製、KER-2500-B)3.5gと、を混合した。
次いで、この混合液をエバポレータによりトルエンを除去することで、実施例1に係る組成物を得た。
得られた実施例1に係る組成物の外観を目視で観察した結果、透明であった。この結果、組成物中において、酸化ジルコニウム粒子は、凝集が抑制され、比較的均一に分散していることが確認できた。
得られた組成物の粘度を、レオメーター(レオストレスRS-6000、HAAKE社製)を用い、25℃、剪断速度1(1/s)の条件で測定した。
その結果、作製直後の粘度は、10Pa・sであった。
この組成物を室温(25℃)で保管し、1ヶ月後の粘度を測定した。その結果、組成物の粘度は50Pa・sであり、増粘はしたものの、実用に耐えられるレベルであった。このことからも、組成物中において酸化ジルコニウム粒子が長期にわたり安定して分散していることが確認できた。
得られた組成物1質量部に、メチルフェニルシリコーン樹脂(信越化学工業社製「KER-2500-A/B」を14質量部加えて、組成物中に表面修飾酸化ジルコニウム粒子が2質量%となるように調整し、混合した。この組成物1質量部に蛍光体粒子(イットリウム・アルミニウム・ガーネット:YAG)を0.38質量部混合した組成物(表面修飾酸化ジルコニウム粒子と樹脂の合計量:蛍光体粒子=100:38)を、LEDリードフレーム内に300μmの厚みで充填した。その後、室温で3時間保持した。次いで、ゆっくりと組成物を加熱硬化させて封止部材を形成し、白色LEDパッケージを作製した。
(1. 分散液の作製)
(i~v)第1から5の工程
平均一次粒子径が12nmの酸化ジルコニウム粒子に代えて、平均一次粒子径が90nmの酸化ジルコニウム粒子(住友大阪セメント社製)を用いた以外は、実施例1と同様にして、実施例2に係る分散液(第3の分散液)を得た。第2の工程において得られた混合液中の酸化ジルコニウム粒子の含有量は30質量%、メチルトリメトキシシランの含有量は63.5質量%、酸化ジルコニウム粒子とメチルトリメトキシシランの合計の含有量は、93.5質量%であった。
(第1の分散液の粒度分布) 実施例1と同様にして、第1の分散液中の無機粒子のD10とD50とD90を測定した。その結果、D10は54nmで、D50は120nmで、D90は223nmであった。D90/D50は、1.86であった。
(i)粒度分布
また、実施例2に係る分散液(第3の分散液)中の酸化ジルコニウム粒子の粒度分布を実施例1と同様に評価した結果、D10は95nmで、D50は184nmで、D90は284nmであった。
(ii)FT-IR分析
さらに、実施例2に係る分散液について実施例1と同様に、FT-IR分析を行ったところ、IAは51.6、IBは24.6であり、IA/IBは、2.1であった。
得られた実施例2に係る第3の分散液を、実施例1と同様に、メチルフェニルシリコーンと混合し、実施例2に係る組成物を得た。得られた組成物の外観を目視で観察した結果、透明な組成物であった。
組成物の粘度を、レオメーター(レオストレスRS-6000、HAAKE社製)を用い、25℃、剪断速度1(1/s)の条件で測定した。
その結果、作製直後の粘度は、10Pa・sであった。
この組成物を室温(25℃)で保管し、1ヶ月後の粘度を測定した。その結果、組成物の粘度は40Pa・sであり、増粘はしたものの、実用に耐えられるレベルであった。
(1. 分散液の作製) 第2の工程において、加水分解液70質量部を用いて、酸化ジルコニウム粒子と混合する替わりに、前記加水分解液20質量部と、イソプロピルアルコール50質量部を用いた以外は、実施例1と全く同様にして、比較例1に係る分散液(固形分30質量%:第3の分散液)を得た。
なお、第1の分散液の固形分(100℃で1時間加熱した後の残留成分)を測定した結果、38質量%であった。
実施例1と同様にして、第1の分散液のD10とD50とD90を測定した。その結果、第1の分散液のD10は13nmで、D50は62nmで、D90は95nmであった。
(2. 分散液の評価)
(i)粒度分布
比較例1に係る分散液のD10は52nmで、D50は105nmで、D90は195nmであった。
(ii)FT-IR分析
さらに、比較例1に係る分散液について実施例1と同様に、FT-IR分析を行ったところ、IAは46.6、IBは10.8であり、IA/IBは、4.3であった。
得られた比較例1に係る第3の分散液を、実施例1と同様に、メチルフェニルシリコーンと混合し、トルエンを除去することで比較例1に係る組成物を得た。その結果、比較例1に係る組成物は白濁し、LEDを封止できる組成物を得ることができなかった。
以上の実施例1、2および比較例1における分散液の製造条件、分散液、組成物の評価についてまとめて表1に示す。
表面修飾酸化ジルコニウム粒子を含まない白色LEDパッケージを作製し、明るさを測定した。すなわち、実施例1のLEDパッケージの作製において、表面修飾酸化ジルコニウム粒子と樹脂の合計量:蛍光体粒子=100:38とする代わりに、樹脂の合計量:蛍光体粒子=100:38とした以外は実施例1と同様にして、参考例の白色LEDパッケージを作製した。
得られた白色パッケージについて、実施例1と同様に測定した結果、この白色LEDパッケージの明るさは、72.5lmであった。
一方で、比較例1においては、メチルフェニルシリコーンと分散液と混合すると、得られる組成物は、ゲル化した。このため、発光素子を封止するための組成物としては不適切であった。
2 基板
21 凹部
3 発光素子
4A、4B、4C、4D 封止部材
41B、41C、41D 第1の層
43B、43C、43D 第2の層
45D 第3の層
5 蛍光体粒子
Claims (7)
- シラン化合物とシリコーン化合物とにより表面修飾された金属酸化物粒子を含む分散液であって、
前記分散液を真空乾燥により乾燥して得られる、前記金属酸化物粒子について、フーリエ変換式赤外分光光度計により800cm-1以上3800cm-1の波数の範囲の透過スペクトルを測定し、当該範囲におけるスペクトルの最大値を100、最小値を0となるように、スペクトルの値を規格化した際に、以下の式(1):
IA/IB≦3.5 (1)
(式中、「IA」は、3500cm-1におけるスペクトル値、「IB」は、1100cm-1におけるスペクトル値をそれぞれ示す)
を満足する、分散液。 - 請求項1に記載の分散液と樹脂成分とを混合することにより得られる、組成物。
- 請求項2に記載の組成物の硬化物である、封止部材。
- 請求項3に記載の封止部材と、前記封止部材により封止された発光素子と、を備える発光装置。
- 請求項4に記載の発光装置を備える、照明器具または表示装置。
- 少なくともシラン化合物と水とを混合し、前記シラン化合物が加水分解された加水分解液を得る第1の工程と、
前記加水分解液と金属酸化物粒子とを混合して混合液を得る第2の工程と、
前記混合液中において前記金属酸化物粒子を分散し、第1の分散液を得る第3の工程と、
前記第1の分散液中の前記金属酸化物粒子をシリコーン化合物により処理して、第2の分散液を得る第4の工程と、を有し、
前記混合液中における前記金属酸化物粒子の含有量が10質量%以上49質量%以下であり、前記混合液中における前記シラン化合物と前記金属酸化物粒子との合計の含有量が65質量%以上98質量%以下である、分散液の製造方法。 - 前記第1の工程において、前記シラン化合物と前記水とともに、触媒を混合する、請求項6に記載の分散液の製造方法。
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WO2021193727A1 (ja) * | 2020-03-26 | 2021-09-30 | 住友大阪セメント株式会社 | 分散液、組成物、封止部材、発光装置、照明器具、表示装置および分散液の製造方法 |
WO2022071385A1 (ja) * | 2020-09-30 | 2022-04-07 | 住友大阪セメント株式会社 | 分散液、組成物、封止部材、発光装置、照明器具、表示装置、分散液の製造方法、および金属酸化物粒子の表面修飾方法 |
WO2023190493A1 (ja) * | 2022-03-31 | 2023-10-05 | 住友大阪セメント株式会社 | 分散液、組成物、封止部材、発光装置、照明器具、表示装置および分散液の製造方法 |
WO2023190495A1 (ja) | 2022-03-31 | 2023-10-05 | 住友大阪セメント株式会社 | 分散液、組成物、封止部材、発光装置、照明器具、表示装置および分散液の製造方法 |
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CN113646909A (zh) | 2021-11-12 |
EP3951897A4 (en) | 2023-09-27 |
EP3951897A1 (en) | 2022-02-09 |
JP7439824B2 (ja) | 2024-02-28 |
KR20210146334A (ko) | 2021-12-03 |
CN113646909B (zh) | 2024-02-02 |
US20220177709A1 (en) | 2022-06-09 |
JPWO2020203462A1 (ja) | 2020-10-08 |
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