WO2020203002A1 - 露光装置、照明光学系、およびデバイス製造方法 - Google Patents

露光装置、照明光学系、およびデバイス製造方法 Download PDF

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Publication number
WO2020203002A1
WO2020203002A1 PCT/JP2020/009124 JP2020009124W WO2020203002A1 WO 2020203002 A1 WO2020203002 A1 WO 2020203002A1 JP 2020009124 W JP2020009124 W JP 2020009124W WO 2020203002 A1 WO2020203002 A1 WO 2020203002A1
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Prior art keywords
exposure
region
optical system
illumination
exposed
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PCT/JP2020/009124
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English (en)
French (fr)
Japanese (ja)
Inventor
亮平 吉田
真高 井田
吉田　大輔
琢己 野嶋
佑介 松橋
暢章 渡辺
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株式会社ニコン
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Priority to KR1020217026446A priority Critical patent/KR20210142602A/ko
Priority to CN202080011094.6A priority patent/CN113439236B/zh
Priority to JP2021511275A priority patent/JPWO2020203002A1/ja
Priority to CN202410602795.7A priority patent/CN118311837A/zh
Publication of WO2020203002A1 publication Critical patent/WO2020203002A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control

Definitions

  • FIG. 3 is an enlarged perspective view showing the fly-eye lens 11c and the condenser lens 12c included in the illumination optical system ILc and the illumination region MIc on the mask 15 as an example.
  • the fly-eye lens 11c is formed by arranging a plurality of lens elements 110 having a rectangular cross-sectional shape (shape in the XY plane) that is similar to the illumination region MIc and is long in the Y direction in the X direction and the Y direction. There is.
  • the incident surface of each lens element 110 (the upper surface in FIG. 3, that is, the surface on the + Z side) is covered with the illumination region MIc (mask 15) on the mask 15 by the optical system including each lens element 110 and the condenser lens 12c.
  • the configurations of the other illumination optical systems ILa to ILe except for the illumination optical system ILc are the same as the configurations shown in FIG.
  • the fly-eye lenses 11a to 11e are examples of optical integrators that superimpose illumination light on the respective illumination regions MIa to MIe and irradiate them.
  • Dimming members 10a to 10e which will be described later, are held and arranged on the incident surface side (input lenses 8a to 8e side) of the fly-eye lenses 11a to 11e by the dimming member holding portions 9a to 9e.
  • the intermediate image plane 20 is conjugate with the substrate 22, by arranging the field diaphragms 21a to 21e on the intermediate image planes 20 in the projection optical systems 19a to 19e, the projection optical systems 19a to 19e on the substrate 22 are arranged.
  • the exposure fields of view PIa to PIe can be defined.
  • FIG. 6A is a diagram showing each exposure field of view PIa to PIe of the five projection optical systems 19a to 19e on the substrate 22.
  • the exposure fields PIa and PIe of the projection optical systems 19a and 19e, which are the projection optical systems 19F of the first row, are the short sides of the two sides parallel to the Y direction, similarly to the exposure field PIc of the projection optical system 19c described above. Is a trapezoid with the + X side and the long side on the -X side.
  • the exposure fields PIa to PIe are extended in the X direction by scanning exposure in the X direction.
  • the exposure area by the left end region PIal and the exposure area by the right end region PIbr match. Since the same applies to other exposure regions, the description thereof will be omitted.
  • the effective exposure amount EE is different between the overlapping portions Oa to Od and the non-overlapping portions Sa to Se, so that the transfer is performed.
  • the line width and thickness of the pattern will change.
  • the non-overlapping portions Sa to Se, which are continuously exposed in time, can also be interpreted as the first region.
  • the overlapping portions Oa to Od in which the exposure is performed discretely in time can be interpreted as the second region.
  • FIG. 7 is a diagram showing the relationship between the exposure amount E and the effective exposure amount EE in the overlapped portion Oct and its vicinity. As shown in FIG. 6, the overlap portion Oct is a region in which the scanning exposure field SIc by the exposure field PIc and the scanning exposure field SId by the exposure field PId are overlapped and exposed.
  • FIG. 7A is a diagram showing two exposure field of view PIc and exposure field of view PId on the substrate 22.
  • FIG. 7B is a diagram showing the distribution Ec of the exposure amount in the overlapped portion Occ and in the vicinity thereof after the exposure by the exposure field of view PIc is performed.
  • the exposure amount distribution Ec is large on the ⁇ Y side (right side) of the overlap portion Occ and is small on the + Y side (left side) of the overlap portion Occ.
  • the temperature of the photosensitive material (uncountable photosensitive material) on the substrate 22 rises significantly, for example, on the ⁇ Y side of the overlapping portion Occ.
  • the non-additive photosensitive material is in a state where further exposure is likely to proceed (high effective sensitivity) due to activation by heat.
  • the temperature rise of the uncountable photosensitive material is small, and further exposure is difficult to proceed (effective sensitivity is low).
  • FIG. 7C is a diagram showing the distribution Ed of the exposure amount by the exposure field of view PId in the overlapping portion Occ and its vicinity after the exposure by the exposure field of view PId is performed. Note that FIG. 7 (c) also shows the distribution Ec of the exposure amount shown in FIG. 7 (b). As shown in FIG. 6C, the sum of the exposure amount distribution Ec and the exposure amount distribution Ed is constant in the overlap portion Occ and its vicinity.
  • the effective photosensitive amount EEc of the non-additive photosensitive material is not constant in the overlap portion Occ and its vicinity. Further, as shown in FIG. 6 (d), the effective exposure amount EEc has a characteristic asymmetric with respect to the central CL of the overlapping portion Occ in the Y direction. This is because, as described above, the effective sensitivities of the uncountable photosensitive materials of the overlapping portions Occ are different at the stage when the exposure by the initial exposure field of view PIc is completed.
  • non-additive property of the non-additive photosensitive material has been described as an example based on the temperature change of the non-additive photosensitive material.
  • non-additive photosensitive materials have non-additive properties based on temperature changes as described above, and there are also non-additive photosensitive materials having non-additive properties due to other causes.
  • FIG. 8 shows the fly-eye lens 11c provided in the illumination optical system ILc, the dimming member 10c (10c1a, 10c1b, 10c2a, 10c2b), and the dimming member holding portion 9c (9c1, 9c2) on the input lens 8c side. It is a figure seen from.
  • the dimming member 10c provided in the illumination optical system ILc and the dimming member holding portion 9c will be described with reference to FIG. 8, but the dimming members provided in the other illumination optical systems ILa to ILe will be described. The same applies to the members 10a to 10e and the dimming member holding portions 9a to 9e.
  • the fly-eye lens 11c has a plurality of lens blocks in which a plurality of lens elements 110 having a rectangular cross section long in the Y direction are arranged in the X direction, and a plurality of lens blocks are arranged in the Y direction.
  • FIG. 8 is a view of the fly-eye lens 11c as viewed from the input lens 8c side, which is the entrance surface side.
  • the incident surface of each lens element 110 is a conjugate surface CP with respect to the exposure field of view PIc formed on the substrate 22. Therefore, in FIG. 8, the exposure field-corresponding region IPIc, which is the region corresponding to the exposure field of view PIc, is shown by a broken line in each lens element 110.
  • the dimming members 10c2a and 10c2b having a width W2 in the Y direction are arranged on the + X side of the fly-eye lens 11c and are held by the slider 9c20 which is a part of the dimming member holding portion 9c2, and the dimming members 10c1a, It is movable in the X and Z directions independently of 10c1b.
  • the positions of the dimming members 10c2a and 10c2b in the X direction and the positions in the Z direction are controlled according to the control signal Sigc2 transmitted from the control unit 50 to the dimming member holding unit 9c2.
  • the relative positional relationship between the slider 9c10 and the main body of the dimming member holding portion 9c1 and the relative positional relationship between the slider 9c20 and the main body of the dimming member holding portion 9c2 are measured by an encoder or the like.
  • the width W1 of the dimming members 10c1a and 10c1b is slightly larger than the width W2 of the dimming members 10c2a and 10c2b, but the widths W1 and W2 are approximately the same as the widths IWs. Therefore, by arranging the dimming members 10c1a and 10c1b so as to cover the portion corresponding to the central region PIcc of the exposure field of view PIc in the exposure field of view corresponding area IPIc of some lens elements 110, the illumination light is dimmed. , The exposure amount of the non-overlapping portion Sc on the substrate 22 can be reduced.
  • the slider 9c10 by moving the slider 9c10 in the X direction, the number of lens elements 110 covered by the dimming members 10c1a and 10c1b and the ratio of the shaded portion in one lens element 110 can be changed. As a result, the illuminance of the central region PIcc of the exposure field of view PIc can be variably reduced substantially continuously with respect to the illuminance of the left end region PIcl and the right end region PIcr.
  • the dimming member 10c is arranged at a position separated by a predetermined distance in the Z direction from the incident surface of the fly-eye lens 11c.
  • the edge of the dimming member 10c in the XY direction is projected blurry.
  • how far the dimming member 10c should be arranged in the Z direction from the incident surface of the fly-eye lens 11c determines the amount of penumbra blur on the edge of the dimming member 10c on the substrate 22. It can be determined based on the lateral magnification of the incident surface of the fly-eye lens 11c and the substrate 22 and the numerical aperture of the illumination light on the incident surface of the fly-eye lens 11c, which are the parameters to be performed.
  • the width of the overlapping portions Oa to Od in the Y direction is DW
  • the lateral magnification of the substrate 22 with respect to the incident surface of the fly-eye lens 11c is ⁇
  • the numerical aperture of the illumination light on the incident surface of the fly-eye lens 11c is NA.
  • the influence of the exposure amount change (exposure amount unevenness) on the substrate 22 due to the edge of the dimming member 10c can be further reduced, and the exposure of the overlapping portions Oa to Od can be further reduced. It is possible to prevent the amount from dropping more than necessary.
  • FIG. 9 shows the overlapping portion Occ on the substrate 22 and its structure when scanning exposure is performed using the exposure apparatus 100 of the first embodiment provided with the above-mentioned dimming members 10a to 10e and the light amount adjusting members ATa to ATe. It is a figure which shows an example of the exposure amount exposed in the vicinity.
  • the width of the overlap portion Occ in the Y direction is 10 mm.
  • FIG. 9A for the sake of explanation, scan exposure was performed in a state where the dimming members 10a to 10e were not inserted into the incident surface of the fly-eye lens 11 and only the positions of the light amount adjusting members ATa to ATe were adjusted.
  • the exposure amount Ec1 indicates the exposure amount by scanning exposure of the exposure field PIc of the projection optical system 19c in the first row
  • the exposure amount Ed1 indicates the exposure amount by scanning exposure of the exposure field PId of the projection optical system 19d in the second row.
  • FIG. 9 (b) shows a predetermined number of lens elements by moving the dimming members 10c and 10d in the + X direction with respect to the fly-eye lenses 11c and 11d with respect to the exposure amounts Ec1 and Ed1 shown in FIG. 9A. It is a figure which shows the dimming ratio of the exposure amount at the time of performing the scanning exposure in the state which covered the part corresponding to the central region PIcc of the exposure field of view PIc in the exposure field of view corresponding area IPIc of 110.
  • the dimming ratio Tc is such that the dimming member 10c is inserted into the fly-eye lens 11c with respect to the exposure amount Ec1 when scanning exposure is performed without inserting the dimming member 10c into the fly-eye lens 11c at each position in the Y direction. Represents the ratio with the later exposure amount.
  • the dimming ratio Td is such that the dimming member 10c is inserted into the fly-eye lens 11c with respect to the exposure amount Ed1 when scanning exposure is performed without inserting the dimming member 10c into the fly-eye lens 11c at each position in the Y direction. Represents the ratio with the later exposure amount.
  • the amount of the illumination optical system ILd dimming member 10d inserted into the fly-eye lens 11d is larger than the amount of the illumination optical system ILc dimming member 10c inserted into the fly-eye lens 11c.
  • the number of lens elements 110 covered by the dimming member 10d of the illumination optical system ILd is larger than the number of lens elements 110 covered by the dimming member 10c of the illumination optical system ILc.
  • the dimming ratio Td by the dimming member 10d is 0.64 times that in the case without dimming.
  • the dimming ratio Td by the dimming member 10c is 0.94 times that in the case without dimming.
  • the amount of penumbra blur on the edge of the dimming member 10c on the substrate 22, that is, the width of the range in which the dimming ratios Tc and Td increase or decrease is, for example, the width of the overlapping portion Occ. It is 5 mm, which is half of 10 mm.
  • the exposure amount Ec2 represents the exposure amount obtained by multiplying the exposure amount Ec1 in FIG. 9 (a) by the dimming ratio Tc in FIG. 9 (b)
  • the exposure amount Ed2 is the exposure amount Ed1 in FIG. 9 (a) multiplied by FIG. It represents the exposure amount multiplied by the dimming ratio Td of (b).
  • the exposure amount ET2 is the sum of the exposure amount Ec2 and the exposure amount Ed2.
  • the + Y side (left side) of the overlap portion Occ is the ⁇ Y side (right side) of the overlap portion Occ.
  • a lower state is an inverted state.
  • FIG. 10 shows a substrate when a pattern is exposed and transferred using a non-additive photosensitive material in the exposure apparatus 100 of the first embodiment including the light amount adjusting members ATa to ATe and the dimming members 10c to 10e.
  • 22 is a diagram for explaining the result on the entire surface.
  • FIG. 10A shows the exposure fields of view PIa to PIe on the substrate 22 in the same manner as in FIG. 6A.
  • FIG. 10B is a graph showing the exposure amount E exposed on the substrate 22 by scanning exposure in the X direction, as in FIG. 6C. Since the dimming members 10a to 10e are inserted into the incident surface of the fly-eye lenses 11a to 11e, the exposure amount E2 of the non-overlapping portions Sa to Se exposed by one of the scanning exposure fields SIa to SIe is Of the positions in the Y direction of the overlapping portions Oa to Od exposed by overlapping each of the two scanning exposure fields SIa to SIe, the exposure amount is smaller than the exposure amount E3 having the largest exposure amount. Further, due to the light amount adjusting members ATa to ATe and the dimming members 10c to 10e, the exposure amount of the overlapped portions Oa to Od is asymmetrically distributed with respect to the center of each position in the Y direction.
  • the dimming amount of the light amount adjusting members ATa and ATe in the first row and the dimming ratio by the dimming members 10a and 10e in the first row are the dimming amount of the light amount adjusting member ATc and the dimming member described above. It is set to the same value as the dimming ratio according to 10c.
  • the dimming amount of the light amount adjusting member ATb in the second row and the dimming ratio by the dimming member 10b in the second row are the dimming amount of the above-mentioned light amount adjusting member ATd and the dimming ratio by the dimming member 10d. And each is set to the same value. Therefore, the approximate asymmetry of the exposure amount of the overlapping portion Oa is the same as the exposure amount of the overlapping portion Occ and its asymmetry.
  • the exposure by the exposure fields of view PIc and PIe on the + Y side is performed before the exposure by the exposure fields of view PIb and PId on the ⁇ Y side, respectively.
  • the asymmetry of the exposure amount of the overlapped portions Ob and Od is such that the asymmetry of the exposure amount of the overlapped portions Oa and Occ is reversed in the Y direction (-Y side from the center, + Y side from the center). Therefore, changes in line width and film thickness can be prevented even in the overlapping portions Ob and Od.
  • FIG. 10 (c) is a graph showing the effective photosensitive amount EE generated in the above-mentioned uncountable photosensitive material by the exposure amount shown in FIG. 10 (b).
  • the exposure amount E2 of the non-overlapping portions Sa to Se is reduced as compared with the exposure amount E3 of the overlapping portions Oa to Od, and the exposure amount of the overlapping portions Oa to Od is set to be asymmetric with respect to the respective centers.
  • the non-additive characteristics of the non-additive photosensitive material are canceled out, and the effective exposure amount EE can be set to a substantially constant value EE2.
  • the transferred pattern between the overlapping portions Oa to Od and the non-overlapping portions Sa to Se It is possible to prevent changes in the line width and thickness of.
  • the substrate 22 is scanned and exposed in the ⁇ X direction with respect to the projection optical systems 19a to 19e, the asymmetry of the exposure amount distribution of the overlapping portions Oa to Od is scanned in the + X direction described above. It is preferable that the images are reversed in the Y direction with respect to the case of exposure.
  • the control unit 50 controls the positions of the light amount adjusting members ATa to ATe and the dimming members 10a to 10e according to the scanning directions of the substrate stage 27 and the mask stage 16 at the time of exposure.
  • the non-additive characteristics of the non-additive photosensitive material are unique to each non-additive photosensitive material, and also vary depending on the time after the non-additive photosensitive material is formed on the substrate 22 and the like. Therefore, in order to accurately cancel the non-additive characteristics of the uncountable photosensitive material to be exposed, it is necessary to accurately control the distribution of the exposure amount in the overlapping portions Oa to Od according to the non-additive characteristics. ..
  • the exposure apparatus 100 of the first embodiment includes two types of dimming members 10c1a and 10c1b having different widths in the Y direction, and dimming members 10c2a and 10c2b. Then, by the control signals SigC1 and SigC2 from the control unit 50, the positions of the dimming members 10c1a and 10c1b having a width W1 and the dimming members 10c2a and 10c2b having a width W2 in the X direction (insertion amount into the fly-eye lens 11c). To control. Thereby, the distribution of the exposure amount in the overlapped portions Oa to Od can be accurately controlled.
  • the uncountable photosensitive materials to be exposed have relatively common non-additive characteristics, it is less necessary to use two types of dimming members having different widths in the Y direction. In some cases, it may be sufficient to use only the dimming members 10c1a and 10c1b having one type of width.
  • the edge of the dimming member 10c on the incident surface of the fly-eye lens 11c in the XY direction can also be moved. You can change the amount of penumbra blur. Therefore, by controlling the Z-direction positions (positions in the optical axis direction) of the dimming members 10c1a and 10c1b and the dimming members 10c2a and 10c2b in the illumination optical systems ILc and ILd, the exposure amount in the overlapping portion Occ The distribution can be adjusted.
  • the dimming members 10c1a and 10c1b and the dimming members 10c2a and 10c2b in the illumination optical system ILc and ILd in the Z direction is controlled, or one of the control amounts (in the Z direction) is controlled.
  • the amount of one penumbra blur becomes larger than the amount of the other penumbra blur, and the distribution of the exposure amount in the overlapping portion Oct becomes asymmetric. be able to.
  • the device configuration may be such that the light amount adjusting member AT is omitted.
  • the method shown in the first embodiment may be used in combination with the method of adjusting the positions of the dimming members 10c1a, 10c1b and the dimming members 10c2a, 10c2b in the Z direction. Further, the method of making the distribution of the exposure amount in the overlapping portion Occ asymmetrical may be changed for each illumination optical system.
  • the positions of the dimming members 10c1a and 10c1b and the dimming members 10c2a and 10c2b in the optical axis direction can be controlled by the control signals SigC and SigD from the control unit 50, respectively.
  • the relationship between the effective exposure amount of the uncountable photosensitive material and the integrated exposure amount for the exposure performed by dividing the time is different depending on each non-additive photosensitive material. Therefore, for example, the insertion amounts (positions in the X direction) of the dimming members 10c1a and 10c1b and the dimming members 10c2a and 10c2b are set in several different steps before the actual exposure to the specific non-additive photosensitive material is performed. It is advisable to perform test exposure under multiple conditions. Then, the optimum insertion amount of the dimming members 10c1a and 10c1b and the dimming members 10c2a and 10c2b may be determined from the result of the test exposure.
  • the illuminance sensor 26 provided on the substrate stage 27 is used to measure the illuminance of the central region PIcc, the left end region PIcl, and the right end region PIcr in the exposure field of view PIc. It is good to do it while doing it.
  • the ends of the two dimming members 10c1a and 10c1b having a width W1 shown in FIG. 8 are offset by half the pitch PX of the X-direction arrangement of the lens elements 110 of the fly-eye lens 11c. ..
  • there is an exposure field of view corresponding region IPIcw corresponding to the exposure field of view PIc there is an exposure field of view corresponding region IPIcw corresponding to the exposure field of view PIc, but the exposure field of view corresponding area IPIcw extends over the entire surface of the lens element 110 in the X direction. is not.
  • both ends of the lens element 110 in the X direction do not correspond to the exposure field of view PIc on the substrate 22, are projected onto the field diaphragm 21c in the projection optical system 19c, and are shaded by the field diaphragm 21c. ..
  • the ends of the dimming member 10c1a in the + X direction are near both ends of the lens element 110 in the X direction, even if the dimming member 10c1a is moved in the X direction, the exposure on the substrate 22 The amount cannot be changed. Therefore, in the first embodiment, the ends of the two dimming members 10c1a, 10c1b, and the two dimming members 10c2a, 10c2b in the + X direction are arranged at the pitch PX of the lens element 110 in the X direction. It is shifted by half.
  • the exposure amount on the substrate 22 can always be changed by moving the two dimming members 10c1a and 10c1b together in the X direction.
  • the two dimming members 10c1a and 10c1b may be independently moved in the X direction. The same applies to the two dimming members 10c2a and 10c2b.
  • the dimming members 10c1a and 10c1b are not limited to the above-mentioned two, and may be three or more, and each may be arranged in a different lens block. Also in this case, if the number of dimming members is m (m is a natural number of 2 or more), the ends of each dimming member in the + X direction are set to be offset by PX / m with respect to the pitch PX. It is preferable that it is.
  • the dimming member 10c (10c1a, 10c1b, 10c2a, 10c2b) is arranged at a position separated by a predetermined distance in the Z direction from the incident surface of the fly-eye lens 11c, but the present invention is not limited to this.
  • the dimming member 10c may be provided on the incident surface of the fly-eye lens 11c, that is, the conjugate surface CP with respect to the upper surface of the substrate 22.
  • the dimming member 10c completely blocks the illumination light, when it is arranged so as to coincide with the conjugated surface CP, the exposure amount of the overlapping portions Oa to Od and the non-overlapping portions Sa to Se There is a risk that the exposure amount of the part will change discontinuously. Therefore, in this case, it is preferable that the dimming member 10c deforms its shape or continuously changes the shading rate of the illumination light according to the position in the Y direction such as a filter.
  • FIG. 11A is a view (top view) of the dimming member 10c (10c3a, 10c4a, 10c3b, 10c4b) and the dimming member holding portion 9c (9c3, 9c4) of the modified example 1 viewed from the input lens 8c side.
  • FIG. 11B is a side view of the dimming member 10c and the dimming member holding portion 9c of the first modification.
  • the same members as those in the above-described first embodiment are designated by the same reference numerals, and only the differences will be described below.
  • the dimming member 10c of the first modification is a set of two dimming members 10c3a and 10c4a in which the ends in the Y direction overlap in the Z direction (the direction of the optical axis IXc of the illumination optical system IL9) and 2 It includes a set of two dimming members 10c3b and 10c4b.
  • the dimming member 10c3a and the dimming member 10c3b are movably held in the X direction, the Z direction, and the Y direction by the dimming member holding portion 9c3 via the slider 9c30.
  • the dimming member 10c4a and the dimming member 10c4b are also movably held in the X direction, the Z direction, and the Y direction by the dimming member holding portion 9c4 via the slider 9c40.
  • the width W3 in the Y direction as a whole of the set of the two dimming members 10c3a and 10c4a is such that the slider 9c30 holding each of them moves in the + Y direction and the slider 9c40 moves in the ⁇ Y direction. It increases when you move to.
  • the width W3 decreases when the slider 9c30 moves in the ⁇ Y direction and the slider 9c40 moves in the + Y direction. Therefore, in the dimming member 10c of the first modification, the substantially width W3 (effective width) in the Y direction can be made variable. Thereby, the distribution of the exposure amount in the overlapped portions Oa to Od can be controlled.
  • This width W3 can be set by the control signals SigC3 and SigC4 from the control unit 50 controlling the dimming member holding unit 9c3 and the dimming member holding unit 9c4.
  • the control unit 50 can control the dimming member 10c in the Z direction via the positions of the slider 9c30 and the slider 9c40.
  • the positions of the ends of the dimming member 10c3a and the dimming member 10c4a in the + X direction coincide with each other, and the positions of the ends of the dimming member 10c3b and the dimming member 10c4b in the + X direction are aligned.
  • the positions of the slider 9c30 and the slider 9c40 in the X direction are controlled so as to match.
  • the exposure apparatus 100 has five projection optical systems 19a to 19e, but the number of projection optical systems is not limited to five, and the number of projection optical systems is not limited to five. It may be any number, such as eight. Further, in the above first embodiment and the first modification, there are a plurality of projection optical systems 19a to 19e, and a plurality of scanning exposure fields SIa to formed by each projection optical system by scanning in the X direction once. It is assumed that SIes overlap each other in the Y direction.
  • a scan-and-stitch exposure apparatus there is only one projection optical system 19, and scanning exposure of the substrate 22 in the X direction is performed a plurality of times while moving the substrate 22 and the mask 15 in the Y direction, and a plurality of exposure fields of view formed by each scanning exposure. May overlap each other in the Y direction.
  • an exposure apparatus having such a configuration will be referred to as a scan-and-stitch exposure apparatus.
  • the illumination optical system IL corresponding to one projection optical system 19 has the same configuration as the above-mentioned illumination optical systems ILa to ILe.
  • the control unit 50 controls the scanning speeds of the substrate stage 27 and the mask stage 16 to collectively control the exposure amount in each scanning exposure field. You may increase or decrease it.
  • the end portion in the + Y direction overlaps with the exposure field exposed by the past scanning exposure and is in the + Y direction.
  • the edge of is overlapped with the exposure field exposed by future scan exposure. Therefore, it may be necessary to make the exposure amount different in the vicinity of both ends in the non-scanning direction (Y direction) of the scanning exposure field of view.
  • the sliders 9c10 and 9c20 are not only in the X and Z directions but also in the Y direction. It is preferably movable.
  • the control signals Sig2C1 and Sig2C2 from the control unit 50 By moving the illuminance changing member 10c (10c1a, 10c1b, 10c2a, 10c2b) in the Y direction by the control signals Sig2C1 and Sig2C2 from the control unit 50, the amount of light in the vicinity of both ends in the non-scanning direction (Y direction) of the scanning exposure field of view. Can be changed.
  • An apparatus having a plurality of projection optical systems 19a to 19e as in the first embodiment described above can expose a larger area on the substrate 22 with a single scanning exposure, and is excellent in processing capacity. There is.
  • the plurality of projection optical systems 19a to 19e are composed of total internal reflection optical systems, but the present invention is not limited to this, and a catadioptric reflection optical system or a total internal reflection optical system may be adopted. You can also.
  • the shapes of the exposure fields PIa to PIe are assumed to be trapezoidal, but this is not limited to the trapezoidal shape, and for example, the portion corresponding to the central portion thereof.
  • the shape of is an arc, and the field of view may have a right end region and a left end region of a triangle at both ends of the arc.
  • the optical axes PAXa to PAXe of the projection optical systems 19a to 19e and the optical axes IXa to IXe of the illumination optical systems ILa to ILe are basically in the Z direction. It is assumed that they are set in parallel. However, when the folding mirror is adopted in any of the optical systems, the direction of the optical axis is not parallel to the Z direction. Further, when the bending mirror is adopted in any of the optical systems, the moving direction of the dimming members 10a to 10e is also different from the scanning direction (X direction) of the substrate 22.
  • the dimming members 10a to 10e optically correspond to the scanning direction of the substrate 22 based on the conjugate relationship between the substrate 22 including the folding mirror and the flyeye lenses 11a to 11e ( It suffices to be movable in the first direction). Further, the dimming members 10a to 10e may be movable in a total of three directions, that is, the direction of the optical axis IX of the illumination optical system IL and the direction orthogonal to the first direction and the direction of the optical axis IX.
  • each of the projection optical systems 19a to 19e two rows of optical systems of a first row of projection optical systems 19F and a second row of projection optical systems 19R are arranged in the X direction.
  • this is not limited to two rows, and three or more rows of optical systems may be arranged in the X direction.
  • a rod integrator can be adopted instead of the fly-eye lens 11 described above.
  • the conjugate surface CP between the substrate 22 and the mask 15 is on the injection side of the rod integrator (the side of the mask 15), so the dimming member 10 is also arranged near the injection side of the rod integrator. To do. Then, the vicinity of one end on the X side of the injection surface of the rod integrator is partially dimmed.
  • the dimming members 10a to 10e may be arranged in the vicinity of the intermediate image plane 20 of the projection optical systems 19a to 19e. Also in this case, the dimming member is configured to dimm the portion corresponding to the central region PIac to PIec of the exposure fields PIa to PIe in the vicinity of the intermediate image plane 20.
  • an intermediate image plane (conjugated surface to the mask 15) is provided inside the illumination optical systems ILa to ILe, and is intermediate in the illumination optical systems ILa to ILe.
  • a field diaphragm may be provided on the image plane to define the shapes of the exposure fields PIa to PIe on the substrate 22. Further, the shape of the diaphragm in the illumination optical system ILa to ILe may be deformed so that the exposure amount distribution in the Y direction in the overlapping regions Oa to Od on the mask 15 and the substrate 22 becomes asymmetric.
  • the shape of the diaphragm in the illumination optical system ILa to ILe is the value obtained by integrating the left end region PIal to PIdl and the right end region PIbr to PIer of the corresponding exposure fields PIa to PIe in the X direction in each minute section in the Y direction.
  • it may be made asymmetric with respect to the central CL of each overlapping region Oa to Od.
  • the light amount adjusting member AT is not limited to the configuration shown in the first embodiment described above.
  • the light amount adjusting member AT may be a filter that blocks a part of the illumination light and transmits a part of the illumination light.
  • the filter may be formed so as to increase or decrease the amount of shading of the illumination light according to the position in the X direction.
  • the projection optical systems 19a to 19e and the illumination optical systems ILa to ILe are fixed and the substrate 22 is moved by the substrate stage 27, but instead, the projection optical systems 19a to 19e and the illumination optics are used.
  • the systems ILa to ILe may be provided on the substrate stage and scanned against the substrate 22.
  • the mask 15 is not limited to a mask in which a pattern is formed on a glass substrate, and may be a variable shaping mask composed of a digital multi-mirror device or a liquid crystal device.
  • the exposure apparatus 100 is an exposure apparatus for liquid crystals that transfers a liquid crystal display element pattern onto a square glass plate, and can be applied to, for example, an exposure apparatus for manufacturing an organic EL (Electro-Lumisensence) panel. Further, in order to manufacture masks or reticle used not only in microdevices such as semiconductor elements but also in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment and the like, glass substrates or silicon wafers and the like are used. It can also be applied to an exposure apparatus that transfers a circuit pattern. The substrate (glass plate, etc.) exposed by the exposure apparatus 100 is developed by a developing apparatus (not shown), and if necessary, etching processing or the like is performed based on the pattern of the photosensitive material formed by the exposure and development processing. It is said.
  • a developing apparatus not shown
  • the exposure target is not limited to the glass substrate, and other objects such as wafers, ceramic substrates, film members, mask blanks, and the like may be used.
  • the thickness of the substrate is not particularly limited, and for example, a film-like (flexible sheet-like member) is also included.
  • the exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll shape.
  • the exposure apparatus 100 of the first embodiment or each modification has a first exposure region (scanning exposure field) on the exposed substrate 22 in the first hour while moving the exposed substrate 22 in the scanning direction (X direction).
  • the illumination optical systems ILa to ILe for supplying the illumination light
  • the projection optical systems 19a to 19e and the non-scanning direction orthogonal to the scanning direction.
  • the exposure amount distribution in the second region (overlapping portions Oa to Od) where a part of each of the first exposure region and the second exposure region overlaps is asymmetric with respect to the central CL of the second region.
  • the setting members 10a to 10e which are set so as to have a uniform distribution, are provided.
  • the pattern is exposed using a non-additive photosensitive material, which has a lower effective exposure amount than when the exposure is divided into a plurality of times and is continuously performed in time. Even when the transfer is performed, it is possible to prevent changes in the line width and thickness of the transferred pattern in the second region (overlapping portions Oa to Od).
  • the exposure apparatus of the first embodiment or the modified example is such that a predetermined pattern is exposed on the illumination optical systems ILa to ILe, the projection optical systems 19a to 19e, and the exposed substrate 22 for supplying the illumination light.
  • a substrate stage 27 for moving the exposed substrate 22 relative to the projection optical systems 19a to 19e in the scanning direction (X direction) is provided. Further, in the exposure, the amount of exposure in the first region (non-overlapping portions Sa to Se) on the exposed substrate 22 that is continuously exposed in time by the scanning exposure fields SIa to SIe of the projection optical systems 19a to 19e.
  • the illuminance changing members 10a to 10e that set the exposure amount distribution of the second region (overlapping portions Oa to Od) in the orthogonal direction (Y direction) to be asymmetrical with respect to the central CL of the second region. It has.
  • the pattern is exposed using a non-additive photosensitive material, which has a lower effective exposure amount than when the exposure is divided into a plurality of times and is continuously performed in time.
  • the line width of the transferred pattern between the second region (overlapping portions Oa to Od) and the first region (non-overlapping portions Sa to Se) It is possible to prevent a change in thickness. In addition, it is possible to prevent changes in the line width and thickness of the transferred pattern in the second region (overlap portions Oa to Od).
  • the first region (non-overlapping portion Sa to The exposure amount of Se) can be accurately controlled.
  • the control unit 50 for controlling the positions of the illuminance changing members 10a to 10e is further provided, the illumination optical systems ILa to ILe have optical integrators 11a to 11e, and the optical integrators 11a to 11e have an incident surface of illumination light.
  • the configuration may be provided at a position serving as a conjugate surface CP with respect to the scanning exposure fields SIa to SIe of the projection optical systems 19a to 19e.
  • the illuminance changing members 10a to 10e are subjected to the light of the illumination optical systems ILa to ILe with respect to the optical integrators 11a to 11e so that the control unit 50 changes the illuminance of the illumination light incident on the optical integrators 11a to 11e.
  • the control unit 50 is effective in the X direction (first direction) of the illuminance changing members 10a to 10e and in the Y direction (second direction) orthogonal to the optical axes IXa to IXe directions of the illumination optical systems ILa to ILe. By controlling the width, the distribution of the exposure amount in the second region (overlapping portions Oa to Od) can be controlled more accurately.
  • Exposure device 1: Light source, ILa to ILe: Illumination optical system, ATa to ATe: Light amount adjusting member, 10a to 10e: Dimming member (illuminance changing member), 11a to 11e: Fly eye lens, 12a to 12e: Condenser lens, 15: mask, MIa to MIe: illumination field, 19a to 19e: projection optical system, 21a to 21e: field diaphragm, 22: substrate, SIa to SIe: scanning exposure field, Sa to Se: non-overlapping part ( 1st area), Oa to Od: Overlapping part (2nd area), 50: Control part

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
PCT/JP2020/009124 2019-03-29 2020-03-04 露光装置、照明光学系、およびデバイス製造方法 WO2020203002A1 (ja)

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CN202080011094.6A CN113439236B (zh) 2019-03-29 2020-03-04 曝光装置、照明光学系统以及元件制造方法
JP2021511275A JPWO2020203002A1 (ko) 2019-03-29 2020-03-04
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JPH10199800A (ja) * 1997-01-09 1998-07-31 Nikon Corp オプティカルインテグレータを備える照明光学装置
JP2001297975A (ja) * 2000-04-17 2001-10-26 Nikon Corp 露光装置及び露光方法
JP2001305745A (ja) * 2000-04-24 2001-11-02 Nikon Corp 走査露光方法および走査型露光装置
JP2002258489A (ja) * 2000-04-20 2002-09-11 Nikon Corp 露光装置および露光方法
JP2004335864A (ja) * 2003-05-09 2004-11-25 Nikon Corp 露光装置及び露光方法
JP2017198990A (ja) * 2016-04-28 2017-11-02 エルジー ディスプレイ カンパニー リミテッド 分割露光装置及びそれを用いた液晶表示装置の製造方法

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Publication number Priority date Publication date Assignee Title
JP2016054230A (ja) 2014-09-04 2016-04-14 キヤノン株式会社 投影露光装置及び露光方法

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Publication number Priority date Publication date Assignee Title
JPH10199800A (ja) * 1997-01-09 1998-07-31 Nikon Corp オプティカルインテグレータを備える照明光学装置
JP2001297975A (ja) * 2000-04-17 2001-10-26 Nikon Corp 露光装置及び露光方法
JP2002258489A (ja) * 2000-04-20 2002-09-11 Nikon Corp 露光装置および露光方法
JP2001305745A (ja) * 2000-04-24 2001-11-02 Nikon Corp 走査露光方法および走査型露光装置
JP2004335864A (ja) * 2003-05-09 2004-11-25 Nikon Corp 露光装置及び露光方法
JP2017198990A (ja) * 2016-04-28 2017-11-02 エルジー ディスプレイ カンパニー リミテッド 分割露光装置及びそれを用いた液晶表示装置の製造方法

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KR20210142602A (ko) 2021-11-25
TW202040284A (zh) 2020-11-01

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