WO2020197485A1 - Composition comprenant une résine fluorée et procédés de production de la composition et d'une dispersion de résine fluorée - Google Patents

Composition comprenant une résine fluorée et procédés de production de la composition et d'une dispersion de résine fluorée Download PDF

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Publication number
WO2020197485A1
WO2020197485A1 PCT/SG2019/050158 SG2019050158W WO2020197485A1 WO 2020197485 A1 WO2020197485 A1 WO 2020197485A1 SG 2019050158 W SG2019050158 W SG 2019050158W WO 2020197485 A1 WO2020197485 A1 WO 2020197485A1
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WO
WIPO (PCT)
Prior art keywords
fluororesin
composition
dispersion
organic solvent
less
Prior art date
Application number
PCT/SG2019/050158
Other languages
English (en)
Inventor
Eason CHAN
Siew Peng CHIA
Sho Masuda
Original Assignee
Agc Asia Pacific Pte. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Asia Pacific Pte. Ltd. filed Critical Agc Asia Pacific Pte. Ltd.
Priority to CN201980092146.4A priority Critical patent/CN113455109A/zh
Priority to PCT/SG2019/050158 priority patent/WO2020197485A1/fr
Priority to TW109108526A priority patent/TWI842856B/zh
Publication of WO2020197485A1 publication Critical patent/WO2020197485A1/fr

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18Homopolymers or copolymers or tetrafluoroethene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09D127/18Homopolymers or copolymers of tetrafluoroethene
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/034Organic insulating material consisting of one material containing halogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18Monomers containing fluorine
    • C08F214/26Tetrafluoroethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18Monomers containing fluorine
    • C08F214/26Tetrafluoroethene
    • C08F214/262Tetrafluoroethene with fluorinated vinyl ethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/015Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Definitions

  • the present invention relates to a composition comprising fluororesin, and methods of producing the composition and a fluororesin dispersion.
  • Fluororesins are used as coatings because they have the characteristics of being chemical resistant, heat resistant, having a low coefficient of friction, and being electrically insulating. Specifically, fluororesins are used as coatings in high frequency circuit boards due to their excellent dielectric characteristics. In a typical process of manufacturing high frequency circuit boards, the fluororesin is processed into fine particles, dispersed in a dispersion medium containing a matrix resin, and then laminated together with a conductor such as a copper foil and the like. The resulting panel is then further processed by etching or the like to form the high frequency circuit board.
  • the matrix resin normally used in the above mentioned manufacturing process is soluble in a hydrocarbon solvent, it is necessary to first disperse the fluororesin in the hydrocarbon solvent.
  • the fluororesin due to its low interfacial tension, the fluororesin has poor wettability with the hydrocarbon type medium and is difficult to disperse in the said medium.
  • the fluororesin considering the relatively high specific gravity of fluororesin, it is practically difficult to avoid separation in the fluororesin dispersion.
  • JP-A-2017-193655 discloses a fluororesin dispersion containing a dispersant having a thermally decomposable group with a specific oxyaikyiene chain, fluororesin particles and water or an organic solvent.
  • JP-A-1987-121700 discloses a fluororesin dispersion characterized by dispersing a fluorine- containing resin powder having a particle size of 2 mm or less in an organic solvent.
  • Japanese Patent 2516241 discloses a technique of dispersing a fluorine-containing resin powder having a particle diameter of 2 mm or less in an aqueous medium in the presence of a non-ionic surfactant and a thickener.
  • Japanese Patent 4255169 discloses a dispersant having an organosiloxane structure which uniformly disperses fibrillated PTFE.
  • Japanese Patent 5195425 discloses a technique of bringing a solution in which a fluororesin is roughly dispersed in an aqueous medium to an ion exchange resin, adding an electrolyte and an anionic emulsifier, and then subjecting to phase separation and concentration to obtain an aqueous fluororesin solution.
  • JP-A-1998-176002 discloses a technique in which polymer particles insoluble In an organic solvent are dispersed by a polymer having an acrylic skeleton and having a fluoroalkyl group in a side chain.
  • US 2013/0149540 discloses a charging roll composition for improving the copy quality of a dry copying machine, and a technique of dispersing polytetrafluoroethylene resin particles with a polymer having an acrylic skeleton and a fiuoroaikyi group in a side chain has been disclosed in the examples.
  • WO 2018070420 discloses a composition obtained by mixing a water-containing fiuoropolymer having a specific sulfonic acid group and a carboxyl group on its structure with water and mesh filtering with a mesh opening size of 20 mm to obtain a composition having a degree of dispersion of 50%. Drying at a work amount of 200 W or less to obtain a powder is disclosed.
  • Japanese Patent 2516241 and Japanese Patent 5195425 disclose the use of water as a dispersion medium.
  • the use of water as a dispersion medium increases the time taken for the application of the fluororesin coating onto the substrate due to the large latent heat of evaporation of water.
  • the presence of a dispersing agent and a thickener for stabilization of the aqueous dispersion could result in the loss of dielectric properties of fluororesin.
  • JP-A-1998-176002 and US 2013/0149540 disclose a technique for producing a non- aqueous dispersion by using a polymer having an acrylic skeleton and having a fluoroalkyl group in a side chain.
  • WO 2018070420 discloses an ion exchange resin having a sulfonic acid group or a carboxyl group which has a high affinity for water as a dispersion solvent itself but cannot be used for a high frequency circuit board where electrical insulation is required. It also suggests the possibility of dispersing the ion exchange resin in organic solvents other than water, but the examples are not shown.
  • a composition comprising fluororesin, a method of producing the composition, and a method of producing a fluororesin dispersion as claimed in the independent claims. Some optional features are defined in the dependent claims.
  • BRIEF DESCRIPTION OF THE DRAWINGS Figure 1A illustrates steps for forming a composition according to an example of the present disclosure.
  • Figure 1B illustrates steps for producing a fluororesin dispersion from the fluororesin composition of Figure 1A.
  • DETAILED DESCRIPTION Examples of a composition and a method of producing the composition and a fluororesin dispersion from the composition are described as follow.
  • FIG. 1A illustrates steps for forming an example of a composition 104 of the present disclosure.
  • the composition 104 in this case is a fluororesin composition.
  • This fluororesin composition 104 is a dry solid in the present example.
  • the following components are first mixed together in a step 1: (a) a fluororesin powder, (b) a dispersant, (c) a solvent and (d) dispersing beads resulting in a mixture 101. It is also possible to use other suitable dispersing aids besides dispersing beads.
  • a step 2 which is regarded as a dispersion step, the fluororesin powder in the mixture 101 is dispersed by mechanical action. Dispersion by mechanical action may include shaking the mixture using a paint shaker.
  • step 3 the dispersing beads are removed by filtration using a suitable filter 102 (see examples of such filter in the Examples described under the EXAMPLES section below) to form a first fluororesin dispersion 106.
  • step 4 the first fluororesin dispersion 106 is dried to form the dry-solid fluororesin composition 104 of the present example.
  • the drying process of step 4 may be a constant drying process with check-points during the process to confirm that the percentage by mass of the organic solvent in the composition 104 is 0.2% or less.
  • the drying process can be such that the first fluororesin dispersion 106 is subject to drying more than once at the same temperature or with fluctuating temperatures with stops or check-points in-between to confirm that the percentage by mass of the organic solvent in the composition 104 is 0.2% or less.
  • the percentage of 0.2% or less of the solvent ensures that the composition 104 is sufficiently dry.
  • the confirmation step at each stop or check-point to ensure that the percentage by mass of the solvent in the composition 104 is 0.2% or less may be in the form of subjecting the composition 104 to a heating process, and determining the mass of the composition 104 before and after the heating process to verify that the percentage change in the mass of the composition 104 is 0.2% or less.
  • FIG. 1 B illustrates steps for producing a second fluororesin dispersion from the dry-solid fluoresin composition 104 produced in the example of Figure 1 A.
  • a second solvent 204 is first added to the dry-solid fluororesin composition 104 of Figure 1 A to form a mixture 201.
  • the mixture 201 is subjected to a redispersion step to redisperse the fluororesin in the mixture 201 by mechanical action to form the second fluororesin dispersion 202.
  • step A In the example of producing the second dispersion 202 as illustrated in Figure 1 B, the components described are added in the following parts per mass in step A:
  • the composition 104 of Figure 1A refers to one wherein the composition comprises fluororesin with an average particle diameter of 1 mm or more and 5 mm or less and a maximum particle size of 10 mm or less, a dispersant, and organic solvent or residual organic solvent having percentage by mass of 0.2 mass% or less.
  • the composition 104 of Figure 1 A may be in a form of a cake-like material, or more specifically, a dried or hardened solid mass in another example, the composition 104 of Figure 1 A may be in powder form and not aggregated to form the cake-like material.
  • composition 104 of Figure 1A One of the advantages of the composition 104 of Figure 1A is that transportation problems can be avoided since the hazardous organic solvent in the fluororesin dispersion is removed or substantially removed.
  • composition 104 of Figure 1A Another advantage of the composition 104 of Figure 1A is that it is able to return to the dispersed state again easily via steps A and B of Figure I B.
  • the size of the fluororesin powder after redispersion in step B of Figure 1 B is 10 mm or less.
  • the redispersion of the composition 104 in step A is performed without using dispersing beads.
  • a suitable but different solvent from the first organic solvent
  • the organic solvent for the redispersion of the composition 104 is not restricted to the first organic solvent.
  • the fluororesin in the composition 104 of Figure 1A may be perfluoro type fluororesin, which has higher dielectric characteristics.
  • the fluororesin can be tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer. Tetrafluoroethylene-hexafluoropropylene is another choice for the fluororesin because it melts during the heating process.
  • the fluororesin may be one or two selected from a group comprising tetrafluoroethyllene-perfluoroalkyl vinyl ether copolymer and tetrafluoroethylene-hexafluoropropylene copolymer.
  • the fluororesin in the composition 104 of Figure 1 A may contain monomers in an amount of 10 mo!% or less for the purposes of improving functions in high frequency circuit boards.
  • the fluororesin may contain itaconic anhydride and 5-norbornene-2,3-dicarboxylic anhydride for improving adhesion of a matrix resin to a substrate of such high frequency circuit boards.
  • the size of the fluororesin powders in the second fluororesin dispersion 202 of Figure 1 B is 10 mm or less.
  • the average particle diameter in the composition 104 of Figure 1 A is 1 to 5 mm or less and the maximum particle diameter is 10 mm or less.
  • the average particle diameter is 1 mm to 5 mm, the amount of the dispersant and organic solvent for the redispersion of the second fluororesin dispersion 202 does not adversely affect the electrical characteristics.
  • organic solvents are usually used based on the solubility in the matrix resin illustrative examples of such organic solvents include MEK (methyl ethyl ketone), toluene, xylene, DMF (dimethyiformamide), NMP (N-methylpyrrolidone), DMAC (dimethylacetamide), CAN (cyclohexanone) and the like.
  • the dispersant in the composition 104 of Figure 1 A an example Is an oligomer of hexafluoropropene. Therefore, the dispersant may be a hexafluoropropylene trimer.
  • the dispersant may comprise one or more surfactant.
  • the amount of the dispersant to be added varies depending on the organic solvent to be used, but may be generally about 1 to 10 parts per mass per 100 parts of the fluororesin.
  • glass, ceramic beads and oxide beads may be used.
  • Example 2 Preparation of a Dispersion in Example 2 (Ex.2)
  • the dispersion was prepared as described in Example 1, except that acetone was used as the organic solvent instead of MEK.
  • the particle size of the dispersion obtained was determined to be less than 10 ⁇ m by a grind gauge.
  • Example 4 This example is meant as a comparative example.
  • the dispersion was prepared as described in Example 1, except that zirconia beads were not added as dispersing beads.
  • the particle size of the dispersion obtained was determined to be more than 10 ⁇ m by a grind gauge.
  • Example 1 This example is meant as a comparative example.
  • the dispersion was prepared as described in Example 1, except that shaking duration was 45 mins instead of 60 mins.
  • the particle size of the dispersion obtained was determined to be more than 10 ⁇ m by a grind gauge.
  • Table 1 shows a summary of the results from Examples 1 to 4.
  • the desired results i.e. particle size less than 10 ⁇ m
  • Examples 3 and 4 are comparative examples that did not produce the desired results.
  • the dispersion obtained by Example 1 above was dried by exposing it to ambient conditions (25°C) for 7 days and leaving the glass jar unsealed in a fume hood to obtain a cake-like material.
  • the cake-like material was confirmed to be dried by subjecting the cake-like material to heat and verifying that the percentage change in mass of the cake-like material to be 0.2% or less.
  • 20g of the cake-like material and 60g of acetone was added into a glass jar of 300ml capacity.
  • the mass of the redispersion solvent to the mass of the cake-like material is 3:1.
  • the glass jar was sealed with an inner cap and jar cap.
  • the sealed glass jar is placed into a paint shaker (Collomix AGIA 200) and shaken for 60mins.
  • the particle size of the dispersion obtained was determined to be less than 10 ⁇ m by a grind gauge.
  • the redispersion was prepared as described in Embodiment I, except that MEK was used as the redispersion solvent.
  • the particle size of the dispersion obtained was determined to be less than 10 ⁇ m by a grind gauge.
  • the redispersion was prepared as described in Example I, except that the cake-like material used was obtained by drying from Example 2 and MEK was used as the redispersion solvent.
  • the particle size of the dispersion obtained was determined to be less than 10 ⁇ m by a grind gauge.
  • This example is meant as a comparative example.
  • the redispersion was prepared as described in Example I, except that dimethylacetamide was used as the redispersion solvent.
  • the particle size of the dispersion obtained was determined to be more than 10 mm by a grind gauge.
  • This example is meant as a comparative example.
  • the redispersion was prepared as described in Example I, except that toluene was used as the redispersion solvent.
  • the particle size of the dispersion obtained was determined to be more than 10 mm by a grind gauge.
  • This example is meant as a comparative example.
  • the redispersion was prepared as described in Example I, except that toluene was used as the redispersion solvent and the mass of the redispersion solvent to the mass of the“cake-like material” is increased to 4:1.
  • the particle size of the dispersion obtained was determined to be more than 10 mm by a grind gauge.
  • This example is meant as a comparative example.
  • the redispersion was prepared as described in Example I, except that toluene was used as the redispersion solvent and the redispersion method used was stirring for 60 mins by a Paint Stirrer.
  • the particle size of the dispersion obtained was determined to be more than 10 mm by a grind gauge.
  • Table 2 below shows successful results of redispersion by using a redispersion solvent that is different from the first dispersion solvent.
  • a successful result is defined as redispersion to below 10 mm marticle size.
  • the successful examples of redispersion are found in Examples I and III, while Examples II, and IV to VII are comparative examples.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

L'invention concerne une composition, un procédé de production de la composition et un procédé de production d'une dispersion de résine fluorée à partir de la composition, la composition comprenant (I) une résine fluorée ayant un diamètre moyen de particule de 1 µm ou plus et de 5 µm ou moins et une taille de particule maximale de 10 µm ou moins ; (ii) un agent dispersant ; et (iii) un solvant organique, le pourcentage en masse du solvant organique dans la composition étant de 0,2 % ou moins.
PCT/SG2019/050158 2019-03-22 2019-03-22 Composition comprenant une résine fluorée et procédés de production de la composition et d'une dispersion de résine fluorée WO2020197485A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980092146.4A CN113455109A (zh) 2019-03-22 2019-03-22 包含氟树脂的组合物及该组合物和氟树脂分散液的制造方法
PCT/SG2019/050158 WO2020197485A1 (fr) 2019-03-22 2019-03-22 Composition comprenant une résine fluorée et procédés de production de la composition et d'une dispersion de résine fluorée
TW109108526A TWI842856B (zh) 2019-03-22 2020-03-16 包含氟樹脂的組合物及該組合物和氟樹脂分散液的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2019/050158 WO2020197485A1 (fr) 2019-03-22 2019-03-22 Composition comprenant une résine fluorée et procédés de production de la composition et d'une dispersion de résine fluorée

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Publication Number Publication Date
WO2020197485A1 true WO2020197485A1 (fr) 2020-10-01

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WO (1) WO2020197485A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302374A (en) * 1975-10-04 1981-11-24 Akzo N.V. Stable dispersion of positively charged polyfluorocarbon resin particles
JPH01289896A (ja) * 1988-05-16 1989-11-21 Central Glass Co Ltd 含フッ素樹脂分散体
US20040266914A1 (en) * 2002-01-22 2004-12-30 Asahi Glass Company Limited Fluororesin powder coating composition and article having coating film
CN109476897A (zh) * 2016-07-22 2019-03-15 Agc株式会社 液态组合物、以及使用该液态组合物的膜和层叠体的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3060297B2 (ja) * 1998-02-10 2000-07-10 株式会社コスモ総合研究所 樹脂組成物、成形物及び樹脂組成物の製造方法
JP2008115336A (ja) * 2006-11-07 2008-05-22 Du Pont Mitsui Fluorochem Co Ltd 接着性フッ素樹脂複合体組成物
JP6912870B2 (ja) * 2016-07-21 2021-08-04 三菱鉛筆株式会社 熱硬化樹脂組成物、それを用いた絶縁材料組成物
JP6694412B2 (ja) * 2017-06-28 2020-05-13 大陽日酸株式会社 複合樹脂粒子の製造方法、樹脂成形体、及び複合樹脂粒子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302374A (en) * 1975-10-04 1981-11-24 Akzo N.V. Stable dispersion of positively charged polyfluorocarbon resin particles
JPH01289896A (ja) * 1988-05-16 1989-11-21 Central Glass Co Ltd 含フッ素樹脂分散体
US20040266914A1 (en) * 2002-01-22 2004-12-30 Asahi Glass Company Limited Fluororesin powder coating composition and article having coating film
CN109476897A (zh) * 2016-07-22 2019-03-15 Agc株式会社 液态组合物、以及使用该液态组合物的膜和层叠体的制造方法

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CN113455109A (zh) 2021-09-28

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