WO2020186851A1 - 光学基准点的选取方法、系统、计算机存储介质及设备 - Google Patents

光学基准点的选取方法、系统、计算机存储介质及设备 Download PDF

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WO2020186851A1
WO2020186851A1 PCT/CN2019/126505 CN2019126505W WO2020186851A1 WO 2020186851 A1 WO2020186851 A1 WO 2020186851A1 CN 2019126505 W CN2019126505 W CN 2019126505W WO 2020186851 A1 WO2020186851 A1 WO 2020186851A1
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Prior art keywords
image
component
pad
substrate
reference point
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PCT/CN2019/126505
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English (en)
French (fr)
Inventor
钱胜杰
刘丰收
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上海望友信息科技有限公司
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Publication of WO2020186851A1 publication Critical patent/WO2020186851A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/20—Image preprocessing
    • G06V10/24—Aligning, centring, orientation detection or correction of the image
    • G06V10/245—Aligning, centring, orientation detection or correction of the image by locating a pattern; Special marks for positioning

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  • the present invention belongs to the field of electronic manufacturing technology, and relates to a method for selecting a reference point, in particular to a method, a system, a computer storage medium and a device for selecting an optical reference point.
  • Micro-miniature chips are becoming more and more popular for the research and development of electronic products, and the types of chips are also increasing, making micro-assembly and system-in-package (SiP) technology more and more popular.
  • SiP system-in-package
  • the substrate also called the board drawing
  • the substrate will be deformed to different degrees during the mounting and inspection process, which leads to the reduction of the precision of the components or bare chips on the substrate, thus affecting the product the quality of.
  • the traditional technology is to design an optical reference point on the substrate to solve the problem of compensation for the original coordinate value of the substrate deformation and improve the pass rate during product placement.
  • Optical fiducial point also called mark point, Fiducial point, optical reference point, optical positioning point, etc.
  • the numerical compensation of the substrate deformation is solved to the original coordinate value, but this method still has the following problems: 1. Designing an optical reference point on the side of the substrate to compensate the correction coordinate has not reached the micro assembly Accuracy. 2. If a local optical reference point is designed next to the component, there is no space for the optical reference point on the substrate. 3. By designing optical reference points on the substrate, the pass rate of product placement is still less than 100%.
  • the purpose of the present invention is to provide a method, system, computer storage medium and equipment for selecting optical fiducials, which are used to solve the problem that the prior art cannot improve the placement of integrated circuit micro-assembly components.
  • the problem of accuracy is to provide a method, system, computer storage medium and equipment for selecting optical fiducials, which are used to solve the problem that the prior art cannot improve the placement of integrated circuit micro-assembly components. The problem of accuracy.
  • one aspect of the present invention provides a method for selecting optical fiducial points.
  • the method for selecting optical fiducial points includes: acquiring a land image of a component to be mounted in a substrate image; The attributes of the design file corresponding to the substrate image or the pad screening process are detected, and the pad on the substrate image is determined in the pad image as the optical reference point of the component to be mounted; The position of the component to be mounted is determined by the center coordinate of the component to be mounted, and the center coordinate of the component to be mounted is obtained from the coordinate file corresponding to the substrate image.
  • the method for selecting an optical reference point before the step of obtaining a land image of a component to be mounted in a substrate image, the method for selecting an optical reference point further includes: obtaining the circuit of the substrate through a substrate design file The layer and the solder mask are used as the image of the substrate; or the image of the substrate collected by a placement device can be obtained.
  • the step of obtaining a land image of a component to be mounted in a substrate image includes: obtaining the information of the component to be mounted from a coordinate file corresponding to the substrate image Center coordinates; coincide the center coordinates of the components to be mounted with the image center positions of the components to be mounted on the substrate image; execute cyclically to obtain the center coordinates of the components to be mounted and the center of the components.
  • the method for selecting the optical reference point further includes: The rectangular right-angle pads and/or circular pads of the coordinates determine the selection range of the optical reference point.
  • the pads on the substrate image are determined in the pad images as the components of the components to be mounted.
  • the step of optical reference point includes: searching for the existing attributes of the design file; and determining the coordinate information of the pad as the optical reference point according to the existing attributes of the design file.
  • the step of determining the pads on the substrate image in the pad image through the pad screening process as the optical reference point of the component to be mounted includes: According to an automatic selection mechanism, in the coordinate file corresponding to the substrate image, the pin coordinates of the component to be mounted are matched with the position of the pad image of the component to be mounted in the substrate image to match one by one Filter out all the pads covering the components to be mounted, and select no less than two of them as optical reference points; wherein, the center coordinates of the components to be mounted are located in In a rectangular area formed by two pads as diagonal corners; or determine the outer frame area of the component to be mounted according to the automatic selection mechanism, so as to screen out the outer frame area of the component to be mounted one by one For all pads in the range, select no less than two pads as optical reference points; the center coordinates of the components to be mounted are located in a rectangle with no less than two pads as diagonal corners within the area.
  • the system for selecting optical fiducial points includes: a pad extraction module for acquiring a pad image of a component to be mounted in a substrate image; and a selection module, Used to determine the pad on the substrate image in the pad image by detecting the attributes of the design file corresponding to the substrate image or the pad screening process, as an optical reference point for the components to be mounted; Wherein, the position of the component to be mounted is determined by the center coordinate of the component to be mounted, and the center coordinate of the component to be mounted is obtained from the coordinate file corresponding to the substrate image.
  • the optical fiducial point selection system further includes: an acquisition module for acquiring the circuit layer and solder resist layer of the substrate as the substrate image through the substrate design file; or acquiring from a chip placement device The captured image of the substrate.
  • Another aspect of the present invention provides a computer storage medium on which a computer program is stored, and when the computer program is executed by a processor, the method for selecting the optical fiducial point is realized.
  • the last aspect of the present invention provides a device, including: a processor and a memory; the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the device executes the optical reference Point selection method.
  • the present invention can increase the product placement qualification rate (the qualification rate reaches 100%), and make the product raw materials
  • the scrap rate is 0, to avoid the waste of raw materials, shorten the project cycle of products, greatly save costs, improve the reputation of the company, and gain recognition in the industry faster.
  • FIG. 1 is a schematic flowchart of an embodiment of the method for selecting optical fiducial points of the present invention.
  • FIG. 2 shows a schematic diagram of a reference point in an embodiment of the method for selecting an optical reference point of the present invention.
  • FIG. 3 shows a flowchart of the method for selecting optical fiducial points in an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the reference point selection in the second embodiment of the optical reference point selection method of the present invention.
  • FIG. 5 is a schematic diagram of the reference point selection in the third embodiment of the optical reference point selection method of the present invention.
  • FIG. 6 is a schematic diagram of the structure of the method for selecting optical fiducial points in an embodiment of the present invention.
  • optical reference point selection method system, computer storage medium, and equipment of the present invention are as follows: Obtain the pad image of the component to be mounted in a substrate image; check the design file corresponding to the substrate image Property or pad screening process, the pad on the substrate image is determined in the pad image as the optical reference point of the component to be mounted; wherein, the position of the component to be mounted is determined by The center coordinates of the components to be mounted are determined, and the center coordinates of the components to be mounted are obtained from the coordinate file corresponding to the substrate image.
  • This embodiment provides a method for selecting optical fiducial points, and the method for selecting optical fiducial points includes:
  • the pads on the substrate image are determined in the pad images to serve as the optical reference points of the components to be mounted; wherein, The position of the component to be mounted is determined by the center coordinate of the component to be mounted, and the center coordinate of the component to be mounted is obtained from the coordinate file corresponding to the substrate image.
  • FIG. 2 shows a schematic diagram of a reference point in an embodiment of the method for selecting an optical reference point of the present invention.
  • the types of optical fiducial points include: whole-board optical fiducial points 21, single-board optical fiducial points 22 and local optical fiducial points 23.
  • the method for selecting optical fiducial points in this embodiment solves the problem of selecting the local optical fiducial points 23 of the micro-assembled chip in the integrated circuit, and optimizes the selection position of the local optical fiducial points 23.
  • FIG. 1 shows the principle flow chart of the method for selecting optical fiducial points in an embodiment of the present invention. As shown in Fig. 1, the method for selecting the optical reference point specifically includes the following steps:
  • the substrate design files are PCB CAD, Gerber, GDSII and other files, which are derived from EDA design software such as Cadence and Mentor.
  • FIGS. 3 and 4 respectively show the flow chart of the method for selecting optical fiducial points of the present invention in an embodiment and the fiducial point of the method for selecting optical fiducial points of the present invention in the second embodiment.
  • Select the schematic diagram. (1) Take a picture of the actual substrate or import the substrate file. Take pictures through SMT and other equipment to obtain a PCB image 45. Or offline by importing substrate design files, such as the front line layer and solder mask of the Gerber file, the image displayed after importing is basically the same as the real substrate obtained by camera.
  • the S11 includes:
  • S111 Obtain the center coordinates of the component to be mounted from the coordinate file corresponding to the substrate image. As shown in Figure 4, after obtaining the substrate image, obtain the center coordinate 43 of the component U625 to be mounted. You can click the center position of the component to be mounted on the substrate image 45 to obtain the coordinates and angle as the U625 center coordinate 43, or import and align the coordinates with the substrate image 45 through the coordinate file; as shown in Figure 5, the substrate image is obtained Then obtain the center coordinate 53 of the component U628 to be mounted. You can click the center position of the component to be mounted on the substrate image 45 with the mouse to obtain the coordinates and the angle as the U628 center coordinate 53, or import and align the coordinates and the substrate image 45 through a coordinate file.
  • the center coordinates of the components to be mounted are overlapped with the image center positions of the components to be mounted on the substrate image to find the position of the components to be mounted on the substrate image.
  • the center coordinate 43 of U625 in the coordinate file corresponding to the substrate image coincides with the center position of the U625 image on the substrate image 45; as shown in FIG. 5, the coordinate file corresponding to the substrate image
  • the center coordinate 53 of the middle U628 coincides with the center position of the U628 image on the substrate image 45.
  • S113 cyclically execute the step of obtaining the center coordinates of the components to be mounted and the center coordinates of the components coincide with the image center positions of the components, so as to extract the land images of the components to be mounted on the substrate image one by one.
  • all the pads of U625 are extracted according to the center coordinate 43 of U625; as shown in FIG. 5, all the pads of U628 are extracted according to the center coordinate 53 of U628.
  • the selection range of the optical fiducial points is managed in a list and edited in the form of a table, see Table 1 for the classification of optical fiducial points.
  • the optical fiducial points selected by U625 in Figure 4 are two circular pads, and the coordinates of the optical fiducial points are the coordinates of the center of the circular pad; the optical fiducial points selected by U628 in Figure 5 are rectangular pads.
  • the coordinates of the point are the center coordinates of the rectangular pad, the other optical reference point is the right angle 0 pad, and the coordinates of the optical reference point are the coordinates of the intersection point of the right angle.
  • the optical fiducial point pad information determined by the above selection method is managed in a list and edited in the form of a table. Refer to Table 2 for the optical fiducial point information table of U625 and U628.
  • Table 1 Type classification table of optical reference points
  • step S13 includes:
  • S131 Search for the existing attributes of the design file; according to the existing attributes of the design file, determine the coordinate information of the pad as the optical reference point.
  • the existing attribute means that during the substrate design process, for each component, at least two pads are designated as optical reference points, and the designated pads are marked with symbols.
  • the existing attributes in the design file can specify the U625 first optical fiducial point 41 and U625 second optical fiducial point 42 as the optical fiducial point of U625, the intersection of the cross in the figure is the coordinate of the optical fiducial point;
  • S132 Match the pin coordinates of the component to be mounted with the position of the pad image of the component to be mounted in the substrate image in the coordinate file corresponding to the substrate image according to an automatic selection mechanism. Filter out all the pads that cover the components to be mounted one by one, and select no less than two of them as optical reference points; wherein, the center coordinates of the components to be mounted are located in the No less than two pads are in a rectangular area formed by diagonally; or
  • the U625 first optical fiducial point 41 and the U625 second optical fiducial point 42 are automatically selected as the optical fiducial points of U625 through the algorithm of the automatic selection mechanism, and the read-in substrate coordinate file contains the pin coordinates of U625. According to the component pins of component U625, the dozens of overlapping and crossing pads that meet the pin coordinates are screened out. According to the image, select a rectangular frame connected by no less than two pads to include the center coordinates of the components; as shown in Figure 5, the U628 first optical fiducial point 51 and U628 second optical are automatically selected through the algorithm of the automatic selection mechanism
  • the reference point 52 serves as the optical reference point of U628, and the read-in substrate coordinate file contains the pin coordinates of U628. According to the component pins of component U628, the dozens of pads that overlap and intersect with the pin coordinates are screened out. According to the image, select a rectangular frame formed by connecting at least two pads to include the center coordinates of the components.
  • the disk is used as an optical reference point; the center coordinates of the components to be mounted are located in a rectangular area with no less than two pads as diagonal corners.
  • the automatic selection mechanism is a pad screening algorithm, which is based on the matching principle of the pin pad coordinates of each component and the pin pad image position and the component frame limitation The principle is to screen the pads.
  • the U625 first optical fiducial point 41 and U625 second optical fiducial point 42 are automatically selected as the optical fiducial points of the U625 through the algorithm of the automatic selection mechanism.
  • the number in the range Ten pads are screened out.
  • select a rectangular frame connected by no less than two pads to include the center coordinates of the components; as shown in Figure 5, the U628 first optical fiducial point 51 and U628 second optical are automatically selected through the algorithm of the automatic selection mechanism
  • the reference point 52 serves as the optical reference point of the U628.
  • the size of the outer frame 54 of the component U628, dozens of pads in the range are screened out.
  • the optical reference point of the component to be mounted can also be selected by the mouse during the pad screening process.
  • This embodiment provides a computer storage medium on which a computer program is stored, and when the computer program is executed by a processor, the method for selecting the optical fiducial point is realized.
  • a person of ordinary skill in the art can understand that all or part of the steps in the foregoing method embodiments can be implemented by hardware related to a computer program.
  • the aforementioned computer program can be stored in a computer-readable storage computer storage medium.
  • the steps including the foregoing method embodiments are executed; and the foregoing storage computer storage medium includes: ROM, RAM, magnetic disk, or optical disk and other computer storage media that can store program codes.
  • the method for selecting optical fiducial points described in this embodiment can increase the product placement qualification rate (the qualification rate reaches 100%), so that the scrap rate of product raw materials is 0, avoiding the waste of raw materials, shortening the product project cycle, and greatly saving costs , Improve the visibility of the company, and gain recognition in the industry faster.
  • This embodiment provides an optical fiducial point selection system, and the optical fiducial point selection system includes:
  • the pad extraction module is used to obtain the pad image of the component to be mounted in a substrate image
  • the selection module is used to determine the pad on the substrate image in the pad image by detecting the attributes of the design file corresponding to the substrate image or the pad screening process, as the optical component of the component to be mounted Reference point; wherein the position of the component to be mounted is determined by the center coordinate of the component to be mounted, and the center coordinate of the component to be mounted is obtained from the coordinate file corresponding to the substrate image.
  • optical fiducial point selection system provided by this embodiment will be described in detail below in conjunction with the drawings. It should be noted that it should be understood that the division of the various modules of the following selection system is only a division of logical functions, and can be fully or partially integrated into a physical entity in actual implementation, or physically separated. And these modules can all be implemented in the form of software called by processing elements, or all can be implemented in the form of hardware, some modules can be implemented in the form of calling software by processing elements, and some modules can be implemented in the form of hardware.
  • the x module can be a separate processing element, or it can be integrated in a certain chip of the following selection system.
  • the x module can also be stored in the memory of the following selection system in the form of program code, which is called by a certain processing element of the following selection system and executes the function of the following x module.
  • the implementation of other modules is similar. All or part of these modules can be integrated together or implemented independently.
  • the processing element described here may be an integrated circuit with signal processing capability.
  • each step of the above method or each of the following modules can be completed by an integrated logic circuit of hardware in the processor element or instructions in the form of software.
  • the following modules may be one or more integrated circuits configured to implement the above methods, for example: one or more specific integrated circuits (Application Specific Integrated Circuit, ASIC for short), one or more microprocessors (Digital Singnal Processor, DSP for short), one or more Field Programmable Gate Array (FPGA for short), etc.
  • ASIC Application Specific Integrated Circuit
  • DSP Digital Singnal Processor
  • FPGA Field Programmable Gate Array
  • the processing element may be a general-purpose processor, such as a central processing unit (Central Processing Unit, CPU for short) or other processors that can call program codes.
  • CPU Central Processing Unit
  • These modules can be integrated together and implemented in the form of System-on-a-chip (SOC for short).
  • FIG. 6 shows a schematic structural diagram of an optical fiducial point selection method in an embodiment of the present invention.
  • the optical fiducial point selection system 6 includes: an acquisition module 60, a pad extraction module 61, a range limitation module 62 and a selection module 63.
  • the pad extraction module 61 is connected to an acquisition module 60, and the acquisition module 60 is used to acquire the circuit layer and the solder resist layer of the substrate as the substrate image through the substrate design file; or to acquire the substrate image collected by a placement device In this way, the pad extraction module 61 obtains a pad image.
  • the pad extraction module 61 is used to obtain the center coordinates of the components to be mounted from the coordinate file corresponding to the substrate image; and to compare the center coordinates of the components to be mounted on the substrate image The image center positions of the components to be mounted coincide; the steps of obtaining the center coordinates of the components to be mounted and the center coordinates of the components coincide with the image center positions of the components are performed cyclically to extract all the images on the substrate one by one The land image of the component to be mounted.
  • the selection module 63 is used to determine the pad on the substrate image in the pad image by detecting the attributes of the design file corresponding to the substrate image or the pad screening process, as the optical reference for the components to be mounted Point; wherein the position of the component to be mounted is determined by the center coordinate of the component to be mounted, and the center coordinate of the component to be mounted is obtained from the coordinate file corresponding to the substrate image.
  • the range limiting module 62 is used for determining the selection range of the optical reference point according to the rectangular right-angled pad and/or the circular pad with center coordinates on the substrate image.
  • the selection module 63 is used to search for the existing attributes of the design file on the one hand; according to the existing attributes of the design file, determine the coordinate information of the pad as the optical reference point.
  • the existing attribute means that during the substrate design process, for each component, at least two pads are designated as optical reference points, and the designated pads are marked with symbols.
  • the selection module 63 is used to compare the pin coordinates of the component to be mounted with the coordinates of the component to be mounted in the substrate image in the coordinate file corresponding to the substrate image according to an automatic selection mechanism.
  • the positions of the pad images are matched to filter out all the pads covering the components to be mounted one by one, and two of the pads are selected as optical reference points; wherein, the center coordinates of the components to be mounted Are located in a rectangular area formed by two of the pads as diagonal corners; or determine the outer frame area of the components to be mounted according to the automatic selection mechanism, so as to screen out the components to be mounted one by one
  • select two of the pads as optical reference points; the center coordinates of the component to be mounted are located in a rectangular area formed by the two pads as diagonal corners .
  • the automatic selection mechanism is a pad screening algorithm, which is based on the matching principle of the pin pad coordinates of each component and the pin pad image position and the component frame limitation The principle is to screen the pads.
  • the optical reference point selection system described in this embodiment can increase the product placement qualification rate (the qualification rate reaches 100%), so that the scrap rate of product raw materials is 0, avoiding the waste of raw materials, shortening the product project cycle, and greatly saving costs , Improve the visibility of the company, and gain recognition in the industry faster.
  • This embodiment provides a device, including: a processor, a memory, a transceiver, a communication interface or/and a system bus; the memory and the communication interface are connected to the processor and the transceiver through the system bus to complete mutual communication, and the memory is used for The computer program is stored, the communication interface is used to communicate with other devices, and the processor and the transceiver are used to run the computer program, so that the device executes the steps of the optical fiducial point selection method described in the first embodiment.
  • the aforementioned system bus may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus.
  • PCI Peripheral Component Interconnect
  • EISA Extended Industry Standard Architecture
  • the system bus can be divided into address bus, data bus, control bus, etc.
  • the communication interface is used to realize the communication between the database access device and other devices (such as client, read-write library and read-only library).
  • the memory may include random access memory (Random Access Memory, RAM for short), and may also include non-volatile memory (non-volatile memory), such as at least one disk memory.
  • the aforementioned processor may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU for short), a network processor (Network Processor, NP), etc.; it may also be a digital signal processor (Digital Signal Processing, DSP for short) , Application Specific Integrated Circuit (ASIC), Field Programmable Gate Array (FPGA), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components.
  • CPU Central Processing Unit
  • NP Network Processor
  • DSP Digital Signal Processing
  • ASIC Application Specific Integrated Circuit
  • FPGA Field Programmable Gate Array
  • protection scope of the method for selecting optical fiducial points of the present invention is not limited to the order of execution of the steps listed in this embodiment, and all the steps implemented in the prior art based on the principles of the present invention include Within the protection scope of the present invention.
  • the present invention also provides a system for selecting optical fiducial points.
  • the system for selecting optical fiducial points can realize the method for selecting optical fiducial points according to the present invention, but the device for implementing the method for selecting optical fiducial points according to the present invention Including but not limited to the structure of the optical reference point selection system listed in this embodiment, any structural modification and replacement of the prior art made according to the principle of the present invention are included in the protection scope of the present invention.
  • the method, system, computer storage medium, and equipment for selecting optical fiducial points of the present invention can increase the product placement qualification rate (the qualification rate reaches 100%), so that the scrap rate of product raw materials is 0, and the raw materials are avoided. Waste, shorten the project cycle of products, greatly save costs, increase the visibility of the company, and gain recognition in the industry faster.
  • the invention effectively overcomes various shortcomings in the prior art and has high industrial value.

Abstract

本发明提供一种光学基准点的选取方法、系统、计算机存储介质及设备，所述光学基准点的选取方法包括：获取一基板图像中待贴装的元器件的焊盘图像；通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。本发明可提高微组装中将元器件或裸芯片贴装到基板上的精度。

Description

光学基准点的选取方法、系统、计算机存储介质及设备 技术领域
本发明属于电子制造技术领域，涉及一种基准点选取方法，特别是涉及一种光学基准点的选取方法、系统、计算机存储介质及设备。
背景技术
随着电子系统越来越复杂，对电子设备的体积和重量提出了更苛刻的要求。微小型的芯片用于电子产品研发越来越普及，且芯片的种类也越来越多，使得微组装,系统级封装(SiP)技术的越来越普及。从而会出现微组装中将元器件或裸芯片贴装到基板上的精度不高的问题。
出现贴装进度不高的原因主要是在贴装时和检测过程中基板(也称板图)会有不同程度的变形，导致元器件或裸芯片贴装到基板上的精度降低，从而影响产品的质量。
针对以上精度问题传统技术是通过在基板上设计光学基准点，来解决基板变形的数值补偿给原有的坐标值，提高产品贴装时的合格率。
光学基准点，也称做mark点、Fiducial点、光学参考点、光学定位点等等。通过在基板上设计光学基准点来解决基板变形的数值补偿给原有的坐标值，但此方法仍存在以下问题：1、在基板边上设计光学基准点来补偿矫正坐标已经达不到微组装的精度。2、在元器件旁边设计局部光学基准点的话基板没有空间设计光学基准点。3、采用在基板上设计光学基准点，产品贴装的合格率仍然达不到100％。
因此，如何提供一种光学基准点的选取方法、系统、计算机存储介质及设备，以解决现有技术无法提高集成电路微组装元器件的贴装精度等缺陷，成为本领域技术人员亟待解决的技术问题。
发明内容
鉴于以上所述现有技术的缺点，本发明的目的在于提供一种光学基准点的选取方法、系统、计算机存储介质及设备，用于解决现有技术无法提高集成电路微组装元器件的贴装精度的问题。
为实现上述目的及其他相关目的，本发明一方面提供一种光学基准点的选取方法，所述光学基准点的选取方法包括：获取一基板图像中待贴装的元器件的焊盘图像；通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的 焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
于本发明的一实施例中，在所述获取一基板图像中待贴装的元器件的焊盘图像的步骤之前，所述光学基准点的选取方法还包括：通过基板设计文件获取基板的线路层与阻焊层作为基板图像；或获取源于一贴片设备所采集的基板图像。
于本发明的一实施例中，所述获取一基板图像中待贴装的元器件的焊盘图像的步骤包括：从所述基板图像对应的坐标文件中获取所述待贴装的元器件的中心坐标；将所述待贴装的元器件的中心坐标与所述基板图像上待贴装的元器件的图像中心位置重合；循环执行获取待贴装的元器件的中心坐标和元器件的中心坐标与元器件的图像中心位置重合的步骤，以逐一提取所述基板图像上待贴装的元器件的焊盘图像。
于本发明的一实施例中，在所述获取一基板图像中待贴装的元器件的焊盘图像的步骤之后，在通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点的步骤之前，所述光学基准点的选取方法还包括：根据基板图像上具有中心坐标的矩形直角焊盘和/或圆形焊盘，确定所述光学基准点的选取范围。
于本发明的一实施例中，所述通过检测所述基板图像对应的设计文件的属性，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点的步骤包括：查找所述设计文件的已有属性；根据所述设计文件的已有属性，确定作为光学基准点的焊盘的坐标信息。
于本发明的一实施例中，所述通过焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点的步骤包括：根据一自动选取机制在所述基板图像对应的坐标文件中将待贴装的元器件的引脚坐标与所述基板图像中该待贴装的元器件的焊盘图像的位置进行匹配，以逐一筛选出涵盖所述待贴装的元器件的所有焊盘，选取其中不少于两个焊盘作为光学基准点；其中，所述待贴装的元器件的中心坐标位于以所述其中不少于两个焊盘作为对角构成的矩形区域内；或根据所述自动选取机制确定所述待贴装的元器件外框区域范围，以逐一筛选出所述待贴装的元器件外框区域范围内的所有焊盘，选取其中不少于两个焊盘作为光学基准点；所述待贴装的元器件的中心坐标位于以所述其中不少于两个焊盘作为对角构成的矩形区域内。
本发明另一方提供一种光学基准点的选取系统，所述光学基准点的选取系统包括：焊盘 提取模块，用于获取一基板图像中待贴装的元器件的焊盘图像；选取模块，用于通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
于本发明的一实施例中，所述光学基准点的选取系统还包括：获取模块，用于通过基板设计文件获取基板的线路层与阻焊层作为基板图像；或获取源于一贴片设备所采集的基板图像。
本发明又一方面提供一种计算机存储介质，其上存储有计算机程序，该计算机程序被处理器执行时实现所述光学基准点的选取方法。
本发明最后一方面提供一种设备，包括：处理器及存储器；所述存储器用于存储计算机程序，所述处理器用于执行所述存储器存储的计算机程序，以使所述设备执行所述光学基准点的选取方法。
如上所述，本发明所述的光学基准点的选取方法、系统、计算机存储介质及设备，具有以下有益效果：本发明可以提高产品贴装合格率(合格率达到100％)，使得产品原材料的报废率为0，避免原材料的浪费，缩短产品的项目周期，大幅度节约成本，提高企业的知名度，更快的获得行业内的认可。
附图说明
图1显示为本发明的光学基准点的选取方法于一实施例中的原理流程图。
图2显示为本发明的光学基准点的选取方法于一实施例中的基准点示意图。
图3显示为本发明的光学基准点的选取方法于一实施例中的流程操作图。
图4显示为本发明的光学基准点的选取方法于实施例二中的基准点选取示意图。
图5显示为本发明的光学基准点的选取方法于实施例三中的基准点选取示意图。
图6显示为本发明的光学基准点的选取方法于一实施例中的结构原理图。
元件标号说明
2        光学基准点的选取系统
21       整板光学基准点
22       单板光学基准点
23         局部光学基准点
41         U625第一光学基准点
42         U625第二光学基准点
43         U625中心坐标
44         U625外框
45         基板图像
51         U628第一光学基准点
52         U628第二光学基准点
53         U628中心坐标
54         U628外框
6          光学基准点的选取系统
60         获取模块
61         焊盘提取模块
62         范围限定模块
63         选取模块
S10～S13   光学基准点的选取方法步骤
具体实施方式
以下通过特定的具体实例说明本发明的实施方式，本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用，本说明书中的各项细节也可以基于不同观点与应用，在没有背离本发明的精神下进行各种修饰或改变。需说明的是，在不冲突的情况下，以下实施例及实施例中的特征可以相互组合。
需要说明的是，以下实施例中所提供的图示仅以示意方式说明本发明的基本构想，遂图式中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的型态、数量及比例可为一种随意的改变，且其组件布局型态也可能更为复杂。
本发明所述光学基准点的选取方法、系统、计算机存储介质及设备的技术原理如下：获取一基板图像中待贴装的元器件的焊盘图像；通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所 述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
实施例一
本实施例提供一种光学基准点的选取方法，所述光学基准点的选取方法包括：
获取一基板图像中待贴装的元器件的焊盘图像；
通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
以下将结合图示对本实施例所提供的光学基准点的选取方法进行详细描述。
请参阅图2，显示为本发明的光学基准点的选取方法于一实施例中的基准点示意图。如图2所示，光学基准点种类包括：整板光学基准点21、单板光学基准点22和局部光学基准点23。本实施例所述光学基准点的选取方法解决集成电路中微组装芯片的局部光学基准点23的选取问题，并对局部光学基准点23的选取位置进行优化。请参阅图1，显示为本发明的光学基准点的选取方法于一实施例中的原理流程图。如图1所示，所述光学基准点的选取方法具体包括以下几个步骤：
S10，通过基板设计文件获取整个基板的线路层与阻焊层作为基板图像；或获取源于一贴片设备所采集的基板图像。所述基板设计文件为PCB CAD、Gerber、GDSII等文件，来源于Cadence，Mentor等EDA设计软件。
具体地，请参阅图3和图4，分别显示为本发明的光学基准点的选取方法于一实施例中的流程操作图和本发明的光学基准点的选取方法于实施例二中的基准点选取示意图。(1)对基板进行实物基板拍照或者导入基板文件。通过SMT等设备拍照，获取基板(PCB)图像45。或者离线通过导入基板设计文件，比如Gerber文件的正面线路层和阻焊层，导入后显示的图像基本和摄像获得的真实基板一致。
S11，获取一基板图像中待贴装的元器件的焊盘图像。
所述S11包括：
S111，从所述基板图像对应的坐标文件中获取所述待贴装的元器件的中心坐标。如图4所示，获得基板图像后获取待贴装的元器件U625中心坐标43。可以通过鼠标点击基板图像45上待贴装的元器件的中心位置获取坐标和角度作为U625中心坐标43，也可以通过坐标文件导入并且对齐坐标和基板图像45；如图5所示，获得基板图像后获取待贴装的元器件U628中心坐标53。可以通过鼠标点击基板图像45上待贴装的元器件的中心位置获取坐标 和角度作为U628中心坐标53，也可以通过坐标文件导入并且对齐坐标和基板图像45。
S112，将所述待贴装的元器件的中心坐标与所述基板图像上待贴装的元器件的图像中心位置重合，以找到基板图像上待贴装的元器件的位置。如图4所示，将所述基板图像对应的坐标文件中U625中心坐标43与所述基板图像45上U625的图像的中心位置重合；如图5所示，将所述基板图像对应的坐标文件中U628中心坐标53与所述基板图像45上U628的图像的中心位置重合。
S113，循环执行获取待贴装的元器件的中心坐标和元器件的中心坐标与元器件的图像中心位置重合的步骤，以逐一提取所述基板图像上待贴装的元器件的焊盘图像。如图4所示，根据U625中心坐标43提取U625的所有焊盘；如图5所示，根据U628中心坐标53提取U628的所有焊盘。
S12，根据基板图像上具有中心坐标的矩形直角焊盘和/或圆形焊盘，确定所述光学基准点的选取范围，进而执行步骤S13。
具体地，将所述光学基准点的选取范围进行列表管理，并以表格形式编辑，参见表1光学基准点的类型分类表。图4中U625选取的光学基准点为两个圆形焊盘，其光学基准点的坐标为圆形焊盘的圆心坐标；图5中U628选取的一个光学基准点为矩形焊盘，其光学基准点的坐标为矩形焊盘的中心坐标，另一个光学基准点为直角0焊盘，其光学基准点的坐标为直角的交点位置坐标。将上述选取方法确定的光学基准点焊盘信息进行列表管理，并以表格形式编辑，参见表2为U625和U628的光学基准点信息表。
表1：光学基准点的类型分类表
Figure PCTCN2019126505-appb-000001
表2：U625的光学基准点信息表
Figure PCTCN2019126505-appb-000002
Figure PCTCN2019126505-appb-000003
S13，通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
在本实施例中，步骤S13包括：
S131，查找所述设计文件的已有属性；根据所述设计文件的已有属性，确定作为光学基准点的焊盘的坐标信息。在本实施例中，所述已有属性是指基板设计过程中，针对每一个元器件，指定至少两个焊盘作为光学基准点，并对指定的焊盘进行符号标记。
参阅图4，设计文件中已有属性可指定U625第一光学基准点41和U625第二光学基准点42作为U625的光学基准点，图中十字交叉的交点为光学基准点的坐标；如图5所示，设计文件中已有属性可指定U628第一光学基准点51为光学基准点，类型为矩形，图中十字交叉的交点为光学基准点的坐标，获得尺寸x＝0.5mm，y＝0.25mm。光学基准点坐标为：x＝16.925mm，y＝33.948mm。设计文件中已有属性可指定U628第二光学基准点52为光学基准点，类型直角0，获得尺寸x＝0.5mm，y＝0.25mm。光学基准点坐标为：x＝16.925mm，y＝33.948mm。
S132，根据一自动选取机制在所述基板图像对应的坐标文件中将待贴装的元器件的引脚坐标与所述基板图像中该待贴装的元器件的焊盘图像的位置进行匹配，以逐一筛选出涵盖所述待贴装的元器件的所有焊盘，选取其中不少于两个焊盘作为光学基准点；其中，所述待贴装的元器件的中心坐标位于以所述其中不少于两个焊盘作为对角构成的矩形区域内；或
具体地，通过自动选取机制的算法自动筛选U625第一光学基准点41和U625第二光学基准点42作为U625的光学基准点，读入的基板坐标文件里有U625的引脚坐标。根据元器 件U625的元器件引脚，将和引脚坐标碰到的、重叠交叉的几十个焊盘都筛选出来。根据图像选取不少于两个焊盘连成的矩形框将元器件中心坐标包含在内；如图5所示，通过自动选取机制的算法自动筛选U628第一光学基准点51和U628第二光学基准点52作为U628的光学基准点，读入的基板坐标文件里有U628的引脚坐标。根据元器件U628的元器件引脚，将和引脚坐标碰到的、重叠交叉的几十个焊盘都筛选出来。根据图像选取不少于两个焊盘连成的矩形框将元器件中心坐标包含在内。
根据所述自动选取机制确定所述待贴装的元器件外框区域范围，以逐一筛选出所述待贴装的元器件外框区域范围内的所有焊盘，选取其中不少于两个焊盘作为光学基准点；所述待贴装的元器件的中心坐标位于以所述其中不少于两个焊盘作为对角构成的矩形区域内。
在本实施例中，所述自动选取机制为一焊盘筛选算法，所述焊盘筛选算法根据每一元器件的引脚焊盘坐标与引脚焊盘图像位置的匹配原则和元器件外框限定原则对焊盘进行筛选处理。
继续参阅图4，通过自动选取机制的算法自动筛选U625第一光学基准点41和U625第二光学基准点42作为U625的光学基准点，根据元器件U625外框44的大小，将范围内的几十个焊盘都筛选出来。根据图像选取不少于两个焊盘连成的矩形框将元器件中心坐标包含在内；如图5所示，通过自动选取机制的算法自动筛选U628第一光学基准点51和U628第二光学基准点52作为U628的光学基准点，根据元器件U628外框54的大小，将范围内的几十个焊盘都筛选出来。根据图像选取不少于两个焊盘连成的矩形框将元器件中心坐标包含在内。
在本实施例中，所述焊盘筛选处理时还可通过鼠标选取待贴装元器件的光学基准点。
本实施例提供一种计算机存储介质，其上存储有计算机程序，该计算机程序被处理器执行时实现所述光学基准点的选取方法。
本领域普通技术人员可以理解：实现上述各方法实施例的全部或部分步骤可以通过计算机程序相关的硬件来完成。前述的计算机程序可以存储于一计算机可读存储计算机存储介质中。该程序在执行时，执行包括上述各方法实施例的步骤；而前述的存储计算机存储介质包括：ROM、RAM、磁碟或者光盘等各种可以存储程序代码的计算机存储介质。
本实施例所述光学基准点的选取方法可以提高产品贴装合格率(合格率达到100％)，使得产品原材料的报废率为0，避免原材料的浪费，缩短产品的项目周期，大幅度节约成本，提高企业的知名度，更快的获得行业内的认可。
实施例二
本实施例提供一种光学基准点的选取系统，所述光学基准点的选取系统包括：
焊盘提取模块，用于获取一基板图像中待贴装的元器件的焊盘图像；
选取模块，用于通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
以下将结合图示对本实施例所提供的光学基准点的选取系统进行详细描述。需要说明的是，应理解以下选取系统的各个模块的划分仅仅是一种逻辑功能的划分，实际实现时可以全部或部分集成到一个物理实体上，也可以物理上分开。且这些模块可以全部以软件通过处理元件调用的形式实现，也可以全部以硬件的形式实现，还可以部分模块通过处理元件调用软件的形式实现，部分模块通过硬件的形式实现。例如：x模块可以为单独设立的处理元件，也可以集成在下述选取系统的某一个芯片中实现。此外，x模块也可以以程序代码的形式存储于下述选取系统的存储器中，由下述选取系统的某一个处理元件调用并执行以下x模块的功能。其它模块的实现与之类似。这些模块全部或部分可以集成在一起，也可以独立实现。这里所述的处理元件可以是一种集成电路，具有信号的处理能力。在实现过程中，上述方法的各步骤或以下各个模块可以通过处理器元件中的硬件的集成逻辑电路或者软件形式的指令完成。
以下这些模块可以是被配置成实施以上方法的一个或多个集成电路，例如：一个或多个特定集成电路(Application Specific Integrated Circuit，简称ASIC)，一个或多个微处理器(Digital Singnal Processor，简称DSP)，一个或者多个现场可编程门阵列(Field Programmable Gate Array，简称FPGA)等。当以下某个模块通过处理元件调用程序代码的形式实现时，该处理元件可以是通用处理器，如中央处理器(Central Processing Unit，简称CPU)或其它可以调用程序代码的处理器。这些模块可以集成在一起，以片上系统(System-on-a-chip，简称SOC)的形式实现。
请参阅图6，显示为本发明的光学基准点的选取方法于一实施例中的结构原理图。如图6所示，所述光学基准点的选取系统6包括：获取模块60、焊盘提取模块61、范围限定模块62和选取模块63。
所述焊盘提取模块61连接一获取模块60，所述获取模块60用于通过基板设计文件获取基板的线路层与阻焊层作为基板图像；或获取源于一贴片设备所采集的基板图像，所述焊盘提取模块61以此来获取焊盘图像。
所述焊盘提取模块61用于从所述基板图像对应的坐标文件中获取所述待贴装的元器件的中心坐标；将所述待贴装的元器件的中心坐标与所述基板图像上待贴装的元器件的图像中心位置重合；循环执行获取待贴装的元器件的中心坐标和元器件的中心坐标与元器件的图像中心位置重合的步骤，以逐一提取所述基板图像上所有待贴装的元器件的焊盘图像。
利用选取模块63通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
在本实施例中，范围限定模块62用于根据基板图像上具有中心坐标的矩形直角焊盘和/或圆形焊盘，确定所述光学基准点的选取范围。
在本实施例中，所述选取模块63一方面用于查找所述设计文件的已有属性；根据所述设计文件的已有属性，确定作为光学基准点的焊盘的坐标信息。所述已有属性是指基板设计过程中，针对每一个元器件，指定至少两个焊盘作为光学基准点，并对指定的焊盘进行符号标记。
所述选取模块63另一方面用于根据一自动选取机制在所述基板图像对应的坐标文件中将待贴装的元器件的引脚坐标与所述基板图像中该待贴装的元器件的焊盘图像的位置进行匹配，以逐一筛选出涵盖所述待贴装的元器件的所有焊盘，选取其中两个焊盘作为光学基准点；其中，所述待贴装的元器件的中心坐标位于以所述其中两个焊盘作为对角构成的矩形区域内；或根据所述自动选取机制确定所述待贴装的元器件外框区域范围，以逐一筛选出所述待贴装的元器件外框区域范围内的所有焊盘，选取其中两个焊盘作为光学基准点；所述待贴装的元器件的中心坐标位于以所述其中两个焊盘作为对角构成的矩形区域内。
在本实施例中，所述自动选取机制为一焊盘筛选算法，所述焊盘筛选算法根据每一元器件的引脚焊盘坐标与引脚焊盘图像位置的匹配原则和元器件外框限定原则对焊盘进行筛选处理。
本实施例所述光学基准点的选取系统可以提高产品贴装合格率(合格率达到100％)，使得产品原材料的报废率为0，避免原材料的浪费，缩短产品的项目周期，大幅度节约成本，提高企业的知名度，更快的获得行业内的认可。
实施例三
本实施例提供一种设备，包括：处理器、存储器、收发器、通信接口或/和系统总线；存储器和通信接口通过系统总线与处理器和收发器连接并完成相互间的通信，存储器用于存 储计算机程序，通信接口用于和其他设备进行通信，处理器和收发器用于运行计算机程序，使所述设备执行如实施例一所述光学基准点的选取方法的各个步骤。
上述提到的系统总线可以是外设部件互连标准(Peripheral Component Interconnect，简称PCI)总线或扩展工业标准结构(Extended Industry Standard Architecture，简称EISA)总线等。该系统总线可以分为地址总线、数据总线、控制总线等。通信接口用于实现数据库访问装置与其他设备(如客户端、读写库和只读库)之间的通信。存储器可能包含随机存取存储器(Random Access Memory，简称RAM)，也可能还包括非易失性存储器(non-volatile memory)，例如至少一个磁盘存储器。
上述的处理器可以是通用处理器，包括中央处理器(Central Processing Unit，简称CPU)、网络处理器(Network Processor，简称NP)等；还可以是数字信号处理器(Digital Signal Processing，简称DSP)、专用集成电路(Application Specific Integrated Circuit，简称ASIC)、现场可编程门阵列(Field Programmable Gate Array，简称FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。
本发明所述的光学基准点的选取方法的保护范围不限于本实施例列举的步骤执行顺序，凡是根据本发明的原理所做的现有技术的步骤增减、步骤替换所实现的方案都包括在本发明的保护范围内。
本发明还提供一种光学基准点的选取系统，所述光学基准点的选取系统可以实现本发明所述的光学基准点的选取方法，但本发明所述的光学基准点的选取方法的实现装置包括但不限于本实施例列举的光学基准点的选取系统的结构，凡是根据本发明的原理所做的现有技术的结构变形和替换，都包括在本发明的保护范围内。
综上所述，本发明所述光学基准点的选取方法、系统、计算机存储介质及设备可以提高产品贴装合格率(合格率达到100％)，使得产品原材料的报废率为0，避免原材料的浪费，缩短产品的项目周期，大幅度节约成本，提高企业的知名度，更快的获得行业内的认可。本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (10)

  1. 一种光学基准点的选取方法，其特征在于，所述光学基准点的选取方法包括：
    获取一基板图像中待贴装的元器件的焊盘图像；
    通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
  2. 根据权利要求1所述的光学基准点的选取方法，其特征在于，在所述获取一基板图像中待贴装的元器件的焊盘图像的步骤之前，所述光学基准点的选取方法还包括：
    通过基板设计文件获取基板的线路层与阻焊层作为基板图像；或
    获取源于一贴片设备所采集的基板图像。
  3. 根据权利要求1所述的光学基准点的选取方法，其特征在于，所述获取一基板图像中待贴装的元器件的焊盘图像的步骤包括：
    从所述基板图像对应的坐标文件中获取所述待贴装的元器件的中心坐标；
    将所述待贴装的元器件的中心坐标与所述基板图像上待贴装的元器件的图像中心位置重合；
    循环执行获取待贴装的元器件的中心坐标和元器件的中心坐标与元器件的图像中心位置重合的步骤，以逐一提取所述基板图像上待贴装的元器件的焊盘图像。
  4. 根据权利要求1所述的光学基准点的选取方法，其特征在于，所述通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点的步骤之前，所述光学基准点的选取方法还包括：
    根据基板图像上具有中心坐标的矩形直角焊盘和/或圆形焊盘，确定所述光学基准点的选取范围。
  5. 根据权利要求4所述的光学基准点的选取方法，其特征在于，所述通过检测所述基板图像对应的设计文件的属性，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点的步骤包括：
    查找所述设计文件的已有属性；
    根据所述设计文件的已有属性，确定作为光学基准点的焊盘的坐标信息。
  6. 根据权利要求4所述的光学基准点的选取方法，其特征在于，所述通过焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点的 步骤包括：
    根据自动选取机制在所述基板图像对应的坐标文件中将待贴装的元器件的引脚坐标与所述基板图像中该待贴装的元器件的焊盘图像的位置进行匹配，以逐一筛选出涵盖所述待贴装的元器件的所有焊盘，选取其中不少于两个焊盘作为光学基准点；其中，所述待贴装的元器件的中心坐标位于以所述其中不少于两个焊盘作为对角构成的矩形区域内；或
    根据所述自动选取机制确定所述待贴装的元器件外框区域范围，以逐一筛选出所述待贴装的元器件外框区域范围内的所有焊盘，选取其中不少于两个焊盘作为光学基准点；所述待贴装的元器件的中心坐标位于以所述其中不少于两个焊盘作为对角构成的矩形区域内。
  7. 一种光学基准点的选取系统，其特征在于，所述光学基准点的选取系统包括：
    焊盘提取模块，用于获取一基板图像中待贴装的元器件的焊盘图像；
    选取模块，用于通过检测所述基板图像对应的设计文件的属性或焊盘筛选处理，在所述焊盘图像中确定所述基板图像上的焊盘，以作为待贴装的元器件的光学基准点；其中，所述待贴装的元器件的位置由该待贴装的元器件的中心坐标确定，所述待贴装的元器件的中心坐标由所述基板图像对应的坐标文件获知。
  8. 根据权利要求7所述的光学基准点的选取系统，其特征在于，所述光学基准点的选取系统还包括：
    获取模块，用于通过基板设计文件获取基板的线路层与阻焊层作为基板图像；或获取源于一贴片设备所采集的基板图像。
  9. 一种计算机存储介质，其上存储有计算机程序，其特征在于，该程序被处理器执行时实现权利要求1至6任一项所述光学基准点的选取方法。
  10. 一种设备，其特征在于，包括：处理器及存储器；
    所述存储器用于存储计算机程序，所述处理器用于执行所述存储器存储的计算机程序，以使所述设备执行如权利要求1至6中任一项所述光学基准点的选取方法。
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