WO2020168619A1 - 一种oled显示面板 - Google Patents

一种oled显示面板 Download PDF

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Publication number
WO2020168619A1
WO2020168619A1 PCT/CN2019/080962 CN2019080962W WO2020168619A1 WO 2020168619 A1 WO2020168619 A1 WO 2020168619A1 CN 2019080962 W CN2019080962 W CN 2019080962W WO 2020168619 A1 WO2020168619 A1 WO 2020168619A1
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WO
WIPO (PCT)
Prior art keywords
layer
metal layer
hole
display panel
oled display
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PCT/CN2019/080962
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English (en)
French (fr)
Inventor
李文齐
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/467,047 priority Critical patent/US11462598B2/en
Publication of WO2020168619A1 publication Critical patent/WO2020168619A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the present invention relates to the field of display technology, in particular to an OLED display panel.
  • the basic principle of fingerprint recognition technology under the optical screen is that when a finger touches a specific area of the screen, the light emitted by the OLED is reflected by the finger, passes through the OLED panel, and reaches the photoelectric sensor placed on the back of the panel. The photoelectric sensor compares and recognizes the use User’s fingerprint information to unlock the OLED display.
  • An OLED display panel including:
  • a second metal layer provided on the display device board
  • An insulating layer disposed on the display device board and covering the second metal layer;
  • a flat layer provided on the light blocking layer
  • the second metal layer includes a source/drain metal layer, and the layer structure between the source/drain metal layer and the anode metal layer is provided with an electrical connection for the source/drain metal layer and the anode metal layer Lap holes.
  • the lap hole includes a first via hole penetrating the planarization layer, and a second via hole disposed on the insulating layer and extending to the surface of the source/drain metal layer.
  • the via hole communicates with the second via hole.
  • the aperture of the first via is larger than the aperture of the second via.
  • the orthographic projection of the first via on the second metal layer includes the orthographic projection of the second via on the second metal layer.
  • the light blocking layer is made of conductive metal
  • the second metal layer further includes a first high-potential source line spaced apart from the source and drain metal layer
  • the insulating layer is provided with a The third via hole on the surface of the first high potential source line, the light blocking layer is electrically connected to the first high potential source line through the third via hole.
  • the light blocking layer is made of conductive metal, and the light blocking layer includes a first split body and a second split body that are independent of each other; the lap hole includes an extending and extending hole provided on the flat layer.
  • a connecting hole is electrically connected with the first sub-body, and the first sub-body is electrically connected with the source/drain metal layer through the second connecting hole.
  • the second metal layer further includes a second high-potential source line, a third connection hole extending to the surface of the second high-potential source line is provided on the insulating layer, and the second split body passes through the The third connection hole is electrically connected to the second high-potential source line.
  • orthographic projection of the first connecting hole on the second metal layer and the orthographic projection of the second connecting hole on the second metal layer are independent of each other.
  • the lap hole extends from the top surface of the flat layer to the surface of the source and drain metal layer; the light blocking layer is provided with a through hole, and the aperture of the through hole is larger than the lap hole And the lap hole penetrates the through hole.
  • the through hole and the hole are formed before forming the flat layer, and the lap hole is made by a single manufacturing process.
  • the display device board includes:
  • a semiconductor layer provided on the substrate
  • a first gate insulating layer provided on the semiconductor layer
  • a second gate metal layer and an interlayer dielectric layer are arranged on the second gate insulating layer, and the second metal layer is arranged on the interlayer dielectric layer.
  • the light barrier layer is used to block the passage of stray light in the environment to prevent the interference of stray light, thereby accurately identifying fingerprints.
  • the light barrier layer is used to electrically connect the high potential source line to improve the uniformity of the high potential source line. It also improves the process yield and reduces the number of photomasks.
  • FIG. 1 is a schematic structural diagram of an OLED display panel in Embodiment 1 of the present invention.
  • FIG. 2 is a schematic diagram of the structure of an OLED display panel in the second embodiment of the present invention.
  • FIG. 3 is a schematic diagram of the positions of the first connecting hole and the second connecting hole in the second embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of an OLED display panel in the third embodiment of the present invention.
  • 5 to 7 are schematic diagrams of the manufacturing process of the OLED display panel in the third embodiment of the present invention.
  • Source and drain metal layer 22. First high-potential source line; 23. Second high-potential source line;
  • the present invention aims at the existing optical under-screen fingerprint identification display panel.
  • a finger touches the screen the light is irradiated on the finger and diffusely reflected.
  • the light reflected by the finger and the stray light in the environment are received by the photoelectric sensor, resulting in It is difficult to accurately identify the technical problem of fingerprints.
  • the present invention can solve the above-mentioned problems.
  • the OLED display panel includes a display device board 10, and a second metal layer, an insulating layer 30, a light blocking layer 40, and a flat panel which are sequentially stacked on the display device board 10.
  • Layer 50 The OLED display panel.
  • the insulating layer 30 is arranged on the display device board 10 and covers the second metal layer.
  • the insulating layer 30 is made of materials including but not limited to silicon nitride and silicon oxide.
  • the light blocking layer 40 is disposed on the insulating layer 30, and the light blocking layer 40 is provided with holes 41 for the light reflected by the finger to pass through, and the holes 41 are evenly distributed.
  • the display device panel A photoelectric sensor 102 that receives light passing through the hole 41 is provided on a side of 10 away from the second metal layer.
  • the OLED display panel has a fingerprint recognition area corresponding to the photoelectric sensor 102.
  • the flat layer 50 is disposed on the light blocking layer 40, and the OLED display panel further includes an anode metal layer 61 and a pixel definition layer 70 disposed on the flat layer 50; on the anode metal layer 61 A light emitting device layer 62 is provided, a cathode metal layer 63 is provided on the light emitting device layer 62, and an encapsulation layer 80 is provided on the cathode metal layer 63.
  • the display device panel 10 includes a substrate 11, a buffer layer 12, a semiconductor layer 13 disposed on the substrate 11, a first gate insulating layer 14 disposed on the semiconductor layer 13, and The first gate metal layer 15 and the second gate insulating layer 16 on the first gate insulating layer 14, and the second gate metal layer 17 and the interlayer provided on the second gate insulating layer 16
  • the dielectric layer 18, and the second metal layer is disposed on the interlayer dielectric layer 18.
  • the second metal layer includes a source-drain metal layer 21, the semiconductor layer 13 includes an active island, and the source-drain metal layer 21 is connected to the doped region 131 on the active island; the source and drain
  • the layer structure between the metal layer 21 and the anode metal layer 61 is provided with a lap hole 90 for electrically connecting the source/drain metal layer 21 and the anode metal layer 61.
  • the light emitted by the light source is irradiated on the finger and then reflected.
  • the light reflected by the finger passes through the hole 41 on the light barrier layer 40, and then passes through other layers and is received by the photoelectric sensor 102.
  • the light barrier layer 40 is used to block the environment.
  • the astigmatic light passes through to prevent the interference of stray light, so as to accurately identify the fingerprint.
  • the lap hole 90 includes a first via 91 penetrating through the planarization layer 50, and a second via provided on the insulating layer 30 and extending to the surface of the source and drain metal layer 21 92.
  • the first via 91 is in communication with the second via 92.
  • the aperture of the first via 91 is larger than the aperture of the second via 92, and the axis of the first via 91 coincides with the axis of the second via 92,
  • the orthographic projection of the first via 91 along the thickness direction of the source/drain metal layer 21 on the second metal layer includes the thickness of the second via 92 along the source/drain metal layer 21 Orthographic projection of the projection of the direction on the second metal layer.
  • the anode metal layer 61 in the anode metal layer 61 is electrically connected to the source and drain metal layer 21 through the first via 91 and the second via 92; the first via 91 and the second via 92 are sleeve holes, and The aperture of the first via 91 is larger than the aperture of the second via 92, which saves a plane area and facilitates high-resolution design.
  • the light blocking layer 40 is made of conductive metal
  • the second metal layer further includes a first high potential source line 22
  • the insulating layer 30 is provided with a surface extending to the first high potential source line 22
  • the light blocking layer 40 is electrically connected to the first high potential source line 22 through the third via hole 93.
  • the light blocking layer 40 By electrically connecting the light blocking layer 40 to the first high-potential source line 22, while the light blocking layer 40 is used to block stray light, the light blocking layer 40 is used as a high-potential source line, thereby increasing the uniformity of the high-potential source line. Sex.
  • An OLED display panel as shown in FIG. 2, is different from the first embodiment in that the arrangement of the overlap hole 90 and the light blocking layer 40 is different.
  • the light blocking layer 40 is made of conductive metal, and the light blocking layer 40 includes a first part 43 and a second part 44 that are independent of each other;
  • the overlap hole 90 includes a A first connection hole 94 on the flat layer 50 and extending to the surface of the first sub-body 43, and a second connection hole provided on the insulating layer 30 and extending to the surface of the source and drain metal layer 21 95;
  • the anode metal layer 61 is electrically connected to the first split body 43 through the first connection hole 94, and the first split body 43 is connected to the source and drain metal layer through the second connection hole 95 21 Electrical connection.
  • the second metal layer further includes a second high-potential source line 23, and the insulating layer 30 is provided with a third connection hole 96 extending to the surface of the second high-potential source line 23, and the second split body 44 is electrically connected to the second high potential source line 23 through the third connection hole 96.
  • the first split body 43 serves as the connection point between the anode metal layer 61 and the semiconductor layer 13, and the second split body 44 isolated from the first split body 43 serves as a high-potential source line to increase the conductivity of the high-potential source line. Uniformity.
  • the orthographic projection of the first connection hole 94 along the thickness direction of the source and drain metal layer 21 on the second metal layer is the same as the second connection hole 95 along the line.
  • the orthographic projections of the thickness direction of the source and drain metal layer 21 on the second metal layer are independent of each other.
  • An OLED display panel as shown in FIG. 4, is different from the first embodiment in that the arrangement of the overlap hole 90 and the light blocking layer 40 is different.
  • the lap hole 90 extends from the top surface of the flat layer 50 to the surface of the source and drain metal layer 21; the light blocking layer 40 is provided with a through hole 42 whose aperture is It is larger than the aperture of the overlap hole 90, and the overlap hole 90 passes through the through hole 42.
  • the through hole 42 and the hole 41 are formed before the flat layer 50 is formed, and the overlap hole 90 is made by a single manufacturing process.
  • the overlap hole 90 is integrally formed and can be made by only one manufacturing process, which reduces the manufacturing process and saves costs.
  • the flat layer 50 is also provided with a signal electrode 101 made by a process with the anode metal layer 61, the light blocking layer 40 is made of conductive metal, and the signal electrode 101 is connected to a high potential source line and light A connection via is provided between the barrier layers 40, and the signal electrode 101 is simultaneously electrically connected to the high potential source line and the light barrier layer 40 through the connection via.
  • FIG. 5 to FIG. 7 are schematic diagrams of the manufacturing process of the OLED display panel.
  • an insulating layer 30, and a light blocking layer 40 are sequentially formed on the display device board 10, a through hole 42 and the hole are formed at a predetermined position on the second metal layer 41.
  • a flat layer 50 is formed on the light blocking layer 40, and an overlap hole 90 and a connection via hole are formed on the flat layer 50 through a process.
  • an anode metal layer 61, a pixel definition layer 70 and an encapsulation layer 80 are formed on the flat layer 50, and the anode metal layer 61 fills the overlap hole 90.
  • the light blocking layer 40 is used to block the passage of stray light in the environment to prevent the stray light from interfering, thereby accurately identifying fingerprints, and at the same time using the light blocking layer 40 to electrically connect the high-potential source line , Improve the conductivity of the high-potential source line.

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  • Chemical & Material Sciences (AREA)
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Abstract

本发明提供一种OLED显示面板，包括显示器件板、设置在显示器件板上的第二金属层以及绝缘层、设置在绝缘层上的光线阻隔层、设置在光线阻隔层上的平坦层、设置在平坦层上的阳极金属层；光线阻隔层上开设有孔洞；其中，第二金属层包括源漏金属层，源漏金属层与阳极金属层之间的层结构上开设有供源漏金属层与阳极金属层电性连接的搭接孔。

Description

一种OLED显示面板 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED显示面板。
 背景技术
随着全面屏手机需求的旺盛，光学式屏下指纹识别技术，因其部分克服了电容式指纹识别技术的弱点，又适用于全面屏，成为近年最热门的前沿技术研发课题。光学式屏下指纹识别技术的基本原理是手指触摸屏幕特定区域时，利用OLED发出的光线经手指反射后，穿过OLED面板，到达面板背面放置的光电传感器，经过光电传感器比对并识别出使用者的指纹信息，来解锁OLED显示器。
然而，在光学式屏下指纹识别显示面板中，手指触摸屏幕时，光线照射在手指上后发生漫反射，手指反射的光线与环境中的杂散光线一起被光电传感器接收，从而导致很难对指纹进行准确的识别。
 技术问题
在光学式屏下指纹识别显示面板中，手指触摸屏幕时，光线照射在手指上后发生漫反射，手指反射的光线与环境中的杂散光线一起被光电传感器接收，从而导致很难对指纹进行准确的识别。
 技术解决方案
一种OLED显示面板，包括：
显示器件板；
设置在所述显示器件板上的第二金属层；
设置在所述显示器件板上且覆盖所述第二金属层的绝缘层；
设置在所述绝缘层上的光线阻隔层，所述光线阻隔层上开设有多个供被手指反射的光线通过的孔洞，所述显示器件板远离所述第二金属层的一侧设置有接收通过孔洞的光线的光电传感器；
设置在所述光线阻隔层上的平坦层；
设置在所述平坦层上的阳极金属层以及像素定义层；
其中，所述第二金属层包括源漏金属层，所述源漏金属层与所述阳极金属层之间的层结构上开设有供所述源漏金属层与所述阳极金属层电性连接的搭接孔。
进一步的，所述搭接孔包括贯穿所述平坦层的第一过孔，以及，设置在所述绝缘层上且延伸到所述源漏金属层的表面的第二过孔，所述第一过孔与所述第二过孔连通。
进一步的，所述第一过孔的孔径大于所述第二过孔的孔径。
进一步的，所述第一过孔在所述第二金属层上的正投影包纳所述第二过孔在所述第二金属层上的正投影。
进一步的，所述光线阻隔层由导电金属制成，所述第二金属层还包括与所述源漏金属层间隔设置的第一高电位源线，所述绝缘层上设置有延伸到所述第一高电位源线的表面的第三过孔，所述光线阻隔层通过所述第三过孔与所述第一高电位源线电性连接。
进一步的，所述光线阻隔层由导电金属制成，并且，所述光线阻隔层包括相互独立的第一分体和第二分体；所述搭接孔包括设置在所述平坦层上且延伸到所述第一分体的表面的第一连接孔，以及，设置在所述绝缘层上且延伸到所述源漏金属层的表面的第二连接孔；所述阳极金属层通过所述第一连接孔与所述第一分体电性连接，所述第一分体通过所述第二连接孔与所述源漏金属层电性连接。
进一步的，所述第二金属层还包括第二高电位源线，所述绝缘层上设置有延伸到第二高电位源线的表面的第三连接孔，所述第二分体通过所述第三连接孔与所述第二高电位源线电性连接。
进一步的，所述第一连接孔在所述第二金属层上的正投影与所述第二连接孔在所述第二金属层上的正投影相互独立。
进一步的，所述搭接孔由所述平坦层的顶面延伸到所述源漏金属层的表面；所述光线阻隔层上开设有通孔，所述通孔的孔径大于所述搭接孔的孔径，并且，所述搭接孔穿过所述通孔。
进一步的，形成所述平坦层之前形成所述通孔和所述孔洞，所述搭接孔通过一道制程制成。
进一步的，所述显示器件板包括：
基板；
设置在所述基板上的半导体层；
设置在所述半导体层上的第一栅极绝缘层；
设置在所述第一栅极绝缘层上的第一栅极金属层和第二栅极绝缘层；以及
设置在所述第二栅极绝缘层上的第二栅极金属层和层间介质层，所述第二金属层设置在所述层间介质层上。
 有益效果
利用光线阻隔层阻挡环境中的杂散光线通过，防止杂散光线产生干扰，从而对指纹进行准确的识别，同时利用光线阻隔层与高电位源线电性连接，提高高电位源线的导电均匀性，同时提高工艺良率，减少光罩数量。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例一中OLED显示面板的结构示意图；
图2为本发明实施例二中OLED显示面板的结构示意图；
图3为本发明实施例二中第一连接孔与第二连接孔的位置示意图；
图4为本发明实施例三中OLED显示面板的结构示意图；
图5至图7为本发明实施例三中OLED显示面板的制作流程示意图。
附图标记：
10、显示器件板；11、基板；12、缓冲层；13、半导体层；131、掺杂区；14、第一栅极绝缘层；15、第一栅极金属层；16、第二栅极绝缘层；17、第二栅极金属层；18、层间介质层；
21、源漏金属层；22、第一高电位源线；23、第二高电位源线；
30、绝缘层；
40、光线阻隔层；41、孔洞；42、通孔；43、第一分体；44、第二分体；
50、平坦层；
61、阳极金属层；62、发光器件层；63、阴极金属层；
70、像素定义层；80、封装层；
90、搭接孔；91、第一过孔；92、第二过孔；93、第三过孔；94、第一连接孔；95、第二连接孔；96、第三连接孔；
101、信号电极；102、光电传感器。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的光学式屏下指纹识别显示面板中，手指触摸屏幕时，光线照射在手指上后发生漫反射，手指反射的光线与环境中的杂散光线一起被光电传感器接收，从而导致很难对指纹进行准确识别的技术问题。本发明可以解决上述问题。
实施例一：
一种OLED显示面板，如图1所示，所述OLED显示面板包括显示器件板10以及依次层叠设置在所述显示器件板10上的第二金属层、绝缘层30、光线阻隔层40和平坦层50。
其中，所述绝缘层30设置在所述显示器件板10上且覆盖所述第二金属层，所述绝缘层30的制成材料包括但不限于氮化硅和氧化硅。
所述光线阻隔层40设置在所述绝缘层30上，所述光线阻隔层40上开设有供被手指反射的光线通过的孔洞41，所述孔洞41均匀分布有多个，所述显示器件板10远离所述第二金属层的一侧设置有接收通过孔洞41的光线的光电传感器102，所述OLED显示面板具有与光电传感器102对应的指纹识别区。
其中，所述平坦层50设置在所述光线阻隔层40上，所述OLED显示面板还包括设置在所述平坦层50上的阳极金属层61以及像素定义层70；所述阳极金属层61上设置有发光器件层62，所述发光器件层62上设置有阴极金属层63，所述阴极金属层63上设置有封装层80。
具体的，所述显示器件板10包括基板11、缓冲层12、设置在所述基板11上的半导体层13、设置在所述半导体层13上的第一栅极绝缘层14、设置在所述第一栅极绝缘层14上的第一栅极金属层15和第二栅极绝缘层16，以及，设置在所述第二栅极绝缘层16上的第二栅极金属层17和层间介质层18，所述第二金属层设置在所述层间介质层18上。
其中，所述第二金属层包括源漏金属层21，所述半导体层13包括有源岛，所述源漏金属层21与所述有源岛上的掺杂区131连接；所述源漏金属层21与所述阳极金属层61之间的层结构上开设有供所述源漏金属层21与所述阳极金属层61电性连接的搭接孔90。
光源发出的光线照射在手指上后发生反射，手指反射的光线透过光线阻隔层40上的孔洞41，再透光其他层结构后被光电传感器102接收，利用光线阻隔层40阻挡环境中的杂散光线通过，防止杂散光线产生干扰，从而对指纹进行准确的识别。
具体的，所述搭接孔90包括贯穿所述平坦层50的第一过孔91，以及，设置在所述绝缘层30上且延伸到所述源漏金属层21的表面的第二过孔92，所述第一过孔91与所述第二过孔92连通。
进一步的，所述第一过孔91的孔径大于所述第二过孔92的孔径，并且，所述第一过孔91的轴心线与所述第二过孔92的轴心线重合，所述第一过孔91沿所述源漏金属层21的厚度方向的投影在所述第二金属层上的正投影包纳所述第二过孔92沿所述源漏金属层21的厚度方向的投影在所述第二金属层上的正投影。
所述阳极金属层61中的阳极金属层61通过第一过孔91和第二过孔92与源漏金属层21电性连接；第一过孔91和第二过孔92为套孔，并且第一过孔91的孔径比第二过孔92的孔径大，节省了平面面积，有利于高分辨率设计。
具体的，所述光线阻隔层40由导电金属制成，所述第二金属层还包括第一高电位源线22，所述绝缘层30上设置有延伸到第一高电位源线22的表面的第三过孔93，所述光线阻隔层40通过所述第三过孔93与所述第一高电位源线22电性连接。
通过将光线阻隔层40与第一高电位源线22电性连接，利用光线阻隔层40阻挡杂散光线的同时，利用光线阻隔层40充当高电位源线，从而增加高电位源线的导电均匀性。
实施例二：
一种OLED显示面板，如图2所示，其与实施例一的不同之处在于搭接孔90和光线阻隔层40的设置不同。
具体的，所述光线阻隔层40由导电金属制成，并且，所述光线阻隔层40包括相互独立的第一分体43和第二分体44；所述搭接孔90包括设置在所述平坦层50上且延伸到所述第一分体43的表面的第一连接孔94，以及，设置在所述绝缘层30上且延伸到所述源漏金属层21的表面的第二连接孔95；所述阳极金属层61通过所述第一连接孔94与所述第一分体43电性连接，所述第一分体43通过所述第二连接孔95与所述源漏金属层21电性连接。
其中，所述第二金属层还包括第二高电位源线23，所述绝缘层30上设置有延伸到第二高电位源线23的表面的第三连接孔96，所述第二分体44通过所述第三连接孔96与所述第二高电位源线23电性连接。
通过第一分体43充当阳极金属层61与半导体层13之间的连接点，同时利用与第一分体43相互隔离的第二分体44充当高电位源线，增加高电位源线的导电均匀性。
如图3所示，进一步的，所述第一连接孔94沿所述源漏金属层21的厚度方向的投影在所述第二金属层上的正投影与所述第二连接孔95沿所述源漏金属层21的厚度方向的投影在所述第二金属层上的正投影相互独立。
防止在挖连接孔的时候有平坦层50残留在连接孔中，提高了制程工艺良率。
实施例三：
一种OLED显示面板，如图4所示，其与实施例一的不同之处在于搭接孔90和光线阻隔层40的设置不同。
具体的，所述搭接孔90由所述平坦层50的顶面延伸到所述源漏金属层21的表面；所述光线阻隔层40上开设有通孔42，所述通孔42的孔径大于所述搭接孔90的孔径，并且，所述搭接孔90穿过所述通孔42。
其中，形成所述平坦层50之前形成所述通孔42和所述孔洞41，所述搭接孔90通过一道制程制成。
搭接孔90一体成型，只需通过一道制程即可制成，减少制造工序，节约成本。
其中，所述平坦层50上还设置有与阳极金属层61通过一道制程制成的信号电极101，所述光线阻隔层40由导电金属制成，所述信号电极101与高电位源线和光线阻隔层40之间设置有连接过孔，所述信号电极101通过连接过孔同时与高电位源线和光线阻隔层40电性连接。
如图5至图7所示，图5至图7为OLED显示面板制作流程示意图。
如图5所示，在所述显示器件板10上依次形成第二金属层、绝缘层30和光线阻隔层40后，在第二金属层上的预设位置处形成通孔42和所述孔洞41。
如图6所示，在所述光线阻隔层40上形成平坦层50，并在平坦层50上通过一道制程形成搭接孔90和连接过孔。
如图7所示，在平坦层50上形成阳极金属层61，像素定义层70和封装层80，所述阳极金属层61填充搭接孔90。
本发明的有益效果为：利用光线阻隔层40阻挡环境中的杂散光线通过，防止杂散光线产生干扰，从而对指纹进行准确的识别，同时利用光线阻隔层40与高电位源线电性连接，提高高电位源线的导电均匀性。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (11)

  1. 一种OLED显示面板，其中，所述OLED显示面板包括：
    显示器件板；
    设置在所述显示器件板上的第二金属层；
    设置在所述显示器件板上且覆盖所述第二金属层的绝缘层；
    设置在所述绝缘层上的光线阻隔层，所述光线阻隔层上开设有多个供被手指反射的光线通过的孔洞，所述显示器件板远离所述第二金属层的一侧设置有接收通过孔洞的光线的光电传感器；
    设置在所述光线阻隔层上的平坦层；
    设置在所述平坦层上的阳极金属层以及像素定义层；
    其中，所述第二金属层包括源漏金属层，所述源漏金属层与所述阳极金属层之间的层结构上开设有供所述源漏金属层与所述阳极金属层电性连接的搭接孔。
  2. 根据权利要求1所述的OLED显示面板，其中，所述搭接孔包括贯穿所述平坦层的第一过孔，以及，设置在所述绝缘层上且延伸到所述源漏金属层的表面的第二过孔，所述第一过孔与所述第二过孔连通。
  3. 根据权利要求2所述的OLED显示面板，其中，所述第一过孔的孔径大于所述第二过孔的孔径。
  4. 根据权利要求3所述的OLED显示面板，其中，所述第一过孔在所述第二金属层上的正投影包纳所述第二过孔在所述第二金属层上的正投影。
  5. 根据权利要求2所述的OLED显示面板，其中，所述光线阻隔层由导电金属制成，所述第二金属层还包括与所述源漏金属层间隔设置的第一高电位源线，所述绝缘层上设置有延伸到所述第一高电位源线的表面的第三过孔，所述光线阻隔层通过所述第三过孔与所述第一高电位源线电性连接。
  6. 根据权利要求1所述的OLED显示面板，其中，所述光线阻隔层由导电金属制成，并且，所述光线阻隔层包括相互独立的第一分体和第二分体；所述搭接孔包括设置在所述平坦层上且延伸到所述第一分体的表面的第一连接孔，以及，设置在所述绝缘层上且延伸到所述源漏金属层的表面的第二连接孔；所述阳极金属层通过所述第一连接孔与所述第一分体电性连接，所述第一分体通过所述第二连接孔与所述源漏金属层电性连接。
  7. 根据权利要求6所述的OLED显示面板，其中，所述第二金属层还包括第二高电位源线，所述绝缘层上设置有延伸到第二高电位源线的表面的第三连接孔，所述第二分体通过所述第三连接孔与所述第二高电位源线电性连接。
  8. 根据权利要求6述的OLED显示面板，其中，所述第一连接孔在所述第二金属层上的正投影与所述第二连接孔在所述第二金属层上的正投影相互独立。
  9. 根据权利要求1所述的OLED显示面板，其中，所述搭接孔由所述平坦层的顶面延伸到所述源漏金属层的表面；所述光线阻隔层上开设有通孔，所述通孔的孔径大于所述搭接孔的孔径，并且，所述搭接孔穿过所述通孔。
  10. 根据权利要求9所述的OLED显示面板，其中，形成所述平坦层之前形成所述通孔和所述孔洞，所述搭接孔通过一道制程制成。
  11. 根据权利要求1所述的OLED显示面板，其中，所述显示器件板包括：
    基板；
    设置在所述基板上的半导体层；
    设置在所述半导体层上的第一栅极绝缘层；
    设置在所述第一栅极绝缘层上的第一栅极金属层和第二栅极绝缘层；以及
    设置在所述第二栅极绝缘层上的第二栅极金属层和层间介质层，所述第二金属层设置在所述层间介质层上。
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