WO2020158155A1 - Dispositif de détection - Google Patents

Dispositif de détection Download PDF

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Publication number
WO2020158155A1
WO2020158155A1 PCT/JP2019/046770 JP2019046770W WO2020158155A1 WO 2020158155 A1 WO2020158155 A1 WO 2020158155A1 JP 2019046770 W JP2019046770 W JP 2019046770W WO 2020158155 A1 WO2020158155 A1 WO 2020158155A1
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WO
WIPO (PCT)
Prior art keywords
hot junction
opening
detection device
heater
thermocouple
Prior art date
Application number
PCT/JP2019/046770
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English (en)
Japanese (ja)
Inventor
隆 笠井
幸志 桃谷
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オムロン株式会社
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Publication of WO2020158155A1 publication Critical patent/WO2020158155A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity

Definitions

  • the present invention relates to a detection device.
  • Patent Documents 1-4 A technique is disclosed in which a cavity is provided inside the substrate and an element is arranged in the opening of the cavity on the substrate surface (for example, Patent Documents 1-4). If the element is a thermocouple in the art, the technology can detect the flow rate of the fluid. Further, in Patent Document 5, a technique for correcting the difference between the temperature of the portion of the substrate on which the cold junction of the first thermocouple is mounted and the temperature of the portion of the substrate on which the cold junction of the second thermocouple is mounted. Is disclosed.
  • the detection device 31 includes a heater 32 in the central portion. Further, the detection device 31 includes thermopiles 33A and 33B symmetrically provided on both sides of the heater 32 around the heater 32. Further, the thermopile 33A includes a first hot junction 34A and a first cold junction 35A. Further, the thermopile 33B includes a second hot junction 34B and a second cold junction 35B. The detection device 31 also includes a film 36 that covers the heater 32 and the thermopiles 33A and 33B. The detection device 31 also includes a substrate 37 on which a film 32 including the heater 32 and the thermopiles 33A and 33B is provided.
  • the substrate 37 has a cavity 38, and an opening 39 of the cavity 38 is formed on the surface thereof.
  • the heater 32 is arranged in the central portion of the opening 39.
  • the first hot junction 34A and the second hot junction 34B are arranged inside the opening 9.
  • the first cold junction 35A and the second cold junction 35B are arranged on the substrate 37 outside the opening 39.
  • thermopile 33A the temperature difference between the temperature of the first hot junction 34A and the temperature of the first cold junction 35A and the temperature difference between the temperature of the second hot junction 34B and the temperature of the second cold junction 35B are substantially the same.
  • thermopile 33B there is no difference between the output of the thermopile 33A and the output of the thermopile 33B.
  • the heat from the heater 32 is affected by the flow of the fluid and spreads symmetrically around the heater 32.
  • thermopile 33B the temperature difference between the temperature of the first hot junction 34A and the temperature of the first cold junction 35A is different from the temperature difference between the temperature of the second hot junction 34B and the temperature of the second cold junction 35B.
  • the flow rate of the fluid can be calculated based on the difference between the output of the thermopile 33A and the output of the thermopile 33B.
  • the dimension of the cavity 38 including the opening 39 formed in the substrate 37 may possibly include an error.
  • the temperature of the portion of the substrate 37 where the first cold junction 35A is arranged and the second temperature The temperature of the portion of the substrate 37 where the cold junction 35B is arranged may be different.
  • the temperature of the first cold junction 35A on the upstream side may be different from the temperature of the second cold junction 35B on the downstream side.
  • the accuracy of the fluid flow rate obtained based on the outputs of the thermopiles 33A and 33B may be reduced.
  • the temperature of the portion of the substrate 37 on which the first cold junction 35A is arranged and the temperature of the portion of the substrate 37 on which the second cold junction 35B is arranged It is considered that the difference in temperature between the two substrates 37 can be corrected by providing a temperature sensor on the substrate 37.
  • the detection device 31 has a complicated structure.
  • the inventor of the present invention has a cavity inside the substrate, the heater is arranged in the central portion of the opening, the hot junctions of the two thermopiles provided so as to sandwich the heater are arranged inside the opening, and the cold junction is formed. It has been found that the accuracy of detecting the flow rate of the fluid may be reduced when the is placed on the substrate outside the opening. The present inventor has also found that the structure of the device is complicated in order to correct the output of the thermocouple.
  • the present invention in one aspect, has been made in view of such circumstances, and an object thereof is to have a cavity inside a substrate and to arrange a thermocouple in an opening of the cavity on the surface of the substrate.
  • the present invention adopts the following configurations in order to solve the above problems.
  • the detection device a substrate having a cavity opened in a part of the surface, a thin film layer provided on the surface of the substrate to cover the opening, provided in the thin film layer, A heater having a substantially linear shape, and a thermocouple string formed by connecting a plurality of thermocouples provided in the thin film layer in series, in each thermocouple in the thermocouple string, A first hot junction and a second hot junction are arranged in a direction perpendicular to the longitudinal direction of the heater, and output based on the temperature of the first hot junction and the temperature difference of the second hot junction. Is generated, and the first hot junction and the second hot junction are arranged inside the opening when viewed from the normal direction of the opening.
  • the difference between the temperature of the first hot junction and the temperature of the second hot junction is substantially the same when the fluid is not flowing, and is different when the fluid is flowing. Can be formed. Therefore, there is a difference in the output of the thermocouple between when the fluid is not flowing and when the fluid is flowing. Also, the difference in the output from the thermocouple changes depending on the flow rate of the fluid. That is, the flow rate of the fluid can be obtained based on the difference in the output from the thermocouple.
  • the 1st hot junction and the 2nd hot junction of a thermocouple are arrange
  • the length of the thermocouple is changed, and the first hot junction and the first hot junction are connected. There is no need to adjust so that the two hot junctions straddle the edge of the opening. That is, even if the size of the cavity is changed, it is possible to prevent the output of the thermocouple from varying without changing the length of the thermocouple. Further, even if the size of the substrate varies, the substrate can be used in the detection device, and the frequency of discarding the substrate is reduced. Therefore, the productivity of the substrate is improved.
  • thermocouple when a cold junction is arranged on the substrate, heat moves from the thermocouple to the substrate via the cold junction. Therefore, it may be necessary to increase the distance between the hot junction and the cold junction to store heat in the electric wire between the hot junction and the cold junction.
  • the cold junction is not arranged on the substrate, and the first hot junction and the second hot junction are arranged inside the opening, so that heat is suppressed from moving to the substrate. In other words, the distance of the thermocouple can be shortened. Therefore, miniaturization of the detection device is realized.
  • thermocouple since the thermocouple is not arranged across the edge of the opening, the heat generated by the heater is suppressed from moving through the thermocouple to the substrate. Therefore, heat loss is reduced. Further, since the heat transfer to the substrate is suppressed, the reduction of the distributed heat amount is suppressed. Therefore, the flow rate of the fluid can be detected even when the flow velocity of the fluid is high and the heat is easily removed by the fluid. That is, it is possible to improve the sensitivity of the thermocouple to changes in the flow rate of the fluid and reduce the consumed current.
  • thermopile only one thermopile is required. Therefore, the structure is simplified and the cost is reduced. Further, the defect occurrence rate is also reduced.
  • the thin film layer includes a hole that communicates the outside of the system with the edge of the opening, and the edge of the opening is inside the opening when viewed from the normal direction of the opening. In the longitudinal direction of the thermocouple, it may be a region outside the first hot junction and/or the second hot junction.
  • thermocouple heat transfer between the substrate and the thermocouple can be suppressed.
  • the heat remains in the portion of the membrane where the heater is arranged, and fluctuations in the output from the thermocouple are suppressed. That is, downsizing of the detection device is realized.
  • one of the heaters is arranged in a central portion of the opening in a direction perpendicular to a longitudinal direction of the heater, and the thermocouple includes the first hot junction and the second hot junction.
  • the contacts may be arranged symmetrically about the heater and across the heater.
  • the width of the portion where the heater and the thermocouple are arranged can be narrowed. That is, downsizing of the detection device is realized.
  • thermocouple when viewed from the normal direction of the opening, the first hot junction and the second hot junction, the center of the opening in the longitudinal direction of the thermocouple.
  • the heater is arranged so as to be symmetrical with respect to a portion, and the heater has a first hot junction and a second hot junction in a direction perpendicular to the longitudinal direction when viewed from the normal direction of the opening. It may be arranged at the center of the portion between them, and with respect to the normal direction of the opening, it may be arranged on the opposite side of the cavity with the thermocouple array interposed therebetween.
  • the heater can be arranged at a place closer to the part where the fluid flows. Therefore, the amount of heat distributed in the portion where the fluid flows becomes large. Therefore, the flow rate of the fluid can be detected even when the flow velocity of the fluid is high and the heat is easily removed by the fluid. That is, it is possible to form a detection device having high sensitivity to the flow of fluid.
  • thermocouple in the longitudinal direction, the first hot junction and the second hot junction, when viewed from the normal direction of the opening, in the central portion of the opening.
  • the heater is disposed symmetrically with respect to the first hot junction and/or the second hot junction of the thermocouple in a direction perpendicular to the longitudinal direction of the heater when viewed from the normal direction of the opening. It may be arranged outside the hot junction side by side with the thermocouple.
  • the heater and the thermocouple are provided side by side. That is, in the process of forming the detection device, the heater and the thermocouple can be formed together. That is, the process of forming the detection device is simplified.
  • thermocouple is arranged at the opening of the cavity on the surface of the substrate, the decrease in accuracy of detecting the flow rate of the fluid is suppressed by the simple structure.
  • Technology can be provided.
  • FIG. 1 schematically illustrates an example of an outline of a cross-sectional view of a conventional detection device.
  • FIG. 2A schematically illustrates an example of the outline of a top view of the detection device according to the embodiment.
  • FIG. 2B schematically illustrates an example of the outline of the cross-sectional view of the detection device according to the embodiment.
  • FIG. 3A schematically illustrates an example of temperature distribution when a fluid is not flowing.
  • FIG. 3B schematically illustrates an example of temperature distribution when a fluid is flowing.
  • FIG. 4 is a flowchart illustrating an example of a method for forming the detection device according to the embodiment.
  • FIG. 5 schematically illustrates one step of the method for forming the detection device.
  • FIG. 6 schematically illustrates one step of the method for forming the detection device.
  • FIG. 5 schematically illustrates one step of the method for forming the detection device.
  • FIG. 7 schematically illustrates one step of the method for forming the detection device.
  • FIG. 8 schematically illustrates one step of the method for forming the detection device.
  • FIG. 9 schematically illustrates one step of the method for forming the detection device.
  • FIG. 10 schematically illustrates one step of the method for forming the detection device.
  • FIG. 11 schematically illustrates one step of the method for forming the detection device.
  • FIG. 12A schematically illustrates an example of an outline of a top view of a detection device according to a modified example of the present embodiment.
  • FIG. 12B schematically illustrates an example of an outline of a cross-sectional view of a detection device according to a modified example of the present embodiment.
  • FIG. 12A schematically illustrates an example of an outline of a top view of a detection device according to a modified example of the present embodiment.
  • FIG. 12B schematically illustrates an example of an outline of a cross-sectional view of a detection device according to a modified example of the present embodiment.
  • FIG. 13 schematically illustrates an example of a cross-sectional view of a detection device according to a modified example of the embodiment.
  • FIG. 14A schematically illustrates an example of the outline of a top view detection device according to a modification of the embodiment.
  • FIG. 14B schematically illustrates an example of an outline of a cross-sectional view of a detection device according to a modified example of the embodiment.
  • this embodiment an embodiment according to one aspect of the present invention (hereinafter, also referred to as “this embodiment”) will be described with reference to the drawings.
  • the present embodiment described below is merely an example of the present invention in all respects. It goes without saying that various improvements and modifications can be made without departing from the scope of the present invention. That is, in implementing the present invention, a specific configuration according to the embodiment may be appropriately adopted.
  • FIG. 2A and 2B schematically illustrate an example of an outline of the detection device 1 according to the present embodiment.
  • FIG. 2A shows an example of a top view of the detection device 1.
  • 2B is an example of a cross-sectional view of the detection device 1 and is a cross-sectional view taken along the line AA in FIG. 2A.
  • the detection device 1 includes a linear heater 2 in the central portion.
  • the detection device 1 includes a thermopile 3 which is symmetrically arranged so as to straddle the heater 2 around the heater 2.
  • the heater 2 is an example of the "heater” of the present invention.
  • the thermopile 3 has a plurality of thermocouples connected in series and is an example of the “thermocouple array” of the present invention.
  • the thermopile 3 also includes a first hot junction 4 and a second hot junction 5.
  • the detection device 1 also includes a film 6 that covers the first hot junction 4 and the second hot junction 5.
  • the film 6 also covers the heater 2.
  • the film 6 is formed of, for example, a silicon oxide film or a silicon nitride film.
  • the first hot junction 4 is an example of the "first hot junction” in the present invention.
  • the second hot junction 5 is an example of the "second hot junction” in the present invention.
  • the film 6 is an example of the “thin film layer” in the present invention.
  • the detection device 1 also includes a substrate 7 on which a film 6 including a heater 2 and a thermopile 3 is arranged.
  • the substrate 7 is made of single crystal silicon. Further, the substrate 7 has a cavity 8, and an opening 9 communicating with the cavity 8 is formed on the surface thereof. The cavity 8 and the opening 9 are symmetrical with respect to the vertical direction in FIG.
  • the heater 2 is arranged in the central portion of the opening 9 in the left-right direction.
  • the thermopile 3 including the first hot junction 4 and the second hot junction 5 is arranged inside the opening 9. That is, the first hot junction 4 and the second hot junction 5 of the thermopile 3 are not arranged on the substrate outside the opening 9, but symmetrically arranged inside the heater 2 as viewed from the normal direction of the opening 9. To be done.
  • the direction from the first hot junction 4 to the second hot junction 5 (the longitudinal direction of the thermocouple) is the direction in which the heat generated by the heater 2 moves as the fluid flows.
  • FIG. 3A schematically illustrates an example of the temperature distribution when the heater 2 is energized in the state where the fluid is not flowing.
  • FIG. 3B schematically illustrates an example of the temperature distribution when the heater 2 is energized while the fluid is flowing.
  • the heat generated by the heater 2 diffuses symmetrically around the heater 2. Therefore, the same as the temperature T D_hot temperature T U_hot a second hot junction 5 of the first hot junction 4. That is, the output of the thermopile 3 does not occur.
  • thermopile 3 in proportion to the temperature difference. Further, since the temperature difference increases according to the flow velocity, the magnitude of the flow velocity can be detected by the magnitude of the electromotive force of the thermopile 3. Further, the positive/negative of the temperature difference between the first hot junction 4 and the second hot junction 5 is reversed depending on the flowing direction of the fluid, and the positive/negative of the electromotive force is also reversed, so that the flowing direction of the fluid can be detected.
  • FIG. 4 is a flowchart illustrating an example of a forming process of the detection device 1 according to this embodiment. Note that the processing procedure described below is merely an example, and each processing may be changed as much as possible. Further, in the processing procedure described below, steps can be omitted, replaced, and added as appropriate according to the embodiment.
  • FIG. 5 schematically illustrates an example of the outline of the process in step S101.
  • the substrate 7 is prepared.
  • the silicon oxide film 10 is formed on the entire surface of the substrate 7.
  • the portion of the cavity 8 that becomes the opening 9 is removed by etching or the like.
  • the silicon oxide film 10 in the central portion of the portion where the heater 2 is to be formed, which is to be the opening 9, is left without being removed. Further, the silicon oxide film 10 becomes a part of the film 6.
  • FIG. 6 schematically illustrates an example of the outline of the process in step S102.
  • the polysilicon layer 11 is formed in the portion where the silicon oxide film 10 has been removed.
  • the polysilicon layer 11 is formed so as to extend to the surface portion 12 of the silicon oxide film 10 surrounding the portion where the silicon oxide film 10 has been removed. Further, the polysilicon layer 11 is also formed on the surface of the silicon oxide film 10 where the heater 2 is formed and is used as the heater 2.
  • FIG. 7 schematically illustrates an example of the outline of the process in step S103.
  • the thermopile 3 is formed so as to straddle the heater 2.
  • FIG. 8 schematically illustrates an example of the outline of the process in step S104.
  • the casing film 13 that protects the thermopile 3 when the cavity 8 is formed by etching the substrate 7 (described later) is provided. Further, the casing film 13 is formed so as to maintain its strength even when the cavity 8 is formed below the heater 2 and the thermopile 3. Further, the casing film 13 becomes a part of the film 6.
  • FIG. 9 schematically illustrates an example of the outline of the process in step S105.
  • the etching hole 14 is provided so as to penetrate the housing film 13.
  • the etching hole 14 allows the outside of the system and the polysilicon layer 11 to communicate with each other.
  • FIG. 10 schematically illustrates an example of the outline of the process in step S106.
  • a corrosive agent that corrodes the polysilicon layer 11 and the substrate 7 is supplied from the etching hole 14.
  • the corrosive agent is, for example, TMAH (TetrAmethyl Ammonium hydroxide) liquid.
  • TMAH TetrAmethyl Ammonium hydroxide
  • the polysilicon layer 11 is formed of a polycrystal of silicon, it has a property that corrosion proceeds isotropically by the TMAH liquid. That is, the polysilicon layer 11 isotropically corrodes in the mounting surface direction of the substrate 7. Further, the TMAH liquid also penetrates into the substrate 7 through the polysilicon layer 11. Then, the substrate 7 is also corroded.
  • FIG. 11 schematically illustrates an example of the outline of the process in step S107.
  • the corrosion of the TMAH solution proceeds to the polysilicon layer 11 existing on the surface portion 12 of the silicon oxide film 10, and the gap 17 is formed.
  • the substrate 7 is corroded to a desired depth to form the cavity 8. Then, the supply of the TMAH liquid from the etching hole 14 is stopped.
  • the polysilicon layer 11 has a property that corrosion proceeds isotropically by the TMAH liquid. Therefore, the variation in the size of the cavity 8 is suppressed. Further, variations in the dimensions of the gap 17 are also suppressed. In other words, the variation in the area of the casing film 13 exposed in the cavity 8 is suppressed. Therefore, variations in the degree to which the heat in the cavity is transferred to the casing film 13 are suppressed. That is, it is possible to prevent the temperature of the first hot junction 4 and the temperature of the second hot junction 5 from varying depending on how the cavity is formed. Therefore, when the flow rate of the fluid is obtained based on the difference in the output from the thermopile 3, the variation in the obtained flow rate is suppressed.
  • the temperature of the first hot junction 4 and the temperature of the second hot junction 5 are substantially the same when the fluid is not flowing, and are different when the fluid is flowing. Therefore, there is a difference in the output of the thermopile 3 depending on whether the fluid is flowing or not. Further, the difference in the output from the thermopile 3 changes depending on the flow rate of the fluid. Therefore, the flow rate of the fluid can be acquired based on the difference in the output from the thermopile 3.
  • the first hot junction 4 and the second hot junction 5 of the thermopile 3 are arranged inside the opening 9. Therefore, heat transfer from the substrate 7 to the first hot junction 4 or the second hot junction 5 is suppressed. Therefore, the output of the thermopile 3 is suppressed from being influenced by the temperature of the substrate 7. Further, the influence of the temperature outside the substrate 7 or the temperature of the fluid flowing near the substrate 7 is reduced. That is, a decrease in the accuracy of the output of the thermopile 3 is suppressed. Therefore, the accuracy of the flow rate of the fluid obtained by using the output of the thermopile 3 is increased.
  • the length of the thermopile 3 is changed even when the size of the cavity 8 formed by the variation in the size generated when the substrate 7 is manufactured is changed. It is not necessary to adjust the hot junction 4 and the second hot junction 5 so as to straddle the edge of the opening 9. That is, even when the size of the cavity 8 is changed, it is possible to suppress variations in the output of the thermopile 3 without changing the length of the thermopile 3. Further, even if the dimensions of the substrate 7 vary, the substrate 7 can be used in the detection device 1, and the frequency of discarding the substrate 7 is reduced. As a result, the productivity of the substrate 7 is improved.
  • thermopile when a cold junction of the thermopile is arranged on the substrate as shown in FIG. 1, heat moves from the thermopile to the substrate via the cold junction. Therefore, it may be necessary to increase the distance between the hot junction and the cold junction to store heat in the electric wire between the hot junction and the cold junction.
  • the cold junction is not arranged on the substrate 7, and the first hot junction 4 and the second hot junction 5 are arranged inside the opening 9. Therefore, transfer of heat to the substrate 7 is suppressed. In other words, the distance of the thermopile 3 can be shortened. Therefore, miniaturization of the detection device 1 is realized.
  • thermopile 3 since the thermopile 3 is not arranged so as to straddle the edge of the opening 9, the heat generated by the heater 2 is suppressed from being transferred to the substrate 7 through the thermopile 3. .. Therefore, heat loss is reduced. Moreover, since the heat transfer to the substrate 7 is suppressed, the reduction of the distributed heat amount is suppressed. Therefore, the flow rate of the fluid can be detected even when the flow velocity of the fluid is high and the heat is easily removed by the fluid. That is, it is possible to improve the sensitivity of the thermopile 3 against changes in the flow rate of the fluid and reduce the consumed current.
  • thermopile 3 only one thermopile 3 is required. Therefore, the structure is simplified and the cost is reduced. Moreover, the electric circuit is simplified. Further, when the thermopile 3 is wire-bonded to another element or wiring, the number of wires used for wire-bonding can be reduced. In addition, since the number of thermopiles is reduced, the defect occurrence rate is reduced.
  • the width of the portion where the heater 2 and the thermopile 3 are arranged can be narrowed. That is, miniaturization of the detection device 1 is realized.
  • 12A and 12B show an example of an outline of a detection device 1A according to a modified example of the present embodiment.
  • 12A is a top view of the detection device 1A
  • FIG. 12B is a cross-sectional view taken along the line AA in FIG. 12A as an example of a cross-sectional view of the detection device 1A.
  • the detection device 1A includes a hole 15 that connects the outside of the system and the edge of the opening 9 to each other.
  • the holes 15 are arranged side by side in the fluid flow direction with the heater 2 as the center.
  • the holes 15 are provided outside the first hot junction 4 and the second hot junction 5 in the longitudinal direction of the thermopile 3.
  • thermopile 3 heat transfer between the substrate 7 and the thermopile 3 can be suppressed. In other words, even when the distance between the thermopile 3 or the heater 2 and the substrate 7 is shortened, the heat stays in the central portion of the film 6 and the fluctuation of the output from the thermopile 3 is suppressed. That is, downsizing of the detection device 1A is realized.
  • FIG. 13 shows an example of a cross-sectional view of a detection device 1B according to a modified example of this embodiment.
  • the first hot junction 4 and the second hot junction 5 of the thermopile 3 are symmetrical with respect to the longitudinal direction in the inside of the opening 9 around the central portion of the opening 9 as viewed from the normal direction of the opening 9. Is located in.
  • the heater 2 is arranged in the center of the portion between the first hot junction 4 and the second hot junction 5 in the direction perpendicular to the longitudinal direction when viewed from the normal direction of the opening 9. Then, the heater 2 is arranged on the side opposite to the cavity 8 with the thermopile 3 in between with respect to the normal direction of the opening 9.
  • the heater 2 can be arranged at a place closer to the portion where the fluid flows. Therefore, the amount of heat distributed in the portion where the fluid flows becomes large. Therefore, the flow rate of the fluid can be detected even when the flow velocity of the fluid is high and the heat is easily removed by the fluid. That is, it is possible to form the detection device 1B having high sensitivity to the flow of fluid.
  • 14A and 14B show an example of an outline of a detection device 1C according to a modified example of this embodiment.
  • 14A is a top view of the detection device 1C
  • FIG. 14B is a cross-sectional view taken along the line AA in FIG. 14A as an example of a cross-sectional view of the detection device 1C.
  • the first hot junction 4 and the second hot junction 5 are symmetrical with respect to the central portion of the opening 9 in the longitudinal direction when viewed from the normal direction of the opening 9. Is arranged as.
  • the heaters 2A and 2B are arranged side by side with the thermopile 3 outside the first hot junction 4 and the second hot junction 5 of the thermopile 3 when viewed from the normal direction of the opening 9 in the direction perpendicular to the longitudinal direction thereof. Will be placed.
  • the heater 2A, the first hot junction 4, the second hot junction 5, and the heater 2B are arranged in this order in the direction in which the fluid flows. That is, when the fluid does not flow, the temperature of the first hot junction 4 and the temperature of the second hot junction 5 become equal. On the other hand, when the fluid is flowing, the temperature of the first hot junction 4 rises and the temperature of the second hot junction 5 falls.
  • the heaters 2A and 2B are formed on the surface of the silicon oxide film 10, and the thermopile 3 is also formed side by side on the surface of the silicon oxide film 10.
  • thermopile 3 when the heaters 2A, 2B and the thermopile 3 are formed in the step of forming the detection device 1C, the heaters 2A, 2B and the thermopile 3 can be formed together. That is, the process of forming the detection device 1C is simplified.
  • the location of the heater and the thermopile illustrated in the above-described embodiment and modification is an example, and the location is not limited to the above location.
  • the heater and the thermopile are arranged at positions where the first hot junction 4 and the second hot junction 5 are arranged inside the opening 9, and the heater 2 is not flowing a fluid and is flowing a fluid. Then, it is only required to be a place where a temperature distribution of the first hot junction 4 and a temperature of the second hot junction 5 are changed.
  • the etching hole 14 opened in the process of forming the above-described detection device may be used as the hole 15.
  • the hole 15 may be provided outside the hot junction of at least one of the first hot junction 4 and the second hot junction 5 in the longitudinal direction of the thermopile 3.
  • the heater is outside the hot junction of at least one of the first hot junction 4 and the second hot junction 5 of the thermopile 3 when viewed from the normal direction of the opening 9 in the direction perpendicular to the longitudinal direction thereof.
  • they may be arranged side by side with the thermopile 3.
  • thermocouple array (3) provided in the thin film layer and formed by connecting a plurality of thermocouples in series; In each thermocouple in the thermocouple row (3), a first hot junction (4) and a second hot junction (5) are arranged in a direction perpendicular to the longitudinal direction of the heater (2, 2A, 2B).
  • the thin film layer (6, 10, 13) has a hole (15) for communicating the outside of the system with the edge of the opening (9), The edge of the opening (9) is inside the opening (9) when viewed from the normal direction of the opening (9), and in the longitudinal direction of the thermocouple, the first hot junction (4) and And/or an area outside the second hot junction (5), The detection device (1A, 1B, 1C) according to attachment 1.
  • thermocouple 3> One of the heaters (2) is arranged in the central portion of the opening (9) in a direction perpendicular to the longitudinal direction thereof, The thermocouple is arranged such that the first hot junction (4) and the second hot junction (5) are symmetrical with respect to the heater (2) across the heater (2). Will be The detection device (1, 1A) according to appendix 1 or 2.
  • the heater (2) has the first hot junction (4) and the second hot junction (5) in a direction perpendicular to the longitudinal direction when viewed from the normal direction of the opening (9). It is arranged at the center of the portion between them, and is arranged on the opposite side of the cavity (8) with respect to the normal direction of the opening (9) with the thermocouple array (3) interposed therebetween.
  • the detection device (1B) according to appendix 1 or 2. ⁇ Appendix 5> With respect to the longitudinal direction of the thermocouple, the first hot junction (4) and the second hot junction (5) of the opening (9) when viewed from the normal direction of the opening (9).
  • the heaters (2A, 2B) have the first hot junction (4) and/or the second hot junction (4) of the thermocouple as viewed from the normal direction of the opening (9) with respect to the direction perpendicular to the longitudinal direction thereof. Disposed outside the hot junction (5) of the thermocouple in parallel with the thermocouple, The detection device (1C) according to appendix 1 or 2.
  • Detection device 1A Detection device 1B: Detection device 1C: Detection device 2: Heater 2A: Heater 2B: Heater 3: Thermopile 4: First hot junction 5: Second hot junction 6: Membrane 7: Substrate 8: Cavity 9: Opening 10: Silicon oxide film 11: Polysilicon layer 12: Surface portion 13: Case film 14: Etching hole 15: Hole 17: Gap 31: Conventional detection device 32: Heater 33A: Thermopile 33B: Thermopile 34A: First hot junction 34B: Second hot junction 35A: First cold junction 35B: Second cold junction 36: Membrane 37: Substrate 38: Cavity 39: Opening

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Abstract

L'invention concerne un dispositif de détection comprenant un substrat possédant une cavité formant une ouverture dans une partie de la surface du substrat, une couche de film mince située sur la surface du substrat de façon à recouvrir l'ouverture, un dispositif de chauffage situé dans un film mince et présentant une forme grossièrement linéaire et une thermopile située dans un film mince et formée à partir d'une pluralité de thermocouples connectés en série. Chacun des thermocouples dans la thermopile possède une première jonction chaude et une seconde jonction chaude agencées dans une direction perpendiculaire à la direction longitudinale du dispositif de chauffage et produit une sortie en fonction de la différence entre la température au niveau de la première jonction chaude et la température au niveau de la seconde jonction chaude. La première jonction chaude et la seconde jonction chaude sont disposées à l'intérieur de l'ouverture lorsqu'elles sont vues depuis une direction de normale à l'ouverture.
PCT/JP2019/046770 2019-01-31 2019-11-29 Dispositif de détection WO2020158155A1 (fr)

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JP2019015739A JP2020122747A (ja) 2019-01-31 2019-01-31 検出装置
JP2019-015739 2019-01-31

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0599722A (ja) * 1991-10-11 1993-04-23 Nippon Steel Corp シリコンを用いた流速測定装置
JPH0599942A (ja) * 1991-10-11 1993-04-23 Nippon Steel Corp シリコンを用いた流速測定装置
US6182509B1 (en) * 1996-06-26 2001-02-06 Simon Fraser University Accelerometer without proof mass
DE10005706A1 (de) * 2000-02-09 2001-08-16 Pierburg Ag Luftmassensensor
JP2004340964A (ja) * 2003-05-13 2004-12-02 Berkin Bv 質量流量計

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2508070B2 (ja) * 1987-04-08 1996-06-19 日本電装株式会社 圧力検出素子及びその製造方法
JP2001116617A (ja) * 1999-10-14 2001-04-27 Korai Kagi Kofun Yugenkoshi 薄膜型装置及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0599722A (ja) * 1991-10-11 1993-04-23 Nippon Steel Corp シリコンを用いた流速測定装置
JPH0599942A (ja) * 1991-10-11 1993-04-23 Nippon Steel Corp シリコンを用いた流速測定装置
US6182509B1 (en) * 1996-06-26 2001-02-06 Simon Fraser University Accelerometer without proof mass
DE10005706A1 (de) * 2000-02-09 2001-08-16 Pierburg Ag Luftmassensensor
JP2004340964A (ja) * 2003-05-13 2004-12-02 Berkin Bv 質量流量計

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