WO2020151048A1 - 发光面板、发光面板的制备方法及显示装置 - Google Patents

发光面板、发光面板的制备方法及显示装置 Download PDF

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Publication number
WO2020151048A1
WO2020151048A1 PCT/CN2019/076686 CN2019076686W WO2020151048A1 WO 2020151048 A1 WO2020151048 A1 WO 2020151048A1 CN 2019076686 W CN2019076686 W CN 2019076686W WO 2020151048 A1 WO2020151048 A1 WO 2020151048A1
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Prior art keywords
adhesive layer
light
layer
water
emitting panel
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Ceased
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PCT/CN2019/076686
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English (en)
French (fr)
Inventor
杨中国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication of WO2020151048A1 publication Critical patent/WO2020151048A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details

Definitions

  • This application relates to the field of display technology, in particular to a light-emitting panel, a method for manufacturing the light-emitting panel, and a display device.
  • OLED Organic Light Emitting Diode
  • the packaging material is mainly composed of a barrier film and a surface-attached packaging adhesive.
  • the surface-laminated encapsulant material used for bottom light emission contains metal oxide particles as a water-absorbing desiccant. Due to its large particle size, the plastic material has a low transmittance.
  • the embodiments of the present application provide a light-emitting panel, a method for manufacturing the light-emitting panel, and a display device, which can improve the light transmittance of the light-emitting panel.
  • an embodiment of the present application provides a light emitting panel, including:
  • the light-emitting substrate, the first adhesive layer, the second adhesive layer and the cover plate are stacked in sequence from bottom to top; wherein,
  • a water-absorbing layer is arranged between the first adhesive layer and the second adhesive layer, and the water-absorbing layer has a closed structure.
  • the outer edge of the water-absorbing layer and the outer edge of the first adhesive layer are in the same cross-section.
  • the horizontal length of the orthographic projection of the water-absorbing layer on the first adhesive layer is smaller than the horizontal width of the first adhesive layer.
  • the water-absorbing layer is doped with desiccant particles, and the desiccant particles are composed of metal oxide.
  • the first adhesive layer, the second adhesive layer, and the water-absorbing layer are made of hyposensitive adhesive material or heat-sensitive adhesive material.
  • the vertical thickness of the water-absorbing layer is less than half of the sum of the vertical thickness of the first adhesive layer and the second adhesive layer.
  • an embodiment of the present application also provides a method for manufacturing a light-emitting panel, including:
  • a second adhesive layer, a water-absorbing layer, and a first adhesive layer are sequentially formed on the cover plate, and the water-absorbing layer is a closed structure;
  • the light-emitting substrate is attached to the second adhesive layer relative to the cover plate.
  • the step of sequentially forming a second adhesive layer, a water-absorbing layer, and a first adhesive layer on the cover plate includes:
  • the encapsulation adhesive material includes a first cover plate, a first adhesive layer, a water absorption layer, a second adhesive layer, and a second cover plate;
  • the second release film is removed, and the light-emitting substrate is attached to the first adhesive layer relative to the cover plate.
  • the steps of removing the second release film and attaching the light emitting substrate to the cover plate on the first adhesive layer include :
  • An inorganic water blocking layer is formed on the light-emitting substrate, so that the inorganic water blocking layer and the first adhesive layer are bonded together.
  • an embodiment of the present application further provides a display device, including: a housing and a light-emitting panel, the light-emitting panel is disposed on the housing, and the light-emitting panel includes:
  • the light-emitting substrate, the first adhesive layer, the second adhesive layer and the cover plate are stacked in sequence from bottom to top; wherein,
  • a water-absorbing layer is arranged between the first adhesive layer and the second adhesive layer, the water-absorbing layer is a closed structure, the water-absorbing layer is doped with desiccant particles, and the desiccant particles are made of metal It is composed of oxides, and the particle size of the desiccant particles is less than 6 microns.
  • the outer edge of the water-absorbing layer and the outer edge of the first adhesive layer are in the same cross-section.
  • the horizontal length of the orthographic projection of the water-absorbing layer on the first adhesive layer is smaller than the horizontal width of the first adhesive layer.
  • the first adhesive layer, the second adhesive layer, and the water-absorbing layer are made of a hyposensitive adhesive material or a heat-sensitive adhesive material.
  • the vertical thickness of the water-absorbing layer is less than half of the sum of the vertical thickness of the first adhesive layer and the second adhesive layer.
  • the light-emitting panel provided by the embodiment of the present application includes a light-emitting substrate, a first adhesive layer, a second adhesive layer, and a cover plate that are stacked in sequence from bottom to top; wherein, the first adhesive layer and the second adhesive layer A water-absorbing layer is arranged between the adhesive layers, and the water-absorbing layer is a closed structure, and the light transmittance of the light-emitting panel is improved by setting the water-absorbing layer in a closed structure.
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a second structure of a light-emitting panel provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a third structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a fourth structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a fifth structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 7 is a flowchart of a method for manufacturing a light-emitting panel provided by an embodiment of the application.
  • the main packaging methods for top-emitting large-size organic light emitting diode (Organic Light Emitting Diode, OLED) TVs mainly include Face Seal (surface mount packaging) and Dam (frame glue)/Getter (moisture absorbent)/Fill( Filling glue) package.
  • Face Seal surface mount packaging
  • Dam frame glue
  • Getter moisture absorbent
  • Fill( Filling glue) package mainly include Face Seal encapsulant for bottom light.
  • the first layer is a water-absorbing layer, which contains metal oxide particles as a water-absorbing desiccant, and its particle size is 1 to 6 microns
  • the second layer is a buffer layer, which is mainly used for bonding the substrate, absorbing impact and protecting the OLED light-emitting layer.
  • the existing Face Seal encapsulant materials cannot be used in top-emitting OLEDs, because the water-absorbing layer contains desiccant particles, and the transmittance is less than 5%, which cannot meet the top-emitting requirements for a transmittance greater than 98%.
  • the current solution is to replace the micron-sized desiccant particles with nano-sized desiccant particles, or replace the opaque desiccant particles with light-transmitting desiccant particles, although the transmittance of these two methods can be satisfied Requirement, but the package life cannot reach the mass production level during packaging.
  • An embodiment of the application provides a display device, which includes a housing and a light-emitting panel, the light-emitting panel is disposed on the housing, and the light-emitting panel includes:
  • the light-emitting substrate, the first adhesive layer, the second adhesive layer and the cover plate are stacked in sequence from bottom to top; wherein,
  • a water-absorbing layer is arranged between the first adhesive layer and the second adhesive layer, the water-absorbing layer is a closed structure, the water-absorbing layer is doped with desiccant particles, and the desiccant particles are made of metal It is composed of oxides, and the particle size of the desiccant particles is less than 6 microns.
  • the outer edge of the water-absorbing layer and the outer edge of the first adhesive layer are in the same cross-section.
  • the horizontal length of the orthographic projection of the water-absorbing layer on the first adhesive layer is smaller than the horizontal width of the first adhesive layer.
  • the first adhesive layer, the second adhesive layer, and the water-absorbing layer are made of hyposensitive adhesive material or heat-sensitive adhesive material.
  • the vertical thickness of the water-absorbing layer is less than half of the sum of the vertical thickness of the first adhesive layer and the second adhesive layer.
  • FIG. 1 is a schematic structural diagram of a display device 1000 according to an embodiment of the application.
  • the display device 100 may include a light emitting panel 100, a control circuit 200, and a housing 300. It should be noted that the display device 1000 shown in FIG. 1 is not limited to the above content, and may also include other devices, such as a camera, an antenna structure, a pattern unlocking module, and the like.
  • the light-emitting panel 100 is disposed on the housing 200.
  • the light-emitting panel 100 may be fixed to the housing 200, and the light-emitting panel 100 and the housing 300 form a closed space to accommodate devices such as the control circuit 200.
  • the housing 300 may be made of a flexible material, such as a plastic housing or a silicone housing.
  • control circuit 200 is installed in the housing 300, the control circuit 200 may be the main board of the display device 1000, and the control circuit 200 may be integrated with a battery, an antenna structure, a microphone, a speaker, a headset interface, a universal serial bus interface, One, two or more of functional components such as camera, distance sensor, ambient light sensor, receiver, and processor.
  • the light-emitting panel 100 is installed in the housing 300, and at the same time, the light-emitting panel 100 is electrically connected to the control circuit 200 to form the display surface of the display device 1000.
  • the light emitting panel 100 may include a display area and a non-display area.
  • the display area can be used to display the screen of the display device 1000 or for the user to perform touch manipulation.
  • This non-display area can be used to set various functional components.
  • FIG. 2 is a schematic diagram of a first structure of a light-emitting panel provided by an embodiment of the application.
  • the light-emitting panel 100 includes: a light-emitting substrate 10, a first adhesive layer 20, and a second adhesive layered in order from bottom to top. Connecting layer 30 and cover plate 40; among them,
  • a water-absorbing layer 50 is provided between the first adhesive layer 20 and the second adhesive layer 30, and the water-absorbing layer 50 has a closed structure.
  • the effective encapsulation area AA is outside the light-emitting area of the light-emitting substrate 10, so only the desiccant on the outside can absorb water, and the desiccant on the light-emitting area is not It plays a role of absorbing water. Therefore, a circle of water absorbing layer 50 can be smeared on the first adhesive layer 20.
  • the water absorbing layer 50 is arranged corresponding to the effective area AA of the package, so that the water absorbing layer 50 forms a closed structure with a hollow in the middle.
  • the light-emitting panel 100 provided by the embodiment of the present application includes a light-emitting substrate 10, a first adhesive layer 20, a second adhesive layer 30, and a cover plate 40 that are sequentially stacked from bottom to top; wherein, the first adhesive layer A water absorbing layer 50 is provided between the second adhesive layer 30 and 20.
  • the water absorbing layer 50 is a closed structure.
  • the light transmittance of the light emitting panel 100 is improved by setting the water absorbing layer 50 in a closed structure.
  • an inorganic water blocking layer 60 is further provided between the light-emitting substrate 10 and the first adhesive layer 20.
  • a color film 70 is also provided between the cover plate 40 and the second adhesive layer 30.
  • FIG. 3 is a schematic diagram of the second structure of the light-emitting panel provided by the embodiment of the application. Among them, FIG. 3 is a top view of the light emitting panel 100 shown in FIG. 2. The horizontal length of the orthographic projection of the water-absorbing layer 50 on the first adhesive layer 20 is smaller than the horizontal width of the first adhesive layer 20.
  • the water-absorbing layer 50 may be disposed inside the first adhesive layer 20 so that at least a part of the outside of the first adhesive layer 20 is exposed.
  • the inner side here refers to the side close to the central axis of the light-emitting panel 100, and the outer side refers to the side far away from the central axis of the light-emitting panel 100.
  • FIG. 4 is a schematic diagram of a third structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a fourth structure of a light emitting panel provided by an embodiment of the application.
  • FIG. 5 is a top view of the light-emitting panel 100 in FIG. 4. The outer edge of the water-absorbing layer 50 and the outer edge of the first adhesive layer 20 are in the same cross-section.
  • the water-absorbing layer 50 may be disposed on the peripheral area of the first adhesive layer 20 to cover the peripheral area of the first adhesive layer 20.
  • the water absorption layer 50 is doped with desiccant particles, and the desiccant particles are composed of metal oxide.
  • first adhesive layer 20 and the second adhesive layer 30 are uniformly dispersed with nano-scale desiccant particles (such as nano molecular sieve) or transparent desiccant particles.
  • nano-scale desiccant particles such as nano molecular sieve
  • transparent desiccant particles such as nano molecular sieve
  • the micron-level desiccant particles can be replaced with nano-level desiccant particles, or the opaque desiccant particles can be replaced It is a light-transmitting desiccant particle, which further improves the packaging effect while ensuring the transmittance.
  • the composition of the desiccant is a metal oxide, such as calcium oxide (CaO) or barium oxide (BaO), etc.
  • the particle size of the desiccant particles is less than 6 microns, which can prevent water vapor from entering the OLED from the side, thereby satisfying The requirements for the package life during packaging.
  • the average transmittance of the first adhesive layer 20 and the second adhesive layer 30 in the full wavelength range (380 ⁇ 780 nm) is greater than 98%, which meets the transmittance requirements of the top luminescence .
  • the first adhesive layer 20, the second adhesive layer 30, and the water-absorbing layer 50 are hyposensitive adhesives or heat-sensitive adhesives.
  • the vertical thickness of the water-absorbing layer 50 is less than half of the sum of the vertical thicknesses of the first adhesive layer 20 and the second adhesive layer 30.
  • the vertical thickness of the first adhesive layer 20 and the second adhesive layer 30 is 10-50 microns
  • the vertical thickness of the water-absorbing layer 50 is 10-50 microns.
  • FIG. 6 is a schematic diagram of the fifth structure of the light emitting panel provided by the embodiments of the application.
  • FIG. 6 is a specific structure diagram of the light-emitting substrate 10 in FIG. 2.
  • the light-emitting substrate 10 includes a base 101 and an OLED device 102 partially covering the base 101.
  • the light-emitting panel 100 provided by the embodiment of the present application includes a light-emitting substrate 10, a first adhesive layer 20, a second adhesive layer 30, and a cover plate 40 that are sequentially stacked from bottom to top; wherein, the first adhesive layer A water absorbing layer 50 is provided between the second adhesive layer 30 and 20.
  • the water absorbing layer 50 is a closed structure.
  • the light transmittance of the light emitting panel 100 is improved by setting the water absorbing layer 50 in a closed structure.
  • FIG. 7 is a flowchart of a method for manufacturing a light-emitting panel provided by an embodiment of the application.
  • the method for manufacturing the light-emitting panel includes:
  • a color film may be formed on the cover plate.
  • a second adhesive layer, a water-absorbing layer, and a first adhesive layer are sequentially formed on the cover plate, and the water-absorbing layer has a closed structure;
  • the color film can be attached to the second adhesive layer.
  • the step of sequentially forming a second adhesive layer, a water-absorbing layer, and a first adhesive layer on the cover plate includes:
  • the encapsulation adhesive material includes a first release film layer, a first adhesive layer, a water absorption layer, a second adhesive layer, and a second release film layer;
  • the second release film is removed, and the light-emitting substrate is attached to the first adhesive layer relative to the cover plate.
  • a circle of water-absorbing layer is coated on the first adhesive layer, where the outer edge of the water-absorbing layer formed by coating is flush with or inside the outer edge of the adhesive layer.
  • the specific coating position of the water-absorbing layer here depends on the effective area of the package during packaging.
  • the step of removing the second release film and attaching the light-emitting substrate to the first adhesive layer relative to the cover plate further includes:
  • An inorganic water blocking layer is formed on the light-emitting substrate, so that the inorganic water blocking layer and the first adhesive layer are bonded together.
  • the operation of attaching the light-emitting substrate to the first adhesive layer is performed in a vacuum environment.
  • first adhesive layer and the second adhesive layer are cured by hot pressing or heating to complete the package.

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  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种发光面板(100)、发光面板(100)的制备方法及显示装置(1000)，发光面板(100)包括从下至上依次层叠设置的发光基板(10)、第一粘接层(20)、第二粘接层(30)以及盖板(40)；其中，在第一粘接层(20)与第二粘接层(30)之间设置有吸水层(50)，吸水层(50)为闭合结构，通过将吸水层(50)设置为闭合结构从而提高发光面板(100)的光透过率。

Description

发光面板、发光面板的制备方法及显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种发光面板、发光面板的制备方法及显示装置。
 背景技术
近年来，有机发光二极管（Organic Light Emitting Diode，OLED）显示技术发展突飞猛进，OLED产品由于具有轻薄、响应快、广视角、高对比度、可弯折等优点，受到了越来越多的关注和应用，主要应用在手机、平板、电视等显示技术领域。
现有技术中，在对发光面板进行封装时，主要采用面贴合封装的方式，其封装材料主要由阻隔膜和面贴合封装胶材等组成。用于底发光的面贴合封装胶材里面含有金属氧化物颗粒作为吸水的干燥剂，由于其粒径过大，导致胶材透过率低。
因此，现有技术存在缺陷，急需改进。
 技术问题
本申请实施例提供一种发光面板、发光面板的制备方法及显示装置，可以提高发光面板的光透过率。
 技术解决方案
第一方面，本申请实施例提供一种发光面板，包括：
从下至上依次层叠设置的发光基板、第一粘接层、第二粘接层以及盖板；其中，
在所述第一粘接层与所述第二粘接层之间设置有吸水层，所述吸水层为闭合结构。
在本申请所述的发光面板中，所述吸水层的外边缘与所述第一粘接层的外边缘处于同一截面。
在本申请所述的发光面板中，所述吸水层在所述第一粘接层上正投影的水平长度小于所述第一粘接层的水平宽度。
在本申请所述的发光面板中，所述吸水层中掺杂有干燥剂颗粒，所述干燥剂颗粒由金属氧化物组成。
在本申请所述的发光面板中，所述第一粘接层、所述第二粘接层及所述吸水层为亚敏型胶材或热敏型胶材。
在本申请所述的发光面板中，所述吸水层的竖直厚度小于所述第一粘接层与所述第二粘接层的竖直厚度之和的一半。
第二方面，本申请实施例还提供一种发光面板的制备方法，包括：
提供一盖板；
在所述盖板上依次形成第二粘接层、吸水层及第一粘接层，所述吸水层为闭合结构；
提供一发光基板；
将所述发光基板相对于所述盖板贴合至所述第二粘接层上。
在本申请所述的发光面板的制备方法中，所述在所述盖板上依次形成第二粘接层、吸水层及第一粘接层的步骤包括：
提供一封装胶材，所述封装胶材包括第一盖板、第一粘接层、吸水层、第二粘接层及第二盖板；
将所述第一盖板摘除，将所述第二粘接层贴合在所述盖板上；
将所述第二离型膜摘除，将所述发光基板相对于所述盖板贴合在所述第一粘接层上。
在本申请所述的发光面板的制备方法中，所述将所述第二离型膜摘除，将所述发光基板相对于所述盖板贴合在所述第一粘接层上的步骤包括：
在所述发光基板上形成无机阻水层，以使所述无机阻水层与所述第一粘接层贴合。
第三方面，本申请实施例还提供一种显示装置，包括：壳体以及发光面板，所述发光面板设置在所述壳体上，所述发光面板包括：
从下至上依次层叠设置的发光基板、第一粘接层、第二粘接层以及盖板；其中，
在所述第一粘接层与所述第二粘接层之间设置有吸水层，所述吸水层为闭合结构，所述吸水层中掺杂有干燥剂颗粒，所述干燥剂颗粒由金属氧化物组成，所述干燥剂颗粒的粒径小于6微米。
在本申请所述的显示装置中，所述吸水层的外边缘与所述第一粘接层的外边缘处于同一截面。
在本申请所述的显示装置中，所述吸水层在所述第一粘接层上正投影的水平长度小于所述第一粘接层的水平宽度。
在本申请所述的显示装置中，所述第一粘接层、所述第二粘接层及所述吸水层为亚敏型胶材或热敏型胶材。
在本申请所述的显示装置中，所述吸水层的竖直厚度小于所述第一粘接层与所述第二粘接层的竖直厚度之和的一半。
 有益效果
本申请实施例提供的发光面板，包括从下至上依次层叠设置的发光基板、第一粘接层、第二粘接层以及盖板；其中，在所述第一粘接层与所述第二粘接层之间设置有吸水层，所述吸水层为闭合结构，通过将吸水层设置为闭合结构从而提高发光面板的光透过率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示装置的结构示意图。
图2为本申请实施例提供的发光面板的第一种结构示意图。
图3为本申请实施例提供的发光面板的第二种结构示意图。
图4为本申请实施例提供的发光面板的第三种结构示意图。
图5为本申请实施例提供的发光面板的第四种结构示意图。
图6为本申请实施例提供的发光面板的第五种结构示意图。
图7为本申请实施例提供的发光面板的制备方法的流程图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
现有技术中，顶发光大尺寸有机发光二极管（Organic Light Emitting Diode，OLED）电视的主要封装方式主要有Face Seal(面贴合封装)和Dam(边框胶)/Getter(吸湿剂)/Fill(填充胶)封装。对于现有的用于底发光的Face Seal封装胶材来说，其结构分两层，第一层为吸水层，里面含有金属氧化物颗粒作为吸水的干燥剂，其粒径为1~6微米左右，第二层为缓冲层，主要是起粘接基板，吸收冲击保护OLED发光层的作用。很明显，现有的Face Seal封装胶材无法用于顶发光的OLED中，因为吸水层含有干燥剂颗粒，透过率小于5%，无法满足顶发光对透过率大于98%的要求。目前的解决方案是将微米级别的干燥剂颗粒替换为纳米级别的干燥剂颗粒，或将不透光的干燥剂颗粒替换为透光的干燥剂颗粒，虽然这两种方法透过率都能满足要求，但封装时封装寿命无法达到量产水平。
本申请实施例提供一种显示装置，其包括：壳体以及发光面板，所述发光面板设置在所述壳体上，所述发光面板包括：
从下至上依次层叠设置的发光基板、第一粘接层、第二粘接层以及盖板；其中，
在所述第一粘接层与所述第二粘接层之间设置有吸水层，所述吸水层为闭合结构，所述吸水层中掺杂有干燥剂颗粒，所述干燥剂颗粒由金属氧化物组成，所述干燥剂颗粒的粒径小于6微米。
其中，所述吸水层的外边缘与所述第一粘接层的外边缘处于同一截面。
其中，所述吸水层在所述第一粘接层上正投影的水平长度小于所述第一粘接层的水平宽度。
其中，所述第一粘接层、所述第二粘接层及所述吸水层为亚敏型胶材或热敏型胶材。
其中，所述吸水层的竖直厚度小于所述第一粘接层与所述第二粘接层的竖直厚度之和的一半。
请参阅图1，图1为本申请实施例提供的显示装置1000的结构示意图。该显示装置100可以包括发光面板100、控制电路200、以及壳体300。需要说明的是，图1所示的显示装置1000并不限于以上内容，其还可以包括其他器件，比如还可以包括摄像头、天线结构、纹解锁模块等。
其中，发光面板100设置于壳体200上。
在一些实施例中，发光面板100可以固定到壳体200上，发光面板100和壳体300形成密闭空间，以容纳控制电路200等器件。
在一些实施例中，壳体300可以为由柔性材料制成，比如为塑胶壳体或者硅胶壳体等。
其中，该控制电路200安装在壳体300中，该控制电路200可以为显示装置1000的主板，控制电路200上可以集成有电池、天线结构、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。
其中，该发光面板100安装在壳体300中，同时，该发光面板100电连接至控制电路200上，以形成显示装置1000的显示面。该发光面板100可以包括显示区域和非显示区域。该显示区域可以用来显示显示装置1000的画面或者供用户进行触摸操控等。该非显示区域可用于设置各种功能组件。
请参阅图2，图2为本申请实施例提供的发光面板的第一种结构示意图，该发光面板100包括：从下至上依次层叠设置的发光基板10、第一粘接层20、第二粘接层30以及盖板40；其中，
在所述第一粘接层20与所述第二粘接层30之间设置有吸水层50，所述吸水层50为闭合结构。
可以理解，由于在对OLED进行封装时，封装有效区AA在发光基板10的发光区的外侧，因此只有在外侧的干燥剂才起到吸水的作用，而相对于发光区上的干燥剂并不起到吸水的作用，因此，可在第一粘接层20上涂抹一圈吸水层50，吸水层50对应于封装有效区    AA进行设置，使吸水层50形成中间镂空的闭合结构，从而在发光基板10上的发光区发光时，光线可从吸水层50中间镂空的部分发出，从而提高发光面板的光透过率。
本申请实施例提供的发光面板100，包括从下至上依次层叠设置的发光基板10、第一粘接层20、第二粘接层30以及盖板40；其中，在所述第一粘接层20与所述第二粘接层30之间设置有吸水层50，所述吸水层50为闭合结构，通过将吸水层50设置为闭合结构从而提高发光面板100的光透过率。
在一些实施例中，所述发光基板10与所述第一粘接层20之间还设置有无机阻水层60。所述盖板40与所述第二粘接层30之间还设置有彩膜70。
在一些实施例中，如图3所示，图3为本申请实施例提供的发光面板的第二种结构示意图。其中，图3为图2所示的发光面板100的俯视图。所述吸水层50在所述第一粘接层20上正投影的水平长度小于所述第一粘接层20的水平宽度。
可以理解，可以将吸水层50设置在第一粘接层20内侧，以使第一粘接层20的外侧露出至少一部分。这里的内侧指的是靠近所述发光面板100中轴线的一侧，外侧指的是远离所述发光面板100中轴线的一侧。
在一些实施例中，如图4，图5所示，图4为本申请实施例提供的发光面板的第三种结构示意图。图5为本申请实施例提供的发光面板的第四种结构示意图。图5为图4中发光面板100的俯视图。所述吸水层50的外边缘与所述第一粘接层20的外边缘处于同一截面。
具体的，可以将吸水层50设置在所述第一粘接层20的周缘区域上，以包覆所述第一粘接层20的周缘区域。
在一些实施例中，所述吸水层50中掺杂有干燥剂颗粒，所述干燥剂颗粒由金属氧化物组成。
其中，所述第一粘接层20及所述第二粘接层30中均匀分散有纳米级别的干燥剂颗粒（如纳米分子筛）或透明的干燥剂颗粒。
可以理解，为了提升第一粘接层20及第二粘接层30的阻水性能，可以将微米级别的干燥剂颗粒替换为纳米级别的干燥剂颗粒，或将不透光的干燥剂颗粒替换为透光的干燥剂颗粒，从而在保证透过率的情况下进一步提升封装效果。
其中，所述干燥剂的成分为金属氧化物，如氧化钙（CaO）或氧化钡（BaO）等，所述干燥剂颗粒的粒径小于6微米，可以防止水汽从侧边侵入OLED，从而满足封装时对封装寿命的要求，同时，第一粘接层20与第二粘接层30在全波段(380~780纳米)的平均透过率大于98%，满足顶发光对透过率的要求。
在一些实施例中，所述第一粘接层20、所述第二粘接层30及所述吸水层50为亚敏型胶材或热敏型胶材。
在一些实施例中，所述吸水层50的竖直厚度小于所述第一粘接层20与所述第二粘接层30的竖直厚度之和的一半。
具体的，所述第一粘接层20及所述第二粘接层30的竖直厚度为10~50微米，吸水层50的竖直厚度为10~50微米。
在一些实施例中，如图6所示，图6为本申请实施例提供的发光面板的第五种结构示意图。图6为图2中发光基板10的具体结构图，所述发光基板10包括基底101以及部分覆盖在所述基底101上的OLED器件102。
本申请实施例提供的发光面板100，包括从下至上依次层叠设置的发光基板10、第一粘接层20、第二粘接层30以及盖板40；其中，在所述第一粘接层20与所述第二粘接层30之间设置有吸水层50，所述吸水层50为闭合结构，通过将吸水层50设置为闭合结构从而提高发光面板100的光透过率。
本申请实施例还提供一种发光面板的制备方法，用于制备如上所述的发光面板。请参阅图7，图7为本申请实施例提供的发光面板的制备方法的流程图，所述发光面板的制备方法包括：
110、提供一盖板；
在一些实施例中，可以在所述盖板上形成彩膜。
120、在所述盖板上依次形成第二粘接层、吸水层及第一粘接层，所述吸水层为闭合结构；
在一些实施例中，可将所述彩膜与所述第二粘接层贴合。
130、提供一发光基板；
140、将所述发光基板相对于所述盖板贴合至所述第一粘接层上。
在一些实施例中，所述在所述盖板上依次形成第二粘接层、吸水层及第一粘接层的步骤包括：
提供一封装胶材，所述封装胶材包括第一离型膜层、第一粘接层、吸水层、第二粘接层及第二离型膜层；
将所述第一离型膜层摘除，将所述第二粘接层贴合在所述盖板上；
将所述第二离型膜摘除，将所述发光基板相对于所述盖板贴合在所述第一粘接层上。
这里在第一粘接层上涂布一圈吸水层，这里涂布形成的吸水层的外边缘与粘接层的外边缘平齐或在粘接层的外边缘的内侧。这里吸水层的具体涂布位置根据封装时的封装有效区而定。
在一些实施例中，所述将所述第二离型膜摘除，将所述发光基板相对于所述盖板贴合在所述第一粘接层上的步骤还包括：
在所述发光基板上形成无机阻水层，以使所述无机阻水层与所述第一粘接层贴合。
具体的，这里将发光基板贴合在第一粘接层上的操作是在真空环境下进行的。
最后通过热压或加热使第一粘接层与第二粘接层固化，完成封装。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种发光面板、发光面板的制备方法及显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (14)

  1. 一种发光面板，其包括：
    从下至上依次层叠设置的发光基板、第一粘接层、第二粘接层以及盖板；其中，
    在所述第一粘接层与所述第二粘接层之间设置有吸水层，所述吸水层为闭合结构。
  2. 根据权利要求1所述的发光面板，其中所述吸水层的外边缘与所述第一粘接层的外边缘处于同一截面。
  3. 根据权利要求1所述的发光面板，其中所述吸水层在所述第一粘接层上正投影的水平长度小于所述第一粘接层的水平宽度。
  4. 根据权利要求1所述的发光面板，其中所述吸水层中掺杂有干燥剂颗粒，所述干燥剂颗粒由金属氧化物组成。
  5. 根据权利要求1所述的发光面板，其中所述第一粘接层、所述第二粘接层及所述吸水层为亚敏型胶材或热敏型胶材。
  6. 根据权利要求5所述的发光面板，其中所述吸水层的竖直厚度小于所述第一粘接层与所述第二粘接层的竖直厚度之和的一半。
  7. 一种发光面板的制备方法，其包括：
    提供一盖板；
    在所述盖板上依次形成第二粘接层、吸水层及第一粘接层，所述吸水层为闭合结构；
    提供一发光基板；
    将所述发光基板相对于所述盖板贴合至所述第一粘接层上。
  8. 根据权利要求7所述的发光面板的制备方法，其中所述在所述盖板上依次形成第二粘接层、吸水层及第一粘接层的步骤包括：
    提供一封装胶材，所述封装胶材包括第一离型膜层、第一粘接层、吸水层、第二粘接层及第二离型膜层；
    将所述第一离型膜层摘除，将所述第二粘接层贴合在所述盖板上；
    将所述第二离型膜摘除，将所述发光基板相对于所述盖板贴合在所述第一粘接层上。
  9. 根据权利要求8所述的发光面板的制备方法，其中所述将所述第二离型膜摘除，将所述发光基板相对于所述盖板贴合在所述第一粘接层上的步骤包括：
    在所述发光基板上形成无机阻水层，以使所述无机阻水层与所述第一粘接层贴合。
  10. 一种显示装置，其包括：壳体以及发光面板，所述发光面板设置在所述壳体上，所述发光面板包括：
    从下至上依次层叠设置的发光基板、第一粘接层、第二粘接层以及盖板；其中，
    在所述第一粘接层与所述第二粘接层之间设置有吸水层，所述吸水层为闭合结构，所述吸水层中掺杂有干燥剂颗粒，所述干燥剂颗粒由金属氧化物组成，所述干燥剂颗粒的粒径小于6微米。
  11. 根据权利要求10所述的显示装置，其中所述吸水层的外边缘与所述第一粘接层的外边缘处于同一截面。
  12. 根据权利要求11所述的显示装置，其中所述吸水层在所述第一粘接层上正投影的水平长度小于所述第一粘接层的水平宽度。
  13. 根据权利要求11所述的显示装置，其中所述第一粘接层、所述第二粘接层及所述吸水层为亚敏型胶材或热敏型胶材。
  14. 根据权利要求13所述的显示装置，其中所述吸水层的竖直厚度小于所述第一粘接层与所述第二粘接层的竖直厚度之和的一半。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116102987A (zh) * 2023-04-13 2023-05-12 合肥华晟光伏科技有限公司 太阳能电池组件封装胶膜及其制备方法、太阳能电池组件
TWI909159B (zh) * 2022-12-15 2025-12-21 同欣電子工業股份有限公司 光學封裝結構及其製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109860417A (zh) * 2019-01-28 2019-06-07 深圳市华星光电半导体显示技术有限公司 发光面板、发光面板的制备方法及显示装置
CN110176549A (zh) * 2019-06-18 2019-08-27 深圳市华星光电半导体显示技术有限公司 封装结构、显示装置及封装方法
CN110993813A (zh) * 2019-11-14 2020-04-10 深圳市华星光电半导体显示技术有限公司 Oled显示面板及其制备方法
CN112310311A (zh) * 2020-10-23 2021-02-02 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置
CN112802977A (zh) * 2021-01-07 2021-05-14 深圳市华星光电半导体显示技术有限公司 封装薄膜及其制备方法、柔性显示面板的封装方法
CN112864337A (zh) * 2021-01-12 2021-05-28 深圳市华星光电半导体显示技术有限公司 柔性显示面板及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
CN104037337A (zh) * 2014-06-09 2014-09-10 京东方科技集团股份有限公司 有机电致发光显示面板及其封装方法、显示装置
CN104505470A (zh) * 2015-01-04 2015-04-08 京东方科技集团股份有限公司 显示面板及其制作方法以及显示装置
CN105206759A (zh) * 2014-06-11 2015-12-30 群创光电股份有限公司 显示装置
CN107180922A (zh) * 2017-06-20 2017-09-19 合肥市惠科精密模具有限公司 一种高防水性amoled封装结构
CN107245305A (zh) * 2017-07-20 2017-10-13 武汉华星光电半导体显示技术有限公司 复合型光学胶的制备方法、复合型光学胶以及显示面板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325953B (zh) * 2012-03-19 2016-02-10 瀚宇彩晶股份有限公司 有机发光二极管封装及其封装方法
CN107170902B (zh) * 2017-05-26 2019-04-02 深圳市华星光电半导体显示技术有限公司 封装薄膜及其制作方法与oled面板的封装方法
CN107833977B (zh) * 2017-08-23 2019-08-09 江苏集萃有机光电技术研究所有限公司 一种有机发光显示器件及其制备方法
CN109755408B (zh) * 2018-12-26 2021-01-15 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制作方法、显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
CN104037337A (zh) * 2014-06-09 2014-09-10 京东方科技集团股份有限公司 有机电致发光显示面板及其封装方法、显示装置
CN105206759A (zh) * 2014-06-11 2015-12-30 群创光电股份有限公司 显示装置
CN104505470A (zh) * 2015-01-04 2015-04-08 京东方科技集团股份有限公司 显示面板及其制作方法以及显示装置
CN107180922A (zh) * 2017-06-20 2017-09-19 合肥市惠科精密模具有限公司 一种高防水性amoled封装结构
CN107245305A (zh) * 2017-07-20 2017-10-13 武汉华星光电半导体显示技术有限公司 复合型光学胶的制备方法、复合型光学胶以及显示面板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI909159B (zh) * 2022-12-15 2025-12-21 同欣電子工業股份有限公司 光學封裝結構及其製造方法
CN116102987A (zh) * 2023-04-13 2023-05-12 合肥华晟光伏科技有限公司 太阳能电池组件封装胶膜及其制备方法、太阳能电池组件
CN116102987B (zh) * 2023-04-13 2023-07-14 合肥华晟光伏科技有限公司 太阳能电池组件封装胶膜及其制备方法、太阳能电池组件

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