WO2020150902A1 - 柔性显示面板及其制作方法 - Google Patents

柔性显示面板及其制作方法 Download PDF

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WO2020150902A1
WO2020150902A1 PCT/CN2019/072698 CN2019072698W WO2020150902A1 WO 2020150902 A1 WO2020150902 A1 WO 2020150902A1 CN 2019072698 W CN2019072698 W CN 2019072698W WO 2020150902 A1 WO2020150902 A1 WO 2020150902A1
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flexible
substrate
flexible substrate
manufacturing
porous alumina
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French (fr)
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高勇
陈力
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to PCT/CN2019/072698 priority Critical patent/WO2020150902A1/zh
Priority to CN201980073409.7A priority patent/CN113243045B/zh
Publication of WO2020150902A1 publication Critical patent/WO2020150902A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • This application relates to the field of flexible display technology, and in particular to a flexible display panel and a manufacturing method thereof.
  • the flexible display panel is a bendable display device made of a soft material.
  • the preparation process of the flexible display panel is roughly as follows: first, a layer of flexible substrate is formed on the carrier substrate; then, various processes are applied to the flexible substrate, and after the various manufacturing processes of the flexible substrate are completed, the carrier substrate is separated from the flexible substrate , Get a flexible display panel.
  • the inventor discovered that in the traditional method of separating the carrier substrate from the flexible substrate, it is necessary to perform preliminary separation by laser stripping first, and then achieve complete separation by mechanical stripping. It is complicated, and because the equipment used for laser lift-off and mechanical lift-off are relatively expensive, the cost of traditional separation methods is too high.
  • This application aims to provide a flexible display panel and a manufacturing method thereof, so as to solve the technical problem of high cost of separating the flexible display panel from the carrier substrate in the manufacturing process of the traditional flexible display panel.
  • a technical solution adopted in the embodiments of the present application is to provide a method for manufacturing a flexible display panel.
  • the method includes: forming a nanoarray on the surface of a flexible substrate; and fixing a carrier substrate on the nanoarray Forming a device functional layer on the surface of the flexible base away from the carrier substrate; separating the flexible base and the carrier substrate to obtain the flexible display panel.
  • the nanoarray on the surface of the flexible substrate is a polyimide nanowire array.
  • the step of forming a nano-array on the surface of the flexible substrate specifically includes: preparing a porous alumina template; spreading a polyamide solution on the surface of the porous alumina template to generate the polyimide Nanowire array.
  • the step of preparing the porous alumina template specifically includes: preparing the porous alumina template by a two-step anodic oxidation method.
  • the step of preparing the porous alumina template by a two-step anodic oxidation method specifically includes the following steps: immersing an aluminum sheet in an oxalic acid solution for the first anodization, and generating on the surface of the aluminum sheet Preliminarily formed aluminum oxide; removing the aluminum oxide film on the surface of the preliminary formed aluminum oxide; and immersing the aluminum sheet after removing the aluminum oxide film in an oxalic acid solution for a second anodic oxidation to obtain a porous aluminum oxide template.
  • the step of spreading the polyamic acid solution on the surface of the porous alumina template to generate the polyimide nanowire array specifically includes: changing the surface of the porous alumina template to aluminum The sheet is placed on the first carrier; the polyamide solution is spread on the porous alumina template; cured and dried to form a flexible substrate; a second carrier is arranged on the side of the flexible substrate away from the aluminum sheet; Flexible substrate, and remove the first carrier and the aluminum sheet; remove the porous alumina template to obtain a polyamide that forms a nanowire array on the surface where the flexible substrate and the porous alumina template meet Imine substrate.
  • the porous alumina template is removed by an alkali etching method.
  • the step of forming a device functional layer on the surface of the flexible base away from the carrier substrate specifically includes: turning over the flexible base again and removing the second carrier, exposing the flexible base and the The separated surface of the supporting substrate; an OLED array is prepared on the separated surface of the flexible base and the supporting substrate.
  • the method further includes: generating a protective film layer on the surface of the device functional layer, the protective film layer covering the device functional layer.
  • the flexible base and the carrier substrate are separated mechanically.
  • a flexible display panel comprising: a flexible substrate; a device functional layer, the device functional layer is arranged on the flexible substrate
  • the first surface of the flexible substrate; the second surface of the flexible substrate away from the functional layer of the device is a nano-array structure, which is used to provide adsorption or desorption capacity for the flexible substrate during the preparation of the flexible panel.
  • the flexible substrate of the flexible display panel manufactured by the method has a nano-array structure, and the intermolecular force has a very important influence on the mechanical behavior of the nano-array. Therefore, it has strong adsorption capacity and desorption capacity.
  • the process of separating the flexible substrate from the carrier substrate it only needs to pass a simple mechanical separation step to realize the separation of the flexible substrate from the carrier substrate, and the separation process is simple. And the cost is lower.
  • FIG. 1 is a schematic flowchart of a method for manufacturing a flexible display panel provided by one of the embodiments of the present application;
  • FIG. 1 are structural schematic diagrams of the flexible display panel manufacturing method shown in FIG. 1 in different manufacturing stages;
  • FIG. 3 is a schematic diagram of a preparation process of forming a polyimide nanowire array on the surface of a flexible substrate according to some embodiments of the present application;
  • FIG. 4 is a schematic structural diagram of a manufacturing process of a flexible display panel provided by another embodiment of the present application.
  • the embodiment of the application is directed to the existing manufacturing method of the flexible display panel, because the carrier substrate and the flexible substrate in the flexible display panel need to be separated by laser first to realize the looseness of the connection surface of the carrier substrate and the flexible substrate, and then mechanical separation is used. To completely separate the carrier substrate and the flexible substrate, the separation process is cumbersome and requires many processes. In addition, in the laser peeling step, it is easy to damage the surface of the flexible substrate, resulting in the problem of low yield of the flexible display panel. A method for manufacturing a flexible display panel is proposed. The embodiment of the present application can improve this defect.
  • FIG. 1 is a schematic flowchart of a method for manufacturing a flexible display panel provided by one embodiment of the present application. The method includes the following steps:
  • Step 11 Form a nano-array on the surface of the flexible substrate.
  • the flexible substrate is the supporting structure of the flexible display panel with corresponding thickness and strength. It can be made of soft materials, such as polypropylene, polystyrene, fiber reinforced composite materials or polyimide. In a specific example, the flexible substrate can be made of polyimide, which is a wear-resistant transparent plastic with high insulation and has good temperature and oxidation resistance.
  • FIG. 2a to 2c are structural schematic diagrams of the flexible display panel manufacturing method shown in FIG. 1 at different manufacturing stages. Please refer to FIG. 2a.
  • the surface 211 of the flexible substrate 21 is formed with a nano-array structure.
  • the highly ordered nano-array structure can Expose a large number of dominant crystal planes that are conducive to charge separation, so it has strong adsorption and desorption capabilities.
  • Step 12 Fix the carrier substrate on the nano array.
  • the carrier substrate can provide a clean and flat supporting surface for the production of the flexible display panel. After the flexible display panel is prepared, it needs to be separated from the flexible substrate in the subsequent manufacturing process.
  • the carrier substrate is a rigid substrate, which can be prepared by using any suitable type of rigid material, such as rigid plastic.
  • the rigid substrate can provide convenience for subsequent transportation of the flexible substrate, and avoid damage to the flexible substrate during transportation.
  • the process of fixing the carrier substrate 22 on the flexible substrate 21 is the adsorption process of the carrier substrate 22 and the flexible substrate 21.
  • the nanoarray structure makes the flexible substrate 21 and the carrier substrate 22 separate There is a strong van der Waals force between them.
  • the nano-array structure can make the surface 211 of the flexible substrate 21 have a strong adsorption capacity, so that the adhesion between the flexible substrate 21 and the carrier substrate 22 is increased. The close contact with the carrier substrate 22 will be maintained, and the flexible base 21 will not be separated from the carrier substrate 22.
  • Step 13 forming a device functional layer on the surface of the flexible base away from the carrier substrate.
  • the device functional layer refers to one or more display devices with various structures in the flexible display panel.
  • the flexible display panel is an Organic Light-Emitting Diode (OLED) display panel, which can form hole transport on the flexible substrate Layers, light-emitting layers and electron transport layers, or other various structures to form an OLED display.
  • OLED Organic Light-Emitting Diode
  • the flexible display panel is electronic paper, an electronic paper display device or the like can be formed on the flexible substrate, and the final device functional layer formed can be determined according to different designs or needs.
  • Step 14 Separate the flexible base and the carrier substrate to obtain the flexible display panel.
  • a preliminary formed flexible display panel is obtained. Before the final product leaves the factory, the flexible substrate needs to be separated from the carrier substrate.
  • the traditional method of separating the flexible substrate from the carrier substrate requires the use of laser technology and mechanical technology for peeling, that is, the two production processes of laser lift-off (LLO) and mechanical separation (Mechanical De-lamination) remove the flexible substrate from Peel off the carrier substrate.
  • LLO laser lift-off
  • Mechanism Mechanical De-lamination
  • the flexible substrate and the carrier substrate are tightly fixed based on a nano-array, and the feature size of the structure has reached the nanometer level, and the distance between neighbors in the array is usually only tens of nanometers, van der Waals force, etc.
  • the intermolecular force has a very important influence on the mechanical behavior of the nanoarray.
  • the flexible substrate 21 Since the intermolecular force between the flexible substrate 21 and the carrier substrate 22 in the desorption process is reduced compared to the intermolecular force during the adsorption process, the flexible substrate 21 has a strong desorption capacity, which only requires mechanical By means of separation, the flexible base 21 and the carrier substrate 22 can be separated.
  • the mechanical separation described above can be achieved by using a cutting knife, a mechanical roller, etc. to separate the flexible base from the carrier substrate.
  • the flexible substrate of the flexible display panel manufactured by the method has a nano-array structure, and the intermolecular force has a very important influence on the mechanical behavior of the nano-array. Therefore, the flexible substrate has a surface with a nano-array structure, which has strong adsorption and desorption capabilities.
  • the intermolecular force gradually decreases, and only a simple mechanical separation step is required. , The separation of the flexible base and the carrier substrate can be achieved.
  • the force between the flexible base and the carrier substrate is relatively large.
  • the mechanical separation method is used for separation.
  • the flexible substrate of the nano-array structure has a simple separation process, which reduces the cost compared with the addition of the laser lift-off process.
  • the laser lift-off is likely to burn the surface of the flexible substrate due to the high temperature of the laser, resulting in a lower yield rate of the flexible display panel
  • the use of a flexible substrate with a nano-array structure reduces the impact factor and improves the yield of flexible display panels.
  • the embodiment of the present application uses polyimide as the raw material for the flexible substrate, and prepares the polyimide nanowire array by the porous alumina template infiltration method. Examples are explained.
  • FIG. 3 is a schematic diagram of the preparation process of forming a polyimide nanowire array on the surface of a flexible substrate provided by an embodiment of the application. As shown in FIG. 3, it includes the following steps:
  • Step 31 Prepare a porous alumina template.
  • This step mainly prepares nano-scale porous alumina, which has a special microstructure and rich pore structure, and can be used as a template for subsequent preparation of flexible substrates with nano-arrays.
  • the porous alumina template can be prepared by a two-step oxidation method.
  • the specific method for preparing the porous alumina template by the two-step oxidation method is as follows:
  • the aluminum sheet is immersed in an oxalic acid solution for the first anodization, and preliminary formed aluminum oxide is generated on the surface of the aluminum sheet.
  • the aluminum sheet before the aluminum sheet is subjected to the first anodization, can also be polished to remove the mechanical damage on the surface of the aluminum sheet to improve the smoothness of the surface.
  • the aluminum sheet can be immersed in a mixture of perchloric acid and ethanol for polishing.
  • organic acids such as phosphoric acid or chromic acid are used to remove the aluminum oxide film on the surface of the aluminum oxide that is preliminarily formed.
  • the aluminum sheet after the aluminum oxide film is removed is immersed again in the oxalic acid solution for a second anodization to obtain a porous aluminum oxide template.
  • an appropriate amount of phosphoric acid solution can also be used to carry out through-holes and then expand the holes to obtain the final porous alumina template.
  • Step 32 Spread the polyamide acid solution on the surface of the porous alumina template to generate a polyimide nanowire array.
  • the polyamide solution can obtain electrons to become polyimide, and spread out on the surface of the porous alumina template quickly, and finally the polyimide enters the template under the siphon effect of capillary force. After the holes are infiltrated for a period of time, a flexible substrate with a nano-array on the surface is formed.
  • step 32 may include the following steps:
  • Step 321 Place the aluminum sheet with the porous alumina template on the first carrier.
  • the first carrier is a device used to provide a reaction place for the manufacturing process and facilitate the movement and fixation of the aluminum sheet during the manufacturing process.
  • Step 322 Spread the polyamide acid solution on the porous alumina template.
  • Step 323 curing and drying to form a flexible substrate.
  • the surface of the flexible substrate and the porous alumina template can be formed into a nano-array.
  • Step 324 Set a second carrier on the side of the flexible substrate away from the aluminum sheet.
  • the second carrier is another carrier different from the first carrier. Its function is the same as that of the first carrier, and it is also convenient to provide a basis for reaction in the production process.
  • Step 325 Turn over the flexible substrate, and remove the first carrier and the aluminum sheet.
  • copper chloride solution replacement or similar methods can be used to remove part of the aluminum sheet and only the porous alumina template remains.
  • Step 326 Remove the porous alumina template to obtain a polyimide substrate with a nanowire array formed on the surface where the flexible substrate and the porous alumina template are connected.
  • an alkaline solution etching method can be used to remove the porous alumina template to finally obtain a polyimide nanowire array.
  • a sodium hydroxide solution of a specific concentration can be used to remove the porous alumina template.
  • the step of forming a device functional layer on the surface of the flexible substrate away from the carrying substrate may specifically include:
  • the flexible base is turned over again and the second carrier is removed, thereby exposing the surface of the flexible base that is separated from the carrier substrate.
  • the exposed surface is a smooth and flat surface, which can provide a very good deposition plane for making multiple functional devices.
  • the carrier substrate is located at the bottom of the flexible base to provide support.
  • an OLED array is prepared on the surface of the flexible base that is separated from the carrier substrate.
  • the preparation of the OLED array can be completed by any suitable one or more manufacturing processes. It is well-known to those skilled in the art and will not be repeated here.
  • the carrier substrate and the flexible base are separated by mechanical separation to complete the manufacture of the flexible display panel.
  • the manufacturing process of the protective film layer may be added. That is, a protective film layer is formed on the surface of the device functional layer so as to cover the device functional layer.
  • the protective film layer covers the functional layer of the device, which can provide a protective effect and avoid damage to the OLED device due to air oxidation and water mist during use.
  • the protective film layer can be made of any suitable flexible material, as long as it has sufficient sealing and wear resistance.
  • FIG. 4 is a schematic diagram of a manufacturing method of a flexible display panel provided in another embodiment of the application in various manufacturing processes. The manufacturing method of the flexible display panel will be described in detail below in conjunction with the manufacturing process shown in FIG. 4.
  • the preparation of the flexible substrate for the nanoarray includes:
  • the aluminum sheet is subjected to secondary oxidation to obtain the aluminum sheet A whose surface is the porous alumina template A1.
  • the aluminum sheet A whose surface is the porous alumina template A1 is placed on the first carrier B with the porous alumina template A1 facing upward.
  • the polyimide flexible substrate C can be formed.
  • the side of the polyimide flexible substrate C that is connected to the porous alumina template A1 is a surface with a nano-array structure.
  • the aluminum sheet A and the porous alumina template A1 need to be removed.
  • the specific method for removing the aluminum sheet A and the porous alumina template A1 is:
  • a second carrier D is provided on the side of the polyimide flexible substrate C away from the aluminum sheet A, as a support for the polyimide flexible substrate C. Then, the polyimide flexible substrate C is turned over so that the first carrier B and the aluminum sheet A are located on the upper part and the first carrier B and the aluminum sheet A are removed.
  • the nanowire array formed on the surface of the polyimide flexible substrate C and the porous alumina template A1 can be exposed.
  • the carrier substrate E is fixed and covered on the surface of the polyimide flexible substrate C.
  • the carrier substrate E is tightly fixed on the polyimide flexible substrate C by the intermolecular force of the nanowire array.
  • the polyimide flexible substrate C is turned over again and the second carrier D is removed, exposing the surface of the polyimide flexible substrate C that is separated from the carrier substrate E.
  • an OLED array is prepared on the surface of the polyimide flexible substrate C separated from the carrier substrate E to form a device functional layer F.
  • the device functional layer F can be set to a corresponding structure according to actual needs, and can be compatible with all flexible display panel device functional layers F.
  • modification steps need to be performed so that the finished flexible display panel can meet the requirements of the actual application environment. These modification steps include:
  • the protective film layer G covers the device functional layer and plays a protective role to prevent internal devices from being affected by oxidation, moisture, or scratches.
  • the flexible display panel is turned over again so that the carrier substrate E is located on the top layer. Then, the carrier substrate E is separated and removed by means of mechanical separation.
  • the embodiment of the present application also provides a flexible display panel.
  • the flexible display panel includes: a flexible substrate and a device function layer.
  • the device functional layer is disposed on the first surface of the flexible substrate; the second surface of the flexible substrate facing away from the device functional layer is a nano-array structure, which is used for preparing the flexible panel during the manufacturing process of the flexible panel.
  • the substrate provides adsorption or desorption capacity.
  • the flexible substrate of the flexible display panel has a nano-array structure, and the intermolecular force has a very important influence on the mechanical behavior of the nano-array. Therefore, the flexible substrate has a surface with a nano-array structure, which has strong adsorption and desorption capabilities.
  • the process of separating the flexible substrate from the carrier substrate is involved, and the process of separating the flexible substrate from the carrier substrate Among them, the intermolecular force gradually decreases, and the flexible substrate has a strong desorption capacity. Only a simple mechanical separation step is required to realize the separation of the flexible substrate and the carrier substrate, which reduces the manufacturing cost of the flexible display panel.

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Abstract

一种柔性显示面板及其制作方法。制作方法包括：在柔性基底（21，C）的表面（211）形成纳米阵列（11）；将承载基板（22，E）固定在纳米阵列上（12）；在柔性基底（21，C）远离承载基板（22，E）的表面形成器件功能层（F）（13）；分离柔性基底（21，C）与承载基板（22，E），获得柔性显示面板（14）。柔性显示面板制作方法制作得到的柔性显示面板的柔性基底（21，C）具有纳米阵列结构，因此，具有较强的吸附能力和脱吸附能力，在柔性基底（21，C）与承载基板（22，E）分离的过程中，只需通过简单的机械分离步骤，即可实现柔性基底（21，C）与承载基板（22，E）的分离，分离工艺简单，且成本较低。

Description

柔性显示面板及其制作方法 技术领域
本申请涉及柔性显示技术领域，特别是涉及一种柔性显示面板及其制作方法。
背景技术
柔性显示面板是由柔软的材料制成的可弯曲的显示装置。柔性显示面板的制备过程大致如下：首先，在承载基板上形成一层柔性基底；然后，对柔性基底施加各种工艺，在完成柔性基底的各种制作工艺之后，再将承载基板与柔性基板分离，得到柔性显示面板。
发明人在实现本发明的过程中发现：传统的将承载基板与柔性基板分离的方法中，需要先经过激光剥离实现初步分离，再通过机械剥离实现完全分离，上述需要经过两次分离的步骤相对复杂，且由于激光剥离和机械剥离使用的设备均较昂贵，传统的分离方式成本太高。
发明内容
本申请旨在提供一种柔性显示面板及其制作方法，以解决传统柔性显示面板制备过程中，柔性显示面板与承载基板分离成本高的技术问题。
为解决上述技术问题，本申请实施例采用的一个技术方案是：提供一种柔性显示面板制作方法，所述方法包括：在柔性基底的表面形成纳米阵列；将承载基板固定在所述纳米阵列上；在所述柔性基底远离所述承载基板的表面形成器件功能层；分离所述柔性基底与所述承载基板，获得所述柔性显示面板。
可选地，所述柔性基底表面的纳米阵列为聚酰亚胺纳米线阵列。
可选地，所述在柔性基底的表面形成纳米阵列的步骤，具体包括：制备多孔氧化铝模板；将聚酰氨酸溶液铺展在所述多孔氧化铝模板的表面，生成所述聚酰亚胺纳米线阵列。
可选地，所述制备多孔氧化铝模板的步骤，具体包括：采用二步阳极氧化法制备所述多孔氧化铝模板。
可选地，所述采用二步阳极氧化法制备所述多孔氧化铝模板的步骤，具体包括如下步骤：将铝片浸润在草酸溶液中进行第一次阳极氧化，在所述铝片的表面生成初步成型的氧化铝；除去所述初步成型的氧化铝表面的氧化铝薄膜；将除去氧化铝薄膜后的铝片再次浸润在草酸溶液中进行第二次阳极氧化，得到多孔氧化铝模板。
可选地，所述将聚酰氨酸溶液铺展在所述多孔氧化铝模板的表面，生成所述聚酰亚胺纳米线阵列的步骤，具体包括：将表面为所述多孔氧化铝模板的铝片放置在第一载体上；在所述多孔氧化铝模板上铺展聚酰氨酸溶液；固化干燥，形成柔性基底；在所述柔性基底远离所述铝片的一面设置第二载体；翻转所述柔性基底，并移除所述第一载体和所述铝片；去除所述多孔氧化铝模板，以得到在所述柔性基底与所述多孔氧化铝模板相接的表面形成纳米线阵列的聚酰亚胺基底。
可选地，通过碱腐蚀法去除所述多孔氧化铝模板。
可选地，所述在所述柔性基底远离所述承载基板的表面形成器件功能层的步骤具体包括：再次翻转所述柔性基底并移除所述第二载体，暴露所述柔性基底与所述承载基板相离的表面；在所述柔性基底与所述承载基板相离的表面制备OLED阵列。
可选地，所述方法还包括：在所述器件功能层的表面生成保护膜层，所述保护膜层覆盖所述器件功能层。
可选地，所述柔性基底与所述承载基板通过机械方式分离。
为解决上述技术问题，本申请实施例采用的另一个技术方案是：提供一种柔性显示面板，所述柔性显示面板包括：柔性基底；器件功能层，所述器件功能层设置于所述柔性基底的第一表面；所述柔性基底背离所述器件功能层的第二表面为纳米阵列结构，用于在所述柔性面板制备过程中，为所述柔性基底提供吸附或者脱吸附能力。
本申请实施例提供的柔性显示面板制作方法，其制作得到的柔性显示面板的柔性基底具有纳米阵列结构，分子间作用力对纳米阵列的力学行为的具有非常重要的影响。因此，其具有较强的吸附能力和脱吸附能力，在柔性基底与承载基板分离的过程中，其只需通过简单的机械分离步骤，即可实现柔性基底与承载基板的分离，分离工艺简单，且成本较低。
附图说明
图1是本申请其中一个实施例提供的一种柔性显示面板制作方法的流程示意图；
图2a至图2c是图1示出的柔性显示面板制作方法在不同制作阶段的结构示意图；
图3是本申请根据一些实施例示出的在柔性基底表面形成聚酰亚胺纳米线阵列的制备流程示意图；
图4是本申请另一实施例提供一种柔性显示面板制作过程的结构示意图。
具体实施方式
为了使本申请的目的、方案及优点更加清楚明白，以下结合实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。此外，下面所描述的本申请不同实施例中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
本申请实施例针对现有柔性显示面板的制作方法中，因柔性显示面板中的承载基板和柔性基底分离的过程中需要先采用激光分离实现承载基板和柔性基底连接面的疏松，然后采用机械分离彻底分离承载基板和柔性基底，其分离工艺繁琐，所需要的工艺制程较多。且在激光剥离步骤，容易对柔性基底的表面造成破坏，得到柔性显示面板良品率较低的问题，提出了一种柔性显示面板的制作方法，本申请实施例能够改善该缺陷。
以下结合附图和实施例对本申请做进一步说明。
请参阅图1，图1是本申请其中一个实施例提供的一种柔性显示面板制作方法的流程示意图，所述方法包括如下步骤：
步骤11、在柔性基底的表面形成纳米阵列。
该柔性基底是柔性显示面板的支撑结构，具有相应的厚度和强度，其可以选用柔软的材料制成，例如：聚丙烯、聚苯乙烯、纤维增强复合材料或聚酰亚胺等。在一具体示例中，该柔性基底具体可以选用聚酰亚胺制备得到，聚酰亚胺为高绝缘性的耐磨透明塑料，具有良好的耐温和耐氧化性能。
图2a至图2c是图1示出的柔性显示面板制作方法在不同制作阶段的结构示意图，请参阅图2a，柔性基底21的表面211形成有纳米阵列结构，该高度有序的纳米阵列结构能够暴露大量有利于电荷分离的优势晶面，因此具有较强的吸附能力和脱吸附能力。
步骤12、将承载基板固定在所述纳米阵列上。
承载基板可以为生产柔性显示面板提供一干净平整的支撑面，在柔性显示面板制备完成后，需要与后续制程中的柔性基底进行分离。
在本申请实施例中，所述承载基板为硬质基板，其具体可以采用任何合适类型的硬质材料制备获得，例如硬质塑料。硬质基板可以为后续柔性基底的运输提供方便，避免柔性基底在运输过程中出现损坏。
其中，如图2b所示，承载基板22固定在柔性基底21上的过程，即为承载基板22与柔性基底21的吸附过程，在吸附过程，该纳米阵列结构使得柔性基底21与承载基板22之间具有较强的范德华力，通过范德华力的叠加，纳米阵列结构可以让柔性基底21的表面211具有较强的吸附能力，使得柔性基底21与承载基板22的粘附力增大，柔性基底21将保持与承载基板22的紧密接触，柔性基底21不会与承载基板22脱离。
步骤13、在所述柔性基底远离所述承载基板的表面形成器件功能层。
该器件功能层是指柔性显示面板中一个或者多个各种结构的显示器件，如柔性显示面板为有机发光(Organic Light-Emitting Diode,OLED)显示面板，则可以在柔性基底上形成空穴传输层、发光层和电子传输层，或者其他的各种结构以组成OLED显示器。又例如，柔性显示面板为电子纸，则可以在柔性基底上形成电子纸显示器件等，其最终形成的器件功能层可以依据不同的设计或者需要而确定。
步骤14、分离所述柔性基底与所述承载基板，获得所述柔性显示面板。
在柔性基底上形成相应的器件功能层后即得到初步成型的柔性显示面板。最终产品出厂前，需要将柔性基底与承载基板进行分离。
传统的柔性基底与承载基板的分离方法需要使用激光工艺和机械工艺进行剥离，即通过激光剥离(Laser Lift-off，LLO)和机械分离(Mechanical De-lamination)这两道制作工程将柔性基底从承载基板上剥离取下来。
然而在本申请实施例中，柔性基底与承载基板之间基于纳米阵列而紧密固 定，其结构特征尺寸已经达到纳米级，且阵列内相邻之间的距离通常仅有几十纳米，范德华力等分子间作用力对纳米阵列的力学行为的具有非常重要的影响。
在脱吸附过程，如图2c所示，随着柔性基底21在与承载基板22之间的夹角θ增大，其分子间作用力逐渐减小，柔性基底21与承载基板22之间的脱附力阈值变小，因此，其仅需较小的外部作用力F 1即可实现柔性基底21与承载基板22的分离。并且，由于柔性基底21表面211形成有纳米阵列结构，柔性基底21在与承载基板22呈线性分离，其脱附力进一步减小。
由于柔性基底21在与承载基板22在脱吸附过程的分子间作用力相对于其在吸附过程的分子间作用力减小，因此，柔性基底21具有较强的脱吸附能力，其仅需通过机械方式分离即可实现柔性基底21与承载基板22的分离。
上述机械方式分离，可以是使用切割刀、机械滚轴等来实现柔性基底与承载基板的分离。
本申请实施例提供的柔性显示面板制作方法，其制作得到的柔性显示面板的柔性基底具有纳米阵列结构，分子间作用力对纳米阵列的力学行为具有非常重要的影响。因此，柔性基底具有纳米阵列结构的表面其具有较强的吸附能力和脱吸附能力，在柔性基底与承载基板分离的过程中，其分子间作用力逐渐减小，只需要通过简单的机械分离步骤，即可实现柔性基底与承载基板的分离。
相对于传统的柔性基底与承载基板之间作用力较大，其需要通过激光剥离的方式使柔性基底与承载基板的连接表面变疏松后，再采用机械分离分方式分离，本申请实施例使用具有纳米阵列结构的柔性基底，分离工艺简单，相对于增加激光剥离工艺程序，减少了成本；另一方面，激光剥离由于激光的高温，容易灼伤柔性基底的表面，使得柔性显示面板的良品率较低，而使用具有纳米阵列结构的柔性基底，其影响因子减少，提高了柔性显示面板的良品率。
为了详细说明表面具有纳米阵列的柔性基底的制作过程，本申请实施例以所述柔性基底选用聚酰亚胺为原料，并通过多孔氧化铝模板浸润法来制备得到聚酰亚胺纳米线阵列为例进行说明。
图3为本申请实施例提供的在柔性基底表面形成聚酰亚胺纳米线阵列的制备流程示意图，如图3所示，其包括如下步骤：
步骤31、制备多孔氧化铝模板。
此步骤主要制备纳米级多孔氧化铝，该纳米级多孔氧化铝具有特殊的微结 构，孔道结构丰富，可作为模板应用于后续制备具有纳米阵列的柔性基底中。
所述多孔氧化铝模板可以采用二步氧化法制备得到。在一具体示例中，利用二步氧化法制备得到多孔氧化铝模板具体方法如下：
首先，将铝片浸润在草酸溶液中进行第一次阳极氧化，在所述铝片的表面生成初步成型的氧化铝。
较佳的是，在将铝片进行第一次阳极氧化之前，还可以对铝片进行抛光处理，去除铝片表面的机械损伤以提高其表面的光滑度。例如，可以将铝片浸润在高氯酸和乙醇的混合液中进行抛光。
然后，选用磷酸或者铬酸等有机酸除去初步成型的氧化铝表面的氧化铝薄膜。
最后，将除去氧化铝薄膜后的铝片再次浸润在草酸溶液中进行第二次阳极氧化，得到多孔氧化铝模板。在一些实施例中，为了得到较大孔洞的多孔氧化铝模板，还可以选用适量的磷酸溶液进行通孔再扩孔，得到最终的多孔氧化铝模板。
步骤32、将聚酰氨酸溶液铺展在所述多孔氧化铝模板的表面，生成聚酰亚胺纳米线阵列。
聚酰氨酸溶液由于表面能较低，能够获得电子变成聚酰亚胺，并较快的在多孔氧化铝模板的表面铺展开来，最后聚酰亚胺在毛细管力的虹吸作用下进入模板孔洞，并浸润一段时间后，形成表面具有纳米阵列的柔性基底。
具体的，与实际的柔性显示面板制程相结合，步骤32可以包括如下步骤：
步骤321、将表面为所述多孔氧化铝模板的铝片放置在第一载体上。
第一载体是用于为制程提供反应场所，便于在制作过程中移动和固定铝片的设备。
步骤322、在所述多孔氧化铝模板上铺展聚酰氨酸溶液。
步骤323、固化干燥，形成柔性基底。
由于多孔氧化铝模板的存在，在固化干燥后，可以使柔性基底与多孔氧化铝模板相接的表面形成纳米阵列。
步骤324、在所述柔性基底远离所述铝片的一面设置第二载体。
第二载体是与第一载体相区别的另一个载体。其作用与第一载体相同，同样也是便于在制作过程中提供反应的基础。
步骤325、翻转所述柔性基底，并移除所述第一载体和所述铝片。
此步骤可以选用氯化铜溶液置换等类似的方式，将铝片部分除去仅剩余多孔氧化铝模板。
步骤326、去除所述多孔氧化铝模板，以得到在所述柔性基底与所述多孔氧化铝模板相接的表面形成纳米线阵列的聚酰亚胺基底。
此步骤可以选用碱性溶液腐蚀的方式来去除多孔氧化铝模板，以最终得到聚酰亚胺纳米线阵列，例如，可以选用特定浓度的氢氧化钠溶液去除多孔氧化铝模板。
在一些实施例中，基于由第二载体承载的柔性基底，所述在所述柔性基底远离所述承载基板的表面形成器件功能层的步骤具体可以包括：
首先，再次翻转所述柔性基底并移除所述第二载体，从而暴露所述柔性基底与所述承载基板相离的表面。
暴露的表面是光滑平整的表面，可以提供非常良好的沉积平面用于制作多个功能器件。承载基板则位于柔性基底的底部以提供支持。
然后，在所述柔性基底与所述承载基板相离的表面制备OLED阵列。具体可以通过任何合适的，一个或者多个制程工艺来完成该OLED阵列的制备。其为本领域技术人员所熟知，在此不作赘述。最后通过机械分离的方式将承载基板与柔性基底分离即可完成柔性显示面板的制作。
在另一些实施例中，在完成OLED阵列的制备以后，还可以增加保护膜层的制程。亦即，在所述器件功能层的表面生成保护膜层以使覆盖所述器件功能层。
该保护膜层覆盖于器件功能层上，可以提供保护作用，避免在使用过程中因空气氧化，水雾问题等造成OLED器件的损伤。保护膜层可以使用任何合适的柔性材料制成，只需要具有足够的密封和耐磨性能即可。
图4为本申请另一实施例提供的柔性显示面板制作方法在各个制程的示意图。以下结合图4所示的制作过程，详细描述柔性显示面板制作方法。
如图4所示，对于纳米阵列的柔性基底制备包括：
首先，将铝片进行二级氧化以后得到表面为多孔氧化铝模板A1的铝片A。
然后，将表面为多孔氧化铝模板A1的铝片A放置在第一载体B上，多孔氧化铝模板A1的一面朝上。
最后，在多孔氧化铝模板A1上铺展聚酰氨酸溶液并固化干燥后，即可形成聚酰亚胺柔性基底C。该聚酰亚胺柔性基底C与多孔氧化铝模板A1相接的一面为具有纳米阵列结构的表面。
为了暴露聚酰亚胺柔性基底C的纳米阵列结构，还需要去除铝片A和多孔氧化铝模板A1。该铝片A和多孔氧化铝模板A1的去除方式具体是：
首先在所述聚酰亚胺柔性基底C远离铝片A的一面设置第二载体D，作为聚酰亚胺柔性基底C的支撑。然后，翻转所述聚酰亚胺柔性基底C，令第一载体B和铝片A位于上部并移除第一载体B和铝片A。
最后，通过碱腐蚀法等去除所述多孔氧化铝模板A1，可以将所述聚酰亚胺柔性基底C与所述多孔氧化铝模板A1相接的表面形成的纳米线阵列暴露出来。
在获得具有纳米线阵列表面的聚酰亚胺柔性基底C以后，可以以此为基础，进行如下的制备过程以获得最终的柔性显示面板产品：
首先，将承载基板E固定覆盖在聚酰亚胺柔性基底C的表面。承载基板E通过纳米线阵列的分子间作用力紧密固定在聚酰亚胺柔性基底C上。然后，再次翻转所述聚酰亚胺柔性基底C并移除所述第二载体D，暴露所述聚酰亚胺柔性基底C与所述承载基板E相离的表面。最后，通过气相沉积、光刻等一个或者多个制程，在所述聚酰亚胺柔性基底C与所述承载基板E相离的表面制备OLED阵列，形成器件功能层F。该器件功能层F具体可以根据实际需要而设置为对应的结构，可以与所有的柔性显示面板器件功能层F兼容。
在制备获得最终的柔性显示面板以后，还需要执行一些修饰性步骤使得柔性显示面板的成品可以适应实际应用环境的需求。这些修饰性步骤包括：
继续在所述OLED阵列的表面生成保护膜层G。所述保护膜层G覆盖所述器件功能层，起到保护作用，避免内部器件受到氧化、水汽或者刮擦等的影响。
在生成保护膜层G以后，再次对柔性显示面板进行翻转，令承载基板E位于最顶层。然后，通过机械分离的方式，分离并去除所述承载基板E。
本申请实施例还提供一种柔性显示面板。所述柔性显示面板包括：柔性基底和器件功能层。所述器件功能层设置于所述柔性基底的第一表面；所述柔性基底背离所述器件功能层的第二表面为纳米阵列结构，用于在所述柔性面板制备过程中，为所述柔性基底提供吸附或者脱吸附能力。
本申请实施例提供的柔性显示面板，其柔性显示面板的柔性基底具有纳米 阵列结构，分子间作用力对纳米阵列的力学行为具有非常重要的影响。因此，柔性基底具有纳米阵列结构的表面其具有较强的吸附能力和脱吸附能力，在柔性显示面板制作过程中，涉及到柔性基底与承载基板的分离过程，在柔性基底与承载基板分离的过程中，其分子间作用力逐渐减小，柔性基底具有较强的脱吸附能力，只需要通过简单的机械分离步骤，即可实现柔性基底与承载基板的分离，减少了柔性显示面板的制作成本。
以上所述仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (11)

  1. 一种柔性显示面板制作方法，其特征在于，所述方法包括：
    在柔性基底的表面形成纳米阵列；
    将承载基板固定在所述纳米阵列上；
    在所述柔性基底远离所述承载基板的表面形成器件功能层；
    分离所述柔性基底与所述承载基板，获得所述柔性显示面板。
  2. 根据权利要求1所述的制作方法，其特征在于，所述柔性基底表面的纳米阵列为聚酰亚胺纳米线阵列。
  3. 根据权利要求2所述的制作方法，其特征在于，所述在柔性基底的表面形成纳米阵列，包括：
    制备多孔氧化铝模板；
    将聚酰胺酸溶液铺展在所述多孔氧化铝模板的表面，生成所述聚酰亚胺纳米线阵列。
  4. 根据权利要求3所述的制作方法，其特征在于，所述制备多孔氧化铝模板，包括：
    采用二步阳极氧化法制备所述多孔氧化铝模板。
  5. 根据权利要求4所述的制作方法，其特征在于，所述采用二步阳极氧化法制备所述多孔氧化铝模板，包括：
    将铝片浸润在草酸溶液中进行第一次阳极氧化，在所述铝片的表面生成初步成型的氧化铝；
    除去所述初步成型的氧化铝表面的氧化铝薄膜；
    将除去氧化铝薄膜后的铝片再次浸润在草酸溶液中进行第二次阳极氧化，得到多孔氧化铝模板。
  6. 根据权利要求5所述的制作方法，其特征在于，所述将聚酰胺酸溶液铺展在所述多孔氧化铝模板的表面，生成所述聚酰亚胺纳米线阵列，包括：
    将表面为所述多孔氧化铝模板的铝片放置在第一载体上；
    在所述多孔氧化铝模板上铺展聚酰胺酸溶液；
    固化干燥，形成聚酰亚胺柔性基底；
    在所述聚酰亚胺柔性基底远离所述铝片的一面设置第二载体；
    翻转所述聚酰亚胺柔性基底，并移除所述第一载体和所述铝片；
    去除所述多孔氧化铝模板，以得到在所述聚酰亚胺柔性基底与所述多孔氧化铝模板相接的表面形成纳米线阵列的聚酰亚胺基底。
  7. 根据权利要求6所述的制作方法，其特征在于，通过碱腐蚀法去除所述多孔氧化铝模板。
  8. 根据权利要求6所述的制作方法，其特征在于，所述在所述柔性基底远离所述承载基板的表面形成器件功能层的步骤具体包括：
    再次翻转所述聚酰亚胺柔性基底并移除所述第二载体，暴露所述聚酰亚胺柔性基底与所述承载基板相离的表面；
    在所述聚酰亚胺柔性基底与所述承载基板相离的表面制备OLED阵列。
  9. 根据权利要求1所述的制作方法，其特征在于，所述方法还包括：
    在所述器件功能层的表面生成保护膜层，所述保护膜层覆盖所述器件功能层。
  10. 根据权利要求1所述的制作方法，其特征在于，所述柔性基底与所述承载基板通过机械方式分离。
  11. 一种柔性显示面板，其特征在于，包括：
    柔性基底；
    器件功能层，所述器件功能层设置于所述柔性基底的第一表面，所述柔性基底背离所述器件功能层的第二表面为纳米阵列结构，用于在所述柔性面板制备过程中，为所述柔性基底提供吸附能力或者脱吸附能力。
PCT/CN2019/072698 2019-01-22 2019-01-22 柔性显示面板及其制作方法 Ceased WO2020150902A1 (zh)

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