WO2020138906A1 - Appareil de moulage et procédé de production de corps moulé - Google Patents

Appareil de moulage et procédé de production de corps moulé Download PDF

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Publication number
WO2020138906A1
WO2020138906A1 PCT/KR2019/018381 KR2019018381W WO2020138906A1 WO 2020138906 A1 WO2020138906 A1 WO 2020138906A1 KR 2019018381 W KR2019018381 W KR 2019018381W WO 2020138906 A1 WO2020138906 A1 WO 2020138906A1
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WIPO (PCT)
Prior art keywords
composition
stage
unit
heat
heat setting
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PCT/KR2019/018381
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English (en)
Korean (ko)
Inventor
키노시타요시히로
나리마츠에이이치로
Original Assignee
주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to US17/273,578 priority Critical patent/US20210331386A1/en
Priority to KR1020217003212A priority patent/KR102390661B1/ko
Priority to CN201980055420.0A priority patent/CN112601657B/zh
Publication of WO2020138906A1 publication Critical patent/WO2020138906A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/16—Both compacting and sintering in successive or repeated steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00—Producing shaped prefabricated articles from the material
    • B28B1/30—Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205—Means for applying layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/227—Driving means
    • B29C64/232—Driving means for motion along the axis orthogonal to the plane of a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/295—Heating elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/307—Handling of material to be used in additive manufacturing
    • B29C64/321—Feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/307—Handling of material to be used in additive manufacturing
    • B29C64/321—Feeding
    • B29C64/336—Feeding of two or more materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present invention relates to a molding apparatus and a method for manufacturing a molded body.
  • a photolithography method which is a three-dimensional molding method of a typical inorganic material, is disclosed in Japanese Patent No. 4800074 (Patent Document 1) and the like.
  • the molding apparatus includes a liquid tank for accommodating a liquid precursor in which inorganic particles are dispersed in a liquid photocurable composition, a stage provided so as to be liftable inside the liquid tank, and light for curing the photocurable composition from above the liquid tank It is equipped with a light source for irradiating.
  • the curing of the first layer is performed by setting the stage at a position slightly lower than the liquid precursor, and irradiating the liquid precursor positioned on the stage with a predetermined first layer pattern. After curing the precursor of the first layer according to a predetermined pattern, the uncured liquid precursor of the first layer is washed and removed (cleaning process). Next, curing of the second layer is performed just above the first layer by slightly lowering the stage and irradiating light with a predetermined second layer pattern. By repeating such an operation, the precursor is cured for each layer from the first layer to the uppermost layer, thereby forming a molded body having a predetermined three-dimensional shape composed of a plurality of layers.
  • the obtained molded article is composed of a cured photocurable composition and inorganic particles dispersed therein.
  • degreasing of the photocurable composition is performed, and the organic material component in the molded body is removed (degreasing step).
  • sintering step by sintering the molded body made of the inorganic particles after degreasing at a high temperature, sintering of the inorganic particles in the molded body is performed (sintering step), thereby obtaining an inorganic material molded body having a predetermined three-dimensional shape.
  • a gap is formed in the molded body as much as the volume of the removed organic material component, and the entire molded body can be compressed by this gap by sintering, so that the dimensions of the finished molded body are assumed. It may be smaller than that, and as a result, there is a fear that the dimensional accuracy of the molded body may not satisfy the required quality.
  • defects such as cracks or breakage may occur in the molded body after sintering due to differences in the thermal expansion coefficient for each part of the molded body, and there is a concern that the quality of the molded body may not be secured. For this reason, the improvement of the quality of the molded object manufactured with a molding apparatus was calculated
  • Patent Document 1 Japanese Patent No. 4800074
  • An object of the present invention is to provide a molding apparatus capable of manufacturing a molded article containing an inorganic material with improved quality.
  • One aspect of the present invention is a supply unit for supplying a composition comprising an inorganic material intermittently or continuously toward a stage, and for thermal fixation configured to perform at least thermal fixation on the stage for the composition supplied from the supply unit.
  • a heating unit comprising a heat source, an information acquiring unit for acquiring information regarding at least one of the geometrical, physical, and chemical states of the heat-setting composition, and a molding cycle comprising supplying the composition and heat-setting.
  • It is a molding apparatus for three-dimensional molding that controls the supply unit and the heating unit to repeat, and includes a control unit that controls at least one of the supply unit and the heating unit based on the information.
  • control unit may control the supply unit and the heating unit to repeat the molding cycle at least along the stage.
  • control unit may determine at least one of a position at which the composition is supplied and a position at which heat setting is performed based on the information.
  • control unit may control the supply unit and the heating unit so as to repeatedly supply and heat fixation of the composition in at least the same plane.
  • the supply unit includes a first supply that intermittently or continuously supplies a first composition comprising a first inorganic material toward the stage, and a second weapon different from the first inorganic material You may have a 2nd feeder which intermittently or continuously supplies the 2nd composition containing a material toward the said stage.
  • the heating unit includes a first heat setting heat source configured to perform at least heat setting on the stage for the first composition supplied from the first supply unit, and the second composition supplied from the second supply unit.
  • a second heat setting heat source configured to perform heat setting on the stage may be provided.
  • the information acquisition unit may have a photographing apparatus that photographs the composition on the stage, and the information acquisition unit is heat-solidified based on photographing data obtained from the photographing apparatus.
  • Acquire information regarding the geometrical state of the composition and the control unit performs a thermal fixation on the stage and a position for supplying the composition on the stage, based on the information regarding the geometrical state of the composition that has been thermally cured. You may decide at least one of the positions.
  • the information acquisition unit has an ultrasonic device for acquiring the information, and the ultrasonic device is configured to transmit ultrasonic waves toward the composition on the stage and receive reflected ultrasonic waves. You may work.
  • a removal unit that removes at least a portion of the composition that has solidified on the stage from the stage may be further provided, and the information acquisition unit, based on data obtained from the ultrasonic apparatus, geometrical state of the composition that has been heat-solidified. Or obtaining information regarding a physical state, and the control unit removes the at least a portion of the composition on the stage from the stage based on the information regarding the geometrical state or physical state of the heat-set composition. You may control the unit.
  • the information acquisition unit has an X-ray diffraction device for acquiring the information, and the X-ray diffraction device may be configured to measure the X-ray diffraction pattern of the composition on the stage. .
  • the information acquisition unit may acquire information regarding a physical state or a chemical state of the composition that has been heat-hardened based on the X-ray diffraction pattern measured by the X-ray diffraction apparatus, and the control unit may The heating unit may be controlled to reheat the composition on the stage based on the information regarding the physical or chemical state of the solidified composition.
  • the composition may include an organic binder in which the inorganic material is dispersed, or an organic coating surrounding the inorganic material, and the heating unit may include the organic binder or the above by applying heat to the composition.
  • the heat source for degreasing which further performs degreasing of the organic coating may be further included, and the control unit may control the heat source for degreasing so as to perform degreasing before heat setting by the heat fixation heat source.
  • the molding apparatus of the above aspect may further include an immobilization unit that immobilizes the composition on the stage.
  • the said composition may contain the organic binder containing a photocurable composition, and the said immobilization unit may contain the light source which performs photocuring of the said photocurable composition before heat setting.
  • the composition may include inorganic particles coated with an organic coating, and the immobilization unit may include a heat source for melting to heat-melt the organic coating before heat setting.
  • Another aspect of the present invention is a method of manufacturing a three-dimensional molded body from a composition comprising an inorganic material, the supply step of supplying the composition intermittently or continuously from the supply unit toward the stage, and the composition supplied from the supply unit With respect to, a heat setting step of performing at least heat setting on the stage by a heating unit, and an information acquisition step of obtaining information on at least one of a geometrical state, a physical state, and a chemical state of the heat-setting composition, and Based on information, it is a manufacturing method of a three-dimensional molded body comprising a control step of controlling at least one of the supply unit and the heating unit, and a molding cycle including the supply step and the heat setting step is repeated.
  • the molding cycle may be repeated at least along the stage.
  • the supplying step and the heat setting step may be performed repeatedly at least in the same plane.
  • the method for manufacturing a molded article of the above aspect may further include a stage moving step of moving the stage along a direction orthogonal to the stage, the molding cycle is repeated along the stage, and the molding cycle along the stage is repeated.
  • stage moving step By repeating and repeating the stage moving step, the three-dimensional molded body having a three-dimensional shape may be formed.
  • the control step may include a step of determining at least one of a position where the composition is supplied and a position where the heat setting is performed based on the information.
  • the method for manufacturing a molded article of the above aspect includes a first supply step of intermittently or continuously supplying a first composition comprising a first inorganic material toward the stage, and a second inorganic material different from the first inorganic material
  • the second composition may include a second supply step of intermittently or continuously supplying the second composition toward the stage.
  • the manufacturing method of the molded object of the said aspect WHEREIN: With respect to the said 1st composition supplied, the 1st heat setting step which performs at least heat setting on the said stage by the said heating unit, and about the supplied 2nd composition, You may include the 2nd heat setting step which performs at least heat setting on the said stage by a heating unit.
  • the information acquiring step may include a step of acquiring information on the arrangement or shape of the composition by photographing the composition on the stage with an imaging device, and the control step May include a step of determining at least one of a position for supplying the composition on the stage and a position for performing heat setting on the stage based on the information regarding the arrangement or shape of the composition.
  • the step of acquiring information includes the step of acquiring information about the density of the composition by transmitting ultrasonic waves toward the composition on the stage with an ultrasonic device and receiving reflected ultrasonic waves.
  • the control step may include a step of determining at least one of a position for supplying the composition on the stage and a position for performing heat setting on the stage, based on the information regarding the density of the composition. You may do it.
  • the step of acquiring information may include a step of acquiring information about crystallinity of the composition by measuring the X-ray diffraction pattern of the composition on the stage with an X-ray diffraction apparatus.
  • the control step may include a step of controlling the heating unit to reheat the composition on the stage based on the information regarding the crystallinity of the composition.
  • a supply unit for supplying a composition comprising an inorganic material intermittently or continuously toward a stage, and for thermal fixation configured to perform at least thermal fixation on the stage for the composition supplied from the supply unit.
  • a molding apparatus for three-dimensional molding comprising a heating unit including a heat source and a control unit controlling the supply unit and the heating unit to repeat a molding cycle including supplying the composition and heat setting at least along the stage. .
  • FIG. 1 is a schematic front view showing a molding apparatus according to a first embodiment.
  • FIG. 2 is a block diagram showing an example of a system configuration of a molding apparatus according to the first embodiment.
  • FIG. 4 is a flowchart showing an example of a method for manufacturing a molded article by the molding apparatus of the first embodiment.
  • FIG. 5 is a schematic front view showing the molding apparatus according to the second embodiment.
  • FIG. 6 is a block diagram showing an example of a system configuration of a molding apparatus according to the second embodiment.
  • FIG. 7 is a flowchart showing an example of a method for manufacturing a molded article by the molding apparatus of the second embodiment.
  • FIG. 8 is a schematic front view showing the molding apparatus according to the third embodiment.
  • FIG. 9 is a block diagram showing an example of a system configuration of a molding apparatus according to the third embodiment.
  • FIG. 11 is a flowchart showing an example of a method for manufacturing a molded body by the molding apparatus of the third embodiment.
  • heat setting laser heat setting heat source
  • XX' means'at least based on XX', and includes cases based on other elements in addition to XX.
  • the term "based on XX" is not limited to the case where XX is directly used, but also includes a case based on calculation or processing performed on XX.
  • 'XX' is an arbitrary element (for example, arbitrary information).
  • the x-direction and the y-direction are directions parallel to the horizontal plane.
  • the y-direction is a direction that intersects (for example, approximately orthogonal) the x-direction.
  • the z direction is a direction parallel to the vertical direction, and is substantially orthogonal to the x direction and the y direction.
  • FIGS. 1 to 4. 1 is a view showing the molding apparatus 1 according to the first embodiment.
  • the molding apparatus 1 can manufacture a three-dimensional molded body made of an inorganic material.
  • the term'inorganic material' refers to any material other than an organic material, and is composed of a metal simple substance, an alloy, a metal element, and a nonmetal element (for example, a metal oxide or metal nitride, metal salt, etc.), and a nonmetal element. And compounds (for example, boron nitride, etc.).
  • the forming apparatus 1 includes a chamber 10, a stage 11, a supply unit 12, an immobilization unit 14, a heating unit 16, an information acquisition unit 18, and removal A unit 20 and a control unit 22 (see FIG. 2) are provided.
  • the chamber 10 has a housing accommodating each component of the forming apparatus 1. Each component of the shaping device 1 housed inside the chamber 10 can be isolated from the outside environment. The internal pressure of the chamber 10 can be changed by a vacuum pump 10a connected to the chamber 10.
  • the stage 11 is a flat plate disposed along a horizontal plane (ie, parallel to the xy plane).
  • the thickness direction of the stage 11 is substantially parallel to the z direction.
  • the stage 11 can be moved at least in the z direction by the stage movement mechanism 11a.
  • the stage movement mechanism 11a is, for example, a rack-and-pinion type actuator driven by a motor (not shown).
  • the arrangement of the stage 11 is not necessarily limited to the above example.
  • the stage 11 may be disposed along a plane intersecting the horizontal plane.
  • the supply unit 12 has an ejector 30 spaced apart from the stage 11 and disposed above the stage 11.
  • the ejector 30 is movable by at least the ejector moving mechanism 32 in the x direction and the y direction.
  • the ejector moving mechanism 32 is, for example, a multi-joint arm driven by a motor (not shown).
  • the ejector 30 is filled with a composition P containing an inorganic material.
  • the ejector 30 can eject the composition P intermittently or continuously toward the stage 11.
  • the discharge amount for example, the volume of one drop in the case where the composition P is intermittently discharged
  • the discharge speed of the supply unit 12 can be appropriately adjusted. Details of the composition P will be described later.
  • the landing surface where the composition P is discharged from the ejector 30 and landed is a substrate 11 supported on the stage 11, the stage 11, or the like, or another composition P or material that is fixed or fixed on the stage 11 or the substrate. Any surface such as a film may be used.
  • the discharged composition P lands on the stage 11 is mainly described, but the following description also applies to the case where the composition P lands on another landing surface such as the surface of another composition P.
  • a description is also collectively referred to as a'stage' including a description when a substrate is placed on a stage.
  • the “direction along the stage” means a direction along a surface (the surface of the stage 11 in FIG.
  • the "direction to be made” means a direction orthogonal to a surface facing the ejector for discharging the composition among the surfaces of the stage.
  • the immobilization unit 14 immobilizes the ejected composition P on the stage 11.
  • the immobilization unit 14 irradiates light (for example, ultraviolet light) to a specific position where the composition P on the stage 11 is present.
  • the immobilization unit 14 can apply photostimulation to the composition P on the stage 11 and cure the photocurable composition contained in the composition P.
  • 'fixed' means that the position is substantially unchanged when no external force is applied.
  • the immobilization unit 14 includes an LED (light emitting diode; light source) 40 as a light source.
  • the LED 40 is spaced from the stage 11 and is disposed above the stage 11.
  • the LED 40 is movable at least in the x-direction and/or the y-direction by the LED moving mechanism 42, and is rotatable about, for example, the z-axis, and is also rotatable in a plane parallel to the z-axis. .
  • the LED moving mechanism 42 changes the irradiation position of the LED 40 by changing the arrangement (for example, direction and position) of the LED 40.
  • the LED moving mechanism 42 is, for example, a multi-joint arm driven by a motor (not shown).
  • the configuration of the LED 40 is not limited to the above example.
  • the LED 40 may irradiate light from the side or the lower side of the stage 11.
  • the LED moving mechanism 42 is omitted, and the arrangement of the LED 40 is permanently fixed, and the irradiation light may be scanned on the stage 11 using, for example, a lens or a reflector.
  • the LED moving mechanism 42 may be used in combination with a lens or a reflector.
  • the components of the immobilization unit 14 are not limited to LEDs, and any element capable of light irradiation such as a laser may be used. Light irradiation may be performed on the stage 11 locally for spots having a size of about 1 drop to several drops of the composition P, or may be performed for a part or all of the stage 11.
  • the LED in either the x-direction or the y-direction. It's enough if you can only move.
  • the light irradiation position of the LED 40 such as the LED moving mechanism 42, lens, reflector, etc. is controlled. The components to be said are unnecessary.
  • the heating unit 16 applies heat locally to a specific position on the stage 11, for example, by irradiating a hot wire. Thereby, the heating unit 16 can perform degreasing of the composition P fixed on the stage 11 or sintering or melt-solidifying the inorganic material contained in the composition P.
  • the term'sintering' refers to bonding of the solid particles by heating the solid particles of the inorganic material (eg, a powder such as a metal oxide or a metal nitride) to a temperature below the melting point of the inorganic material.
  • melting solidification means that the solid particles of an inorganic material (for example, particles such as metal or alloy) are heated to a temperature equal to or higher than the melting point of the inorganic material, and then the solid particles are melted, followed by natural cooling or the like. It means to solidify the alloy particles.
  • sintering and melt solidification are collectively referred to as'thermal fixation'.
  • the heating unit 16 includes a degreasing laser (heat source for degreasing) 50 and a laser for thermal fixation (heat source for thermal fixation) 52 as a heat source.
  • the degreasing laser 50 and the thermal fixation laser 52 are arranged above the stage 11 away from the stage 11.
  • the degreasing laser 50 can be moved at least in the x-direction and the y-direction by the degreasing laser movement mechanism 54, and can be rotated, for example, about the z-axis and also rotated in a plane parallel to the z-axis. It is possible.
  • the heat setting laser 52 can be moved at least in the x direction and the y direction by the heat setting laser moving mechanism 56, and can be rotated about, for example, the z axis, and is a plane parallel to the z axis. You can rotate within.
  • the degreasing laser movement mechanism 54 and the heat setting laser movement mechanism 56 are, for example, multi-joint arms driven by a motor (not shown).
  • the laser 50 for degreasing is capable of degreasing the composition P by heating the composition P to, for example, 200°C to 800°C, preferably 300°C to 500°C, by performing laser irradiation on the composition P. .
  • the laser 52 for thermal fixation is subjected to laser irradiation on the composition P, thereby heating the composition P to, for example, 500°C to 4000°C, preferably 1000°C to 3000°C, to perform thermal setting of the composition P.
  • the heating temperature is not limited to this, and may be appropriately changed depending on the type of the inorganic particles Pa or the binder Pb included in the composition P.
  • both degreasing and heat setting may be performed using a single laser.
  • the output of the single laser may be changed in the degreasing step and the heat setting step, the degreasing step is omitted, and the composition P is heated to the heat setting temperature at a time by the single laser, thereby degreasing and heat setting once. You may do it to.
  • the components of the heating unit 16 are not limited to lasers, and any element capable of local heating such as an electron beam device may be used. Moreover, heating is not limited to heating from above, For example, local heating may be performed from below.
  • the information acquisition unit 18 acquires information about at least one of the geometrical state, physical state, and chemical state of the composition P on the stage 11.
  • the information acquisition unit 18 includes an imaging device 70, an ultrasonic device 72, and an X-ray diffraction device 74. Based on various information acquired by the information acquisition unit 18, feedback control of each unit of the molding apparatus 1 can be performed. The details of the feedback control will be described later.
  • 'geometric state' means an object state that can be expressed using spatial coordinates in a three-dimensional space, and includes an object's arrangement, size, shape, and the like.
  • physical state means a state of an object that can be expressed based on physics (for example, by a physical quantity or a classification of physics), and includes density, crystal phase, and physical properties.
  • chemical state' means a state of an object that can be expressed based on chemistry, and includes a chemical composition, a chemical structure, and a charge state.
  • the imaging device 70 performs imaging of the composition P on the stage 11.
  • the imaging device 70 is spaced from the stage 11 and is disposed above the stage 11.
  • the information acquisition unit 18 is based on the photographed image, such as the landing position and timing of the composition P ejected toward the stage 11, and the geometrical size and position of the composition P already positioned on the stage 11, etc.
  • Information about the state, furthermore, the shape of the composition P (for example, the shape of heat shrinkage) is obtained.
  • the imaging device 70 can also measure the size of the composition P in the z direction by depth measurement.
  • the imaging device 70 is movable at least in the x-direction and/or the y-direction by the imaging device moving mechanism 76, and is rotatable about, for example, the z-axis, and also rotates in a plane parallel to the z-axis. It is possible.
  • the imaging device moving mechanism 76 is, for example, a multi-joint arm driven by a motor (not shown).
  • the arrangement of the imaging device 70 is not limited to the above example, and one or a plurality of imaging devices 70 may be arranged on the side of the stage 11 or the like.
  • the ultrasonic device 72 transmits ultrasonic waves toward the composition P on the stage 11 and receives ultrasonic waves reflected by the composition P.
  • the ultrasonic device 72 is spaced from the stage 11 and is disposed above the stage 11.
  • the information acquisition unit 18 is, for example, information obtained from the imaging device 70 (for example, the size of the composition P on the stage 11) or information obtained from the ultrasonic device 72 (for example, from transmission of ultrasound) Based on the time until the reception of the reflected ultrasound), information on the physical state of the composition P, such as the density of the composition P on the stage 11, can be obtained.
  • the information acquisition unit 18 acquires information about the geometrical state of the composition P, such as the presence and size of cracks or pores in the composition P on the stage 11, by comparing the theoretical value and the measured value of the density of the composition P. It might be.
  • 'crack' refers to a crack occurring on the surface or inside of an object
  • 'pore' refers to a void generated inside the object.
  • the ultrasonic device 72 is movable at least in the x-direction and/or the y-direction by the ultrasonic device moving mechanism 78, and is rotatable about, for example, the z-axis, and also rotates in a plane parallel to the z-axis. It is possible.
  • the ultrasonic device moving mechanism 78 is, for example, a multi-joint arm driven by a motor (not shown).
  • the ultrasonic device 72 may be divided into two components at the sending and receiving sides of the ultrasonic wave (in this case, the composition P is not reflected ultrasonic wave). You may receive the transmitted ultrasonic waves), and a plurality of ultrasonic devices 72 may be provided.
  • the X-ray diffraction device 74 measures the X-ray diffraction pattern of the composition P on the stage 11.
  • the X-ray diffraction device 74 has an X-ray irradiation section 74a and an X-ray detection section 74b spaced apart from the stage 11 and disposed above the stage 11.
  • the X-ray irradiation unit 74a generates X-rays and irradiates X-rays toward the composition P on the stage 11.
  • the X-ray detection unit 74b measures the intensity of X-rays diffracted by the composition P.
  • the X-ray irradiation unit 74a and the X-ray detection unit 74b have an angle formed by a straight line and a vertical line connecting the X-ray irradiation unit 74a or the X-ray detection unit 74b and the composition P, for example, from about 5° to about 90°. It is movable by the X-ray diffraction apparatus moving mechanism 80 (for example, in the xz plane) so as to change to.
  • the X-ray irradiation unit 74a and the X-ray detection unit 74b are arranged symmetrically to each other with respect to the vertical line passing through the composition P to be measured, and the X-ray diffraction device moving mechanism is maintained while maintaining a symmetrical relationship with each other with respect to the vertical line. 80).
  • the X-ray diffraction pattern is obtained by performing X-ray measurement while moving the X-ray irradiation section 74a and the X-ray detection section 74b in this way. For example, based on the position or line width of the main peak of the X-ray diffraction pattern, information on the physical state or chemical state of the chemical composition, crystal phase, phase fraction, crystallinity, etc. of the composition P can be obtained.
  • the X-ray diffraction device moving mechanism 80 is, for example, a goniometer driven by a motor (not shown).
  • the components of the information acquisition unit 18 are not limited to the imaging device 70, the ultrasonic device 72, and the X-ray diffraction device 74, and the vibration detection device or the heat detection device provided on the stage 11 Or the like, or a radiation analysis device such as an energy dispersive X-ray analysis device, or a combination thereof.
  • the removal unit 20 removes at least a portion of the composition P on the stage 11.
  • the removal unit 20 has, for example, a cutting device 90 and a recovery device 92.
  • the cutting device 90 physically scrapes off part or all of the composition P on the stage 11.
  • the cutting device 90 may be any one such as a drill or a cutter as long as the composition P can be scraped off.
  • the recovery device 92 collects and collects fragments of the composition P cut off by the cutting device 90 and impurities on the stage 11 and the like.
  • the recovery device 92 may have an intake function using a pump (not shown), may have an air supply function that blows off the composition P from the stage 11, or both functions. .
  • the cutting device 90 and the recovery device 92 can be moved by an arbitrary moving mechanism (not shown).
  • the configuration of the removal unit 20 is not limited to the above example.
  • the removal unit 20 may cut the composition P by an ion milling device, a laser processing device, or the like.
  • the control unit 22 receives input data such as three-dimensional shape data of the molded body to be manufactured, and controls each component of the molding apparatus 1.
  • the control unit 22 is realized, for example, by a processor such as a central processing unit (CPU) or a graphics processing unit (GPU). The operation of the control unit 22 will be described later.
  • the composition P discharged by the supply unit 12 is, for example, a fluid containing inorganic particles Pa and a binder Pb.
  • the composition P is prepared by dispersing the inorganic particles Pa in the binder Pb.
  • the composition P is filled in the ejector 30 while the inorganic particles Pa are dispersed in the binder Pb.
  • the inorganic particles Pa are particles made of any inorganic material such as metal, oxide, nitride, oxynitride, carbide, hydroxide, carbonate, phosphorus oxide, or a combination thereof.
  • the material of the inorganic particles Pa is not particularly limited.
  • metals examples include aluminum, titanium, iron, copper, stainless steel, and nickel chrome steel.
  • oxides include silicon dioxide, aluminum oxide, magnesium oxide, titanium oxide, oxidation, zinc oxide, yttrium oxide, zirconium oxide, and barium titanate.
  • nitrides examples include silicon nitride, aluminum nitride, titanium nitride, iron nitride, and the like.
  • oxynitride examples include silicon oxynitride, aluminum oxynitride, and the like.
  • carbides examples include silicon carbide, titanium carbide, boron carbide, and zirconium carbide.
  • hydroxide examples include magnesium hydroxide, iron hydroxide, and hydroxyapatite.
  • Examples of the carbonate include calcium carbonate, sodium carbonate, potassium carbonate, and lithium carbonate.
  • phosphates examples include iron phosphate, manganese phosphate, and calcium phosphate.
  • the binder Pb contains, for example, a photocurable composition that receives and cures light of a specific wavelength (for example, ultraviolet light).
  • the photocurable composition contains, for example, a radically polymerizable monomer or a cationic polymerizable monomer and a photopolymerization initiator.
  • the radically polymerizable monomer is, for example, a (meth)acrylic monomer.
  • the cationic polymerizable monomer is, for example, an epoxy compound or a cyclic ether compound.
  • the photopolymerization initiator is, for example, a radical photopolymerization initiator such as acetophenone.
  • a photopolymerization initiator is a cationic photopolymerization initiator, such as an onium salt, for example.
  • the content of the inorganic particles Pa in the composition P is, for example, 30% to 90% by weight, preferably 40% to 80% by weight, and more preferably 50% to 70% by weight.
  • composition P may contain, in addition to the inorganic particles Pa and the binder Pb, optional additives such as stabilizers, dispersants, and fillers.
  • FIG. 2 is a block diagram showing an example of a system configuration of the molding apparatus 1 of the first embodiment.
  • the input unit 94 receives input data of a molded object to be manufactured and transmits the input data to the control unit 22.
  • the information acquisition unit 18 uses at least the imaging device 70, the ultrasonic device 72, and the X-ray diffraction device 74 to at least one of the geometrical, physical, and chemical states of the composition P on the stage 11 In addition to acquiring information about one, the information is transmitted to the control unit 22.
  • the information includes, for example, the position or size, shape, shape of heat shrinkage, volume density, presence and size of cracks or pores, chemical composition, crystal phase, crystallinity, etc. do. Further, the information acquisition unit 18 also acquires information (for example, the landing position and timing of the composition P) of the composition P on the stage 11, for example, by the imaging device 70. It is possible.
  • the control unit 22 is based on the input data from the input unit 94, information obtained from the information acquisition unit 18, or the like, on the stage 11 on which the composition P is to be discharged next (hereinafter referred to as the'discharge location').
  • the'discharge location' information obtained from the information acquisition unit 18, or the like
  • the control unit 22 is based on the input data from the input unit 94, information obtained from the information acquisition unit 18, or the like, on the stage 11 on which the composition P is to be discharged next (hereinafter referred to as the'discharge location').
  • the control unit 22 controls the stage moving mechanism 11a so that the stage 11 moves to an appropriate position, and also the ejector 30, the LED 40, The ejector moving mechanism 32, the LED moving mechanism 42, the degreasing laser moving mechanism 54, and the thermal fixing laser moving such that the degreasing laser 50 and the thermal fixation laser 52 are properly arranged.
  • the mechanism 56 is controlled.
  • control unit 22 controls the supply unit 12 to discharge the appropriate amount of the composition P at an appropriate timing based on input data, information from the information acquisition unit 18, and the like, and also controls the binder Pb.
  • the LED 40, the degreasing laser 50, and the heat setting laser 52 are respectively controlled to irradiate light for curing or laser light for degreasing and heat setting at appropriate timing.
  • control unit 22 is based on the input data, information from the information acquisition unit 18, or the like, and then the position on the stage 11 to be imaged by the imaging device 70, and then the ultrasonic device 72
  • the position on the stage 11 to be irradiated with ultrasonic waves, and then the position on the stage 11 to be measured with the X-ray diffraction pattern by the X-ray diffraction device 74, etc. (hereinafter, collectively referred to as'measurement position') Can decide.
  • the control unit 22 moves the imaging device moving mechanism 76 and the ultrasonic device so that the imaging device 70, the ultrasonic device 72, and the X-ray diffraction device 74 are properly arranged.
  • the mechanism 78 and the X-ray diffraction device moving mechanism 80 are controlled.
  • the control unit 22 controls the imaging device 70, the ultrasonic device 72, and the X-ray diffraction device 74 to obtain information by performing various measurements at appropriate timings.
  • control unit 22 is based on input data or information from the information acquisition unit 18 (for example, image data by the imaging device 70 or density data by the ultrasonic device 72), and the like.
  • On the composition P can be determined the position on the stage 11 to be removed (hereinafter referred to as'removal position'). Based on this position, the control unit 22 controls these moving mechanisms so that the cutting device 90 and the recovery device 92 are in proper arrangement, and also scrapes and scrapes the composition P in the removal position. The cutting device 90 and the recovery device 92 are controlled to recover the crushed composition P.
  • control unit 22 based on the geometrical, physical, and/or chemical state of the composition P on which the immobilization and fixation has already been performed on the stage 11, the supply unit 12, the immobilization unit 14, Feedback control of the heating unit 16, the information acquisition unit 18, and the removal unit 20 can be performed.
  • control unit 22 may be configured to capture an imaging device ( Based on the image data from 70), such a positional deviation is detected, and the discharge position of the composition P to be discharged next, the LED 40, the degreasing laser 50, the thermal fixation laser 52, etc. At least one of the irradiation positions can be modified.
  • the control unit 22 reheats the composition P, for example, in order to suppress the residual of cracks and pores.
  • the control unit 22 may instruct the removal unit 20 to remove some or all of the composition P from the stage 11 in order to suppress the residual of cracks and pores.
  • image data or the like of the imaging device 70 can also be used in combination.
  • the control unit 22 can determine the next discharge position and irradiation position so that the removed part is filled with the composition P (for example, the next composition P is discharged to the removed part). have. Further, by irradiating the composition P with the laser light again from the laser for thermal fixation 52, it is also possible to try again to thermally fix the cracks of the composition P and the peripheral portion of the pore. In this case, it is also possible to increase the temperature of the heat setting, for example, by increasing the output of the heat setting laser 52.
  • the control unit 22 re-applies laser light to the composition P in order to increase the crystallinity of the composition P.
  • the laser 52 for heat setting can be instructed to perform irradiation and heating. Also in this case, for example, the temperature of the heat setting can be changed by adjusting the output of the heat setting laser 52.
  • FIG 3 is a diagram showing an example of a method for manufacturing a molded body by the molding apparatus 1 of the first embodiment.
  • the composition P is discharged from the ejector 30 toward the stage 11.
  • thermally solidified body C which has already been thermally cured, and inorganic particles Da to Dd wrapped with a cured binder B are formed.
  • the discharge of the composition P is sequentially performed from the left side (-x direction) to the right side (+x direction) of the drawing. That is, as the process proceeds, the ejector 30, the LED 40, the degreasing laser 50, and the heat setting laser 52 move in the +x direction with respect to the stage 11.
  • the ejected composition P lands next to the inorganic particles Dd.
  • the information acquisition unit 18 acquires the landing position and timing of the composition P.
  • the binder Pb of the discharged composition P wraps the inorganic particles De(Pa) and has fluidity.
  • the LED 40 of the immobilization unit 14 irradiates light of a wavelength suitable for curing the binder Pb.
  • the binder Pb containing the photocurable composition is cured to form part of the cured binder B.
  • the inorganic particle De contained in the discharged composition P is fixed on the stage 11.
  • the degreasing laser 50 of the heating unit 16 irradiates laser light near the inorganic particles Da, and heats the binder B.
  • the distance between the position at which the composition P is immobilized and the position at which degreasing (and heat setting) is performed immediately thereafter is , It can be determined according to various conditions, such as the properties of the composition P or the discharge speed, the intensity of the laser 50 for degreasing.
  • the position at which degreasing is performed may be the same as the position at which the composition P is immobilized (ie, the vicinity of the inorganic particle De immobilized immediately before).
  • the binder B in the vicinity of the inorganic particles Da is degreased by the degreasing laser 50, and the inorganic particles Da are exposed.
  • the laser 52 for thermal fixation of the heating unit 16 irradiates laser light near the boundary between the thermal fixation body C and the inorganic particle Da, and heats the thermal fixation body C and the inorganic particle Da. Thereby, thermal solidification occurs between the thermal solidified body C and the inorganic particles Da.
  • the inorganic particles Da are integrated into the thermally-solidified body C by thermally-solidifying the thermally-solidified body C and the inorganic particle Da.
  • the control unit 22 is based on image data on the stage 11 received from the information acquisition unit 18, radiation analysis data (for example, data obtained by X-ray diffraction measurement), ultrasonic analysis data, and the like.
  • the shape of the heat shrinkage of the composition P on the stage 11 is also considered, and one or both of the discharge position of the next composition P and the irradiation positions of the immobilization unit 14 and the heating unit 16 are determined.
  • the LED 40, the degreasing laser 50, and the heat setting laser 52 are moved in the +x direction with respect to the stage 11 (here, the LED 40, the degreasing laser 50, And the heat setting laser 52 is not shown).
  • the moving direction and the moving distance are changed depending on the place where the composition P is to be discharged next.
  • the next ejection position is right next to the inorganic particle De (see Fig. 3(f)).
  • a section in which the composition P is not discharged may exist between the inorganic particles De and the next discharge position.
  • the supply unit 12, the immobilization unit 14, and the heating unit 16 are slightly moved along the y direction, The process is again performed from one end of 10 to the other along the x direction.
  • each step of ejection and immobilization of the composition P, degreasing, and heat setting can be performed throughout the stage 11.
  • the method of moving the supply unit 12, the immobilization unit 14, and the heating unit 16 with respect to the stage 11 is not limited to this.
  • the process may be performed along the y direction rather than the x direction.
  • you may repeat the movement of the supply unit 12, the immobilization unit 14, and the heating unit 16 directly to an arbitrary position where the composition P should be discharged, rather than repeating the movement along a specific direction.
  • a position where the distance from the current supply unit 12 is the shortest among the positions where the composition P should be discharged may be selected as the next discharge position.
  • FIG. 4 is a flowchart showing an example of a method for manufacturing a molded body by the molding apparatus 1 of the first embodiment.
  • the control unit 22 sets the initial discharge position and irradiation position based on the input data of the three-dimensional molded body received from the input unit 94. Decide (S1002). Next, the control unit 22, based on the determined discharge position and irradiation position, the ejector 30, the LED 40, the degreasing laser 50, and the heat setting laser 52 in an appropriate arrangement To move, the ejector moving mechanism 32, the LED moving mechanism 42, the degreasing laser moving mechanism 54, and the heat setting laser moving mechanism 56 are instructed (S1004).
  • the control unit 22 instructs the ejector 30 to eject the composition P toward the stage 11 (S1006).
  • the information acquisition unit 18 detects the landing of the composition P (S1008).
  • the information acquisition unit 18 detects the landing position and timing of the composition P by performing imaging on the stage 11 by continuously or regularly photographing on the stage 11 by the imaging device 70.
  • control unit 22 instructs the LED 40 to irradiate light for immobilizing the landed composition P on the stage 11 (here, curing the binder Pb) (S1010).
  • the binder Pb containing the photocurable composition is cured, and the composition P is fixed on the stage 11.
  • the control unit 22 instructs the degreasing laser 50 to irradiate laser light for degreasing the binder Pb of the composition P on the stage 11 (S1012).
  • the irradiation position of the degreasing laser 50 may be the same as the irradiation position of the LED 40, and as described with reference to FIG. 3, the distance from the irradiation position of the LED 40 to which the composition P was previously immobilized is somewhat different. You may be in a location.
  • the control unit 22 instructs the laser 52 for thermal fixation so as to irradiate laser light for performing thermal fixation of the inorganic particles Pa of the composition P on the stage 11 (S1014).
  • the irradiation position of the thermal fixation laser 52 may be the same as the irradiation position of the degreasing laser 50, or may be a different position to some extent.
  • the control unit 22 instructs the information acquisition unit 18 to acquire information regarding the geometrical state, physical state, and/or chemical state of the composition P on the stage 11 (S1016).
  • the control unit 22 instructs the photographing apparatus 70 to photograph the composition P immobilized, the composition P degreased, and the composition P heat-hardened in each of the above steps.
  • the information acquisition unit 18 acquires information about the geometrical state of the composition P on the stage 11, such as the position, size, shape, and presence or absence of cracks.
  • the control unit 22 instructs the ultrasonic device 72 to irradiate ultrasonic waves to the composition P that has been heat-hardened in the above step.
  • the information acquisition unit 18 acquires information about the physical state such as the density of the composition P on the stage 11, and the geometrical state such as the presence and size of cracks and pores. Get information about.
  • the control unit 22 instructs the X-ray diffraction device 74 to measure the X-ray diffraction pattern for the composition P heat-hardened in the above step. Based on the measured X-ray diffraction pattern, the information acquisition unit 18 acquires information about the physical or chemical state of the composition P on the stage 11, such as the chemical composition, crystal phase, phase fraction, crystallinity, and the like.
  • the control unit 22 determines whether or not the formation of the first layer is completed in light of the input data (S1018). When it is determined that the formation of the first layer has not been completed (S1018: NO), the flow returns to S1002. That is, the control unit 22, on the basis of the information on the geometrical state, physical state, and/or chemical state of the composition P on the stage 11 obtained by the information acquisition unit 18, then the composition P In addition to determining the discharge position to be discharged, the irradiation position of the LED 40, the degreasing laser 50, and the heat setting laser 52 is also determined. Thereafter, a molding process of discharging, immobilizing, degreasing, and heat setting of the composition P described so far is performed again.
  • the next discharge position is determined by an arbitrary method.
  • the next discharge position as described above, first goes from one end of the stage 11 along the x direction to the other end, then slightly advances in the y direction, and again from the one end of 10 along the x direction to the other end, Go back a little in the y direction again... ... It may be determined according to the same procedure as above, or may be determined based on the distance from the current position of the supply unit 12.
  • the control unit 22 determines whether the formation of the entire molded body is complete (S1020). When it is determined that the formation of the molded body is not completed (S1020: NO), the control unit 22 stages the stage 11 to move in the z direction (for example, to descend by one layer in the z direction) The movement mechanism 11a is instructed (S1022). Thereafter, the flow returns to S1000, and formation of the second layer is started.
  • the molding apparatus 1 forms each layer of the three-dimensional molded body by repeating the molding cycle including each step S1002 to S1016 of position control, ejection, immobilization, degreasing, heat setting, and information acquisition, By repeating this layer formation from the first layer to the final layer, a three-dimensional molded body can be formed.
  • the term'molding cycle' means a series of processes repeated to produce a molded body, which is composed of two or more steps (for example, a discharge step and a heat setting step).
  • steps for example, a discharge step and a heat setting step.
  • 'repeating' means that it is performed at least twice continuously or intermittently, and includes, for example, a case where another process is interposed between one repeating unit and the next repeating unit.
  • the order and number of times of each step may be arbitrarily changed, or any other steps may be added.
  • the movement of the immobilization unit 14, the heating unit 16, and the information acquisition unit 18 may be performed after the ejection of the composition P (S1006).
  • the information acquisition step (S1016) may be performed not only after the heat setting step (S1014) but also after an arbitrary step.
  • the control unit 22 instructs the removal unit 20 to partially remove the composition P on the stage 11 based on the acquired information. May be added.
  • the molding cycle can be repeated at least along stage 11.
  • following the stage' means'following the side opposite to the ejector ejecting the composition from each side of the stage'.
  • 'repeating at least along the stage' means that a plurality of molding cycles are performed along the stage, regardless of whether the molding cycle is repeated along the direction crossing the stage.
  • the position at which the molding cycle is performed corresponds to, for example, a position at which the ejected composition P lands and a position at which thermal setting occurs when the molding cycle includes a discharge step and a heat setting step.
  • the molding cycle is performed along the stage' means, for example, when the molding cycle includes an ejection step and a thermal setting step, the position and thermal setting of the composition P in a plurality of molding cycles occur. It means that the position is following the stage.
  • the above molding cycle can be repeated in the same plane.
  • 'repeating in the same plane' means that four or more molding cycles sufficient to define a plane in a three-dimensional space are repeated on the plane.
  • molding cycle containing the supply of composition P and the heat setting of composition P is performed repeatedly. That is, the thermal setting of the composition P is performed locally, and the next composition P is further supplied even after the thermal setting operation is performed.
  • these processes are performed in order to follow the supply of the composition P from the supply unit 12, so that the immobilization of the composition P (hardening of the binder Pb), degreasing of the binder Pb, and thermal solidification of the inorganic particles Pa are sequentially performed. This can be subdivided.
  • degreasing step is subdivided and degreasing is performed on a small amount of the composition P, degreasing is performed as compared with the case where the degreasing is performed on the entire molded body after three-dimensional molding of a binder in which inorganic particles are dispersed as in the conventional photolithography method.
  • the binder Pb is removed for each operation, and it is possible to suppress the residual components of the binder Pb and the binder Pb in the molded body.
  • the finished molded body may shrink as much as the gap, but the degreasing process as in the present embodiment When this granularity occurs, even if such a gap occurs, since the composition P is continuously supplied, the gap can be filled with the next composition P, and it is possible to suppress such shrinkage.
  • the heat setting step is subdivided and heat setting is performed on a small amount of the composition P, compared with the case where the heat setting is performed on the entire degreased molded body after performing three-dimensional molding once as in the conventional photolithography method, the part of the molded body It is possible to suppress the occurrence of cracks or breakage of the heat-solidified body due to the difference in the thermal expansion coefficient for each. Even if cracks due to thermal expansion and thermal contraction occur, since composition P is continuously supplied, these defects can be filled by the following composition P, and it is possible to suppress the adverse effects of these defects. By controlling the ejection of the composition P in a feedback manner based on the result of the heat setting, it is possible to manufacture a solid molded body having a desired shape and size.
  • the molded object containing an inorganic material with improved quality can be produced.
  • molding apparatus 1 is equipped with the LED 40 as the immobilization unit 14, and the degreasing laser 50 and the heat fixation laser 52 as the heating unit 16 are provided. To be equipped. Thereby, it becomes possible to separately control the execution position and timing of each process of immobilization, degreasing, and heat setting, and the sequential molding process as described above can be efficiently performed.
  • a photocurable composition was used as the binder Pb of the composition P, but the binder Pb is not limited thereto.
  • a thermosetting composition such as phenol resin or polyurethane is employed as the binder Pb, and a heat source (for example, a laser) for curing the thermosetting resin instead of the LED 40 is used as a component of the immobilization unit 14.
  • a heat source for example, a laser
  • the composition P is fixed on the stage 11 by curing the binder Pb made of a thermosetting resin with heat from a heat source.
  • thermoplastic composition such as polyethylene or polyethylene terephthalate may be employed as the binder Pb, and the composition P may be heated in advance to supply the composition P toward the stage 11 while the binder Pb is melted.
  • the binder Pb made of a thermoplastic resin is naturally cooled on the stage 11, so that the composition P is immobilized on the stage 11.
  • the second embodiment differs from the first embodiment in that a molded body composed of two types of compositions is produced using two ejectors.
  • the structures other than those described below are the same as in the first embodiment.
  • FIG. 5 is a view showing the molding apparatus 101 according to the second embodiment.
  • 6 is a block diagram showing an example of a system configuration of the molding apparatus 101 of the second embodiment.
  • molding apparatus 101 which concerns on 2nd Embodiment is the chamber 110, the stage 111, the supply unit 112, the immobilization unit 114, the heating unit 116, and information acquisition A unit 118, a removal unit 120, and a control unit 122 (see FIG. 6) are provided.
  • the supply unit 112 includes a first ejector (first supply) 130 and a second ejector (second) Feeder) 132.
  • the first ejector 130 ejects the first composition P1 containing the first inorganic particles Pa1 toward the stage 111 intermittently or continuously.
  • the second ejector 132 discharges the second composition P2 containing the second inorganic particles Pa2 intermittently or continuously toward the stage 111.
  • the first ejector 130 and the second ejector 132 are movable by the first ejector movement mechanism 134 and the second ejector movement mechanism 136, respectively.
  • the 1st composition P1 is a fluid containing the 1st inorganic particle Pa1 and the 1st binder Pb1 similarly to the composition P of 1st Embodiment, for example.
  • the second composition P2 is, for example, a fluid containing the second inorganic particles Pa2 and the second binder Pb2.
  • the first composition P1 and the second composition P2 are filled in the first ejector 130 and the second ejector 132, respectively, with inorganic particles Pa1 and Pa2 dispersed in the binders Pb1 and Pb2.
  • the first inorganic particles Pa1 are the same as the inorganic particles Pa of the first embodiment, for example, any inorganic material such as metal, oxide, nitride, oxynitride, carbide, hydroxide, carbonate, phosphorus oxide, or a combination thereof It is made of particles.
  • the 2nd inorganic particle Pa2 is a particle which consists of arbitrary inorganic materials or combinations of inorganic materials different from 1st inorganic particle Pa1.
  • the material of the inorganic particles Pa1 and Pa2 is not particularly limited. It is also possible to make the second inorganic particle Pa2 the same as the first inorganic particle Pa1, but an example in which the second inorganic particle Pa2 different from the first inorganic particle Pa1 is used will be described below.
  • the 1st binder Pb1 contains the photocurable composition which receives and hardens light (for example, ultraviolet ray) of a specific wavelength, like the binder Pb of 1st Embodiment, for example.
  • the second binder Pb2 also includes a photocurable composition.
  • the photocurable composition of the first binder Pb1 and the photocurable composition of the second binder Pb2 may be the same or different.
  • the immobilization unit 14 of the first embodiment comprises a single LED 40
  • the immobilization unit 114 includes a first LED 140 for the first composition P1 and a second for the second composition P2.
  • LED 142 The first LED 140 fixes the first composition P1 on the stage 111 by curing the first binder Pb1.
  • the second LED 142 fixes the second composition P2 on the stage 111 by curing the second binder Pb2.
  • the first LED 140 and the second LED 142 are movable by the first LED moving mechanism 144 and the second LED moving mechanism 146, respectively.
  • the heating unit 116 is for the first degreasing for the first composition P1, while the heating unit 16 in the first embodiment includes a single degreasing laser 50 and a single thermal fixation laser 52. It includes a laser 150 and a first thermal fastening laser 152, a second degreasing laser 154 for the second composition P2, and a second thermal fastening laser 156. Both the first degreasing laser 150 and the first thermal fixation laser 152 are subjected to laser irradiation on the first composition P1 to heat the first composition P1, thereby degreasing and thermal fixation of the first composition P1, respectively. Do it.
  • the second degreasing laser 154 and the second-row solidification laser 156 are both subjected to laser irradiation on the second composition P2 to heat the second composition P2, thereby degreasing and thermal fixation of the second composition P2, respectively. Do it.
  • the 1st heat fixation laser 152 and the 2nd heat fixation laser 156 can also be used in order to heat fix the adjacent 1st composition P1 and the 2nd composition P2 on the stage 111 to each other.
  • the heating temperature by the first heat-setting laser 152 or the second heat-setting laser 156 can be set to a temperature suitable for heat-setting the first composition P1 and the second composition P2 containing different materials. .
  • the first degreasing laser 150, the first thermal fixation laser 152, the second degreasing laser 154, and the second thermal fixation laser 156 are respectively the first degreasing laser moving mechanism 158. ), the first heat setting laser moving mechanism 160, the second degreasing laser moving mechanism 162, and the second heat fixing laser moving mechanism 164 are movable.
  • control unit 122 is based on the geometrical state, physical state, and/or chemical state of the first composition P1 and the second composition P2 acquired by the information acquisition unit 118, Feedback control of the supply unit 112, the immobilization unit 114, the heating unit 116, the information acquisition unit 118, and the removal unit 120 can be performed.
  • the control unit 122 can be formed from the first composition P1 and the first composition PX from the X-ray diffraction pattern or the like acquired by the X-ray diffraction device 174.
  • the discharge position, irradiation position, and removal unit for each composition P1, P2 Whether or not to use 120 may be determined.
  • FIG. 7 is a flowchart showing an example of a method of manufacturing a molded body by the molding apparatus 101 of the second embodiment.
  • the flow of the method for manufacturing a molded article according to the second embodiment is basically the same as that of the first embodiment, except that two types of inorganic materials are used. That is, in FIG. 7, each step from position control to information acquisition in the method for manufacturing a molded body by the molding apparatus 1 of the first embodiment described with reference to FIG. 4 is the first composition P1 and the second composition P2 It is done about.
  • the control unit 122 When the formation of the first layer is started (S2000), the control unit 122, the discharge position of the first composition P1 and the second composition P2, LED (140, 142) or the laser for degreasing (150, 154), heat The irradiation position of the high-resolution lasers 152 and 156 is determined (S2002).
  • control unit 122 moves each of the supply unit 112, the immobilization unit 114, the heating unit 116, and the information acquisition unit 118 based on these discharge positions and irradiation positions. It is instructed to the moving mechanism (S2004).
  • the control unit 122 instructs the first ejector 130 and the second ejector 132 to eject the first composition P1 and the second composition P2 toward the stage 111 (S2006). . These discharge timings may be simultaneous or may be shifted.
  • the information acquisition unit 118 detects the landing of the first composition P1 and the second composition P2 (S2008).
  • control unit 122 irradiates the first LED 140 and the second LED 142, respectively, so as to irradiate light for immobilizing the landed first composition P1 and the second composition P2 on the stage 111.
  • Instruct (S2010)
  • control unit 122 first degreasing each to irradiate laser light for degreasing the first binder Pb1 of the first composition P1 on the stage 111 and the second binder Pb2 of the second composition P2.
  • the laser 150 and the second degreasing laser 154 are instructed (S2012).
  • control unit 122 irradiates laser light for performing thermal fixation of the first inorganic particles Pa1 of the first composition P1 and the second inorganic particles Pa2 of the second composition P2 on the stage 111, respectively.
  • the first thermal fastening laser 152 and the second thermal fastening laser 156 are instructed (S2014).
  • control unit 122 instructs the information acquisition unit 118 to acquire information regarding the geometrical state, physical state, and/or chemical state of the first composition P1 and the second composition P2 on the stage 111. (S2016).
  • the molding cycle including each of the above steps S2002 to S2016 is repeated until layer formation is completed (S2018).
  • the control unit 122 instructs the stage movement mechanism 111a to move the stage 111 in the z direction (S2022).
  • the flow returns to S2000, and formation of the second layer is started. By repeating this layer formation, a three-dimensional molded body is formed.
  • both the first composition P1 and the second composition P2 are treated at each step of the molding cycle, but each treatment of the first composition P1 and the second composition P2 may be performed in any order.
  • first, discharge, immobilization, degreasing, and heat setting of the first composition P1 may be performed, and then discharge, immobilization, degreasing, and heat setting of the second composition P2 may be performed.
  • degreasing and heat setting of the 1st composition P1 may be performed first, and then degreasing and heat setting of the 2nd composition P2 may be performed.
  • the molding cycle is repeated only for the first composition P1, and after the heat setting of all the first compositions P1 to be included in the first layer is completed, the molding cycle is repeated for the second composition P2, so that the entire first layer is May be formed.
  • the molding apparatus 101 in addition to the advantages described with respect to the molding apparatus 1 according to the first embodiment, it is possible to manufacture a molded body formed in a complex manner by combining a plurality of materials in various ways. .
  • the process of assembling is not only omitted, but also the use and fitting of a bonding agent or a joined part for bonding each part to each other. It is possible to omit the formation of a shape and the like. Thereby, manufacturing cost can be significantly reduced.
  • the molding apparatus 101 can select the material used for the molded body in units of one droplet discharged from each ejector, it is possible to control the material composition to the details of the molded body. In addition, since a variety of inorganic materials can be used, the molding apparatus 101 can be used to manufacture molded articles for various purposes such as industrial products, medical products, research and development products, daily necessities, and ceramic products.
  • the information acquisition unit 118 Based on the information from ), the output of the laser light of the first heat setting laser 152 and the second heat setting laser 156, and furthermore, by performing feedback control of the heat setting temperature, to the material at each irradiation position. It is possible to perform heat setting at the optimum temperature. Thereby, since various materials can be sufficiently heat-solidified at an arbitrary site, the quality of the resulting molded article is improved.
  • inorganic materials two types are used, but three or more types of inorganic materials may be used.
  • the number of supply means such as a discharger, immobilization means such as an LED, heating means such as a degreasing laser or a heat setting laser may be appropriately changed to three or more.
  • both the first composition P1 and the second composition P2 may be immobilized using a single LED, and both the first composition P1 and the second composition P2 may be similarly provided by a single degreasing laser or a single thermal fixation laser.
  • Degreasing and heat setting may be performed.
  • the molding cycles of both the first composition P1 and the second composition P2 may be sequentially executed by a single LED or laser.
  • the information acquisition unit 118 includes the imaging device 170, the ultrasonic device 172, and the X-ray diffraction device 174 one by one, but you may increase the number of these as needed.
  • the discharge positions of the first composition P1 and the second composition P2 are set to the same position on the stage 111. do. For example, by setting the ejection positions of the first composition P1 in each molding process to the same position as the ejection positions of the second composition P2, the molding process is repeated, so that the first composition P1 and the second composition P2 as a whole are predetermined. It is possible to manufacture molded bodies formed by mixing with each other in proportions.
  • the molding process is performed while setting the discharge position of the first composition P1 in each molding process to the same position as the discharge position of the second composition P2, and gradually changing the ratio of the discharge amounts of the first composition P1 and the second composition P2.
  • the concentration ratio of the first composition P1 and the second composition P2 gradually changes depending on the position in the molded body.
  • the control unit 122 determines the next discharge position and the irradiation position for each molding cycle, but the control unit 122, for example, the first ejector 130 and the second ejector 132 While continuously moving at a constant speed in a predetermined direction, the presence or absence of discharge of the first ejector 130 and the second ejector 132 at each position, the presence or absence of degreasing or thermal fixation may be determined.
  • the control unit 122 for example, the first ejector 130 and the second ejector 132 While continuously moving at a constant speed in a predetermined direction, the presence or absence of discharge of the first ejector 130 and the second ejector 132 at each position, the presence or absence of degreasing or thermal fixation may be determined.
  • the first composition P1 and the second composition P2 have been discharged until then, but degreasing or thermal fixation is not properly performed. In the position determined not to be possible, it is possible to further perform discharge or heat setting.
  • a third embodiment will be described with reference to FIGS. 8 to 11.
  • a composition P'in which the inorganic particles Pa' are wrapped with an organic coating Pb' is used, and as a component of the immobilization unit 214, instead of the LED 40, a melting laser (heat source for melting) ( 240) is different from the first embodiment.
  • a melting laser heat source for melting
  • the structures other than those described below are the same as in the first embodiment.
  • FIG. 8 is a view showing the molding apparatus 201 according to the third embodiment.
  • 9 is a block diagram showing an example of a system configuration of the molding apparatus 201 of the third embodiment.
  • the composition P' has a core shell structure comprising an inorganic particle Pa' (core) and an organic coating Pb' (shell) coating the inorganic particle Pa'.
  • Composition P' is a solid, and a number of compositions P'are filled in ejector 230.
  • the ejector 230 ejects the composition P'on the stage 211 one by one.
  • the organic coating Pb' is made of a thermoplastic resin or the like that is softened or melted by heat (hereinafter, collectively referred to simply as'melting').
  • thermoplastic resin include polyethylene, polypropylene, polystyrene, polyamide, polycarbonate, polyacetal, polyethylene terephthalate, vinyl chloride resin, ABS resin (acrylonitrile-butadiene-styrene copolymer synthetic resin) and the like.
  • molding apparatus 201 which concerns on 3rd embodiment acquires the chamber 210, the stage 211, the supply unit 212, the immobilization unit 214, the heating unit 216, and information. It has a unit 218, a removal unit 220, and a control unit 222 (see Fig. 9).
  • the immobilization unit 214 includes a laser 240 for fusion, while the immobilization units 14 and 114 of the first and second embodiments include LEDs 40, 140 and 142 for curing the binder Pb. ).
  • the melting laser 240 applies heat to the organic coating Pb' on the stage 211. Thereby, the organic coating Pb' is melted on the stage 211.
  • the laser 240 for melting heats the composition P'to, for example, 80°C to 200°C by performing laser irradiation on the composition P'to melt the organic coating Pb' of the composition P'.
  • the fusion laser 240 is movable at least in the x-direction and the y-direction by the fusion laser movement mechanism 242, and can be rotated, for example, about the z-axis and rotates in a plane parallel to the z-axis. It is possible.
  • 10 is a diagram showing an example of a method of manufacturing a molded body by the molding apparatus 201 of the third embodiment. 10 shows a series of processes (a) to (g) from discharging the composition P'in the production method to heat setting.
  • Fig. 10A the composition P'is discharged from the ejector 230 toward the stage 211.
  • the inorganic particles Da' to Dd' wrapped with the solidified coating B' which is already solidified after thermal solidification C'and the organic coating Pb' are melted and solidified. Is formed.
  • the composition P' is discharged sequentially from the left side (-x direction) to the right side (+x direction) of the drawing.
  • the ejected composition P' lands next to the inorganic particles Dd'.
  • the information acquisition unit 218 acquires the landing position and timing of the composition P'.
  • the ejected composition P' is a solid, and the organic coating Pb' of the composition P'is not integrated with the adjacent solidifying coating B'.
  • the laser 240 for melting of the immobilization unit 214 irradiates laser light. Thereby, the organic coating Pb' made of a thermoplastic resin is melted.
  • the organic coating B'in the vicinity of the inorganic particles Dd' adjacent to the organic coating Pb' is also melted simultaneously by the melting laser 240 and the organic coating Pb'. It is integrated.
  • the melted organic coating Pb' solidifies by natural cooling. At this time, since the organic coating B'that melted at the same time also solidifies, the entire organic coating surrounding the inorganic particles Da' to De' is integrated.
  • Figs. 10(d) to 10(g) after this are substantially the same as those shown in Figs. 3(c) to 3(f). That is, in FIG. 10(d), the degreasing laser 250 of the heating unit 216 desorbs the solidified coating B'near the inorganic particles Da' by irradiating laser light near the inorganic particles Da'. In Fig. 10(e), the thermal solidification laser 252 of the heating unit 216 irradiates laser light near the boundary between the thermal solidification body C'and the inorganic particle Da', and the thermal solidification body C'and the inorganic particle Heat Da'. In Fig. 10(f), the ejector 230 or the like moves in the +x direction. In Fig. 10(g), the composition P'is discharged from the ejector 230 toward the stage 211 again. Thereafter, the operations described with reference to Figs. 10(b) to 10(f) are repeated.
  • FIG. 11 is a flowchart showing an example of a method for manufacturing a molded body by the molding apparatus 201 of the third embodiment.
  • the step of immobilizing the composition on the stage is different.
  • the step of immobilizing the composition P is performed by curing the binder Pb with the LED 40 after the landing of the composition P is detected (S1006).
  • the control unit 222 after landing of the composition P'is detected, applies a heat to the organic coating Pb' of the composition P'landed on the stage 211 to melt the laser.
  • the laser 240 for melting is instructed (S3010).
  • the melted organic coating Pb' solidifies by natural cooling (S3012).
  • the composition P' is immobilized on the stage 211.
  • the organic coating Pb' has solidified by irradiating the state or temperature of the organic coating Pb' with the imaging device 270 of the information acquisition unit 218 or an arbitrary detector (for example, a thermography device). .
  • an arbitrary detector for example, a thermography device.
  • composition P'of the third embodiment may be used in the second embodiment.
  • one or both of the first composition P1 and the second composition P2 of the second embodiment may be in the same form as the composition P'of the third embodiment.
  • the stage is moved in the x-direction or y-direction, so that the next composition is discharged, but the molding process is not limited to this.
  • the stage may be moved before the degreasing step, and discharge or immobilization of the next composition may be performed in parallel with degreasing or heat setting.
  • the discharge of the next composition may be performed in parallel with the immobilization of the composition.
  • the composition when the discharge of the composition from the ejector is performed continuously, not intermittently, the composition is continuously supplied, and thus, in parallel with the supply of the composition, immobilization, degreasing, thermal fixation of the supplied composition, and stage Movement of each component such as a laser can be performed.
  • the laser for degreasing and the laser for thermal fixation are irradiating laser light to the same area, but these irradiation positions are not necessarily the same.
  • the irradiation position of the thermal fixation laser is set to be a certain distance (for example, about 1 mm) from the irradiation position of the degreasing laser, even if the irradiation of the thermal fixation laser is controlled to follow the irradiation by the degreasing laser. do.
  • the operation of the molding apparatus can be stabilized by temporarily fixing the composition on the stage using an LED or a laser for melting before the degreasing step, for example, omitting this fixing step, and landing the composition on the stage When is detected, the laser for degreasing may be irradiated to degrease the binder.
  • the immobilization unit and the heating unit are provided as separate components, but it is also possible to use, for example, a degreasing laser or a heat setting laser of the heating unit as a light source for curing the photocurable composition in the composition. .
  • a degreasing laser or a heat setting laser of the heating unit as a light source for curing the photocurable composition in the composition.
  • the discharge position of the discharger and the irradiation position of the immobilization unit and the heating unit are determined by the control unit, and their arrangement may be changed.
  • the timing of determining and disposing the discharge position and the irradiation position is not limited thereto.
  • the control unit can change the arrangement of the discharger at an arbitrary timing to move the discharger moving mechanism, LED moving mechanism, and degreasing laser. Instruments, and a laser moving mechanism for heat setting.
  • the ejection position and the irradiation position are determined based on the information acquired by the information acquisition unit, but without using such information, the ejection of the composition and each step are executed according to a sequence of preset ejection positions and irradiation positions You may work.
  • the irradiation timing of the immobilization unit or the heating unit is determined based on the information acquired by the information acquisition unit, but without using such information, the timing at which the ejector actually performs ejection, the density of the composition, the ejection amount, The irradiation timing of the immobilization unit or the heating unit may be determined based on the distance between the ejector and the stage.
  • the process in which the stage is lowered stepwise in the z-direction to form the molded body one layer from below was described, but it is not necessary to perform the molding in units of layers.
  • the ejector, the immobilization unit, and the heating unit it is also possible to mold the molded body by stacking the composition on the stage without moving the stage in the z direction.
  • the ejector, the immobilization unit, and the heating unit may be movable in the z direction by the ejector movement mechanism, the LED movement mechanism, and the laser movement mechanism for degreasing, and the laser movement mechanism for heat setting.
  • the ejector, the immobilization unit, and the heating unit are moved based on the determined ejection position and irradiation position, but instead of moving the ejector, immobilization unit, and heating unit, in the x-direction and y-direction Therefore, the stage may be moved. That is, the positions of the ejector, the immobilization unit, and the heating unit may be fixed, and the stage may be moved in the x, y, and z directions. Alternatively, the stage, the ejector, the immobilization unit, and the heating unit may all be movable in the x direction and the y direction.
  • an ejector is used as a feeder for supplying the composition, but the feeder is not limited thereto.
  • the feeder is not limited thereto.
  • a fine arm mechanism that can be placed anywhere on the stage while maintaining the composition by adsorption by physical gripping or magnetic action may be used as a feeder. do.

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Abstract

L'invention concerne un appareil de moulage permettant de produire un corps moulé contenant un matériau inorganique présentant une qualité améliorée. L'invention concerne également un appareil de moulage pour une mise en forme tridimensionnelle, l'appareil de moulage comprenant : une unité d'alimentation permettant de fournir de façon intermittente ou continue une composition contenant un matériau inorganique vers une plateforme ; une unité chauffante comprenant une source thermique de thermodurcissement qui est conçue pour effectuer, sur la plateforme, au moins un thermodurcissement sur la composition fournie par l'unité d'alimentation ; une unité d'acquisition d'informations permettant d'acquérir des informations concernant les états géométriques, physiques et/ou chimiques de la composition thermodurcie ; et une unité de commande permettant de commander l'unité d'alimentation et l'unité chauffante pour répéter un cycle de moulage qui comprend l'alimentation et le thermodurcissement de la composition et de commander l'unité d'alimentation et/ou l'unité chauffante en fonction des informations.
PCT/KR2019/018381 2018-12-25 2019-12-24 Appareil de moulage et procédé de production de corps moulé WO2020138906A1 (fr)

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US17/273,578 US20210331386A1 (en) 2018-12-25 2019-12-24 Forming Apparatus and Method of Producing Formed Body
KR1020217003212A KR102390661B1 (ko) 2018-12-25 2019-12-24 성형 장치 및 성형체의 제조 방법
CN201980055420.0A CN112601657B (zh) 2018-12-25 2019-12-24 成形装置和生产成形体的方法

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JP2018240882A JP7321624B2 (ja) 2018-12-25 2018-12-25 成形装置及び成形体の製造方法

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