WO2018208095A1 - Dispositif de brasage, et appareil d'usinage au laser et procédé d'usinage - Google Patents

Dispositif de brasage, et appareil d'usinage au laser et procédé d'usinage Download PDF

Info

Publication number
WO2018208095A1
WO2018208095A1 PCT/KR2018/005362 KR2018005362W WO2018208095A1 WO 2018208095 A1 WO2018208095 A1 WO 2018208095A1 KR 2018005362 W KR2018005362 W KR 2018005362W WO 2018208095 A1 WO2018208095 A1 WO 2018208095A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
inspection
laser
soldered
solder ball
Prior art date
Application number
PCT/KR2018/005362
Other languages
English (en)
Korean (ko)
Inventor
최병찬
강기석
Original Assignee
최병찬
주식회사 엔디테크
강기석
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 최병찬, 주식회사 엔디테크, 강기석 filed Critical 최병찬
Priority claimed from KR1020180053424A external-priority patent/KR102110763B1/ko
Publication of WO2018208095A1 publication Critical patent/WO2018208095A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Definitions

  • Embodiments of the present invention relate to a soldering apparatus, a laser processing apparatus and a processing method.
  • soldering performed by a laser processing apparatus and method is an apparatus for electrically connecting electrical components using a conductive material (for example, solder balls), and may be used for manufacturing various electronic products.
  • a conductive material for example, solder balls
  • Patent Document 1 Republic of Korea Patent Publication No. 10-0332378 (2002. 03. 30.)
  • An embodiment of the present invention relates to a laser processing apparatus, comprising: a vision inspection module or step for performing soldering using a laser but determining a soldering position, and a fast and highly efficient laser processing apparatus and method including a laser soldering module or step The purpose is to provide.
  • a head unit irradiating inspection light to an object; And a controller for matching the surface information obtained by irradiating the surface information and the inspection light of the previously soldered target region, and by matching the surface information, according to one or more positioning factors, the first position being a reference position or A soldering apparatus is provided in which soldering is performed at a distance compensated second position from a reference position.
  • the positioning factor may include a distance between terminals to be soldered, a difference in size of terminals to be soldered, an angle formed between terminals to be soldered, and a size of solder balls to be soldered.
  • the separation distance between the terminals is a distance spaced in the lateral or longitudinal direction, and may be a positioning factor to allow distance compensation in the spaced direction.
  • the difference in size of the terminal is a difference in the direction crossing the terminal to be soldered, and may be a positioning factor to allow distance compensation in the crossing direction.
  • the angle formed by the terminal is an angle formed between the terminals to be soldered, and as the angle decreases, the degree of distance compensation from the first position decreases, and as the angle increases, the degree of distance compensation from the first position increases. Can be.
  • the distance compensation from the first position may decrease, and as the size of the solder ball decreases, the distance compensation from the first position may increase.
  • the second position may be determined by reflecting one or more factors of the positioning factors.
  • the head unit may perform pre-heating on the soldering target region through a laser before soldering is performed.
  • soldering target region may be included in a region where the inspection light reaches.
  • the rotation of the jig fixing the object may be rotated by the multi-axis to change the soldering target position toward the head portion.
  • the soldering position is determined by the position or the second position, and the positioning factors include the spacing between the terminals to be soldered, the size of the terminals to be soldered, the angle formed by the terminals to be soldered, and the size of the solder balls to be soldered.
  • a second position is determined by one or more conditions detected among the positioning factors, and the second position is a soldering position, the distance being compensated and determined from the first position by the positioning factor difference. .
  • one of the first inspection for detecting the alignment of the object by the inspection unit and the second inspection (Post-inspection) for detecting the occurrence of internal cracks and pores of the solder portion fed to the object
  • the above may further comprise a step performed.
  • a second inspection may be performed at the same time as performing the soldering.
  • the method may further include sorting the object by a predetermined quality criterion after the post-inspection.
  • a jig into which the subject is loaded A first inspection unit for detecting and pre-inspecting an alignment state of the object loaded in the jig; A moving unit for loading and unloading an object into a jig; A second inspection unit selectively performing a post-inspection on the object; And a processing unit including a head unit and a control unit, wherein the head unit is controlled by the control unit and irradiates a laser to the object, and the control unit irradiates the surface information and inspection light of the previously soldered region to be input. According to one or more positioning factors, soldering is performed at a first position, which is a reference position or a distance-compensated second position, from a reference position, by matching the obtained surface information and matching the surface information. do.
  • the second inspection may be a test for detecting whether the soldering cracks and pores (pore) occurs.
  • the apparatus may further include a classification apparatus for sorting the object by a predetermined quality standard after the post-inspection.
  • the apparatus may further include a cleaning device for removing dust and foreign matter after the post-inspection step, wherein the cleaning device includes a dry air blowing device that provides dry air, and a carbon dioxide snow cleaning device. CO2 Snow Cleaning) device and an inert gas blowing device.
  • a cleaning device for removing dust and foreign matter after the post-inspection step, wherein the cleaning device includes a dry air blowing device that provides dry air, and a carbon dioxide snow cleaning device. CO2 Snow Cleaning) device and an inert gas blowing device.
  • soldering performed on the object may further include a prepayment unit performing pre-soldering before post-soldering.
  • Embodiments of the present invention may include a vision inspection module or step and a laser soldering module or step to implement a fast and high efficiency laser processing apparatus and method.
  • FIG. 1 is a view showing a camera module according to an embodiment of the present invention
  • FIG. 2 and 3 is a view showing a laser processing method according to an embodiment of the present invention
  • FIG. 4 is a view showing a camera module that is a soldering object according to an embodiment of the present invention.
  • FIG. 5 is a view showing a heating process according to an embodiment of the present invention.
  • FIG. 6 is a view showing that the solder ball is moved by the nozzle according to an embodiment of the present invention
  • FIG. 8 is a graph showing laser energy output according to an embodiment of the present invention.
  • VCM Vehicle Coil Motor
  • FIG. 10 is a view showing that the soldering is used for the connection of the terminal according to an embodiment of the present invention
  • FIG. 11 is a view showing an example of bonding through soldering according to an embodiment of the present invention.
  • FIG. 12 is a view showing a laser processing apparatus including a nozzle according to an embodiment of the present invention.
  • FIG. 13 is an enlarged cross-sectional view of a nozzle according to an embodiment of the present invention.
  • FIG. 16 is a perspective view showing a jig according to an embodiment of the present invention.
  • 17 is a view illustrating determining a soldering position according to an embodiment of the present invention.
  • solder ball device determines the soldering position according to the separation distance between the terminals according to an embodiment of the present invention
  • solder ball device determines the soldering position according to the size of the terminal according to an embodiment of the present invention
  • solder ball device determines the soldering position according to the joint surface angle according to an embodiment of the present invention
  • 21 is a view showing that the solder ball device according to an embodiment of the present invention determines the soldering position according to the solder ball size.
  • the laser processing apparatus and method according to an embodiment of the present invention it is possible to perform marking, drilling, welding and soldering to the laser processing target.
  • the laser processing apparatus and method of the present invention will be described as an example of performing soldering. That is, the laser processing apparatus may be employed as the soldering apparatus to perform only the soldering process.
  • the laser processing apparatus can be described as a soldering apparatus.
  • the laser processing target may be applied to manufacturing various electronic components such as various electronic components including the camera module 20.
  • various electronic components including the camera module 20.
  • the soldered object will be described with an example of a camera module 20 of FIG. 1.
  • the camera module 20 described below can be used in various portable devices such as smartphones and tablet pcs, as well as smart televisions, home appliances including home appliances, vehicles, security cameras (CCTV), and various medical devices.
  • the optical element can be mounted and used in a variety of necessary devices.
  • it when used in automobiles, it can be applied to various electrical components, ABS sensors, vehicle batteries, and the like, and home appliances can be applied to turning cases, flat screen monitor PCBs, and photoelectric sensors.
  • CMOS sensors, smart watches, etc. included in various ICs and may be applied to a CCD camera module 20, a USB connection terminal, a battery terminal, etc. in the portable device.
  • the laser processing apparatus included in the laser processing apparatus according to the embodiment of the present invention may not only be included in various processes such as welding, soldering, and bonding, but also the material in which each process is performed may be polymer, metal, or electric. Of course, it can be applied to a variety of materials, such as semiconductor.
  • FIG. 1 is a diagram illustrating a configuration of an object.
  • the camera module 20 may include a lens module 21 (Lens Actuator) and an image sensor module 22 (Image Sensor Module).
  • the lens actuator may include a lens module 21 (Module Lens or Lens Module), a lens cover, a lens cover, a VCM driver, a holder, an IR filter, and the like.
  • the image sensor module 22 may include a semiconductor sensor chip, ACF, FPCB, and the like.
  • the camera module 20 or the compact camera module 20 may include a lens lens 21, an AF actuator, an optical image stabilizer, It may include an image sensor, an AF driver, a PCB, an FPCB, a socket, and the like.
  • the lens module 21 may include a plurality of lenses, for example, imaging lenses for imaging, and may include a support for supporting the plurality of lenses.
  • the lens module 21 may include a plurality of IR filters. Can be included on one side of the lens, the IR filter can be supported by the support.
  • the image sensor may be included in the image sensor module 22, and the image sensor module 22 may include a sensitivity enhancing MLA, a CCD, or a CMOS.
  • the image sensor is a sensor that converts the captured image into an electrical signal, and a plurality of lenses collect the images.
  • the PCB serves as a wire bonding support for the image sensor and serves as a path for inputting and outputting electrical signals from the sensor to the outside, and the FPCB includes a connection line directly connected to an external backend chip. Do it.
  • FIG. 2 is a view briefly illustrating a manufacturing process of the camera module 20 according to the embodiment of the present invention.
  • the camera module 20 is the manufacturing of the lens module 21, the manufacturing of the packaging module through the packaging (Packing) of the manufactured lens module 21, the camera module 20 through the further completion of the packaging module ) Production.
  • the manufacturing of the camera module 20 includes a process assembly and inspection process of the camera module 20, and more specifically, single lens injection, single lens cut, single lens coat, single lens Defect inspection, lens assembly, lens performance inspection, lens holder assembly.
  • Packaging module fabrication may include wafer saw, die attach, wire bond, clean, lens holder mount.
  • additional packaging modules are available for Lens Pre-Ass'y, Focus UV Lock, Sensor Test, FPCB Attach, Case Assembly, and Includes shipping inspection.
  • the manufacturing process of the camera module 20 used in the mobile device such as a smart phone and a mobile phone will be described in detail with reference to FIG. 3.
  • a laser processing apparatus (Laser Soldering Apparatus) may be used for FPCB attach, case assembly, and the like.
  • soldering that is, soldering, is required to connect the terminals.
  • the laser processing apparatus included in the embodiment of the present invention may be used.
  • such a laser processing apparatus may be used for two-side soldering or three-side soldering in the camera module 20.
  • 6 to 8 points soldering may be performed on the upper surface of the camera module 20, and 6 to 8 points soldering may be performed on the lower surface opposite to the upper surface.
  • 16 points can be made over three sides of the soldering as a whole.
  • the camera module 20 may be an OIS (Optical Image Stabilizer) camera module 20.
  • a process of pre-heating a laser by irradiating a laser to a soldering point may be performed.
  • the area irradiated with the laser emits heat, for example, planar heat such as a circle, a rectangle, and a ring. Heat is then transferred to the surrounding area and can raise the temperature.
  • a solder ball S may be supplied and a post-heat process may be performed by a laser.
  • a soldering process is performed through a cool down (CD). If necessary, the soldering process is completed through the supply of solder balls (S), post-heat (PH2) and cool down (CD) processes without preheating (PH1). You may.
  • the laser soldering apparatus may vary in device configuration and laser irradiation method depending on one of using a solder wire, using a solder ball S, and using a solder paste.
  • solder ball (S) As shown in Figure 6, by moving the solder ball (S) to position the solder ball (S) in the required position, and irradiated with a laser to the solder ball (S) melted dropping There may be a Pick and Place soldering method that allows for bonding.
  • solder jetting method of transferring the solder ball S through the nozzle to melt the inside of the nozzle and jetting.
  • the nozzle may be replaced when an abnormal state is detected.
  • the nozzle may further include a sensing unit configured to detect whether the abnormal state including contamination and deformation is present.
  • the sensing unit may include a first sensing unit and a second sensing unit.
  • the first sensing unit is a sensor for checking the state of the nozzle 100 and may be a charge-coupled device (CCD) camera.
  • CCD charge-coupled device
  • the detachable unit may detach the nozzle in the abnormal state, and may bring a new nozzle stored in the nozzle cartridge unit and attach it to the joining unit.
  • alignment of the new nozzle can be performed through the alignment portion.
  • the second sensing unit may be a charge-coupled device (CCD) camera, an area sensor, a hall sensor, or a capacitive sensor.
  • CCD charge-coupled device
  • the abnormal state of the disk in particular the abnormal state of the solder ball transfer port, can be confirmed by the second sensing unit and transmitted to the controller. That is, the contamination state of the solder ball feed hole is checked and a signal indicating that the solder ball feed hole is in an abnormal state when the contamination level interferes with the supply of the solder ball (for example, when the diameter in the solder ball feed hole is smaller than or equal to a predetermined value). It can be transmitted to the controller side.
  • the controller may provide information for the user to replace the disk by displaying it to the user when an abnormal state of the disk for moving and providing the solder ball S is confirmed.
  • the pick and place soldering method will be described in more detail with reference to FIG. 6.
  • one or more nozzles pick up one or more solder balls S (Step 1), and soldering (Step 2). Place it on top of this required position (Step 3).
  • Solder ball (S) located at the top is melted by the laser irradiation is to drop in the solder ball (S) required position (Step 4).
  • the laser may be sequentially irradiated to each solder ball (S).
  • FIG. 6 (a) one or more nozzles pick up one or more solder balls S (Step 1), and soldering (Step 2). Place it on top of this required position (Step 3).
  • Solder ball (S) located at the top is melted by the laser irradiation is to drop in the solder ball (S) required position (Step 4).
  • the laser may be sequentially irradiated to each solder ball (S).
  • FIG. 6 illustrates a case in which two or more solder balls S are picked up, but the present invention is not limited thereto, and may include a case in which a nozzle picks up one solder ball S to be dropped in a position where soldering is required.
  • FIG. 7 may be considered when examining solder wires, solder pastes, and prepaid solders, unlike FIG. 6 (Pick and Place).
  • the operation of the laser is necessary depending on the factors to be considered. Size of heated area by laser, prevention of error and securing focal length to make laser soldering smooth even if error occurs, and the surrounding components in the laser irradiation Consideration should be given to the cone angle of the laser to prevent it from being blocked by or damaging the surrounding components.
  • the size and focal length of the region heated by the laser can be adjusted by adjusting the cone angle and the wavelength of the laser having a conical shape. Further, by reducing the cone angle of the laser, it is possible to prevent the flaw due to contact with the peripheral configuration.
  • the laser processing apparatus may include a laser wavelength adjusting unit and a laser cone angle adjusting unit in the upper laser supply unit for supplying the laser of the nozzle 16. have.
  • considerations may be made in consideration of the cycle period of the laser processing apparatus, the operating temperature, and the temperature sensitivity of the material to be soldered, the contact sensitivity, and the allowable temperature for smooth performance of the following process.
  • the heat load of the soldering object may be considered.
  • the mass of the solder paste (solder ball S) may be considered. This is because the laser must add enough energy to evaporate the flux and liquefy the alloy. In addition, the flux vapor affects the heating rate and may even auto-ignite.
  • joint geometry can be considered. If the joint shape is a complex shape such as stranded wire, it may take longer for the alloy to be completely wet. This is because the alloy must be liquid enough to flow and wet across the surface.
  • thermal sensitivity can be considered. Components and solder must be heated quickly to limit the total amount of heat absorbed. This is because excessive heat can conduct to the surrounding composition and damage the composition.
  • the laser can control the laser power over time, it is possible to profile the heating to make the most of the required heating effect.
  • the profile can be a single power level at a time. If cycle time is critical and a minimum amount of time is required before the part is completely wetted, the laser has a high enough power to start reflow before falling to lower power to maintain a heated area to maintain reflow without overheating. Can be applied at the level.
  • the laser may be ramped from one output level to another by linearly changing the output level over time.
  • This laser soldering process can be automated. E.g. Vision recognition to recognize the object in the laser processing apparatus can be made, it can be controlled so that vision recognition and laser soldering can be performed on the same line.
  • a linear motor can be included to improve control efficiency and workability.
  • two nozzles 16 for performing laser soldering may be included (dual laser bonding heads) or more than two to improve workability.
  • two or more heads and two or more tables each having laser soldering are included so as to correspond to the head and two or more work can be done in parallel.
  • such a laser processing apparatus may include a moving table including a motor that allows the laser soldering nozzle 16 to be moved in two or more directions, as well as for supplying a laser.
  • Solder ball (S) supply for supplying the laser supply and the solder may be included.
  • the laser processing apparatus may include a rotating motor for rotating the nozzle 16, the nozzle 16 is rotated by the rotation of the rotating motor to be able to irradiate the laser obliquely to the portion requiring laser soldering on the object. have.
  • the laser processing apparatus may be manufactured in a desktop type, or may be provided in a robot automated type in which the laser soldering nozzle 16 may be moved by a robot. Furthermore, the configuration of the automated system on the manufacturing process line may be provided as an automated device or as a standalone system. Furthermore, as shown in FIG. 9, the voice coil motor terminal (VCM terminal) / yoke terminal and the ceramic multilayer substrate as a voice coil motor (VCM) soldering equipment of the camera module 20 process. (HTCC substrate, High Temperature Coried Ceramics) can also be applied as a device for soldering using a laser.
  • the laser processing apparatus may include a control unit to perform control necessary for laser soldering.
  • the controller may be started, the embedded system and the program upgrade through an external signal, or may be controlled or adjusted through the soldering parameter input and output.
  • Laser processing apparatus may include a display unit for easily grasping the operating state and control state of the device.
  • the laser processing apparatus may include a non-contact temperature sensor to measure the temperature of at least one of the object and the solder. It may also include a feeder for precise feeding of solder.
  • the control unit may also include two or more selectable soldering profiles to enable laser soldering without input of a separate control factor.
  • the laser processing apparatus according to the embodiment of the present invention may have a plurality of soldering profiles, and each laser soldering profile may be divided into three steps and eight steps in order to enable flexible and accurate parameter control.
  • the control unit of the laser processing apparatus may be provided to select two or more laser head options of the focal length, IR temperature sensing, and real-time soldering quality monitoring.
  • the laser soldering profile may include the slope of the laser output, the laser irradiation time, the number of laser irradiation and the relationship between the laser output and the irradiation time.
  • Various combinations of the four conditions may determine a laser profile corresponding to the size of the solder ball and the soldering environment. For example, when the solder ball is large, melting of the solder ball may not be completely performed, and thus laser irradiation for heating may be performed a plurality of times for melting of the soldering. Depending on the size of the solder balls, it may be to perform reflow soldering. In addition, when heating is completed, slow cooling may be performed. When quenching occurs, cold solder may occur and cracks may occur in the soldering part. Therefore, slow cooling can be performed at the time of cooling.
  • the slow cooling may also be performed by slow cooling performed by continuously decreasing the laser output and slow cooling performed by gradually decreasing the output. Even in slow cooling by continuously decreasing the laser output, the higher the slope between the laser output and the irradiation time, the more similar the quench and the effect can be selectively controlled.
  • various laser profiles may be selected to form one or more output sections in the soldering process through a combination of laser power, laser irradiation time, laser irradiation frequency, and inclination in the laser output and irradiation time relationship.
  • soldering may be applied to electrical connections of various terminals.
  • soldering can be performed smoothly even when the terminals are located on the same plane or at an angle.
  • corner connection Corner connection
  • Cav connection Cav connection
  • omnidirectional bonding All connection
  • a portion of the device according to an embodiment of the invention comprises an upper base 17 and a lower base 18 and comprises a hole disk located between the upper base 17 and the lower base 18.
  • the hole disk may be rotated by the rotation shaft 6, and may include a plurality of holes to move the solder balls located at each hole to the laser transmission channel 14 by rotation about the rotation shaft 6. That is, the solder ball S introduced through the solder ball inlet 2 is positioned in one of a plurality of holes provided in the hole disk, and the solder ball S located in one hole of the hole disk by the rotation of the rotation shaft 6. May be moved to the side of the laser transmission channel 14.
  • solder ball (S) supplied to the solder ball inlet (2) may be temporarily stored in the storage chamber (3), the outlet of the solder ball (S) by the supply of nitrogen gas through the nitrogen gas inlet (11) (4)
  • the solder ball S may be moved to the port 5 and the solder ball S may be located in one of a plurality of holes provided in the hole disk.
  • the upper base 17 is provided with a structure capable of rotatably supporting the rotating shaft 6, the adapter 7 may be included on the upper side.
  • a receiving port 10 and a transmission port 9 penetrating the upper base 17 and the lower base 18 may be included.
  • the solder ball S moved toward the laser transmission channel 14 may be moved toward the nozzle 16 through the solder ball S outlet channel 12.
  • the transparent glass 13 may be provided above the laser transmission channel 14, and the laser irradiated through the transparent glass 13 may be irradiated toward the nozzle 16 via the laser transmission channel 14. .
  • the nozzle 16 may be coupled to the nozzle 16 locking screw provided on the lower base 18. As such, replacement of the nozzle 16 may be facilitated by allowing the nozzle 16 to be coupled via the lower base 18 and the nozzle 16 lock screw.
  • the nozzle 16 has been described as an example of the locking screw, the coupling structure may be adopted to the nozzle 16 and the lower base 18 to enable the nozzle 16 to be replaced, of course, to be.
  • the nitrogen gas inlet 11 (4) for supplying nitrogen gas to the laser transmission channel 14 above so that the solder ball S inside the nozzle 16 melted by the laser can be discharged to a portion requiring laser soldering. ) Can be arranged.
  • An enlarged look at the nozzle 16 included in the laser processing apparatus according to the embodiment may be the same as that of FIG. 13.
  • the nozzle 16 illustrated in FIG. 13 may be provided with a through hole including a cylindrical portion and a truncated cone portion coupled to a lower portion of the cylindrical portion.
  • Solder ball (S) is introduced into the nozzle 16 via the solder ball (S) outlet channel 12, and then falls by gravity through the cylindrical shape. Falling solder ball (S) is caught in the truncated conical shape does not go out of the nozzle (16).
  • the laser is irradiated to the hanging solder fire of the truncated cone via the transparent glass 13, and the molten solder ball S is discharged to the outside by nitrogen gas.
  • a cap may be provided at one side of the solder ball inlet 2, and the cap may be opened only when the solder ball S is moved toward the solder ball inlet 2 in the solder ball S supply chamber in which the solder ball S is stored.
  • the cap provided in the solder ball inlet (2) can be opened so that the solder ball (S) can be supplied only when the laser processing apparatus according to the embodiment of the present invention is used.
  • any gas that can be used as a carrier as an inert gas such as helium gas or argon gas may be used.
  • FIGS. 14 and 15 sequentially illustrating some processes that are examples of laser processing apparatuses.
  • the flowcharts A to F described in FIG. 14 will be briefly described.
  • the object is moved (A) to the vision inspection position after the object is loaded, and then the alignment, rotation, and placement of the object is detected (B). Thereafter, it is moved to the soldering position (C) to be soldered (D) by the laser processing apparatus. Next, it is moved to the unloading position (E) and unloaded. When the next object is loaded (F), it is moved to the vision inspection position (A). On the other hand, the option of moving to the vision inspection position to check the quality of the soldering after laser soldering may be added, of course.
  • the flowcharts A 'to F' described in FIG. 15 will be briefly described.
  • the soldered object is taken out and the object to be soldered is loaded at the unloading position B' and then moved to the vision inspection position C '.
  • the alignment, rotation, and placement of the object are detected (D ').
  • it is moved to the soldering position (E ') to be soldered (F') by the laser processing apparatus.
  • An option that can be added here is the step of moving the object to a vision inspection position (position) to check the quality of the soldering after laser soldering, and the alignment, rotation after detecting the alignment, rotation, and placement of the object. And / or an option to move to the unloading position if the placement is not normal and again unload and load.
  • the processing sequence described with reference to FIGS. 14 and 15 is controlled by the controller, and can be described in more detail with reference to FIG. 17.
  • Soldering is performed by the machining section, which includes the head.
  • the head may include one or more of a laser beam focusing optical head and a solder ball feeding apparatus.
  • the processing unit may further include a nozzle for discharging the solder ball.
  • the controller may determine a predetermined state of the nozzle 16, that is, a state such as contamination or damage, and determine a time of cleaning or replacement. Further, the controller can record the laser output and correct the laser output.
  • the quality control of the solder portion which is a soldered portion, may be performed by the control of the controller, which may be controlled to discard or collect the solder balls used in the bonding test and defective solder balls defective in manufacturing. .
  • the laser beam may be irradiated to the solder part that does not meet the predetermined quality standard to re-melt the solder part to improve solder wettability, or may be removed and re-soldered through remelting. As another example, it may be classified by the classification apparatus.
  • the controller may perform control to correct the laser beam position, the nozzle position, and the vision inspection position.
  • the controller may control the soldering to be performed by the profile of the laser determined by a combination of a laser output, a laser irradiation time, a laser irradiation frequency, and a slope in a relationship between the laser output and the irradiation time.
  • the apparatus or method according to the embodiment of the present invention may include the following configuration.
  • the inspection described below may include a first inspection (pre-inspection) and a second inspection (post-inspection) performed by the inspection unit.
  • the first inspection pre-inspection
  • the second inspection post-inspection
  • It may be a test for detecting at least one of cracks and pores of the solder part.
  • an object that does not satisfy the quality standard as a result of the second test may be classified as an object that satisfies the quality standard, and resoldering may be performed on the object that does not satisfy the quality standard.
  • the laser supplied from the laser supply device may be a laser having a high laser absorption rate depending on the solder material. It may also be a solid state laser such as a fiber laser or a diode laser.
  • the laser beam generated from the laser generating device may be transmitted through the optical fiber to the laser soldering head without a separate optical mirror. As a result, precise operation may be possible at the time of soldering by stable supply of laser and laser irradiation.
  • the laser processing apparatus may include a pick and place soldering head or a jet soldering head including the laser soldering nozzle 16.
  • the laser soldering head may include a laser beam focusing optical head, a solder ball S supply, and a nozzle 16.
  • the laser soldering head may mean a head, and may not only be configured as a single head, but also as a dual head including two heads. Not only this, of course, it can be composed of a head body including three or more heads. Thus, when two or more laser soldering heads are included, productivity of an apparatus can be improved.
  • a vision inspection module Vision Inspection Module / unit
  • a vision inspection step By including such a vision inspection module or step, it is possible to perform a position inspection, an alignment state inspection, and the like (pre-inspection) of the camera module 20 to be soldered. can do.
  • a vision inspection module consisting of a low magnification and a high magnification lens
  • a motorized variable zoom lens (1X to x18: the maximum magnification can be increased according to the zoom lens design). High magnification at low magnification, narrow area can be inspected automatically.
  • Pre-Inpsection and Post-Inpsection can be combined into one vision inspection module, but can be configured as separate vision inspection modules to increase productivity (eg, pre-inspection). 1 for Pre-Inpsection and 1 for Post-Inpsection).
  • Pre-Inpsection and Post-Inpsection are provided with one vision inspection module
  • the object which has undergone the Pre-Inpsection is moved to the position for soldering and soldered. After that, it can be returned to the previous position and post-inspected.
  • the vision inspection module is equipped with two pre-inpsection functions, one for pre-inpsection and one for post-inpsection, the pre-inpsection module, laser soldering
  • the objects may be moved and inspected and soldered in turn in the order in which the modules and the post-inpsection modules are located.
  • it may further include an infrared inspection device for post-inspection, such as monitoring the soldering quality in real time to control parameters or for internal cracking of the soldered area, pore inspection, and the like.
  • an infrared inspection device for post-inspection, such as monitoring the soldering quality in real time to control parameters or for internal cracking of the soldered area, pore inspection, and the like.
  • the apparatus may further include a sorting device capable of classifying objects that do not meet the soldering quality standards required after the post-inspection.
  • a repair device that can repair the object that does not meet the soldering quality standards required after post-inspection (Post-inspection).
  • a repair apparatus may re-melt the solder by re-irradiating the laser to improve solder wettability or to remove and resold the pre-soldered solder.
  • When removing the soldered solder it can be removed automatically by using mechanical tools such as pins, or by remelting with a laser and suctioned.
  • the cleaning device may further include a cleaning device including a dust collecting device for removing dust and foreign matter for quality control after soldering (Soldering).
  • the cleaning device may further include at least one of a dry air blowing device, a carbon dioxide snow cleaning device, and an inert gas blowing device.
  • it may further include a soldering pre-paid pre-paid according to the type of substrate to be soldered. It also includes an additional laser soldering head to maximize soldering quality and productivity.
  • solder ball S solder ball S
  • the supply of the solder ball S which is a material
  • bonding between metals, bonding between metals and resins, and plastic welding may be performed.
  • Bonding of both base materials may be performed by varying the conditions such as the irradiation intensity, the irradiation time, and the irradiation period of the laser according to the properties of the object to which the laser is irradiated.
  • the laser processing apparatus may include a plurality of nozzles 16 described above. That is, when the solder ball S is supplied to the nozzle 16 by the hole disk 8, the solder ball S may be provided by the hole disk 8 so as to correspond to the plurality of nozzles 16. That is, the movement may be performed simultaneously instead of being provided to one nozzle 16 of the plurality of nozzles 16.
  • the solder balls S may be provided to two dual laser bonding heads and may be discharged from the head by discharging nitrogen gas after being dissolved by a laser. This process can be done at the two heads simultaneously, so that the soldering time can be shortened.
  • An apparatus in which two heads (dual laser bonding heads) are provided is, for example, provided that a larger number of heads may be provided to improve work efficiency.
  • the laser processing apparatus may further include a jig.
  • the jig may be a rotating fixture jig that is moved in a rotational manner.
  • a fixture jig channel including a plurality of jigs employing the rotatable movement method may be provided.
  • a three fixture jig channel may be provided in which three or more jigs which are moved in a rotatable manner are coupled to each other. In such a fixture jig channel, a plurality of objects to be soldered may be included or seated.
  • the jig when performing at least one of soldering and bonding at two or more points of the object, respectively, if soldering or bonding at one of the two points present in one object is present in the object
  • the jig can be moved so that laser processing can be performed at the remaining two points.
  • the movement of the jig may be a rotation, may be a movement by a linear movement, may be a movement by a combination of the rotation and linear movement.
  • soldering or bonding may be performed at the remaining points.
  • the first bonding (laser bonding head 1) performs the bonding (bonding) on the first jig portion (fixture jig channel 1)
  • the head 2 (laser bonding head 2) is a third jig portion (fixture jig channel) 3) bonding can be performed.
  • the first head can perform a bonding operation on the second jig portion.
  • the object on which the bonding operation is completed may be taken out.
  • a new object may be positioned on the first jig portion from which the object is taken out to wait for the bonding operation.
  • the object When the bonding operation is completed with respect to the object located in the third jig unit, the object may be taken out and a new object may be positioned on the third jig unit from which the object is taken out to wait for the bonding operation.
  • the first head When the first head is bonded to the object located on the second jig portion, the first head may perform the bonding operation to the object located on the first jig portion.
  • the second jig unit When the second jig unit is positioned at the unloading position, the object on which the bonding operation is completed is taken out, and a new object is positioned on the second jig unit to wait for the bonding operation.
  • the second head When the second head completes the bonding operation on the object on the third jig portion, the second head may perform the bonding operation on the second jig portion.
  • the above bonding operation is repeatedly performed, and laser processing can be performed.
  • each jig 30 in which a plurality of objects are disposed in the loaded or unloaded position may be mounted on the first jig portion.
  • each jig in which a plurality of objects are disposed may be mounted on the second jig unit in a position where the object is loaded or unloaded.
  • each jig in which a plurality of objects are disposed may be mounted on the third jig unit in a position where the object is loaded or unloaded.
  • the vision inspection unit may check whether the object to be worked is normally operated such as alignment, rotation, and placement.
  • the first head may bond the bonding surface formed on each object disposed on the first jig portion. While the first jig unit performs the joining operation, the vision inspection unit may check whether or not the rotation of the alignment state and the arrangement of each object disposed in the third jig unit are normally operated.
  • the second head may join the bonding surface formed on each object disposed on the second jig portion.
  • each jig included in the first jig portion may move to the bonding operation position of the other surface.
  • the movement may be rotation.
  • the vision inspection unit may check an alignment state, an arrangement, etc. of each object located on the first jig unit.
  • the other surface of the object on the first jig portion moved by the first head may be joined.
  • the first jig unit may be moved to the unloaded position.
  • the object may be taken out on the first jig part and a new object may be disposed on the first jig part.
  • the respective jig included in the third jig part may be moved to the bonding operation position of the other surface.
  • the vision inspection unit may inspect the alignment, placement, etc. of each object rotated by the third jig unit.
  • the second head may be bonded to the other surface of each object disposed on the third jig portion.
  • the vision inspection unit is used to check the alignment, rotation, placement, etc. of each object placed on the second jig part. Can be checked
  • the first head may be bonded to one surface of each object disposed in the second jig unit, and the first jig unit in which the object to be newly joined may be disposed may wait until the work of the second jig unit is completed. Therefore, the subsequent working process may repeat the above process.
  • Each object of the completed fixture jig channel may perform post-inspection with one or two vision inspection modules / units.
  • the nozzle 16 is pressurized through a gas such as nitrogen, the nozzle 16 in contact with the inner surface of the nozzle 16, that is, the dissolved material in the process of discharging the material (solder ball (S)) located on the inside
  • the inner side of the) may be contaminated.
  • the contamination may include a material that is not discharged and adheres to the remaining material, and a foreign material generated on the surface by repeated discharge of a gas (such as nitrogen) and foreign matters generated in the process of thermal damage by the temperature when the material is dissolved can do. Accumulation of the foreign matter and the like may affect the laser processing efficiency and cause an indeterminate result.
  • a process of inspecting the condition and quality of the nozzle 16 it is necessary to clean it at predetermined intervals or intermittently.
  • the degree of contamination is measured to reach a predetermined contamination level or to be determined based on a predetermined unit time.
  • foreign matter, dust, and the like may be removed by a nozzle cleaning unit while being moved to the washing area to be cleaned or the object is not positioned. It may be cleaned by a method such as physical or chemical, and a configuration for performing this may include a vision unit and a nozzle monitor.
  • the laser intensity may be adjusted to compensate for the difference.
  • the control unit (not shown) and the laser power (energy) detection unit are connected to each other and received from the laser power (energy) detection unit (laser power (energy) detection unit). The intensity of the irradiated laser can be increased or decreased in comparison with the preset laser intensity based on the obtained information.
  • the laser processing apparatus further includes a waste ball collecting unit for discarding or collecting the solder balls S used in the bonding test and the defective solder balls S defective in manufacturing. can do.
  • the solder ball S may be collected and discarded in the process of being moved before being discharged from the nozzle 16 immediately after the solder ball S is provided to the laser processing apparatus by a waste ball collecting unit.
  • the control unit (not shown)
  • the calibration plate connected to the sensor immediately detects information of one or more of the absolute and relative coordinates of the laser beam, the nozzle 16, and the vision inspection to the control unit. Compensation for the difference from the preset setting value by comparing with the preset setting value, the actual beam position, the nozzle 16 (nozzle) position and the vision inspection (vision inspection) position You can move it to converge to the set value.
  • the laser irradiation step is not performed, thereby preventing a malfunction related to laser irradiation.
  • the soldering object may be the camera module 20 or may be another full length. Therefore, of course, it is not limited to the shape of the illustrated example.
  • 17 is a diagram illustrating determining a soldering position according to an embodiment of the present invention.
  • the inspection light L may be irradiated from the head part 110 toward the soldering target area P2 for soldering positioning.
  • the head 110 has a configuration including a nozzle, and may function to discharge the solder ball S.
  • the surface information of the soldering target region P2 may be input by irradiating the inspection light L, and the surface information may be matched with the previously input soldering information. Therefore, the soldering target region P2 may be included in the region to which the inspection light L is irradiated.
  • soldering may be performed at the first position SP1, which is a reference value, and the soldering position is compensated for some unmatched information. Can be determined and soldering can be performed.
  • the mismatched information will be described below as a positioning factor to specifically describe the soldering positioning.
  • the inspection light L may be emitted from the head 110.
  • the irradiation area of the inspection light L may be an area including an area occupied by the plurality of terminal parts 50 to be soldered in order to electrically connect the plurality of terminal parts 50 to each other by soldering.
  • the laser processing apparatus may detect a position of the terminal unit 50, a separation distance between the terminal units 50, and an angle spaced between the terminal units 50 through the inspection light L. Based on the detected information, the solder ball S may be discharged, that is, the soldering position may be determined. And, by determining the soldering position, it is possible to adjust the bonding force by the soldering and to control the distribution of the solder ball (S). Meaning of adjusting the bonding force means that the solder ball (S) can adjust the area in contact with the terminal.
  • the head unit 110 may perform soldering.
  • various positioning factors may be present.
  • the positioning factors include the separation distance between the terminals, the difference in size of the terminals (difference in width or exposed area), the angle at the time of joining, and the size of the solder ball (S).
  • the soldering position may be determined as the first position SP1 and soldering may be performed.
  • solder ball (S) device determines the soldering position according to the separation distance between the terminals.
  • a difference may occur in a position at which a separation distance between terminals is previously inputted with the input data (the default value) and the inspection light L.
  • soldering may be performed at the second position SP2 which is a position corrected by the distance reflected from the first position SP1.
  • the separation distance may be determined as a position compensated in the X direction, when the second position SP2, which is the corrected soldering position, is referred to as the separation in the X direction.
  • the separation in the X direction For example, when the center positions of the two terminals 50 are 0.3 mm apart from each other, the soldering position of the second position SP2 is 0.15 mm compensated from the center position, and the center positions of the two terminals 50 spaced apart from each other. Can be determined.
  • the distance compensated for the separation distance is an example, and may be changed by other positioning factors, and is not limited to the numerical value except for other positioning factors.
  • each terminal 50 has a uniform bonding area of the solder ball (S) than the case where the soldering is performed in the first position (SP1)
  • the conductance can be improved. For example, when soldering is performed at the first position SP1, one terminal of the two terminals 50 is matched with pre-entered data, and the other terminal is not matched.
  • the first position SP1 is determined and soldering is performed, the other terminal and the first position SP1 are disposed at a position spaced apart from the one terminal and the first position SP1. Therefore, while the contact area with the solder ball (S) is formed non-uniformly with the two terminals 50, the electrical conductivity may be reduced. That is, determining the second position SP2 and performing soldering may improve conduction and increase bonding strength.
  • solder ball (S) device determines the soldering position according to the size of the terminal.
  • the sizes of the two terminals 50 may be formed differently from each other, unlike the default value.
  • the size of each of these different terminals 50 is sensed by irradiating irradiation light, and the position of soldering may be determined differently according to the size of the terminal. That is, the size of the terminal may be included in the positioning factor.
  • Soldering may be performed to the second position SP2 which is a position compensated from the first position SP1 according to the size of the terminal.
  • the second position SP2 which is the compensated position, may be a position moved in the X direction from the first position SP1.
  • the positioning of the soldering in the state that the two terminals 50 are different it may be a position moved in the Y direction from the first position (SP1).
  • the solder balls S may be discharged to the larger terminal side. That is, the second position SP2 may be determined by moving the soldering position from the first position SP1 to the Y direction, which is a direction in which the larger terminal is located. This positioning has the effect that the solder ball (S) increases the contact area with the terminal and improve the electrical conductivity.
  • the second position SP2 may be determined in the X and Y directions from the first position SP1.
  • solder ball (S) device determines the soldering position according to the joint surface angle.
  • the soldering position may be determined by an angle formed according to the arrangement of the joining surfaces to which the two terminals 50 are joined by soldering.
  • soldering is performed between the two terminals 50, since the two members each including the two terminals 50 are disposed at a predetermined angle, the solder ball S may be positioned in the valley formed while the two members face each other. have.
  • the joint surface angle may be included in the positioning factor.
  • the degree of reflecting the second position SP2 determined according to different sizes of the two terminals 50 can be set low. That is, as the level of the solder ball S melted in the valley is higher, the second position SP2 is determined by different sizes, but the determined second position SP2 may have a small soldering positioning effect. This is because the molten solder ball S may be sufficiently in contact with the two terminals 50 due to the small angle of the valleys.
  • 21 is a view showing that the solder ball (S) device according to an embodiment of the present invention determines the soldering position according to the size of the solder ball (S).
  • the possibility that the two terminals 50 are joined by soldering may be increased because the larger the solder ball S, the higher the water level H1 is formed. That is, when the solder ball S is large, the contact area with the two terminals 50 may be wider than when the solder ball S is small. Due to this effect, when the solder ball S is large, the effect of soldering positioning may be insignificant, and thus the degree of intervention of the positioning process may be lowered.
  • the solder ball S when the solder ball S is small, the contactability between the two terminals 50 is low, and even if the contact with the two terminals 50 is made, the contact between the terminal 50 and the solder ball S depending on the soldering position. Area differences can occur. When the difference occurs, the electrical conductivity and bonding strength may be lowered. Therefore, when the solder ball S is small, the degree of intervention of the positioning process may be increased, and the contact area of the solder part may be increased by increasing the number of soldering times two or more times.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un appareil d'usinage au laser comprenant : une partie tête permettant d'émettre une lumière d'inspection en direction d'un objet; et une partie de commande permettant de mettre en correspondance des informations de surface d'une zone pré-entrée devant être brasée et des informations de surface acquises par l'émission de la lumière d'inspection, le brasage étant réalisé au niveau d'une première position, qui est une position de référence, ou d'une seconde position dont la distance est compensée à partir de la position de référence, selon un ou plusieurs facteurs de détermination de position par la mise en correspondance des informations de surface.
PCT/KR2018/005362 2017-05-10 2018-05-10 Dispositif de brasage, et appareil d'usinage au laser et procédé d'usinage WO2018208095A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20170058353 2017-05-10
KR10-2017-0058353 2017-05-10
KR20170063892 2017-05-24
KR10-2017-0063892 2017-05-24
KR1020180053424A KR102110763B1 (ko) 2017-05-10 2018-05-10 솔더링 장치, 레이저 가공 장치 및 가공 방법
KR10-2018-0053424 2018-05-10

Publications (1)

Publication Number Publication Date
WO2018208095A1 true WO2018208095A1 (fr) 2018-11-15

Family

ID=64104821

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/005362 WO2018208095A1 (fr) 2017-05-10 2018-05-10 Dispositif de brasage, et appareil d'usinage au laser et procédé d'usinage

Country Status (1)

Country Link
WO (1) WO2018208095A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114749745A (zh) * 2022-04-28 2022-07-15 深圳市紫宸激光设备有限公司 自动化激光锡焊方法、装置及系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050041451A (ko) * 2003-10-31 2005-05-04 성창경 레이저 가공 대상물의 가공 위치 표시 장치와 그 장치를 이용한 가공 방법
US20080272112A1 (en) * 2004-06-01 2008-11-06 Soutec Soudronic Ag Hard-Soldering Method and Device
KR20110018074A (ko) * 2009-08-17 2011-02-23 (주)미래컴퍼니 레이저 가공 및 검사장치 및 방법
JP2011212727A (ja) * 2010-03-31 2011-10-27 Panasonic Electric Works Sunx Co Ltd レーザ加工装置
KR20170017044A (ko) * 2015-08-04 2017-02-15 크루셜머신즈 주식회사 카메라 모듈용 솔더링 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050041451A (ko) * 2003-10-31 2005-05-04 성창경 레이저 가공 대상물의 가공 위치 표시 장치와 그 장치를 이용한 가공 방법
US20080272112A1 (en) * 2004-06-01 2008-11-06 Soutec Soudronic Ag Hard-Soldering Method and Device
KR20110018074A (ko) * 2009-08-17 2011-02-23 (주)미래컴퍼니 레이저 가공 및 검사장치 및 방법
JP2011212727A (ja) * 2010-03-31 2011-10-27 Panasonic Electric Works Sunx Co Ltd レーザ加工装置
KR20170017044A (ko) * 2015-08-04 2017-02-15 크루셜머신즈 주식회사 카메라 모듈용 솔더링 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114749745A (zh) * 2022-04-28 2022-07-15 深圳市紫宸激光设备有限公司 自动化激光锡焊方法、装置及系统
CN114749745B (zh) * 2022-04-28 2023-10-27 深圳市紫宸激光设备有限公司 自动化激光锡焊方法、装置及系统

Similar Documents

Publication Publication Date Title
KR102110763B1 (ko) 솔더링 장치, 레이저 가공 장치 및 가공 방법
WO2021100960A1 (fr) Dispositif de refusion par laser et procédé de refusion par laser
WO2013066113A1 (fr) Dispositif automatisé pour réaffûtage de foret
WO2021002622A1 (fr) Module d'affichage à micro-del et procédé de fabrication associé
WO2023054966A1 (fr) Dispositif de brasage laser à position d'irradiation laser réglable et procédé de brasage le comprenant
WO2018208095A1 (fr) Dispositif de brasage, et appareil d'usinage au laser et procédé d'usinage
WO2017142150A1 (fr) Procédé de réparation par soudage laser, procédé de soudage laser et système de soudage laser
JPH08340195A (ja) 電子部品実装方法及び装置
WO2018208096A1 (fr) Ensemble gabarit, et appareil d'usinage laser le comprenant
WO2018208097A1 (fr) Procédé et dispositif de traitement au laser
WO2018117510A2 (fr) Procédé d'affinage de domaine magnétique d'une plaque d'acier électrique à grains orientés, et dispositif associé
WO2020262979A1 (fr) Système et procédé de fabrication de carte composite
WO2021167172A1 (fr) Appareil d'impression à jet d'encre et procédé d'inspection de tête à jet d'encre l'utilisant
WO2018199363A1 (fr) Procédé et appareil d'inspection d'article
WO2023003105A1 (fr) Système de brasage dur et procédé de brasage dur
TWI467197B (zh) An electronic component operating unit for an image capturing device, and a working device for its application
WO2015088090A1 (fr) Appareil permettant de fabriquer un coupe-circuit thermique (tco) et son procédé de fabrication
WO2020005001A1 (fr) Dispositif électronique et procédé de détermination de cause de défaut de montage dans des composants montés sur un substrat
WO2020105957A1 (fr) Gabarit pour traitement de trou d'interconnexion, dispositif de traitement de trou d'interconnexion, et procédé de traitement de trou d'interconnexion l'utilisant
US20100150430A1 (en) Visual inspection apparatus and visual inspection method for semiconductor laser chip or semiconductor laser bar
WO2022250208A1 (fr) Procédé, système et appareil de traitement de tranche
WO2022080921A1 (fr) Procédé, système et appareil de traitement de plaquette
WO2016099197A1 (fr) Dispositif et procédé de test d'un élément semi-conducteur au moyen d'une caractéristique dynamique d'une température de jonction
WO2023068388A1 (fr) Dispositif de brasage laser à position d'irradiation laser réglable et procédé de brasage le comprenant
WO2023075549A1 (fr) Système de pressage de billes et appareil de pressage de billes pour boitier bga

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18797566

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18797566

Country of ref document: EP

Kind code of ref document: A1