WO2020138207A1

WO2020138207A1 - Gas barrier laminate

Info

Publication number: WO2020138207A1
Application number: PCT/JP2019/050923
Authority: WO
Inventors: 博貴木下; 智史永縄
Original assignee: リンテック株式会社
Priority date: 2018-12-27
Filing date: 2019-12-25
Publication date: 2020-07-02
Also published as: CN113226750B; CN113226750A; JP7398394B2; JPWO2020138207A1; TW202031479A; KR20210110592A

Abstract

This gas barrier laminate has a high fracture elongation and good gas barrier properties, and is provided with a process film, a base layer, and a gas barrier layer, in this order, wherein the base layer is a layer comprising a cured product of a curable resin composition which contains a polymer component (A) and a curable monomer (B). The gas barrier laminate satisfies the following requirements [1] and [2]. [1] The absolute value of a thermal shrinkage of the gas barrier laminate is 0.5% or less. [2] The fracture elongation of the gas barrier laminate is 1.9% or more.

Description

Gas barrier laminate

The present invention relates to a gas barrier laminate that is preferably used as a member for electronic devices such as liquid crystal displays and electroluminescence (EL) displays.

For a display such as a liquid crystal display or an electroluminescence (EL) display, it has been considered to use a transparent plastic film in place of a glass plate in order to realize thinning, weight reduction, and flexibility.
However, in general, a plastic film is more permeable to water vapor, oxygen, etc. than a glass plate, and when a transparent plastic film is used as a substrate for a display, the water vapor, oxygen, etc. that permeate the substrate act on the elements inside the display device. However, there is a problem that the performance of the device is deteriorated and the life is shortened.
In order to solve this problem, it has been proposed to use a film having a property of suppressing permeation of water vapor and oxygen as a substrate of a display. Hereinafter, the property of suppressing permeation of water vapor and oxygen will be referred to as “gas barrier property”, the film having gas barrier property will be referred to as “gas barrier film”, and the laminate having gas barrier property will be referred to as “gas barrier laminate”.

In recent years, higher performance displays and the like have been sought, and also in gas barrier films used as members for electronic devices and the like, in addition to excellent gas barrier properties, heat resistance, solvent resistance, and interlayer adhesion are excellent, There is a growing demand for excellent various properties such as low birefringence and excellent optical isotropy.
For example, Patent Document 1 discloses a gas barrier film having a gas barrier layer on one surface of a cured resin layer, wherein the cured resin layer comprises a thermoplastic resin having a glass transition temperature of 140° C. or higher and a curable monomer. A gas barrier film, which is a layer composed of a cured product of a curable resin composition contained therein, has been proposed.

International Publication No. 2013/065812

However, there is still room for improvement in conventional gas barrier laminates, and with the evolution of electronic devices, it is required to have higher bending resistance and to further enhance gas barrier properties.

In view of the above problems, an object of the present invention is to provide a gas barrier laminate having high bending resistance and excellent gas barrier properties, which is suitably used as a member for electronic devices.

The present inventors have conducted extensive studies to solve the above problems, and as a result, a gas barrier laminate having a process film, an underlayer, and a gas barrier layer in this order, wherein the underlayer is a polymer. A layer formed of a cured product of a curable resin composition containing the component (A) and the curable component (B), and the absolute value of the heat shrinkage rate of the gas barrier laminate and the elongation at break of the underlayer are predetermined. It was found that the above problems can be solved by setting the value to be the value, and the present invention has been completed.
That is, the present invention provides the following [1] to [6].
[1] A gas barrier laminate comprising a step film, a base layer, and a gas barrier layer in this order,
The underlayer is a layer formed of a cured product of a curable resin composition containing a polymer component (A) and a curable component (B),
A gas barrier laminate, wherein the gas barrier laminate satisfies the following requirements (1) and (2).
(1) The absolute value of the thermal shrinkage of the gas barrier laminate is 0.5% or less.
(2) The breaking elongation of the gas barrier laminate is 1.9% or more.
[2] The gas barrier laminate according to [1], wherein the underlayer has a thickness of 0.1 to 10 μm.
[3] The gas barrier laminate according to the above [1] or [2], wherein the gas barrier layer is a coating film.
[4] The gas barrier laminate according to any one of the above [1] to [3], wherein the curable component (B) contains a cyclopolymerizable monomer.
[5] The curable component (B) further contains a polyfunctional (meth)acrylate compound, and the mass ratio of the cyclopolymerizable monomer to the polyfunctional (meth)acrylate compound is 95:5 to 30. : 70, the gas barrier laminate according to the above [4].
[6] The gas barrier laminate according to any one of the above [1] to [5], wherein the glass transition temperature of the polymer component (A) is 250° C. or higher.

According to the present invention, it is possible to provide a gas barrier laminate having high bending resistance and excellent gas barrier properties.

It is a cross-sectional schematic diagram which shows the structure of the gas barrier laminated body which concerns on embodiment of this invention. It is process drawing which shows an example of the manufacturing method of a gas barrier laminated body.

In the present specification, preferable rules can be arbitrarily selected, and combinations of preferable rules can be said to be more preferable.
In the present specification, the description “XX to YY” means “XX or more and YY or less”.
In the present specification, the lower limit value and the upper limit value described stepwise for the preferable numerical range (for example, the range of the content etc.) can be independently combined. For example, from the description "preferably 10 to 90, more preferably 30 to 60", the "preferable lower limit value (10)" and the "more preferable upper limit value (60)" are combined to obtain "10 to 60". You can also
In the present specification, for example, “(meth)acrylic acid” indicates both “acrylic acid” and “methacrylic acid”, and other similar terms are also the same.
The gas barrier laminate according to the embodiment of the present invention will be described below.

1. Gas Barrier Laminate A gas barrier laminate according to an embodiment of the present invention includes a process film, a base layer, and a gas barrier layer in this order. The underlayer is a layer formed of a cured product of a curable resin composition containing the polymer component (A) and the curable component (B), and the gas barrier laminate has the following requirement [1] and [2] is satisfied.
[1] The absolute value of the thermal shrinkage of the gas barrier laminate is 0.5% or less.
[2] The breaking elongation of the gas barrier laminate is 1.9% or more.
In the gas barrier laminate according to the embodiment of the present invention, the base layer is a cured product of the curable resin composition, whereby the base layer has excellent solvent resistance. Therefore, for example, when the gas barrier layer is formed as a coating film, the underlayer is less likely to be eroded by the solvent during coating. As a result, it is possible to make it difficult for the gas barrier laminate to have a reduced gas barrier property. The coating film is a coating film obtained by applying the coating material onto a substrate or an object and subjecting it to treatment such as drying or curing by heating if necessary. When the gas barrier layer is used as a coating film, it is a coating film obtained by applying a coating material containing a component for forming a gas barrier layer, which will be described later, onto the undercoat layer and performing curing by drying or heating. Further, when the underlying layer is a coating film, the curable resin composition is applied to an object to be coated such as a process film, and either or both of curing treatments such as drying and heating and irradiation with active energy rays are performed. It is a film obtained by performing.
Further, by satisfying the above requirement [1], shrinkage of the gas barrier laminate during heating is suppressed. Therefore, for example, when the gas barrier layer is formed on the underlayer by applying the material forming the gas barrier layer and heating and drying, the gas barrier layer is contracted by the underlayer and the precursor of the gas barrier layer. It can be avoided that the gas barrier property is lowered due to the deformation.
Further, by satisfying the above requirement [2], the flexibility of the gas barrier laminate is enhanced, and the gas barrier laminate has excellent bending resistance and is suitable for flexible device applications.
In the specification of the present application, the thermal contraction rate of the gas barrier laminate is determined by setting the gas barrier laminate in a thermomechanical analyzer, raising the temperature to 130° C. at 5° C./min, and then cooling to room temperature at 5° C./min. However, it is a value obtained by measuring the rate of change of displacement in the longitudinal direction before and after heating the underlayer, and it is measured in detail by the procedure shown in the examples.
Further, in the present specification, the breaking elongation of the underlayer is a value measured according to JIS K7127:1999, and more specifically, it is measured by the procedure shown in the examples.

1-1. Underlayer The underlayer of the gas barrier laminate according to the embodiment of the present invention comprises a cured product of a curable resin composition containing a polymer component (A) and a curable component (B). The underlayer may be a single layer or may include a plurality of laminated layers.

[Polymer component (A)]
The glass transition temperature (Tg) of the polymer component (A) is preferably 250° C. or higher, more preferably 290° C. or higher, still more preferably 320° C. or higher. When Tg is 250° C. or higher, the heat shrinkage of the underlayer is suppressed, and as a result, it becomes easy to adjust the heat shrinkage rate of the gas barrier laminate to the range described above (that is, the above requirement [1]). Easier to meet).
Here, Tg is the maximum point of tan δ (loss elastic modulus/storage elastic modulus) obtained by viscoelasticity measurement (measurement in a tensile mode at a frequency of 11 Hz and a temperature rising rate of 3° C./minute in a range of 0 to 250° C.). Refers to temperature.

The weight average molecular weight (Mw) of the polymer component (A) is usually 100,000 to 3,000,000, preferably 200,000 to 2,000,000, and more preferably 250,000 to 2,000. 000, particularly preferably 500,000 to 1,000,000. The molecular weight distribution (Mw/Mn) is preferably in the range of 1.0 to 5.0, more preferably 2.0 to 4.5. The weight average molecular weight (Mw) and the molecular weight distribution (Mw/Mn) are polystyrene-converted values measured by the gel permeation chromatography (GPC) method. By setting the Mw to 100,000 or more, it becomes easy to increase the breaking elongation of the underlayer.

As the polymer component (A), a thermoplastic resin is preferable, and an amorphous thermoplastic resin is more preferable. By using the amorphous thermoplastic resin, it is easy to obtain a base layer having excellent optical isotropy, and it is easy to obtain a gas barrier laminate having excellent transparency. Further, since the amorphous thermoplastic resin is generally easily dissolved in an organic solvent, the underlayer can be efficiently formed by using the solution casting method as described later.
Here, the amorphous thermoplastic resin refers to a thermoplastic resin whose melting point is not observed in differential scanning calorimetry.

It is particularly preferable that the polymer component (A) is soluble in a general organic solvent having a low boiling point such as benzene and methyl ethyl ketone (MEK). If it is soluble in a general-purpose organic solvent, it becomes easy to form the underlayer by coating.

Particularly preferred as the polymer component (A) is an amorphous thermoplastic resin having a Tg of 250° C. or higher, which is soluble in a general organic solvent having a low boiling point such as benzene and MEK.

As the polymer component (A), from the viewpoint of heat resistance, a thermoplastic resin having a ring structure such as an aromatic ring structure or an alicyclic structure is preferable, and a thermoplastic resin having an aromatic ring structure is more preferable.

Specific examples of the polymer component (A) include polyimide resin and polyarylate resin. These resins generally have a high Tg and excellent heat resistance, and since they are amorphous thermoplastic resins, they are capable of forming a coating film by a solution casting method. Among these, a polyimide resin is preferable because it has a high Tg and excellent heat resistance, and that it is easy to obtain a resin that is soluble in a general-purpose organic solvent while exhibiting good heat resistance.

The polyimide resin is not particularly limited as long as it does not impair the effects of the present invention. For example, an aromatic polyimide resin, an aromatic (carboxylic acid component)-cyclic aliphatic (diamine component) polyimide resin, a cyclic fat A group (carboxylic acid component)-aromatic (diamine component) polyimide resin, a cycloaliphatic polyimide resin, a fluorinated aromatic polyimide resin, or the like can be used. In particular, a polyimide resin having a fluoro group in the molecule is preferable. Generally, the Tg of a polyimide resin is 250° C. or higher.

Specifically, a polyimide resin obtained by using an aromatic diamine compound and a tetracarboxylic dianhydride to polymerize into a polyamic acid and undergo a chemical imidization reaction is preferable.

As the aromatic diamine compound, a polyimide having a predetermined transparency, which is soluble in a common solvent (for example, N,N-dimethylacetamide (DMAC)) by a reaction with a tetracarboxylic dianhydride used together. Any aromatic diamine compound can be used as long as it is an aromatic diamine compound that gives Specifically, m-phenylenediamine, p-phenylenediamine, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl sulfide, 3,4′ -Diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, 3 , 3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)propane, 2 -(3-Aminophenyl)-2-(4-aminophenyl)propane, 2,2-bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2- Bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2-(3-aminophenyl)-2-(4-aminophenyl)-1,1,1,3 3,3-hexafluoropropane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(3-aminophenoxy)benzene, 1,4 -Bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 3,3'-bis(4-aminophenoxy)biphenyl, 3,4'-bis(3-aminophenoxy) Biphenyl, bis[4-(4-aminophenoxy)phenyl]sulfide, bis[3-(4-aminophenoxy)phenyl]sulfide, bis[4-(3-aminophenoxy)phenyl]sulfide, bis[3-(4 -Aminophenoxy)phenyl]sulfide, bis[3-(3-aminophenoxy)phenyl]sulfide, bis[3-(4-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenyl)]sulfone, bis [3-(3-aminophenoxy)phenyl] sulfone, bis[4-(3-aminophenyl)] sulfone, bis[4-(3-aminophenoxy)phenyl]ether, bis[4-(4-amino) Phenoxy)phenyl]ether, bis[3-(3-aminophenoxy)phenyl]ether, bis[4-(3-aminophenoxy)phenyl]methane, bis[4-(4-aminophenoxy)phenyl] ] Methane, bis[3-(3-aminophenoxy)phenyl]methane, bis[3-(4-aminophenoxy)phenyl]methane, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[3-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy) Phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoro Propane, 2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[3-(4-aminophenoxy)phenyl ]-1,1,1,3,3,3-hexafluoropropane, 1,3-bis[4-(4-amino-6-trifluoromethylphenoxy)-α,α-dimethylbenzyl]benzene, 1, 3-bis[4-(4-amino-6-fluoromethylphenoxy)-α,α-dimethylbenzyl]benzene, 2,2′-dimethyl-4,4′-diaminobiphenyl, 3,3′-dimethyl-4 , 4'-diaminobiphenyl, 3,3'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl and the like. ..

These aromatic diamine compounds may be used alone or two or more kinds of aromatic diamine compounds may be used. From the viewpoint of transparency and heat resistance, preferable aromatic diamine compounds are 2,2-bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2 -Bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2-(3-aminophenyl)-2-(4-aminophenyl)-1,1,1,3 ,3,3-Hexafluoropropane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4- (4-Aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3 3,3-hexafluoropropane, 2,2-bis[3-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 1,3-bis[4-( 4-amino-6-trifluoromethylphenoxy)-α,α-dimethylbenzyl]benzene, 3,3′-bis(trifluoromethyl)-4,4′-diaminobiphenyl, 2,2′-bis(trifluoro Examples thereof include aromatic diamine compounds having a fluoro group such as methyl)-4,4′-diaminobiphenyl, and it is preferable that at least one kind of the aromatic diamine compound used is an aromatic diamine compound having a fluoro group. Preferred is 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl. By using the aromatic diamine compound having a fluoro group, it becomes easy to obtain transparency, heat resistance, and solubility in a solvent.

As the tetracarboxylic acid dianhydride, a tetracarboxylic acid which is soluble in a common solvent (for example, N,N-dimethylacetamide (DMAC)) and gives a polyimide having a predetermined transparency, like the aromatic diamine compound. Any dianhydride can be used, and specifically, 4,4′-(1,1,1,3,3,3-hexafluoropropane-2,2-diyl)diphthalic acid dianhydride can be used. Anhydride, pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 1,4-hydroquinone dibenzoate-3,3',4,4'-tetracarboxylic Examples thereof include acid dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 3,3′,4,4′-diphenylethertetracarboxylic dianhydride. These tetracarboxylic acid dianhydrides may be used alone, or two or more kinds of tetracarboxylic acid dianhydrides may be used. From the viewpoint of transparency, heat resistance and solubility in a solvent, 4,4′-(1,1,1,3,3,3-hexafluoropropane-2,2-diyl)diphthalic acid dianhydride, etc. It is preferable to use a tetracarboxylic dianhydride having at least one kind of fluoro group.

The polymerization to polyamic acid can be performed by reacting the above aromatic diamine compound and tetracarboxylic dianhydride in a solvent in which the polyamic acid to be produced is soluble. Solvents used for polymerization into polyamic acid include N,N-dimethylacetamide, N,N-dimethylformamide, N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethyl sulfoxide, and the like. Can be used.

The polymerization reaction to polyamic acid is preferably carried out while stirring in a reaction vessel equipped with a stirrer. For example, a predetermined amount of an aromatic diamine compound is dissolved in the solvent, a reaction is carried out by adding tetracarboxylic acid dianhydride while stirring, to obtain a polyamic acid, the tetracarboxylic acid dianhydride is dissolved in the solvent Then, while stirring, a method of adding an aromatic diamine compound while reacting to obtain a polyamic acid, a method of alternately charging an aromatic diamine compound and a tetracarboxylic acid dianhydride and reacting to obtain a polyamic acid, etc. Can be mentioned.

The temperature of the polymerization reaction into the polyamic acid is not particularly limited, but it is preferably carried out at a temperature of 0 to 70°C, more preferably 10 to 60°C, still more preferably 20 to 50°C. By carrying out the polymerization reaction within the above range, it is possible to obtain a high-molecular-weight polyamic acid with little coloration and excellent transparency.

Further, the aromatic diamine compound and the tetracarboxylic acid dianhydride used for polymerization into the polyamic acid are used in approximately equimolar amounts, but in order to control the degree of polymerization of the polyamic acid obtained, the tetracarboxylic acid dianhydride is used. It is also possible to change the molar amount of the above/the molar amount of the aromatic diamine compound (molar ratio) within the range of 0.95 to 1.05. The molar ratio of the tetracarboxylic dianhydride and the aromatic diamine compound is preferably in the range of 1.001 to 1.02, more preferably 1.001 to 1.01. In this way, by slightly excess tetracarboxylic dianhydride with respect to the aromatic diamine compound, it is possible to stabilize the degree of polymerization of the resulting polyamic acid, the unit derived from tetracarboxylic dianhydride It can be placed at the end of the polymer, and as a result, it becomes possible to provide a polyimide with little coloration and excellent transparency.

The concentration of the polyamic acid solution to be generated is preferably adjusted to an appropriate concentration (for example, about 10 to 30% by mass) so that the viscosity of the solution can be kept appropriate and handling in subsequent steps is easy.

Add an imidizing agent to the obtained polyamic acid solution to carry out a chemical imidization reaction. As the imidizing agent, carboxylic acid anhydrides such as acetic anhydride, propionic anhydride, succinic anhydride, phthalic anhydride, and benzoic anhydride can be used, and they are anhydrous from the viewpoint of cost and ease of removal after the reaction. Preference is given to using acetic acid. The equivalent amount of the imidizing agent used is equal to or more than the equivalent amount of the amide bond of the polyamic acid that undergoes the chemical imidization reaction, and is preferably 1.1 to 5 times the equivalent amount of the amide bond, and is 1.5 to 4 times. Is more preferable. Thus, by using a slight excess of the imidizing agent with respect to the amide bond, the imidization reaction can be efficiently performed even at a relatively low temperature.

In the chemical imidization reaction, aliphatic, aromatic or heterocyclic tertiary amines such as pyridine, picoline, quinoline, isoquinoline, trimethylamine and triethylamine can be used as imidization promoters. By using such amines, the imidization reaction can be efficiently performed at a low temperature, and as a result, it becomes possible to suppress coloration during the imidization reaction, and it becomes easier to obtain a more transparent polyimide.

The chemical imidization reaction temperature is not particularly limited, but it is preferably performed at 10°C or higher and lower than 50°C, more preferably 15°C or higher and lower than 45°C. By performing the chemical imidization reaction at a temperature of 10° C. or higher and lower than 50° C., coloration during the imidization reaction is suppressed, and a polyimide having excellent transparency is easily obtained.

After that, if necessary, a poor solvent for the polyimide is added to the polyimide solution obtained by the chemical imidization reaction to precipitate the polyimide to form a powder, and the powder is dried.

The polyimide resin is preferably capable of being a low boiling point organic solvent such as benzene or MEK, and more preferably soluble in MEK. When it is soluble in MEK, a layer of the curable resin composition can be easily formed by coating and drying.

A polyimide resin containing a fluoro group is preferable from the viewpoints of being easily dissolved in a general-purpose organic solvent having a low boiling point such as MEK and easily forming a base layer by a coating method.
As the polyimide resin having a fluoro group, an aromatic polyimide resin having a fluoro group in the molecule is preferable, and one having a skeleton represented by the following chemical formula in the molecule is preferable.

The polyimide resin having the skeleton represented by the above chemical formula has an extremely high Tg exceeding 300° C. due to the high rigidity of the skeleton. Therefore, the heat resistance of the underlayer can be greatly improved. Further, the skeleton is linear and has relatively high flexibility, and it becomes easy to increase the breaking elongation of the underlayer. Further, the polyimide resin having the above skeleton has a fluoro group, so that it can be dissolved in a low boiling point general-purpose organic solvent such as MEK. Therefore, the undercoat layer can be formed as a coating film by applying the solution using the solution casting method, and the solvent can be easily removed by drying. Polyimide resins having a skeleton represented by the above chemical formula include 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl and 4,4′-(1,1,1,3,3,3 -Hexafluoropropane-2,2-diyl)diphthalic acid dianhydride, and can be obtained by the polymerization and imidization reaction of the above polyamic acid.

The polyarylate resin is a resin composed of a polymer compound obtained by reacting an aromatic diol with an aromatic dicarboxylic acid or its chloride. The polyarylate resin also has a relatively high Tg and relatively good elongation characteristics. The Tg of the polyarylate resin is in the range of about 170 to 300° C., and depending on its structure, there is Tg of 250° C. or more. The polyarylate resin is not particularly limited, and known ones can be used.

Examples of aromatic diols include bis(4-hydroxyphenyl)methane [bisphenol F], bis(3-methyl-4-hydroxyphenyl)methane, 1,1-bis(4′-hydroxyphenyl)ethane, 1, 1-bis(3'-methyl-4'-hydroxyphenyl)ethane, 2,2-bis(4'-hydroxyphenyl)propane [bisphenol A], 2,2-bis(3'-methyl-4'-hydroxy) Bis(hydroxyphenyl)alkanes such as phenyl)propane, 2,2-bis(4′-hydroxyphenyl)butane, and 2,2-bis(4′-hydroxyphenyl)octane; 1,1-bis(4′- Bis(hydroxy) such as hydroxyphenyl)cyclopentane, 1,1-bis(4′-hydroxyphenyl)cyclohexane [bisphenol Z], 1,1-bis(4′-hydroxyphenyl)-3,3,5-trimethylcyclohexane Phenyl)cycloalkanes; bis(4-hydroxyphenyl)phenylmethane, bis(3-methyl-4-hydroxyphenyl)phenylmethane, bis(2,6-dimethyl-4-hydroxyphenyl)phenylmethane, bis(2,2 3,6-Trimethyl-4-hydroxyphenyl)phenylmethane, bis(3-t-butyl-4-hydroxyphenyl)phenylmethane, bis(3-phenyl-4-hydroxyphenyl)phenylmethane, bis(3-fluoro-) 4-hydroxyphenyl)phenylmethane, bis(3-bromo-4-hydroxyphenyl)phenylmethane, bis(4-hydroxyphenyl)-4-fluorophenylmethane, bis(3-fluoro-4-hydroxyphenyl)-4- Fluorophenylmethane, bis(4-hydroxyphenyl)-4-chlorophenylmethane, bis(4-hydroxyphenyl)-4-bromophenylmethane, bis(3,5-dimethyl-4-hydroxyphenyl)-4-fluorophenylmethane , 1,1-bis(4′-hydroxyphenyl)-1-phenylethane [bisphenol P], 1,1-bis(3′-methyl-4′-hydroxyphenyl)-1-phenylethane, 1,1- Bis(3'-t-butyl-4'-hydroxyphenyl)-1-phenylethane, 1,1-bis(3'-phenyl-4'-hydroxyphenyl)-1-phenylethane, 1,1-bis( 4'-hydroxyphenyl)-1-(4'-nitrophenyl)ethane, 1,1-bis(3' -Bromo-4'-hydroxyphenyl)-1-phenylethane, 1,1-bis(4'-hydroxyphenyl)-1-phenylpropane, bis(4-hydroxyphenyl)diphenylmethane, bis(4-hydroxyphenyl)di Bis(hydroxyphenyl)phenylalkanes such as benzylmethane; Bis(hydroxyphenyl)ethers such as bis(4-hydroxyphenyl)ether and bis(3-methyl-4-hydroxyphenyl)ether; Bis(4-hydroxyphenyl) ) Ketone, bis(hydroxyphenyl)ketone such as bis(3-methyl-4-hydroxyphenyl)ketone; bis(bis(4-hydroxyphenyl)sulfide, bis(3-methyl-4-hydroxyphenyl)sulfide and the like Hydroxyphenyl) sulfides; bis(hydroxyphenyl) sulfoxides such as bis(4-hydroxyphenyl) sulfoxide and bis(3-methyl-4-hydroxyphenyl) sulfoxide; bis(4-hydroxyphenyl) sulfone [bisphenol S], Bis(hydroxyphenyl)sulfones such as bis(3-methyl-4-hydroxyphenyl)sulfone; 9,9-bis(4'-hydroxyphenyl)fluorene, 9,9-bis(3'-methyl-4'- Bis(hydroxyphenyl)fluorenes such as hydroxyphenyl)fluorene; and the like.

Examples of aromatic dicarboxylic acids or chlorides thereof include phthalic acid, isophthalic acid, terephthalic acid, 4,4′-biphenyldicarboxylic acid, diphenoxyethanedicarboxylic acid, diphenylether 4,4′-dicarboxylic acid, 4,4′- Examples thereof include diphenyl sulfone dicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and chlorides thereof. The polyarylate-based resin used may be a modified polyarylate-based resin. Among these, the polyarylate resin is preferably a resin made of a polymer compound obtained by the reaction of 2,2-bis(4'-hydroxyphenyl)propane and isophthalic acid.

The polymer component (A) may be used singly or in combination of two or more, but one using a single kind of polyimide resin, one using a plurality of different kinds of polyimide resins, and polyimide It is preferable to add at least one of a polyamide resin and a polyarylate resin to the resin from the viewpoint of adjusting the elongation property and the solvent resistance.

As the polyamide resin, those soluble in an organic solvent are preferable, and rubber-modified polyamide resin is preferable. As the rubber-modified polyamide resin, for example, those described in JP-A-2004-035638 can be used.

When a polyamide resin or a polyarylate resin is added to the polyimide resin, the amount of the resin added is preferably 100 relative to 100 parts by weight of the polyimide resin from the viewpoint of imparting appropriate flexibility while maintaining a high Tg. The amount is not more than 70 parts by mass, more preferably not more than 70 parts by mass, further preferably not more than 50 parts by mass, still more preferably not more than 30 parts by mass, and preferably not less than 1 part by mass, more preferably not less than 3 parts by mass.

[Curable component (B)]
The curable component (B) is a component that can participate in the polymerization reaction, or the polymerization reaction and the crosslinking reaction, and has, for example, a polymerizable unsaturated bond, and is involved in the polymerization reaction or the polymerization reaction and the crosslinking reaction. It is the monomer to be obtained. In the present specification, "curing" means a broad concept including this "polymerization reaction of monomers" or "polymerization reaction of monomers and subsequent crosslinking reaction of polymer". By using the curable component (B), a gas barrier laminate having excellent solvent resistance can be obtained.

The curable component (B) has a molecular weight of usually 3,000 or less, preferably 200 to 2,000, more preferably 200 to 1,000.
The number of polymerizable unsaturated bonds in the curable component (B) is not particularly limited. The curable component (B) may be a monofunctional monomer having one polymerizable unsaturated bond or a polyfunctional monomer having a plurality of difunctional or trifunctional monomers. Good.

Examples of the monofunctional monomers include monofunctional (meth)acrylic acid derivatives.
The monofunctional (meth)acrylic acid derivative is not particularly limited, and known compounds can be used. Examples thereof include monofunctional (meth)acrylic acid derivatives having a nitrogen atom, monofunctional (meth)acrylic acid derivatives having an alicyclic structure, and monofunctional (meth)acrylic acid derivatives having a polyether structure. ..

The monofunctional (meth)acrylic acid derivative having a nitrogen atom includes compounds represented by the following formula.

In the formula, ^{R 1} represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, ^{R 2} and ^{R 3} each independently represent an organic group having a hydrogen atom or a C 1 -C 12, ^{R 2} and R ³ may combine with each other to form a ring structure, and R ⁴ represents a divalent organic group.
Examples of the alkyl group having 1 to 6 carbon atoms represented by R ¹ include a methyl group, an ethyl group and a propyl group, and a methyl group is preferable.
Examples of the organic group having 1 to 12 carbon atoms represented by R ² and R ³ include an alkyl group having 1 to 12 carbon atoms such as methyl group, ethyl group and propyl group; cyclopentyl group, cyclohexyl group and the like, And cycloalkyl groups having 3 to 12 carbon atoms; aromatic groups having 6 to 12 carbon atoms such as phenyl group, biphenyl group and naphthyl group. These groups may have a substituent at any position. Further, R ² and R ³ may combine to form a ring, and the ring may further have a nitrogen atom or an oxygen atom in the skeleton.
Examples of the divalent organic group represented by R ⁴ include groups represented by —(CH ₂ ) _m — and —NH—(CH ₂ ) _m —. Here, m is an integer of 1 to 10.

Among these, (meth)acryloylmorpholine represented by the following formula is preferable as the monofunctional (meth)acrylic acid derivative having a nitrogen atom.

By using a monofunctional (meth)acrylic acid derivative having a nitrogen atom as the curable component (B), it is possible to form a base layer having more excellent heat resistance.

The monofunctional (meth)acrylic acid derivative having an alicyclic structure includes compounds represented by the following formula.

In the formula, R ¹ has the same meaning as described above, and R ⁵ is a group having an alicyclic structure.
Examples of the group having an alicyclic structure represented by R ⁵ include a cyclohexyl group, an isobornyl group, a 1-adamantyl group, a 2-adamantyl group and a tricyclodecanyl group.

Specific examples of the monofunctional (meth)acrylic acid derivative having an alicyclic structure include isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, 1-adamantyl (meth)acrylate, and 2-adamantyl (meth)acrylate. Can be mentioned.

By using a monofunctional (meth)acrylic acid derivative having an alicyclic structure as the curable component (B), it is possible to form an underlayer having more excellent optical properties.

Examples of monofunctional (meth)acrylic acid derivatives having a polyether structure include compounds represented by the following formula.

In the formula, R ¹ has the same meaning as described above, and R ⁶ represents an organic group having 1 to 12 carbon atoms. Examples of the organic group having 1 to 12 carbon atoms represented by R ⁶ include alkyl groups having 1 to 12 carbon atoms such as methyl group, ethyl group and propyl group; and 3 to 12 carbon atoms such as cyclohexyl group. Examples thereof include a cycloalkyl group; an aromatic group having 6 to 12 carbon atoms such as a phenyl group, a biphenyl group and a naphthyl group; j represents an integer of 2 to 20.

Specific examples of the monofunctional (meth)acrylic acid derivative having a polyether structure include ethoxylated o-phenylphenol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, and phenoxypolyethylene glycol (meth)acrylate. ..

By using a monofunctional (meth)acrylic acid derivative having a polyether structure as the curable component (B), an underlayer having excellent toughness can be formed.

Examples of the polyfunctional monomers include polyfunctional (meth)acrylic acid derivatives.
The polyfunctional (meth)acrylic acid derivative is not particularly limited, and known compounds can be used. For example, a bifunctional to hexafunctional (meth)acrylic acid derivative may be mentioned.
Examples of the bifunctional (meth)acrylic acid derivative include compounds represented by the following formula.

In the formula, R ¹ has the same meaning as described above, and R ⁷ represents a divalent organic group. Examples of the divalent organic group represented by R ⁷ include groups represented by the following formula.

(In the formula, s represents an integer of 1 to 20, t represents an integer of 1 to 30, u and v each independently represent an integer of 1 to 30, and “−” at both ends represents Represents a bond.)

Specific examples of the bifunctional (meth)acrylic acid derivative represented by the above formula include tricyclodecane dimethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propoxylated ethoxylated bisphenol A di(meth)acrylate. , Ethoxylated bisphenol A di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy) Phenyl]fluorene and the like. Among these, from the viewpoint of heat resistance and toughness, those in which the divalent organic group represented by R ⁷ in the above formula has a tricyclodecane skeleton, such as tricyclodecane dimethanol di(meth)acrylate, and propoxy. Ethoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, etc., in which the divalent organic group represented by R ⁷ in the above formula has a bisphenol skeleton, 9,9-bis In the above formula, a divalent organic group represented by R ⁷ has a 9,9-bisphenylfluorene skeleton, such as [4-(2-acryloyloxyethoxy)phenyl]fluorene.

In addition, as other bifunctional (meth)acrylic acid derivatives, neopentyl glycol adipate di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, caprolactone-modified dicyclopentenyl di(meth)acrylate, Examples thereof include ethylene oxide-modified di(meth)acrylate phosphate, di(acryloxyethyl)isocyanurate, and allylated cyclohexyl di(meth)acrylate.

Trifunctional (meth)acrylic acid derivatives include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, propionic acid-modified dipentaerythritol tri(meth)acrylate, and propylene oxide-modified trimethylolpropane tri(meth)acrylate. ) Acrylate, tris(acryloxyethyl) isocyanurate and the like.
Examples of the tetrafunctional (meth)acrylic acid derivative include pentaerythritol tetra(meth)acrylate.
Examples of the pentafunctional (meth)acrylic acid derivative include propionic acid-modified dipentaerythritol penta(meth)acrylate.
Examples of the hexafunctional (meth)acrylic acid derivative include dipentaerythritol hexa(meth)acrylate and caprolactone-modified dipentaerythritol hexa(meth)acrylate.

The curable component (B) can be used alone or in combination of two or more.
Among these, the curable component (B) is preferably a polyfunctional monomer because it provides an underlayer having excellent heat resistance and solvent resistance. As the polyfunctional monomer, a bifunctional (meth)acrylic acid derivative is preferable from the viewpoint that it is easily mixed with the polymer component (A), curling of the polymer hardly occurs and curling of the cured product can be suppressed. .. When the curable component (B) contains a polyfunctional monomer, its content is preferably 40% by mass or more, more preferably 50 to 100% by mass, based on the total amount of the curable component (B). More preferably, it is 100% by mass.

The curable component (B) preferably contains a cyclopolymerizable monomer. The cyclopolymerizable monomer is a monomer having a property of radical polymerization while undergoing cyclization.
Cyclic polymerizable monomers grow into linear macromolecules by forming a ring structure in the molecule by polymerization, but the solvent resistance of the underlying layer is higher than that of general monofunctional curable monomers. The heat resistance can be improved. One of the reasons for this is that, in the case of a polymer of a cyclopolymerizable monomer, a ring structure is formed in the polymer chain, which makes the molecule stiffer than a general linear polymer, which results in an underlayer. It is thought that the heat resistance of is improved. In addition, in the cyclizable polymerizable monomer, the molecular design is designed so that the intramolecular cyclization reaction occurs selectively, but some monomers undergo intermolecular reaction, and the structural units derived from that monomer do not react. Functional groups remain. When this reactive functional group reacts with another monomer, branching of the polymer chain occurs, and a crosslinked structure is formed in the polymer of the cyclopolymerizable monomer. This is considered to further improve the heat resistance of the underlayer and also improve the solvent resistance. On the other hand, most of the polymers of cyclopolymerizable monomers have a linear structure, and the ring structure obtained by cyclopolymerization is more flexible than an aromatic ring, so that the flexibility of the underlayer is low. Can be satisfied, and the underlayer exhibits a high elongation at break (that is, it becomes easy to meet the above requirement [2]).

Specific examples of the cyclopolymerizable monomer include non-conjugated dienes, and for example, an α-allyloxymethylacrylic acid-based monomer represented by the following formula (1) can be used.

(In the formula (1), R ⁸ represents a hydrogen atom or a monovalent organic group. The organic group is composed of a hydrocarbon and may have an ether group. The hydrogen atom of the hydrocarbon is halogen. Optionally substituted with atoms.)

The organic group may have a straight chain structure, a branched chain structure, or a cyclic structure. The hydrocarbon group contained in the organic group is not particularly limited. For example, the hydrocarbon group is a chain saturated hydrocarbon group having 1 or more carbon atoms, a chain unsaturated hydrocarbon group having 3 or more carbon atoms, an alicyclic hydrocarbon group having 3 or more carbon atoms, and a carbon number 6 These are aromatic hydrocarbon groups and the like. Among these, the hydrocarbon group is a chain saturated hydrocarbon group having 1 to 30 carbon atoms, a chain unsaturated hydrocarbon group having 3 to 30 carbon atoms, an alicyclic hydrocarbon group having 4 to 30 carbon atoms and carbon. It is preferably an aromatic hydrocarbon group having a number of 6 to 30. The substituent is not particularly limited. For example, the substituent is a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, a cyano group or a trimethylsilyl group.

The chain saturated hydrocarbon group is not particularly limited. As an example, the chain saturated hydrocarbon group includes methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, n-amyl group, sec-amyl group. Group, tert-amyl group, neopentyl group, n-hexyl group, sec-hexyl group, n-heptyl group, n-octyl group, sec-octyl group, tert-octyl group, 2-ethylhexyl group, capryl group, nonyl group , Decyl group, undecyl group, lauryl group, tridecyl group, myristyl group, pentadecyl group, cetyl group, heptadecyl group, stearyl group, nonadecyl group, eicosyl group, ceryl group, melissyl group and the like.

The chain unsaturated hydrocarbon group is not particularly limited. As an example, the chain unsaturated hydrocarbon group includes a crotyl group, a 1,1-dimethyl-2-propenyl group, a 2-methyl-butenyl group, a 3-methyl-2-butenyl group and a 3-methyl-3-group. Examples thereof include butenyl group, 2-methyl-3-butenyl group, oleyl group, linole group and linolene group.

The alicyclic hydrocarbon group is not particularly limited. As an example, the alicyclic hydrocarbon group includes a cyclopentyl group, a cyclopentylmethyl group, a cyclohexyl group, a cyclohexylmethyl group, a 4-methylcyclohexyl group, a 4-tert-butylcyclohexyl group, a tricyclodecanyl group, an isobornyl group, Examples thereof include an adamantyl group, a dicyclopentanyl group, and a dicyclopentenyl group.

The aromatic hydrocarbon group is not particularly limited. As an example, the aromatic hydrocarbon group is a phenyl group, a methylphenyl group, a dimethylphenyl group, a trimethylphenyl group, a 4-tert-butylphenyl group, a benzyl group, a diphenylmethyl group, a diphenylethyl group, a triphenylmethyl group. , Cinnamyl group, naphthyl group, anthranyl group and the like.

The hydrocarbon group having an ether bond is not particularly limited. As an example, the hydrocarbon group having an ether bond is a chain ether group such as a methoxyethyl group, a methoxyethoxyethyl group, a methoxyethoxyethoxyethyl group, a 3-methoxybutyl group, an ethoxyethyl group, an ethoxyethoxyethyl group. A group having both an alicyclic hydrocarbon group such as a cyclopentoxyethyl group, a cyclohexyloxyethyl group, a cyclopentoxyethoxyethyl group, a cyclohexyloxyethoxyethyl group, and a dicyclopentenyloxyethyl group and a chain ether group; phenoxyethyl Group, group having both aromatic hydrocarbon group such as phenoxyethoxyethyl group and chain ether group; glycidyl group, β-methylglycidyl group, β-ethylglycidyl group, 3,4-epoxycyclohexylmethyl group, 2-oxetanemethyl Group, 3-methyl-3-oxetanemethyl group, 3-ethyl-3-oxetanemethyl group, tetrahydrofuranyl group, tetrahydrofurfuryl group, tetrahydropyranyl group, dioxazolanyl group, dioxanyl group, and other cyclic ether groups.

In the present embodiment, R ⁸ in formula (1) is preferably a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, and more preferably a methyl group.

Of these, an alkyl ester of 2-allyloxymethylacrylic acid having 1 to 4 carbon atoms and cyclohexyl 2-(allyloxymethyl)acrylic acid are preferable, and an alkyl ester of 2-allyloxymethylacrylic acid having 1 to 4 carbon atoms is more preferable. Methyl 2-(allyloxymethyl)acrylate is more preferable.

Other specific cyclopolymerizable monomers include, for example, monomers represented by the following formula (2).

(In the formula (2), X represents an oxygen atom or a methylene group, a represents 0 or 1, b represents 1 or 2, and c represents an integer of 1 or 2. R ⁹ represents an alkyl group having 6 or less carbon atoms. Represents.)

Examples of the cyclopolymerizable monomer represented by the formula (2) include dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate and diethyl-2,2'-[oxybis(methylene)]. Bis-2-propenoate, di(n-propyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(i-propyl)-2,2'-[oxybis(methylene)]bis- 2-propenoate, di(n-butyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-hexyl)-2,2'-[oxybis(methylene)]bis-2- Examples thereof include propenoate and dicyclohexyl-2,2′-[oxybis(methylene)]bis-2-propenoate.

The curable component (B) more preferably contains the polyfunctional (meth)acrylate compound described above and a cyclopolymerizable monomer. By using these in combination, while controlling the elongation at break of the underlayer within the above range, the heat shrinkage of the underlayer is suppressed, and as a result, it is easy to adjust the heat shrinkage rate of the gas barrier laminate within the above range. Becomes
In the curable component (B), the mass ratio of the cyclopolymerizable monomer and the polyfunctional (meth)acrylate compound is preferably 95:5 to 30:70, more preferably 90:10 to 35:65, further preferably Is 90:10 to 40:60. Since the mass ratio of the cyclopolymerizable monomer and the polyfunctional (meth)acrylate compound is in the above range, the heat shrinkage rate of the gas barrier laminate is described above while adjusting the breaking elongation of the underlayer to the above range. It becomes easier to adjust the range.

[Curable resin composition]
The curable resin composition used for forming the underlayer according to the embodiment of the present invention comprises a polymer component (A), a curable component (B), and, if desired, a polymerization initiator and other components described below. It can be prepared by mixing and dissolving or dispersing in a suitable solvent.

The total content of the polymer component (A) and the curable monomer (B) in the curable resin composition is preferably 40 to 99 based on the total mass of the curable resin composition excluding the solvent. The amount is 0.5% by mass, more preferably 60 to 99% by mass, and further preferably 80 to 98% by mass.

The content of the polymer component (A) and the curable component (B) in the curable resin composition is the mass ratio of the polymer component (A) and the curable component (B), and preferably the polymer Component (A): Curable component (B)=30:70 to 90:10, and more preferably 35:65 to 80:20.
In the curable resin composition, when the mass ratio of the polymer component (A): the curable monomer (B) is within such a range, the flexibility of the obtained underlayer is more easily improved, and the underlayer Solvent resistance tends to be maintained.

Further, when the content of the curable component (B) in the curable resin composition is in the above range, for example, when the underlayer is obtained by a solution casting method or the like, the solvent can be efficiently removed, and thus the drying is performed. The problem of deformation such as curling and waviness due to the lengthening of the process is solved.

If desired, the curable resin composition may contain a polymerization initiator. The polymerization initiator can be used without particular limitation as long as it initiates the curing reaction, and examples thereof include a thermal polymerization initiator and a photopolymerization initiator.

Examples of the thermal polymerization initiator include organic peroxides and azo compounds.
Organic peroxides include dialkyl peroxides such as di-t-butyl peroxide, t-butyl cumyl peroxide and dicumyl peroxide; diacyl peroxides such as acetyl peroxide, lauroyl peroxide and benzoyl peroxide. Ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide and methyl cyclohexanone peroxide; peroxyketals such as 1,1-bis(t-butylperoxy)cyclohexane T-butyl hydroperoxide, cumene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 2,5-dimethylhexane-2, Hydroperoxides such as 5-dihydroperoxide; peroxys such as t-butylperoxyacetate, t-butylperoxy-2-ethylhexanoate, t-butylperoxybenzoate, t-butylperoxyisopropyl carbonate Esters; and the like.
Examples of the azo compound include 2,2′-azobis(4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis(2-cyclopropylpropionitrile), 2,2′-azobis(2 ,4-Dimethylvaleronitrile), azobisisobutyronitrile, 2,2′-azobis(2-methylbutyronitrile), 1,1′-azobis(cyclohexane-1-carbonitrile), 2-(carbamoylazo) ) Isobutyronitrile, 2-phenylazo-4-methoxy-2,4-dimethylvaleronitrile and the like can be mentioned.

Examples of the photopolymerization initiator include 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one. , 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-[4-[4-(2-hydroxy-2 -Methyl-propionyl)-benzyl]phenyl]-2-methyl-propan-1-one, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethyl Amino-1-(4-morpholinophenyl)-butanone-1,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone Alkylphenone-based photopolymerization initiators such as; 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, ethyl (2,4,6-trimethylbenzoyl) -Phosphorus photopolymerization initiators such as phenylphosphinate, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide; bis(η ⁵ -2,4-cyclopentadien-1-yl) )-Bis[2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl]titanium and other titanocene-based photopolymerization initiators; 1,2-octanedione-1-[4-(phenylthio)- 2-(O-benzoyl oxime)], ethanone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime), etc. Photopolymerization initiator; benzophenone, p-chlorobenzophenone, benzoylbenzoic acid, methyl o-benzoylbenzoate, 4-methylbenzophenone, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4'-methyl-diphenyl Benzophenones such as sulfide, 3,3'-dimethyl-4-methoxybenzophenone, 2,4,6-trimethylbenzophenone, 4-(13-acryloyl-1,4,7,10,13-pentaoxatridecyl)-benzophenone -Based photopolymerization initiators: thioxanthone, 2-chlorothioxanthone, 3-methylthioxanthone, 2,4-dime Thioxanthone-based photopolymerization initiators such as tylthioxanthone, 2,4-diisopropylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, and 4-isopropylthioxanthone; Are listed.

Among the above photopolymerization initiators, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, ethyl(2,4,6-trimethylbenzoyl)- Phosphorus photopolymerization initiators such as phenylphosphinate and bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide are preferable.
When the polymer component (A) is a thermoplastic resin having an aromatic ring, the polymer component (A) absorbs ultraviolet rays, and as a result, a curing reaction may be difficult to occur. However, by using the above-mentioned phosphorus-based photopolymerization initiator, the curing reaction can be efficiently progressed by utilizing the light of the wavelength which is not absorbed by the polymer component (A).
The polymerization initiators may be used alone or in combination of two or more.

The content of the polymerization initiator is preferably 0.05 to 15% by mass, more preferably 0.05 to 10% by mass, and further preferably 0.05 to 5% by mass, based on the entire curable resin composition.

In addition to the polymer component (A), the curable component (B), and the polymerization initiator, the curable resin composition also includes a photopolymerization initiation aid such as triisopropanolamine or 4,4′-diethylaminobenzophenone. You may contain the agent.

The solvent used for preparing the curable resin composition is not particularly limited, and examples thereof include aliphatic hydrocarbon solvents such as n-hexane and n-heptane; aromatic hydrocarbon solvents such as toluene and xylene; dichloromethane. , Halogenated hydrocarbon solvents such as ethylene chloride, chloroform, carbon tetrachloride, 1,2-dichloroethane, monochlorobenzene; alcohol solvents such as methanol, ethanol, propanol, butanol, propylene glycol monomethyl ether; acetone, methyl ethyl ketone, 2 -Pentanone, isophorone, cyclohexanone and other ketone solvents; ethyl acetate, butyl acetate and other ester solvents; ethyl cellosolve and other cellosolve solvents; 1,3-dioxolane and other ether solvents;

The content of the solvent in the curable resin composition is not particularly limited, but is usually 0.1 to 1,000 g, preferably 1 to 100 g per 1 g of the polymer component (A). By appropriately adjusting the amount of the solvent, the viscosity of the curable resin composition can be adjusted to an appropriate value.

Further, the curable resin composition may further contain known additives such as a plasticizer, an antioxidant and an ultraviolet absorber within a range that does not impair the objects and effects of the present invention.

The method for curing the curable resin composition can be appropriately determined according to the type of polymerization initiator or curable monomer used. Details will be described in the section of the method for producing a gas barrier laminate of the present invention described later.

[Properties of underlayer, etc.]
The gas barrier laminate according to the embodiment of the present invention preferably satisfies the following requirement [2′].
[2′] The breaking elongation of the underlayer is 2.5% or more.

When the requirement [2′] is satisfied and the underlayer is suitable for the above requirement [1], deformation of the underlayer due to heating is suppressed, and as a result, the gas barrier property of the gas barrier laminate is improved. Therefore, the flexibility of the gas barrier laminate can be enhanced. The upper limit of the breaking elongation of the underlayer is not particularly limited, but is usually 20% or less, preferably 15% or less.
Here, when the cyclopolymerizable monomer is used, the breaking elongation can be improved while maintaining the elastic modulus at a high temperature relatively high, and the requirement [2′] is easily satisfied. On the other hand, if all the curable components (B) are cyclopolymerizable monomers, the gas barrier properties of the gas barrier laminate will tend to deteriorate. As a result of various studies by the present inventors, it was found that the reduction of the gas barrier property was suppressed by suppressing the absolute value of the heat shrinkage ratio within a certain range. This is because the underlayer is affected by heat, and for example, when the underlayer is deformed in the plane direction by heating when forming the gas barrier layer by coating, the heat shrinkage ratio should be within a predetermined range. It seems that the above phenomenon can be suppressed by selecting materials, etc.

In order to satisfy the requirement [2′], for example, a polyimide resin is used as the polymer component (A), a flexible skeleton is introduced by further adding a polyamide resin, or the polymer component (A) is added. It is effective to increase the molecular weight of ##STR3## or to use a cyclopolymerizable monomer as the curable component (B) to reduce the proportion of aromatic rings present and improve the elongation characteristics of the underlayer.
In addition, for example, by using a polyfunctional (meth)acrylate compound and a cyclopolymerizable monomer in combination, it is possible to increase the network structure, or as the polymerizable component (A), use a rigid resin represented by a polyimide resin. Therefore, by selecting one having a high glass transition temperature, it is possible to form an underlayer suitable for the above requirement [1].

The thickness of the underlayer is not particularly limited and may be determined according to the purpose of the gas barrier laminate. The thickness of the underlayer is usually 0.1 to 300 μm, preferably 0.1 to 100 μm, more preferably 0.1 to 50 μm, still more preferably 0.1 to 10 μm, still more preferably 0.2 to It is 10 μm.

When the underlayer has a thickness of, for example, about 0.1 to 10 μm, it is possible to prevent the thickness of the gas barrier laminate from increasing, and it is possible to obtain a thin gas barrier laminate. A thin gas-barrier laminate is preferable because it is not a factor for increasing the thickness of the entire applied device in an application such as an organic EL display where thinning is required. Further, if the gas barrier laminate is thin, the flexibility and bending resistance of the gas barrier laminate after mounting can be improved.

The base layer has excellent solvent resistance. Since the solvent resistance is excellent, for example, even when an organic solvent is used when forming another layer on the surface of the underlayer, the surface of the underlayer is hardly dissolved. Therefore, for example, even when the gas barrier layer is formed on the surface of the underlayer using a resin solution containing an organic solvent, the components of the underlayer are less likely to mix into the gas barrier layer, and therefore the gas barrier property is less likely to deteriorate.

From this viewpoint, the gel fraction of the underlayer is preferably 90% or more, more preferably 94% or more. Since the underlayer having a gel fraction of 90% or more has excellent solvent resistance, even when an organic solvent is used for forming another layer on the underlayer surface by coating, the underlayer surface is It is possible to easily obtain a gas barrier layered product which is hardly dissolved and has excellent solvent resistance.

Here, the gel fraction means that the underlayer cut into 100 mm×100 mm is wrapped with a nylon mesh (#120) of 150 mm×150 mm whose mass is measured in advance, dipped in toluene (100 mL) for 3 days, and taken out. After being dried at 120° C. for 1 hour and then left at 23° C. and 50% relative humidity for 3 hours to adjust the humidity, the mass is measured and obtained by the following formula.

Gel fraction (%) = [(mass of residual resin after immersion)/(mass of resin before immersion)] x 100

The base layer has excellent interlayer adhesion with the gas barrier layer. That is, the gas barrier layer can be formed without providing the anchor coat layer on the underlayer.

The base layer is preferably colorless and transparent. Since the underlayer is colorless and transparent, the gas barrier laminate according to the embodiment of the present invention can be preferably used for optical applications.

The underlayer has a low birefringence and is excellent in optical isotropy. The in-plane retardation of the underlayer is usually 20 nm or less, preferably 15 nm or less. The retardation in the thickness direction is usually -500 nm or less, preferably -450 nm or less. The value (birefringence) obtained by dividing the in-plane retardation by the thickness of the underlayer is usually 100×10 ⁻⁵ or less, preferably 20×10 ⁻⁵ or less.
If the in-plane retardation of the underlayer, the retardation in the thickness direction, and the birefringence are within the above ranges, a gas barrier laminate having a low birefringence and excellent optical isotropy can be obtained. The gas barrier laminate according to the embodiment can be preferably used for optical applications.

The absolute value of the heat shrinkage rate of the underlayer is 0.5% or less, preferably 0.3% or less, and more preferably 0.2% or less.

The breaking elongation of the underlayer is preferably 2.5% or more, more preferably 2.6% or more, still more preferably 2.7% or more, and particularly preferably 3.0% or more. When the breaking elongation of the underlayer is 2.5% or more, it becomes easy to adjust the breaking elongation of the gas barrier laminate to about 2% or more, and as a result, the gas barrier property is excellent in bending resistance and flexibility. A laminated body is easily obtained.

The tensile elastic modulus at 130° C. of the underlayer is preferably 1.0×10 ³ MPa or more, 1.3×10 ³ MPa or more, more preferably 1.5×10 ³ MPa% or more, further preferably 2.0. It is ×10 ³ MPa or more. When the tensile elastic modulus at 130° C. of the underlayer is 1.3×10 ³ MPa or more, the heat resistance of the underlayer can be increased, and the water vapor permeability of the gas barrier layered product is low. In addition, it is easy to set it to 1×10 ⁻² (g·m ⁻² ·day ⁻¹ ) or less.

As described above, the underlayer has excellent heat resistance, solvent resistance, interlayer adhesion, and transparency, and also has a low birefringence rate and excellent optical isotropy. Therefore, as will be described later, by forming a gas barrier layer on the underlayer having such characteristics by, for example, a solution casting method, the gas barrier layer exhibits excellent gas barrier properties, and moreover, the gas barrier layer has excellent properties. It is also possible to prevent the gas barrier property from being impaired by at least one of heat and solvent due to at least one of heat resistance and solvent resistance. In addition, the obtained gas barrier laminate has excellent heat resistance, interlayer adhesion, and transparency. Furthermore, a gas barrier laminate having a low birefringence rate and excellent optical isotropy can be obtained.

1-2. Gas Barrier Layer The material and the like of the gas barrier layer of the gas barrier laminate according to the embodiment of the present invention are not particularly limited as long as they have gas barrier properties. Examples thereof include a gas barrier layer made of an inorganic film, a gas barrier layer containing a gas barrier resin, and a gas barrier layer obtained by subjecting a layer containing a polymer compound to a modification treatment.
Among these, the gas barrier layer is a gas barrier layer obtained by subjecting a gas barrier layer made of an inorganic film and a layer containing a polymer compound to a modification treatment because a thin layer having excellent gas barrier properties and solvent resistance can be efficiently formed. Layers are preferred.

The inorganic film is not particularly limited, and examples thereof include an inorganic vapor deposition film.
Examples of the inorganic vapor deposition film include vapor deposition films of inorganic compounds and metals.
Inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide, tin oxide, and the like; inorganic nitrides such as silicon nitride, aluminum nitride, and titanium nitride; inorganic carbides; Inorganic sulfides; inorganic oxynitrides such as silicon oxynitride; inorganic oxycarbides; inorganic nitriding carbides; inorganic oxynitriding carbides and the like.
Examples of the raw material for the metal vapor deposition film include aluminum, magnesium, zinc, tin, and the like.
These may be used alone or in combination of two or more.
Among these, from the viewpoint of gas barrier properties, inorganic oxides, inorganic nitrides or inorganic vapor-deposited films using a metal as a raw material are preferable, and from the viewpoint of transparency, inorganic oxides or inorganic nitrides using a raw material as an inorganic material. Evaporated films are preferred. The inorganic vapor deposition film may be a single layer or a multilayer.

The thickness of the inorganic vapor deposition film is preferably 10 to 2,000 nm, more preferably 20 to 1,000 nm, more preferably 30 to 500 nm, further preferably 40 to 200 nm, from the viewpoint of gas barrier properties and handleability. is there.

Examples of methods for forming an inorganic vapor deposition film include PVD (physical vapor deposition) methods such as vacuum vapor deposition, sputtering, and ion plating, thermal CVD (chemical vapor deposition), plasma CVD, and photo-CVD. A CVD method can be used.

Examples of the gas barrier resin used in the gas barrier layer containing the gas barrier resin include polyvinyl alcohol, partially saponified products thereof, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl chloride, polyvinylidene chloride, polychlorotrifluoroethylene and the like. Resins that are difficult to permeate oxygen and the like are mentioned.

From the viewpoint of gas barrier properties, the thickness of the gas barrier layer containing the gas barrier resin is preferably 10 to 2,000 nm, more preferably 20 to 1,000 nm, more preferably 30 to 500 nm, further preferably 40 to 200 nm. Is.

As a method for forming the gas barrier layer containing the gas barrier resin, there is a method of applying a solution containing the gas barrier resin onto the underlayer and appropriately drying the obtained coating film.

In the gas barrier layer obtained by subjecting a layer containing a polymer compound (hereinafter, sometimes referred to as “polymer layer”) to a modification treatment, the polymer compound used is a silicon-containing polymer compound, polyimide, polyamide, polyamide Examples include imides, polyphenylene ethers, polyether ketones, polyether ether ketones, polyolefins, polyesters, polycarbonates, polysulfones, polyether sulfones, polyphenylene sulfides, polyarylates, acrylic resins, cycloolefin polymers, and aromatic polymers. .. These polymer compounds may be used alone or in combination of two or more.

Among these, the polymer compound is preferably a silicon-containing polymer compound. Examples of the silicon-containing polymer compound include polysilazane compounds (Japanese Patent Publication No. 63-16325, Japanese Patent Laid-Open No. 62-195024, Japanese Patent Laid-Open No. 63-81122, Japanese Patent Laid-Open No. 1-138108, Japanese Patent Laid-Open No. 2-138108) No. 84437, No. 2-175726, No. 4-63833, No. 5-238827, No. 5-345826, No. 2005-36089, No. 6-122852. References: JP-A-6-299118, JP-A-6-306329, JP-A-9-31333, JP-A-10-245436, JP-A-2003-514822, and International Publication WO2011/107018. )), polycarbosilane compound (Journal of Materials Science, 2569-2576, Vol. 13, 1978, Organometallics, 1336-1344, Vol. JP-A-51-126300, JP-A-2001-328991, JP-A-2006-117917, JP-A-2009-286891, JP-A-2010-106100, etc.), polysilane compounds (R. D. Miller, J. Michl; Chemical Review, Vol. 89, p. 1359 (1989), N. Matsumoto; Japane Journal of Physics, vol. 37, p. 2009-235358, etc.), polyorganosiloxane compounds (see JP 2010-229445 A, JP 2010-232569 A, JP 2010-238736 A, etc.) and the like.

Among these, polysilazane compounds are preferable from the viewpoint of forming a gas barrier layer having excellent gas barrier properties. Examples of the polysilazane-based compound include inorganic polysilazane and organic polysilazane. Examples of the inorganic polysilazane include perhydropolysilazane and the like, and examples of the organic polysilazane include compounds in which a part or all of hydrogen of perhydropolysilazane is substituted with an organic group such as an alkyl group. Among these, inorganic polysilazane is more preferable from the viewpoint of availability and formation of a gas barrier layer having excellent gas barrier properties.
Further, as the polysilazane compound, a commercially available product such as a glass coating material can be used as it is.
The polysilazane compounds can be used alone or in combination of two or more.

The polymer layer may contain, in addition to the above-mentioned polymer compound, other components as long as the object of the present invention is not impaired. Examples of other components include curing agents, other polymers, antioxidants, light stabilizers, flame retardants and the like.

The content of the polymer compound in the polymer layer is preferably 50% by mass or more, and more preferably 70% by mass or more, from the viewpoint of forming a gas barrier layer having excellent gas barrier properties.

As the method for forming the polymer layer, for example, a layer-forming solution containing at least one kind of polymer compound, optionally other components, and a solvent is formed on the underlayer or optionally on the underlayer by a known method. A method of applying on the formed primer layer and appropriately drying the obtained coating film may be used.

When applying the layer forming solution, a known device such as a spin coater, a knife coater, or a gravure coater can be used.

It is preferable to dry the obtained coating film or to heat the coating film in order to improve the gas barrier properties of the gas barrier laminate. As the heating and drying method, conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be adopted. The heating temperature is usually 80 to 150° C., and the heating time is usually several tens of seconds to several tens of minutes.

When the gas barrier layer of the gas barrier layered product is formed, for example, when the polysilazane compound as described above is used, the conversion reaction of polysilazane occurs by heating after coating, and a coating film having excellent gas barrier properties is obtained.
On the other hand, when an underlayer having low heat resistance is used, there is a possibility that the underlayer may be deformed by heating when forming such a coating film. The deformation of the underlayer may adversely affect the gas barrier properties of the gas barrier layer of the gas barrier laminate. However, since the underlayer according to the embodiment of the present invention has excellent heat resistance, deformation is unlikely to occur even during heating during and after coating. Therefore, it is possible to avoid deterioration of the gas barrier property of the gas barrier laminate due to the deformation of the underlayer.

The thickness of the polymer layer is usually 20 to 1,000 nm, preferably 30 to 800 nm, more preferably 40 to 400 nm.
Even if the thickness of the polymer layer is nano-order, a gas barrier laminate having sufficient gas barrier performance can be obtained by performing a modification treatment as described below.
Further, it is preferable that the polymer layer is obtained by subjecting a coating film of a composition containing a silicon compound to a modification treatment. When the polymer layer is obtained by subjecting a coating film of a composition containing a silicon compound to a modification treatment, the polymer layer can be made more flexible than an inorganic film provided by vapor deposition or sputtering, for example.

As the modification treatment, ion implantation, vacuum ultraviolet light irradiation, etc. may be mentioned. Of these, ion implantation is preferable because high gas barrier performance can be obtained. In the ion implantation, the amount of ions to be implanted into the polymer layer may be appropriately determined according to the purpose of use (necessary gas barrier property, transparency, etc.) of the gas barrier laminate to be formed.

Ions of rare gases such as argon, helium, neon, krypton, and xenon; ions of fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, sulfur, and the like;
Ions of alkane gases such as methane, ethane, propane, butane, pentane, and hexane; ions of alkenes gases such as ethylene, propylene, butene, and pentene; ions of alkadiene gases such as pentadiene and butadiene; acetylene, Ions of alkyne gases such as methylacetylene; ions of aromatic hydrocarbon gases such as benzene, toluene, xylene, indene, naphthalene, phenanthrene; ions of cycloalkane gases such as cyclopropane and cyclohexane; cyclopentene, Ions of cycloalkene-based gases such as cyclohexene;
Ions of conductive metals such as gold, silver, copper, platinum, nickel, palladium, chromium, titanium, molybdenum, niobium, tantalum, tungsten and aluminum;
Silane (SiH ₄ ) or an ion of an organic silicon compound; and the like.

Examples of the organic silicon compound include tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, and tetra t-butoxysilane;
An alkylalkoxysilane having an unsubstituted or substituted group such as dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, (3,3,3-trifluoropropyl)trimethoxysilane;
Arylalkoxysilanes such as diphenyldimethoxysilane and phenyltriethoxysilane;
Hexamethyldisiloxane (HMDSO) and other disiloxanes;
Aminosilanes such as bis(dimethylamino)dimethylsilane, bis(dimethylamino)methylvinylsilane, bis(ethylamino)dimethylsilane, diethylaminotrimethylsilane, dimethylaminodimethylsilane, tetrakisdimethylaminosilane, and tris(dimethylamino)silane;
Silazanes such as hexamethyldisilazane, hexamethylcyclotrisilazane, heptamethyldisilazane, nonamethyltrisilazane, octamethylcyclotetrasilazane, tetramethyldisilazane and the like;
Cyanate silane such as tetraisocyanate silane;
Halogenosilanes such as triethoxyfluorosilane;
Alkenylsilanes such as diallyldimethylsilane and allyltrimethylsilane;
An unsubstituted or substituted alkylsilane such as di-t-butylsilane, 1,3-disilabutane, bis(trimethylsilyl)methane, tetramethylsilane, tris(trimethylsilyl)methane, tris(trimethylsilyl)silane, benzyltrimethylsilane;
Silylalkynes such as bis(trimethylsilyl)acetylene, trimethylsilylacetylene, 1-(trimethylsilyl)-1-propyne;
Silylalkenes such as 1,4-bistrimethylsilyl-1,3-butadiyne and cyclopentadienyltrimethylsilane;
Arylalkylsilanes such as phenyldimethylsilane and phenyltrimethylsilane;
Alkynylalkylsilanes such as propargyltrimethylsilane;
Alkenylalkylsilanes such as vinyltrimethylsilane;
Disilane such as hexamethyldisilane;
Siloxane such as octamethylcyclotetrasiloxane, tetramethylcyclotetrasiloxane, hexamethylcyclotetrasiloxane;
N,O-bis(trimethylsilyl)acetamide;
Bis(trimethylsilyl)carbodiimide;
Etc.
These ions may be used alone or in combination of two or more.

Of these, at least one selected from the group consisting of hydrogen, nitrogen, oxygen, argon, helium, neon, xenon, and krypton, because it can be injected more easily and a gas barrier layer having particularly excellent gas barrier properties can be obtained. Are preferred.

The method of implanting ions is not particularly limited, but examples include a method of irradiating ions (ion beam) accelerated by an electric field and a method of implanting ions in plasma. Among them, the latter method of injecting plasma ions is preferable because a gas barrier film can be easily obtained.

As a plasma ion implantation method, (α) a method of injecting ions existing in plasma generated by using an external electric field into a polymer layer, or (β) applying to the layer without using an external electric field A method of injecting into the polymer layer ions existing in the plasma generated only by the electric field generated by the negative high voltage pulse is preferable.

In the above method (α), it is preferable that the pressure during ion implantation (pressure during plasma ion implantation) be 0.01 to 1 Pa. When the pressure at the time of plasma ion implantation is in such a range, it is possible to simply and efficiently and uniformly implant ions, and it is possible to efficiently form a desired gas barrier layer.

The method (β) does not require a high degree of decompression, the processing operation is simple, and the processing time can be greatly shortened. Further, the entire layer can be uniformly processed, and ions in the plasma can be continuously injected into the polymer layer with high energy when a negative high voltage pulse is applied. Furthermore, without applying any other special means such as radio frequency (high frequency, hereinafter abbreviated as “RF”) or high frequency power source such as microwave, simply by applying a negative high voltage pulse to the layer, Good quality ions can be uniformly injected into the polymer layer.

In any of the above methods (α) and (β), the pulse width when applying a negative high voltage pulse, that is, when implanting ions is preferably 1 to 15 μsec. When the pulse width is in such a range, it is possible to more simply and efficiently implant ions uniformly.

The applied voltage when generating plasma is preferably -1 to -50 kV, more preferably -1 to -30 kV, and particularly preferably -5 to -20 kV. If the applied voltage is lower than −1 kV, the ion implantation amount (dose amount) becomes insufficient and it becomes difficult to obtain desired performance. On the other hand, if ion implantation is performed at a value higher than −50 kV, the film is charged during ion implantation and defects such as coloring of the film are likely to occur, which is not preferable.

As the ion species for plasma ion implantation, the same species as those exemplified as the above-mentioned implanted ions can be mentioned.

A plasma ion implanter is used to implant the ions in the plasma into the polymer layer.
As a plasma ion implantation apparatus, specifically, (i) a high-frequency power is superposed on a feedthrough for applying a negative high voltage pulse to a polymer layer (hereinafter, also referred to as “ion implantation layer”). Device for uniformly encircling a layer to be ion-implanted with plasma to attract, inject, collide, and deposit ions in the plasma (Japanese Patent Laid-Open No. 2001-26887), (ii) An antenna is provided in the chamber, and high-frequency power is supplied. After the plasma reaches the periphery of the layer for ion implantation, the positive and negative pulses are alternately applied to the layer for ion implantation to attract and collide electrons in the plasma with the positive pulse. A device for heating a layer to be ion-implanted and controlling a pulse constant to control the temperature while applying a negative pulse to attract and inject ions in plasma (Japanese Patent Laid-Open No. 2001-156013), (iii). A plasma ion implanter for inducing and injecting ions in the plasma by generating a plasma using an external electric field such as a high frequency power source such as a microwave and applying a high voltage pulse, and (iv) a high voltage without using an external electric field. Examples thereof include a plasma ion implantation device that implants ions in plasma generated only by an electric field generated by applying a voltage pulse.

Among these, it is preferable to use the plasma ion implantation apparatus of (iii) or (iv) because the treatment operation is simple, the treatment time can be greatly shortened, and the continuous use is suitable.
Examples of the method using the plasma ion implantation apparatus of (iii) and (iv) include those described in International Publication WO2010/021326.

In the plasma ion implantation apparatus of (iii) and (iv), the plasma generating means for generating plasma is also used by the high-voltage pulse power source, and therefore other special means such as a high-frequency power source such as RF or microwave is used. It is possible to generate plasma by simply applying a negative high-voltage pulse without continuously, and to continuously implant ions in the plasma into the polymer layer. A gas barrier laminate having a molecular layer, that is, a gas barrier layer can be mass-produced.

The thickness of the portion where the ions are injected can be controlled by the injection conditions such as the type of ions, the applied voltage, and the processing time, and is determined according to the thickness of the polymer layer, the purpose of use of the gas barrier laminate, etc. However, it is usually 5 to 1,000 nm.

The ion implantation can be confirmed by performing elemental analysis measurement at about 10 nm from the surface of the polymer layer using X-ray photoelectron spectroscopy (XPS).

It can be confirmed that the gas barrier layer has a gas barrier property because the water vapor permeability of the gas barrier layer is small.
The water vapor permeability of the gas barrier layer in an atmosphere of 40° C. and 90% relative humidity is usually 1.0 g/m ² /day or less, preferably 0.8 g/m ² /day or less, and more preferably 0 g/m ² /day or less. It is 0.5 g/m ² /day or less, and more preferably 0.1 g/m ² /day or less. The water vapor transmission rate can be measured by a known method.

1-3. Process film The process film has a role of protecting the underlayer, the gas barrier layer, and the other layers described above when the gas barrier laminate is stored or transported, and is peeled off in a predetermined process. ..

When the gas barrier laminate has a process film, the gas barrier laminate may have a process film on one side, or may have a process film on both sides. In the latter case, it is preferable to use two types of process films so that the process film that is peeled first can be more easily peeled. When the process film is provided on the underlayer side, it is possible to obtain a gas barrier laminate having high handling property while protecting the underlayer, as compared with the gas barrier laminate without the process film.

The process film is preferably a sheet or film. The sheet-like or film-like one is not limited to a long one, but includes a short flat one.

Examples of the process film include paper substrates such as glassine paper, coated paper, and high-quality paper; laminated paper obtained by laminating a thermoplastic resin such as polyethylene or polypropylene on these paper substrates; cellulose, starch, polyvinyl on the above paper substrates. Examples thereof include those subjected to sealing treatment with alcohol, acrylic-styrene resin and the like; or polyester films such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and plastic films such as polyolefin films such as polyethylene and polypropylene; glass and the like.

The process film may be a paper base material or a plastic film provided with a release agent layer from the viewpoint of easy handling. The release layer can be formed using a conventionally known release agent such as a silicone release agent, a fluorine release agent, an alkyd release agent, and an olefin release agent.
The thickness of the release agent layer is not particularly limited, but is usually 0.02 to 2.0 μm, and more preferably 0.05 to 1.5 μm.

The thickness of the process film is preferably 1 to 500 μm, more preferably 5 to 300 μm from the viewpoint of easy handling.

The surface roughness Ra (arithmetic mean roughness) of the process film is preferably 10.0 nm or less, and more preferably 8.0 nm or less. Further, the surface roughness Rt (maximum cross-sectional height) is preferably 100 nm or less, more preferably 50 nm or less.
When the surface roughnesses Ra and Rt exceed 10.0 nm and 100 nm, respectively, the surface roughness of the layer in contact with the process film increases, and the gas barrier properties of the gas barrier laminate may deteriorate.
The surface roughness Ra and Rt are values obtained by an optical interference method in a measurement area of 100 μm×100 μm.

1-4. Gas Barrier Laminate As described above, the gas barrier laminate according to the embodiment of the present invention includes a process film, a base layer, and a gas barrier layer in this order. When the gas barrier laminate is actually used, the process film is peeled from the gas barrier laminate and attached to a display or an electronic device for use.

As described above, the gas barrier laminate according to the embodiment of the present invention satisfies the following requirement [1].
[1] The absolute value of the thermal shrinkage of the gas barrier laminate is 0.5% or less.

In order to satisfy the requirement [1], for example, as described above, a polyfunctional (meth)acrylate compound and a cyclized compound are used as the curable component (B) contained in the curable resin composition for forming the underlayer. By using together with a polymerizable monomer, it is possible to increase the network structure, or to select, as the polymerizable component (A), one having a rigid yet flexible structure as represented by a polyimide resin. Good.

Further, as described above, the gas barrier laminate according to the embodiment of the present invention satisfies the following requirement [2].
[2] The breaking elongation of the gas barrier laminate is 1.9% or more.
The breaking elongation of the gas barrier laminate is preferably 2.0% or more. When the elongation at break of the gas barrier laminate is in such a range, the flexibility of the gas barrier laminate can be enhanced. The upper limit of the breaking elongation of the underlayer is not particularly limited, but is usually 17% or less, preferably 13% or less.

Since the thickness of the gas barrier layer is usually significantly smaller than that of the underlayer, the breaking elongation of the gas barrier laminate is greatly affected by the underlayer and tends to be close to the breaking elongation of the underlayer. Therefore, if the underlayer satisfies the above-mentioned requirement [2′], even if the breaking elongation of the gas barrier layered product is slightly smaller than the breaking elongation of the underlayer due to the influence of the gas barrier layer or the like, the requirements may be satisfied. It is easy to obtain a gas barrier laminate satisfying [2].

The thickness of the gas barrier laminate can be appropriately determined depending on the intended use of the electronic device and the like. From the viewpoint of handleability, the substantial thickness of the gas barrier laminate according to the embodiment of the present invention is preferably 0.3 to 50 μm, more preferably 0.5 to 25 μm, and further preferably 0.7 to 12 μm. Is.
In addition, "substantial thickness" means the thickness in a use state. That is, the gas barrier laminate may have a process sheet or the like, but the thickness of the portion (process sheet or the like) removed during use is not included in the “substantial thickness”.

The underlayer according to the embodiment of the present invention can have excellent flexibility, and further, when the thickness of the gas barrier laminate is reduced, the bending resistance after mounting the gas barrier laminate is further improved. You can also

Since the gas barrier laminate according to the embodiment of the present invention has the above-described underlayer and gas barrier layer, it is excellent in heat resistance, solvent resistance, interlayer adhesion and gas barrier properties, and has a low birefringence and isotropic optical properties. Excellent in performance. The in-plane retardation of the gas barrier laminate is usually 20 nm or less, preferably 15 nm or less. The retardation in the thickness direction is usually -500 nm or less, preferably -450 nm or less. The value (birefringence) obtained by dividing the in-plane retardation by the thickness of the gas barrier laminate is usually 100×10 ⁻⁵ or less, preferably 20×10 ⁻⁵ or less.
If the in-plane retardation of the gas barrier laminate, the retardation in the thickness direction, and the birefringence are within the above ranges, the gas barrier laminate according to the embodiment of the present invention is excellent in optical isotropy, It can be preferably used for applications.

The water vapor permeability of the gas barrier laminate according to the embodiment of the present invention at 40° C. and 90% relative humidity is usually 1.0×10 ⁻² g/m ² /day or less, preferably 8. It is 0×10 ⁻³ g/m ² /day or less, and more preferably 6.0×10 ⁻³ g/m ² /day or less.

The gas barrier laminate according to the embodiment of the present invention has an underlayer and a gas barrier layer on at least one surface of the underlayer. The gas barrier laminate according to the embodiment of the present invention may have one underlayer and one gas barrier layer, or two or more underlayers and/or gas barrier layers. Good.

FIG. 1 shows a specific structural example of the gas barrier laminate according to the embodiment of the present invention.
The gas barrier laminate (10) shown in FIG. 1 has a gas barrier layer (3) on one surface of the underlayer (2), and is provided on the surface of the underlayer (2) opposite to the gas barrier layer (3). It has a process film (1). When the process film (1) is peeled and removed, the portion including the underlayer (2) and the gas barrier layer (3) indicated by reference numeral 10a becomes a gas barrier laminate after the process film is removed.

The gas barrier laminate according to the embodiment of the present invention is not limited to that shown in FIG. 1, and may have gas barrier layers on both sides of the underlayer, or a plurality of underlayers and gas barrier layers may be provided as one set. The set may be laminated. Further, one or more layers may be further contained within a range not impairing the object of the present invention.
Examples of the other layer include a conductor layer, a shock absorbing layer, an adhesive layer, a bonding layer, and a process sheet. Further, the arrangement position of other layers is not particularly limited.

The material forming the conductor layer includes metals, alloys, metal oxides, electrically conductive compounds, mixtures thereof, and the like. Specifically, antimony-doped tin oxide (ATO); fluorine-doped tin oxide (FTO); tin oxide, germanium-doped zinc oxide (GZO), zinc oxide, indium oxide, indium tin oxide (ITO). , Semiconductive metal oxides such as indium zinc oxide (IZO); metals such as gold, silver, chromium, nickel; mixtures of these metals with conductive metal oxides; inorganic conductive materials such as copper iodide and copper sulfide. Substances; organic conductive materials such as polyaniline, polythiophene, polypyrrole; and the like.

There is no particular limitation on the method of forming the conductor layer. For example, a vapor deposition method, a sputtering method, an ion plating method, a thermal CVD method, a plasma CVD method and the like can be mentioned.

The thickness of the conductor layer may be appropriately selected according to its application. It is usually 10 nm to 50 μm, preferably 20 nm to 20 μm.

The shock absorbing layer is for protecting the gas barrier layer when a shock is applied to the gas barrier layer. The material for forming the shock absorbing layer is not particularly limited, but examples thereof include acrylic resin, urethane resin, silicone resin, olefin resin, and rubber material.

The method for forming the shock absorbing layer is not particularly limited, and for example, a material for forming the shock absorbing layer, and, if desired, a shock absorbing layer forming solution containing other components such as a solvent may be provided on the layer to be laminated. Examples include a method of applying, drying the obtained coating film, and heating it as necessary to form it.
Alternatively, a shock absorbing layer may be separately formed on the release substrate, and the obtained film may be transferred onto the layer to be laminated and laminated.
The thickness of the shock absorbing layer is usually 1 to 100 μm, preferably 5 to 50 μm.

The adhesive layer is a layer used when the gas barrier laminate is attached to an adherend. The material for forming the adhesive layer is not particularly limited, and a known adhesive or pressure-sensitive adhesive such as acrylic, silicone, or rubber, a heat seal material, or the like can be used.

The bonding layer is a layer that is used when a gas barrier laminate is manufactured by combining a plurality of sets with a base layer and a gas barrier layer as one set. The bonding layer is a layer for bonding a base layer included in one of the adjacent groups and a gas barrier layer included in the other pair to maintain a laminated structure. The bonding layer may be a single layer or a plurality of layers. Examples of the bonding layer include a layer having a single-layer structure formed by using an adhesive and a layer having a layer formed by using an adhesive on both surfaces of a support layer.

The material used in forming the bonding layer is not particularly limited as long as it can bond the pair of the underlayer and the gas barrier layer to each other and can maintain the laminated structure, and a known adhesive can be used. It is preferable to use a pressure-sensitive adhesive from the viewpoint that the combination of the underlayer and the gas barrier layer can be bonded to each other.
Examples of the pressure-sensitive adhesive used for the bonding layer include an acrylic pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, and a rubber pressure-sensitive adhesive. Among these, acrylic adhesives and urethane adhesives are preferable from the viewpoints of adhesive strength, transparency and handleability. Further, a pressure-sensitive adhesive capable of forming a cross-linked structure as described below is preferable.
The pressure-sensitive adhesive may be in any form such as a solvent-type pressure-sensitive adhesive, an emulsion-type pressure-sensitive adhesive, a hot melt-type pressure-sensitive adhesive.

2. Method for producing gas barrier laminate The gas barrier laminate according to the embodiment of the present invention is produced using a process film. By using the process film, the gas barrier laminate can be efficiently and easily manufactured. Particularly, a method having the following steps 1 to 3 is preferable.

Step 1: Step A step of forming a curable resin layer on the film using a curable resin composition containing a polymer component (A) having a Tg of 250° C. or higher and a curable component (B) Step 2: Step of curing the curable resin layer obtained in Step 1 to form an underlayer made of a cured resin layer Step 3: Step of forming a gas barrier layer on the underlayer obtained in Step 2.

FIG. 2 shows an example of a manufacturing process of the gas barrier laminate according to the embodiment of the present invention. 2A corresponds to the step 1, FIG. 2B corresponds to the step 2, and FIG. 2C corresponds to the step 3.

(Process 1)
First, using a curable resin composition containing a polymer component (A) having a Tg of 250° C. or higher and a curable component (B) on a process film, a curable resin layer (reference numeral of FIG. 2A) is used. 2a) is formed.

Examples of the process film and the curable resin composition used include the same ones as described above.
The method for applying the curable resin composition onto the process film is not particularly limited, and includes spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, and gravure coating. A known coating method such as a method can be used.

The method for drying the obtained coating film is not particularly limited, and conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be used. As described above, the curable resin composition used for forming the underlayer according to the embodiment of the present invention contains the polymer component (A) having a very high Tg, but the curable component By containing (B), the solvent can be efficiently removed when the coating film obtained by the solution casting method is dried.

The drying temperature of the coating film is usually 30 to 150°C, preferably 50 to 100°C.
The thickness of the dry coating film (curable resin layer) is not particularly limited, but since it has almost no difference from the thickness after curing, it may be the same as the thickness of the underlayer described above.

(Process 2)
Next, the curable resin layer obtained in step 1 is cured to form a cured resin layer. This cured resin layer becomes a base layer (reference numeral 2 in FIG. 2B).
The method for curing the curable resin layer is not particularly limited, and a known method can be adopted. For example, when the curable resin layer is formed using a curable resin composition containing a thermal polymerization initiator, the curable resin layer can be heated to cure the curable resin layer. .. The heating temperature is usually 30 to 150°C, preferably 50 to 100°C.

When the curable resin layer is formed using a curable resin composition containing a photopolymerization initiator, the curable resin layer is cured by irradiating the curable resin layer with active energy rays. Can be made. The active energy ray can be irradiated using a high pressure mercury lamp, an electrodeless lamp, a xenon lamp or the like.

The wavelength of the active energy ray is preferably 200 to 400 nm, more preferably 350 to 400 nm. The irradiation amount is usually in the range of illuminance of 50 to 1,000 mW/cm ² and light amount of 50 to 5,000 mJ/cm ² , preferably 1,000 to 5,000 mJ/cm ² . The irradiation time is usually 0.1 to 1,000 seconds, preferably 1 to 500 seconds, more preferably 10 to 100 seconds. Irradiation may be performed a plurality of times in order to satisfy the above-described light amount in consideration of the heat load of the light irradiation step.

In this case, in order to prevent deterioration of the polymer component (A) due to irradiation with active energy rays and coloring of the underlayer, the active energy rays are curable through a filter that absorbs light of a wavelength unnecessary for the curing reaction. The resin composition may be irradiated. According to this method, light having a wavelength that is unnecessary for the curing reaction and deteriorates the polymer component (A) is absorbed by the filter, so that the deterioration of the polymer component (A) is suppressed, and the colorless and transparent layer is formed. A stratum can be easily obtained.
A resin film such as a polyethylene terephthalate film can be used as the filter. When a resin film is used, it is preferable to provide a step of laminating a resin film such as a polyethylene terephthalate film on the curable resin layer between step 1 and step 2. The resin film is usually peeled off after step 2.

Also, the curable resin layer can be cured by irradiating the curable resin layer with an electron beam. When irradiated with an electron beam, the curable resin layer can be usually cured without using a photopolymerization initiator. When irradiating with an electron beam, an electron beam accelerator or the like can be used. The irradiation dose is usually in the range of 10 to 1,000 krad. The irradiation time is usually 0.1 to 1,000 seconds, preferably 1 to 500 seconds, more preferably 10 to 100 seconds.

The curing of the curable resin layer may be carried out in an atmosphere of an inert gas such as nitrogen gas, if necessary. By performing the curing in an inert gas atmosphere, it becomes easy to avoid the oxygen, water, etc. from interfering with the curing.

(Process 3)
Then, a gas barrier layer (reference numeral 3 in FIG. 2C) is formed on the underlayer obtained in step 2.
As the method of forming the gas barrier layer, the method described above can be appropriately adopted.
For example, when the gas barrier layer is a layer obtained by subjecting a layer containing a silicon-containing polymer compound to a modification treatment, a step of forming a layer containing a silicon-containing polymer compound on an underlayer, and A gas barrier layer can be formed by a step of subjecting a layer containing a molecular compound to a modification treatment.

The gas barrier layer included in the gas barrier laminate can be formed by various methods such as an extrusion molding method and a coating method, but the gas barrier performance of the gas barrier laminate may decrease depending on the method of forming the gas barrier layer. In particular, when the gas barrier layer is formed by a forming method involving heating, for example, coating/drying, there is a possibility that the underlying layer is physically or chemically affected and the characteristics such as gas barrier properties are deteriorated.
However, as described above, the underlayer according to the embodiment of the present invention is a layer formed of a cured product of a curable resin composition containing the polymer component (A) and the curable component (B), and the polymer Since the Tg of the component (A) is 250° C. or higher, the underlayer is less likely to be affected by the heating when forming the gas barrier layer. Therefore, the formed gas barrier layer is less likely to be affected by the deformation of the underlayer during the manufacturing process, and the gas barrier layer is less likely to have a problem that, for example, microcracks or the like deteriorate the gas barrier property. ..

As the method of forming the layer containing the silicon-containing polymer compound and the method of performing the modification treatment, those described above can be adopted.
In addition, as a method of performing a modification treatment, a long film in which a layer containing a silicon-containing polymer compound is formed on the underlayer obtained in step 2 is conveyed in a certain direction, and the silicon film is formed. It is preferable that the layer containing the contained polymer compound is subjected to a modification treatment to produce a gas barrier laminate.
According to this manufacturing method, for example, a long gas-barrier laminate can be continuously manufactured.

The process film is usually peeled off in a predetermined process depending on the use of the gas barrier laminate, and as shown in FIG. 2C, the gas barrier laminate after removal of the process film (3). (10a). For example, another layer or the like may be formed after step 3 and then the step film may be peeled off, or the step film may be peeled off after step 3. Further, the process film may be peeled off between the process 2 and the process 3.

As described above, in the manufacturing method having the steps 1 to 3, the curable resin layer is formed by using the step film, and the gas barrier laminate obtained by this method has the step film. May or may not be included.
According to the method for producing a gas barrier laminate described above, the gas barrier laminate according to the embodiment of the present invention can be efficiently, continuously, and easily produced.

Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

The physical properties of the underlayer and the gas barrier laminate of each of the examples and comparative examples were measured and evaluated in the following procedure.

<Solvent resistance of base layer>
The underlayer was cut into a 25 mm×25 mm test piece, the test piece was dipped in a xylene solvent for 2 minutes, the change in the test piece before and after the immersion was visually observed, and the solvent resistance was evaluated according to the following criteria.
A: No change.
B: A slight change in outer shape can be seen, but there is no problem in practical use.
C: Whitening and external shape changes such as swelling, curling, and waviness occur, which impedes practical use.

<Heat Shrinkage of Gas Barrier Laminate>
The gas barrier laminate was cut into 5 mm x 30 mm test pieces, and the first polyethylene terephthalate (PET) film on the underlayer side corresponding to the process film was peeled off and removed, and a thermomechanical analyzer TMA4000SE (Netch Japan Co., Ltd.) After setting the distance between chucks to 20 mm, the temperature was raised to 130° C. at 5° C./min and then cooled to room temperature at 5° C./min. The rate of change in displacement in the lengthwise direction before and after heating (value in which the ratio of the amount of displacement to the chuck distance 20 mm was expressed as a percentage) was defined as the heat shrinkage rate. A negative value was given when the gas barrier laminate was contracted, and a positive value was obtained when it was extended.

<Water vapor transmission rate (WVTR) of gas barrier laminate>
The gas barrier laminate was cut into a circular test piece having an area of 50 cm ² , and a water vapor transmission rate measuring device (manufactured by MOCON, device name: AQUATRAN) was used at a gas flow rate of 20 sccm at 40° C. and 90% RH. The water vapor transmission rate (g/m ² /day) was measured. The lower limit of detection of the measuring device is 0.0005 g/m ² /day. Since the gas barrier laminate is inferior in self-supporting property when the PET film used for forming the underlayer is peeled off, the measurement was performed in a state where the PET film was laminated. Since the water vapor transmission rate of the gas barrier layer is much smaller than that of the PET film, the influence of the lamination of the PET film on the WVTR is negligibly small.

<Elongation at Break of Underlayer and Gas Barrier Laminate>
The underlayer was cut into 15 mm×150 mm test pieces, and the breaking elongation was measured according to JIS K7127:1999. Specifically, after setting the distance between chucks to 100 mm by a tensile tester (manufactured by Shimadzu Corporation, Autograph), the above-mentioned test piece was subjected to a tensile test at a speed of 200 mm/min, and the breaking elongation [% ] Was measured. The tensile elongation at break was taken as the tensile elongation at break when the test piece had no yield point, and the tensile elongation at break was taken as the tensile elongation at break with the yield point. In addition, the same test was performed on a gas barrier laminate having a gas barrier layer (without a process film).

[Example 1]
The curable resin composition 1 which will be the base layer was prepared by the following procedure.
<Curable resin composition 1>
As a polymer component, 100 parts by mass of a pellet of polyimide resin (PI) (Kawamura Sangyo Co., Ltd., product name KPI-MX300F, Tg=354° C., weight average molecular weight 280,000) was dissolved in methyl ethyl ketone (MEK) to prepare PI. Was prepared as a 15% by mass solution. Next, 122 parts by mass of tricyclodecane dimethanol diacrylate (A-DCP manufactured by Shin-Nakamura Chemical Co., Ltd.) as a curable monomer, and bis(2,4,6- Curable resin composition 1 was prepared by adding and mixing 5 parts by mass of trimethylbenzoyl)-phenylphosphine oxide (manufactured by BASF, Irgacure 819). The curable monomer and the polymerization initiator used in this example and other experimental examples do not contain a solvent and are all raw materials having a solid content of 100%.
Next, as the process film, the first PET film (PET100A-4100, manufactured by Toyobo Co., Ltd., thickness 100 μm) having an easy-adhesion layer on one surface was used, and on the surface opposite to the easy-adhesion layer surface of this PET film, The curable resin composition was applied, and the coating film was heated at 90° C. for 3 minutes and dried.
Further, a second PET film (Cosmo Shine A4100, manufactured by Toyobo Co., Ltd., thickness 50 μm) having an easy-adhesion layer on one surface was placed on the dried coating film so that the surface opposite to the easy-adhesion surface faced. Using a belt conveyor type ultraviolet irradiation device (manufactured by Eye Graphics Co., Ltd., product name: ECS-401GX), a high pressure mercury lamp (manufactured by Eye Graphics Co., Ltd., product name: H04-L41) was used to stack and stack the ultraviolet lamps. Under the conditions of 100 mm, ultraviolet lamp output 3 kw, illuminance of light having wavelength of 365 nm of 400 mW/cm ² , and light quantity of 800 mJ/cm ² (measured by UV light meter UV-351 manufactured by Oak Manufacturing Co., Ltd.), a second PET film was formed. A curing reaction was performed by irradiating ultraviolet rays through the layer to form a base layer having a thickness of 5 μm.
Then, the second PET film is peeled off to expose the underlayer, and a polysilazane compound (a coating agent containing perhydropolysilazane (PHPS) as a main component (Amiakuka NL-110 manufactured by Merck Performance Materials, Inc.) is formed on the underlayer. -20, solvent: xylene)) was applied by a spin coating method and dried by heating at 130 ^° C. for 2 minutes to form a polymer compound layer (polysilazane layer) having a thickness of 200 nm and containing perhydropolysilazane.
Next, using a plasma ion implanter (manufactured by JEOL Ltd., RF power source: “RF” 56000; Kurita Manufacturing Co., Ltd., high voltage pulse power source: PV-3-HSHV-0835), a gas flow rate of 100 sccm and a duty ratio of 0 were used. 0.5%, applied DC voltage -6 kV frequency 1,000 Hz, applied RF power 1,000 W, chamber internal pressure 0.2 Pa, DC pulse width 5 μsec, processing time 200 seconds under conditions of argon gas-derived ion polymer compound layer. It was injected onto the surface of (polysilazane layer) to form a gas barrier layer. In this way, a gas barrier layered product was prepared by laminating the gas barrier layer on the underlayer.

[Example 2]
61 parts by mass of dicyclopentadiene diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., A-DCP) as a curable monomer, allyl ether type acrylate which is a cyclopolymerizable monomer (manufactured by Nippon Shokubai Co., Ltd., FX-AO- (MA) A gas barrier laminate was produced in the same manner as in Example 1 except that 61 parts by mass was used.

[Comparative Example 1]
Gas barrier laminate in the same manner as in Example 1 except that only 122 parts by mass of allyl ether type acrylate (FX-AO-MA manufactured by Nippon Shokubai Co., Ltd.), which is a cyclopolymerizable monomer, was used as the curable monomer. The body was made.

[Comparative example 2]
As Comparative Example 1, except that 100 parts by mass of pellets of polysulfone resin (PSF) (manufactured by BASF, ULTRASON S6010, Tg=187° C., weight average molecular weight 60,000) were used as the polymer component instead of the polyimide resin. A gas barrier laminate was prepared in the same manner.

[Comparative Example 3]
Except for using 100 parts by mass of toluene (Tg≦190° C., weight average molecular weight less than 100,000) of a polycarbonate resin (PC) as a polymer component instead of a polyimide resin as a solvent for dissolving pellets, and a polyimide resin as a polymer component. A gas barrier laminate was prepared in the same manner as in Example 1.

Table 1 shows the measurement results of each example and comparative example.

As is clear from Table 1, in Examples 1 and 2, the underlayer is excellent in solvent resistance and elongation at break, and the gas barrier laminate after removal of the process film has elongation at break and heat shrinkage. And the water vapor permeability of the gas barrier laminate is also excellent.
On the other hand, in Comparative Examples 1 to 3, the solvent resistance of the underlayer was good, but the absolute value of the heat shrinkage rate of the gas barrier laminate after removing the process film was larger than that of Example 1, and the gas barrier laminate was The water vapor transmission rate of No. 1 is lower than that of Example 1 by one digit or more. Further, the breaking elongations of both the underlayer and the gas barrier laminate are inferior to those of the examples.

According to the gas barrier laminate of the present invention, it is possible to further enhance the gas barrier property while having a high breaking elongation, and therefore an electronic device that is required to have gas barrier properties and flexibility and bending resistance at the same time. For example, it can be applied to a member for an element that constitutes various electronic devices that are easily deteriorated in the atmosphere, such as a flexible organic EL element or the like, or a flexible thermoelectric conversion element or the like.

1: Process film 2: Base layer 2a: Base layer before curing 3: Gas barrier layer 10: Gas barrier laminate 10a: Gas barrier laminate after process film removal

Claims

A gas barrier laminate comprising a process film, a base layer, and a gas barrier layer in this order,
The underlayer is a layer formed of a cured product of a curable resin composition containing a polymer component (A) and a curable component (B),
A gas barrier laminate, wherein the gas barrier laminate satisfies the following requirements [1] and [2].
[1] The absolute value of the thermal shrinkage of the gas barrier laminate is 0.5% or less.
[2] The breaking elongation of the gas barrier laminate is 1.9% or more.
The gas barrier laminate according to claim 1, wherein the underlayer has a thickness of 0.1 to 10 μm.
The gas barrier laminate according to claim 1 or 2, wherein the gas barrier layer is a coating film.
The gas barrier laminate according to any one of claims 1 to 3, wherein the curable component (B) contains a cyclopolymerizable monomer.
The curable component (B) further contains a polyfunctional (meth)acrylate compound, and the mass ratio of the cyclopolymerizable monomer to the polyfunctional (meth)acrylate compound is 95:5 to 30:70. The gas barrier laminate according to claim 4, which is present.
The gas barrier laminate according to any one of claims 1 to 5, wherein the glass transition temperature of the polymer component (A) is 250°C or higher.