WO2018016346A1 - Film for transfer of gas barrier multilayer film and organic el device - Google Patents

Abstract

The purpose of the present invention is to provide a film for transfer of a gas barrier multilayer film that achieves good gas barrier properties. In order to achieve the above-described purpose, the present invention has the following configuration. Namely, a film for transfer of a gas barrier multilayer film, which is characterized by having, on a release film, a gas barrier multilayer film that sequentially comprises an undercoat layer and a gas barrier layer in this order, and which is also characterized in that the release strength between the release film and the undercoat layer is within the range of 15-700 mN/18 mm.

Description

Gas barrier laminate film transfer film and organic EL device

The present invention is a transfer for transferring and depositing a gas barrier laminate film on a transfer member that requires gas barrier properties, for example, an electronic member such as an organic EL element, an organic EL device, a liquid crystal display element, and a solar cell element. It is related with film.

A gas barrier film in which a gas barrier layer is laminated on a base film made of a plastic film such as a polyethylene terephthalate film is generally known. As the gas barrier layer, vapor deposition films of inorganic oxides such as aluminum oxide, silicon oxide, and magnesium oxide are generally known.

On the other hand, displays using organic electroluminescence (EL) and liquid crystals are required to be lightweight, thin and flexible, and accordingly, gas barrier films used in these displays are also thin and flexible. Is required.

Therefore, a gas barrier laminate film transfer film is proposed in which a gas barrier laminate film (meaning a gas barrier layer and a protective layer or a hard coat layer provided as necessary) is laminated on a release film (patent) References 1-3).

JP-A-8-179291 JP-A-8-234181 International Publication No. 2013/018602

However, the transfer film of the gas barrier laminate film described above has a stable gas barrier property as compared with a general gas barrier film (meaning that a gas barrier layer is laminated on a base film). It turns out that there is a problem that it is difficult to obtain. Such a problem appears remarkably when the gas barrier property is good (for example, when the water vapor transmission rate is less than 0.1 g / m ² / day, and further less than 0.01 g / m ² / day).

Accordingly, an object of the present invention is to provide a transfer film of a gas barrier laminate film that can obtain a good gas barrier property in view of the above-mentioned problems.

The above object of the present invention is achieved by the following present invention.
[1] A gas barrier laminate film including an undercoat layer and a gas barrier layer in this order on the release film, and the peel force between the release film and the undercoat layer is in the range of 15 to 700 mN / 18 mm. A film for transferring a gas barrier laminate film, which is characterized.
[2] The transfer film for a gas barrier laminate film according to [1], wherein the water vapor permeability of the gas barrier laminate film is less than 0.1 g / m ² / day.
[3] The gas barrier laminate film transfer film according to [1] or [2], wherein the undercoat layer is a thermosetting resin layer or an active energy ray curable resin layer.
[4] The gas barrier according to any one of [1] to [3], wherein the surface roughness (Ra) of the surface of the undercoat layer on the gas barrier layer side measured by an atomic force microscope is less than 2.0 nm. Film for conductive laminated film.
[5] The transfer film for a gas barrier laminate film according to any one of [1] to [4], wherein the gas barrier layer contains at least zinc oxide and silicon oxide.
[6] The transfer film for a gas barrier laminate film according to any one of [1] to [5], wherein the gas barrier layer is a layer containing zinc oxide, silicon dioxide, and aluminum oxide.
[7] In the gas barrier layer, the Zn atom concentration is 10 to 40 atom%, the Si atom concentration is 5 to 20 atom%, the Al atom concentration is 0.5 to 5 atom%, and the O atom concentration is 35 to 70 atom%. ] Transfer film of gas barrier laminate film according to any one of the above.
[8] The transfer film for a gas barrier laminate film according to any one of [1] to [7], wherein the gas barrier laminate film includes an undercoat layer, a gas barrier layer, and a sealing resin layer in this order.
[9] The sealing resin layer has, as a sealing resin, polyisobutylene, butyl rubber, polyisoprene, styrene-isobutylene modified resin, styrene-isoprene-styrene block copolymer, styrene-butadiene-styrene block copolymer, styrene. The transfer film for a gas barrier laminate film according to [8], comprising at least one resin selected from the group consisting of isoprene rubber, polybutadiene rubber, styrene-butadiene rubber, and polybutene, and a tackifying resin.
[10] The transfer film for a gas barrier laminate film according to [8] or [9], having a second release film on a surface that is not on the gas barrier layer side of the sealing resin layer.
[11] In any one of [1] to [10], the minimum mandrel diameter at which cracks do not occur is 4 mm in a bendability test according to the cylindrical mandrel method (JIS K5600-5-1: 1999). A film for transferring a gas barrier laminate film.
[12] An organic EL device in which the gas barrier laminate film of the gas barrier laminate film according to any one of [1] to [11] is deposited on an organic EL element.

According to the present invention, it is possible to provide a transfer film of a gas barrier laminate film capable of obtaining good gas barrier properties.

The transfer film for a gas barrier laminate film of the present invention is suitable for transferring and depositing a gas barrier laminate film on an organic EL element of an organic EL device in which an organic EL element is disposed on a substrate. That is, the organic EL device to which the gas barrier laminate film of the gas barrier laminate film of the present invention is applied has good gas barrier properties.

Also, according to a preferred aspect of the present invention, it is possible to provide a gas barrier laminate film transfer film having a high degree of flexibility that can withstand bending and bending. Therefore, a preferable embodiment of the transfer film of the gas barrier laminate film of the present invention is suitable for an organic EL element or an organic EL device having a high degree of flexibility.

It is a schematic cross section which shows an example of the process of transferring and adhering the gas barrier laminated film of the transfer film of the gas barrier laminated film of this invention to an organic EL element. It is a schematic cross section which shows an example of the process of transferring and adhering the gas barrier laminated film of the transfer film of the gas barrier laminated film of this invention to an organic EL element. It is the schematic which shows typically the winding-type sputtering apparatus for manufacturing the film for transfer of the gas-barrier laminated film of this invention.

The transfer film for a gas barrier laminate film of the present invention has a gas barrier laminate film including an undercoat layer and a gas barrier layer in this order on a release film. In the following description, the transfer film of the gas barrier laminate film of the present invention may be simply abbreviated as “transfer film”.

When the transfer film of the present invention is used, the gas barrier laminate film is peeled off from the release film, and a transferred member requiring gas barrier properties, such as an organic EL element, an organic EL device, a liquid crystal display element, and a solar cell element. A gas barrier laminate film is transferred and deposited on an electronic member such as a polarizing plate, a retardation plate, and an optical film such as a transparent conductive film. Peeling of the release film and the gas barrier laminate film is performed between the release film and the undercoat layer.

Here, it has been found that the peeling force between the release film and the undercoat layer constituting the gas barrier laminate film affects the gas barrier properties of the gas barrier laminate film, and has led to the present invention. That is, it has been found that the gas barrier property is stabilized at a high level by controlling the peeling force between the release film and the undercoat layer in the range of 15 to 700 mN / 18 mm.

In particular, when the water vapor permeability (gas barrier property) of the gas barrier laminate film is required to be less than 0.1 g / m ² / day, and more preferably less than 0.01 g / m ² / day, the release film This high level of gas barrier property can be stably obtained by controlling the peeling force between the undercoat layer and the undercoat layer in the range of 15 to 700 mN / 18 mm.

When the peeling force between the release film and the undercoat layer is smaller than 15 mN / 18 mm, the gas barrier property is lowered. This is presumed to be due to a decrease in adhesion between the release film and the undercoat layer.

That is, when the peeling force between the release film and the undercoat layer is less than 15 mN / 18 mm and the adhesion force between the release film and the undercoat layer is reduced, the undercoat layer applied and laminated on the release film It is estimated that the uniformity is deteriorated and the gas barrier layer formed on the gas barrier layer is not even, and as a result, the gas barrier property is lowered. Similarly, if the adhesive force between the release film and the undercoat layer is reduced, the release film and the undercoat can be used in a high temperature atmosphere (about 100 to 200 ° C.) when the gas barrier layer is formed on the undercoat layer. It is presumed that the undercoat layer is distorted due to the difference in thermal shrinkage with the layer, and the gas barrier properties are lowered due to the distortion.

On the other hand, if the peeling force between the release film and the undercoat layer is greater than 700 mN / 18 mm, the gas barrier laminate film cannot be smoothly peeled from the release film, and cracks and the like are generated in the gas barrier layer. It is thought that the nature is lowered.

From the above viewpoint, the peeling force between the release film and the undercoat layer is preferably 20 mN / 18 mm or more, more preferably 30 mN / 18 mm or more, and particularly preferably 40 mN / 18 mm or more. The peeling force is preferably 600 mN / 18 mm or less, more preferably 400 mN / 18 mm or less, and particularly preferably 250 mN / 18 mm or less.

[Release film]
The kind of release film used in the present invention is not particularly limited, and can be appropriately selected from known or commercially available release films. That is, the release film can be appropriately selected and used so that the peeling force between the release film and the undercoat layer is in the range of 15 to 700 mN / 18 mm.

As a release film, for example, a release film having a release property such as a polyolefin resin film, a fluororesin film, a silicone resin film, or a base film such as a polyester film is laminated with a release layer. Examples include release films.

In the present invention, from the viewpoint of stably controlling the peeling force between the release film and the undercoat layer in the range of 15 to 700 mN / 18 mm, the release film is a release film having a release layer on the base film. A mold film is preferably used. When a release film having a release layer on the base film is used, the release film is peeled between the release layer and the undercoat layer.

Hereinafter, a release film preferably used in the present invention, that is, a release film having a release layer on a base film will be described in detail.

The material constituting the base film is not particularly limited, but for example, polyester resins such as polyethylene terephthalate and polyethylene naphthalate, polyolefin resins such as polypropylene and polyethylene, cellulose resins such as diacetyl cellulose and triacetyl cellulose, polysulfone resins, Various resins such as polyether ether ketone resin, polyether sulfone resin, polyphenylene sulfide resin, polyether imide resin, polyimide resin, polyamide resin, and acrylic resin can be used. Among these, from the viewpoint of ease of processing, durability, heat resistance, cost, and the like, a polyester resin is preferable, and a polyethylene terephthalate resin is more preferable. The base film may be an unstretched film, but is preferably a uniaxially stretched or biaxially stretched film.

The thickness of the base film is generally in the range of 10 to 100 μm, preferably in the range of 15 to 75 μm, particularly preferably in the range of 20 to 50 μm.

Examples of the release agent constituting the release layer include silicone resins, modified silicone resins, long chain alkyl group-containing resins, fluororesins, polyolefin resins, alkyd resins, melamine resins, rubber elastomers, and the like. A mold release agent can be used individually or in combination. Among these release agents, a silicone resin, a modified silicone resin, and a long-chain alkyl group-containing resin are preferable from the viewpoint of controlling the peeling force between the release film and the undercoat layer in the range of 15 to 700 mN / 18 mm.

The silicone resin is preferably a curable silicone resin, and examples of the curable silicone resin include a condensation reaction type, an addition reaction type, an ultraviolet ray or an electron beam curable type, and the like.

Specific examples of the curable silicone resin include the following.

KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-856, KS-723A, KS-723B, KS-3703, X-62-2422, X of Shin-Etsu Chemical Co., Ltd. -62-2461, X-62-1387, KNS-3051, X-62-1496, KNS320A, KNS316, X-62-1574A / B, X-62-7052, X-62-7028A / B, X-62 -7619, X-62-7213, etc.
TPR-6701, -6702, -6703, -3704, -6705, -6722, -6721, -6700, XSR-7029, YSR-3022, YR-3286, etc.
DKQ3-202, DKQ3-203, DKQ3-204, DKQ3-205, DKQ3-210, DKQ3-33061, etc. of Dow Corning Co., Ltd.
Toray Dow Corning SRX357, SRX211, SRX67, SD7220, LTC750A, LTC760A, SP7259, BY24-468C, SP7248S, BY24-452, etc.
Momentive Performance Materials YSR-3022, TPR-6700, TPR-6720, TPR-6721, TPR6500, TPR6501, UV9300, UV9425, XS56-A2775, XS56-A2982, UV9430, TPR6600, TPR6604, TPR6605, etc.

Moreover, peeling force can be adjusted by using together with said silicone resin a peeling force regulator (it is also called a heavy peeling agent or a peeling control agent). Examples of the peel strength adjusting agent include (1) a silica structure having SiO ₂ units, (2) a resin structure having SiO ₂ units and (CH ₃ ) ₃ SiO _1/2 units, and (3) SiO ₂ units. And those having a resin structure having CH ₂ ═CH (CH ₃ ) ₂ SiO _1/2 units. Commercially available products of such a peel strength adjusting agent include, for example, KS-3800, X-92-183 of Shin-Etsu Chemical Co., Ltd., SDY7292, BY24-843, BY24-4980 of Toray Dow Corning Co., Ltd. Can be mentioned.

The addition amount of the peeling force adjusting agent is preferably in the range of 1 to 150 parts by weight, more preferably in the range of 5 to 100 parts by weight, and particularly preferably in the range of 10 to 75 parts by weight with respect to 100 parts by weight of the silicone resin.

Furthermore, it is preferable to add a catalyst for curing the silicone resin in the release layer. As such a catalyst, a platinum-based catalyst is preferable. Specifically, LTC-856, LTC-761, SRX-212 manufactured by Toray Dow Corning Co., Ltd., KS-3800, X manufactured by Shin-Etsu Chemical Co., Ltd., X -62-183, X-62-2829, X-62-2853, X-62-2856, X-62-2857, PL-5000, PL-50T and the like. The addition amount of the catalyst is preferably in the range of 0.3 to 15 parts by mass, more preferably in the range of 1 to 12 parts by mass with respect to 100 parts by mass of the silicone resin.

Examples of the modified silicone resin include modified silicone resins obtained by graft polymerization with organic resins such as polyester resins, acrylic resins, urethane resins, epoxy resins, and alkyd resins. Specific examples of the modified silicone resin include X-62-9027 and X-62-900B manufactured by Shin-Etsu Chemical Co., Ltd., SR2114 and SR2107 manufactured by Toray Dow Corning Co., Ltd., Toshiba Silicone Co., Ltd. TSR180 (above alkyd-modified silicone resin), TSR187 (polyester-modified silicone resin) manufactured by Toshiba Silicone Co., Ltd., TSR171 (acryl-modified silicone resin) manufactured by Toshiba Silicone Co., Ltd., and the like.

In order to accelerate the curing of the modified silicone resin, it is preferable to add an acid catalyst. Examples of the acid catalyst include sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, p-toluenesulfonic acid and the like. Of these, p-toluenesulfonic acid is preferably used. The addition amount of the acid catalyst is suitably in the range of 0.1 to 10 parts by mass with respect to 100 parts by mass of the modified silicone resin.

The long chain alkyl group-containing resin refers to a resin having a linear or branched alkyl group having 8 or more carbon atoms. Specifically, the long chain alkyl group-containing polyvinyl resin, the long chain alkyl group-containing acrylic resin, Examples include a chain alkyl group-containing polyester resin, a long chain alkyl group-containing ether compound, a long chain alkyl group-containing amine compound, and a long chain alkyl group-containing alkyd resin.

The carbon number of the long chain alkyl group is preferably 8 or more, more preferably 10 or more, and particularly preferably 12 or more. The upper limit of carbon number is preferably 30 or less, more preferably 28 or less, and particularly preferably 25 or less.

Commercially available resins can be used for the long chain alkyl group-containing resin. Specifically, Rekyo series “K-256”, “N-137”, “P-677”, “Q-472” manufactured by Chukyo Yushi Co., Ltd., “RA-95H” manufactured by Asio Sangyo Co., Ltd. , “RA-585S”, “HT”, “1050”, “1010”, “1070”, “406” of Pyroyl series manufactured by Yushi Co., Ltd., “ZF-15” manufactured by Nihon Ventures-Poval “ZF-15H”, Epomin “RP-20” manufactured by Nippon Shokubai Co., Ltd., and the like.

When using a long-chain alkyl group-containing resin as a release agent, it is preferable to use a crosslinking agent in combination. Examples of such crosslinking agents include epoxy crosslinking agents, isocyanate crosslinking agents, oxazoline crosslinking agents, carbodiimide crosslinking agents, melamine crosslinking agents, and the like. Among these, a melamine type crosslinking agent is preferably used.

The melamine-based crosslinking agent has various modifications on the amino group of so-called melamine [1,3,5-triazine-2,4,6-triamine] in which an amino group is bonded to each of three carbon atoms of the triazine ring. It is a generic name for compounds and includes those in which a plurality of triazine rings are condensed. As the type of modification, one in which at least one hydrogen atom of three amino groups is alkylated or methylolated is preferably used. In particular, a methylolated melamine compound in which at least one amino group is methylol-substituted is preferably used.

In addition, it is preferable to add an acid catalyst in order to accelerate the curing of the long-chain alkyl group-containing resin and the crosslinking agent. Examples of the acid catalyst include sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, p-toluenesulfonic acid and the like. Of these, p-toluenesulfonic acid is preferably used. The addition amount of the acid catalyst is suitably in the range of 0.1 to 10 parts by mass with respect to 100 parts by mass of the long-chain alkyl group-containing resin.

The thickness of the release layer is generally in the range of 10 to 1000 nm, preferably in the range of 20 to 500 nm, particularly preferably in the range of 50 to 200 nm.

The release layer is preferably formed on the base film by applying it by wet coating, drying, and heat-curing. Examples of the wet coating method include a reverse coating method, a spray coating method, a bar coating method, a gravure coating method, a rod coating method, a die coating method, a spin coating method, and an extrusion coating method. As heat curing conditions, it is preferable to heat at 80 to 200 ° C., preferably 100 to 180 ° C. for 10 to 200 seconds.

Also, the release layer can be coated in-line in the base film forming process. For example, within the production process of the polyester film, after the polyester film is uniaxially stretched, a release layer is applied and further stretched (totally biaxially stretched).

In the release film, an anchor layer can be provided between the base film and the release layer in order to improve adhesion, prevent oligomer precipitation, or provide antistatic properties. Moreover, an oligomer precipitation preventing layer or an antistatic layer can be provided on the opposite surface of the base film from the release layer.

[Gas barrier laminate film]
The gas barrier laminated film according to the present invention includes an undercoat layer and a gas barrier layer. Furthermore, the gas barrier laminate film according to the present invention can include layers other than the undercoat layer and the gas barrier layer, for example, functional layers such as a sealing resin layer and a protective layer. Specifically, a configuration including an undercoat layer, a gas barrier layer, and a sealing resin layer in this order, a configuration including an undercoat layer, a gas barrier layer, and a protective layer in this order, an undercoat layer, a gas barrier layer, a protective layer, and a sealing resin A configuration including layers in this order can be employed.

The water vapor permeability of the gas barrier laminate film according to the present invention is preferably less than 0.1 g / m ² / day, more preferably less than 0.01 g / m ² / day, and 0.001 g / m. Particularly preferred is less than ² / day. The lower limit water vapor transmission rate is not particularly limited, but is practically about 1 × 10 ⁻⁶ g / m ² / day.

[Undercoat layer]
The undercoat layer is preferably a resin layer, and more preferably a cured resin layer. When the undercoat layer is a cured resin layer, it becomes easy to control the peeling force with the release film. The curable resin layer is preferably a thermosetting resin layer or an active energy ray curable resin layer, and more preferably an active energy ray curable resin layer. Since the active energy ray curable resin layer has a relatively high hardness, the gas barrier property of the gas barrier layer laminated thereon is good.

The undercoat layer may be a single layer or a laminated structure of 2 to 4 layers. In the case of the above laminated structure, at least one layer is preferably a cured resin layer. The undercoat layer is particularly preferably a single layer of a cured resin layer from the viewpoints of productivity, gas barrier properties, and peelability.

The thermosetting resin layer is a cured resin layer cured by heating at least a film containing the thermosetting resin. Examples of such thermosetting resins include acrylic resins, polyvinyl resins, polyester resins, polyether resins, polyurethane resins, polycarbonate resins, polystyrene resins, polyolefin resins, fluorine resins, polyimide resins, and the like. . Among these resins, a polyurethane resin is preferably used.

The thermosetting resin layer also contains a crosslinking agent (for example, a melamine crosslinking agent, an oxazoline crosslinking agent, a carbodiimide crosslinking agent, an isocyanate crosslinking agent, an aziridine crosslinking agent, or an epoxy crosslinking agent) that crosslinks the resin. can do.

The undercoat layer in the present invention is preferably an active energy ray curable resin layer. Hereinafter, the aspect in which an undercoat layer is an active energy ray hardening resin layer is demonstrated in detail.

The active energy ray-curable resin layer is a cured resin layer that is cured by irradiating the coating film containing at least the active energy ray-curable resin with ultraviolet rays or an electron beam. The active energy ray-curable resin means a resin that is polymerized and cured by active energy rays. Examples of the active energy ray-curable resin include compounds (monomers and oligomers) having at least one ethylenically unsaturated group in the molecule. Here, examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acryloyl group, a methacryloyl group, an acryloyloxy group, a methacryloyloxy group, an allyl group, and a vinyl group. Examples of such compounds include urethane compounds, acrylic compounds, epoxy compounds, polyether compounds, silicone compounds, and the like. Among these, urethane compounds are preferable. Furthermore, as the urethane compound, urethane (meth) acrylate or urethane (meth) acrylate oligomer is preferably used.

In the present invention, the expression “... (Meth) acrylate” includes two compounds “... acrylate” and “... methacrylate”.

Examples of urethane compounds (urethane (meth) acrylate or urethane (meth) acrylate oligomer) include the following compounds.

a) a compound obtained by reacting a polyisocyanate having two or more isocyanate groups in one molecule with a 1 to 5 functional polycaprolactone-modified alkyl (meth) acrylate,
b) a compound obtained by reacting a polyisocyanate having two or more isocyanate groups in one molecule with a 1 to 5 functional polyalkylene glycol (meth) acrylate,
c) a compound obtained by reacting a polyisocyanate having two or more isocyanate groups in one molecule with a polycarbonate diol and a 1 to 5 functional hydroxy-modified (meth) acrylate,
d) A compound obtained by reacting a polyisocyanate having two or more isocyanate groups in one molecule with a 1 to 5 functional hydroxy-modified epoxy (meth) acrylate.

e) pentaerythritol tri (meth) acrylate hexamethylene diisocyanate urethane oligomer,
f) pentaerythritol tri (meth) acrylate toluene diisocyanate urethane oligomer,
g) pentaerythritol tri (meth) acrylate isophorone diisocyanate urethane oligomer,
Etc.

Examples of the polyisocyanate include aromatic diisocyanates such as tolylene diisocyanate, xylylene diisocyanate, methylene diphenyl diisocyanate, phenylene diisocyanate, naphthalene diisocyanate, and tolidine diisocyanate, and aromatics such as α, α, α ′, α′-tetramethylxylylene diisocyanate. Aliphatic diisocyanates having a ring, methylene diisocyanate, propylene diisocyanate, lysine diisocyanate, trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, etc., cyclohexane diisocyanate, methylcyclohexane diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, isopropylidene diisocyanate B alicyclic diisocyanates such as hexyl diisocyanate.

In addition, a composition containing a urethane compound (urethane (meth) acrylate or urethane (meth) acrylate oligomer) or a urethane compound is commercially available and can be used. For example, AT-600, UA-101l, UA-306H, UA-306T, UA-306l, UF-8001, UF-8003 etc. manufactured by Kyoeisha Chemical Co., Ltd., UV7550B, UV-7650B, UV- 6300B, etc., manufactured by Shin-Nakamura Chemical Co., Ltd. U-4HA, U-6HA, UA-100H, U-6LPA, U-15HA, UA-32P, U-324A, U-2PPA, UA-NDP, etc. Ebecryl-270, Ebecryl-284, Ebecryl-264, Ebecryl-9260, Ebecryl-1290, Ebecryl-1290K, Ebecryl-5129, manufactured by Negami Kogyo Co., Ltd., UN-3220HA, UN-3220B, UN-3220B, 3220HS, etc. Made by Mitsubishi Rayon RQ Series, Arakawa Chemical Industries Beam Set Series, Dainichi Seika Industry Co., Ltd. Seika Beam Series, Aika Industry Co., Ltd. Aika Eyetron Series, DIC Corporation Unidic Series, Taisei Fine Chemical ( 8KX series, etc.).

Among the above urethane (meth) acrylate or urethane (meth) acrylate oligomer, from the viewpoint of improving the flexibility and peelability of the undercoat layer, the number of functional groups (ethylenically unsaturated groups) in one molecule is 5 or less is preferable, 4 or less is more preferable, and 3 or less is particularly preferable. The number of functional groups is preferably 1 or more, and more preferably 2 or more. By setting the number of functional groups (ethylenically unsaturated groups) in one molecule of the urethane (meth) acrylate or urethane (meth) acrylate oligomer within the above range, cracks in the flexibility test by the cylindrical mandrel method described later Occurrence is easily suppressed.

When the number of functional groups of urethane (meth) acrylate or urethane (meth) acrylate oligomer exceeds 5, the flexibility may be lowered.

The active energy ray-curable resin layer can further contain a compound other than the urethane compound (compound having 2 to 8 ethylenically unsaturated groups (monomer)) in addition to the urethane compound. . The content of the compound (monomer) other than the urethane compound is preferably in the range of 1 to 100 parts by mass, preferably in the range of 3 to 50 parts by mass, with respect to 100 parts by mass of the urethane compound. Is particularly preferred.

Examples of compounds (monomers) other than urethane compounds include ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. 1,6-hexanediol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, polyethylene glycol di (Meth) acrylate, polypropylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, ditrimethylolpropane tri (meth) acrylate, dito Methylolpropane tetra (meth) acrylate, glycerin propoxytri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, Examples include dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol tri (meth) acrylate, and tripentaerythritol hexa (meth) acrylate.

The active energy ray-curable resin layer preferably further contains a photopolymerization initiator. Specific examples of the photopolymerization initiator include acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, benzophenone, 2-chlorobenzophenone, 4,4′-dichlorobenzophenone, 4,4′-bisdiethylaminobenzophenone, Michler's ketone, benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, methyl benzoylformate, p-isopropyl-α-hydroxyisobutylphenone, α-hydroxyisobutylphenone, 2, Carbonyl compounds such as 2-dimethoxy-2-phenylacetophenone and 1-hydroxycyclohexyl phenyl ketone, tetramethylthiuram monosulfide, teto Sulfur compounds such as lamethylthiuram disulfide, thioxanthone, 2-chlorothioxanthone, and 2-methylthioxanthone can be used. These photopolymerization initiators may be used alone or in combination of two or more.

In addition, photopolymerization initiators are generally commercially available and can be used. For example, Irgacure 184, Irgacure 907, Irgacure 379, Irgacure 127, Irgacure 127, Irgacure 500, Irgacure 754, Irgacure 250, Irgacure 1800, Irgacure 1870, Irgacure OXE01, DAROCURO SPEEDCUREMBB, SPEEDCURE PBZ, SPEEDCURE ITX, SPEEDCURE CTX, SPEEDCURE EDB, ESACURE ONE, ESCURE KIP150, Esacure KTO 150 , KAYACURE DMBI, and the like.

The content of the photopolymerization initiator is preferably in the range of 0.1 to 10% by mass, more preferably in the range of 0.5 to 8% by mass with respect to 100% by mass of the total solid content of the active energy ray-curable resin layer. .

Examples of active energy rays for curing the active energy ray-curable resin layer include ultraviolet rays, visible rays, infrared rays, electron beams, rays, β rays, γ rays, and the like. Among these active energy rays, ultraviolet rays and electron beams are preferable, and ultraviolet rays are particularly preferably used.

Although it does not specifically limit as a light source for irradiating an ultraviolet-ray, For example, an ultraviolet fluorescent lamp, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a carbon arc lamp, a metal halide lamp, a xenon lamp etc. can be used. . An ArF excimer laser, a KrF excimer laser, an excimer lamp, synchrotron radiation, or the like can also be used. Among these, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc, a xenon arc, and a metal halide lamp can be preferably used. In addition, when irradiating with ultraviolet rays, it is preferable to perform irradiation in an atmosphere having a low oxygen concentration, for example, an atmosphere having an oxygen concentration of 500 ppm or less because it can be cured efficiently.

Irradiation light amount of the ultraviolet rays is preferably from 50 mJ / cm ² or more, 100 mJ / cm ² or more, and particularly 150 mJ / cm ² or more. The irradiation light amount is preferably 2000 mJ / cm ² or less, and more preferably 1000 mJ / cm ² or less.

The undercoat layer is preferably applied on the release film by a wet coating method. Examples of the wet coating method include a reverse coating method, a spray coating method, a bar coating method, a gravure coating method, a rod coating method, a die coating method, a spin coating method, and an extrusion coating method.

The thickness of the undercoat layer is preferably 0.5 μm or more, more preferably 1 μm or more from the viewpoint of maintaining the peelability when the gas barrier laminate film is peeled from the release film and the strength of the gas barrier laminate film after peeling. It is preferably 2 μm or more. If the thickness of the undercoat layer becomes too thick, the peelability may deteriorate. Therefore, the thickness of the undercoat layer is preferably 15 μm or less, more preferably 10 μm or less, and particularly preferably 8 μm or less.

The surface of the undercoat layer is preferably smooth. When laminating a gas barrier layer on the undercoat layer, if the surface smoothness of the undercoat layer is low, pinholes and cracks may occur in the gas barrier layer, and the gas barrier property may be deteriorated.

The surface smoothness of the undercoat layer can be represented by, for example, the surface roughness (Ra) measured with an atomic force microscope. The surface roughness (Ra) measured with an atomic force microscope on the surface of the undercoat layer, that is, the gas barrier layer side of the undercoat layer is preferably less than 2.0 nm, more preferably 1.5 nm or less. 0 nm or less is particularly preferable. The lower limit is not particularly limited, but is about 0.1 nm.

As described above, when the peeling force between the release film and the undercoat layer is less than 15 mN / 18 mm, the applicability of the undercoat layer to the release film is lowered, and the surface smoothness of the undercoat layer is lowered. There is. Therefore, also from the above viewpoint, the peeling force between the release film and the undercoat layer needs to be 15 mN / 18 mm or more, preferably 20 mN / 18 mm or more, more preferably 30 mN / 18 mm or more, and particularly preferably 40 mN / 18 mm or more. .

The undercoat layer in the present invention may be a layer having various functions. For example, a hard coat layer, an antireflection layer, a retardation layer, an adhesion reinforcing layer, a smoothing layer and the like can be mentioned. The undercoat layer is particularly preferably a hard coat layer. The function as a hard-coat layer can be provided by making an undercoat layer into the above-mentioned thermosetting resin layer or active energy ray hardening resin layer.

[Gas barrier layer]
The gas barrier layer can be laminated using a known material. The gas barrier layer may be a single film or a laminated structure of a plurality of films.

As a material for forming the gas barrier layer, for example,
(I) oxides, nitrides, sulfides or mixtures of elements such as Si, Zn, Al, Ti, Zr, Sn, In, Nb, Mo, Ta, etc.
(Ii) an organosilicon compound,
(Iii) gas barrier resin,
(Iv) a polymer compound in which ions are implanted,
Etc.

Hereinafter, these materials will be described in detail.

[Material (i)]
Among the materials (i) described above, oxides are preferable, and among oxides, oxides of Si, Zn, and Al are preferable, and it is preferable to contain at least zinc oxide or zinc sulfide.

Further, by containing zinc oxide or zinc sulfide and silicon oxide, the film quality can be formed amorphous and dense, and excellent gas barrier properties can be obtained. In particular, the gas barrier layer preferably contains zinc oxide and silicon oxide because excellent gas barrier properties can be stably obtained and the color tone is almost achromatic.

Among the gas barrier layers containing zinc oxide and silicon oxide, (a) a layer containing zinc oxide, silicon dioxide and aluminum oxide is preferably used. In this gas barrier layer, it is preferable that zinc oxide, silicon dioxide and aluminum oxide coexist in one gas barrier layer.

<(A) Layer containing zinc oxide, silicon dioxide and aluminum oxide>
As the composition of this gas barrier layer, the Zn atom concentration measured by X-ray photoelectron spectroscopy (XPS method) is 10 to 40 atom%, the Si atom concentration is 5 to 20 atom%, the Al atom concentration is 0.5 to 5 atom%, The O atom concentration is preferably 35 to 70 atom%.

When the Zn atom concentration is higher than 40 atom% or the Si atom concentration is lower than 5 atom%, the oxide that suppresses the crystal growth of zinc oxide is insufficient, so that voids and defects increase, and sufficient gas barrier properties are obtained. It may not be obtained. When the Zn atom concentration is lower than 10 atom% or the Si atom concentration is higher than 20 atom%, the amorphous component of silicon dioxide inside the gas barrier layer may increase and the flexibility of the layer may be lowered.

When the Al atom concentration is higher than 5 atom%, the affinity between zinc oxide and silicon dioxide becomes excessively high, so that the hardness of the film increases, and cracks are likely to occur due to heat and external stress. When the Al atom concentration is less than 0.5 atom%, the affinity between zinc oxide and silicon dioxide becomes insufficient, and the bonding force between the particles forming the layer cannot be improved, so the flexibility may decrease.

When the O atom concentration is higher than 70 atom%, the amount of defects in the gas barrier layer increases, so that high gas barrier properties may not be obtained. When the O atom concentration is less than 35 atom%, the oxidation state of zinc, silicon, and aluminum becomes insufficient, crystal growth cannot be suppressed, and the particle diameter becomes large, so that the gas barrier property may be deteriorated.

From the above viewpoint, it is further preferable that the Zn atom concentration is 20 to 35 atom%, the Si atom concentration is 10 to 15 atom%, the Al atom concentration is 1 to 3 atom%, and the O atom concentration is 50 to 64 atom%.

Since the above composition is formed with the same composition as the mixed sintered material used when forming the gas barrier layer, it can be adjusted by using a mixed sintered material having a composition that matches the composition of the target gas barrier layer. it can.

The method for forming the gas barrier layer is not particularly limited, and can be formed by a vacuum deposition method, a sputtering method, an ion plating method, or the like using a mixed sintered material of zinc oxide, silicon dioxide, and aluminum oxide. . When using a single material of zinc oxide, silicon dioxide, and aluminum oxide, form a film of zinc oxide, silicon dioxide, and aluminum oxide simultaneously from separate vapor deposition sources or sputter electrodes, and mix them to the desired composition. Can be formed. Among these methods, a sputtering method using a mixed sintered material is more preferable from the viewpoint of composition reproducibility of the gas barrier layer.

[(Ii) Organosilicon compound]
Examples of silicon-containing organic compounds include silane, methylsilane, dimethylsilane, trimethylsilane, tetramethylsilane, ethylsilane, diethylsilane, triethylsilane, tetraethylsilane, propoxysilane, dipropoxysilane, tripropoxysilane, tetrapropoxysilane, dimethyl Disiloxane, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetramethyldisiloxane, hexamethyldisiloxane, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, deca Methylcyclopentasiloxane, undecamethylcyclohexasiloxane, dimethyldisilazane, trimethyldisilazane, tetra Chirujishirazan, hexamethyldisilazane, hexamethylcyclotrisilazane, octamethylcyclotetrasilazane, decamethylcyclopentasiloxane silazane, such undecapeptide methyl cyclohexasilane La disilazane and the like. Among these, hexamethyldisiloxane and tetraethoxysilane are preferable from the viewpoint of handling.

An inorganic film such as a silicon oxide film, a silicon oxynitride film, or a silicon nitride film can be formed by forming a film by the plasma CVD method using the organosilicon compound as a raw material.

In addition, after applying the organosilicon compound by a known wet coating method (coating method using a slit die coater, gravure coater, etc.), irradiation with vacuum ultraviolet rays (excimer light) results in a silicon oxide film or a silicon oxynitride film. An inorganic film such as a silicon nitride film can be formed.

[(Iii) Gas barrier resin]
Examples of the gas barrier resin include polyvinyl alcohol or a partially saponified product thereof, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl chloride, polyvinylidene chloride, polychlorotrifluoroethylene, and the like. A gas barrier layer can be formed by applying these resins by a known wet coating method (coating method using a slit die coater or a gravure coater).

[(Iv) Ions implanted into polymer compound]
The gas barrier layer can be formed by ion implantation into a layer containing a polymer compound. Examples of such polymer compounds include silicon-containing polymer compounds, polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, Examples thereof include acrylic resins, cycloolefin polymers, and aromatic polymers. These polymer compounds can be used alone or in combination of two or more.

Among these polymer compounds, silicon-containing polymer compounds are preferable, and among the silicon-containing polymer compounds, polysilazane compounds are preferable.

The layer containing the polymer compound can be formed using a known wet coating method (coating method using a slit die coater or a gravure coater).

As ions implanted into the layer containing the polymer compound, for example, a gas such as hydrogen, oxygen, nitrogen, argon, helium, neon, krypton, or xenon is preferably used.

Among the gas barrier layers described above, the gas barrier layer may contain at least zinc oxide and silicon oxide from the viewpoint of reducing the water vapor transmission rate and suppressing the occurrence of cracks in the flexibility test by the mandrel method described later. Further, the layer (a) containing zinc oxide, silicon dioxide and aluminum oxide is particularly preferable.

The thickness of the gas barrier layer is suitably in the range of 10 to 800 nm, preferably in the range of 20 to 500 nm, more preferably in the range of 30 to 300 nm, and particularly preferably in the range of 50 to 200 nm.

[Sealing resin layer]
The sealing resin layer has a function of transferring the gas barrier laminate film to a transfer target member (for example, an organic EL element, an organic EL display element, a liquid crystal display element, a solar cell element, etc.) that requires a gas barrier property. It is preferable.

The sealing resin layer includes, as a sealing resin, polyisobutylene, butyl rubber, polyisoprene, styrene-isobutylene modified resin, styrene-isoprene-styrene block copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene rubber, It is preferable to contain at least one resin selected from the group consisting of polybutadiene rubber, styrene-butadiene rubber, and polybutene. Among these, it is more preferable that polyisobutylene and butyl rubber are included.

The sealing resin layer preferably further contains a tackifying resin. Examples of such tackifying resins include alicyclic petroleum resins, alicyclic hydrogenated petroleum resins, aromatic petroleum resins, and rosin resins. Among these tackifying resins, alicyclic petroleum resins are preferable, and among alicyclic hydrogenated petroleum resins, hydrogenated terpene resins, hydrogenated ester resins, hydrogenated resins of C5 petroleum resins, C9 A hydrogenated resin of a petroleum petroleum resin is preferred.

The mass ratio of the sealing resin to the tackifier resin (sealing resin / tackifier resin) is preferably 10/90 to 100/0, and more preferably 20/80 to 90/10.

The sealing resin layer can further contain an ultraviolet absorber, an antioxidant, an antistatic agent, a plasticizer, a filler, a flame retardant, a crosslinking agent, a rust inhibitor, and the like.

The thickness of the sealing resin layer is preferably in the range of 5 to 150 μm, more preferably in the range of 10 to 100 μm, and particularly preferably in the range of 20 to 80 nm. In addition, the sealing resin layer preferably has a water vapor permeability of 40 g / m ² / day or less, more preferably 30 g / m ² / day or less, and 20 g / m ² / day or less. Is particularly preferred.

The sealing resin layer may be formed by applying on the gas barrier layer, or after the sealing resin layer is once applied to another release film, only the sealing resin layer is transferred onto the gas barrier layer. Alternatively, the sealing resin layer may be applied to another release film and attached to the gas barrier layer together with the release film.

[Protective layer]
The protective layer has a function of protecting the gas barrier layer. The protective layer is preferably a cured resin layer. The cured resin layer as the protective layer is preferably a thermosetting resin layer or an active energy ray curable resin layer, and more preferably an active energy ray curable resin layer.

The thermosetting resin layer or the active energy ray curable resin layer as the protective layer can have the same configuration as the above-described undercoat layer. The thickness of the protective layer is preferably in the range of 0.3 to 5 μm, more preferably in the range of 0.5 to 3 μm, and particularly preferably in the range of 0.7 to 2 μm.

[Transfer film for gas barrier laminate film]
Although some structural examples are given below about the transfer film of the present invention, it is not limited to these structural examples.
1) Release film / undercoat layer / gas barrier layer 2) Release film / undercoat layer / gas barrier layer / protective layer 3) Release film / undercoat layer / gas barrier layer / protective film 4) Release film / undercoat Layer / gas barrier layer / sealing resin layer / second release film 5) release film / undercoat layer / gas barrier layer / protective layer / sealing resin layer / second release film In the above configuration example 3), for transfer When a gas barrier laminate film (undercoat layer / gas barrier layer) is transferred and adhered from a film to a member to be transferred, it is preferable to first peel off the protective film. For this purpose, the peeling force between the protective film and the gas barrier layer is The peel strength between the release film and the undercoat layer is preferably smaller. Specifically, the difference (A−B) between the peel force (A) between the release film and the undercoat layer and the peel force (B) between the protective film and the gas barrier layer is preferably 3 mN / 18 mm or more, 5 mN / 18 mm or more is more preferable, and 10 mN / 18 mm or more is preferable.

Here, as the protective film, a base film (preferably a polyester film, a polyolefin film, etc.) laminated with a slightly adhesive layer or a self-adhesive film is used.

Similarly, in the case of structural examples 4) and 5), it is preferable to first peel off the second release film. For this purpose, the peeling force between the second release film and the sealing resin layer is the same as that of the release film. It is preferably smaller than the peel strength with the undercoat layer. Specifically, the difference (AC) between the peel force (A) between the release film and the undercoat layer and the peel force (C) between the second release film and the sealing resin layer is 3 mN / 18 mm or more is preferable, 5 mN / 18 mm or more is more preferable, and 10 mN / 18 mm or more is preferable.

Here, the second release film can adopt the same configuration as the above-described release film, but in order to reduce the peeling force from the sealing resin layer, the second release film is a release mold. A material in which a release layer containing a silicone resin as an agent is laminated on a base film is preferably used. Moreover, a commercially available light release film can be used.

As will be described later, the transfer film of the present invention is preferably applied to an organic EL element or an organic EL device, and further to an organic EL element or an organic EL device having a high degree of flexibility that can withstand bending and bending. Preferably applied. In order to apply the transfer film to an organic EL element or organic EL device having a high degree of flexibility, the transfer film preferably has a high degree of flexibility that can withstand bending and bending.

From the above viewpoint, the transfer film of the present invention preferably has a minimum mandrel diameter of 4 mm at which cracks do not occur in a flexibility test in accordance with the cylindrical mandrel method (JIS K5600-5-1: 1999). 3 mm is more preferable, and 2 mm is particularly preferable.

[Application example of transfer film for gas-burr laminate film]
The present invention relates to a member to be transferred that requires gas barrier properties, such as an organic EL element, an organic EL device, a liquid crystal display element, an electronic member such as a solar cell element, a polarizing plate, a retardation plate, a transparent conductive film, etc. Since the gas barrier laminate film is transferred to an optical film or the like, it is suitable as a transfer film. In particular, it is suitable for organic EL elements and organic EL devices (in which an organic EL element is disposed on a substrate).

A mode when the transfer film of the present invention is applied to an organic EL element and an organic EL device will be described. 1 and 2 are schematic cross-sectional views showing a process of transferring and depositing the gas barrier laminate film of the transfer film of the present invention to an organic EL element.

FIG. 1 shows an application example of a transfer film having the configuration 1) (release film / undercoat layer / gas barrier layer). In FIG. 1, an organic EL element 12 disposed on a substrate 11 is coated with a sealing resin layer 13 in advance, and a transfer film 10 (release film 1 / undercoat layer 2 / gas barrier layer 3). ) Is applied (FIG. 1a).

First, the sealing resin layer 13 and the gas barrier layer 3 of the transfer film 10 are laminated so as to face each other (FIG. 1b). Next, the release film 1 of the transfer film 10 is peeled off, and the gas barrier laminate film (undercoat layer 2 / gas barrier layer 3) is transferred and deposited from the transfer film 10 (FIG. 1c).

The case of applying a transfer film comprising the configuration of 2) (release film / undercoat layer / gas barrier layer / protective layer) is the same as in FIG. 1, and first, the sealing resin layer 13 and the transfer film. 10 is laminated so that the protective layer 10 (not shown) faces, and then the release film 1 of the transfer film 10 is peeled off, and the gas barrier laminate film (undercoat layer / gas barrier layer / protection) is transferred from the transfer film 10. Layer) is transferred and deposited.

FIG. 2 shows an application example of a transfer film having the configuration 4) (release film / undercoat layer / gas barrier layer / sealing resin layer / second release film). In FIG. 2, an organic EL element 12 is arranged on a substrate 11, and a transfer film 10 (release film 1 / undercoat layer 2 / gas barrier layer 3 / sealing resin layer 4 / second mold release) In this mode, the film 5) is applied (FIG. 2a).

First, the second release film 5 is peeled from the transfer film 10 (FIG. 2b). Next, the organic EL element 12 disposed on the substrate 11 and the sealing resin layer 4 of the transfer film 10 are laminated so as to face each other (FIG. 2c). Next, the release film 1 of the transfer film 10 is peeled off, and the gas barrier laminate film (undercoat layer 2 / gas barrier layer 3 / sealing resin layer 4) is transferred and deposited from the transfer film 10 (FIG. 2d).

The case of applying a transfer film composed of the above 3) (release film / undercoat layer / gas barrier layer / protective film) is the same as in FIG. Is then laminated so that the organic EL element disposed on the substrate 11 and the gas barrier layer of the transfer film 10 face each other, and then the release film 1 of the transfer film 10 is peeled off, A gas barrier laminate film (undercoat layer / gas barrier layer) is transferred and deposited from the transfer film 10.

The case of applying a transfer film composed of the above 5) (release film / undercoat layer / gas barrier layer / protective layer / sealing resin layer / second release film) is also the same as in FIG. The second release film 5 is peeled from the transfer film 10, and then laminated so that the organic EL element 12 disposed on the substrate 11 and the sealing resin layer of the transfer film 10 face each other. The release film 1 of the transfer film 10 is peeled off, and the gas barrier laminate film (undercoat layer / gas barrier layer / protective layer / sealing resin layer) is transferred and adhered from the transfer film 10.

Hereinafter, the present invention will be specifically described based on examples. However, the present invention is not limited to the following examples.
[Evaluation methods]
First, an evaluation method in each example and comparative example will be described. The number of evaluation n was n = 5 and the average value was obtained unless otherwise specified.

(1) Measurement of peeling force between release film and undercoat layer The transfer films prepared in Examples and Comparative Examples were cut into a width of 20 mm and a length of 100 mm to prepare test samples. An adhesive tape (31B of Nitto Denko Corporation; width 18 mm × length 100 mm) was bonded to the surface of the gas barrier layer of this test sample, and after pressure bonding with a rubber roller having a weight of 400 g, the temperature was 23 ° C. and the relative humidity was 55%. After leaving in an atmosphere for 24 hours, the adhesive tape was peeled off at a rate of 200 mm / min in the 180 ° direction using a tensile tester, and the peeling force (mN / 18 mm) was measured.

For the transfer films produced in Examples 41 to 44, the peel force between the second release film and the sealing resin layer is smaller than the peel force between the release film and the undercoat layer. The second release film needs to be peeled off. Next, an adhesive tape (31B of Nitto Denko Corporation; width 18 mm × length 100 mm) was bonded to the surface of the sealing resin layer exposed by peeling off the second release film, and pressure-bonded with a rubber roller having a weight of 400 g. Then, after leaving for 24 hours in an atmosphere of 23 ° C. and 55% relative humidity, the adhesive tape was peeled off at a rate of 200 mm / min in the direction of 180 ° using a tensile tester, and the peeling force (mN / 18 mm) Was measured.

(2) Measurement of peel force between sealing resin layer and second release film The transfer films prepared in Examples 41 to 44 were cut into a width of 20 mm and a length of 100 mm to prepare test samples. Using a tensile tester, the second release film of the test sample was peeled in the 180 ° direction at a speed of 200 mm / min, and the peel force (mN / 18 mm) was measured.

(3) Measurement of water vapor permeability of gas barrier laminate film 1
The transfer films prepared in Examples 1 to 40 and Comparative Examples 1 to 32 were cut into a width of 100 mm and a length of 100 mm, and the gas barrier layer surface of the transfer film was formed into a biaxially stretched polyethylene terephthalate film having the same size as described above. (Toray Industries, Inc. “Lumilar (registered trademark)” “U48”; 100 μm thickness) is bonded via an acrylic adhesive (“836-1” from 3M Corporation; 25 μm thickness) The sample for measurement was produced by pressure bonding with a rubber roller having a weight of 400 g. This sample was allowed to stand for 24 hours in an atmosphere of 23 ° C. and relative humidity 55%, then cut to the measurement size of the following measuring device, peeled off the release film of the transfer film, and then measured the water vapor transmission rate. Evaluation based on the criteria.

In addition, the water vapor permeability of the biaxially stretched polyethylene terephthalate film used above ("Lumirror (registered trademark)""U48" of Toray Industries, Inc .; thickness 100 [mu] m) is about 20 g / m < ² > / day and has a gas barrier property. It does not affect the measurement of the water vapor transmission rate of the laminated film. The same applies to the adhesive used for bonding.

<Measurement equipment and measurement conditions>
Using a water vapor transmission rate measuring device (model name: DELTAPERRM (registered trademark)) manufactured by Technolox, UK, measurement was performed under conditions of a temperature of 40 ° C., a humidity of 90% RH, and a measurement area of 50 cm ² .

<Evaluation criteria>
A; water vapor transmission rate of 0.001g ^/ m 2 ^/ day below B; water vapor transmission rate of 0.001g ^/ m 2 ^/ day or more, 0.005g ^/ m 2 ^/ day below C; water vapor transmission rate of 0.005 g / m ² / day or more, 0.01 g ^/ m 2 / day below D; water vapor transmission rate of 0.01 g ^/ m 2 / day or more, 0.05 g ^/ m 2 / day below E; water vapor transmission rate of 0.05 g / m ² / day or more, less than 0.1 g / m ² / day F; water vapor transmission rate is 0.1 g / m ² / day or more.

(4) Measurement of water vapor permeability of gas barrier laminate film 2
The transfer films prepared in Examples 41 to 44 were cut into a width of 100 mm and a length of 100 mm, the second release film was peeled off, and then a biaxially stretched polyethylene terephthalate film having the same size as above ("Toray Industries, Inc." The surface of the sealing resin layer of the transfer film was bonded to one surface of Lumirror (registered trademark) “U48” (thickness: 100 μm) and pressure-bonded with a rubber roller having a weight of 400 g to prepare a measurement sample. This sample was allowed to stand for 24 hours in an atmosphere of 23 ° C. and a relative humidity of 55%, then cut to the measurement size of the measuring device, and after peeling the release film of the transfer film, the water vapor transmission rate was measured. Evaluation was made according to the above criteria. The measurement apparatus and measurement conditions are the same as described above.

(5) Composition analysis of the gas barrier layer The composition analysis of the gas barrier layer (whether the gas barrier layer contains zinc oxide, silicon dioxide, aluminum oxide and the content ratio of each element) is performed by X-ray photoelectron spectroscopy (XPS method). It was. That is, after removing the outermost layer by etching about 5 nm by sputter etching using argon ions, the content ratio of each element was measured. The measurement conditions of the XPS method are as follows.
・ Equipment: ESCA 5800 (manufactured by ULVAC-PHI)
Excitation X-ray: monochromic AlKα
・ X-ray output: 300W
-X-ray diameter: 800 μm
-Photoelectron escape angle: 45 °
Ar ion etching: 2.0 kV, 10 mPa.

(6) Thickness of each layer Using a microsampling system (Hitachi FB-2000A) for the sample for observing the cross section of the transfer film by the FIB method (specifically, “Polymer Surface Processing” (by Atsushi Iwamori) p 119-119)). Using a transmission electron microscope (Hitachi H-9000UHRII), the cross section of the sample for cross section observation was observed at an acceleration voltage of 300 kV, and each layer such as an undercoat layer, a gas barrier layer, a release film release layer, and a sealing resin layer The thickness of was measured.

(7) Measurement of surface roughness (Ra) measured by atomic force microscope of undercoat layer The surface roughness (Ra) of the undercoat layer was measured using an atomic force microscope “AFM5100N” manufactured by Hitachi High-Tech Science, Measurement was performed under the following conditions.
・ Scanning mode: DFM
・ Scanning range: 5μm × 5μm
-Number of data: 256 x 256
Measurement environment: 25 ° C. in the atmosphere.

(8) Flexibility test by cylindrical mandrel method In accordance with the cylindrical mandrel method (JIS K5600-5-1: 1999), the transfer film has a gas barrier layer side on the outside of a cylindrical mandrel with a diameter of 2 mm to 5 mm. (Make the release film come into contact with the cylindrical mandrel) and visually observe whether or not there are cracks in the wound part, check the minimum diameter of the mandrel where cracks do not occur, and evaluate according to the following criteria did.

A: Minimum diameter of 2 mm (diameter of 2 mm and no cracks are generated).

B: Minimum diameter 3 mm (cracks occur at a diameter of 2 mm, but no crack occurs at a diameter of 3 mm).

C: Minimum diameter of 4 mm (crack occurs at a diameter of 3 mm, but no crack occurs at a diameter of 4 mm).

D: Minimum diameter 5 mm (cracks occur at a diameter of 4 mm, but no cracks occur at a diameter of 5 mm).

E: Minimum diameter exceeds 5 mm (cracks occur at a diameter of 5 mm).

[Production of release film]
<Release film 1>
On the smooth surface side of a biaxially stretched polyethylene terephthalate film having a thickness of 38 μm (“Lumirror (registered trademark)” “R80” manufactured by Toray Industries, Inc.), the following release layer coating solution p1 was applied with a gravure coater, and 100 After preliminary drying at 0 ° C., the product was dried by heating at 160 ° C. to laminate a release layer. The thickness of the release layer was 100 nm.

<Release layer coating solution p1>
45 parts by mass of a curable silicone resin (“KS-3703” from Shin-Etsu Chemical Co., Ltd.), 5 parts by mass of a release force modifier (“KS-3800” from Shin-Etsu Chemical Co., Ltd.), a curing agent (Shin-Etsu Chemical Co., Ltd.) A release layer coating solution was prepared by mixing 1 part by mass of a platinum catalyst “PL-50T” from Co., Ltd. and 100 parts by mass of a toluene / MEK (50/50) mixture.

<Release film 2>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that the release layer coating liquid p2 was changed to the following.

<Release layer coating solution p2>
40 parts by mass of a curable silicone resin (“KS-3703” from Shin-Etsu Chemical Co., Ltd.), 10 parts by mass of a release force regulator (“KS-3800” from Shin-Etsu Chemical Co., Ltd.), a curing agent (Shin-Etsu Chemical Co., Ltd.) A release layer coating solution was prepared by mixing 1 part by mass of a platinum catalyst “PL-50T” from Co., Ltd. and 100 parts by mass of a toluene / MEK (50/50) mixture.

<Release film 3>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that it was changed to the following release layer coating liquid p3.

<Release layer coating solution p3>
35 parts by mass of a curable silicone resin (“KS-3703” from Shin-Etsu Chemical Co., Ltd.), 25 parts by mass of a release force modifier (“KS-3800” from Shin-Etsu Chemical Co., Ltd.), a curing agent (Shin-Etsu Chemical Co., Ltd.) A release layer coating solution was prepared by mixing 1 part by mass of a platinum catalyst “PL-50T” from Co., Ltd. and 100 parts by mass of a toluene / MEK (50/50) mixture.

<Release film 4>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that it was changed to the following release layer coating solution p4.

<Release layer coating solution p4>
10 parts by mass of curable silicone resin (“X-62-5039” from Shin-Etsu Chemical Co., Ltd.), 0.4 parts by mass of curable silicone resin (“X-92-185” from Shin-Etsu Chemical Co., Ltd.) 10 parts by weight of a peeling force adjusting agent (“KS-3800” from Shin-Etsu Chemical Co., Ltd.), 1 part by weight of a curing agent (platinum catalyst “PL-5000” from Shin-Etsu Chemical Co., Ltd.), toluene / MEK (50 / 50) A release layer coating solution in which 200 parts by mass of the mixed solution was mixed was prepared.

<Release film 5>
The following anchor layer coating solution was applied with a gravure coater to the smooth surface side of a biaxially stretched polyethylene terephthalate film having a thickness of 38 μm (“Lumirror (registered trademark)” “R80” manufactured by Toray Industries, Inc.) After drying and heating, the following release layer coating solution p5 was applied with a gravure coater, preliminarily dried at 100 ° C., and then heated and dried at 160 ° C. to laminate a release layer. The anchor layer had a thickness of 50 nm, and the release layer had a thickness of 100 nm.

<Anchor layer coating solution>
5 parts by mass of BY24-846B (Toray Dow Corning Co., Ltd.) which is an epoxy group-containing organosilicon compound, BY24-846C (Toray Dow Corning Co., Ltd.) which is a methacryl group-containing organosilicon compound, aluminum chelate An anchor layer coating solution was prepared by mixing 1 part by mass of BY24-846D (Toray Dow Corning Co., Ltd.) and 100 parts by mass of a toluene / MEK (50/50) mixture.

<Release layer coating solution p5>
20 parts by mass of an alkyd-modified silicone resin (“X-62-900B” from Shin-Etsu Chemical Co., Ltd.), 0.25 mass by para-toluenesulfonic acid (“CAT-PS-80” from Shin-Etsu Chemical Co., Ltd.) as an acid catalyst As a diluent solvent, 30 parts by mass of MEK and 50 parts by mass of toluene were mixed to prepare a release layer coating solution.

<Release film 6>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that it was changed to the following release layer coating liquid p6.

<Release layer coating solution p6>
10 parts by mass of curable silicone resin (“X-62-5039” from Shin-Etsu Chemical Co., Ltd.), 0.4 parts by mass of curable silicone resin (“X-92-185” from Shin-Etsu Chemical Co., Ltd.) 15 parts by weight of a peel strength adjusting agent (“KS-3800” from Shin-Etsu Chemical Co., Ltd.), 1 part by weight of a curing agent (platinum catalyst “PL-5000” from Shin-Etsu Chemical Co., Ltd.), toluene / MEK (50 / 50) A release layer coating solution in which 200 parts by mass of the mixed solution was mixed was prepared.

<Release film 7>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that the release layer coating liquid p7 was changed to the following.

<Releasing layer coating solution p7>
A long-chain alkyl group-containing resin (“Asioresin” RA-95H from Ashio Sangyo Co., Ltd.) was dissolved in toluene to prepare a coating solution having a solid concentration of 2.0% by mass.

<Release film 8>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that it was changed to the following release layer coating liquid p8.

<Release layer coating solution p8>
23 parts by mass of a curable silicone resin (“KS-3703” from Shin-Etsu Chemical Co., Ltd.), 76 parts by mass of a release force regulator (“KS-3800” from Shin-Etsu Chemical Co., Ltd.), a curing agent (Shin-Etsu Chemical Co., Ltd.) A release layer coating solution was prepared by mixing 1 part by mass of a platinum catalyst “PL-50T” (Co., Ltd.) and 400 parts by mass of a toluene / MEK (50/50) mixture.

<Release film 9>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that it was changed to the following release layer coating liquid p9.

<Release layer coating solution p9>
17 parts by mass of a curable silicone resin (“KS-3703” from Shin-Etsu Chemical Co., Ltd.), 82 parts by mass of a release force modifier (“KS-3800” from Shin-Etsu Chemical Co., Ltd.), a curing agent (Shin-Etsu Chemical Co., Ltd.) A release layer coating solution was prepared by mixing 1 part by mass of a platinum catalyst “PL-50T” (Co., Ltd.) and 400 parts by mass of a toluene / MEK (50/50) mixture.

<Release film 10>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that it was changed to the following release layer coating liquid p10.

<Release layer coating solution p10>
10 parts by mass of a curable silicone resin (“KS847H” from Shin-Etsu Chemical Co., Ltd.), 0.05 parts by mass of a curing agent (platinum catalyst “PL-50T” from Shin-Etsu Chemical Co., Ltd.), toluene / MEK (50 / 50) A release layer coating solution in which 100 parts by mass of the mixed solution was mixed was prepared.

<Release film 11>
In the production of the release film 1, it was produced in the same manner as the release film 1 except that it was changed to the following release layer coating liquid p11.

<Release layer coating solution p11>
10 parts by weight of solid chain equivalent resin (“Pyroyl” HT from Lion Specialty Chemicals Co., Ltd.) as a release agent and a melamine-based crosslinking agent (Mitsui Chemicals Co., Ltd. 28-60) is 2.5 parts by mass in terms of solid content, p-toluenesulfonic acid (“TAYCACURE” AC-700 from Teika Co., Ltd.) as an acid catalyst is 1.8 parts by mass in terms of solid content, toluene / A release layer coating solution in which 500 parts by mass of a TEK (40/10) mixture was mixed was prepared.

[Example 1]
On the release layer of release film 1, the following undercoat layer coating solution a1 is applied with a gravure coater, dried at 90 ° C., and then irradiated with UV light at 400 mJ / cm ² to form an undercoat layer. did. The thickness of this undercoat layer was 1 μm.

<Coating liquid a1 for undercoat layer>
Dilute UV curable resin coating solution containing trifunctional urethane acrylate oligomer (“UV-7550B” from Nippon Synthetic Chemical Co., Ltd.) with organic solvent (MEK) so that the solid content is 20% by mass. did.

<Lamination of gas barrier layer>
On the undercoat layer formed as described above, a transfer film was produced by laminating a gas barrier layer to a thickness of 150 nm in the following manner.

A sputter target, which is a mixed sintered material formed of zinc oxide, silicon dioxide, and aluminum oxide, is placed on the sputter electrode 32 using the winding type sputtering / CVD apparatus 21 having the structure shown in FIG. Sputtering with gas was performed, and a gas barrier layer (not shown) was laminated on the surface of the undercoat layer (not shown) of the release film 24 on which the undercoat layer was laminated.

The specific operation is as follows. First, in a winding chamber 26 of a winding type sputtering / CVD apparatus 21 in which a sputtering target sintered with a composition ratio of zinc oxide / silicon dioxide / aluminum oxide of 77/20/3 is installed on the sputtering electrode 32. The undercoat layer (not shown) of the release film 24 in which the undercoat layer is laminated on the unwinding shaft 27 is set so that the surface of the release film 24 faces the sputter electrode 32, and unwinding and unwinding side guide rolls 28, 29 are set. , 30 and passed through the cooling drum 31. Argon gas and oxygen gas were introduced at an oxygen gas partial pressure of 10% so that the degree of decompression was 2 × 10 ⁻¹ Pa, and an argon / oxygen gas plasma was generated by applying an input power of 4000 W from a DC power source, thereby producing a gas barrier. A layer was formed. The thickness was adjusted by the film transport speed. Then, it wound around the winding shaft 36 via the winding side guide rolls 33, 34, 35.

The composition of this gas barrier layer was such that the Zn atom concentration was 27.5 atom%, the Si atom concentration was 13.1 atom%, the Al atom concentration was 2.3 atom%, and the O atom concentration was 57.1 atom%.

[Example 2]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 2 in Example 1.

[Example 3]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 3 in Example 1.

[Example 4]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 4 in Example 1.

[Example 5]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 5 in Example 1.

[Example 6]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 6 in Example 1.

[Example 7]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 7 in Example 1.

[Example 8]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 8 in Example 1.

[Example 9]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 9 in Example 1.

[Comparative Example 1]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 10 in Example 1.

[Comparative Example 2]
A transfer film was produced in the same manner as in Example 1 except that the release film 1 was changed to the release film 11 in Example 1.

[Evaluation]
The transfer films obtained in Examples 1 to 9 and Comparative Examples 1 and 2 were measured and evaluated as described above. The results are shown in Table 1.

[Examples 11 to 19 and Comparative Examples 11 to 12]
In Examples 1 to 9 and Comparative Examples 1 and 2, except that the undercoat layer coating solution was changed to the following coating solution a2 and the thickness of the undercoat layer was changed by 3 μm, Examples 1 to 9 and In the same manner as in Comparative Examples 1 and 2, an undercoat layer was laminated on the release film.

<Coating liquid a2 for undercoat layer>
An ultraviolet curable resin “Seika Beam IL-PC2” manufactured by Dainichi Seika Kogyo Co., Ltd. was diluted with an organic solvent (MEK) to a solid content concentration of 20% by mass.

<Lamination of gas barrier layer>
On the undercoat layer formed as described above, the sputtering target was made of aluminum oxide (the ratio of the number of oxygen atoms to aluminum atoms (O / Al ratio) was 1.5) using the same manufacturing apparatus as in Example 1 (FIG. 3). The film for transfer was prepared by laminating the gas barrier layer in the same manner as in Example 1 except that the thickness was changed to 200 nm and the thickness of the gas barrier layer was changed to 200 nm.

[Evaluation]
The transfer films obtained in Examples 11 to 19 and Comparative Examples 11 to 12 were measured and evaluated as described above. The results are shown in Table 2.

[Examples 21 to 29 and Comparative Examples 21 to 22]
In Examples 1 to 9 and Comparative Examples 1 and 2, the undercoat layer coating solution was changed to the following coating solution a3, and the thickness of the undercoat layer was changed to 5 μm. A transfer film was prepared in the same manner as in Comparative Examples 1 and 2.

<Coating liquid a3 for undercoat layer>
140 parts by mass of the following urethane (meth) acrylate oligomer (UA), 20 parts by mass of dipentaerythritol hexaacrylate, 5 parts by mass of a photopolymerization initiator (“Irgacure (registered trademark) 907” manufactured by Ciba Specialty Chemicals) Then, it was diluted with an organic solvent (MEK) to prepare a solid content concentration of 20% by mass.

<Synthesis of urethane (meth) acrylate oligomer (UA)>
In a four-necked flask, 3180 parts by mass of bisphenol F type diepoxy resin (manufactured by Toto Kasei Co., Ltd., trade name: Epototo YDF-8170C, epoxy equivalent: 159), acrylic acid (manufactured by Mitsubishi Chemical Corporation, trade name: (Acrylic acid) 1440 parts by mass, 4.6 parts by mass of hydroquinone monomethyl ether as a polymerization inhibitor, and 23 parts by mass of dimethylaminoethyl methacrylate (trade name: Acryester DM, manufactured by Mitsubishi Rayon Co., Ltd.) as a synthesis catalyst were stirred. The temperature was raised to 95 ° C., and the reaction was continued for 14 hours while maintaining the temperature at 95 ° C. When the acid value became 1 mgKOH / g or less, it was cooled until the internal temperature reached 60 ° C. to obtain an epoxy (meth) acrylate.

Next, 298 parts by mass of the epoxy (meth) acrylate and 711.3 parts by mass of ethyl acetate were placed in a four-necked flask and heated to an internal temperature of 60 ° C. 0.21 part by mass of di-n-butyltin dilaurate was added as a synthesis catalyst, and 199 parts by mass of methylcyclohexylene diisocyanate (manufactured by Mitsui Chemicals Polyurethanes Co., Ltd., trade name: Takenate 600) was stirred for 1 hour with stirring. And dripped. The reaction was continued for 2 hours after completion of the dropping, and then 27.3 parts by mass of diethylene glycol (a reagent manufactured by Wako Pure Chemical Industries, Ltd., trade name: diethylene glycol, molecular weight 106), pentaerythritol tetraacrylate (manufactured by Toagosei Co., Ltd.) (Product name: Aronix M-306) A mixture of 187 parts by mass was added dropwise over 1 hour. Reaction was continued for 5 hours after dripping, and the urethane (meth) acrylate oligomer (UA) with a mass average molecular weight of 19800 was obtained.

[Example 30]
In Example 21, a transfer film was produced in the same manner as in Example 21 except that the undercoat layer coating solution was changed to the following coating solution a4.

<Coating liquid a4 for undercoat layer>
95 parts by mass of dipentaerythritol hexaacrylate (“A-DPH” from Shin-Nakamura Chemical Co., Ltd.), 5 parts by mass of photopolymerization initiator (“Irgacure (registered trademark) 907” manufactured by Ciba Specialty Chemicals) Was diluted with an organic solvent (MEK) to prepare a solid concentration of 20% by mass.

[Evaluation]
The transfer films obtained in Examples 21 to 30 and Comparative Examples 21 to 22 were measured and evaluated as described above. The results are shown in Table 3.

[Examples 31 to 40 and Comparative Examples 31 to 32]
In Examples 21 to 30 and Comparative Examples 21 to 22, transfer films were produced in the same manner as in Examples 21 to 30 and Comparative Examples 21 to 22, except that the gas barrier layer was changed to the following.

<Lamination of gas barrier layer>
Using a winding-type sputtering / CVD apparatus 21 having the structure shown in FIG. 3, chemical vapor deposition (CVD) using hexamethyldisilazane as a raw material was performed, and an SiO ₂ film was laminated. The thickness of this SiO ₂ film was 200 nm.

[Evaluation]
The transfer films obtained in Examples 31 to 40 and Comparative Examples 31 to 32 were measured and evaluated as described above. The results are shown in Table 4.

[Example 41]
On the gas barrier layer of the transfer film obtained in Example 3, the following sealing resin layer coating solution was applied with a bar coater to a dry thickness of 40 μm, and dried at 110 ° C. to form a sealing resin layer. Laminated. Subsequently, a second release film (silicone release film “PET38 × 1-A3” from Nipper Co., Ltd.) was laminated on the sealing resin layer to produce a transfer film.

<Sealing resin layer>
60 parts by mass of polyisobutylene (“OPanol B100” manufactured by BASF) as a sealing resin and 40 parts by mass of an alicyclic hydrogenated petroleum resin (“Escollets 5340” manufactured by Exxon Mobil) as a tackifier resin A 15% by mass resin solution was prepared by dissolving in toluene.

[Example 42]
On the gas barrier layer of the transfer film obtained in Example 5, a sealing resin layer and a second release film were laminated in the same manner as in Example 41 to produce a transfer film.

[Example 43]
On the gas barrier layer of the transfer film obtained in Example 23, a sealing resin layer and a second release film were laminated in the same manner as in Example 41 to produce a transfer film.

[Example 44]
On the gas barrier layer of the transfer film obtained in Example 25, a sealing resin layer and a second release film were laminated in the same manner as in Example 41 to produce a transfer film.

[Evaluation]
The transfer films obtained in Examples 41 to 44 were measured and evaluated as described above. The results are shown in Table 5.

DESCRIPTION OF SYMBOLS 1 Release film 2 Undercoat layer 3 Gas barrier layer 4 Sealing resin layer 5 2nd release film 10 Transfer film 11 Substrate 12 Organic EL element 13 Sealing resin layer 21 Rewind-type sputtering and CVD apparatus 24 Undercoat layer Laminated release film 26 Winding chamber 27 Unwinding shaft 28, 29, 30 Unwinding side guide roll 31 Cooling drum 32 Sputtering electrode or CVD electrode 33, 34, 35 Winding side guide roll 36 Winding shaft

Claims (12)

1. It has a gas barrier laminate film including an undercoat layer and a gas barrier layer in this order on the release film, and the peel force between the release film and the undercoat layer is in the range of 15 to 700 mN / 18 mm. , Transfer film for gas barrier laminate film.
2. The transfer film for a gas barrier laminate film according to claim 1, wherein the water vapor permeability of the gas barrier laminate film is less than 0.1 g / m ² / day.
3. The gas barrier laminate film transfer film according to claim 1 or 2, wherein the undercoat layer is a thermosetting resin layer or an active energy ray curable resin layer.
4. The gas barrier laminate film transfer according to any one of claims 1 to 3, wherein a surface roughness (Ra) measured by an atomic force microscope of a surface of the undercoat layer on the gas barrier layer side is less than 2.0 nm. Film.
5. The film for transfer of a gas barrier laminate film according to any one of claims 1 to 4, wherein the gas barrier layer contains at least zinc oxide and silicon oxide.
6. 6. The transfer film for a gas barrier laminate film according to claim 1, wherein the gas barrier layer is a layer containing zinc oxide, silicon dioxide and aluminum oxide.
7. 7. The gas barrier layer according to claim 6, wherein the Zn atom concentration is 10 to 40 atom%, the Si atom concentration is 5 to 20 atom%, the Al atom concentration is 0.5 to 5 atom%, and the O atom concentration is 35 to 70 atom%. A film for transferring a gas barrier laminate film.
8. The gas barrier laminate film transfer film according to any one of claims 1 to 7, wherein the gas barrier laminate film comprises an undercoat layer, a gas barrier layer, and a sealing resin layer in this order.
9. The sealing resin layer is used as a sealing resin, such as polyisobutylene, butyl rubber, polyisoprene, styrene-isobutylene modified resin, styrene-isoprene-styrene block copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene rubber. 9. The transfer film for a gas barrier laminate film according to claim 8, comprising at least one resin selected from the group consisting of polybutadiene rubber, styrene-butadiene rubber, and polybutene, and a tackifying resin.
10. The transfer film for a gas barrier laminate film according to claim 8 or 9, wherein the transfer resin layer has a second release film on a surface that is not on the gas barrier layer side of the sealing resin layer.
11. The gas barrier laminate film according to any one of claims 1 to 10, wherein a minimum mandrel diameter at which cracks do not occur is 4 mm in a flexibility test in accordance with a cylindrical mandrel method (JIS K5600-5: 1: 1999). Transfer film.
12. 12. An organic EL device comprising a gas barrier laminate film of the gas barrier laminate film transfer film according to claim 1 deposited on an organic EL element.
    

Images