WO2020134354A1 - 扬声器模组 - Google Patents
扬声器模组 Download PDFInfo
- Publication number
- WO2020134354A1 WO2020134354A1 PCT/CN2019/110719 CN2019110719W WO2020134354A1 WO 2020134354 A1 WO2020134354 A1 WO 2020134354A1 CN 2019110719 W CN2019110719 W CN 2019110719W WO 2020134354 A1 WO2020134354 A1 WO 2020134354A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cover
- sound
- upper cover
- sink
- speaker module
- Prior art date
Links
- 238000004891 communication Methods 0.000 claims abstract description 3
- 238000010521 absorption reaction Methods 0.000 claims abstract 5
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 239000011358 absorbing material Substances 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
- H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Definitions
- the invention relates to the field of electro-acoustic conversion, in particular to a speaker module.
- the related-art speaker module includes a housing with a receiving space, a speaker unit installed in the receiving space, and a sound absorbing cover. By arranging the sound absorbing cover, particles-like attracting materials are placed in the sound absorbing cover. The acoustic performance of the speaker module is greatly enhanced.
- the sound-absorbing hood is often directly connected to the housing, resulting in the side of the sound-absorbing hood connected to the housing being impermeable to air, thereby causing the speaker Group loss of acoustic performance.
- the technical problem to be solved by the present invention is to provide a speaker module with better acoustic performance.
- the present invention provides a speaker module including a housing with a receiving space and a speaker unit installed in the receiving space, the speaker unit dividing the receiving space into a front cavity
- the rear cavity opposite to the front cavity also includes a sound absorbing housing accommodated in the rear cavity and fixedly connected to the housing, and a connection surface between the housing and the sound absorbing housing is provided with the sound absorbing housing
- the sink communicates with the rear cavity, and the surface of the sound absorbing cover opposite to the sink is a breathable surface.
- the housing includes an upper cover and a base that is assembled with the upper cover to form the receiving space, the sink is provided on the base, and the base includes a bottom wall opposite to the upper cover, The sink is recessed from a surface of the bottom wall close to the upper cover in a direction away from the upper cover.
- the sink has a rectangular shape, and the sink includes a slot bottom and four bosses extending from a corner of the slot bottom toward the upper cover, The boss is fixedly connected.
- the surface of the boss away from the bottom of the groove is on the same plane as the surface of the bottom wall close to the upper cover, and the orthographic projection of the sound absorbing cover toward the upper cover is wrapped in the direction of the sink In the orthographic projection of the upper cover.
- the sound absorbing cover is glued to the boss.
- the base further includes four side walls connecting the bottom wall and the upper cover, the surfaces of the sound absorbing cover opposite to the four side walls are all spaced apart from the side walls, and the The surfaces of the sound-absorbing cover opposite to the side walls are all breathable surfaces.
- the surface of the sound absorbing cover opposite to the upper cover is a breathable surface, and is spaced apart from the upper cover.
- the internal space of the sound-absorbing cover is filled with sound-absorbing material.
- the sound-absorbing cover is formed by hot pressing.
- the speaker module of the present invention is provided with a sink groove opposite to the sound absorbing cover on the connecting surface of the casing and the sound absorbing cover, the sink groove communicating with the rear cavity, and
- the surface of the sound absorbing cover opposite to the sink is set as a breathable surface, so that the sound can penetrate through the surface of the sound absorbing cover and the housing, which strengthens the sound absorbing cover and the speaker alone Improve the acoustic performance of the speaker module; by setting the other surfaces of the sound-absorbing hood as ventilation surfaces, and setting them opposite to the side wall and the upper cover, respectively, to achieve six sound-absorbing hoods
- the surface breathable structure greatly enhances the breathability of the sound absorbing cover and improves the acoustic performance of the speaker module.
- FIG. 1 is a three-dimensional schematic diagram of a speaker module provided by the present invention
- FIG. 2 is a cross-sectional view of the speaker module shown in FIG. 1 along line A-A;
- FIG. 3 is a three-dimensional schematic diagram of the speaker module shown in FIG. 1 after removing the upper cover;
- FIG. 4 is an enlarged view of part B of the speaker module shown in FIG. 3;
- FIG. 5 is an exploded schematic view of the three-dimensional structure of the speaker module shown in FIG. 1;
- FIG. 6 is an enlarged view of part C of the speaker module shown in FIG. 5.
- the present invention provides a speaker module 100 including a housing 10 with a receiving space 101, a speaker unit 30 installed in the receiving space 101, and Absorbing cover 50.
- the speaker unit 30 divides the accommodating space 101 into a front cavity 102 and a rear cavity 103 opposite to the front cavity 102, and the sound absorbing hood 50 is accommodated in the rear cavity 103 and connected with the housing 10 Fixed connection.
- the housing 10 includes an upper cover 11 and a base 13 that is combined with the upper cover 11 to form the receiving space.
- the connecting surface of the casing 10 and the sound absorbing cover 50 is provided with a sink 70 opposite to the sound absorbing cover 50.
- the sink 70 communicates with the rear cavity 103, and the sound absorbing cover 50 and the The opposite surface of the sink 70 is a ventilation surface.
- the sound absorbing cover 50 may be fixedly connected to the upper cover 11 or the base 13, that is, the sink
- the groove 70 may be provided in the upper cover 11 or the base 13.
- the sink 70 is provided on the base 13, and the sound absorbing cover 50 is fixedly connected to the base 13 as an example.
- the base 13 includes a bottom wall 131 opposite to the upper cover 11 and four side walls 133 connecting the upper cover 11 and the bottom wall 131.
- the sink 70 is recessed from the surface of the bottom wall 131 close to the upper cover 11 in a direction away from the upper cover 11.
- the sink 70 is rectangular. Specifically, the sink 70 includes a groove bottom 71 and four bosses 73 extending from a corner of the groove bottom 71 toward the upper cover 11, the sound absorbing cover 50 and the four protrusions Table 73 is fixedly connected.
- the sound absorbing cover 50 Since the sound absorbing cover 50 is fixedly connected to the boss 73, the sound absorbing cover 50 is spaced from the groove bottom 71 to form an accommodation space. Further, the orthographic projection of the sound absorbing cover 50 toward the upper cover 11 is wrapped in the orthographic projection of the sink 70 toward the upper cover 11. In this way, the communication between the accommodating space and the rear cavity 103 is ensured, so that sound can penetrate through the surface of the sound-absorbing hood 50 connected to the housing 10, which strengthens the sound-absorbing hood 50 and the speaker The connection of the monomers 30 improves the acoustic performance of the speaker module 100.
- the surface of the boss 73 away from the groove bottom 71 is on the same plane as the surface of the bottom wall 131 near the upper cover 11.
- the sound absorbing cover 50 is glued to the boss 73.
- the surfaces of the sound absorbing cover 50 and the four side walls 133 are spaced apart from the side walls 133, and the sound absorbing cover 50 is opposite to the side walls 133
- the surfaces are all breathable.
- the surface of the sound absorbing cover 50 opposite to the bottom wall 131 realizes a five-sided ventilation structure of the sound absorbing cover 50, which further strengthens the connection between the sound absorbing cover 50 and the speaker unit 30 , The acoustic performance of the speaker module 100 is improved.
- the surface of the sound absorbing cover 50 opposite to the upper cover 11 is a breathable surface, and is spaced apart from the upper cover 11. It is arranged in this way to form a six-sided ventilation structure of the sound absorbing cover 50.
- the sound generated by the speaker unit 30 can enter the sound absorbing hood 50 through each surface of the sound absorbing hood 50, thereby maximizing the acoustic performance of the speaker module 100.
- the sound absorbing cover 50 is formed by hot pressing. And the sound absorbing cover 50 is filled with a suction material to enhance the suction effect of the sound absorbing cover 50.
- the speaker module 100 of the present invention is provided with a sink 70 opposed to the sound absorbing cover 50 on the connecting surface of the housing 10 and the sound absorbing cover 50.
- the sink 70 and all The rear cavity 103 communicates, and the surface of the sound absorbing cover 50 and the sink 70 is set as a breathable surface, so that the sound can penetrate through the surface of the sound absorbing cover 50 and the housing 10, which strengthens
- the connection between the sound-absorbing cover 50 and the speaker unit 30 improves the acoustic performance of the speaker module 100; by setting the other surfaces of the sound-absorbing cover 50 as breathable surfaces, respectively, and the side walls
- the relative arrangement of 133 and the upper cover 11 realizes the six-sided ventilation structure of the sound absorbing cover 50, which greatly enhances the air permeability of the sound absorbing cover 50 and improves the acoustic performance of the speaker module 100.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
本发明提供了一种扬声器模组,包括具收容空间的壳体和安装于所述收容空间中的扬声器单体,所述扬声器单体将所述收容空间分隔成前腔和与所述前腔相对的后腔,还包括收容于所述后腔并与所述壳体固定连接的吸音罩,所述壳体与所述吸音罩的连接面设置有与所述吸音罩相对的沉槽,所述沉槽与所述后腔连通,所述吸音罩与所述沉槽相对的表面为透气面。与相关技术相比,本发明提供的扬声器模组声学性能更优。
Description
本发明涉及电声转换领域,尤其涉及一种扬声器模组。
近年来,信息科技迅猛发展,尤其是无线移动通信技术,越来越多的移动电子设备出现在人们的日常生活中,如智能手机、平板电脑、笔记本电脑及多功能媒体播放器已成为人们生活中的必备用品。而扬声器模组作为语音播放装置成为上述移动电子设备的核心组件,其性能将直接影响整个设备的性能。
相关技术的扬声器模组包括具收容空间的壳体、安装于所述收容空间中的扬声器单体和吸音罩,通过设置所述吸音罩,因所述吸音罩内放置有颗粒类吸引材料,在极大程度上加强了所述扬声器模组的声学性能。
然而,相关技术的扬声器模组在安装所述吸音罩时,所述吸音罩往往与所述壳体直接连接,从而导致所述吸音罩与壳体连接的侧面无法透气,进而导致所述扬声器模组声学性能的损失。
因此,有必要提供一种新的扬声器模组来解决上述问题。
本发明要解决的技术问题是提供一种声学性能更优的扬声器模组。
为解决上述技术问题,本发明提供了一种扬声器模组,包括具收容空间的壳体和安装于所述收容空间内的扬声器单体,所述扬声器单体将所述收容空间分隔成前腔和与所述前腔相对的后腔,还包括收容于所述后腔并与所述壳体固定连接的吸音罩,所述壳体与所述吸音罩的连接面设置有与所述吸音罩相对的沉槽,所述沉槽与所述后腔连通,所述吸音罩与所述沉槽相对的表面为透气面。
优选的,所述壳体包括上盖及与所述上盖组配形成所述收容空间的底座,所述沉槽设置于所述底座,所述底座包括与所述上盖相对的底壁,所述沉槽自所述底壁靠近所述上盖的表面向远离所述上盖方向凹陷形成。
优选的,所述沉槽呈矩形,所述沉槽包括槽底及自所述槽底的拐角处向靠近所述上盖的方向延伸的四个凸台,所述吸音罩与四个所述凸台固定连接。
优选的,所述凸台远离所述槽底的表面与所述底壁靠近所述上盖的表面处于同一平面,且所述吸音罩向所述上盖的正投影包裹于所述沉槽向所述上盖的正投影内。
优选的,所述吸音罩与所述凸台胶接。
优选的,所述底座还包括连接所述底壁和所述上盖的四个侧壁,所述吸音罩与四个所述侧壁相对的表面均与所述侧壁间隔设置,且所述吸音罩与所述侧壁相对的表面均为透气面。
优选的,所述吸音罩与所述上盖相对的表面为透气面,且与所述上盖间隔设置。
优选的,所述吸音罩的内部空间填充吸音材料。
优选的,所述吸音罩通过热压成型。
与相关技术相比,本发明的扬声器模组,通过在所述壳体与所述吸音罩的连接面设置与所述吸音罩相对的沉槽,所述沉槽与所述后腔连通,并将所述吸音罩与所述沉槽相对的表面设置为透气面,使得声音能够通过所述吸音罩与所述壳体连接的表面透入,加强了所述吸音罩与所述扬声器单体的联系,提升了所述扬声器模组的声学性能;通过将所述吸音罩的其他表面均设置为透气面,并分别与所述侧壁及所述上盖相对设置,实现所述吸音罩的六面透气结构,极大的增强了所述吸音罩的透气性,提升了所述扬声器模组的声学性能。
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图,其中:
图1为本发明提供的扬声器模组的立体结构示意图;
图2为图1所示的扬声器模组沿A-A线的剖视图;
图3为图1所示的扬声器模组去除上盖后的立体结构示意图;
图4为图3所示的扬声器模组的B部分放大图;
图5为图1所示的扬声器模组的立体结构分解示意图;
图6为图5所示的扬声器模组的C部分放大图。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
请结合参阅图1至图6,本发明提供了一种扬声器模组100,所述扬声器模组100包括具收容空间101的壳体10、安装于所述收容空间101中的扬声器单体30及吸音罩50。其中,所述扬声器单体30将所述收容空间101分隔成前腔102和与所述前腔102相对的后腔103,所述吸音罩50收容于所述后腔103并与所述壳体10固定连接。
所述壳体10包括上盖11及与所述上盖11组配形成所述收容空间的底座13。所述壳体10与所述吸音罩50的连接面设置有与所述吸音罩50相对的沉槽70,所述沉槽70与所述后腔103连通,且所述吸音罩50与所述沉槽70相对的表面为透气面。
需要说明的是,在保证所述沉槽70与所述后腔103连通的情况下,所述吸音罩50可以与所述上盖11或所述底座13固定连接,也就是说,所述沉槽70可以设置于所述上盖11或所述底座13。在本实施方式中,以所述沉槽70设置于所述底座13,所述吸音罩50与所述底座13固定连接为例进行描述。
具体的,所述底座13包括与所述上盖11相对的底壁131及连接所述上盖11和所述底壁131的四个侧壁133。所述沉槽70自所述底壁131靠近所述上盖11的表面向远离所述上盖11方向凹陷形成。
所述沉槽70呈矩形。具体的,所述沉槽70包括槽底71及自所述槽底71的拐角处向靠近所述上盖11的方向延伸的四个凸台73,所述吸音罩50与四个所述凸台73固定连接。
因所述吸音罩50与所述凸台73固定连接,则所述吸音罩50与所述槽底71间隔设置形成有容纳空间。进一步的,所述吸音罩50向所述上盖11的正投影包裹于所述沉槽70向所述上盖11的正投影内。如此设置,保证了所述容纳空间与所述后腔103的连通,使得声音能够通过所述吸音罩50与所述壳体10连接的表面透入,加强了所述吸音罩50与所述扬声器单体30的联系,提升了所述扬声器模组100的声学性能。
优选的,在本实施方式中,所述凸台73远离所述槽底71的表面与所述底壁131靠近所述上盖11的表面处于同一平面。
具体的,所述吸音罩50与所述凸台73胶接。
更优选的,在本实施方式中,所述吸音罩50与四个所述侧壁133相对的表面均与所述侧壁133间隔设置,且所述吸音罩50与所述侧壁133相对的表面均为透气面。如此设置,加上所述吸音罩50与所述底壁131相对的表面,实现了所述吸音罩50的五面透气结构,进一步加强了所述吸音罩50与所述扬声器单体30的联系,提升了所述扬声器模组100的声学性能。
更优选的,所述吸音罩50与所述上盖11相对的表面为透气面,且与所述上盖11间隔设置。如此设置以形成所述吸音罩50的六面透气结构。使得所述扬声器单体30产生的声音可以通过所述吸音罩50的各个表面进入所述吸音罩50,在最大程度上提升了所述扬声器模组100的声学性能。
具体的,所述吸音罩50通过热压成型。且在所述吸音罩50的内部填充有吸引材料以加强所述吸音罩50的吸引效果。
与相关技术相比,本发明的扬声器模组100,通过在所述壳体10与所述吸音罩50的连接面设置与所述吸音罩50相对的沉槽70,所述沉槽70与所述后腔103连通,并将所述吸音罩50与所述沉槽70相对的表面设置为透气面,使得声音能够通过所述吸音罩50与所述壳体10连接的表面透入,加强了所述吸音罩50与所述扬声器单体30的联系,提升了所述扬声器模组100的声学性能;通过将所述吸音罩50的其他表面均设置为透气面,并分别与所述侧壁133及所述上盖11相对设置,实现所述吸音罩50的六面透气结构,极大的增强了所述吸音罩50的透气性,提升了所述扬声器模组100的声学性能。
以上所述的仅是本发明的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出改进,但这些均属于本发明的保护范围。
Claims (9)
- 一种扬声器模组,包括具收容空间的壳体和安装于所述收容空间内的扬声器单体,所述扬声器单体将所述收容空间分隔成前腔和与所述前腔相对的后腔,其特征在于,还包括收容于所述后腔并与所述壳体固定连接的吸音罩,所述壳体与所述吸音罩的连接面设置有与所述吸音罩相对的沉槽,所述沉槽与所述后腔连通,所述吸音罩与所述沉槽相对的表面为透气面。
- 根据权利要求1所述的扬声器模组,其特征在于,所述壳体包括上盖及与所述上盖组配形成所述收容空间的底座,所述沉槽设置于所述底座,所述底座包括与所述上盖相对的底壁,所述沉槽自所述底壁靠近所述上盖的表面向远离所述上盖方向凹陷形成。
- 根据权利要求2所述的扬声器模组,其特征在于,所述沉槽呈矩形,所述沉槽包括槽底及自所述槽底的拐角处向靠近所述上盖的方向延伸的四个凸台,所述吸音罩与四个所述凸台固定连接。
- 根据权利要求3所述的扬声器模组,其特征在于,所述凸台远离所述槽底的表面与所述底壁靠近所述上盖的表面处于同一平面,且所述吸音罩向所述上盖的正投影包裹于所述沉槽向所述上盖的正投影内。
- 根据权利要求3所述的扬声器模组,其特征在于,所述吸音罩与所述凸台胶接。
- 根据权利要求2所述的扬声器模组,其特征在于,所述底座还包括连接所述底壁和所述上盖的四个侧壁,所述吸音罩与四个所述侧壁相对的表面均与所述侧壁间隔设置,且所述吸音罩与所述侧壁相对的表面均为透气面。
- 根据权利要求6所述的扬声器模组,其特征在于,所述吸音罩与所述上盖相对的表面为透气面,且与所述上盖间隔设置。
- 根据权利要求1~7任一项所述的扬声器模组,其特征在于,所述吸音罩的内部空间填充吸音材料。
- 根据权利要求1~7任一项所述的扬声器模组,其特征在于,所述吸音罩通过热压成型。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160302000A1 (en) * | 2015-04-10 | 2016-10-13 | Haebora Co., Ltd. | Earset |
CN206302557U (zh) * | 2016-11-18 | 2017-07-04 | 歌尔科技有限公司 | 扬声器模组 |
CN107147979A (zh) * | 2017-06-02 | 2017-09-08 | 歌尔股份有限公司 | 扬声器模组 |
CN109831725A (zh) * | 2018-12-27 | 2019-05-31 | 瑞声科技(新加坡)有限公司 | 扬声器模组 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005099300A1 (ja) * | 2004-03-31 | 2005-10-20 | Matsushita Electric Industrial Co., Ltd. | スピーカ装置 |
JPWO2006022199A1 (ja) * | 2004-08-23 | 2008-05-08 | 松下電器産業株式会社 | スピーカ装置 |
JP2008160230A (ja) * | 2006-12-21 | 2008-07-10 | Victor Co Of Japan Ltd | スピーカシステム |
CN104219607B (zh) * | 2014-09-01 | 2017-01-11 | 歌尔股份有限公司 | 扬声器模组 |
CN204217107U (zh) * | 2014-11-05 | 2015-03-18 | 瑞声光电科技(常州)有限公司 | 扬声器箱 |
JP2016171537A (ja) * | 2015-03-15 | 2016-09-23 | 哲男 古本 | 音響装置 |
US9615165B2 (en) * | 2015-08-07 | 2017-04-04 | Sound Solutions International Co., Ltd. | Loudspeaker device having foam insert to improve gas distribution in sound adsorber material |
CN105657615B (zh) * | 2016-03-28 | 2019-06-25 | 歌尔股份有限公司 | 扬声器模组 |
CN105828262B (zh) * | 2016-04-28 | 2019-09-27 | 歌尔股份有限公司 | 用于扬声器的含通气槽结构的封装吸音组件 |
CN205987346U (zh) * | 2016-07-27 | 2017-02-22 | 歌尔股份有限公司 | 扬声器模组 |
CN206149491U (zh) * | 2016-10-26 | 2017-05-03 | 瑞声科技(沭阳)有限公司 | 扬声器箱 |
CN206341395U (zh) * | 2016-10-26 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | 扬声器箱 |
CN206422906U (zh) * | 2017-01-24 | 2017-08-18 | 歌尔科技有限公司 | 吸音组件及设有该吸音组件的扬声器模组 |
CN207869334U (zh) * | 2017-12-22 | 2018-09-14 | 歌尔科技有限公司 | 一种吸音颗粒的封装结构及扬声器模组 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160302000A1 (en) * | 2015-04-10 | 2016-10-13 | Haebora Co., Ltd. | Earset |
CN206302557U (zh) * | 2016-11-18 | 2017-07-04 | 歌尔科技有限公司 | 扬声器模组 |
CN107147979A (zh) * | 2017-06-02 | 2017-09-08 | 歌尔股份有限公司 | 扬声器模组 |
CN109831725A (zh) * | 2018-12-27 | 2019-05-31 | 瑞声科技(新加坡)有限公司 | 扬声器模组 |
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