WO2020124810A1 - 柔性显示屏及其制作方法 - Google Patents

柔性显示屏及其制作方法 Download PDF

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Publication number
WO2020124810A1
WO2020124810A1 PCT/CN2019/077988 CN2019077988W WO2020124810A1 WO 2020124810 A1 WO2020124810 A1 WO 2020124810A1 CN 2019077988 W CN2019077988 W CN 2019077988W WO 2020124810 A1 WO2020124810 A1 WO 2020124810A1
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Prior art keywords
area
substrate
display screen
flexible display
flexible
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English (en)
French (fr)
Inventor
尹炳坤
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US16/469,159 priority Critical patent/US11054683B2/en
Publication of WO2020124810A1 publication Critical patent/WO2020124810A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Definitions

  • the invention relates to the field of display technology, in particular to a flexible display screen and a manufacturing method thereof.
  • Flexible display is a new field in display technology. Flexible displays have many advantages, such as light weight, small size, thinness, easy to carry, impact resistance, and wider working environment.
  • the flexible display has many advantages such as those mentioned above, when manufacturing a flexible display, an integrated circuit (IC) must be pasted to a pad of a flexible substrate. Since the flexible substrate has a larger coefficient of thermal expansion than the glass substrate, in the manufacture of flexible displays, integrated circuits (integrated) due to the thermal expansion and contraction of the pads of the flexible substrate circuit, IC) is a major challenge.
  • IC integrated circuit
  • the present invention proposes a flexible display screen, including:
  • the display area has a flexible substrate for displaying images; the sticking area has a hard substrate with solder pads for sticking chips, the solder pads are formed on the hard substrate; and the transition area, A rigid substrate covered with a flexible substrate, between the display area and the adhesive area; wherein, the flexible substrate extending from the display area overlies the rigid substrate in the transition area .
  • the display area further includes a color filter, a liquid crystal, a metal layer, and a buffer layer.
  • a buffer layer is included between the bonding pad and the rigid substrate.
  • the transition zone further includes a buffer layer and a metal layer.
  • the area of the pasting area is between 1/6 and 1/10 of the area of the display area.
  • the substrate of the display area is composed of polyimide (PI).
  • the substrate of the sticking area is a glass substrate.
  • the invention further proposes a method for manufacturing the flexible display screen, which is characterized by comprising:
  • thermosetting polymer Provides a glass substrate, and coat the glass substrate with a thermosetting polymer, and cure the above thermosetting polymer into a solid film by baking; remove the solid film as the surface of the sticking area to expose the surface of the glass substrate below; in the solid state A buffer layer is formed on the film and the glass substrate from which the solid film has been removed; a metal layer is formed on the buffer layer; solder pads and metal wires are formed on the adhesion area of the metal layer; after the panel unit is bonded and cut Affixing the chip to the bonding pad of the affixing area; and removing the glass substrate outside the affixing area and the transition area.
  • the solid film removed as the surface of the sticking area is removed by dry etching (dry etch) or laser lift off (laser lift off).
  • the buffer layer is chemical vapor deposited (chemical vapor Deposition, CVD) means.
  • the metal layer is formed by physical vapor deposition (physical vapor deposition) deposition, PVD) means.
  • the removal of the glass substrate other than the sticking area and the transition area is implemented by at least one means of laser cutting, cutter wheel cutting, and splitting.
  • the present invention further proposes a flexible display screen, including: a display area with a flexible substrate for displaying images, the display area includes a color filter, a liquid crystal, a metal layer, and a buffer layer; the sticking area has rigidity
  • the substrate is provided with bonding pads for pasting chips, the bonding pads are formed on the rigid substrate, and the buffer layer is included between the bonding pads and the rigid substrate; and the transition area has an overlay
  • the rigid substrate of the flexible substrate is between the display area and the adhesion area, and the transition area includes the buffer layer and the metal layer; wherein, the flexible substrate extending from the display area is at the transition The region covers the rigid substrate.
  • the area of the pasting area is between 1/6 and 1/10 of the area of the display area.
  • the flexible substrate is composed of polyimide (PI).
  • the rigid substrate is a glass substrate.
  • the flexible display screen manufactured by the method of the present invention combines the advantages of a flexible substrate and a rigid substrate, and has the characteristics of bendability and a lower thermal expansion coefficient of the chip bonding area, which can solve the problem of using only a flexible substrate
  • Flexible display screen due to the high thermal expansion coefficient of the chip's bonding area, has integrated circuits due to thermal expansion and contraction (integrated circuit, IC) sticking problem.
  • FIG. 1 is a schematic diagram of the area configuration of a flexible display screen according to a preferred embodiment of the present invention
  • Figure 2 is a flowchart of a method for manufacturing a flexible display screen according to a preferred embodiment of the present invention
  • FIG. 3 is a schematic cross-sectional view of the film structure of steps S1 and S2 of a flexible display screen according to a preferred embodiment of the present invention
  • step S3 of the flexible display screen is a schematic cross-sectional view of the film structure of step S3 of the flexible display screen according to the preferred embodiment of the present invention.
  • step S4 of the flexible display screen manufacturing process is a schematic cross-sectional view of the film structure in step S4 of the flexible display screen manufacturing process according to the preferred embodiment of the present invention.
  • step S5 of the flexible display screen is a schematic cross-sectional view of the film structure of step S5 of the flexible display screen according to the preferred embodiment of the present invention.
  • step S6 of the flexible display screen is a schematic cross-sectional view of the film structure of step S6 of the flexible display screen according to the preferred embodiment of the present invention.
  • step S7 of the flexible display screen is a schematic cross-sectional view of the film structure of step S7 of the flexible display screen according to the preferred embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of the film structure in step S8 of the flexible display screen according to the preferred embodiment of the present invention.
  • the present invention provides a flexible display screen 10, including:
  • the display area 20 has a flexible substrate 101 for displaying images;
  • the sticking area 40 has a rigid substrate 100 and is provided with solder pads 104 for sticking chips 105, and the solder pads 104 are formed on the hard substrate On the buffer layer 102 of the bottom 100;
  • the transition area 30 has a rigid substrate 100 covered with a flexible substrate 101, between the display area 20 and the adhesive area 40;
  • the flexible substrate 101 extending from the display area 20 covers the rigid substrate 100 in the transition area 30.
  • the display area 20 further includes a color filter 80, a liquid crystal 90, a metal layer 103, and a buffer layer 102.
  • a buffer layer 102 is included between the bonding pad 104 on the adhesive area 40 and the rigid substrate 100.
  • the transition area 30 further includes a buffer layer 102 and a metal layer 103.
  • the area of the pasting area 40 is preferably between 1/6 and 1/10 of the area of the display area 20.
  • the present invention also proposes a method for manufacturing the flexible display screen 10 shown in FIGS. 1 and 9. Details are as follows.
  • step S1 a glass substrate 100 for the Array process is provided, and a thermosetting polymer is coated on the glass substrate 100.
  • thermosetting polymer is a polyimide (PI) polymer.
  • step S2 the polyimide (PI) polymer is baked and cured into a polyimide (PI) film 101.
  • step S3 the polyimide (polyimide, which is the surface of the adhesion area is removed by dry etching (laser etch) or laser lift off (laser lift off), etc. PI)
  • the thin film 101 exposes the surface of the glass substrate 100 below it.
  • step S4 the polyimide (PI) film 101 and the surface of the glass substrate 100 from which the polyimide (PI) film has been removed are chemically Vapor deposition Deposition, CVD) means to make the buffer layer 102 preferably composed of silicon nitride or silicon oxide.
  • CVD chemically Vapor deposition Deposition
  • a metal layer 103 preferably made of indium tin oxide (ITO) is formed on the buffer layer 102 by physical vapor deposition (PVD).
  • step S6 the solder pad 104 and the metal wire 106 are formed on the metal layer 103 by means of photoresist coating, exposure, development, etching and stripping (see FIG. 1) and Other wires or electrical grades (not shown in the detailed manufacturing process).
  • the glass substrate 100 that has completed the Array process is subjected to processes such as cleaning, alignment film printing, alignment film alignment, and sealant coating (a conventional and detailed process is not shown).
  • thermosetting polymer is a polyimide (PI) polymer.
  • step S7 the glass substrate 100 and other processes that complete the Array process and subsequent cleaning, alignment film printing, alignment film alignment, sealant coating, and injection of liquid crystal 90 are also completed.
  • Cloth and baking process covered with polyimide (PI) film 99 and the color filter (color filter, After the glass substrate 200 of CF) 80 is bonded, the chip 105 is pasted onto the bonding pad 104 by a die bonder (not shown in the conventional detailed manufacturing process).
  • PI polyimide
  • step S8 the glass substrate 100 and the glass substrate 200 after precision bonding are removed by at least one means of laser cutting, cutter wheel cutting, and splitting.
  • the portions of the glass substrate 100 and the glass substrate 200 other than the adhesion area 40 and the transition area 30 are removed from the display area 20 of the glass substrate 100 and the glass substrate 200.
  • a flexible display screen combining a flexible substrate and a rigid substrate can be obtained, which has the characteristics of bendability and a lower thermal expansion coefficient of the chip bonding area, which can solve the flexible display screen using a flexible substrate, Due to the high thermal expansion coefficient of the chip's bonding area, the resulting deviation of the integrated circuit (IC) bonding caused by thermal expansion and contraction.
  • IC integrated circuit

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性显示屏及其制作方法系被提供。所述制作方法包括:提供玻璃基板,并在玻璃基板上涂布热固性聚合物；将上述热固性聚合物通过烘烤固化为固态薄膜；去除作为黏贴区表面的固态薄膜,露出其下方玻璃基板的表面；在所述固态薄膜和已去除固态薄膜的玻璃基板的表面上制作缓冲层；在所述缓冲层上制作金属层；在所述金属层的黏贴区上形成焊接垫和金属导线；完成面板的贴合及切割后，将芯片黏贴至所述黏贴区的焊接垫上；以及去除所述玻璃基板在所述黏贴区及所述过渡区以外的部分。

Description

柔性显示屏及其制作方法 技术领域
本发明涉及显示技术领域,具体涉及一种柔性显示屏及其制作方法。
 背景技术
柔性显示器为显示器科技中的新领域。柔性显示器具有诸多优点,例如重量轻、体积小、薄型化、携带方便、耐冲击、能适应的工作环境更广等优点。
 技术问题
虽然柔性显示器具有上述等诸多优点,但在制作柔性显示器时,须将集成电路(integrated circuit, IC)黏贴至柔性衬底的焊垫(pad)上。由于柔性衬底与玻璃衬底相较,具有较大的热膨胀系数,因此在柔性显示器的制造中,因柔性衬底的焊垫的热胀冷缩所造成的集成电路(integrated circuit, IC)黏贴的偏位问题为一大面临的挑战。
 技术解决方案
为解决上述问题,本发明提出一种柔性显示屏,包括:
显示区,具有柔性衬底,用于显示影像;黏贴区,具有硬性衬底,设有焊垫,用于黏贴芯片,所述焊垫形成在所述硬性衬底上;以及过渡区,具有覆上柔性衬底的硬性衬底,介于所述显示区与黏贴区之间;其中,延伸自所述显示区的柔性衬底于所述过渡区覆于所述硬性衬底之上。
较佳地,所述显示区还包括彩色滤光片、液晶、金属层、以及缓冲层。
较佳地,所述焊垫和硬性衬底之间包括一缓冲层。
较佳地,所述过渡区还包括一缓冲层和金属层。
较佳地,所述黏贴区面积为所述显示区面积的1/6至1/10之间。
较佳地,所述显示区的衬底由聚酰亚胺(polyimide, PI)所组成。
较佳地,所述黏贴区的衬底为玻璃基板。
本发明另外提出一种所述柔性显示屏的制作方法,其特征在于,包括:
提供玻璃基板,并在玻璃基板上涂布热固性聚合物,将上述热固性聚合物通过烘烤固化为固态薄膜;去除作为黏贴区表面的固态薄膜,露出其下方玻璃基板的表面;在所述固态薄膜和已去除固态薄膜的玻璃基板上制作缓冲层;在所述缓冲层上制作金属层;在所述金属层的黏贴区上形成焊接垫和金属导线;完成面板单元的贴合及切割后,将芯片黏贴至所述黏贴区的焊接垫上;以及去除所述黏贴区及过渡区以外的玻璃基板。
较佳地,所述去除作为黏贴区表面的固态薄膜通过干蚀刻(dry etch)或雷射剥离(laser lift off)手段实施。
较佳地,所述缓冲层通过化学气相沉积(chemical vapor deposition, CVD)手段实施。
较佳地,所述金属层通过物理气相沉积(physical vapor deposition, PVD)手段实施。
较佳地,所述去除黏贴区及过渡区以外的玻璃基板通过激光切割、刀轮切割、以及裂片之至少一种手段实施。
本发明另外提出一种柔性显示屏,包括:显示区,具有柔性衬底,用于显示影像,所述显示区包括彩色滤光片、液晶、金属层、以及缓冲层;黏贴区,具有硬性衬底,设有焊垫,用于黏贴芯片,所述焊垫形成在所述硬性衬底上,所述焊垫和硬性衬底之间包括所述缓冲层;以及过渡区,具有覆上柔性衬底的硬性衬底,介于所述显示区与黏贴区之间,所述过渡区包括所述缓冲层和金属层;其中,延伸自所述显示区的柔性衬底于所述过渡区覆于所述硬性衬底之上。
较佳地,所述黏贴区面积为所述显示区面积的1/6至1/10之间。
较佳地,所述柔性衬底由聚酰亚胺(polyimide, PI)所组成。
较佳地,所述硬性衬底为玻璃基板。
 有益效果
通过本发明所述方法制作的柔性显示屏,结合柔性衬底和硬性衬底的优点,兼具可弯折性以及较低热膨胀系数的芯片黏贴区特性,可以解决仅有使用柔性衬底的柔性显示屏,因芯片的黏贴区材料热膨胀系数较高,所具有的由于热胀冷缩所造成的集成电路(integrated circuit, IC)黏贴的偏位问题。
 附图说明
图1为本发明较佳实施例的柔性显示屏的区域配置示意图；
图2为本发明较佳实施例的柔性显示屏的制造方法流程图;
图3为本发明较佳实施例的柔性显示屏制作步骤S1和S2的膜层结构剖面示意图；
图4为本发明较佳实施例的柔性显示屏制作步骤S3的膜层结构剖面示意图；
图5为本发明较佳实施例的柔性显示屏制作步骤S4的膜层结构剖面示意图；
图6为本发明较佳实施例的柔性显示屏制作步骤S5的膜层结构剖面示意图；
图7为本发明较佳实施例的柔性显示屏制作步骤S6的膜层结构剖面示意图；
图8为本发明较佳实施例的柔性显示屏制作步骤S7的膜层结构剖面示意图；以及
图9为本发明较佳实施例的柔性显示屏制作步骤S8的膜层结构剖面示意图。
 本发明的最佳实施方式
以下实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
以下将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
请参考图1及一并参考图9,本发明提出一种柔性显示屏10,包括:
显示区20,具有柔性衬底101,用于显示影像;黏贴区40,具有硬性衬底100,设有焊垫104,用于黏贴芯片105，所述焊垫104形成在所述硬性衬底100的缓冲层102上;以及
过渡区30,具有覆上柔性衬底101的硬性衬底100,介于所述显示区20与黏贴区40之间;
其中,延伸自所述显示区20的柔性衬底101于所述过渡区30覆于所述硬性衬底100之上。
所述显示区20还包括彩色滤光片80、液晶90、金属层103、以及缓冲层102。
所述黏贴区40上的焊垫104和硬性衬底100之间包括一缓冲层102。
所述过渡区30还包括一缓冲层102和金属层103。
所述黏贴区40面积优选为所述显示区20面积的1/6至1/10之间。
本发明亦提出一方法以制造图1和图9所显示的柔性显示屏10。详述如下。
请参考图2和图3,于步骤S1,提供一用于Array制程的玻璃基板100,并在该玻璃基板100上涂布热固性聚合物。
于本较佳实施例,所述热固性聚合物为聚酰亚胺(polyimide, PI) 聚合物。
于步骤S2,通过将上述聚酰亚胺(polyimide, PI)聚合物烘烤固化为聚酰亚胺(polyimide, PI)薄膜101。
请参考图2和图4,于步骤S3,通过干蚀刻(dry etch)或雷射剥离(laser lift off)等手段去除作为黏贴区表面的聚酰亚胺(polyimide, PI)薄膜101,露出其下方玻璃基板100的表面。
请参考图请参考图2和图5,于步骤S4在所述聚酰亚胺(polyimide, PI)薄膜101和已去除聚酰亚胺(polyimide, PI)薄膜的玻璃基板100的表面上通过化学气相沉积(chemical vapor deposition, CVD)手段,制作优选由氮化硅或氧化硅所组成的缓冲层102。
请参考图2和图6,于步骤S5在所述缓冲层102上通过物理气相沉积(physical vapor deposition, PVD)手段制作优选为铟锡氧化物（ITO）的金属层103。
请参考图2和图7,于步骤S6的制程中,在金属层103上以光阻涂布、曝光、显影、蚀刻以及剥膜等手段形成焊接垫104、金属导线106(参见图1)以及其他导线或电级(习知细节制程未图示)。
接着对上述完成Array制程的玻璃基板100进行清洗、配向膜印刷、配向膜配向以及密封胶涂布等制程(习知细节制程未图示)。
请参考图8,然后提供另一用于彩色滤光片(color filter, CF)制程的玻璃基板200,并在该玻璃基板200上涂布热固性聚合物(同上述流程部分,未图示)。
于本较佳实施例,所述热固性聚合物为聚酰亚胺(polyimide, PI) 聚合物。
请参考图8,将上述聚酰亚胺(polyimide, PI)聚合物烘烤固化为聚酰亚胺(polyimide, PI)薄膜99后,在所述聚酰亚胺薄膜99上完成彩色滤光片(color filter, CF)80的制作(习知细节制程未图示)。然后,将上述完成Array制程并通过后续清洗、配向膜印刷、配向膜配向、密封胶涂布以及注入液晶90等制程的玻璃基板100和已通过涂布及烘烤程序,覆有聚酰亚胺(polyimide, PI)薄膜99及在该薄膜99上制作完彩色滤光片(color filter, CF)80的玻璃基板200作精密贴合(习知细节制程未图示)。
接着,请参考图2和图8,于步骤S7,在将上述完成Array制程及后续清洗、配向膜印刷、配向膜配向、密封胶涂布以及注入液晶90等制程的玻璃基板100和亦完成涂布及烘烤程序,覆有聚酰亚胺(polyimide, PI)薄膜99及在该薄膜99上制作完彩色滤光片(color filter, CF)80的玻璃基板200贴合后,将芯片105通过芯片焊接机(die bonder)黏贴至所述焊接垫104上(习知细节制程未图示)。
请参考图8、9及一并参考图1、2,于步骤S8,将上述通过精密贴合后的玻璃基板100和玻璃基板200通过激光切割、刀轮切割、以及裂片之至少一种手段去除所述玻璃基板100和玻璃基板200在所述黏贴区40及过渡区30以外的部分,即去除所述玻璃基板100和玻璃基板200在显示区20的部分。
通过上述实施例，可获得一结合柔性衬底和硬性衬底的柔性显示屏,兼具可弯折性以及较低热膨胀系数的芯片黏贴区特性,可以解决使用柔性衬底的柔性显示屏,因芯片的黏贴区材料热膨胀系数较高,所产生的因热胀冷缩所造成的集成电路(integrated circuit, IC)黏贴的偏位问题。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本申请,本领域的普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。

Claims (17)

  1. 一种柔性显示屏,其特征在于,包括:
    显示区,具有柔性衬底,用于显示影像;
    黏贴区,具有硬性衬底,设有焊垫,用于黏贴芯片,所述焊垫形成在所述硬性衬底上;以及
    过渡区,具有覆上柔性衬底的硬性衬底,介于所述显示区与黏贴区之间;
    其中,延伸自所述显示区的柔性衬底于所述过渡区覆于所述硬性衬底之上。
  2. 如权利要求1所述的柔性显示屏,其特征在于,所述显示区还包括彩色滤光片、液晶、金属层、以及缓冲层。
  3. 如权利要求1所述的柔性显示屏,其特征在于,所述焊垫和硬性衬底之间包括一缓冲层。
  4. 如权利要求1所述的柔性显示屏,其特征在于,所述过渡区还包括一缓冲层和金属层。
  5. 如权利要求1所述的柔性显示屏,其特征在于,所述黏贴区面积为所述显示区面积的1/6至1/10之间。
  6. 如权利要求1所述的柔性显示屏,其特征在于,所述柔性衬底由聚酰亚胺(polyimide, PI)所组成。
  7. 如权利要求1所述的柔性显示屏,其特征在于,所述硬性衬底为玻璃基板。
  8. 一种柔性显示屏的制作方法,其特征在于,包括:
    提供玻璃基板,并在玻璃基板上涂布热固性聚合物;
    将上述热固性聚合物通过烘烤固化为固态薄膜;
    去除作为黏贴区表面的固态薄膜,露出其下方玻璃基板的表面;
    在所述固态薄膜和已去除固态薄膜的玻璃基板的表面上制作缓冲层;
    在所述缓冲层上制作金属层;
    在所述金属层上的黏贴区形成焊接垫和金属导线;
    完成面板单元的贴合及切割后,将芯片黏贴至所述黏贴区的焊接垫上;以及
    去除所述玻璃基板在所述黏贴区及所述过渡区以外的部分。
  9. 如权利要求8所述的柔性显示屏的制作方法,其特征在于,所述热固性聚合物为聚酰亚胺(polyimide, PI)。
  10. 如权利要求8所述的柔性显示屏的制作方法,其特征在于,所述去除作为黏贴区表面的固态薄膜通过干蚀刻(dry etch)或雷射剥离(laser lift off)手段实施。
  11. 如权利要求8所述的柔性显示屏的制作方法,其特征在于,所述缓冲层通过化学气相沉积(chemical vapor deposition, CVD)手段实施。
  12. 如权利要求8所述的柔性显示屏的制作方法,其特征在于,所述金属层通过物理气相沉积(physical vapor deposition, PVD)手段实施。
  13. 如权利要求8所述的柔性显示屏的制作方法,其特征在于,所述去除黏贴区及过渡区以外的玻璃基板通过激光切割、刀轮切割、以及裂片之至少一种手段实施。
  14. 一种柔性显示屏,其特征在于,包括:
    显示区,具有柔性衬底,用于显示影像,所述显示区包括彩色滤光片、液晶、金属层、以及缓冲层;
    黏贴区,具有硬性衬底,设有焊垫,用于黏贴芯片,所述焊垫形成在所述硬性衬底上,所述焊垫和硬性衬底之间包括所述缓冲层;以及
    过渡区,具有覆上柔性衬底的硬性衬底,介于所述显示区与黏贴区之间,所述过渡区包括所述缓冲层和金属层;
    其中,延伸自所述显示区的柔性衬底于所述过渡区覆于所述硬性衬底之上。
  15. 如权利要求14所述的柔性显示屏的制作方法,其特征在于,所述黏贴区面积为所述显示区面积的1/6至1/10之间。
  16. 如权利要求14所述的柔性显示屏的制作方法,其特征在于,所述柔性衬底由聚酰亚胺(polyimide, PI)所组成。
  17. 如权利要求14所述的柔性显示屏的制作方法,其特征在于,所述硬性衬底为玻璃基板。
PCT/CN2019/077988 2018-12-18 2019-03-13 柔性显示屏及其制作方法 Ceased WO2020124810A1 (zh)

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