WO2020124717A1 - 用于制造有机发光显示装置的封装结构的方法 - Google Patents

用于制造有机发光显示装置的封装结构的方法 Download PDF

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Publication number
WO2020124717A1
WO2020124717A1 PCT/CN2019/071731 CN2019071731W WO2020124717A1 WO 2020124717 A1 WO2020124717 A1 WO 2020124717A1 CN 2019071731 W CN2019071731 W CN 2019071731W WO 2020124717 A1 WO2020124717 A1 WO 2020124717A1
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Prior art keywords
sub
pixel
color film
blue
encapsulation layer
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PCT/CN2019/071731
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English (en)
French (fr)
Inventor
龚文亮
金江江
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武汉华星光电半导体显示技术有限公司
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Priority to US16/336,943 priority Critical patent/US20210343980A1/en
Publication of WO2020124717A1 publication Critical patent/WO2020124717A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Definitions

  • the present invention relates to the technical field of displays, and in particular, to a method for manufacturing a packaging structure of an organic light-emitting display device, and an organic light-emitting display device and a packaging structure manufactured using the method.
  • FIG. 1 is a schematic cross-sectional view of an existing organic light-emitting display device having a polarizer 30.
  • the organic light-emitting display device includes an organic light-emitting portion 10 having a red sub-pixel 11, a green sub-pixel 12, and a blue sub-pixel 13, and an encapsulation layer 20 and a polarizer 30 (polarizer) are formed on the organic light-emitting portion 10.
  • Polarizer 30 can effectively reduce the reflectivity of the panel under strong light, but loses nearly 58% of the light output (ie, the light output rate is about 42%), which is for organic light-emitting diodes (organic light emitting diode, OLED) panel, which greatly increases the burden of its life.
  • OLED organic light emitting diode
  • the polarizer has a large thickness (about 60 ⁇ m) and a brittle material, which is not conducive to the development of dynamic bending products.
  • a brittle material which is not conducive to the development of dynamic bending products.
  • new materials, new technologies, and new processes must be introduced to replace the polarizer 30.
  • FIG. 2 is a schematic cross-sectional view of an existing organic light-emitting display device having a color film 60.
  • the organic light-emitting display device includes an organic light-emitting portion 40 having a red sub-pixel 41, a green sub-pixel 42 and a blue sub-pixel 43.
  • An encapsulation layer 50 and a color filter layer 60 (Color Filter) are formed on the organic light-emitting portion 40.
  • the use of color filter layer 60 (Color Filter) instead of polarizer 30 (polarizer) is classified as a POL-less technology, which not only reduces the thickness of the encapsulation layer from about 60 ⁇ m to ⁇ 5 ⁇ m. And can increase the light output rate from 42% to 60%.
  • the color film layer 60 is composed of red, green, and blue color films 61, 62, and 63, and a light-shielding layer 64 (also called a black matrix).
  • the red color film 61, the green color film 62, and the blue color film 63 have red color resistance, green color resistance, and blue color resistance, respectively, corresponding to the red sub-pixel 41, green sub-pixel 42, and blue sub-pixel
  • the light emitted by the pixels 63; the light shielding layer 64 is mainly responsible for preventing light leakage of the panel and reducing reflection of the panel.
  • the three-mask photolithography technology that must be used in the existing color film layer manufacturing process is complicated, and the development and baking processes in the photolithography technology will cause the functional layer of the OLED damage.
  • the existing shading layer has poor bending resistance, so it is necessary to develop a method for manufacturing a packaging structure of an organic light-emitting display device, which can simplify and improve the process of the color film layer and enhance its resistance Bending.
  • An object of the present invention is to provide a method for manufacturing a packaging structure of an organic light-emitting display device, which can simplify the manufacturing process of the packaging structure of an organic light-emitting display device and reduce the organic light-emitting diode (organic Light emitting diode (OLED) panel's functional layer is destroyed, and its bending resistance is enhanced.
  • OLED organic Light emitting diode
  • the present invention provides a method for manufacturing a packaging structure of an organic light-emitting display device, characterized in that the method includes the following steps:
  • S10 Provide an organic light-emitting portion, wherein the organic light-emitting portion includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel;
  • S20 forming a first encapsulation layer on the organic light-emitting portion, wherein the first encapsulation layer includes a red sub-pixel area, a green sub-pixel area, and a blue sub-pixel area, respectively corresponding to the red color of the organic light-emitting portion Sub-pixel, green sub-pixel and blue sub-pixel;
  • S30 Form a red color film, a green color film and a blue color film in the red sub-pixel area, the green sub-pixel area and the blue sub-pixel area of the first encapsulation layer by inkjet printing, respectively ;
  • the material of the first encapsulation layer and the second encapsulation layer is SiN.
  • step S20 includes: forming the first encapsulation layer on the organic light emitting portion by chemical vapor deposition; and step 60 includes: forming on the flat layer by chemical vapor deposition The second encapsulation layer.
  • step S50 includes: forming a transparent layer on the first encapsulation layer, the red color film, the green color film and the blue color film by inkjet printing technology Flat layer.
  • the present invention also provides an organic light-emitting display device, the packaging structure of the organic light-emitting display device is made by the above method, and includes:
  • An organic light emitting part including a red sub-pixel, a green sub-pixel and a blue sub-pixel;
  • An encapsulation structure is provided to cover the organic light-emitting portion, and includes:
  • a first encapsulation layer is provided on the organic light-emitting portion, and includes a red sub-pixel area, a green sub-pixel area, and a blue sub-pixel area, respectively corresponding to the red sub-pixel, green sub-pixel, and Blue subpixel
  • a flat layer provided on the first encapsulation layer, the red color film, the green color film and the blue color film;
  • a second encapsulation layer disposed on the flat layer
  • the location of the color sub-pixel area defines multiple holes.
  • the material of the first encapsulation layer and the second encapsulation layer is SiN.
  • the present invention also provides a packaging structure for an organic light-emitting display device.
  • An organic light-emitting portion of the organic light-emitting display device includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel.
  • the packaging structure is obtained by the above method Made, arranged to cover the organic light emitting part, and comprising:
  • a first encapsulation layer is provided on the organic light-emitting portion, and includes a red sub-pixel area, a green sub-pixel area, and a blue sub-pixel area, respectively corresponding to the red sub-pixel, green sub-pixel, and Blue subpixel
  • a flat layer provided on the first encapsulation layer, the red color film, the green color film and the blue color film;
  • a second encapsulation layer disposed on the flat layer
  • the location of the color sub-pixel area defines multiple holes.
  • the material of the first encapsulation layer and the second encapsulation layer is SiN.
  • the present invention provides a method for manufacturing a packaging structure of an organic light-emitting display device, characterized in that the method includes the following steps:
  • S10 Provide an organic light-emitting portion, wherein the organic light-emitting portion includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel;
  • S20 forming a first encapsulation layer on the organic light-emitting portion, wherein the first encapsulation layer includes a red sub-pixel area, a green sub-pixel area, and a blue sub-pixel area, respectively corresponding to the red color of the organic light-emitting portion Sub-pixel, green sub-pixel and blue sub-pixel;
  • S30 Form a red color film, a green color film and a blue color film in the red sub-pixel area, the green sub-pixel area and the blue sub-pixel area of the first encapsulation layer by inkjet printing, respectively ;
  • the material of the first encapsulation layer and the second encapsulation layer is SiN.
  • step S20 includes: forming the first encapsulation layer on the organic light emitting portion by chemical vapor deposition; and step 60 includes: forming on the flat layer by chemical vapor deposition The second encapsulation layer.
  • inkjet printing ink jet printing technology, accurately covering the red, green, and blue color resists on the red, green, and blue sub-pixels of the organic light-emitting display device, and then curing by light Form a red color film (color filter), green color film and blue color film, and get the embedded color film film packaging structure (thin-film encapsulation). Therefore, it effectively simplifies the three mask lithography technology that must be used in the existing color film manufacturing process, and reduces the damage to the OLED functional layer caused by the development and baking processes in the lithography technology.
  • a black polyimide (PI) is coated on the second encapsulation layer (SiN) as a light-shielding layer to expose red sub-pixels, green-red sub-pixels and blue sub-pixels by lithography, thereby improving light shielding Bending resistance of the layer.
  • FIG. 1 is a schematic cross-sectional view of a conventional organic light-emitting display device having a polarizer
  • FIG. 2 is a schematic cross-sectional view of an existing organic light-emitting display device having a color film
  • FIG. 3 is a flowchart of a method for manufacturing a packaging structure of an organic light-emitting display device according to an embodiment of the invention
  • FIG. 4 is a schematic side view of steps 10 and 20 of the method for manufacturing a packaging structure of an organic light-emitting display device according to an embodiment of the present invention
  • FIG. 5 is a schematic side view of steps 30 and 40 of the method for manufacturing a packaging structure of an organic light-emitting display device according to an embodiment of the present invention
  • FIG. 6 is a schematic side view of steps 50 and 60 of the method for manufacturing a packaging structure of an organic light-emitting display device according to an embodiment of the present invention.
  • FIG. 7 is a schematic side view of steps 10 and 80 of the method for manufacturing a packaging structure of an organic light-emitting display device according to an embodiment of the present invention, and can also be used as an organic light-emitting display device manufactured according to this method and A schematic cross-sectional view of the packaging structure.
  • FIG. 3 is a flowchart of a method for manufacturing a packaging structure of an organic light-emitting display device according to an embodiment of the present invention.
  • 4 to 7 are schematic side views of steps 10 to 80 of the method for manufacturing a packaging structure of an organic light-emitting display device according to an embodiment of the present invention.
  • the present invention provides a method for manufacturing a package structure of an organic light-emitting display device 1, characterized in that the method includes the following steps:
  • an organic light-emitting portion 100 is provided, wherein the organic light-emitting portion includes a red sub-pixel 101, a green sub-pixel 102, and a blue sub-pixel 103.
  • a first encapsulation layer 110 is formed on the organic light-emitting portion 100, wherein the first encapsulation layer includes a red sub-pixel region 111, a green sub-pixel region 112, and a blue sub-pixel
  • the regions 113 correspond to the red sub-pixel 101, the green sub-pixel 102, and the blue sub-pixel 103 of the organic light-emitting portion 100, respectively.
  • the material of the first encapsulation layer 110 is silicon nitride (SiN), and plasma-enhanced by plasma-enhanced chemical vapor deposition (plasma-enhanced chemical vapor deposition (PECVD) forming the first encapsulation layer 110 on the organic light emitting portion 100.
  • SiN silicon nitride
  • PECVD plasma-enhanced chemical vapor deposition
  • step S30 the red color film (color A filter 121, a green color film 122, and a blue color film 123 are formed in the red sub-pixel region 111, the green sub-pixel region 112, and the blue sub-pixel region 113 of the first encapsulation layer.
  • the inkjet printing in jet printing technology, materials containing red color resist (color resist), green color resist, and blue color resist are accurately covered in the red sub-pixel region 111, green sub-pixel region 112, and blue sub-pixel Area 113.
  • step S40 ultraviolet light is irradiated to cure the red color film 121, the green color film 122, and the blue color film 123.
  • a flat layer 130 is formed on the first encapsulation layer 110, the red color film 121, the green color film 122, and the blue color film 123.
  • a transparent film is formed on the first encapsulation layer 110, the red color film 121, the green color film 122 and the blue color film 123 by inkjet printing technology ⁇ 130 ⁇ The flat layer 130.
  • a second encapsulation layer 140 is formed on the flat layer 130.
  • the material of the second encapsulation layer 140 is silicon nitride (SiN), and plasma-enhanced chemical vapor deposition (plasma-enhanced chemical vapor) deposition, PECVD) forming the second encapsulation layer 140 on the flat layer 130.
  • a light-shielding layer 150 is coated on the second encapsulation layer 140, wherein the light-shielding layer includes black polyimide (black PI).
  • step S80 the positions of the red sub-pixel region 111, the green sub-pixel region 112, and the blue sub-pixel region 113 are etched on the light-shielding layer 150 by photolithography Multiple holes 151, 152, 153.
  • the holes 151, 152, and 153 respectively serve as holes for the red sub-pixel 101, the green sub-pixel 102, and the blue sub-pixel 103 to emit light, and the black polyimide light-shielding layer 150 absorbs external light and reduces reflection.
  • black polyimide is used as the material of the light-shielding layer 150, which has excellent mechanical properties and can improve the bending resistance of the light-shielding layer 150 in the prior art.
  • FIG. 7 for a schematic cross-sectional view of an organic light-emitting display device manufactured according to the above method according to an embodiment of the present invention.
  • the present invention also provides an organic light-emitting display device 1.
  • the packaging structure of the organic light-emitting display device 1 is made by the above method, and includes: an organic light-emitting portion 100 and a packaging structure 200.
  • the organic light emitting portion 100 includes a red sub-pixel 101, a green sub-pixel 102, and a blue sub-pixel 103.
  • the packaging structure 200 is disposed to cover the organic light-emitting portion 100, and includes: a first packaging layer 110, a red color film 121, a green color film 122, a blue color film 123, a flat layer 130, a first Two encapsulation layers 140 and a light-shielding layer 150.
  • the first encapsulation layer 110 is disposed on the organic light-emitting portion 100, and includes a red sub-pixel area 111, a green sub-pixel area 112, and a blue sub-pixel area 113, respectively corresponding to the red sub-pixels of the organic light-emitting portion
  • the material of the first encapsulation layer 110 is silicon nitride (SiN), and plasma-enhanced chemical vapor deposition (plasma-enhanced chemical vapor) deposition, PECVD) forming the first encapsulation layer 110 on the organic light emitting portion.
  • the red color film 121, the green color film 122, and the blue color film 123 are formed in the red sub-pixel region 111, the green sub-pixel region 112, and the blue of the first encapsulation layer, respectively 113 in the color sub-pixel area.
  • the ink jet printing (ink jet printing) technology is used to accurately cover the materials containing red color resist (color resist), green color resist and blue color resist respectively in red
  • the red color film 121, the green color film 122 and the blue color film 123 are formed on the sub-pixel area 111, the green sub-pixel area 112 and the blue sub-pixel area 113.
  • the red color film 121, the yellow color film 122 and the blue color film 123 are cured by ultraviolet light irradiation.
  • the flat layer 130 is disposed on the first encapsulation layer 110, the red color film 121, the green color film 122, and the blue color film 123.
  • a transparent film is formed on the first encapsulation layer 110, the red color film 121, the green color film 122 and the blue color film 123 by inkjet printing technology ⁇ 130 ⁇ The flat layer 130.
  • the second encapsulation layer 140 is disposed on the flat layer 130.
  • the material of the second encapsulation layer 140 is silicon nitride (SiN), and plasma-enhanced chemical vapor deposition (plasma-enhanced chemical vapor) deposition, PECVD) forming the second encapsulation layer 140 on the flat layer 130.
  • the light-shielding layer 150 is disposed on the second encapsulation layer 140; wherein the light-shielding layer 150 includes polyimide, and corresponds to the red sub-pixel region 111 and the green sub-pixel on the light-shielding layer
  • the positions of the region 112 and the blue sub-pixel region 113 define holes 151, 152, and 153.
  • the positions of the red sub-pixel region 111, the green sub-pixel region 112, and the blue sub-pixel region 113 are etched on the light-shielding layer 150 by photolithography Holes 151, 152, 153.
  • the holes 151, 152, and 153 respectively serve as holes for the red sub-pixel 101, the green sub-pixel 102, and the blue sub-pixel 103 to emit light, and the black polyimide light-shielding layer 150 absorbs external light and reduces reflection.
  • black polyimide is used as the material of the light-shielding layer 150, which has excellent mechanical properties and can improve the bending resistance of the light-shielding layer 150 in the prior art.
  • FIG. 7 is a schematic cross-sectional view of a package structure manufactured according to this method according to an embodiment of the invention.
  • the present invention also provides a packaging structure 200 for an organic light-emitting display device 1.
  • An organic light-emitting portion 100 of the organic light-emitting display device 1 includes a red sub-pixel 101, a green sub-pixel 102, and a blue sub-pixel 103.
  • the packaging structure 200 is made by the method described above, and is arranged to cover the organic light-emitting portion 100, and includes: a first packaging layer 110, a red color film 121, a green color film 122, a blue color film 123, a flat Layer 130, a second encapsulation layer 140 and a light-shielding layer 150.
  • the first encapsulation layer 110 is disposed on the organic light-emitting portion 100, and includes a red sub-pixel area 111, a green sub-pixel area 112, and a blue sub-pixel area 113, respectively corresponding to the red sub-pixels of the organic light-emitting portion
  • the material of the first encapsulation layer 110 is silicon nitride (SiN), and plasma-enhanced chemical vapor deposition (plasma-enhanced chemical vapor) deposition, PECVD) forming the first encapsulation layer 110 on the organic light emitting portion.
  • the red color film 121, the green color film 122 and the blue color film 123 are formed in the red sub-pixel area 111, the green sub-pixel area 112 and the blue color of the first encapsulation layer 113 in subpixel area.
  • the ink jet printing (ink jet printing) technology is used to accurately cover the materials containing red color resist (color resist), green color resist and blue color resist respectively in red
  • the red color film 121, the green color film 122 and the blue color film 123 are formed on the sub-pixel area 111, the green sub-pixel area 112 and the blue sub-pixel area 113.
  • the red color film 121, the yellow color film 122 and the blue color film 123 are cured by ultraviolet light irradiation.
  • the flat layer 130 is disposed on the first encapsulation layer 110, the red color film 121, the green color film 122, and the blue color film 123.
  • a transparent film is formed on the first encapsulation layer 110, the red color film 121, the green color film 122 and the blue color film 123 by inkjet printing technology ⁇ 130 ⁇ The flat layer 130.
  • the second encapsulation layer 140 is disposed on the flat layer 130.
  • the material of the second encapsulation layer 140 is silicon nitride (SiN), and plasma-enhanced chemical vapor deposition (plasma-enhanced chemical vapor) deposition, PECVD) forming the second encapsulation layer 140 on the flat layer 130.
  • the light-shielding layer 150 is disposed on the second encapsulation layer 140; wherein the light-shielding layer 150 includes polyimide, and corresponds to the red sub-pixel region 111 and the green sub-pixel on the light-shielding layer
  • the positions of the region 112 and the blue sub-pixel region 113 define holes 151, 152, and 153.
  • the positions of the red sub-pixel region 111, the green sub-pixel region 112, and the blue sub-pixel region 113 are etched on the light-shielding layer 150 by photolithography Holes 151, 152, 153.
  • the holes 151, 152, and 153 respectively serve as holes for the red sub-pixel 101, the green sub-pixel 102, and the blue sub-pixel 103 to emit light, and the black polyimide light-shielding layer 150 absorbs external light and reduces reflection.
  • black polyimide is used as the material of the light-shielding layer 150, which has excellent mechanical properties and can improve the bending resistance of the light-shielding layer 150 in the prior art.
  • inkjet printing ink jet printing technology, accurately covering the red, green, and blue color resists on the red, green, and blue sub-pixels of the organic light-emitting display device, and then curing by light Form a red color film (color filter), green color film and blue color film, and get the embedded color film film packaging structure (thin-film encapsulation). Therefore, it effectively simplifies the three mask lithography technology that must be used in the existing color film manufacturing process, and reduces the damage to the OLED functional layer caused by the development and baking processes in the lithography technology.
  • the red sub-pixels, green-red sub-pixels and blue sub-pixels are exposed by photolithography to improve the light-shielding layer Bending resistance.

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Abstract

提供一种用于制造一有机发光显示装置的一封装结构的方法，包括以下步骤：提供一有机发光部分；在所述有机发光部分上形成一第一封装层，其中所述第一封装层包括红色、绿色和蓝色子像素区域，分别对应于所述有机发光部分的红色、绿色和蓝色子像素；通过喷墨打印，分别将红色、绿色和蓝色彩膜形成在所述红色、绿色和蓝色子像素区域；在所述第一封装层和所述红色、绿色和蓝色彩膜上形成一平坦层、一第二封装层和一遮光层，其中所述遮光层包括聚酰亚胺；以及在所述遮光层上对应所述红色、绿色和蓝色子像素区域的位置蚀刻出多个孔洞。

Description

用于制造有机发光显示装置的封装结构的方法 技术领域
本发明涉及显示器技术领域，特别是涉及一种用于制造有机发光显示装置的封装结构的方法，以及使用所述方法所制造的有机发光显示装置以及封装结构。
 背景技术
请见图1，其为现有具有偏光片30的有机发光显示装置的一剖面示意图。有机发光显示装置包括一有机发光部分10，具有红色子像素11、绿色子像素12和蓝色子像素13，在有机发光部分10形成封装层20和偏光片30（polarizer）。偏光片30能够有效地降低强光下面板的反射率，却损失了接近58%的出光(即出光率约42%)，这对于有机发光二极管(organic light emitting diode, OLED)面板来说，极大地增加了其寿命负担。另一方面，偏光片厚度较大(约60μm)、材质脆，不利于动态弯折产品的开发。为了开发基于OLED现实技术的弯折产品，必须导入新材料、新技术以及新工艺替代偏光片30。
请见图2，其为现有具有彩膜60的有机发光显示装置的一剖面示意图。有机发光显示装置包括一有机发光部分40，具有红色子像素41、绿色子像素42和蓝色子像素43，在有机发光部分40形成封装层50和使用彩膜层60（Color Filter）。使用彩膜层60（Color Filter）替代偏光片30（polarizer）被归属为无偏光片(POL-less)技术，它不仅能将封装层的厚度从约60μm降低至＜5 μm。而且能够将出光率从42%提高至60%。然而，相对于偏光片，彩膜技术的表面反射率较高，强光下的对比度较低，不利于室外显示。彩膜层60由红色（red）、绿色(green)、蓝色（blue）彩膜61、62、63以及遮光层64(又称黑色矩阵，black matrix）组成。在OLED 面板中，红色彩膜61、绿色彩膜62和蓝色彩膜63分别具有红色色阻、绿色色阻和蓝色色阻，分别承担着对应红色子像素41、绿色子像素42和蓝色子像素63的出光；而遮光层64则主要承担着防止面板的漏光与降低面板的反射的作用。
然而，在现有的彩膜层的制程中必须使用到的三道光罩(mask)的光刻技术，制程工艺繁复，并且光刻技术中的显影和烘烤的工艺会造成OLED的功能层的破坏。除此外，现有的遮光层耐弯折性较差，因此有必要发展出一种用于制造有机发光显示装置的封装结构的方法，其能够简化并改良彩膜层的制程，以及增强其耐弯折性。
 技术问题
本发明的目的在于提供一种用于制造有机发光显示装置的封装结构的方法，其能够简化有机发光显示装置的封装结构的制程工艺，降低所述制程工艺对有机发光二极管(organic light emitting diode, OLED)面板的功能层的破坏，并增强其耐弯折性。
 技术解决方案
为解决上述技术问题，本发明提供一种用于制造一有机发光显示装置的一封装结构的方法，其特征在于：所述方法包括以下步骤：
S10:提供一有机发光部分，其中所述有机发光部分包括红色子像素、绿色子像素和蓝色子像素；
S20: 在所述有机发光部分上形成一第一封装层，其中所述第一封装层包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
S30: 通过喷墨打印，分别将红色彩膜、绿色彩膜和蓝色彩膜形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域；
S40: 通过紫外光照射，以固化所述红色彩膜、所述绿色彩膜和所述蓝色彩膜；
S50: 在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上形成一平坦层；
S60: 在所述平坦层上形成一第二封装层；
S70: 在所述第二封装层上涂布一遮光层，其中所述遮光层包括聚酰亚胺；以及
S80: 通过光刻，在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置蚀刻出多个孔洞。
根据本发明的一个实施例的进一步特征，所述第一封装层和所述第二封装层的材料为SiN。
根据本发明的一个实施例的进一步特征，步骤S20包括：通过化学气相沉积在所述有机发光部分上形成所述第一封装层；并且步骤60包括：通过化学气相沉积在所述平坦层上形成所述第二封装层。
根据本发明的一个实施例的进一步特征，步骤S50包括: 通过喷墨打印技术，在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上形成一透明的平坦层。
本发明还提供一种有机发光显示装置，所述有机发光显示装置的封装结构是由上述方法所制成，并且包括：
一有机发光部分，包括红色子像素、绿色子像素和蓝色子像素；以及
一封装结构，设置用以覆盖在所述有机发光部分，并且包括：
一第一封装层，设置在所述有机发光部分上，并且包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
一红色彩膜、一绿色彩膜和一蓝色彩膜，分别形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域中；
一平坦层，设置在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上；
一第二封装层，设置在所述平坦层上；以及
一遮光层，设置在所述第二封装层上；其中所述遮光层包括聚酰亚胺，并且在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置定义多个孔洞。
根据本发明的一个实施例的进一步特征，所述第一封装层和所述第二封装层的材料为SiN。
本发明还提供一种用于有机发光显示装置的封装结构，所述有机发光显示装置的一有机发光部分包括红色子像素、绿色子像素和蓝色子像素，所述封装结构是由上述方法所制成，设置用以覆盖在所述有机发光部分，并且包括：
一第一封装层，设置在所述有机发光部分上，并且包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
一红色彩膜、一绿色彩膜和一蓝色彩膜，分别形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域中；
一平坦层，设置在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上；
一第二封装层，设置在所述平坦层上；以及
一遮光层，设置在所述第二封装层上；其中所述遮光层包括聚酰亚胺，并且在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置定义多个孔洞。
根据本发明的一个实施例的进一步特征，所述第一封装层和所述第二封装层的材料为SiN。
为解决上述技术问题，本发明提供一种用于制造一有机发光显示装置的一封装结构的方法，其特征在于：所述方法包括以下步骤：
S10:提供一有机发光部分，其中所述有机发光部分包括红色子像素、绿色子像素和蓝色子像素；
S20: 在所述有机发光部分上形成一第一封装层，其中所述第一封装层包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
S30: 通过喷墨打印，分别将红色彩膜、绿色彩膜和蓝色彩膜形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域；
S40: 通过紫外光照射，以固化所述红色彩膜、所述绿色彩膜和所述蓝色彩膜；
S50: 通过喷墨打印技术，在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上形成一平坦层；
S60: 在所述平坦层上形成一第二封装层；
S70: 在所述第二封装层上涂布一遮光层，其中所述遮光层包括聚酰亚胺；以及
S80: 通过光刻，在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置蚀刻出多个孔洞。
根据本发明的一个实施例的进一步特征，所述第一封装层和所述第二封装层的材料为SiN。
根据本发明的一个实施例的进一步特征，步骤S20包括：通过化学气相沉积在所述有机发光部分上形成所述第一封装层；并且步骤60包括：通过化学气相沉积在所述平坦层上形成所述第二封装层。
 有益效果
在本发明的所述用于制造有机发光显示装置的封装结构的方法中，以及所述方法所制造的有机发光显示装置以及封装结构中，通过使用喷墨打印(ink jet printing)技术，将红色色阻(color resist)、绿色色阻和蓝色色阻准确的覆盖在有机发光显示装置的红色子像素、绿色子像素和蓝色子像素上，然后通过光照以固化而形成红色彩膜 (color filter)、绿色彩膜和蓝色彩膜，而得到内嵌彩膜薄膜封装结构(thin-film encapsulation)。因此，有效地简化现有彩膜制程中必须使用到的三道光罩(mask)的光刻技术，并且降低光刻技术中的显影和烘烤的工艺对OLED的功能层造成的破坏。此外，利用在第二封装层封装层(SiN)上涂布黑色聚酰亚胺 (polyimide, PI)作为遮光层，光刻露出红色子像素、绿红色子像素和蓝色子像素，从而改良遮光层的耐弯折性。
 附图说明
本文所述的本发明，仅作为示例，参考附图，其中：
图1 为现有具有偏光片的有机发光显示装置的一剖面示意图；
图2 为现有具有彩膜的有机发光显示装置的一剖面示意图；
图3 为根据本发明的一实施例中，一种用于制造有机发光显示装置的封装结构的方法的流程图；
图4 为根据本发明的一实施例中，所述用于制造有机发光显示装置的封装结构的方法的步骤10和步骤20的侧面示意图；
图5 为根据本发明的一实施例中，所述用于制造有机发光显示装置的封装结构的方法的步骤30和步骤40的侧面示意图；
图6 为根据本发明的一实施例中，所述用于制造有机发光显示装置的封装结构的方法的步骤50和步骤60的侧面示意图；以及
图7 为根据本发明的一实施例中，所述用于制造有机发光显示装置的封装结构的方法的步骤10和步骤80的侧面示意图，也可作为根据此方法所制造的有机发光显示装置以及封装结构的剖面示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。
实施例一：
请参考图3，其为根据本发明的一实施例中，一种用于制造有机发光显示装置的封装结构的方法的流程图。以及参考图4至图7，为根据本发明的一实施例中，所述用于制造有机发光显示装置的封装结构的方法的步骤10至步骤80的侧面示意图。
本发明提供一种用于制造一有机发光显示装置1的一封装结构的方法，其特征在于：所述方法包括以下步骤：
如图4所示，步骤S10中，提供一有机发光部分100，其中所述有机发光部分包括红色子像素101、绿色子像素102和蓝色子像素103。
如图4所示，步骤S20中，在所述有机发光部分100上形成一第一封装层110，其中所述第一封装层包括红色子像素区域111、绿色子像素区域112和蓝色子像素区域113，分别对应于所述有机发光部分100的红色子像素101、绿色子像素102和蓝色子像素103。根据本发明的一优选实施例中，所述第一封装层110的材料为氮化硅(SiN)，并且通过电浆辅助化学气相沉积（plasma-enhanced chemical vapor deposition, PECVD）在所述有机发光部分100上形成所述第一封装层110。
如图5所示，步骤S30中，通过喷墨打印(ink jet printing, IJP)，分别将红色彩膜(color filter)121、绿色彩膜122和蓝色彩膜123形成在所述第一封装层的所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域113。根据本发明的一优选实施例中，在所述喷墨打印(ink jet printing)技术中，将分别含有红色色阻(color resist) 的材料、绿色色阻的材料和蓝色色阻的材料准确的覆盖在红色子像素区域111、绿色子像素区域112和蓝色子像素区域113上。
如图5所示，步骤S40中，通过紫外光照射，以固化所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123。
如图6所示，步骤S50中，在所述第一封装层110、所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123上形成一平坦层130。根据本发明的一优选实施例中，通过喷墨打印技术，在所述第一封装层110、所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123上形成一透明的平坦层130。
如图6所示，步骤S60:中，在所述平坦层130上形成一第二封装层140。根据本发明的一优选实施例中，所述第二封装层140的材料为氮化硅(SiN)，并且通过电浆辅助化学气相沉积（plasma-enhanced chemical vapor deposition, PECVD）在所述平坦层130上形成所述第二封装层140。
如图7所示，步骤S70中，在所述第二封装层140上涂布一遮光层150，其中所述遮光层包括黑色聚酰亚胺(black polyimide, black PI)。
如图7所示，步骤S80中，通过光刻，在所述遮光层上150对应所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域113的位置蚀刻出多个孔洞151、152、153。所述孔洞151、152、153分别作为红色子像素101、绿色子像素102和蓝色子像素103出光的空洞，而黑色聚酰亚胺的遮光层150吸收外界的光线，降低反射。在本发明中使用黑色聚酰亚胺作为遮光层150材质，具有优良的机械性能，可以改良现有技术中遮光层150的耐弯折性能。
实施例二：
请参考图7 为根据本发明的一实施例中，根据上述方法所制造的有机发光显示装置的剖面示意图。
本发明还提供一种有机发光显示装置1，所述有机发光显示装置1的封装结构是由上述方法所制成，并且包括：一有机发光部分100以及一封装结构200。
所述有机发光部分100，包括红色子像素101、绿色子像素102和蓝色子像素103。
所述封装结构200，设置用以覆盖在所述有机发光部分100，并且包括：一第一封装层110、红色彩膜121、绿色彩膜122、蓝色彩膜123、一平坦层130、一第二封装层140以及一遮光层150。
所述第一封装层110，设置在所述有机发光部分100上，并且包括红色子像素区域111、绿色子像素区域112和蓝色子像素区域113，分别对应于所述有机发光部分的红色子像素101、绿色子像素102和蓝色子像素103。根据本发明的一优选实施例中，所述第一封装层110的材料为氮化硅(SiN)，并且通过电浆辅助化学气相沉积（plasma-enhanced chemical vapor deposition, PECVD）在所述有机发光部分上形成所述第一封装层110。
所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123，分别形成在所述第一封装层的所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域中113。根据本发明的一优选实施例中，通过喷墨打印(ink jet printing)技术，将分别含有红色色阻(color resist) 的材料、绿色色阻的材料和蓝色色阻的材料准确的覆盖在红色子像素区域111、绿色子像素区域112和蓝色子像素区域113上而形成所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123。通过紫外光照射，以固化所述红色彩膜121、所述黄色彩膜122和所述蓝色彩膜123。
所述平坦层130，设置在所述第一封装层110、所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123上。根据本发明的一优选实施例中，通过喷墨打印技术，在所述第一封装层110、所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123上形成一透明的平坦层130。
所述第二封装层140，设置在所述平坦层上130。根据本发明的一优选实施例中，所述第二封装层140的材料为氮化硅(SiN)，并且通过电浆辅助化学气相沉积（plasma-enhanced chemical vapor deposition, PECVD）在所述平坦层130上形成所述第二封装层140。
所述遮光层150，设置在所述第二封装层140上；其中所述遮光层150包括聚酰亚胺，并且在所述遮光层上对应所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域113的位置定义孔洞151、152、153。根据本发明的一优选实施例中，通过光刻，在所述遮光层上150对应所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域113的位置蚀刻出孔洞151、152、153。所述孔洞151、152、153分别作为红色子像素101、绿色子像素102和蓝色子像素103出光的空洞，而黑色聚酰亚胺的遮光层150吸收外界的光线，降低反射。在本发明中使用黑色聚酰亚胺作为遮光层150材质，具有优良的机械性能，可以改良现有技术中遮光层150的耐弯折性能。
实施例三：
图7 为根据本发明的一实施例中，根据此方法所制造的封装结构的剖面示意图。
本发明还提供一种用于有机发光显示装置1的封装结构200，所述有机发光显示装置1的一有机发光部分100包括红色子像素101、绿色子像素102和蓝色子像素103，所述封装结构200是由上述方法所制成，设置用以覆盖在所述有机发光部分100，并且包括：一第一封装层110、红色彩膜121、绿色彩膜122、蓝色彩膜123、一平坦层130、一第二封装层140以及一遮光层150。
所述第一封装层110，设置在所述有机发光部分100上，并且包括红色子像素区域111、绿色子像素区域112和蓝色子像素区域113，分别对应于所述有机发光部分的红色子像素101、绿色子像素102和蓝色子像素103。根据本发明的一优选实施例中，所述第一封装层110的材料为氮化硅(SiN)，并且通过电浆辅助化学气相沉积（plasma-enhanced chemical vapor deposition, PECVD）在所述有机发光部分上形成所述第一封装层110。
所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123，形成在所述第一封装层的所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域中113。根据本发明的一优选实施例中，通过喷墨打印(ink jet printing)技术，将分别含有红色色阻(color resist) 的材料、绿色色阻的材料和蓝色色阻的材料准确的覆盖在红色子像素区域111、绿色子像素区域112和蓝色子像素区域113上而形成所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123。通过紫外光照射，以固化所述红色彩膜121、所述黄色彩膜122和所述蓝色彩膜123。
所述平坦层130，设置在所述第一封装层110、所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123上。根据本发明的一优选实施例中，通过喷墨打印技术，在所述第一封装层110、所述红色彩膜121、所述绿色彩膜122和所述蓝色彩膜123上形成一透明的平坦层130。
所述第二封装层140，设置在所述平坦层上130。根据本发明的一优选实施例中，所述第二封装层140的材料为氮化硅(SiN)，并且通过电浆辅助化学气相沉积（plasma-enhanced chemical vapor deposition,  PECVD）在所述平坦层130上形成所述第二封装层140。
所述遮光层150，设置在所述第二封装层140上；其中所述遮光层150包括聚酰亚胺，并且在所述遮光层上对应所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域113的位置定义孔洞151、152、153。根据本发明的一优选实施例中，通过光刻，在所述遮光层上150对应所述红色子像素区域111、所述绿色子像素区域112和所述蓝色子像素区域113的位置蚀刻出孔洞151、152、153。所述孔洞151、152、153分别作为红色子像素101、绿色子像素102和蓝色子像素103出光的空洞，而黑色聚酰亚胺的遮光层150吸收外界的光线，降低反射。在本发明中使用黑色聚酰亚胺作为遮光层150材质，具有优良的机械性能，可以改良现有技术中遮光层150的耐弯折性能。
总结而言，在本发明的所述用于制造有机发光显示装置的封装结构的方法中，以及所述方法所制造的有机发光显示装置以及封装结构中，通过使用喷墨打印(ink jet printing)技术，将红色色阻(color resist)、绿色色阻和蓝色色阻准确的覆盖在有机发光显示装置的红色子像素、绿色子像素和蓝色子像素上，然后通过光照以固化而形成红色彩膜 (color filter)、绿色彩膜和蓝色彩膜，而得到内嵌彩膜薄膜封装结构(thin-film encapsulation)。因此，有效地简化现有彩膜制程中必须使用到的三道光罩(mask)的光刻技术，并且降低光刻技术中的显影和烘烤的工艺对OLED的功能层造成的破坏。此外，利用在第二封装层(SiN)上涂布黑色聚酰亚胺 (polyimide, PI)作为遮光层，光刻露出红色子像素、绿红色子像素和蓝色子像素，从而改良遮光层的耐弯折性。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (11)

  1. 一种用于制造一有机发光显示装置的一封装结构的方法，包括以下步骤：
    S10:提供一有机发光部分，其中所述有机发光部分包括红色子像素、绿色子像素和蓝色子像素；
    S20: 在所述有机发光部分上形成一第一封装层，其中所述第一封装层包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
    S30: 通过喷墨打印，分别将红色彩膜、绿色彩膜和蓝色彩膜形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域；
    S40: 通过紫外光照射，以固化所述红色彩膜、所述绿色彩膜和所述蓝色彩膜；
    S50: 在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上形成一平坦层；
    S60: 在所述平坦层上形成一第二封装层；
    S70: 在所述第二封装层上涂布一遮光层，其中所述遮光层包括聚酰亚胺；以及
    S80: 通过光刻，在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置蚀刻出多个孔洞。
  2. 如权利要求1所述的方法，其中所述第一封装层和所述第二封装层的材料为SiN。
  3. 如权利要求2所述的方法，其中
    步骤S20包括：通过化学气相沉积在所述有机发光部分上形成所述第一封装层；并且
    步骤60包括：通过化学气相沉积在所述平坦层上形成所述第二封装层。
  4. 如权利要求1所述的方法，其中
    步骤S50包括: 通过喷墨打印技术，在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上形成一透明的平坦层。
  5. 一种有机发光显示装置，包括：
    一有机发光部分，包括红色子像素、绿色子像素和蓝色子像素；以及
    一封装结构，设置用以覆盖在所述有机发光部分，并且包括：
    一第一封装层，设置在所述有机发光部分上，并且包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
    一红色彩膜、一绿色彩膜和一蓝色彩膜，分别形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域中；
    一平坦层，设置在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上；
    一第二封装层，设置在所述平坦层上；以及
    一遮光层，设置在所述第二封装层上；其中所述遮光层包括聚酰亚胺，并且在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置定义多个孔洞。
  6. 如权利要求5所述的有机发光显示装置，其中所述第一封装层和所述第二封装层的材料为SiN。
  7. 一种用于一有机发光显示装置的封装结构，所述有机发光显示装置的一有机发光部分包括红色子像素、绿色子像素和蓝色子像素，所述封装结构包括：
    一第一封装层，设置在所述有机发光部分上，并且包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
    一红色彩膜、一绿色彩膜和一蓝色彩膜，分别形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域中；
    一平坦层，设置在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上；
    一第二封装层，设置在所述平坦层上；以及
    一遮光层，设置在所述第二封装层上；其中所述遮光层包括聚酰亚胺，并且在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置定义多个孔洞。
  8. 如权利要求7所述的封装结构，其中所述第一封装层和所述第二封装层的材料为SiN。
  9. 一种用于制造一有机发光显示装置的一封装结构的方法，包括以下步骤：
    S10:提供一有机发光部分，其中所述有机发光部分包括红色子像素、绿色子像素和蓝色子像素；
    S20: 在所述有机发光部分上形成一第一封装层，其中所述第一封装层包括红色子像素区域、绿色子像素区域和蓝色子像素区域，分别对应于所述有机发光部分的红色子像素、绿色子像素和蓝色子像素；
    S30: 通过喷墨打印，分别将红色彩膜、绿色彩膜和蓝色彩膜形成在所述第一封装层的所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域；
    S40: 通过紫外光照射，以固化所述红色彩膜、所述绿色彩膜和所述蓝色彩膜；
    S50: 通过喷墨打印技术，在所述第一封装层、所述红色彩膜、所述绿色彩膜和所述蓝色彩膜上形成一平坦层；
    S60: 在所述平坦层上形成一第二封装层；
    S70: 在所述第二封装层上涂布一遮光层，其中所述遮光层包括聚酰亚胺；以及
    S80: 通过光刻，在所述遮光层上对应所述红色子像素区域、所述绿色子像素区域和所述蓝色子像素区域的位置蚀刻出多个孔洞。
  10. 如权利要求1所述的方法，其中所述第一封装层和所述第二封装层的材料为SiN。
  11. 如权利要求2所述的方法，其中
    步骤S20包括：通过化学气相沉积在所述有机发光部分上形成所述第一封装层；并且
    步骤60包括：通过化学气相沉积在所述平坦层上形成所述第二封装层。
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