WO2020124415A1 - 柔性面板及柔性面板制作方法 - Google Patents

柔性面板及柔性面板制作方法 Download PDF

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Publication number
WO2020124415A1
WO2020124415A1 PCT/CN2018/121994 CN2018121994W WO2020124415A1 WO 2020124415 A1 WO2020124415 A1 WO 2020124415A1 CN 2018121994 W CN2018121994 W CN 2018121994W WO 2020124415 A1 WO2020124415 A1 WO 2020124415A1
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WO
WIPO (PCT)
Prior art keywords
base material
flexible panel
hard
flexible
hard portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/121994
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English (en)
French (fr)
Inventor
雷晓华
李贺
胡康军
陈鑫
朱林
袁泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2018/121994 priority Critical patent/WO2020124415A1/zh
Priority to CN201880097628.4A priority patent/CN113169215A/zh
Publication of WO2020124415A1 publication Critical patent/WO2020124415A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass

Definitions

  • the present application relates to the field of flexible equipment, in particular to a flexible panel and a method of manufacturing the flexible panel.
  • the substrate of the flexible display panel or the flexible touch panel is a flexible substrate, and its strength is insufficient.
  • the substrate is easily deformed at the binding area and cannot be effectively connected to the functional element , Affecting the functional stability of the flexible panel.
  • the application provides a flexible panel and a method for manufacturing the flexible panel.
  • the present application provides a flexible panel, wherein the flexible panel includes a base material and an electronic device, the base material includes a binding area for connecting to a functional element, the base material is provided with a hard portion that strengthens the support strength of the binding area, the electronic The device is fixed to the substrate, and the electronic device is connected to the wire extending to the binding area.
  • the present application provides a method for manufacturing a flexible panel, wherein the method for manufacturing a flexible panel includes the following steps:
  • the base material includes a binding area for connecting with a functional element, and a hard part that strengthens the supporting strength of the binding area.
  • the electronic device is fixed to the base material, and the electronic device extends to Wire connection in the binding area.
  • the flexible panel and the manufacturing method of the flexible panel of the present application by providing a hard portion on the substrate, the hard portion provides stress reinforcement to the binding area, so that the binding area is not easily deformed, and the connection between the electronic device and the functional element is prevented. Improve the functional stability of the flexible panel.
  • FIG. 1 is a schematic diagram of a flexible panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic perspective view of a base material of a flexible panel provided by an embodiment of the present application.
  • FIG 3 is a schematic cross-sectional view of a flexible panel provided by another embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a flexible panel provided by another embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 7 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 8 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 9 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 10 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 11 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 12 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 13 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 14 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • 15 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • 16 is a schematic view of the manufacturing process of the flexible panel provided by the embodiment of the present application.
  • FIG. 17 is a schematic diagram of a manufacturing process of a flexible panel provided by another embodiment of the present application.
  • FIG. 18 is a schematic diagram of a manufacturing process of a flexible panel provided by another embodiment of the present application.
  • 19 is a schematic view of the manufacturing process of the flexible panel provided by the embodiment of the present application.
  • FIG. 20 is a schematic diagram of the manufacturing process of the flexible panel provided by the embodiment of the present application.
  • FIG. 21 is a schematic flowchart of manufacturing a flexible panel provided by an embodiment of the present application.
  • step 102 of manufacturing a flexible panel provided by an embodiment of the present application.
  • a component when a component is said to be “fixed” to another component, it can be directly on another component or there can also be a centered component. When a component is considered to be “connected” to another component, it can be directly connected to another component or there may be a centered component at the same time.
  • the present application provides a flexible panel 100 including a substrate 10 and an electronic device 20.
  • the base material 10 includes a binding area 11 for connecting with a functional element.
  • the base material 10 is provided with a hard portion 12 that strengthens the supporting strength of the binding area 11, and the hard portion 12 contains a metal material.
  • the electronic device 20 is fixed to the base material 10 and provided on the flexible portion 16 connected to the hard portion 12.
  • the electronic device 20 is connected to the wire 30 extending to the binding area 11.
  • the thickness of the hard portion 12 is greater than the thickness of the wire 30.
  • the flexible panel 100 may be a flexible sensor such as a flexible sensor, a flexible display panel, or a flexible touch panel.
  • the flexible panel 100 may be applied to a bendable or stretchable electronic device, and the bendable or stretchable electronic device may be a wearable device such as a mobile phone, a watch, a wristband, or the like.
  • the flexible panel 100 can also be used in bendable or stretchable electronic devices in the fields of monitoring, entertainment interaction, and smart wear.
  • the hard portion 12 By providing a hard portion 12 containing a metal material on the base material 10, the hard portion 12 provides stress reinforcement to the binding area 11, so that the base material 10 of the binding area 11 is not easily deformed, preventing the electronic device 20 and the functional element The failure of the connection improves the functional stability of the flexible panel 100.
  • the substrate 10 is a substrate having flexibility and flexibility or a substrate having elasticity and being stretchable.
  • the base material 10 includes a first short side 13 and a second short side 14 disposed opposite to the first short side 13, and two opposite long sides 15 connected between the first short side 13 and the second short side 14.
  • the base material 10 is also provided with a flexible portion 16 connected to the hard portion 12.
  • the flexible portion 16 occupies a larger area of the base material 10, and the hard portion 12 is substantially adjacent to the first short side 13.
  • the hard portion 12 may be substantially elongated or rectangularly shaped.
  • the hard portion 12 may extend substantially perpendicular to the first short side 13 or in any other direction.
  • the hardness of the hard portion 12 is greater than the hardness of the flexible portion 16.
  • the thickness of the hard portion 12 may be the same as the thickness of the flexible portion 16 or may be smaller than the thickness of the flexible portion 16.
  • the thickness of the substrate 10 is approximately 5 ⁇ m to 80 ⁇ m.
  • the flexible portion 16 can be bent and stretched arbitrarily according to requirements to meet the requirements of bending and stretching of the base material 10.
  • the hard portion 12 has strong internal stress, and the hard portion 12 is not likely to deform under the action of heat and pressure.
  • the hard portion 12 can provide a more stable connection structure for the binding area 11 to facilitate the electrical connection of the substrate 10 and the functional element in the binding area 11, prevent the substrate 10 from connecting with the functional element in the binding area 11 and improve flexibility The functional stability of the panel 100.
  • the material of the substrate 10 may be synthetic rubber such as polyurethane, silicone, natural rubber, ethylene-propylene rubber, styrene-butadiene rubber, butyl rubber, and silicone rubber, or materials such as thermoplastic elastomers.
  • the substrate 10 can be formed into a film by processes such as blow molding, calendering, casting, casting, and injection molding.
  • the hard portion 12 includes a metal sheet, or may be a mixed sheet plated with a weldable metal film layer on a non-metallic sheet. The metal sheet or the mixed sheet can be mixed into the base material 10 to form the hard portion 12 during the formation of the base material 10, so as to be integrated with the flexible portion 16 of the base material 10.
  • the rigid portion 12 and the flexible portion 16 have a stable structure and are not easy to separate, and the rigid portion 12 can effectively provide stress support to the binding area 11 to prevent the substrate 10 of the binding area 11 from being deformed under heat and pressure to prevent The connection between the flexible panel 100 and the functional element fails.
  • the hard portion 12 may completely cover the binding area 11 or may partially cover the binding area 11 as long as the hard portion 12 can provide stress reinforcement to the binding area 11 as needed.
  • the base material 10 may be provided with a plurality of rigid portions 12 that are isolated from each other.
  • the shape of the hard portion 12 may also be circular, square, or other irregular shapes.
  • the electronic device 20 is a touch electrode, that is, the flexible panel 100 is a flexible touch panel.
  • the flexible panel 100 can be applied to electronic devices such as folding mobile phones, flexible wearable devices, and flexible detection devices that can sense external signals.
  • the electronic device 20 may be composed of a plurality of capacitance sensing units 21.
  • a plurality of capacitive sensing units 21 are arranged in an array on the flexible portion 16.
  • the plurality of capacitive sensing units 21 may be printed on the substrate 10 by a screen printing process.
  • the plurality of capacitive sensing units 21 may move closer to or move away from each other as the flexible portion 16 bends or stretches.
  • the wire 30 includes a plurality of signal lines 31.
  • the signal line 31 is connected to the capacitance sensing unit 21, and one end of the signal line 31 extends to the binding area 11 to facilitate the conduction of the functional element and the signal line 31 in the binding area 11 and to obtain the sensing signals of the plurality of capacitance sensing units 21.
  • the signal line 31 can be bent and stretched along with the flexible portion 16 to facilitate the flexible panel 100 to sense the signal in the bent and stretched deformation state.
  • the signal line 31 located at one end of the binding area 11 constitutes the leading end of the electronic device 20.
  • the hard portion 12 reinforces the base material 10 of the binding area 11 to prevent the binding area 11 from being deformed by heat and causing poor contact with the functional element, thereby increasing the functional stability of the flexible panel 100.
  • the flexible panel 100 is a flexible touch panel.
  • a flexible touch display 1000 is provided.
  • the flexible touch display 1000 includes a transparent cover 1001, a flexible panel 100, and a display panel 1002. .
  • the flexible panel 100 is attached between the light-transmitting cover plate 1001 and the display panel 1002.
  • the flexible portion 16 of the flexible panel 100 is substantially aligned with the display area of the display panel 1002, so that the flexible panel 100 can form a virtual key in combination with the display area of the display panel 1002.
  • the binding area 11 of the flexible panel 100 may protrude from the display panel 1002 to facilitate binding with the flexible circuit board 40, so that the flexible touch display 1000 has a touch function.
  • the flexible panel 100 may also be attached to the side of the display panel 1002 facing away from the light-transmitting cover plate 1001, or integrated into the light-transmitting cover plate 1001.
  • the flexible panel 100 can also be applied to wearable devices such as wristbands, watches, straps and the like that need to be provided with a touch function.
  • FIG. 4 is different from the embodiment shown in FIG. 3 in that the flexible panel 100 is a flexible display panel.
  • a flexible display screen 2000 is provided.
  • the flexible display screen 2000 includes a light-transmitting cover plate 2001 and a flexible panel 100.
  • the flexible panel 100 is attached to the light-transmitting cover plate 2001.
  • the flexible panel 100 further includes a display layer 110, and the display layer 110 is attached to a side of the substrate 10 where the electronic device 20 is arranged.
  • the display layer 110 has a plurality of light emitting cells in an array.
  • the electronic device 20 is a driving electrode.
  • the electronic device 20 can drive the plurality of light emitting units of the display layer 110 to emit light.
  • the electronic device 20 may be composed of a plurality of drive units 22 in an array.
  • Each driving unit 22 is directly opposite to each light emitting unit of the display layer 110.
  • Each driving unit 22 may be composed of a thin film crystal diode switch.
  • the flexible portion 16 is substantially aligned with the display area of the display layer 110.
  • the electronic device 20 drives the display area of the display layer 110 to display an image in a light-emitting manner.
  • the binding area 11 protrudes from the display layer 110 to facilitate binding with the flexible circuit board 40, so that the flexible display screen 2000 can obtain a display signal through the flexible circuit board 40.
  • the flexible panel 100 may also be applied to electronic devices with flexible display functions such as foldable tablet computers, foldable displays, and the like.
  • the flexible panel 100 further includes a flexible circuit board 40.
  • a part of the flexible circuit board 40 is fixed to the binding area 11 and connected to the wire 30.
  • the flexible circuit board 40 includes a first end 41 fixedly connected to the base material 10 and a second end 42 disposed opposite to the first end 41.
  • the first end 41 is fixed to the binding area 11 and covers the binding area 11.
  • the first end 41 is provided with a plurality of exposed copper.
  • the plurality of exposed copper can be connected to the plurality of wires 30 so that the electronic device 20 can be connected to the flexible circuit board 40 via the wires 30.
  • the second end 42 is offset from the base material 10, and the second end 42 may be provided with a connector 421.
  • the connector 421 and the plurality of exposed copper are connected through a copper foil cable, so that the connector 421 can be connected to the electronic device 20 through the wire 30.
  • the electronic device 20 can transmit the sensing signal to the main board of the electronic device via the flexible circuit board 40, so that the flexible panel 100 can send the sensing signal to the outside.
  • the hard portion 12 can be used to strengthen the binding area 11 to ensure that the wire 30 opposite to the binding area 11 can firmly contact the first end 41 of the flexible circuit board 40 to increase the conduction performance.
  • the flexible circuit board 40 is fixed to the binding area 11 via the conductive adhesive 50 and is connected to the wire 30 via the conductive adhesive 50.
  • the binding area 11 coincides with the hard portion 12.
  • the conductive adhesive 50 completely covers the binding area 11, that is, the conductive adhesive 50 completely covers the hard portion 12.
  • the conductive glue 50 and the metal material of the hard portion 12 can be separated by an insulating layer.
  • the conductive glue 50 is in contact with the wire 30 extending to the binding area 11.
  • the wire 30 and the metal material of the hard portion 12 may be insulated by an insulating layer.
  • the flexible circuit board 40 is firmly bonded to the substrate 10 via the conductive adhesive 50, and the exposed copper and the wire 30 of the flexible circuit board 40 can be effectively conducted.
  • the flexible circuit board 40 and the substrate 10 are firmly connected by the conductive adhesive 50, the flexible circuit board 40, the conductive adhesive 50 and the substrate 10 need to be heated, and the flexible circuit board 40 and the substrate 10 are under greater pressure
  • the conductive adhesive is squeezed under the action to make the conductive particles in the conductive adhesive conduct up and down, so that the conductive adhesive 50 can exhibit stable adhesion and conduction performance.
  • the rigid portion 12 is used to reinforce the binding area 11, so that the hardness of the substrate 10 in the binding area 11 increases, and the substrate 10 is not easily deformed at the binding area 11, reducing the failure of the flexible circuit board 40 and the substrate 10 connection failure Chance to improve the functional stability of the flexible circuit board 100.
  • the hard portion 12 includes a metal material.
  • the metal material may be integrally formed in the base material 10 by a mold during the formation of the base material 10 to form the hard portion 12. That is, the hard portion 12 is embedded in the base material 10.
  • the hard portion 12 has an outer surface flush with the surface of the base material 10 and an inner surface inside the base material 10.
  • the base material 10 has a first surface 17 and a second surface 18 disposed opposite to the first surface 17.
  • the thickness of the hard portion 12 is smaller than the thickness of the base material 10.
  • the hard portion 12 is formed at a position where the base material 10 is substantially flush with the first surface 17.
  • the surface of the hard portion 12 away from the first surface 17 is at a distance from the second surface 18. Both the flexible circuit board 40 and the wire 30 are disposed on the first surface 17 of the base material 10.
  • FIG. 6 is different from the embodiment shown in FIG. 5 in that the substrate 10 is provided with a hard portion 12 on both the first surface 17 and the second surface 18. That is, the metal materials of the two hard portions 12 are located at positions where the first surface 17 and the second surface 18 are substantially flush. The metal materials of the two hard portions 12 are separated by the non-metallic material of the base material 10 itself.
  • the flexible panel 100 is provided with a flexible circuit board 40 and wires 30 on both the first surface 17 and the second surface 18, that is to say, the flexible panel 100 can be bound to the functional elements on both the upper and lower sides of the substrate 10 at the same time.
  • the hard portion 12 includes two hard structures 122 located on opposite sides of the substrate, in the thickness direction of the substrate 10
  • the two hard structures 122 are separated by an insulating layer 121.
  • the insulating layer 121 is a non-metallic material, and the insulating layer 121 may be a hard material such as engineering plastic.
  • the hard structure 122 is a metal layer.
  • the two hard structures 122 may be formed on the insulating layer 121 through an evaporation process or injection or printing process.
  • the two hard structures 122 are substantially flush with the first surface 17 and the second surface 18, respectively.
  • the conductive wires 30 located on opposite sides of the base material 10 are insulated from the two rigid structures 122 of the rigid portion 12 respectively.
  • the flexible circuit boards 40 on the two opposite sides of the base material 10 are respectively connected to the conductive wires 30 on the two sides via the conductive adhesive 50.
  • FIG. 8 which is different from the embodiment of FIG. 5 in that the hard portion 12 penetrates the opposite surfaces of the base material 10 in the thickness direction of the base material 10.
  • the thickness of the hard portion 12 corresponds to the thickness of the base material 10.
  • the hard portion 12 has an upper surface 123 substantially flush with the first surface 17 and a lower surface 124 substantially flush with the second surface 18.
  • the conductive adhesive 50 covers the binding area 11, and the flexible circuit board 40 communicates with the conductive wire 30 via the conductive adhesive 50.
  • the hard portion 12 penetrates the opposite surfaces of the base material 10 in the thickness direction of the base material 10 to further reinforce the binding area 11.
  • FIG. 9 is different from the embodiment of FIG. 8 in that the wire 30 partially covers the upper surface 123 of the hard portion 12, and the flexible circuit board 40 and the hard portion 12 are not covered by the wire 30 Binding.
  • the base material 10 may be provided with a plurality of hard parts, the plurality of hard parts 12 are insulated from each other, and the plurality of hard parts 12 together form the pins of the binding area 11 to facilitate each hard part 12 to correspond to the flexible circuit board 40 The line is on.
  • the conductive wire 30 and the flexible circuit board 40 are disposed on the first surface 17 of the base material 10, and the conductive wire 30 and the upper surfaces 123 of the plurality of hard portions 12 are soldered by low temperature solder, that is, each hard portion 12 is connected to the corresponding conductive wire 30 .
  • Low-temperature solders include lead-tin alloys, bismuth-tin alloys and other low-temperature solders with melting points less than 230 degrees.
  • the flexible circuit board 40 is bonded to the area of the hard portion 12 that is not covered by the wire 30 via the conductive adhesive 50, and the flexible circuit board 40 is electrically connected to the hard portion 12 via the conductive adhesive 50.
  • the present embodiment not only increases the functional stability of the flexible panel 100, but also provides a way of using low-temperature solder to conduct the electrical connection between the flexible panel 100 and the functional element.
  • FIG. 10 is different from the embodiment of FIG. 9 in that the conductive adhesive 50 completely covers the upper surface 123 of the hard portion 12.
  • the wire 30 is disposed on the second surface 18 of the substrate 10.
  • the flexible circuit board 40 and the wires 30 are located on opposite sides of the substrate 20 respectively.
  • the flexible circuit board 40 is connected to the wires 30 through the metal material of the hard portion 12 so that the flexible circuit board 40 does not need to be connected to external devices in a bent state.
  • the hard portion 12 is a thin metal layer embedded in the substrate 10 and is flat with the upper surface 17 of the substrate 10 Qi.
  • the hard portion 12 is processed with a plurality of partition voids 126 through a laser etching process or a cutting process.
  • a plurality of partition voids 126 partition the hard portion 12 into a plurality of mutually-insulated hard blocks 125.
  • a part of the hard block 125 can be connected to the flexible circuit board 40 through the conductive adhesive 50, and the other part can be connected to the corresponding wire 30 by soldering to realize the flexible circuit board 40 through the hard block 125 and the wire 30 and the electronic device 20 turned on.
  • the partition gap 126 can be optimally set according to the wiring structure of the flexible circuit board 40 to meet various wiring structure forms of the flexible circuit board 40 and facilitate binding of the hard portion 12 to the flexible circuit board 40.
  • the hard portion 12 forms one side of the base material 10.
  • the flexible circuit board 40 and the lead 30 are formed on one side of the base material 10, and the thickness of the hard portion 12 in the present embodiment is small, so that the subsequent processing of the separation gap 126 is simpler.
  • FIG. 13 which is different from the embodiment shown in FIGS. 11 and 12 in that the opposite sides of the substrate 10 are provided with hard portions 12, and the hard portions 12 are thin metal layers.
  • the opposite sides of the base material 10 are provided with wires 30 and a flexible circuit board 40, and the wires 30 and the flexible circuit board 40 on the opposite sides are electrically connected to the hard portions 12 on the opposite sides.
  • FIG. 14 is different from the embodiment of FIG. 11 in that the wire 30 completely covers the hard portion 12, so that the wire 30 and the metal material of the hard portion 12 are electrically connected.
  • the flexible circuit board 40 is connected to the conductive wire 30 via the conductive adhesive 50, and the conductive adhesive 50 covers the hard portion 12.
  • FIG. 15 is different from the embodiment shown in FIG. 14 in that the opposite sides of the substrate 10 are provided with hard portions 12, and two layers of conductive adhesive 50 cover the two hard portions respectively 12.
  • the opposite sides of the base material 10 are provided with wires 30 and a flexible circuit board 40, the wires 30 on the opposite sides are connected to the hard parts 12 on the opposite sides, and the flexible circuit boards 40 on the opposite sides are connected to the leads 30 on the opposite sides via conductive adhesive .
  • the present application also provides a method for manufacturing a flexible panel, including steps:
  • a hard material 120 containing a metal material can be provided.
  • the hard member 120 may be a mixture of metallic materials and non-metallic materials, or may be a metal sheet or a metal block.
  • the hard member 120 has a higher hardness, which is convenient for the hard member 120 to provide a strong stress structure for the flexible panel 100.
  • the hard member 120 is a filler block combining a metal block and a non-metallic plastic.
  • the hard member 120 includes a plurality of metal blocks 1201 and a plastic body 1202 integrally formed with the plurality of metal blocks 1201.
  • the plurality of metal blocks 1201 may be isolated and insulated from each other.
  • the plastic body 1202 and the plurality of metal blocks 1201 can be integrally formed by an injection mold. By combining the plastic body 1202 with a plurality of metal blocks 1201, the manufacturing cost of the hard member 120 is reduced, and the high hardness requirement of the hard member 120 is satisfied.
  • the material of the metal block 1201 is a weldable metal material such as copper, silver, gold, nickel and other metals or alloy materials.
  • FIG. 17 is different from the embodiment of FIG. 16 in that the hard member 120 has a metal strip structure.
  • a plurality of rigid members 120 are provided, and the plurality of rigid members 120 may be arranged in isolation from each other, so as to facilitate the plurality of rigid members 120 to meet the hardness requirements of the flexible panel 100.
  • FIG. 18 is different from the embodiment of FIG. 17 in that the hard member 120 has a thin metal layer structure.
  • the hard member 120 can be processed into a plurality of partition voids 126 by laser etching process or cutting etching.
  • a plurality of partition voids 126 separates the hard member 120 into a plurality of hard blocks 125 that are insulated from each other.
  • the base material 10 includes a binding area 11 for connecting with a functional element, and a hard portion 12 that strengthens the supporting strength of the binding area 11, and the electronic device 20 is fixed to the The substrate 10 and the electronic device 20 are connected to the wire 30 extending to the binding area 11.
  • step 102 includes the following steps:
  • the base material may be a thermoplastic elastomer plastic material such as synthetic rubber such as polyurethane, silicone, natural rubber, ethylene propylene rubber, styrene-butadiene rubber, butyl rubber, and silicone rubber.
  • synthetic rubber such as polyurethane, silicone, natural rubber, ethylene propylene rubber, styrene-butadiene rubber, butyl rubber, and silicone rubber.
  • the base material is heated to form a molten molding material.
  • the base material may be heated and pressurized by an injection molding machine, so that the base material forms a molding material that can flow in a molten state.
  • the use of the molding material in a flowable liquid state or semi-liquid state facilitates the combination of the molding material and the hard member 120, and facilitates the molding material to form a substrate structure with bendable properties.
  • the hard member 120 is mixed into the molding material.
  • a molding die 200 is provided.
  • the molding die 200 has a cavity 201, and a hard member 120 containing a metal material is placed in the cavity 201. The molten molding material is injected into the cavity 201.
  • a base material 10 is formed, and the hard portion 12 of the base material 10 includes a metal material.
  • the material to be molded is cooled and solidified to obtain the base material 10, and the hard member 120 forms the hard portion 12 of the base material 10 so that the hard portion 12 includes a metal material.
  • the hard portion 12 is formed at a position where the binding area 11 is provided on the base material 10 to strengthen the supporting strength of the binding area 11.
  • the metal block 1201 of the hard portion 12 may be formed on one surface of the base material 10. The surface of the metal block 1201 is substantially flush with the surface of the substrate 10.
  • the base material 10 can also be formed by mixing the molding material and the hard member 120 through molding processes such as blow molding, calendering, casting, and casting. After processing the molding material to form the film layer structure, the hard member 120 may be embedded in the film layer structure to form the base material 10 by heating or pressing. The metal blocks 1201 of the hard portion 12 may be formed on opposite sides of the base material 10.
  • the electronic device 20 and the wire 30 are formed.
  • the wire 30 is connected to the electronic device 20 and extends to the binding area 11.
  • the electronic device 20 and the wire 30 may be printed on the substrate 10 by a screen printing process.
  • the electronic device 20 may be composed of a plurality of capacitive sensing units 21 arranged in an array.
  • the electronic device 20 is formed at the flexible portion 16 of the substrate 10 so that the electronic device 20 can bend and stretch with the substrate 10.
  • the wire 30 is formed on the same side of the substrate 10 and the electronic device 20 to electrically connect the electronic device 20 and the bonding area 11.
  • the electronic device 20 and the wire 30 may also be formed on opposite sides of the substrate 10.
  • the step of forming the electronic device 20 and the wire 30 may be before the step of forming the hard portion 12.
  • the present application also provides a method for manufacturing a flexible panel, which further includes steps:
  • the conductive adhesive 50 is applied to the binding area 11 of the substrate 10, and one end of the flexible circuit board 40 is attached to the conductive adhesive 50. Apply a certain squeezing force to the flexible circuit board 40 and the substrate 10, and heat the conductive adhesive 50 to facilitate the conductive adhesive 50 to firmly connect the flexible circuit board 40 and the substrate 10, and to guide the flexible circuit board 40 and the lead 30 through.
  • the hard portion 12 enhances the hardness of the binding area 11, prevents the base material 10 from being deformed, and ensures the functional stability of the flexible panel 100.
  • the flexible circuit board 40 can be electrically connected to the metal material of the hard portion 12 via the conductive adhesive 50, and can be electrically connected to the wire 30 through the metal material of the hard portion.
  • the substrate is provided with a hard part, which provides stress reinforcement to the binding area, so that the binding area is not easily deformed, preventing the failure of the connection between the electronic device and the functional element, and improving the functional stability of the flexible panel.

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Abstract

本申请提供一种柔性面板及柔性面板制作方法，所述柔性面板(100)包括基材(10)和电子器件(20)，基材(10)包括用于和功能元件连接的绑定区(11)，所述基材(10)设有强化所述绑定区(11)的支撑强度的硬质部(12)，所述电子器件(20)固定于所述基材(10)，所述电子器件(20)与延伸至所述绑定区(11)的导线(30)连接。通过在基材(10)设有硬质部(12)，硬质部(12)对绑定区(11)提供应力补强，使得绑定区(11)不易产生变形，防止电子器件(20)与功能元件连接失效，提高了柔性面板(100)的功能稳定性。

Description

柔性面板及柔性面板制作方法 技术领域
本申请涉及柔性设备领域，具体涉及一种柔性面板及柔性面板制作方法。
背景技术
目前柔性显示面板或柔性触摸面板的基材为柔性基材，其强度不足，导致在热压绑定或焊接的过程中，基材在绑定区处易发生变形而与功能元件无法有效的连接，影响柔性面板功能稳定性。
发明内容
本申请提供一种柔性面板及柔性面板制作方法。
本申请提供一种柔性面板，其中，柔性面板包括基材和电子器件，基材包括用于和功能元件连接的绑定区，基材设有强化绑定区的支撑强度的硬质部，电子器件固定于基材，电子器件与延伸至绑定区的导线连接。
本申请提供一种柔性面板制作方法，其中，柔性面板制作方法包括步骤：
提供金属材料；形成基材和电子器件，基材包括用于和功能元件连接的绑定区，以及强化绑定区的支撑强度的硬质部，电子器件固定于基材，电子器件与延伸至绑定区的导线连接。
本申请的柔性面板及柔性面板制作方法，通过在基材设有硬质部，硬质部对绑定区提供应力补强，使得绑定区不易产生变形，防止电子器件与功能元件连接失效，提高了柔性面板的功能稳定性。
附图说明
图1是本申请实施例提供的柔性面板的示意图。
图2是本申请实施例提供的柔性面板的基材的立体示意图。
图3是本申请另一实施例提供的柔性面板的截面示意图。
图4是本申请另一实施例提供的柔性面板的截面示意图。
图5是本申请实施例提供的柔性面板的截面示意图。
图6是本申请另一实施例提供的柔性面板的示意图。
图7是本申请另一实施例提供的柔性面板的示意图。
图8是本申请另一实施例提供的柔性面板的示意图。
图9是本申请另一实施例提供的柔性面板的示意图。
图10是本申请另一实施例提供的柔性面板的示意图。
图11是本申请另一实施例提供的柔性面板的示意图。
图12是本申请另一实施例提供的柔性面板的示意图。
图13是本申请另一实施例提供的柔性面板的示意图。
图14是本申请另一实施例提供的柔性面板的示意图。
图15是本申请另一实施例提供的柔性面板的示意图。
图16是本申请实施例提供的柔性面板制作的加工示意图。
图17是本申请另一实施例提供的柔性面板制作的加工示意图。
图18是本申请另一实施例提供的柔性面板制作的加工示意图。
图19是本申请实施例提供的柔性面板制作的加工示意图。
图20是本申请实施例提供的柔性面板制作的加工示意图。
图21是本申请实施例提供的柔性面板制作的流程示意图。
图22是本申请实施例提供的柔性面板制作的步骤102的流程示意图。
具体实施例
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请一并参阅图1和图2，本申请提供一种柔性面板100，包括基材10和电子器件20。基材10包括用于和功能元件连接的绑定区11，基材10设有强化绑定区11的支撑强度的硬质部12，硬质部12含金属材料。电子器件20固定于基材10，设于与硬质部12相连接的柔性部16上。电子器件20与延伸至绑定区11的导线30连接。硬质部12的厚度大于导线30的厚度。
可以理解的是，柔性面板100可以是柔性传感器、或柔性显示面板、或柔性触摸面板等柔性面板。柔性面板100可以应用于可弯曲或可拉伸的电子设备中，可弯曲或可拉伸的电子设备可以是手机、手表、护腕等可穿戴设备。柔性面板100还可以用于检测监测、娱乐交互和智能穿戴等领域的可弯曲或可拉伸电子设备中。
通过在基材10设有含金属材料的硬质部12，硬质部12对绑定区11提供应力补强，使得绑定区11的基材10不易产生变形，防止电子器件20与功能元件连接失效，提高了柔性面板100的功能稳定性。
本实施方式中，基材10为具有柔性性能可弯曲的基材或具有弹性性能可拉伸的基材。基材10包括第一短边13和相对第一短边13设置的第二短边14，以及连接于第一短边13和第二短边14之间的两个相对的长边15。基材10还设有与硬质部12相连接的柔性部16。 柔性部16占据基材10较大的面积，硬质部12大致邻近于第一短边13。硬质部12可以大致呈长条状或呈矩形块状。硬质部12可以大致沿垂直第一短边13延伸，或者沿其他任意方向延伸。硬质部12的硬度大于柔性部16的硬度。硬质部12的厚度可以与柔性部16的厚度一致，也可以是小于柔性部16的厚度。基材10的厚度大致为5μm～80μm。柔性部16可以根据需求任意弯曲及拉伸，以满足基材10的弯曲及拉伸的要求。硬质部12具有较强的内应力，硬质部12在受热、受压作用下，不易产生变形。硬质部12可以为绑定区11提供较稳固的连接结构，以方便基材10在绑定区11与功能元件电连接，防止基材10在绑定区11与功能元件连接失效，提高柔性面板100的功能稳定性。基材10的材质可以是聚氨酯、有机硅、天然橡胶、乙丙橡胶、丁苯橡胶、丁基橡胶、硅橡胶等合成橡胶、或热性塑性弹性体等材料。基材10可通过吹塑、压延、流延、浇注、注塑等工艺制造成膜。硬质部12包括金属片材，也可以是非金属片材上镀设有可焊接的金属膜层的混合片材。金属片材或混合片材可在基材10的形成过程中，混入基材10中形成硬质部12，实现与基材10的柔性部16一体设置。即硬质部12与柔性部16结构稳固，不易分离，而且硬质部12可以有效对绑定区11提供应力支撑，防止绑定区11的基材10在受热受压情况下产生形变，防止柔性面板100与功能元件连接失效。硬质部12可以全部覆盖绑定区11，也可以是部分覆盖绑定区11，只要硬质部12可以根据需要对绑定区11提供应力补强即可。当然，在其他实施方式中，基材10也可以设有多个相互隔离的硬质部12。硬质部12的形状还可以是圆形或方形或异形的其他形状。
本实施方式中，电子器件20为触控电极，即柔性面板100为柔性触控面板。柔性面板100可以应用于可感应外部信号的折叠手机、柔性可穿戴设备、柔性检测设备等电子设备。作为一种实施方式，电子器件20可以是由多个电容感应单元21构成。多个电容感应单元21在柔性部16上阵列排布。多个电容感应单元21可以是丝网印刷工艺印刷于基材10上。多个电容感应单元21可以随柔性部16弯曲或拉伸而相互靠拢或相互远离。导线30包括多条信号线31。信号线31连接电容感应单元21，信号线31的一端延伸至绑定区11以方便功能元件在绑定区11与信号线31导通，并实现获取多个电容感应单元21的感应信号。信号线31可以随柔性部16弯曲、拉伸，以方便柔性面板100在弯曲、拉伸形变状态下可以感应信号。信号线31位于绑定区11的一端构成电子器件20的引导端。硬质部12对绑定区11的基材10补强，防止绑定区11受热变形而导致与功能元件接触不良，增加柔性面板100功能稳定性。
本实施方式中，所述柔性面板100为柔性触控面板，如图3所示，提供一种柔性触摸显示屏1000，柔性触摸显示屏1000包括透光盖板1001、柔性面板100和显示面板1002。所述柔性面板100贴合于所述透光盖板1001和所述显示面板1002之间。所述柔性面板100的柔性部16大致与所述显示面板1002的显示区域相对齐，以使得所述柔性面板100可以结合所述显示面板1002的显示区域形成虚拟按键。所述柔性面板100的绑定区11可以相对显示面板1002凸出，方便与柔性电路板40绑定，以使得所述柔性触摸显示屏1000具有触控功能。当然，在其他实施方式中，所述柔性面板100还可以贴合于显示面板1002背离透光盖板1001一侧，或者是集成于透光盖板1001。当然，所述柔性面板100也可以应用于护腕、手表、绑带等具有需要设置触控功能的可穿戴设备。
在另一个实施例中，请参阅图4，与图3所示实施例不同的是，所述柔性面板100为柔性显示面板。提供一种了柔性显示屏2000，柔性显示屏2000包括透光盖板2001和柔性面板100。所述柔性面板100贴合于所述透光盖板2001，所述柔性面板100还包括显示层110，所述显示层110贴合于所述基材10排布所述电子器件20一侧。显示层110具有阵列的多个发光单元。电子器件20为驱动电极。电子器件20可以驱动所述显示层110的多个发光单元发光。电子器件20可以由阵列的多个驱动单元22构成。每一驱动单元22与显示层110的每一发光单元正对。每一驱动单元22可以由薄膜晶体二极管开关构成。柔性部16与显示层110的显示区域大致对齐。电子器件20驱动显示层110的显示区域发光显示图像。绑定区11相对显示层110凸出，方便与柔性电路板40绑定，以使得柔性显示屏2000可以经柔性电路板40获取显示信号。当然，在其他实施方式中，柔性面板100也可以是应用于可折叠平板电脑、可折叠显示器等具有柔性显示功能的电子设备中。
进一步地，请参阅图5，柔性面板100还包括柔性电路板40，柔性电路板40的一部分固定于绑定区11，并与导线30连接。
本实施方式中，柔性电路板40包括固定连接基材10的第一端41和相对第一端41设置的第二端42。第一端41固定于绑定区11并覆盖绑定区11。第一端41设置有多个露铜。多个露铜可与多条导线30导通，以使得电子器件20可以经导线30与柔性电路板40导通。第二端42与基材10相错开，第二端42可以设有连接器421。连接器421与多个露铜经铜箔线缆导通，以使得连接器421可以经导线30与电子器件20导通。在连接器421与电子设备的主板连接时，电子器件20可以将感应信号经柔性电路板40传送至电子设备的主板，以使得柔性面板100可以对外发送感应信号。利用硬质部12可以对绑定区11进行强化，以保证与绑定区11相对的导线30与柔性电路板40的第一端41可以稳固接触，以增加导通性能。
在一个实施例中，柔性电路板40经导电胶50固定于绑定区11，并经导电胶50与导线30导通。绑定区11与硬质部12相重合。导电胶50完全覆盖绑定区11，即导电胶50完全覆盖硬质部12。导电胶50与硬质部12的金属材料可以经绝缘层相隔离。导电胶50与延伸至绑定区11的导线30相接触。导线30与硬质部12的金属材料之间也可通过绝缘层绝缘。柔性电路板40经导电胶50与基材10粘接稳固，以及使得柔性电路板40的露铜与导线30可有效导通。在柔性电路板40与基材10经导电胶50稳固连接的过程中，需要对柔性电路板40、导电胶50和基材10进行加热，并使得柔性电路板40和基材10在较大压力作用下挤压导电胶，使得导电胶内的导电粒子上下导通，以使得导电胶50可以呈现稳固粘接和导通性能。利用硬质部12对绑定区11补强，使得基材10在绑定区11硬度增加，基材10在绑定区11处不易变形，减小柔性电路板40与基材10连接失效的几率，提高柔性电路板100的功能稳定性。
硬质部12包括金属材料。金属材料可以在基材10形成过程中，通过模具一体成型于基材10中，形成硬质部12。即硬质部12嵌入基材10内。硬质部12具有与基材10表面相平齐的外表面，以及具有位于基材10内部的内表面。基材10具有第一表面17和相对第一表面17设置的第二表面18。硬质部12的厚度小于基材10的厚度。硬质部12形成于基材10与第一表面17大致平齐处。硬质部12远离第一表面17的表面距离第二表面18存在 间距。柔性电路板40和导线30均设置于基材10的第一表面17上。
在另一个实施例中，请参阅图6，与图5所示实施例不同的是，基材10在第一表面17和第二表面18均设有硬质部12。即两个硬质部12的金属材料分别位于第一表面17和第二表面18大致平齐的位置。两个硬质部12的金属材料通过基材10本身的非金属材料相隔离。柔性面板100在第一表面17和第二表面18均设置有柔性电路板40和导线30，也就是说柔性面板100可以同时在基材10的上下两面与功能元件进行绑定。
在另一个实施方式中，请参阅图7，与图6实施例不同的是，硬质部12包括分别位于基材相对两侧的两个硬质结构122，在所述基材10的厚度方向上，两个硬质结构122之间通过绝缘层121隔开。具体的，绝缘层121为非金属材料，绝缘层121可以为工程塑料等硬质材质。硬质结构122为金属层。两个硬质结构122可以经蒸镀工艺或者是经射入或印刷工艺成型于绝缘层121上。两个硬质结构122分别与第一表面17和第二表面18大致平齐。位于基材10相对两面的导线30分别与硬质部12的两个硬质结构122绝缘。位于基材10相对两面的柔性电路板40分别与两面的导线30经导电胶50导通。
在另一个实施方式中，请参阅图8，与图5实施例不同的是，硬质部12沿基材10的厚度方向贯通基材10的相对两表面。硬质部12厚度与基材10的厚度一致。硬质部12具有与第一表面17大致平齐的上表面123和与第二表面18大致平齐的下表面124。导电胶50覆盖绑定区11，柔性电路板40经导电胶50与导线30导通。本实施方式中，硬质部12在基材10厚度方向上贯通基材10相对的两表面，进一步对绑定区11进行加固。
在另一个实施方式中，请参阅图9，与图8实施例不同的是，导线30部分覆盖硬质部12的上表面123，柔性电路板40与硬质部12未被导线30覆盖的区域绑定。基材10可设置多个硬质部，多个硬质部12相互绝缘，多个硬质部12共同形成绑定区11的引脚，以方便每一硬质部12与柔性电路板40相应的线路导通。导线30与柔性电路板40设置于基材10的第一表面17上，导线30与多个硬质部12的上表面123通过低温焊料焊接，即各硬质部12与相应的导线30导通。低温焊料包括铅锡合金、铋锡合金等熔点小于230度的低温焊料。柔性电路板40经导电胶50粘接于硬质部12未被导线30覆盖的区域，柔性电路板40经导电胶50与硬质部12导通。本实施方式不仅增加柔性面板100的功能稳定性，也给柔性面板100与功能元件的电连接提供了使用低温焊料来导通这种方式。
在另一个实施例中，请参阅图10，与图9实施例不同的是，导电胶50完全覆盖硬质部12的上表面123。导线30设置于基材10的第二表面18。柔性电路板40和导线30分别位于基材20相对的两面，柔性电路板40经硬质部12的金属材料与导线30导通，使得柔性电路板40不用以弯折状态连接外部器件。
在另一个实施例中，请参阅图11和图12，与图5所示的实施例不同的是硬质部12为薄金属层嵌入于基材10内，并与基材10上表面17平齐。硬质部12经激光蚀刻工艺、或切割工艺加工出多个隔断空隙126。多个隔断空隙126将硬质部12分隔出多个相互绝缘的硬质块125。硬质块125一部分可经导电胶50与柔性电路板40导通，另一部分可以与相应的导线30以焊接的方式导通，以实现柔性电路板40经硬质块125与导线30及电子器件20导通。隔断空隙126可以根据柔性电路板40的走线结构进行优化设置，以满足柔性电路板40多种排线结构形式，方便硬质部12与柔性电路板40绑定。硬质部12形成基材10 的一面。柔性电路板40和导线30形成于基材10的一面，本实施方式中的硬质部12的厚度较小，如此使后续隔断空隙126的加工更为简单。在另一个实施方式中，请参阅图13，与图11和图12所示实施例不同的是，基材10相对两面都设有硬质部12，且硬质部12都为薄金属层。基材10的相对两面均设有导线30和柔性电路板40，相对两面的导线30和柔性电路板40与相对两面的硬质部12电连接。
在另一个实施方式中，请参阅图14，与图11实施例不同的是，导线30完全覆盖硬质部12，以使导线30与硬质部12的金属材料导通。柔性电路板40经导电胶50与导线30导通，导电胶50覆盖硬质部12。
在另一个实施方式中，请参阅图15，与图14所示实施例不同的是，基材10的相对两面都设有硬质部12，且两层导电胶50分别覆盖两个硬质部12。基材10的相对两面均设有导线30和柔性电路板40，相对两面的导线30与相对两面的硬质部12连接，相对两面的柔性电路板40经导电胶50与相对两面的导线30连接。
请参阅图21和图22，本申请还提供一种柔性面板制作方法，包括步骤：
101：提供金属材料。
本实施方式中，可以提供含有金属材料的硬质件120。硬质件120可以是金属材料与非金属材料的混合件，也可以是金属片材或金属块。利用硬质件120内金属材料的刚性应力，使得硬质件120具有较高的硬度，方便硬质件120为柔性面板100提供较强应力结构。
请参阅图16，在一个实施例中，硬质件120为金属块与非金属塑胶相结合的填充块。硬质件120包括多个金属块1201和与多个金属块1201一体成型的塑胶体1202。多个金属块1201可以相互隔离并绝缘。塑胶体1202与多个金属块1201可以经注塑模具一体成型。通过将塑胶体1202与多个金属块1201相结合，减小硬质件120的制作成本，并满足硬质件120的高硬度要求。金属块1201的材质为铜、银、金、镍等金属或合金材料等可焊接的金属材料。
在另一个实施例中，请参阅图17，与图16实施例不同的是，硬质件120呈金属条状结构。提供多个硬质件120，多个硬质件120可以是相互隔离排布，以方便多个硬质件120满足柔性面板100的硬度需求。
在另一个实施例中，请参阅图18，与图17实施例不同的是，硬质件120呈薄金属层结构。硬质件120可以经激光蚀刻工艺、或切割蚀刻加工出多个隔断空隙126。多个隔断空隙126将硬质件120分隔出多个相互绝缘的硬质块125。
102：形成基材10和电子器件20，基材10包括用于和功能元件连接的绑定区11，以及强化绑定区11的支撑强度的硬质部12，电子器20件固定于所述基材10，电子器件20与延伸至所述绑定区11的导线30连接。
请参阅图19和图22，本实施方式中，步骤102包括步骤：
1021：提供基材原材料。
本实施方式中，基材原材料可以是聚氨酯、有机硅、天然橡胶、乙丙橡胶、丁苯橡胶、丁基橡胶、硅橡胶等合成橡胶等热塑料弹性体塑料材质。
1022：对基材原材料和金属材料加工。
本实施方式中，对基材原材料加热，形成熔融状态的成型材料。可以是通过注塑机， 对基材原材料进行加热加压，以使得基材原材料形成熔融状态可以流动的成型材料。利用成型材料呈可流动的液态或半液态，方便成型材料与硬质件120结合，以及方便成型材料形成具有可弯曲性能的基材结构。
将硬质件120混入成型材料。
本实施方式中，提供成型模具200，成型模具200具有模腔201，将含有金属材料的硬质件120放置于模腔201内。向模腔201内注射熔融状态的成型材料。
1023：形成基材10，基材10的硬质部12包括金属材料。
本实施方式中，待成型材料冷却固化，获得基材10，硬质件120形成基材10的硬质部12，以使得硬质部12包括金属材料。硬质部12形成于基材10设置绑定区11的位置，以实现对绑定区11的支撑强度进行强化。硬质部12的金属块1201可以形成于基材10的一面。金属块1201的表面与基材10的表面大致平齐。
当然在其他实施方式中，还可以通过吹塑、压延、流延、浇注等成型工艺将成型材料与硬质件120混合形成基材10。也可以是在成型材料加工形成膜层结构后，通过加热或加压方式将硬质件120埋入膜层结构形成基材10。硬质部12的金属块1201也可以形成于基材10的相对两面。
1024：形成电子器件20以及导线30，导线30连接电子器件20，并延伸至绑定区11。
请参阅图20，本实施方式中，电子器件20和导线30可以采用经丝网印刷工艺印刷于基材10上。电子器件20可以由多个阵列排布的电容感应单元21构成。电子器件20形成于基材10的柔性部16处，以方便电子器件20可随基材10弯曲及拉伸。导线30形成于基材10与电子器件20相同一侧，以将电子器件20与绑定区11电连接。当然，在其他实施方式中，还可以在基材10的相对两面上均形成电子器件20和导线30。当然，在其他实施方式中，形成电子器件20和导线30的步骤也可以在形成硬质部12的步骤之前。
进一步地，本申请还提供一种柔性面板制作方法还包括步骤：
103：提供柔性电路板40，将柔性电路板40在绑定区11处与基材10绑定。
本实施方式中，在基材10的绑定区11处涂刷导电胶50，将柔性电路板40的一端贴合于导电胶50上。对柔性电路板40和基材10施加一定挤压作用力，并对导电胶50进行加热，以方便导电胶50稳固连接柔性电路板40和基材10，以及使得柔性电路板40与导线30导通。硬质部12增强了绑定区11的硬度，防止基材10形变，保证柔性面板100的功能稳定性。当然，在其他实施方式中，柔性电路板40可以经导电胶50与硬质部12的金属材料导通，并通过硬质部的金属材料与导线30导通。
通过基材设有硬质部，硬质部对绑定区提供应力补强，使得绑定区不易产生变形，防止电子器件与功能元件连接失效，提高了柔性面板的功能稳定性。
以上对本申请实施例所提供的一种柔性面板及柔性面板制作方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种柔性面板，其特征在于，所述柔性面板包括基材和电子器件，基材包括用于和功能元件连接的绑定区，所述基材设有强化所述绑定区的支撑强度的硬质部，所述电子器件固定于所述基材，所述电子器件与延伸至所述绑定区的导线连接。
  2. 如权利要求1所述的柔性面板，其特征在于，所述基材包括与所述硬质部连接的柔性部，所述硬质部硬度大于所述柔性部硬度。
  3. 如权利要求1所述的柔性面板，其特征在于，所述硬质部包括金属材料。
  4. 如权利要求1所述的柔性面板，其特征在于，所述硬质部嵌设于所述基材内。
  5. 如权利要求4所述的柔性面板，其特征在于，所述硬质部具有与所述基材的一表面齐平的外表面。
  6. 如权利要求5所述的柔性面板，其特征在于，所述硬质部与外表面相对的内表面位于所述基材内部。
  7. 如权利要求5所述的柔性面板，其特征在于，所述硬质部沿所述基材的厚度方向贯通所述基材的相对二表面。
  8. 如权利要求1所述的柔性面板，其特征在于，所述硬质部的厚度大于所述导线的厚度。
  9. 如权利要求1所述的柔性面板，其特征在于，所述硬质部包括多个分离的硬质块，每一所述硬质块与相应的导线电连接。
  10. 如权利要求9所述的柔性面板其特征在于，多个所述硬质块共同形成所述绑定区的引脚，多个所述硬质块用于和功能元件绑定。
  11. 如权利要要求1所述的柔性面板，其特征在于，所述硬质部包括分别位于所述基材相对两侧的两个硬质结构，在所述基材的厚度方向上，两个所述硬质结构之间通过绝缘层隔开。
  12. 如权利要求1所述的柔性面板，其特征在于，所述导线覆盖所述硬质部。
  13. 如权利要求1所述的柔性面板，其特征在于，所述导线部分覆盖所述硬质部并与所述硬质部导通，所述功能元件与所述硬质部未被所述导线部分覆盖的区域绑定。
  14. 一种柔性面板制作方法，其特征在于，所述柔性面板制作方法包括步骤：
    提供金属材料；
    形成基材和电子器件，所述基材包括用于和功能元件连接的绑定区，以及强化所述绑定区的支撑强度的硬质部，所述电子器件固定于所述基材，所述电子器件与延伸至所述绑定区的导线连接。
  15. 如权利要求14所述的柔性面板制作方法，其特征在于，所述形成基材和电子器件的步骤包括：
    提供基材原材料；
    对所述基材原材料和所述金属材料加工；
    形成基材，所述基材的硬质部包括所述金属材料。
  16. 如权利要求14所述的柔性面板制作方法，其特征在于，在形成基材和电子器件的步骤中，所述硬质部具有与所述基材的一表面平齐的外表面。
  17. 如权利要求16所述的柔性面板制作方法，其特征在于，在形成基材和电子器件的步骤中，所述硬质部与外表面相对的内表面位于所述基材内部。
  18. 如权利要求14所述的柔性面板制作方法，其特征在于，在形成基材和电子器件的步骤中，所述硬质部沿所述基材的厚度方向贯通所述基材的相对二表面。
  19. 如权利要求14所述的柔性面板制作方法，其特征在于，在形成基材和电子器件的步骤中，将所述硬质部加工形成多个分离的硬质块，每一所述硬质块与相应的导线电连接。
  20. 如权利要求14所述的柔性面板制作方法，其特征在于，所述柔性面板制作方法包括步骤：
    提供柔性电路板，将所述柔性电路板在所述绑定区处与所述基材绑定。
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CN106410029A (zh) * 2016-11-04 2017-02-15 上海天马微电子有限公司 一种柔性显示面板及其制作方法、柔性显示装置
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
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JP4603522B2 (ja) * 2006-09-25 2010-12-22 エプソンイメージングデバイス株式会社 実装構造体、電気光学装置及び電子機器
KR101829313B1 (ko) * 2011-11-03 2018-02-20 삼성디스플레이 주식회사 플렉서블 디스플레이 장치

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CN106410029A (zh) * 2016-11-04 2017-02-15 上海天马微电子有限公司 一种柔性显示面板及其制作方法、柔性显示装置
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN108777113A (zh) * 2018-06-14 2018-11-09 武汉华星光电半导体显示技术有限公司 柔性基板结构和显示装置

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