WO2020121775A1 - Tôle d'alliage de cuivre, son procédé de fabrication, produit d'étirage, élément de composant électrique/électronique, matériau de blindage électromagnétique et composant de dissipation de chaleur - Google Patents

Tôle d'alliage de cuivre, son procédé de fabrication, produit d'étirage, élément de composant électrique/électronique, matériau de blindage électromagnétique et composant de dissipation de chaleur Download PDF

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WO2020121775A1
WO2020121775A1 PCT/JP2019/045712 JP2019045712W WO2020121775A1 WO 2020121775 A1 WO2020121775 A1 WO 2020121775A1 JP 2019045712 W JP2019045712 W JP 2019045712W WO 2020121775 A1 WO2020121775 A1 WO 2020121775A1
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copper alloy
alloy sheet
rolling
mass
value
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PCT/JP2019/045712
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English (en)
Japanese (ja)
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俊太 秋谷
樋口　優
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古河電気工業株式会社
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Priority to CN201980064171.1A priority Critical patent/CN112789359B/zh
Priority to KR1020217007855A priority patent/KR20210100078A/ko
Publication of WO2020121775A1 publication Critical patent/WO2020121775A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • C21D8/0221—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the working steps
    • C21D8/0226—Hot rolling
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • C21D8/0221—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the working steps
    • C21D8/0236—Cold rolling
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • C21D8/0247—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the heat treatment
    • C21D8/0273—Final recrystallisation annealing
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Definitions

  • the present invention relates to a copper alloy plate material, a method for manufacturing the same, a drawn product, a member for electric/electronic parts, an electromagnetic wave shield material, and a heat dissipation part.
  • Copper alloy plate materials such as connectors for electric/electronic parts, lead frames, relays, switches, sockets, shield cases, shield cans, liquid crystal reinforcing plates, liquid crystal chassis, organic EL display reinforcing plates, and in-vehicle connectors. Copper alloy plate materials used for shield cases, shield cans and the like are usually subjected to press working such as punching, bending, drawing, and overhanging.
  • the "difficult-to-machine shape” here means, for example, the shape formed when processed with a jig such as a punch whose radius of curvature of corners and edges is smaller than usual when manufacturing drawn products. To do.
  • a drawn product having such a difficult-to-machine shape it cannot be said that the original mechanical and electrical characteristics of the copper alloy sheet are fully utilized.
  • the mechanical and electrical characteristics of the copper alloy sheet material are emphasized, it is necessary to give up processing to a target difficult-to-machine shape, and it is not possible to satisfy the demand for miniaturization of electronic devices.
  • Patent Document 1 one or two kinds of Ni and Co are contained in 0.8 to 4.0 mass %, Si is contained in 0.2 to 1.0 mass %, and one or two kinds of Ni and Co are contained.
  • the mass ratio of Si is 3.0 to 7.0, the balance is Cu and unavoidable impurities, the tensile strength in the rolling parallel direction is 570 MPa or more, the proof stress is 500 MPa or more, the elongation is 5% or more, and the rolling orthogonal direction is Tensile strength is 550MPa or more, proof stress is 480MPa or more, elongation is 5% or more, conductivity is more than 35%IACS, and ratio R/t of bending radius R and plate thickness t is 0.5, and bending line is rolled.
  • the bending limit width when performing 90 degree bending in the vertical direction is 70 mm or more
  • the bending processing limit width when performing contact bending in which the bending line is in the vertical direction is 20 mm or more
  • the Rank Ford value is 0.9.
  • the above is the strength as a structural member, especially the strength to withstand deformation and drop impact resistance, the bending workability to withstand the processing of complex shapes, the workability such as overhanging and drawing, and the high heat radiation performance against heat from semiconductor elements, etc.
  • a copper alloy plate for a heat dissipation component is described.
  • Patent Document 2 contains 0.5 to 3.0% by mass of Co, 0.1 to 2.0% by mass of Ni, and 0.1 to 1.5% by mass of Si in a mass ratio. (Ni+Co)/Si is 3 to 5, the balance is copper and inevitable impurities, 0.2% proof stress in the rolling parallel direction is 630 MPa or more, the conductivity is 50% IACS or more, and the average crystal grain in the rolling parallel cross section.
  • X-ray diffraction integrated intensity I ⁇ 200 ⁇ from the ⁇ 200 ⁇ crystal plane on the surface X-ray diffraction integrated intensity I ⁇ 220 ⁇ from the ⁇ 220 ⁇ crystal plane, and ⁇ 311 ⁇ crystal having a diameter of 10 to 20 ⁇ m X-ray diffraction integrated intensity I ⁇ 311 ⁇ from the plane satisfies the relationship of (I ⁇ 220 ⁇ +I ⁇ 311 ⁇ )/I ⁇ 200 ⁇ 5.0, which is 0.2% suitable for use in electronic materials.
  • a copper alloy for electronic materials which has proof stress and conductivity, and can improve dimensional stability when pressed into a connector shape or the like.
  • Patent Document 3 1.0 to 3.0% by mass of Ni is contained, Si is contained at a concentration of 1/6 to 1/4 with respect to the mass% concentration of Ni, and the balance is Cu and unavoidable.
  • the average deviation Ra of the surface is 0.02 to 0.2 ⁇ m, and the standard deviation of the absolute values of the peaks and troughs based on the surface roughness average line is 0.1 ⁇ m or less, the average value of the aspect ratio of crystal grains in the alloy structure (minor axis of crystal grains/major axis of crystal grains) is 0.4 to 0.6, and the backscattered electron diffraction image system is provided.
  • Patent Documents 1 to 3 are inventions relating to a copper alloy sheet material containing at least one of Ni and Co and Si and have good drawability, but copper alloys Among the steps constituting the method for manufacturing a plate material, particularly in the series of steps from the finish cold rolling step to the temper annealing step, control is not performed to suppress the generation of crystal grains that deteriorate the drawability.
  • control is not performed to suppress the generation of crystal grains that deteriorate the drawability.
  • the processing conditions are particularly severe when performing a deep drawing test, particularly when the punching is performed with a punch having a small radius of curvature R at the corner (for example, the radius of curvature R is 0.9 mm or less)
  • a satisfactory level of drawing is obtained.
  • workability cannot be stably obtained.
  • JP, 2017-89003 A Japanese Patent Laid-Open No. 2018-62705 International Publication No. 2012/160684
  • An object of the present invention is to provide a copper alloy sheet material capable of stably obtaining excellent drawability even under severe drawing conditions without impairing the basic properties (especially heat dissipation) of conventional copper alloy sheet materials.
  • Another object of the present invention is to provide a manufacturing method thereof, a drawn product, a member for electric/electronic parts, an electromagnetic wave shielding material and a heat dissipation part.
  • the gist configuration of the present invention is as follows. (1) It has a composition containing 1.0 to 5.0 mass% of Ni and Co in a total amount of 1.0 to 5.0 mass% and 0.1 to 1.5 mass% of Si, and the balance of Cu and unavoidable impurities. , The conductivity was 38% IACS or more, and obtained by performing a tensile test on three types of test pieces cut out in the rolling parallel direction, the direction of 45° to the rolling direction, and the vertical direction of the rolling.
  • the ratio (Er/t ratio) of the Erichsen value (Er) to the plate thickness (t) in the Erichsen test and the breaking elongation EL (%) when pulled in the rolling parallel direction are expressed by the following formula (4).
  • the copper alloy sheet material according to (1) or (2) which satisfies the inequality relationship.
  • the composition further contains at least one component selected from the group consisting of Sn, Mg, Mn, Cr, Zr, Ti, Fe and Zn in a total amount of 0.2 to 1.2% by mass or less.
  • the elongation rate ⁇ of the material is set to 0.1 to 1.0%, and the material temperature TA (° C.) of the temper annealing [step 10] is expressed by the following equation (5) in relation to the elongation rate ⁇ .
  • the copper alloy sheet of the present invention contains 1.0 to 5.0 mass% of Ni and Co in total and 0.1 to 1.5 mass% of Si, and the balance of Cu and unavoidable impurities.
  • Tensile tests were carried out on three types of test pieces having a certain composition, an electric conductivity of 38% IACS or more, and cut in the rolling parallel direction, the direction of 45° to the rolling direction, and the vertical direction of the rolling.
  • the value obtained from the nominal stress-nominal strain curve obtained by performing the above and the value of the Cube orientation area ratio obtained by the electron backscatter diffraction (EBSD) method are substituted into the above equation (1) to obtain the parameter Ax.
  • the method for producing a copper alloy sheet according to the present invention is performed on a copper alloy material by casting [step 1], homogenizing treatment [step 2], hot rolling [step 3], chamfering [step 4], cold rolling [step. 5], solution heat treatment [Step 6], intermediate heat treatment [Step 7], finish cold rolling [Step 8], straightening [Step 9], and temper annealing [Step 10], and the finish cold rolling.
  • the maximum temperature TR of the material during rolling in [Step 8] is controlled to 75° C. or higher and 100° C.
  • the elongation rate ⁇ of the material in the straightening [Step 9] is set to 0.1 to 1.0%, and
  • the material temperature TA (° C.) in the heat treatment annealing [step 10] so as to satisfy the inequality shown in the equation (5) in relation to the elongation ⁇ , the above-mentioned copper alloy sheet material Can be manufactured.
  • FIG. 1 is a diagram showing, as an example, a nominal stress-nominal strain curve obtained by performing a tensile test on a test piece cut out from a copper alloy sheet according to an embodiment of the present invention in a rolling parallel direction.
  • Fig. 2 shows the fracture ratio when the ratio (Er/t ratio) of the Erichsen value (Er) to the plate thickness (t) obtained by conducting Erichsen test for various copper alloy sheet materials was pulled in the rolling parallel direction. It is a figure when it plots in relation with elongation EL (%).
  • FIG. 1 is a diagram showing, as an example, a nominal stress-nominal strain curve obtained by performing a tensile test on a test piece cut out from a copper alloy sheet according to an embodiment of the present invention in a rolling parallel direction.
  • Fig. 2 shows the fracture ratio when the ratio (Er/t ratio) of the Erichsen value (Er) to the plate thickness (t) obtained by conducting Erichsen test for various copper alloy sheet materials was pulled in
  • FIG. 3 conceptually shows a state in which the center portion of the test plate W is pushed by a punch having a cylindrical tip and a small radius of curvature R at the corners in order to evaluate the drawability with a deep drawing tester.
  • FIG. 4 is a view conceptually showing a state in which the central portion of the test plate W is pushed in by a punch having a hemispherical tip so as to obtain the Erichsen value by the Erichsen tester.
  • the copper alloy sheet according to the present invention contains 1.0 to 5.0 mass% of Ni and Co in total, and 0.1 to 1.5 mass% of Si, and the balance of Cu and unavoidable impurities.
  • Tensile tests were carried out on three types of test pieces having a certain composition, an electric conductivity of 38% IACS or more, and cut in the rolling parallel direction, the direction of 45° to the rolling direction, and the vertical direction of the rolling.
  • the value obtained from the nominal stress-nominal strain curve obtained by performing and the value of the Cube azimuth area ratio obtained by the electron backscatter diffraction (EBSD) method are substituted into the following formula (1) to obtain the parameter Ax.
  • the copper alloy sheet material of the present invention contains 1.0 to 5.0 mass% of Ni and Co in total and 0.1 to 1.5 mass% of Si.
  • Ni (nickel) and Co (cobalt) are elements necessary for increasing the strength of the copper alloy sheet material, and it is necessary to contain 1.0 to 5.0 mass% of Ni and Co in total. Is. If the total content of one or more of Ni and Co is less than 1.0% by mass, the material strength decreases, and the strength required for an electronic component such as a shield case that is a drawn product manufactured by drawing is obtained. I can't. Further, when the total content of one or more of Ni and Co is more than 5.0% by mass, Ni and Co cannot be completely dissolved in the solution heat treatment [step 6] described later and a metallic structure is formed as a second phase.
  • the total content of at least one of Ni and Co is set to the range of 1.0 to 5.0 mass %.
  • the total content is preferably in the range of 1.0 to 4.0% by mass.
  • Si is an element necessary for forming a compound with Ni or Co and increasing the strength of the copper alloy sheet, and it is necessary to contain Si in an amount of 0.1 to 1.5 mass %. This is because if the Si content is less than 0.1% by mass, the amount of the compound formed with Ni or Co will decrease and the material strength will decrease. Further, if the Si content is more than 1.5% by mass, the thermal conductivity of the copper alloy plate material is lowered and the heat dissipation is deteriorated. Therefore, the Si content is set to the range of 0.1 to 1.5 mass %. The Si content is preferably in the range of 0.2 to 1.0% by mass.
  • the copper alloy sheet of the present invention contains one or more components of Ni and Co and Si as essential basic components, and further contains Sn, Mg, Mn, Cr, Zr, as an optional additional component. At least one component selected from the group consisting of Ti, Fe and Zn may be contained in a total amount of 0.2 to 1.2% by mass or less. All of these components are components having an effect of improving the material strength, and in order to exert such an effect, the total content of these components is preferably 0.2% by mass or more. Further, if the total content of these components exceeds 1.2% by mass, the conductivity tends to decrease, so the total content of the above components is in the range of 0.2 to 1.2% by mass. It is preferable that 0.5 to 1.0% by mass is particularly preferable.
  • Sn (tin) is an element having a high effect of solid-solution strengthening a copper alloy, and it is preferable to add 0.1 mass% or more, but if the addition amount exceeds 0.45 mass %, the conductivity decreases. Tend to let. Therefore, the amount of Si added is preferably in the range of 0.1 to 0.45 mass %.
  • Mg manganesium
  • Mg is an element having a high effect of solid-solution strengthening a copper alloy, and it is preferable to add 0.1 mass% or more, but if the addition amount exceeds 0.25 mass%, the conductivity decreases. Tend to let. Therefore, the amount of Mg added is preferably in the range of 0.1 to 0.25% by mass.
  • Mn manganese
  • Mn is an element having an effect of solid solution strengthening a copper alloy and an effect of improving hot workability, and is preferably added in an amount of 0.1% by mass or more, but more than 0.2% by mass. A larger amount tends to lower the conductivity. Therefore, the amount of Mn added is preferably in the range of 0.1 to 0.2 mass %.
  • Cr chromium
  • Cr has the effect of strengthening the material by forming a second phase compound containing chromium and silicon and suppressing coarsening of the crystal grain size in the solution heat treatment step by the compound. It is desirable to add 1% by mass or more, but if the amount added is more than 0.25% by mass, coarse crystallized substances are formed during casting and the starting point of fracture during press working is likely to occur. Therefore, the Cr addition amount is preferably in the range of 0.1 to 0.25 mass %.
  • Zr zirconium
  • Zr zirconium
  • the Zr addition amount is preferably in the range of 0.05 to 0.15 mass %.
  • Ti titanium
  • Ti is an element having a solid solution in the material and having an effect of suppressing the growth of recrystallized grains in the solution heat treatment by increasing the recrystallization temperature of the material, and addition of 0.02 mass% or more
  • the Ti addition amount is preferably in the range of 0.02 to 0.1% by mass.
  • Fe is an element having a high effect of solid-solution strengthening a copper alloy, and it is desirable to add 0.05 mass% or more, but if the addition amount is larger than 0.1 mass%, the conductivity decreases. Tend. Therefore, the amount of Fe added is preferably in the range of 0.05 to 0.1 mass %.
  • Zn (zinc) is an element that has the effects of improving bending workability and improving adhesion and migration characteristics of Sn plating and solder plating.
  • the Zn content is preferably 0.2% by mass or more.
  • the amount of Zn added is preferably in the range of 0.2 to 0.6 mass %.
  • the balance other than the above-mentioned components is Cu (copper) and inevitable impurities.
  • the unavoidable impurities referred to here mean impurities at a content level that can be unavoidably included in the manufacturing process. Since the unavoidable impurities may be a factor that decreases the conductivity depending on the content, it is preferable to suppress the content of the unavoidable impurities to some extent in consideration of the decrease in the conductivity.
  • Examples of the components that can be cited as the inevitable impurities include Bi, Se, As, Ag, and the like.
  • the upper limit of the content of these components may be 0.03 mass% for each of the above components, and 0.10 mass% for the total amount of the above components.
  • the copper alloy sheet material of the present invention needs to have an electric conductivity of 38% IACS or more.
  • the thermal conductivity can be calculated from the conductivity according to the Wiedemann-Franz law, and if the temperature is constant, it is proportional to the conductivity regardless of the type of metal. Are known. Therefore, the copper alloy sheet material of the present invention can have high thermal conductivity by setting the electrical conductivity to 38% IACS or more, and as a result, can have excellent thermal conductivity.
  • the conductivity can be calculated by measuring the specific resistance by the four-terminal method in a constant temperature bath kept at 20° C. ( ⁇ 0.5° C.) with the distance between terminals being 100 mm, for example.
  • the arithmetic average value Aave. is in the range of 4.0 to 13.0 GPa ⁇ %.
  • the copper alloy sheet of the present invention has the arithmetic average value Aave. in the range of 4.0 to 13.0 GPa ⁇ %. It is necessary to be.
  • the arithmetic mean value Aave. is the rolling parallel direction, the direction of 45° with respect to the rolling direction (may be simply referred to as “45° direction”), and the vertical direction of rolling (may be simply referred to as “90° direction”).
  • the present inventors have obtained the knowledge that the parameter Aave. correlates well with the drawing workability of the material, through experiments until the present invention. It has been conventionally known that, among the crystallographic orientations of copper and copper alloys, in particular, the Cube orientation is integrated, which reduces the drawability of the material. However, a quantitative correlation between the degree of integration of the Cube orientation and the drawability and the quantitative evaluation of the drawability using the degree of integration of the Cube orientation have not been performed.
  • precipitation strengthened copper alloys such as Cu-Ni-Si and Cu-Co-Si alloys such as the component system of the present invention are copper and copper alloys conventionally used for drawing, such as pure copper and brass.
  • control process such as size, existing density, existing ratio of second phase compound and rolling process on mechanical properties of material Is very large, and moreover, because multiple material properties affect each other, they change at the same time, for example, the abundance ratio of the second phase compound and the material strength change at the same time.
  • the fact that the influence on the workability cannot be extracted made it difficult to improve the drawability of the precipitation strengthened alloy and to evaluate the drawability.
  • the present inventors have found that the drawability can be well evaluated by the precipitation-strengthened alloy by the formula (2), and further that there is a correlation between the formula (2) and the drawability. Has led to the invention of a precipitation-strengthened alloy with improved properties.
  • FIG. 1 is a diagram showing, as an example, a nominal stress-nominal strain curve obtained by performing a tensile test on a test piece cut out from a copper alloy sheet according to an embodiment of the present invention in a rolling parallel direction. ..
  • the arithmetic mean value Aave. calculated by substituting the three-direction parameters A 0° , A 45°, and A 90° obtained from the formula (1) into the formula (2) is a parameter that correlates well with the drawing workability. I found that. By obtaining this correlation, it becomes possible to evaluate the drawability by the formula (2).
  • the arithmetic mean value Aave. is set in the range of 4.0 to 13.0 GPa ⁇ %.
  • the arithmetic mean value Aave. is preferably in the range of 6.0 to 11.0 GPa ⁇ %.
  • the nominal stress may be measured, for example, every time the nominal strain is 0.001% or more and 0.300% or less.
  • the Cube azimuth area ratio (%) used to calculate the parameter Ax is continuously measured using an EBSD detector attached to a high resolution scanning analysis electron microscope (JEOL Ltd., trade name: JSM-7001FA). It can be calculated from the crystal orientation data measured by using analysis software (manufactured by TSL, trade name: OIM-Analysis).
  • EBSD is an abbreviation for Electron BackScatter Diffraction, which is a crystal orientation analysis technology that utilizes the reflected electron Kikuchi line diffraction that occurs when a sample is irradiated with an electron beam in a scanning electron microscope (SEM). Yes, and "OIM-Analysis” is an analysis software of data measured by EBSD.
  • the values A 0° , A 45°, and A 90° in each direction of the parameter Ax are obtained by substituting the integral value calculated by the above-described method and the Cube azimuth area ratio (%) into the above formula (1).
  • the values A 0° , A 45° and A 90° of the parameter Ax in each direction can be calculated, and the arithmetic average value Aave. is calculated by using the calculated A 0° , A 45° and A 90° in equation (2). It can be calculated by substituting into
  • the drawability is measured by a deep drawing tester (for example, a thin plate forming tester manufactured by Erichsen Co., Ltd.) 10 after tightening the edge of the test plate W between the die 12 and the wrinkle holding member 16 as shown in FIG. Then, the center portion of the test plate W was pushed by the punch 14 to form a cylindrical cup.
  • the minimum punch corner radius R at which the cylindrical cup can be molded without cracking and the difference between the maximum valley depth and the maximum peak height of the undulation of the edge of the cylindrical cup were evaluated.
  • the value of the moving distance (the depth of the depression) of the punch until the penetration crack occurs in the overhang test that is, the Erichsen value Er is measured, and in addition to this Erichsen value Er, the thickness of the test plate W (Mm), elongation at break (%) when pulled in the rolling direction, and the results were taken into consideration for comprehensive evaluation.
  • the values B 0° , B 45° and B 90° of the parameter Bx defined in the above formula (3) in each direction By controlling the values B 0° , B 45° and B 90° of the parameter Bx defined in the above formula (3) in each direction to be 10% or less, the undulation of the edge after drawing is performed. Can be stably reduced, the shape can be made uniform, and the drawability can be further improved by twisting. If the values B 0° , B 45° , and B 90° in any direction of the parameter Bx are larger than 10%, the yield in the production of drawn products tends to decrease. Therefore, the value of the parameter Bx in each direction Each of B 0° , B 45° and B 90° is preferably 10% or less, and more preferably 5.5% or less.
  • the parameter Bx can be calculated by substituting the calculated parameter Ax and the arithmetic mean value Aave. into the equation (3) as described above.
  • the ratio of the Erichsen value (Er) to the plate thickness (t) (Er/t ratio) and the elongation at break EL (%) when stretched in the rolling parallel direction are expressed by the following inequality (4).
  • the copper alloy sheet of the present invention has a ratio (Er/t ratio) of the Erichsen value (Er) to the sheet thickness (t) in the Erichsen test, and an elongation at break EL (%) when pulled in the rolling parallel direction.
  • a ratio (Er/t ratio) of the Erichsen value (Er) to the sheet thickness (t) in the Erichsen test, and an elongation at break EL (%) when pulled in the rolling parallel direction Preferably satisfies the relation of the inequality of the following equation (4).
  • the Erichsen value (Er value) is obtained by tightening the edge of the test plate W between the die 12 and the wrinkle holding member 16 by the Erichsen tester, and then measuring the central part of the test plate W as follows.
  • the punch 14A having a hemispherical tip was pushed in, and the value of the moving distance of the punch (the depth of the depression) until the occurrence of through cracks was measured, and the measured value was used.
  • Such a copper alloy sheet according to one embodiment of the present invention is formed by casting [step 1], homogenizing [step 2], and hot rolling on a copper alloy material having the same composition as the above-mentioned copper alloy sheet.
  • the elongation rate ⁇ of the material in the straightening [step 9] is set to 0.1 to 1.0%, Then, by controlling the material temperature TA (° C.) of the temper annealing [step 10] so as to satisfy the relation of the inequality shown in the following equation (5) in relation to the elongation rate ⁇ , the heat radiation property is particularly impaired. Even if the drawing conditions are severe, a copper alloy sheet material having excellent drawability can be manufactured.
  • Solution heat treatment step [Step 6] In the solution heat treatment step, the temperature is raised at a predetermined heating rate (for example, 900° C. to 990° C. over 5 seconds to 10 seconds), held for 1 second to 1 hour, and then set to 250° C./s to 500° C./s. Cooled at rate.
  • a predetermined heating rate for example, 900° C. to 990° C. over 5 seconds to 10 seconds
  • Step 7 Intermediate heat treatment step
  • heat treatment was performed at a predetermined temperature (for example, 300° C. to 600° C.) for 10 seconds to 10 hours.
  • the finish cold rolling process is a process mainly performed for processing to a desired plate thickness, improvement of material strength, and control of crystal orientation, and the maximum temperature TR of the material during rolling is 75°C or higher and 100°C or lower. Need to be controlled.
  • the maximum temperature TR of the material during rolling is 75°C or higher and 100°C or lower. Need to be controlled.
  • the maximum temperature TR of the material during rolling is set to 75°C or higher and 100°C or lower.
  • the straightening process is a process performed for the purpose of removing/uniformizing the residual stress of the material, and the elongation rate ⁇ of the material during the straightening by the tension leveler is in the range of 0.1 to 1.0%. is necessary. If the elongation ⁇ is less than 0.1%, the effect of removing and uniformizing residual stress is small, and the shape uniformity after drawing is deteriorated. On the other hand, if the elongation ⁇ is larger than 1.0%, the processing strain due to the repeated bending of the tension leveler becomes large, and the corner radius of the punch tip where cracks do not occur during drawing processing cannot be made small, resulting in severe drawing. The drawability is reduced under the processing conditions. Therefore, the elongation rate ⁇ of the material in the straightening step is set in the range of 0.1 to 1.0%.
  • the temper annealing step is a step for recovering the elongation of the material and further for reducing the anisotropy of mechanical properties including elongation, and the material temperature TA (° C.) of the temper annealing [step 10].
  • TA ° C.
  • Drawability is improved by controlling the material temperature TA in the temper annealing process according to the equation (5).
  • the arithmetic mean value Aave. and the Erichsen value Er which are the parameters of the material, become large.
  • the material temperature TA in the temper annealing step is lower than the lower limit value in the equation (5), recovery of dislocations by rolling (that is, removal of work strain) becomes insufficient.
  • the material temperature TA in the temper annealing step exceeds the upper limit value in the equation (5), the precipitate of the compound of Ni or Co and Si becomes coarse, and accordingly, the material strength decreases. Therefore, the material temperature TA (° C.) in the temper annealing [step 10] is set so as to satisfy the relationship of the inequality shown in the expression (5) in relation to the elongation rate ⁇ (%) of the material in the straightening step.
  • the copper alloy material of the present invention is particularly suitable for use in producing a drawn product by subjecting it to drawing, for example, a member for electric/electronic parts, an electromagnetic wave shielding material and It can be used as a heat dissipation component.
  • a member for electric/electronic parts for example, a member for electric/electronic parts, an electromagnetic wave shielding material and It can be used as a heat dissipation component.
  • connectors for electric/electronic parts, lead frames, relays, switches, sockets, shield cases, shield cans, liquid crystal reinforcement plates, liquid crystal chassis, reinforcement plates for organic EL displays, connectors for automobiles, shield cases, A shield can or the like can be manufactured.
  • Examples 1 to 15 and Comparative Examples 1 to 11 A copper alloy material having the composition shown in Table 1 was melted in a high-frequency melting furnace in the air and cast to obtain an ingot having a thickness of 30 mm, a width of 100 mm, and a length of 150 mm. Next, immediately after the homogenizing heat treatment of heating and holding at 1000° C. for 1 hour in an inert gas atmosphere, hot rolling was performed to obtain a hot-rolled sheet having a thickness of 10 mm, and then immediately cooled. Then, chamfering and cold rolling were sequentially performed to make the plate thickness 0.25 to 1.0 mm. Then, the solution heat treatment is performed at 800 to 990° C.
  • Parameter Bx is a parameter Ax obtained by substituting the integral value calculated in [3] above and the Cube orientation area ratio calculated in [4] above into equation (1).
  • the copper alloy sheet materials of Examples 1 to 15 all have an alloy composition within the proper range of the present invention, a conductivity of 38% IACS or more, and an arithmetic average value Aave. Since it is in the range of 0 to 13.0 GPa ⁇ %, it can be seen that both heat dissipation and drawing workability are at or above the passing level. Particularly, in Examples 3, 6, 8 and 12, the alloy composition and the manufacturing conditions were appropriate, and therefore the conductivity was particularly excellent. In Examples 1, 8 and 13, the conditions from casting to temper annealing were appropriate, and the parameters A and B showed good values. Therefore, the minimum radius of curvature of the corner portion of the punch tip where cracks do not occur. And the maximum value of the difference between the ridges and valleys of the undulation of the cup edge became small, so that the drawability was particularly excellent.
  • Comparative Examples 1, 2, 4, 5, and 8 since the Ni+Co content or Si was small, the arithmetic average value Aave. fell outside the appropriate range of the present invention, and the drawability was poor.
  • Comparative Example 6 the straightening was not performed by the tension leveler and the elongation was 0%, so that the anisotropy was high, and thus Bx was out of the range.
  • Comparative Examples 8 and 10 the rolling temperature in finish cold rolling was low, and many Cube orientations remained, so that the arithmetic average value Aave.
  • the parameter B 90° was out of the range, and the maximum height difference after drawing was large.
  • Comparative Examples 3, 7, and 9 the component content was larger than the appropriate range of the present invention, and thus the conductivity was particularly low. Particularly, in Comparative Example 7, the elongation in straightening was larger than the specified value, and the Erichsen value/plate thickness value was also outside the specified value, so the drawability was also poor. In Comparative Example 11, the material temperature during finish rolling became high, seizure of the material and the rolling roll occurred, and defects such as large unevenness occurred on the surface of the material. Therefore, the characteristic evaluation was not performed, but the drawability was remarkably reduced. Was obvious.

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Abstract

Une tôle d'alliage de cuivre selon la présente invention a une composition contenant 1,0 à 5,0 % en masse au total d'au moins l'un parmi Ni et Co, et 0,1 à 1,5 % en masse de Si, le reste comprenant Cu et des impuretés inévitables, et a une conductivité d'au moins 38 % IACS, où, pour trois types d'échantillons d'essai découpés respectivement dans une direction parallèle à la direction de roulement, une direction à 45° par rapport à la direction de laminage, et une direction perpendiculaire à la direction de laminage, la valeur moyenne arithmétique Aave. est dans la plage de 4,0 à 13,0 % GPa telle que calculée par substitution des valeurs obtenues à partir des courbes de contrainte nominale-déformation nominale obtenues à partir d'essais de traction, et des valeurs de rapports d'aire d'azimut de cube obtenues par un procédé de diffraction de rétrodiffusion d'électrons (EBSD) dans l'équation spécifique 1 pour déterminer les valeurs de A0°, A45° et A90° pour les directions respectives de paramètre Ax (x : 0°, 45°, 90°), et substitution des valeurs déterminées de A0°, A45° et A90° pour les directions respectives dans l'équation spécifique 2. Selon la présente invention, une excellente aptitude à l'étirage peut être obtenue de façon fiable sans compromettre les propriétés de base (en particulier, la dissipation thermique) de tôles d'alliage de cuivre conventionnelles.
PCT/JP2019/045712 2018-12-13 2019-11-21 Tôle d'alliage de cuivre, son procédé de fabrication, produit d'étirage, élément de composant électrique/électronique, matériau de blindage électromagnétique et composant de dissipation de chaleur WO2020121775A1 (fr)

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