WO2020113711A1 - 一种柔性基板切割方法 - Google Patents

一种柔性基板切割方法 Download PDF

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Publication number
WO2020113711A1
WO2020113711A1 PCT/CN2018/123429 CN2018123429W WO2020113711A1 WO 2020113711 A1 WO2020113711 A1 WO 2020113711A1 CN 2018123429 W CN2018123429 W CN 2018123429W WO 2020113711 A1 WO2020113711 A1 WO 2020113711A1
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Prior art keywords
flexible substrate
photoresist
cutting
cutting area
area
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PCT/CN2018/123429
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English (en)
French (fr)
Inventor
赵凯祥
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/320,104 priority Critical patent/US11119407B2/en
Publication of WO2020113711A1 publication Critical patent/WO2020113711A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

Definitions

  • the present application relates to the technical field of display panels, and in particular, to a flexible substrate cutting method.
  • the panel substrate In actual production, in order to adapt to a multi-platform display solution, the panel substrate usually uses a flexible substrate, and the flexible substrate needs to be cut to obtain multiple display panels.
  • the cutting method of the flexible substrate is usually laser cutting, that is, the flexible substrate between the display panels is cut by laser. Since the flexible substrate is generally made of polyimide and has good thermal conductivity, the heat generated by laser cutting will be quickly conducted to the surrounding circuit devices, which may cause damage to the circuit devices or electrical drift.
  • Embodiments of the present application provide a method for cutting a flexible substrate to solve the problem that the heat generated by the existing laser cutting may cause damage to surrounding circuit devices or electrical drift.
  • An embodiment of the present application provides a flexible substrate cutting method, including:
  • Dry etching the flexible substrate to decompose the flexible substrate in the cutting area Dry etching the flexible substrate to decompose the flexible substrate in the cutting area.
  • the blocking object is photoresist
  • the covering the non-cutting area of the flexible substrate with a covering to expose the cutting area of the flexible substrate includes:
  • the photoresist on the flexible substrate is exposed through the photomask to retain the photoresist on the non-cutting area and dissolve the photoresist on the cutting area.
  • the photoresist is a positive photoresist
  • the photomask includes an opaque region and a transparent region, the opaque region corresponds to a non-cutting region of the flexible substrate, and the transparent region corresponds to a cutting region of the flexible substrate;
  • the photoresist on the non-cutting area of the flexible substrate is not seen, and the photoresist on the cutting area of the flexible substrate is dissolved.
  • the photoresist is a negative photoresist
  • the photomask includes an opaque region and a transparent region, the transparent region corresponds to a non-cutting region of the flexible substrate, and the opaque region corresponds to a cutting region of the flexible substrate;
  • the photoresist on the non-cutting area of the flexible substrate is visible, and the photoresist on the cutting area of the flexible substrate is not dissolved.
  • the method further includes:
  • the blocking object is a Zhang net
  • the covering the non-cutting area of the flexible substrate with a covering to expose the cutting area of the flexible substrate includes:
  • a netting device Using a netting device, apply the netting to the non-cutting area of the flexible substrate to expose the cut area of the flexible substrate.
  • the sheet net includes a metal sheet net or a quartz sheet net.
  • the flexible substrate is made of polyimide
  • the dry etching the flexible substrate to decompose the flexible substrate in the cutting area includes:
  • the method further includes:
  • the photoresist stripping solution is used to dissolve the photoresist on the non-cutting area of the flexible substrate.
  • the method further includes:
  • the net stretching device is used to separate the net from the flexible substrate.
  • An embodiment of the present application also provides a flexible substrate cutting method, including:
  • the covering covered on the flexible substrate is removed.
  • the blocking object is photoresist
  • the covering the non-cutting area of the flexible substrate with a covering to expose the cutting area of the flexible substrate includes:
  • the photoresist on the flexible substrate is exposed through the photomask to retain the photoresist on the non-cutting area and dissolve the photoresist on the cutting area.
  • the photoresist is a positive photoresist
  • the photomask includes an opaque region and a transparent region, the opaque region corresponds to a non-cutting region of the flexible substrate, and the transparent region corresponds to a cutting region of the flexible substrate;
  • the photoresist on the non-cutting area of the flexible substrate is not seen, and the photoresist on the cutting area of the flexible substrate is dissolved.
  • the photoresist is a negative photoresist
  • the photomask includes an opaque region and a transparent region, the transparent region corresponds to a non-cutting region of the flexible substrate, and the opaque region corresponds to a cutting region of the flexible substrate;
  • the photoresist on the non-cutting area of the flexible substrate is visible, and the photoresist on the cutting area of the flexible substrate is not dissolved.
  • the method further includes:
  • the blocking object is a Zhang net
  • the covering the non-cutting area of the flexible substrate with a covering to expose the cutting area of the flexible substrate includes:
  • a netting device Using a netting device, apply the netting to the non-cutting area of the flexible substrate to expose the cut area of the flexible substrate.
  • the sheet net includes a metal sheet net or a quartz sheet net.
  • the flexible substrate is made of polyimide
  • the dry etching the flexible substrate to decompose the flexible substrate in the cutting area includes:
  • the removing the covering covered on the flexible substrate includes:
  • the photoresist stripping solution is used to dissolve the photoresist on the non-cutting area of the flexible substrate.
  • the removing the covering covered on the flexible substrate includes:
  • the net stretching device is used to separate the net from the flexible substrate.
  • the beneficial effects of the present invention are: when cutting a flexible substrate, covering the non-cutting area of the flexible substrate with a covering, exposing the cutting area of the flexible substrate, and then performing dry etching on the flexible substrate to decompose only the flexible substrate in the cutting area to achieve flexibility The cutting of the substrate, and no heat is generated during the cutting process, so that the internal components of the flexible substrate are protected.
  • FIG. 1 is a schematic flowchart of a flexible substrate cutting method provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a flexible substrate in a method for cutting a flexible substrate according to an embodiment of the present application
  • FIG. 3 is another schematic flowchart of a flexible substrate cutting method provided by an embodiment of the present application.
  • a flexible substrate cutting method comprising: providing a flexible substrate; a cutting area is preset on the flexible substrate; a covering is covered on a non-cutting area of the flexible substrate to expose the cutting area of the flexible substrate; The flexible substrate is dry-etched to decompose the flexible substrate in the cutting area.
  • FIG. 1 is a schematic flowchart of a flexible substrate cutting method provided by an embodiment of the present application.
  • the specific flow of the flexible substrate cutting method may be as follows:
  • a cutting area is preset on the flexible substrate.
  • the flexible substrate 200 includes a cutting area 201 and a non-cutting area 202, where the non-cutting area 202 is other area on the flexible substrate 200 except for the cutting area 201.
  • the non-cutting area 202 includes a plurality of regularly arranged display areas, and the cutting area 201 may be disposed between the plurality of display areas.
  • the non-cutting area of the flexible substrate is covered with a covering to expose the cut area of the flexible substrate.
  • the non-cutting area of the flexible substrate is shielded, and only the cutting area of the flexible substrate is exposed to facilitate subsequent cutting of the cutting area of the flexible substrate.
  • the blocking object is a photoresist.
  • the covering the non-cutting area of the flexible substrate with a covering to expose the cutting area of the flexible substrate includes:
  • a layer of photoresist is coated on all areas of the flexible substrate (including the cutting area and the non-cutting area), and then a mask is designed to make part of the mask transparent and part of the mask opaque. Attach the photomask to the coated photoresist so that the transparent and opaque areas of the photomask correspond to the cut and non-cut areas of the flexible substrate to ensure that the flexible substrate is not exposed after exposure
  • the photoresist on the cutting area is retained, and the photoresist on the cutting area is dissolved.
  • the non-cutting area of the flexible substrate is blocked, and only the cut area of the flexible substrate is exposed.
  • photoresist is divided into positive photoresist and negative photoresist. If a layer of positive photoresist is coated on the flexible substrate, design a mask to match the size, shape and position of the transparent area of the mask with the cutting area of the flexible substrate and make the opaque area of the mask Match the size, shape and position of the non-cutting area of the flexible substrate. After attaching the photomask to the photoresist coated on the flexible substrate, the light-transmitting area of the photomask corresponds to the cutting area of the flexible substrate, and the opaque area of the photomask corresponds to the non-cutting area of the flexible substrate.
  • the cut area of the flexible substrate transmits light, so that the photoresist on the cut area is dissolved, and the non-cut area of the flexible substrate does not transmit light, so that the non-cut area The photoresist is retained.
  • a layer of negative photoresist is coated on the flexible substrate, design a mask to match the size, shape and position of the transparent area of the mask with the non-cutting area of the flexible substrate to make the mask opaque
  • the area matches the size, shape and position of the cutting area of the flexible substrate.
  • the cut area of the flexible substrate is opaque, so that the photoresist on the cut area is dissolved, and the non-cut area of the flexible substrate is transparent, so that the photoresist on the non-cut area is retained .
  • the blocking object is a Zhang net
  • the covering the non-cutting area of the flexible substrate with a covering to expose the cutting area of the flexible substrate includes:
  • a netting device Using a netting device, apply the netting to the non-cutting area of the flexible substrate to expose the cut area of the flexible substrate.
  • a sheet net is designed so that the sheet net includes a hollow area, and the hollow area matches the size, shape, and position of the cutting area of the flexible panel. Adopting a web-laying device to attach the designed web to the surface of the flexible substrate, so that the hollowed-out area of the web corresponds exactly to the cutting area of the flexible substrate, so as to shield the non-cutting area of the flexible substrate by the web, and only expose the flexible substrate Cutting area.
  • the sheet net may be a metal sheet net or a quartz sheet net.
  • the flexible substrate is placed in the chamber of the dry etching device, and etching gas is input into the chamber through the air inlet, so that the etching gas etches the flexible substrate in the chamber.
  • the flexible substrate covered by the barrier is not in contact with the etching gas and thus will not be decomposed, while the bare flexible substrate is decomposed by the etching gas through contact with the etching gas, that is, the non-cutting area
  • the flexible substrate is retained, and the flexible substrate in the cutting area is decomposed, thereby cutting the flexible substrate.
  • the flexible substrate is made of polyimide (PI), so the flexible substrate can be etched using sulfur hexafluoride SF6. Sulfur hexafluoride can decompose polyimide without reacting to photoresist, metal sheet mesh and quartz sheet mesh.
  • PI polyimide
  • FIG. 3 is another schematic flowchart of the flexible substrate cutting method provided by the embodiment of the present application.
  • the specific process of the flexible substrate cutting method may be as follows:
  • a cutting area is preset on the flexible substrate.
  • the non-cutting area of the flexible substrate is covered with a covering to expose the cut area of the flexible substrate.
  • the blocking object is a photoresist
  • a photoresist stripping solution is used to dissolve the photoresist on the non-cutting area of the flexible substrate to obtain a cut flexible substrate.
  • the covering object is a sheet net
  • a sheet net device is used to grip one end of the sheet net on the flexible substrate to separate the sheet net from the flexible substrate to obtain a cut flexible substrate.
  • the flexible substrate cutting method provided in this embodiment covers the non-cutting area of the flexible substrate when covering the flexible substrate, exposing the cutting area of the flexible substrate, and then performing dry etching on the flexible substrate to only decompose the cutting
  • the flexible substrate in the area realizes the cutting of the flexible substrate, and no heat is generated during the cutting process, so that the internal components of the flexible substrate are protected.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
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Abstract

一种柔性基板切割方法，包括：提供柔性基板；所述柔性基板上预设有切割区域（101）；在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域（102）；对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板（103），从而在柔性基板切割过程中，柔性基板的内部元器件能够受到保护。

Description

一种柔性基板切割方法 技术领域
本申请涉及显示面板技术领域，尤其涉及一种柔性基板切割方法。
 背景技术
在实际生产中，为了适应多平台的显示方案，面板基底通常采用柔性基板，而柔性基板需要通过切割来获得多个显示面板。目前，柔性基底的切割方式通常为激光切割，即采用激光切断显示面板之间的柔性基板。由于柔性基板一般由聚酰亚胺制成，导热性比较好，因此激光切割产生的热量会快速传导至周围的电路器件，可能会引起电路器件的损坏或电性飘逸。
 技术问题
本申请实施例提供一种柔性基板切割方法，以解决现有激光切割产生的热量会引起周围电路器件损坏或电性飘逸等问题。
 技术解决方案
本申请实施例提供了一种柔性基板切割方法，包括：
提供柔性基板；所述柔性基板上预设有切割区域；
在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域；
对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
在一个实施方式中，所述遮挡物为光阻；
所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
在所述柔性基板的表面涂布一层光阻；
在所述光阻上贴服光罩；
通过所述光罩对所述柔性基板上的光阻进行曝光处理，以保留所述非切割区域上的光阻，并溶解所述切割区域上的光阻。
具体地，所述光阻为正性光阻；
所述光罩包括不透光区域和透光区域，所述不透光区域与所述柔性基板的非切割区域相对应，所述透光区域与所述柔性基板的切割区域相对应；
在曝光处理中，所述柔性基板的非切割区域上的光阻未见光被保留，所述柔性基板的切割区域上的光阻见光被溶解。
具体地，所述光阻为负性光阻；
所述光罩包括不透光区域和透光区域，所述透光区域与所述柔性基板的非切割区域相对应，所述不透光区域与所述柔性基板的切割区域相对应；
在曝光处理中，所述柔性基板的非切割区域上的光阻见光被保留，所述柔性基板的切割区域上的光阻未见光被溶解。
进一步地，在所述对所述柔性基板进行曝光处理之后，还包括：
去除所述光阻上的光罩。
在另一个实施方式中，所述遮挡物为张网；
所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
采用张网设备，将所述张网服帖在所述柔性基板的非切割区域，以裸露出所述柔性基板的切割区域。
进一步地，所述张网包括金属张网或石英张网。
进一步地，所述柔性基板由聚酰亚胺制成；
所述对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板，包括：
采用六氟化硫对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
进一步地，在所述对所述柔性基板进行干蚀刻之后，还包括：
采用光阻剥离液对所述柔性基板的非切割区域上的光阻进行溶解。
进一步地，在所述对所述柔性基板进行干蚀刻之后，还包括：
采用所述张网设备将所述张网从所述柔性基板上分离。
本申请实施例还提供了一种柔性基板切割方法，包括：
提供柔性基板；所述柔性基板上预设有切割区域；
在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域；
对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板；
去除所述柔性基板上覆盖的遮挡物。
在一个实施方式中，所述遮挡物为光阻；
所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
在所述柔性基板的表面涂布一层光阻；
在所述光阻上贴服光罩；
通过所述光罩对所述柔性基板上的光阻进行曝光处理，以保留所述非切割区域上的光阻，并溶解所述切割区域上的光阻。
具体地，所述光阻为正性光阻；
所述光罩包括不透光区域和透光区域，所述不透光区域与所述柔性基板的非切割区域相对应，所述透光区域与所述柔性基板的切割区域相对应；
在曝光处理中，所述柔性基板的非切割区域上的光阻未见光被保留，所述柔性基板的切割区域上的光阻见光被溶解。
具体地，所述光阻为负性光阻；
所述光罩包括不透光区域和透光区域，所述透光区域与所述柔性基板的非切割区域相对应，所述不透光区域与所述柔性基板的切割区域相对应；
在曝光处理中，所述柔性基板的非切割区域上的光阻见光被保留，所述柔性基板的切割区域上的光阻未见光被溶解。
进一步地，在所述对所述柔性基板进行曝光处理之后，还包括：
去除所述光阻上的光罩。
在另一个实施方式中，所述遮挡物为张网；
所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
采用张网设备，将所述张网服帖在所述柔性基板的非切割区域，以裸露出所述柔性基板的切割区域。
进一步地，所述张网包括金属张网或石英张网。
进一步地，所述柔性基板由聚酰亚胺制成；
所述对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板，包括：
采用六氟化硫对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
进一步地，所述去除所述柔性基板上覆盖的遮挡物，包括：
采用光阻剥离液对所述柔性基板的非切割区域上的光阻进行溶解。
进一步地，所述去除所述柔性基板上覆盖的遮挡物，包括：
采用所述张网设备将所述张网从所述柔性基板上分离。
 有益效果
本发明的有益效果为：在切割柔性基板时，在柔性基板的非切割区域覆盖遮挡物，裸露出柔性基板的切割区域，进而对柔性基板进行干蚀刻，只分解切割区域的柔性基板，实现柔性基板的切割，且切割过程中未产生热量，使柔性基板的内部元器件受到保护。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的柔性基板切割方法的流程示意图；
图2为本申请实施例提供的柔性基板切割方法中的柔性基板的结构示意图；
图3为本申请实施例提供的柔性基板切割方法的另一流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
一种柔性基板切割方法，包括：提供柔性基板；所述柔性基板上预设有切割区域；在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域；对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
如图1所示，图1是本申请实施例提供的柔性基板切割方法的流程示意图，该柔性基板切割方法具体流程可以如下：
101．提供柔性基板；所述柔性基板上预设有切割区域。
具体的，如图2所示，柔性基板200包括切割区域201和非切割区域202，其中，非切割区域202为柔性基板200上除去切割区域201以外的其他区域。非切割区域202包括多个规则排列的显示区域，切割区域201可以设置在多个显示区域之间。
102．在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域。
具体地，在柔性基板从玻璃基板上剥离之后，对柔性基板的非切割区域进行遮挡，仅裸露出柔性基板的切割区域，以方便后续对柔性基板的切割区域进行切割。
作为一个实施方式，所述遮挡物为光阻。
所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
在所述柔性基板的表面涂布一层光阻；
在所述光阻上贴服光罩；
通过所述光罩对所述柔性基板上的光阻进行曝光处理，以保留所述非切割区域上的光阻，并溶解所述切割区域上的光阻；
去除所述光阻上的光罩。
需要说明的是，先在柔性基板的所有区域（包括切割区域和非切割区域）涂布一层光阻，进而设计一张光罩，使光罩的部分区域透光，部分区域不透光，将该光罩贴服在涂布的光阻上，使光罩的透光区域和不透光区域与柔性基板的切割区域和非切割区域进行对应，保证柔性基板在曝光后，柔性基板的非切割区域上的光阻被保留，切割区域上的光阻被溶解。曝光处理后，去除光阻上的光罩，即可使柔性基板的非切割区域被遮挡，而仅裸露出柔性基板的切割区域。
具体地，光阻分为正性光阻和负性光阻。若在柔性基板上涂布一层正性光阻，则设计一张光罩，使光罩的透光区域与柔性基板的切割区域大小、形状、位置相匹配，使光罩的不透光区域与柔性基板的非切割区域大小、形状、位置相匹配。将光罩贴服在柔性基板涂布的光阻上后，光罩的透光区域对应贴服在柔性基板的切割区域，光罩的不透光区域对应贴服在柔性基板的非切割区域。在对柔性基板上的光阻进行曝光处理时，柔性基板的切割区域处透光，使得切割区域上的光阻被溶解，而柔性基板的非切割区域处不透光，使得非切割区域上的光阻被保留。
若在柔性基板上涂布一层负性光阻，则设计一张光罩，使光罩的透光区域与柔性基板的非切割区域大小、形状、位置相匹配，使光罩的不透光区域与柔性基板的切割区域大小、形状、位置相匹配。将光罩贴服在柔性基板涂布的光阻上后，光罩的透光区域对应贴服在柔性基板的非切割区域，光罩的不透光区域对应贴服在柔性基板的切割区域。在对柔性基板进行曝光处理时，柔性基板的切割区域处不透光，使得切割区域上的光阻被溶解，而柔性基板的非切割区域处透光，使得非切割区域上的光阻被保留。
作为另一个实施方式，所述遮挡物为张网；
所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
采用张网设备，将所述张网服帖在所述柔性基板的非切割区域，以裸露出所述柔性基板的切割区域。
需要说明的是，设计一张张网，使张网包括镂空区域，且所述镂空区域与柔性面板的切割区域大小、形状、位置相匹配。采用张网设备将设计的张网贴服在柔性基板的表面，使张网的镂空区域与柔性基板的切割区域完全对应，实现张网对柔性基板的非切割区域的遮挡，仅裸露出柔性基板的切割区域。
具体地，张网可以为金属张网或石英张网等。
103. 对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
具体地，将柔性基板放置在干蚀刻装置的腔室内，通过进气口向腔室内输入蚀刻气体，使蚀刻气体对腔室内的柔性基板进行蚀刻。
在对柔性基板进行干蚀刻时，对于被遮挡物覆盖的柔性基板不与蚀刻气体接触，从而不会被分解，而裸露的柔性基板通过与蚀刻气体的接触被蚀刻气体分解，即非切割区域的柔性基板被保留，切割区域的柔性基板被分解，从而实现对柔性基板的切割。
需要说明的是，柔性基板由聚酰亚胺(PI，Polyimide)制成，因此可以采用六氟化硫SF6对柔性基板进行蚀刻。六氟化硫可以对聚酰亚胺进行分解，而对光阻、金属张网和石英张网等不起反应。
如图3所示，图3是本申请实施例提供的柔性基板切割方法的另一流程示意图，该柔性基板切割方法具体流程可以如下：
201. 提供柔性基板；所述柔性基板上预设有切割区域。
202．在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域。
203. 对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
204．去除所述柔性基板上覆盖的遮挡物。
具体地，若遮挡物为光阻，则采用光阻剥离液对所述柔性基板的非切割区域上的光阻进行溶解，即可获得切割后的柔性基板。若遮挡物为张网，则采用张网设备夹取柔性基板上的张网的一端，以将所述张网从所述柔性基板上分离，获得切割后的柔性基板。
由上述可知，本实施例提供的柔性基板切割方法，在切割柔性基板时，在柔性基板的非切割区域覆盖遮挡物，裸露出柔性基板的切割区域，进而对柔性基板进行干蚀刻，只分解切割区域的柔性基板，实现柔性基板的切割，且切割过程中未产生热量，使柔性基板的内部元器件受到保护。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种柔性基板切割方法，其中，包括：
    提供柔性基板；所述柔性基板上预设有切割区域；
    在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域；
    对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
  2. 根据权利要求1所述的柔性基板切割方法，其中，所述遮挡物为光阻；
    所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
    在所述柔性基板的表面涂布一层光阻；
    在所述光阻上贴服光罩；
    通过所述光罩对所述柔性基板上的光阻进行曝光处理，以保留所述非切割区域上的光阻，并溶解所述切割区域上的光阻。
  3. 根据权利要求2所述的柔性基板切割方法，其中，所述光阻为正性光阻；
    所述光罩包括不透光区域和透光区域，所述不透光区域与所述柔性基板的非切割区域相对应，所述透光区域与所述柔性基板的切割区域相对应；
    在曝光处理中，所述柔性基板的非切割区域上的光阻未见光被保留，所述柔性基板的切割区域上的光阻见光被溶解。
  4. 根据权利要求2所述的柔性基板切割方法，其中，所述光阻为负性光阻；
    所述光罩包括不透光区域和透光区域，所述透光区域与所述柔性基板的非切割区域相对应，所述不透光区域与所述柔性基板的切割区域相对应；
    在曝光处理中，所述柔性基板的非切割区域上的光阻见光被保留，所述柔性基板的切割区域上的光阻未见光被溶解。
  5. 根据权利要求2所述的柔性基板切割方法，其中，在所述对所述柔性基板进行曝光处理之后，还包括：
    去除所述光阻上的光罩。
  6. 根据权利要求1所述的柔性基板切割方法，其中，所述遮挡物为张网；
    所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
    采用张网设备，将所述张网服帖在所述柔性基板的非切割区域，以裸露出所述柔性基板的切割区域。
  7. 根据权利要求6所述的柔性基板切割方法，其中，所述张网包括金属张网或石英张网。
  8. 根据权利要求1所述的柔性基板切割方法，其中，所述柔性基板由聚酰亚胺制成；
    所述对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板，包括：
    采用六氟化硫对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
  9. 根据权利要求2所述的柔性基板切割方法，其中，在所述对所述柔性基板进行干蚀刻之后，还包括：
    采用光阻剥离液对所述柔性基板的非切割区域上的光阻进行溶解。
  10. 根据权利要求6所述的柔性基板切割方法，其中，在所述对所述柔性基板进行干蚀刻之后，还包括：
    采用所述张网设备将所述张网从所述柔性基板上分离。
  11. 一种柔性基板切割方法，其中，包括：
    提供柔性基板；所述柔性基板上预设有切割区域；
    在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域；
    对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板；
    去除所述柔性基板上覆盖的遮挡物。
  12. 根据权利要求11所述的柔性基板切割方法，其中，所述遮挡物为光阻；
    所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
    在所述柔性基板的表面涂布一层光阻；
    在所述光阻上贴服光罩；
    通过所述光罩对所述柔性基板上的光阻进行曝光处理，以保留所述非切割区域上的光阻，并溶解所述切割区域上的光阻。
  13. 根据权利要求12所述的柔性基板切割方法，其中，所述光阻为正性光阻；
    所述光罩包括不透光区域和透光区域，所述不透光区域与所述柔性基板的非切割区域相对应，所述透光区域与所述柔性基板的切割区域相对应；
    在曝光处理中，所述柔性基板的非切割区域上的光阻未见光被保留，所述柔性基板的切割区域上的光阻见光被溶解。
  14. 根据权利要求12所述的柔性基板切割方法，其中，所述光阻为负性光阻；
    所述光罩包括不透光区域和透光区域，所述透光区域与所述柔性基板的非切割区域相对应，所述不透光区域与所述柔性基板的切割区域相对应；
    在曝光处理中，所述柔性基板的非切割区域上的光阻见光被保留，所述柔性基板的切割区域上的光阻未见光被溶解。
  15. 根据权利要求12所述的柔性基板切割方法，其中，在所述对所述柔性基板进行曝光处理之后，还包括：
    去除所述光阻上的光罩。
  16. 根据权利要求11所述的柔性基板切割方法，其中，所述遮挡物为张网；
    所述在所述柔性基板的非切割区域覆盖遮挡物，以裸露出所述柔性基板的切割区域，包括：
    采用张网设备，将所述张网服帖在所述柔性基板的非切割区域，以裸露出所述柔性基板的切割区域。
  17. 根据权利要求16所述的柔性基板切割方法，其中，所述张网包括金属张网或石英张网。
  18. 根据权利要求11所述的柔性基板切割方法，其中，所述柔性基板由聚酰亚胺制成；
    所述对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板，包括：
    采用六氟化硫对所述柔性基板进行干蚀刻，以分解所述切割区域的柔性基板。
  19. 根据权利要求12所述的柔性基板切割方法，其中，所述去除所述柔性基板上覆盖的遮挡物，包括：
    采用光阻剥离液对所述柔性基板的非切割区域上的光阻进行溶解。
  20. 根据权利要求16所述的柔性基板切割方法，其中，所述去除所述柔性基板上覆盖的遮挡物，包括：
    采用所述张网设备将所述张网从所述柔性基板上分离。
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