WO2020113682A1 - 一种彩膜基板的制备工艺、彩膜基板及显示装置 - Google Patents

一种彩膜基板的制备工艺、彩膜基板及显示装置 Download PDF

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Publication number
WO2020113682A1
WO2020113682A1 PCT/CN2018/121902 CN2018121902W WO2020113682A1 WO 2020113682 A1 WO2020113682 A1 WO 2020113682A1 CN 2018121902 W CN2018121902 W CN 2018121902W WO 2020113682 A1 WO2020113682 A1 WO 2020113682A1
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Prior art keywords
substrate
color
color filter
filter substrate
transparent conductive
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PCT/CN2018/121902
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English (en)
French (fr)
Inventor
张雷
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HKC Co Ltd
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HKC Co Ltd
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Priority to US17/044,725 priority Critical patent/US20210149244A1/en
Publication of WO2020113682A1 publication Critical patent/WO2020113682A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars

Definitions

  • the present disclosure relates to the field of displays, in particular to a preparation process of a color filter substrate, a color filter substrate prepared by the preparation process of the color filter substrate, and a display device having the color filter substrate.
  • Liquid crystal display devices are widely used in a variety of electrical equipment, such as televisions and computer display screens.
  • the color film substrate is a key part of the colorization of liquid crystal display devices, and accounts for the highest cost in display devices.
  • the existing color film substrate needs to enter the thermal process after the transparent conductive film process, such as the printing process of the alignment film (temperature up to 90 °C), because there is still moisture in the color resistance before entering the thermal process, enter the heat After the manufacturing process, the high temperature causes water to evaporate from the color resist, resulting in bubbles in the finished product of the liquid crystal display device, which affects the display effect.
  • the main purpose of the present disclosure is to provide a preparation process of a color film substrate, which aims to avoid bubbles in the finished product of the display device and affect the display effect.
  • the preparation process of the color filter substrate includes the following steps: forming a transparent conductive thin film layer on the substrate substrate by a sputtering process and forming black by a coating operation A matrix; and coating a color resist on the transparent conductive film or black matrix to form a pixel unit.
  • the steps of forming a transparent conductive thin film layer on the substrate substrate through a sputtering process and forming a black matrix through a coating operation include: forming a transparent conductive thin film layer on the substrate substrate through a sputtering process; and A black matrix is formed on the conductive thin film layer through a coating operation.
  • the steps of forming a transparent conductive thin film layer on the substrate substrate through a sputtering process and forming a black matrix through a coating operation include: forming a black matrix on the substrate substrate through a coating operation; and on the black matrix A transparent conductive thin film layer is formed through a sputtering process.
  • the present disclosure also proposes a color filter substrate, which is located on the light-emitting side of the liquid crystal layer in a display device.
  • the color filter substrate includes: a substrate substrate, a transparent conductive film and a color resist, the transparent conductive film and the color The resists are all provided on the substrate substrate, wherein the transparent conductive film is located between the substrate substrate and the color resist, and the transparent conductive film covers at least the area surrounded by the color resist.
  • the color filter substrate further includes a black matrix, and the black matrix is located between the transparent conductive film and the color resist, and the color resist is coated on the black matrix.
  • the color resistance includes three primary color resistances of red, green, and blue.
  • the color resistance includes four primary color resistances of red, green, blue and yellow.
  • the color resistance includes four primary color resistances of red, green, blue and white.
  • the red, green, and blue primary color resists are arranged in sequence and set at intervals.
  • the color filter substrate further includes a black matrix, the black matrix is located between the transparent conductive film and the substrate substrate, and the color resist is coated on the transparent conductive film.
  • the color resist includes three primary color resists of red, green, and blue, or the color resist includes four primary color resists of red, green, blue, and yellow, or the color resist includes red, green, and blue. And the primary color resistance of white.
  • the color resists are arranged at intervals, and the black matrix is applied between the color resists spaced apart from each other.
  • the edge of the color resist overlaps with the black matrix.
  • the color resistance does not completely overlap with the black matrix.
  • the transparent conductive film is indium tin oxide.
  • the color matrix in the outermost layer is surrounded by a black matrix.
  • the substrate substrate is transparent and can transmit visible light.
  • the present disclosure also proposes a display device including a color filter substrate located on the light exit side of the liquid crystal layer in the display device.
  • the color filter substrate includes a substrate substrate, a transparent conductive film and Color resist, the transparent conductive film and the color resist are both disposed on the substrate substrate, wherein the transparent conductive film is located between the substrate substrate and the color resist, and the transparent conductive film covers at least Describe the area enclosed by the color block.
  • the display device further includes an array substrate, the liquid crystal is located between the array substrate and the color filter substrate, light propagates from the side of the array substrate through the liquid crystal to the color filter substrate, and transmits the color Block out the color filter substrate.
  • the color filter substrate further includes a spacer, and the spacer is disposed on the main body of the color filter substrate.
  • the transparent conductive film is sputtered between the substrate substrate and the color resist, so that the transparent conductive film is located between the substrate substrate and the color resist, so that the color filter substrate will not be affected by the surface after entering the subsequent thermal process It is covered with a layer of transparent conductive film to hinder the release of water vapor in the color resister, thereby avoiding the existence of bubbles in the finished product of the color filter substrate.
  • FIG. 1 is a schematic flow chart of a process for preparing a color film substrate of the present disclosure
  • FIG. 2 is a schematic flowchart of an embodiment of step 1 in FIG. 1;
  • FIG. 3 is a schematic flowchart of another embodiment of step 1 in FIG. 1;
  • FIG. 4 is a schematic structural diagram of an embodiment of a color filter substrate of the present disclosure.
  • FIG. 5 is a schematic structural diagram of another embodiment of a color filter substrate of the present disclosure.
  • FIG. 6 is a schematic structural diagram of an embodiment of a display device of the present disclosure.
  • the present disclosure proposes a process for preparing a color film substrate, including the following steps:
  • Step S10 forming a transparent conductive film 50 layer on the substrate substrate 10 by a sputtering process and forming a black matrix 20 by a coating operation; and Step S20: forming a color resist 30 on the transparent conductive film 50 or the black matrix 20 Pixel unit.
  • the color resist 30 is located at the outermost layer of the color filter substrate, the transparent conductive film 50 is located between the substrate substrate 10 and the color resist 30, and the transparent conductive film 50 is sputtered.
  • the process covers the substrate substrate 10 or the black matrix 20, that is, as long as the transparent conductive film 50 is located between the substrate substrate 10 and the color resister 30, as to whether the transparent conductive film 50 covers the base substrate of the substrate or the black matrix 20, have no effect on the performance of the color film substrate itself.
  • the transparent conductive film 50 is a transparent conductive oxide formed of indium tin oxide (Indium Tin Oxides, ITO).
  • ITO Indium Tin Oxides
  • the thickness of the thin film can be adjusted by the sputtering process conditions and the time along the product.
  • the substrate substrate 10 needs to be cleaned first to avoid contamination on the substrate affecting the uniformity of the film coating or causing contamination of the film.
  • the transparent conductive film 50 is between the substrate substrate 10 and the black matrix 20
  • the transparent conductive film 50 is directly sputtered on the substrate substrate 10.
  • the black matrix 20 coating process is performed on the transparent conductive film 50.
  • the coating of the black matrix 20 causes the transparent conductive film 50 to face away from the substrate substrate 10
  • the black matrix 20 coating is covered, but in the color filter substrate, one of the main functions of the black matrix 20 is to prevent the mixing of the primary colors in the color resist 30 and improve the color purity of the displayed image. Therefore, as shown in FIGS. 4 and 5 As shown, the color resist 30 cannot completely overlap with the black matrix 20, which requires removing part of the paint of the black matrix 20 to apply the color resist 30.
  • the photolithography and development are used to remove the unnecessary black matrix 20 paint, wherein the photolithography process uses ultraviolet rays to irradiate the parts that need to be left in the black matrix 20, the material of the black matrix 20 is negative Due to the characteristics of the photoresist, in the development process, the unirradiated material of the black matrix 20 is removed by the alkaline developer, leaving the irradiated portion to form the black matrix pattern 20.
  • the color resist 30 is coated on the black matrix pattern 20.
  • the color resist 30 includes three primary color resists 30 of red, green and blue, and the three primary color resists 30 are arranged in sequence (the arrangement order is not limited) , As long as any three adjacent primary colors include red, green, and blue primary color resists 30), but there is a black matrix 20 paint between the two color resists 30 to prevent color mixing between the primary colors and affect the display effect.
  • the color resist 30 is applied in sequence, and the order can be determined according to the needs, and there is no limitation. Take the red color resist 31 first as an example.
  • the coating of the red color resist 31 is directly formed after photolithography and development On the black matrix pattern 20, the red color resist paint that does not need to be left is removed by photolithography and development to form a red color resist 31.
  • the color filter substrate already has two patterns of black matrix 20 and red color resist 31, and then the green color resist 32 coating is coated on it, and then the unnecessary green color resist coating is removed by photolithography and development, leaving Under the required part, a green color resist 32 is formed. Finally, the blue color resist 33 coating is applied, and then the blue color resist 33 is formed by photolithography and development. At this point, the color resist 30 process of the color filter substrate is completed.
  • the black matrix coating is applied on the substrate substrate 10, and the black matrix is formed after photolithography and development After the pattern 20, a sputtering process of the transparent conductive film 50 is performed on the black matrix pattern 20, so that the transparent conductive film 50 is formed on the black matrix pattern 20.
  • the color resist 30 is coated on the transparent conductive film 50.
  • the red color resist coating is first coated on the transparent conductive film 50, and then it is unnecessary by photolithography and development The red color resist material is removed to form the red color resist 30, and then the green color resist 32 is coated, lithographically and developed to form the green color resist 32, and finally the blue color resist 33 process is entered.
  • the color resist 30 Since the color resist 30 is in the outermost layer of the color filter substrate, the water that the color resist 30 fails to completely release during the preparation process remains in the color resist 30, or, during the storage process after the color filter substrate is made, the color resist 30 will also absorb a certain amount of moisture from the air.
  • the way in which the transparent conductive film 50 is located between the substrate substrate 10 and the color resister 30 allows the color filter substrate to freely release the moisture in the subsequent thermal process without being affected by Because of the obstruction of the transparent conductive film 50, no bubbles formed by water vapor will appear in the finished color filter substrate. When the color filter substrate is used in a display device, no bubbles will appear on the display device to affect the display effect.
  • the present disclosure also proposes a color filter substrate prepared by any one of the preparation processes of the color filter substrate as described above.
  • the color filter substrate is located on the light-emitting side of the liquid crystal layer in the display device.
  • the color filter substrate includes: a substrate substrate 10, a transparent conductive film 50 and a color resist 30, the transparent conductive film 50 and the color resist 30 are both disposed on the substrate substrate 10, wherein the transparent conductive film 50 is located on the The substrate substrate 10 is between the color resist 30 and the transparent conductive film 50 covers at least the area surrounded by the color resist 30.
  • the transparent conductive film 50 is a complete film, covering at least the area surrounded by the color resist 30.
  • the transparent conductive film 50 is mainly used as a common
  • the electrodes work together with the electrodes on the other side of the liquid crystal to deflect the liquid crystal. Therefore, the transparent conductive film 50 can also cover the entire substrate substrate 10, which does not affect the performance of the color filter substrate.
  • the color filter substrate further includes a black matrix 20.
  • the black matrix 20 is coated between the transparent conductive film 50 and the substrate substrate 10 or between the transparent conductive film 50 and the color resister 30.
  • the function of the black matrix 20 is to block the messy scattered light of the liquid crystal layer, so that the light only passes through the color filter 30 to prevent color mixing between the primary colors, and prevent ambient light from irradiating the thin film transistor channel, which affects the display effect. Therefore, the black matrix 20 paint is spaced between the two color resists 30, and the black matrix material is also surrounded around the outermost color resist 30, so that the light irradiated to the color resist 30 comes from the liquid crystal.
  • the edge portion of the color resist 30 may overlap with the black matrix 20, and the overlapping portion of the color resist and the black matrix is located above the black matrix to prevent the color incident phenomenon of the light incident from the edge position of the color resist 30, that is, the color resist 30 It is only necessary that there is a portion that is not covered by the material of the black matrix 20 so that light can pass through the color resister 30.
  • the color resist 30 includes three primary color resists of red, green, and blue, or the color resist 30 includes four primary color resists of red, green, blue, and yellow, or the color resist 30 includes red, The four primary colors of green, blue and white color resistance.
  • the light cannot pass through the part with the black matrix paint, and the light passes through the color filter 30 and is filtered by the color filter 30, leaving only light of a specific color.
  • the substrate substrate 10 is transparent and can transmit visible light.
  • the color resist 30 Since the color resist 30 is in the outermost layer of the color filter substrate, the water that the color resist 30 fails to completely release during the preparation process remains in the color resist 30, or, during the storage process after the color filter substrate is made, the color resist 30 will also absorb a certain amount of moisture from the air.
  • the way in which the transparent conductive film 50 is located between the substrate substrate 10 and the color resister 30 allows the color filter substrate to freely release the moisture in the subsequent thermal process without being affected by The transparent conductive film 50 is hindered, so that no bubbles formed by water vapor appear in the finished color film substrate.
  • the display device includes any color film substrate as described above.
  • the display device further includes a liquid crystal 60 and an array substrate 70.
  • the liquid crystal 60 is located between the array substrate 70 and the color filter substrate. Light propagates from the side of the array substrate 70 through the liquid crystal 60 to the color filter substrate. And through the color resistance 30 out of the color film substrate.
  • the color filter substrate further includes a spacer 40, and the spacer 40 is disposed on the main body of the color filter substrate to support a space containing liquid crystal.
  • the color filter substrate is located on the light exit side of the liquid crystal layer
  • the array substrate 70 is located on the light incident side of the liquid crystal layer.
  • the color filter substrate and the array substrate 70 each have a common electrode. After the two common electrodes are energized, the liquid crystal 60 is on Deflection occurs under the action of an electric field.
  • the "light valve" characteristic of the liquid crystal 60 modulates the change in transmittance of light passing through the liquid crystal layer, and the light from the liquid crystal
  • the display device realizes the screen display.
  • the spacer 40 is disposed on the main body of the color filter substrate, maintains the gap between the array substrate 70 and the color filter substrate, supports the space for accommodating the liquid crystal 60, and makes the thickness of the liquid crystal cell stable.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
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Abstract

本公开提供了一种彩膜基板的制备工艺、利用该彩膜基板的制备工艺制备的彩膜基板以及具有该彩膜基板的显示装置，其中，一种彩膜基板的制备工艺包括如下步骤：在基板衬底上通过溅射制程形成透明导电薄膜层及通过涂布操作形成黑矩阵；在所述透明导电薄膜或者黑矩阵上涂布色阻形成像素单元。

Description

一种彩膜基板的制备工艺、彩膜基板及显示装置
技术领域
本公开涉及显示器领域，特别涉及一种彩膜基板的制备工艺、利用该彩膜基板的制备工艺制备的彩膜基板以及具有该彩膜基板的显示装置。
背景技术
液晶显示装置广泛应用于多种电器设备，如电视、电脑显示屏，彩膜基板是液晶显示装置彩色化的关键部分，在显示装置中占的成本最高。现有的彩膜基板在经过透明导电薄膜制程后，还需进入热制程，如配向膜的印刷制程（温度高达90°C），由于在进入热制程前色阻中还存在水份，进入热制程后，高温使得水份从色阻中蒸发，导致液晶显示装置的成品出现气泡，影响显示效果。
申请内容
本公开的主要目的是提供一种彩膜基板的制备工艺，旨在避免显示装置的成品出现气泡，影响显示效果。
为实现上述目的，本公开提出一种彩膜基板的制备工艺，所述彩膜基板的制备工艺包括如下步骤：在基板衬底上通过溅射制程形成透明导电薄膜层并通过涂布操作形成黑矩阵；以及在所述透明导电薄膜或者黑矩阵上涂布色阻形成像素单元。
可选地，所述在基板衬底上通过溅射制程形成透明导电薄膜层及通过涂布操作形成黑矩阵的步骤包括：在基板衬底上通过溅射制程形成透明导电薄膜层；以及在透明导电薄膜层上通过涂布操作形成黑矩阵。
可选地，所述在基板衬底上通过溅射制程形成透明导电薄膜层及通过涂布操作形成黑矩阵的步骤包括：在基板衬底上通过涂布操作形成黑矩阵；以及在黑矩阵上通过溅射制程形成透明导电薄膜层。
本公开还提出一种彩膜基板，所述彩膜基板位于显示装置中液晶层的出光侧，所述彩膜基板包括：基板衬底、透明导电薄膜及色阻，所述透明导电薄膜及色阻均设置在所述基板衬底上，其中所述透明导电薄膜位于所述基板衬底与所述色阻之间，且所述透明导电薄膜至少覆盖所述色阻围成的区域。
可选地，所述彩膜基板还包括黑矩阵，所述黑矩阵位于所述透明导电薄膜与所述色阻之间，所述色阻涂布在所述黑矩阵上。
可选地，所述色阻包括红、绿、蓝三种基色色阻。
可选地，所述色阻包括红、绿、蓝及黄四种基色色阻。
可选地，所述色阻包括红、绿、蓝及白四种基色色阻。
可选地，所述红、绿、蓝三种基色色阻依次排列且间隔设置。
可选地，所述彩膜基板还包括黑矩阵，所述黑矩阵位于所述透明导电薄膜与所述基板衬底之间，所述色阻涂布在所述透明导电薄膜上。
可选地，所述色阻包括红、绿、蓝三种基色色阻，或所述色阻包括红、绿、蓝及黄四种基色色阻，或所述色阻包括红、绿、蓝及白四种基色色阻。
可选地，所述色阻间隔设置，所述黑矩阵涂布于所述相互间隔的色阻之间。
可选地，所述色阻的边缘与所述黑矩阵重叠。
可选地，所述色阻与所述黑矩阵不完全重叠。
可选地，所述透明导电薄膜为氧化铟锡。
可选地，处于最外层的所述色阻四周包围有黑矩阵。
可选地，所述基板衬底透明，能透过可见光。
本公开还提出一种显示装置，所述显示装置包括一种彩膜基板，所述彩膜基板位于显示装置中液晶层的出光侧，所述彩膜基板包括：基板衬底、透明导电薄膜及色阻，所述透明导电薄膜及色阻均设置在所述基板衬底上，其中所述透明导电薄膜位于所述基板衬底与所述色阻之间，且所述透明导电薄膜至少覆盖所述色阻围成的区域。
可选地，所述显示装置还包括阵列基板，所述液晶位于所述阵列基板与所述彩膜基板之间，光从所述阵列基板一侧经液晶传播至彩膜基板，并透过色阻传出彩膜基板。
可选地，所述彩膜基板还包括隔垫物，所述隔垫物设置于所述彩膜基板的主体上。
本公开技术方案通过在基板衬底与色阻之间溅射透明导电薄膜，使得透明导电薄膜位于基板衬底与色阻之间，以使彩膜基板在进入后续的热制程后不会因表面覆盖有一层透明导电薄膜而阻碍色阻中的水汽释出，从而避免了无法释出的水汽在彩膜基板的成品中存在气泡。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本公开一种彩膜基板的制备工艺的流程示意图；
图2为图1中步骤1的一实施例的流程示意图；
图3为图1中步骤1的另一实施例的流程示意图；
图4为本公开彩膜基板一实施例的结构示意图；
图5为本公开彩膜基板另一实施例的结构示意图；
图6为本公开显示装置的一实施例的结构示意图。
本公开目的的实现、功能特点及优点将结合实施例，参照附图做可选说明。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开的一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
需要说明，本公开实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本公开中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本公开要求的保护范围之内。
请参照图1，本公开提出了一种彩膜基板的制备工艺，包括如下步骤：
步骤S10：在基板衬底10上通过溅射制程形成透明导电薄膜50层及通过涂布操作形成黑矩阵20；以及步骤S20：所述透明导电薄膜50或者黑矩阵20上涂布色阻30形成像素单元。
如图4、图5所示，在本实施例中，色阻30位于彩膜基板的最外层，透明导电薄膜50位于基板衬底10与色阻30之间，透明导电薄膜50通过溅射制程覆盖于基板衬底10或黑矩阵20上，也即，只要透明导电薄膜50位于基板衬底10与色阻30之间即可，至于透明导电薄膜50是覆盖在基板底衬底还是黑矩阵20上，均对彩膜基板本身的性能没有任何影响。
透明导电薄膜50是一种透明的导电氧化物，由氧化铟锡形成（Indium Tin Oxides，ITO），在透明导电薄膜50的溅射制程中，薄膜的厚度可通过溅射的工艺条件和沿积的时间来调整。在基板衬底10上溅射透明导电薄膜50之前需要先清洗基板衬底10，避免基板上的脏污影响薄膜涂布的均匀性或给薄膜造成污染。
如图4所示，在透明导电薄膜50处于基板衬底10与黑矩阵20之间的实施例中，透明导电薄膜50直接溅射在基板衬底10上。如图2所示，透明导电薄膜50的溅射制程完成后，在透明导电薄膜50上进行黑矩阵20的涂布制程，黑矩阵20的涂布使得透明导电薄膜50背离基板衬底10的一面均覆盖了黑矩阵20涂料，但在彩膜基板中，黑矩阵20的主要作用之一是防止色阻30中的各基色间混色，提高显示图像的色纯度，因此，如图4及图5所示，色阻30不能与黑矩阵20完全重叠，这就需要将部分黑矩阵20的涂料除去以涂布色阻30。
在彩膜基板的制备工艺中，利用光刻与显影去除不需要的黑矩阵20涂料，其中，光刻工艺利用紫外线对黑矩阵20中需要留下的部位进行照射，黑矩阵20材料具有负性光刻胶的特性，在显影制程中，未照射到的黑矩阵20材料被碱性显影液除去，留下被照射到的部分，形成黑矩阵图案20。
色阻30涂布在黑矩阵图案20上，在本实施例中，色阻30包括红、绿、蓝三种基色色阻30，三种基色色阻30之间依次排列（排列顺序不受限制，只要任何相邻的三个基色均包括红、绿、蓝三种基色色阻30即可），但两两色阻30之间间隔有黑矩阵20涂料，以防止各基色间混色，影响显示效果。色阻30的涂布依次进行，顺序可根据需要而定，并无先后的限制，以先涂布红色色阻31为例，红色色阻31的涂料直接涂布在经过光刻及显影后形成的黑矩阵图案20上，再经光刻及显影将不需要留下的红色色阻涂料除去，形成红色色阻31。此时，彩膜基板上已经具有黑矩阵20与红色色阻31两种图案，再在其上涂布绿色色阻32涂料，再通过光刻与显影将不需要的绿色色阻涂料除去，留下需要的部分，形成绿色色阻32。最后涂布蓝色色阻33涂料，再经光刻与显影形成蓝色色阻33。至此，彩膜基板的色阻30制程完成。
如图2及图5所示，在透明导电薄膜50处于黑矩阵20与色阻30之间的实施例中，黑矩阵涂料涂布在基板衬底10上，经过光刻与显影后形成黑矩阵图案20，之后在黑矩阵图案20上进行透明导电薄膜50的溅射制程，使透明导电薄膜50形成于黑矩阵图案20上。色阻30涂布于透明导电薄膜50上，以红、绿、蓝三种基色色阻为例，首先在透明导电薄膜50上涂布红色色阻涂料，然后经光刻与显影将不需要的红色色阻材料去掉形成红色色色阻30，再进行绿色色阻32的涂布、光刻及显影形成绿色色阻32，最后进入蓝色色阻33的制程。
由于色阻30处于彩膜基板的最外层，色阻30在制备过程中未能完全释放的水份还留存在色阻30中，或者，彩膜基板制作完成后的存放过程中，色阻30也会从空气中吸收一定量的水份，透明导电薄膜50位于基板衬底10与色阻30之间的方式使得彩膜基板在后续的热制程中能够自由释放其中的水份，不受透明导电薄膜50的阻碍，因此，不会存在水汽形成的气泡出现在彩膜基板的成品中，当彩膜基板应用于显示装置中时，显示装置上不会出现气泡点影响显示效果。
本公开还提出一种彩膜基板，所述彩膜基板通过如上所述的任一项彩膜基板的制备工艺制备而成，所述彩膜基板位于显示装置中液晶层的出光侧，所述彩膜基板包括：基板衬底10、透明导电薄膜50及色阻30，所述透明导电薄膜50及色阻30均设置在所述基板衬底10上，其中所述透明导电薄膜50位于所述基板衬底10与所述色阻30之间，且所述透明导电薄膜50至少覆盖所述色阻30围成的区域。
在本实施例中，透明导电薄膜50是一整片完整的薄膜，至少覆盖了色阻30所围成的区域，当彩膜基板应用于显示装置时，透明导电薄膜50的主要是作为一公共电极，与液晶另一侧的电极共同作用使液晶产生偏转，因此透明导电薄膜50也可以将整个基板衬底10覆盖，这并不影响彩膜基板的使用性能。
如图4、图5所示，所述彩膜基板还包括黑矩阵20，黑矩阵20具有涂布于透明导电薄膜50与基板衬底10之间或涂布于透明导电薄膜50与色阻30之间两种方式，黑矩阵20的作用是遮挡液晶层的杂乱散射光，使光线只从色阻30中穿过，以防止各基色间混色，并防止环境光照射到薄膜晶体管沟道，影响显示效果。因此，两两色阻30之间间隔有黑矩阵20涂料，且最外层的色阻30四周也包围有黑矩阵材料，使得照射到色阻30的光线均来自于液晶。色阻30的边缘部分可以与黑矩阵20重叠，且色阻与黑矩阵的重叠部分位于黑矩阵的上方，以防止从色阻30边缘位置射入的光线发生混色现象，也即，色阻30只需存在不被黑矩阵20材料覆盖的部分使光线能够穿过色阻30即可。
可选地，所述色阻30包括红、绿、蓝三种基色色阻，或所述色阻30包括红、绿、蓝及黄四种基色色阻，或所述色阻30包括红、绿、蓝及白四种基色色阻。
光线无法穿过具有黑矩阵涂料的部位，光线经过色阻30后经色阻30过滤，只留下特定颜色的光。
具体地，基板衬底10透明，能够透过可见光。
由于色阻30处于彩膜基板的最外层，色阻30在制备过程中未能完全释放的水份还留存在色阻30中，或者，彩膜基板制作完成后的存放过程中，色阻30也会从空气中吸收一定量的水份，透明导电薄膜50位于基板衬底10与色阻30之间的方式使得彩膜基板在后续的热制程中能够自由释放其中的水份，不受透明导电薄膜50的阻碍，因此，不会存在水汽形成的气泡出现在彩膜基板的成品中。
本公开还提出一种显示装置，如图6所示，所述显示装置包括如上所述的任一项彩膜基板。所述显示装置还包括液晶60及阵列基板70，所述液晶60位于所述阵列基板70与所述彩膜基板之间，光从所述阵列基板70一侧经液晶60传播至彩膜基板，并透过色阻30传出彩膜基板。所述彩膜基板还包括隔垫物40，所述隔垫物40设置于所述彩膜基板的主体上，以支撑容纳液晶的空间。
在本实施例中，彩膜基板位于液晶层的出光侧，阵列基板70位于液晶层的入光侧，彩膜基板与阵列基板70上各有一公共电极，两个公共电极通电后，液晶60在电场的作用下发生偏转，当光从所述阵列基板70一侧经液晶60传播至彩膜基板时，液晶60的“光阀”特性调制穿过液晶层光线的透过率变化，光从液晶层射入彩膜基板时，彩膜基板中对光线进行过滤分光，最终使显示装置实现画面显示。
而隔垫物40设置于彩膜基板的主体上，维持阵列基板70与彩膜基板间的间隙，支撑起容纳液晶60的空间，使得液晶盒厚稳定。
由于彩膜基板的成品中不存在水汽形成的气泡，因此，显示装置上不会出现气泡点影响显示效果，能够可选保证显示装置的生产质量。
以上所述仅为本公开的可选实施例，并非因此限制本公开的专利范围，凡是在本公开的构思下，利用本公开说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本公开的专利保护范围内。

Claims (20)

  1. 一种彩膜基板的制备工艺，其中，所述彩膜基板的制备工艺包括如下步骤：
    在基板衬底上通过溅射制程形成透明导电薄膜层并通过涂布操作形成黑矩阵，以及；
    在所述透明导电薄膜或者黑矩阵上涂布色阻形成像素单元。
  2. 根据权利要求1所述的彩膜基板的制备工艺，其中，所述在基板衬底上通过溅射制程形成透明导电薄膜层及通过涂布操作形成黑矩阵的步骤包括：
    在基板衬底上通过溅射制程形成透明导电薄膜层，以及；
    在透明导电薄膜层上通过涂布操作形成黑矩阵。
  3. 根据权利要求1所述的彩膜基板的制备工艺，其中，所述在基板衬底上通过溅射制程形成透明导电薄膜层及通过涂布操作形成黑矩阵的步骤包括：
    在基板衬底上通过涂布操作形成黑矩阵，以及；
    在黑矩阵上通过溅射制程形成透明导电薄膜层。
  4. 一种彩膜基板，其中，所述彩膜基板位于显示装置中液晶层的出光侧，所述彩膜基板包括：
    基板衬底、透明导电薄膜及色阻，所述透明导电薄膜及色阻均设置在所述基板衬底上，其中所述透明导电薄膜位于所述基板衬底与所述色阻之间，且所述透明导电薄膜至少覆盖所述色阻围成的区域。
  5. 根据权利要求4所述的彩膜基板，其中，所述彩膜基板还包括黑矩阵，所述黑矩阵位于所述透明导电薄膜与所述色阻之间，所述色阻涂布在所述黑矩阵上。
  6. 根据权利要求5所述的彩膜基板，其中，所述色阻包括红、绿、蓝三种基色色阻。
  7. 根据权利要求5所述的彩膜基板，其中，所述色阻包括红、绿、蓝及黄四种基色色阻。
  8. 根据权利要求5所述的彩膜基板，其中，所述色阻包括红、绿、蓝及白四种基色色阻。
  9. 根据权利要求6所述的彩膜基板，其中，所述红、绿、蓝三种基色色阻依次排列且间隔设置。
  10. 根据权利要求4所述的彩膜基板，其中，所述彩膜基板还包括黑矩阵，所述黑矩阵位于所述透明导电薄膜与所述基板衬底之间，所述色阻涂布在所述透明导电薄膜上。
  11. 根据权利要求10所述的彩膜基板，其中，所述色阻包括红、绿、蓝三种基色色阻，或所述色阻包括红、绿、蓝及黄四种基色色阻，或所述色阻包括红、绿、蓝及白四种基色色阻。
  12. 根据权利要求11所述的彩膜基板，其中，所述色阻间隔设置，所述黑矩阵涂布于所述相互间隔的色阻之间。
  13. 根据权利要求12所述的彩膜基板，其中，所述色阻的边缘与所述黑矩阵重叠。
  14. 根据权利要求13所述的彩膜基板，其中，所述色阻与所述黑矩阵重叠的部分位于所述黑矩阵的上方。
  15. 根据权利要求4所述的彩膜基板，其中，所述透明导电薄膜为氧化铟锡。
  16. 根据权利要求4所述的彩膜基板，其中，处于最外层的所述色阻四周包围有黑矩阵。
  17. 根据权利要求4所述的彩膜基板，其中，所述基板衬底透明，能透过可见光。
  18. 一种显示装置，其中，所述显示装置包括一种彩膜基板，所述彩膜基板位于显示装置中液晶层的出光侧，所述彩膜基板包括：
    基板衬底、透明导电薄膜及色阻，所述透明导电薄膜及色阻均设置在所述基板衬底上，其中所述透明导电薄膜位于所述基板衬底与所述色阻之间，且所述透明导电薄膜至少覆盖所述色阻围成的区域。
  19. 根据权利要求18所述的显示装置，其中，所述显示装置还包括阵列基板，所述液晶位于所述阵列基板与所述彩膜基板之间，光从所述阵列基板一侧经液晶传播至彩膜基板，并透过色阻传出彩膜基板。
  20. 根据权利要求18所述的显示装置，其中，所述彩膜基板还包括隔垫物，所述隔垫物设置于所述彩膜基板的主体上。
PCT/CN2018/121902 2018-12-04 2018-12-19 一种彩膜基板的制备工艺、彩膜基板及显示装置 Ceased WO2020113682A1 (zh)

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