WO2020107673A1 - 蒸镀载板及利用该蒸镀载板对基板进行蒸镀的方法 - Google Patents

蒸镀载板及利用该蒸镀载板对基板进行蒸镀的方法 Download PDF

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Publication number
WO2020107673A1
WO2020107673A1 PCT/CN2019/071327 CN2019071327W WO2020107673A1 WO 2020107673 A1 WO2020107673 A1 WO 2020107673A1 CN 2019071327 W CN2019071327 W CN 2019071327W WO 2020107673 A1 WO2020107673 A1 WO 2020107673A1
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Prior art keywords
protrusion
substrate
protrusions
vapor
vapor deposition
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PCT/CN2019/071327
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English (en)
French (fr)
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刘志乔
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武汉华星光电半导体显示技术有限公司
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Priority to US16/349,280 priority Critical patent/US20210180181A1/en
Publication of WO2020107673A1 publication Critical patent/WO2020107673A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Definitions

  • the invention relates to the technical field of vapor deposition equipment and OLED substrate manufacturing, in particular to a vapor deposition carrier plate and a method for vapor deposition of a substrate using the vapor deposition carrier plate.
  • the substrate size of OLED display devices is getting larger and larger.
  • the substrate and the vapor deposition carrier (Touch Plate) After the bonding, the curvature of the substrate also increases, so the risk of fragmentation is greatly increased, and the proportion of defective display unevenness in OLED products will also be greatly increased.
  • the protrusion and the body of the carrier are designed in one piece. Therefore, the position and size of the protrusion cannot be adjusted according to the actual situation. For example, when the arrangement of the upper surface of the substrate changes, the design of the metal mask changes, the bonding between the substrate and the metal mask changes, and the fixed bumps cannot be adjusted accordingly.
  • the substrate in the vacuum evaporation chamber and the evaporation carrier (Touch Plate) sticking phenomenon and the uneven gap between the substrate and the metal mask become more and more serious.
  • the technical problem to be solved by the present invention is to provide a vapor-deposited carrier board and a method for vapor-depositing a substrate using the vapor-deposited carrier board.
  • the structure of the protrusion and the carrier body is separated. Replace the matching protrusion with the corresponding position of the substrate to improve the problems of substrate sticking and uneven display of the display device.
  • a vapor-deposited carrier board including a carrier board body, having a loading surface for loading a substrate, the substrate includes side portions, a transition area, and a display area; Detachably fixed on the loading surface of the carrier body; the protrusions include first protrusions, wherein at least one of the first protrusions corresponds to the transition area; the second protrusions correspond to the Display area.
  • both the first protrusion and the second protrusion are in a lattice arrangement structure, and the distribution density of the second protrusion is smaller than that of the first protrusion.
  • the height of the second protrusion is smaller than the height of the first protrusion
  • the height of the first protrusion is 40-50 microns; the height of the second protrusion is 35-45 microns.
  • the protrusion is at least one of a truncated cone shape, a truncated cone shape, a cylindrical shape, and a prismatic shape.
  • the carrier body is provided with an inlay groove, and the protrusion is correspondingly embedded in the inlay groove.
  • the invention also provides a method for vapor-depositing a substrate by using a vapor-deposited carrier board.
  • the method includes: providing a vapor-deposited carrier board, including a carrier board body and a plurality of protrusions, the carrier board body having A loading surface for loading the substrate; the protrusions include several first protrusions and several second protrusions; a substrate is provided, including side portions, transition areas, and display areas; at least one of them The first protrusion corresponds to the transition area, and the second protrusion corresponds to the display area.
  • the first protrusion and the second protrusion are both a lattice arrangement structure, and the distribution density of the second protrusion is smaller than that of the first protrusion.
  • the transition area of the substrate is in contact with the side portion; the minimum distance between the transition area and the closest one of the first protrusions is 7000 ⁇ m-8000 ⁇ m .
  • the substrate is an OLED display substrate.
  • the vapor-deposited carrier board of the present invention and a method for vapor-depositing a substrate using the vapor-deposited carrier board can effectively reduce the probability of sticking and reduce the risk of chipping by designing the carrier body and the protrusion as a separate combined structure
  • the invention also improves the problem that the substrate is unevenly attached to the metal mask plate due to the bending deformation, thereby improving the darkening phenomenon of some products caused by the deviation of the coating film.
  • the actual bonding requirements are different for different products.
  • the present invention can facilitate the design and actual design in real time through the separate combination design of the carrier body and the protrusion
  • the protrusions with matching requirements include flexible setting of the protrusion size, distribution position, quantity, angle, etc., without replacing the entire vapor deposition carrier, only need to adjust the protrusion size, distribution position, number, etc. to meet different Deposition requirements for substrates.
  • FIG. 1 is an exploded view of the structure of a vapor-deposited carrier board according to an embodiment of the present invention, which mainly embodies a convex mosaic method.
  • FIG. 2 is a top view of the structure of the vapor-deposited carrier board according to an embodiment of the present invention, which mainly reflects the distribution of the first protrusion and the second protrusion.
  • FIG. 3 is a layered enlarged view of the circled portion A in FIG. 2, mainly reflecting the positional correspondence between the protrusions and the various regions of the substrate.
  • the vapor deposition carrier 100 of the present invention includes a carrier body 110 and a plurality of protrusions 120.
  • the carrier body 110 may be a rectangular metal plate, the size of which is designed according to the size of the substrate 200 to fit the substrate 200 (see FIG. 3 ).
  • the carrier body 110 has a loading surface 112 for loading the substrate 200.
  • the substrate 200 is generally a glass substrate, and its shape is also generally rectangular, which fits the carrier body 110.
  • the substrate 200 is an OLED display substrate.
  • the substrate 200 includes a side portion 210, a transition area 220 and a display area 230.
  • the transition area 220 is connected to the side portion 210 of the substrate 200; the display area 230 is located in the middle area of the substrate and connected to the transition area 220.
  • the protrusion 120 is detachably fixed on the loading surface 112 of the carrier body 110.
  • the protrusion 120 may be fixed on the carrier body 110 by adhesive or mosaic. If the bonding method is adopted, that is, an adhesive layer is added between the protrusion 120 and the carrier body 110, but due to the evaporation, the adhesive layer may be softened due to excessive temperature, which may cause It has an influence on the evaporation process. Therefore, in this embodiment, the protrusion 120 is embedded on the carrier body 110 by using a mosaic method.
  • a plurality of mosaic grooves 111 whose size matches the size of the corresponding protrusion 120 are provided on the side of the carrier body 110 facing the substrate 200 (on the loading surface 112), and then each of the protrusions It is only necessary to embed the corresponding 120 in the embedding groove 111.
  • the shape and size of the protrusion 120 can also be adjusted according to actual conditions.
  • the shape of the protrusion 120 can be designed as at least one of a truncated cone shape, a truncated cone shape, a cylindrical shape, and a prismatic shape.
  • a trapezoidal mesa-shaped structure in a pyramid shape is used.
  • the bottom surface of the protrusion 120 with a large area is embedded in the inlay groove 111, so that the protrusion 120 will not be displaced or rotated to remain fixed.
  • the display area 230 receives more heat, while the side portions 210 and all The transition zone 220 receives less heat. Therefore, a zone with larger deformation generally occurs in the transition zone 220. Therefore, as shown in FIG. 2, when the protrusion 120 is designed, the protrusion 120 is divided into a plurality of first protrusions 121 and a plurality of second protrusions 122. Both the first protrusion 121 and the second protrusion 122 are in a lattice arrangement structure. The first protrusion 121 surrounds the second protrusion 122.
  • the distribution density of the second protrusions 122 is smaller than that of the first protrusions 121, that is, the distance between the first protrusions 121 may be set to 5-11 mm, and the distance between the second protrusions 122 The distance can be set to 25-40 mm, and the height of the protrusion 120 can be adjusted according to actual conditions to optimize the evaporation solution.
  • the height of the second protrusion 122 is smaller than the first protrusion 121 the height of.
  • the height of the first protrusion 121 is 40-50 microns.
  • the height of the second protrusion 122 is 35-45 microns. This design is beneficial to prevent the substrate 200 from falling off when the substrate 200 and the carrier body 110 are attached to the adhesive sheet, and a chipping phenomenon.
  • the protrusion 120 adopts a trapezoidal platform structure, and at least includes two oppositely arranged side surfaces.
  • the two oppositely arranged side surfaces are not parallel but have an included angle. °-120°.
  • the side of the protrusion 120 of the trapezoidal mesa structure facing the substrate can be angle-adjusted as needed to adapt it to actual needs.
  • At least one of the first protrusions 121 corresponds to the transition area 220 of the substrate 200; the second protrusions 122 correspond to the display area 230 of the substrate 200, and On the substrate 200, the edge of the display area 230 extends to a position corresponding to the second protrusion 122.
  • the minimum distance between the transition region 220 and the closest one of the first protrusions 121' is 7000-8000 microns, this design It is beneficial to reduce the uneven bonding phenomenon between the substrate 200 and the metal mask plate caused by the bending deformation of the transition region 220, thereby effectively preventing the relative displacement of the film formation on the substrate 200.
  • the method for vapor-depositing a substrate using the vapor-deposited carrier board of the present invention includes the following:
  • a vapor deposition carrier 100 including a carrier body 110 and a plurality of protrusions 120.
  • the carrier body 110 has a loading surface 112 for loading the substrate 200;
  • the protrusion 120 includes a plurality of first protrusions 121, and several second protrusions 122; wherein the first protrusions 121 and the second protrusions 122 are both lattice array structures, and the distribution density of the second protrusions 122 is smaller than that of the first protrusions 121 distribution density, and the first protrusion 121 surrounds the second protrusion 122;
  • a substrate 200 is provided, including a side portion 210, a transition area 220, and a display area 230; at least one of the first protrusions 121 corresponds to the transition area 220, and the second protrusions 122 correspond to the display area 230.
  • the above method may further include providing a metal mask plate, which is attached to the substrate 200.
  • the present invention will be further described below in conjunction with the use process.
  • the vapor deposition carrier 100 of this embodiment is used for vapor deposition for the first time, if the display area 230 is found to have a portion of the height of the first protrusion 121 Insufficient, so that the adhesion between the substrate 200 and the vapor deposition carrier 100 is not high, so that the substrate 200 falls off and breaks, then the next bump can be replaced at the next vapor deposition 121, adapt it to the current requirements of the substrate 200 in the evaporation process, and prevent the substrate 200 from falling off.
  • the protrusions 120 corresponding to a certain area on the substrate 200 are too small, the substrate 200 at that location is deformed too much, causing a relative shift in the position of the film formation, then next time During vapor deposition, one or more of the protrusions 120 may be added to the corresponding area of the substrate 200 according to the current vapor deposition situation.
  • the vapor deposition carrier 100 of the present invention can effectively reduce the probability of sticking and reduce the risk of chipping by designing the carrier body 110 and the protrusion 120 as a separate combined structure.
  • the problem that the substrate 200 is unevenly attached to the metal mask plate due to bending deformation is solved, thereby improving the phenomenon of darkening of some products caused by the deviation of the coating film.
  • the separate combination design of the carrier body 110 and the protrusion 120 can facilitate the real-time design of the actual requirements
  • the matching protrusions 120 include flexibly setting the size, distribution position, number, and angle of the protrusions 120 without replacing the entire vapor deposition carrier 100. That is, the present invention only needs to adjust the size, distribution position, number, etc. of the protrusions 120 to meet the vapor deposition requirements of different substrates 200.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

提供了一种蒸镀载板(100)及利用该蒸镀载板(100)对基板(200)进行蒸镀的方法，所述蒸镀载板(100)包括载板本体(110)，具有一装载面(112)，用以装载一基板(200)，所述基板(200)包括边侧部(210)、过渡区(220)以及显示区(230)；以及若干凸起(120)，可拆卸地固定在载板本体(110)的装载面(112)上；所述凸起(120)包括第一凸起(121，121')，其中至少一个所述第一凸起(121)对应于所述过渡区(220)；第二凸起(122)，对应所述显示区(230)。为了改善蒸镀制程的风险，将载板本体(110)与凸起(120)分离式组合设计，有效的降低了粘片的概率，减少了破片风险，同时，改善了基板(200)因弯曲形变造成的与金属掩膜板贴合不均匀问题，从而改善了因镀膜偏移造成的部分产品发暗现象。

Description

蒸镀载板及利用该蒸镀载板对基板进行蒸镀的方法 技术领域
本发明涉及蒸镀设备及OLED基板制造的技术领域，具体为一种蒸镀载板及利用该蒸镀载板对基板进行蒸镀的方法。
 背景技术
随着科技的发展，OLED显示装置的基板尺寸越来越大。在基板进行蒸镀过程中，由于基板的尺寸过大，在基板与蒸镀载板（Touch Plate）贴合后，基板的弯曲度也随之增大，因此，破片风险大幅升高，OLED产品中，显示不均的不良比例也会大幅提高。而现有的蒸镀载板（Touch Plate）中，凸起与载板本体一体设计，因此，凸起的位置、大小无法根据实际状况进行调整。例如，当基板上表面的排列方式发生更改，金属掩膜板的设计发生变更，基板与金属掩膜板的贴合状况均会发生变化，而固定的凸起无法做出相应调整。真空蒸镀腔内的基板与蒸镀载板（Touch Plate）的粘片现象以及基板与金属掩膜板之间贴合间隙不均匀问题变得越发严峻。
 技术问题
本发明所要解决的技术问题是：提供一种蒸镀载板及利用该蒸镀载板对基板进行蒸镀的方法，通过凸起与载板本体分离的结构，根据蒸镀实际状况，方便在与基板对应位置更换适配的凸起，以改善基板粘片现象和显示装置显示不均等问题。
 技术解决方案
为解决上述技术问题：提供一种蒸镀载板，包括载板本体，具有一装载面，用以装载一基板，所述基板包括边侧部、过渡区以及显示区；以及若干凸起，可拆卸地固定在所述载板本体的所述装载面上；所述凸起包括第一凸起，其中至少一个所述第一凸起对应于所述过渡区；第二凸起，对应所述显示区。
在本发明一实施例中，所述第一凸起和所述第二凸起均为点阵排列结构，所述第二凸起的分布密度小于所述第一凸起的分布密度。
在本发明一实施例中，所述第二凸起的高度小于所述第一凸起的高度；
所述第一凸起的高度为40-50微米；所述第二凸起的高度为35-45微米。
在本发明一实施例中，所述凸起为棱台形、圆台形、圆柱形、棱柱形中的至少一种。
在本发明一实施例中，所述凸起与所述载板本体之间具有黏胶层，所述凸起通过黏胶层粘接并固定至所述载板本体上。
在本发明一实施例中，所述载板本体上设有镶嵌槽，所述凸起对应的嵌入于所述镶嵌槽中。
本发明还提供了一种利用蒸镀载板对基板进行蒸镀的方法，该方法包括：提供一所述的蒸镀载板，包括载板本体以及若干凸起，所述载板本体具有一装载面，用以装载所述基板；所述凸起包括若干个第一凸起、以及若干个第二凸起；提供一基板，包括边侧部、过渡区和显示区；其中至少一个所述第一凸起对应于所述过渡区，而所述第二凸起对应所述显示区。
在本发明一实施例中，所述第一凸起和所述第二凸起均为点阵排列结构，所述第二凸起的分布密度小于第一凸起的分布密度。
在本发明一实施例中，在所述基板的所述过渡区与所述边侧部相接；所述过渡区与最相近的一所述第一凸起的最小距离为7000微米-8000微米。
在本发明一实施例中，所述基板为OLED显示基板。
 有益效果
本发明的蒸镀载板及利用该蒸镀载板对基板进行蒸镀的方法通过将载板本体与凸起设计为分离式组合结构，能够有效降低粘片的概率，减少破片风险，同时，本发明还改善了基板因弯曲形变造成的与金属掩膜板贴合不均匀的问题，从而改善了因镀膜偏移造成的部分产品发暗现象。此外，考虑到实际蒸镀过程与理论模拟的差异，对应不同产品时实际贴合需求也不同，因此，本发明通过载板本体与凸起的分离式组合设计，能够方便实时地设计出与实际需求相匹配的凸起，包括灵活设置凸起的尺寸、分布位置、数量、角度等，而不需要更换整个蒸镀载板，只需要调整凸起的尺寸、分布位置、数量等即可满足不同基板的蒸镀要求。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
下面结合附图和实施例对本发明作进一步解释。
图1是本发明实施例的蒸镀载板结构的爆炸图，主要体现凸起的镶嵌方式。
图2是本发明实施例的蒸镀载板结构俯视图，主要体现第一凸起和第二凸起的分布情况。
图3是图2中圆圈部分A的层状放大图，主要体现凸起与基板各个区域的位置对应关系。
其中，
100蒸镀载板；
110载板本体；                   120凸起；
111镶嵌槽；                     112装载面；
121、121’第一凸起；             122第二凸起；
200基板；
210边侧部；                     220过渡区；
230显示区。
 本发明的最佳实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
以下实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「顶」、「底」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
如图1所示，在其中一实施例中，本发明的蒸镀载板100，包括载板本体110以及若干凸起120。
所述载板本体110可采用长方形的金属板，其尺寸依据基板200的尺寸设计，以适应基板200（参见图3）。所述载板本体110具有一装载面112，用以装载所述基板200。
如图3所示，所述基板200一般为玻璃基板，其形状一般也为长方形，与载板本体110相契合。在本实施例中，所述基板200为OLED显示基板。所述基板200包括边侧部210、过渡区220和显示区230。所述过渡区220与所述基板200的边侧部210相接；所述显示区230位于基板的中间区域，并与所述过渡区220相连。
如图1所示，所述凸起120可拆卸地固定在所述载板本体110的装载面112上。在实际组装时，所述凸起120可采用粘接方式或者镶嵌方式固定在所述载板本体110上。若采用粘接方式，即在所述凸起120与所述载板本体110之间添加一层黏胶层即可，但由于蒸镀时，黏胶层可能因温度过高而软化，从而会对蒸镀工艺产生影响，因此，本实施例中，采用镶嵌方式将所述凸起120镶嵌在所述载板本体110上。具体设计时，即在所述载板本体110朝向基板200的一面（装载面112上）设置若干个尺寸与对应的所述凸起120尺寸相匹配的镶嵌槽111，之后将每一所述凸起120对应地镶嵌在镶嵌槽111中即可。
所述凸起120的形状、尺寸也可以根据实际状况加以调整，一般的，所述凸起120的形状可以设计成棱台形、圆台形、圆柱形、棱柱形中的至少一种。如图1所示，本实施例中，采用棱台形中的梯形台状结构。其中，所述凸起120的面积较大的底面被镶嵌在镶嵌槽111内，这样所述凸起120就不会发生位移或者转动以保持固定。
如图3所示，为了适应所述基板200上不同区域位置的实际情况，一般情况下，由于蒸镀时受热不均，所述显示区230受热较多，而所述边侧部210和所述过渡区220的受热较少，因此，一般形变较大的区发生在所述过渡区220。因此，如图2所示，在设计所述凸起120时，将所述凸起120分为若干个第一凸起121、以及若干个第二凸起122。所述第一凸起121和第二凸起122均为点阵排列结构。所述第一凸起121围绕所述第二凸起122。所述第二凸起122的分布密度小于第一凸起121的分布密度，即所述第一凸起121之间的距离可设置为5-11毫米，所述第二凸起122之间的距离可设置为25-40毫米，所述凸起120的高度根据实际情况进行调整，以优化蒸镀方案，本实施例中，所述第二凸起122的高度小于所述第一凸起121的高度。所述第一凸起121的高度为40-50微米。所述第二凸起122的高度为35-45微米。这种设计有利于防止所述基板200与所述载板本体110贴合粘片时造成基板200脱落，发生破片现象。
由于本实施例中，所述凸起120采用梯形台状结构，至少包括两个相对设置的侧面，两个相对设置的侧面并非平行而是存在一个夹角，该夹角范围一般可以设置在110°-120°。同时，梯形台状结构的所述凸起120朝向所述基板的一面可以根据需要进行角度调整，使之适应实际需求。
参照图3所示，其中至少一个所述第一凸起121对应于所述基板200的所述过渡区220；第二凸起122对应所述基板200的所述显示区230，且在所述基板200上，所述显示区230的边缘延伸至所述第二凸起122所对应的位置。其中，在所述过渡区220与所述边侧部210相接处，所述过渡区220与最相近的一所述第一凸起121’的最小距离为7000微米-8000微米，这种设计有利于降低因所述过渡区220发生弯曲形变造成的基板200与金属掩膜板贴合不均现象，从而有效防止基板200上膜层成膜发生相对位移的现象。
请同时参照图1至图3所示，本发明利用该蒸镀载板对基板进行蒸镀的方法包括如下：
提供一蒸镀载板100，包括载板本体110以及若干凸起120，所述载板本体110具有一装载面112，用以装载所述基板200；所述凸起120包括若干个第一凸起121、以及若干个第二凸起122；其中所述第一凸起121和所述第二凸起122均为点阵排列结构，所述第二凸起122的分布密度小于第一凸起121的分布密度，且所述第一凸起121围绕所述第二凸起122；
提供一基板200，包括边侧部210、过渡区220和显示区230；其中至少一个所述第一凸起121对应于所述过渡区220，而所述第二凸起122对应所述显示区230。
当然，上述方法还可以进一步包括一提供金属掩膜板，其贴合于所述基板200上。
下面结合使用过程对本发明作进一步说明。可对应参照图1-3所示，例如，第一次采用本实施例的所述蒸镀载板100进行蒸镀时，若发现所述显示区230因部分的所述第一凸起121高度不够，使得所述基板200与所述蒸镀载板100的贴合度不高，从而发生基板200脱落而破片的现象时，那么在下一次蒸镀时，则可以更换该处的第一凸起121，使之适应于当前基板200在蒸镀过程中的要求，防止基板200脱落。再如，若发现对应基板200上某一区域的所述凸起120因排布密度过小，造成该处的所述基板200形变过大，引起成膜的位置发生相对偏移，那么在下一次蒸镀时，就可以根据本次的蒸镀情况，在所述基板200的对应区域增设一个或几个所述凸起120。
综上所述，本发明的蒸镀载板100通过将所述载板本体110与所述凸起120设计为分离式的组合结构，能够有效降低粘片的概率，减少破片风险，同时，改善了基板200因弯曲形变造成的与金属掩膜板贴合不均匀的问题，从而改善了因镀膜偏移造成的部分产品发暗的现象。考虑到实际蒸镀过程与理论模拟的差异，对应不同产品时实际贴合需求也不同，因此，这种载板本体110与凸起120的分离式组合设计，能够方便实时的设计出与实际需求相匹配的凸起120，包括灵活设置凸起120的尺寸、分布位置、数量、角度等，而不需要更换整个蒸镀载板100。亦即，本发明只需要通过调整凸起120的尺寸、分布位置、数量等，即可满足不同基板200的蒸镀要求。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种蒸镀载板，其包括
    载板本体，具有一装载面，用以装载一基板，所述基板包括边侧部、过渡区以及显示区；以及
    若干凸起，可拆卸地固定在所述载板本体的所述装载面上；
    所述凸起包括
    若干个第一凸起，其中至少一个所述第一凸起对应于所述过渡区；
    若干个第二凸起，对应所述显示区。
  2. 根据权利要求1所述的蒸镀载板，其中，所述第一凸起和所述第二凸起均为点阵排列结构，所述第二凸起的分布密度小于所述第一凸起的分布密度。
  3. 根据权利要求1所述的蒸镀载板，其特征在于，所述第二凸起的高度小于所述第一凸起的高度；
    所述第一凸起的高度为40-50微米；
    所述第二凸起的高度为35-45微米。
  4. 根据权利要求1所述的蒸镀载板，其中，所述凸起为棱台形、圆台形、圆柱形、棱柱形中的至少一种。
  5. 根据权利要求1所述的蒸镀载板，其特征在于，所述凸起与所述载板本体之间具有黏胶层，所述凸起通过黏胶层粘接并固定至所述载板本体上。
  6. 根据权利要求1所述的蒸镀载板，其中，所述载板本体上设有镶嵌槽，所述凸起对应的嵌入于所述镶嵌槽中。
  7. 一种利用蒸镀载板对基板进行蒸镀的方法，其中，该方法包括：
    提供一如权利要求1所述的蒸镀载板，包括载板本体以及若干凸起，所述载板本体具有一装载面，用以装载所述基板；所述凸起包括若干个第一凸起、以及若干个第二凸起；
    提供一基板，包括边侧部、过渡区和显示区；其中至少一个所述第一凸起对应于所述过渡区，而所述第二凸起对应所述显示区。
  8. 根据权利要求7所述的利用蒸镀载板对基板进行蒸镀的方法，其中，所述第一凸起和所述第二凸起均为点阵排列结构，所述第二凸起的分布密度小于第一凸起的分布密度。
  9. 根据权利要求7所述的利用蒸镀载板对基板进行蒸镀的方法，其中，在所述基板的所述过渡区与所述边侧部相接处，所述过渡区与最相近的一所述第一凸起的最小距离为7000微米-8000微米。
  10. 根据权利要求7所述的利用蒸镀载板对基板进行蒸镀的方法，其中，所述基板为OLED显示基板。
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