WO2020104084A1 - Leiterplatte für radarsensoren mit metallischer füllstruktur und verfahren zur herstellung einer leiterplatte für radarsensoren mit metallischer füllstruktur - Google Patents
Leiterplatte für radarsensoren mit metallischer füllstruktur und verfahren zur herstellung einer leiterplatte für radarsensoren mit metallischer füllstrukturInfo
- Publication number
- WO2020104084A1 WO2020104084A1 PCT/EP2019/075429 EP2019075429W WO2020104084A1 WO 2020104084 A1 WO2020104084 A1 WO 2020104084A1 EP 2019075429 W EP2019075429 W EP 2019075429W WO 2020104084 A1 WO2020104084 A1 WO 2020104084A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna device
- circuit board
- filling structure
- substrate
- filling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Definitions
- the present invention relates to a circuit board for radar sensors with a metallic filling structure and a method for producing a circuit board for radar sensors with a metallic filling structure.
- circuit boards for radar sensors are only manufactured with the metal structures required for the sensor, for example radar sensors of generation 1 to 4.
- the manufacturing tolerances of the production process of the circuit board are checked on the relevant structures, such as the antenna, the conductor tracks or the soldering areas, using a optical system.
- Optical camera systems are usually used for this, which can only check the relevant structures to a limited extent in the production process due to short process times.
- Vias become electrically conductive again by means of an electroplating process by growing copper on the vias.
- the relevant structures occupy only a small amount of the available space on the circuit board and the remaining area of the circuit board remains free. Because of the small amount of copper on the circuit board, the galvanic growth is not homogeneous over the entire Printed circuit board is distributed. This can lead to different tolerances being formed on the circuit board. As a result, the mechanical dimensions of the relevant structures are changed such that, for example, areas on the circuit board are grown thicker or thinner with copper. In addition, oblique edges of the relevant structures can be made round or are not mapped as required. If the rate is too low
- the electroplating process is not evenly distributed over the surface of the circuit board, but rather can occur concentrated in a few positions on the circuit board.
- the circuit board for radar sensors has only the antenna areas, very thin conductor tracks and the soldering areas in order to provide an electrical connection to integrated components on the underside of the circuit board.
- the remaining areas on the circuit board are unused areas and are not used or required for the functionality of the radar sensor. This can lead to the deployed
- the area of the conductor tracks for electrically connecting the antenna to the soldering areas can be smaller or not as required, as a result of which, in the worst case, there is no electrical signal flow between the antenna and the corresponding electronics. Furthermore, in the case of a high-frequency component such as the radar sensor, increased noise may occur at the receiver or the antennas may no longer radiate in the desired direction. It is also disadvantageous if the conductor track, which for example has a nominal width of 100 mhh, only has a width of 80 mhh, the characteristic impedance is out of tune and therefore a different resistance value than required is present.
- Printed circuit boards for use in radar sensors are known for example from DE 10 2016 119825 A1.
- the present invention provides a circuit board for radar sensors with a metallic filling structure and a method for producing a circuit board for radar sensors with a metallic filling structure according to the independent
- the present invention provides a circuit board for radar sensors comprising a substrate with a top and a bottom.
- the circuit board has at least one arranged on the top of the substrate
- Antenna device which is formed from a metal layer. Furthermore, the circuit board has one arranged on the upper side of the substrate
- Filling structure which is formed from the metal layer.
- the filling structure is arranged at a distance from the antenna device in a surface area of the upper side of the substrate that is not occupied by the antenna device.
- the filling structure has no electrical connection to the antenna device.
- an area coverage of the filling structure lies in a ratio between 50% to 300% of an area coverage of the
- the present invention provides a method for producing a circuit board for radar sensors comprising a substrate with an upper side and a lower side.
- the method comprises a step of applying a completely closed metal layer on an upper side of a substrate.
- the method comprises a further step of forming at least one antenna device arranged on the upper side of the substrate and a filling structure which are formed from the metal layer.
- the filling structure is arranged at a distance from the antenna device in a surface area of the upper side of the substrate that is not occupied by the antenna device.
- the filling structure has no electrical connection to the antenna device.
- the surface structure of the fill structure is in a ratio between 50% to 300% of an area occupancy of the
- the antenna device is to be understood as the relevant structures for the circuit board of a radar sensor. These include at least one antenna, which is connected to a soldering surface via a conductor track. An electrical connection to the monolithic microwave integrated circuit (MMIC) with supply and data lines soldered to the top of the printed circuit board is provided via the soldering area.
- MMIC monolithic microwave integrated circuit
- the Monolithic Microwave Integrated Ciruit is on the
- both the proportion of the metal surface on the printed circuit board can be increased, which is advantageous for the optimization of the production process, and a check of the necessary accuracy of the
- the idea on which the invention is based is therefore to apply additional filling structures to the surface of the printed circuit board in order advantageously to make the copper distribution more homogeneous during the electroplating process.
- This has the advantage that there are no longer only thin conductor tracks, but rather a relatively uniform metallic image, preferably a copper image, is formed.
- the filling structures are formed in the dimensions and orientation of the antenna device or the antenna, the conductor tracks and soldering areas, which can advantageously be used to check the etching tolerances or whether these have been complied with on the metallic filling structures, preferably made of copper. It is also advantageous that not only isolated areas, such as the antenna, for example, but larger areas are formed from the applied full copper area after the copper is etched, as a result of which the etching process can be carried out in a clearly defined and optimized manner. This can result in improved quality in terms of the required manufacturing tolerances.
- the copper is better distributed in the plated-through holes during the electroplating process and there is a more homogeneous distribution on the entire printed circuit board.
- the area coverage of the filling structure is in a ratio between 75% to 200%, in particular in a ratio between 90% and 150% of the area coverage of the
- the white area has the
- metal in particular metal structures
- filling structures in particular made of metal.
- full metal surfaces have the disadvantage that it is not possible to check the manufacturing tolerances on full metal surfaces. It is therefore advantageous to provide the free area with regular and spaced-apart filling structures with dimensions in the order of magnitude of the antenna device.
- the at least one filling structure is formed in a rectangular or square shape. Rectangular or square shapes have the advantage that a regular grid can be formed with these shapes and, on the other hand, are easier to implement in the order of magnitude of the antenna device.
- the printed circuit board production process, in particular the etching and copper plating, are improved.
- the rectangular or square shape of the filling structure and the antenna device have edges and the edges of the filling structure run in the same orientation as the edges of the antenna device.
- This embodiment is advantageous in that the edges of the rectangular or square shape can be arranged in the same orientation as the antenna device and are therefore subject to the same fault tolerances as the antenna device. A check of the fault tolerances is thus improved.
- a multiplicity of filling structures are arranged in a grid in different orientations and distances.
- This embodiment is advantageous in that the metal surface is distributed evenly on the printed circuit board by the large number of filling structures and the antenna device, as a result of which the required tolerances in the
- Production process of a printed circuit board can be better adhered to. This is particularly advantageous in the electroplating step.
- the coppering on the circuit board is more homogeneous.
- the distances between the filling structures are in a ratio between 50% to 200%, in particular in a ratio between 75% and 150% of the antenna device.
- the distances between the filling structures are preferably at a distance of 100% of the distance of the antenna device.
- the spacings of the rectangular or square filling structures advantageously correspond to the spacings of the antenna device, so that the filling structures have the same manufacturing tolerances as the antenna device. In this way, the checking of the manufacturing tolerances can be carried out more effectively and improved
- the antenna device and the metallic fill structure are formed from copper.
- Figure 1 is a schematic representation of the circuit board according to a first embodiment of the present invention.
- FIG. 2 shows a schematic illustration of a printed circuit board in a cross-sectional view without metal structures and fill structures being formed
- Fig. 3 is a schematic representation of the circuit board in a grid
- FIG. 4 shows a schematic illustration to explain a method for producing a printed circuit board for radar sensors with a metallic fill structure according to the first embodiment of the present invention
- Fig. 5 is a schematic representation of an exemplary circuit board for radar sensors.
- FIG. 1 is a schematic illustration of the circuit board 10 according to a first embodiment of the present invention.
- reference numeral 10 denotes a circuit board according to the present invention.
- the printed circuit board 10 comprises a substrate 1 with an upper side 4 and a lower side 3.
- At least one antenna device 11 is formed on the upper side 4 of the substrate 1.
- the antenna device 11 has two antennas.
- the antenna device 11 is formed from a metal layer 2, preferably from copper.
- the antenna device 11 comprises the antenna, the conductor track 13 and the
- soldering surface 12 The conductor track 13 connects the antenna to the soldering surface 12.
- a monolithic microwave can be made through vias in the soldering surface 12
- MMIC Integrated Circuit
- the MMIC is arranged on the underside 3 of the substrate 1.
- filling structures 14 are arranged on the upper side 4 of the substrate 1.
- the filling structures 14 are arranged at a distance from the antenna device 11 in a surface area of the upper side 4 of the substrate 1 that is not occupied by the antenna device 11.
- the filling structure 14 has no electrical connection to the antenna device 11.
- the area occupancy of the filling structure 14 is in a ratio between 50% to 300% of an area occupancy of the antenna device 11.
- FIG. 1 shows an embodiment of the circuit board 10 of a radar sensor, in which three filling structures 14 are formed.
- circuit board surface is covered with metal as evenly as possible.
- the free surfaces of the circuit board 1 are therefore with regular filling structures 14, with dimensions in the
- Fig. 1 represents one
- the filling structures 14 can be designed as rectangles or squares.
- the filling structures 14 can advantageously be arranged in a regular grid to be ordered.
- the edges of the rectangular or square filling structures 14 are in the same orientation as the edges of the
- edges of the filling structures 14 are therefore advantageously subject to the same manufacturing tolerances as that
- the distances between the rectangular and square fill structures 14 are in the order of magnitude of the antenna device 11.
- FIG. 2 is a schematic illustration of a circuit board in cross-sectional view without metal structures and fill structures.
- reference numeral 10 denotes a circuit board according to the present invention.
- the circuit board 10 comprises a substrate 1 with an underside 3 and an upper side 4.
- the metal layer 2 is formed on the upper side 4.
- the antenna device 11, comprising at least one antenna, conductor tracks, and soldering areas, and the filling structures 14 from the metal layer 2 are formed from the metal layer 2.
- the metal layer 2 preferably comprises copper.
- FIG. 3 is a schematic illustration of the printed circuit board with filling structures 14 arranged in a grid according to a second embodiment of the present invention.
- FIG. 3 shows an antenna array with two antenna devices 11.
- the antenna device 11 has antennas and conductor tracks 13.
- the antenna device 11 is formed from a metal layer 2, preferably copper.
- the antenna device 11 has distances A and B.
- Fig. 3 are filling structures 14 with dimensions in the order of
- the antennas of the antenna devices 11 are at a distance B from one another.
- the individual filling structures 14, the filling structures arranged in a grid, are at the same distance B from one another.
- the etching process on the filling structures on the printed circuit board 1 proceeds in the same way as on the antenna device 11.
- the filling structures 14 have a rectangular or square shape.
- the filling structures 14 are in a multiplicity to several Groups of filling structures 14 arranged. This has the advantage that the area occupancy of the filling structure 14 corresponds to the area occupancy of the
- Antenna device 11 corresponds. If, at best, the filling structures 14 are aligned uniformly vertically overall, then there is a significantly increased surface occupancy for the filling structures 14 than for the antenna device 11.
- the alternating horizontal and vertical arrangement of the filling structures 14 are aligned uniformly vertically overall, then there is a significantly increased surface occupancy for the filling structures 14 than for the antenna device 11.
- the regular arrangement of the filling structures 14 in a grid can be checked using an optical system.
- FIG. 4 is a schematic illustration for explaining a method for producing a printed circuit board for radar sensors with a metallic filling structure according to the first embodiment of the present invention.
- a complete one is applied
- the metallic layer 2 is preferably formed from copper.
- step S2 at least one is on the top of the substrate 1
- Antenna device 11 and a filling structure 14 are formed.
- Antenna device 11 and the filling structure 14 are formed from the metal layer 2. Furthermore, the filling structure 14 is arranged in a surface area of the upper side 4 of the substrate 1 at a distance from the antenna device 11. The area is an area on the top 4 of the substrate 1 that is not occupied by the antenna device 11.
- the antenna device 11 comprises at least one antenna, at least one conductor track 13 and at least one soldering pad 12.
- the antenna of the antenna device 11 and the soldering pad 12 are electrically connected by the conductor track 13.
- the solder pad 12 can have plated-through holes for the electrical connection of a monolithic microwave integrated circuit to the antenna device 11.
- the filling structure 14 arranged on the upper side 4 of the substrate 1 has no electrical connection to the antenna device 11.
- the area coverage of the Filling structure 14 is in a ratio between 50% to 300% of
- the process of the present invention optimizes the production process of the printed circuit board 1, in particular the steps of etching the antenna device 11 and the filling structures 14 from the closed metal layer 2. Furthermore, the coppering takes place more homogeneously, since the filling structures 14 contain an increased proportion of copper on the printed circuit board 1 and the copper grows better distributed or evenly on the several structures, in particular the filling structures.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Security & Cryptography (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Radar Systems Or Details Thereof (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Waveguide Aerials (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/272,149 US11831079B2 (en) | 2018-11-22 | 2019-09-20 | Circuit board for radar sensors having a metallic fill structure, and method for producing a circuit board for radar sensors having a metallic fill structure |
JP2021528958A JP2022507915A (ja) | 2018-11-22 | 2019-09-20 | 金属充填構造を有するレーダセンサ用プリント配線板、および金属充填構造を有するレーダセンサ用プリント配線板を製造する方法 |
EP19778907.6A EP3884543A1 (de) | 2018-11-22 | 2019-09-20 | Leiterplatte für radarsensoren mit metallischer füllstruktur und verfahren zur herstellung einer leiterplatte für radarsensoren mit metallischer füllstruktur |
MX2021005813A MX2021005813A (es) | 2018-11-22 | 2019-09-20 | Placa de circuito para sensores de radar con una estructura metalica de relleno y metodo para producir una placa de circuito para sensores de radar con una estructura metalica de relleno. |
KR1020217018836A KR20210091299A (ko) | 2018-11-22 | 2019-09-20 | 금속 충전 구조를 갖는 레이더 센서용 회로 기판 및 금속 충전 구조를 갖는 레이더 센서용 회로 기판의 제조 방법 |
CN201980076836.0A CN113169443A (zh) | 2018-11-22 | 2019-09-20 | 用于雷达传感器的具有金属填充结构的电路板和用于制造用于雷达传感器的具有金属填充结构的电路板的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018219986.8 | 2018-11-22 | ||
DE102018219986.8A DE102018219986A1 (de) | 2018-11-22 | 2018-11-22 | Leiterplatte für Radarsensoren mit metallischer Füllstruktur und Verfahren zur Herstellung einer Leiterplatte für Radarsensoren mit metallischer Füllstruktur |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020104084A1 true WO2020104084A1 (de) | 2020-05-28 |
Family
ID=68072356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2019/075429 WO2020104084A1 (de) | 2018-11-22 | 2019-09-20 | Leiterplatte für radarsensoren mit metallischer füllstruktur und verfahren zur herstellung einer leiterplatte für radarsensoren mit metallischer füllstruktur |
Country Status (8)
Country | Link |
---|---|
US (1) | US11831079B2 (de) |
EP (1) | EP3884543A1 (de) |
JP (1) | JP2022507915A (de) |
KR (1) | KR20210091299A (de) |
CN (1) | CN113169443A (de) |
DE (1) | DE102018219986A1 (de) |
MX (1) | MX2021005813A (de) |
WO (1) | WO2020104084A1 (de) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68910677T2 (de) * | 1988-02-15 | 1994-02-24 | British Telecomm | Mikrostreifenantenne. |
DE102008000502A1 (de) * | 2008-03-04 | 2009-09-10 | Robert Bosch Gmbh | Radarsensor mit Patch-Antenne für Kraftfahrzeuge |
DE102014219432A1 (de) * | 2014-09-25 | 2016-03-31 | Robert Bosch Gmbh | Antenne für Nahbereichsradar |
DE102016119825A1 (de) | 2016-10-18 | 2018-04-19 | HELLA GmbH & Co. KGaA | Leiterplatte |
DE112016005738T5 (de) * | 2015-12-15 | 2018-10-04 | Denso Corporation | Antennenvorrichtung |
US20180316098A1 (en) * | 2017-05-01 | 2018-11-01 | Intel Corporation | Antenna package for large-scale millimeter wave phased arrays |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3006867B2 (ja) | 1990-10-22 | 2000-02-07 | 日本電信電話株式会社 | 広帯域平面アンテナ |
JP2002344238A (ja) | 2001-05-15 | 2002-11-29 | Nippon Hoso Kyokai <Nhk> | 偏波共用平面アンテナ |
JP4134751B2 (ja) | 2003-02-26 | 2008-08-20 | 株式会社日本自動車部品総合研究所 | 侵入センサ用アンテナ |
KR100859864B1 (ko) | 2005-06-13 | 2008-09-24 | 삼성전자주식회사 | 아이솔레이션 소자를 포함하는 평판형 미모 어레이 안테나 |
JP4596369B2 (ja) | 2005-12-05 | 2010-12-08 | Toto株式会社 | マイクロストリップアンテナおよび同マイクロストリップアンテナを用いた高周波センサ |
JP4208025B2 (ja) | 2006-07-12 | 2009-01-14 | Toto株式会社 | 高周波センサ装置 |
CN102110884B (zh) | 2010-12-30 | 2013-07-03 | 中国科学院上海微系统与信息技术研究所 | 采用无源加载方式控制副瓣电平的有源相控阵天线 |
JP5554352B2 (ja) | 2012-02-16 | 2014-07-23 | 古河電気工業株式会社 | 広角アンテナ及びアレーアンテナ |
KR101455729B1 (ko) | 2013-03-06 | 2014-11-03 | (주)프론티어 | 근거리 통신 안테나 모듈 및 제조 방법, 이를 포함한 무선 통신 단말기의 배터리 패키지와 후면 커버 패키지 |
JP6262617B2 (ja) | 2014-08-08 | 2018-01-17 | 株式会社Soken | 表面電流抑制フィルタ及びアンテナ装置 |
JP6456716B2 (ja) | 2015-02-19 | 2019-01-23 | 日本ピラー工業株式会社 | アンテナユニット |
JP6437942B2 (ja) | 2016-02-23 | 2018-12-12 | 株式会社Soken | アンテナ装置 |
JP6647121B2 (ja) | 2016-04-05 | 2020-02-14 | 株式会社ユーシン | アンテナ装置、レーダ装置および無線通信装置 |
JP6499116B2 (ja) | 2016-04-06 | 2019-04-10 | 株式会社Soken | アンテナ装置 |
-
2018
- 2018-11-22 DE DE102018219986.8A patent/DE102018219986A1/de active Pending
-
2019
- 2019-09-20 EP EP19778907.6A patent/EP3884543A1/de active Pending
- 2019-09-20 KR KR1020217018836A patent/KR20210091299A/ko not_active Application Discontinuation
- 2019-09-20 US US17/272,149 patent/US11831079B2/en active Active
- 2019-09-20 CN CN201980076836.0A patent/CN113169443A/zh active Pending
- 2019-09-20 JP JP2021528958A patent/JP2022507915A/ja active Pending
- 2019-09-20 MX MX2021005813A patent/MX2021005813A/es unknown
- 2019-09-20 WO PCT/EP2019/075429 patent/WO2020104084A1/de unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68910677T2 (de) * | 1988-02-15 | 1994-02-24 | British Telecomm | Mikrostreifenantenne. |
DE102008000502A1 (de) * | 2008-03-04 | 2009-09-10 | Robert Bosch Gmbh | Radarsensor mit Patch-Antenne für Kraftfahrzeuge |
DE102014219432A1 (de) * | 2014-09-25 | 2016-03-31 | Robert Bosch Gmbh | Antenne für Nahbereichsradar |
DE112016005738T5 (de) * | 2015-12-15 | 2018-10-04 | Denso Corporation | Antennenvorrichtung |
DE102016119825A1 (de) | 2016-10-18 | 2018-04-19 | HELLA GmbH & Co. KGaA | Leiterplatte |
US20180316098A1 (en) * | 2017-05-01 | 2018-11-01 | Intel Corporation | Antenna package for large-scale millimeter wave phased arrays |
Also Published As
Publication number | Publication date |
---|---|
CN113169443A (zh) | 2021-07-23 |
DE102018219986A1 (de) | 2020-05-28 |
US11831079B2 (en) | 2023-11-28 |
MX2021005813A (es) | 2021-07-02 |
JP2022507915A (ja) | 2022-01-18 |
KR20210091299A (ko) | 2021-07-21 |
US20210328359A1 (en) | 2021-10-21 |
EP3884543A1 (de) | 2021-09-29 |
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