WO2020103795A1 - 显示器件、显示装置及显示器件的制备方法 - Google Patents

显示器件、显示装置及显示器件的制备方法

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Publication number
WO2020103795A1
WO2020103795A1 PCT/CN2019/119192 CN2019119192W WO2020103795A1 WO 2020103795 A1 WO2020103795 A1 WO 2020103795A1 CN 2019119192 W CN2019119192 W CN 2019119192W WO 2020103795 A1 WO2020103795 A1 WO 2020103795A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint recognition
recognition sensor
groove
display device
display panel
Prior art date
Application number
PCT/CN2019/119192
Other languages
English (en)
French (fr)
Inventor
郭文峰
付超
李飞
杨广杰
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/767,812 priority Critical patent/US11515371B2/en
Publication of WO2020103795A1 publication Critical patent/WO2020103795A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • G06K19/0703—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery the battery being onboard of a handheld device, e.g. a smart phone or PDA
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10544—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum
    • G06K7/10821—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum further details of bar or optical code scanning devices
    • G06K7/1095—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum further details of bar or optical code scanning devices the scanner comprising adaptations for scanning a record carrier that is displayed on a display-screen or the like

Definitions

  • the present disclosure relates to the application of fingerprint recognition technology in the field of display technology, and in particular, to a display device, a display device, and a method for manufacturing the display device.
  • a fingerprint recognition sensor module for example, a fingerprint recognition sensor
  • the frame glue is attached to the display panel, and the frame glue has a certain height, so that the fingerprint recognition sensor can form an air gap (Air Gap) with the display panel when it is installed in the frame glue to meet the function of realizing fingerprint recognition need.
  • the fingerprint recognition sensor is bonded by the edge sealant and the frame glue, so as to realize the relative fixing of the fingerprint recognition sensor and the display panel.
  • the design of the above-mentioned related fingerprint identification module mainly has the following two defects: one is reliability indentation, due to the inconsistent thermal expansion coefficient and shrinkage coefficient of the frame glue, edge sealant and display panel, resulting in the fingerprint identification module After the environmental reliability test, the display panel is deformed. From the front of the display panel, it can be seen that there are obvious indentations in the area corresponding to the fingerprint recognition sensor, which affects the appearance of the product. The second is that the fingerprint recognition sensor is easy to loosen. The edge sealant that fixes the fingerprint recognition sensor is only dispensed on the frame glue.
  • the purpose is to fix the fingerprint recognition sensor on the frame glue so that the fingerprint recognition sensor only depends on the adhesion of the frame glue It is fixed on a display panel (such as an OLED panel).
  • the above-mentioned fixing structure has undergone some mechanical tests and is prone to loosening or slipping of the fingerprint recognition sensor.
  • a display device including a main board, a display panel and a fingerprint recognition sensor, the display panel being provided on the main board.
  • the fingerprint identification sensor is provided on the main board, and the fingerprint identification sensor is located between the main board and the display panel.
  • the surface of the display panel facing the main board is provided with a groove, and the orthographic projection of the groove on the main board corresponds to the position of the fingerprint recognition sensor.
  • the groove is configured to form an air gap between the fingerprint recognition sensor and the display panel.
  • the outer periphery of the fingerprint recognition sensor is adhesively fixed to the main board by an edge sealant layer.
  • a part of the outer periphery of the fingerprint recognition sensor is adhesively fixed to the main board through the edge sealant layer.
  • the shape of the groove and the portion of the fingerprint recognition sensor where the edge sealant layer is bonded is the same.
  • the size of the groove and the portion of the fingerprint recognition sensor where the edge sealant layer is bonded is the same.
  • the groove depth of the groove is 20 ⁇ m-50 ⁇ m.
  • a display device includes the display device proposed by the present disclosure and described in the above embodiments.
  • a method for manufacturing a display device includes the following steps:
  • the display panel is connected to the main board with the side surface, and the groove forms an air gap between the fingerprint recognition sensor and the display panel.
  • the fingerprint identification sensor in the step of fixing the fingerprint identification sensor on the main board, is adhesively fixed to the main board through an edge sealant layer.
  • the groove in the step of opening the groove on one side surface of the display panel, the groove is cut on the display panel by laser cutting.
  • FIG. 1 is a schematic structural diagram of a main board of a display device according to an exemplary embodiment
  • FIG. 2 is a schematic structural diagram of a display panel of the display device shown in FIG. 1;
  • FIG. 3 is a partial cross-sectional view of the display device shown in FIG. 1.
  • FIG. 1 it schematically shows a schematic structural diagram of a main board of a display device proposed by the present disclosure.
  • the display device proposed by the present disclosure is explained by taking a display device having a fingerprint recognition function such as a mobile phone or a Pad as an example. It is easily understood by those skilled in the art that, in order to apply the related design of the present disclosure to other types of display devices with fingerprint recognition functions or other fields, various modifications, additions, Substitutions, deletions, or other changes are still within the scope of the principles of the display device proposed in this disclosure.
  • the display device proposed in the present disclosure mainly includes a main board 210, a display panel 220 and a fingerprint recognition sensor 230.
  • the display panel 220 is disposed on the main board 210.
  • the display panel 220 is attached to the main board 210 through one side surface.
  • a display device such as a display device with a fingerprint recognition function such as a mobile phone or a Pad (such as an OLED display device)
  • the fingerprint recognition technology under the aperture screen of the display device is generally implemented based on the principle of aperture imaging. That is, the light reflected by the fingerprint passes through the small hole under the screen and is received at the mirror surface of the fingerprint recognition sensor.
  • FIG. 2 representatively shows a schematic structural diagram of a display panel 220 of a display device capable of embodying the principles of the present disclosure
  • FIG. 3 representatively shows a display device capable of embodying the principles of the present disclosure Partial cross-sectional view.
  • the fingerprint recognition sensor 230 is provided on the main board 210 of a main circuit board such as a mobile phone or Pad, and the fingerprint recognition sensor 230 is provided on the main board 210 and the display panel
  • the surface on which 220 is attached that is, the fingerprint recognition sensor 230 is located between the main board 210 and the display panel 220 after the main board 210 and the display panel 220 are attached.
  • the surface of the display panel 220 facing the main board 210 (that is, the surface of the display panel 220 attached to the main board 210) is provided with a groove 221, and the groove 221 corresponds to the position of the fingerprint recognition sensor 230.
  • the present disclosure can alleviate the problems of bonding indentation and reliability indentation caused by the fingerprint recognition sensor attached to the display panel in the related solutions.
  • the outer periphery of the fingerprint recognition sensor 230 is preferably fixed on the main board 210 by an edge sealant layer 240.
  • the material of the edge sealant 240 can be further optimized to provide a better bonding effect, thereby improving the problem of the fingerprint recognition sensor 230 loosening or slipping.
  • the fingerprint recognition sensor 230 may also be fixed on the main board 210 by other fixing methods, which is not limited to this embodiment.
  • the fingerprint identification sensor 230 is preferably A part of the outer periphery is adhesively fixed to the main board 210.
  • the portion of the fingerprint recognition sensor 230 that is fixed to the main board 210 by the edge sealant layer 240 can be roughly a semi-enclosed outline of the fingerprint recognition sensor 230
  • the structure, the “semi-enclosed outline structure” can be understood as a part of one side of the fingerprint recognition sensor 230 and the other two sides adjacent to the side, that is, the edge sealant layer 240 on the main board 210 Orthographic projection is also roughly referred to as the "semi-enclosed" structure described above.
  • the fingerprint recognition sensor 230 is divided into a first part for receiving light reflected by the fingerprint and a second part for implementing other functions such as electrical connection.
  • the first part is the part fixed on the main board 210 by the edge sealant layer 240 of the semi-enclosed structure
  • the second part is the part not fixed by the edge sealant layer 240.
  • the cooperation relationship between the groove 221 and the fingerprint recognition sensor 230 the cooperation relationship between the groove 221 and the above-mentioned first part will be mainly described.
  • the shape of the groove 221 formed in the display panel 220 and the portion of the fingerprint recognition sensor 230 where the edge sealant layer 240 is bonded is preferably the same.
  • the shape of the groove 221 can also be selected to be different from the shape of the part of the fingerprint recognition sensor 230 to which the edge sealant layer 240 is adhered. Based on the function of the part of the layer 240, various other shapes can be flexibly selected according to needs, and is not limited to this embodiment.
  • the size of the groove 221 formed in the display panel 220 and the portion of the fingerprint recognition sensor 230 where the edge sealant layer 240 is bonded is preferably the same.
  • the description of “same size” can be understood as that the size of the groove 221 is slightly larger than the size of the part of the fingerprint recognition sensor 230 to which the edge sealant layer 240 is bonded, so as to accommodate the light receiving part of the fingerprint recognition sensor 230 .
  • the groove depth of the groove 221 formed in the display panel 220 is preferably designed to be 20 ⁇ m to 50 ⁇ m, which can be flexibly adjusted according to the actual needs of implementing the fingerprint recognition function.
  • the display device proposed by the present disclosure may be a mobile device such as a mobile phone or a Pad, however, the present disclosure is not limited thereto, and the display device of the present disclosure may be any display device having a fingerprint recognition function.
  • the method for manufacturing a display device proposed by the present disclosure includes at least the following steps:
  • a groove is formed on one side surface of the display panel, the groove corresponding to the position of the fingerprint recognition sensor;
  • the fingerprint recognition sensor is preferably fixed on the main board by adhesive bonding.
  • the groove is preferably cut on the display panel by laser cutting.
  • grooves with different groove sizes including groove length, width and groove depth
  • other precision cutting methods may be used instead of the above-mentioned laser cutting methods to achieve the cutting and forming of the groove on the display panel.
  • the fingerprint recognition sensor is provided on the main board, and a groove is provided on the surface of the display panel facing the main board, and the fingerprint recognition sensor and the display panel are provided through the groove There is an air gap required to realize the fingerprint recognition function. Accordingly, through the above-mentioned design, the present disclosure can alleviate the problems of bonding indentation and reliability indentation caused by the fingerprint recognition sensor being attached to the display panel in the related solutions.
  • Exemplary embodiments of the display device, the display device, and the method for manufacturing the display device proposed by the present disclosure are described and / or illustrated in detail above.
  • the embodiments of the present disclosure are not limited to the specific embodiments described herein.
  • the components and / or steps of each embodiment may be used independently and separately from other components and / or steps described herein.
  • Each component and / or each step of one embodiment may also be used in combination with other components and / or steps of other embodiments.
  • the terms “a”, “a”, “above”, etc. are used to indicate the presence of one or more elements / components / etc.
  • the terms “comprising", “including” and “having” are intended to mean an open-ended inclusion and mean that there may be additional elements / components / etc in addition to the listed elements / components / etc.

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Abstract

一种显示器件、显示装置及显示器件的制备方法。显示器件包括主板（210）、显示面板（220）以及指纹识别传感器（230），显示面板（220）设于主板（210）上。其中，指纹识别传感器（230）设于主板（210）上，且指纹识别传感器（230）位于主板（210）与显示面板（220）之间。显示面板（220）朝向主板（210）一侧的表面开设有凹槽（221），凹槽（221）在主板（210）上的正投影与指纹识别传感器（230）的位置相对应。凹槽（221）被配置为在指纹识别传感器（230）与显示面板（220）之间形成气隙。

Description

显示器件、显示装置及显示器件的制备方法
交叉引用
本申请要求于2018年11月23日提交的申请号为201811409464.2、发明名称为“显示器件、显示装置及显示器件的制备方法”的中国发明专利申请的优先权，该中国发明专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及显示技术领域中的指纹识别技术的应用，尤其涉及一种显示器件、显示装置及显示器件的制备方法。
背景技术
指纹识别作为现今显示技术中的重要功能被广泛应用。在相关技术中，指纹识别传感器模组(例如，指纹识别传感器)通常设置在显示面板上。具体而言，显示面板上贴附有框胶，框胶具有一定高度，从而使指纹识别传感器设于框胶时能够与显示面板之间形成气隙(Air Gap)，以满足实现指纹识别的功能需要。指纹识别传感器是通过封边胶与框胶粘接，从而实现指纹识别传感器与显示面板的相对固定。
然而，上述相关指纹识别模组的设计主要存在以下两方面缺陷：其一为信赖性压痕，由于框胶、封边胶和显示面板三者的热膨胀系数及收缩系数不一致，导致指纹识别模组投入环境信赖性测试后，显示面板发生形变，从显示面板的正面可以看出指纹识别传感器对应的区域存在明显的压痕，影响产品外观。其二为指纹识别传感器容易松动，固定指纹识别传感器的封边胶仅点胶在框胶上，其目的是将指纹识别传感器固定在框胶上，使得指纹识别传感器仅靠框胶的粘附力固定于显示面板(例如OLED面板)上，上述固定结构经过一些机械测试，容易发生指纹识别传感器松动或滑落的问题。
发明内容
根据本公开的一个方面，提供一种显示器件，包括主板、显示面板以及指纹识别传感器，所述显示面板设于所述主板上。其中，所述指纹识别传感器设于所述主板上，且所述指纹识别传感器位于所述主板与所述显示面板之间。所述显示面板朝向所述主板一侧的表面开设有凹槽，所述凹槽在所述主板上的正投影与所述指纹识别传感器的位置相对应。所述凹槽被配置为在所述指纹识别传感器与所述显示面板之间形成气隙。
根据本公开的其中一个实施方式，所述指纹识别传感器的外周通过封边胶层粘接 固定于所述主板。
根据本公开的其中一个实施方式，所述指纹识别传感器的外周的一部分通过所述封边胶层粘接固定于所述主板。
根据本公开的其中一个实施方式，所述凹槽与所述指纹识别传感器的粘接有所述封边胶层的部分的形状相同。
根据本公开的其中一个实施方式，所述凹槽与所述指纹识别传感器的粘接有所述封边胶层的部分的尺寸相同。
根据本公开的其中一个实施方式，所述凹槽的槽深为20μm～50μm。
根据本公开的另一个方面，提供一种显示装置。其中，所述显示装置包括本公开提出的并在上述实施方式中所述的显示器件。
根据本公开的又一个方面，提供一种显示器件的制备方法。其中，显示器件的制备方法包括以下步骤：
提供一主板、一显示面板与一指纹识别传感器；
将所述指纹识别传感器固定在所述主板上；
在所述显示面板一侧表面上开设凹槽，所述凹槽与所述指纹识别传感器的位置相对应；以及
将所述显示面板以该侧表面对接于所述主板，且所述凹槽在所述指纹识别传感器与所述显示面板之间形成气隙。
根据本公开的其中一个实施方式，将所述指纹识别传感器固定在所述主板上的步骤中，所述指纹识别传感器是通过封边胶层粘接固定在所述主板。
根据本公开的其中一个实施方式，在所述显示面板一侧表面上开设所述凹槽的步骤中，所述凹槽是通过激光切割的方式在所述显示面板上切割而成。
附图说明
通过结合附图考虑以下对本公开的优选实施方式的详细说明，本公开的各种目标、特征和优点将变得更加显而易见。附图仅为本公开的示范性图解，并非一定是按比例绘制。在附图中，同样的附图标记始终表示相同或类似的部件。其中：
图1是根据一示例性实施方式示出的一种显示器件的主板的结构示意图；
图2是图1示出的显示器件的显示面板的结构示意图；
图3是图1示出的显示器件的局部剖视图。
附图标记说明如下：
210.主板；
220.显示面板；
221.凹槽；
230.指纹识别传感器；
240.封边胶层。
具体实施方式
体现本公开特征与优点的典型实施例将在以下的说明中详细叙述。应理解的是本公开能够在不同的实施例上具有各种的变化，其皆不脱离本公开的范围，且其中的说明及附图在本质上是作说明之用，而非用以限制本公开。
在对本公开的不同示例性实施方式的下面描述中，参照附图进行，所述附图形成本公开的一部分，并且其中以示例方式显示了可实现本公开的多个方面的不同示例性结构、系统和步骤。应理解的是，可以使用部件、结构、示例性装置、系统和步骤的其他特定方案，并且可在不偏离本公开范围的情况下进行结构和功能性修改。而且，虽然本说明书中可使用术语“之上”、“之间”、“之内”等来描述本公开的不同示例性特征和元件，但是这些术语用于本文中仅出于方便，例如根据附图中所述的示例的方向。本说明书中的任何内容都不应理解为需要结构的特定三维方向才落入本公开的范围内。
参阅图1，其代表性地示出了本公开提出的显示器件的主板的结构示意图。在该示例性实施方式中，本公开提出的显示器件是以例如手机或Pad等具有指纹识别功能的显示器件为例进行说明的。本领域技术人员容易理解的是，为将本公开的相关设计应用于其他类型的具有指纹识别功能的显示器件或其他领域中，而对下述的具体实施方式做出多种改型、添加、替代、删除或其他变化，这些变化仍在本公开提出的显示器件的原理的范围内。
如图1所示，在本实施方式中，本公开提出的显示器件主要包括主板210、显示面板220以及指纹识别传感器230。显示面板220设置在主板210上，例如显示面板220通过其一侧表面与主板210相贴合。其中，以显示器件为例如手机或Pad等具有指纹识别功能的显示器件(例如OLED显示装置)为例，显示器件的小孔屏下指纹识别技术，大致是基于小孔成像原理实现。即，指纹反射下来的光线通过屏下小孔，在指纹识别传感器的镜面处被接收，上述光线传播所需的气隙在相关指纹识别模组的设计中，是通过框胶(即相关指纹识别模组中将指纹识别传感器固定在显示面板上的框胶)的厚度控制。配合参阅图2和图3，图2中代表性地示出了能够体现本公开原理的显示器件的显示面板220的结构示意图；图3中代表性地示出了能够体现本公开原理的显示器件的局部剖视图。以下结合上述附图，对本公开提出的显示器件的各主要组成部分的结构、连接方式和功能关系进行详细说明。
如图1和图2所示，在本实施方式中，指纹识别传感器230设置在例如为手机或Pad等的主电路板的主板210上，且指纹识别传感器230是设置在主板210的与显示面板220贴合的一侧表面，即指纹识别传感器230在主板210与显示面板220贴合后是位于主板210与显示面板220之间。显示面板220的朝向主板210一侧的表面(即 显示面板220的与主板210贴合的一侧表面)开设有凹槽221，且该凹槽221与指纹识别传感器230的位置相对应。通过凹槽221的槽深与指纹识别传感器230凸出于主板210的厚度之间的差异控制，当显示面板220与主板210贴合时，显示面板220上开设的凹槽221能够在指纹识别传感器230与显示面板220(即凹槽221的槽底)之间形成气隙，从而满足指纹识别技术的实现需要。本公开通过上述设计，能够缓解相关方案中指纹识别传感器贴附于显示面板而产生的贴合压痕以及信赖性压痕的问题。
进一步地，如图1所示，在本实施方式中，指纹识别传感器230的外周优选地通过封边胶层240粘接固定在主板210上。其中，可以进一步优化封边胶240的材质，使其提供更优的粘接效果，进而改善指纹识别传感器230松动或滑落的问题。在其他实施方式中，指纹识别传感器230亦可采用其他的固定方式固定在主板210上，并不以本实施方式为限。
进一步地，如图1所示，基于指纹识别传感器230通过封边胶层240粘接固定在主板210上的设计，在本实施方式中，优选为通过封边胶层240将指纹识别传感器230的外周的一部分粘接固定于主板210。其中，以指纹识别传感器230在主板210上的正投影大致呈矩形为例，指纹识别传感器230的通过封边胶层240与主板210固定的部分，可以大致为指纹识别传感器230的半包围的轮廓结构，该“半包围的轮廓结构”可以理解为指纹识别传感器230的一条侧边以及与该条侧边相邻的另外两条侧边的各自一部分，即封边胶层240在主板210上的正投影亦大致称上述“半包围”结构。
需说明的是，在本说明书的示例性说明中，指纹识别传感器230是分为：用于接收指纹反射下来的光线的第一部分和实现例如电连接等其他功能的第二部分。其中，第一部分即为通过上述半包围结构的封边胶层240固定在主板210上的部分，第二部分即为未经封边胶层240固定的部分。另外，在以下关于凹槽221与指纹识别传感器230的配合关系的描述中，主要是以凹槽221与上述第一部分的配合关系为主进行说明。
进一步地，如图2和图3所示，在本实施方式中，显示面板220所开设的凹槽221，与指纹识别传感器230的粘接有封边胶层240的部分的形状优选为相同。在其他实施方式中，凹槽221的形状，亦可选择不同于指纹识别传感器230的粘接有封边胶层240的部分的形状，可在实现容纳指纹识别传感器230的粘接有封边胶层240的部分的功能基础上，根据需要灵活选择各种其他形状，并不以本实施方式为限。
进一步地，如图2和图3所示，在本实施方式中，显示面板220所开设的凹槽221，与指纹识别传感器230的粘接有封边胶层240的部分的尺寸优选为相同，且该“尺寸相同”的描述可以理解为凹槽221的尺寸略大于指纹识别传感器230的粘接有封边胶层240的部分的尺寸，以实现对指纹识别传感器230的接收光线的部分的容纳。
进一步地，在本实施方式中，显示面板220所开设的凹槽221的槽深优选地设计为20μm～50μm，可根据实现指纹识别功能的实际需要灵活调整。其中，“μm”即为微米，且1μm＝1×10 -3mm＝1×10 -6m。
在此应注意，附图中示出而且在本说明书中描述的显示器件仅仅是能够采用本公开原理的许多种显示器件中的几个示例。应当清楚地理解，本公开的原理绝非仅限于附图中示出或本说明书中描述的显示器件的任何细节或显示器件的任何部件。
如上所述，本公开提出的显示器件可以是手机或Pad等移动装置，然而本公开不限于此，本公开的显示器件可以是任何具有指纹识别功能的显示器件。
在此应注意，附图中示出而且在本说明书中描述的显示器件仅仅是能够采用本公开原理的许多种显示器件中的几个示例。应当清楚地理解，本公开的原理绝非仅限于附图中示出或本说明书中描述的显示器件的任何细节或显示器件的任何部件。
另外，本公开提出的上述显示器件的制备方法。本领域技术人员容易理解的是，为将本公开的相关设计应用于其他应用场合的显示器件或其他工艺中，而对下述的具体实施方式做出多种改型、添加、替代、删除或其他变化，这些变化仍在本公开提出的显示器件的制备方法的原理的范围内。
在本实施方式中，本公开提出的显示器件的制备方法至少包括以下步骤：
提供一主板、一显示面板与一指纹识别传感器；
将指纹识别传感器固定在主板上；
在显示面板一侧表面上开设凹槽，凹槽与指纹识别传感器的位置相对应；以及
将显示面板以该侧表面对接于主板，使凹槽在指纹识别传感器与显示面板之间形成气隙。
进一步地，在本实施方式中，对于将指纹识别传感器固定在主板上的步骤而言，指纹识别传感器是优选地通过封边胶层粘接固定在主板。
进一步地，在本实施方式中，对于在显示面板一侧表面上开设凹槽的步骤而言，凹槽是优选地通过激光切割的方式在显示面板上切割而成。据此，在显示面板的该侧表面上，可依据不同的功能需要，通过激光切割的方式精确地切割出不同槽型尺寸(包括槽口长度、宽度和槽深)的凹槽。在其他实施方式中，亦可采用其他精密切割的方式替代上述激光切割的方式，实现凹槽在显示面板上的切割成型。
在此应注意，附图中示出而且在本说明书中描述的显示器件的制备方法仅仅是能够采用本公开原理的许多种显示器件的制备方法中的几个示例。应当清楚地理解，本公开的原理绝非仅限于附图中示出或本说明书中描述的显示器件的制备方法的任何细节或显示器件的制备方法的任何步骤。
综上所述，本公开提出的显示器件及其制备方法，将指纹识别传感器设置在主板上，并在显示面板朝向主板一侧的表面开设有凹槽，通过凹槽在指纹识别传感器与显示面板之间形成实现指纹识别功能所需的气隙。据此，本公开通过上述设计，能够缓 解相关方案中指纹识别传感器贴附于显示面板而产生的贴合压痕以及信赖性压痕的问题。
以上详细地描述和/或图示了本公开提出的显示器件、显示装置及显示器件的制备方法的示例性实施方式。但本公开的实施方式不限于这里所描述的特定实施方式，相反，每个实施方式的组成部分和/或步骤可与这里所描述的其它组成部分和/或步骤独立和分开使用。一个实施方式的每个组成部分和/或每个步骤也可与其它实施方式的其它组成部分和/或步骤结合使用。在介绍这里所描述和/或图示的要素/组成部分/等时，用语“一个”、“一”和“上述”等用以表示存在一个或多个要素/组成部分/等。术语“包含”、“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等。
虽然已根据不同的特定实施例对本公开提出的显示器件、显示装置及显示器件的制备方法进行了描述，但本领域技术人员将会认识到可在权利要求的精神和范围内对本公开的实施进行改动。

Claims (10)

  1. 一种显示器件，包括主板、显示面板以及指纹识别传感器，所述显示面板设于所述主板上，其中：
    所述指纹识别传感器设于所述主板上，且所述指纹识别传感器位于所述主板与所述显示面板之间；
    所述显示面板朝向所述主板一侧的表面开设有凹槽，所述凹槽在所述主板上的正投影与所述指纹识别传感器的位置相对应；
    其中，所述凹槽被配置为在所述指纹识别传感器与所述显示面板之间形成气隙。
  2. 根据权利要求1所述的显示器件，其中，所述指纹识别传感器的外周通过封边胶层粘接固定于所述主板。
  3. 根据权利要求2所述的显示器件，其中，所述指纹识别传感器的外周的一部分通过所述封边胶层粘接固定于所述主板。
  4. 根据权利要求2所述的显示器件，其中，所述凹槽与所述指纹识别传感器的粘接有所述封边胶层的部分的形状相同。
  5. 根据权利要求4所述的显示器件，其中，所述凹槽与所述指纹识别传感器的粘接有所述封边胶层的部分的尺寸相同。
  6. 根据权利要求1所述的显示器件，其中，所述凹槽的槽深为20μm～50μm。
  7. 根据权利要求1所述的显示器件，其中，所述凹槽容纳所述指纹识别传感器的至少一部分。
  8. 一种指显示器件的制备方法，包括以下步骤：
    提供一主板、一显示面板与一指纹识别传感器；
    将所述指纹识别传感器固定在所述主板上；
    在所述显示面板一侧表面上开设凹槽；以及
    将所述显示面板以所述侧表面对接于所述主板，
    其中，所述凹槽被形成为在将所述显示面板以所述侧表面对接于所述主板之后，所述凹槽在所述主板上的正投影与所述指纹识别传感器的位置相对应，并且所述凹槽在所述指纹识别传感器与所述显示面板之间形成气隙。
  9. 根据权利要求8所述的显示器件的制备方法，其中，将所述指纹识别传感器固定在所述主板上的步骤中，所述指纹识别传感器是通过封边胶层粘接固定在所述主板。
  10. 根据权利要求8所述的显示器件的制备方法，其特征在于，在所述显示面板一侧表面上开设所述凹槽的步骤中，所述凹槽是通过激光切割的方式在所述显示面板上切割而成。
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