WO2020103670A1 - 一种一体化高效散热及光效优化的led车灯及其制备方法 - Google Patents

一种一体化高效散热及光效优化的led车灯及其制备方法

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Publication number
WO2020103670A1
WO2020103670A1 PCT/CN2019/114900 CN2019114900W WO2020103670A1 WO 2020103670 A1 WO2020103670 A1 WO 2020103670A1 CN 2019114900 W CN2019114900 W CN 2019114900W WO 2020103670 A1 WO2020103670 A1 WO 2020103670A1
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WO
WIPO (PCT)
Prior art keywords
groove
efficiency
ceramic substrate
heat dissipation
lamp post
Prior art date
Application number
PCT/CN2019/114900
Other languages
English (en)
French (fr)
Inventor
李宗涛
汤勇
陈凯航
余树东
庄宝山
余彬海
Original Assignee
华南理工大学
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Publication date
Application filed by 华南理工大学 filed Critical 华南理工大学
Publication of WO2020103670A1 publication Critical patent/WO2020103670A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/25—Projection lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
    • F21W2102/10—Arrangement or contour of the emitted light
    • F21W2102/13—Arrangement or contour of the emitted light for high-beam region or low-beam region
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the technical field of LED car lamp manufacturing, in particular to an integrated high-efficiency heat dissipation and light effect optimization LED car lamp and preparation method thereof.
  • LED has the obvious advantages of environmental protection, energy saving and high efficiency, low working voltage (about 3V), safety, long life (up to 100,000 hours), rich colors, small size, fast response speed, vibration resistance, and easy maintenance. Due to the many advantages of LED light sources, LED car lights have been favored by more and more car manufacturers. However, the heat flux density of the LED lamp is relatively large, and the thermal management of the lamp is special. Many factors such as the space condition of the lamp and the ambient temperature of the lamp cavity need to be considered. The inner volume of the headlight of the car is small, and the heat dissipation effect of the traditional radiator is limited, and it is difficult to meet the heat dissipation requirements under the narrow space condition.
  • the light spot used as a low beam light needs to have a clear cut-off line; the light spot used as a high beam light needs to form a condensed light spot.
  • the light spot of the car lamp can be controlled by the design of the optical lens.
  • the LED car lamp still has the problems of immature optical lens design and complicated manufacturing process.
  • the present invention provides an integrated high-efficiency heat dissipation and light efficiency optimized LED car lamp and preparation method thereof, which uses a flat heat pipe to achieve high heat flow LED heat dissipation and optical lens
  • the design is combined with the production process of the car lamp to realize the controllable light spot of the light source, and through the integrated preparation, the heat dissipation effect of the car lamp is improved, the process flow is reduced, and the production efficiency is improved.
  • An integrated high-efficiency heat dissipation and light efficiency optimized LED car lamp includes a lamp post shell, a flat heat pipe, a rear heat dissipation fin, a ceramic substrate, an LED chip, and a circuit board.
  • the flat heat pipe is closely attached to the lamp post by expanding the tube
  • the inner wall of the housing, the cold end is welded to the rear heat dissipation fins
  • the ceramic substrate is welded to the surface of the flat heat pipe through the groove bottom through hole of the surface of the lamp post housing
  • the LED chip is packaged on the ceramic substrate
  • the circuit board is inserted In the channel between the flat heat pipe and the inner wall of the lamp post housing, it is connected to the electrode wire on the ceramic substrate.
  • an optical lens is further included, and the optical lens is disposed on the groove surface of the lamp post housing.
  • the lamp post shell is made of aluminum alloy material, and is manufactured by die-casting or machining, and is a hollow tubular shell, and a groove structure is symmetrically arranged on the outer surface, and glue injection is provided on both sides of the groove
  • the bottom surface is provided with through holes, and the injection port, the exhaust port and the through hole are all formed by die casting or processing, the thickness of the lamp post shell is 4 to 5 mm, and the depth of the groove It is 0.5 ⁇ 1.5mm.
  • the flat heat pipe is a sintered liquid-absorbing wick heat pipe made of copper powder material with a copper base material, and has a thickness of 0.5-3.5 mm.
  • the inside of the groove of the surface of the lamp post is encapsulated by a colloid
  • the colloid is fluorescent glue or silica gel
  • the coating method of the inner encapsulation of the groove is dispensing, conformal coating or remote coating, and the groove It is encapsulated between the optical lens and the optical lens through the injection port and the exhaust port.
  • the groove and the optical lens are encapsulated through a glue injection port and an exhaust hole.
  • the thickness of the ceramic substrate is 0.2-0.8 mm, the LED chip and the electrode wire are both provided on the surface of the ceramic substrate, and the LED chip and the electrode wire are connected.
  • the circuit board is a PFC flexible circuit board, provided with positive and negative external circuits, and the thickness is 0.1 to 0.5 mm.
  • the optical lens is made of a highly light-transmitting material.
  • a preparation method of integrated high-efficiency heat dissipation and optimized light effect LED lamp includes the following steps:
  • the aluminum alloy lamp post shell is manufactured by die casting or machining.
  • the shell is a hollow tubular structure.
  • the outer surface of the shell is symmetrically provided with a groove structure.
  • the bottom surface of the groove is provided with a through hole. Port and exhaust port;
  • Step 3 Solder the ceramic substrate to the surface of the flat heat pipe through the through hole in the bottom of the groove, the soldering temperature is 160 ⁇ 200 °C, the LED chip and the electrode wire are set on the surface of the ceramic substrate;
  • Step 4 Insert the FPC flexible circuit board into the channel between the flat heat pipe and the inner wall of the lamp post housing, and weld its electrode end to the electrode end of the ceramic substrate;
  • the interior of the groove is filled with glue, conformal coating or remote coating. If the integrated LED lamp with efficient heat dissipation and optimized light efficiency also includes an optical lens, then An optical lens is placed on the surface of the groove, and the glue injection port and the exhaust port on the edge of the groove are used to encapsulate the glue to form an integrated optical structure, forming an integrated optical structure; heated to 100 ⁇ 140 °C, 40 ⁇ 90min insulation; When sealing, the fluorescent glue is injected from the glue injection port, and the exhaust port at the other end is used to balance the air pressure to ensure the smooth flow of the colloid;
  • the present invention has the following advantages and effects:
  • the present invention uses a heat pipe as a direct heat transfer medium, which can greatly increase the heat dissipation power and better control the working temperature of the LED chip; directly solder the ceramic substrate On the heat pipe, the multi-layer thermal resistance of the middle heat transfer is reduced; the flat heat pipe used effectively shortens the distance between the symmetrical chips, close to the light emission of the conventional halogen lamp, and has a better center light effect.
  • the present invention combines the design of optical lens with the production process of car lamps.
  • the optically designed grooves are synchronously processed, and then combined with the LED ceramic substrate and the potting package to achieve the right
  • the shape control of the light spot emitted by the light source of the car lamp; the LED car lamp with the light efficiency optimized lens is prepared in an integrated manner, which simplifies the manufacturing process of the car lamp and improves the production efficiency.
  • FIG. 1 is a schematic structural view of an integrated high-efficiency heat dissipation and optimized light effect LED car light of the present invention
  • ⁇ ⁇ 2 is a schematic structural view of a lamp post housing of the LED vehicle lamp of the present invention
  • ⁇ ⁇ 3 is a schematic structural view of the groove on the lamp post housing of the present invention.
  • ⁇ ⁇ 4 is a cross-sectional view of the mounting structure of the flat heat pipe and FPC flexible circuit board of the present invention
  • ⁇ ⁇ 5 is a cross-sectional view of an LED vehicle lamp post encapsulated by a glue coating method in Example 1;
  • ⁇ ⁇ 6 is a cross-sectional view of an LED vehicle lamp post packaged in a conformal coating method in Example 2;
  • ⁇ ⁇ 7 is a cross-sectional view of an LED vehicle lamp post packaged in a remote coating manner in Embodiment 3;
  • ⁇ ⁇ 8 is a cross-sectional view of an LED vehicle lamp post encapsulated in a dispensing manner without installing an optical lens in Example 4.
  • Figures 1 to 8 include: 1 lamp post housing; 2 flat heat pipe; 3 tail heat dissipation fins; 4 ceramic substrate; 5 LED chip; 6 circuit board; 7 colloid; 8 optical lens; 9 exhaust port; 10 silicone .
  • FIG. 1 it is an integrated high-efficiency heat dissipation and light efficiency optimized LED car lamp according to an embodiment of the present invention, including a lamp post housing 1, a flat heat pipe 2, a rear heat dissipation fin 3, a ceramic substrate 4, and an LED chip 5.
  • the circuit board 6 and the optical lens 8, the flat heat pipe 2 is in close contact with the inner wall of the lamp post housing 1, the cold end of the flat heat pipe 2 is welded to the rear heat dissipation fin 3, and the ceramic substrate 4 passes through the surface of the lamp post housing 1
  • the bottom hole of the groove is welded to the surface of the flat heat pipe 2, the LED chip 6 is packaged on the ceramic substrate 4, as shown in FIG. 4, the circuit board 6 is inserted between the flat heat pipe 2 and the inner wall of the lamp post housing 1 Is connected to the electrode wire on the ceramic substrate 4, and the optical lens 8 is provided on the groove surface of the lamp post housing 1.
  • the lamp post housing 1 is made of aluminum alloy material, and is manufactured by die-casting or machining, and is a hollow tubular housing, and a groove structure is symmetrically arranged on the outer surface, and the concave Both sides of the groove are provided with a plastic injection port and an exhaust port 9, and a bottom surface is provided with a through hole.
  • the plastic injection port, the exhaust port 9 and the through hole are all formed by die casting or processing.
  • the thickness of the lamp post shell 1 It is 4 to 5 mm, and the depth of the groove is 0.5 to 1.5 mm.
  • the flat heat pipe 2 is a sintered liquid-absorbing wick heat pipe made of copper powder material with a copper base material, and has a thickness of 0.5-3.5 mm.
  • the inside of the groove of the surface of the lamp post 1 and the groove and the optical lens 8 are encapsulated by a glue 7, the glue 7 is fluorescent glue or silicone 10, and the coating method of the inside of the groove is dispensing
  • the groove and the optical lens 8 are encapsulated by a glue injection port and a gas discharge port 9.
  • the thickness of the ceramic substrate 4 is 0.2-0.8 mm.
  • the circuit board 6 is a PFC flexible circuit board, and the thickness is 0.1-0.5 mm.
  • the optical lens 8 is made of PMMA, which is a highly transparent material.
  • a preparation method of an integrated high-efficiency heat dissipation and optimized light effect LED lamp includes the following steps:
  • Aluminum alloy lamp post housing 1 manufactured by die casting or machining.
  • the housing is a hollow tubular structure.
  • the outer surface of the housing is symmetrically provided with a groove structure.
  • the bottom surface of the groove is provided with a through hole.
  • the ceramic substrate 4 is welded to the surface of the flat heat pipe 2 through the through hole in the bottom of the groove, the soldering temperature is 160 ° C, and the LED chip 6 and the electrode wire are provided on the surface of the ceramic substrate 4;
  • encapsulate the package by dispensing glue encapsulate the fluorescent glue inside the groove, place the optical lens 8 on the surface of the groove, and use the glue injection port and row at the edge of the groove
  • the gas port 9 is encapsulated by glue injection to form an integrated optical structure, which is heated to 100 ° C and kept warm for 40 minutes; during potting, fluorescent glue is injected from the glue injection port, and the other end of the exhaust port is used to balance the air pressure to ensure the smooth flow of colloid;
  • a preparation method of an integrated high-efficiency heat dissipation and optimized light effect LED lamp includes the following steps:
  • Aluminum alloy lamp post housing 1 manufactured by die casting or machining.
  • the housing is a hollow tubular structure.
  • the outer surface of the housing is symmetrically provided with a groove structure.
  • the bottom surface of the groove is provided with a through hole.
  • the ceramic substrate 4 is welded to the surface of the flat heat pipe 2 with a soldering temperature of 200 ° C, and the LED chip 6 and the electrode wire are provided on the surface of the ceramic substrate 4;
  • conformal coating is used to encapsulate the package, the fluorescent glue is evenly coated on the surface of the LED chip 5, and then the silicone 10 is potted inside the groove, and the optical is placed on the surface of the groove
  • the lens 8 is glue-encapsulated by the glue injection port and the exhaust port 9 on the edge of the groove to form an integrated optical structure. It is heated to 140 ° C and kept warm for 90 minutes; during potting, fluorescent glue is injected from the glue injection port and the other end row
  • the air port is used to balance the air pressure to ensure the smooth flow of colloid;
  • a preparation method of an integrated high-efficiency heat dissipation and optimized light effect LED lamp includes the following steps:
  • Aluminum alloy lamp post housing 1 manufactured by die casting or machining.
  • the housing is a hollow tubular structure.
  • the outer surface of the housing is symmetrically provided with a groove structure.
  • the bottom surface of the groove is provided with a through hole.
  • the ceramic substrate 4 is welded to the surface of the flat heat pipe 2 through the through hole in the bottom of the groove, the soldering temperature is 180 ° C, and the LED chip 6 and the electrode wire are provided on the surface of the ceramic substrate 4;
  • a remote coating encapsulation method is used to encapsulate the glue, and the silicone 10 is encapsulated inside the groove, then the fluorescent glue is evenly coated on the surface of the silicone, and the optical lens 8 is placed on the surface of the groove,
  • the glue injection port and the exhaust port 9 at the edge of the groove are used for glue injection encapsulation to form an integrated optical structure, which is heated to 120 ° C and kept warm for 60 minutes; during potting, fluorescent glue is injected from the injection port, and the other end of the exhaust port is used To balance the air pressure to ensure the smooth flow of colloid;
  • a preparation method of an integrated high-efficiency heat dissipation and optimized light effect LED lamp includes the following steps:
  • Aluminum alloy lamp post housing 1 manufactured by die casting or machining.
  • the housing is a hollow tubular structure.
  • the outer surface of the housing is symmetrically provided with a groove structure.
  • the bottom surface of the groove is provided with a through hole.
  • the ceramic substrate 4 is welded to the surface of the flat heat pipe 2 through the through hole in the bottom of the groove, the soldering temperature is 180 ° C, and the LED chip 6 and the electrode wire are provided on the surface of the ceramic substrate 4;
  • the present invention provides an integrated high-efficiency heat dissipation and light efficiency optimized LED car lamp and preparation method, which uses a flat heat pipe to achieve high heat flow LED heat dissipation, and combines optical lens design with the car lamp production process to achieve light source emission
  • the light spot can be controlled, and through integrated preparation, the heat dissipation effect of the car lamp is improved, the process flow is reduced, and the production efficiency is improved.

Abstract

一种一体化高效散热及光效优化的LED车灯及其制备方法。车灯包括灯柱壳体（1）、扁平热管（2）、尾部散热鳍片（3）、陶瓷基板（4）、LED芯片（5）、电路板（6）和光学透镜（8），扁平热管（2）通过胀管方式紧贴灯柱壳体（1）内壁，冷端与尾部散热鳍片（3）焊接，陶瓷基板（4）通过灯柱壳体（1）表面的凹槽底部通孔焊接在扁平热管（2）表面，LED芯片（5）封装在陶瓷基板（4）上，电路板（6）插在扁平热管（2）与灯柱壳体（1）内壁之间的槽道中，与陶瓷基板（4）上的电极线连接，光学透镜（8）摆置在灯柱壳体（1）的凹槽表面上；利用扁平热管（2）实现LED高热流散热，并将光学透镜（8）设计与车灯生产工艺结合，实现光源出射光斑可控，并且通过一体化制备，提升车灯散热效果，减少工艺流程，提高生产效率。

Description

一种一体化高效散热及光效优化的LED车灯及其制备方法 技术领域
 本发明涉及LED车灯制造技术领域，具体涉及一种一体化高效散热及光效优化的LED车灯及其制备方法。
 背景技术
LED具有绿色环保、节能高效、工作电压低（3V左右）、安全、寿命长（可达10万小时）、色彩丰富、体积小、响应速度快、耐振动、易维护等显著优点。由于LED光源的诸多优点，LED车灯已经为越来越多的汽车厂商所青睐。然而LED灯热流密度较大，车灯的热管理具有特殊性，需要考虑车灯空间条件以及车灯内腔的环境温度等诸多因素。汽车前大灯内腔容积较小，而传统散热器散热效果有限，难以在狭窄的空间条件下满足散热要求。
    根据车灯设计的标准，作为近光灯使用的车灯，出射光斑需要具有清晰的明暗截止线；作为远光灯使用的车灯，出射光斑需要形成汇聚光斑。车灯出射光斑可通过对光学透镜的设计进行控制，然而目前LED车灯尚存在光学透镜设计不成熟，制造工艺复杂等问题。
 技术问题
有鉴于此，为解决上述现有技术中的问题，本发明提供了一种一体化高效散热及光效优化的LED车灯及其制备方法，利用扁平热管实现LED高热流散热，并将光学透镜设计与车灯生产工艺结合，实现光源出射光斑可控，并且通过一体化制备，提升车灯散热效果，减少工艺流程，提高生产效率。
 技术解决方案
为实现上述目的，本发明的技术方案如下。
一种一体化高效散热及光效优化的LED车灯，包括灯柱壳体、扁平热管、尾部散热鳍片、陶瓷基板、LED芯片和电路板，所述扁平热管通过胀管方式紧贴灯柱壳体内壁，冷端与尾部散热鳍片焊接，所述陶瓷基板通过灯柱壳体表面的凹槽底部通孔焊接在扁平热管表面，所述LED芯片封装在陶瓷基板上，所述电路板插在扁平热管与灯柱壳体内壁之间的槽道中，与陶瓷基板上的电极线连接。
进一步地，还包括光学透镜，所述光学透镜摆置在灯柱壳体的凹槽表面上。
    进一步地，所述灯柱壳体是由铝合金材料制成，通过压铸成型或机加工制造，为中空管状壳体，外表面对称设置有凹槽结构，所述凹槽两侧设有注胶口和排气口，底面设有通孔，所述注胶口、排气口和通孔均通过压铸成型或加工成型，所述灯柱壳体的厚度为4～5mm，所述凹槽深度为0.5～1.5mm。
    进一步地，所述扁平热管是由铜基材的铜粉材料制成的烧结型吸液芯热管，厚度为0.5～3.5mm。
     进一步地，所述灯柱壳体表面凹槽内部通过胶体封装，所述胶体为荧光胶或硅胶，凹槽内部封装涂覆方式为点胶涂覆、保形涂覆或远程涂覆，凹槽和光学透镜之间通过注胶口和排气口注胶封装。
进一步地，若还包括光学透镜，则凹槽和光学透镜之间通过注胶口和排气口注胶封装。
    进一步地，所述陶瓷基板厚度为0.2～0.8mm，所述LED芯片和电极线均设置在陶瓷基板的表面，所述LED芯片与电极线连接。
    进一步地，所述电路板为PFC柔性电路板，设有正极和负极外接线路，厚度为0.1～0.5mm。
    进一步地，所述光学透镜由高透光性材料制成。
    一种一体化高效散热及光效优化的LED车灯的制备方法，包括以下步骤：
    步骤1、利用压铸成型或机加工制造的铝合金灯柱壳体，壳体为中空管状结构，壳体外表面对称设置有凹槽结构，凹槽底面设有通孔，凹槽两侧有注胶口和排气口；
    步骤2、在扁平热管表面均匀涂抹导热硅脂，置于灯柱壳体中央孔内，在200～300℃下加热15～30min，使扁平热管胀在灯柱壳体内壁；热管冷端与尾部散热鳍片焊接，三者形成一体结构；
    步骤3、通过凹槽底面通孔，将陶瓷基板焊接于扁平热管表面，锡焊温度为160～200℃，LED芯片和电极线设置在陶瓷基板表面；
   步骤4、在扁平热管与灯柱壳体内壁之间的槽道内，插入FPC柔性电路板，并将其电极端与陶瓷基板的电极端焊接一起；
    步骤5、在凹槽内部采用点胶涂覆、保形涂覆或远程涂覆的封装方式灌胶封装；若所述一体化高效散热及光效优化的LED车灯还包括光学透镜，则在凹槽表面摆置光学透镜，利用凹槽边缘的注胶口和排气口进行注胶封装，形成一体化光学结构，形成一体化光学结构；加热至100～140℃，保温40～90min；灌封时，由注胶口注入荧光胶，另一端排气口用于平衡气压以保证胶体的顺利流入；
    步骤6、固化完毕后，即可得到一体化高效散热及光效优化的LED车灯。
 有益效果
与现有技术比较，本发明具有如下的优点及效果：
    （1）本发明相比于一体化的铝基材灯柱壳体，使用热管作为直接的传热介质，可以大幅度提高散热功率，更好的控制LED芯片的工作温度；将陶瓷基板直接焊接于热管上，减少了中间传热的多层热阻；使用的扁平热管，有效地缩短了对称芯片之间的距离，接近常规卤素灯的发光情况，具有更好的中心发光效果。
（2）本发明将光学透镜设计与车灯生产工艺结合，在车灯灯柱壳体的加工过程中，同步加工出经光学设计的凹槽，再配合LED陶瓷基板及灌胶封装，实现对车灯光源出射光斑的形状控制；一体化制备出具有光效优化透镜的LED车灯，简化车灯制造工艺，提高生产效率。
 附图说明
图1为本发明的一种一体化高效散热及光效优化的LED车灯的结构示意图；
    图2为本发明的LED车灯的灯柱壳体结构示意图；
    图3为本发明的灯柱壳体上凹槽的结构示意图；
    图4为本发明的扁平热管及FPC柔性电路板安装结构的截面图；
    图5为实施例1中以点胶涂覆方式封装的LED车灯灯柱的剖视图；
    图6为实施例2中以保形涂覆方式封装的LED车灯灯柱的剖视图；
    图7为实施例3中以远程涂覆方式封装的LED车灯灯柱的剖视图；
    图8为实施例4中未安装光学透镜以点胶涂覆方式封装的LED车灯灯柱的剖视图。
    图1至图8中包括：1 灯柱壳体；2 扁平热管；3 尾部散热鳍片；4 陶瓷基板；5 LED芯片；6电路板；7 胶体；8 光学透镜；9排气口；10 硅胶。
 本发明的实施方式
下面将结合附图和具体的实施例对本发明的具体实施作进一步说明。需要指出的是，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例，基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
    如图1所示，为本发明实施例的一种一体化高效散热及光效优化的LED车灯，包括灯柱壳体1、扁平热管2、尾部散热鳍片3、陶瓷基板4、LED芯片5、电路板6和光学透镜8，所述扁平热管2紧贴灯柱壳体1内壁，扁平热管2的冷端与尾部散热鳍片3焊接，所述陶瓷基板4通过灯柱壳体1表面的凹槽底部通孔焊接在扁平热管2表面，所述LED芯片6封装在陶瓷基板4上，如图4所示，所述电路板6插在扁平热管2与灯柱壳体1内壁之间的槽道中，与陶瓷基板4上的电极线连接，所述光学透镜8设置在灯柱壳体1的凹槽表面上。
    如图2、图3所示，所述灯柱壳体1是由铝合金材料制成，通过压铸成型或机加工制造，为中空管状壳体，外表面对称设置有凹槽结构，所述凹槽两侧设有注胶口和排气口9，底面设有通孔，所述注胶口、排气口9和通孔均通过压铸成型或加工成型，所述灯柱壳体1的厚度为4～5mm，所述凹槽深度为0.5～1.5mm。
    优选的，所述扁平热管2是由铜基材的铜粉材料制成的烧结型吸液芯热管，厚度为0.5～3.5mm。
    优选的，所述灯柱壳体1表面凹槽内部与凹槽和光学透镜8之间均通过胶体7封装，所述胶体7为荧光胶或硅胶10，凹槽内部封装涂覆方式为点胶涂覆、保形涂覆或远程涂覆，凹槽和光学透镜8之间通过注胶口和排气口9注胶封装。
    优选的，所述陶瓷基板4厚度为0.2～0.8mm。
    优选的，所述电路板6为PFC柔性电路板，厚度为0.1～0.5mm。
    优选的，所述光学透镜8由高透光性材料PMMA制成。
实施例 1
    一种一体化高效散热及光效优化的LED车灯的制备方法，包括如下步骤：
    （1）利用压铸成型或机加工制造的铝合金灯柱壳体1，壳体为中空管状结构，壳体外表面对称设置有凹槽结构，凹槽底面设有通孔，凹槽两侧有注胶口和排气口9；
    （2）在扁平热管2表面均匀涂抹导热硅脂，置于灯柱壳体1中央孔内，在200℃下加热15min，使扁平热管2胀在灯柱壳体1内壁；热管冷端与尾部散热鳍片3焊接，三者形成一体结构；
    （3）通过凹槽底面通孔，将陶瓷基板4焊接于扁平热管2表面，锡焊温度为160℃，LED芯片6和电极线设置在陶瓷基板4表面；
    （4）在扁平热管与壳体内壁之间的槽道内，插入FPC柔性电路板，并将其电极端与陶瓷基板的电极端焊接一起；
    （5）如图5所示，采用点胶涂覆的封装方式灌胶封装，在凹槽内部灌封荧光胶，在凹槽表面摆置光学透镜8，利用凹槽边缘的注胶口和排气口9进行注胶封装，形成一体化光学结构，加热至100℃，保温40min；灌封时，由注胶口注入荧光胶，另一端排气口用于平衡气压以保证胶体的顺利流入；
    （6）固化完毕后，即可得到一体化高效散热及光效优化的LED车灯。
实施例 2
    一种一体化高效散热及光效优化的LED车灯的制备方法，包括如下步骤：
    （1）利用压铸成型或机加工制造的铝合金灯柱壳体1，壳体为中空管状结构，壳体外表面对称设置有凹槽结构，凹槽底面设有通孔，凹槽两侧有注胶口和排气口9；
    （2）在扁平热管2表面均匀涂抹导热硅脂，置于灯柱壳体1中央孔内，在300℃下加热30min，使扁平热管2胀在灯柱壳体1内壁；热管冷端与尾部散热鳍片3焊接，三者形成一体结构；
    （3）通过凹槽底面通孔，将陶瓷基板4焊接于扁平热管2表面，锡焊温度为200℃，LED芯片6和电极线设置在陶瓷基板4表面；
    （4）在扁平热管与壳体内壁之间的槽道内，插入FPC柔性电路板，并将其电极端与陶瓷基板的电极端焊接一起；
    （5）如图6所示，采用保形涂覆的封装方式灌胶封装，将荧光胶均匀涂覆于LED芯片5表面，之后在凹槽内部灌封硅胶10，在凹槽表面摆置光学透镜8，利用凹槽边缘的注胶口和排气口9进行注胶封装，形成一体化光学结构，加热至140℃，保温90min；灌封时，由注胶口注入荧光胶，另一端排气口用于平衡气压以保证胶体的顺利流入；
    （6）固化完毕后，即可得到一体化高效散热及光效优化的LED车灯。
实施例 3
    一种一体化高效散热及光效优化的LED车灯的制备方法，包括如下步骤：
    （1）利用压铸成型或机加工制造的铝合金灯柱壳体1，壳体为中空管状结构，壳体外表面对称设置有凹槽结构，凹槽底面设有通孔，凹槽两侧有注胶口和排气口9；
    （2）在扁平热管2表面均匀涂抹导热硅脂，置于灯柱壳体1中央孔内，在250℃下加热20min，使扁平热管2胀在灯柱壳体1内壁；热管冷端与尾部散热鳍片3焊接，三者形成一体结构；
    （3）通过凹槽底面通孔，将陶瓷基板4焊接于扁平热管2表面，锡焊温度为180℃，LED芯片6和电极线设置在陶瓷基板4表面；
    （4）在扁平热管与壳体内壁之间的槽道内，插入FPC柔性电路板，并将其电极端与陶瓷基板的电极端焊接一起；
    （5）如图7所示，采用远程涂覆的封装方式灌胶封装，在凹槽内部灌封硅胶10，之后将荧光胶均匀涂覆于硅胶表面，在凹槽表面摆置光学透镜8，利用凹槽边缘的注胶口和排气口9进行注胶封装，形成一体化光学结构，加热至120℃，保温60min；灌封时，由注胶口注入荧光胶，另一端排气口用于平衡气压以保证胶体的顺利流入；
    （6）固化完毕后，即可得到一体化高效散热及光效优化的LED车灯。
实施例 4
    一种一体化高效散热及光效优化的LED车灯的制备方法，包括如下步骤：
    （1）利用压铸成型或机加工制造的铝合金灯柱壳体1，壳体为中空管状结构，壳体外表面对称设置有凹槽结构，凹槽底面设有通孔，凹槽两侧有注胶口和排气口9；
    （2）在扁平热管2表面均匀涂抹导热硅脂，置于灯柱壳体1中央孔内，在250℃下加热15min，使扁平热管2胀在灯柱壳体1内壁；热管冷端与尾部散热鳍片3焊接，三者形成一体结构；
    （3）通过凹槽底面通孔，将陶瓷基板4焊接于扁平热管2表面，锡焊温度为180℃，LED芯片6和电极线设置在陶瓷基板4表面；
    （4）在扁平热管与壳体内壁之间的槽道内，插入FPC柔性电路板，并将其电极端与陶瓷基板的电极端焊接一起；
    （5）如图8所示，采用点胶涂覆的封装方式，在凹槽内部灌封荧光胶，不安装光学透镜，加热至120℃，保温40min；
    （6）固化完毕后，即可得到一体化高效散热及光效优化的LED车灯。
    综上所述，本发明的一种一体化高效散热及光效优化的LED车灯及制备方法，利用扁平热管实现LED高热流散热，并将光学透镜设计与车灯生产工艺结合，实现光源出射光斑可控，并且通过一体化制备，提升车灯散热效果，减少工艺流程，提高生产效率。

Claims (10)

  1. 一种一体化高效散热及光效优化的LED车灯，其特征在于：包括灯柱壳体（1）、扁平热管（2）、尾部散热鳍片（3）、陶瓷基板（4）、LED芯片（5）和电路板（6），所述扁平热管（2）通过胀管方式紧贴灯柱壳体（1）内壁，冷端与尾部散热鳍片（3）焊接，所述陶瓷基板（4）通过灯柱壳体（1）表面的凹槽底部通孔焊接在扁平热管（2）表面，所述LED芯片（5）封装在陶瓷基板（4）上，所述电路板（6）插在扁平热管（2）与灯柱壳体（1）内壁之间的槽道中，与陶瓷基板（4）上的电极线连接。
  2. 根据权利要求1所述的一体化高效散热及光效优化的LED车灯，其特征在于：还包括光学透镜（8），所述光学透镜（8）摆置在灯柱壳体（1）的凹槽表面上。
  3. 根据权利要求1所述的一体化高效散热及光效优化的LED车灯，其特征在于：灯柱壳体（1）由铝合金材料制成，通过压铸成型或机加工制造，为中空管状壳体，外表面对称设置有凹槽结构，所述凹槽两侧设有注胶口和排气口（9），底面设有通孔，所述注胶口、排气口（9）和通孔均通过压铸成型或加工成型。
  4. 根据权利要求1所述的一体化高效散热及光效优化的LED车灯，其特征在于：扁平热管（2）是由铜基材的铜粉材料制成的烧结型吸液芯热管，厚度为0.5～3.5mm。
  5. 根据权利要求1或2所述的一体化高效散热及光效优化的LED车灯，其特征在于：灯柱壳体（1）表面凹槽内部通过胶体（7）封装，胶体（7）为荧光胶或硅胶（10），凹槽内部封装的涂覆方式为点胶涂覆、保形涂覆或远程涂覆。
  6. 根据权利要求5所述的一体化高效散热及光效优化的LED车灯，其特征在于：凹槽和光学透镜（8）之间通过注胶口和排气口（9）注胶封装。
  7. 根据权利要求1所述的一体化高效散热及光效优化的LED车灯，其特征在于：陶瓷基板（4）厚度为0.2～0.8mm， LED芯片（5）和电极线均设置在陶瓷基板（4）的表面， LED芯片（5）与电极线连接。
  8. 根据权利要求1所述的一体化高效散热及光效优化的LED车灯，其特征在于：电路板（6）为PFC柔性电路板，设有正极和负极外接线路，厚度为0.1～0.5mm。
  9. 根据权利要求1所述的一体化高效散热及光效优化的LED车灯，其特征在于：灯柱壳体（1）的厚度为4～5mm，凹槽深度为0.5～1.5mm。
  10. 制备权利要求1或2所述一体化高效散热及光效优化的LED车灯的方法，其特征在于，包括以下步骤：
    步骤1、利用压铸成型或机加工制造的铝合金灯柱壳体（1），壳体为中空管状结构，壳体外表面对称设置有凹槽结构，凹槽底面设有通孔，凹槽两侧有注胶口和排气口（9）；
    步骤2、在扁平热管（2）表面均匀涂抹导热硅脂，置于灯柱壳体（1）中央孔内，在200～300℃下加热15～30min，使扁平热管（2）胀在灯柱壳体（1）内壁；热管冷端与尾部散热鳍片（3）焊接，三者形成一体结构；
    步骤3、通过灯柱壳体（1）凹槽底面通孔，将陶瓷基板（4）焊接于扁平热管（2）表面，锡焊温度为160～200℃，LED芯片（6）和电极线设置在陶瓷基板（4）表面；
    步骤4、在扁平热管（2）与灯柱壳体（1）内壁之间的槽道内，插入FPC柔性电路板，并将其电极端与陶瓷基板（4）的电极端焊接一起；
    步骤5、在凹槽内部采用点胶涂覆、保形涂覆或远程涂覆的封装方式灌胶封装；若所述一体化高效散热及光效优化的LED车灯还包括光学透镜（8），则在凹槽表面摆置光学透镜（8），利用凹槽边缘的注胶口和排气口（9）进行注胶封装，形成一体化光学结构；加热至100～140℃，保温40～90min；灌封时，由注胶口注入荧光胶，另一端排气口（9）用于平衡气压以保证胶体的顺利流入；
    步骤6、固化完毕后，即可得到一体化高效散热及光效优化的LED车灯。
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KR101210485B1 (ko) * 2012-07-10 2012-12-11 (주)미라클산업 Ｌｅｄ 조명등 및 이에 이용되는 방열유닛
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CN207350213U (zh) * 2017-06-13 2018-05-11 苏州科医世凯半导体技术有限责任公司 一种led车灯导热装置
CN109404853A (zh) * 2018-11-25 2019-03-01 华南理工大学 一种一体化高效散热及光效优化的led车灯及制备方法
CN208997969U (zh) * 2018-11-25 2019-06-18 华南理工大学 一种一体化高效散热及光效优化的led车灯

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